Display panel, display device and preparation method of display panel

Abstract

The embodiment of the invention provides a display panel, a display device and a preparation method of the display panel, the display panel comprises a substrate, a first flat layer, an isolation structure, a light emitting device layer, a first packaging layer and an isolation piece, the first flat layer is arranged on one side of the substrate; the isolation structure is located on the side, away from the substrate, of the first flat layer, and the isolation structure is provided with a plurality of limiting openings and a plurality of first openings; the first packaging layer is located on one side, deviating from the substrate, of the isolation structure and the light-emitting device layer; the isolation piece is located in the non-display area, the isolation piece is used for isolating the first flat layer and the packaging layer, and the orthographic projection of the isolation piece on the substrate and the orthographic projection of the first opening on the substrate are at least partially overlapped. According to the invention, the separator reduces or prevents water vapor from flowing between the first flat layer and the first packaging layer, and the service life of the light-emitting unit is prolonged.

Description

Technical Field

[0001] This application relates to the field of display device technology, and in particular to a display panel, a display device, and a method for manufacturing the display panel. Background Technology

[0002] Organic light-emitting diode (OLED) and LED-based display panels are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide application range, becoming the mainstream in display devices. However, the lifespan of existing display panels still needs improvement. Summary of the Invention

[0003] This application provides a display panel, a display device, and a method for manufacturing the display panel, aiming to address the technical problem of optimizing the lifespan of the display panel.

[0004] An embodiment of the first aspect of this application provides a display panel having a display area and a non-display area, wherein the non-display area is at least partially disposed around the display area; the display panel includes:

[0005] substrate;

[0006] The first planarization layer is disposed on one side of the substrate;

[0007] An isolation structure is located on the side of the first planarization layer away from the substrate. The isolation structure has multiple defined openings and multiple first openings, with the defined openings located in the display area and the first openings located in the non-display area.

[0008] The light-emitting device layer includes a plurality of light-emitting units located in the display area, at least a portion of which is disposed within a defined opening;

[0009] The first encapsulation layer is located on the side of the isolation structure and light-emitting device layer that is away from the substrate;

[0010] An isolator is located in the non-display area, the isolator is spaced between the first planarization layer and the first encapsulation layer, and the orthographic projection of the isolator on the substrate at least partially overlaps with the orthographic projection of the first opening on the substrate.

[0011] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a first electrode layer, a second electrode layer, and a second encapsulation layer, wherein the first electrode layer, the light-emitting device layer, the second electrode layer, the second encapsulation layer, and the first encapsulation layer are stacked sequentially in a direction away from the substrate;

[0012] A portion of at least one of the first electrode layer, the light-emitting device layer, the second electrode layer, and the second encapsulation layer is disposed in the same layer as at least a portion of the insulating member.

[0013] According to any of the foregoing embodiments of the first aspect of this application, at least a portion of the spacer is located within the first opening.

[0014] According to any of the foregoing embodiments of the first aspect of this application, the edge of the spacer overlaps with the spacer structure.

[0015] According to any of the foregoing embodiments of the first aspect of this application, a portion of the isolation member is located on the side of the isolation structure away from the substrate.

[0016] According to any of the foregoing embodiments of the first aspect of this application, the second encapsulation layer includes a plurality of first encapsulation portions disposed at intervals, the first encapsulation portions being located in the display area and on the side of the light-emitting unit away from the substrate, and the isolation member including the second encapsulation portion, the first encapsulation portions and the second encapsulation portions being disposed in the same layer.

[0017] According to any of the foregoing embodiments of the first aspect of this application, at least a portion of the second encapsulation portion is located within the first opening.

[0018] According to any of the foregoing embodiments of the first aspect of this application, a portion of the second packaging portion is located on the side of the isolation structure away from the substrate.

[0019] According to any of the foregoing embodiments of the first aspect of this application, a portion of the second encapsulation portion contacts the surface of the isolation structure away from the substrate.

[0020] According to any of the foregoing embodiments of the first aspect of this application, the side of the second encapsulation portion near the substrate contacts the first planarization layer, and the side of the second encapsulation portion away from the substrate contacts the first encapsulation layer.

[0021] According to any of the foregoing embodiments of the first aspect of this application, a portion of the first encapsulation layer fills the first opening and contacts the surface of the separator away from the substrate.

[0022] According to any of the foregoing embodiments of the first aspect of this application, the first encapsulation layer is an organic material layer, and the first planarization layer is an organic material layer.

[0023] According to any of the foregoing embodiments of the first aspect of this application, the second encapsulation layer is an inorganic material layer.

[0024] According to any of the foregoing embodiments of the first aspect of this application, the first electrode layer includes a plurality of first electrodes, the first electrodes are located in the display area and disposed on the side of the light-emitting unit close to the substrate, and the isolation member includes a first isolation electrode, the first electrodes and the first isolation electrode are disposed in the same layer.

[0025] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a pixel definition layer, which is disposed between the substrate and the isolation structure. The pixel definition layer includes a pixel opening and a second opening, which are connected to the defined opening. At least a portion of the light-emitting unit is disposed within the pixel opening, and the second opening is connected to the first opening.

[0026] According to any of the foregoing embodiments of the first aspect of this application, the first isolation electrode includes a first surface and a second surface disposed opposite to each other, and a side surface connected to the first surface. The first surface is disposed on the side of the second surface away from the substrate, and the pixel definition layer covers at least a portion of the side surface.

[0027] According to any of the foregoing embodiments of the first aspect of this application, the pixel definition layer covers a portion of the first surface.

[0028] According to any of the foregoing embodiments of the first aspect of this application, the side of the first isolation electrode close to the substrate is in contact with the first planarization layer, and the side of the first isolation electrode away from the substrate is in contact with the first encapsulation layer.

[0029] According to any of the foregoing embodiments of the first aspect of this application, the second electrode layer includes a plurality of second electrodes, the second electrodes are located in the display area and disposed on the side of the light-emitting unit away from the substrate, and the isolation member includes a second isolation electrode, the second electrodes and the second isolation electrode are disposed in the same layer;

[0030] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure includes a first isolation layer and a second isolation layer stacked together, wherein the first isolation layer is disposed on the side of the second isolation layer near the substrate.

[0031] Within the display area, the orthographic projection of the first isolation layer on the substrate lies within the orthographic projection of the second isolation layer on the substrate.

[0032] According to any of the foregoing embodiments of the first aspect of this application, the edge of the second electrode overlaps with the isolation structure.

[0033] According to any of the foregoing embodiments of the first aspect of this application, the second electrode is electrically connected to the isolation structure.

[0034] According to any of the foregoing embodiments of the first aspect of this application, the side of the second isolation electrode near the substrate is in contact with the first planarization layer, and the side of the second isolation electrode away from the substrate is in contact with the first encapsulation layer.

[0035] According to any of the foregoing embodiments of the first aspect of this application, the isolation member includes an isolation unit, the isolation unit and the light-emitting unit are disposed at a distance, and the isolation unit and the light-emitting unit are disposed on the same layer.

[0036] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a pixel definition layer, which is disposed between the substrate and the isolation structure. The pixel definition layer includes a pixel opening and a second opening, which are connected to the defined opening. At least a portion of the light-emitting unit is disposed within the pixel opening, the second opening is connected to the first opening, and at least a portion of the isolation unit is disposed within the second opening.

[0037] According to any of the foregoing embodiments of the first aspect of this application, the plurality of light-emitting units include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, and the thickness of the isolation unit in the direction away from the substrate is equal to the sum of the thicknesses of at least two of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit in the direction away from the substrate.

[0038] According to any of the foregoing embodiments of the first aspect of this application, the side of the isolation unit closest to the substrate is in contact with the first planarization layer, and the side of the isolation unit away from the substrate is in contact with the first encapsulation layer.

[0039] According to any of the foregoing embodiments of the first aspect of this application, the isolation member includes a first isolation unit, a first isolation sub-electrode, and a first encapsulation isolation portion arranged sequentially in a direction away from the substrate.

[0040] According to any of the foregoing embodiments of the first aspect of this application, the isolation unit further includes a second isolation unit, a second isolation sub-electrode, and a second encapsulation isolation portion, wherein the first isolation unit, the first isolation sub-electrode, the first encapsulation isolation portion, the second isolation unit, the second isolation sub-electrode, and the second encapsulation isolation portion are arranged sequentially in a direction away from the substrate.

[0041] According to any of the foregoing embodiments of the first aspect of this application, the plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit, the second electrode layer includes a first sub-electrode located on the side of the first light-emitting unit away from the substrate and a second sub-electrode located on the side of the second light-emitting unit away from the substrate, and the second encapsulation layer includes a first encapsulation sub-part located on the side of the first sub-electrode away from the substrate and a second encapsulation sub-part located on the side of the second sub-electrode away from the substrate.

[0042] The first isolation unit is disposed on the same layer as the first light-emitting unit, the first isolation sub-electrode and the first sub-electrode are disposed on the same layer, the first encapsulation isolation part and the first encapsulation sub-part are disposed on the same layer, the second isolation unit is disposed on the same layer as the second light-emitting unit, the second isolation sub-electrode and the second sub-electrode are disposed on the same layer, and the second encapsulation isolation part and the second encapsulation sub-part are disposed on the same layer.

[0043] According to any of the foregoing embodiments of the first aspect of this application, the isolation unit further includes a third isolation unit, a third isolation sub-electrode, and a third packaging isolation portion, which are located on the side of the second packaging isolation portion away from the substrate and are sequentially arranged in the direction away from the substrate.

[0044] According to any of the foregoing embodiments of the first aspect of this application, the plurality of light-emitting units include a third light-emitting unit, the second electrode layer includes a third sub-electrode located on the side of the third light-emitting unit away from the substrate, and the second encapsulation layer includes a third encapsulation sub-part located on the side of the third sub-electrode away from the substrate.

[0045] The third isolation unit is arranged on the same layer as the third light-emitting unit, the third isolation sub-electrode and the third sub-electrode are arranged on the same layer, and the third encapsulation isolation part and the third encapsulation sub-part are arranged on the same layer.

[0046] According to any of the foregoing embodiments of the first aspect of this application, at least a portion of the isolation member is a conductive member, and the display panel further includes a touch layer located on the side of the first encapsulation layer away from the substrate. The touch layer includes a plurality of touch units, and the orthographic projection of the touch units on the substrate at least partially overlaps with the orthographic projection of the isolation member on the substrate.

[0047] According to any of the foregoing embodiments of the first aspect of this application, the substrate includes a substrate and a driving circuit layer, the driving circuit layer is disposed between the substrate and the light-emitting device layer, the driving circuit layer includes a plurality of conductive structures, and the orthographic projection of some conductive structures on the substrate at least partially overlaps with the orthographic projection of the insulating member on the substrate.

[0048] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a first conductive layer, the first conductive layer including a first signal line located in a non-display area, a first planarization layer having a third opening, and a portion of an isolation structure located within the third opening and electrically connected to the first signal line.

[0049] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the isolation member on the substrate is located in the orthographic projection of the first signal line on the substrate.

[0050] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the third opening on the substrate is spaced apart from the orthographic projection of the first opening on the substrate.

[0051] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a second planarization layer, which is located on the side of the first conductive layer near the substrate.

[0052] According to any of the foregoing embodiments of the first aspect of this application, the first conductive layer further includes a fourth opening penetrating the first signal line, and the first planarization layer and the second planarization layer are in contact through the fourth opening.

[0053] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the first opening on the substrate and the orthographic projection of the fourth opening on the substrate are spaced apart.

