Laser processing apparatus and laser processing method

Abstract

A laser processing device is provided with a gas injection unit that injects a gas from an opening toward a site where a laser beam irradiates a surface of a steel plate, the gas injection unit having a nozzle unit that has an outer surface, the outer surface is inclined so as to approach the center of the opening from the outside of the opening in a direction parallel to the surface of the steel plate from the side opposite the opening in the injection direction toward the opening side. At least a part of the outer surface of the nozzle part is provided with a first adhesion blocking part for blocking the adhesion of laser spatter.

Description

Technical Field

[0001] This disclosure relates to laser processing apparatus and laser processing methods. Background Technology

[0002] Previously, in the steel industry, it is known to process the surface of steel plates by irradiating the surface of steel plates being transported in a predetermined direction or in a stationary state with a laser to create grooves or similar processing. For example, Japanese Patent Application Publication No. 2020-138226 discloses a technique in which multiple laser processing units, each having a laser light source, are arranged along the width direction of a directional electromagnetic steel plate. In Japanese Patent Application Publication No. 2020-138226, processing grooves extending along the width direction are formed on the surface of the steel plate by laser irradiation.

[0003] Dust known as laser spatter is generated from the laser irradiation site (i.e., the irradiation location) on the surface of the steel plate. Furthermore, in this specification, foreign matter such as laser spatter and chips are also referred to as "spatters." If spatter adheres to the surface of the steel plate, it may adversely affect the performance of the steel plate. Therefore, a technique for removing spatter from the surrounding area of ​​the steel plate has been proposed.

[0004] As a technology for removing splatter, for example, Japanese Patent Application Publication No. 2020-138226 discloses a laser processing apparatus, which includes: a laser irradiation device; a dust collection mechanism to attract splatter; and an air nozzle as a gas jetting unit to jet air toward the laser irradiation area.

[0005] Patent Document 1: Japanese Patent Application Publication No. 2020-138226 Summary of the Invention

[0006] The problem that the invention aims to solve Here, the present inventors have observed that when using a gas jet section that sprays gas from a nozzle towards an irradiation area, spatter tends to adhere to the outer surface of the nozzle section. The nozzle section, as referred to here, is the portion of the gas jet section having an outer surface that is inclined from the outside of the opening towards the opening side in a direction parallel to the surface of the steel plate, moving from the side opposite to the opening for gas injection towards the opening side. In particular, the present inventors have observed that fine spatter generated by groove processing on the surface of the steel plate adheres to the nozzle section of the gas jet section due to prolonged use of the laser processing equipment. The groove depth is approximately 10 μm to 50 μm. Furthermore, the size of the spatter generated by the groove formation is also approximately 10 μm to 50 μm, similar to the groove depth.

[0007] In this regard, Japanese Patent Application Publication No. 2020-138226 does not study a technique for suppressing the adhesion of spatter to the outer surface of the nozzle in laser processing when the gas jet section has a nozzle section.

[0008] This disclosure was made in view of the above circumstances, and provides a laser processing apparatus and laser processing method capable of suppressing laser spatter from adhering to the outer surface of the nozzle portion of a gas jet section.

[0009] Methods for solving problems The laser processing apparatus disclosed herein includes a gas jetting section that jets gas from an opening toward a laser irradiation portion of a steel plate surface. The gas jetting section has a nozzle section with an outer surface that is inclined from the outside of the opening toward the opening side in a direction parallel to the surface of the steel plate, and a first adhesion barrier for preventing the adhesion of laser sputtering material is disposed on at least a portion of the outer surface of the nozzle section.

[0010] The laser processing method disclosed herein irradiates the surface of a steel plate with a laser. A gas jetting section is used to jet gas from an opening toward the irradiation site in such a way that laser spatter generated from the irradiation site is rolled up from the surface of the steel plate. The gas jetting section has a nozzle section having an outer surface that is inclined from the outside of the opening toward the center of the opening in a direction parallel to the surface of the steel plate, moving from the side opposite to the opening in the jetting direction toward the opening side. At least a portion of the outer surface of the nozzle section is provided with an adhesion-resistant section for preventing the adhesion of laser spatter.

[0011] Invention Effects According to this disclosure, it is possible to suppress the adhesion of laser sputtering material to the outer surface of the nozzle portion of the gas jet section. Attached Figure Description

[0012] Figure 1 This is a top view illustrating the laser processing apparatus of the first embodiment of this disclosure.

[0013] Figure 2 yes Figure 1 The 2-2 line cross-section diagram.

[0014] Figure 3 Is Figure 1 The cross-sectional view of the laser processing apparatus of the first modified example of the first embodiment, cut off at the position of line 2-2 in the diagram, is used for illustration.

[0015] Figure 4 Is Figure 1The cross-sectional view of the laser processing apparatus of the second modification of the first embodiment, cut off at the position of line 2-2 in the diagram, is used for illustration.

[0016] Figure 5 Is Figure 1 The cross-sectional view shown is a cut-off section at the position of line 2-2 in the first embodiment of the laser processing apparatus for illustration.

[0017] Figure 6 It is a graph illustrating the adhesion rate of spatter to the gas jet section in each laser processing apparatus of the first embodiment and the first to third modifications.

[0018] Figure 7 In the context of Figure 1 The cross-sectional view shown is a cut-off section of the laser processing apparatus of the second embodiment of this disclosure, corresponding to line 2-2.

[0019] Figure 8 In the context of Figure 1 The cross-sectional view shown is a cut-off section of the gas jet section of the laser processing apparatus of the fourth modification of the second embodiment, corresponding to line 2-2 in the diagram.

[0020] Figure 9 This is a front view of the gas jet section of the laser processing apparatus of the fourth variation of the second embodiment, viewed along the conveying direction, for explanation purposes.

[0021] Figure 10 In the context of Figure 1 The cross-sectional view of the laser processing apparatus of the fifth modified example of the second embodiment, which is cut off at the position corresponding to line 2-2 in the diagram, is used for illustration.

[0022] Figure 11 In the context of Figure 1 The cross-sectional view of the laser processing apparatus of the sixth modified example of the second embodiment, which is cut off at the position corresponding to line 2-2 in the diagram, is used for illustration.

[0023] Figure 12 This is a graph illustrating the adhesion rate of spatter to the gas jet section in each laser processing apparatus of the second embodiment and the fourth to sixth modifications.

[0024] Figure 13 In the context of Figure 1 The cross-sectional view shown is a cut-off section of the laser processing apparatus of the third embodiment of this disclosure, corresponding to line 2-2.

[0025] Figure 14 In the context of Figure 1 The cross-sectional view of the laser processing apparatus of the seventh modified example of the third embodiment, which is cut at the position corresponding to line 2-2 in the diagram, is used for illustration.

[0026] Figure 15 In the context of Figure 1 The cross-sectional view of the laser processing apparatus of the eighth modified example of the third embodiment, which is cut at the position corresponding to line 2-2 in the diagram, is used for illustration.

[0027] Figure 16 This is a top view illustrating the first stripping mechanism in standby mode in the dust collection mechanism section of the laser processing apparatus in the eighth variation of the third embodiment.

[0028] Figure 17 yes Figure 16 The cross-sectional view along line 17-17 in the diagram.

[0029] Figure 18 yes Figure 16 The cross-sectional view of line 18-18 in the diagram.

[0030] Figure 19 This is a top view illustrating the first stripping mechanism in the ejection state of the dust collection mechanism section of the laser processing apparatus in the eighth variation of the third embodiment.

[0031] Figure 20 In the context of Figure 16 The first stripping mechanism in the ejected state of the dust collection mechanism of the laser processing apparatus of the eighth modification of the third embodiment is shown in the cross-sectional view corresponding to line 17-17 in the diagram.

[0032] Figure 21 This is a top view illustrating the second stripping mechanism in standby mode in the dust collection mechanism section of the laser processing apparatus in the eighth variation of the third embodiment.

[0033] Figure 22 yes Figure 21 The cross-sectional view along line 22-22 in the diagram.

[0034] Figure 23 This is a front view of the stripping mechanism in the dust collection mechanism section of the laser processing apparatus of the eighth modified example of the third embodiment, which is in a standby state on the bottom side.

[0035] Figure 24 This is a top view illustrating the second stripping mechanism in the ejected state of the dust collection mechanism section of the laser processing apparatus in the eighth variation of the third embodiment.

[0036] Figure 25 In the context of Figure 21 The cross-sectional view shown is provided for illustrating the second stripping mechanism in the ejected state of the dust collection mechanism section of the laser processing apparatus of the eighth modified example of the third embodiment, which is cut off at the position corresponding to line 22-22.

[0037] Figure 26 In the context of Figure 1The cross-sectional view of the laser processing apparatus of the ninth modified example of the third embodiment, which is cut at the position corresponding to line 2-2 in the diagram, is used for illustration.

[0038] Figure 27 This is a graph illustrating the adhesion rate of spatter to the dust collection mechanism in each laser processing apparatus of the third embodiment and the seventh to ninth modifications. Detailed Implementation

[0039] The first and second embodiments are described below. In the following drawings, the same or similar parts are labeled with the same or similar reference numerals. However, the drawings are schematic, and the relationship between thickness and planar dimensions, the thickness ratios of each device and component, etc., may differ from reality. Therefore, specific thicknesses and dimensions should be determined with reference to the following description. Furthermore, the drawings also include parts with different dimensional relationships and ratios. Additionally, unless otherwise specified in the specification, the number of each constituent element of this disclosure is not limited to one, and multiple elements may exist.

[0040] Laser processing equipment like Figure 1 and Figure 2 As shown, the laser processing apparatus 1 of the first embodiment includes a laser light source unit 10, a gas jet unit 20, a dust collection mechanism unit 30, and a top plate 90. The laser light source unit 10, the gas jet unit 20, and the dust collection mechanism unit 30 are controlled in operation, for example, by various computers (not shown), such as a process computer that uniformly controls the steel plate manufacturing process.

[0041] (steel plate) The laser processing apparatus 1 of the first embodiment processes steel plates S. There is no particular limitation on the type of steel plate S; various known steel plates S, such as directional electromagnetic steel plates (e.g., JIS C 2553:2012), can be used. Furthermore, there is no limitation on the type of laser processing used. The laser processing apparatus 1 of the first embodiment can be applied to various known laser-based processes performed at arbitrary timings in the manufacturing process for producing various types of steel plates S.

[0042] The steel plate S is conveyed by conveyor rollers R arranged at predetermined intervals along the conveying direction C. The conveying direction C is preset. The laser processing apparatus 1 of the first embodiment is arranged between adjacent conveyor rollers R. However, in this disclosure, the location of the laser processing apparatus is not limited to between adjacent conveyor rollers.

