Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method of the display panel and a display device. The problem that in the prior art, a film layer of a display panel is not flat is solved. The display panel comprises a substrate, a first electrode layer, an isolation layer, a light-emitting structure layer and an insulating layer, the first electrode layer is located on one side of the substrate and comprises a plurality of first electrodes arranged at intervals, and the isolation layer is arranged on one side of the substrate and comprises an isolation structure and an isolation opening defined by the isolation structure; the light-emitting structure layer is located on the side, away from the substrate, of the first electrode layer and comprises a plurality of light-emitting structure parts limited in the isolation openings. The insulating layer comprises insulating parts located between the adjacent first electrodes, and the orthographic projection of the insulating parts on the substrate is not overlapped with the orthographic projection of the first electrodes on the substrate.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel, its manufacturing method, and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) and flat panel display devices based on light-emitting diode (LED) technologies are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body and wide range of applications, becoming the mainstream of display devices.

[0003] However, current display panels suffer from uneven film layers. Summary of the Invention

[0004] In view of this, the present application provides a display panel, a method for manufacturing the same, and a display device, which solves the problem of uneven film layers in the prior art display panels.

[0005] The first aspect of this application provides a display panel, including a substrate, a first electrode layer, an isolation layer, a light-emitting structure layer, and an insulating layer. The first electrode layer is located on one side of the substrate and includes a plurality of first electrodes spaced apart. The isolation layer is disposed on one side of the substrate and includes an isolation structure and an isolation opening formed by the isolation structure. The light-emitting structure layer is located on the side of the first electrode layer away from the substrate and includes a plurality of light-emitting structure portions defined within the isolation opening. The insulating layer includes an insulating portion located between adjacent first electrodes, and the orthographic projection of the insulating portion on the substrate does not overlap with the orthographic projection of the first electrode on the substrate.

[0006] In conjunction with the first aspect, in some possible embodiments, the thickness of the insulating portion is greater than or equal to 1500 angstroms and less than or equal to 3500 angstroms; preferably, the surface of the insulating portion facing away from the substrate is flush with the surface of the first electrode facing away from the substrate; preferably, the material of the insulating layer is an organic material.

[0007] In conjunction with the first aspect, in some possible implementations, a pixel defining layer is further included. The pixel defining layer is located on the side of the first electrode layer and the insulating layer away from the substrate. The pixel defining layer encloses a pixel opening, which exposes at least a portion of the first electrode. Preferably, the pixel defining layer is made of an inorganic material. Preferably, the orthographic projection of the pixel defining layer on the substrate covers the orthographic projection of the insulating portion on the substrate. Preferably, the orthographic projection of the isolation opening on the substrate covers the orthographic projection of the pixel opening on the substrate.

[0008] In conjunction with the first aspect, in some possible implementations, the orthographic projection of the isolation structure on the substrate and the orthographic projection of the first electrode on the substrate do not overlap; preferably, the orthographic projection of the isolation structure on the substrate is located within the orthographic projection of the insulating portion on the substrate.

[0009] In conjunction with the first aspect, in some possible implementations, the orthographic projection of the isolation structure on the substrate and the orthographic projection of the first electrode on the substrate at least partially overlap; preferably, the orthographic projection of the isolation structure on the substrate covers the orthographic projection of the insulating portion on the substrate.

[0010] In conjunction with the first aspect, in some possible embodiments, the isolation structure includes a first part and a second part, the first part being located on the side of the second part closer to the substrate, and the orthographic projection of the first part on the substrate being located within the orthographic projection of the second part on the substrate; preferably, the orthographic projection of the first part on the substrate and the orthographic projection of the insulating part on the substrate at least partially overlap; preferably, the orthographic projection of the second part on the substrate and the orthographic projection of the insulating part on the substrate at least partially overlap; preferably, the material of the first part is aluminum, copper, or silver; preferably, the material of the second part is titanium or molybdenum.

[0011] In conjunction with the first aspect, in some possible embodiments, the isolation structure further includes a third part located on the side of the first part closer to the substrate, wherein the orthographic projection of the first part on the substrate lies within the orthographic projection of the third part on the substrate; preferably, the orthographic projection of the third part on the substrate and the orthographic projection of the insulating part on the substrate at least partially overlap; preferably, the material of the third part is molybdenum or titanium.

[0012] In conjunction with the first aspect, in some possible implementations, a second electrode layer is also included, which is located on the side of the light-emitting structure layer away from the substrate; preferably, the second electrode layer overlaps with the first part.

[0013] In conjunction with the first aspect, in some possible implementations, an inorganic encapsulation portion is also included, located on the side of the second electrode layer away from the substrate and extending to the side of the isolation structure away from the substrate, wherein the orthographic projection of the inorganic encapsulation portion on the substrate covers the orthographic projection of the second electrode on the substrate; preferably, a plurality of inorganic encapsulation portions are spaced apart; preferably, a plurality of inorganic encapsulation portions and a plurality of light-emitting structures correspond one-to-one.

[0014] In conjunction with the first aspect, in some possible implementations, an organic encapsulation layer is also included, located on the side of the inorganic encapsulation portion away from the substrate, wherein the orthographic projection of the organic encapsulation layer on the substrate covers the orthographic projection of the inorganic encapsulation portion on the substrate; preferably, the display panel further includes an inorganic encapsulation layer, located on the side of the organic encapsulation layer away from the substrate, wherein the orthographic projection of the inorganic encapsulation layer on the substrate covers the orthographic projection of the organic encapsulation layer on the substrate.