[0054] According to any of the foregoing embodiments of the first aspect of this application, a plurality of first openings are alternately spaced along a first direction in the orthographic projection of the substrate and a plurality of third openings are alternately spaced along a first direction in the orthographic projection of the substrate; a plurality of third openings are alternately spaced along a first direction in the orthographic projection of the substrate and a plurality of fourth openings.

[0055] The second aspect of this application also provides a method for manufacturing a display panel, the display panel having a display area and a non-display area, the non-display area being at least partially disposed around the display area; the manufacturing method includes:

[0056] A first planarization layer is formed on the substrate;

[0057] An isolation material layer is disposed on the side of the first planarization layer away from the substrate. The isolation material layer is etched with an etching solution to form an isolation structure. The isolation structure has multiple defined openings and multiple first openings. The defined openings are located in the display area, and the first openings are located in the non-display area.

[0058] The light-emitting device layer comprises at least a plurality of light-emitting units located in the display area, at least a portion of which are disposed within a defined opening, and the light-emitting unit is located in the non-display area. The orthographic projection of the light-emitting unit onto the substrate at least partially overlaps with the orthographic projection of the first opening onto the substrate.

[0059] In the portion where the first encapsulation layer is formed on the side of the isolation structure away from the substrate, the isolation member separates the first planarization layer and the first encapsulation layer to block the etching solution absorbed by the first planarization layer.

[0060] According to any of the foregoing embodiments of the second aspect of this application, forming at least a portion of the light-emitting unit and the insulating member includes:

[0061] A light-emitting material is disposed on one side of a substrate. Part of the light-emitting material falls into a defined opening to form a light-emitting unit, and part of the light-emitting material falls into a first opening to form an isolation unit. The isolation member includes the isolation unit.

[0062] According to any of the foregoing embodiments of the second aspect of this application, forming at least a portion of the light-emitting unit and the insulating member includes:

[0063] A light-emitting material is disposed on one side of the substrate, and at least a portion of the light-emitting material falls into a defined opening to form a light-emitting unit;

[0064] A second electrode material is disposed on one side of the substrate. A portion of the second electrode material falls into a defined opening to form a second electrode, and a portion of the second electrode material falls into a first opening to form a second isolation electrode. The isolation member includes the second isolation electrode.

[0065] According to any of the foregoing embodiments of the second aspect of this application, forming at least a portion of the light-emitting unit and the insulating member includes:

[0066] A light-emitting material is disposed on one side of the substrate, and at least a portion of the light-emitting material falls into a defined opening to form a light-emitting unit;

[0067] A second electrode material is disposed on one side of the substrate, and at least a portion of the second electrode material falls into a defined opening to form a second electrode;

[0068] A first encapsulation material is disposed on one side of the substrate. A portion of the first encapsulation material falls into a defined opening to form a first encapsulation portion, and a portion of the first encapsulation material falls into the first opening to form a second encapsulation portion. The separator includes the second encapsulation portion.

[0069] According to any of the foregoing embodiments of the second aspect of this application, an isolation material layer is provided on the side of the first planarization layer facing away from the substrate, and the isolation material layer is etched using an etching solution to form an isolation structure, including:

[0070] An isolation material layer is disposed on the side of the first planarization layer away from the substrate. The isolation material layer is etched with an etching solution to form an isolation structure with multiple defined openings, wherein the multiple defined openings have a first defined opening and a second defined opening.

[0071] The portion forming at least the light-emitting unit and the insulating element includes:

[0072] A first light-emitting material, a second electrode material, and a second encapsulation material are used to fill and define the opening and the first opening, and then patterned. The first light-emitting material, the second electrode material, and the second encapsulation material located within the first defined opening respectively form a first light-emitting unit, a first sub-electrode, and a first encapsulation sub-part. The first light-emitting material, the second electrode material, and the first encapsulation material located within the first opening respectively form a first isolation unit, a first isolation sub-electrode, and a first encapsulation isolation part.

[0073] A second light-emitting material, a second electrode material, and a second encapsulation material are used to fill and define the opening and the first opening, and then patterned. The second light-emitting material, the second electrode material, and the second encapsulation material located in the second defined opening respectively form a second light-emitting unit, a second sub-electrode, and a second encapsulation sub-part. The first light-emitting material, the second electrode material, and the second encapsulation material located in the first opening respectively form a second isolation unit, a second isolation sub-electrode, and a second encapsulation isolation part.

[0074] According to any of the foregoing embodiments of the second aspect of this application, the plurality of defined openings, including a third defined opening, forming at least a portion of the light-emitting unit and the insulating member, further include:

[0075] A third light-emitting material, a second electrode material, and a second encapsulation material are used to fill and define the opening and the first opening, and then patterned. The third light-emitting material, the second electrode material, and the second encapsulation material located in the third defined opening respectively form a third light-emitting unit, a third sub-electrode, and a third encapsulation sub-part. The third light-emitting material, the second electrode material, and the second encapsulation material located in the first opening respectively form a third isolation unit, a third isolation sub-electrode, and a third encapsulation isolation part.

[0076] An embodiment of the third aspect of this application also provides a display device, including a display panel of any embodiment of the first aspect described above, or a display panel prepared according to any embodiment of the second aspect described above.

[0077] In the display panel, display device, and display panel manufacturing method provided in the embodiments of this application, by providing a first opening in the isolation structure, moisture in the first planarization layer can be discharged outward through the first opening during the manufacturing process of the display panel; providing the first opening in the non-display area is beneficial to increasing the distribution density of the light-emitting units in the display area; by providing that the orthographic projection of the isolation member on the substrate at least partially overlaps with the orthographic projection of the first opening on the substrate, and the isolation member separating the first planarization layer and the first encapsulation layer, the isolation member can isolate the first planarization layer and the first encapsulation layer, avoiding contact between the first planarization layer and the first encapsulation layer, thereby avoiding or reducing the absorption of liquid preparation by the first planarization layer during the manufacturing process, avoiding or reducing the entry of moisture in the first planarization layer into the first encapsulation layer through the first opening, improving the service life of the light-emitting unit, and avoiding or reducing display abnormalities of the light-emitting unit. Attached Figure Description

[0078] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0079] Figure 1 This is a schematic diagram of the planar structure of a display panel provided in some embodiments of this application;

[0080] Figure 2 This is a partial cross-sectional structural diagram of a display panel provided in some embodiments of this application;

[0081] Figure 3 This is a partial cross-sectional structural diagram of a display panel provided in some embodiments of this application;

[0082] Figure 4 This is a partial cross-sectional structural diagram of a display panel provided in some embodiments of this application;

[0083] Figure 5This is a partial cross-sectional structural diagram of a display panel provided in some embodiments of this application;

[0084] Figure 6 This is a partial cross-sectional structural diagram of a display panel provided in some embodiments of this application;

[0085] Figure 7 This is a partial cross-sectional structural diagram of a display panel provided in some embodiments of this application;

[0086] Figure 8 This is a partial cross-sectional structural diagram of a display panel provided in some embodiments of this application;

[0087] Figure 9 This is a partial cross-sectional structural diagram of a display panel provided in some embodiments of this application;

[0088] Figure 10 This is a partial planar structural diagram of a display panel provided in some embodiments of this application;

[0089] Figure 11 This is a partial cross-sectional structural diagram of a display panel provided in some embodiments of this application;

[0090] Figure 12 This is a partial cross-sectional structural diagram of a display panel provided in some embodiments of this application;

[0091] Figure 13 This is a partial cross-sectional structural diagram of a display panel provided in some embodiments of this application;

[0092] Figure 14 This is a schematic flowchart of a display panel manufacturing method provided in some embodiments of this application;

[0093] Figure 15 This is a schematic flowchart of a display panel manufacturing method provided in some embodiments of this application.

[0094] Explanation of reference numerals in the attached figures:

[0095] 100. Display panel; AA. Display area; NA. Non-display area;

[0096] 1. Substrate; 11. Substrate; 12. Driving circuit layer; 13. Transistor; 131. Source; 132. Drain; 133. Gate; 134. Active layer; 135. First electrode plate; 136. Second electrode plate; 14. Second planarization layer; 15. First signal line; 151. Fourth opening;

[0097] 2. Isolation structure; 21. First isolation layer; 22. Second isolation layer; 23. Defining opening; 23a. First limiting opening; 23b. Second limiting opening; 23c. Third limiting opening; 24. Third isolation layer; 25. First opening;

[0098] 3. Light-emitting device layer; 31. Light-emitting unit; 31a. First light-emitting unit; 31b. Second light-emitting unit; 31c. Third light-emitting unit; 32. Isolation unit;

[0099] 4. Pixel definition layer; 41. Pixel opening; 42. Second opening; 44. Fifth opening;

[0100] 5. First leveling layer; 511. Third opening;

[0101] 6. First electrode layer; 61. First electrode; 62. First isolation electrode;

[0102] 71. First encapsulation layer; 72. Second encapsulation layer; 721. First encapsulation portion; 721a. First encapsulation sub-portion; 721b. Second encapsulation sub-portion; 721c. Third encapsulation sub-portion; 722. Second encapsulation portion; 73. Third encapsulation layer;

[0103] 8. Touch layer; 81. Touch unit; 9. Second electrode layer; 91. Second electrode; 91a. First sub-electrode; 91b. Second sub-electrode; 91c. Third sub-electrode; 92. Second isolation electrode;

[0104] 20. Isolator; 201. First surface; 202. Second surface; 203. Side surface; 204. First isolation unit; 205. First isolation sub-electrode; 206. First encapsulation isolation portion; 207. Second isolation unit; 208. Second isolation sub-electrode; 209. Second encapsulation isolation portion; 210. Third isolation unit; 211. Third isolation sub-electrode; 212. Third encapsulation isolation portion;

[0105] X, third direction; Y, first direction; Z, second direction. Detailed Implementation

[0106] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0107] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0108] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0109] During the fabrication of the display panel, moisture is discharged from the first planarization layer through a first opening in the isolation structure. In subsequent processes, some liquid formulations can enter the first planarization layer through the first opening. In the completed display panel, moisture in the first planarization layer can enter the encapsulation layer located on one side of the isolation structure through the first opening, thereby increasing the amount of moisture entering the light-emitting unit through the encapsulation layer, leading to a reduction in the lifespan of the light-emitting unit and display abnormalities.

[0110] To address the aforementioned issues, this application provides a display panel, a display device, and a method for manufacturing the display panel. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the display panel, display device, and method for manufacturing the display panel.

[0111] like Figure 1 and Figure 2As shown, the first aspect of this application provides a display panel 100, which has a display area AA and a non-display area NA, with the non-display area NA disposed around at least a portion of the display area AA. The display panel 100 includes: a substrate 1, a first planarization layer 5, an isolation structure 2, a light-emitting device layer 3, a first encapsulation layer 71, and an isolation member 20. The first planarization layer 5 is disposed on one side of the substrate 1. The isolation structure 2 is located on the side of the first planarization layer 5 away from the substrate 1, and the isolation structure 2 has a plurality of defined openings 23 and a plurality of first openings 25. The defined openings 23 are located in the display area AA, and the first openings 25 are located in the non-display area NA. The light-emitting device layer 3 includes a plurality of light-emitting units 31 located in the display area AA, with at least a portion of the light-emitting units 31 disposed within the defined openings 23. The first encapsulation layer 71 is located on the side of the isolation structure 2 away from the substrate 1. The isolation member 20 is located in the non-display area NA, and the orthographic projection of the isolation member 20 onto the substrate 1 at least partially overlaps with the orthographic projection of the first openings 25 onto the substrate 1. The isolation member 20 spacers the first planarization layer 5 and the first encapsulation layer 71.

