Server refrigeration device, electronic equipment and storage medium

Abstract

The invention relates to the technical field of refrigeration devices, and provides a server refrigeration device, electronic equipment and a storage medium. The server refrigeration device is applied to a server module, the server module comprises a plurality of servers, each server comprises a server body and a server power supply, the server refrigeration device comprises a plurality of refrigeration modules, the plurality of refrigeration modules are in one-to-one correspondence with the plurality of servers, and the refrigeration modules are used for conveying a cooling medium to the servers. The refrigeration modules are used for refrigerating the server to cool the server, and the different refrigeration modules are used for conveying different cooling media.

Description

Technical Field

[0001] This application relates to the field of cooling equipment technology, and more particularly to server cooling equipment, electronic equipment and storage media. Background Technology

[0002] With the rapid development of information technology, servers, as the core equipment of data centers, are constantly improving in terms of processing power and integration, resulting in a corresponding increase in heat generation. Efficient and reliable heat dissipation solutions are crucial for ensuring stable server operation, extending equipment lifespan, and reducing energy consumption. Currently, common server cooling methods mainly include air cooling and liquid cooling. Among them, liquid cooling technology is increasingly widely used in high-end computing and high-density deployment scenarios due to its higher heat dissipation efficiency and lower noise.

[0003] However, existing server liquid cooling solutions mostly employ a centralized or unified loop design, supplying the entire server rack or a group of servers with the same temperature and flow rate of cooling medium. In actual operation, the load conditions of different servers within a data center often vary, resulting in different operating power and heat generation. Adopting a uniform cooling strategy can lead to overcooling of low-load servers, resulting in energy waste; while high-load servers may experience insufficient heat dissipation, posing a risk of localized overheating and impacting performance and reliability. Furthermore, fixed cooling capacity is difficult to flexibly adapt to dynamically changing server workloads.

[0004] Therefore, a cooling device that can more precisely match the actual heat dissipation needs of the server is needed to achieve a higher energy efficiency ratio and more reliable heat dissipation. Summary of the Invention

[0005] This application aims to solve at least one of the technical problems existing in the related art. To this end, this application proposes a server cooling device, electronic device, and storage medium.

[0006] According to an embodiment of the first aspect of this application, a server cooling device is applied to a server module, the server module including multiple servers, each server including a server body and a server power supply, the server cooling device including multiple cooling modules, each cooling module corresponding to one of the multiple servers, the cooling modules being used to deliver a cooling medium to the server to cool the server, wherein different cooling modules are used to deliver different cooling media.

[0007] According to one embodiment of this application, the plurality of servers include a first server and a second server, wherein the rated power of the first server is greater than the rated power of the second server; The plurality of cooling modules include a first cooling module and a second cooling module. The first cooling module is used to deliver a first cooling medium to the first server, and the second cooling module is used to deliver a second cooling medium to the second server. The specific heat capacity of the first cooling medium is greater than that of the second cooling medium.

[0008] According to one embodiment of this application, the server module further includes a housing, the housing having a mounting cavity for containing coolant, the server being installed in the mounting cavity and immersed in the coolant, the housing having an inlet communicating with the mounting cavity and an outlet communicating with the mounting cavity, the output end of the cooling module being connected to the inlet, and the input end of the cooling module being connected to the outlet.

[0009] According to one embodiment of this application, the server cooling device further includes a liquid driving component, which is installed in the mounting cavity and is used to drive the liquid in the mounting cavity to flow up and down.

[0010] The server system according to a second aspect of this application includes the server cooling device described above.

[0011] A control method based on the server cooling device described above, according to an embodiment of a third aspect of this application, includes: Based on the different real-time power of the servers, the target cooling medium for each server is determined. The operation of multiple cooling modules is controlled based on the different target cooling media of the servers.

[0012] The control device according to the fourth aspect of this application includes: A determination module is used to determine the target cooling medium for different servers based on their real-time power. A control module is used to control the operation of multiple cooling modules based on different target cooling media of the servers.

[0013] An electronic device according to a fifth aspect of this application includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the control method described above.

[0014] According to a sixth aspect of this application, a non-transitory computer-readable storage medium includes a computer program that, when executed by the processor, implements the control method described above.

[0015] According to a seventh aspect embodiment of this application, the computer program product includes a computer program that, when executed by the processor, implements the control method described above.

[0016] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a flowchart illustrating the control method provided by the present invention; Figure 2 This is a schematic diagram of the control device provided by the present invention; Figure 3 This is a schematic diagram of the structure of the electronic device provided by the present invention; Figure 4 This is a schematic diagram of the server module provided by the present invention; Figure 5 This is one of the structural schematic diagrams of the server power supply provided by the present invention; Figure 6 This is a partial structural diagram of the server module provided by the present invention; Figure 7 This is the second schematic diagram of the server power supply provided by the present invention; Figure 8 This is the third schematic diagram of the server power supply provided by the present invention; Figure 9 This is a schematic diagram of the server cooling device provided by the present invention; Figure 10 This is a schematic diagram of the structure of the liquid drive assembly provided by the present invention. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] This application provides embodiments of a control method. It should be noted that although the logical order is shown in the flowchart, under certain data conditions, the steps shown or described may be performed in a different order than that shown here.

[0021] Before introducing the control method of the embodiments of this application, the application scenarios of the control method will be explained first. The control method of this application can be applied to smart terminals such as smartphones, tablets and computers, and can also be applied to servers. This application does not make any special limitations here, as long as it can carry and implement the control method of this application.

[0022] The following explanation uses the application of control methods on the server side, but it should be understood that the control methods are not limited to the server side.

[0023] The following is combined with Figures 1 to 10 This application describes the server cooling device, electronic equipment, and storage medium.

[0024] According to the embodiments of the first aspect of this application, such as Figure 9 As shown, a server cooling device is applied to a server module, which includes multiple servers. Each server 2 includes a server body and a server power supply 3. The server cooling device includes multiple cooling modules 5, which correspond one-to-one with each of the multiple servers 2. Each cooling module 5 is used to deliver a cooling medium to the server 2 to cool it. Different cooling modules 5 are used to deliver different cooling media.

[0025] According to the server cooling device of the present application embodiment, different cooling media have different cooling capabilities, and different cooling modules 5 can deliver different cooling media to different servers to achieve targeted cooling and heat dissipation according to the actual situation of the server.

[0026] It is understandable that by obtaining the actual operating power of different servers, the cooling module 5 can deliver coolant with stronger cooling capacity to servers with higher actual operating power, and vice versa.

[0027] In some embodiments, such as Figure 9 As shown, the plurality of servers 2 include a first server 21 and a second server 22, wherein the rated power of the first server 21 is greater than the rated power of the second server 22; The plurality of cooling modules 5 include a first cooling module 51 and a second cooling module 52. The first cooling module 51 is used to deliver a first cooling medium to the first server 21, and the second cooling module 52 is used to deliver a second cooling medium to the second server 22. The specific heat capacity of the first cooling medium is greater than that of the second cooling medium.

