Electrode slurry dynamic curing method and application

By combining electromagnetic induction interface preferential curing with thermal expansion microspheres and phase change microcapsules, the transmission path of drying stress is changed, solving the problems of interface micro-cracks and demolding in the traditional curing process, and realizing high-strength and long-life electrode sheets.

CN121768960APending Publication Date: 2026-03-31深圳耀石锂电科技有限公司
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Patent Information

Application Number
CN202511991920.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-26
Publication Date
2026-03-31

AI Technical Summary

Technical Problem

During traditional hot air or oven curing processes, the drying stress on lithium-ion battery electrodes leads to microscopic cracks at the interface and demolding, affecting the integrity of the electrode structure and electrochemical performance, resulting in battery capacity decay and reduced cycle life.

Method used

A multi-stage dynamic curing process is adopted, which includes electromagnetic induction interface preferential curing, hot air drying and stress offsetting. The current collector-slurry interface is heated by electromagnetic induction to form a strong cross-linked network. Thermal expansion microspheres and phase change microcapsules are used to actively offset the drying shrinkage stress and construct a uniform stress dissipation channel.

Benefits of technology

This invention achieves a composite negative electrode sheet with no demolding and long lifespan, which improves the interfacial bonding strength and the stability of the electrode structure, extends the battery cycle life, and reduces the interfacial impedance.

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Abstract

The invention discloses an electrode slurry dynamic curing method. Rapidly heating a current collector-slurry interface to 100-120 DEG C by adopting electromagnetic induction, and triggering adhesive crosslinking and thermal expansion microspheres to generate pre-compressive stress; stress is relieved through phase change microcapsules in the hot air drying process of 70-90 DEG C; and finally, curing is completed at the temperature of 110-130 DEG C. The electrode slurry comprises thermal expansion microspheres and phase change microcapsules; the initial expansion temperature of the thermal expansion microspheres is 75-105 DEG C, and the phase change temperature of the phase change microcapsules is 45-65 DEG C; by reversing a traditional curing path and combining thermal expansion microspheres and phase change microcapsules with specific temperature response, the problems of demolding and cracking caused by negative electrode drying stress are solved, the interface integrity is remarkably improved, and the cycle life is remarkably prolonged.
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