[0112] In the display panel 100 provided in this application embodiment, the display panel 100 can be a display panel based on organic light-emitting diode (OLED) technology. The isolation structure (also known as a partition structure, etc.) is described in patents CN118251982A, 202410864269.8, PT / N2024 / 09R407, PCT / CNP02A09R217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0113] The display area AA is provided with multiple light-emitting units 31, enabling the display area AA to emit light and display. The non-display area NA is not used for display and illumination, and no light-emitting units 31 are provided in the non-display area NA. The signal lines used for electrically connecting the light-emitting units 31 can be distributed in the non-display area NA to reduce the space occupied by these signal lines in the display area AA, which is beneficial to increasing the distribution density of the light-emitting units 31 in the display area AA.

[0114] In the display panel 100 provided in this embodiment, the substrate 1 not only provides support for the isolation structure 2, but also provides electrical signals for the light-emitting device layer 3. The substrate 1 includes a substrate 11 and a driving circuit layer 12, which is disposed between the substrate 11 and the light-emitting device layer 3. The driving circuit layer 12 may include a pixel driving circuit. For example, the pixel driving circuit disposed on the driving circuit layer 12 includes a transistor 13 and a storage capacitor. The transistor 13 includes an active layer 134, a gate 133, a drain 132, and a source 131. The storage capacitor includes a first electrode 135 and a second electrode 136. A plurality of patterned conductive layers form the aforementioned transistor 13 and storage capacitor.

[0115] The first planarization layer 5 can be used to planarize the functional layer located on the side of it close to the substrate 1. The functional layer can be a conductive layer forming the aforementioned source 131 and drain 132, or it can be a conductive layer used to connect with the vias of the source 131 and drain 132.

[0116] During the fabrication of the display panel 100, the isolation structure 2 is located on the side of the first planarization layer 5 away from the substrate 1, and the first planarization layer 5 is baked. The moisture in the first planarization layer 5 can be discharged outward through the first opening 25 to keep the first planarization layer 5 dry.

[0117] The isolation structure 2 forms a plurality of defined openings 23, with adjacent defined openings 23 spaced apart by the isolation structure 2. The number of defined openings 23 can correspond one-to-one with the number of light-emitting units 31. The plurality of light-emitting units 31 can be light-emitting units 31 capable of emitting light of different colors. For example, they can be red light-emitting units capable of emitting red light, green light-emitting units capable of emitting green light, and blue light-emitting units capable of emitting blue light.

[0118] The first encapsulation layer 71 can be made of organic materials. The first encapsulation layer 71 helps to improve the gas isolation capability of the light-emitting device layer 3.

[0119] The first encapsulation layer 71 extends from the display area AA to the non-display area NA and is located on the side of the light-emitting device layer 3 facing away from the substrate 1, thereby achieving full-area encapsulation of the display area AA and the non-display area NA. The first encapsulation layer 71 located in the display area AA encapsulates the side of the light-emitting device layer 3 and the isolation structure 2 facing away from the substrate 1, preventing external water and oxygen from entering the light-emitting unit 31 from the side of the light-emitting device layer 3 and the isolation structure 2 facing away from the substrate 1, thus affecting the display and light emission of the light-emitting unit 31. The first encapsulation layer 71 located in the non-display area NA is stacked on the side of the isolation structure 2 facing away from the substrate 1, preventing external water and oxygen from entering the display area AA from the non-display area NA, thus affecting the display and light emission of the light-emitting unit 31.

[0120] The orthographic projection of the isolator 20 onto the substrate 1 at least partially overlaps with the orthographic projection of the first opening 25 onto the substrate 1. The isolator 20 may be entirely disposed within the first opening 25, partially disposed within the first opening 25, or located outside the first opening 25. The isolator 20 separates the first planarization layer 5 and the first encapsulation layer 71, meaning that the first planarization layer 5 and the first encapsulation layer 71 do not contact each other. This prevents moisture in the first planarization layer 5 from entering the first encapsulation layer 71 through the first opening 25, and also prevents moisture in the first encapsulation layer 71 from entering the first planarization layer 5 through the first opening 25. Unless otherwise specified, the orthographic projection on the substrate 1 in this application is a projection along a third direction X. The third direction X can be the thickness direction of the display panel 100 or a direction perpendicular to the substrate 1.

[0121] The display panel 100 provided in this application may further include a cover plate located on the side of the light-emitting device layer 3 facing away from the substrate 1, a touch layer 8 located between the cover plate and the light-emitting device layer 3, and an optical adhesive layer located between the cover plate and the touch layer 8. The cover plate provides protection for the display panel 100, preventing scratches and damage from external forces. The touch layer 8 enables touch functionality. The optical adhesive layer bonds the cover plate and the touch layer 8.

[0122] In the display panel 100 provided in this application, by providing a first opening 25 in the isolation structure 2, moisture in the first planarization layer 5 can be discharged outward through the first opening 25 during the fabrication of the display panel 100. Providing the first opening 25 in the non-display area NA is beneficial for increasing the distribution density of the light-emitting units 31 in the display area AA. By setting the orthographic projection of the isolation member 20 on the substrate 1 to at least partially overlap with the orthographic projection of the first opening 25 on the substrate 1, and by separating the first planarization layer 5 and the first encapsulation layer 71 by the isolation member 20, the isolation member 20 can isolate the first planarization layer 5 and the first encapsulation layer 71, preventing contact between the first planarization layer 5 and the first encapsulation layer 71. This avoids or reduces the absorption of liquid preparations by the first planarization layer 5 during fabrication, and avoids or reduces the entry of moisture in the first planarization layer 5 into the first encapsulation layer 71 through the first opening 25, thereby improving the lifespan of the light-emitting units 31 and avoiding or reducing display abnormalities of the light-emitting units 31.

[0123] In some embodiments, the display panel 100 further includes a first electrode layer 6, a second electrode layer 9, and a second encapsulation layer 72. The first electrode layer 6, the light-emitting device layer 3, the second electrode layer 9, the second encapsulation layer 72, and the first encapsulation layer 71 are stacked sequentially in a direction away from the substrate 1. At least one of the first electrode layer 6, the light-emitting device layer 3, the second electrode layer 9, and the second encapsulation layer 72 is disposed in the same layer as at least a portion of the isolation member 20.

[0124] The first electrode layer 6 and the second electrode layer 9 are in contact with the light-emitting device layer 3 on opposite sides, so that the light-emitting device layer 3 can be powered by the first electrode layer 6 and the second electrode layer 9 to control the light-emitting unit 31 to emit light.

[0125] The second encapsulation layer 72 can be made of organic or inorganic materials. The first encapsulation layer 71 and the second encapsulation layer 72 can be made of the same or different materials. Using different materials for the first encapsulation layer 71 and the second encapsulation layer 72 allows them to have different properties, thereby improving the display panel's resistance to water and oxygen.

[0126] At least one of the first electrode layer 6, the light-emitting device layer 3, the second electrode layer 9, and the second encapsulation layer 72 is disposed in the same layer as at least a portion of the isolation member 20. That is, during the preparation of at least one of the first electrode layer 6, the light-emitting device layer 3, the second electrode layer 9, and the second encapsulation layer 72, a partial structure located in the non-display area NA is prepared together, and this partial structure forms at least a portion of the isolation member 20, thereby simplifying the preparation process of the isolation member 20.

[0127] In some embodiments, at least a portion of the spacer 20 is located within the first opening 25.

[0128] The defined opening and the first opening 25 can be prepared together, and then the spacer 20 can be prepared. The spacer 20 prepared later can be completely or partially housed in the first opening 25 to cover the first planarization layer 5 exposed from the first opening 25, and then the first encapsulation layer 71 can be prepared on the spacer 20, so that the spacer 20 can isolate the first planarization layer 5 and the first encapsulation layer 71.

[0129] In some embodiments, the edge of the spacer 20 overlaps with the spacer structure 2.

[0130] The periphery of the isolation member 20 can overlap with the isolation structure 2, so that the first planarization layer 5 and the first encapsulation layer 71 can be separated by the isolation structure 2 and the isolation member 20, thus preventing moisture from the first planarization layer 5 from entering the first encapsulation layer 71 through the gap between the isolation member 20 and the isolation structure 2.

[0131] In some embodiments, a portion of the isolation member 20 is located on the side of the isolation structure 2 away from the substrate 1.

[0132] The isolator 20 may be partially located in the first opening 25 and extend along the wall of the isolator 2 surrounding the first opening 25 to the side of the isolator 2 away from the substrate 1, so as to increase the contact area between the isolator 20 and the isolator 2 and prevent moisture from the first planarization layer 5 from entering the first encapsulation layer 71 from the gap between the isolator 20 and the isolator 2.

[0133] Please see Figure 3In some embodiments, the second encapsulation layer 72 includes a plurality of spaced first encapsulation portions 721, the first encapsulation portions 721 being located in the display area AA and on the side of the light-emitting unit 31 away from the substrate 1, and the isolation member 20 includes a second encapsulation portion 722, the first encapsulation portions 721 and the second encapsulation portions 722 being disposed in the same layer.

[0134] The second encapsulation portion 722 can be fabricated together with all or part of the first encapsulation portions 721. The encapsulation material located in the display area AA forms the first encapsulation portion 721, and the encapsulation material located in the non-display area AA forms the second encapsulation portion 722. The first encapsulation portions 721 and the light-emitting units 31 can be arranged in a one-to-one correspondence, that is, one first encapsulation portion 721 is used to encapsulate one light-emitting unit 31. When multiple first openings 25 are provided in the display panel 100, multiple second encapsulation portions 722 can be arranged in a one-to-one correspondence with the first openings 25, that is, one second encapsulation portion 722 is used to isolate the first planarization layer 5 and the first encapsulation layer 71 located at one first opening 25.

[0135] The first encapsulation portion 721 may be entirely disposed within the defined opening 23, or may partially extend to the outside of the defined opening 23. The edge of the first encapsulation portion 721 overlaps with the isolation structure 2 to avoid or reduce the formation of a gap between the first encapsulation portion 721 and the isolation structure 2 that allows water and oxygen to pass through.

[0136] In some embodiments, at least a portion of the second encapsulation portion 722 is located within the first opening 25.

[0137] The second encapsulation portion 722 can be formed directly on the first planarization layer 5 exposing the first opening 25, or it can be formed on any one of the first electrode layer 6, the light-emitting device layer 3, and the second electrode layer 9. At least a portion of the second encapsulation portion 722 is located within the first opening 25, so that at least a portion of the second encapsulation portion 722 can utilize the empty space of the first opening 25, which is beneficial to reducing the thickness of the display panel 100.

[0138] In some embodiments, a portion of the second encapsulation portion 722 is located on the side of the isolation structure 2 away from the substrate 1, thereby increasing the area of ​​the second encapsulation portion 722 and reducing the amount of moisture from the first planarization layer 5 entering the first encapsulation layer 71 through the gap between the isolation member 20 and the isolation structure 2.

[0139] In some embodiments, a portion of the second encapsulation portion 722 contacts the surface of the isolation structure 2 away from the substrate 1 to increase the contact area between the isolation member 20 and the isolation structure 2, thereby reducing the amount of moisture from the first planarization layer 5 entering the first encapsulation layer 71 from the gap between the isolation member 20 and the isolation structure 2.