[0028] It is understandable that the rated power of the first server 21 is greater than the rated power of the second server 22, meaning the first server 21 is a large server and the second server 22 is a small server. Delivering the first cooling medium, which has a higher specific heat capacity, to the first server 21 ensures its heat dissipation and stable operation. The second server 22, with a lower rated power, generates less heat; therefore, the second cooling medium, with a lower specific heat capacity, is used. This allows for targeted cooling based on the specific needs of each server.

[0029] In some embodiments, the server module further includes a housing with a mounting cavity for containing coolant. The server 2 is installed in the mounting cavity and immersed in the coolant. The housing has an inlet communicating with the mounting cavity and an outlet communicating with the mounting cavity. The output end of the cooling module 5 is connected to the inlet, and the input end of the cooling module 5 is connected to the outlet.

[0030] In some embodiments, such as Figure 10 As shown, the server cooling device also includes a liquid driving component 8, which is installed in the mounting cavity and is used to drive the liquid in the mounting cavity to flow up and down.

[0031] Understandably, the liquid drive component 8 can drive the liquid in the mounting cavity to flow up and down, improve the fluidity of the liquid in the mounting cavity, reduce the temperature of the liquid in the mounting cavity, and thus effectively reduce the temperature difference between different locations of the server.

[0032] Specifically, such as Figure 10 As shown, the liquid drive assembly 8 includes a liquid pipeline 81, an electromagnetic component 82, an electrode assembly 83, and a magnetic separator 84. The liquid pipeline 81 is vertically installed in the mounting cavity. The liquid pipeline 81 includes a lower port and an upper port that are arranged opposite to each other, and the lower port faces the liquid inlet. The electromagnetic component 82 is connected to the outer wall of the liquid pipeline 81. The electromagnetic component 82 is used to generate a magnetic field and make at least a portion of the liquid pipeline 81 within the magnetic field, wherein the flow direction of the liquid in the liquid pipeline 81 is perpendicular to the magnetic field. The electrode assembly 83 is connected to the liquid pipeline 81. The electrode assembly 83 is used to generate an electric field. The direction of the electric field is perpendicular to the magnetic field. The cooling medium in the liquid pipeline 81 is conductive. The magnetic separator 84 is sleeved on the outside of the electromagnetic component 82.

[0033] Understandably, according to the principles of magnetohydrodynamics, the liquid in the liquid pipe 81 will move from bottom to top under the action of the Lorentz force, which can drive the liquid flow in the mounting cavity and improve the temperature uniformity of the liquid in the mounting cavity.

[0034] Understandably, when current is applied to electrode assembly 83, the current flows through the conductive cooling medium. These moving charges (currents) are in the magnetic field generated by electromagnetic component 82. According to Fleming's left-hand rule, the current-carrying body will experience a force perpendicular to both the current direction and the magnetic field direction, namely the Lorentz force. The Lorentz force acts directly on the fluid itself, becoming a volume force that propels the fluid forward, thus achieving the pumping function.

[0035] Understandably, the electromagnetic isolation chamber can prevent the electromagnetic component 82 from leaking out, which is beneficial to increasing the magnetic field strength at the liquid pipeline 81. At the same time, it can also prevent the magnetic field from extending to the server and avoid the magnetic field from affecting the server.

[0036] In some examples, the cooling medium within the liquid line 81 is a high-conductivity coolant, such as a specially formulated water-glycol-based electrolyte, a liquid metal alloy (e.g., gallium indium tin alloy), or a high-purity ionic coolant. The conductivity of the cooling medium should be no less than 10 S / m to ensure sufficient Lorentz force is generated under reasonable electrical input.

[0037] In some examples, electrode assembly 83 is embedded in the tube wall and positioned opposite each other to ensure that the electric field direction is perpendicular to the magnetic field and the flow direction.

[0038] According to an embodiment of the second aspect of this application, the server system includes the server cooling device described above.

[0039] According to the embodiments of the third aspect of this application, such as Figure 3 As shown, the control method includes: Step 101: Determine the target cooling medium for different servers based on their real-time power. Step 102: Control the operation of multiple cooling modules based on the different target cooling media of the servers.

[0040] It is understandable that by obtaining the actual operating power of different servers, the cooling module can deliver coolant with stronger cooling capacity to servers with higher actual operating power, and vice versa.

[0041] like Figure 1 and Figure 4 As shown, a control method is applied to a server module, which includes a housing 1, a server 2, and a cooling module 5. The housing 1 has a mounting cavity 11 for containing coolant. The server 2 is installed in the mounting cavity 11 and is at least partially immersed in the coolant. The housing 1 has a coolant inlet and an coolant outlet communicating with the mounting cavity 11. The output end of the cooling module 5 is connected to the coolant inlet, and the input end of the cooling module 5 is connected to the coolant outlet. The control method further includes: Obtain the bloat level of server 2; It is understandable that server 2 will experience thermal expansion due to heat generation during operation, and the degree of expansion is positively correlated with temperature. By using deformation sensors (such as strain gauges or fiber optic deformation sensors) or displacement detection devices (such as laser rangefinders) installed on the server 2 casing or key components (such as the CPU or power module), the deformation or displacement of the server 2 casing or internal structure can be monitored in real time to obtain data on the degree of expansion.

[0042] Based on the degree of expansion of server 2, the real-time temperature of server 2 is determined; It is understandable that an expansion degree-temperature mapping model (such as a lookup table or mathematical model) can be established in advance through experiments or simulations. The expansion degree detected in step 101 can be input into the model and directly converted into the corresponding real-time temperature of server 2. This avoids the complexity of arranging temperature sensors in the coolant or inside server 2 and can reflect the comprehensive temperature of the server 2 as a whole or in local hot spots.

[0043] For example, the temperature of the coolant can be adjusted by controlling the refrigeration unit (such as a compressor or heat exchanger) of the refrigeration module 5.

[0044] For example, the flow rate of coolant can be adjusted by adjusting the speed of the coolant pump or the valve opening of the refrigeration module 5.

[0045] Based on the real-time temperature of the server 2, the operating parameters of the cooling module 5 are determined; Understandably, the operating parameters of the cooling module 5 include the temperature and flow rate of the coolant. Different coolant temperatures and flow rates will result in different cooling effects. When the real-time temperature of server 2 varies, the required coolant temperature and flow rate to control the temperature of server 2 within the standard temperature range will also vary. Therefore, the operating parameters of the cooling module 5 can be determined based on the real-time temperature of server 2.

[0046] The operation of the refrigeration module 5 is controlled according to its operating parameters to adjust the temperature and flow rate of the coolant.

