Signal line repairing method and device and packaging structure

Abstract

The invention relates to a signal line repairing method, a signal line repairing device and a packaging structure. The method comprises the steps that signal lines in a packaging structure are detected, one or more protruding block areas are arranged in the packaging structure, each protruding block area comprises a plurality of protruding block arrays, each protruding block array comprises a plurality of protruding blocks, the number of the protruding blocks in all the protruding block arrays in the same protruding block area is the same, and the number of the protruding blocks in all the protruding block arrays in the same protruding block area is smaller than the number of the protruding blocks in all the protruding block arrays in the same protruding block area; the plurality of bump arrays in each bump region comprise a plurality of signal bump arrays and at least one redundant bump array, and different signal lines correspond to different signal bumps; if it is detected that a first signal line which does not meet the use condition exists in the signal lines, determining a first bump array needing to be repaired in the signal bump array according to a first bump corresponding to the first signal line; the first bump array is repaired based on the redundant bump array. And the power and the power consumption can be reduced while the repair efficiency and the repair speed of the signal line are improved.

Description

Technical Field

[0001] This disclosure relates to the field of integrated circuits, and in particular to a signal line repair method, apparatus, and packaging structure. Background Technology

[0002] Lane repair is primarily used during package initialization and training. It allows for functional testing of signal lines on the package structure and the replacement of faulty or non-short-circuited signal lines, ensuring the normal operation of the package structure. However, related technologies for lane repair suffer from high power consumption and low efficiency. Summary of the Invention

[0003] In view of this, this disclosure proposes a signal line repair method, apparatus, and packaging structure.

[0004] According to one aspect of this disclosure, a signal line repair method is provided, the method comprising:

[0005] The signal lines in the package structure are detected. The package structure has one or more bump regions. Each bump region includes multiple bump arrays. Each bump array includes multiple bumps and the number of bumps in each bump array in the same bump region is the same. The multiple bump arrays in each bump region include multiple signal bump arrays and at least one redundant bump array. The signal bumps corresponding to different signal lines are different.

[0006] If a first signal line that does not meet the usage conditions is detected in the signal line, the first bump array that needs to be repaired in the signal bump array is determined according to the first bump corresponding to the first signal line. The first bump is the signal bump corresponding to the first signal line.

[0007] Repair the first bump array according to the redundant bump array.

[0008] In one possible implementation, the redundant bump array is located in the middle region of the bump area.

[0009] In one possible implementation, multiple bump arrays in each of the bump regions are arranged linearly, and the redundant bump array is located at the middle position of the multiple bump arrays in the bump region.

[0010] In one possible implementation, the method further includes:

[0011] Based on the relative positional relationship between the first bump array and the redundant bump array in the bump region where the first bump array is located, the moving direction corresponding to the repair of the first bump array is determined.

[0012] Wherein, if the first bump array is located to the left of the redundant bump array in the bump region, the corresponding movement direction of the first bump array is to the right; or, if the first bump array is located to the right of the redundant bump array in the bump region, the corresponding movement direction of the first bump array is to the left.

[0013] In one possible implementation, the method further includes:

[0014] Based on the movement direction corresponding to the first bump array, a second bump array is determined from the redundant bump array in the bump region where the first bump array is located, so as to repair the first bump array based on the second bump array.

[0015] In one possible implementation, the packaging structure includes any one of a 2D packaging structure, a 2.5D packaging structure, and a 3D packaging structure.

[0016] The packaging structure includes multiple structural layers, each structural layer having one or more bump regions. The bumps in each structural layer are divided into at least one repair group. The same repair group includes bumps in at least one bump region in the same structural layer. The structural layer is a device layer or interposer layer on which a chip is disposed. The bumps of each chip in the device layer are divided into the same repair group.

[0017] In one possible implementation, the number of bumps in each bump array within each bump region belonging to the same repair group in the encapsulation structure is the same; the method further includes:

[0018] If all redundant bump arrays in the bump region where the first bump array is located are occupied, a second bump array is selected from other bump regions belonging to the same repair group as the bump region where the first bump array is located, so as to repair the first bump array based on the second bump array.

[0019] In one possible implementation, repairing the first bump array based on the redundant bump array includes:

[0020] The signal lines corresponding to each signal bump in the first bump array are replaced by signal lines corresponding to each signal bump in the second bump array determined from the redundant bump array through remapping.

[0021] In one possible implementation, the encapsulation structure is provided with a power switch for each of the redundant bump arrays, and the method further includes:

[0022] If it is determined that the redundant bump array is not in use, the power switch corresponding to each unused redundant bump array is turned off, thereby de-energizing each bump in each unused redundant bump array; and / or

[0023] If it is determined that the redundant bump array is identified as the second bump array, the power switch corresponding to the second bump array is turned on to power on each bump in the second bump array.