[0140] When fabricating the light-emitting unit 31, a first light-emitting unit for emitting a first color of light and a first encapsulation portion 721 for encapsulating the first light-emitting unit are first fabricated. Light-emitting material remaining at locations where the first light-emitting unit is not needed is removed. Then, a second light-emitting unit for emitting a second color of light and a first encapsulation portion 721 for encapsulating the second light-emitting unit are fabricated. Removing the light-emitting material remaining at locations where the first light-emitting unit is not needed can be done by removing the light-emitting material remaining on the side of the isolation structure 2 away from the substrate 1. This results in the first encapsulation portion 721 extending to the side of the isolation structure 2 away from the substrate 1, with the first encapsulation portion 721 spaced apart from the surface of the isolation structure 2 away from the substrate.

[0141] In some embodiments, the second encapsulation portion 722 is an isolation member 20. The side of the second encapsulation portion 722 close to the substrate 1 contacts the first planarization layer 5, and the side of the second encapsulation portion 722 away from the substrate 1 contacts the first encapsulation layer 71. That is, only the second encapsulation portion 722 is provided at the first opening 25 to isolate the first planarization layer 5 and the first encapsulation layer 71.

[0142] In some embodiments, a portion of the first encapsulation layer 71 fills the first opening 25 and contacts the surface of the separator 20 away from the substrate 1.

[0143] When the second encapsulation layer 72 is not disposed in the same layer as at least a portion of the separator 20, the encapsulation material used to prepare the second encapsulation layer 72 can be distributed only in the display area AA. The first encapsulation layer 71 is distributed in both the display area AA and the non-display area AA. The first encapsulation layer 71 encapsulates both the display area AA and the non-display area AA together, which is beneficial to improving the display panel's resistance to water and oxygen. The first encapsulation layer 71 partially fills the first opening 25 to encapsulate and planarize the separator structure 2, which is beneficial to setting other functional layers on the side of the first encapsulation layer 71 away from the substrate 1.

[0144] In some embodiments, the first encapsulation layer 71 is an organic material layer, and the first planarization layer 5 is an organic material layer.

[0145] Compared to inorganic material layers, organic material layers have better flexibility, enabling the first encapsulation layer 71 and the first planarization layer 5 to achieve planarization. The first encapsulation layer 71 and the first planarization layer 5 also absorb moisture more easily, so a separator 20 is provided between the first encapsulation layer 71 and the first planarization layer 5 to reduce the flow of moisture between them.

[0146] In some embodiments, the second encapsulation layer 72 is an inorganic material layer.

[0147] Compared to organic material layers, inorganic material layers have better water and oxygen barrier capabilities. Conversely, organic material layers offer better flexibility and film-forming properties. By encapsulating the light-emitting device layer 3 with both organic and inorganic material layers, the overall water and oxygen resistance of the display panel 100 is improved.

[0148] In some embodiments, the first encapsulation layer 71 further includes a third encapsulation layer 73, which is disposed on the side of the first encapsulation layer 71 away from the substrate 1.

[0149] The third encapsulation layer 73 can be made of organic or inorganic materials. The first encapsulation layer 71, the second encapsulation layer 72, and the third encapsulation layer 73 can be made of the same or different materials. The third encapsulation layer 73 helps to improve the water and oxygen isolation capability of the display panel 100 from the light-emitting device layer 3. The third encapsulation layer 73 and the first encapsulation layer 71 are made of different materials, so that the third encapsulation layer 73 and the first encapsulation layer 71 can have different properties to improve the water and oxygen resistance capability of the display panel 100.

[0150] In some embodiments, the third encapsulation layer 73 is an inorganic material layer.

[0151] The material of the third encapsulation layer 73 can be the same as that of the first encapsulation layer 71 to simplify the manufacturing process.

[0152] Please see Figure 4 In some embodiments, the first electrode layer 6 includes a plurality of first electrodes 61, the first electrodes 61 being located in the display area AA and disposed on the side of the light-emitting unit 31 near the substrate 1, and the isolation member 20 includes a first isolation electrode 62, the first electrodes 61 and the first isolation electrode 62 being disposed in the same layer.

[0153] The electrode material for fabricating the first electrode layer 6 can be laid entirely on one side of the substrate 1. The electrode material is then patterned to form multiple first electrodes 61 and first isolation electrodes 62. The first isolation electrode 62 isolates the first planarization layer 5 and the first encapsulation layer 71. The orthographic projection of the first isolation electrode 62 onto the substrate 1 overlaps with the orthographic projection of the first opening 25 onto the substrate 1. The first isolation electrode 62 has the ability to prevent moisture from flowing between the first planarization layer 5 and the first encapsulation layer 71.

[0154] By setting the first electrode 61 and the first isolation electrode 62 in the same layer, the step of separately preparing the isolation element 20 is eliminated, thus simplifying the preparation process.

[0155] In some embodiments, the display panel 100 further includes a pixel definition layer 4 disposed between the substrate 1 and the isolation structure 2. The pixel definition layer 4 includes a pixel opening 41 and a second opening 42. The pixel opening 41 is connected to the defining opening 23. The light-emitting unit 31 is at least partially disposed in the pixel opening 41. The second opening 42 is connected to the first opening 25.

[0156] A pixel definition layer 4 is disposed on the side of the first planarization layer 5 facing away from the substrate 1. The pixel definition layer 4 includes a pixel opening 41 located in the display area AA and a second opening 42 located in the non-display area NA. The pixel opening 41 defines the position, shape, and size of the light-emitting unit 31. The isolation structure 2 can be directly disposed on the side of the pixel definition layer 4 facing away from the substrate 1, and the pixel definition layer 4 supports the isolation structure 2. The isolation member 20 can be entirely located within the second opening 42, partially located within the second opening 42, or located outside the second opening 42.

[0157] Please refer to the following: Figure 5 In some embodiments, the first isolation electrode 62 includes a first surface 201 and a second surface 202 disposed opposite to each other, and a side surface 203 connected to the first surface 201. The first surface 201 is disposed on the side of the second surface 202 away from the substrate 1, and the pixel definition layer 4 covers at least part of the side surface 203.

[0158] The first isolation electrode 62 can be prepared first, and then the pixel definition layer 4 with the second opening 42 can be prepared. The pixel definition layer 4 can cover part of the isolation member 20. For example, the pixel definition layer 4 can cover at least part of the side 203 to reduce the contact of the side 203 with the preparation agent in subsequent processes, and avoid or reduce the damage of the preparation agent to the side 203.

[0159] In some embodiments, the pixel definition layer 4 covers a portion of the first surface 201.

[0160] The pixel definition layer 4 can extend from the side 203 to the edge of the first surface 201, thereby ensuring that the pixel definition layer 4 effectively covers the side 203.

[0161] In some embodiments, a plurality of first electrodes 61 and a plurality of first isolation electrodes 62 may be spaced apart, such that the first electrodes 61 and the first isolation electrodes 62 can be used to transmit different electrical signals respectively. The pixel definition layer 4 may be made of an insulating material, and a portion of the pixel definition layer 4 is located between adjacent first electrodes 61 and first isolation electrodes 62 to prevent crosstalk between the electrical signals transmitted by the first electrodes 61 and first isolation electrodes 62. The first electrodes 61 and first isolation electrodes 62 are connected so that they have the same potential.

[0162] In some embodiments, the second electrode layer 9 includes a plurality of second electrodes 91, the second electrodes 91 being located in the display area AA and disposed on the side of the light-emitting unit 31 away from the substrate 1, and the isolation member 20 includes a second isolation electrode 92, the second electrodes 91 and the second isolation electrode 92 being disposed in the same layer.

[0163] The electrode material for fabricating the second electrode layer 9 can be laid entirely on one side of the substrate 1. The electrode material is then patterned to form multiple second electrodes 91 and second isolation electrodes 92. The second isolation electrode 92 isolates the first planarization layer 5 and the first encapsulation layer 71. The orthographic projection of the second isolation electrode 92 onto the substrate 1 overlaps with the orthographic projection of the first opening 25 onto the substrate 1. The second isolation electrode 92 has the ability to prevent moisture from flowing between the first planarization layer 5 and the first encapsulation layer 71.

[0164] In some embodiments, the isolation structure 2 includes a first isolation layer 21 and a second isolation layer 22 stacked together. The first isolation layer 21 is disposed on the side of the second isolation layer 22 close to the substrate 1. In the display area AA, the orthographic projection of the first isolation layer 21 on the substrate 1 is located within the orthographic projection of the second isolation layer 22 on the substrate 1.

[0165] The isolation structure 2 encloses and forms a defined opening 23 to define the area where the light-emitting device layer 3 is disposed. The isolation structure 2 includes a first isolation layer 21 and a second isolation layer 22 stacked together. The orthographic projection of the first isolation layer 21 on the substrate 1 lies within the orthographic projection of the second isolation layer 22 on the substrate 1, such that the cross-sectional area of ​​the isolation structure 2 at the end away from the substrate 1 is larger, and the cross-sectional area of ​​the isolation structure 2 at the end closer to the substrate 1 is smaller. Along the direction from the isolation structure 2 to the substrate 1, the second isolation layer 22 completely blocks the first isolation layer 21.

[0166] When fabricating the light-emitting unit 31, the light-emitting material A used to fabricate the light-emitting unit 31 can be deposited onto the isolation structure 2 using vapor deposition technology. Because the second isolation layer 22 blocks the first isolation layer 21, the light-emitting material A used to fabricate the light-emitting unit 31 experiences a significant drop at the edge of the second isolation layer 22. The light-emitting material A falling within the defined opening 23 and the light-emitting material A falling on the second isolation layer 22 are difficult to connect, resulting in breakage and the formation of light-emitting materials A spaced apart within adjacent defined openings 23. Compared to the related technology of fabricating the light-emitting device layer 3 by vapor deposition using a mask, this application, by setting the first isolation layer 21 and the second isolation layer 22, allows the light-emitting unit 31 located within the defined opening 23 to be fabricated without a metal mask, thus saving the cost of fabricating a metal mask. Compared to fabricating the light-emitting device layer 3 by vapor deposition using a high-precision metal mask, directly fabricating the high-precision isolation structure 2 is easier to achieve, making the structure of the display panel 100 provided by this application less demanding on the fabrication process, and resulting in good consistency of the fabricated display panel 100. The light-emitting material A can be an indium-containing complex.

[0167] In some embodiments, the edge of the second electrode 91 overlaps with the isolation structure 2.

[0168] One of the first electrode 61 and the second electrode 91 can be a cathode and the other can be an anode. The first electrode 61 and the second electrode 91 are respectively connected to the light-emitting unit 31 and used to drive the light-emitting unit 31 to emit light. The first encapsulation part 721 can cover the side of the second electrode 91 facing away from the substrate 1. The first encapsulation part 721 can reduce or prevent water and oxygen from entering the light-emitting unit 31 and improve the service life of the light-emitting unit 31. Optionally, the first electrode 61 is an anode and the second electrode 91 is a cathode.

[0169] In some embodiments, the second electrode 91 is electrically connected to the isolation structure 2.

[0170] The edge of the second electrode 91 overlaps with the first isolation layer 21, so that the first isolation layer 21 can supply power to the second electrode 91 and also enable adjacent second electrodes 91 to conduct electricity, thereby forming a surface electrode that conducts electricity across the entire surface.

[0171] In some embodiments, the side of the second isolation electrode 92 closest to the substrate 1 contacts the first planarization layer 5, and the side of the second isolation electrode 92 away from the substrate 1 contacts the first encapsulation layer 71. That is, the second isolation electrode 92 is the entirety of the isolation member 20, and the second isolation electrode 92 isolates the first planarization layer 5 and the first encapsulation layer 71.

[0172] Please see Figure 6 In some embodiments, the isolation element 20 further includes an isolation unit 32, which is spaced apart from the light-emitting unit 31 and is disposed on the same layer as the light-emitting unit 31.

