Method for producing vacuum interrupter

Abstract

The invention relates to a method for joining housing components during the production of a vacuum interrupter, the housing components being configured with walls (22) enclosing a structural space, and the method comprising at least the following method steps: i) coaxially aligning at least two housing components; the method comprises the steps of i) providing a housing component, ii) bringing the joints (20) of the walls (22) of the housing component into contact, iii) joining the housing component in a locally, spatially limited manner, and iv) fully joining the housing component, and wherein v) at least one further working step is carried out between the method step iii) and the method step iv).

Description

Technical Field

[0001] This invention relates to a method for manufacturing a vacuum switch tube. Furthermore, this invention relates to a vacuum switch tube produced by a corresponding method and a semi-finished product for manufacturing the vacuum switch tube. Background Technology

[0002] In the manufacturing process of vacuum switch tubes, it is often necessary to connect different housing components and parts to each other in a vacuum-sealed manner. In particular, it is necessary to connect metal and ceramic materials themselves or to each other.

[0003] However, it is technically difficult to join metal and ceramic components in a hermetically or vacuum-sealed manner, due to factors such as surface energy and wettability. To enable such connections, an intermediate layer consisting of active and inert solders is often used, or a metal coating is applied to the ceramic. Furthermore, careful consideration must be given to the pairing of different material combinations with the solder intermediate layer to minimize the effects of thermal stress during subsequent processing or soldering. However, achieving precise alignment is often challenging.

[0004] Other solutions based on carbon, as well as organic and inorganic compounds, may contaminate vacuum processing or require increased processing time, for example, due to hardening.

[0005] Additionally, a ceramic metallization layer with a thickness of less than 10 to 20 μm, commonly found in composite structures, is used on the surface, making direct bonding via fusion welding impossible. Furthermore, the ceramics used are often sensitive to thermal shock.

[0006] In current production, multi-layered composite structures are typically fixed and coaxially aligned relative to each other using complex devices and supports to join housing components. This requires significant manual labor and is prone to errors, potentially leading to leaks in vacuum switch tubes and resulting in scrap. Displacement of the mating components relative to each other in orientation can affect solder flow during vacuum welding processes and may cause material buildup in areas of critical arc flashover, negatively impacting the insulation performance of the ceramic and hindering / impeding mechanical function.

[0007] Therefore, the solutions in the prior art still have potential for improvement. In particular, these solutions have potential for improvement in the safe and repeatable manufacturing of vacuum switch tubes, especially in the steps of connecting or joining their housing components. Summary of the Invention

[0008] Therefore, the technical problem to be solved by the present invention is to at least partially overcome the disadvantages known from the prior art. In particular, the technical problem to be solved by the present invention is to provide a solution that improves the manufacturing of vacuum switching tubes, especially the joining of housing components.

[0009] According to the present invention, the solution to the above-mentioned technical problem is achieved at least in part by a method having the features of claim 1. Furthermore, according to the present invention, the solution to the above-mentioned technical problem is achieved at least in part by a vacuum switch tube having the features of claim 9 and by a semi-finished product having the features of claim 10. Preferred embodiments of the invention are described in the dependent claims, the specification, or the drawings, wherein, unless explicitly stated otherwise in the context, other features described or shown in the dependent claims, the specification, or the drawings may constitute the subject matter of the invention, alone or in any combination.

[0010] A method for joining a housing component during the manufacture of a vacuum switch tube is described, wherein the housing component is configured to have walls surrounding a structural space, and wherein the method includes at least the following method steps:

[0011] i) Align at least two shell components coaxially;

[0012] ii) To bring the joints of the walls of the shell components into contact;

[0013] iii) Joining shell components in a localized, spatially limited manner; and

[0014] iv) Fully engage the shell components, wherein,

[0015] v) Perform at least one additional working step between method step iii) and method step iv).

[0016] This method enables improvements in the manufacturing of vacuum switching transistors and also improves the quality of the correspondingly manufactured vacuum switching transistors.

[0017] Specifically, the method described herein is used to produce a vacuum switching tube. In particular, multiple housing components can be connected or joined together to form the housing of the vacuum switching tube. Such a vacuum switching tube can be, in particular, a component of switching devices, such as medium-voltage or high-voltage switching devices, which operate in a vacuum within an internal space.