[0043] Furthermore, although figures are omitted, in this disclosure, the laser processing apparatus can also be arranged opposite to the portion of the steel plate being transported and the irradiation direction overlapping on the roller surface of the steel plate support roller, which alters the transport direction C of the steel plate S. For example, the steel plate support roller can change the pass line of the steel plate S transported in the horizontal direction to an inclined direction. Additionally, the steel plate support roller can change the pass line of the steel plate S transported obliquely upwards to an obliquely downwards. In this disclosure, the laser processing apparatus can be arranged at any position on the transport line of the steel plate S.

[0044] (Steel strip coil) As the first embodiment, the steel plate S uses a steel strip coil. Furthermore, in this disclosure, the steel plate is not limited to a steel strip coil; for example, a pre-cut plate from a steel strip coil may also be used. The steel strip coil can be produced by winding a long strip of steel with a certain width.

[0045] When laser processing is performed on the surface of the steel plate S, the center end of the wound steel strip is rotatably supported on one end of the processing equipment along its long side, and the outer end of the steel strip is connected to the other end of the processing equipment along its long side. Furthermore, the other end of the steel strip is pulled out and wound at a substantially constant speed toward the other end of the processing equipment. In the first embodiment, the case where the surface of the steel plate S is laser-processed by passing the wound steel strip through the laser processing apparatus 1 provided within the processing equipment is also referred to as "through plate".

[0046] (Continuous processing) In the first embodiment, laser processing performed on the through-plate of the steel sheet S from the steel strip coil is referred to as "continuous processing." On the other hand, laser processing of the surface of the cutting plate without pulling out the steel strip coil is referred to as "batch processing (intermittent processing)." In batch laser processing, the steel sheet, for example, is fixed on a processing support table or supported on a conveyor line, and laser processing is performed on individual cutting plates as needed, while the laser processing device moves along the length of the cutting plate. Furthermore, for each cutting plate, there are operations such as fixing it to the support table and feeding or retrieving it from the conveyor line. Therefore, in batch processing, the cost of slot processing tends to increase, resulting in lower productivity.

[0047] On the other hand, in the continuous laser processing described in the first embodiment, by continuously and repeatedly performing processing in the strip width direction, such as scanning with laser LB, it is possible to perform approximately uniform groove processing covering almost the entire length of the steel strip coil in a relatively short time after winding. Furthermore, there is no need for operations that require the laser processing apparatus 1 to move along the entire length of the steel strip coil, i.e., no need to move it along the conveying direction C. Therefore, in continuous processing, compared to batch processing, the cost of groove processing can be reduced, resulting in increased productivity.

[0048] (Laser Source Department) The laser source unit 10 irradiates the surface of the conveyed steel plate S with a laser LB of a predetermined wavelength. The laser source unit 10 includes: a laser source for irradiating the laser LB with the wavelength and intensity required to achieve the desired processing, the laser source not shown; and an optical system for guiding the laser LB irradiated from the laser source to the surface of the steel plate S, the optical system not shown.

[0049] Regarding the laser source, there are no particular limitations; various solid-state laser sources, gas laser sources, semiconductor laser sources, and other types of laser sources can be used. Similarly, regarding the optical system, there are no particular limitations; various optical systems used to guide the laser LB to the surface of the steel plate S can be used.

[0050] The location of the laser light source unit 10 described above is not particularly limited, for example, Figure 2 As illustrated, it is preferable to position the laser LB approximately perpendicular to the surface of the steel plate S in the vertical direction above the steel plate S.

[0051] (Gas injection section) like Figure 1 and Figure 2 As shown, the gas injection unit 20 is positioned at two locations relative to the laser LB emission unit 12 of the laser source unit 10: one upstream of the laser source unit 10 in the transport direction C and the other downstream of the laser source unit 10 in the transport direction C. Figure 2 As shown, an air supply pump P1 is connected to the gas injection section 20 via an air supply pipe 24.

[0052] In the first embodiment, the gas injection section 20 is an air nozzle that injects gas 20A from an opening 21B1 parallel to the optical axis of the laser LB toward the irradiation area SA of the laser LB. The opening 21B1 of the gas injection section 20 in the first embodiment, when viewed from above, has a width direction (...). Figure 1The long side of the gas jet 20 extends in the vertical direction. The opening of the gas jet section of this disclosure is not limited to a rectangular shape and may be other geometric shapes. The gas jet section 20 sprays dry air supplied by an air supply pipe not shown in the figure as an example of gas 20A onto the irradiation part SA of the laser LB on the surface of the steel plate S.

[0053] The gas injection section 20 has a base 21A and a nozzle section 21B. Figure 2 The base 21A of the steel plate S has a pair of opposite outer surfaces along its longitudinal direction. The pair of outer surfaces are along the width direction. Figure 1 It extends in the vertical direction and is closed at both ends. Figure 2 One outer surface of the base 21A is vertical. Figure 2 The upper part of the base 21A is mounted on the top plate 90, and the lower part of the base 21A is continuous with the nozzle part 21B. Furthermore, the shape of the base 21A is not limited to... Figure 2 Any shape that can guide gas to the nozzle section 21B is acceptable.

[0054] like Figure 2 As shown, the nozzle section 21B is connected to the side of the base 21A opposite to the top plate 90. The nozzle section 21B is equipped with a nozzle that can be adjusted according to the direction of injection ( Figure 2 The side opposite to opening 21B1 in the vertical direction (in the middle) Figure 2 The upper side of the middle) faces the opening 21B1 side ( Figure 2 The lower side of the opening 21B1) is the outer surface that slopes towards the center of the opening 21B1 from the outside in a direction parallel to the surface of the steel plate S. The center of the opening 21B1 refers to the long side direction of the steel plate S (the lower side of the opening 21B1). Figure 2 The position of the center of the opening 21B1 in the left and right directions. Figure 2 The center of the opening 21B1 overlaps with the laser LB, as illustrated by the single-dotted line.

[0055] In other words, the length of the outer surfaces of the nozzle section 21B facing each other along the long side of the steel plate S, as measured along the long side of the steel plate S, decreases as it moves from the injection section 12 side toward the irradiation area SA side. The opening surface of the nozzle section 21B is orthogonal to the injection direction. The outer surface of the nozzle section 21B is inclined relative to the conveying direction C. The outer surface of the nozzle section 21B includes an object surface whose normal points toward the direction in which the steel plate S exists.

[0056] Regarding the long side direction of the steel plate S, as in the first embodiment, when the steel plate S is conveyed during laser processing, the long side direction of the steel plate S is perpendicular to the conveying direction C (i.e., Figure 1 The conveying direction C is parallel to the width direction of the steel plate S (i.e., the left-right direction). Figure 1The vertical direction is orthogonal to the horizontal direction. Furthermore, when the steel plate S is stationary during laser processing, the long side of the steel plate S is parallel to its surface and orthogonal to its width direction.

[0057] The gas injection unit 20 is configured such that, when viewed along the conveying direction C, in the width direction of the steel plate S (i.e., Figure 1 The sprayed gas 20A, i.e., dry air, overlaps with the laser LB across the entire scanning width of the laser LB in the vertical direction. That is, the gas injection section 20 is configured such that the sprayed dry air is directed towards at least a portion of the laser LB. The ejected jet of gas 20A from the gas injection section 20 suppresses the adhesion of spatter LS to the ejection section 12. A portion of the surface of the steel plate S heats up and expands in volume due to the energy of the laser LB, and this expanded portion flies off the surface of the steel plate S as spatter LS. The ejected spatter LS is collected by the dust collection mechanism section 30 by the suction airflow DF of the dust collection mechanism section 30.

[0058] In the laser processing apparatus 1 of the first embodiment, instead of using an air knife with a flow rate that scrapes splatter from the inside of the groove G on the surface of the steel plate, a gas jet section 20 that sprays dry air at a flow rate lower than that of an air knife is used. As a result, the flow of air used for dust collection is not disturbed as with an air knife, and the splatter LS can be rolled up from the surface of the steel plate S and superimposed on the air flow of the dust collection mechanism section 30.

[0059] In other words, in the laser processing apparatus 1 of the first embodiment, dry air is sprayed from the gas jet section 20 toward the irradiation area SA of the laser LB to a degree that can roll up the spatter LS from the surface of the steel plate S. Therefore, in this disclosure, not all of the dry air may reach the irradiation area SA. Alternatively, only a portion of the dry air may reach the irradiation area SA. As a result, it is possible to prevent the rolled-up spatter LS from adhering to the laser processing apparatus, and in particular to the ejection section 12 and the gas jet section 20. In order to roll up the spatter LS from the surface of the steel plate S, for example, the jetting conditions, including the jetting speed, are determined based on experiments, and a gas such as dry air is sprayed under the determined jetting conditions.

[0060] On the other hand, unlike the air nozzle of the first embodiment, the dry air ejected by the air knife reaches the groove G and blows away the spatter inside the groove G. Therefore, the blown-away spatter LS adheres to the laser processing apparatus including the ejection section 12. More specifically, when using an air knife, molten particles with a diameter of 100 μm or more, referred to as debris, are sometimes generated. These debris are difficult to cool and are difficult to accumulate in the airflow caused by the dust collection mechanism 30, thus easily adhering to surrounding equipment. In contrast, by using an air nozzle like that of the first embodiment, the generation of molten particles with a diameter of 100 μm or more can be suppressed, resulting in the ability to control the generated particles to only 10-50 μm, which are easier to cool and easier to accumulate in the airflow caused by the dust collection mechanism 30.

[0061] The gas injection unit 20 can be positioned anywhere that allows dry air to be sprayed onto the surface of the steel plate S; there are no specific requirements. However, if... Figure 1 and Figure 2 As shown, the gas injection section 20 is preferably positioned directly above the steel plate S. Furthermore, it is more preferable that the gas injection section 20 is positioned parallel to the optical axis of the laser LB, such that the main axis direction of the nozzle of the gas injection section 20, in other words, the direction of travel of the injected dry air, is approximately coaxial with the optical axis direction of the laser LB of the laser light source section 10. Figure 2 The dry air illustrated is sprayed toward the surface of the steel plate S in a manner that is parallel to the optical axis of the laser LB and approximately orthogonal to the surface of the steel plate S.

[0062] In this first embodiment, the amount of dry air injected from the gas injection unit 20 is preferably set to be less than or equal to the suction amount of the dust collection mechanism 30. By ensuring that the amount of dry air injected from the gas injection unit 20 is less than or equal to the suction amount of the dust collection mechanism 30, it is possible to more reliably suppress the dry air from disturbing the flow of air used to attract the splashes LS and to suppress the generation of debris while simultaneously rolling up the splashes LS from the surface of the steel plate S. Therefore, the dust collection efficiency of the splashes LS can be improved more reliably. More preferably, the amount of dry air injected from the gas injection unit 20 is controlled more precisely. Furthermore, in this disclosure, the amount of dry air injected is not limited to less than or equal to the suction amount of the dust collection mechanism 30 and can be varied arbitrarily.