[0015] A second aspect of this application provides a display panel, including a substrate, a first electrode layer, an isolation layer, a light-emitting structure layer, a plurality of conductive portions, and an insulating layer. The first electrode layer is located on one side of the substrate and includes a plurality of first electrodes spaced apart. The isolation layer is disposed on one side of the substrate and includes an isolation structure and an isolation opening formed by the isolation structure. The light-emitting structure layer is disposed on the side of the first electrode layer away from the substrate and includes a plurality of light-emitting structure portions defined within the isolation opening. The plurality of conductive portions are located within the gaps. The insulating layer includes an insulating portion located between adjacent first electrodes, and the insulating portion covers the conductive portion.

[0016] In conjunction with the second aspect, in some possible implementations, the thickness of the conductive portion is less than the thickness of the first electrode in the direction perpendicular to the substrate; preferably, a plurality of conductive portions are spaced apart, and an insulating portion is located between adjacent conductive portions and covers the side of the conductive portion away from the substrate.

[0017] In conjunction with the second aspect, in some possible implementations, the thickness of the insulating portion is greater than or equal to 1500 angstroms and less than or equal to 3500 angstroms; preferably, in the direction perpendicular to the substrate, the thickness of the insulating portion is equal to the thickness of the first electrode; preferably, the surface of the insulating portion facing away from the substrate is flush with the surface of the first electrode facing away from the substrate; preferably, the material of the insulating layer is an organic material.

[0018] In conjunction with the second aspect, in some possible implementations, the orthographic projection of the isolation structure on the substrate and the orthographic projection of the first electrode on the substrate do not overlap; preferably, the orthographic projection of the isolation structure on the substrate is located within the orthographic projection of the insulating portion on the substrate.

[0019] In conjunction with the second aspect, in some possible implementations, the orthographic projection of the isolation structure on the substrate and the orthographic projection of the first electrode on the substrate at least partially overlap; preferably, the orthographic projection of the isolation structure on the substrate covers the orthographic projection of the insulating portion on the substrate.

[0020] A third aspect of this application provides a method for fabricating a display panel, comprising fabricating a plurality of first electrode layers on one side of a substrate, the first electrode layers including a plurality of first electrodes spaced apart; fabricating an insulating material layer on the side of the first electrodes away from the substrate, and patterning the insulating material layer to obtain an insulating layer, the insulating layer including an insulating portion located between adjacent first electrodes, the orthographic projection of the insulating portion on the substrate not overlapping the orthographic projection of the first electrode on the substrate; and fabricating an isolation layer on the side of the first electrodes and the insulating layer away from the substrate, the isolation layer including an isolation structure and an isolation opening formed by the isolation structure.

[0021] In conjunction with the third aspect, in some possible implementations, fabricating a plurality of first electrode layers on one side of the substrate includes: fabricating a first electrode material layer on one side of the substrate and patterning the first electrode material layer to obtain a plurality of first electrodes and a plurality of conductive portions, wherein the plurality of first electrodes are spaced apart to form gaps, and the plurality of conductive portions are located within the gaps; preferably, an insulating layer is located within the gaps and covers the conductive portions.

[0022] In conjunction with the third aspect, in some possible embodiments, before fabricating the isolation layer on the side of the insulating layer away from the substrate, the fabrication method further includes: a pixel defining material layer on the side of the first electrode and the side of the insulating layer away from the substrate; fabricating the isolation layer on the side of the insulating layer away from the substrate includes: fabricating an isolation material layer on the side of the pixel defining material layer away from the substrate, and patterning the isolation material layer to form an isolation structure and an isolation opening enclosed by the isolation structure; after fabricating the isolation layer on the side of the insulating layer away from the substrate, the fabrication method further includes: patterning the pixel defining layer to obtain a pixel defining layer, the pixel defining layer enclosing a pixel opening, and the orthogonal projection of the pixel opening on the substrate being located within the orthogonal projection of the isolation opening on the substrate.

[0023] In conjunction with the third aspect, in some possible implementations, the preparation method further includes: sequentially preparing a light-emitting material layer, a second electrode material layer, and an inorganic encapsulation material layer within an isolation opening, and patterning the inorganic encapsulation material layer, the second electrode material layer, and the light-emitting material layer to obtain a light-emitting structure, a second electrode, and an inorganic encapsulation part.

[0024] The fourth aspect of this application provides a display device, including the display panel described above, or the display panel obtained by the preparation method described above.

[0025] According to the display panel, its preparation method, and display device provided in the embodiments of this application, by setting an insulating layer between adjacent first electrodes, electrode material residue is avoided during the etching process to form the first electrodes, thus preventing it from affecting the flatness of the display panel film. Attached Figure Description

[0026] The above and other objects, features, and advantages of this application will become more apparent from the more detailed description of the embodiments of this application in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0027] Figure 1a This is a schematic cross-sectional view of the display panel provided in the first embodiment of this application.

[0028] Figure 1b yes Figure 1aThe diagram shows a partially enlarged cross-sectional view of the display panel.

[0029] Figure 2 This is a cross-sectional structural diagram of the display panel provided in the second embodiment of this application.

[0030] Figure 3 This is a cross-sectional structural diagram of the display panel provided in the third embodiment of this application.

[0031] Figure 4a This is a schematic cross-sectional view of the display panel provided in the fourth embodiment of this application.

[0032] Figure 4b yes Figure 4a The diagram shows a partially enlarged cross-sectional view of the display panel.

