Head unit and liquid ejecting apparatus

Abstract

The invention relates to a head unit and a liquid ejecting apparatus. The positioning accuracy of a head chip relative to a support member is improved. A head unit includes a first liquid ejecting head that ejects a liquid in a first direction and a support member that supports the first liquid ejecting head, and the support member includes a support plate that has a first surface that supports the first liquid ejecting head and faces the first direction, and a first positioning portion that positions the first liquid ejecting head and the support plate. The first liquid ejecting head includes a head chip that ejects a liquid, a cover member to which the head chip is fixed, a base member to which the cover member is fixed, and a laminated structure that is laminated in a second direction opposite to the first direction with respect to a placement surface provided on the base member, the laminated structure including an opposing portion that opposes the first surface. The base member includes a protruding portion protruding from the placement surface in the second direction, and the protruding portion includes a contact surface in contact with the first surface and a second positioning portion for positioning the first liquid ejecting head and the support plate.

Description

Technical Field

[0001] This invention relates to head units and liquid injection devices. Background Technology

[0002] Conventional technology regarding head units includes a liquid injection head and a support member supporting the liquid injection head. For example, Patent Document 1 discloses a head unit including a liquid injection head and a support member supporting the liquid injection head. The liquid injection head has a plurality of head chips that spray liquid from above to below, a cover member on which the plurality of head chips are fixed, and a base member that holds the plurality of head chips between the base member and the cover member. The support member is provided with an opening for the injection surface of the liquid injection head to be inserted from above to below.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2023-146038

[0004] In conventional technologies, during the manufacturing of the head unit, the spray surface of the liquid injection head is inserted into the support member from top to bottom. Therefore, an opening with an area larger than the spray surface needs to be provided on the support member. However, providing a support member with a large opening area cannot adequately ensure the rigidity of the support member. Therefore, a configuration can be considered where the support member is positioned above the liquid injection head, allowing the liquid injection head to be fixed from below the support member without forming a large opening on the support member. Specifically, a configuration can be considered where the liquid injection head is fixed to the support member using a stacked structure, which is stacked above the base member holding multiple head chips. However, with this configuration, since the stacked structure is located between the base member holding multiple head chips and the support member, there is a possibility of reduced positioning accuracy of the head chips relative to the support member. Summary of the Invention

[0005] To solve the above problems, the head unit of the present invention is characterized by comprising: a first liquid injection head for injecting liquid in a first direction; and a support member for supporting the first liquid injection head, the support member comprising: a support plate having a first surface facing the first direction, the first surface being the surface supporting the first liquid injection head; and a first positioning portion for positioning the first liquid injection head relative to the support plate, the first liquid injection head comprising: a plurality of head chips having a plurality of nozzle groups for injecting liquid; and a cover member having a plurality of exposure openings for exposing each of the plurality of nozzle groups to the outside. The chip is fixed to the cover member; a base member, to which the cover member is fixed; and a stacked structure comprising a plurality of stacked substrates stacked in a first direction and stacked in a second direction opposite to the first direction relative to the mounting surface disposed on the base member, the stacked structure having an opposing portion facing the first surface, the base member having a protrusion protruding from the mounting surface in the second direction, the protrusion having: a contact surface contacting the first surface; and a second positioning portion corresponding to the first positioning portion for positioning the first liquid injection head and the support plate.

[0006] Furthermore, the liquid injection device of the present invention is characterized by comprising a head unit and a main frame supporting the head unit. The head unit comprises: a first liquid injection head for injecting liquid in a first direction; and a support member for supporting the first liquid injection head. The support member comprises: a support plate having a first surface facing the first direction, the first surface being the surface supporting the first liquid injection head; and a first positioning portion for positioning the first liquid injection head relative to the support plate. The first liquid injection head comprises: a plurality of head chips having a plurality of nozzle groups for injecting liquid; a cover member having a plurality of exposed openings for exposing each of the plurality of nozzle groups to the outside, the plurality of head chips being fixed to the cover member; and a base member to which the cover member is fixed. The support member includes a component; and a stacked structure comprising a plurality of stacked substrates stacked in the first direction and stacked in a second direction opposite to the first direction relative to the mounting surface disposed on the base component. The stacked structure has an opposing portion facing the first surface. The base component has a protrusion protruding from the mounting surface in the second direction. The protrusion has: a contact surface that contacts the first surface; and a second positioning portion disposed corresponding to the first positioning portion for positioning the first liquid injection head and the support plate. The support component has: a third positioning portion disposed on a flat plate portion of the support plate having the first surface for positioning the main frame and the support plate; and a fixing portion disposed on the flat plate portion for fixing the main frame and the support plate. Attached Figure Description

[0007] Figure 1 This is a configuration diagram illustrating an example of a liquid injection device 100 according to an embodiment of the present invention.

[0008] Figure 2 A top view showing an example of the configuration of the head unit HD.

[0009] Figure 3 A perspective view showing an example of the configuration of the support member 5.

[0010] Figure 4 A top view showing an example of the configuration of the head unit HD.

[0011] Figure 5 A cross-sectional view showing an example of the configuration of the head unit HD.

[0012] Figure 6 An exploded perspective view showing an example of the configuration of the liquid injection head 1.

[0013] Figure 7 A cross-sectional view showing an example of the configuration of the head unit HD.

[0014] Figure 8 A cross-sectional view showing an example of the configuration of the head unit HD.

[0015] Figure 9 A cross-sectional view showing an example of the configuration of the head unit HD.

[0016] Figure 10 This is a schematic diagram illustrating an example of the configuration of the head unit HD.

[0017] Figure 11 A cross-sectional view showing an example of the configuration of the head unit HD.

[0018] Figure 12 A cross-sectional view showing an example of the configuration of the head unit HD.

[0019] Figure 13 This is a schematic diagram illustrating an example of the configuration of the head unit HD-W1 involved in comparative example W1.

[0020] Figure 14 This is a schematic diagram illustrating an example of the configuration of the head unit HD-W2 involved in the comparative example W2.

[0021] Figure 15 This is a schematic diagram illustrating an example of the configuration of the head unit HD-B1 involved in variant B1.

[0022] Figure 16This is a schematic diagram illustrating an example of the configuration of the head unit HD-B2 involved in variant B2.

[0023] Figure 17 A perspective view showing an example of the configuration of the relay substrate 14.

[0024] Figure 18 A top view showing an example of the configuration of the liquid injection head 1.

[0025] Figure 19 An illustrative diagram showing an example of a supply flow path Q(1)~Q(4).

[0026] Figure 20 This is a schematic diagram illustrating an example of the configuration of the supply flow path Q.

[0027] Figure 21 A top view showing an example of the configuration of the supply flow paths Q(1) to Q(4).

[0028] Figure 22 This is a schematic diagram illustrating an example of the configuration of the supply flow path Q-V1 involved in the comparative example V1.

[0029] Figure 23 This is an illustrative diagram showing an example of the suction cleaning process for the supply flow path Q-V1 involved in comparative example V1.

[0030] Figure 24 This is an illustrative diagram showing an example of a suction cleaning process for the supply flow path Q.

[0031] Figure 25 This is a schematic diagram illustrating an example of the configuration of the supply flow path Q-V2 involved in the comparative example V2.

[0032] Figure 26 This is a schematic diagram illustrating an example of the configuration of the supply flow path Q-V3 involved in the comparative example V3.

[0033] Figure 27 This is a schematic diagram illustrating an example of the configuration of the supply flow path Q-C1 involved in the modified example C1.

[0034] Figure 28 This is a schematic diagram illustrating an example of the configuration of the supply flow path Q-C2 involved in the modified example C2.

[0035] Figure 29 A cross-sectional view showing an example of the configuration of the liquid injection head 1.

[0036] Figure 30 A cross-sectional view showing an example of the configuration of the liquid injection head 1.

[0037] Figure 31 A perspective view showing an example of the periphery of the filter fixing screw 61 and nut 62.

[0038] Figure 32 A top view showing an example of the configuration of the liquid injection head 1.

[0039] Figure 33 A cross-sectional view showing an example of the configuration of the liquid injection head 1.

[0040] Figure 34 A cross-sectional view showing an example of the configuration of the liquid injection head 1.

[0041] Figure 35 A cross-sectional view showing an example of the configuration of the liquid injection head 1.

[0042] Figure 36 A perspective view showing an example of the configuration of the lower retainer 131.

[0043] Figure 37 A perspective view showing an example of the configuration of the fixing plate 11 and the lower retainer 131.

[0044] Figure 38 This is a configuration diagram illustrating an example of a liquid injection device 100D according to a variation of the present invention.

[0045] Figure 39 A top view showing an example of the head unit HD-D involved in Modified Example 1.

[0046] Explanation of reference numerals in the attached figures

[0047] 1: Liquid injection head; 5: Support component; 11: Fixing plate; 12: Head chip; 13: Holder; 14: Relay substrate; 15: Substrate cover; 16: Filter unit; 50: Support plate; 51: Flat plate section; 55: Laminated structure; 61: Filter fixing screw; 62: Nut; 63: Filter fixing threaded hole; 64: Receiving part; 65: Nut ejection opening; 70: Peripheral wall section; 71: Partition wall section; 72: Thinning part; 73: Recessed part; 74: Protruding part; 75: Outer peripheral recess; 77: Fixing plate opening; 100: Liquid injection device; 111: Nozzle exposure opening; 131: Lower retainer, 131S: storage part, 131T: protrusion, 132: intermediate retainer, 133: upper retainer, BT: opposing part, DM: molding area, DS: bonding area, DSS: separate bonding area, GB: branch position, HD: head unit, LLa[1]: nozzle row, LLa[2]: nozzle row, P511: lower side, PS13: mounting surface, PT13: contact surface, Q: supply flow path, Q0: inlet flow path, Q1: distribution flow path, Q2: distribution flow path, QK1: separate flow path, QK2: separate flow path, QR1: extension flow path, QR2: extension flow path. Detailed Implementation

[0048] The embodiments for carrying out the present invention will now be described with reference to the accompanying drawings. However, the dimensions and scales of the various parts in the drawings may appropriately differ from the actual situation. Furthermore, the embodiments described below are suitable specific examples of the present invention, and therefore various preferred limitations are attached to them technically, but the scope of the present invention is not limited to these embodiments unless specifically defined in the following description.

[0049] A. Implementation Method

[0050] The liquid injection device 100 according to the embodiment will now be described.

[0051] A.1. Overview of the liquid injection device 100

[0052] Figure 1 An explanatory diagram illustrating the liquid injection device 100 according to this embodiment is provided.

[0053] The liquid jetting device 100 is an inkjet printing device that jets ink onto a substrate PP. The substrate PP is typically printing paper, but any printing material such as resin film or fabric can be used as the substrate PP.

[0054] like Figure 1 As shown, the liquid injection device 100 includes a head unit HD, a control device 90, a conveying mechanism 91, a liquid container 93, a cleaning unit 94, and a moving mechanism 95.

[0055] Liquid container 93 stores ink and supplies the stored ink to head unit HD. Liquid container 93 can be, for example, a cartridge that can be detachably attached to liquid jet device 100, a bag-shaped ink pouch formed of a flexible membrane, or an ink reservoir capable of being refilled. Liquid container 93 stores various inks of different colors.

[0056] It is important to note that this is an example of ink being a "liquid".

[0057] The control device 90 includes, for example, processing circuits such as a CPU or FPGA and storage circuits such as semiconductor memory, to control various elements of the liquid injection device 100. Here, CPU is short for Central Processing Unit, and FPGA is short for Field Programmable Gate Array.

[0058] The control device 90 supplies a drive signal Com to drive the head unit HD and a control signal SI to control the head unit HD. Thus, under the control of the control signal SI, the head unit HD is driven by the drive signal Com, ejecting ink from some or all of the multiple nozzles N disposed on the head unit HD. It should be noted that the nozzles N will be described later.

[0059] Under the control of the control device 90, the conveying mechanism 91 conveys the medium PP in the Y1 direction along the Y-axis.

[0060] Hereinafter, the Y1 direction and the Y2 direction, which is opposite to the Y1 direction, will be collectively referred to as the Y-axis direction. Furthermore, the X1 direction along the X-axis, which intersects the Y-axis, and the X2 direction, which is opposite to the X1 direction, will be collectively referred to as the X-axis direction. Furthermore, the Z1 direction along the Z-axis, which intersects both the X-axis and the Y-axis, and the Z2 direction, which is opposite to the Z1 direction, will be collectively referred to as the Z-axis direction. In this embodiment, we assume that the ink ejection direction from nozzle N is the Z1 direction.

[0061] It should be noted that, below, the Z1 direction is sometimes referred to as the "downward direction," and the Z2 direction as the "upward direction." Furthermore, below, when another object is placed in the area located in the Z1 direction as viewed from one object, it is sometimes stated that "the other object is placed below one object." Furthermore, below, when another object is placed in the area located in the Z2 direction as viewed from one object, it is sometimes stated that "the other object is placed above one object." In this embodiment, as an example, the X-axis, Y-axis, and Z-axis are assumed to be orthogonal to each other. However, the present invention is not limited to this configuration. The X-axis, Y-axis, and Z-axis can simply intersect each other.

[0062] The head unit HD is a row-type head with multiple nozzles N arranged in a direction intersecting the transport direction (Y1 direction) of the medium PP, capable of ejecting ink into a range wider than the width of the medium PP. Specifically, in this embodiment, the head unit HD is provided with multiple nozzles N extending in a range wider than the width of the medium PP in the X1 direction intersecting the transport direction (Y1 direction) of the medium PP. Therefore, under the control of the control device 90, the head unit HD is linked with the transport mechanism 91 to transport the medium PP, ejecting ink from some or all of the multiple nozzles N, causing the ejected ink to fall onto the surface of the medium PP, thereby forming a desired image on the entire surface of the medium PP. It should be noted that, below, the process by which the liquid jetting device 100 forms an image on the medium PP is sometimes referred to as "printing process".

[0063] The head unit HD has two liquid injection heads 1: liquid injection head 1-1 and liquid injection head 1-2. Hereinafter, liquid injection head 1-1 and liquid injection head 1-2 are sometimes collectively referred to as liquid injection head 1-m. Here, the variable m is a natural number satisfying 1 ≤ m ≤ 2. Furthermore, in the following descriptions, the designations of the constituent elements corresponding to liquid injection head 1-m among the various constituent elements provided in the head unit HD are sometimes appended with the suffix "-m".

[0064] The liquid ejector head 1-1 has four head chips 12. Each head chip 12 has multiple nozzles N, and under the control of the control signal SI, it ejects ink from some or all of the multiple nozzles N in the Z1 direction.

[0065] Similar to liquid injection head 1-1, liquid injection head 1-2 has four head chips 12. Looking at liquid injection head 1-1, liquid injection head 1-2 is positioned in the X1 direction.

[0066] The cleaning unit 94 performs a cleaning process. Here, the cleaning process refers to the process of cleaning each liquid ejection head 1 provided in the head unit HD. Specifically, the cleaning process includes an aspiration cleaning process that draws ink from each nozzle N provided in the liquid ejection head 1, and a wiping process that wipes the ejection surface MF of the head unit HD, which is provided with multiple nozzles N, with a wiping member (not shown).

[0067] The moving mechanism 95 moves the cleaning unit 94 to the position corresponding to the part of the head unit HD that is to be cleaned.

[0068] A.2. Overview of Head Unit HD

[0069] Below, refer to Figures 2 to 5 This section provides an overview of the head unit HD.

[0070] Figure 2This is a top view of the head unit HD when viewed from above in the Z1 direction. Furthermore, Figure 3 This is a perspective view of the support member 5 included in the head unit HD. Furthermore, Figure 4 This is a top view of the head unit HD when viewed from above in the Z2 direction. Furthermore, Figure 5 For along Figure 2 The cross-sectional view is obtained by cutting the head element HD along the Ii line.

[0071] like Figures 2 to 5 As shown, the head unit HD includes two liquid jet heads 1, namely liquid jet head 1-1 and liquid jet head 1-2, a support member 5 supporting the two liquid jet heads 1, a common flow path member 41 having various flow paths, and a common electrical member 42 serving as a rigid substrate having various electronic components, and is fixed to the main frame 900 of the liquid jet device 100.

[0072] like Figure 3 As shown, the support member 5 includes a support plate 50 comprising a flat plate portion 51 and two bent portions 52, and various openings provided on the flat plate portion 51.

[0073] The flat plate portion 51 is a flat plate-shaped component extending on a plane with the Z-axis as the normal direction, and is a rectangular component that is longer in the X-axis direction.

[0074] The bending portion 52 is a flat plate extending on a plane with the Y-axis as the normal direction, and is a rectangular portion that is longer in the X-axis direction.

[0075] In this embodiment, it is envisioned that the flat plate portion 51 and the bent portion 52 are made of metal. For example, in this embodiment, the two ends of a metal plate extending in the plane with the Z-axis as the normal direction may be bent in the Z1 direction, thereby making the two bent ends of the metal plate the bent portion 52, and the portion between the two bent portions 52 of the metal plate the flat plate portion 51.

[0076] It should be noted that, in this embodiment, the metal plate constituting the flat plate portion 51 can be an iron-based metal plate such as SPCC (Steel Plate Cold Commercial), SECC (Steel Electrolytic Cold Commercial), or SGCC (Steel Galvanized Cold Commercial), or a stainless steel-based metal plate such as SUS304 or SUS316, or an aluminum-based metal plate such as A1100 or A5052.

[0077] Furthermore, the metal plate constituting the flat plate portion 51 is preferably a thin metal plate that can be bent. Specifically, the thickness of the metal plate constituting the flat plate portion 51 is 6 mm or less, preferably 3 mm or less. On the other hand, the metal plate constituting the flat plate portion 51 is preferably a metal plate with a thickness that ensures strength. Specifically, the metal plate constituting the flat plate portion 51 preferably has a thickness of 0.8 mm or more.

