Die fixing device

Abstract

The invention discloses a mold fixing device, and relates to the technical field of guiding and fixing of molds, the fixing device comprises an attaching unit, the attaching unit comprises a pressed plate, a sliding block, a laser transmitter, a refractor and a balance signal transmitting mechanism, and when the attaching surface of the fixing device is not completely attached to the top end of an upper mold, the laser transmitter transmits a laser signal to the top end of the upper mold; when the pressing plate is pressed, the pressed plate slightly deflects due to a gap or inclination of a binding face, at the moment, laser emitted by the laser emitter cannot penetrate through through holes in the two sides of the sliding block at the same time after being refracted by the refractor, or only part of the laser is irradiated on the balance signal emitting mechanism, so that the balance signal emitting mechanism cannot receive complete laser irradiation, and then the pressing plate is pressed. The standard of transmitting signals cannot be met; and when the fitting state meets the requirement, the angle of the refractor corresponds to a preset light path, the laser penetrates along the central axis of the through hole after being refracted and completely covers the induction area of the balance signal transmitting mechanism, a confirmation signal for fitting in place is triggered, and real-time monitoring and feedback of the fitting precision of the fixing device and the upper mold are achieved.

Description

Technical Field

[0001] This invention relates to the field of mold guiding and fixing technology, specifically a mold fixing device. Background Technology

[0002] In the field of mold processing and forming, precise mold fixing is one of the core links to ensure product quality. When clamping an upper mold with an axisymmetric block on both sides of its top (the upper end face of the axisymmetric block is parallel to the mating end face of the upper mold), traditional mold fixing methods often rely on manual calibration or simple mechanical clamps. This is not only cumbersome and time-consuming, but also prone to mold positioning deviation due to human error, resulting in product dimensional deviations and surface defects. Especially in high-precision mold processing scenarios, even a small positioning error can directly lead to the scrapping of an entire batch of products, significantly increasing production costs. At the same time, existing fixing devices often lack real-time status monitoring and feedback mechanisms, making it impossible to detect the positional deviation of the mold during the fixing process in time. It is difficult to ensure that the mating surfaces of the upper mold and the clamping device are completely aligned. As a result, in scenarios such as die casting, the mating surfaces of the upper mold and the clamping device are not completely aligned, leading to uneven force on the mold when the mold is closed. This can easily cause local stress concentration in the mold, which will accelerate mold wear and even cracking in the long run, shortening the mold's service life. Summary of the Invention

[0003] The purpose of this invention is to provide a mold fixing device to solve the problem that traditional mold fixing devices in the prior art cannot detect the positional displacement of the mold during the fixing process in real time, and it is difficult to ensure that the contact surface between the upper mold and the clamping device is completely fitted.

[0004] To achieve the above objectives, the present invention provides the following technical solution: The fixing device includes a bonding unit, which includes a pressure plate, a slider, a laser emitter, a refractor, and a balance signal emitting mechanism; The pressure plate is rotatably connected to one end of the slider at the central axis. The refractors are located on both sides of the slider. The refractors are fixedly installed on the end face of the pressure plate on the side where the slider is located. The laser emitter and the balanced signal emission mechanism are located above the refractors on both sides of the slider, respectively. Both sides of the slider are provided with through holes, the two through holes are coaxial, and the central axis of the two through holes is parallel to the contact plane of the fixing device; When the fixing device is fully attached to the top of the upper mold, the laser emitted by the laser emitter is refracted by the refracting mirror and passes through the two through holes in sequence, and is completely irradiated on the balanced signal transmitting mechanism.

