Feedthrough assembly and device comprising same

Abstract

Various embodiments of a feedthrough assembly and a hermetically sealed package including such an assembly are disclosed. The assembly includes: a monolithic diamond substrate having a first surface and a second surface; a feedthrough extending through the monolithic diamond substrate between the first surface and the second surface of the substrate, where the feedthrough comprises an electrically conductive carbon material; and an external contact disposed adjacent to the first surface of the monolithic diamond substrate and electrically connected to the feedthrough.

Description

[0001] This application claims the benefit of U.S. Provisional Patent Application Serial No. 63 / 535,855, filed August 31, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates in particular to electrical feedthroughs, and more specifically to electrical feedthroughs disposed in a diamond substrate. Background Technology

[0003] Various systems require electrical coupling between electrical devices housed within a hermetically sealed enclosure and external devices. Typically, this electrical coupling must withstand various environmental factors to maintain the stability of one or more conductive pathways from the outer surface to the housing. For example, implantable medical devices (IMDs) including electronic circuitry and battery components, such as pacemakers, defibrillators, neurostimulators, and drug pumps, require a housing or enclosure to house and hermetically seal these components within the patient's body. Many of these IMDs include one or more electrical feedthrough assemblies to provide electrical connection between components contained within the housing and components of the IMD outside the housing. Examples include sensors and / or electrodes and / or leads mounted on the outer surface of the housing, or electrical contacts housed within a connector head mounted on the housing to provide coupling for one or more implantable leads, which typically carry one or more electrodes and / or one or more other types of physiological sensors. Physiological sensors incorporated into the lead body (e.g., pressure sensors) may also require a hermetically sealed housing to house the sensor's electronic circuitry and electrical feedthrough assemblies to provide electrical connections between one or more wires extending from the implantable lead body and the housed circuitry.

[0004] Feedthrough assemblies typically include one or more feedthrough pins that extend from the inside of the housing to the outside via a ring. Each feedthrough pin is electrically isolated from the ring, and for multipole assemblies, they are electrically isolated from each other by an insulating element (e.g., glass or ceramic) mounted within the ring and surrounding the feedthrough pin. Glass insulators are typically sealed directly to the pins and ring, for example, by heating the assembly to a temperature at which the glass wets the pins and ring, while ceramic insulators are typically sealed to the pins and ring via brazing joints. High temperatures are typically required to bond corrosion-resistant conductive materials with corrosion-resistant insulating materials. Summary of the Invention

[0005] The present disclosure relates generally to a feedthrough assembly and an apparatus including such a feedthrough assembly. The feedthrough assembly may include a monolithic diamond substrate and a feedthrough extending through the substrate. The feedthrough may comprise a conductive carbon material deposited within the substrate or formed by converting the monolithic diamond material of the substrate into conductive carbon using, for example, electromagnetic radiation, which can be directed into the substrate using any suitable technique. One or more additional devices or components (such as one or more capacitors) may also be disposed within the substrate. Such devices and components may be electrically connected to one or more feedthroughs using any suitable technique.

[0006] This disclosure includes, but is not limited to, the following terms:

[0007] Clause 1: A feedthrough assembly comprising: a monolithic diamond substrate having a first surface and a second surface; a feedthrough extending through the monolithic diamond substrate between the first surface and the second surface, wherein the feedthrough comprises a conductive carbon material; and an external contact disposed adjacent to the first surface of the monolithic diamond substrate and electrically connected to the feedthrough.

[0008] Clause 2: The component according to Clause 1, wherein the conductive carbon material is converted from a portion of the monolithic diamond substrate.

[0009] Clause 3: The component according to Clause 2, wherein the conductive carbon material comprises laser-converted conductive carbon material.

[0010] Clause 4: The component according to any one of Clauses 1 to 3, wherein the feeder further comprises an internal contact electrically connected to the feeder.

[0011] Clause 5: The component according to any one of Clauses 1 to 4, wherein the monolithic diamond substrate comprises a single-crystal diamond substrate.

[0012] Clause 6: The component according to any one of Clauses 1 to 5, wherein the feedthrough includes a first feedthrough, and wherein the component further includes a second feedthrough extending through the monolithic diamond substrate between the first surface and the second surface of the substrate, wherein the second feedthrough includes a conductive carbon material and a second external contact disposed adjacent to and electrically connected to the second feedthrough.

[0013] Clause 7: The component according to Clause 6, wherein the center-to-center distance between the first feedthrough and the second feedthrough, measured in a direction substantially parallel to the first surface of the substrate, is at least 50 micrometers.

[0014] Clause 8: The component according to Clause 6, wherein the center-to-center distance between the first feedthrough and the second feedthrough, measured in a direction substantially parallel to the first surface of the substrate, is not greater than 0.060 inches.

[0015] Clause 9: The component according to any one of Clauses 1 to 5, wherein the feeder comprises a feeder array.

[0016] Clause 10: The component according to any one of Clauses 1 to 8, wherein the conductive carbon material comprises graphite carbon.

[0017] Clause 11: The component according to any one of Clauses 1 to 10 further includes a patterned conductive layer disposed adjacent to the first surface of the monolithic diamond substrate and electrically connected to the external contact.

[0018] Clause 12: The component according to any one of Clauses 1 to 11 further includes a capacitor disposed adjacent to the feedthrough within the substrate, wherein the capacitor is electrically coupled to the feedthrough.

[0019] Clause 13: The component according to Clause 12, wherein the capacitor includes a first plate and a second plate substantially parallel to the first plate, wherein a portion of the substrate is disposed between the first plate and the second plate.

[0020] Clause 14: The component according to Clause 13, wherein the main surface of each of the first plate and the second plate is substantially orthogonal to the feedthrough.

[0021] Clause 15: The component as described in Clause 14, wherein the feedthrough extends through the first plate and the second plate.

[0022] Clause 16: An assembly according to any one of Clauses 13 to 15, wherein the first plate and the second plate of the capacitor comprise a conductive carbon material converted from a portion of the monolithic diamond substrate.

[0023] Clause 17: A hermetically sealed package comprising a housing and a feedthrough assembly forming part of the housing. The feedthrough assembly comprises: a monolithic diamond substrate including a first surface and a second surface, wherein the substrate is connected to the housing; a feedthrough extending through the monolithic diamond substrate between the first surface and the second surface, wherein the feedthrough comprises a conductive carbon material; and an external contact disposed adjacent to the first surface of the monolithic diamond substrate and electrically connected to the feedthrough.

[0024] Clause 18: The package as described in Clause 17, wherein the conductive carbon material is converted from a portion of the monolithic diamond substrate.

[0025] Clause 19: The package as described in Clause 18, wherein the conductive carbon material comprises laser-converted conductive carbon material.

[0026] Clause 20: The package according to any one of Clauses 17 to 19, wherein the feedthrough further includes an internal contact electrically connected to the feedthrough.