[0033] Figure 5 This is a cross-sectional structural diagram of the display panel provided in the fifth embodiment of this application.

[0034] Figure 6 This is a flowchart of the method for manufacturing a display panel provided in the first embodiment of this application.

[0035] Figures 7a-7f This is a schematic diagram of the structure of the intermediate product obtained by executing the preparation method provided in the first embodiment of this application.

[0036] Figure 8 This is a flowchart of the method for preparing a display panel according to the second embodiment of this application.

[0037] Figure 9 This is a schematic diagram of the structure of the intermediate product obtained by executing the preparation method provided in the second embodiment of this application.

[0038] Figure 10 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Detailed Implementation

[0039] As mentioned in the background section, flat panel displays based on technologies such as Organic Light Emitting Display (OLED) and Light Emitting Diode (LED) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide application range, becoming the mainstream display devices. However, current display panels suffer from the problem of uneven film layers.

[0040] In view of this, the display panel, its manufacturing method, and the display device provided in the embodiments of this application avoid the presence of electrode material residue during the etching process of forming the first electrode, thereby affecting the flatness of the display panel film layer, by providing an insulating layer between adjacent first electrodes.

[0041] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0042] In the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity. It is understood that when a structure is referred to as being "on" or "below" another structure, the structure may be directly on or below the other structure, or there may be intermediate structures. The same reference numerals always indicate the same structure. Structures referred to herein include any of the following: membrane, element, device, component, assembly.

[0043] When a structure is referred to as being “connected” to another structure, it can be directly connected to the other structure or indirectly connected to the other structure by means of one or more intermediate structures placed between them.

[0044] Patent CN118251982A, Patent 202410864269.8, Patent PCT / CN2024 / 098407, Patent PCT / CN2024 / 102783, Patent PCT / CN2024 / 098217, Patent PCT / CN2024 / 099419, Patent PCT / CN2024 / 099072, Patent CN117979755A, Patent CN11799890 Patents CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A describe relevant technical solutions for isolation structures and encapsulation layers, the contents of which are incorporated herein by reference.

[0045] Figure 1a This is a schematic cross-sectional view of the display panel provided in the first embodiment of this application. Figure 1aAs shown, the display panel includes a substrate 11, a first electrode layer, an isolation layer, a light-emitting structure layer, and an insulating layer. The first electrode layer is located on one side of the substrate 11 and includes a plurality of first electrodes 121 spaced apart. The isolation layer is disposed on one side of the substrate 11 and includes an isolation structure 16 and an isolation opening Q formed by the isolation structure 16. The light-emitting structure layer is disposed on the side of the first electrode layer away from the substrate 11 and includes a plurality of light-emitting structure portions 123 defined within the isolation opening Q. The insulating layer includes an insulating portion 13 located between adjacent first electrodes 121. The orthographic projection of the insulating portion 13 on the substrate 11 does not overlap with the orthographic projection of the first electrode 121 on the substrate 11.

[0046] The substrate 11 may be a substrate substrate. In some embodiments, the substrate substrate may be a glass substrate. In some embodiments, the substrate substrate may include organic resin materials such as epoxy resin, triazine, silicone resin, or polyimide. For example, the substrate substrate may be an FR4 type printed circuit board (PCB), or a flexible PCB that is easily deformable. In some embodiments, the substrate substrate may include ceramic materials such as silicon nitride, aluminum nitride, or aluminum oxide, or include metals or metal compounds. For example, the substrate substrate may be a metal core PCB (MCPCB) or a metal copper clad laminate (MCCL).

[0047] Furthermore, in one embodiment, the substrate 11 may have a driving circuit for driving multiple light-emitting devices to emit light of corresponding colors. For example, the substrate 11 may include a substrate layer, a barrier layer, a buffer layer, a gate insulator (GI), a capacitance insulator (CI), a gate, a source and drain, an interlayer dielectric (ILD), etc.

[0048] In one embodiment, the display panel further includes light-emitting devices, which may be organic light-emitting diodes (OLEDs), micro light-emitting diodes (Micro LEDs), quantum dot light-emitting diodes (QLEDs), etc. The light-emitting devices can be of various colors, such as red light-emitting devices R, green light-emitting devices G, and blue light-emitting devices B.

[0049] In one embodiment, the light-emitting device includes a first electrode layer, a second electrode layer, and at least one light-emitting structural layer located between the first electrode layer and the second electrode layer. The second electrode layer is located on the side of the light-emitting structural layer facing away from the substrate 11, and the second electrode layer includes a plurality of second electrodes 122. The first electrode 121 may be an anode, and the second electrode 122 may be a cathode. The at least one light-emitting structural layer includes an emitting layer (EML), and may further include at least one of a hole injection layer (HIL), a hole transport layer (HTL), and an electron-blocking layer (EBL) located between the anode and the emitting layer (EML), and at least one of an electron injection layer (EIL), an electron transport layer (ETL), and a hole-blocking layer (HBL) located between the cathode and the emitting layer (EML).

[0050] In one embodiment, at least one light-emitting device 12 includes a plurality of light-emitting devices, the plurality of light-emitting devices including at least two of a red light-emitting device R, a green light-emitting device G, and a blue light-emitting device B.

[0051] Figure 1b yes Figure 1a The diagram shows a partially enlarged cross-sectional view of the display panel. Figure 1b As shown, in one embodiment, the thickness L1 of the insulating portion 13 is greater than or equal to 1500 angstroms and less than or equal to 3500 angstroms. For example, the thickness L1 of the insulating portion 13 can be 1500 angstroms, 2000 angstroms, 3500 angstroms, etc.