[0063] Furthermore, the ejection velocity of the dry air injected from the gas injection unit 20 is preferably set to a value lower than or equal to the suction velocity of the dust collection mechanism unit 30. By setting the ejection velocity of the dry air to a value lower than or equal to the suction velocity of the dust collection mechanism unit 30, the dust collection efficiency of the dust collection mechanism unit 30 can be further improved. Moreover, in this disclosure, the ejection velocity of the dry air is not limited to being lower than or equal to the suction velocity of the dust collection mechanism unit 30, and can be arbitrarily varied.

[0064] Furthermore, there is no particular limitation on the specific example of the gas injection unit 20 that realizes the injection of dry air, and various known air injection nozzles can be used. For example, a slit nozzle can be used as an air injection nozzle. In addition, the gas 20A injected from the gas injection unit 20 is not limited to the dry air described above, and can also be nitrogen, argon, carbon dioxide, helium, etc.

[0065] (Attachment obstruction part) In the first embodiment, an adhesion-blocking portion 22A comprising a carbon monomer and used to prevent the adhesion of splashes LS is disposed on the surface of the gas jet section 20. The adhesion-blocking portions provided in the respective gas jet sections 20 of the first embodiment and its variations correspond to the first adhesion-blocking portions of this disclosure. Specifically, in the first embodiment, the entire gas jet section 20, including the base portion 21A and the nozzle portion 21B, is formed of the adhesion-blocking portion 22A from a carbon monomer. In other words, "the entire gas jet section 20" refers to the main body of the air nozzle of the gas jet section 20.

[0066] Furthermore, the portion of the gas injection section 20 that is connected to the air supply pump P1, for example, can also be included in the "entire gas injection section 20" by being formed from carbon monomers. In addition, in this disclosure, the entire gas injection section 20 does not necessarily have to be formed from carbon monomers; for example, a portion of the steel plate side of the gas injection section 20 may be formed from carbon monomers.

[0067] In the gas jet section 20, which is a carbon monomer, the surface flatness is improved compared to a gas jet section made of a metal such as steel or a resin that does not contain carbon monomers. Therefore, surface unevenness is greatly suppressed. Similarly, the gas jet section 20, which is a carbon monomer, exhibits superior heat resistance compared to a gas jet section made of a metal such as steel or a resin that does not contain carbon monomers. In the first embodiment, by improving flatness and heat resistance, it is difficult for high-temperature spatter LS to adhere.

[0068] The carbon monomer disclosed herein can be defined as a structure formed by multiple carbon atoms bonded together. In a first embodiment, the carbon monomer is, for example, isotropic graphite that can be manufactured by cold isostatic pressing (CIP), but this disclosure is not limited to this, and other graphite materials may also be used. For example, the carbon monomer may be anisotropic graphite, carbon fiber, carbon sheet, etc.

[0069] In the first embodiment, the bulk density of the carbon monomer is preferably approximately 1.7 g / cm³ or higher. If the bulk density is less than 1.7 g / cm³, the durability of the carbon monomer in the laser processing apparatus may decrease.

[0070] Furthermore, in this disclosure, for example, when the carbon monomer is anisotropic graphite, the bulk density of the carbon monomer is preferably approximately 1.5 g / cm³ or higher. However, compared to using other materials, isotropic graphite is preferred as the carbon monomer, as in the first embodiment, in terms of improving the durability of the carbon monomer.

[0071] (Dust Collection Mechanism Department) The dust collection mechanism 30 is a mechanism that uses the injection of dry air from the gas injection unit 20 to suppress the adhesion of splashes LS to the ejection unit 12 and to collect dust from the splashes LS floating near the irradiation area SA of the laser LB. The dust collection mechanism 30 has, for example, an appearance constructed of a cylindrical dust collection hood, which has a dust collection port 30A on one side of the axial direction for collecting the splashes LS. The dust collection mechanism 30 includes a dust collection flow path (not shown) for attracting the splashes LS, a dust collection pipe 34 connected to the dust collection flow path, and a suction pump P2 connected to the dust collection pipe 34.

[0072] The dust collection mechanism 30 is configured to draw in the atmosphere surrounding the dust collection port 30A with a predetermined suction amount. The dust collection mechanism 30 collects dust from the splashes LS generated at the irradiation site SA of the laser LB from the dust collection port 30A via a suction action. There are no particular limitations on the specific structure of the dust collection mechanism 30, and various known mechanisms can be appropriately utilized. Furthermore, the number of dust collection mechanisms 30 is not limited to one; multiple units may be used.

[0073] like Figure 1 and Figure 2 As schematically shown, the dust collection mechanism 30 is disposed only on one side of the irradiation area SA of the laser LB in the conveying direction C of the steel plate S, either upstream or downstream. That is, the dust collection mechanism 30 is not disposed on either the upstream or downstream side of the irradiation area SA of the laser LB. By disposing of the dust collection mechanism 30 only upstream or only downstream of the irradiation area SA of the laser LB, stagnation of the airflow used to attract the splash LS near the irradiation area SA of the laser LB can be prevented, thus reliably collecting dust from the splash LS.

[0074] Furthermore, assuming the dust collection mechanism 30 is disposed on one side of the upstream or downstream side, it is sometimes difficult to ensure sufficient space for the dust collection mechanism 30 due to interference between the dust collection mechanism 30 and the components of the laser processing apparatus 1. In this first embodiment, the dust collection mechanism 30 can be disposed on either the upstream or downstream side, so even if it is difficult to ensure sufficient space for the dust collection mechanism 30 on one side, space can be provided on the other side. That is, the placement position of the dust collection mechanism 30 can be easily and flexibly changed. Additionally, in this disclosure, the dust collection mechanism can also be disposed on both the upstream and downstream sides of the irradiation area SA of the laser LB in the conveying direction C of the steel plate S.

[0075] In addition, such as Figure 2 As schematically shown, the dust collection mechanism 30 is preferably provided only downstream of the irradiation area SA of the laser LB. By conveying the steel plate S, which is the object to be processed, along the conveying direction C, an airflow (i.e., a co-current flow) is generated from the upstream side to the downstream side of the conveying direction C. Therefore, by providing the dust collection mechanism 30 only downstream of the irradiation area SA of the laser LB, the co-current flow can be effectively utilized, resulting in more reliable dust collection of the splashes LS.

[0076] The suction amount of the dust collection mechanism 30 is preferably greater than or equal to the amount of dry air ejected from the gas ejection section 20. This allows for more reliable prevention of airflow stagnation around the irradiation area SA of the laser LB, and more reliable collection of the splashes LS. Furthermore, in this disclosure, the suction amount of the dust collection mechanism 30 is not limited to greater than or equal to the amount of gas 20A ejected from the gas ejection section 20, and can be varied arbitrarily.

[0077] Furthermore, the suction flow rate of the dust collection mechanism 30 is preferably 15 m / s or more and 50 m / s or less, more preferably 20 m / s or more and 30 m / s or less. By maintaining a suction flow rate of 15 m / s or more and 50 m / s or less, the airflow around the irradiation area SA of the laser LB remains turbulent. As a result, the splashes LS can be collected more reliably.

[0078] When the suction flow rate is less than 15 m / s, the spatter attraction rate decreases. Furthermore, when the suction flow rate exceeds 50 m / s, power consumption increases. Additionally, when the suction flow rate exceeds 50 m / s, the negative pressure increases due to suction, resulting in air pressure vibration, which may cause problems with the stability of the through-plate and the laser equipment. Moreover, in this disclosure, the suction flow rate of the dust collection mechanism 30 is not limited to 15 m / s or more and 50 m / s or less, and can be arbitrarily varied.

[0079] (Laser processing department and laser processing components) In this disclosure, a "laser processing unit" may be constituted by a laser light source unit 10, a gas jet unit 20, and a dust collection mechanism unit 30 that correspond to each other. Alternatively, a "laser processing assembly" may be constituted by multiple laser processing units arranged along the width direction of the steel plate S.

[0080] In this disclosure, the number of laser processing units constituting a laser processing assembly can be one or more. Alternatively, in this disclosure, for a single steel plate S, two or more laser processing assemblies can be arranged in multiple stages along the conveying direction C.

[0081] (roof) A laser source unit 10 and a gas jet unit 20 are mounted on the top plate 90. Furthermore, in this disclosure, the top plate may be included to constitute a "laser processing unit." Figure 2 As shown, the top plate 90, positioned at the height of the emission portion 12 of the laser light source unit 10, separates the space on the side of the steel plate S from the space on the opposite side of the steel plate S. That is, the top plate 90 functions to prevent spatter LS from adhering to the partition wall located above the emission portion 12 of the laser light source unit 10.

[0082] The laser processing apparatus 1 of the first embodiment can more efficiently collect the splatter LS generated by the irradiation of the laser LB, and can more easily achieve a dust collection efficiency of, for example, 90% or more. The dust collection efficiency of the splatter LS can be calculated as (the number of splatter LS particles that reach the depth of the dust collection flow path provided in the dust collection mechanism 30) / (the number of splatter LS particles generated).

[0083] Furthermore, the improved dust collection efficiency of the splatter LS also reduces the amount of splatter LS reaching the wall of the laser source unit 10, further improving the cleanliness and ease of maintenance of the laser source unit 10. Therefore, when the laser processing apparatus 1 of the first embodiment is applied to, for example, the magnetic domain control processing of directional electromagnetic steel plates, even when the irradiation power of the laser LB to be irradiated is further increased, the generated splatter LS can be collected more reliably.

[0084] (Laser processing method) By using the laser processing apparatus 1 of the first embodiment, the laser processing method of the first embodiment can be realized. The laser processing method of the first embodiment is a method for collecting dust splatter LS generated from the irradiation area SA of the laser LB that irradiates the surface of the steel plate S.

[0085] In the laser processing method of the first embodiment, as a continuous process, laser LB is irradiated from the laser light source unit 10 onto the surface of a steel plate S (i.e., a moving steel plate S) being transported in a predetermined transport direction C. Additionally, dry air is ejected from the nozzle section 21B1 of the gas jet unit 20, parallel to the optical axis of the laser LB, toward the irradiation area SA. By ejecting dry air, the spatter LS generated from the irradiation area SA can be rolled up, i.e., risen, from the surface of the steel plate S.

[0086] In the first embodiment, even if the splatter LS is rolled up, the gas jet section 20, which is an adhesion barrier section 22A containing carbon monomers, prevents the splatter LS from adhering to the surface of the gas jet section 20. Furthermore, in the conveying direction C of the steel plate S, the splatter LS is collected by the dust collection port 30A of the dust collection mechanism section 30, which is provided only upstream or downstream of the irradiation site SA of the laser LB.