[0027] Clause 21: The package according to Clause 20 further includes a patterned conductive layer disposed on the second surface of the substrate and electrically connected to the internal contacts.

[0028] Clause 22: A package according to any one of Clauses 17 to 21, wherein the feedthrough includes a first feedthrough. The assembly further includes a second feedthrough extending through the monolithic diamond substrate between the first surface and the second surface of the substrate. The second feedthrough includes a conductive carbon material and a second external contact disposed adjacent to and electrically connected to the first surface of the monolithic diamond substrate.

[0029] Clause 23: The package according to Clause 22, wherein the distance between the first feedthrough and the second feedthrough, measured in a direction substantially parallel to the first surface of the substrate, is at least 50 micrometers.

[0030] Clause 24: The package as described in Clause 22, wherein the distance between the first feedthrough and the second feedthrough, measured in a direction substantially parallel to the first surface of the substrate, is not greater than 0.060 inches.

[0031] Clause 25: The package according to any one of Clauses 17 to 21, wherein the feeder comprises a feeder array.

[0032] Clause 26: The package according to any one of Clauses 17 to 25, wherein the conductive carbon material comprises graphite carbon.

[0033] Clause 27: The package according to any one of Clauses 17 to 26 further includes a patterned conductive layer disposed adjacent to the first surface of the monolithic diamond substrate and electrically connected to the external contact.

[0034] Clause 28: The package according to any one of Clauses 17 to 27 further includes a capacitor disposed within the substrate adjacent to the feedthrough, wherein the capacitor is electrically coupled to the feedthrough.

[0035] Clause 29: The package according to Clause 28, wherein the capacitor includes a first plate and a second plate substantially parallel to the first plate, wherein a portion of the substrate is disposed between the first plate and the second plate.

[0036] Clause 30: The package as described in Clause 29, wherein the main surface of each of the first plate and the second plate is substantially orthogonal to the feedthrough.

[0037] Clause 31: The package as described in Clause 30, wherein the feedthrough extends through the first plate and the second plate.

[0038] Clause 32: A package according to any one of Clauses 29 to 31, wherein the first plate and the second plate of the capacitor comprise a conductive carbon material converted from a portion of the monolithic diamond substrate.

[0039] Clause 33: An implantable medical device comprising an hermetically sealed encapsulation according to any one of Clauses 17 to 32.

[0040] Clause 34: A method comprising: focusing electromagnetic radiation onto a monolithic diamond substrate to convert a region of the monolithic diamond substrate into a conductive carbon material, the conductive carbon material forming a feedthrough extending between a first surface and a second surface of the monolithic diamond substrate. The method further comprises: disposing an external contact adjacent to the first surface of the monolithic diamond substrate such that the external contact is electrically connected to the feedthrough.

[0041] Clause 35: The method according to Clause 34 further comprises: providing a patterned conductive layer adjacent to the first surface of the monolithic diamond substrate.

[0042] Clause 36: The method according to Clause 35 further includes: electrically connecting the patterned conductive layer to the external contact.

[0043] Clause 37: The method according to any one of Clauses 34 to 36, wherein focusing electromagnetic radiation comprises: shaping the laser beam to form a Bezier focus.

[0044] Clause 38: The method according to any one of Clauses 34 to 36, wherein focusing electromagnetic radiation comprises: shaping the laser beam to form a Gaussian focus.

[0045] Clause 39: The method according to any one of Clauses 34 to 36, wherein focusing electromagnetic radiation comprises: focusing pulsed electromagnetic radiation onto the monolithic diamond body.

[0046] Clause 40: The method according to any one of Clauses 34 to 39, the method further comprising: laser bonding the external contact to the first surface of the monolithic diamond substrate.

[0047] Clause 41: The method according to any one of Clauses 34 to 40, the method further comprising: providing an internal contact adjacent to the second surface of the monolithic diamond substrate, such that the internal contact is electrically connected to the feedthrough.

[0048] Clause 42: The method according to any one of Clauses 34 to 41, wherein the feedthrough includes a first feedthrough. The method further comprises: focusing electromagnetic radiation into the monolithic diamond substrate to convert a second region of the monolithic diamond substrate into a conductive carbon material, the conductive carbon material forming a second feedthrough extending between the first surface and the second surface of the monolithic diamond substrate. The method further comprises: disposing a second external contact adjacent to the first surface of the monolithic diamond substrate such that the external contact is electrically connected to the second feedthrough.

[0049] Clause 43: The method according to Clause 42, wherein the distance between the first feedthrough and the second feedthrough, measured in a direction substantially parallel to the first surface of the substrate, is at least 50 micrometers.

[0050] Clause 44: The method according to any one of Clauses 34 to 43 further comprises: attaching the monolithic diamond substrate to the housing to form a hermetically sealed package.

[0051] Clause 45: The method according to any one of Clauses 34 to 44, the method further comprising: focusing electromagnetic radiation into the monolithic diamond substrate to convert a third region of the monolithic diamond substrate into a conductive carbon material forming a capacitor within the substrate, wherein the capacitor is electrically coupled to the feedthrough.

[0052] Clause 46: The method according to Clause 45, wherein the capacitor comprises a first plate and a second plate substantially parallel to the first plate. A portion of the substrate is disposed between the first plate and the second plate.

[0053] Clause 47: The method according to Clause 46, wherein the main surface of each of the first plate and the second plate is substantially orthogonal to the feedthrough.

[0054] Clause 48: The method according to Clause 47, wherein the feeder extends through the first plate and the second plate.

[0055] Clause 49: The method according to Clause 34 further comprises: removing the conductive carbon material of the feedthrough to form a through hole; and disposing a metallic material within the through hole to form the feedthrough.

[0056] Details of one or more aspects of this disclosure are set forth in the following drawings and description. Other features, objects, and advantages of the technology described in this disclosure will be apparent from the description, drawings, and claims. Attached Figure Description

[0057] Figure 1 This is a schematic cross-sectional view of one implementation scheme of the feedthrough component.

[0058] Figure 2 yes Figure 1 A schematic plan view of the feedthrough component of the feedthrough assembly.

[0059] Figure 3 It includes the shell and Figure 1 A schematic cross-sectional view of one embodiment of the hermetically sealed package of the feedthrough component.

[0060] Figures 4A to 4D It is formed Figure 1 A schematic cross-sectional view of the method for the feedthrough component, wherein Figure 4A An example is illustrated where electromagnetic radiation is focused into a substrate to form one or more feedthroughs of an assembly; Figure 4B An example is shown of one or more external contacts disposed on a first surface of a substrate and electrically connected to a feedthrough; Figure 4C An example is illustrated by a patterned conductive layer disposed on a first surface and a second surface of a substrate; and Figure 4D An example is shown of one or more internal contacts disposed on the second surface of the substrate and electrically connected to the feedthrough.

[0061] Figure 5 This is a schematic perspective view of another embodiment of the feedthrough component, wherein the substrate of the component is made transparent for illustrative purposes.