[0078] like Figure 2 and Figure 3 As shown, multiple openings are provided on the flat plate portion 51.

[0079] Specifically, on the plate section 51, corresponding to each liquid injection head 1, there are two head fixing threaded holes AH1 and AH2, two head positioning holes AP1 and AP2, a frame fixing threaded hole AM, a frame positioning hole AQ, an electrical connection opening AC, and multiple connection flow path openings AR.

[0080] More specifically, on the plate portion 51, corresponding to the liquid injection head 1-1, there are threaded holes AH1-1 and AH2-1 for head fixing, and head positioning holes AP1-1 and AP2-1 for head positioning; corresponding to the liquid injection head 1-2, there are threaded holes AH1-2 and AH2-2 for head fixing, and head positioning holes AP1-2 and AP2-2 for head positioning. Furthermore, on the plate portion 51, corresponding to the liquid injection head 1-1, there is threaded hole AM-1 for frame fixing and a frame positioning hole AQ-1; corresponding to the liquid injection head 1-2, there is threaded hole AM-2 for frame fixing and a frame positioning hole AQ-2. Additionally, on the plate portion 51, corresponding to the liquid injection head 1-1, there is an electrical connection opening AC-1 and multiple connection flow path openings AR-1; corresponding to the liquid injection head 1-2, there is an electrical connection opening AC-2 and multiple connection flow path openings AR-2.

[0081] As described above, the liquid injection head 1 has four head chips 12. Hereinafter, the j-th head chip 12 among the four head chips 12 of the liquid injection head 1 will sometimes be referred to as head chip 12[j]. Here, the variable j is a natural number satisfying 1≤j≤4. Furthermore, below, the designations of the constituent elements corresponding to head chip 12[j] among the various constituent elements of the liquid injection head 1 will sometimes be described with the suffix [j].

[0082] like Figure 4As shown, the liquid injection head 1 includes a mounting plate 11. On the mounting plate 11, four nozzle exposure openings 111 are provided corresponding to the four head chips 12 of the liquid injection head 1. Hereinafter, the nozzle exposure opening 111 among the four nozzle exposure openings 111 provided on the mounting plate 11 that corresponds to the head chip 12 [j] is sometimes referred to as nozzle exposure opening 111 [j]. The nozzle exposure opening 111 [j] is an opening for exposing the plurality of nozzles N provided on the head chip 12 [j] towards the Z1 direction of the head unit HD.

[0083] It should be noted that, in this embodiment, as Figure 4 (and later) Figure 6 As shown, it is envisioned that the head chip 12 [2] and the nozzle exposure opening 111 [2] are provided in the region located in the X1 direction as viewed from the head chip 12 [1] and the nozzle exposure opening 111 [1]. Furthermore, in this embodiment, it is envisioned that the head chip 12 [3] and the nozzle exposure opening 111 [3] are provided in the region located in the direction between the X1 and Y1 directions as viewed from the head chip 12 [1] and the nozzle exposure opening 111 [1]. Furthermore, in this embodiment, it is envisioned that the head chip 12 [4] and the nozzle exposure opening 111 [4] are provided in the region located in the X1 direction as viewed from the head chip 12 [3] and the nozzle exposure opening 111 [3].

[0084] like Figure 5 As shown, each liquid injection head 1 is provided with two threaded holes AS1 and AS2 for fixing the support plate, and two positioning holes AB1 and AB2 for fixing the support plate.

[0085] Specifically, the liquid injection head 1-1 is provided with two threaded holes AS1-1 and AS2-1 for fixing the support plate, and two positioning holes AB1-1 and AB2-1 for fixing the support plate. Furthermore, the liquid injection head 1-2 is provided with two threaded holes AS1-2 and AS2-2 for fixing the support plate, and two positioning holes AB1-2 and AB2-2 for fixing the support plate.

[0086] like Figure 5As shown, head-fixing screws SH1 are inserted into the head-fixing threaded holes AH1 and AS1 corresponding to each liquid injection head 1, and head-fixing screws SH2 are inserted into the head-fixing threaded holes AH2 and AS2 corresponding to each liquid injection head 1. Furthermore, head-positioning pins SP1 are inserted into the head-positioning holes AP1 and AB1 corresponding to each liquid injection head 1, and head-positioning pins SP2 are inserted into the head-positioning holes AP2 and AB2 corresponding to each liquid injection head 1.

[0087] Specifically, a head-fixing screw SH1-1 is inserted into the head-fixing threaded hole AH1-1 and the support plate-fixing threaded hole AS1-1, which are provided corresponding to the liquid injection head 1-1; and a head-fixing screw SH2-1 is inserted into the head-fixing threaded hole AH2-1 and the support plate-fixing threaded hole AS2-1, which are provided corresponding to the liquid injection head 1-1. Furthermore, a head positioning pin SP1-1 is pressed into the head positioning hole AP1-1 and the support plate positioning hole AB1-1, which are provided corresponding to the liquid injection head 1-1; and a head positioning pin SP2-1 is pressed into the head positioning hole AP2-1 and the support plate positioning hole AB2-1, which are provided corresponding to the liquid injection head 1-1. Furthermore, a head-fixing screw SH1-2 is inserted into the head-fixing threaded hole AH1-2 and the support plate-fixing threaded hole AS1-2, which are provided corresponding to the liquid injection head 1-2; and a head-fixing screw SH2-2 is inserted into the head-fixing threaded hole AH2-2 and the support plate-fixing threaded hole AS2-2, which are provided corresponding to the liquid injection head 1-2. Additionally, a head positioning pin SP1-2 is pressed into the head positioning hole AP1-2 and the support plate positioning hole AB1-2, which are provided corresponding to the liquid injection head 1-2; and a head positioning pin SP2-2 is pressed into the head positioning hole AP2-2 and the support plate positioning hole AB2-2, which are provided corresponding to the liquid injection head 1-2.

[0088] like Figure 5 As shown, the flow path provided in each liquid injection head 1 is connected to the flow path provided in the common flow path component 41 via the connecting flow path RR inserted into the connecting flow path opening AR.

[0089] Furthermore, the electronic components mounted on each liquid injection head 1 are electrically connected to the electronic components mounted on the common electrical component 42 via a BtoB connector CN that is inserted into the electrical connection opening AC. Here, the electronic components mounted on the common electrical component 42 and the relay substrate 14 refer to wiring, capacitors, resistors, ICs, etc. Furthermore, the BtoB connector is also called a board-to-board connector. BtoB is short for Board to Board. A BtoB connector is a connector that directly connects two substrates without cables. In this embodiment, the BtoB connector is, for example, a so-called straight-insertion type where the mating surface of the connector is approximately parallel to the surface on the substrate where the connector is mounted. The BtoB connector CN is located on the Z1-oriented surface of the common electrical component 42. It should be noted that in this embodiment, the BtoB connector CN is inserted into the electrical connection opening AC, but this configuration is not limited to this. The BtoB connector 142 of the liquid injection head 1 may also be inserted into the electrical connection opening AC, or it may be a flexible substrate such as an FFC or a rigid substrate used for electrically connecting the common electrical component 42 and the relay substrate 14.

[0090] Specifically, the flow path in the liquid injection head 1-1 is connected to the flow path in the common flow path component 41 via multiple connecting flow paths RR-1 corresponding to multiple connecting flow path openings AR-1. Furthermore, the flow path in the liquid injection head 1-2 is connected to the flow path in the common flow path component 41 via multiple connecting flow paths RR-2 corresponding to multiple connecting flow path openings AR-2. Additionally, electronic components on the liquid injection head 1-1 are electrically connected to electronic components on the common electrical component 42 via a BtoB connector CN-1 inserted into the electrical connection opening AC-1. Furthermore, electronic components on the liquid injection head 1-2 are electrically connected to electronic components on the common electrical component 42 via a BtoB connector CN-2 inserted into the electrical connection opening AC-2.

[0091] like Figure 5 As shown, a frame fixing screw SM is inserted into the frame fixing threaded hole AM ​​corresponding to each liquid injection head 1, and a frame positioning pin SQ is inserted into the frame positioning hole AQ corresponding to each liquid injection head 1.

[0092] Specifically, a frame fixing screw SM-1 is inserted into the frame fixing threaded hole AM-1 corresponding to the liquid injection head 1-1, and a frame positioning pin SQ-1 is inserted into the frame positioning hole AQ-1 corresponding to the liquid injection head 1-1. Furthermore, a frame fixing screw SM-2 is inserted into the frame fixing threaded hole AM-2 corresponding to the liquid injection head 1-2, and a frame positioning pin SQ-2 is inserted into the frame positioning hole AQ-2 corresponding to the liquid injection head 1-2.

[0093] It should be noted that, in this embodiment, as Figure 3 As shown, the head fixing threaded hole AH, the head positioning hole AP, the frame fixing threaded hole AM, and the frame positioning hole AQ are arranged in a straight line in the Y-axis direction, thus suppressing the size of the liquid injection head 1 in the X-axis direction.

[0094] Furthermore, in this embodiment, such as Figure 3 As shown, the frame fixing threaded hole AM-1 and the frame positioning hole AQ-1 are arranged diagonally on the flat plate 51 along with the frame fixing threaded hole AM-2 and the frame positioning hole AQ-2. Therefore, for example, compared with the arrangement of closely spaced components, the positioning accuracy of the support member 5 relative to the main frame 900 is improved.

[0095] Furthermore, in this embodiment, such as Figure 3 As shown, the threaded hole AH1 for head fixing and the head positioning hole AP1 are arranged diagonally relative to the liquid injection head 1, as are the threaded hole AH2 for head fixing and the head positioning hole AP2. Therefore, for example, compared with the arrangement of close proximity, the positioning accuracy of the liquid injection head 1 relative to the support member 5 is improved.

[0096] Furthermore, in this embodiment, such as Figure 5 As shown, the head positioning pin SP and the frame positioning pin SQ are disposed on the same side of the plate portion 51 (the lower side P511 described later). Therefore, compared with the solution where they are disposed on opposite sides of the plate portion 51, the positioning accuracy of the liquid injection head 1 relative to the main frame 900 can be improved.

[0097] A.3. Composition of Liquid Injector Head 1

[0098] Below, refer to Figures 6 to 9 The general structure of the liquid injection head 1 will be described below.

[0099] Figure 6 This is an exploded perspective view of liquid injection head 1. Figure 7 For along Figure 4 The cross-sectional view is obtained by cutting along line II-ii, which includes the head unit HD of liquid injection head 1-1 and liquid injection head 1-2. Figure 8 For along Figure 4 The cross-sectional view is obtained by cutting the head unit HD of the liquid injection head 1 along line III-iii. Figure 9 For along Figure 4 The cross-sectional view is obtained by cutting along line IV-iv, including the head unit HD of the liquid injection head 1.

[0100] like Figure 6As shown, the liquid injection head 1 includes a fixing plate 11, head chips 12[1]~12[4], a holder 13, a relay substrate 14, a substrate cover 15, and a filter unit 16. The holder 13 includes a lower holder 131, a middle holder 132, and two upper holders 133A and 133B. Furthermore, the filter unit 16 includes a lower filter unit 161 and an upper filter unit 162.

[0101] like Figure 6 As shown, the fixing plate 11 is a plate-shaped component that is relatively long in the X-axis direction, and is made of metal, for example. As described above, four nozzle exposure openings 111[1] to 111[4] are provided on the fixing plate 11. The nozzle exposure opening 111[j] is an opening for exposing the plurality of nozzles N of the head chip 12[j] to the lower side of the fixing plate 11. In this embodiment, as described above, in the fixing plate 11, the nozzle exposure opening 111[2] is provided in the region located in the X1 direction as viewed from the nozzle exposure opening 111[1], the nozzle exposure opening 111[3] is provided in the region located in the direction between the X1 direction and the Y1 direction as viewed from the nozzle exposure opening 111[1], and the nozzle exposure opening 111[4] is provided in the region located in the X1 direction as viewed from the nozzle exposure opening 111[3].

[0102] like Figure 7 As shown, the fixing plate 11 is electrically connected to the flat plate portion 51 of the support member 5 via the grounding spring 59.

[0103] like Figures 6 to 9 As shown, head chips 12[1]~12[4] are provided on the upper side of the fixing plate 11. Specifically, in this embodiment, multiple head chips 12 are fixed to the upper surface of the fixing plate 11 by an adhesive. It should be noted that, as described above, in the fixing plate 11, head chips 12[2] are fixed in the region located in the X1 direction from the head chip 12[1], head chips 12[3] are fixed in the region located in the direction between the X1 direction and the Y1 direction from the head chip 12[1], and head chips 12[4] are fixed in the region located in the X1 direction from the head chip 12[3].

[0104] like Figure 6 As shown, the head chip 12 has an ejection surface MF with multiple nozzles N for ejecting ink in the Z1 direction (see reference). Figure 18Furthermore, the wiring circuit board 120 is connected to the head chip 12. The wiring circuit board 120 is, for example, an FPC (Flexible Printed Circuit), configured to extend in the Z2 direction from the upper side of the head chip 12. In this embodiment, a drive control circuit 121 is mounted on the wiring circuit board 120. The drive control circuit 121 is a circuit for driving the head chip 12 based on the control signal SI by supplying a drive signal Com to the head chip 12 based on the control signal SI.

[0105] like Figures 6 to 9 As shown, a lower retainer 131 is provided on the upper side of the head chips 12[1]~12[4]. Specifically, in this embodiment, the lower retainer 131 is fixed to the fixing plate 11 by adhesive to hold the head chips 12[1]~12[4] between the lower retainer 131 and the fixing plate 11. The lower retainer 131 is a component that is longer in the X-axis direction, and is made of resin or metal, for example. Four wiring openings 131K[1]~131K[4] corresponding to the four head chips 12[1]~12[4] are provided on the lower retainer 131. The wiring circuit board 120[j] is inserted through the wiring opening 131K[j]. In addition, notches KKA and KKB are provided on the lower retainer 131. The notch KKA is a recess in the Y1 direction located between the wiring opening 131K[1] and the wiring opening 131K[2], on the end face of the lower retainer 131 in the Y2 direction. The notch KKB is a recess in the Y2 direction located between the wiring opening 131K[3] and the wiring opening 131K[4], on the end face of the lower retainer 131 in the Y1 direction. Hereinafter, the notch KKA and the notch KKB are sometimes collectively referred to as the notch KK.

[0106] like Figures 6 to 9 As shown, an intermediate retainer 132 is provided on the upper side of the lower retainer 131. Specifically, in this embodiment, the intermediate retainer 132 is fixed to the upper surface of the lower retainer 131 by an adhesive. The intermediate retainer 132 is a component that is longer in the X-axis direction, and is made of resin or metal, for example. Four wiring openings 132K[1] to 132K[4] corresponding to the four head chips 12[1] to 12[4] are provided on the intermediate retainer 132. The wiring circuit board 120[j] is inserted into the wiring opening 132K[j]. Hereinafter, the wiring opening 131K[j] and the wiring opening 132K[j] will be referred to as the wiring opening 130K[j].

[0107] like Figures 6 to 9As shown, a relay substrate 14 is disposed on the upper side of the intermediate retainer 132. Specifically, in this embodiment, the relay substrate 14 is fixed to the upper surface of the intermediate retainer 132 by an adhesive. The relay substrate 14 is a component that is relatively long in the X-axis direction, and various electronic components are mounted on a resin substrate, for example.

[0108] like Figure 8 and Figure 9 As shown, four wiring circuit boards 120[1]~120[4] are connected to the relay board 14. That is, the relay board 14 is electrically connected to the head chip 12[j] via the wiring circuit board 120[j]. In addition, a BtoB connector 142 is provided on the relay board 14. The BtoB connector 142 is configured to extend from the upper side of the relay board 14 in the Z2 direction and connect to the BtoB connector CN. That is, the relay board 14 is electrically connected to the common electrical component 42 via the BtoB connector 142 and the BtoB connector CN. It should be noted that the structural details of the relay board 14 will be discussed later. Figure 17 As described in the text.

[0109] like Figure 6 as well as Figure 8 and Figure 9 As shown, an upper retainer 133 is provided on the upper side of the intermediate retainer 132. Specifically, in this embodiment, the upper retainer 133 is fixed to the upper surface of the intermediate retainer 132 by an adhesive. More specifically, the upper retainer 133A is fixed to the upper surface of the intermediate retainer 132 at a position above the notch KKA. Furthermore, the upper retainer 133B is fixed to the upper surface of the intermediate retainer 132 at a position above the notch KKB. The upper retainer 133 is a component that is longer in the X-axis direction, and is made of, for example, resin or metal.

[0110] like Figure 8 and Figure 9 As shown, in the retainer 13, which includes a lower retainer 131, a middle retainer 132, and an upper retainer 133, multiple supply flow paths Q are provided for supplying ink to the four head chips 12[1]~12[4] of the liquid ejector head 1. In this embodiment, it is envisioned that the four head chips 12[1]~12[4] of the liquid ejector head 1 are supplied with ink using the four supply flow paths Q. Hereinafter, the u-th supply flow path Q of the four supply flow paths Q will be referred to as supply flow path Q(u). Here, the variable u is a natural number that satisfies 1≤u≤4. Details about the supply flow path Q will be discussed later. Figure 19 and Figure 20 As described in the text.

[0111] like Figures 6 to 9As shown, a substrate cover 15 is provided on the upper side of the upper retainer 133 and the relay substrate 14. Specifically, in this embodiment, the substrate cover 15 can be fixed to the upper surface of the intermediate retainer 132 by adhesive, or it can be detachably fixed to the intermediate retainer 132 by snap-fit. The substrate cover 15 is a component that is relatively long in the X-axis direction, and is made of, for example, resin or metal.