[0052] In one embodiment, the thickness L1 of the insulating portion 13 and the thickness L2 of the first electrode 121 are equal in the direction Z perpendicular to the substrate 11.

[0053] In one embodiment, the surface of the insulating portion 13 facing away from the substrate 11 and the surface of the first electrode 121 facing away from the substrate 11 are flush to improve the flatness of the film layer of the display panel.

[0054] In one embodiment, the insulating layer is made of an organic material.

[0055] In one embodiment, the orthographic projection of the isolation structure 16 on the substrate 11 and the orthographic projection of the insulating portion 13 on the substrate 11 at least partially overlap.

[0056] like Figure 1aAs shown, in one embodiment, the orthographic projection of the isolation structure 16 on the substrate 11 and the orthographic projection of the first electrode 121 on the substrate 11 do not overlap.

[0057] In one further embodiment, the orthographic projection of the isolation structure 16 on the substrate 11 lies within the orthographic projection of the insulating portion 13 on the substrate 11.

[0058] Figure 2 This is a schematic cross-sectional view of the display panel provided in the second embodiment of this application. (See attached diagram.) Figure 2 As shown, in one embodiment, the orthographic projection of the isolation structure 16 on the substrate 11 and the orthographic projection of the first electrode 121 on the substrate 11 at least partially overlap.

[0059] In one further embodiment, the orthographic projection of the isolation structure 16 on the substrate 11 covers the orthographic projection of the insulating portion 13 on the substrate 11.

[0060] In one embodiment, the isolation structure 16 can isolate the light-emitting structure layer and the second electrode layer of multiple light-emitting devices 12. In one embodiment, the isolation structure 16 includes a first part 161 and a second part 162, the first part 161 being located on the side of the second part 162 closer to the substrate 11, and the orthographic projection of the first part 161 on the substrate 11 being within the orthographic projection range of the second part 162 on the substrate 11. Exemplarily, the first part 161 can be designed as an independent film layer, that is, there is no physical interface inside the first part 161, and each part is made of the same material, for example, the material of the first part 161 is aluminum, copper, or silver. Alternatively, the first part 161 can be designed to be formed by at least two film layers stacked together. For example, the first part 161 is formed by stacking two conductive film layers. The materials of the two conductive film layers can be molybdenum and aluminum, respectively, and the conductive film layer made of molybdenum is located between the substrate 11 and the conductive film layer made of aluminum. Exemplarily, the first part 161 includes a conductive portion, or the first part 161 itself is a conductive structure. The first part 161 overlaps with the second electrode 122 of the light-emitting device 12, so that the second electrodes 122 of adjacent light-emitting devices 12 are electrically connected to each other, thereby realizing a full-surface cathode. The material of the second part 162 can be an organic material, an inorganic material, or a metallic material, such as molybdenum or titanium. If the second part 162 is a metallic material, the material of the second part 162 can be titanium.

[0061] In one embodiment, the orthographic projection of the first part 161 on the substrate 11 and the orthographic projection of the insulating part 13 on the substrate 11 at least partially overlap.

[0062] For example, such as Figure 1a As shown, the orthographic projection of the first part 161 on the substrate 11 is located within the orthographic projection of the insulating part 13 on the substrate 11.

[0063] For example, such as Figure 2As shown, the orthographic projection of the first part 161 on the substrate 11 covers the orthographic projection of the insulating part 13 on the substrate 11.

[0064] In one embodiment, the orthographic projection of the second part 162 on the substrate 11 and the orthographic projection of the insulating part 13 on the substrate 11 at least partially overlap.

[0065] For example, such as Figure 1a As shown, the orthographic projection of the second part 162 on the substrate 11 is located within the orthographic projection of the insulating part 13 on the substrate 11.

[0066] For example, such as Figure 2 As shown, the orthographic projection of the second part 162 on the substrate 11 covers the orthographic projection of the insulating part 13 on the substrate 11.

[0067] In one embodiment, the isolation structure 16 further includes a third portion 163 located on the side of the first portion 161 near the substrate 11, wherein the orthographic projection of the first portion 161 onto the substrate 11 falls within the orthographic projection range of the third portion 163 onto the substrate 11. The material of the third portion 163 is molybdenum or titanium. For example, the first portion 161 is a conductive film layer made of aluminum, and the third portion 163 is a conductive film layer made of molybdenum. In this case, the cross-section of the isolation structure 16 is I-shaped. Of course, in other embodiments, the third portion 163 is a conductive film layer made of titanium.

[0068] In one embodiment, the orthographic projection of the third part 163 on the substrate 11 and the orthographic projection of the insulating part 13 on the substrate 11 at least partially overlap.

[0069] For example, such as Figure 1a As shown, the orthographic projection of the third part 163 on the substrate 11 is located within the orthographic projection of the insulating part 13 on the substrate 11.

[0070] For example, such as Figure 2 As shown, the orthographic projection of the third part 163 on the substrate 11 covers the orthographic projection of the insulating part 13 on the substrate 11.

[0071] In one embodiment, the display panel further includes a pixel definition layer 14, which is located on the side of the first electrode layer and the insulating layer away from the substrate 11. The pixel definition layer 14 encloses a pixel opening 141, which exposes at least a portion of the first electrode 121.