[0024] According to another aspect of this disclosure, a signal line repair apparatus is provided, the apparatus comprising:

[0025] A signal line detection module is used to detect signal lines in a package structure. The package structure has one or more bump regions, each bump region includes multiple bump arrays, each bump array includes multiple bumps, and the number of bumps in each bump array in the same bump region is the same. The multiple bump arrays in each bump region include multiple signal bump arrays and at least one redundant bump array. Different signal lines correspond to different signal bumps.

[0026] The first array determination module is used to determine the first bump array that needs to be repaired in the signal bump array based on the first bump corresponding to the first signal line when a first signal line that does not meet the usage conditions is detected in the signal line. The first bump is the signal bump corresponding to the first signal line.

[0027] The repair module is used to repair the first bump array based on the redundant bump array.

[0028] In one possible implementation, the redundant bump array is located in the middle region of the bump area.

[0029] In one possible implementation, multiple bump arrays in each of the bump regions are arranged linearly, and the redundant bump array is located at the middle position of the multiple bump arrays in the bump region.

[0030] In one possible implementation, the device further includes:

[0031] The movement direction determination module is used to determine the movement direction corresponding to the repair of the first bump array based on the relative positional relationship between the first bump array and the redundant bump array in the bump region where the first bump array is located.

[0032] Wherein, if the first bump array is located to the left of the redundant bump array in the bump region, the corresponding movement direction of the first bump array is to the right; or, if the first bump array is located to the right of the redundant bump array in the bump region, the corresponding movement direction of the first bump array is to the left.

[0033] In one possible implementation, the device further includes:

[0034] The second array determination module is used to determine a second bump array from the redundant bump array in the bump region where the first bump array is located according to the movement direction corresponding to the first bump array, so as to repair the first bump array based on the second bump array.

[0035] In one possible implementation, the packaging structure includes any one of a 2D packaging structure, a 2.5D packaging structure, and a 3D packaging structure.

[0036] The packaging structure includes multiple structural layers, each structural layer having one or more bump regions. The bumps in each structural layer are divided into at least one repair group. The same repair group includes bumps in at least one bump region in the same structural layer. The structural layer is a device layer or interposer layer on which a chip is disposed. The bumps of each chip in the device layer are divided into the same repair group.

[0037] In one possible implementation, the number of bumps in each bump array within each bump region belonging to the same repair group in the encapsulation structure is the same; the device further includes:

[0038] The third array determination module is used to select a second bump array from other bump areas belonging to the same repair group as the bump area where the first bump array is located if all redundant bump arrays in the bump area where the first bump array is located are occupied, so as to repair the first bump array based on the second bump array.

[0039] In one possible implementation, the repair module includes:

[0040] The repair submodule is used to replace the signal lines corresponding to each signal bump in the first bump array with the signal lines corresponding to each signal bump in the second bump array determined from the redundant bump array by means of remapping.

[0041] In one possible implementation, the packaging structure includes a power switch for each of the redundant bump arrays, and the device further includes:

[0042] The power-on control module is configured to, when it is determined that the redundant bump array is not in use, control the power-on switch corresponding to each unused redundant bump array to disconnect, thereby de-energizing each bump in each unused redundant bump array; and / or

[0043] If it is determined that the redundant bump array is identified as the second bump array, the power switch corresponding to the second bump array is turned on to power on each bump in the second bump array.

[0044] According to another aspect of this disclosure, an encapsulation structure is provided, wherein one or more bump regions are provided, each bump region includes multiple bump arrays, each bump array includes multiple bumps and the number of bumps in each bump array in the same bump region is the same, the multiple bump arrays in each bump region include multiple signal bump arrays and at least one redundant bump array, and the signal bumps corresponding to different signal lines are different.

[0045] The packaging structure also includes the aforementioned signal line repair device.

[0046] According to another aspect of this disclosure, a signal line repair apparatus is provided, comprising: a processor; a memory for storing processor-executable instructions; wherein the processor is configured to implement the above method when executing the instructions stored in the memory.

[0047] According to another aspect of this disclosure, a non-volatile computer-readable storage medium is provided that stores computer program instructions thereon, wherein the computer program instructions, when executed by a processor, implement the above-described method.

[0048] According to another aspect of this disclosure, a computer program product is provided, including computer-readable code, or a non-volatile computer-readable storage medium carrying computer-readable code, wherein when the computer-readable code is run in a processor of an electronic device, the processor in the electronic device performs the above-described method.