[0112] like Figures 6 to 9 As shown, a filter unit 16 is provided on the upper side of the substrate cover 15. Figure 7 As shown, in this embodiment, the filter unit 16 is fixed to the substrate cover 15 by filter fixing screws 61 and nuts 62. Figure 6 and Figure 7 As shown, the filter unit 16 includes a lower filter unit 161 and an upper filter unit 162 disposed on the upper side of the lower filter unit 161.

[0113] The lower filter unit 161 is a component that is relatively long in the X-axis direction, and is made of resin, for example. A flow path communicating with the supply flow path Q is provided in the lower filter unit 161. Furthermore, an electrical connection opening 161K is provided on the lower filter unit 161. A BtoB connector 142 is inserted into the electrical connection opening 161K.

[0114] The upper filter unit 162 is a component that is relatively long in the X-axis direction, and is made of, for example, resin. The upper filter unit 162 is provided with a connecting flow path RR and a flow path communicating with the connecting flow path RR. Figure 6 , 8 As shown in Figure 11, the connecting flow path RR is formed inside a flow path tube that protrudes in the Z2 direction from the upper surface of the upper filter unit 162. The flow path provided in the upper filter unit 162 communicates with the flow path provided in the lower filter unit 161. Furthermore, an electrical connection opening 162K is provided on the upper filter unit 162. A BtoB connector 142 is inserted into the electrical connection opening 162K. Hereinafter, the electrical connection openings 161K and 162K will be referred to as the electrical connection opening 160K. It should be noted that the connecting flow path RR, which is inserted into the connecting flow path opening AR, can be formed inside a flow path tube that protrudes in the Z1 direction from the lower surface of the common flow path component 41, or it can be formed inside a flexible tube for liquid-tight connection between the common flow path component 41 and the liquid injection head 1.

[0115] It should be noted that filter unit 16 is provided with a filter chamber FT containing filter FF (see below). Figure 11 and Figure 12The filter chamber FT is connected to the connecting flow path RR and the supply flow path Q. The filter FF is configured to remove air bubbles and foreign matter contained in the ink supplied from the liquid container 93 via the connecting flow path RR. The ink supplied from the liquid container 93 via the connecting flow path RR has air bubbles and foreign matter removed in the filter FF provided in the filter chamber FT and is then supplied to the supply flow path Q.

[0116] like Figure 8 and Figure 9 As shown, the flat plate portion 51 is provided on the upper side of the filter unit 16 included in the liquid injection head 1. In addition, the bent portion 52 is provided in the region located in the Y1 direction as viewed from the filter unit 16 and in the region located in the Y2 direction as viewed from the filter unit 16.

[0117] It should be noted that, below, the components of the liquid injection head 1 located on the upper side of the lower retainer 131, namely the intermediate retainer 132, the upper retainer 133, the relay substrate 14, the substrate cover 15, and the filter unit 16, are sometimes referred to as the laminated structure 55.

[0118] A.4. Relationship between liquid injection head 1 and support component 5

[0119] Below, refer to Figures 10 to 16 The positional relationship between the liquid injection head 1 and the support component 5 is explained.

[0120] A.4.1. Composition of liquid injection head 1 and support component 5

[0121] Figure 10 This is a schematic diagram showing the cross-section obtained by using a planar section head element HD with the Y-axis as the normal direction. Figure 11 This is a cross-sectional view obtained by using a planar sectioning head element HD that is fixed by a threaded hole AS through a support plate and has the Y-axis direction as the normal direction. Figure 12 This is a cross-sectional view obtained using a planar cutting head element HD that passes through the positioning hole AB of the support plate and takes the Y-axis direction as the normal direction.

[0122] like Figures 10 to 12 As shown above, the head unit HD includes a fixing plate 11 on which the head chip 12 is fixed, a lower retainer 131 on which the head chip 12 is housed and fixed to the fixing plate 11, a stacked structure 55 stacked on the lower retainer 131, and a flat plate portion 51 fixed on the lower retainer 131.

[0123] The lower retainer 131 has a mounting surface PS13. The mounting surface PS13 is a surface with the Z2 direction as its normal direction, and is used to mount the stacked structure 55. In this embodiment, the stacked structure 55 is stacked on the mounting surface PS13 with the Z2 direction facing it.

[0124] Furthermore, the lower retainer 131 includes a storage portion 131S and a protrusion 131T. The storage portion 131S and the protrusion 131T are integrally formed by injection molding or the like using a mold, and are not constructed by fixing separate parts together through bonding or joining.

[0125] The storage section 131S is the portion of the lower retainer 131 located lower than the mounting surface PS13, and has a portion that overlaps with the head chip 12 when viewed in the X-axis direction. The storage section 131S accommodates the head chip 12 between the storage section 131S and the fixing plate 11.

[0126] The protrusion 131T is the portion of the lower retainer 131 located above the mounting surface PS13, and has a portion that overlaps with the laminated structure 55 when viewed in the X-axis direction. Furthermore, the protrusion 131T has a contact surface PT13. The contact surface PT13 is a surface with the Z2 direction as its normal direction, and is the end surface of the protrusion 131T located in the Z2 direction. The contact surface PT13 contacts the flat plate portion 51. It should be noted that, hereinafter, among the surfaces of the flat plate portion 51, the surface on the lower side of the flat plate portion 51 with the Z1 direction as its normal direction will be referred to as the lower surface P511, and the surface on the upper side of the flat plate portion 51 with the Z2 direction as its normal direction will be referred to as the upper surface P512. The contact surface PT13 contacts the lower surface P511.

[0127] The stacked structure 55 has an opposing portion BT and a non-opposite portion BH.

[0128] The opposing portion BT is the part of the stacked structure 55 that faces the lower side surface P511 of the flat plate portion 51. In other words, the opposing portion BT is the part that overlaps with the flat plate portion 51 when the stacked structure 55 is viewed from above in the Z1 direction.

[0129] The non-opposing portion BH is the part of the laminated structure 55 that does not oppose the lower side surface P511 of the flat plate portion 51. Specifically, the non-opposing portion BH is the part that overlaps with the openings such as the electrical connection opening AC and the connection flow path opening AR provided on the flat plate portion 51 when the laminated structure 55 is viewed from above in the Z1 direction.

[0130] It should be noted that, in this embodiment, when the observation head unit HD is viewed from above in the Z1 direction, the area of ​​the opposing portion BT in the stacked structure 55 is larger than the area of ​​the non-opposing portion BH. Furthermore, in this embodiment, when the observation head unit HD is viewed from above in the Z1 direction, the areas of the multiple openings provided on the flat plate portion 51, such as the electrical connection opening AC and the connection flow path opening AR, are each smaller than the area of ​​the spray surface MF of the head chip 12.

[0131] As described above, a head positioning hole AP is provided on the flat plate portion 51. Furthermore, a support plate positioning hole AB is provided on the protrusion 131T. Therefore, by pressing the head positioning pin SP into the head positioning hole AP and the support plate positioning hole AB, the lower retainer 131 is positioned relative to the support member 5. This positions the head chip 12 relative to the support member 5.

[0132] Furthermore, as described above, a head-fixing threaded hole AH is provided on the flat plate portion 51. Additionally, a support plate-fixing threaded hole AS is provided on the protrusion 131T. Therefore, by inserting the head-fixing screw SH into the head-fixing threaded hole AH and the support plate-fixing threaded hole AS, the support member 5 is fixed to the lower retainer 131. Thus, the liquid injection head 1 is fixed relative to the support member 5.

[0133] It is important to note that, such as Figure 10 As shown, the position of the end of the protrusion 131T in the X1 direction in the X-axis direction is called position XT13. The position of the end of the receiving portion 131S in the X1 direction in the X-axis direction is called position XS13. The position of the end of the head chip 12[4] disposed in the X1 direction among the plurality of head chips 12 in the X1 direction in the X-axis direction is called position X12. It should be noted that Figure 10 The head chip 12 in the diagram schematically refers to the head chip 12[4]. In this case, in the X-axis direction, position XS13 is located between position XT13 and position X12. That is, in the X-axis direction, the end of the receiving portion 131S in the X1 direction is located between the end of the protrusion 131T in the X1 direction and the end of the head chip 12 in the X1 direction. Similarly, in the X-axis direction, the end of the receiving portion 131S in the X2 direction is located between the end of the protrusion 131T in the X2 direction and the end of the head chip 12[1] disposed at the end in the X2 direction among the plurality of head chips 12.

[0134] Thus, according to this embodiment, in the X-axis direction, the protrusion 131T has a shape that extends further outward than the receiving portion 131S. Therefore, according to this embodiment, for example, compared to a solution where the protrusion 131T has a shape that narrows further inward than the receiving portion 131S in the X-axis direction, the size of the stacked structure 55 disposed in the middle of the protrusion 131T can be increased.

[0135] A.4.2. Comparative Example

[0136] Below, to clarify the advantages of this embodiment, refer to Figure 13 and Figure 14 The head unit involved in the comparative example will be explained.

[0137] Figure 13This is a schematic diagram showing the cross-section of the head unit HD-W1 involved in the comparative example W1.

[0138] like Figure 13 As shown, the head unit HD-W1 involved in comparative example W1 differs from the head unit HD involved in this embodiment in that: it has a flat plate portion 51-W1 instead of the flat plate portion 51; and it has a lower retainer 131-W1 instead of the lower retainer 131.

[0139] A support plate positioning hole AB-W1 is provided on the lower retainer 131-W1. In addition, the laminated structure 55 is laminated on the upper side of the lower retainer 131-W1 facing the Z2 direction.

[0140] The flat plate portion 51-W1 is provided with a head positioning hole AP-W1 and an opening A-W1. Here, the opening A-W1 is an opening for inserting part or all of the head chip 12, which includes the spray surface MF of the head chip 12, from the upper side to the lower side.

[0141] Therefore, in comparative example W1, the lower retainer 131-W1 is positioned relative to the flat plate portion 51-W1 by pressing the head positioning pin SP into the head positioning hole AP-W1 and the support plate positioning hole AB-W1.

[0142] Thus, in Comparative Example W1, an opening A-W1 for the insertion of the spray surface MF is provided on the flat plate portion 51-W1. When viewed from above in the Z1 direction, the opening A-W1 has an area larger than the spray surface MF of the head chip 12. Therefore, in Comparative Example W1, the flat plate portion 51-W1 may not be able to ensure sufficient rigidity to support the liquid spray head including the head chip 12, the lower retainer 131-W1, and the stacked structure 55. This is particularly evident when the flat plate portion 51-W1 is made of a metal plate.

[0143] In this embodiment, when viewed from above in the Z1 direction, the area of ​​each opening provided on the flat plate portion 51 is smaller than the area of ​​the spray surface MF. Furthermore, according to this embodiment, when viewed from above in the Z1 direction, the area of ​​the opposing portion BT is smaller than the area of ​​the non-opposing portion BH. Therefore, in the flat plate portion 51, when viewed from above in the Z1 direction, the total area of ​​the openings provided on the portions overlapping with the laminated structure 55 is smaller than the total area of ​​the portions without openings. Therefore, according to this embodiment, compared to comparative example W1, the rigidity of the flat plate portion 51 can be improved.

[0144] Figure 14 This is a schematic diagram showing the cross-section of the head unit HD-W2 involved in the comparative example W2.

[0145] like Figure 14As shown, the head unit HD-W2 in comparative example W2 differs from the head unit HD in this embodiment in that: it has a flat plate portion 51-W2 instead of the flat plate portion 51; it has a lower retainer 131-W2 instead of the lower retainer 131; and it has a stacked structure 55-W2 instead of the stacked structure 55.

[0146] The stacked structure 55-W2 is stacked on the upper side of the lower retainer 131-W2 in the Z2 direction. The difference between the lower retainer 131-W2 and the lower retainer 131 in this embodiment is that it does not contact the flat plate portion 51-W2.

[0147] The difference between the stacked structure 55-W2 and the stacked structure 55 involved in this embodiment is that the stacked structure 55-W2 is provided with a support plate positioning hole AB-W2.

[0148] The flat plate portion 51-W2 is provided with a head positioning hole AP-W2, multiple electrical connection openings AC, and multiple connection flow path openings AR. In other words, the difference between the flat plate portion 51-W2 and the flat plate portion 51 according to this embodiment is that the head positioning hole AP-W2 is provided instead of the head positioning hole AP.

[0149] Therefore, by pressing the head positioning pin SP into the head positioning hole AP-W2 and the support plate positioning hole AB-W2, the stacked structure 55-W2 and the lower retainer 131-W2 are positioned relative to the flat plate portion 51-W2.

[0150] It should be noted that, according to Comparative Example W2, when viewed from above in the Z1 direction, the area of ​​each opening provided on the flat plate portion 51-W2 is smaller than the area of ​​the spray surface MF. Furthermore, according to Comparative Example W2, when viewed from above in the Z1 direction, the total area of ​​the openings provided on the portion of the flat plate portion 51-W2 that overlaps with the laminated structure 55-W2 is smaller than the total area of ​​the portion without openings. Therefore, according to Comparative Example W2, the rigidity of the flat plate portion 51-W2 can be improved compared to Comparative Example W1.

[0151] However, in Comparative Example W2, the stacked structure 55-W2 is located between the flat plate portion 51-W2 and the lower retainer 131-W2. Therefore, according to Comparative Example W2, compared with Comparative Example W1, there is a problem that the positioning accuracy of the head chip 12 relative to the flat plate portion 51-W2 cannot be improved.

[0152] In this embodiment, the flat plate portion 51 directly contacts the protrusion 131T of the lower retainer 131. Therefore, according to this embodiment, the positioning accuracy of the head chip 12 relative to the flat plate portion 51 can be improved compared to Comparative Example W2. Thus, according to this embodiment, compared to Comparative Examples W1 and W2, it is easier to balance ensuring the rigidity of the flat plate portion 51 and ensuring the positioning accuracy of the head chip 12 relative to the flat plate portion 51.

[0153] A.4.3. Variation Example

[0154] Below, refer to Figure 15 and Figure 16 The following describes two variations, B1 and B2, in which the lower retainer 131 of the head unit HD in this embodiment is changed to other solutions.

[0155] Figure 15 This is a schematic diagram showing the cross-section of the head element HD-B1 involved in variant B1.

[0156] like Figure 15 As shown, the head unit HD-B1 in Modified Example B1 differs from the head unit HD in this embodiment in that it has a lower retainer 131-B1 instead of the lower retainer 131, and it does not have a fixing plate 11. The lower retainer 131-B1 differs from the lower retainer 131 in this embodiment in that it has a storage portion 131S-B1 instead of the storage portion 131S. The storage portion 131S-B1 has a shape that combines the storage portion 131S and the fixing plate 11. Thus, in Modified Example B1, a plurality of head chips 12 are fixed to the storage portion 131S-B1 in a mutually aligned state.

[0157] According to Modification B1, similar to this embodiment, it is easy to balance ensuring the rigidity of the flat plate portion 51 and ensuring the positioning accuracy of the head chip 12 relative to the flat plate portion 51. Furthermore, according to Modification B1, since the head unit HD-B1 does not have a fixing plate 11, the number of components in the head unit HD-B1 can be reduced.

[0158] Figure 16 A schematic diagram showing the cross-section of the head unit HD-B2 involved in variant B2.

[0159] like Figure 16As shown, the head unit HD-B2 in variant B2 differs from the head unit HD in this embodiment in that it has a lower retainer 131-B2 instead of the lower retainer 131. The lower retainer 131-B2 differs from the lower retainer 131 in this embodiment in that it has a storage portion 131S-B2 instead of the storage portion 131S. The storage portion 131S-B2 differs from the storage portion 131S in this embodiment in that the plurality of head chips 12 are fixed in a mutually aligned state.

[0160] It is important to note that, in Figure 16 The example shown illustrates a configuration where the head chip 12 is fixed to both the fixing plate 11 and the storage section 131S-B2, but variation B2 is not limited to this configuration. The head chip 12 may also be fixed only to the storage section 131S-B2. In this case, the fixing plate 11 may also be fixed only to the storage section 131S-B2.

[0161] According to variation B2, similar to this embodiment, it is easy to balance ensuring the rigidity of the flat plate portion 51 and ensuring the positioning accuracy of the head chip 12 relative to the flat plate portion 51.

[0162] A.5. Relay substrate 14

[0163] Below, refer to Figure 17 The relay substrate 14 will be described.

[0164] Figure 17 This is a perspective view of the components including the relay substrate 14, the lower holder 131, the middle holder 132, and the upper holder 133.

[0165] like Figure 17 As shown, on the upper surface of the relay substrate 14, the relay substrate 14 is provided with drive wiring connection connectors 141[1]~141[4] corresponding to the four wiring circuit substrates 120[1]~120[4] and a BtoB connector 142 corresponding to the BtoB connector CN. The wiring circuit substrate 120[j] is connected to the drive wiring connection connector 141[j]. The BtoB connector CN is connected to the BtoB connector 142.

[0166] like Figure 17As shown, when the relay substrate 14 is viewed from above in the Z1 direction, the BtoB connector 142 is disposed in the region between the drive wiring connector 141[1] and the drive wiring connector 141[2], and between the drive wiring connector 141[3] and the drive wiring connector 141[4], in the X-axis direction, and in the region between the drive wiring connector 141[1] and the drive wiring connector 141[2] and the drive wiring connector 141[3] and the drive wiring connector 141[4] in the Y-axis direction. That is, when the relay substrate 14 is viewed from above in the Z1 direction, the BtoB connector 142 is disposed inside the four drive wiring connectors 141[1] to 141[4]. More specifically, when the relay substrate 14 is viewed from above in the Z1 direction, the BtoB connector 142 may also be disposed in the center or center of the four drive wiring connectors 141[1] to 141[4].

[0167] It should be noted that the drive wiring connector 141[j] and the BtoB connector 142 are electrically connected by wiring that is not shown in the figure. Therefore, the relay board 14 electrically connects the wiring circuit board 120[j] connected to the drive wiring connector 141[j] and the BtoB connector CN connected to the BtoB connector 142.

