Wafer anti-sticking transmission mechanism

Abstract

The invention relates to a wafer anti-sticking transmission mechanism which comprises a base, a supporting rotating wheel set, a plurality of supporting rods, a transmission module connected with the supporting rotating wheel set and a driving module, the supporting rotating wheel set comprises two supporting rotating wheels rotationally arranged on the base, and the two supporting rotating wheels in the same set are located at the same height and spaced from each other; the multiple supporting rods correspond to the supporting rotating wheels one to one, are coaxially fixed to the corresponding supporting rotating wheels and extend in the horizontal direction. The driving module is configured to drive the two supporting rotating wheels in the same supporting rotating wheel set to rotate reversely so as to drive the correspondingly arranged supporting rods to rotate synchronously and reversely, so that the wafer is always in a dynamic bearing state by the supporting rods, the continuous solidification and crystallization process of a corrosive residual liquid film at a contact point is effectively broken, and the service life of the wafer is prolonged. And the adhesion between the wafer and the supporting structure is fundamentally prevented.

Description

Technical Field

[0001] This invention belongs to the technical field of wafer quality inspection equipment, and specifically relates to a wafer anti-sticking transport mechanism. Background Technology

[0002] Currently, in the silicon carbide crystal manufacturing process, to accurately assess the crystal crystallization quality, the silicon carbide crystal is typically cut into wafers, which are then supported by a wafer frame and immersed in a high-temperature corrosive molten liquid (such as molten potassium hydroxide KOH at approximately 400°C) for etching treatment. By observing the etching morphology on the wafer surface, key quality indicators such as internal crystal defects and dislocation density can be effectively determined.

[0003] However, after high-temperature etching and removal from the molten metal, existing wafer frames often leave some molten etching solution on the wafer surface. As the temperature drops below the freezing point, the remaining KOH and other corrosive media rapidly solidify, causing a strong bond between the wafer and the wafer frame. This bonding phenomenon makes it difficult to safely and completely separate the wafer from the frame. Forcible disassembly can easily cause wafer breakage or microcracks, severely affecting subsequent wafer processing and performance evaluation, thereby reducing overall process efficiency and product yield.

[0004] Therefore, there is an urgent need to develop a transfer mechanism that can effectively prevent the wafer and the wafer frame from sticking together after the high-temperature etching process, so as to improve the operability and reliability of the silicon carbide wafer processing process and ensure the integrity of the wafer structure and the accuracy of detection. Summary of the Invention

[0005] The purpose of this invention is to provide a wafer anti-sticking transport mechanism.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows: This invention provides a wafer anti-sticking transport mechanism, comprising: Base; The support roller assembly has one set or multiple sets arranged at intervals along the vertical direction. Each support roller assembly includes two support rollers rotatably mounted on the base, and the two support rollers in the same set are located at the same height and spaced apart from each other. Multiple support rods are provided, each corresponding to a support wheel, and the support rods are coaxially fixed with the corresponding support wheels and extend horizontally. A transmission module, connected to the support wheel assembly, is used to transmit power to enable the support wheels to rotate synchronously. The drive module is configured to drive two support wheels in the same support wheel assembly to rotate in opposite directions.

[0007] In some embodiments, the transmission module includes a first transition wheel, a second transition wheel, and an annular conveyor. The first and second transition wheels are respectively disposed on the upper and lower sides of the support roller assembly; the annular conveyor is sequentially wound and tensioned around all the support rollers, the first transition wheel, and the second transition wheel.

[0008] In some embodiments, the axisymmetric lines of all support rollers, the first transition roller, and the second transition roller located on the same side of the support roller assembly are coplanar.

[0009] In some embodiments, when there is only one set of support rollers, the winding path of the annular conveyor is as follows: it goes around the outside of the first transition roller, goes down around the inside of the support roller directly below it, then goes around the outside of the second transition roller, turns to the other support roller and goes around its outside, finally forming a transmission closed loop.