[0049] The signal line repair method, apparatus, and packaging structure provided in this disclosure arrange redundant bump arrays in the middle of multiple bump arrays within each bump area of ​​the packaging structure. Then, during signal line detection within the packaging structure, if a first signal line that does not meet the usage conditions is detected, the first bump array requiring repair is determined based on the first bumps corresponding to each first signal line. The first bump array is then repaired based on the redundant bump array. This improves the efficiency and speed of signal line repair while reducing power consumption.

[0050] Other features and aspects of this disclosure will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0051] The accompanying drawings, which are included in and form part of this specification, illustrate exemplary embodiments, features, and aspects of this disclosure together with the specification and serve to explain the principles of this disclosure.

[0052] Figure 1 A flowchart illustrating a signal line repair method according to an embodiment of the present disclosure is shown.

[0053] Figure 2 The packaging structure used in a signal line repair method according to an embodiment of the present disclosure is shown.

[0054] Figures 3-5 This diagram illustrates the direction of movement in a signal line repair method according to an embodiment of the present disclosure.

[0055] Figure 6 This is a block diagram illustrating an apparatus 1900 for signal line repair according to an exemplary embodiment. Detailed Implementation

[0056] Various exemplary embodiments, features, and aspects of this disclosure will now be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote elements that have the same or similar functions. Although various aspects of the embodiments are shown in the drawings, they are not necessarily drawn to scale unless specifically indicated otherwise.

[0057] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0058] Furthermore, to better illustrate this disclosure, numerous specific details are set forth in the following detailed description. Those skilled in the art will understand that this disclosure can be practiced without certain specific details. In some instances, methods, means, components, and circuits well known to those skilled in the art have not been described in detail in order to highlight the main points of this disclosure.

[0059] To address the aforementioned technical problems, this disclosure provides a signal line repair method, apparatus, and packaging structure. A redundant bump array within each bump region of the packaging structure is positioned at the center of multiple bump arrays. During signal line detection within the packaging structure, if a first signal line that does not meet usage conditions is detected, the first bump array requiring repair is determined based on the first bumps corresponding to each first signal line. Then, the first bump array is repaired based on the redundant bump array. This improves the efficiency and speed of signal line repair while reducing power consumption.

[0060] like Figure 1 As shown, the signal line repair method provided in this disclosure includes steps S101-S103. This method is applied to... Figure 2The packaging structure shown is used for signal line repair. The packaging structure includes any one of a 2D packaging structure, a 2.5D packaging structure, or a 3D packaging structure.

[0061] In this embodiment, as Figure 3 As shown, the encapsulation structure has one or more bump regions. In some embodiments, the encapsulation structure includes multiple structural layers, and each structural layer of the encapsulation structure has one or more bump regions. Each bump region includes multiple bump arrays, and each bump array includes multiple bumps. The number of bumps in each bump array within the same bump region is the same. The multiple bump arrays in each bump region include multiple signal bump arrays and at least one redundant bump array. The signal bumps corresponding to different signal lines (lanes) in the encapsulation structure are different.

[0062] In step S101, the signal lines in the package structure are detected to determine whether each signal line meets the usage conditions. In some embodiments, signal lines that do not meet the usage conditions may refer to signal lines that experience open circuits, short circuits, or whose signal transmission rates do not meet preset requirements, thus affecting the normal function of the package structure. The detection performed in step S101 can be a pre-use detection performed during the initialization or training process of the package structure, or it can be a detection performed during periodic checks after the package structure is put into use. The timing of the detection in step S101 can be set according to actual needs, and this disclosure does not impose any limitations on this.

[0063] In step S102, if a first signal line that does not meet the usage conditions is detected in the signal line, the first bump array that needs to be repaired in the signal bump array is determined according to the first bump corresponding to each first signal line. The first bump is the signal bump corresponding to the first signal line.

[0064] In this embodiment, there may be one or more first signal lines that do not meet the usage conditions; therefore, there may also be one or more determined first bumps. Based on the position of the first bumps, a bump array that includes some or all of the first bumps can be determined as a first bump array, meaning that at least one of the multiple signal bumps in each first bump array is a first bump.

[0065] In step S103, the first bump array is repaired based on the redundant bump array.

[0066] In one possible implementation, the method may further include: determining the movement direction corresponding to the repair of each of the first bump arrays based on the relative positional relationship between the first bump array and the redundant bump arrays in the bump region where the first bump array is located. The movement direction may refer to moving to the left or right relative to the position of the first bump array itself, and based on this movement direction, the redundant bump arrays required to replace the first bump array and repair the first signal line can be located.