[0005] When the contact surface of the fixing device is not fully in contact with the top of the upper mold, the pressure plate will deflect slightly due to the gap or tilt of the contact surface, causing the angle of the refractor fixed on its surface to change synchronously. At this time, the laser emitted by the laser emitter will deviate from the original coaxial path after being refracted by the refractor and will not be able to pass through the through holes on both sides of the slider at the same time, or only part of the laser will irradiate the balance signal emitting mechanism, so that the balance signal emitting mechanism cannot receive complete laser irradiation and fails to meet the standard for transmitting signals. When the contact state meets the requirements, the angle of the refractor corresponds to the preset optical path, and the laser passes through the central axis of the through hole after refraction, completely covering the sensing area of ​​the balance signal emitting mechanism, triggering the confirmation signal of contact in place, and realizing real-time monitoring and feedback of the contact accuracy between the fixing device and the upper mold.

[0006] Furthermore, the bonding unit also includes a connecting seat and a laser displacement sensor. The slider connecting seat is slidably connected, and a return spring is provided between the slider and the connecting seat. The two ends of the return spring are fixedly connected to the slider and the connecting seat respectively. The laser displacement sensor is located inside the return spring and is fixedly connected to the connecting seat. The laser emitted by the laser displacement sensor is perpendicular to the end face of the slider facing the return spring.

[0007] During the gradual clamping and lifting of the upper mold, as the upper mold rises, the pressure plate also rises. During this rise, the pressure plate drives the slider to slide upwards within the connecting seat. Simultaneously, the return spring is gradually compressed due to the slider's displacement. A laser displacement sensor monitors the slider's sliding distance in real time. When the slider's displacement reaches a preset threshold, the laser displacement sensor sends a signal to the control system, indicating that the upper mold has completed its lifting and positioning. As the upper mold is released, the return spring gradually releases its elastic potential energy, pushing the slider downwards along the connecting seat to reset the pressure plate, returning it to its initial position and preparing for the next mold fixing operation.

[0008] Furthermore, the bonding unit also includes a photoresistor, a power supply, an acceleration signal circuit board, and a deceleration signal circuit board. There are two photoresistors and a power supply. One photoresistor, power supply, and acceleration signal circuit board form a complete circuit, and the other photoresistor, power supply, and deceleration signal circuit board form another complete circuit. All photoresistors, power supplies, acceleration signal circuit boards, and deceleration signal circuit boards are fixedly connected to the slider.

[0009] The photoresistor electrically connected to the acceleration signal circuit board is located above the through-hole on one side of the laser emitter. When the refractor on the same side of the laser emitter moves away from the laser emitter due to the rotation of the pressure plate, the laser emitted by the laser emitter will partially illuminate the sensing area of ​​the photoresistor, causing its resistance to decrease. The acceleration signal circuit board detects the change in current in the circuit and sends a deceleration command to the control system. The photoresistor electrically connected to the deceleration signal circuit board is located below the through-hole on one side of the laser emitter. When the refractor on the same side of the laser emitter moves away from the laser emitter due to the rotation of the pressure plate, the laser emitted by the laser emitter will partially illuminate the sensing area of ​​the photoresistor, causing its resistance to decrease. The deceleration signal circuit board detects the change in current in the circuit and sends a deceleration command to the control system.

[0010] Furthermore, the balanced signal transmitting mechanism includes a photoresistor, a power supply, and a balanced signal circuit board, which are connected in series. When the fixing device is fully attached to the top of the upper mold, the laser emitted by the laser emitter is refracted by the refracting mirror and passes through the two through holes in sequence, and completely irradiates the photoresistor.

[0011] When the bonding condition meets the requirements, the angle of the refractor corresponds to the preset optical path. After refraction, the laser passes through the central axis of the through hole and completely illuminates the photoresistor. The resistance of the photoresistor decreases, and the current in the circuit increases. When the balance signal circuit board triggers the bonding confirmation signal, it sends a bonding confirmation signal to the control system, realizing real-time monitoring and feedback of the bonding accuracy between the fixing device and the upper mold.