[0087] (Effects of the first implementation method) In the first embodiment, an adhesion-blocking portion 22A containing carbon monomers and used to prevent the adhesion of splashes LS is disposed on the outer surface of the nozzle portion 21B of the gas jet section 20. Here, the present inventors have observed that, as in Embodiment 1 described below, when the adhesion-blocking portion 22A containing carbon monomers is disposed on the outer surface of the nozzle portion 21B of the gas jet section 20, the effect of suppressing the adhesion of splashes LS generated from the irradiation site SA to the outer surface of the nozzle portion 21B is higher than that when the adhesion-blocking portion 22A is not disposed. The splashes LS that are prevented from adhering to the outer surface of the nozzle portion 21B by the adhesion-blocking portion 22A are collected by the dust collection mechanism 30. According to the first embodiment, the adhesion of splashes LS to the outer surface of the nozzle portion 21B of the gas jet section 20, which jets gas 20A from the opening 21B1 toward the irradiation site SA of the laser LB, can be suppressed.

[0088] Furthermore, in the first embodiment, the adhesion barrier 22A is formed entirely of carbon monomers by the gas injection section 20. As a result, the adhesion barrier 22A is disposed on the entire outer surface of the nozzle section 21B. Therefore, it is not necessary to prepare a component different from the gas injection section 20 as the adhesion barrier 22A.

[0089] Here, the present applicant has obtained the following insight: when the gas jet direction in the gas jet section is parallel to the optical axis of the laser, spatter tends to adhere to the outer surface of the nozzle section. In the first embodiment, even when the gas jet direction of the gas 20A in the gas jet section 20 is parallel to the optical axis of the laser LB, the adhesion barrier 22A can suppress the adhesion of spatter LS to the nozzle section 21B of the gas jet section 20. Furthermore, in this disclosure, the gas jet direction in the gas jet section is not limited to being parallel to the optical axis of the laser, nor is it excluded from being intersecting the optical axis.

[0090] Furthermore, in the first embodiment, the laser processing apparatus 1 includes: a conveying roller R for conveying a steel plate S in a predetermined conveying direction C; and a laser light source unit 10 for irradiating the surface of the steel plate S being conveyed in the conveying direction C with a laser LB. Therefore, laser processing can be performed on the steel plate S being conveyed.

[0091] In particular, when the dust collection mechanism is configured within a laser processing apparatus having a nozzle, the nozzle significantly functions as a guide for gas flow, depending on the positional relationship between the nozzle and the dust collection mechanism. Therefore, it is known that due to prolonged use of the laser processing apparatus, spatter adheres to the nozzle, causing stagnation in the flow of air and other gases, resulting in reduced dust collection efficiency. However, as disclosed herein, by arranging a spatter adhesion-obstructing part in the nozzle, the laser processing apparatus can operate for even longer periods, resulting in reduced maintenance burden and improved availability (in other words, continuous operation capability).

[0092] (First variation) like Figure 3 As shown, the difference between the first modified example and the first embodiment is that the carbon plate 22B, which is composed of carbon monomers and serves as an adhesion barrier, is disposed in the gas injection section 20 as a separate component from the gas injection section 20.

[0093] Specifically, the gas jet section 20 of the laser processing apparatus 1A in the first modified example differs from the gas jet section 20 of the first embodiment, which is made of carbon monomers. For example, it is made of metals such as steel or resin. Furthermore, the adhesion barrier is a plate-shaped component disposed on a portion of the surface of the gas jet section 20. Moreover, in this disclosure, the carbon plate is not limited to being composed of a single plate-shaped component. For example, even an adhesion barrier composed of a single carbon sheet or a stack of two or more carbon sheets can be used as the carbon plate of this disclosure.

[0094] Carbon plate 22B is disposed at the front end of the irradiation portion SA side in the gas injection section 20. Figure 3The lower end of the nozzle 21B is located on its outer surface. Furthermore, in this disclosure, the placement of the carbon plate 22B is not limited to this; it can be located between the laser LB irradiation area SA and the gas jet section 20. From the perspective of suppressing micro-vibrations during processing, it is preferable to place the carbon plate 22B on the lower end of the nozzle 21B. Figure 3 The lower end of the plate is closely attached to the carbon plate 22B. The other structures in the first variation are the same as in the first embodiment, so repeated descriptions are omitted.

[0095] (The effect of the first variation) Furthermore, similarly to the first embodiment, in the first modified example, adhesion of the splash LS to the outer surface of the nozzle portion 21B of the gas jet section 20, which jets gas from the opening 21B1 toward the irradiation area SA of the laser LB, can be suppressed. In the first modified example, the adhesion barrier is a plate-shaped component disposed on a portion of the surface of the gas jet section 20. That is, a carbon plate 22B made of carbon monomers, serving as the adhesion barrier, is disposed on the entire outer surface of the nozzle portion 21B of the gas jet section 20 as a separate component from the gas jet section 20. Moreover, in this disclosure, the adhesion barrier made of carbon monomers may be disposed on at least a portion of the outer surface of the nozzle portion of the gas jet section as a separate component from the gas jet section.

[0096] Therefore, for the existing gas jet section 20 which does not have an adhesion barrier, it is easy to install an adhesion barrier separately. Furthermore, since the adhesion barrier is a different component from the gas jet section 20, it is less likely to be damaged even when subjected to vibrations from the laser processing apparatus. Other effects of the first modification are the same as those of the first embodiment.

[0097] (Second variation) like Figure 4 As shown, the second modification differs from the first embodiment in that, in addition to the adhesion-blocking portion 22A, which is a carbon monomer, the gas jet section 20 also includes a charge application device 40 that applies a charge 22C of the same polarity as the charge of the splash LS to the gas jet section 20 as an adhesion-blocking portion. That is, in the second modification, the adhesion of the splash LS to the gas jet section 20 is further hindered by electrostatic repulsion. In this disclosure, it is not necessary to use both the adhesion-blocking portion of the carbon monomer and the adhesion-blocking portion of the charge of the splash LS. The charge adhesion-blocking portion can also be used alone.

[0098] Specifically, in the laser processing apparatus 1B of the second modification, a charge application device 40 is provided. This charge application device 40 has a power supply 42 and a wire 44 connected at one end to the power supply 42. The other end of the wire 44 is connected to the gas jet section 20. Here, the charge of the sputtering material LS is typically around -1kV to -50kV. In the first embodiment, for example, the charge of the sputtering material LS can be set to approximately -10kV.

[0099] Furthermore, a charge 22C of the same level as -10kV is applied to the gas jet section 20 using the charge application device 40, thereby generating an electrical repulsion force against the splash LS on the surface of the gas jet section 20. In addition, to prevent short circuits, it is preferable that the gas jet section 20 is electrically insulated from the components surrounding it. The other structures in the second variation are the same as in the first embodiment, and therefore, repeated descriptions are omitted.

[0100] (The effect of the second variation) In the second variation, similar to the first embodiment, adhesion of the spatter LS to the gas jet section 20 can be suppressed. This gas jet section 20 jets gas towards the irradiation area SA of the laser LB in a manner parallel to the optical axis of the laser LB. Furthermore, in the second variation, the laser processing apparatus includes a charge application device 40 as an adhesion-blocking part, which applies a charge 22C of the same polarity as the charge of the spatter LS to the gas jet section 20. That is, the adhesion-blocking part includes the charge application device 40. By using electrorepulsion, adhesion of the spatter LS to the gas jet section 20 is further hindered, thus further improving the adhesion suppression effect of the spatter LS. Other effects of the second variation are the same as those of the first embodiment.

[0101] (Third variation) like Figure 5 As shown, the third variation differs from the first embodiment in that, in addition to being a carbon monomer, the gas injection unit 20 also includes a covering agent supply device, which supplies a covering agent to cover the splashes LS. That is, unlike the first embodiment, by supplying a covering agent to the splashes LS, adhesion of the splashes LS to the gas injection unit 20 is further hindered.

[0102] Specifically, in the laser processing apparatus 1C of the third modification, a covering agent supply device 50 is provided. The covering agent supply device 50 has a covering agent source 52, a supply pipe 54 connected to the covering agent source 52 at one end, and a supply nozzle 56 connected to the other end of the supply pipe 54.

[0103] (Covering agent) The covering agent in the first embodiment is in the form of sand or powder. Specifically, for example, a commercially available pre-coating agent used to prevent sparks in grinding operations can be used as the covering agent. As a powdered pre-coating agent, calcium carbonate or quicklime (i.e., calcium hydroxide) can be used, for example. Furthermore, in this disclosure, the covering agent is not limited to sand or powder as long as it can cover the spatter LS, and can take any shape and chemical composition.

[0104] The covering agent is supplied towards the splashes LS that are propelled by the formation of the tank G. Specifically, it can be supplied towards the irradiation area SA where the splashes LS are generated and its surroundings, or it can be supplied mainly from the tank G towards the downstream side in the conveying direction C. The splashes LS are covered by the covering agent, making it difficult for them to adhere to the gas jet section 20.

[0105] In the first embodiment, the supply flow rate of the covering agent is preferably set according to the amount of splatter LS generated. Specifically, the supply flow rate of the covering agent can be set to the same amount as the amount of splatter LS generated per unit time, or it can be set within a certain range relative to the amount of splatter LS generated per unit time. For example, the supply flow rate of the covering agent can be set to more than 60% and less than 150% of the amount of splatter LS generated per unit time.

[0106] When the supply flow rate of the covering agent is less than 60% of the amount of LS generated per unit time, the amount of covering agent capable of covering the LS is excessively reduced, thus decreasing the suppression effect on the adhesion of the LS to the gas jet section 20. On the other hand, when the supply flow rate of the covering agent exceeds 150% of the amount of LS generated per unit time, the amount of covering agent becomes excessive, thus increasing the cost of the covering agent and the processing burden.

[0107] Furthermore, the supply flow rate of the covering agent is less than or equal to the suction flow rate of the dust collection mechanism 30 operated by the suction pump P2, which is preferable in that it does not interfere with the flow of the suction airflow. Additionally, in this disclosure, the supply flow rate of the covering agent exceeding the suction flow rate of the dust collection mechanism does not constitute an obstruction. The other structures in the third modification are the same as in the first embodiment, therefore, repeated descriptions are omitted.