[0062] Figure 6 yes Figure 5 A schematic cross-sectional view of the feedthrough component.

[0063] Figure 7 This is a schematic plan view of another implementation of the feedthrough component.

[0064] Figure 8 This is a schematic cross-sectional view of another implementation of the feedthrough component. Detailed Implementation

[0065] The present disclosure relates generally to a feedthrough assembly and an apparatus including such a feedthrough assembly. The feedthrough assembly may include a monolithic diamond substrate and a feedthrough extending through the substrate. The feedthrough may comprise a conductive carbon material, which is formed by converting the monolithic diamond material of the substrate into conductive carbon using, for example, electromagnetic radiation, which can be directed into the substrate using any suitable technique. One or more additional devices or components (such as one or more capacitors) may also be disposed within the substrate. Such devices and components may be electrically connected to one or more feedthroughs using any suitable technique.

[0066] Electrical feedthroughs used in suitable devices, such as medical devices, typically comprise a non-conductive substrate, such as sapphire, so that electrical pathways formed by one or more feedthroughs extending through the substrate remain electrically isolated. Other suitable non-conductive materials, such as diamond, can also be used to assemble the substrate. Diamond is commercially available in single-crystal form at millimeter and sub-millimeter thicknesses.

[0067] Using a diamond substrate, feedthroughs can be generated by converting bulk diamond into conductive carbon material (e.g., graphitic carbon) wires using electromagnetic radiation, for example, provided by a laser. Multiple feedthroughs can be generated in a single diamond substrate. Due to the fine resolution achievable with lasers, the bias of the feedthroughs can be located within a few micrometers or smaller, potentially offering substantial improvements over typical glass feedthroughs. Furthermore, diamond and graphitic carbon are chemically inert, which can provide stable and corrosion-resistant feedthroughs.

[0068] As described herein, a monolithic diamond substrate can be used to form feedthrough components by selectively converting regions of the diamond substrate into a conductive carbon material. Regions of conductive carbon material can be formed within the diamond substrate using electromagnetic radiation to establish feedthroughs and other devices or components on or within the substrate. In one or more embodiments, one or more capacitors can be disposed or formed within the substrate, which can be used to limit or prevent electromagnetic interference from propagating along conductive pathways or vias formed from the conductive carbon material. The plates or electrodes of these capacitors can be separated by layers of the unconverted diamond substrate to establish one or more dielectric layers of the diamond capacitor. Diamond can be described as having high dielectric strength, allowing energy to be stored in the capacitor at higher voltages, with a smaller dielectric volume compared to other dielectric materials (such as in electrolytic capacitors). Therefore, by way of example, a single diamond capacitor can also be smaller than a single electrolytic capacitor and still operate at a higher voltage than an electrolytic capacitor.

[0069] Various embodiments of the feedthrough components described herein can be used with any device or system requiring a hermetically sealed conductive path. For example, one or more embodiments of the feedthrough components described herein can be used with implantable medical devices or systems. In one or more embodiments, the implantable medical device or system may employ one or more leads that can be used with various embodiments of the feedthrough components described herein. Representative examples of such implantable medical devices include: hearing implants, such as cochlear implants; sensing or monitoring devices; signal generators, such as pacemakers or defibrillators, neurostimulators (such as spinal cord stimulators, brain or deep brain stimulators, peripheral nerve stimulators, vagus nerve stimulators, occipital nerve stimulators, subcutaneous stimulators, etc.), or gastric stimulators; etc. Furthermore, in one or more embodiments, the implantable medical device may include one or more external contacts of the sealing component that can be used to directly deliver energy to the patient's tissues.

[0070] Figures 1 to 2 These are cross-sectional and top plan views of one embodiment of the feedthrough assembly 10. Assembly 10 includes: a monolithic diamond substrate 12 having a first surface 14 and a second surface 16; one or more feedthroughs 18 extending through the monolithic diamond substrate between the first and second surfaces, wherein the feedthroughs comprise conductive carbon material 20; and an external contact 22 disposed adjacent to the first surface of the monolithic diamond substrate and electrically connected to one or more of the feedthroughs.

[0071] Component 10 includes a monolithic diamond substrate. Although described as monolithic, in one or more embodiments, substrate 12 may comprise two or more portions joined or bonded using any suitable technology. In one or more embodiments, substrate 12 may be described as single-crystal diamond or bulk single-crystal diamond. Any suitable technology may be used to form substrate 12. In one or more embodiments, substrate 12 may be laboratory-grown. In one or more embodiments, substrate 12 may be naturally formed. Substrate 12 may have any suitable quality. Suitable quality may include, for example, industrial-grade diamond. In one or more embodiments, one or more dopants (e.g., nitrogen, boron, etc.) may be disposed at any suitable concentration on or within the monolithic diamond substrate.

[0072] The substrate 12 can take any suitable shape and have any suitable size. The substrate 12 can be between 2 cm and 6 cm wide, and between 0.1 cm and 0.5 cm thick. In one or more embodiments, the width of the substrate 12 can be between 1 cm and 10 cm. In other examples, the width of the substrate 12 can be greater than 0.5 cm, greater than 1 cm, greater than 2 cm, greater than 5 cm, greater than 8 cm, or greater than 10 cm, and / or less than 15 cm, less than 12 cm, less than 10 cm, less than 8 cm, less than 5 cm, less than 3 cm, or less than 1 cm. The substrate 12 can be about 4 cm. In one or more embodiments, the height of the substrate 12 can be between 0.05 cm and 1 cm. In other examples, the height of substrate 12 may be greater than 0.05 cm, greater than 0.1 cm, greater than 0.2 cm, greater than 0.5 cm, greater than 0.8 cm, or greater than 1 cm, and / or less than 1.5 cm, less than 1.2 cm, less than 1 cm, less than 0.8 cm, less than 0.5 cm, less than 0.3 cm, or less than 0.1 cm. In one or more embodiments, the height of substrate 12 may be about 0.3 cm. In one or more embodiments, the depth of substrate 12 may be between 0.5 cm and 5 cm. In other examples, the depth of substrate 12 may be greater than 0.5 cm, greater than 1 cm, greater than 2 cm, greater than 5 cm, or greater than 8 cm, and / or less than 10 cm, less than 7 cm, less than 5 cm, less than 3 cm, less than 2 cm, less than 1 cm, or less than 0.5 cm. In one or more embodiments, the depth of substrate 12 may be about 2 cm.

[0073] The substrate 12 may have any suitable volume. A suitable volume may include, for example, between 0.1 cubic centimeters and 10 cubic centimeters. In one or more embodiments, the volume of the substrate 12 may be greater than 0.1 cubic centimeters, greater than 1 cubic centimeter, greater than 3 cubic centimeters, greater than 5 cubic centimeters, greater than 8 cubic centimeters, or greater than 10 cubic centimeters, and / or less than 15 cubic centimeters, less than 12 cubic centimeters, less than 8 cubic centimeters, less than 6 cubic centimeters, less than 3 cubic centimeters, less than 1 cubic centimeter, or less than 0.5 cubic centimeters. In one or more embodiments, the volume of the substrate 12 may be about 2 cubic centimeters.