[0012] Furthermore, the fixing device also includes a telescopic motor, which is set on both sides of the rotation axis of the pressure plate. The telescopic motor and the connecting seat are fixedly connected. The telescopic motor is located below the pressure plate. The output end of the telescopic motor is equipped with a roller. The rotation axis of the roller is parallel to the rotation axis of the pressure plate. The plane formed by the central axis of the roller is parallel to the contact plane of the fixing device.

[0013] After receiving a signal from the acceleration or deceleration circuit board, the control system sends an acceleration or deceleration signal to the telescopic motor on the same side as the laser emitter. When the upper mold is fixed, the telescopic motors on both sides of the rotation axis of the pressure plate start. The telescopic motors extend synchronously from both sides of the concave side of the axisymmetric block towards the center. The rollers roll against the concave sidewall of the axisymmetric block, thereby clamping and lifting the upper mold. During the lifting process, if the end of the upper mold closest to the laser emitter is lower than the end away from the laser emitter, the end of the pressure plate closest to the laser emitter will deflect downwards, causing the angle of the refractor on that side to change. This causes part of the laser emitted by the laser emitter to irradiate the photoresistor corresponding to the acceleration signal circuit board. The resistance of this photoresistor decreases, and the acceleration signal circuit board sends a signal to the control system. Upon receiving an acceleration command, the control system instructs the telescopic motor on the side closest to the laser emitter to increase its output power, propelling the upper mold upwards rapidly on that side. Conversely, if the end of the upper mold closest to the laser emitter is higher than the end furthest from the laser emitter, the end of the pressure plate closest to the laser emitter deflects upwards, and the laser beam illuminates the photoresistor corresponding to the deceleration signal circuit board. The deceleration signal circuit board then sends a deceleration command, causing the telescopic motor on that side to reduce its output power until the pressure plate returns to a horizontal state. At this point, both telescopic motors return to synchronous output, ensuring that the upper mold remains horizontal throughout the lifting process and preventing tilting or shifting due to uneven force on both sides.

[0014] Furthermore, the fixing device also includes a centering unit, which includes a drive cylinder. The drive cylinder and the connecting seat are fixedly connected. The drive cylinder is symmetrically arranged about the central axis of the fixing device's contact plane, and the output axis of the drive cylinder is parallel to the rotation axis of the pressure plate.

[0015] When the control system receives the bonding confirmation signal from the balance signal circuit board, the control system sends a command to the drive cylinder. The output ends of the drive cylinders on both sides of the upper mold output towards the upper mold, gradually pushing the upper mold to a position where the central axis of the upper mold coincides with the central axis of the bonding plane of the fixing device. This achieves precise centering of the upper mold within the fixing device, providing a stable reference for subsequent processing or inspection procedures.

[0016] Furthermore, the centering unit also includes a centering detection mechanism, which includes a rotating rod and a contact switch; The rotating rod and the side wall of the output end of the drive electric cylinder are rotatably connected. The rotation axis of the rotating rod is perpendicular to the output axis of the drive electric cylinder. The contact switch is located on the side of the rotating rod away from the central axis of the plane of the fixed device. The contact switch and the side wall of the output end of the drive electric cylinder are fixedly connected. When the rotating rod rotates to the side away from the central axis of the plane where it is attached to the fixed device, the rotating rod presses down on the contact switch.

[0017] When the rotating rod rotates a fixed angle away from the central axis of the fixed device's contact plane, the end of the rotating rod precisely presses down the trigger button of the contact switch, closing the contact switch and sending a signal to the control system. If there is a deviation between the central axis of the upper mold and the central axis of the fixed device's contact plane, the timing of the two rotating rods contacting the mold will be slightly different: the rotating rod on the deviated side will contact the mold sidewall first and rotate around the rotation axis away from the center under the reaction force of the mold. When the rotation angle reaches the preset value, the rotating rod on that side presses down the contact switch, which sends a signal to the control system. The control system receives the signal and instructs the drive cylinder on that side to stop outputting. The drive cylinder on the other side continues to push the rotating rod until it contacts the mold sidewall and rotates to press down the contact switch. At this time, both contact switches are in the closed state, and the central axis of the upper mold is completely aligned with the central axis of the fixed device's contact plane, completing the centering positioning.