[0173] The light-emitting unit 31 may have multiple layered structures, which may include a hole transport layer, a hole injection layer, an electron transport layer, an electron injection layer, a light-emitting layer, a charge generation layer, etc. The isolation unit 32 may include layered structures that are the same as or different from those of the light-emitting unit 31. If the layered structures in the isolation unit 32 are completely identical to those in the light-emitting unit 31, the isolation unit 32 is considered to include the same layered structures as the light-emitting unit 31. If the layered structures in the isolation unit 32 differ in their arrangement, number of layers, or materials of the layered structures in the same order compared to those in the light-emitting unit 31, the isolation unit 32 is considered to include layered structures different from those of the light-emitting unit 31.

[0174] The material used to prepare any layer of the light-emitting unit 31 can be deposited into the first opening 25 by a vapor deposition process to form at least a portion of the isolation unit 20. The isolation unit 32 isolates the first planarization layer 5 and the first encapsulation layer 71. The orthographic projection of the isolation unit 32 onto the substrate 1 overlaps with the orthographic projection of the first opening 25 onto the substrate 1. The isolation unit 32 has the ability to prevent moisture from flowing between the first planarization layer 5 and the first encapsulation layer 71.

[0175] In some embodiments, the display panel 100 further includes a pixel definition layer 4 disposed between the substrate 1 and the isolation structure 2. The pixel definition layer 4 includes a pixel opening 41 and a second opening 42. The pixel opening 41 is connected to the defining opening 23. At least a portion of the light-emitting unit 31 is disposed within the pixel opening 41. The second opening 42 is connected to the first opening 25. At least a portion of the isolation unit 32 is disposed within the second opening 42.

[0176] The second opening 42 and the first opening 25 can be connected, allowing water vapor in the first flat layer 5 to be discharged outward sequentially through the second opening 42 and the first opening 25. The isolating element 20 can be entirely or partially located within the second opening 42. The isolating unit 32 can be entirely or partially located within the second opening 42, with the position of the isolating unit 32 restricted by the second opening 42.

[0177] In some embodiments, the plurality of light-emitting units 31 include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, and the thickness of the isolation unit 32 in the direction away from the substrate 1 is the sum of the thicknesses of at least two of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit in the direction away from the substrate 1.

[0178] The greater the thickness of the isolation unit 32, the better its isolation effect on the first planarization layer 5 and the first encapsulation layer 71. Since the light-emitting units 31 for emitting different colors of light in the light-emitting device layer 3 are fabricated stepwise, the isolation unit 32 can be formed by stacking materials used to fabricate multiple light-emitting units 31. The thickness of the isolation unit 32 in the direction away from the substrate 1 is the sum of the thicknesses of at least two of the first, second, and third light-emitting units in the direction away from the substrate. For example: Please refer to... Figure 7When preparing a green light emitting unit 31a for emitting green light, the green light emitting material falling into the defined opening 23 forms the green light emitting unit 31a, and the green light emitting material falling into the first opening 25 forms the green light layer 321. When preparing a blue light emitting unit 31b for emitting blue light, the blue light emitting material falling into the defined opening 23 forms the blue light emitting unit 31b, and the blue light emitting material falling into the first opening 25 forms the blue light layer 322. The isolation unit 32 includes the stacked green light layer 321 and blue light layer 322, that is, the thickness H of the isolation unit 32 is equal to the sum of the thicknesses of the green light emitting unit 31a and the blue light emitting unit 31b, H=Ha+Hb.

[0179] In some embodiments, the side of the isolation unit 32 closest to the substrate 1 contacts the first planarization layer 5, and the side of the isolation unit 32 away from the substrate 1 contacts the first encapsulation layer 71. That is, only the isolation unit 32 is provided at the first opening 25 to separate the first planarization layer 5 and the first encapsulation layer 71.

[0180] Please see Figure 8 In some embodiments, the isolation member 20 includes at least one of a first isolation electrode 62, an isolation unit 32, a second isolation electrode 92, and a second encapsulation portion 722. The first isolation electrode 62, the isolation unit 32, the second isolation electrode 92, and the second encapsulation portion 722 may be stacked sequentially to form the isolation member 20, or one, two, or three may be stacked to form the isolation member 20.

[0181] Please see Figure 9 In some embodiments, the isolation member 20 includes a first isolation unit 204, a first isolation sub-electrode 205 and a first encapsulation isolation portion 206 arranged sequentially in a direction away from the substrate 1.

[0182] The first isolation unit 204 can be made of the material used to prepare any of the light-emitting units 31, the first isolation sub-electrode 205 can be made of the material used to prepare the second electrode 91, and the first encapsulation isolation portion 206 can be made of the material used to prepare the second encapsulation layer 72. The isolation member 20 includes the first isolation unit 204, the first isolation sub-electrode 205, and the first encapsulation isolation portion 206 to improve the isolation member 20's ability to block moisture.

[0183] In some embodiments, the isolation member 20 further includes a second isolation unit 207, a second isolation sub-electrode 208, and a second encapsulation isolation portion 209. The first isolation unit 204, the first isolation sub-electrode 205, the first encapsulation isolation portion 206, the second isolation unit 207, the second isolation sub-electrode 208, and the second encapsulation isolation portion 209 are arranged sequentially in a direction away from the substrate 1.

[0184] The second isolation unit 207 can be made of the material used to prepare any of the light-emitting units 31, the second isolation sub-electrode 208 can be made of the material used to prepare the second electrode 91, and the second encapsulation isolation portion 209 can be made of the material used to prepare the second encapsulation layer 72. The isolation member 20 includes a first isolation unit 204, a first isolation sub-electrode 205, a first encapsulation isolation portion 206, a second isolation unit 207, a second isolation sub-electrode 208, and a second encapsulation isolation portion 209 to improve the ability of the isolation member 20 to block moisture.

[0185] In some embodiments, the plurality of light-emitting units 31 include a first light-emitting unit 31a and a second light-emitting unit 31b, the second electrode layer 9 includes a first sub-electrode 91a located on the side of the first light-emitting unit 31a away from the substrate 1 and a second sub-electrode 91b located on the side of the second light-emitting unit 31b away from the substrate 1, and the second encapsulation layer 72 includes a first encapsulation sub-part 721a located on the side of the first sub-electrode 91a away from the substrate 1 and a second encapsulation sub-part 721b located on the side of the second sub-electrode 91b away from the substrate 1.

[0186] The first light-emitting unit 31a and the second light-emitting unit 31b can be used to emit light of different colors. The materials used in the first light-emitting unit 31a and the second light-emitting unit 31b differ, allowing the first light-emitting unit 31a and the second light-emitting unit 31b to be fabricated in steps. Multiple second electrodes 91 may include first sub-electrodes 91a and second sub-electrodes 91b, and multiple first encapsulation portions 721 may include first encapsulation sub-portions 721a and second encapsulation sub-portions 721b.

[0187] The first isolation unit 204 is disposed on the same layer as the first light-emitting unit 31a, the first isolation sub-electrode 205 and the first sub-electrode 91a are disposed on the same layer, the first encapsulation isolation part 206 is disposed on the same layer as the first encapsulation sub-part 721a, the second isolation unit 207 is disposed on the same layer as the second light-emitting unit 31b, the second isolation sub-electrode 208 and the second sub-electrode 91b are disposed on the same layer, and the second encapsulation isolation part 209 is disposed on the same layer as the second encapsulation sub-part 721b. That is, while the first light-emitting unit 31a and the second light-emitting unit 31b are being manufactured, the first isolation unit 204, the first isolation sub-electrode 205, the first encapsulation isolation part 206, the second isolation unit 207, the second isolation sub-electrode 208 and the second encapsulation isolation part 209 in the isolation member 20 are also being manufactured.

[0188] In some embodiments, the isolation member 20 further includes a third isolation unit 210, a third isolation sub-electrode 211, and a third packaging isolation portion 212, which are located on the side of the second packaging isolation portion 209 away from the substrate 1 and are sequentially arranged in the direction away from the substrate 1.

[0189] The third isolation unit 210 can be made of the material used to prepare any of the light-emitting units 31, the third isolation sub-electrode 211 can be made of the material used to prepare the second electrode 91, and the third encapsulation isolation portion 212 can be made of the material used to prepare the second encapsulation layer 72. The isolation member 20 includes a first isolation unit 204, a first isolation sub-electrode 205, a first encapsulation isolation portion 206, a second isolation unit 207, a second isolation sub-electrode 208, a second encapsulation isolation portion 209, a third isolation unit 210, a third isolation sub-electrode 211, and a third encapsulation isolation portion 212 to improve the ability of the isolation member 20 to block moisture.

[0190] In some embodiments, the plurality of light-emitting units 31 include a third light-emitting unit 31c, the second electrode layer 9 includes a third sub-electrode 91c located on the side of the third light-emitting unit 31c away from the substrate 1, and the second encapsulation layer 72 includes a third encapsulation sub-part 721c located on the side of the third sub-electrode 91c away from the substrate 1.

[0191] The third isolation unit 210 is disposed on the same layer as the third light-emitting unit 31c, the third isolation sub-electrode 211 and the third sub-electrode 91c are disposed on the same layer, and the third encapsulation isolation part 212 is disposed on the same layer as the third encapsulation sub-part 721c.

[0192] The first light-emitting unit 31a, the second light-emitting unit 31b, and the third light-emitting unit 31c can be used to emit light of different colors. The materials used in some parts of the first light-emitting unit 31a, the second light-emitting unit 31b, and the third light-emitting unit 31c are different, allowing the first light-emitting unit 31a, the second light-emitting unit 31b, and the third light-emitting unit 31c to be fabricated in stages. The plurality of second electrodes 91 may include a first sub-electrode 91a, a second sub-electrode 91b, and a third sub-electrode 91c, and the plurality of first encapsulation portions 721 may include a first encapsulation sub-portion 721a, a second encapsulation sub-portion 721b, and a third encapsulation sub-portion 721c.

[0193] The third isolation unit 210 is disposed on the same layer as the third light-emitting unit 31c, the third isolation sub-electrode 211 and the third sub-electrode 91c are disposed on the same layer, and the third encapsulation isolation part 212 is disposed on the same layer as the third encapsulation sub-part 721c. That is, while the third light-emitting unit 31c is being manufactured, the third isolation unit 210, the third isolation sub-electrode 211 and the third encapsulation isolation part 212 in the isolation member 20 are also being manufactured.

[0194] In some embodiments, at least a portion of the isolator 20 is a conductive element, and the display panel 100 further includes a touch layer 8 located on the side of the first encapsulation layer 71 away from the substrate 1. The touch layer 8 includes a plurality of touch units 81, and the orthographic projection of the touch units 81 on the substrate 1 at least partially overlaps with the orthographic projection of the isolator 20 on the substrate 1.

[0195] When at least a portion of the isolator 20 is conductive, the isolator 20 serves to prevent signals from being transmitted.

[0196] The touch layer 8 enables touch operation on the display panel 100. To prevent the touch layer 8 from affecting the display of the light-emitting device layer 3, the touch layer 8 can be made of a light-transmitting material. The touch layer 8 is either a self-capacitive touch layer 8 or a mutual-capacitive touch layer 8.

[0197] The mutual capacitance touch layer 8 includes a first touch sublayer and a second touch sublayer. When a finger touches the display panel 100, the first touch unit in the first touch sublayer and the second touch unit in the second touch sublayer respectively form coupling capacitors, thereby achieving touch control through changes in capacitance. The orthographic projection of the isolator 20 on the substrate 1 at least partially overlaps with the orthographic projection of the first touch unit on the substrate 1, that is, the isolator 20 has a signal shielding effect for the first touch unit. The orthographic projection of the isolator 20 on the substrate 1 at least partially overlaps with the orthographic projection of the second touch unit on the substrate 1, that is, the isolator 20 has a signal shielding effect for the second touch unit.