[0047] According to the control method of this application embodiment, the degree of expansion of server 2 is first obtained, and then the real-time temperature of server 2 is determined based on the degree of expansion of server 2. Based on the real-time temperature of server 2, the operating parameters of the cooling module 5 can be determined. Finally, based on the operating parameters of the cooling module 5, the operation of the cooling module 5 is controlled to adjust the temperature and flow rate of the coolant. In other words, this application indirectly measures temperature by utilizing the physical characteristics of the thermal expansion of server 2 itself. This eliminates the need to deploy a large number of temperature sensors in a complex liquid-cooled environment to achieve real-time temperature detection of server 2, which helps reduce costs and failure rates. Simultaneously, by reflecting temperature changes through the degree of expansion, the operating parameters of the cooling module 5 are adjusted in real time, achieving precise temperature control and energy consumption optimization, thus improving the intelligence level of the data center.

[0048] In one embodiment of this application, such as Figure 7 As shown, the server module also includes a rigid sleeve 01 and a stress detector 02. The rigid sleeve 01 is sleeved on the outside of the server 2, and the stress detector 02 is located on the side of the rigid sleeve 01 away from the server 2. The stress detector 02 is used to detect the stress of the rigid sleeve 01 in order to determine the degree of expansion of the server 2 based on the stress of the rigid sleeve 01.

[0049] It is understandable that when server 2 expands, it will exert a force on rigid sleeve 01, thereby causing stress in rigid sleeve 01. Therefore, the stress of rigid sleeve 01 is detected by stress detector 02, and then the degree of expansion of server 2 can be determined by stress, thus realizing the detection of the degree of expansion of server 2.

[0050] Specifically, the step of obtaining the bloat level of server 2 includes: Based on the detection data from the stress detector 02, the degree of expansion of the server 2 is determined.

[0051] In one embodiment of this application, such as Figure 8As shown, the server module also includes a rigid sleeve 01 and a resonance detector 03. The rigid sleeve 01 is sleeved on the outside of the server 2, and the resonance detector 03 is located on the side of the rigid sleeve 01 away from the server 2. The resonance detector 03 is used to detect the shift of the resonance peak of the rigid sleeve 01, so as to determine the degree of expansion of the server 2 based on the shift of the resonance peak of the rigid sleeve 01.

[0052] It is understandable that when server 2 expands, it will exert a force on rigid sleeve 01, causing rigid sleeve 01 to deform under the force. As a result, the resonant peak of rigid sleeve 01 will also change. Therefore, the resonant detector 03 detects the shift of the resonant peak of rigid sleeve 01, and then the degree of expansion of server 2 can be determined by the shift of the resonant peak, thus realizing the detection of the degree of expansion of server 2.

[0053] It is understandable that when the rigid sleeve 01 is fitted onto the outer wall of the server 2, the resonant peak of the rigid sleeve 01 will shift when the state of the server 2 changes due to the contact between the rigid sleeve 01 and the outer wall of the server 2. In other words, the state of the server 2 is related to the shift of the resonant peak of the rigid sleeve 01. This application uses a resonant detector 03 to detect the shift of the resonant peak of the rigid sleeve 01. Based on the shift of the resonant peak of the rigid sleeve 01, the degree of expansion of the server 2 can be determined. Therefore, the degree of expansion of the server 2 can be detected without a large number of detection sensors, reducing the detection complexity and cost of the server 2.

[0054] For example, a mapping relationship between the expansion degree of server 2 and the offset of the resonance peak of rigid sleeve 01 can be established in advance. When the offset of the resonance peak of rigid sleeve 01 is obtained, the expansion degree of server 2 can be determined according to the mapping relationship.

[0055] In some systems, the resonant detector 03 is, for example, a harmonic oscillator.

[0056] Specifically, the step of obtaining the bloat level of server 2 includes: Based on the detection data from the resonant detector 03, the degree of expansion of the server 2 is determined.

[0057] In one embodiment of this application, such as Figure 1 and Figure 4 As shown, the control method includes a server module comprising a server power supply 3, which is installed within the mounting cavity 11 and is at least partially immersed in coolant. The server power supply 3 is connected to the server 2 and is used to supply power to the server 2. The control method also includes: Based on the operating mode of server 2, determine the real-time power required by server 2; Understandably, the operating mode of server 2 (such as low load, high load, standby, etc.) directly affects its power consumption. For example, during AI training or big data computing, server 2 operates in a high-load mode, resulting in higher power consumption; while during idle periods, power consumption is lower. The real-time power required by server 2 can be determined through monitoring its operating status (such as CPU / GPU utilization, task queues, etc.) or by using a preset power-mode mapping table.

[0058] Based on the real-time power requirements, determine the heat generated by server power supply 3. It is understandable that the heat generated by server power supply 3 is related to its power supply efficiency, and the power supply capacity of server power supply 3 is related to the power required in real time. Therefore, the heat generated by server power supply 3 can be determined based on the power required in real time.

[0059] Based on the heat generated by the server power supply 3, the operating parameters of the cooling module 5 are determined. Understandably, the operating parameters of the cooling module 5 include the coolant flow rate and coolant temperature to ensure that the heat dissipation efficiency matches the heat generation. Optimal parameters can be determined using lookup tables or computational models (such as thermodynamic formulas).

[0060] The operation of the refrigeration module 5 is controlled based on its operating parameters.

[0061] Understandably, based on the calculated operating parameters, the speed of the liquid pump in the cooling module 5 and the power of the cooling module 5 are adjusted so that the coolant flows through the server power supply 3 at a suitable flow rate and temperature, thereby achieving precise heat dissipation.

[0062] According to the control method of this application embodiment, the real-time power requirement of server 2 is determined based on the working mode of server 2. Based on the real-time power requirement, the heat generation of server power supply 3 can be determined. Based on the heat generation of server power supply 3, the operating parameters of cooling module 5, such as coolant flow rate and temperature, can be determined. That is, the operating parameters of cooling module 5 are derived from the heat generation. Then, the operation of cooling module 5 is controlled according to the operating parameters, so that the coolant can cool server power supply 3, keeping the temperature of server power supply 3 within a standard range. This achieves efficient heat dissipation control of server power supply 3 by intelligently adjusting the flow rate and temperature of coolant, improving the level of intelligence. Furthermore, it dynamically adjusts the heat dissipation strategy according to the load of server 2, avoiding over-cooling or insufficient heat dissipation, reducing the operating intensity of cooling module 5 under low load, and reducing unnecessary energy waste.

[0063] In one embodiment of this application, such as Figure 4 As shown, the server module also includes an impurity filter component 7; after the step of controlling the operation of the cooling module 5, the following steps are included: If the impurity content in the coolant exceeds the standard value, control the impurity filter assembly 7 to filter the coolant.