[0074] The first surface 14 and the second surface 16 of the substrate 12 can take any suitable shape. Furthermore, the first surface 14 and the second surface 16 can be any suitable surface of the substrate 12. The first surface 14 and the second surface 16 can be arranged in any suitable geometric relationship with each other. In one or more embodiments, the first surface 14 can be a first principal surface of the substrate 12, and the second surface 16 of the substrate 12 can be a second principal surface, such that the first surface and the second surface are substantially parallel, as... Figure 1As shown. In one or more embodiments, the first surface 14 and the second surface 16 may be substantially orthogonal.

[0075] One or more feedthroughs 18 extend through the substrate 12 between a first surface 14 and a second surface 16. Although depicted as extending through the substrate 12, in one or more embodiments, one or more feedthroughs 18 may extend from a surface of the substrate to a means or component disposed within the substrate, such that the feedthrough does not extend from one surface of the substrate to another. Such feedthroughs 18 may be formed using any suitable techniques as further described herein.

[0076] Component 10 may include any suitable number of feedthroughs 18. At least one of the feedthroughs 18 comprises a conductive carbon material 20. In one or more embodiments, component 10 may include a first feedthrough 18-1 and a second feedthrough 18-2, wherein each of the first and second feedthroughs comprises a conductive carbon material 20. Furthermore, each of the first feedthrough 18-1 and the second feedthrough 18-2 includes an external contact 22 disposed adjacent to and electrically connected to a first surface 14 of the substrate 12. Component 10 may also include a third feedthrough 18-3 and a fourth feedthrough 18-4.

[0077] The first feedthrough 18-1 and the second feedthrough 18-2 can be set at any suitable center-to-center distance 2 (i.e., pitch) measured in a direction substantially parallel to the first surface 14 of the substrate 12. In one or more embodiments, the distance 2 is at least 50 micrometers. In one or more embodiments, the distance 2 may not be greater than 0.060 inches. Furthermore, component 10 may include an array 24 of feedthroughs 18. Such an array 24 may include feedthroughs 18 arranged in any suitable configuration. For example, the feedthroughs 18 may be arranged in a regular array, a pseudo-random array, or a random array.

[0078] Each feedthrough 18 can take any suitable shape and have any suitable dimensions. For example, each feedthrough 18 can have any suitable cross-sectional shape in a plane parallel to the first surface 14 of the substrate 12, such as elliptical, linear, polygonal, etc. In one or more embodiments, the feedthrough 18 can have the same cross-sectional shape along an axis substantially orthogonal to the first surface 14 of the substrate 12. In one or more embodiments, the feedthrough 18 can have a cross-sectional shape that varies along such an axis. Each feedthrough 18 can also have any suitable cross-sectional area.

[0079] Figure 8 This is a schematic cross-sectional view of another embodiment of the feedthrough component 500. This article is about... Figures 1 to 2 All design considerations and possibilities described for the feedthrough component 10 are equally applicable. Figure 8 The feedthrough assembly 500. One difference between assembly 500 and assembly 10 is that at least one of the feedthroughs 518 of assembly 500 has a cross-sectional shape that varies along an axis 502 substantially orthogonal to a first surface 514 of substrate 512. For example, each feedthrough 518 has a first portion 521 and a second portion 523. The first portion 521 has a larger cross-sectional area in a plane orthogonal to axis 502 than the second portion 523. In one or more embodiments, the first portion 521 may have a different cross-sectional shape in a plane orthogonal to axis 502 than the second portion 523. Furthermore, in one or more embodiments, the first portion 521 may have a different cross-sectional shape in a plane substantially parallel to axis 502 than the second portion 523 in such a plane. The first portion 521 may be disposed in a cavity 513 of substrate 512, which may be formed when the substrate is converted into a conductive carbon material 520. In one or more embodiments, the first portion 521 and the second portion 523 may comprise a conductive carbon material 520. In one or more embodiments, the first portion 521 may comprise a material different from that of the second portion 523. For example, the first portion 521 may comprise a conductive material (e.g., a metal such as copper), and the second portion 523 may comprise a conductive carbon material 520. In such embodiments, any suitable technique can be used to form the cavity 513 in the substrate 512, and any suitable technique can be used to dispose the conductive material in the cavity such that the conductive material is electrically connected to the second portion 523 of the feedthrough 518. Figure 8 In the illustrated embodiment, the larger cross-sectional area of ​​the first portion 521 of the feedthrough 518 in a plane orthogonal to the axis 502 can enhance the electrical connectivity between the feedthrough and the external contact 522.

[0080] As described herein, the feedthrough 18 may comprise a conductive carbon material 20. Any suitable conductive carbon material may be used. As an example, a suitable form of conductive carbon may be described as a conductive carbon allotrope, such as a non-diamond carbon allotrope. As an example, a suitable form of conductive carbon may include those with sp 2 Carbon allotropes with hybrid orbitals. As another example, suitable forms of conductive carbon may include conductive allotropes of carbon formed by the pyrolysis of diamond. Further examples of conductive carbon may include at least one of graphene, graphite, graphitic carbon, carbon nanotubes, or amorphous carbon.

[0081] Conductive carbon 20 can be characterized based on resistivity. Conductive carbon can be characterized by any suitable resistivity. Suitable conductive carbon resistivity may include, for example, between 2 micro ohms / meter (µO / m) and 3,000 µO / m, between 500 µO / m and 800 µO / m, or between 2.5 µO / m and 5 µO / m. Suitable conductive carbon resistivity may additionally or alternatively include less than 5,000 µO / m, less than 500 µO / m, less than 50 µO / m, or less than 5 µO / m.

[0082] The conductive carbon material 20 may additionally or alternatively be characterized based on its electrical conductivity. Conductive carbon can be characterized by any suitable electrical conductivity. Suitable conductive carbon conductivity may include, for example, between 1 siemens / meter (S / m) and 300,000 S / m, between 200 S / m and 2,000 S / m, or between 2 S / m and 300,000 S / m. Suitable conductive carbon conductivity may additionally or alternatively include greater than 1 S / m, greater than 100 S / m, greater than 1,000 S / m, greater than 10,000 S / m, or greater than 100,000 S / m.

[0083] The conductive carbon material 20 can be formed using any suitable technique. In one or more embodiments, the conductive carbon material 20 is transferred from a portion of a monolithic diamond substrate 12 using any suitable technique. In one or more embodiments, the conductive carbon material is a laser-transformed conductive carbon material, as further described herein.