[0067] In some embodiments, the redundant bump array is located in the middle region of the bump area, which greatly improves the speed and efficiency of finding the redundant bump array in signal line repair compared to the method of placing redundant bumps at the corners in related technologies.

[0068] In some embodiments, each structural layer in the package structure can be a device layer or an interposer layer on which chips are disposed, wherein the chips in the device layer can be bare chips. The bumps in the device layer are the bumps of each chip in that device layer, and the bumps in the interposer layer can be the bumps in that interposer layer used to implement electrical connections between different structural layers. The bumps in each of the structural layers in the package structure can be divided into at least one repair group, and the same repair group includes bumps in at least one bump region of the same structural layer, with the bumps of each chip in the device layer being divided into the same repair group. For example, assuming... Figure 3 The structural layer 1 shown is a device layer and includes two chips. All bumps in bump region 1 and bump region 2 can belong to the first chip and belong to the first repair group. All bumps in bump region 3, bump region 4 and bump region 5 can belong to the second chip and belong to the second repair group.

[0069] In this embodiment, each bump in the same bump array can be as follows: Figure 3 , Figure 4 The bumps are arranged in an array, and the shape of the array can be set according to actual needs. Alternatively, the bumps in the same bump array can be arranged randomly, and this disclosure does not impose any restrictions on this. The number of bumps in the bump array can be set according to actual needs, and this disclosure does not impose any restrictions on this.

[0070] In this embodiment, as Figure 3 , Figure 4As shown, in each of the aforementioned bump regions, the plurality of bump arrays are arranged linearly, and the redundant bump array is located in the middle position of the plurality of bump arrays in its respective bump region. The linear arrangement can mean that the plurality of bump arrays in the same bump region are located on the same preset line. This preset line can be a straight line or a near-straight line, or it can be a curve or a wavy line; this disclosure does not impose any limitations on this. In the above steps, if the first bump array is located to the left of the redundant bump array in its respective bump region, then the corresponding movement direction of the first bump array is to the right; or, if the first bump array is located to the right of the redundant bump array in its respective bump region, then the corresponding movement direction of the first bump array is to the left. For example, Figure 3 The direction of movement corresponding to the first bump array A1.1 shown is rightward (because the first bump array A1.1 in bump region 1 is located to the left of the redundant bump array). Figure 3 The direction of movement corresponding to the first bump array A2.8 shown is leftward (because the first bump array A2.8 in bump region 2 is located to the right of the redundant bump array).

[0071] In one possible implementation, the method may further include: after determining the movement direction corresponding to each first bump array, determining a second bump array from the redundant bump array in the bump region where the first bump array is located according to the movement direction corresponding to each first bump array, so as to perform step S103 to repair the first bump array based on the second bump array.

[0072] Specifically, redundant bump arrays within the bump region where each first bump array is located can be queried sequentially according to the movement direction corresponding to that first bump array. If an unused redundant bump array is identified within the bump region where the first bump array is located, then that unused redundant bump array is designated as the second bump array. For example, Figure 3 In this context, redundant bump array B1, which belongs to bump region 1 and is the same as the first bump array A1.1, can be determined as the second bump array corresponding to the first bump array A1.1, and redundant bump array B2, which belongs to bump region 2 and is the same as the first bump array A2.8, can be determined as the second bump array corresponding to the first bump array A2.8.

[0073] In this embodiment, since the number of redundant bump arrays in each bump region is limited, and in some cases, after all the redundant bump arrays in the bump region have been used, if the first bump array is detected again, in order to ensure the normal use of the packaging structure, the number of bumps in each bump array in each bump region belonging to the same repair group can be preset to be the same. Then, an unused redundant bump array can be found from other bump regions belonging to the same repair group as the bump region where the first bump array is located as the second bump array corresponding to the first bump array.

[0074] In some embodiments, the method may further include: during the process of querying the second bump array, if all redundant bump arrays in the bump region where the first bump array is located are occupied, then selecting the second bump array from other bump regions belonging to the same repair group as the bump region where the first bump array is located, to repair the first bump array based on the second bump array. Specifically, candidate bump regions may be selected from other bump regions belonging to the same repair group as the bump region where the first bump array is located; the redundant bump arrays in the candidate bump regions are queried sequentially according to the new movement direction corresponding to the first bump array; if an unused redundant bump array is determined from the candidate bump regions, then the unused redundant bump array is determined as the second bump array. Specifically, the bump region closest to the first bump array in the other bump regions belonging to the same repair group as the first bump array may be selected as the candidate bump region.