[0072] In one embodiment, the orthogonal projection of the isolation opening Q on the substrate 11 covers the orthogonal projection of the pixel opening 141 on the substrate 11.

[0073] In one embodiment, the orthographic projection of the pixel definition layer 14 on the substrate 11 covers the orthographic projection of the insulating portion 13 on the substrate 11.

[0074] Optionally, the material of the pixel definition layer 14 may include inorganic materials.

[0075] Optionally, the pixel definition layer 14 can be a light-transmitting material to allow light from the light-emitting device 12 to pass through the pixel definition layer better. Optionally, the pixel definition layer 14 can be an opaque material, which can improve the light absorption of the pixel definition layer 14, reduce the reflectivity of the display panel, further reduce optical crosstalk between adjacent light-emitting devices 12, and improve the display effect of the display panel.

[0076] In one embodiment, the display panel further includes an inorganic encapsulation portion 17, which is located on the side of the second electrode layer opposite to the substrate 11 and extends to the side of the isolation structure 16 opposite to the substrate 11. The orthographic projection of the inorganic encapsulation portion 17 on the substrate 11 covers the orthographic projection of the second electrode 122 on the substrate 11. Exemplarily, the material of the inorganic encapsulation portion 17 is silicon oxide, silicon oxynitride, or silicon nitride, etc. The inorganic encapsulation portion 17 can be a single layer, multiple layers, composite layers, etc.

[0077] In one embodiment, there are multiple inorganic encapsulation portions 17, which are spaced apart.

[0078] In one embodiment, a plurality of inorganic encapsulation portions 17 correspond one-to-one with a plurality of light-emitting structural portions 123.

[0079] Figure 3 This is a schematic cross-sectional view of the display panel provided in the third embodiment of this application. Figure 3 As shown, in one embodiment, the display panel further includes an organic encapsulation layer 18, which is located on the side of the inorganic encapsulation portion 17 facing away from the substrate 11. The orthographic projection of the organic encapsulation layer 18 onto the substrate 11 covers the orthographic projection of the inorganic encapsulation portion 17 onto the substrate 11. Exemplarily, the material of the organic encapsulation layer 18 is a fiber material, a resin material, or a multilayer board material, etc. The organic encapsulation layer 18 can be a single layer, a multilayer, a composite layer, etc.

[0080] The display panel also includes an inorganic encapsulation layer 19, which is located on the side of the organic encapsulation layer 18 facing away from the substrate 11. The orthographic projection of the inorganic encapsulation layer 19 onto the substrate 11 covers the orthographic projection of the organic encapsulation layer 18 onto the substrate 11. For example, the material of the inorganic encapsulation layer 19 is silicon oxide, silicon oxynitride, or silicon nitride, etc. The inorganic encapsulation layer 19 can be a single layer, multiple layers, composite layers, etc.

[0081] According to the display panel provided in the embodiments of this application, by providing an insulating layer between adjacent first electrodes, electrode material residue is avoided during the etching process to form the first electrodes, thus preventing it from affecting the flatness of the display panel film.

[0082] Figure 4a This is a schematic cross-sectional view of the display panel provided in the fourth embodiment of this application. Figure 4a and Figure 4b As shown, the display panel includes a substrate 11, a first electrode layer, an isolation layer, a light-emitting structure layer, a plurality of conductive portions 15, and an insulating layer. The first electrode layer is located on one side of the substrate 11 and includes a plurality of first electrodes 121 spaced apart, with a gap 101 formed between adjacent first electrodes 121. The isolation layer is located on one side of the substrate 11 and includes an isolation structure 16 and an isolation opening Q formed by the isolation structure 16. The light-emitting structure layer is located on the side of the first electrode layer away from the substrate 11 and includes a plurality of light-emitting structure portions 123 defined within the isolation opening Q. The plurality of conductive portions 15 are located within the gap 101. The insulating layer includes an insulating portion 13 located between adjacent first electrodes 121, and the insulating portion 13 covers the conductive portion 15.

[0083] The conductive part 15 is the electrode remaining after the first electrode 121 is patterned. Therefore, the shape, size, and distance between adjacent conductive parts 15 are not limited.

[0084] Figure 4b yes Figure 4a The diagram shows a partially enlarged cross-sectional view of the display panel. Figure 4b As shown, in one embodiment, since the conductive portion 15 is an electrode remaining after etching, the thickness L3 of the conductive portion 15 in the direction Z perpendicular to the substrate 11 is less than the thickness L2 of the first electrode 121.

[0085] In one embodiment, the insulating portion 13 is located between adjacent conductive portions 15 within the gap 101 and the insulating portion 13 also covers the side of the conductive portion 15 away from the substrate 11.

[0086] In one embodiment, the thickness L1 of the insulating portion 13 is greater than or equal to 1500 angstroms and less than or equal to 3500 angstroms. For example, the thickness L1 of the insulating portion 13 can be 1500 angstroms, 2000 angstroms, 3500 angstroms, etc.

[0087] In one embodiment, the thickness L1 of the insulating portion 13 and the thickness L2 of the first electrode 121 are equal in the direction Z perpendicular to the substrate 11.

[0088] In one embodiment, the surface of the insulating portion 13 facing away from the substrate 11 and the surface of the first electrode 121 facing away from the substrate 11 are flush to improve the flatness of the film layer of the display panel.

[0089] In one embodiment, the insulating layer is made of an organic material.

[0090] In one embodiment, the orthographic projection of the isolation structure 16 on the substrate 11 and the orthographic projection of the insulating portion 13 on the substrate 11 at least partially overlap.