[0084] Component 10 may also include one or more external contacts 22 disposed adjacent to a first surface 14 of substrate 12. As used herein, the term "adjacent to the first primary surface of substrate" means that an element or component is positioned closer to the first surface 14 of substrate 12 than to a second surface 16 of substrate 12. In one or more embodiments, the external contacts 22 may be disposed on and in contact with the first surface 14. In one or more embodiments, one or more additional layers may be disposed between the external contacts 22 and the first surface 14. When viewed in a plane substantially parallel to the first surface 14, the external contacts 22 may be disposed adjacent to the first surface 14 of substrate 12 above the conductive carbon material 20 of the feedthrough.

[0085] At least one external contact 22 may be electrically connected to one of the feedthroughs 18. In one or more embodiments, one external contact 22 is electrically connected to each feedthrough 18. Any suitable technique may be used to electrically connect the external contact 22 to the feedthrough. In one or more embodiments, the external contact 22 may be adapted to electrically couple the feedthrough 18 to a conductor or contact of a device, such as a contact of the head of an implantable medical device. Such conductors and contacts may be electrically coupled to the external contact 22 using any suitable technique (e.g., brazing, physical contact, welding, etc.).

[0086] In one or more embodiments, the external contact 22 is hermetically sealed to the first surface 14 of the substrate 12. Any suitable technique can be used to hermetically seal the external contact 22 to the first surface 14. For example, in one or more embodiments, the external contact 22 can be hermetically sealed to the first surface 14 of the substrate 12 in a plane substantially parallel to the first surface via a coupling 26 surrounding the through-hole 18, such as... Figure 2 As shown. Any suitable technique can be used to form the bond 26. For example, in one or more embodiments, a laser can be used to form the bond 26 to provide a laser bond, such as the laser diffusion bonding technique described in one or more embodiments of U.S. Patent No. 10,124,559 B2 entitled “KINETICALLY LIMITED NANO-SCALE DIFFUSION BOND STRUCTURES AND METHODS”. By surrounding the feedthrough 18 with the bond 26 that hermetically seals the external contact 22 to the first surface 14 of the substrate 12, the feedthrough 18 is also protected from the external environment. Therefore, the electrical coupling between the external contact 22 and the conductive carbon material 20 of the feedthrough 18 is protected, and the integrity of this electrical path from the first surface 14 to the second surface 16 of the substrate 12 can be maintained. In one or more embodiments, a bond other than the bond 26 can also be used to attach the external contact 22 to the first surface 14 of the substrate 12. In one or more embodiments, the substrate 12 can be chemically functionalized to enhance the bonding between the external contact 22 and the substrate.

[0087] One or more of the feedthroughs 18 may include an internal contact 28 disposed adjacent to the second surface 16 of the substrate 12. As used herein, the term "adjacent to the second surface of the substrate" means that an element or component is disposed closer to the second surface 16 than to the first surface 14 of the substrate 12. The internal contact 28 may comprise any suitable material, such as the same material used for the external contact 22, and may be formed using any suitable technique, such as sputtering, electroplating, evaporation, etc. Furthermore, the internal contact 28 may take any suitable shape and have any suitable thickness in the direction perpendicular to the second surface 16 of the substrate 12, such as the same shape and thickness described with respect to the external contact 22, or other thicknesses and shapes, such as conductive traces.

[0088] An internal contact 28 is disposed above a feedthrough 18 on the second surface 16 of the substrate 12. The internal contact 28 is electrically coupled to a conductive carbon material 20 within the feedthrough 18. The arrangement of the external contact 22, the feedthrough 18, and the internal contact 28 facilitates the formation of an electrical path between the outer side adjacent to the first surface 14 and the inner side adjacent to the second surface 16. In one or more embodiments, the internal contact 28 is hermetically sealed to the second primary surface 16 of the substrate 12 using any suitable technique, such as as described herein with respect to the hermetic sealing of the external contact 22, by a bonding (e.g., laser bonding) that surrounds the feedthrough in a plane substantially parallel to the second surface 16.

[0089] A patterned conductive layer 30 is disposed on a first surface 14 adjacent to the substrate 12. The patterned conductive layer 30 can be electrically connected to the external contact 22 using any suitable technique. The patterned conductive layer 30 may comprise any suitable conductive or non-conductive material, such as at least one of copper, silver, titanium, niobium, zirconium, tantalum, stainless steel, platinum, iridium, aluminum, Kova iron nickel cobalt alloy, or nickel. The patterned conductive layer 30 may comprise any suitable number of layers. In one or more embodiments, the patterned conductive layer 30 may comprise one or more foils disposed using any suitable technique. The patterned conductive layer 30 may comprise any suitable layer or sublayer.

[0090] Furthermore, when connected to the first surface 14 of the substrate 12, the patterned conductive layer 30 can be configured with any suitable pattern. In one or more embodiments, one or more portions of the patterned conductive layer 30 may form one or more external contacts 22. Additionally, the patterned conductive layer 30 may include one or more solder portions that can be used to attach the collar 106 ( Figure 3 It is connected to substrate 12, as further described herein.

[0091] The patterned conductive layer 30 can be disposed on or adjacent to the first surface 14 of the substrate 12 using any suitable technique. For example, the patterned conductive layer 30 can be disposed on or adjacent to the first surface 14 using one or more of photolithography, etching, plasma vapor deposition, chemical vapor deposition, electroplating, laser bonding, etc. In one or more embodiments, the patterned conductive layer 30 can be connected to the first surface 14 by one or more laser bonding methods 36.

[0092] In one or more embodiments, the patterned conductive layer 30 may be considered as the first patterned conductive layer, and the component 10 may optionally include a second patterned conductive layer 38 disposed on or adjacent to the second surface 16 of the substrate 12. The second patterned conductive layer 38 may include any suitable patterned conductive layer, such as the patterned conductive layer 30. The same design features and possibilities described herein with respect to the first patterned conductive layer 30 may be applied to the second patterned conductive layer 38. The second patterned conductive layer 38 may be electrically connected to one or more internal contacts in the internal contacts 328 using any suitable technique.

[0093] Component 10 may also include one or more electronic devices or electronic components 40 disposed adjacent to at least one of the first surface 14 or the second surface 16 of the substrate 12. Electronic components 40 may include at least one of any suitable circuitry or components, such as capacitors, transistors, integrated circuits (including controllers or multiplexers), sensors, accelerometers, optical components (e.g., transmitters and detectors), etc. Although described as including one electronic component 40, component 10 may include any suitable number of electronic components. Furthermore, electronic components 40 may be electrically connected to one or more feedthroughs 18 using any suitable technology or one or more techniques. In one or more embodiments, electronic components 40 are electrically connected to one or more feedthroughs 18 via one or more device contacts 42. Such device contacts 42 may be electrically connected to one or more internal contacts 28 of the feedthrough 18 using any suitable technology. In one or more embodiments, electronic component 40 may include one or more test points disposed on one or more surfaces of the electronic component, as further described, for example, in U.S. Patent Publication No. 2021 / 0178518A1 entitled “HERMETIC ASSEMBLY AND DEVICE INCLUDING SAME”.