[0010] In some embodiments, when there are multiple sets of support rollers, the winding path of the annular conveyor is as follows: it passes around the outside of the first transition roller, goes down and passes around the inside of the first support roller directly below it, and then passes around each subsequent support roller below it in sequence from the outside to the inside; subsequently, the annular conveyor passes around the outside of the second transition roller, turns to the lowest support roller on the other side and passes around its outside, and then passes around each subsequent support roller above it in sequence from the inside to the outside on that side, finally forming a transmission closed loop.

[0011] In some embodiments, the annular conveyor is an annular conveyor belt or an annular chain. The annular conveyor belt can be a toothed belt or a flat belt. When a toothed belt is used, the surfaces of the support pulley, the first steering pulley, and the second steering pulley are provided with toothed grooves that mesh with the toothed belt.

[0012] In some embodiments, the rotational linear velocities of the first transition wheel, the second transition wheel, and the supporting wheel are equal.

[0013] In some embodiments, the drive module is drivenly connected to one or more of the support rollers, the first transition roller, and the second transition roller, so as to drive all the support rollers to rotate synchronously through the transmission module. Preferably, the drive module includes a drive motor, the output shaft of which is connected to and coaxial with any of the support rollers, the first transition roller, and the second transition roller.

[0014] In some embodiments, the number of the support roller assemblies is set to an odd number.

[0015] In some embodiments, the two support rollers in the same support roller assembly have the same linear rotational velocity.

[0016] The present invention also provides a wafer quality inspection system, which includes the wafer anti-sticking transport mechanism described above.

[0017] Due to the application of the above-described technical solution, the present invention has at least the following advantages compared with the prior art: The wafer anti-adhesion transfer mechanism provided by this invention drives two support rollers in the same support roller group to rotate in opposite directions via a drive module, which in turn drives the corresponding support rods to rotate synchronously in opposite directions, ensuring that the wafer is always dynamically supported by the support rods. This dynamic contact mode effectively interrupts the continuous solidification and crystallization process of corrosive residual liquid film at the contact point, fundamentally preventing adhesion between the wafer and the support structure. As the process is completed, the wafer is gradually cooled to room temperature or within a set safe temperature range under controlled conditions. Because adhesion has been successfully prevented, the wafer can be extracted or transferred efficiently and without damage. Attached Figure Description

[0018] Figure 1 This is a front view of the wafer anti-sticking transport mechanism provided in Embodiment 1 of the present invention; Figure 2 This is a side view of the wafer anti-sticking transport mechanism provided in Embodiment 1 of the present invention; Figure 3 This is a top view of the wafer anti-sticking transport mechanism provided in Embodiment 1 of the present invention; Among them, 1. base; 2. support wheel; 3. support rod; 41. annular conveyor; 42. first transition wheel; 43. second transition wheel; 5. drive motor; 6. wafer. Detailed Implementation

[0019] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the embodiments of the invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0020] In the description of the embodiments of the present invention, it should be understood that the terms "upper" and "lower," etc., indicate the orientation or positional relationship as described above. Figure 1 The orientations are defined as shown, such as the orientation of the drive motor 5 being "down" and the orientation of the first transition wheel 42 being "up". The above description of orientation terms is only for the convenience of describing the embodiments of the present invention and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of the present invention.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of the present invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0022] In embodiments of the present invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0023] The following disclosure provides many different implementations or examples for carrying out different structures of the embodiments of the present invention. To simplify the disclosure of the embodiments of the present invention, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the embodiments of the present invention. Furthermore, reference numerals and / or reference letters may be repeated in different examples of the embodiments of the present invention; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0024] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0025] Example 1: A wafer anti-sticking transport mechanism, such as Figures 1 to 3 As shown, it includes a base 1, a set of supporting rollers, multiple support rods 3, a transmission module, and a drive module. The set of supporting rollers has one group or multiple groups arranged at intervals along the vertical direction. Each group of supporting rollers includes two supporting rollers 2 rotatably mounted on the base 1, with the two supporting rollers 2 in the same group located at the same height and spaced apart from each other. Multiple support rods 3 are arranged one-to-one with the supporting rollers 2, and the support rods 3 are coaxially fixed with their corresponding supporting rollers 2 and extend horizontally. That is, the two support rods 3 corresponding to each group of supporting rollers define a bearing surface parallel to the horizontal plane. The transmission module is connected to the supporting roller group and is used to transmit power to make each group of supporting rollers 2 rotate synchronously. The drive module is configured to drive two supporting rollers 2 in the same supporting roller group to rotate in opposite directions.