[0198] The self-capacitive touch layer 8 includes touch units 81 with a grid structure. Multiple touch units 81 are touch lines arranged in an array, and mutual capacitance is formed between the arrayed touch lines. When a finger approaches or touches the display panel 100, the value of the mutual capacitance changes, and touch control is achieved through this change in mutual capacitance. The orthographic projection of the isolator 20 onto the substrate 1 at least partially overlaps with the orthographic projection of the touch line onto the substrate 1, meaning that the isolator 20 has a signal shielding effect on the touch line.

[0199] In some embodiments, the substrate 1 includes a substrate 11 and a driving circuit layer 12. The driving circuit layer 12 is disposed between the substrate 11 and the light-emitting device layer 3. The driving circuit layer 12 includes a plurality of conductive structures. The orthographic projection of some of the conductive structures on the substrate 1 at least partially overlaps with the orthographic projection of the isolation member 20 on the substrate 1.

[0200] The conductive structure can specifically be a signal line for user signal transmission in the driving circuit layer 12, a transistor 13 that drives the light-emitting unit 31 to emit light, etc. The orthographic projection of a portion of the conductive structure on the substrate 1 overlaps at least partially with the orthographic projection of the isolator 20 on the substrate 1, so that the isolator 20 has a signal shielding effect on that portion of the conductive structure.

[0201] In some embodiments, the first isolation electrode 62 or the second isolation electrode 92 is insulated from the driving circuit layer 12, and the first electrode 61 is electrically connected to the driving circuit layer 12.

[0202] The first electrode 61 is electrically connected to the driving circuit layer 12, so that the first electrode 61 can provide an electrical signal to the light-emitting unit 31, driving the light-emitting unit 31 to emit light. The first isolation electrode 62 or the second isolation electrode 92 is insulated from the driving circuit layer 12, thereby simplifying the circuit design in the display panel 100.

[0203] In some embodiments, the display panel 100 further includes a first conductive layer, the first conductive layer including a first signal line 15 located in the non-display area NA, the first planarization layer 5 having a third opening 511, and a portion of the isolation structure 2 located within the third opening 511 and electrically connected to the first signal line 15.

[0204] The first signal line 15 can be arranged around the display area AA. The first signal line 15, the first planarization layer 5, and the isolator 20 can be formed sequentially. The isolation material used to prepare the isolation structure 2 falls into the third opening 511, and this part of the isolation material is based on the first signal line 15 exposed from the third opening 511, thereby realizing the electrical connection between the isolation structure 2 and the first signal line 15, so that the isolation structure 2 can be used to transmit electrical signals.

[0205] In some embodiments, the orthographic projection of the isolator 20 onto the substrate 1 is located in the orthographic projection of the first signal line 15 onto the substrate 1, so that the isolator 20 can shield the electrical signal of the first signal line 15, thereby reducing the interference between the first signal line 15 and the electrical signal transmission structure located on the side of the isolator 20 away from the substrate 1. The electrical signal transmission structure located on the side of the isolator 20 away from the substrate 1 can be a touch signal line 82 electrically connected to the touch unit 81.

[0206] Please refer to the following: Figure 8 , Figure 10 and Figure 11 In some embodiments, the orthographic projection of the third opening 511 onto the substrate 1 is spaced apart from the orthographic projection of the first opening 25 onto the substrate 1.

[0207] The pixel definition layer 4 extends into the third opening 511. The pixel definition layer 4 has a fifth opening 44 located within the third opening 511, through which the first signal line 15 is exposed. The pixel definition layer 4 extends along the wall of the third opening 511, preventing moisture in the first planarization layer 5 from escaping through the third opening 511. A second opening 42 is provided on the pixel definition layer 4, allowing moisture in the first planarization layer 5 to escape through the second opening 42. The third opening 511 and the second opening 42 are spaced apart. The third opening 511 and the fifth opening 44 can be connected.

[0208] In some embodiments, the display panel 100 further includes a second planarization layer 14, which is located on the side of the first conductive layer near the substrate 1.

[0209] A second planarization layer 14 can be prepared first, and the functional layer located on the side of the second planarization layer 14 near the substrate 11 can be planarized, which is beneficial to the preparation of the first conductive layer on the second planarization layer 14.

[0210] In some embodiments, the first conductive layer further includes a fourth opening 151 extending through the first signal line 15, through which the first planarization layer 5 and the second planarization layer 14 are in contact.

[0211] Water vapor in the second planarization layer 14 can be discharged outward through the fourth opening 151, and can also move into the first planarization layer 5 through the fourth opening 151, and then be discharged through the second opening 42.

[0212] In some embodiments, the orthographic projection of the second opening 42 onto the substrate 1 and the orthographic projection of the fourth opening 151 onto the substrate 1 are spaced apart, thereby avoiding interference between the conductive structure located on the side of the fourth opening 151 near the substrate 11 and the electrical signal transmission structure located on the side of the second opening 42 away from the substrate 11.

[0213] In some embodiments, the projections of a plurality of second openings 42 onto the substrate 1 and the projections of a plurality of third openings 511 onto the substrate 1 are alternately spaced along the first direction Y; the projections of a plurality of third openings 511 onto the substrate 1 and the projections of a plurality of fourth openings 151 are alternately spaced along the first direction Y.

[0214] The arrangement of multiple second openings 42 and multiple third openings 511 facilitates the discharge of water vapor from the first flattening layer 5 and the second flattening layer 14. The regular arrangement of the multiple second openings 42 and multiple third openings 511 avoids or reduces the accumulation of water vapor in certain areas of the first flattening layer 5 and the second flattening layer 14, preventing effective discharge. Optionally, the multiple second openings 42 and multiple third openings 511 arranged in a row, and the multiple fourth openings 151 and multiple third openings 511 arranged in a row, can be spaced apart along the second direction Z, with the first direction Y perpendicular to the second direction Z.

[0215] Please see Figure 12 In some embodiments, in the display area AA, the surface of the second isolation layer 22 facing away from the substrate 1 has a smaller projected area on the substrate 1 than the surface of the second isolation layer 22 facing away from the substrate 1.

[0216] The second isolation layer 22 extends outward by a predetermined distance relative to the first isolation layer 21. That is, the surface of the second isolation layer 22 facing away from the substrate 1 has a smaller orthogonal projection area on the substrate 1 than the surface of the second isolation layer 22 facing the substrate 1. This results in the second isolation layer 22 having an inclined ramp structure, so as to define the pattern of the light-emitting unit 31 through the second isolation layer 22.

[0217] In some embodiments, in the display area AA, the cross-sectional area of ​​the second isolation layer 22 gradually decreases in the direction away from the substrate 1.

[0218] Optionally, the cross-section of the second isolation layer 22 is a trapezoid with the bottom edge facing the substrate 1, so that the second isolation layer 22 has a sloping surface, which is beneficial for the preparation material to be broken at the partition edge, forming a state in which part of the preparation material is located on the second isolation layer 22 and part of the preparation material is located in the defined opening.

[0219] In some embodiments, in the display area AA, the surface of the first isolation layer 21 facing away from the substrate 1 has a smaller projected area on the substrate 1 than the surface of the second isolation layer 22 facing away from the substrate 1.

[0220] That is, the second isolation layer 22 extends outward relative to the first isolation layer 21 to restrict the pattern of the light-emitting unit 31. The area of ​​the second isolation layer 22 is larger than that of the first isolation layer 21, and it is completely covered by the first isolation layer 21. At this time, the first isolation layer 21 is recessed relative to the second isolation layer 22 in a direction away from the defined opening. When the light-emitting unit 31 is fabricated, at least part of the material used to fabricate the light-emitting unit 31 has a large drop at the edge of the isolation structure 2, and the first isolation layer 21 is recessed. The material used to fabricate the light-emitting unit 31 is difficult to connect on the outside of the isolation structure 2, thus a break is found, forming mutually isolated light-emitting units 31.

[0221] Optionally, the isolation structure 2 is in the form of a grid, and the openings are arranged in an array to improve the light emission uniformity of the light-emitting units 31.

[0222] Please see Figure 13 In some embodiments, the isolation structure 2 further includes a third isolation layer 24, which is disposed on the side of the first isolation layer 21 near the substrate 1, and the orthographic projection of the first isolation layer 21 on the substrate 1 is located within the orthographic projection of the third isolation layer 24 on the substrate 1.

[0223] Within the display area AA, the cross-section of the isolation structure 2 can be I-shaped. Optionally, the projected area of ​​the first isolation layer 21 on the substrate 1 is smaller than the projected area of ​​the third isolation layer 24 on the substrate 1.

[0224] The cross-section of the first isolation layer 21 can be trapezoidal, increasing the size of the limiting opening 23. The cross-sectional shape of the first isolation layer 21 can be a regular trapezoid, which on the one hand provides stable support for the second isolation layer 22, and on the other hand reduces the contact area between the first isolation layer 21 and the second isolation layer 22. The orthographic projection of the first isolation layer 21 on the substrate 1 lies within the orthographic projection of the third isolation layer 24 on the substrate 1, allowing the third isolation layer 24 to stably support the first isolation layer 21. This enables the first isolation layer 21 to be recessed relative to the second isolation layer 22 in a direction away from the central axis of the limiting opening 23, facilitating the disconnection of the light-emitting device layer 3 at the isolation structure 2. Etching waste generated from etching the first isolation layer 21 falls onto the third isolation layer 24, making cleaning easier.

[0225] In other embodiments, the second electrode 91 is electrically connected to the third isolation layer 24. The third isolation layer 24 is made of molybdenum metal; and / or the first isolation layer 21 is made of aluminum metal; and / or the second isolation layer 22 is made of titanium metal.

[0226] In some embodiments, the orthographic projection of the pixel opening 41 on the substrate 1 is located within the orthographic projection range of the limiting opening 23 on the substrate 1.

[0227] By limiting the area of ​​the opening 23 to be larger than the area of ​​the pixel opening 41, the influence of the isolation structure 2 on the light emission angle of the light-emitting device layer 3 can be reduced.

[0228] Optionally, there may be multiple pixel openings 41, which are spaced apart. The isolation structure 2 may be disposed on the pixel definition layer between at least a portion of two adjacent pixel openings 41. Optionally, the isolation structure 2 may be disposed around at least a portion of the pixel openings 41.

[0229] The second aspect of this application also provides a method for manufacturing a display panel, the display panel 100 having a display area AA and a non-display area NA, the non-display area NA being disposed around at least a portion of the display area AA; the manufacturing method includes:

[0230] S100, a first planarization layer 5 is formed on the substrate 1;

[0231] S200, an isolation material layer is provided on the side of the first planarization layer 5 away from the substrate 1, and the isolation material layer is etched by an etching solution to form an isolation structure 2. The isolation structure 2 has multiple limiting openings 23 and multiple first openings 25. The limiting openings 23 are located in the display area AA, and the first openings 25 are located in the non-display area NA.

[0232] S300, forming at least a portion of the light-emitting device layer 3 and the isolation member 20, the light-emitting device layer 3 including a plurality of light-emitting units 31 located in the display area AA, the light-emitting units 31 being at least partially disposed in the defined opening 23, the isolation member 20 being located in the non-display area NA, the orthographic projection of the isolation member 20 on the substrate 1 and the orthographic projection of the first opening 25 on the substrate 1 at least partially overlap.

[0233] S400, a first encapsulation layer 71 is formed on the side of the isolation structure 2 away from the substrate 1, and the isolation member 20 spacees the first planarization layer 5 and the first encapsulation layer 71.