[0094] As described herein, various implementations of the feedthrough component can be used in any suitable device or system. For example, Figure 3 This is a schematic cross-sectional view of one embodiment of the hermetically sealed package 100. The package 100 includes a housing 102 and... Figures 1 to 2 Feedthrough component 10. Although described as including feedthrough component 10, the hermetically sealed package 100 may include any suitable feedthrough component. In one or more embodiments, component 10 may form part of housing 102 of package 100. Housing 102 defines recess 104 in which one or more electronic components or circuits (e.g., electronic component 40) may be disposed.

[0095] The housing 102 can be connected to the component 10 using any suitable technology. In one or more embodiments, the collar 106 can be connected to the component 10 and the housing 102 using any suitable technology, such as one or more technologies described in U.S. Patent Publication No. 2021 / 0178518 A1. For example, the collar 106 can be connected to the patterned conductive layer 30 of the component 10 via one or more weld seams 108. Any suitable welding technology, such as laser welding, can be used to provide the weld seams 108. Furthermore, the weld seams 108 can take any suitable shape or have any suitable size. In addition, the collar 106 can be connected to the housing 102 via one or more joints or weld seams 110. Any suitable technology, such as the same technology described herein with respect to weld 108, can be used to form the weld seams 110. When connected, the housing 102, collar 106, and substrate 12 of the feed assembly 10 form a cavity 112.

[0096] The housing 102 of the package 100 may include any suitable size and shape. Furthermore, the housing 102 may include any suitable material, such as metal, polymer, ceramic, or inorganic material. In one or more embodiments, the housing 102 may include at least one of glass, quartz, silicon dioxide, sapphire, silicon carbide, diamond, synthetic diamond, or gallium nitride (including cladding structures, laminates, etc.). In one or more embodiments, the housing 102 may include at least one of copper, silver, titanium, niobium, zirconium, tantalum, stainless steel, platinum, iridium, aluminum, nickel, Kova iron-nickel-cobalt alloy, or AlMg (including cladding structures, laminates, etc.). In one or more embodiments, the housing 102 may include the same material as the substrate 12 of component 10.

[0097] Package 100 may include any suitable electronic component 40 or electronic device disposed within housing 102. In one or more embodiments, electronic component 40 may include any suitable integrated circuit or device, such as a controller, multiplexer, etc. It should be understood that any electronic device mentioned in this disclosure may be coupled to a power source. Furthermore, package 100 may include a second electronic component 114 disposed at any suitable location within housing 102. Second electronic component 114 may include any suitable integrated circuit or device. In one or more embodiments, second electronic component 114 may include a power source adapted to provide power to one or more integrated circuits or devices disposed within or outside housing 102. Any suitable power source 114 may be disposed within housing 102, for example, one or more batteries, capacitors, etc. Power source 114 may be recharged by electrically connecting it to a power source via feedthrough assembly 10. In one or more embodiments, power source 114 may be adapted to be inductively charged by an inductive power system outside package 100. Power source 114 may be electrically connected to electronic component 40 using any suitable technology. In one or more embodiments, the power source 114 may include a hermetically sealed battery connected to the feedthrough assembly 10 using any suitable one or more technologies.

[0098] As described herein, any suitable technique can be used to form the feedthrough 18 of component 10. For example, Figures 4A to 4D It is formed Figures 1 to 2 A schematic cross-sectional view of one embodiment of the method for feedthrough assembly 10. Although reference assembly 10 is depicted, method 200 can be used to form any suitable feedthrough assembly. Figure 4A As shown, electromagnetic radiation 202 is focused into a monolithic diamond substrate 12 to transform region 204 of the substrate into a conductive carbon material 20, which forms a feedthrough 18 and extends between a first surface 14 and a second surface 16 of the substrate. Although depicted as guiding electromagnetic radiation 202 through the first surface 14 of the substrate 12, electromagnetic radiation 202 can be guided through any surface of the substrate to transform region 204 into the conductive carbon material 20. For example, in one or more embodiments, electromagnetic radiation 202 can be guided through the second surface 16 of the substrate to transform region 204 into the conductive carbon material 20. Any suitable electromagnetic radiation having any suitable one or more wavelengths and pulse widths can be utilized. In one or more embodiments, electromagnetic radiation 202 can include a pulsed laser (e.g., an ultrafast pulsed laser) having any suitable pulse length (e.g., less than 1 picosecond, less than 30 femtoseconds, etc.).

[0099] Focusing electromagnetic radiation 202 into substrate 12 may include shaping the electromagnetic radiation (e.g., a laser beam) to produce a Gaussian focus. For example, a Gaussian laser pulse may be focused within substrate 12. A Gaussian focus can be described as exhibiting a relatively shallow axial depth of focus, which may be approximately the same size as the lateral extent of the focus. In other words, a Gaussian focus can be described as having a low aspect ratio.

[0100] Focusing 202 on the electromagnetic radiation may additionally or alternatively include shaping the electromagnetic radiation (e.g., a laser beam) to produce a Bessel focus. For example, a Bessel laser pulse may be focused within the substrate 12. A Bessel focus can be described as exhibiting a relatively deep axial depth of focus, which may be hundreds of times longer than the lateral extent of the focus. In other words, a Bessel focus can be described as forming a cylindrical focal region conceptually similar to a pencil. In other words, a Bessel focus can be described as having a low aspect ratio. While the beam of the Bessel laser can be described as converging across a wide lateral extent, the energy intensity can be described as reaching a threshold for converting the diamond monolithic mass only within the very center of the overlapping region, within 1 to 2 micrometers. In one or more embodiments, a Bessel laser pulse can convert a large amount of material at once, thereby potentially reducing manufacturing time.

[0101] In one or more embodiments, the feedthrough 18 may be a first feedthrough 18-1, and the method may include focusing electromagnetic radiation into the substrate 12 to convert a second region 206 of the substrate into a conductive carbon material 20, the conductive carbon material being formed in a second feedthrough 18-2 extending between a first surface 14 and a second surface of the substrate, such as... Figure 4B As shown. A first external contact 22-1 of the external contact 22 may be electrically connected to a first feedthrough 18-1, and a second external contact 22-2 may be associated with a second feedthrough 18-2. In one or more embodiments, a third external contact 22-3 may be associated with a third feedthrough 18-3, and a fourth external contact 22-4 may be associated with a fourth feedthrough 18-4. As further described herein, any suitable number of feedthroughs 18 may be disposed in the substrate 12.

[0102] In one or more embodiments, before setting at least one of the external contact 22 or the internal contact 28, the conductive carbon material 20 may be removed to form a through-hole using any suitable technique. For example, the conductive carbon material 20 may be laser-ablated to form a through-hole. Then, any suitable conductive material may be disposed within the through-hole using any suitable technique to form a feedthrough 18.