[0018] Here, the housing member is constructed to have walls that surround the structural space. For example, the housing member is designed to be tubular. In the resulting vacuum switch tube, either in the internal space or in the structural space, corresponding contacts of the switching device are formed, for example.

[0019] To produce a vacuum switch tube or its housing, according to method step i), the housing components are arranged coaxially relative to each other. When the housing components to be joined are arranged coaxially, the joints of the housing components to be joined are aligned adjacent to each other. Here, the joints are specifically the end faces of the walls to be joined. This results in an airtight and vacuum-sealed connection, or a housing for joining the vacuum switch tube can be produced from the housing components, the joined housing being airtight and vacuum-sealed under the operating conditions of the vacuum switch tube.

[0020] According to method step ii), the joints of the walls of the housing members are brought into contact, thus bringing the adjacent end faces of the housing members into contact.

[0021] At this location, according to method step iii), the shell components are joined in a localized, spatially limited manner, thus joining the joints in a localized, spatially limited manner. Therefore, unlike solutions in the prior art, this method step does not directly and completely join or connect the respective shell components at their joint locations, but rather connects the joint locations to each other only in a spatially limited manner, i.e., at defined points or areas. Therefore, at this stage of the method, there is no airtight connection of the shell components; method step iii) only creates a pre-fixation.

[0022] According to the invention, a final, complete fixation is performed according to method step iv), thus performing a final engagement, i.e., fully engaging the housing members, particularly along the entire engagement joint. Therefore, after this method step, the connection of the housing members is configured such that the housing members withstand the operating conditions of the ultimately generated vacuum switch tube, i.e., particularly the defined vacuum, in a hermetically and vacuum-sealed manner.

[0023] According to the invention, at least one additional working step is performed between method step iii) and method step iv). Correspondingly, the pre-fixation produced in method step iii) is specifically intended to ensure that the method steps performed between method steps iii) and method step iv) can be carried out without problems and without undesirable relative movement between the partially joined housing members.

[0024] In particular, the method steps are transportation steps or other operational steps, which can be executed without problems due to pre-fixation. However, in principle, the method steps can also include only storage performed within a limited time period.

[0025] Therefore, the present invention solves the problem of how to temporarily or permanently fix different mating parts, i.e., housing components, to each other or relative to each other, so as to feed them to a subsequent final fixation, such as to vacuum welding performed under conditions exemplarily >700°C. This can further be done with only a small temperature load on the mating parts.

[0026] For example, spatially limited fixation of shell components can be performed at purely point-like locations close to each other, or it can be achieved through limited planar connections. Furthermore, spatially limited fixation can ideally be performed without damaging the carrier material, but it may also have an impact on the carrier material within indistinct limits.

[0027] Therefore, using the method according to the invention, two or more mating components can be easily oriented relative to each other during construction, achieving precise alignment and protection against mechanical stresses during transport and manufacturing. This invention provides significant support for automated (“bottom-up” manufacturing) design schemes because, to date, it has been impossible or difficult to permanently and repeatably join metal-ceramic composite structures, for example.

[0028] Here, the method according to the invention offers significant advantages compared to known solutions. Known solutions are based on methods of mechanically fixing and aligning the housing components to each other. In subsequent final fixing processes, such as vacuum welding, these fixings involve additional volumes that must be heated, or these additional volumes may be sources of contamination for the process. Additionally, these methods according to the prior art have drawbacks, such as the possibility of components slipping during transport and eventual leakage in the vacuum switching tube, requiring complete disposal. Other methods, such as those using auxiliary / intermediate media / layers utilizing organic or inorganic components, require longer processing times to harden or maintain the fixing function. More challenging is that in vacuum welding, contaminating components typically dissolve into the vacuum as the temperature rises.

[0029] In contrast, the method according to the invention offers significant advantages in terms of pre-fixation, reliably maintaining the pre-fixation even during transport or other operations. Therefore, defects in the resulting products can be minimized, and corresponding scrap can be prevented or at least significantly reduced.

[0030] This invention enables the fixation and connection of dissimilar components, such as ceramics and predominantly metallized ceramics, starting with a relatively small metallization layer thickness (>2 μm). Therefore, it eliminates the need for complex, apparatus-dependent mechanical fixation or alternatives to organic / inorganic fixation media used in subsequent vacuum welding processes.