[0064] Understandably, after controlling the operation of the cooling module 5 based on its operating parameters, the impurity content in the coolant is detected. When the impurity content in the coolant exceeds the standard value, it indicates that the impurity content is excessive, which will lead to a decrease in the cooling effect of the coolant. Therefore, the impurity filter component 7 is controlled to filter the coolant to reduce the impurity content and ensure the cooling effect of the coolant. In other words, this embodiment adds the impurity filter component 7 to monitor and filter impurities in the coolant, ensuring the long-term stable operation of the heat dissipation system.

[0065] In some examples, optical sensors (such as turbidity sensors), conductivity sensors, or particulate detectors can be used to monitor the content of impurities (such as metal debris, oxides, dust, etc.) in the coolant in real time.

[0066] Specifically, the server module also includes a switching valve. The inlet of the switching valve is connected to the output end of the cooling module 5, and the first outlet of the switching valve is connected to the liquid inlet through a pipe. The impurity filter assembly 7 is connected between the second outlet and the liquid inlet of the switching valve. By controlling the switching valve, the switching valve can switch between a first state and a second state. In the first state, the switching valve connects the output end of the cooling module 5 and the pipe. At this time, the coolant does not pass through the impurity filter assembly 7. In the second state, the switching valve connects the output end of the cooling module 5 and the impurity filter assembly 7. At this time, the coolant passes through the impurity filter assembly 7 and then flows into the mounting cavity 11.

[0067] In some examples, the impurity filtration assembly 7 is, for example, a centrifuge or a magnetic filter. It should be noted that the appropriate filter element for the impurity filtration assembly 7 can be selected based on the type of impurity; no special limitations are imposed here.

[0068] In one embodiment of this application, the step of determining that the impurity content in the coolant exceeds a standard value includes: Get the current temperature value of server power supply 3; Obtain the total heat generated by server power supply 3 within a preset time period; After a preset time, obtain the subsequent temperature value of server power supply 3; The cooling efficiency is determined based on the current temperature, total heat production, and subsequent temperature. When the cooling efficiency is lower than the preset efficiency, it is determined that the impurity content in the coolant exceeds the standard value.

[0069] Understandably, when determining whether the impurity content in the coolant exceeds the standard value, the current temperature value of the server power supply 3 can be obtained first, and then the total heat generated by the server power supply 3 within a preset time period can be obtained. After the preset time period, the temperature of the server power supply 3 can be obtained again. By comparing the current temperature value with the subsequent temperature value, the temperature change of the server power supply 3 can be determined. Combined with the total heat generated, it can be determined how much heat of the server power supply 3 was removed by the coolant within the preset time period, and thus the cooling efficiency can be determined.

[0070] The cooling efficiency is compared with the preset efficiency. When the cooling efficiency is lower than the preset efficiency, it indicates that the impurity content in the coolant exceeds the standard, resulting in a decrease in cooling effect. This confirms that the impurity content in the coolant exceeds the standard value. In other words, this embodiment indirectly determines whether the coolant's heat dissipation efficiency has decreased due to impurity accumulation by analyzing the relationship between the heat generation of the server power supply 3 and temperature changes, thereby triggering a filtration operation. This avoids reliance on high-cost sensors and improves the system's reliability and economy.

[0071] In one embodiment of this application, such as Figure 6 As shown, the server module also includes a connecting pipe 101, a rigid component 102, and a resonance detection component 103. The connecting pipe 101 connects the liquid outlet and the input end of the cooling module 5. The rigid component 102 is sleeved on the outer wall of the connecting pipe 101. The resonance detection component 103 is located on the side of the rigid component 102 away from the connecting pipe 101. The resonance detection component 103 is used to detect the shift of the resonance peak of the rigid component 102. The step of determining that the impurity content in the coolant exceeds the standard value includes: Obtain the offset value of the resonance peak of rigid component 102; Based on the offset value of the resonance peak, the impurity content of the coolant in the connecting pipe 101 is determined.

[0072] It is understandable that since the impurity content in the coolant will affect the shift of the resonance peak of the rigid component 102, the impurity content in the coolant can be determined in real time by monitoring the changes in the resonance characteristics of the connecting pipe 101, so as to achieve more accurate and faster impurity detection.

[0073] Understandably, the initial calibration of the resonance peak can be performed in advance: when the coolant is pure (free of impurities), the rigid component 102 will generate an inherent resonant frequency f0 due to the liquid flow in the connecting pipe 101 (which can be determined in advance through experiments or simulations). Then, the impurity content of the coolant is changed sequentially, and the offset value of the resonance peak of the rigid component 102 is obtained. This establishes a mapping relationship between the impurity content and the offset value of the resonance peak of the rigid component 102, so that the impurity content of the coolant in the connecting pipe 101 can be directly determined based on the offset value of the resonance peak of the rigid component 102.

[0074] It should be noted that when the coolant contains impurities (such as particles, bubbles or oil), the density, viscosity or flow state of the liquid will change, resulting in changes in the vibration characteristics of the connecting pipe 101.

[0075] In one embodiment of this application, such as Figure 4 As shown, the impurity filtration assembly 7 includes an impurity filtration housing 71 and an impurity filtration pump 72. The input end of the impurity filtration pump 72 is connected to the liquid outlet, the output end of the impurity filtration pump 72 is connected to the inlet of the filter housing 1, and the outlet of the filter housing 1 is connected to the liquid inlet. The impurity filtration pump 72 is used to drive the coolant to flow between the mounting cavity 11 and the impurity filtration housing 71. The steps for controlling the impurity filtration assembly 7 to filter the coolant include: Based on the tasks of server 2, determine the predicted power required for server 2; It was determined that the predicted power required by server 2 was lower than the preset power during the target time period; During the target time period, the impurity filter pump 72 is controlled to drive the coolant to flow to the impurity filter housing 71.

[0076] It is understandable that the coolant in the mounting cavity 11 can be drawn into the impurity filter box 71 for filtration by the impurity filter pump 72, and then the filtered coolant can be transported back to the mounting cavity 11.

[0077] When controlling the impurity filter assembly 7 to filter the coolant, the preset required power of the server 2 is first determined according to the working task of the server 2. The time period when the preset required power is lower than the preset power is determined as the target time period. Then, during the target time period, the impurity filter pump 72 is controlled to drive the coolant to flow to the impurity filter box 71 to filter the coolant.

[0078] Filtering the coolant can reduce its flow rate or lower its level in the mounting cavity 11. However, in this embodiment, by determining the preset power required by the server 2, the filtration time period is set during a period when the server 2's power requirement is lower. At this time, the server 2 generates less heat, and even if the coolant flow rate is lower or the coolant level in the mounting cavity 11 drops, the server 2's heat dissipation needs can still be met, thus avoiding the server 2's temperature from becoming too high due to filtration of the coolant.