[0075] The method for determining the new direction of movement may include: determining it based on the relative positional relationship between the first bump array and the redundant bump arrays in the candidate bump region. For example, as... Figure 4 As shown, since the redundant bump array B2 in bump region 2 is occupied, bump region 3, which is closest to bump region 2 among the bump regions 3 and 4 belonging to the same repair group as bump region 2, can be selected as a candidate bump region. Then, based on the relative positional relationship between the first bump array A2.1 and the redundant bump array B3, a new movement direction can be determined, which can be as shown by the green arrow (right then down) or as shown by the purple arrow (down then right). The new movement direction can also be determined by the relative positional relationship between the occupied redundant bump array determined when the query stops in the bump region where the first bump array is located and the redundant bump array in the candidate bump region. For example, as shown... Figure 5As shown, since the redundant bump array B2 in bump region 2 is occupied, bump region 3, which is closest to bump region 2 among the bump regions 3 and 4 belonging to the same repair group as bump region 2, can be selected as a candidate bump region. Then, based on the relative positional relationship between the occupied redundant bump array B2 and redundant bump array B3 determined when the query stops in bump region 2 where the first bump array A2.1 is located, a new moving direction can be determined, such as right-to-down (as shown by the purple arrow) or down-to-right (as shown by the green arrow). In this way, querying from the occupied redundant bump array according to the new moving direction can improve the speed and efficiency of determining the second bump array.

[0076] If the redundant bump array in the candidate bump area is still occupied, then new candidate bump areas are selected from other bump areas belonging to the same repair group as the bump area where the first bump array is located, until no unoccupied redundant bump array can be found or an unoccupied redundant bump array that can be used as the second bump array is found.

[0077] In one possible implementation, each bump array in each structural layer can be pre-marked. The identifier of the bump array includes: a position marker, which may include a horizontal marker x and a vertical marker y; a region marker (used to mark the bump region where the bump array is located); and a repair group marker (used to mark the repair group to which the bump region where the bump array is located belongs). Then, the relative positional relationship of the markers of each bump array is determined according to the first bump array. The method of determining the relative positional relationship can be set according to actual needs, and this disclosure does not limit it. For example, assuming that the marker of the bump array is represented by (x, y, n, m), where x, y, n, and m are the position marker, region marker, and repair group marker, respectively. If the first bump array is marked as (1, 1, 1, 1), and the marker of the redundant bump array in the bump region where the first bump array is located is (6, 1, 1, 1), then since 6 in the horizontal marker x is greater than 1, the movement direction corresponding to the first bump array is to the right.

[0078] In one possible implementation, step S103 may include: after determining the second bump array from the redundant bump array, replacing the signal lines corresponding to each signal bump in the first bump array with the signal lines corresponding to each signal bump in the second bump array through remapping. Specifically, remapping can replace the signal lines corresponding to each signal bump in the first bump array with the signal lines corresponding to each second bump in the second bump array. Further testing and verification of the new signal lines are then required to ensure that the signal line repair process does not introduce any new errors or problems. In this way, for a first bump array with unusable first bumps, the entire array's corresponding signal lines can be replaced and repaired, which improves the efficiency and speed of the repair compared to replacing and repairing each first bump individually.

[0079] In one possible implementation, the packaging structure includes a power switch for each of the redundant bump arrays. The method further includes: when it is determined that the redundant bump array is not used, controlling the power switch corresponding to each unused redundant bump array to open, thereby de-energizing each bump in the unused redundant bump array; and / or when it is determined that the redundant bump array is identified as a second bump array, controlling the power switch corresponding to the second bump array to open, thereby energizing each bump in the second bump array. The power switch can be a switching device capable of circuit on / off control, such as a transistor, and this disclosure does not limit this. This allows for power de-energization when the redundant bump array is not in use, reducing the power consumption of the packaging structure.

[0080] This disclosure also provides a signal line repair device, which includes:

[0081] A signal line detection module is used to detect signal lines in a package structure. The package structure has one or more bump regions, each bump region includes multiple bump arrays, each bump array includes multiple bumps, and the number of bumps in each bump array in the same bump region is the same. The multiple bump arrays in each bump region include multiple signal bump arrays and at least one redundant bump array. Different signal lines correspond to different signal bumps.

[0082] The first array determination module is used to determine the first bump array that needs to be repaired in the signal bump array based on the first bump corresponding to the first signal line when a first signal line that does not meet the usage conditions is detected in the signal line. The first bump is the signal bump corresponding to the first signal line.

[0083] The repair module is used to repair the first bump array based on the redundant bump array.