[0031] This invention can be used in multilayer composite structures, which have or lack metallization layers between one or more ceramics, and may contain active or inert solders, or layers composed of different metals in the absence of ceramics as bonding pairs. For example, the method can be applied to metallization layer thicknesses of a few μm, for example, less than or equal to 10 μm, up to tens of μm, for example, up to 70 μm, for example, up to 40 μm. However, in principle, designs for bonding pairs composed of metals and ceramics in a contoured or uncontacted manner, with or without metallization layers, are all possible.

[0032] Here, exemplary material combinations include, for example:

[0033] - Ceramic-metallized layer-solder;

[0034] - Ceramic - Metallization - Solder - Copper / Stainless Steel / Metal;

[0035] - Ceramics - Solder - Ceramics;

[0036] - Ceramic-Metallization-Solder-Metallization-Ceramic;

[0037] - Ceramic-Metallization-Solder-Metal-Solder-Metallization-Ceramic;

[0038] - Ceramics-Solder-Metal-Solder-Ceramic;

[0039] Exemplary joining geometries include, for example:

[0040] - Fillet welds, straight welds, and lap welds.

[0041] The corresponding processing for pre-fixation according to step iii) includes, for example, fusion welding and laser seam welding.

[0042] The method or method step iii) can be performed, for example, using all common beam welding methods. In the field of electron beams, this is preferably performed under vacuum conditions, or in principle, under non-vacuum conditions, wherein, particularly in such a design, it is preferable to produce a circumferential weld. The invention relates particularly to the characteristics of the mating materials and the use of the radiation source. Infrared lasers have demonstrated good results in a series of experiments, and can therefore be further improved. For this purpose, lasers of specific wavelengths in the green spectral range are used, wherein the blue spectral range can also be used.

[0043] The existing conditions can be adjusted effectively using the rays used, for example by using ray modulation, such as spirals, oscillations, points, circles, lines or planar grids, symmetrical or asymmetrical patterns, defocusing, etc.

[0044] In principle, the method, or particularly step iii), can be performed under a shielding gas or without a shielding gas, which further improves the wide range of applications. In particular, the reducing shielding gas supports the welding process by facilitating the flow of solder in the molten zone.

[0045] The preceding implementations demonstrate that the method can be easily adapted to different applications. It can be executed quickly, adapted flexibly and without problems, and is scalable.

[0046] For example, a spraying process can be used to locally or planar heat a metallic material, such as a housing component or solder. Through heat conduction, a temperature rise close to or exceeding the softening or melting point of the solder is generated at the metal-solder transition. The viscous or molten solder can then wet and bond the metal and the metallized ceramic, and in the case of an active solder, it can also wet and bond ceramics without a metallized layer.

[0047] According to one design scheme, step iii) of the method can be performed by point bonding to form mutually separated bonding points. In particular, this design scheme allows for stable pre-fixation, and also enables very small temperature loads on the mating components. For example, two, three, four, or five bonding points can be created. Therefore, in principle, ten or fewer bonding points, such as five or fewer, can be created. Preferably, the bonding points are distributed at equal intervals along the joint, for example, along the end face of the housing member.

[0048] Furthermore, it may be preferable to create a material fit connection in step iii). In particular, the material fit connection can be created by heating the mating materials or the materials arranged between the mating materials to above their softening or melting point through temperature action, thus creating a material fit connection after solidification.

[0049] For example, the metals that serve as mating components can be heated to form a material fit. Furthermore, solder can be used between the mating components, i.e., between the housing members.

[0050] As a temperature source, a radiation source, such as one that generates an electron beam or a laser beam, can be used. This allows it to be directed and repeatedly applied to the mating components or the material disposed between them, such as solder.

[0051] For example, solder can be used in step iii) as follows: the solder is heated to above its softening point or melting point, and thus the housing components can be joined after cooling.

[0052] In particular, the solder can be directly heated using a radiation source. Therefore, in this design, the effect of temperature can first act directly on the solder, for example, by directing the corresponding radiation directly at the solder. This allows the solder to melt and, for example, become viscous, thereby wetting the mating materials, such as metallic mating materials and, for example, metallized ceramics, which, upon solidification, creates a bond between the materials. This keeps the temperature load on the mating materials, particularly ceramic mating materials, low. While small cracks may occur in the case of thermally shock-sensitive ceramics, this risk is greatly reduced, and any cracks formed are functionally insignificant. Therefore, the risk of damage to the mating materials due to the bonding process can be eliminated or greatly reduced, which could lead to a non-sealing of the resulting vacuum switch tube.