[0091] like Figure 4aAs shown, in one embodiment, the orthographic projection of the isolation structure 16 on the substrate 11 and the orthographic projection of the first electrode 121 on the substrate 11 do not overlap.

[0092] In one further embodiment, the orthographic projection of the isolation structure 16 on the substrate 11 lies within the orthographic projection of the insulating portion 13 on the substrate 11.

[0093] Figure 5 This is a schematic cross-sectional view of the display panel provided in the fifth embodiment of this application. Figure 5 As shown, in one embodiment, the orthographic projection of the isolation structure 16 on the substrate 11 and the orthographic projection of the first electrode 121 on the substrate 11 at least partially overlap.

[0094] In one further embodiment, the orthographic projection of the isolation structure 16 on the substrate 11 covers the orthographic projection of the insulating portion 13 on the substrate 11.

[0095] The display panel provided according to the embodiments of this application belongs to the same inventive concept as the display panel provided in the foregoing embodiments of this application, and has corresponding film layer structures and beneficial effects. Details not described in detail in the embodiments of this display panel can be found in the embodiments section of the foregoing display panel, and will not be repeated here.

[0096] This application also provides a method for manufacturing a display panel. Figure 6 This is a flowchart illustrating a method for fabricating a display panel according to the first embodiment of this application. This fabrication method is used to fabricate the display panel provided in any of the above embodiments. Figure 6 As shown, the preparation method includes:

[0097] Step S610: A first electrode layer is prepared on one side of the substrate. The first electrode layer includes a plurality of first electrodes spaced apart.

[0098] In step S620, an insulating material layer is prepared on the side of the first electrode layer away from the substrate, and the insulating material layer is patterned to obtain an insulating layer. The insulating layer includes an insulating portion located between adjacent first electrodes, and the orthographic projection of the insulating portion on the substrate does not overlap with the orthographic projection of the first electrode on the substrate.

[0099] Step S630: An isolation layer is prepared on the side of the first electrode and the insulating layer away from the substrate. The isolation layer includes an isolation structure and an isolation opening formed by the isolation structure.

[0100] Figures 7a-7f This is a schematic diagram of the structure of the intermediate product obtained by executing the preparation method provided in the first embodiment of this application. The preparation method specifically includes:

[0101] According to step S610, refer to Figure 7aA first electrode layer is prepared on one side of the substrate 11. The first electrode layer includes a plurality of first electrodes 121 arranged at intervals.

[0102] According to step S620, refer to Figure 7b An insulating material layer is prepared on the side of the first electrode 121 away from the substrate 11, and the insulating material layer is patterned to obtain an insulating layer. The insulating layer includes an insulating portion 13 located between adjacent first electrodes 121. The orthographic projection of the insulating portion 13 on the substrate 11 does not overlap with the orthographic projection of the first electrode 121 on the substrate 11.

[0103] In one embodiment, the thickness of the insulating portion 13 is greater than or equal to 1500 angstroms and less than or equal to 3500 angstroms.

[0104] In one embodiment, the thickness of the insulating portion 13 is equal to the thickness of the first electrode 121 in a direction perpendicular to the substrate 11.

[0105] In one embodiment, the surface of the insulating portion 13 facing away from the substrate 11 is flush with the surface of the first electrode 121 facing away from the substrate 11.

[0106] According to step S630, an isolation layer is prepared on the side of the first electrode 121 and the insulating layer away from the substrate 11. The isolation layer includes an isolation structure 16 and an isolation opening Q formed by the isolation structure 16.

[0107] In one embodiment, forming an isolation layer between the first electrode 121 and the insulating layer on the side facing away from the substrate 11 includes:

[0108] See Figure 7c A pixel definition material layer 140 is prepared on the side of the first electrode 121 and the insulating layer away from the substrate 11. The pixel definition material can be an inorganic material.

[0109] See Figure 7d The preparation of the isolation layer on the side of the first electrode 121 and the insulating layer away from the substrate 11 includes: preparing an isolation material layer on the side of the pixel definition material layer 140 away from the substrate 11, and patterning the isolation material layer to form an isolation structure 16 and an isolation opening Q enclosed by the isolation structure 16.

[0110] An isolation material layer is prepared using a film-forming process, and then the isolation material layer is patterned to obtain the isolation structure 16. For example, a groove can be formed on the isolation material layer using a dry etching process first, and then the sidewalls of the groove can be further etched using a wet etching process to form an undercut structure.

[0111] In one embodiment, after the isolation layer is formed on the side of the first electrode 121 and the insulating layer facing away from the substrate 11, the fabrication method further includes:

[0112] See Figure 7e The pixel definition material layer 140 is patterned to obtain the pixel definition layer 14. The pixel definition layer 14 encloses the pixel opening 141. The orthogonal projection of the pixel opening 141 on the substrate 11 is located within the orthogonal projection of the isolation opening Q on the substrate 11.

[0113] See Figure 7f In one embodiment, the preparation method further includes: sequentially preparing a light-emitting material layer, a second electrode material layer, and an inorganic encapsulation material layer within the isolation opening Q, and patterning the inorganic encapsulation material layer, the second electrode material layer, and the light-emitting material layer to obtain a light-emitting structure 123, a second electrode 122, and an inorganic encapsulation part 17.

[0114] In one embodiment, the light-emitting material layer and the second electrode material layer can be formed by vapor deposition.

[0115] In one embodiment, the inorganic encapsulation material layer can be formed using a thin film deposition process.