[0026] The number of support wheel assemblies can be flexibly designed according to actual needs, for example, it can be set to 2, 3, 4, 5 or other multiple sets. In some embodiments, only 1 set can be set to meet the requirements of simple structure or special layout. As a preferred method, the number of support wheel assemblies can be set to an odd number, so that the support wheel 2 is subjected to more balanced force and more stable movement during transmission, thereby improving the overall transmission coordination. The two support wheels 2 in the same support wheel assembly have equal rotational linear velocities, and the rotational linear velocities of the support wheels 2 in different support wheel assemblies are preferably equal. In this embodiment, there are 3 support wheel assemblies, and the axis centers of the three support wheels 2 located on the same side are coplanar, and the rotational linear velocities of all support wheels 2 are equal.

[0027] Furthermore, the spacing between the two supporting rollers 2 on the same bearing surface can be specifically designed according to the size of the supported wafer 6 (such as a silicon carbide wafer 6) to ensure that the wafer 6 can completely cover the bearing surface and avoid edge suspension or uneven force. The distance between two adjacent supporting roller groups can also be reasonably set according to the specific structural layout and functional requirements to ensure that each supporting roller group is independent and does not interfere with each other during operation, while taking into account the compactness and coordination of the overall structure.

[0028] The transmission module includes a first transition wheel 42, a second transition wheel 43, and an annular conveyor 41. The first transition wheel 42 and the second transition wheel 43 are respectively located on the upper and lower sides of the support wheel assembly. Preferably, the first transition wheel 42 and the second transition wheel 43 are coplanar with the axis of all support wheels 2 located on the same side (such as the left or right side) of the support wheel assembly. The annular conveyor 41 is sequentially wound and tensioned around all the support wheels 2, the first transition wheel 42, and the second transition wheel 43, forming a closed transmission circuit.

[0029] In this embodiment, as Figure 3 As shown, the winding path of the annular conveyor 41 is as follows: it goes around the outside of the first transition wheel 42, goes down and around the inside of the first support wheel 2 directly below it, and then goes around each of the subsequent support wheels 2 below it in sequence from the outside to the inside; then, the annular conveyor 41 goes around the outside of the second transition wheel 43, turns to the bottom support wheel 2 on the other side (left side) and goes around it from the outside; finally, on this side, it goes around each of the subsequent support wheels 2 above it in sequence from the inside to the outside, and finally forms a transmission closed loop.

[0030] The annular conveyor 41 can be an annular conveyor belt or an annular chain. The annular conveyor belt can be a toothed belt or a flat belt. When a toothed belt is used, the surfaces of the supporting pulley 2, the first steering pulley, and the second steering pulley are provided with toothed groove structures that mesh with the toothed belt to ensure accurate transmission and anti-slip. If an annular chain is used, the surfaces of the aforementioned pulleys can be provided with protruding ridges or chain teeth structures that cooperate with the chain, thereby achieving reliable meshing and power transmission.

[0031] The drive module is preferably connected to any of the support rollers 2, the first transition roller 42, or the second transition roller 43 to drive all the support rollers 2 to rotate synchronously via the transmission module. Preferably, the drive module includes a drive motor 5 for simultaneously driving all the support rollers 2, the first transition roller 42, and the second transition roller 43 to rotate. In this embodiment, the output shaft of the drive motor 5 is connected to and coaxially arranged with the second transition roller 43.

[0032] The base 1 is preferably L-shaped, with its bottom used to install the drive module and its sides used to install the support wheel 2 and the transmission module.