[0108] (The effect of the third variation) In the third modification, similar to the first embodiment, the adhesion of spatter LS to the gas jet section 20 can be suppressed. This gas jet section 20 jets gas towards the irradiation area SA of the laser LB in a manner parallel to the optical axis of the laser LB. Furthermore, in the third modification, the laser processing apparatus 1C includes a covering agent supply device that supplies a covering agent to cover the spatter LS. That is, the adhesion of the spatter LS to the gas jet section 20 can be reduced accordingly to the covering agent. Therefore, the adhesion suppression effect of the spatter LS can be further improved. Other effects of the third modification are the same as those of the first embodiment. In addition, by combining the structure of the laser processing apparatus 1C of the third modification with any of the laser processing apparatuses of the first embodiment, the first modification, and the second modification described above, an even more advanced spatter adhesion suppression effect can be obtained.

[0109] Example (Example 1) Next, refer to Figure 6 For use Figures 1-5 Example 1, which describes the adhesion rate of the spatter LS measured by the laser processing apparatus of the first embodiment and the first to third modified examples, will be explained.

[0110] Figure 6 The adhesion rate of the splashes LS is the ratio of the number of splashes LS particles reaching the outer surface of the nozzle portion 21B of the gas jet section 20 in the first comparative example to the number of particles reaching the outer surface of the nozzle portion 21B of the gas jet section 20, calculated in the first embodiment and the first to third modified examples, when the number of splashes LS particles reaching the outer surface of the nozzle portion 21B of the gas jet section 20 is set to 1.

[0111] The gas jet section of the laser processing apparatus in the first comparative example does not have an adhesion barrier that contains carbon monomers and is used to prevent the adhesion of spatter. Furthermore, the laser processing apparatuses in the first comparative example, the first embodiment, and the first to third modified examples have the same shape and size. Additionally, in Example 1, the carbon plate 22B installed in the gas jet section 20 of the first modified example has a thickness of approximately 1 mm.

[0112] In Example 1, analysis based on computer simulation was performed using Fluent, a commercially available numerical calculation software. First, analysis models corresponding to the laser processing apparatuses of the first comparative example, the first embodiment, and the first to third modified examples were established. Then, using each established analysis model, analysis was performed on laser processing equivalent to continuously irradiating a steel plate with laser LB for approximately 100 hours. In each analysis model, the number of spatter particles LS generated from the irradiation site SA was the same. Then, the number of spatter particles LS reaching the outer surface of the nozzle portion of each gas jet section from the irradiation site SA was calculated.

[0113] like Figure 6 As shown, in the first embodiment, the amount of splatter adhering is reduced to approximately 1 / 10 compared to the first comparative example. Furthermore, in the first modified example, the amount of splatter adhering can be reduced to the same level as in the first embodiment. Furthermore, in the second modified example, the amount of splatter LS adhering is reduced to approximately 1 / 20 compared to the first comparative example. Furthermore, in the third modified example, the amount of splatter adhering is reduced to approximately 1 / 40 compared to the first comparative example. As can be seen from Example 1, when an adhesion barrier of carbon monomers is provided, the amount of splatter LS adhering can be significantly reduced compared to the case where an adhesion barrier of carbon monomers is not provided.

[0114] In addition, verification based on laboratory experiments was conducted in Example 1. Specifically, experimental models corresponding to the laser processing apparatuses of the first comparative example, the first embodiment, and the first to third modified examples were set up. Then, using the set experimental models, laser processing was performed on steel plates by continuously irradiating them with laser LB for approximately 100 hours. In each experimental model, the weight increase at each location was measured to calculate the adhesion amount. The same results as the analysis based on computer simulations described above were obtained in the verification based on laboratory experiments.

[0115] Next, the second and third embodiments will be described. Repeated descriptions of structures identical to those in the first embodiment in the second and third embodiments will be omitted. The adhesion-obstructing portions provided in the gas injection sections 20 of the variations of the second and second embodiments correspond to the first adhesion-obstructing portions of this disclosure.

[0116] <Second Implementation Method> (Attachment obstruction part) like Figure 7 As shown, in the second embodiment, the outer surface of the gas jet section 20 of the laser processing apparatus 2 is provided with an adhesion-blocking section 22D, which is a single copper component used to prevent the adhesion of spatter LS. Specifically, in the second embodiment, the entire gas jet section 20 is formed of a single copper component as the adhesion-blocking section 22D. In other words, "the entire gas jet section 20" refers to the main body of the air nozzle of the gas jet section 20.

[0117] In the gas jet section 20, which is made of copper, the thermal conductivity is improved compared to gas jet sections made of metals such as steel or resin that do not contain copper. Therefore, even if spatter LS is attached to the outer surface of the nozzle section 21B, the temperature of the spatter LS drops rapidly, making it difficult for it to accumulate.

[0118] In addition, such as Figure 7As shown, the box-shaped dust collection mechanism 30 has a top 31 on the upper side of the dust collection port 30A and a bottom 32 on the lower side of the dust collection port 30A. An example is shown in... Figure 7 The state of the adhering material A1 with splashes LS adhering and accumulating on the inner surface of the top 31. An example is shown in... Figure 7 The state of the deposit A2, which has splashed material LS, attached and accumulated on the end face of the bottom 32. An example is shown in... Figure 7 The nozzle part 21B has an adhering and accumulating deposit of splash LS on its outer surface, which is a state of deposit A3.

[0119] Figure 7 The inner surface of the top 31 is at its highest point from the steel plate S in the dust collection mechanism section 30. Figure 7 The example shows the height x of the inner surface of the top 31 from the steel plate S and the height y of the upper end of the outer surface of the nozzle part 21B from the steel plate S. Figure 7 The height x of the inner surface of the top 31 of the nozzle 21 from the steel plate S is greater than the height y of the upper end of the nozzle 21B from the steel plate S. That is, x > y. Therefore, the flow of gas attracted by the dust collection mechanism 30 is promoted towards the dust collection mechanism 30 by the inclined outer surface of the nozzle 21B. In other words, the inclined outer surface of the nozzle 21B guides the flow of the attracted gas.

[0120] Here, in the machining of grooves with a depth of approximately 10 μm to 50 μm, when using an air knife with a flow rate similar to scraping spatter from the inside of the groove G on the surface of the steel plate, unlike in this disclosure, particles larger than 100 μm, i.e., debris, are easily generated as dust. These debris are difficult to cool and accumulate in the airflow of the dust collection mechanism 30, thus easily adhering to surrounding equipment.

[0121] The dust collection mechanism is located on both the upstream and downstream sides of the laser irradiation area, and the height of the inner surface of the top of the dust collection mechanism from the steel plate is greater than the height of the upper end of the nozzle from the steel plate (in other words, in...). Figure 7 In the case where x < y, the flow of gas that is difficult to be attracted by the dust collection mechanism 30 is promoted toward the dust collection mechanism 30.

[0122] On the other hand, in the second embodiment, the dust collection mechanism 30 is only provided upstream of the irradiation area SA of the laser LB in the conveying direction C of the steel plate S, and the height x of the inner surface of the top 31 from the steel plate S is greater than the height y of the upper end of the nozzle 21B from the steel plate S. Therefore, in the second embodiment, compared with the air knife, the accumulation rate of the spatter LS towards the nozzle 21B and the dust collection mechanism 30 is lower during continuous use of the laser processing apparatus. For example, in the case of a laser processing apparatus using an air knife without an adhesion barrier, the accumulation rate is approximately 10 mm / hour, while in the case of the second embodiment, the accumulation rate is suppressed to approximately 0.1 mm / hour.

[0123] Furthermore, in the second embodiment, compared to an air knife, the interval for maintenance work—removing deposits that have adhered and accumulated during continuous use of the laser processing apparatus from the nozzle section 21B and the dust collection mechanism section 30—is longer. For example, in a laser processing apparatus using an air knife without an adhesion barrier, the interval for maintenance work is approximately 30 minutes; however, in the case of the second embodiment, the interval for maintenance work is approximately 3000 minutes. That is, in the second embodiment, it is difficult for splatter LS to come into contact with the nozzle section 21B and the dust collection mechanism section 30.

[0124] (Effects of the second implementation method) In the second embodiment, an adhesion-blocking portion 22D containing a copper monomer and used to prevent the adhesion of spatter LS is disposed on the outer surface of the nozzle portion 21B of the gas injection unit 20. Here, the present inventors have observed that, as in Embodiment 2 described later, when the adhesion-blocking portion 22D containing the copper monomer is disposed on the outer surface of the nozzle portion 21B of the gas injection unit 20, the effect of suppressing the adhesion of spatter LS generated from the irradiation area SA to the outer surface of the nozzle portion 21B is higher than that when the adhesion-blocking portion 22D is not disposed. The spatter LS whose adhesion to the outer surface of the nozzle portion 21B is blocked by the adhesion-blocking portion 22D is collected by the dust collection mechanism 30. According to the second embodiment, the adhesion of spatter LS to the outer surface of the nozzle portion 21B of the gas injection unit 20 can be suppressed by the adhesion-blocking portion 22D.

[0125] Furthermore, in the second embodiment, the adhesion barrier 22D is formed entirely of copper from the gas injection section 20. As a result, the adhesion barrier 22D is disposed on the entire outer surface of the nozzle section 21B. Therefore, it is not necessary to prepare a component different from the gas injection section 20 as the adhesion barrier 22D.

[0126] (Fourth variation) like Figure 8As shown, the fourth variation differs from the second embodiment in that the copper plate 22E, which is made of copper monomers and serves as an adhesion obstruction part, is disposed on the gas injection part 20 as a separate component from the gas injection part 20.

[0127] Specifically, the gas jet section 20 of the laser processing apparatus 2A in the fourth modification differs from the gas jet section 20 of the second embodiment, which is made of a single copper component. For example, it is made of a metal such as steel or resin. Furthermore, the adhesion barrier is a plate-shaped component disposed on a portion of the surface of the gas jet section 20. Additionally, in this disclosure, the copper plate is not limited to being composed of a single plate-shaped component. For example, an adhesion barrier composed of a single copper plate or a laminate of two or more copper plates can be used as the copper plate of this disclosure.

[0128] A copper plate 22E is disposed on the outer surface of the nozzle portion 21B of the gas jet section 20. Furthermore, in this disclosure, the placement of the copper plate 22E is not limited to this; it can be located between the irradiation area SA of the laser LB and the gas jet section 20. It is preferable to place the copper plate 22E in close contact with the outer surface of the nozzle portion 21B of the gas jet section 20 in order to suppress the effects of micro-vibrations during processing.

[0129] like Figure 8 As shown, considering the ease of adhesion of the splash LS, copper plates 22E are respectively disposed on the two outer surfaces of the nozzle portion 21B in the conveying direction C. Figure 9 As shown, the copper plate 22E can be freely mounted on the outer surface of the nozzle portion 21B via the connector 23. Figure 8 The connecting member 23 is a mechanical component such as a screw. Furthermore, the copper plate is not necessarily positioned in the width direction ( Figure 9 The outer surface of the nozzle portion 21B in the left-right direction (in the middle). Additionally, in this disclosure, carbon monomers and copper monomers can be combined to form the adhesion barrier portion. For example, in... Figure 8 In this process, the material of the bonding member 23 that joins the copper plate 22E can also be made of carbon monomers.