[0018] Furthermore, the pressure plate has multiple rotating rollers arranged in an array, and the rotation axis of the multiple rotating rollers is perpendicular to the rotation axis of the pressure plate.

[0019] The rotating roller reduces the frictional resistance between the axisymmetric block and the pressure plate during the centering and positioning of the upper mold, allowing the upper mold to slide more smoothly along the bonding plane under the push of the drive cylinder, thus avoiding mold displacement or scratches on the bonding surface due to excessive friction.

[0020] Compared with the prior art, the beneficial effects of the present invention are: 1. The present invention is provided with a bonding unit, which can make the upper end surface of the upper mold completely bonded to the bonding surface of the fixing device, ensuring that the upper mold itself does not tilt. 2. The optical path monitoring system composed of the refractive mirror, laser emitter, and balanced signal emission mechanism in the bonding unit of this invention can provide real-time feedback on bonding accuracy; 3. In this invention, the symmetrical drive electric cylinder of the central unit, combined with the triggering mechanism of the rotating rod and the contact switch, ensures that the center of the mold and the center of the device are precisely aligned. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall appearance and structure of the present invention; Figure 2 This is a schematic diagram of the first cross-sectional structure of the present invention; Figure 3 This is a schematic diagram of the second cross-sectional structure of the present invention; Figure 4 This is a schematic diagram of the third cross-sectional structure of the present invention; Figure 5 This is a schematic diagram of the fourth cross-sectional structure of the present invention; Figure 6 This is a partial structural diagram of the slider of the present invention; Figure 7 This is a schematic diagram of a portion of the internal structure of the connector of the present invention; Figure 8 This is a schematic diagram of the top structure of the fixed upper mold of the present invention; Figure 9 for Figure 5 A magnified view of part A; Figure 10 for Figure 7 A magnified schematic diagram of part B.

[0022] In the diagram: 1. Bonding unit; 2. Telescopic motor; 3. Centering unit; 11. Pressure plate; 12. Slider; 13. Laser emitter; 14. Refracting mirror; 15. Balance signal transmitting mechanism; 16. Laser displacement sensor; 17. Photoresistor; 18. Power supply; 19. Acceleration signal circuit board; 110. Deceleration signal circuit board; 111. Balance signal circuit board; 112. Rotating roller; 113. Through hole; 114. Connecting seat; 115. Return spring; 21. Roller; 31. Drive cylinder; 32. Detection mechanism; 33. Rotating rod; 34. Contact switch. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] Example: Figure 1 - Figure 10 As shown, the present invention provides a technical solution: a mold fixing device. like Figure 1 and Figure 2 As shown, the fixing device includes a bonding unit 1, which includes a pressure plate 11, a slider 12, a laser emitter 13, a refractor 14, and a balance signal emitting mechanism 15. The pressure plate 11 is rotatably connected to one end of the slider 12 at the central axis. The refractor 14 is located on both sides of the slider 12. The refractor 14 is fixedly installed on the end face of the pressure plate 11 on the side where the slider 12 is located. The laser emitter 13 and the balanced signal emission mechanism 15 are respectively located above the refractor 14 on both sides of the slider 12. Both sides of the slider 12 are provided with through holes 113, the two through holes 113 are coaxial, and the central axis of the two through holes 113 is parallel to the contact plane of the fixing device. When the fixing device is fully attached to the top of the upper mold, the laser emitted by the laser emitter 13 is refracted by the refracting mirror 14 and passes through the two through holes 113 in sequence, and is fully irradiated on the balanced signal transmitting mechanism 15.