[0053] Alternatively, a radiation source can be used to directly heat the metal adjacent to the solder. In this design, the metal can be melted due to the introduction of heat, for example, through the targeted action of radiation such as a laser beam, wherein the solder becomes viscous or molten in the transition region to the solder. Accordingly, all mating materials are wetted. While it is not entirely excluded that the radiant energy may extend to the transition region from the solder to, for example, the metallized ceramic, or into that transition region, this effect can be significantly reduced, thus significantly decreasing the thermal load on the ceramic.

[0054] Solder foil can preferably be used to join housing components, or solder foil can be used to perform step iii) of method. In particular, solder foil can offer significant advantages, for example, when using a laser beam and correspondingly laser welding. Therefore, in automated solutions, only the ceramic and solder foil components need to be processed, which simplifies the manufacturing process. Furthermore, errors can be reduced, especially through automated processing, because the correct solder foil can be reliably applied in the correct manner, i.e., in the correct position, e.g., concentrically and without slippage. This results in high repeatability of the final product, which can be manufactured through a shorter processing time.

[0055] Furthermore, an advantage of using solder foil is that even if there are flatness deviations in the solder foil, this is not a problem because these deviations no longer exist after soldering. Therefore, in principle, solder foils with lower requirements can be selected. For example, relatively small solder foils can be used because it is often not necessary to compensate for component tolerances, and the solder foil is precisely positioned during final bonding. Because the solder foil correspondingly does not require alignment between the ceramic and the solder foil itself, the tooling costs for manufacturing the solder foil are further relatively low. In addition, solder foil can be manufactured simply and quickly.

[0056] Furthermore, since the alignment and support of the solder foil can be eliminated during final bonding, solder foils with very simple geometries can be used, which simplifies its use in principle. Additionally, because the support function of the solder foil can be essentially eliminated, the diameter tolerances of the housing components are less critical.

[0057] Finally, even when high flatness is required, resource savings can be achieved because annealing of the solder foil is no longer necessary.

[0058] Furthermore, it may be preferable to use a laser emitter or an electron emitter as the radiation source. It can be demonstrated that such emitters, or particularly such radiation, are especially suitable for enabling not only the complete final joining according to method step iv), but also the partial joining according to method step iii). This is, for example, because, with a very targeted energy input, only a limited spatial area can be heated without problems, thereby allowing method step iii) to be performed with the minimum possible thermal load on the housing components. Furthermore, the joining according to method step iii) can be performed in a very defined and repeatable manner.

[0059] For other advantages or technical features of the method, please refer to the description of the vacuum switch tube, the semi-finished product, the accompanying drawings, and the description of the accompanying drawings.

[0060] Furthermore, a vacuum switch tube is described having at least two housing components connected to each other, wherein the vacuum switch tube is manufactured according to the method described above.

[0061] This type of vacuum switch tube can be a component of a switching device, also known as a circuit breaker.

[0062] Such switching devices can, for example, form circuit breakers or power contactors, and can be part of medium-voltage or high-voltage switchgear. Here, medium-voltage switchgear should be understood as switchgear capable of switching voltages from approximately 1 kV up to 60 kV. Furthermore, high-voltage switchgear can be understood as switchgear capable of switching voltages exceeding 60 kV. Additionally, the switchgear can be, for example, gas-insulated switchgear (GIS).

[0063] Such switching devices typically have a vacuum switching tube with a housing that is vacuum-sealed under operating conditions, in which active components, such as, in particular, contacts, are arranged.

[0064] Due to the manufacturing method and the resulting housing components that are precisely and repeatably joined, the vacuum switch tube according to the invention can provide advantages in terms of sealing and stability.

[0065] In particular, the vacuum switch tube manufactured according to the present invention may differ from conventionally manufactured vacuum switch tubes in the following aspects.

[0066] The spatially limited bonding area produced by step iii) can be identified, for example, by slight protrusion or tempering color. Furthermore, because the material change alters the welding process and significantly changes the flow characteristics, particles may form within the bonding area, or planar areas may form at the edges or surfaces of the solder. Additionally, when, for example, ferrous metals and copper / silver—that is, materials that, in principle, make solder and metallization layers or metal bonding pairs—are melted and mixed, intermetallic phases may also be visible as small particles.