[0130] (The effect of the fourth variation) In the fourth variation, similar to the second embodiment, it is possible to suppress the adhesion of splashes LS to the outer surface of the nozzle portion 21B of the gas jet section 20, which jets gas from the opening 21B1 toward the irradiation area SA of the laser LB. Furthermore, in the fourth variation, the adhesion barrier is a plate-shaped component disposed on a portion of the surface of the gas jet section 20. That is, a copper plate 22E made of copper monomers, serving as the adhesion barrier, is disposed as a separate component from the gas jet section 20 on the entire outer surface of the nozzle portion 21B of the gas jet section 20. Moreover, in this disclosure, the adhesion barrier made of copper monomers may be disposed on at least a portion of the outer surface of the nozzle portion of the gas jet section, as a separate component from the gas jet section.

[0131] Therefore, for the existing gas jet section 20 which does not have an adhesion barrier, it is easy to install an adhesion barrier separately. Furthermore, since the adhesion barrier is a different component from the gas jet section 20, it is easy to replace if damaged. Other effects of the fourth modification are the same as in the second embodiment.

[0132] (Fifth variation) like Figure 10 As shown, the laser processing apparatus 2B of the fifth modification differs from the fourth modification in that, in addition to the copper plate 22E disposed on the outer surface of the nozzle portion 21B of the fourth modification, it also includes a peeling mechanism 22F as an additional adhesion barrier. Furthermore, in this disclosure, the peeling mechanism 22F is not limited to being combined with other adhesion barriers such as the copper plate 22E, but can be used as a standalone adhesion barrier.

[0133] The peeling mechanism 22F includes a drive unit 22F1 and a movable plate 22F2. The peeling mechanism 22F can be constructed, for example, using a known linear mechanism. Although not shown in the figure, the drive unit 22F1 can be physically supported at any position, for example, using the empty space around the gas injection unit 20.

[0134] The drive unit 22F1 causes the movable plate 22F2 to reciprocate along the inclined outer surface of the nozzle part 21B. Figure 10 The lower end of the movable plate 22F2 approaches and separates from the nozzle portion 21B. The movable plate 22F2 extends along the width direction. As the movable plate 22F2 approaches the inclined outer surface of the nozzle portion 21B, the front edge of the movable plate 22F2 on the side opposite to the drive portion 22F1 slides on the outer surface of the nozzle portion 21B, resulting in the ability to peel off the adhering substance A3 from the outer surface.

[0135] (The effect of the fifth variation) In the fifth modification, similarly to the second embodiment, it is possible to suppress the adhesion of spatter LS to the outer surface of the nozzle portion 21B of the gas jet section 20, which jets gas from the opening 21B1 toward the irradiation area SA of the laser LB. Furthermore, in the fifth modification, a movable plate 22F2 reciprocates along the inclined outer surface of the nozzle portion 21B via a peeling mechanism 22F, which serves as an additional adhesion-blocking mechanism. Therefore, it is possible to further suppress the adhesion of spatter LS to the outer surface of the nozzle portion 21B of the gas jet section 20. Other effects of the fifth modification are the same as those of the second embodiment.

[0136] (Sixth variation) like Figure 10 As shown, the laser processing apparatus 2B of the sixth modification differs from the fourth modification in that, in addition to the copper plate 22E disposed on the outer surface of the nozzle portion 21B in the fourth modification, it also includes a vibration-applying device 22G as an additional adhesion barrier. Furthermore, in this disclosure, the vibration-applying device 22G is not limited to being combined with other adhesion barriers such as the copper plate 22E, but can be used as a standalone adhesion barrier.

[0137] The vibration imparting device 22G can be constructed using, for example, a known vibrator. The vibration imparting device 22G can also impart vibration, for example, by impact. The vibration imparting device 22G is mounted on the outer surface of the base 21A of the gas injection section 20. In this disclosure, the number of vibration imparting devices is arbitrary, whether it is one or more. Furthermore, the mounting position of the vibration imparting device can be appropriately changed. In this disclosure, the vibration imparting device is not necessarily mounted in a state of constant contact with the gas injection section 20. The vibration imparting device can also be arranged around the gas injection section 20 in a state of separation from it. Although figures are omitted, the vibration imparting device can also have a movable part, and vibration is imparted to the nozzle section by impact or the like from the movable part, which can contact the gas injection section as needed even from a separated position.

[0138] (The effect of the sixth variation) In the sixth modification, similarly to the second embodiment, it is possible to suppress the adhesion of the spatter LS to the outer surface of the nozzle portion 21B of the gas jet section 20, which jets gas from the opening 21B1 toward the irradiation area SA of the laser LB. Furthermore, in the sixth modification, the adhesion of the spatter LS to the outer surface of the nozzle portion 21B of the gas jet section 20 is further suppressed by the vibration-imposing device 22G, which serves as an additional adhesion-damping part. Other effects of the sixth modification are the same as those of the second embodiment.

[0139] (Example 2) Next, refer to Figure 12 For use Figures 7-11 Example 2, which describes the adhesion rate of the spatter LS measured in each of the second embodiment and the fourth to sixth modifications of the laser processing apparatus illustrated in the example, will be explained.

[0140] Figure 12 The adhesion rate of the splashes LS is the ratio of the number of splashes LS particles reaching the outer surface of the nozzle portion 21B of the gas jet section 20 in the second comparative example to the number of particles reaching the outer surface of the nozzle portion 21B of the gas jet section 20, calculated in the second embodiment and the fourth to sixth modified examples, when the number of splashes LS particles reaching the outer surface of the nozzle portion 21B of the gas jet section 20 is set to 1.

[0141] The gas jet section of the laser processing apparatus in the second comparative example does not have an adhesion barrier that includes a copper monomer and is used to prevent the adhesion of spatter. Furthermore, the laser processing apparatuses in the second comparative example, the second embodiment, and the fourth to sixth modifications are identical in shape and size. Additionally, in Embodiment 2, the copper plate 22E mounted on the gas jet section 20 in the fourth to sixth modifications is approximately 1 mm thick.

[0142] In Example 2, verification based on laboratory experiments was conducted. First, experimental models corresponding to the laser processing apparatuses of the second comparative example, the second embodiment, and the fourth to sixth modifications were set up. Then, using each of the set experimental models, laser processing was performed on steel plates by continuously irradiating them with laser LB for approximately 100 hours. In each experimental model, the weight increase at each location was measured to calculate the adhesion amount.

[0143] like Figure 12 As shown, in the second embodiment, the amount of spatter adhered is reduced to approximately 1 / 10 compared to the second comparative example. Furthermore, in the fourth modification, the amount of spatter adhered can be reduced to the same level as in the second embodiment. Furthermore, in the fifth modification, the amount of spatter adhered is reduced to approximately 1 / 20 compared to the second comparative example. Furthermore, in the sixth modification, the amount of spatter adhered is reduced to approximately 1 / 20 compared to the second comparative example. As can be seen from Embodiment 2, when an adhesion barrier for copper monomers is provided, the amount of spatter LS adhered can be significantly reduced compared to the case where an adhesion barrier for copper monomers is not provided.

[0144] Next, the third embodiment will be described. In the third embodiment and its 7th to 9th variations, the difference from the second embodiment is that in the laser processing apparatus 2A of the fourth variation of the second embodiment, the adhesion-blocking portion in the dust collection mechanism 30 that prevents the spatter LS from adhering to the dust collection mechanism 30 is separately configured from the adhesion-blocking portion that prevents the spatter LS from adhering to the gas jet section 20. Therefore, since the structure in the third embodiment is the same as that in the fourth variation of the second embodiment, repeated descriptions will be omitted.

[0145] Furthermore, in this disclosure, the adhesion barrier for preventing the splashes LS from adhering to the dust collection mechanism 30 does not necessarily have to be used in combination with the adhesion barrier of the gas jet section 20. The adhesion barrier for preventing the splashes LS from adhering to the dust collection mechanism 30 may also be used without the accompanying adhesion barrier for preventing the splashes LS from adhering to the gas jet section 20.

[0146] <Third Implementation Method> (Attachment obstruction part) like Figure 13 As shown, an adhesion-blocking portion 33A is disposed on the outer surface of the dust collection mechanism 30 of the laser processing apparatus 2A in the third embodiment. This adhesion-blocking portion 33A comprises a single copper component and is used to prevent the adhesion of spatter LS. The adhesion-blocking portions provided in the dust collection mechanism 30 of the third embodiment and its variations correspond to the second adhesion-blocking portions of this disclosure. Specifically, in the third embodiment, the entire dust collection mechanism 30 is formed from a single copper component as the adhesion-blocking portion 33A. In other words, "the entire dust collection mechanism 30" refers to the main body of the dust collection nozzle of the dust collection mechanism 30.

[0147] In the dust collection mechanism section 30, which is made of copper, the thermal conductivity is improved compared to a dust collection mechanism section made of metals such as steel or resin that does not contain copper. Therefore, even if splatter LS is attached to the inner surface and end face of the dust collection mechanism section 30, the temperature of the splatter LS will drop rapidly, making it difficult for it to accumulate. The inner surface and end face of the dust collection mechanism section 30 in the third embodiment correspond to the "surface of the dust collection mechanism section" where the attachment of splatter LS is blocked by the second attachment barrier of this disclosure.

[0148] (Effects of the third implementation method) In the third embodiment, an adhesion-blocking portion 33A, comprising a copper monomer, is disposed on the inner surface and end face of the dust collection mechanism 30 to prevent the adhesion of spatter LS. Here, the present applicant has observed that, as in Embodiment 3 described below, when the adhesion-blocking portion comprising the copper monomer is disposed on the inner surface and end face of the dust collection mechanism 30, the effect of suppressing the adhesion of spatter LS generated from the irradiation area SA to the inner surface and end face of the dust collection mechanism 30 is higher than that without the adhesion-blocking portion. According to the third embodiment, the adhesion-blocking portion 33A can suppress the adhesion of spatter LS to the inner surface and end face of the dust collection mechanism 30. As a result, the burden of maintenance work to remove the adhering material can be reduced.

[0149] Furthermore, in the third embodiment, the adhesion barrier 33A is formed entirely of copper from a single piece of material, which is integrated into the dust collection mechanism 30. As a result, the adhesion barrier 33A is disposed on the inner surface and end face of the dust collection mechanism 30. Therefore, it is not necessary to prepare a component different from the dust collection mechanism 30 as the adhesion barrier 33A.

[0150] (Seventh variation) like Figure 8 As shown, the difference between the seventh variation and the third embodiment is that the copper plate 33B, which is made of copper monomers and serves as an adhesion barrier, is disposed in the dust collection mechanism 30 as a separate component from the dust collection mechanism 30.