[0025] When the contact surface of the fixing device is not fully in contact with the top of the upper mold, the pressure plate 11 will deflect slightly due to the gap or tilt of the contact surface, causing the angle of the refractor 14 fixed on its surface to change synchronously. At this time, the laser emitted by the laser emitter 13 will deviate from the original coaxial path after being refracted by the refractor 14, and will not be able to pass through the through holes 113 on both sides of the slider 12 at the same time, or only part of the laser will irradiate the balance signal emitting mechanism 15, so that the balance signal emitting mechanism 15 cannot receive complete laser irradiation and does not meet the standard for transmitting signals. When the contact state meets the requirements, the angle of the refractor 14 corresponds to the preset optical path, and the laser passes through the central axis of the through hole 113 after refraction, completely covering the sensing area of ​​the balance signal emitting mechanism 15, triggering the confirmation signal of contact in place, and realizing real-time monitoring and feedback of the contact accuracy between the fixing device and the upper mold.

[0026] like Figures 2 to 4 As shown, the bonding unit 1 also includes a connecting seat 114 and a laser displacement sensor 16. The slider 12 is slidably connected to the connecting seat 114. A return spring 115 is provided between the slider 12 and the connecting seat 114. The two ends of the return spring 115 are fixedly connected to the slider 12 and the connecting seat 114 respectively. The laser displacement sensor 16 is located inside the return spring 115. The laser displacement sensor 16 is fixedly connected to the connecting seat 114. The laser emitted by the laser displacement sensor 16 is perpendicular to the end face of the slider 12 facing the return spring 115.

[0027] During the gradual clamping and lifting of the upper mold, as the upper mold rises, the pressure plate 11 also rises. During this rise, the pressure plate 11 drives the slider 12 to slide upwards within the connecting seat 114. At this time, the return spring 115 is gradually compressed due to the displacement of the slider 12. The laser displacement sensor 16 monitors the sliding distance of the slider 12 in real time. When the displacement of the slider 12 reaches a preset threshold, the laser displacement sensor 16 sends a signal to the control system, indicating that the upper mold has completed its lifting and positioning. During the process of releasing the upper mold, the return spring 115 gradually releases its elastic potential energy, pushing the slider 12 downwards along the connecting seat 114 to reset, allowing the pressure plate 11 to return to its initial position, preparing for the next mold fixing operation.

[0028] like Figure 6As shown, the bonding unit 1 also includes a photoresistor 17, a power supply 18, an acceleration signal circuit board 19, and a deceleration signal circuit board 110. There are two photoresistors 17 and power supplies 18. One photoresistor 17, power supply 18, and acceleration signal circuit board 19 form a complete circuit, and the other photoresistor 17, power supply 18, and deceleration signal circuit board 110 form another complete circuit. The photoresistors 17, power supply 18, acceleration signal circuit board 19, and deceleration signal circuit board 110 are all fixedly connected to the slider 12.

[0029] The photoresistor 17, electrically connected to the acceleration signal circuit board 19, is located above the through hole 113 on one side of the laser emitter 13. When the refractor 14 on the same side of the laser emitter 13 moves away from the laser emitter 13 due to the rotation of the pressure plate 11, the laser emitted by the laser emitter 13 will partially irradiate the sensing area of ​​the photoresistor 17, causing its resistance to decrease. The acceleration signal circuit board 19 detects the change in current in the circuit and sends a deceleration command to the control system. The photoresistor 17, electrically connected to the deceleration signal circuit board 110, is located below the through hole 113 on one side of the laser emitter 13. When the refractor 14 on the same side of the laser emitter 13 moves away from the laser emitter 13 due to the rotation of the pressure plate 11, the laser emitted by the laser emitter 13 will partially irradiate the sensing area of ​​the photoresistor 17, causing its resistance to decrease. The deceleration signal circuit board 110 detects the change in current in the circuit and sends a deceleration command to the control system.