[0084] In one possible implementation, the redundant bump array is located in the middle region of the bump area.

[0085] In one possible implementation, multiple bump arrays in each of the bump regions are arranged linearly, and the redundant bump array is located at the middle position of the multiple bump arrays in the bump region.

[0086] In one possible implementation, the device further includes:

[0087] The movement direction determination module is used to determine the movement direction corresponding to the repair of the first bump array based on the relative positional relationship between the first bump array and the redundant bump array in the bump region where the first bump array is located.

[0088] Wherein, if the first bump array is located to the left of the redundant bump array in the bump region, the corresponding movement direction of the first bump array is to the right; or, if the first bump array is located to the right of the redundant bump array in the bump region, the corresponding movement direction of the first bump array is to the left.

[0089] In one possible implementation, the device further includes:

[0090] The second array determination module is used to determine a second bump array from the redundant bump array in the bump region where the first bump array is located according to the movement direction corresponding to the first bump array, so as to repair the first bump array based on the second bump array.

[0091] In one possible implementation, the packaging structure includes any one of a 2D packaging structure, a 2.5D packaging structure, and a 3D packaging structure.

[0092] The packaging structure includes multiple structural layers, each structural layer having one or more bump regions. The bumps in each structural layer are divided into at least one repair group. The same repair group includes bumps in at least one bump region in the same structural layer. The structural layer is a device layer or interposer layer on which a chip is disposed. The bumps of each chip in the device layer are divided into the same repair group.

[0093] In one possible implementation, the number of bumps in each bump array within each bump region belonging to the same repair group in the encapsulation structure is the same; the device further includes:

[0094] The third array determination module is used to select a second bump array from other bump areas belonging to the same repair group as the bump area where the first bump array is located if all redundant bump arrays in the bump area where the first bump array is located are occupied, so as to repair the first bump array based on the second bump array.

[0095] In one possible implementation, the repair module includes:

[0096] The repair submodule is used to replace the signal lines corresponding to each signal bump in the first bump array with the signal lines corresponding to each signal bump in the second bump array determined from the redundant bump array by means of remapping.

[0097] In one possible implementation, the packaging structure includes a power switch for each of the redundant bump arrays, and the device further includes:

[0098] The power-on control module is configured to, when it is determined that the redundant bump array is not in use, control the power-on switch corresponding to each unused redundant bump array to disconnect, thereby de-energizing each bump in each unused redundant bump array; and / or

[0099] If it is determined that the redundant bump array is identified as the second bump array, the power switch corresponding to the second bump array is turned on to power on each bump in the second bump array.

[0100] This disclosure also provides an encapsulation structure, wherein one or more bump regions are provided, each bump region includes multiple bump arrays, each bump array includes multiple bumps and the number of bumps in each bump array in the same bump region is the same, the multiple bump arrays in each bump region include multiple signal bump arrays and at least one redundant bump array, and the signal bumps corresponding to different signal lines are different.

[0101] The packaging structure also includes the aforementioned signal line repair device.

[0102] In some embodiments, the redundant bump array is located in the middle region of the bump region.

[0103] In some embodiments, the plurality of bump arrays in each of the bump regions are arranged linearly, and the redundant bump array is located at the middle position of the plurality of bump arrays in the bump region.

[0104] In some embodiments, the packaging structure includes any one of a 2D packaging structure, a 2.5D packaging structure, and a 3D packaging structure. The packaging structure includes multiple structural layers, each of which has one or more bump regions. The bumps in each structural layer are divided into at least one repair group. The same repair group includes bumps in at least one bump region in the same structural layer. The structural layer is a device layer or an interposer layer on which a chip is disposed. The bumps of each chip in the device layer are divided into the same repair group.

[0105] In some embodiments, the number of bumps in each bump array in each bump region belonging to the same repair group in the encapsulation structure is the same.

[0106] In some embodiments, the packaging structure is provided with a power switch for each of the redundant bump arrays.

[0107] It should be noted that although the above embodiments have been used as examples to illustrate the signal line repair method, apparatus, and packaging structure, those skilled in the art will understand that this disclosure is not limited thereto. In fact, users can flexibly set each step, module, and structure according to their personal preferences and / or actual application scenarios, as long as it conforms to the technical solution of this disclosure.

[0108] In some embodiments, the functions or modules of the apparatus provided in this disclosure can be used to perform the methods described in the above method embodiments. The specific implementation can be referred to the description of the above method embodiments, and for the sake of brevity, it will not be repeated here.

[0109] This disclosure also proposes a computer-readable storage medium storing computer program instructions that, when executed by a processor, implement the above-described method. The computer-readable storage medium can be volatile or non-volatile.