[0151] Specifically, the dust collection mechanism 30 of the laser processing apparatus 2A in the seventh modification differs from the dust collection mechanism 30 of the third embodiment, which is made of a single copper unit. For example, it is made of a metal such as steel or resin. Furthermore, the adhesion barrier is a plate-shaped component disposed on a portion of the surface of the dust collection mechanism 30. Additionally, in this disclosure, the copper plate is not limited to being composed of a single plate-shaped component. For example, an adhesion barrier composed of a single copper plate or a laminate of two or more copper plates can also be used as the copper plate of this disclosure.

[0152] Copper plate 33B is disposed on both the inner surface and the end face of the dust collection mechanism section 30. Furthermore, in this disclosure, the copper plate 33B may be disposed on at least one of the inner surface and the end face of the dust collection mechanism section 30. Figure 14 As shown, copper plates 33B are respectively disposed on the inner surface of the dust collection mechanism section 30 for attaching the attachment A1 and the end face of the dust collection mechanism section 30 for attaching the attachment A2. Furthermore, in Figure 14The illustration shows a configuration where the lower surface of the upper copper plate 33B is coplanar with the inner surface of the dust collection mechanism 30, and the lower surface of the lower copper plate 33B is coplanar with the outer surface of the dust collection mechanism 30. However, this disclosure is not limited to this configuration. It is also possible that a step may be formed between the surface of the copper plate and the surface of the dust collection mechanism 30.

[0153] (The effect of the seventh variation) In the seventh modification, the adhesion barrier is a plate-shaped component disposed on a portion of the surface of the dust collection mechanism 30. Specifically, a copper plate 33B, composed of a single copper unit, is disposed as a separate component from the dust collection mechanism 30 on both the inner surface and the end face of the dust collection mechanism 30. Therefore, for existing dust collection mechanism 30s that do not have an adhesion barrier, it is easy to install an additional adhesion barrier. Other effects of the seventh modification are the same as in the third embodiment.

[0154] (Eighth variation) like Figure 15 As shown, the laser processing apparatus 2A of the eighth modification differs from the seventh modification in that, in addition to the copper plate 33B disposed on the inner surface and end face of the dust collection mechanism 30 of the seventh modification, it also includes a first peeling mechanism 33C and a second peeling mechanism 33D as additional adhesion barriers. Furthermore, in this disclosure, the first peeling mechanism 33C and the second peeling mechanism 33D are not limited to being combined with other adhesion barriers such as the copper plate 33B, but can be used separately as independent adhesion barriers.

[0155] (First stripping unit) like Figure 16 as well as Figure 17 As shown, the first peeling mechanism 33C includes a drive unit 34A, a shaft 34B, a connecting unit 34C, a movable plate 34D, and a support unit 34E. Figure 17 As shown, the dust collection mechanism 30 is L-shaped. The suction airflow DF enters the inner side of the dust collection mechanism 30 from the dust collection port 30A, and then... Figure 17 The periphery of the right-side dust collection port 30A opposite the left-side sidewall 30B moves upward.

[0156] The drive unit 34A is disposed on the outer surface of the top 31. For example... Figure 16 As shown, the movable plate 34D extends along the width direction. Figure 17 As shown, the upper end of the connecting part 34C is mounted on the left end of the shaft 34B, and the lower end of the connecting part 34C is mounted on the left end of the movable plate 34D.

[0157] like Figure 18 As shown, a slit 31A is formed at the top 31 for inserting a rod-shaped connecting portion 34C. Figures 16-18As shown, the support portion 34E is a plate-shaped member provided on the inner surface of the sidewalls facing each other in the width direction inside the dust collection mechanism portion 30, protruding horizontally inward from the inner surface. The support portion 34E supports the movable plate 34D that slides from below. In this disclosure, the support portion is not necessary.

[0158] The drive unit 34A and shaft 34B can be constructed, for example, by a known direct-acting mechanism such as a cylinder with a piston rod or a threaded feed mechanism. The drive unit 34A enables the movable plate 34D to move along the dust collection mechanism section 30 via shaft 34B and connecting part 34C. Figure 17 The inner surface of the top 31 reciprocates in the horizontal direction. Figure 17 The right end of the movable plate 34D can move outwards to the right, further to the right than the dust collection port 30A. In standby mode, without performing maintenance to remove deposits, Figure 17 The right end of the movable plate 34D exits from the dust collection port 30A. Figure 17 The standby distance C1 of the movable plate 34D is illustrated in the figure.

[0159] like Figure 19 As shown, when the drive unit 34A moves the shaft 34B to the right, the connecting part 34C moves to the right within the slit 31A in conjunction with the shaft 34B. Figure 20 As shown, in conjunction with the movement of the connecting part 34C, the right end of the movable plate 34D slides on the inner surface of the top 31 of the dust collection mechanism part 30. Through this sliding, the deposit A1 on the inner surface is pushed outward from the dust collection port 30A, resulting in the removal of the deposit A1. Figure 20 The example shows the extension distance C2 of the movable plate 34D.

[0160] (Second stripping unit) like Figure 21 and Figure 22 As shown, the second stripping mechanism 33D includes a drive unit 34A, a shaft 34B, a connecting part 34C, a movable plate 34D1, and a support part 34E1. The drive unit 34A is provided with... Figure 22 On the outer surface of the left sidewall 30B of the dust collection mechanism section 30. For example... Figure 21 As shown, the movable plate 34D1 extends along the width direction. Figure 22 As shown, the upper end of the connecting part 34C is mounted on the left end of the shaft 34B, and the lower end of the connecting part 34C is mounted on the left end of the movable plate 34D1.

[0161] like Figures 21-23 As shown, the support portion 34E1 is on the outer surface of the bottom 32 of the dust collection mechanism portion 30 (i.e., Figure 23 A plate-shaped component with an L-shaped cross-section is provided at each end in the width direction on the lower surface of the bottom 32. For example... Figure 23As shown, one end (i.e., the upper end) of the L-shaped plate member is mounted on the lower surface of the bottom 32, and the other end (i.e., the inner end) extends inward in the width direction. The portion of the support 34E1 on the inner side of the L-shape supports the sliding movable plate 34D1 from below. In this disclosure, the support is not necessary.

[0162] The drive unit 34A and shaft 34B can be constructed, for example, by a known direct-acting mechanism such as a cylinder with a piston rod or a threaded feed mechanism. The drive unit 34A enables the movable plate 34D1 to move along the dust collection mechanism section 30 via shaft 34B and connecting part 34C. Figure 22 The outer surface of the bottom 32 moves back and forth in the horizontal direction. Figure 22 The right end of the movable plate 34D1 can move outwards to the right, further to the right than the dust collection port 30A. In standby mode, without performing maintenance to remove deposits, Figure 22 The right end of the movable plate 34D1 in the middle exits from the dust collection port 30A. Figure 22 The standby distance D1 of the movable plate 34D1 is shown.

[0163] like Figure 24 As shown, when the drive unit 34A moves the shaft 34B to the right, the connecting part 34C moves to the right in conjunction with the shaft 34B. Figure 25 As shown, in conjunction with the movement of the connecting part 34C, the right end of the movable plate 34D1 protrudes outward from the end face of the bottom 32 of the dust collection mechanism part 30. By sliding, the adhering substance A2 on the end face is pushed outward from the position of the dust collection port 30A, thereby peeling off the adhering substance A2. Figure 25 The example shows the extension distance D2 of the movable plate 34D1.

[0164] (Effect of the eighth variation) In the eighth modification, the movable plate reciprocates along the surface of the dust collection mechanism 30 via the first peeling mechanism 33C and the second peeling mechanism 33D, which serve as additional adhesion barriers. Therefore, it is possible to further suppress the adhesion of splashes LS to the inner surface and end face of the dust collection mechanism 30. Other effects of the eighth modification are the same as those of the second embodiment.

[0165] (Ninth variation) like Figure 26 As shown, the difference between the laser processing apparatus 2A of the ninth modification and the seventh modification is that, in addition to the copper plate 33B disposed on the inner surface and end face of the dust collection mechanism 30 of the seventh modification, it also has a vibration imparting device 33E as an additional adhesion barrier. Furthermore, in this disclosure, the vibration imparting device 33E is not limited to being combined with other adhesion barriers such as the copper plate 33B, but can be used as a standalone adhesion barrier.

[0166] The vibration imparting device 33E can be constructed using, for example, a known vibrator. The vibration imparting device 33E can also impart vibration, for example, by impact. The vibration imparting device 33E is mounted on the outer surface of the top 31 of the dust collection mechanism 30. In this disclosure, the number of vibration imparting devices is arbitrary, whether it is one or more. Furthermore, the mounting position of the vibration imparting device can be appropriately changed. In this disclosure, the vibration imparting device is not necessarily mounted in a state of constant contact with the dust collection mechanism 30. The vibration imparting device can also be arranged around the dust collection mechanism 30 in a state of separation from it. Although figures are omitted, the vibration imparting device can also have a movable part, and vibration is imparted to the nozzle section by the impact of the movable part, etc., and the movable part can contact the dust collection mechanism section as needed even from a separated position.

[0167] (The effect of the ninth variation) In the ninth modification, the vibration-imposing device 33E, which serves as an additional adhesion-impeding part, further suppresses the adhesion of splashes LS to the inner surface and end face of the dust collection mechanism 30. Other effects of the ninth modification are the same as those of the third embodiment.

[0168] (Example 3) Next, refer to Figure 27 For use Figures 13-15 , Figure 26 Example 3, which describes the adhesion rate of the spatter LS measured in each of the third embodiment and the seventh to ninth modifications of the laser processing apparatus, will be explained.

[0169] Figure 27 The adhesion rate of the splashes LS is the ratio of the number of splashes LS particles reaching the inner surface and end face of the dust collection mechanism 30, calculated in the third embodiment and the seventh to ninth modified examples, when the number of splashes LS particles reaching the inner surface and end face of the dust collection mechanism 30 in the third comparative example is set to 1.

[0170] The dust collection mechanism of the laser processing apparatus in the third comparative example does not have an adhesion barrier that includes a copper-containing unit and is used to prevent the adhesion of spatter. Furthermore, the laser processing apparatuses in the third comparative example, the third embodiment, and the seventh to ninth modifications are identical in shape and size. Additionally, in embodiment 3, the copper plate 33B mounted on the dust collection mechanism 30 in the seventh to ninth modifications is approximately 1 mm thick.

[0171] In Example 3, verification based on laboratory experiments was conducted. First, experimental models corresponding to the laser processing apparatus of the third comparative example, the third embodiment, and the seventh to ninth modifications were set up. Then, using each of the set experimental models, laser processing was performed on steel plates by continuously irradiating them with laser LB for approximately 100 hours. In each experimental model, the weight increase at each location was measured to calculate the adhesion amount.