[0030] like Figure 7 and Figure 10 As shown, the balanced signal transmitting mechanism 15 includes a photoresistor 17, a power supply 18, and a balanced signal circuit board 111, which are connected in series. When the fixing device is fully attached to the top of the upper mold, the laser emitted by the laser emitter 13 is refracted by the refracting mirror 14 and passes through the two through holes 113 in sequence, and is fully irradiated on the photoresistor 17.

[0031] When the bonding state meets the requirements, the angle of the refracting mirror 14 corresponds to the preset optical path. After refraction, the laser passes through the central axis of the through hole 113 and completely illuminates the photoresistor 17. The resistance of the photoresistor 17 decreases, and the current in the circuit increases. The balance signal circuit board 111 triggers the bonding confirmation signal and sends a bonding confirmation signal to the control system, realizing real-time monitoring and feedback of the bonding accuracy between the fixing device and the upper mold.

[0032] like Figure 2 and Figure 3As shown, the fixing device also includes a telescopic motor 2, which is arranged on both sides of the rotation axis of the pressure plate 11. The telescopic motor 2 and the connecting seat 114 are fixedly connected. The telescopic motor 2 is located below the pressure plate 11. The output end of the telescopic motor 2 is provided with a roller 21. The rotation axis of the roller 21 is parallel to the rotation axis of the pressure plate 11. The plane formed by the central axis of the roller 21 is parallel to the contact plane of the fixing device.

[0033] After receiving a signal from the acceleration signal circuit board 19 or the deceleration signal circuit board 110, the control system sends an acceleration or deceleration signal to the telescopic motor 2 on the same side as the laser emitter 13. When the upper mold is fixed, the telescopic motors 2 on both sides of the rotation axis of the pressure plate 11 are activated. The telescopic motors 2 extend synchronously from both sides of the concave side of the axisymmetric block towards the center. The roller 21 rolls against the concave side wall of the axisymmetric block, thereby clamping and lifting the upper mold. During the lifting process, if the end of the upper mold near the laser emitter 13 is lower than the end away from the laser emitter 13, the end of the pressure plate 11 near the laser emitter 13 will deflect downward, causing the angle of the refractor 14 on that side to change. This causes part of the laser emitted by the laser emitter 13 to irradiate the photoresistor 17 corresponding to the acceleration signal circuit board 19. The resistance of the photoresistor 17 decreases, and the acceleration signal circuit board 19 sends an acceleration or deceleration signal to the control system. The system sends an acceleration command, and the control system then instructs the telescopic motor 2 on the side closer to the laser emitter 13 to increase its output power, pushing the upper mold on that side to rise rapidly. Conversely, if the end of the upper mold closer to the laser emitter 13 is higher than the end away from the laser emitter 13, the end of the pressure plate 11 closer to the laser emitter 13 deflects upward, and the laser part irradiates the photoresistor 17 corresponding to the deceleration signal circuit board 110. The deceleration signal circuit board 110 sends a deceleration command, and the telescopic motor 2 on that side reduces its output power until the pressure plate 11 returns to a horizontal state. The telescopic motors 2 on both sides return to a synchronous output state, ensuring that the upper mold remains horizontal during the lifting process and avoiding tilting or displacement caused by uneven force on both sides.

[0034] like Figure 1 , Figure 4 and Figure 5 As shown, the fixing device also includes a centering unit 3, which includes a drive cylinder 31. The drive cylinder 31 and the connecting seat 114 are fixedly connected. The drive cylinder 31 is symmetrically arranged about the central axis of the fixing device's contact plane. The output axis of the drive cylinder 31 is parallel to the rotation axis of the pressure plate 11.

[0035] When the control system receives the bonding confirmation signal from the balance signal circuit board 111, the control system sends a command to the drive cylinder 31. The output ends of the drive cylinders 31 on both sides of the upper mold output towards the upper mold, gradually pushing the upper mold to the position where the central axis of the upper mold coincides with the central axis of the bonding plane of the fixing device, so as to achieve precise centering positioning of the upper mold in the fixing device, and provide a stable reference for subsequent processing or inspection processes.