[0110] This disclosure also proposes a signal repair apparatus, comprising: a processor; and a memory for storing processor-executable instructions; wherein the processor is configured to implement the above method when executing the instructions stored in the memory.

[0111] This disclosure also provides a computer program product, including computer-readable code, or a non-volatile computer-readable storage medium carrying computer-readable code, wherein when the computer-readable code is run in a processor of an electronic device, the processor in the electronic device performs the above-described method.

[0112] Figure 6 This is a block diagram illustrating an apparatus 1900 for signal line repair according to an exemplary embodiment. For example, apparatus 1900 can be provided as a terminal device. (Refer to...) Figure 6 The apparatus 1900 includes a processing component 1922, which further includes one or more processors, and memory resources represented by memory 1932 for storing instructions, such as application programs, that can be executed by the processing component 1922. The application programs stored in memory 1932 may include one or more modules, each corresponding to a set of instructions. Furthermore, the processing component 1922 is configured to execute instructions to perform the methods described above.

[0113] Device 1900 may also include a power supply component 1926 configured to perform power management of device 1900, a wired or wireless network interface 1950 configured to connect device 1900 to a network, and an input / output interface 1958 (I / O interface). Device 1900 can operate on an operating system, such as Windows Server, stored in memory 1932. TM macOS X TM Unix TM Linux TM FreeBSD TM Or similar.

[0114] In an exemplary embodiment, a non-volatile computer-readable storage medium is also provided, such as a memory 1932 including computer program instructions that can be executed by a processing component 1922 of the device 1900 to perform the above-described method.

[0115] This disclosure can be a system, method, and / or computer program product. A computer program product may include a computer-readable storage medium having computer-readable program instructions loaded thereon for causing a processor to implement various aspects of this disclosure.

[0116] Computer-readable storage media can be tangible devices capable of holding and storing instructions for use by an instruction execution device. Computer-readable storage media can be, for example—but not limited to—electrical storage devices, magnetic storage devices, optical storage devices, electromagnetic storage devices, semiconductor storage devices, or any suitable combination of the foregoing. More specific examples (a non-exhaustive list) of computer-readable storage media include: portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), static random access memory (SRAM), portable compact disc read-only memory (CD-ROM), digital multifunction disc (DVD), memory sticks, floppy disks, mechanical encoding devices, such as punch cards or recessed protrusions storing instructions thereon, and any suitable combination of the foregoing. The computer-readable storage media used herein are not to be construed as transient signals themselves, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through waveguides or other transmission media (e.g., light pulses through fiber optic cables), or electrical signals transmitted through wires.

[0117] The computer-readable program instructions described herein can be downloaded from computer-readable storage media to various computing / processing devices, or downloaded via a network, such as the Internet, local area network, wide area network, and / or wireless network, to an external computer or external storage device. The network may include copper transmission cables, fiber optic transmission, wireless transmission, routers, firewalls, switches, gateway computers, and / or edge servers. A network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards them to the computer-readable storage media in the respective computing / processing device.

[0118] Computer program instructions used to perform the operations of this disclosure may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, status setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Smalltalk, C++, etc., and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The computer-readable program instructions may execute entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving a remote computer, the remote computer may be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or may be connected to an external computer (e.g., via the Internet using an Internet service provider). In some embodiments, electronic circuitry, such as programmable logic circuitry, field-programmable gate arrays (FPGAs), or programmable logic arrays (PLAs), is personalized by utilizing the status information of the computer-readable program instructions to implement various aspects of this disclosure.

[0119] Various aspects of this disclosure are described herein with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this disclosure. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer-readable program instructions.

[0120] These computer-readable program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to produce a machine such that, when executed by the processor of the computer or other programmable data processing apparatus, they create means for implementing the functions / actions specified in one or more blocks of the flowchart and / or block diagram. These computer-readable program instructions can also be stored in a computer-readable storage medium that causes a computer, programmable data processing apparatus, and / or other device to operate in a particular manner; thus, the computer-readable medium storing the instructions comprises an article of manufacture that includes instructions for implementing aspects of the functions / actions specified in one or more blocks of the flowchart and / or block diagram.

[0121] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device to cause a series of operational steps to be performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process, thereby causing the instructions executed on the computer, other programmable data processing apparatus, or other device to perform the functions / actions specified in one or more boxes of a flowchart and / or block diagram.