[0103] For example Figure 4BAs shown, one or more external contacts 22 may be disposed adjacent to the first surface 14 of the substrate 12, such that at least one external contact is electrically connected to each feedthrough 18. Any suitable technique can be used to dispose the external contacts 22 adjacent to the first surface 14 of the substrate 12. In one or more embodiments, any suitable technique can be used to connect one or more of the external contacts 22 to the first surface 14 of the substrate 12. For example, one or more external contacts 22 can be connected by forming a bonding line 26 (… Figure 2 The laser binds the first surface 14 of the substrate 12 to the substrate 12.

[0104] The patterned conductive layer 30 can be disposed adjacent to the first surface 14 of the substrate 12 using any suitable technique, such as Figure 4C As shown. Furthermore, any suitable technique can be used to electrically connect the patterned conductive layer 30 to one or more of the external contacts 22. Additionally, the patterned conductive layer 30 can be a first patterned conductive layer, and any suitable technique can be used to deposit a second patterned conductive layer 38 adjacent to the second surface 16 of the substrate 12.

[0105] exist Figure 4D In this configuration, one or more internal contacts 28 may be disposed adjacent to the second surface 16 of the substrate 12, such that the one or more internal contacts are electrically connected to one or more feedthroughs in the feedthroughs 18. The internal contacts 28 may be disposed on the second surface 16 of the substrate 12 using any suitable technique. Furthermore, the one or more internal contacts 28 may be electrically connected to the second patterned conductive layer 38 using any suitable technique.

[0106] Although not shown, in one or more embodiments, the substrate 12 of component 10 may be attached to the housing using any suitable technology (e.g., Figure 3 The housing 102) is used to form a hermetically sealed package (e.g., a hermetically sealed package 100). For example, the ferrule (e.g., ferrule 106) can be attached to the component 10 and the housing by forming one or more laser weld seams between the ferrule and at least one of the components or the housing.

[0107] As mentioned herein, any suitable device or component may be disposed within the substrate 12 of component 10. For example, Figures 5 to 6 This is a view of various embodiments of the feedthrough component 300. This article is about Figures 1 to 2 All the design considerations and possibilities described for the feedthrough component 10 also apply to the feedthrough component 10. Figures 5 to 6The feedthrough assembly 300 includes a monolithic diamond substrate 312 having a first surface 314 and a second surface 316. One or more feedthrough elements 318 extend through the substrate 312 between the first surface 314 and the second surface 316. One or more feedthrough elements 318 comprise a conductive carbon material 320. Furthermore, one or more external contacts 322 are disposed adjacent to the first surface 314 of the substrate 312, wherein the external contacts can be electrically connected to each feedthrough element 318 using any suitable technique. Additionally, as... Figure 6 As shown, one or more internal contacts 328 can be disposed adjacent to the second surface 316 of the substrate 312 using any suitable technique, wherein the internal contacts can be electrically connected to each feedthrough 318 using any suitable technique.

[0108] Figures 5 to 6 Feedthrough component 300 and Figures 1 to 2 One difference between the feedthrough components 10 is that component 300 includes one or more capacitors 350 disposed adjacent to feedthrough 318 within substrate 312. One or more capacitors of the capacitors 350 can be electrically coupled to one or more feedthroughs of the feedthrough 318 using any suitable technique. As used herein, the term "electrically coupled" means that one or more capacitors 350 are disposed relative to feedthrough 318 such that the capacitors are capable of filtering one or more signals transmitted through the feedthrough. Any suitable capacitors 350 may be disposed on or within substrate 312, such as the one or more capacitors described in U.S. Patent Application No. 63 / 461,037 entitled "MONOLITHIC DIAMOND CAPACITOR WITH CONDUCTIVE CARBON ELECTRODES". Component 300 may include any suitable number of capacitors.

[0109] Each capacitor 350 includes a first plate or electrode region 352 and a second plate or electrode region 354 substantially parallel to the first plate. The first plate 352 may define a plane or axis. Furthermore, the first plate 352 may extend from a first electrode contact region 353 at a third surface 315, a fourth surface 317, or each of the third and fourth surfaces of the substrate 312. In one or more embodiments, the first plate 352 may extend from either or both of the first surface 314 and the second surface 316. The first plate 352 may have polarity, such as positive or negative.

[0110] Although not shown, a second plate 354 may extend from a second electrode contact region at one or more surfaces of the substrate 312. The second plate 354 may define a plane or axis parallel to the plane or axis of the first plate 352. The second plate 354 may have polarity, such as negative or positive. The second plate 354 may have a polarity opposite to that of the first plate 352.

[0111] Furthermore, one or more portions 356 of the substrate 312 may be disposed between the first plate 352 and the second plate 354 to form a layer. The portions 356 may be described as separating the capacitive interface regions of the first plate 352 and the second plate 354, respectively. An exemplary capacitor 350 may be described as comprising a plurality of capacitor unit cells. That is, each capacitor 350 includes a dielectric diamond layer 356 separating the two electrode plates 352, 354, thereby establishing a capacitor unit cell.

[0112] Each of the first plate 352 and the second plate 354 is substantially orthogonal to the feedthrough 318. In one or more embodiments, each feedthrough 318 extends through the first plate 352 and the second plate 354 through one or more openings 358 provided in the first plate and one or more openings 360 provided in the second plate. The openings 358, 360 may take any suitable shape and have any suitable size.

[0113] Each of the first plate 352 and the second plate 354 of capacitor 350 may comprise any suitable conductive material. In one or more embodiments, at least one of the first plate 352 and the second plate 354 of capacitor 350 comprises a conductive carbon material, which is used as described herein with respect to feedthroughs (e.g., ...). Figures 1 to 2 The feedthrough element 18) is formed by any suitable technique derived from one or more portions of the substrate 12.

[0114] In one or more embodiments, each capacitor 350 may include a first electrode connector (not shown) that electrically connects at least two first plates 352 of a plurality of capacitor unit cells 350. Additionally or alternatively, capacitor 350 may include a second electrode connector (not shown) that electrically connects at least two second plates 354 of a plurality of capacitor unit cells. The first or second electrode connector may each be electrically connected to a power source (such as a battery or another capacitor, just two examples) for transferring energy from the power source to the capacitor. Additionally or alternatively, the first or second electrode connector may each be electrically connected to a device (e.g., leads such as those in a medical device) for transferring energy from the capacitor to the leads.

[0115] Electrode connectors can comprise any suitable material. As several examples, a suitable electrode connector material can be selected based on the material's conductivity, desired assembly method, and material compatibility (such as between the electrode connector and the electrode region or between the electrode connector and a monolithic diamond substrate). As another example, a suitable material can be selected based on the compatibility of the material with the conductive carbon in the electrode region. Compatibility can include factors such as the contact resistance between the electrode connector material and the conductive carbon or the adhesion between the electrode connector material and the conductive carbon. Suitable electrode connector materials can include, for example, metals, conductive resins, conductive epoxy resins (such as silver-impregnated epoxy resins), conductive polymers, or combinations of two or more of these. As yet another example, suitable electrode connector materials can include aluminum, copper, silver, gold, platinum, or combinations of two or more of these. As yet another example, suitable electrode connector materials can include simple metal layers, sputtered metal, solder balls, or combinations of two or more of these. It will be understood from this disclosure that any suitable electrode connector material can be used, and this disclosure is not limited in this respect.