[0168] Thus, according to this embodiment, since the BtoB connector 142 is disposed in the center of the four drive wiring connectors 141[1] to 141[4], the path length of the wiring between the BtoB connector 142 and each drive wiring connector 141[j] can be shortened, for example, compared to a scheme in which the BtoB connector 142 is disposed on the outside of the four drive wiring connectors 141[1] to 141[4]. Therefore, according to this embodiment, the possibility of noise superimposed on the signal flowing in the wiring provided on the relay substrate 14 can be reduced.

[0169] A.6. Supply Flow Path Q

[0170] Below, refer to Figures 18 to 28 The supply flow path Q is explained.

[0171] A.6.1. Summary of the supply flow path Q

[0172] First, refer to Figures 18 to 21 An overview of the nozzle N from which ink is supplied from the supply flow path Q and an overview of the supply flow path Q are provided.

[0173] Figure 18 This is a top view of the liquid jet head 1 when viewed from above in the Z2 direction.

[0174] like Figure 18 As shown, the liquid injection head 1 has multiple nozzle rows LL. Here, a nozzle row LL refers to a collection of multiple nozzles N. In this embodiment, it is envisioned that the nozzle rows LL consist of a predetermined number of nozzles N arranged in the X-axis direction. Furthermore, in this embodiment, it is envisioned that each of the four head chips 12[1] to 12[4] provided in the liquid injection head 1 has two nozzle rows LL. That is, in this embodiment, it is envisioned that eight nozzle rows LL are provided in the liquid injection head 1.

[0175] Hereinafter, the two rows of nozzles LL disposed on the head chip 12[j] will be referred to as nozzle row LLa[j] and nozzle row LLb[j]. When the liquid injection head 1 is viewed in the Z2 direction, nozzle row LLa[j] and nozzle row LLb[j] are configured to protrude from the nozzle exposure opening 111[j] in the Z1 direction. Furthermore, from the perspective of nozzle row LLa[j], nozzle row LLb[j] is disposed in the Y1 direction.

[0176] It is important to note that, such as Figure 18 As shown, when the liquid jet head 1 is viewed from above in the Z2 direction, the surface in the head chip 12 where the nozzle array LL is formed is called the nozzle forming surface MN. Furthermore, the lower surface in the fixing plate 11 is called the medium opposing surface MK. The jetting surface MF is the surface that includes both the nozzle forming surface MN and the medium opposing surface MK.

[0177] In addition, such as Figure 18 As shown, when the liquid injection head 1 is viewed from above in the Z2 direction, a notch KKA is provided between the nozzle exposure opening 111[1] and the nozzle exposure opening 111[2]. A media suppression mechanism GZA is disposed in the notch KKA. The media suppression mechanism GZA is a component used to suppress the medium PP conveyed by the conveying mechanism 91 in the Y1 direction from leaving the conveying path. Specifically, the media suppression mechanism GZA suppresses the medium PP from leaving the conveying path by applying force to the medium PP in the Z1 direction.

[0178] Furthermore, when the liquid injection head 1 is viewed from above in the Z2 direction, a notch KKB is provided between the nozzle exposure opening 111[3] and the nozzle exposure opening 111[4]. A media suppression mechanism GZB is disposed in the notch KKB. The media suppression mechanism GZB has the same configuration as the media suppression mechanism GZA, and suppresses the medium PP conveyed by the conveying mechanism 91 in the Y1 direction from leaving the conveying path of the medium PP. It should be noted that, below, the media suppression mechanism GZA and the media suppression mechanism GZB are sometimes collectively referred to as the media suppression mechanism GZ.

[0179] In addition, such as Figure 18As shown, two fixing plate openings 77, including fixing plate opening 77A and fixing plate opening 77B, are provided on the fixing plate 11. The fixing plate opening 77A is provided between the nozzle exposure opening 111[1] and the nozzle exposure opening 111[3]. In addition, the fixing plate opening 77B is provided between the nozzle exposure opening 111[2] and the nozzle exposure opening 111[4].

[0180] The fixing plate opening 77 is an opening through which a positioning pin (not shown) provided in a fixture is inserted when the head chip 12 is fixed relative to the fixing plate 11 during the manufacturing process of the head unit HD. When the head chip 12 is fixed relative to the fixing plate 11, the fixing plate 11 is positioned relative to the fixture by inserting the positioning pin of the fixture into the fixing plate opening 77. Thus, with the positioning pin of the fixture inserted into the fixing plate opening 77, the head chip 12 is fixed relative to the fixing plate 11, thereby enabling accurate positioning between multiple head chips 12 with the fixing plate 11 as a reference.

[0181] Figure 19 This is a schematic diagram showing the relationship between the four supply flow paths Q(1)~Q(4) provided in the liquid injection head 1 and the eight rows of nozzles LL provided on the liquid injection head 1.

[0182] like Figure 19 As shown, the liquid jet head 1 has four supply flow paths Q (1) to Q (4) of the system. Furthermore, the liquid jet head 1 has four filter chambers FT (1) to FT (4) corresponding to the four supply flow paths Q (1) to Q (4). Supply flow path Q (u) is connected to filter chamber FT (u). Hereinafter, the connecting flow path RR connected to filter chamber FT (u) is sometimes referred to as connecting flow path RR (u). Ink is supplied to filter chamber FT (u) from the flow path provided in the common flow path component 41 via connecting flow path RR (u).

[0183] like Figure 19 As shown, the supply flow path Q(1) supplies ink supplied from the connecting flow path RR(1) via the filter chamber FT(1) to the nozzle array LLa[1] and the nozzle array LLa[2].

[0184] The supply flow path Q(2) supplies ink from the connecting flow path RR(2) via the filter chamber FT(2) to the nozzle array LLb[1] and the nozzle array LLb[2].

[0185] The supply flow path Q(3) supplies ink from the connecting flow path RR(3) via the filter chamber FT(3) to the nozzle line LLa[3] and the nozzle line LLa[4].

[0186] The supply flow path Q(4) supplies ink from the connecting flow path RR(4) via the filter chamber FT(4) to the nozzle array LLb[3] and the nozzle array LLb[4].

[0187] Figure 20 This is a schematic diagram illustrating the configuration of the supply flow path Q. It should be noted that, as an example, in... Figure 20 The supply flow path Q(1) is shown in the figure.

[0188] like Figure 20 As shown, the supply flow path Q has an inlet flow path Q0, a distribution flow path Q1, and a distribution flow path Q2.

[0189] The inlet flow path Q0 is a flow path used to supply ink introduced from the filter chamber FT(1) to the branch position GB. Specifically, the inlet flow path Q0 is a flow path that extends in the upper retainer 133 along the Z1 direction and reaches the branch position GB. Here, the branch position GB refers to the position where the inlet flow path Q0 branches into the distribution flow path Q1 and the distribution flow path Q2.

[0190] The distribution flow path Q1 is a flow path located further downstream than the branch position GB, and is used to supply ink introduced from the inlet flow path Q0 to the branch position GB to the nozzle array LLa[1]. Specifically, the distribution flow path Q1 connects the inlet flow path Q0 to the head chip 12[1]. More specifically, the distribution flow path Q1 connects to the inlet flow path Q0 at the branch position GB, and also connects to the in-chip flow path provided in the head chip 12[1] for supplying ink to the nozzle array LLa[1].

[0191] like Figure 20 As shown, the distribution flow path Q1 has a portion extending from the branch position GB in the Z1 direction between the intermediate retainer 132 and the lower retainer 131, and a portion extending in the X2 direction between the lower retainer 131 and the intermediate retainer 132.

[0192] It should be noted that, below, the portion of the inlet flow path Q0 and the distribution flow path Q1 that extends along the Z1 direction in the upper retainer 133, the intermediate retainer 132 and the lower retainer 131 is sometimes referred to as the extension flow path QR1.

[0193] Furthermore, the portion of the distribution flow path Q1 extending along the X2 direction between the lower retainer 131 and the intermediate retainer 132 is sometimes referred to as the separate flow path QK1. That is, the separate flow path QK1 is a flow path that is connected to the end of the extended flow path QR1 in the Z1 direction, extends in the X2 direction, and is separately connected to the nozzle array LLa[1].

[0194] The distribution path Q2 is a path located further downstream than the branch position GB, and is used to supply ink introduced from the inlet path Q0 to the branch position GB to the nozzle array LLa[2]. Specifically, the distribution path Q2 connects the inlet path Q0 to the head chip 12[2]. More specifically, the distribution path Q2 connects to the inlet path Q0 at the branch position GB, and also connects to the in-chip flow path provided in the head chip 12[2] for supplying ink to the nozzle array LLa[2].

[0195] like Figure 20 As shown, the distribution flow path Q2 includes a portion extending between the upper retainer 133 and the intermediate retainer 132 along the X1 direction, a portion extending in the intermediate retainer 132 along the Z1 direction, and a portion extending between the lower retainer 131 and the intermediate retainer 132 along the X1 direction.

[0196] It should be noted that, below, the portion of the distribution flow path Q2 extending along the X1 direction between the upper retainer 133 and the intermediate retainer 132 is sometimes referred to as the separate flow path QK2. That is, the separate flow path QK2 is a flow path that connects to the extension flow path QR1 at the branch position GB, extends in the X1 direction, and is separately connected to the nozzle array LLA[2].

[0197] Furthermore, the portion of the distribution flow path Q2 that extends along the X1 direction between the lower retainer 131 and the intermediate retainer 132 is sometimes referred to as the extended flow path QR2.

[0198] like Figure 20 As shown, on the lower retainer 131, a notch KK is provided at a position where it overlaps with the individual flow path QK2 when viewed from above in the Z1 direction, between the individual flow path QK1 and the extended flow path QR2. Furthermore, on the intermediate retainer 132, a recess 132u is provided at a position where it overlaps with both the individual flow path QK2 and the notch KK when viewed from above in the Z1 direction, and is recessed in the Z2 direction.

[0199] Thus, according to this embodiment, since the recess 132u is provided on the upper side of the notch KK, sufficient space can be ensured for arranging the media pressing mechanism GZ.

[0200] Furthermore, in this embodiment, as described below... Figure 21As shown, the shape of the supply flow path Q is determined such that the flow path length of the individual flow path QK2 is shorter than the flow path length of the individual flow path QK1 and shorter than the flow path length of the extended flow path QR2. Therefore, in this embodiment, the shape of the retainer 13 is determined such that, when viewed from above in the Z1 direction, the area of ​​the upper retainer 133 that is more inward than its outer periphery is smaller than the area of ​​the lower retainer 131 that is more inward than its outer periphery, and smaller than the area of ​​the middle retainer 132 that is more inward than its outer periphery. It should be noted that here, "the area of ​​an object that is more inward than its outer periphery when viewed from above in the Z1 direction" refers to the total area of ​​the object when viewed from above in the Z1 direction, plus the area of ​​any openings provided on the object.

[0201] Thus, in this embodiment, by defining the shape of the supply flow path Q such that the flow path length of the individual flow path QK2 is relatively short, the area of ​​the upper retainer 133 defining the upper side of the individual flow path QK2 can be reduced. Therefore, according to this embodiment, compared to the case where the flow path length of the individual flow path QK2 is longer than the flow path length of the individual flow path QK1 or the flow path length of the extended flow path QR2, and the area of ​​the upper retainer 133 is larger than the area of ​​the lower retainer 131 or the area of ​​the intermediate retainer 132 when viewed from above in the Z1 direction, the liquid injection head 1 can be miniaturized.

[0202] It should be noted that, in this embodiment, when viewed from above in the Z1 direction, the feed path Q0 is positioned in the upper retainer 133 closer to the head chip 12[1] than the head chip 12[2]. Therefore, in this embodiment, a portion extending from the branch position GB in the Z1 direction can be provided in the distribution path Q1. That is, in this embodiment, an extension path QR1 extending in the Z1 direction and having a branch position GB midway can be provided in the supply path Q.

[0203] Figure 21 This is a top view used to illustrate the configuration of the cage 13 and the supply flow paths Q(1) to Q(4) when viewed from above in the Z1 direction. It should be noted that, below, the inlet flow path Q0 corresponding to the supply flow path Q(u) is sometimes referred to as the inlet flow path Q0(u), the extension flow path QR1 corresponding to the supply flow path Q(u) is sometimes referred to as the extension flow path QR1(u), the separate flow path QK1 corresponding to the supply flow path Q(u) is sometimes referred to as the separate flow path QK1(u), the extension flow path QR2 corresponding to the supply flow path Q(u) is sometimes referred to as the extension flow path QR2(u), and the separate flow path QK2 corresponding to the supply flow path Q(u) is sometimes referred to as the separate flow path QK2(u).

[0204] like Figure 21As shown, when viewed from above in the Z1 direction, the supply flow path Q(1) includes an extended flow path QR1(1), a separate flow path QK1(1) extending in a straight line from the extended flow path QR1(1) in the X2 direction, a separate flow path QK2(1) extending in a straight line from the extended flow path QR1(1) in the X1 direction, and an extended flow path QR2(1) extending in a straight line from the position overlapping with the end of the separate flow path QK2(1) in the X1 direction in the X1 direction.

[0205] Furthermore, when viewed from above in the Z1 direction, the supply flow path Q(2) includes an extended flow path QR1(2), a separate flow path QK1(2) that extends in a curved manner from the extended flow path QR1(2) toward the X1 direction to avoid the wiring opening 130K[2], a separate flow path QK2(2) that extends in a straight manner from the extended flow path QR1(2) toward the X2 direction, and an extended flow path QR2(2) that extends in a curved manner from the position overlapping with the end of the separate flow path QK2(2) in the X2 direction toward the X2 direction to avoid the wiring opening 130K[1].

[0206] Furthermore, when viewed from above in the Z1 direction, the supply flow path Q(3) includes an extended flow path QR1(3), a separate flow path QK1(3) that extends in a curved manner from the extended flow path QR1(3) toward the X2 direction to avoid the wiring opening 130K[3], a separate flow path QK2(3) that extends in a straight manner from the extended flow path QR1(3) toward the X1 direction, and an extended flow path QR2(3) that extends in a curved manner from the position overlapping with the end of the separate flow path QK2(3) in the X1 direction toward the X1 direction to avoid the wiring opening 130K[4].

[0207] Furthermore, when viewed from above in the Z1 direction, the supply flow path Q(4) includes an extended flow path QR1(4), a separate flow path QK1(4) extending in a straight line from the extended flow path QR1(4) in the X1 direction, a separate flow path QK2(4) extending in a straight line from the extended flow path QR1(4) in the X2 direction, and an extended flow path QR2(4) extending in a straight line from the position overlapping with the end of the separate flow path QK2(4) in the X2 direction in the X2 direction.

[0208] Thus, according to this embodiment, in supply flow paths Q(2) and Q(3), which overlap with the wiring opening 130K[j] in the Y-axis direction and need to avoid the wiring opening 130K[j], the wiring opening 130K[j] is avoided by making the individual flow path QK1(u) and the extended flow path QR2(u) curved, while the individual flow path QK2(u) remains straight. Therefore, in this embodiment, the flow path length of the individual flow path QK2(u) can be made shorter than the flow path length of the individual flow path QK1(u) and the flow path length of the extended flow path QR2(u). As a result, in this embodiment, the area of ​​the upper holder 133 that defines the upper side of the individual flow path QK2(u) can be reduced. Therefore, according to this embodiment, for example, compared with the solution of making the individual flow path QK2(u) curved, the liquid injection head 1 can be miniaturized.

[0209] A.6.2. Comparative Example

[0210] Below, to clarify the advantages of this embodiment, refer to Figures 22 to 26 The advantages of this embodiment will be explained in relation to the supply flow path involved in the comparative example.

[0211] Figure 22 This is a schematic diagram illustrating the configuration of the supply flow path Q-V1 provided in the liquid injection head 1-V1 involved in comparative example V1.

[0212] like Figure 22 As shown, the supply flow path Q-V1 includes an inlet flow path Q0-V1, a distribution flow path Q1-V1, and a distribution flow path Q2-V1.

[0213] The inlet flow path Q0-V1 is a flow path for supplying ink introduced from the filter chamber FT(1) to the branch position GB-V1. It is a flow path that extends along the Z1 direction in the intermediate retainer 132 and reaches the branch position GB-V1.

[0214] The distribution flow path Q1-V1 is a flow path for supplying ink introduced from the inlet flow path Q0-V1 to the nozzle row LLA[1]. It is located further downstream than the branch position GB-V1 and extends from the branch position GB-V1 along the X2 direction between the lower retainer 131 and the middle retainer 132.

[0215] The distribution flow path Q2-V1 is a flow path for supplying ink introduced from the inlet flow path Q0-V1 to the nozzle array LLA[2]. It is located further downstream than the branch position GB-V1 and extends from the branch position GB-V1 along the X1 direction between the lower retainer 131 and the middle retainer 132.

[0216] Figure 23This is a schematic diagram illustrating the suction cleaning process performed on the liquid jet heads 1-V1 involved in Comparative Example V1. It should be noted that the suction cleaning process consists of multiple suction actions, including a first suction action to draw ink from the nozzle array LLa[1] and a second suction action to draw ink from the nozzle array LLa[2]. Figure 23 The diagram illustrates the execution of the first suction action in the suction cleaning process.

[0217] like Figure 23 As shown, the cleaning unit 94 includes a cover 941, a suction pump 941, a discharge pipe 943, and a waste liquid tank 944. When suction is applied to the nozzle array LL, the cover 941 closes the nozzle forming surface MN of the nozzle array LL in the spray surface MF, thereby forming a closed space between the cover 941 and the nozzle forming surface MN. The closed space formed by the cover 941 communicates with the plurality of nozzles N constituting the nozzle array LL, which are the targets of the suction operation. The suction pump 942 draws ink from each nozzle N constituting the nozzle array LL by depressurizing the closed space formed by the cover 941. Then, the suction pump 942 discharges the ink drawn from each nozzle N into the waste liquid tank 944 via the discharge pipe 943.