[0116] In one embodiment, the preparation method may further include: preparing an organic encapsulation layer and an inorganic encapsulation layer on the side of the inorganic encapsulation portion 17 away from the substrate 11.

[0117] Figure 8 This is a flowchart of the method for manufacturing a display panel according to the second embodiment of this application. Figure 8 As shown, fabricating a first electrode layer on one side of the substrate includes:

[0118] Step S611: A first electrode material layer is prepared on one side of the substrate, and the first electrode material layer is patterned to obtain a plurality of first electrodes and a plurality of conductive parts. The plurality of first electrodes are spaced apart to form gaps, and the plurality of conductive parts are spaced apart and located within the gaps.

[0119] Figure 9 This is a schematic diagram of the structure of the intermediate product obtained by executing the preparation method provided in the second embodiment of this application. The preparation method specifically includes:

[0120] According to step S631, see [link / reference] Figure 9 A first electrode material layer is prepared on one side of the substrate 11, and the first electrode material layer is patterned to obtain a plurality of first electrodes 121 and a plurality of conductive parts 15. The plurality of first electrodes 121 are spaced apart to form gaps 101, and the plurality of conductive parts 15 are spaced apart and located within the gaps 101.

[0121] In one embodiment, the thickness of the conductive portion 15 is less than the thickness of the first electrode 121 in a direction perpendicular to one side of the substrate 11.

[0122] In one embodiment, the insulating layer is located within the gap 101 and covers the conductive portion 15.

[0123] Figure 10 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Figure 10 As shown, the display device is a product with image display capabilities. For example, the display device can be used to display static images, such as pictures or photographs. The display device can also be used to display dynamic images, such as videos.

[0124] Display devices can be laptops, mobile phones, handheld or portable computers, cameras, camcorders, in-vehicle smart central control screens, calculators, smartwatches, GPS navigators, electronic photographs, electronic billboards or signs, projectors, etc.

[0125] The display device includes the display panel 100 provided in any of the above embodiments or the display panel 100 obtained by the manufacturing method provided in any of the above embodiments. The display panel 100 may be an organic light-emitting diode display substrate or a quantum dot electroluminescent display substrate.

[0126] In addition, the display device can also perform functions such as taking photos, recording videos, fingerprint recognition, and facial recognition. Accordingly, the display device also includes at least one functional module for implementing the above functions, such as an under-display camera or an under-display fingerprint recognition sensor.

[0127] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0128] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A display panel, characterized in that, include: substrate; A first electrode layer is located on one side of the substrate and includes a plurality of first electrodes spaced apart. An isolation layer is disposed on one side of the substrate and includes an isolation structure and an isolation opening formed by the isolation structure. A light-emitting structure layer is disposed on the side of the first electrode layer away from the substrate and includes a plurality of light-emitting structure portions defined within the isolation opening; as well as An insulating layer includes an insulating portion located between adjacent first electrodes, wherein the orthographic projection of the insulating portion on the substrate does not overlap with the orthographic projection of the first electrode on the substrate.

2. The display panel according to claim 1, characterized in that, The thickness of the insulating portion is greater than or equal to 1500 angstroms and less than or equal to 3500 angstroms; Preferably, in the direction perpendicular to the substrate, the thickness of the insulating portion is equal to the thickness of the first electrode; Preferably, the surface of the insulating portion facing away from the substrate is flush with the surface of the first electrode facing away from the substrate; Preferably, the insulating layer is made of an organic material.

3. The display panel according to claim 1, characterized in that, It also includes a pixel definition layer, which is located on the side of the first electrode layer and the insulating layer away from the substrate. The pixel definition layer encloses a pixel opening, and the pixel opening exposes at least a portion of the first electrode. Preferably, the pixel definition layer is made of an inorganic material; Preferably, the orthographic projection of the pixel definition layer on the substrate covers the orthographic projection of the insulating portion on the substrate; Preferably, the orthographic projection of the isolation opening on the substrate covers the orthographic projection of the pixel opening on the substrate.

4. The display panel according to claim 3, characterized in that, The orthographic projection of the isolation structure on the substrate and the orthographic projection of the first electrode on the substrate do not overlap; Preferably, the orthographic projection of the isolation structure on the substrate is located within the orthographic projection of the insulating portion on the substrate.

5. The display panel according to claim 1, characterized in that, The orthographic projection of the isolation structure on the substrate and the orthographic projection of the first electrode on the substrate at least partially overlap; Preferably, the orthographic projection of the isolation structure on the substrate covers the orthographic projection of the insulating portion on the substrate.

6. The display panel according to claim 1, characterized in that, The isolation structure includes a first part and a second part, the first part being located on the side of the second part closer to the substrate, and the orthographic projection of the first part on the substrate being located within the orthographic projection of the second part on the substrate; Preferably, the orthographic projection of the first part on the substrate and the orthographic projection of the insulating part on the substrate at least partially overlap; Preferably, the orthographic projection of the second part on the substrate and the orthographic projection of the insulating part on the substrate at least partially overlap; Preferably, the material of the first part is aluminum, copper or silver; Preferably, the material of the second part is titanium or molybdenum.

7. The display panel according to claim 6, characterized in that, The isolation structure further includes a third part, which is located on the side of the first part closer to the substrate, and the orthographic projection of the first part on the substrate is located within the orthographic projection of the third part on the substrate; Preferably, the orthographic projection of the third part on the substrate and the orthographic projection of the insulating part on the substrate at least partially overlap; Preferably, the material of the third part is molybdenum or titanium.