[0079] In one embodiment of this application, an online viscosity sensor and a temperature sensor are provided at the liquid inlet. The online viscosity sensor is used to detect the viscosity of the coolant, and the temperature sensor is used to detect the temperature of the coolant. After the step of controlling the operation of the refrigeration module 5, the method further includes: Determine that the real-time viscosity of the coolant exceeds the preset viscosity, and determine that the real-time temperature of the coolant exceeds the preset temperature; Control the speed of the pump in the refrigeration module 5.

[0080] It is understandable that the viscosity of the coolant affects the heat dissipation efficiency as the temperature changes. In this embodiment, an online viscosity sensor is installed in the coolant circuit. Combined with data collected by the temperature sensor, when high temperature and high viscosity are detected, the pump speed of the refrigeration module 5 is automatically increased by 15% to 20% to ensure stable flow, which is beneficial to improving heat dissipation efficiency and reducing pump energy consumption.

[0081] In one embodiment of this application, such as Figure 1 and Figure 4 As shown, the server module includes a server 2, a server power supply 3, and a liquid spraying assembly 4. The server 2 and server power supply 3 are both installed inside the mounting cavity 11. The liquid spraying assembly 4 is located on the outer wall of the housing 1 and is used to spray and cool the housing 1. The control method also includes: Obtain the first temperature value of the server power supply 3 and the second temperature value of the outer wall surface of the enclosure 1; For example, temperature data can be collected in real time using a temperature sensor: The first temperature value of server power supply 3 (e.g., the internal temperature of the power module); and The second temperature value of the outer wall surface of enclosure 1 (such as the temperature of the metal outer shell of enclosure 1). Determine that the first temperature value is greater than the first threshold, and determine that the second temperature value is greater than the second threshold; The spraying component 4 is controlled to spray and cool the tank 1.

[0082] Understandably, when the server module is placed outdoors, it may be exposed to direct sunlight, which could cause the temperature of the outer wall of the enclosure 1 to become too high, thus affecting the heat dissipation of the server power supply 3. Therefore, when the first temperature value is greater than the first threshold and the second temperature value is greater than the second threshold, the liquid spraying component 4 is controlled to spray the outer wall of the enclosure 1 to cool it down, thereby reducing the temperature of the outer wall of the enclosure 1 and allowing the heat of the server power supply 3 to be effectively dissipated to the outside through the outer wall of the enclosure 1.

[0083] According to the control method of this application embodiment, by acquiring the temperature of the server power supply 3 and the temperature of the outer wall of the enclosure 1, it is determined whether the temperature of the server power supply 3 and the temperature of the outer wall of the enclosure 1 are too high. When it is determined that both the temperature of the server power supply 3 and the temperature of the outer wall of the enclosure 1 are too high, it indicates that the server power supply 3 needs to be cooled down. Furthermore, the excessively high temperature of the outer wall of the enclosure 1 is detrimental to the heat dissipation of the server power supply 3. Therefore, the liquid spraying component 4 is controlled to spray the enclosure 1 to cool it down, thereby reducing the temperature of the outer wall of the enclosure 1 and the temperature of the server power supply 3, ensuring that the server 2 and the server power supply 3 can operate stably. In other words, by providing the liquid spraying component 4, this application improves the heat dissipation capacity of the server module, preventing the excessively high temperature of the outer wall of the enclosure 1 from affecting the heat dissipation of the server 2 and the server power supply 3, thus ensuring that the server 2 and the server power supply 3 can operate stably.

[0084] Understandably, this application employs a dual-temperature judgment mechanism. If the temperature of server power supply 3 is too high, it indicates that server power supply 3 itself has insufficient heat dissipation, possibly due to excessive load or internal cooling failure; if the temperature of the outer wall of enclosure 1 is too high, it indicates that the environmental heat load has affected the internal temperature of enclosure 1, exacerbating the heat dissipation pressure on the power supply. Spraying when both exceed the standard can avoid unnecessary spraying due to a single temperature fluctuation (such as a brief high load on the power supply), thus saving cooling resources.

[0085] In one embodiment of this application, the server module further includes a fan connected to the outer wall of the housing 1, the fan being used to drive the airflow at the outer wall of the housing 1; after the step of controlling the liquid spraying assembly 4 to spray and cool the housing 1, the following steps are included: After the spraying component 4 has been working for a preset time, the first temperature value of the server power supply 3 is obtained again. If the first temperature value obtained again is still greater than the first threshold, then the fan is controlled to start working.

[0086] Understandably, after spraying the outer wall of the enclosure 1 for a preset time, the temperature of the server power supply 3 is detected again to determine whether the first temperature value of the server power supply 3 is still greater than the first threshold. If it is greater, it means that the heat dissipation speed is insufficient. Therefore, the fan can be controlled to work, so that the fan drives the air flow on the outer wall of the enclosure 1, accelerates the evaporation speed of the moisture on the outer wall of the enclosure 1, and thus improves the cooling effect.

[0087] In one embodiment of this application, the control method further includes: Based on the working data of server 2, determine the standard heating rate of server power supply 3; When the ambient temperature is greater than the third threshold and the actual heating rate of the server power supply 3 is greater than the standard heating rate, the spray component 4 is controlled to spray the enclosure 1 to cool it down.

[0088] Understandably, the system monitors the real-time operating data of server 2 (such as CPU / GPU load, memory usage, network traffic, etc.) and calculates the standard temperature rise rate (i.e., the temperature rise trend under typical workload) of server power supply 3 based on historical data or a preset model. The system also acquires the external ambient temperature of enclosure 1 via an ambient temperature sensor and compares it with a preset third threshold (e.g., 35°C).

[0089] When the ambient temperature exceeds the third threshold, it indicates a harsh external thermal environment. If the actual temperature rise rate of the server power supply 3 exceeds the standard temperature rise rate, it indicates abnormal power supply heat dissipation or an unexpected load. In other words, the ambient temperature will affect the heat dissipation of the server power supply 3, thereby controlling the liquid spraying component 4 to spray the outer wall of the enclosure 1 to reduce the impact of the ambient temperature on the heat dissipation of the server power supply 3 and suppress the excessively rapid rise in the temperature of the server power supply 3.

[0090] Understandably, by introducing an ambient temperature threshold, unnecessary spraying in low-temperature environments (such as at night or in cold regions) can be avoided. Simultaneously, if the server power supply temperature 3 has not yet reached the first threshold but the temperature rise trend is abnormal, the spraying can be activated in advance to prevent temperature runaway, which is particularly suitable for intermittent high-load scenarios (such as sudden traffic surges during emergency communication by the server module).