[0036] like Figure 9 As shown, the centering unit 3 also includes a centering detection mechanism 32, which includes a rotating rod 33 and a contact switch 34; The rotating rod 33 and the side wall of the output end of the drive cylinder 31 are rotatably connected. The rotation axis of the rotating rod 33 is perpendicular to the output axis of the drive cylinder 31. The contact switch 34 is located on the side of the rotating rod 33 away from the central axis of the plane of the fixed device. The contact switch 34 and the side wall of the output end of the drive cylinder 31 are fixedly connected. When the rotating rod 33 rotates to the side away from the central axis of the plane of the fixed device, the rotating rod 33 presses down the contact switch 34.

[0037] When the rotating rod 33 rotates a fixed angle away from the central axis of the fixed device's contact plane, the end of the rotating rod 33 precisely presses down the trigger button of the contact switch 34, causing the contact switch 34 to close and sending a signal to the control system. If there is a deviation between the central axis of the upper mold and the central axis of the fixed device's contact plane, the timing of the two rotating rods 33 contacting the mold will be slightly different: the rotating rod 33 on the deviated side will contact the mold sidewall first and rotate around the rotation axis away from the center under the reaction force of the mold. When the rotation angle reaches the preset value, the rotating rod 33 on that side presses down the contact switch 34, and the contact switch 34 sends a signal to the control system. The control system receives the signal and instructs the drive cylinder 31 on that side to stop outputting; the drive cylinder 31 on the other side continues to push the rotating rod 33 to move until the rotating rod 33 contacts the mold sidewall and rotates down to press down the contact switch 34. At this time, both contact switches 34 are in the closed state, the central axis of the upper mold is completely aligned with the central axis of the fixed device's contact plane, and the centering positioning is completed.

[0038] like Figure 4 As shown, multiple rotating rollers 112 are arrayed on the pressure plate 11, and the rotation axis of the multiple rotating rollers 112 is perpendicular to the rotation axis of the pressure plate 11.

[0039] The rotating roller 112 reduces the frictional resistance between the axisymmetric block and the pressure plate 11 during the centering positioning of the upper mold, allowing the upper mold to slide more smoothly along the bonding plane under the push of the drive cylinder 31, avoiding mold displacement or scratches on the bonding surface due to excessive friction.

[0040] The working principle of this invention is as follows: When the contact surface of the fixing device is not fully in contact with the top of the upper mold, the pressure plate 11 will deflect slightly due to the gap or tilt of the contact surface, causing the angle of the refractor 14 fixed on its surface to change synchronously. At this time, the laser emitted by the laser emitter 13 will deviate from the original coaxial path after being refracted by the refractor 14, and will not be able to pass through the through holes 113 on both sides of the slider 12 at the same time, or only part of the laser will irradiate the balance signal emitting mechanism 15, so that the balance signal emitting mechanism 15 cannot receive complete laser irradiation and does not meet the standard for transmitting signals. When the contact state meets the requirements, the angle of the refractor 14 corresponds to the preset optical path, and the laser passes through the central axis of the through hole 113 after refraction, completely covering the sensing area of ​​the balance signal emitting mechanism 15, triggering the confirmation signal of contact in place, and realizing real-time monitoring and feedback of the contact accuracy between the fixing device and the upper mold.

[0041] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A mold fixing device, characterized in that: The fixing device includes a bonding unit (1), which includes a pressure plate (11), a slider (12), a laser emitter (13), a refractor (14), and a balance signal emitting mechanism (15). The pressure plate (11) is rotatably connected to one end of the slider (12) at the central axis. The refractor (14) is located on both sides of the slider (12). The refractor (14) is fixedly installed on the end face of the pressure plate (11) on the side where the slider (12) is located. The laser emitter (13) and the balanced signal emission mechanism (15) are respectively located above the refractor (14) on both sides of the slider (12). Both sides of the slider (12) are provided with through holes (113), the two through holes (113) are coaxial, and the central axis of the two through holes (113) is parallel to the contact plane of the fixing device; When the fixing device is fully attached to the top of the upper mold, the laser emitted by the laser emitter (13) is refracted by the refracting mirror (14) and passes through the two through holes (113) in sequence, and is fully irradiated on the balanced signal transmitting mechanism (15).