[0218] like Figure 23 As shown, when the first suction action of drawing ink from the nozzle array LLa[1] is performed in the liquid jet head 1-V1, the suction pump 942 applies negative pressure to the distribution flow path Q1-V1, and discharges the ink in the distribution flow path Q1-V1 from each nozzle N constituting the nozzle array LLa[1]. Since the distribution flow path Q1-V1 is connected to the inlet flow path Q0-V1 and the distribution flow path Q2-V1, the negative pressure applied by the suction pump 942 to the distribution flow path Q1-V1 also acts on the inlet flow path Q0-V1 and the distribution flow path Q2-V1 via the distribution flow path Q1-V1.

[0219] As described above, the distribution flow path Q1-V1 extends in the X1 direction at the branch position GB-V1. The distribution flow path Q2-V1 extends in the X2 direction at the branch position GB-V1. That is, in Comparative Example V1, at the branch position GB-V1, distribution flow path Q1-V1 and distribution flow path Q2-V1 are opposite each other. Furthermore, the input flow path Q0-V1 extends in the Z1 direction at the branch position GB-V1. That is, in Comparative Example V1, at the branch position GB-V1, distribution flow path Q1-V1 intersects with input flow path Q0-V1.

[0220] Therefore, in Comparative Example V1, the negative pressure applied by the suction pump 942 to the distribution flow path Q1-V1 has a relatively strong effect on the distribution flow path Q2-V1, which is opposite to the distribution flow path Q1-V1 at the branch position GB-V1 and extends in the same direction as the distribution flow path Q1-V1, and a relatively weak effect on the inlet flow path Q0-V1, which intersects the distribution flow path Q1-V1 at the branch position GB-V1 and extends in a direction different from the distribution flow path Q1-V1. Therefore, by applying the negative pressure from the suction pump 942 to the distribution flow path Q1-V1, the ink in the distribution flow path Q2-V1 is easily discharged from the nozzle array LLa[1] via the distribution flow path Q1-V1, while the ink in the inlet flow path Q0-V1 is very likely to be unable to be fully discharged from the nozzle array LLa[1]. Therefore, according to comparative example V1, sometimes it is not possible to fully remove the air bubbles trapped in the filter chamber FT(1) connected to the inlet flow path Q0-V1.

[0221] It should be noted that when the second suction action of drawing ink from the nozzle array LLa[2] is performed in the liquid jet head 1-V1, the negative pressure applied by the suction pump 942 to the distribution flow path Q2-V1 has a relatively strong effect on the distribution flow path Q1-V1, which is opposite to the distribution flow path Q2-V1 at the branch position GB-V1 and extends in the same direction as the extension direction of the distribution flow path Q2-V1, and a relatively weak effect on the inlet flow path Q0-V1, which intersects the distribution flow path Q2-V1 at the branch position GB-V1 and extends in a direction different from the extension direction of the distribution flow path Q2-V1. Therefore, according to Comparative Example V1, in the second suction action, the ink in the distribution flow path Q1-V1 is easily discharged from the nozzle array LLa[2] via the distribution flow path Q2-V1 by the negative pressure applied by the suction pump 942 to the distribution flow path Q2-V1, while the ink in the inlet flow path Q0-V1 is very likely to be unable to be discharged sufficiently from the nozzle array LLa[2]. Therefore, according to Comparative Example V1, similarly, in the second suction action, it is sometimes impossible to effectively attract the bubbles trapped in the filter chamber FT(1) connected to the inlet flow path Q0-V1.

[0222] Figure 24 This is a schematic diagram illustrating the suction cleaning process performed on the liquid jet head 1 according to this embodiment. It should be noted that... Figure 24 The diagram shows the first suction action performed on the nozzle array LLa[1] during the suction cleaning process.

[0223] like Figure 24As shown, when the first suction action of drawing ink from the nozzle array LLa[1] is performed in the liquid jet head 1, the suction pump 942 applies a negative pressure to the distribution flow path Q1, and discharges the ink in the distribution flow path Q1 from each nozzle N constituting the nozzle array LLa[1]. Since the distribution flow path Q1 is connected to the inlet flow path Q0 and the distribution flow path Q2, the negative pressure applied by the suction pump 942 to the distribution flow path Q1 also acts on the inlet flow path Q0 and the distribution flow path Q2 via the distribution flow path Q1.

[0224] As described above, distribution flow path Q1 extends in the Z1 direction at branch position GB. Distribution flow path Q2 extends in the X1 direction at branch position GB. That is, in this embodiment, distribution flow path Q1 and distribution flow path Q2 intersect at branch position GB. Furthermore, input flow path Q0 extends in the Z1 direction at branch position GB. That is, in this embodiment, distribution flow path Q1 and input flow path Q0 are opposite each other at branch position GB.

[0225] Therefore, in this embodiment, the negative pressure applied by the suction pump 942 to the distribution flow path Q1 has a relatively strong effect on the inlet flow path Q0, which is opposite to the distribution flow path Q1 at the branch position GB and extends in the same direction as the extension direction of the distribution flow path Q1, and a relatively weak effect on the distribution flow path Q2, which intersects the distribution flow path Q1 at the branch position GB and extends in a direction different from the extension direction of the distribution flow path Q1. Therefore, by applying the negative pressure from the suction pump 942 to the distribution flow path Q1, the ink in the distribution flow path Q2 is not easily discharged from the nozzle array LLa[1] via the distribution flow path Q1, while the ink in the inlet flow path Q0 is easily discharged from the nozzle array LLa[1]. Therefore, according to this embodiment, compared with Comparative Example V1, the air bubbles trapped in the filter chamber FT(1) connected to the inlet flow path Q0 can be effectively discharged.

[0226] It should be noted that when the second suction action of drawing ink from the nozzle array LLa[2] is performed in the liquid jet head 1, the negative pressure applied by the suction pump 942 to the distribution flow path Q2 has a relatively weaker effect on the inlet flow path Q0, which intersects the distribution flow path Q2 at the branch position GB and extends in a direction different from the extension direction of the distribution flow path Q2, compared with the first suction action. Therefore, according to this embodiment, in the second suction action, the ink in the inlet flow path Q0 may not be sufficiently discharged from the nozzle array LLa[2] due to the negative pressure applied by the suction pump 942 to the distribution flow path Q2. However, according to this embodiment, since the air bubbles trapped in the filter chamber FT(1) connected to the inlet flow path Q0 are sufficiently discharged in the first suction action, even if the air bubbles are not sufficiently drawn from the filter chamber FT(1) in the second suction action, the air bubbles in the filter chamber FT(1) can be sufficiently discharged in the overall suction cleaning process.

[0227] It is important to note that, such as Figure 23 As shown, according to Comparative Example V1, the distribution flow paths Q1-V1 and Q2-V1 are arranged between the lower retainer 131 and the intermediate retainer 132. Therefore, according to Comparative Example V1, it is impossible to provide a notch KK in the lower retainer 131. Consequently, according to Comparative Example V1, it is difficult to ensure sufficient space for arranging the media suppression mechanism GZ in the liquid injection heads 1-V1. Therefore, according to Comparative Example V1, it is necessary to provide additional space for arranging the media suppression mechanism GZ outside the space for arranging the liquid injection heads 1-V1, which may result in a larger liquid injection device.

[0228] In this embodiment, since the distribution flow path Q2 includes a separate flow path QK2 defined by the intermediate retainer 132 and the upper retainer 133, a notch KK can be provided in the lower retainer 131, and a recess 132u can be provided in the intermediate retainer 132. Therefore, according to this embodiment, space for arranging the media pressing mechanism GZ can be ensured in the space where the liquid injection head 1 is arranged. Thus, according to this embodiment, the liquid injection device 100 can be miniaturized compared to Comparative Example V1.

[0229] Figure 25 This is a schematic diagram illustrating the configuration of the supply flow path Q-V2 provided in the liquid injection head 1-V2 involved in comparative example V2.

[0230] like Figure 25 As shown, the supply flow path Q-V2 includes the inlet flow path Q0-V2, the distribution flow path Q1-V2, and the distribution flow path Q2-V2.

[0231] The inlet flow path Q0-V2 is a flow path for supplying ink introduced from the filter chamber FT(1) to the branch position GB-V2. It is a flow path that extends along the Z1 direction in the upper retainer 133 and the middle retainer 132 and reaches the branch position GB-V2.

[0232] The distribution flow path Q1-V2 is a flow path for supplying ink introduced from the inlet flow path Q0-V2 to the nozzle row LLa[1]. It is located further downstream than the branch position GB-V2 and extends from the branch position GB-V2 along the X2 direction between the lower retainer 131 and the middle retainer 132.

[0233] The distribution flow path Q2-V2 is a flow path for supplying ink introduced from the inlet flow path Q0-V2 to the nozzle array LLa[2], and is located downstream of the branch position GB-V2. The distribution flow path Q2-V2 includes: a portion extending from the branch position GB-V2 along the X1 direction between the lower retainer 131 and the intermediate retainer 132 to reach the bending portion CB1; a portion located downstream of the bending portion CB1 and extending along the Z2 direction in the intermediate retainer 132 to reach the bending portion CB2; a portion located downstream of the bending portion CB2 and extending along the X1 direction between the upper retainer 133 and the intermediate retainer 132 to reach the bending portion CB3; a portion located downstream of the bending portion CB3 and extending along the Z1 direction in the intermediate retainer 132 to reach the bending portion CB4; and a portion located downstream of the bending portion CB4 and extending along the X1 direction between the intermediate retainer 132 and the lower retainer 131.

[0234] According to Comparative Example V2, since the distribution flow path Q2-V2 has a portion extending in the X1 direction from the bending portion CB2 to the bending portion CB3 between the upper retainer 133 and the intermediate retainer 132, a notch portion KK can be provided in the lower retainer 131. Therefore, according to Comparative Example V2, similarly to this embodiment, space for arranging the media pressing mechanism GZ can be ensured within the space where the liquid injection heads 1-V2 are arranged.

[0235] However, according to Comparative Example V2, at branch position GB-V2, the distribution flow path Q1-V2 is opposite to the distribution flow path Q2-V2, at branch position GB-V2, the import flow path Q0-V2 intersects with the distribution flow path Q1-V2, and the import flow path Q0-V2 intersects with the distribution flow path Q2-V2.

[0236] Therefore, according to Comparative Example V2, in the first suction action of drawing ink from the nozzle array LLa[1] during the suction cleaning process of the liquid jet head 1-V2, the negative pressure applied by the suction pump 942 to the distribution flow path Q1-V2 has a relatively strong effect on the distribution flow path Q2-V2 opposite to the distribution flow path Q1-V2, and a relatively weak effect on the inlet flow path Q0-V2 that intersects with the distribution flow path Q1-V2. Therefore, according to Comparative Example V2, in the first suction action, the air bubbles trapped in the filter chamber FT(1) connected to the inlet flow path Q0-V2 cannot be fully discharged. Similarly, according to Comparative Example V2, in the second suction action of drawing ink from the nozzle array LLa[2] during the suction cleaning process of the liquid jet heads 1-V2, the negative pressure applied by the suction pump 942 to the distribution flow path Q2-V2 has a relatively strong effect on the distribution flow path Q1-V2 opposite to the distribution flow path Q2-V2, and a relatively weak effect on the inlet flow path Q0-V2 that intersects with the distribution flow path Q2-V2. Therefore, according to Comparative Example V2, in the second suction action, the air bubbles trapped in the filter chamber FT(1) connected to the inlet flow path Q0-V2 cannot be fully discharged. Thus, according to Comparative Example V2, in the suction cleaning process of the liquid jet heads 1-V2, there is a problem that the air bubbles trapped in the filter chamber FT(1) connected to the inlet flow path Q0-V2 cannot be fully discharged.

[0237] In this embodiment, at the branch position GB, the inlet flow path Q0 is opposite to the distribution flow path Q1. Therefore, according to this embodiment, compared to Comparative Example V2, air bubbles in the filter chamber FT(1) can be more effectively removed during the suction cleaning process.

[0238] Furthermore, according to Comparative Example V2, the distribution flow path Q2-V2 has four bending portions CB: bending portion CB1, bending portion CB2, bending portion CB3, and bending portion CB4. Therefore, according to Comparative Example V2, the flow path resistance of the ink flowing in the distribution flow path Q2-V2 from the bending portions CB increases, and the load for supplying ink to the head chip 12[2] via the distribution flow path Q2-V2 increases.

[0239] In this embodiment, the distribution flow path Q2 has only two bending portions CB, namely the end of the individual flow path QK2 in the distribution flow path Q2 in the X1 direction and the end of the extended flow path QR2 in the distribution flow path Q2 in the X2 direction. Therefore, according to this embodiment, compared with comparative example V2, the flow path resistance of the ink flowing in the distribution flow path Q2 from the bending portions CB can be reduced, and the load for supplying ink to the head chip 12[2] via the distribution flow path Q2 can be reduced.

[0240] Figure 26This is a schematic diagram illustrating the configuration of the supply flow path Q-V3 provided in the liquid injection head 1-V3 involved in comparative example V3.

[0241] like Figure 26 As shown, the supply flow path Q-V3 includes the inlet flow path Q0-V3, the distribution flow path Q1-V3, and the distribution flow path Q2-V3.

[0242] The inlet flow path Q0-V3 is a flow path for supplying ink introduced from the filter chamber FT(1) to the branch position GB-V3. It is a flow path that extends along the Z1 direction in the upper retainer 133 and the middle retainer 132 and reaches the branch position GB-V3.

[0243] The distribution flow path Q1-V3 is a flow path for supplying ink introduced from the inlet flow path Q0-V3 to the nozzle row LLA[1]. It is located further downstream than the branch position GB-V3 and extends from the branch position GB-V3 along the X2 direction between the lower retainer 131 and the middle retainer 132.

[0244] The distribution flow path Q2-V3 is a flow path for supplying ink introduced from the inlet flow path Q0-V3 to the nozzle array LLa[2], and is located downstream of the branch position GB-V3. The distribution flow path Q2-V3 includes: a portion extending from the branch position GB-V3 along the X1 direction between the lower retainer 131 and the intermediate retainer 132 to reach the bending portion CB1; a portion located downstream of the bending portion CB1 and extending along the Z2 direction in the intermediate retainer 132 to reach the bending portion CB2; and a portion located downstream of the bending portion CB2 and extending along the X1 direction between the upper retainer 133 and the intermediate retainer 132 to reach the bending portion CB3.

[0245] According to Comparative Example V3, since the distribution flow path Q2-V3 has a portion extending in the X1 direction from the bending portion CB2 to the bending portion CB3 between the upper retainer 133 and the intermediate retainer 132, a notch portion KK can be provided in the lower retainer 131. Thus, according to Comparative Example V3, similarly to this embodiment, space for arranging the media pressing mechanism GZ can be ensured in the space where the liquid injection heads 1-V3 are arranged.

[0246] Furthermore, according to Comparative Example V3, the distribution flow path Q2-V3 has three bending portions CB: bending portion CB1, bending portion CB2, and bending portion CB3. Therefore, according to Comparative Example V3, similar to this embodiment, compared to Comparative Example V2, the flow path resistance of the ink flowing in the distribution flow path Q2-V3 from the bending portions CB can be reduced, and the load for supplying ink to the head chip 12[2] via the distribution flow path Q2-V3 can be reduced.

[0247] However, according to Comparative Example V3, at the branch position GB-V3, the distribution flow path Q1-V3 is opposite to the distribution flow path Q2-V3, at the branch position GB-V3, the import flow path Q0-V3 intersects with the distribution flow path Q1-V3, and in addition, the import flow path Q0-V3 intersects with the distribution flow path Q2-V3.

[0248] Therefore, according to Comparative Example V3, similar to Comparative Example V2, in the suction cleaning process of liquid jet heads 1-V3, there is a problem that the air bubbles trapped in the filter chamber FT(1) connected to the inlet flow path Q0-V3 cannot be fully discharged.

[0249] In this embodiment, at the branch position GB, the inlet flow path Q0 is opposite to the distribution flow path Q1. Therefore, according to this embodiment, compared to Comparative Example V3, air bubbles in the filter chamber FT(1) can be more effectively removed during the suction cleaning process.

[0250] Furthermore, according to Comparative Example V3, the flow path in distribution flow path Q2-V3 extending from the bent portion CB2 to the bent portion CB3 between the upper retainer 133 and the intermediate retainer 132 in the X1 direction extends to the upper side of the head chip 12 [2]. Therefore, according to Comparative Example V3, the flow path in distribution flow path Q2-V3 extending from the bent portion CB2 to the bent portion CB3 between the upper retainer 133 and the intermediate retainer 132 in the X1 direction is longer than the flow path length of the individual flow path QK2 in this embodiment. Therefore, according to Comparative Example V3, by enlarging the upper retainer 133, it is possible to enlarge the liquid injection head 1-V3 as well.

[0251] In this embodiment, the distribution flow path Q2 is configured such that the individual flow path QK2 is shorter than the extension flow path QR2. Therefore, according to this embodiment, compared with comparative example V3, the upper cage 133 can be miniaturized, thereby also preventing the liquid injection head 1 from becoming too large.

[0252] A.6.3. Variation Example

[0253] Below, refer to Figure 27 and Figure 28 The following describes two variations, C1 and C2, in which the supply flow path Q in the liquid injection head 1 of this embodiment is changed to other schemes.

[0254] Figure 27 This is a schematic diagram illustrating the configuration of the supply flow path Q-C1 provided in the liquid injection head 1-C1 involved in the modified example C1.