[0116] The feedthrough assembly 300 can be formed using any suitable technique. For example, the feedthrough element 318, the external contact 322, and the internal contact 328 can use reference [reference / technology]. Figures 4A to 4D The technical formation described with respect to feedthrough component 10. Capacitor 350 may be formed using any suitable technique, such as one or more techniques described in U.S. Patent Application No. 63 / 461,037.

[0117] For example, electromagnetic radiation can be focused onto substrate 312 to convert region 302 of the substrate into a conductive carbon material, which forms one or more capacitors 350 within the substrate. Any suitable technique can be used to electrically couple the capacitors 350 to one or more feedthroughs in feedthrough 318. Each capacitor 350 may include a first plate 352, a second plate 354, and a portion or layer 356 of the substrate 312 disposed between the first and second plates. Any suitable number of capacitors 350 can be formed within substrate 312.

[0118] One or more embodiments of the feedthrough assembly described herein include one or more feedthrough elements disposed within a monolithic diamond substrate. In one or more embodiments, the one or more feedthrough elements may be disposed within a portion of the monolithic diamond substrate, and then disposed within an additional substrate to provide the feedthrough assembly. For example, Figure 7 This is a schematic plan view of a feedthrough assembly 400 including feedthrough element 418. This article is about... Figures 1 to 2 Feedthrough component 10 and Figures 5 to 6 All the design considerations and possibilities described in the feedthrough component 300 also apply to the feedthrough component 300. Figure 7 400 feedthrough component.

[0119] One difference between component 400 and components 10 and 300 is that component 400 includes a monolithic diamond portion 412 surrounding the feedthrough 418 to form sub-component 402. This sub-component 402 is disposed within substrate 404 to provide the feedthrough component 400. Sub-component 402 can be formed using any suitable technique. In one or more embodiments, sub-component 402 may be formed together with additional sub-components in a monolithic diamond substrate and then divided using any suitable technique (e.g., sawing, laser ablation, laser cutting, etc.). This divided sub-component 402 can then be disposed within substrate 404 using any suitable technique.

[0120] It should be understood that the various aspects disclosed herein can be combined with combinations different from those specifically presented in the specification and drawings. It should also be understood that, depending on the example, certain actions or events of any of the processes or methods described herein may be performed in a different order, or may be completely added, combined, or omitted (e.g., performing these techniques may not require all the described actions or events). Furthermore, although for clarity some aspects of this disclosure are described as being performed by a single module or unit, it should be understood that the techniques of this disclosure can be performed by combinations of units or modules associated with, for example, a medical device.

[0121] In one or more examples, the described techniques may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functionality may be stored as one or more instructions or code on a computer-readable medium and executed by a hardware-based processing unit. A computer-readable medium may include a computer-readable storage medium, which corresponds to a tangible medium such as a data storage medium (e.g., RAM, ROM, EEPROM, flash memory, or any other medium that can be used to store desired program code in the form of instructions or data structures and is accessible by a computer).

[0122] Instructions may be executed by one or more processors, such as one or more digital signal processors (DSPs), general-purpose microprocessors, application-specific integrated circuits (ASICs), field-programmable arrays (FPGAs), or other equivalent integrated or discrete logic circuit systems. Therefore, the term "processor" as used herein may refer to any of the foregoing structures or any other physical structures suitable for implementing the described techniques. Furthermore, these techniques may be fully implemented in one or more circuit or logic elements.

[0123] All references and publications cited herein are expressly incorporated in their entirety unless they could directly contradict this invention. Exemplary embodiments of this disclosure have been discussed, and possible variations within the scope of this disclosure have been referenced. These and other variations and modifications of this invention will be apparent to those skilled in the art without departing from the scope of the invention, and it should be understood that the invention is not limited to the illustrative embodiments set forth herein. Therefore, the invention is limited only by the appended claims.

Claims

1. A feedthrough assembly, the feedthrough assembly comprising: A monolithic diamond substrate, wherein the monolithic diamond substrate includes a first surface and a second surface; A feedthrough extending through the monolithic diamond substrate between the first and second surfaces of the substrate, wherein the feedthrough comprises a conductive carbon material; and An external contact is disposed adjacent to the first surface of the monolithic diamond substrate and electrically connected to the feedthrough.

2. The component of claim 1, wherein the conductive carbon material is converted from a portion of the monolithic diamond substrate.

3. The component according to any one of claims 1 to 2, wherein the monolithic diamond substrate comprises a single-crystal diamond substrate.

4. The component according to any one of claims 1 to 3, wherein the conductive carbon material comprises graphite carbon.

5. The component according to any one of claims 1 to 4, the component further comprising a capacitor disposed adjacent to the feedthrough within the substrate, wherein the capacitor is electrically coupled to the feedthrough.

6. The component of claim 5, wherein the capacitor includes a first plate and a second plate substantially parallel to the first plate, wherein a portion of the substrate is disposed between the first plate and the second plate.

7. The component of claim 6, wherein the first plate and the second plate of the capacitor comprise a conductive carbon material converted from a portion of the monolithic diamond substrate.

8. A hermetically sealed package, the hermetically sealed package comprising a housing and a feedthrough assembly forming part of the housing, wherein the feedthrough assembly comprises: A monolithic diamond substrate, the monolithic diamond substrate including a first surface and a second surface, wherein the substrate is connected to the housing; A feedthrough extending through the monolithic diamond substrate between the first and second surfaces of the substrate, wherein the feedthrough comprises a conductive carbon material; and An external contact is disposed adjacent to the first surface of the monolithic diamond substrate and electrically connected to the feedthrough.

9. The package of claim 8, further comprising a capacitor disposed within the substrate adjacent to the feedthrough, wherein the capacitor is electrically coupled to the feedthrough.

10. The package of claim 9, wherein the capacitor includes a first plate and a second plate substantially parallel to the first plate, wherein a portion of the substrate is disposed between the first plate and the second plate.

11. The package of claim 10, wherein the main surface of each of the first plate and the second plate is substantially orthogonal to the feedthrough.

12. The package of claim 11, wherein the feedthrough extends through the first plate and the second plate.

13. The package according to any one of claims 9 to 12, wherein the first plate and the second plate of the capacitor comprise a conductive carbon material converted from a portion of the monolithic diamond substrate.

14. An implantable medical device comprising an airtight encapsulation according to any one of claims 8 to 13.

15. A method, the method comprising: Electromagnetic radiation is focused onto a monolithic diamond substrate to convert a region of the monolithic diamond substrate into a conductive carbon material, which forms a feedthrough extending between a first surface and a second surface of the monolithic diamond substrate. as well as An external contact is disposed adjacent to the first surface of the monolithic diamond substrate such that the external contact is electrically connected to the feedthrough.

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