[0091] For example, when a server module performs a large-scale data forwarding task in hot weather, the CPU load suddenly increases to 90%, and the power supply temperature rises at a rate of 2°C / min (the standard rate is 1°C / min). The system immediately triggers a spray cooling system to prevent the power supply from overheating.

[0092] In one embodiment of this application, the server module further includes a heat-conducting component. The server 2 and the server power supply 3 are both connected to the inner wall of the housing 1 through the heat-conducting component. The housing 1 is made of heat-dissipating material.

[0093] Understandably, connecting server 2 to the inner wall of enclosure 1 via a heat-conducting component allows the heat generated by server 2 to be directly transferred to enclosure 1, and then dissipated to the outside through enclosure 1, thus improving the heat dissipation of server 2. Similarly, connecting server power supply 3 to the inner wall of enclosure 1 via a heat-conducting component allows the heat generated by server power supply 3 to be directly transferred to enclosure 1, and then dissipated to the outside through enclosure 1, thus improving the heat dissipation of server power supply 3.

[0094] In one embodiment of this application, the top wall of the housing 1 is formed with a receiving groove 12 for receiving the liquid spraying assembly 4.

[0095] It is understandable that by accommodating the spraying assembly 4 in the receiving slot 12, the space utilization of the housing 1 is improved, and the situation where the spraying assembly 4 protrudes from the housing 1 when not in operation can be avoided.

[0096] In one embodiment of this application, such as Figure 4 As shown, the spraying assembly 4 includes a spraying component 41 and a lifting component 42. The lifting component 42 is disposed in the receiving tank 12. The spraying component 41 is connected to the lifting component 42. The lifting component 42 is used to drive the spraying component 41 to rise and fall, so that the spraying component 41 rises and falls relative to the receiving tank 12.

[0097] Understandably, the lifting component 42 drives the spray nozzle to rise and fall, allowing the spray nozzle 41 to switch between two states: located inside the receiving groove 12 and protruding from the receiving groove 12. When the spray nozzle 41 needs to spray the cabinet 1, the lifting component will drive the spray nozzle 41 to rise, enabling the spray nozzle 41 to effectively spray the cabinet 1 and improve the intelligence level of the server module.

[0098] In some examples, the spray element 41 is, for example, a nozzle connected to the vehicle's water tank or an external water storage device via a water pipe, with a water pump installed at the water pipe, allowing the nozzle to spray and cool the housing 1. The lifting element 42 is, for example, a cylinder lifting structure.

[0099] In one embodiment of this application, the server module further includes an air conditioning cooling circuit for cooling the cab. At least a portion of the air conditioning cooling circuit is located within the mounting cavity 11 so that the air conditioning cooling circuit can be used to cool the server 2 and the server power supply 3.

[0100] It is understandable that vehicles are generally equipped with air conditioning systems, which cool the vehicle's cabin through an air conditioning cooling circuit. This application places a portion of the air conditioning cooling circuit within the mounting cavity 11, allowing it to also cool the server 2 and server power supply 3 within the mounting cavity 11, thereby reducing their temperatures and improving the server module's heat dissipation capacity.

[0101] It should be noted that the air conditioning refrigeration circuit is a mature refrigeration structure in related technologies, and will not be described in detail here.

[0102] In one embodiment of this application, the server module further includes an air conditioning cooling circuit, cooling pipes, control valves, and heat exchangers. The air conditioning cooling circuit is used to cool the cab. The air conditioning cooling circuit includes a compressor, a condenser, an expansion valve, and an evaporator connected in sequence. The first end of the control valve is connected between the expansion valve and the evaporator, and the second end of the control valve is connected to the first end of the refrigeration pipeline. The control valve is used to control the opening and closing of the first end of the refrigeration pipeline and the output end of the expansion valve. The second end of the refrigeration pipeline is connected to the output end of the evaporator. Server 2 and server power supply 3 are connected to the cooling pipes via heat exchange components.

[0103] Understandably, by connecting the first end of the refrigeration pipe and the output end of the expansion valve through the control valve, the refrigerant in the air conditioning refrigeration circuit can flow into the refrigeration pipe, and then through the second end of the refrigeration pipe to the output end of the evaporator, forming a flow cycle. In other words, some of the refrigerant can flow into the refrigeration pipe to cool it down. The refrigeration pipe is connected to server 2 and server power supply 3 through heat exchangers. Heat from server 2 and server power supply 3 is transferred to the heat exchangers, and the refrigeration pipes can cool the heat exchangers, thereby achieving cooling of server 2 and server power supply 3. This reuse of the air conditioning refrigeration circuit improves the heat dissipation capacity of the server module.

[0104] Understandably, when the temperature of server 2 and / or the temperature of server power supply 3 exceed the limit, the control valve opens, diverting some of the expanded low-temperature refrigerant to the refrigeration piping. After absorbing heat from server 2, the cooling medium flows through the heat exchanger and returns to the evaporator output to participate in the main loop circulation.

[0105] In one embodiment of this application, after the step of controlling the spray assembly 4 to spray and cool the housing 1, the following steps are included: It is determined that the first temperature value is still greater than the first threshold. The control valve connects the refrigeration pipeline and the output end of the expansion valve, allowing part of the refrigerant in the air conditioning refrigeration circuit to flow into the refrigeration pipeline.

[0106] Understandably, after the spray component 4 sprays the housing 1 to cool it down, if the first temperature value of the server power supply 3 is still greater than the first threshold, the control valve connects the output end of the refrigeration pipe and the expansion valve, so that part of the refrigerant in the air conditioning refrigeration circuit flows into the refrigeration pipe, thereby using the air conditioning refrigeration circuit to cool down the server power supply 3, effectively reducing the temperature of the server power supply 3 and ensuring that the server power supply 3 can work stably.

[0107] In one embodiment of this application, such as Figure 1 and Figure 4 As shown, the control method also includes: Based on the operating mode of server 2, determine the real-time power required by server 2; Understandably, based on the operating mode of server 2, the tasks it performs can be determined, and consequently, the real-time power required by server 2 to complete those tasks can be calculated. Specifically, the current real-time power requirement is calculated based on the power consumption curve or preset mapping table corresponding to the operating mode (e.g., 400W in high-performance mode and 50W in standby mode).

[0108] For example, the operating mode of server 2 (such as CPU / GPU full load, idle state, etc.) is obtained in real time through built-in sensors or system management software (such as IPMI, BMC).

[0109] Based on the real-time power required, determine the target temperature and target flow velocity; Understandably, based on thermodynamic formulas and the allowable operating temperatures of the server power supply and chips, the target temperature of the coolant can be deduced. For example, the coolant temperature needs to be lowered (e.g., 25°C) for high power, and can be appropriately increased (e.g., 35°C) for low power. Using fluid heat dissipation efficiency models (e.g., Newton's law of cooling) and considering the heat generated by the real-time power, the minimum necessary flow rate of the coolant can be determined. For example, a flow rate of 2 m / s is required for 400W power, while it can be reduced to 0.5 m / s for 50W power.