[0172] like Figure 27 As shown, in the third embodiment, the amount of splatter adhering is reduced to approximately 1 / 10 compared to the third comparative example. Furthermore, in the seventh modification, the amount of splatter adhering is reduced to the same level as in the third embodiment. Additionally, in the eighth modification, the amount of splatter adhering is reduced to approximately 1 / 20 compared to the third comparative example. Furthermore, in the ninth modification, the amount of splatter adhering is reduced to approximately 1 / 20 compared to the third comparative example. As can be seen from Embodiment 3, when a copper monomer adhesion barrier is provided, the amount of splatter LS adhering can be significantly reduced compared to the case where a copper monomer adhesion barrier is not provided.

[0173] <Other Implementation Methods> This disclosure has been described through the above-described embodiments, but it should not be construed as limiting this disclosure by the arguments and drawings that form part of it. It should be understood that various alternative embodiments, examples, and techniques will readily conceive of by those skilled in the art based on this disclosure.

[0174] For example, the structures illustrated in the accompanying drawings can be partially combined to form this disclosure. As described above, this disclosure includes various embodiments not described above, and the technical scope of this disclosure is determined solely by the specific matters disclosed in the proper claims based on the foregoing description.

[0175] Postscript Based on this specification, the following scheme is conceptualized.

[0176] Option 1, a laser processing apparatus, includes a gas jetting section that jets gas from an opening toward a laser irradiation portion of a steel plate surface. The gas jetting section has a nozzle section with an outer surface that is inclined from the outside of the opening toward the center of the opening in a direction parallel to the surface of the steel plate as it moves from the side opposite to the opening in the jetting direction toward the opening side. A first adhesion barrier for preventing the adhesion of laser sputtering material is disposed on at least a portion of the outer surface of the nozzle section.

[0177] Option 2, according to the laser processing apparatus of Option 1, wherein the first adhesion barrier comprises a carbon monomer or a copper monomer.

[0178] Option 3, according to the laser processing apparatus of Option 2, wherein the first adhesion barrier is formed by the gas jet section including the nozzle section being entirely formed of carbon monomers or copper monomers.

[0179] Option 4, according to the laser processing apparatus of Option 2, the first adhesion obstruction part is a plate-shaped component disposed on at least a portion of the outer surface of the nozzle part of the gas jet part.

[0180] Option 5, the laser processing apparatus according to any one of Options 1 to 4, wherein the first attachment obstruction portion includes a charge application device that applies a charge of the same polarity as the charge of the laser sputtering material to the gas jet portion.

[0181] Option 6, the laser processing apparatus according to any one of Options 1 to 5, includes a covering agent supply device that supplies a covering agent to cover the laser sputtering material.

[0182] Option 7, according to any one of Options 1 to 6, the gas jetting unit jets the gas parallel to the optical axis of the laser.

[0183] Option 8, the laser processing apparatus according to any one of Options 1 to 7, further comprises: a conveying roller for conveying a steel plate in a predetermined conveying direction; and a laser light source unit for irradiating the surface of the steel plate conveyed in the conveying direction with the laser.

[0184] Option 9, according to the laser processing apparatus described in Option 8, includes a dust collection mechanism, which is only located on one side of the conveying direction that is upstream or downstream of the irradiation part, and collects the laser spatter from the dust collection port.

[0185] Solution 10, according to the laser processing apparatus of Solution 9, provides a second adhesion barrier in the dust collection mechanism, which is used to prevent the laser sputtering material from adhering to the surface of the dust collection mechanism.

[0186] Solution 11, a laser processing method, wherein a laser is used to irradiate the surface of a steel plate, and a gas jet section is used to jet gas from an opening toward the irradiation site in such a way that laser spatter generated from the irradiation site of the laser is rolled up from the surface of the steel plate. The gas jet section has a nozzle section having an outer surface that is inclined from the outside of the opening toward the center of the opening in a direction parallel to the surface of the steel plate as it moves from the side opposite to the opening in the jetting direction toward the opening side. At least a portion of the outer surface of the nozzle section is provided with an adhesion barrier for preventing the adhesion of laser spatter.

[0187] Other options In addition, based on this specification, the following other solutions are conceptualized.

[0188] Other option 1, a laser processing apparatus, comprising: a laser source unit for irradiating the surface of a steel plate being conveyed in a predetermined conveying direction with a laser; and a gas jet unit for jetting gas toward the irradiation area of ​​the laser in a manner parallel to the optical axis of the laser, wherein an adhesion barrier is disposed on the surface of the gas jet unit, the adhesion barrier comprising carbon monomers and preventing the adhesion of laser sputtering material.

[0189] In alternative embodiment 2, the laser processing apparatus according to alternative embodiment 1 is constructed by forming the adhesion barrier portion entirely from carbon monomers through the gas jet section.

[0190] In alternative embodiment 3, according to the laser processing apparatus of alternative embodiment 1, the adhesion obstruction is a plate-shaped component disposed on a portion of the surface of the gas jet section.

[0191] In alternative embodiment 4, the laser processing apparatus according to any one of alternative embodiments 1 to 3 further comprises a charge application device that applies a charge of the same polarity as the charge of the laser sputtering material to the gas jet section.

[0192] Other embodiment 5, the laser processing apparatus according to any one of other embodiments 1 to 4, includes a covering agent adding device, which adds a covering agent to cover the laser sputtering.

[0193] Other option 6, a laser processing method, uses a laser light source to irradiate the surface of a steel plate being conveyed in a predetermined conveying direction, and uses a gas jetting unit with an adhesion barrier on the surface to jet gas toward the irradiated area of ​​the laser in a manner parallel to the optical axis of the laser, thereby rolling up laser spatter generated from the irradiated area from the surface of the steel plate, wherein the adhesion barrier contains carbon monomers and prevents the adhesion of the laser spatter.

[0194] Other solutions can improve the dust collection efficiency of laser spatter and prevent the adhesion of laser spatter along the entire width of the plate.

[0195] The publication of Japanese Patent Application No. 2023-149623, filed on September 14, 2023, is incorporated herein by reference in its entirety. Furthermore, all documents, patent applications, and technical standards described in this specification are incorporated herein by reference to the same extent that each document, patent application, and technical standard is specifically and individually referenced.

[0196] 1,1A~1C Laser processing equipment 2,2A~2C Laser processing equipment 10. Laser Source Section 12 Ejection section 20 Gas injection section 20A Gas 21A Vertical section 21B Nozzle Section 21B1 Opening 22A Adhesion Obstruction Section (First Adhesion Obstruction Section) 22B Carbon Plate (First Adhesion Barrier) 22C charge (first attachment barrier) 22D Adhesion Obstruction Section (First Adhesion Obstruction Section) 22E Copper Plate (First Attachment Barrier) 23. Connecting parts 24 Gas supply pipelines 22F Peeling Mechanism (First Attachment Barrier) 22F1 Drive Unit 22F2 Movable Plate 22G Vibration Mechanism (First Attachment Obstruction Section) 33A Adhesion Obstruction Section (Second Adhesion Obstruction Section) 33B Copper Plate (Second Attachment Obstruction) 33C First peeling mechanism (second adhesion barrier) 33D Second peeling mechanism (second attachment barrier) 34A Drive Unit 34B axis 34C Connector 34D Movable Plate 34E Support section 30 Dust Collection Mechanism Department 30A Dust Collection Port 30B sidewall 31 Top 31A Slit 32 Bottom 33E Vibration Mechanism (Second Attachment Obstruction Section) 34 Dust collection duct 40 Charge application device 42 Power Supply 44 electrical wires 50 Covering agent supply device 52 Covering agent source 54 Supply piping 56 Supply nozzle 90mm top plate A1~A3 Attachments C Conveying direction C1 Standby distance C2 launch distance D1 Standby distance D2 Launch Distance DF draws airflow G slot LB Laser LS spatter (laser spatter) P1 Air Supply Pump P2 suction pump R conveyor roller S steel plate SA irradiation site x Height from the steel plate to the top of the inner wall of the dust collection mechanism y The height from the steel plate to the top of the nozzle section of the gas injection unit

Claims

1. A laser processing device, The device includes a gas jetting section that jets gas from an opening toward a portion of the surface of a steel plate to be irradiated by a laser. The gas jetting section has a nozzle section with an outer surface that is inclined from the outside of the opening toward the center of the opening in a direction parallel to the surface of the steel plate, moving from the side opposite to the opening in the jetting direction toward the opening side. At least a portion of the outer surface of the nozzle section is provided with a first adhesion barrier for preventing the adhesion of laser sputtering material.

2. The laser processing apparatus according to claim 1, The first adhesion barrier contains a carbon monomer or a copper monomer.

3. The laser processing apparatus according to claim 2, The first adhesion barrier is formed by the gas injection section, including the nozzle section, being entirely composed of carbon monomers or copper monomers.

4. The laser processing apparatus according to claim 2, The first adhesion obstruction portion is a plate-shaped member disposed on at least a portion of the outer surface of the nozzle portion of the gas injection portion.

5. The laser processing apparatus according to any one of claims 1 to 4, The first adhesion barrier includes a charge application device that applies a charge of the same polarity as the charge of the laser sputtering to the gas jet.

6. The laser processing apparatus as described in any one of claims 1 to 5, It includes a covering agent supply device that supplies a covering agent to cover the laser sputtering material.

7. The laser processing apparatus according to any one of claims 1 to 6, The gas jetting section ejects the gas in a manner parallel to the optical axis of the laser.

8. The laser processing apparatus according to any one of claims 1 to 7, It also has: Conveyor rollers convey steel plates in a pre-set conveying direction; and The laser source unit irradiates the surface of the steel plate being conveyed in the conveying direction with the laser.

9. The laser processing apparatus according to claim 8, It has a dust collection mechanism that is located only on one side of the conveying direction, either upstream or downstream of the irradiation part, to collect the laser sputtering material from the dust collection port.

10. The laser processing apparatus according to claim 9, A second adhesion barrier is provided in the dust collection mechanism to prevent the laser sputtering material from adhering to the surface of the dust collection mechanism.

11. A laser processing method, Laser irradiation of steel plate surface A gas jetting section is used to jet gas from an opening toward the irradiation site in such a way that laser sputtering material generated from the irradiation site of the laser is rolled up from the surface of the steel plate. The gas jetting section has a nozzle section with an outer surface that is inclined from the outside of the opening toward the center of the opening in a direction parallel to the surface of the steel plate, moving from the side opposite to the opening in the jetting direction toward the opening side. At least a portion of the outer surface of the nozzle section is provided with an adhesion-resistant portion for preventing the adhesion of the laser sputtering material.

Images