[0122] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of an instruction containing one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions marked in the blocks may occur in a different order than those shown in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

[0123] The various embodiments of this disclosure have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or technical improvements to the embodiments in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A signal line repair method, characterized in that, The method includes: The signal lines in the package structure are detected. The package structure has one or more bump regions. Each bump region includes multiple bump arrays. Each bump array includes multiple bumps and the number of bumps in each bump array in the same bump region is the same. The multiple bump arrays in each bump region include multiple signal bump arrays and at least one redundant bump array. The signal bumps corresponding to different signal lines are different. If a first signal line that does not meet the usage conditions is detected in the signal line, the first bump array that needs to be repaired in the signal bump array is determined according to the first bump corresponding to the first signal line. The first bump is the signal bump corresponding to the first signal line. The first bump array is repaired based on the redundant bump array.

2. The method according to claim 1, characterized in that, The redundant bump array is located in the middle region of the bump area.

3. The method according to claim 1, characterized in that, The multiple bump arrays in each of the bump regions are arranged linearly, and the redundant bump array is located in the middle of the multiple bump arrays in its respective bump region.

4. The method according to claim 1, characterized in that, The method further includes: Based on the relative positional relationship between the first bump array and the redundant bump array in the bump region where the first bump array is located, the moving direction corresponding to the repair of the first bump array is determined. Wherein, if the first bump array is located to the left of the redundant bump array in the bump region, the corresponding movement direction of the first bump array is to the right; or, if the first bump array is located to the right of the redundant bump array in the bump region, the corresponding movement direction of the first bump array is to the left.

5. The method according to claim 4, characterized in that, The method further includes: Based on the movement direction corresponding to the first bump array, a second bump array is determined from the redundant bump array in the bump region where the first bump array is located, so as to repair the first bump array based on the second bump array.

6. The method according to claim 1, characterized in that, The packaging structure includes any one of 2D packaging structure, 2.5D packaging structure, and 3D packaging structure. The packaging structure includes multiple structural layers, each structural layer having one or more bump regions. The bumps in each structural layer are divided into at least one repair group. The same repair group includes bumps in at least one bump region in the same structural layer. The structural layer is a device layer or interposer layer on which a chip is disposed. The bumps of each chip in the device layer are divided into the same repair group.

7. The method according to claim 6, characterized in that, In the encapsulation structure, the number of bumps in each bump array within each bump region belonging to the same repair group is the same; the method further includes: If all redundant bump arrays in the bump region where the first bump array is located are occupied, a second bump array is selected from other bump regions belonging to the same repair group as the bump region where the first bump array is located, so as to repair the first bump array based on the second bump array.

8. The method according to any one of claims 1-7, characterized in that, Repairing the first bump array based on the redundant bump array includes: The signal lines corresponding to each signal bump in the first bump array are replaced by signal lines corresponding to each signal bump in the second bump array determined from the redundant bump array through remapping.

9. The method according to claim 8, characterized in that, The encapsulation structure includes a power switch for each of the redundant bump arrays, and the method further includes: If it is determined that the redundant bump array is not in use, the power switch corresponding to each unused redundant bump array is turned off, thereby de-energizing each bump in each unused redundant bump array; and / or If it is determined that the redundant bump array is identified as the second bump array, the power switch corresponding to the second bump array is turned on to power on each bump in the second bump array.

10. A signal line repair device, characterized in that, The device includes: A signal line detection module is used to detect signal lines in a package structure. The package structure has one or more bump regions, each bump region includes multiple bump arrays, each bump array includes multiple bumps, and the number of bumps in each bump array in the same bump region is the same. The multiple bump arrays in each bump region include multiple signal bump arrays and at least one redundant bump array. Different signal lines correspond to different signal bumps. The first array determination module is used to determine the first bump array that needs to be repaired in the signal bump array based on the first bump corresponding to the first signal line when a first signal line that does not meet the usage conditions is detected in the signal line. The first bump is the signal bump corresponding to the first signal line. The repair module is used to repair the first bump array based on the redundant bump array.

11. A packaging structure, characterized in that, The encapsulation structure is provided with one or more bump regions, each bump region includes multiple bump arrays, each bump array includes multiple bumps and the number of bumps in each bump array in the same bump region is the same, the multiple bump arrays in each bump region include multiple signal bump arrays and at least one redundant bump array, and the signal bumps corresponding to different signal lines are different. The packaging structure further includes the signal line repair device as described in claim 10.

12. A signal line repair device, characterized in that, include: processor; Memory used to store processor-executable instructions; The processor is configured to implement the method of any one of claims 1 to 9 when executing instructions stored in the memory.

13. A non-volatile computer-readable storage medium storing computer program instructions thereon, characterized in that, When the computer program instructions are executed by the processor, they implement the method described in any one of claims 1 to 9.

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