[0110] Based on the target temperature and target flow rate, the cooling module 5 adjusts the temperature and flow rate of the coolant.

[0111] For example, the heat exchanger (such as a thermoelectric cooler or a chiller unit) connected to the refrigeration module 5 can be controlled to adjust the coolant inlet temperature to the target value.

[0112] For example, the coolant circulation speed can be adjusted to the target flow rate by using a variable frequency pump or flow valve to ensure an optimal match between heat dissipation efficiency and pump power consumption.

[0113] According to the control method of this application embodiment, the real-time power required by server 2 can be determined based on the operating mode of server 2. Based on the real-time power requirement, the heat generated by server 2 can be determined. Based on the heat generated, the target temperature and target flow rate of the coolant can be determined, allowing the coolant to effectively control the temperature of server 2. Therefore, the cooling module 5 is controlled according to the target temperature and target flow rate to adjust the real-time temperature and flow rate of the coolant to the target temperature and flow rate. In other words, this application can adjust the temperature and flow rate of the coolant in real time according to the operating mode of server 2, so that the temperature and flow rate of the coolant match the heat generated by server 2. This prevents the temperature of server 2 from becoming too high, ensuring stable operation of server 2 and improving the intelligence level of the server module.

[0114] Understandably, this application dynamically adjusts the temperature and flow rate of the coolant by monitoring the operating mode of server 2 in real time to match the heat dissipation requirements of server 2. Specifically, the operating mode of server 2 (such as high-load computing, low-load standby, etc.) determines its real-time power consumption, which in turn affects heat generation. By calculating the required power in real time, the optimal coolant temperature and flow rate can be derived, thereby precisely controlling the cooling module 5 (such as pumps, heat exchangers, etc.) to achieve a balance between efficient heat dissipation and energy consumption optimization.

[0115] In one embodiment of this application, after the step of controlling the refrigeration module 5 to adjust the temperature and flow rate of the coolant, the control method includes: Based on the tasks of server 2, determine the predicted power required for server 2; Based on the predicted power required by server 2, the predicted heat generation of server 2 and server power supply 3 is determined. If the predicted heat generation is greater than the current heat generation, the refrigeration module 5 will be controlled to adjust the temperature of the coolant based on the predicted heat generation.

[0116] It is understood that this embodiment employs a predictive temperature control mechanism, which analyzes the workload of server 2 (such as upcoming high-performance computing, batch data processing, etc.) to predict changes in its power consumption and heat generation in advance. If a significant increase in heat generation is predicted, the coolant temperature is lowered in advance to prevent a sudden rise in the temperature of server 2 or the power supply due to delayed heat dissipation, thereby maintaining the system within a safe temperature range, improving stability, and reducing the impact of temperature fluctuations on the hardware.

[0117] Specifically, the system obtains task load information (such as CPU / GPU utilization, memory bandwidth requirements, etc.) for a future period (e.g., 5-10 seconds) through the server's operating system, task scheduler (e.g., Kubernetes, SLURM), or AI prediction models. Based on historical data or task feature libraries (e.g., deep learning training tasks typically correspond to 300W+ power), the predicted power is directly matched. Based on the predicted power, the predicted heat generation can be determined. If the predicted heat generation is greater than the current heat generation, the coolant temperature can be lowered in advance to avoid temperature overshoot caused by traditional "lagging adjustment," reducing hardware thermal stress. Simultaneously, by combining task prediction with real-time data, a smooth temperature control transition is achieved, improving system stability.

[0118] In one embodiment of this application, after the step of controlling the refrigeration module 5 to adjust the temperature and flow rate of the coolant, the control method includes: Based on the real-time power requirements of server 2, determine the actual heat generated by server 2 and server power supply 3. If the actual heat generation is lower than the preset value, the depth of server 2 and server power supply 3 immersed in the coolant will be controlled and adjusted based on the actual heat generation.

[0119] Understandably, when the actual heat generation of server 2 and the power supply is low, adjusting the immersion depth (such as partially exposing them to the coolant) can reduce coolant flow resistance and pump power consumption while still ensuring effective heat dissipation. Conversely, when heat generation is high, maintaining full immersion maximizes heat dissipation efficiency.

[0120] For example, when the actual heat generation is lower than the preset value, non-critical heat-generating components of the server 2 or power supply (such as the power module casing or part of the PCB) can be partially raised using an electric lifting mechanism or buoyancy adjustment device (such as an inflatable airbag) to reduce the immersion volume (e.g., from 100% immersion to 50%). If the heat generation rises back to the preset value or above, the fully immersion state is restored.

[0121] In some examples, the server module also includes a coolant reservoir and a pump located outside the enclosure 1. The pump is connected to the containment cavity. The pump can draw coolant from the containment cavity into the coolant reservoir, or it can deliver coolant from the coolant reservoir into the containment cavity, thereby adjusting the coolant level in the containment cavity and adjusting the height of the server 2 and the server power supply 3 immersed in the coolant.

[0122] In one embodiment of this application, such as Figure 4 As shown, the server module also includes an ejector 6, which is movably mounted within the mounting cavity 11. After controlling the cooling module 5 to adjust the temperature and flow rate of the coolant, the control method includes: Obtain the actual temperature at different locations of the server power supply 3; It was determined that the actual temperature at one location of the server power supply 3 was higher than the actual temperature at other locations of the server power supply 3. Control the jet injector 6 to increase the flow rate of coolant at one of the locations of the server power supply 3.

[0123] Understandably, by monitoring the temperature distribution at different locations of the power supply, identifying hot spots (such as near high-power MOSFETs or transformers), and controlling the movable jet 6 to directionally enhance the coolant flow rate in that area, precise local heat dissipation can be achieved. This avoids the temperature unevenness problem caused by traditional uniform heat dissipation methods, enabling rapid suppression of hot spot temperatures and preventing power supply devices from failing due to localized high temperatures.

[0124] For example, temperature sensors (such as NTC thermistors or infrared temperature measurement modules) can be placed near key heat-generating components of the power supply (such as input / output filter capacitors, switching transistors, inductors, etc.). Alternatively, data from each sensor can be collected via multiple ADCs to generate a temperature distribution map of the power supply (e.g., location A is 65°C, location B is 50°C, and location C is 70°C).

[0125] In some examples, the jet injector 6 consists of a rotatable nozzle and a miniature centrifugal pump, which is driven by a servo motor to move within the mounting cavity 11 (e.g., an XYZ three-axis guide rail). Based on the hot spot coordinates (e.g., position C), the jet injector 6 is moved above the target area, the nozzle angle is adjusted, and the pump speed is increased, causing the coolant to impact the hot spot surface at a high-speed jet (e.g., 3 m / s). For example, if the temperature at position C reaches 70°C, the jet injector 6 is moved directly above it, and the flow rate is increased from 1 m / s to 3 m / s, continuing until the temperature drops below 65°C.