[0255] like Figure 27As shown, the difference between supply flow path Q-C1 and supply flow path Q in this embodiment is that it has distribution flow path Q2-C1 instead of distribution flow path Q2. The difference between distribution flow path Q2-C1 and distribution flow path Q2 in this embodiment is that it has separate flow path QK2-C1 instead of separate flow path QK2. The difference between separate flow path QK2-C1 and separate flow path QK2 in this embodiment is that it has an inclined portion that slopes in the Z1 direction as it moves downstream from the branch position GB. It should be noted that in modified example C1, separate flow path QK2-C1 and separate flow path QK2 are also defined by upper retainer 133 and intermediate retainer 132. It should be noted that the inclined portion can be as follows: Figure 27 It can be set in the entire area of ​​a single flow path QK2-C1, or it can be set only in a part of a single flow path QK2-C1.

[0256] Therefore, in modified example C1, similar to this embodiment, a notch KK can be provided on the lower side of the individual flow path QK2-C1, thus ensuring space for arranging the medium pressing mechanism GZ in the space where the liquid injection head 1-C1 is arranged.

[0257] Furthermore, in Modified Example C1, similarly to this embodiment, at the branch position GB, the inlet flow path Q0 and the distribution flow path Q1 are opposite each other. Thus, according to Modified Example C1, similar to this embodiment, air bubbles in the filter chamber FT(1) can be more effectively removed during the suction cleaning process.

[0258] Figure 28 This is a schematic diagram illustrating the configuration of the supply flow path Q-C2 provided in the liquid injection head 1-C2 involved in the modified example C2.

[0259] like Figure 28 As shown, the supply flow path Q-C2 includes an inlet flow path Q0-C2, a distribution flow path Q1-C2, and a distribution flow path Q2-C2.

[0260] The inlet flow path Q0-C2 is a flow path for supplying ink introduced from the filter chamber FT(1) to the branch position GB-C2. It is a flow path that extends along the Z1 direction in the upper retainer 133 and the middle retainer 132 and reaches the branch position GB-C2.

[0261] The distribution flow path Q1-C2 is a flow path for supplying ink introduced from the inlet flow path Q0-C2 to the nozzle array LLa[1]. It is located further downstream than the branch position GB-C2 and has a portion extending from the branch position GB-C2 in the X2 direction between the upper retainer 133 and the middle retainer 132, a portion extending in the middle retainer 132 in the Z1 direction, and a portion extending in the X2 direction between the lower retainer 131 and the middle retainer 132.

[0262] The distribution flow path Q2-C2 is a flow path for supplying ink introduced from the inlet flow path Q0-C2 to the nozzle array LLa[2]. It is located further downstream than the branch position GB-C2 and has a portion extending from the branch position GB-C2 in the X1 direction between the upper retainer 133 and the middle retainer 132, a portion extending in the Z1 direction in the middle retainer 132, and a portion extending in the X1 direction between the lower retainer 131 and the middle retainer 132.

[0263] In modified example C2, similar to this embodiment, a notch KK can be provided on the lower side of the lower retainer 131, thus ensuring space for arranging the media pressing mechanism GZ in the space where the liquid injection head 1-C2 is arranged.

[0264] A.7. Filter fixing screws 61 and nuts 62

[0265] As described above, in this embodiment, the filter unit 16 is fixed to the substrate cover 15 by filter fixing screws 61 and nuts 62. Hereinafter, referring to... Figures 29 to 31 The process of fixing the filter unit 16 relative to the substrate cover 15 by means of filter fixing screws 61 and nuts 62 will be described.

[0266] Figure 29 This is a cross-sectional view obtained by cutting the liquid jet head 1 with a plane whose normal direction is the Y-axis, including head chip 12[1] and head chip 12[2]. Figure 30 To be Figure 29 Enlarged cross-sectional view near filter fixing screw 61. Figure 31 To show Figure 30 A perspective view of the area near the filter fixing screw 61.

[0267] like Figures 29 to 31 As shown, a receiving portion 64 is provided on the substrate cover 15.

[0268] The receiving portion 64 is a recess for accommodating the nut 62 of the four corner posts, extending in the X1 direction. Specifically, the receiving portion 64 is a recess provided on the end face 640 facing the X1 direction, and the end face 640 is the end of the substrate cover 15 in the X2 direction.

[0269] The nut 62 is made of metal and is pressed into the receiving portion 64 in the X1 direction. Therefore, in this embodiment, the nut 62 is fixed to the receiving portion 64 without the use of adhesive. It should be noted that the nut 62 pressed into the receiving portion 64 is positioned in the X-axis direction by contacting the inner surface 641, which is the end of the receiving portion 64 in the X1 direction. Furthermore, it is positioned in the Z-axis direction by contacting the position-defining surface 642, which is located higher than the bottom surface 643, which is the end of the receiving portion 64 in the Z1 direction.

[0270] like Figure 29 and Figure 30 As shown, a filter-fixing threaded hole 63 penetrating the filter unit 16 and the substrate cover 15 in the Z1 direction is provided on the filter unit 16 and the substrate cover 15. Furthermore, a threaded hole 621 is provided on the nut 62. When the nut 62 is pressed into the receiving portion 64 and positioned by the inner surface 641 and the position-defining surface 642, viewed from the Z1 direction, the filter-fixing threaded hole 63 in the filter unit 16 and the substrate cover 15 overlaps with the threaded hole 621 in the nut 62. Therefore, by inserting the filter-fixing screw 61 into the filter-fixing threaded hole 63 and the threaded hole 621, the substrate cover 15 and the filter unit 16 are secured.

[0271] like Figure 29 and Figure 30 As shown, a nut ejection opening 65 penetrating the inner surface 641 is provided on the base plate cover 15. The area of ​​the nut ejection opening 65 is smaller than the area of ​​the side surface of the nut 62 that contacts the inner surface 641. By inserting a rod (not shown) into the nut ejection opening 65 and pushing the nut 62 into the receiving portion 64 in the X2 direction with the help of the rod, the nut 62 can be removed from the receiving portion 64.

[0272] like Figure 30 As shown, a threaded groove 622 extending in the X1 direction is provided on the nut 62. Since the threaded groove 622 opens toward the end face 640 that opens toward the recess of the receiving portion 64, the nut 62 can be removed from the receiving portion 64 by fastening a screw (not shown) to the threaded groove 622 and pulling the screw in the X2 direction.

[0273] like Figure 31 As shown, in the receiving part 64, a gap 644 communicating with the threaded hole 621 is provided between the nut 62 and the bottom surface 643. By inserting the L-shaped rod (not shown) with its front end bent into the gap 644, and pulling the L-shaped rod in the X2 direction with the bent part of the L-shaped rod hooked in the threaded hole 621, the nut 62 can be removed from the receiving part 64.

[0274] Thus, according to this embodiment, the insertion direction of the filter fixing screw 61 is the Z1 direction, and the insertion direction of the nut 62 into the receiving portion 64 is the X1 direction. That is, according to this embodiment, the insertion direction of the filter fixing screw 61 into the nut 62 intersects the insertion direction of the nut 62 into the receiving portion 64. Therefore, according to this embodiment, when the filter fixing screw 61 is fixed to the nut 62, the nut 62 can be prevented from falling off the outside of the receiving portion 64. Thus, according to this embodiment, the nut 62 can be fixed in the receiving portion 64 without the use of adhesive.

[0275] Furthermore, according to this embodiment, since a nut ejection opening 65 communicating with the receiving portion 64 is provided in the substrate cover 15, the nut 62 can be easily removed from the receiving portion 64. Thus, according to this embodiment, for example, compared to a scheme where the insertion direction of the filter fixing screw 61 is opposite to the insertion direction of the nut 62 into the receiving portion 64, the nut 62 is easier to reuse.

[0276] A.8. Fixing of the fixing plate 11 to the lower retainer 131

[0277] As described above, in this embodiment, the lower retainer 131 is fixed relative to the fixing plate 11 by an adhesive. Next, referring to... Figures 32 to 37 The fixation of the lower retainer 131 relative to the fixed plate 11 will be explained.

[0278] Figure 32 This is a top view of the liquid injection head 1, including the lower retainer 131, viewed from above in the Z2 direction after the retaining plate 11 has been removed from the liquid injection head 1. It should be noted that... Figure 32 For ease of explanation, the nozzle protrusion opening 111 provided on the fixing plate 11 is shown overlapping with the retainer 13. Figure 33 This is a cross-sectional view obtained by cutting the liquid jet head 1 with a plane whose normal direction is the X-axis, including the opening 77 of the fixed plate. Figure 34 To be Figure 33 An enlarged cross-sectional view of the area near opening 77 of the fixed plate. Figure 35 This is a cross-sectional view obtained by cutting the liquid jet head 1 with a plane whose normal direction is the Y-axis, including the opening 77 of the fixed plate. Figure 36 This is a perspective view of the lower retainer 131. Figure 37 This is a perspective view of a liquid injection head 1 including a fixed plate 11 and a lower retainer 131.

[0279] like Figures 32 to 36As shown, the lower retainer 131 has a peripheral wall portion 70. Here, the peripheral wall portion 70 is the portion of the lower retainer 131 that includes the bottom surface of the receiving portion 131S that accommodates the head chip 12. The peripheral wall portion 70 is configured to surround each of the four head chips 12[1] to 12[4] disposed in the liquid injection head 1.

[0280] like Figures 32 to 36 As shown, the peripheral wall portion 70 has four partition wall portions 71 corresponding to the four head chips 12[1]~12[4]. Here, the partition wall portion 71 is the portion of the peripheral wall portion 70 provided between two adjacent head chips 12 in the Y-axis direction. Hereinafter, the partition wall portion 71 closest to the head chip 12[j] among the four partition wall portions 71 provided by the peripheral wall portion 70 will be referred to as partition wall portion 71[j]. It should be noted that in Figure 33 and Figure 34 The image shows two of the four partition walls 71 provided in the peripheral wall portion 70, located between the head chip 12 [1] and the head chip 12 [3]. That is, in Figure 33 and Figure 34 The diagram shows the partition wall 71 closest to the head chip 12 [1] and the partition wall 71 [3] closest to the head chip 12 [3] among the four partition wall portions 71 of the peripheral wall portion 70.

[0281] like Figure 32 as well as Figure 35 and Figure 36 As shown, the peripheral wall portion 70 includes a thinning portion 72. The thinning portion 72 is a recess located inside two partition walls 71 disposed between two adjacent head chips 12 in the Y-axis direction within the peripheral wall portion 70, and is configured to be recessed from the bottom surface of the peripheral wall portion 70 upwards. Hereinafter, as... Figure 32 As shown, the thinning portion 72 provided between the partition wall portion 71[1] and the partition wall portion 71[3] is sometimes referred to as thinning portion 72A, and the thinning portion 72 provided between the partition wall portion 71[2] and the partition wall portion 71[4] is referred to as thinning portion 72B.

[0282] like Figure 33 and Figure 34 As shown, the bottom surface of the peripheral wall portion 70 and the fixing plate 11 serve as the bonding area DS. Here, the bonding area DS is the area including the bottom surface of the peripheral wall portion 70, which is the area coated with adhesive DX1 and fixed to the fixing plate 11. In addition, the bonding area DS has four individual bonding areas DSS[1] to DSS[4] corresponding to the four partition wall portions 71[1] to 71[4]. The individual bonding area DSS[j] is the area including the bottom surface of the peripheral wall portion 70, coated with adhesive DX1 and fixed to the fixing plate 11, which corresponds to the bottom surface of the partition wall portion 71[j].

[0283] like Figures 32 to 36 As shown, a recess 73 is provided on the bottom surface of the peripheral wall portion 70. The recess 73 is a portion of the bottom surface of the peripheral wall portion 70 that is recessed in the Z2 direction, and is provided between two adjacent partition wall portions 71 in the Y-axis direction, surrounded by a protrusion 74 in the lower retainer 131 that forms the Z1 direction end. Below, as... Figure 32 As shown, the recess 73 provided between the partition wall portion 71[1] and the partition wall portion 71[3] is sometimes referred to as recess 73A, and the recess 73 provided between the partition wall portion 71[2] and the partition wall portion 71[4] is referred to as recess 73B. It should be noted that in this embodiment, it is envisioned that the distance from the fixing plate 11 to the recess 73 in the Z-axis direction is smaller than the diameter of the recess 73 when viewed from above in the Z2 direction. However, the distance from the fixing plate 11 to the recess 73 in the Z-axis direction can also be larger than the diameter of the recess 73 when viewed from above in the Z2 direction.

[0284] like Figure 33 and Figure 34 As shown, the recess 73 and the fixing portion 11 serve as the molding area DM. Here, the molding area DM is the area including the recess 73, which is the area coated with adhesive DX2 and fixed to the fixing plate 11. In this embodiment, the lower retainer 131 and the fixing plate 11 are configured such that when the liquid jet head 1 is viewed from above in the Z2 direction, the fixing plate opening 77A overlaps with the recess 73A, and the fixing plate opening 77B overlaps with the recess 73B. Therefore, in this embodiment, the recess 73 is filled by the adhesive DX2 applied to the molding area DM, sealing the fixing plate opening 77. It should be noted that in this embodiment, it is envisioned that when viewed from above in the Z1 direction, the recess 73 is larger than the fixing plate opening 77.

[0285] It should be noted that, in this embodiment, as Figure 34 As shown, the molding area DM is arranged with a gap between the inner sides of two adjacent individual bonding areas DSS in the Y-axis direction. Specifically, as... Figure 34 and Figure 36 As shown, an outer peripheral recess 75 is provided on the bottom surface of the peripheral wall portion 70 between the partition wall portion 71 and the recess 73. Therefore, in this embodiment, it is possible to prevent the adhesive DX1 applied to the individual bonding area DSS and the adhesive DX2 applied to the molding area DM from mixing together. Thus, in this embodiment, adhesives of different types can be used as adhesive DX1 and adhesive DX2, increasing the freedom of adhesive selection.

[0286] It should be noted that in this embodiment, we envision using adhesives of different types as adhesive DX1 and adhesive DX2. However, it is also possible to use adhesives of the same type as adhesive DX1 and adhesive DX2.

[0287] Furthermore, in this embodiment, it is envisioned that the distance from the fixing plate 11 to the recess 73 in the Z-axis direction is longer than the distance from the fixing plate 11 to the outer peripheral recess 75 in the Z-axis direction. However, the distance from the fixing plate 11 to the recess 73 in the Z-axis direction may also be less than the distance from the fixing plate 11 to the outer peripheral recess 75 in the Z-axis direction.

[0288] Furthermore, in this embodiment, the molding region DM is arranged with a gap between the inner sides of two adjacent individual bonding regions DSS in the Y-axis direction. Therefore, in this embodiment, for example, it is possible to suppress the occurrence of excessive adhesive in the individual bonding regions DSS due to the adhesive DX2 applied to the molding region DM spreading to the individual bonding regions DSS. Thus, according to this embodiment, poor adhesion between the partition wall portion 71 and the fixing plate 11 in the individual bonding regions DSS can be suppressed.

[0289] It is important to note that, such as Figure 33 and Figure 35 as well as Figure 37 As shown, in this embodiment, the fixing plate 11 is provided with a flat, bent portion 119Y and a flat, bent portion 119X. The bent portion 119Y is a portion bent in the Z2 direction at its end in the Y-axis direction, with the Y-axis direction as the normal direction. The bent portion 119X is a portion bent in the Z2 direction at its end in the X-axis direction, with the X-axis direction as the normal direction. In this embodiment, it is envisioned that the width of the bent portion 119X in the Z-axis direction is greater than the width of the bent portion 119Y in the Z-axis direction. Therefore, in this embodiment, when the wiping member provided in the cleaning unit 94 moves along the X-axis direction, the possibility of the wiping member contacting the lower retainer 131 can be reduced.

[0290] B. Variations

[0291] The methods illustrated above can be varied in many ways. Specific variations will be shown below. Within the bounds of non-contradiction, any two or more methods selected from the examples below can be appropriately combined.

[0292] Variation Example 1

[0293] In the above embodiments, a line-type head has been described as a head unit HD, but the present invention is not limited to this embodiment. The head unit HD can also be a serial head that ejects ink while reciprocating in the X-axis direction.

[0294] Figure 38 An explanatory diagram is provided to illustrate the liquid injection device 100D involved in Modification Example 1.

[0295] like Figure 38 As shown, the liquid injection device 100D differs from the liquid injection device 100 of the embodiment in that it has a head unit HD-D as a serial head instead of a head unit HD as a row head; and it has a moving mechanism 92 that causes the head unit HD-D to reciprocate in the X1 and X2 directions.

[0296] Under the control of the control device 90, the moving mechanism 92 causes the head unit HD-D to reciprocate in the X1 and X2 directions. The moving mechanism 92 includes a housing 921 for accommodating the head unit HD-D and an annular belt 922 for fixing the housing 921. It should be noted that the liquid container 93 can also be stored together with the head unit HD-D in the housing 921.

[0297] The difference between the head unit HD-D and the head unit HD involved in the implementation is that, in addition to the liquid injection head 1-1 and the liquid injection head 1-2, it also has a total of 4 liquid injection heads 1, namely liquid injection head 1-3 and liquid injection head 1-4; and in the head unit HD-D, each liquid injection head 1 is configured such that the head chip 12 provided on each liquid injection head 1 extends in the Y-axis direction.

[0298] It should be noted that in this variation, the variable m is a natural number satisfying 1 ≤ m ≤ 4. Therefore, in this variation, the m-th liquid jet 1 among liquid jet heads 1-1 to 1-4 is called liquid jet head 1-m.

[0299] Figure 39 This is an explanatory diagram illustrating the configuration of the nozzle array LL in the head unit HD-D.

[0300] like Figure 39 As shown, in the head unit HD-D, liquid jet head 1-2 is provided in the region located in the X1 direction as viewed from liquid jet head 1-1, liquid jet head 1-3 is provided in the region located in the X1 direction as viewed from liquid jet head 1-2, and liquid jet head 1-4 is provided in the region located in the X1 direction as viewed from liquid jet head 1-3.