[0234] After S100, it may also include:

[0235] A first electrode layer 6 is formed on the first planarization layer 5.

[0236] S200 may also include:

[0237] A pixel definition material layer and an isolation material layer are sequentially disposed on the first flat layer 5. The pixel definition material layer covers the first electrode 61. The pixel definition material layer and the isolation material layer are patterned to obtain a second opening 42 located in the non-display area NA and a pixel opening 41 located in the display area AA. The opening 23 and the pixel opening 41 are connected, and the second opening 42 and the first opening 25 are connected.

[0238] A pixel definition material layer is used to fabricate pixel definition layer 4. The pixel definition material layer can be patterned using a dry etching process to obtain the desired pixel definition layer 4. After S200, the process may further include drying the first planarization layer 5 to allow moisture in the first planarization layer 5 to escape through the second opening 42. The first planarization layer 5 may also be dried using the ambient high temperature required for fabricating the first electrode layer 6.

[0239] In S200, when the etching solution is used to etch the isolation material layer, part of the etching solution is absorbed and stored in the first planarization layer. During the fabrication of the light-emitting unit 31, the formulation used to remove excess light-emitting material and photoresist may be absorbed by the first planarization layer. The isolation component 20 can prevent or reduce the entry of moisture from the first planarization layer 5 into the first encapsulation layer 71 and the light-emitting unit 31 in the fabricated display panel 100, thereby improving the service life of the light-emitting unit 31.

[0240] In S300, after the isolation structure 2 is formed, at least a portion of the isolation element 20 is prepared. The at least portion of the isolation element 20 can be an independently prepared isolation element 20 or an isolation element 32 prepared in the same layer as the light-emitting unit 31.

[0241] In some embodiments, S300 includes:

[0242] S310, a light-emitting material is disposed on one side of the substrate 1, a portion of the light-emitting material falls into the defined opening 23 to form a light-emitting unit 31, and a portion of the light-emitting material falls into the first opening 25 to form an isolation unit 32, and the isolation member 20 includes the isolation unit 32.

[0243] Simultaneous fabrication of the light-emitting unit 31 and the isolation unit 32 simplifies the fabrication process.

[0244] In some embodiments, S300 includes:

[0245] S320, a light-emitting material is disposed on one side of the substrate 1, and at least a portion of the light-emitting material falls into the defined opening 23 to form a light-emitting unit 31;

[0246] S330, a second electrode material is disposed on one side of the substrate 1, a portion of the second electrode material falls into the defined opening 23 to form a second electrode 91, and a portion of the second electrode material falls into the first opening 25 to form a second isolation electrode 92, and the isolation member 20 includes the second isolation electrode 92.

[0247] The second electrode 91 and the second isolation electrode 92 are prepared simultaneously, thereby simplifying the preparation process.

[0248] In some embodiments, S300 includes:

[0249] S340, a light-emitting material is disposed on one side of the substrate 1, and at least a portion of the light-emitting material falls into the defined opening to form a light-emitting unit 31;

[0250] S350, a second electrode material is disposed on one side of the substrate 1, and at least a portion of the second electrode material falls into the defined opening to form a second electrode 91;

[0251] S360, a first encapsulation material is provided on one side of the substrate 1, a portion of the first encapsulation material falls into the defined opening 23 to form a first encapsulation portion 721, and a portion of the first encapsulation material falls into the first opening 25 to form a second encapsulation portion 722, and the separator 20 includes the second encapsulation portion 722.

[0252] The first packaging part 721 and the second packaging part 722 are prepared simultaneously, thereby simplifying the preparation process.

[0253] All formulations used in processes following the isolation element 20 are blocked by the isolation element 20. For example, the etching solution used in forming the isolation structure 2, the formulation used in removing excess light-emitting material during the preparation of the light-emitting unit 31, and the photoresist are all blocked by the isolation element 20, thereby preventing the formulations from entering the first planarization layer 5. This prevents or reduces the entry of moisture from the first planarization layer 5 into the first encapsulation layer 71 and the light-emitting unit 31 in the prepared display panel 100, thereby improving the service life of the light-emitting unit 31.

[0254] Please see Figure 14 In some embodiments, S200 includes:

[0255] S210, an isolation material layer is provided on the side of the first planarization layer 5 away from the substrate 1, and an etching solution is used to etch the isolation material layer to form an isolation structure 2 with multiple defined openings 23, wherein the multiple defined openings 23 have a first defined opening 23a and a second defined opening 23b.

[0256] The S300 includes:

[0257] S311, a first light-emitting material, a second electrode material, and a second encapsulation material are provided to fill the limiting opening 23 and the first opening 25, and patterned. The first light-emitting material, the second electrode material, and the second encapsulation material located in the first limiting opening 23 respectively form a first light-emitting unit 31a, a first sub-electrode 91a, and a first encapsulation sub-part 721a. The first light-emitting material, the second electrode material, and the first encapsulation material located in the first opening 25 respectively form a first isolation unit 204, a first isolation sub-electrode 205, and a first encapsulation isolation part 206.

[0258] S312, a second light-emitting material, a second electrode material, and a second encapsulation material are provided to fill the limiting opening 23 and the first opening 25, and patterned. The second light-emitting material, the second electrode material, and the second encapsulation material located in the second limiting opening 23 respectively form a second light-emitting unit 31b, a second sub-electrode 91b, and a second encapsulation sub-part 721b. The first light-emitting material, the second electrode material, and the second encapsulation material located in the first opening 25 respectively form a second isolation unit 207, a second isolation sub-electrode 208, and a second encapsulation isolation part 209.

[0259] like Figure 14 As shown in (a) and (b), in S210, the first defined opening 23a, the second defined opening 23b, and the first opening 25 can be formed simultaneously by etching. Figure 14 As shown in (c) and (d), in S300, light-emitting units of different colors can be prepared step by step. For example: a first light-emitting material is deposited by vapor deposition, and the light-emitting material located in the first defined opening 23 is retained to form a first light-emitting unit 31a for emitting light of the first color. The light-emitting material in the other defined openings 23 is removed. Then, a second light-emitting material is deposited by vapor deposition, and the light-emitting material located in the second defined opening 23 is retained to form a second light-emitting unit 31b for emitting light of the second color. The light-emitting material in the other defined openings 23 is removed. This process is repeated until the desired type of light-emitting unit is obtained.

[0260] The isolation member 20 is fabricated together with the first light-emitting unit 31a and the second light-emitting unit 31b, such that the isolation member 20 may include the first light-emitting unit 31a, the second light-emitting unit 31b, and all material layers of the second electrode 91 and the first encapsulation portion 721 located on one side of the first light-emitting unit 31a and the second light-emitting unit 31b, respectively.

[0261] The plurality of defined openings 23 prepared in S200 may also include a third defined opening 23c. Furthermore, after S312, the isolation material layer may be etched using an etching solution to form the third defined opening 23c. Figure 15 As shown in (a), the third limiting opening 23c and the first limiting opening 23a are opened in stages, thereby avoiding damage to the shape of the third limiting opening 23c and the first electrode exposed from the third limiting opening 23c by the preparation steps of S311 and S312.

[0262] In some embodiments, the plurality of defined openings 23 include a third defined opening 23c, and S300 further includes:

[0263] S313, a third light-emitting material, a second electrode material, and a second encapsulation material are provided to fill the limiting opening 23 and the first opening 25, and patterned. The third light-emitting material, the second electrode material, and the second encapsulation material located in the third limiting opening 23c respectively form a third light-emitting unit 31c, a third sub-electrode 91c, and a third encapsulation sub-part 721c. The third light-emitting material, the second electrode material, and the second encapsulation material located in the first opening 25 respectively form a third isolation unit 210, a third isolation sub-electrode 211, and a third encapsulation isolation part 212.

[0264] like Figure 15 As shown in (b), the isolator 20 is partially fabricated together with the first light-emitting unit 31a, the second light-emitting unit 31b, and the third light-emitting unit 31c, such that the isolator 20 may include the first light-emitting unit 31a, the second light-emitting unit 31b, the third light-emitting unit 31c, and all material layers of the second electrode 91 and the first encapsulation portion 721 located on one side of the first light-emitting unit 31a, the second light-emitting unit 31b, and the third light-emitting unit 31c, respectively.

[0265] It should be noted that when patterning the light-emitting unit, sub-electrode, and encapsulation portion located at the second and third defined openings 23, the second isolation unit 207, the second isolation sub-electrode 208, the second encapsulation isolation portion 209, the third isolation unit 210, the third isolation sub-electrode 211, and the third encapsulation isolation portion 212 located within the first opening 25 may not be formed simultaneously. In this case, the isolation component includes the first isolation unit 204, the first isolation sub-electrode 205, and the first encapsulation isolation portion 206. It should be noted that the first isolation unit 204, the first isolation sub-electrode 205, and the first encapsulation isolation portion 206 can protect the first planarization layer 5 during subsequent patterning, especially when wet etching is required.

[0266] An embodiment of the third aspect of this application also provides a display device; please refer to [link to relevant documentation]. Figure 1 and Figure 2 The display device includes the display panel 100 of any of the first aspects of the above-described embodiments, or the display panel 100 prepared according to any of the second aspects of the above-described embodiments. Since the display device provided in the third aspect of this application includes the display panel 100 of any of the first aspects of the above-described embodiments, or the display panel 100 prepared according to any of the second aspects of the above-described embodiments, the display device provided in the third aspect of this application has the beneficial effects of the display panel 100 of any of the first aspects of the above-described embodiments, or the display panel 100 prepared according to any of the second aspects of the above-described embodiments, which will not be elaborated further here.

[0267] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0268] The embodiments described above are not exhaustive and do not limit the invention to specific examples. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that, The display panel has a display area and a non-display area, the non-display area being disposed around at least a portion of the display area; the display panel includes: substrate; A first planarization layer is disposed on one side of the substrate; An isolation structure is located on the side of the first planarization layer opposite to the substrate. The isolation structure has a plurality of defined openings and a plurality of first openings. The defined openings are located in the display area, and the first openings are located in the non-display area. The light-emitting device layer includes a plurality of light-emitting units located in the display area, at least a portion of the light-emitting units being disposed within the defined opening; The first encapsulation layer is located on the side of the isolation structure and the light-emitting device layer that faces away from the substrate; An isolator is located in the non-display area, the isolator isolating the first planarization layer and the first encapsulation layer, and the orthographic projection of the isolator on the substrate at least partially overlaps with the orthographic projection of the first opening on the substrate.

2. The display panel according to claim 1, characterized in that, The display panel further includes a first electrode layer, a second electrode layer, and a second encapsulation layer, wherein the first electrode layer, the light-emitting device layer, the second electrode layer, the second encapsulation layer, and the first encapsulation layer are stacked sequentially in a direction away from the substrate; A portion of at least one of the first electrode layer, the light-emitting device layer, the second electrode layer, and the second encapsulation layer is disposed in the same layer as at least a portion of the insulating member; Preferably, at least a portion of the spacer is located within the first opening; Preferably, the edge of the isolation member overlaps with the isolation structure; Preferably, a portion of the isolation member is located on the side of the isolation structure opposite to the substrate.

3. The display panel according to claim 2, characterized in that, The second encapsulation layer includes a plurality of spaced-apart first encapsulation portions, the first encapsulation portions being located in the display area and on the side of the light-emitting unit facing away from the substrate, and the isolation member including a second encapsulation portion, the first encapsulation portions and the second encapsulation portions being disposed in the same layer; Preferably, at least a portion of the second encapsulation portion is located within the first opening; Preferably, a portion of the second encapsulation portion is located on the side of the isolation structure opposite to the substrate; Preferably, a portion of the second encapsulation portion contacts the surface of the isolation structure opposite to the substrate; Preferably, the side of the second encapsulation portion closest to the substrate contacts the first planarization layer, and the side of the second encapsulation portion away from the substrate contacts the first encapsulation layer.