[0126] In one embodiment of this application, such as Figure 5 As shown, the server power supply 3 includes a power supply body 31, a steel strip 32, and stress detection elements 33. The steel strip 32 is sleeved on the outer wall of the power supply body 31, and stress detection elements 33 are provided at different positions on the side of the steel strip 32 away from the power supply body 31. The steps for obtaining the actual temperature at different positions of the server power supply 3 include: Based on the detection data of different stress detection components 33, the actual temperature at different locations of the server power supply 3 is determined.

[0127] Understandably, since the server power supply 3 is in an immersion cooling environment, traditional temperature sensors may be affected by coolant flow or limited installation space. This solution utilizes the thermal stress-temperature correlation and sets stress detection elements 33 at different positions of the steel strip 32. By detecting the stress changes of the steel strip 32 caused by the thermal expansion of the power supply body 31, the temperature distribution at different positions of the power supply can be indirectly inferred, thus achieving non-contact temperature monitoring.

[0128] Understandably, a stepped power load (e.g., 100W → 400W) can be applied to the power supply in a laboratory environment beforehand, and the micro-strain values ​​(με) of each stress detection component 33 and the measured temperature of the infrared thermal imager can be recorded simultaneously to establish a strain-temperature mapping table, so that the temperature of the server power supply 3 can be directly determined based on the detection data of the stress detection component 33.

[0129] According to the embodiments of the third aspect of this application, such as Figure 4As shown, the server module includes a housing 1, a server 2, and a cooling module 5. The housing 1 has a mounting cavity 11 for containing coolant. The server 2 is installed in the mounting cavity 11 and is at least partially immersed in the coolant. The housing 1 has a liquid inlet communicating with the mounting cavity 11 and a liquid outlet communicating with the mounting cavity 11. The output end of the cooling module 5 is connected to the liquid inlet, and the input end of the cooling module 5 is connected to the liquid outlet.

[0130] Specifically, the server module also includes a rigid sleeve 01 and a stress detector 02. The rigid sleeve 01 is sleeved on the outside of the server 2, and the stress detector 02 is located on the side of the rigid sleeve 01 away from the server 2. The stress detector 02 is used to detect the stress of the rigid sleeve 01 in order to determine the degree of expansion of the server 2 based on the stress of the rigid sleeve 01.

[0131] Specifically, the server module also includes a rigid sleeve 01 and a resonance detector 03. The rigid sleeve 01 is sleeved on the outside of the server 2, and the resonance detector 03 is located on the side of the rigid sleeve 01 away from the server 2. The resonance detector 03 is used to detect the shift of the resonance peak of the rigid sleeve 01, so as to determine the degree of expansion of the server 2 based on the shift of the resonance peak of the rigid sleeve 01.

[0132] According to an embodiment of the fourth aspect of this application, a control device and a control method are respectively referred to as follows. The control device includes: A determination module is used to determine the target cooling medium for different servers based on their real-time power. A control module is used to control the operation of multiple cooling modules based on different target cooling media of the servers.

[0133] According to the embodiments of the fifth aspect of this application, such as Figure 4 As shown, the electronic device may include: a processor 310, a communications interface 320, a memory 330, and a communication bus 340, wherein the processor 310, the communications interface 320, and the memory 330 communicate with each other via the communication bus 340. The processor 310 can call logical instructions from the memory 330 to execute a control method, which includes: Based on the different real-time power of the servers, the target cooling medium for each server is determined. The operation of multiple cooling modules is controlled based on the different target cooling media of the servers.

[0134] Furthermore, the logical instructions in the aforementioned memory 330 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0135] On the other hand, this application also provides a computer program product, which includes a computer program stored on a non-transitory computer-readable storage medium. The computer program includes program instructions, and when the program instructions are executed by a computer, the computer is able to perform the control methods provided by the above-described methods. The method includes: Based on the different real-time power of the servers, the target cooling medium for each server is determined. The operation of multiple cooling modules is controlled based on the different target cooling media of the servers.

[0136] According to an embodiment of the sixth aspect of this application, the application further includes a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, is implemented to perform the control methods provided above, the method comprising: Based on the different real-time power of the servers, the target cooling medium for each server is determined. The operation of multiple cooling modules is controlled based on the different target cooling media of the servers.

[0137] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0138] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., including several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods of various embodiments or some parts of embodiments.

[0139] Finally, it should be noted that the above embodiments are only used to illustrate this application and are not intended to limit this application. Although this application has been described in detail with reference to the embodiments, those skilled in the art should understand that various combinations, modifications, or equivalent substitutions of the technical solutions of this application do not depart from the spirit and scope of the technical solutions of this application and should be covered within the scope of the claims of this application.

Claims

1. A server cooling device, characterized in that, The device is applied to a server module, which includes multiple servers. Each server includes a server body and a server power supply. The server cooling device includes multiple cooling modules, each corresponding to one of the servers. The cooling modules are used to deliver cooling media to the servers to cool them. Different cooling modules are used to deliver different cooling media.

2. The server cooling device according to claim 1, characterized in that, The plurality of servers include a first server and a second server, wherein the rated power of the first server is greater than the rated power of the second server; The plurality of cooling modules include a first cooling module and a second cooling module. The first cooling module is used to deliver a first cooling medium to the first server, and the second cooling module is used to deliver a second cooling medium to the second server. The specific heat capacity of the first cooling medium is greater than that of the second cooling medium.

3. The server cooling device according to claim 1 or 2, characterized in that, The server module also includes a housing with a mounting cavity for containing coolant. The server is installed in the mounting cavity and immersed in the coolant. The housing has an inlet and an outlet communicating with the mounting cavity. The output end of the cooling module is connected to the inlet, and the input end of the cooling module is connected to the outlet.

4. The server cooling device according to claim 3, characterized in that, The server cooling device also includes a liquid driving component, which is installed in the mounting cavity and is used to drive the liquid in the mounting cavity to flow up and down.

5. A server system, characterized in that, Includes the server cooling device as described in any one of claims 1 to 4.

6. A control method based on a server cooling device as described in any one of claims 1 to 4, characterized in that, include: Based on the different real-time power of the servers, the target cooling medium for each server is determined. The operation of multiple cooling modules is controlled based on the different target cooling media of the servers.

7. A control device, characterized in that, include: A determination module is used to determine the target cooling medium for different servers based on their real-time power. A control module is used to control the operation of multiple cooling modules based on different target cooling media of the servers.

8. An electronic device, the electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the control method of claim 6.

9. A non-transitory computer-readable storage medium, the non-transitory computer-readable storage medium comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the control method of claim 6.

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