[0301] Furthermore, in this modified example, similar to the embodiment, four head chips 12 are provided on the liquid injection head 1-m. Hereinafter, the j-th head chip 12 of the four head chips 12 provided on the liquid injection head 1-m will be referred to as head chip 12-m[j].

[0302] It should be noted that the head chip 12 involved in this modification has the same configuration as the head chip 12 involved in the embodiment. In this modification, in the liquid injection head 1-m, the head chip 12-m[2] is provided in the region located in the Y1 direction as viewed from the head chip 12-m[1], the head chip 12-m[3] is provided in the region located in the direction between the X2 direction and the Y1 direction as viewed from the head chip 12-m[1], and the head chip 12-m[4] is provided in the region located in the Y1 direction as viewed from the head chip 12-m[3].

[0303] The two rows of nozzles LL on the head chip 12-m[j] provided on the liquid injection head 1-m will be referred to as nozzle row LLa-m[j] and nozzle row LLb-m[j], respectively. Nozzle row LLa-m[j] is located in the region in the X1 direction as viewed from nozzle row LLb-m[j].

[0304] Furthermore, in this modified example, among the four supply paths Q(1) to Q(4) of the liquid jet head 1-m, supply path Q(1) and supply path Q(3) are supplied with ink of the same color, while supply paths Q(2) and supply path Q(4) are supplied with ink of the same color but a different color than the ink supplied to supply paths Q(1) and supply path Q(3). Thus, in this modified example, the color of the ink ejected from each nozzle column LL is determined such that the colors of the ink ejected from the 16 nozzle columns LL arranged in the X-axis direction in the head unit HD-D are linearly symmetrical about the virtual line AX extending along the Y-axis between liquid jet heads 1-2 and liquid jet heads 1-3.

[0305] Below, the nozzle array LL that sprays black ink will be referred to as Black Spray Nozzle Array LLC1. The nozzle array LL that sprays cyan ink will be referred to as Cyan Spray Nozzle Array LLC2. The nozzle array LL that sprays yellow ink will be referred to as Yellow Spray Nozzle Array LLC3. The nozzle array LL that sprays magenta ink will be referred to as Magenta Spray Nozzle Array LLC4.

[0306] In this modified example, black ink is supplied to the nozzle arrays LLb-1[1], LLb-1[2], LLb-1[3] and LLb-1[4], as well as the nozzle arrays LLa-4[1], LLa-4[2], LLa-4[3] and LLa-4[4], which serve as the black jet nozzle array LLC1.

[0307] In this modified example, cyan ink is supplied to the nozzle arrays LLa-1[1], LLa-1[2], LLa-1[3] and LLa-1[4], and LLb-4[1], LLb-4[2], LLb-4[3] and LLb-4[4], which serve as the cyan jet nozzle array LLC2.

[0308] In this modified example, yellow ink is supplied to nozzle arrays LLb-2[1], LLb-2[2], LLb-2[3] and LLb-2[4], as well as nozzle arrays LLa-3[1], LLa-3[2], LLa-3[3] and LLa-3[4], which serve as yellow jet nozzle array LLC3.

[0309] In this modified example, magenta ink is supplied to nozzle arrays LLa-2[1], LLa-2[2], LLa-2[3] and LLa-2[4], as well as nozzle arrays LLa-3[1], LLa-3[2], LLa-3[3] and LLa-3[4], to act as magenta jet nozzle array LLC4.

[0310] According to this modified example, since the colors of the ink ejected from the 16 rows of nozzles LL arranged in the X-axis direction of the head unit HD-D are linearly symmetrical about the virtual line AX, the color order of the ink landing on the medium PP when the head unit HD-D moves in the X1 direction is the same as the color order of the ink landing on the medium PP when the head unit HD-D moves in the X2 direction. Therefore, according to this modified example, compared with a scheme where the colors of the ink ejected from the 16 rows of nozzles LL arranged in the X-axis direction of the head unit HD-D are not linearly symmetrical, unevenness and other issues in the image formed on the medium PP are suppressed, and a higher quality image can be formed.

[0311] Variation Example 2

[0312] The liquid jetting apparatus illustrated in the above embodiments and variation 1 can be applied not only to equipment specifically designed for printing, but also to various other equipment such as fax machines and copiers. However, the application of the liquid jetting apparatus of the present invention is not limited to printing. For example, the liquid jetting apparatus for jetting a solution of pigment material is used as an apparatus for manufacturing color filters for forming liquid crystal display devices. Furthermore, the liquid jetting apparatus for jetting a solution of conductive material is used as an apparatus for manufacturing wiring and electrodes for forming wiring substrates.

[0313] C. Postscript

[0314] The following are notes on solutions related to the above description. It should be noted that, for ease of understanding, reference numerals from the accompanying drawings are conveniently included in parentheses below, but the invention is not intended to be limited to the illustrated solutions.

[0315] C.1. Appendix 1

[0316] The liquid injection device 100 and liquid injection head 1 mentioned in Appendix 1 will be described below.

[0317] Appendix 1-1

[0318] The liquid ejector head 1 described in Appendix 1-1 is characterized by comprising: a nozzle array LLa[1] (an example of a "first nozzle group") for ejecting ink ("liquid"); a nozzle array LLa[2] (an example of a "second nozzle group") for ejecting ink; and a retainer 13 (an example of a "multiple flow path plates") comprising a lower retainer 131, an intermediate retainer 132, and an upper retainer 133 stacked in the Z1 direction (an example of a "first direction"). A supply flow path Q for supplying ink to the nozzle array LLa[1] and the nozzle array LLa[2] is provided on the retainer 13. Q has an extended flow path QR1 (an example of a "first flow path") extending in the Z1 direction, a separate flow path QK1 (an example of a "first separate flow path") and a separate flow path QK2 (an example of a "second separate flow path"). The separate flow path QK1 is connected to the end of the extended flow path QR1 in the Z1 direction, extends in the X2 direction intersecting the Z1 direction, and is separately connected to the nozzle array LLA[1]. The separate flow path QK2 is connected to the extended flow path QR1 at a branch position GB located in the middle of the extended flow path QR1, extends in the X1 direction intersecting the Z1 direction, and is separately connected to the nozzle array LLA[2].

[0319] According to Appendix 1-1, both the portion of the extended flow path QR1 upstream of the branch position GB and the portion of the extended flow path QR1 downstream of the branch position GB extend in the Z1 direction. Therefore, by performing a suction cleaning process that draws ink from the nozzle array LLa[1], ink located upstream of the branch position GB can be effectively discharged from the nozzle array LLa[1]. Therefore, according to Appendix 1-1, air bubbles stagnating upstream of the branch position GB can be effectively discharged.

[0320] Appendix 1-2

[0321] The liquid injection head 1 mentioned in Appendix 1-2 is the same as the liquid injection head 1 mentioned in Appendix 1-1, characterized in that the extended flow path QR1 is a flow path that passes through the upper retainer 133 and the intermediate retainer 132 in the retainer 13 in the Z1 direction, the separate flow path QK1 is a flow path defined between the lower retainer 131 and the intermediate retainer 132 that are adjacent to each other in the Z1 direction, and the separate flow path QK2 is a flow path defined between the intermediate retainer 132 and the upper retainer 133 that are adjacent to each other in the Z1 direction.

[0322] Appendix 1-3

[0323] The liquid injection head 1 mentioned in Appendix 1-3 is the liquid injection head 1 mentioned in Appendix 1-1 or Appendix 1-2, characterized in that the supply flow path Q includes a distribution flow path Q1 (an example of a "first distribution flow path") and a distribution flow path Q2 (an example of a "second distribution flow path"). The distribution flow path Q1 includes a separate flow path QK1 and is located downstream of the branch position GB. The distribution flow path Q2 includes a separate flow path QK2 and is located downstream of the branch position GB. The distribution flow path Q2 includes an extended flow path QR2 (an example of a "second flow path") defined between the lower retainer 131 and the intermediate retainer 132. The lower retainer 131 has a notch KK that is disposed between the separate flow path QK1 and the extended flow path QR2 when viewed in the Z1 direction and is configured to overlap with the separate flow path QK2.

[0324] According to Appendix 1-3, since the medium pressing mechanism GZ can be configured in the notch KK, the liquid injection device 100 including the liquid injection head 1 can be miniaturized compared with the solution without the notch KK.

[0325] Appendix 1-4

[0326] The liquid injection head 1 mentioned in Appendix 1-4 is the liquid injection head 1 mentioned in Appendix 1-1 to Appendix 1-3, characterized in that the flow path length of the individual flow path QK2 is shorter than the flow path length of the individual flow path QK1, and shorter than the flow path length of the extended flow path QR2.

[0327] According to notes 1-4, compared to the case where the flow path length of the individual flow path QK2 is longer than that of the individual flow path QK1 or the case where the flow path length of the extended flow path QR2 is longer, the upper cage 133 can be miniaturized.

[0328] Appendix 1-5

[0329] The liquid injection head 1 mentioned in Notes 1-5 is the liquid injection head 1 mentioned in Notes 1-1 to Notes 1-4, characterized in that, when viewed in the Z1 direction, the area of ​​the inner side of the outer periphery of the upper retainer 133 is smaller than the area of ​​the inner side of the outer periphery of the lower retainer 131, and smaller than the area of ​​the inner side of the outer periphery of the middle retainer 132.

[0330] According to Appendix 1-5, compared to the case where the area of ​​the inner side of the outer periphery of the upper retainer 133 is larger than the area of ​​the inner side of the outer periphery of the lower retainer 131 or the area of ​​the inner side of the outer periphery of the intermediate retainer 132, the liquid injection head 1 can be miniaturized.

[0331] Appendix 1-6

[0332] The liquid injection head 1 mentioned in Notes 1-6 is the liquid injection head 1 mentioned in Notes 1-1 to Notes 1-5, characterized in that the individual flow path QK2 extends in a straight line.

[0333] According to notes 1-6, compared with the scheme where the single flow path QK2 extends in a curved shape, the upper cage 133 can be miniaturized.

[0334] Appendix 1-7

[0335] The liquid injection head 1 mentioned in Appendix 1-7 is the liquid injection head 1 mentioned in Appendix 1-1 to Appendix 1-6, characterized in that it has a separate flow path QK2-C1 instead of a separate flow path QK2, and the separate flow path QK2-C1 has an inclined portion that tilts in the Z1 direction as it moves downstream from the branch position GB.

[0336] According to notes 1-7, it is possible to reduce the flow resistance when ink flows from the extended flow path QR1 to the individual flow path QK2-C1.

[0337] Appendix 1-8

[0338] The liquid injection device 100 described in Appendix 1-8 is characterized by comprising: a liquid injection head 1 as described in Appendix 1-1 to Appendix 1-7; a cover 941, which, when the cover 941 closes the injection surface MF of the liquid injection head 1, forms a closed space between the cover 941 and the injection surface MF that communicates with a plurality of nozzles N formed on the injection surface MF; and a suction pump 942 (an example of a "pressure reduction mechanism") that reduces pressure within the closed space formed by the cover 941 and the injection surface MF.

[0339] Appendix 1-9

[0340] The liquid jetting device 100 described in Appendix 1-9 is characterized by having a liquid jetting head 1 as described in Appendix 1-3, a conveying mechanism 91 for conveying the medium PP that the ink jetting from the liquid jetting head 1 lands on, and a medium pressing mechanism GZ (an example of a "restriction part") disposed in the notch KK to prevent the medium PP conveyed by the conveying mechanism 91 from leaving the conveying path.

[0341] C.2. Appendix 2

[0342] The liquid injection device 100 and head unit HD mentioned in Appendix 2 will be described below.

[0343] Appendix 2-1

[0344] The head unit HD described in Appendix 2-1 is characterized by having a liquid ejection head 1-1 (an example of a "first liquid ejection head") that ejects ink (an example of a "first direction") in the Z1 direction (an example of a "first direction"), and a support member 5 that supports the liquid ejection head 1-1. The support member 5 includes: a support plate 50 having a lower side surface P511 (an example of a "first surface") facing the Z1 direction, the lower side surface P511 being the surface supporting the liquid ejection head 1-1; and a head positioning pin SP (an example of a "first positioning part") for positioning the liquid ejection head 1-1 relative to the support plate 50. The liquid ejection head 1-1 includes: multiple head chips 12 having multiple nozzle rows LL (an example of a "nozzle group") for ejecting ink, and multiple nozzle exposure openings 111 ("exposure openings") formed for exposing each of the multiple nozzle rows LL to the outside. (Example) A fixing plate 11 (an example of a "covering member") on which multiple head chips 12 are fixed, a lower retainer 131 (an example of a "base member") on which the fixing plate 11 is fixed, and a stacked structure 55 including multiple stacked substrates stacked in the Z1 direction and stacked in the Z2 direction (an example of a "second direction") opposite to the Z1 direction relative to the mounting surface PS13 provided on the lower retainer 131. The stacked structure 55 has an opposing portion BT opposite to the lower side surface P511. The lower retainer 131 has a protrusion 131T protruding from the mounting surface PS13 in the Z2 direction. The protrusion 131T has a contact surface PT13 that contacts the lower side surface P511, and a support plate positioning hole AB (an example of a "second positioning part") provided corresponding to the head positioning pin SP and used for positioning the liquid injection head 1-1 and the support plate 50.

[0345] According to Appendix 2-1, for example, compared with the scheme in which the support plate positioning hole AB is set in the stacked structure 55, the positioning accuracy of the head chip 12 relative to the support plate 50 can be improved.

[0346] Appendix 2-2

[0347] The head unit HD mentioned in Appendix 2-2 is the same as the head unit HD mentioned in Appendix 2-1, characterized in that, when viewed in the Z1 direction, the area of ​​the opposing portion BT in the stacked structure 55 is greater than the area of ​​the non-opposing portion BH in the stacked structure 55 that does not overlap with the support plate 50.

[0348] According to Appendix 2-2, compared with the scheme where the opposing portion BT is smaller than the non-opposing portion BH, the area of ​​the portion of the support plate 50 opposing the laminated structure 55 can be increased, thus improving the rigidity of the support plate 50.

[0349] Appendix 2-3

[0350] The head unit HD mentioned in Appendix 2-3 is the head unit HD mentioned in Appendix 2-1 or Appendix 2-2, characterized in that a plurality of electrical connection openings AC and a plurality of connection flow path openings AR are provided on the support plate 50 through the support plate 50 in the Z1 direction. When viewed in the Z1 direction, each of the plurality of electrical connection openings AC and the plurality of connection flow path openings AR is smaller than the spray surface MF of the liquid injection head 1-1.

[0351] According to Appendix 2-3, compared with the scheme of providing an opening on the support plate 50 larger than the spray surface MF, the rigidity of the support plate 50 can be improved.

[0352] Appendix 2-4

[0353] The head unit HD mentioned in Appendix 2-4 is the head unit HD mentioned in Appendix 2-1 to Appendix 2-3, characterized in that the first positioning part can also be a positioning hole or a positioning cavity with a bottom wall, and the second positioning part can also be a positioning pin inserted into the positioning hole or positioning cavity.

[0354] Appendix 2-5

[0355] The head unit HD mentioned in Appendix 2-5 is the same as the head unit HD mentioned in Appendix 2-1 to Appendix 2-4, characterized in that the lower retainer 131 has a storage portion 131S that overlaps with the head chip 12 when viewed in the X1 direction (an example of the "third direction") which is orthogonal to the Z1 direction.

[0356] Appendix 2-6

[0357] The head unit HD mentioned in Appendix 2-6 is the same as the head unit HD mentioned in Appendix 2-1 to Appendix 2-5, characterized in that a lower retainer 131-B2 having a plurality of head chips 12 fixed thereon replaces the lower retainer 131.

[0358] According to notes 2-6, the positioning accuracy of the head chip 12 relative to the support plate 50 can be improved.

[0359] Appendix 2-7

[0360] The head unit HD mentioned in Appendix 2-7 is the same as the head unit HD mentioned in Appendix 2-1 to Appendix 2-6. It is characterized by having a liquid injection head 1-2 (an example of a "second liquid injection head") supported on the lower side surface P511 of the support plate 50 and injecting liquid in the Z1 direction, and a common flow path component 41 disposed in the Z2 direction as viewed from the support plate 50 and connected to the flow path of the liquid injection head 1-1 and the flow path of the liquid injection head 1-2. The support plate 50 has a flow path for connecting the common flow path component 41 to the liquid injection head 1-1. The multiple connecting flow path openings AR-1 through which the connecting flow path RR-1 (an example of a "first flow path connection") is inserted, and the multiple connecting flow path openings AR-2 through which the connecting flow path RR-2 (an example of a "second flow path connection") for connecting the common flow path component 41 to the flow path of the liquid injection head 1-2 is inserted, when viewed in the Z1 direction, the area of ​​each of the multiple connecting flow path openings AR-1 and the area of ​​each of the multiple connecting flow path openings AR-2 are smaller than the area of ​​the inner side of the outer periphery of the stacked structure 55.

[0361] According to Appendix 2-7, compared with the scheme of providing an opening on the support plate 50 that is larger than the outer periphery of the laminated structure 55, the rigidity of the support plate 50 can be improved.

[0362] Appendix 2-8

[0363] The head unit HD mentioned in Appendix 2-8 is the head unit HD mentioned in Appendix 2-1 to Appendix 2-7. It is characterized by having a liquid injection head 1-2 supported on the lower side surface P511 of the support plate 50 and spraying liquid in the Z1 direction, and a common electrical component 42 provided in the Z2 direction as seen from the support plate 50 and electrically connected to the electronic components of the liquid injection head 1-1 and the liquid injection head 1-2. The support plate 50 has an electrical connection opening AC-1 for inserting a BtoB connector CN-1 (an example of a "first electrical connection part") for electrically connecting the common electrical component 42 to the electronic component of the liquid injection head 1-1, and an electrical connection opening AC-2 for inserting a BtoB connector CN-2 (an example of a "second electrical connection part") for electrically connecting the common electrical component 42 to the electronic component of the liquid injection head 1-2. When viewed in the Z1 direction, the area of ​​the electrical connection opening AC-1 and the area of ​​the electrical connection opening AC-2 are both smaller than the area of ​​the inner side of the outer periphery of the stacked structure 55.