[0067] In addition, minor damage to the solder areas may have been found, as the solder does not wet the non-metallized ceramic, which can lead to porosity, for example. Furthermore, solder deformation or flow marks may have occurred due to shrinkage caused by welding, which hinders deformation. Additionally, in principle, bumps, pits, or spatter cannot be ruled out due to the guidance of the X-ray source, but these are not important for later functionalization.

[0068] Here, the features described above appear particularly at spatially limited junction locations and do not affect the basic function of the vacuum switch tube.

[0069] For other advantages or technical features of the vacuum switching tube, please refer to the description of the method, the semi-finished product, the accompanying drawings, and the description of the accompanying drawings.

[0070] In addition, a semi-finished product for manufacturing a vacuum switch tube is described, wherein the semi-finished product includes two housing components that are connected to each other in a localized and spatially limited manner.

[0071] Therefore, this semi-finished product appears between method step iii) and method step iv). This allows for improved assembly of the housing components during the manufacturing process of the vacuum switch tube, as the operation, transport, and final assembly can be performed with particular reliability and repeatability.

[0072] For other advantages or technical features of the semi-finished product, please refer to the description of the method, the vacuum switch tube, the accompanying drawings, and the description of the accompanying drawings. Attached Figure Description

[0073] Further details, features, and advantages of the subject matter of this invention will become apparent from the dependent claims and from the following description of the drawings. In the drawings:

[0074] Figure 1 A schematic diagram of a structure for manufacturing a vacuum switch tube to be joined according to a design according to the present invention is shown;

[0075] Figure 2 A schematic diagram of a structure for manufacturing a vacuum switch tube to be joined according to another design according to the present invention is shown;

[0076] Figure 3 A radiation process for local bonding according to a design scheme based on the method according to the invention is shown;

[0077] Figure 4 A radiation process for local bonding according to another design scheme of the method according to the invention is shown;

[0078] Figure 5 A radiation process for local bonding according to another design scheme of the method according to the invention is shown;

[0079] Figure 6 A radiation process for local bonding according to another design scheme of the method according to the invention is shown;

[0080] Figure 7 The diagram illustrates a radiation process for local bonding according to another design scheme of the method according to the invention; and

[0081] Figure 8A radiation process for local bonding according to another design scheme of the method according to the invention is shown. Detailed Implementation

[0082] exist Figure 1 and Figure 2 Different combinations of mating pairs are shown in the diagram.

[0083] Here, Figure 1 A ceramic housing component 10 is shown, which is to be connected to a metal housing component 12. More precisely, walls 22 of the housing components are shown, each having a joint 20 pointing relative to each other. For joining, the ceramic housing component 10 has a metallization layer 14 coated with solder 16, such as an inert solder and / or, for example, in the form of solder foil.

[0084] Figure 2 A similar design is shown, but in this design, active solder can be used in particular. The metallization layer 14 is omitted in this design.

[0085] However, in principle, multiple variations can be implemented. Examples of structural combinations include, for instance: ceramic shell component 10 - metallization layer 14 - solder 16, particularly as an inert solder - metallization layer 14 - ceramic shell component 10;

[0086] Ceramic housing component 10 - particularly solder 16 as active solder - ceramic housing component 10;

[0087] Ceramic shell component 10 - Metallization layer 14 - Solder 16, particularly as an inert solder - Metal shell component 12 - Solder 16, particularly as an inert solder - Metallization layer 14 - Ceramic shell component 10;

[0088] Ceramic housing component 10 - Solder 16, particularly as an active solder - Metal housing component 12 - Solder 16, particularly as an active solder - Ceramic housing component 10.

[0089] It should be noted that active soldering can be performed without a metallization layer, but inert soldering is preferred when a metallization layer is present.

[0090] For at least localized, i.e. spatially limited engagement, radiation 18, such as a laser beam or an electron beam, is used. The incident radiation 18 is shown in the following figures.

[0091] exist Figure 3The diagram shows radiation 18 directed axially toward solder 16, which is configured as an inert solder, for example. For instance, radiation 18 can partially melt solder 16, thereby wetting metallization layer 14, or it can heat solder 16 to its softening point, which in turn wets metallization layer 14. These alternatives are applicable in principle, independent of the corresponding design of the layer or structural configuration of the components to be joined.

[0092] according to Figure 4 The radiation 18 points at an angle of approximately 45° relative to the axial direction to the solder 16, which is configured as an inert solder, and may reach the metallization layer if necessary, or may not reach the metallization layer.