2. The mold fixing device according to claim 1, characterized in that: The bonding unit (1) further includes a connecting seat (114) and a laser displacement sensor (16). The slider (12) is slidably connected to the connecting seat (114). A reset spring (115) is provided between the slider (12) and the connecting seat (114). The two ends of the reset spring (115) are fixedly connected to the slider (12) and the connecting seat (114) respectively. The laser displacement sensor (16) is located inside the reset spring (115). The laser displacement sensor (16) is fixedly connected to the connecting seat (114). The laser emitted by the laser displacement sensor (16) is perpendicular to the end face of the slider (12) facing the reset spring (115).

3. The mold fixing device according to claim 1, characterized in that: The bonding unit (1) further includes a photoresistor (17), a power supply (18), an acceleration signal circuit board (19), and a deceleration signal circuit board (110). There are two photoresistors (17) and power supplies (18). One photoresistor (17), power supply (18), and acceleration signal circuit board (19) form a complete circuit, and the other photoresistor (17), power supply (18), and deceleration signal circuit board (110) form another complete circuit. The photoresistor (17), power supply (18), acceleration signal circuit board (19), and deceleration signal circuit board (110) are all fixedly connected to the slider (12).

4. The mold fixing device according to claim 1, characterized in that: The balanced signal transmitting mechanism (15) includes a photoresistor (17), a power supply (18), and a balanced signal circuit board (111), which are connected in series. When the fixing device is fully attached to the top of the upper mold, the laser emitted by the laser emitter (13) is refracted by the refracting mirror (14) and passes through the two through holes (113) in sequence, and is fully irradiated on the photoresistor (17).

5. A mold fixing device according to claim 4, characterized in that: The fixing device also includes a telescopic motor (2), which is arranged on both sides of the rotation axis of the pressure plate (11). The telescopic motor (2) and the connecting seat (114) are fixedly connected. The telescopic motor (2) is located below the pressure plate (11). The output end of the telescopic motor (2) is provided with a roller (21). The rotation axis of the roller (21) is parallel to the rotation axis of the pressure plate (11). The plane formed by the central axis of the roller (21) is parallel to the contact plane of the fixing device.

6. The mold fixing device according to claim 1, characterized in that: The fixing device also includes a centering unit (3), which includes a drive cylinder (31). The drive cylinder (31) and the connecting seat (114) are fixedly connected. The drive cylinder (31) is symmetrically arranged about the central axis of the fixing device's contact plane. The output axis of the drive cylinder (31) is parallel to the rotation axis of the pressure plate (11).

7. A mold fixing device according to claim 6, characterized in that: The centering unit (3) also includes a centering detection mechanism (32), which includes a rotating rod (33) and a contact switch (34). The rotating rod (33) and the side wall of the output end of the drive cylinder (31) are rotatably connected. The rotation axis of the rotating rod (33) is perpendicular to the output axis of the drive cylinder (31). The contact switch (34) is located on the side of the rotating rod (33) away from the central axis of the plane of the fixing device. The contact switch (34) and the side wall of the output end of the drive cylinder (31) are fixedly connected. When the rotating rod (33) rotates to the side away from the central axis of the plane of the fixing device, the rotating rod (33) presses down the contact switch (34).

8. The mold fixing device according to claim 1, characterized in that: The pressure plate (11) has a plurality of rotating rollers (112) arranged in an array. The rotation axis of the plurality of rotating rollers (112) is perpendicular to the rotation axis of the pressure plate (11).

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