[0033] In use, the base 1 can be connected to the robotic arm, the drive motor 5 is turned on, and the second transition wheel 43 rotates, which drives the annular conveyor 41 to rotate, thereby driving the support wheel 2 to rotate, and then driving the support rod 3 to rotate. After the wafer frame pulls the wafer 6 out of the molten etching solution, the support rod 3 is inserted under the wafer 6 and moved upward to lift the wafer 6. The wafer 6 and the support rod 3 make rotational contact to avoid the wafer 6 sticking to the support rod 3. When the temperature of the wafer 6 drops to room temperature or a safe temperature, the wafer 6 can be easily removed.

[0034] The wafer anti-sticking transport mechanism of the present invention has a simple, scientific and reasonable structure, is safe and reliable, easy to use, and has significant effects. It can be widely used in the etching process and high-temperature treatment of various artificial crystal wafers.

[0035] The present invention has been described in detail above, with the aim of enabling those skilled in the art to understand and implement the invention. However, this description should not be construed as limiting the scope of protection of the invention. All equivalent changes or modifications made in accordance with the spirit and essence of the invention should be included within the scope of protection of the invention.

Claims

1. A wafer anti-stiction transport mechanism, comprising: The base (1) comprises: a plurality of supporting roller groups, each group comprising two supporting rollers (2) rotatably arranged on the base (1) and located at the same height and spaced apart from each other; a plurality of supporting rods (3) corresponding to the supporting rollers (2) and coaxially fixed to the corresponding supporting rollers (2) and extending in the horizontal direction; a transmission module connected to the supporting roller groups for transmitting power to synchronously rotate the supporting rollers (2) in each group, and a driving module configured to drive the two supporting rollers (2) in the same supporting roller group to rotate in opposite directions. The transmission module comprises a first transition wheel (42), a second transition wheel (43) and an annular transmission member (41).

2. The wafer anti-stiction transport mechanism of claim 1, wherein, The first transition wheel (42) and the second transition wheel (43) are arranged on the upper and lower sides of the supporting roller groups. The annular transmission member (41) is wound and tensioned on all the supporting rollers (2), the first transition wheel (42) and the second transition wheel (43) in sequence. The axial lines of all the supporting rollers (2), the first transition wheel (42) and the second transition wheel (43) on the same side of the supporting roller groups are coplanar.

3. The wafer anti-stiction transport mechanism of claim 2, wherein, When the supporting roller groups have only one group, the winding path of the annular transmission member (41) is: from the outside of the first transition wheel (42), passing through the inside of the supporting roller (2) directly below, then passing through the outside of the second transition wheel (43), turning to the other side supporting roller (2) and passing through from the outside, finally forming a transmission closed loop.

4. The wafer anti-stiction transport mechanism of claim 3, wherein, When the supporting roller groups have multiple groups, the winding path of the annular transmission member (41) is: from the outside of the first transition wheel (42), passing through the inside of the first supporting roller (2) directly below, then passing through each of the subsequent supporting rollers (2) from outside to inside in sequence; then, the annular transmission member (41) passes through the outside of the second transition wheel (43), turns to the other side of the lowermost supporting roller (2) and passes through from the outside, and then passes through each of the subsequent supporting rollers (2) from inside to outside in sequence on this side, finally forming a transmission closed loop. The annular transmission member (41) is an annular transmission belt or an annular chain.

5. The wafer anti-stiction transport mechanism of claim 2, wherein, The rotational linear speed of the first transition wheel (42), the second transition wheel (43) and the supporting roller (2) is equal.

6. The wafer anti-stiction transport mechanism of claim 2, wherein, The driving module is drivingly connected to one or more of the supporting roller (2), the first transition wheel (42) and the second transition wheel (43) to drive all the supporting rollers (2) to rotate synchronously through the transmission module.

7. A wafer anti-stiction transport mechanism according to any one of claims 2 to 6, wherein, The driving module comprises a driving motor (5) whose output shaft is connected to any one of the supporting roller (2), the first transition wheel (42) and the second transition wheel (43).

8. The wafer anti-stiction transport mechanism of claim 7, wherein, The rotational linear speed of the two supporting rollers (2) in the same supporting roller group is equal.

9. The wafer debonding transport mechanism of claim 1, wherein, ​

Images