[0093] according to Figure 5 A metal shell member 12 is provided on the solder 16, which is specifically constructed as an inert solder. According to... Figure 5 The radiation 18 points at an angle of approximately 45° relative to the axial direction toward the metal housing member 12 and extends into the solder 16 if necessary, but does not contact the ceramic housing member 10.

[0094] For example, in this design, the metal housing component 12 can be heated in a point-like or large-area manner by radiation 18, thereby heating the solder 16 as well, for example, to melt or soften the solder 16, and thus achieving wetting of adjacent components. This can be particularly achieved by utilizing, for example... Figure 6 This is achieved through radial irradiation as shown.

[0095] exist Figure 6 The diagram shows different radiations 18 that can preferably be used alone, i.e., not in combination, and can be directed in different ways, particularly to the solder 16 or the metal housing member 12, which is configured as an inert solder. For example, the radiations 18 can be directed radially into the solder 16 or the metal housing member 12, or they can be directed at an angle relative to the axial direction, for example, 45°, into the metal housing member 12, or they can be directed axially into the metal housing member 12.

[0096] according to Figure 7 The metal housing component 12 can have very small, for example point-like contact with the solder 16, which is specifically configured as an inert solder, wherein the radiation 18 is preferably not combined and is guided relative to the axial direction at an angle of, for example, 45° to the contact point or the directly adjacent area, thereby producing minimal impact.

[0097] exist Figure 8An exemplary example of a multilayer composite structure is shown, comprising two ceramic shell members 10 each having a metallization layer 14, and adjacent to the metallization layer 14 are solder 16, specifically configured as inert solder, and a metal shell member 12 between the layers composed of the solder 16. Heat input is further provided by means of radiation 18 directed radially into the solder 16 or the metal shell member 12.

[0098] In principle, as can be seen from the preceding figures, the corresponding radiation 18 can be directed toward the solder 16 or the metal bonding mating member 12 in different ways, such as radially, axially, or at an angle between the radial and axial directions. Thus, according to the invention, advantageous pre-fixing can be achieved. Final bonding can be performed, for example, in a furnace or under a vacuum.

[0099] Furthermore, all body edges, i.e., the edges of the housing members 10, 12 or the solder 16 configured as solder foil, can be radially offset relative to each other.

[0100] Regardless of the grammatical gender of a particular term, people with either male or female gender identity are included.

[0101] While the invention has been shown and described in further detail through preferred embodiments, the invention is not limited to the disclosed examples, and those skilled in the art can derive other modifications without departing from the scope of protection of the invention.

[0102] List of reference numerals

[0103] 10 Ceramic shell components

[0104] 12 Metal Shell Components

[0105] 14 metallization layers

[0106] 16 solder

[0107] 18 radiation

[0108] 20 joints

[0109] 22 walls

Claims

1. A method for joining housing components during the manufacturing of a vacuum switch tube, wherein, The shell member is configured to have a wall (22) surrounding the structural space, and the method includes at least the following method steps: i) Align at least two shell components coaxially; ii) To bring the joint (20) of the wall (22) of the shell member into contact; iii) Joining shell components in a localized, spatially limited manner; and iv) Fully engage the shell components, wherein, v) Perform at least one additional working step between method step iii) and method step iv).

2. The method according to claim 1, characterized in that, Step iii) of the method is performed by point bonding to form bonding points that are separated from each other.

3. The method according to claim 1 or 2, characterized in that, In step iii), a material fit is created.

4. The method according to claim 3, characterized in that, The solder (16) is used in step iii) as follows, that is, the solder (16) is heated to above its softening point or melting point, and thus a connection of the shell components is formed after cooling.

5. The method according to claim 4, characterized in that, The solder is heated directly using a radiation source (16).

6. The method according to claim 4, characterized in that, The metal adjacent to the solder (16) is heated directly using a radiation source.

7. The method according to any one of claims 4 to 6, characterized in that, Perform step iii of the method using solder foil.

8. The method according to any one of claims 1 to 7, characterized in that, The method steps implemented between method step iii) and method step iv) include transportation or storage.

9. A vacuum switch tube, said vacuum switch tube having at least two housing members connected to each other, characterized in that, The vacuum switch tube is manufactured according to any one of claims 1 to 8.

10. A semi-finished product for manufacturing a vacuum switch tube, characterized in that, The semi-finished product includes two shell components connected to each other in a localized and spatially limited manner.

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