[0364] According to Appendix 2-8, compared with the scheme of providing an opening on the support plate 50 that is larger than the outer periphery of the laminated structure 55, the rigidity of the support plate 50 can be improved.

[0365] Appendix 2-9

[0366] Notes 2-9 refer to the head unit HD as described in Notes 2-1 to 2-8, characterized in that the stacked structure 55 includes a filter unit 16, which includes a filter FF that allows ink flowing inside the liquid jet head 1-1 to pass through.

[0367] According to Appendix 2-9, it is possible to capture foreign objects and air bubbles contained in the ink supplied to the liquid jet head 1-1 in advance.

[0368] Postscript 2-10

[0369] Note 2-10 refers to the head unit HD as described in Notes 2-1 to 2-9, characterized in that the stacked structure 55 has a lower retainer 131 and an intermediate retainer 132 (an example of a "flow path board") for supplying ink to a plurality of head chips 12.

[0370] Postscript 2-11

[0371] Note 2-11 refers to the head unit HD mentioned in Notes 2-1 to 2-10, characterized in that the stacked structure 55 has a relay substrate 14 electrically connected to a plurality of head chips 12.

[0372] Postscript 2-12

[0373] The head unit HD mentioned in Appendix 2-12 is the head unit HD mentioned in Appendix 2-1 to Appendix 2-11, characterized in that the lower retainer 131 has a storage portion 131S located in the Z1 direction more than the mounting surface PS13 and accommodating the head chip 12, and the end of the storage portion 131S in the X1 direction orthogonal to the Z1 direction is located between the end of the head chip 12 in the X1 direction and the end of the protrusion 131S in the X1 direction.

[0374] According to Appendix 2-12, since the protrusion 131T is a structure that extends further outward than the storage portion 131S, it is easy to ensure space for accommodating the stacked structure 55.

[0375] Postscript 2-13

[0376] The head unit HD-B1 described in Appendix 2-13 is characterized by comprising a liquid ejection head 1-1 for ejecting ink in the Z1 direction and a support member 5 for supporting the liquid ejection head 1-1. The support member 5 comprises: a support plate 50 having a lower side surface P511 facing the Z1 direction, the lower side surface P511 being the surface supporting the liquid ejection head 1-1; and a head positioning pin SP for positioning the liquid ejection head 1-1 relative to the support plate 50. The liquid ejection head 1-1 comprises: a plurality of head chips 12 having a plurality of nozzle rows LL for ejecting ink; and a lower retainer 131-B2 ("one of the fixing members") on which the plurality of head chips 12 are fixed. Example), and a stacked structure 55 comprising multiple stacked substrates stacked in the Z1 direction and stacked in the Z2 direction opposite to the Z1 direction relative to the mounting surface PS13 provided on the lower retainer 131-B2. The stacked structure 55 has an opposing portion BT opposite to the lower side surface P511. The lower retainer 131-B2 has a protrusion 131T protruding from the mounting surface PS13 in the Z2 direction. The protrusion 131T has a contact surface PT13 that contacts the lower side surface P511 and a support plate positioning hole AB that is provided corresponding to the head positioning pin SP and is used for positioning the liquid injection head 1-1 and the support plate 50.

[0377] Postscript 2-14

[0378] The liquid injection device 100 described in Appendix 2-14 is characterized by having a head unit HD (or possibly a head unit HD-B1 or head unit HD-B2) as described in Appendix 2-1 to 2-13, and a main frame 900 supporting the head unit HD. The support member 5 includes: a frame positioning hole AQ (an example of a "third positioning part") disposed on a support plate 50 with a flat plate portion 51 having a lower side surface P511 and used for positioning the main frame 900 and the support member 5; and a frame fixing threaded hole AM ​​(an example of a "fixing part") disposed on the flat plate portion 51 and used for fixing the main frame 900 and the support plate 50.

[0379] According to Appendix 2-14, since the frame positioning hole AQ and the head positioning hole AP are set on the same plane, the positioning accuracy of the liquid injection head 1 relative to the main frame 900 is improved compared with the scheme where the head positioning hole AP and the frame positioning hole AQ are set on different planes.

[0380] C.3. Appendix 3

[0381] The following is a description of the liquid injection head 1 mentioned in Appendix 3.

[0382] Appendix 3-1

[0383] The liquid injection head 1 described in Appendix 3-1 is characterized by having: a filter fixing screw 61 (an example of a screw) that is inserted into a filter fixing threaded hole 63 (an example of a fixing hole) in the Z1 direction (an example of a "first direction") and passes through the substrate cover 15 (an example of a "first component") and the filter unit 16 (an example of a "second component") to fasten the substrate cover 15 to the filter unit 16; and a metal nut 62 that is inserted into a receiving portion 64 along the X1 direction and engages with the filter fixing screw 61, wherein the receiving portion 64 is configured to extend in the X1 direction (an example of a "second direction") that intersects the Z1 direction.

[0384] According to Appendix 3-1, since the insertion direction of the filter fixing screw 61 into the nut 62, i.e., the Z1 direction, and the insertion direction of the nut 62 into the receiving part 64, i.e., the X1 direction, are intersecting each other, the nut 62 can be prevented from falling off the receiving part 64 when the filter fixing screw 61 and the nut 62 are engaged.

[0385] Appendix 3-2

[0386] The liquid injection head 1 mentioned in Appendix 3-2 is the same as the liquid injection head 1 mentioned in Appendix 3-1, characterized in that the nut 62 is pressed into the receiving part 64.

[0387] According to Appendix 3-2, when the filter fixing screw 61 is engaged with the nut 62, it is possible to prevent the nut 62 from falling off the receiving part 64.

[0388] Appendix 3-3

[0389] The liquid injection head 1 mentioned in Appendix 3-3 is the liquid injection head 1 mentioned in Appendix 3-1 or Appendix 3-2, characterized in that the receiving portion 64 has an inner surface 641 (an example of a "first surface") that defines the end of the receiving portion 64 in the X1 direction, and when the nut 62 is in contact with the inner surface 641, when viewed in the Z1 direction, the threaded hole 621 provided on the nut 62 overlaps with the threaded hole 63 for fixing the filter.

[0390] According to Appendix 3-3, the position of nut 62 in the X1 direction can be easily guided.

[0391] Appendix 3-4

[0392] The liquid injection head 1 mentioned in Appendix 3-4 is the liquid injection head 1 mentioned in Appendix 3-1 to Appendix 3-3, characterized in that the receiving portion 64 has a position defining surface 642 (an example of a "second surface") for defining the position of the nut 62 received in the receiving portion 64 in the Z1 direction.

[0393] According to notes 3-4, the position of nut 62 can be prevented from changing in the Z1 direction.

[0394] Appendix 3-5

[0395] The liquid injection head 1 mentioned in Appendix 3-5 is the liquid injection head 1 mentioned in Appendix 3-1 to 3-4, characterized in that the receiving portion 64 has an inner surface 641 that defines the end of the receiving portion 64 in the X1 direction, and a nut ejection opening 65 (an example of an "opening") that communicates with the outside of the receiving portion 64 is provided on the inner surface 641.

[0396] According to Appendix 3-5, it becomes easy to remove the nut 62 from the receiving part 64 by pushing the nut 62 out of the nut with the opening 65 using a rod or the like.

[0397] Appendix 3-6

[0398] The liquid injection head 1 mentioned in Appendix 3-6 is the liquid injection head 1 mentioned in Appendix 3-1 to Appendix 3-5, characterized in that a threaded groove 622 extending in the X1 direction is provided on the nut 62.

[0399] According to Appendix 3-6, by tightening the screw into the threaded groove 622 and pulling it in the X2 direction, it becomes easy to remove the nut 62 from the receiving part 64.

[0400] Appendix 3-7

[0401] The liquid injection head 1 mentioned in Appendix 3-7 is the liquid injection head 1 mentioned in Appendix 3-1 to Appendix 3-6, characterized in that a gap 644 is provided on the wall surface of the receiving part 64, which extends in the X1 direction and communicates with the threaded hole 621 of the nut 62 received in the receiving part 64.

[0402] According to Appendix 3-7, the nut 62 is easily removed from the receiving part 64 by inserting the front end of the L-shaped rod into the threaded hole 621 and pulling it in the X2 direction.

[0403] Appendix 3-8

[0404] The liquid jetting device 100 described in Appendix 3-8 is characterized by having a liquid jetting head 1 described in Appendix 3-1 to Appendix 3-7, and a liquid container 93 for storing ink supplied to the liquid jetting head 1.

[0405] C.4. Appendix 4

[0406] The following is a description of the liquid injection head 1 mentioned in Appendix 4.

[0407] Appendix 4-1

[0408] The liquid ejector head 1 described in Appendix 4-1 is characterized by comprising a plurality of head chips 12 for ejecting ink (an example of a "liquid"), a fixing plate 11 on which the plurality of head chips 12 are fixed, and a lower retainer 131 (an example of a "retainer") holding the plurality of head chips 12 between itself and the fixing plate 11. Each of the plurality of head chips 12 has a nozzle array LL for ejecting ink (an example of a "nozzle group"). The fixing plate 11 has a plurality of nozzle exposure openings 111 (an example of an "exposed opening") corresponding to the plurality of nozzle arrays LL so that each of the plurality of nozzle arrays LL corresponding to the plurality of head chips 12 is exposed to the outside, and a fixing plate opening 77 (an example of an "orifice") different from the plurality of nozzle exposure openings 111. The lower retainer 131 has a... When viewed from above in the Z2 direction, the lower retainer 131 has a peripheral wall portion 70 surrounding each of the multiple head chips 12, and a thinning portion 72 disposed inside the peripheral wall portion 70 and disposed between two adjacent head chips 12. The bottom surface of the lower retainer 131 has an adhesive area DS that overlaps with the peripheral wall portion 70 and is bonded to the fixing plate 11 when viewed from above in the Z2 direction, and a recess 73 disposed inside the adhesive area DS that overlaps with the separating wall portion 71 when viewed from above in the Z2 direction. When viewed from above in the Z2 direction, the fixing plate opening 77 is disposed inside the thinning portion 72. When viewed from above in the Z2 direction, the recess 73 overlaps with the fixing plate opening 77 and is disposed inside the individual adhesive area DSS and spaced apart from the individual adhesive area DSS.

[0409] According to Appendix 4-1, since the individual bonding area DSS is spaced apart from the recess 73, it is possible to prevent the adhesive DX1 applied to the individual bonding area DSS from mixing with the adhesive DX2 applied to seal the opening 77 of the fixing plate. Therefore, according to Appendix 4-1, it is possible to prevent poor adhesion between the lower retainer 131 and the fixing plate 11.

[0410] Appendix 4-2

[0411] The liquid injection head 1 mentioned in Appendix 4-2 is the same as the liquid injection head 1 mentioned in Appendix 4-1, characterized in that the recess 73 is filled with adhesive DX2.

[0412] Appendix 4-3

[0413] The liquid injection head 1 mentioned in Appendix 4-3 is the liquid injection head 1 mentioned in Appendix 4-1 or Appendix 4-2, characterized in that the adhesive DX2 filled in the recess 73 is separately configured from the adhesive DX1 that bonds the fixing plate 11 to the lower retainer 131 in the separate bonding area DSS.

[0414] Appendix 4-4

[0415] The liquid injection head 1 mentioned in Appendix 4-4 is the same liquid injection head 1 mentioned in Appendix 4-1 to Appendix 4-3, characterized in that, when viewed from above in the Z2 direction, the size of the recess 73 is larger than the size of the opening 77 of the fixing plate.

[0416] Postscript 4-5

[0417] The liquid injection head 1 mentioned in Appendix 4-5 is the liquid injection head 1 mentioned in Appendix 4-1 to Appendix 4-4, characterized in that the bottom surface of the lower retainer 131 has an outer peripheral recess 75 disposed on the outer periphery of the recess 73, and the distance from the fixing plate 11 to the bottom surface of the recess 73 is longer than the distance from the fixing plate 11 to the bottom surface of the outer peripheral recess 75.

[0418] Appendix 4-6

[0419] The liquid injection head 1 mentioned in Appendix 4-6 is the same liquid injection head 1 mentioned in Appendix 4-1 to Appendix 4-5, characterized in that the distance from the fixing plate 11 to the bottom surface of the recess 73 is less than the diameter of the recess 73 when viewed from above.

Claims

1. A head unit, characterized by, Possessing: a first liquid ejection head that ejects liquid in a first direction; and a support member that supports the first liquid ejection head, the support member possesses: a support plate that has a first face that faces the first direction, the first face being a face that supports the first liquid ejection head; and a first positioning portion that performs positioning of the first liquid ejection head and the support plate, the first liquid ejection head possesses: a plurality of head chips that have a plurality of nozzle groups that eject liquid; a cover member that is formed with a plurality of exposure opening portions for exposing the plurality of nozzle groups, respectively, to the outside, the plurality of head chips being fixed to the cover member; a base member to which the cover member is fixed; and a laminated structure that includes a plurality of laminated substrates that are laminated in the first direction and that are laminated in a second direction that is opposite to the first direction with respect to a placement face that is provided to the base member, the laminated structure possesses an opposing portion that opposes the first face, the base member possesses a protruding portion that protrudes from the placement face in the second direction, the protruding portion possesses: a contact face that contacts the first face; and a second positioning portion that is provided in correspondence with the first positioning portion and that performs positioning of the first liquid ejection head and the support plate.

2. The head unit according to claim 1, wherein an area of the opposing portion in the laminated structure is larger than an area of a non-opposing portion in the laminated structure that does not overlap with the support plate, as viewed in the first direction.

3. The head unit according to claim 1, wherein a plurality of openings that penetrate the support plate in the first direction are provided to the support plate, each of the plurality of openings is smaller than an ejection face of the first liquid ejection head, as viewed in the first direction.

4. The head unit according to claim 1, wherein one of the first positioning portion and the second positioning portion is a through-hole or a positioning hole having a bottom wall, the other of the first positioning portion and the second positioning portion is a positioning pin that is inserted into the through-hole or the positioning hole.

5. The head unit according to claim 1, wherein the base member has a portion that overlaps with the head chip, as viewed in a third direction that is orthogonal to the first direction.

6. The head unit according to claim 1, wherein the plurality of head chips are fixed with respect to the base member. the head unit possesses:

7. The head unit of claim 1, wherein, a second liquid ejection head that is supported by the first face of the support plate and that ejects liquid in the first direction; and a common flow path member that is provided in the second direction from the support plate and that connects a flow path of the first liquid ejection head and a flow path of the second liquid ejection head, the support plate possesses a plurality of openings through which a first flow path connection portion and a second flow path connection portion are inserted, the first flow path connection portion connecting the common flow path member and the flow path of the first liquid ejection head, the second flow path connection portion connecting the common flow path member and the flow path of the second liquid ejection head, ​ Each of the plurality of openings has an area smaller than an area of an inner side of an outer periphery of the layered structure when viewed in the first direction.

8. The head unit of claim 1, wherein, The head unit includes: a second liquid ejection head supported on the first face of the support plate and ejecting liquid in the first direction; and a common electrical component disposed in the second direction from the support plate and electrically connected to the electronic component of the first liquid ejection head and the electronic component of the second liquid ejection head, the support plate includes a plurality of openings through which a first electrical connection portion and a second electrical connection portion are inserted, the first electrical connection portion electrically connecting the common electrical component and the electronic component of the first liquid ejection head, and the second electrical connection portion electrically connecting the common electrical component and the electronic component of the second liquid ejection head, Each of the plurality of openings has an area smaller than an area of an inner side of an outer periphery of the layered structure when viewed in the first direction.

9. The head unit according to claim 1, wherein the layered structure includes a filter unit including a filter through which liquid flowing inside the first liquid ejection head passes.

10. The head unit according to claim 1, wherein the layered structure includes a flow path plate for supplying liquid to the plurality of head chips.

11. The head unit according to claim 1, wherein the layered structure includes a relay substrate electrically connected to the plurality of head chips.

12. The head unit according to claim 1, wherein the base member includes a housing portion located at a position closer to the first direction than the placement face and housing the head chip, an end portion of the housing portion in a third direction orthogonal to the first direction is located between an end portion of the head chip in the third direction and an end portion of the protruding portion in the third direction.

13. A head unit characterized by comprising: includes: a first liquid ejection head ejecting liquid in a first direction; and a support member supporting the first liquid ejection head, the support member includes: a support plate having a first face facing the first direction, the first face being a face on which the first liquid ejection head is supported; and a first positioning portion for positioning the first liquid ejection head and the support plate, the first liquid ejection head includes: a plurality of head chips having a plurality of nozzle groups ejecting liquid; a fixing member on which the plurality of head chips are fixed; and a layered structure including a plurality of layered substrates layered in the first direction and layered in a second direction opposite to the first direction with respect to a placement face provided to the fixing member, the fixing member includes a protruding portion protruding from the placement face in the second direction, the layered structure includes an opposing portion opposite to the first face, the protruding portion includes: a contact face contacting the first face; and a second positioning portion provided in correspondence with the first positioning portion and for positioning the first liquid ejection head and the support plate.

14. A liquid ejection device, comprising: includes: the head unit according to claim 1 or claim 13; and a main body frame supporting the head unit, the support member includes: A third positioning portion is arranged on the flat plate portion of the support plate provided with the first surface, and is used for positioning the main frame and the support plate. A fixing portion is arranged on the flat plate portion, and is used for fixing the main frame and the support plate.

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