8. The display panel according to claim 6, characterized in that, It also includes a second electrode layer, which is located on the side of the light-emitting structure layer away from the substrate; Preferably, the second electrode layer overlaps with the first part.

9. The display panel according to claim 8, characterized in that, It also includes an inorganic encapsulation portion located on the side of the second electrode layer away from the substrate and extending to the side of the isolation structure away from the substrate, wherein the orthographic projection of the inorganic encapsulation portion on the substrate covers the orthographic projection of the second electrode on the substrate; Preferably, the plurality of inorganic encapsulation portions are spaced apart; Preferably, the plurality of inorganic encapsulation portions and the plurality of light-emitting structural portions correspond one-to-one.

10. The display panel according to claim 9, characterized in that, It also includes an organic encapsulation layer located on the side of the inorganic encapsulation portion away from the substrate, wherein the orthogonal projection of the organic encapsulation layer on the substrate covers the orthogonal projection of the inorganic encapsulation portion on the substrate; Preferably, the display panel further includes an inorganic encapsulation layer located on the side of the organic encapsulation layer opposite to the substrate, wherein the orthographic projection of the inorganic encapsulation layer on the substrate covers the orthographic projection of the organic encapsulation layer on the substrate.

11. A display panel, characterized in that, include: substrate; A first electrode layer is located on one side of the substrate and includes a plurality of first electrodes spaced apart, with gaps formed between adjacent first electrodes. An isolation layer is disposed on one side of the substrate and includes an isolation structure and an isolation opening formed by the isolation structure. A light-emitting structure layer is disposed on the side of the first electrode layer away from the substrate and includes a plurality of light-emitting structure portions defined within the isolation opening; Multiple conductive parts are located within the gap; as well as An insulating layer includes an insulating portion located between adjacent first electrodes, the insulating portion covering the conductive portion.

12. The display panel according to claim 11, characterized in that, In a direction perpendicular to the substrate, the thickness of the conductive portion is less than the thickness of the first electrode; Preferably, the plurality of conductive portions are spaced apart, and the insulating portion is located between adjacent conductive portions and covers the side of the conductive portions away from the substrate.

13. The display panel according to claim 11, characterized in that, The thickness of the insulating portion is greater than or equal to 1500 angstroms and less than or equal to 3500 angstroms; Preferably, in the direction perpendicular to the substrate, the thickness of the insulating portion is equal to the thickness of the first electrode; Preferably, the surface of the insulating portion facing away from the substrate is flush with the surface of the first electrode layer facing away from the substrate; Preferably, the insulating layer is made of an organic material.

14. The display panel according to claim 11, characterized in that, The orthographic projection of the isolation structure on the substrate and the orthographic projection of the first electrode on the substrate do not overlap; Preferably, the orthographic projection of the isolation structure on the substrate is located within the orthographic projection of the insulating portion on the substrate.

15. The display panel according to claim 11, characterized in that, The orthographic projection of the isolation structure on the substrate and the orthographic projection of the first electrode on the substrate at least partially overlap; Preferably, the orthographic projection of the isolation structure on the substrate covers the orthographic projection of the insulating portion on the substrate.

16. A method for manufacturing a display panel, characterized in that, include: A first electrode layer is prepared on one side of a substrate, the first electrode layer comprising a plurality of first electrodes spaced apart; An insulating material layer is prepared on the side of the first electrode layer away from the substrate, and the insulating material layer is patterned to obtain an insulating layer. The insulating layer includes an insulating portion located between adjacent first electrodes, and the orthographic projection of the insulating portion on the substrate does not overlap with the orthographic projection of the first electrode on the substrate. An isolation layer is prepared on the side of the first electrode and the insulating layer away from the substrate. The isolation layer includes an isolation structure and an isolation opening formed by the isolation structure.

17. The preparation method according to claim 16, characterized in that, The fabrication of the first electrode layer on one side of the substrate includes: A first electrode material layer is prepared on one side of a substrate, and the first electrode material layer is patterned to obtain a plurality of first electrodes and a plurality of conductive parts. The plurality of first electrodes are spaced apart to form gaps, and the plurality of conductive parts are located within the gaps. Preferably, the insulating layer is located within the gap and covers the conductive portion.

18. The preparation method according to claim 16, characterized in that, Before fabricating an isolation layer on the side of the insulating layer facing away from the substrate, the fabrication method further includes: A pixel definition material layer is formed on the side of the first electrode and the insulating layer facing away from the substrate. The preparation of an isolation layer on the side of the insulating layer opposite to the substrate includes: An isolation material layer is prepared on the side of the pixel definition material layer away from the substrate, and the isolation material layer is patterned to form an isolation structure and an isolation opening enclosed by the isolation structure; After the insulating layer is prepared on the side facing away from the substrate, the preparation method further includes: The pixel definition layer is patterned to obtain the pixel definition layer, which encloses the pixel opening. The orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate.

19. The preparation method according to claim 16, characterized in that, The preparation method further includes: sequentially preparing a light-emitting material layer, a second electrode material layer, and an inorganic encapsulation material layer within an isolation opening, and patterning the inorganic encapsulation material layer, the second electrode material layer, and the light-emitting material layer to obtain a light-emitting structure, a second electrode layer, and an inorganic encapsulation part.

20. A display device, characterized in that, The display panel includes any one of claims 1-13, or the display panel obtained by the preparation method described in claims 16-19.

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