4. The display panel according to claim 2, characterized in that, The first encapsulation layer partially fills the first opening and contacts the surface of the isolator away from the substrate. Preferably, the first encapsulation layer is an organic material layer, and the first planarization layer is an organic material layer; Preferably, the second encapsulation layer is an inorganic material layer.

5. The display panel according to claim 2, characterized in that, The first electrode layer includes a plurality of first electrodes, the first electrodes are located in the display area and disposed on the side of the light-emitting unit close to the substrate, and the isolation member includes a first isolation electrode, the first electrodes and the first isolation electrode are disposed in the same layer; Preferably, the display panel further includes a pixel definition layer, which is disposed between the substrate and the isolation structure. The pixel definition layer includes a pixel opening and a second opening, the pixel opening communicating with the defined opening, and the light-emitting unit being at least partially disposed within the pixel opening. The second opening is communicating with the first opening. Preferably, the first isolation electrode includes a first surface and a second surface disposed opposite to each other, and a side surface connected to the first surface, wherein the first surface is disposed on the side of the second surface away from the substrate, and the pixel definition layer covers at least a portion of the side surface; Preferably, the pixel definition layer covers a portion of the first surface; Preferably, the side of the first isolation electrode closest to the substrate is in contact with the first planarization layer, and the side of the first isolation electrode opposite to the substrate is in contact with the first encapsulation layer.

6. The display panel according to claim 2, characterized in that, The second electrode layer includes a plurality of second electrodes, the second electrodes are located in the display area and disposed on the side of the light-emitting unit away from the substrate, and the isolation member includes a second isolation electrode, the second electrodes and the second isolation electrode are disposed in the same layer; Preferably, the isolation structure includes a first isolation layer and a second isolation layer stacked together, wherein the first isolation layer is disposed on the side of the second isolation layer closer to the substrate. Within the display area, the orthographic projection of the first isolation layer on the substrate lies within the orthographic projection of the second isolation layer on the substrate; Preferably, the edge of the second electrode overlaps with the isolation structure; Preferably, the second electrode is electrically connected to the isolation structure; Preferably, the side of the second isolation electrode closest to the substrate is in contact with the first planarization layer, and the side of the second isolation electrode opposite to the substrate is in contact with the first encapsulation layer.

7. The display panel according to claim 2, characterized in that, The isolation component includes an isolation unit, which is spaced apart from the light-emitting unit and is disposed on the same layer as the light-emitting unit; Preferably, the display panel further includes a pixel definition layer disposed between the substrate and the isolation structure. The pixel definition layer includes a pixel opening and a second opening. The pixel opening communicates with the defined opening. At least a portion of the light-emitting unit is disposed within the pixel opening. The second opening communicates with the first opening. At least a portion of the isolation unit is disposed within the second opening. Preferably, the plurality of light-emitting units include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, and the thickness of the isolation unit in the direction away from the substrate is equal to the sum of the thicknesses of at least two of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit in the direction away from the substrate; Preferably, the isolation unit is in contact with the first planarization layer on the side closest to the substrate, and the isolation unit is in contact with the first encapsulation layer on the side away from the substrate.

8. The display panel according to claim 2, characterized in that, The isolation component includes a first isolation unit, a first isolation sub-electrode, and a first encapsulation isolation portion arranged sequentially in a direction away from the substrate; Preferably, the isolation unit further includes a second isolation unit, a second isolation sub-electrode, and a second encapsulation isolation portion, wherein the first isolation unit, the first isolation sub-electrode, the first encapsulation isolation portion, the second isolation unit, the second isolation sub-electrode, and the second encapsulation isolation portion are arranged sequentially in a direction away from the substrate; Preferably, the plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit, the second electrode layer includes a first sub-electrode located on the side of the first light-emitting unit away from the substrate and a second sub-electrode located on the side of the second light-emitting unit away from the substrate, and the second encapsulation layer includes a first encapsulation sub-part located on the side of the first sub-electrode away from the substrate and a second encapsulation sub-part located on the side of the second sub-electrode away from the substrate; The first isolation unit is disposed on the same layer as the first light-emitting unit, the first isolation sub-electrode and the first sub-electrode are disposed on the same layer, the first encapsulation isolation part is disposed on the same layer as the first encapsulation sub-part, the second isolation unit is disposed on the same layer as the second light-emitting unit, the second isolation sub-electrode and the second sub-electrode are disposed on the same layer, and the second encapsulation isolation part is disposed on the same layer as the second encapsulation sub-part. Preferably, the isolation unit further includes a third isolation unit, a third isolation sub-electrode, and a third packaging isolation portion, which are located on the side of the second packaging isolation portion away from the substrate and are arranged sequentially in the direction away from the substrate; Preferably, the plurality of light-emitting units include a third light-emitting unit, the second electrode layer includes a third sub-electrode located on the side of the third light-emitting unit away from the substrate, and the second encapsulation layer includes a third encapsulation sub-part located on the side of the third sub-electrode away from the substrate; The third isolation unit is disposed on the same layer as the third light-emitting unit, the third isolation sub-electrode and the third sub-electrode are disposed on the same layer, and the third encapsulation isolation part is disposed on the same layer as the third encapsulation sub-part.

9. The display panel according to claim 1, characterized in that, At least a portion of the isolator is a conductive element, and the display panel further includes a touch layer located on the side of the encapsulation layer opposite to the substrate. The touch layer includes a plurality of touch units, and the orthographic projection of the touch units on the substrate at least partially overlaps with the orthographic projection of the isolator on the substrate. Preferably, the substrate includes a substrate and a driving circuit layer, the driving circuit layer being disposed between the substrate and the light-emitting device layer, the driving circuit layer including a plurality of conductive structures, and the orthographic projection of some of the conductive structures on the substrate at least partially overlaps with the orthographic projection of the insulating member on the substrate.

10. The display panel according to claim 1, characterized in that, The display panel further includes a first conductive layer, the first conductive layer including a first signal line located in the non-display area, the first planarization layer having a third opening, and a portion of the isolation structure located within the third opening and electrically connected to the first signal line. Preferably, the orthographic projection of the isolator on the substrate is located in the orthographic projection of the first signal line on the substrate; Preferably, the third opening is spaced apart from the first opening in the orthographic projection of the substrate.

11. The display panel according to claim 10, characterized in that, The display panel further includes a second planarization layer, which is located on the side of the first conductive layer near the substrate; Preferably, the first conductive layer further includes a fourth opening penetrating the first signal line, and the first planarization layer and the second planarization layer are in contact through the fourth opening; Preferably, the first opening and the fourth opening are spaced apart in the orthographic projection of the substrate. Preferably, the plurality of first openings and the plurality of third openings are alternately spaced along a first direction in their orthographic projections onto the substrate. The plurality of third openings are alternately spaced along the first direction in the orthographic projection of the substrate and the plurality of fourth openings.

12. A method for manufacturing a display panel, characterized in that, The display panel has a display area and a non-display area, wherein the non-display area is disposed around at least a portion of the display area; the manufacturing method includes: A first planarization layer is formed on the substrate; An isolation material layer is disposed on the side of the first planarization layer opposite to the substrate. The isolation material layer is etched with an etching solution to form an isolation structure. The isolation structure has multiple defined openings and multiple first openings. The defined openings are located in the display area, and the first openings are located in the non-display area. The light-emitting unit and the isolator are formed in at least part of the display area, the light-emitting unit is at least partially disposed within the defined opening, the isolator is located in the non-display area, and the orthographic projection of the isolator on the substrate at least partially overlaps with the orthographic projection of the first opening on the substrate. In the portion of the isolation structure on the side opposite to the substrate where a first encapsulation layer is formed, the isolation member spacers the first planarization layer and the first encapsulation layer.

13. The method for manufacturing a display panel according to claim 12, characterized in that, The at least portion forming the light-emitting unit and the isolator includes: A light-emitting material is disposed on one side of the substrate. A portion of the light-emitting material falls into the defined opening to form the light-emitting unit, and a portion of the light-emitting material falls into the first opening to form an isolation unit. The isolation member includes the isolation unit.

14. The method for manufacturing a display panel according to claim 12, characterized in that, The at least portion forming the light-emitting unit and the isolator includes: A light-emitting material is disposed on one side of the substrate, and at least a portion of the light-emitting material falls into the defined opening to form the light-emitting unit; A second electrode material is disposed on one side of the substrate. A portion of the second electrode material falls into the defined opening to form a second electrode, and a portion of the second electrode material falls into the first opening to form a second isolation electrode. The isolation member includes the second isolation electrode.

15. The method for manufacturing a display panel according to claim 12, characterized in that, The at least portion forming the light-emitting unit and the isolator includes: A light-emitting material is disposed on one side of the substrate, and at least a portion of the light-emitting material falls into the defined opening to form the light-emitting unit; A second electrode material is disposed on one side of the substrate, and at least a portion of the second electrode material falls into the defined opening to form the second electrode; A first encapsulation material is disposed on one side of the substrate. A portion of the first encapsulation material falls into the defined opening to form a first encapsulation portion, and a portion of the first encapsulation material falls into the first opening to form a second encapsulation portion. The separator includes the second encapsulation portion.

16. The method for manufacturing a display panel according to claim 12, characterized in that, An isolation material layer is disposed on the side of the first planarization layer opposite to the substrate, and the isolation material layer is etched using an etching solution to form an isolation structure, including: An isolation material layer is disposed on the side of the first planarization layer opposite to the substrate, and the isolation material layer is etched with an etching solution to form an isolation structure with multiple defined openings, wherein the multiple defined openings include a first defined opening and a second defined opening. The at least portion forming the light-emitting unit and the isolator includes: A first light-emitting material, a second electrode material, and a second encapsulation material are used to fill the defined opening and the first opening, and then patterned. The first light-emitting material, the second electrode material, and the second encapsulation material located in the first defined opening respectively form a first light-emitting unit, a first sub-electrode, and a first encapsulation sub-part. The first light-emitting material, the second electrode material, and the first encapsulation material located in the first opening respectively form a first isolation unit, a first isolation sub-electrode, and a first encapsulation isolation part. A second light-emitting material, a second electrode material, and a second encapsulation material are used to fill the defined opening and the first opening, and then patterned. The second light-emitting material, the second electrode material, and the second encapsulation material located in the second defined opening respectively form a second light-emitting unit, a second sub-electrode, and a second encapsulation sub-part. The first light-emitting material, the second electrode material, and the second encapsulation material located in the first opening respectively form a second isolation unit, a second isolation sub-electrode, and a second encapsulation isolation part. Preferably, the plurality of defined openings includes a third defined opening, and at least a portion of forming the light-emitting unit and the insulating member further includes: A third light-emitting material, a second electrode material, and a second encapsulation material are used to fill the defined opening and the first opening, and then patterned. The third light-emitting material, the second electrode material, and the second encapsulation material located in the third defined opening respectively form a third light-emitting unit, a third sub-electrode, and a third encapsulation sub-part. The third light-emitting material, the second electrode material, and the second encapsulation material located in the first opening respectively form a third isolation unit, a third isolation sub-electrode, and a third encapsulation isolation part.

17. A display device, characterized in that, It includes a display panel as described in any one of claims 1 to 11, or a display panel prepared by the preparation method as described in any one of claims 12 to 17.

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