Multi-process compatible coating equipment

Abstract

The invention discloses coating equipment compatible with multiple processes. A first linear conveying direction and a second linear conveying direction which are parallel to each other are defined in the coating equipment, the first coating cavity and the second coating cavity are arranged along the first linear conveying direction, and the third coating cavity and the fourth coating cavity are arranged along the second linear conveying direction; a rotating platform and a fifth conveying assembly are arranged in the transfer cavity, the fifth conveying assembly is eccentrically arranged on the rotating platform, and the rotating platform is provided with a first conveying position and a second conveying position; at the first conveying position, the fifth conveying assembly is aligned with the first conveying assembly and the second conveying assembly; and at the second conveying position, the fifth conveying assembly is aligned with the third conveying assembly and the fourth conveying assembly. According to the coating equipment, multiple process paths can be flexibly configured, the deposition requirements of multiple specifications and multiple types of film layers can be met, and production continuity and efficiency are guaranteed.

Description

Technical Field

[0001] This application relates to the field of vacuum coating technology, and in particular to a coating equipment compatible with multiple processes. Background Technology

[0002] In display panel array manufacturing, the coating processes for key components such as the gate and source / drain electrodes are crucial for constructing the thin-film transistor circuit structure, directly determining the panel's circuit conductivity, film adhesion, and production efficiency. The gate typically uses a single metal layer or a simple composite film, while the source / drain electrodes are generally composite films.

[0003] Existing coating equipment for panels includes multiple coating chambers arranged in a straight line. Each coating chamber is configured to perform a specific film coating process. This layout makes the process path linear and fixed, lacking flexible adjustment space, making it difficult to adapt to the deposition needs of multiple specifications and types of film layers, and limiting the application scenarios. Summary of the Invention

[0004] In view of the problems of the prior art, this application provides a coating equipment that is compatible with multiple processes.

[0005] A multi-process compatible coating apparatus includes a transfer chamber and a first coating chamber, a second coating chamber, a third coating chamber, and a fourth coating chamber arranged around the transfer chamber. The coating apparatus spatially defines a first linear conveying direction and a second linear conveying direction that are parallel to each other. The first and second coating chambers are arranged along the first linear conveying direction, and the third and fourth coating chambers are arranged along the second linear conveying direction. A first conveying component is disposed in the first coating chamber, a second conveying component is disposed in the second coating chamber, a third conveying component is disposed in the third coating chamber, and a fourth conveying component is disposed in the fourth coating chamber. A rotating platform and a fifth conveying component are disposed in the transfer chamber. The fifth conveying component is eccentrically disposed on the rotating platform, and the rotating platform has a first conveying position and a second conveying position. At the first transmission position, the fifth transmission component extends along the first straight transmission direction and is aligned with the first transmission component and the second transmission component; at the second transmission position, the fifth transmission component extends along the second straight transmission direction and is aligned with the third transmission component and the fourth transmission component.

[0006] Several alternative methods are provided below, but they are not intended as additional limitations on the overall solution above. They are merely further additions or optimizations. Provided there are no technical or logical contradictions, each alternative method can be combined individually with respect to the overall solution above, or multiple alternative methods can be combined with each other.

[0007] Optionally, the first coating cavity and the fourth coating cavity are arranged in a mirror-symmetric configuration, and the second coating cavity and the third coating cavity are arranged in a mirror-symmetric configuration.

[0008] Optionally, at least two of the first coating chamber, the second coating chamber, the third coating chamber, and the fourth coating chamber are configured to perform different coating processes.

[0009] Optionally, the first coating chamber and the fourth coating chamber are configured to perform the same coating process.

[0010] Optionally, the second coating chamber and the third coating chamber are configured to perform the same coating process.

[0011] Optionally, the second, third, and fifth transmission components are all bidirectional transmission structures.

[0012] Optionally, a first valve is provided between the first coating chamber and the transfer chamber, a second valve is provided between the second coating chamber and the transfer chamber, a third valve is provided between the third coating chamber and the transfer chamber, and a fourth valve is provided between the fourth coating chamber and the transfer chamber.

[0013] Optionally, the coating equipment further includes a feeding chamber, a discharging chamber, a first buffer chamber, and a second buffer chamber; The feeding chamber, the first buffer chamber, the first coating chamber, and the second coating chamber are arranged along the first linear conveying direction, and the discharging chamber, the second buffer chamber, the third coating chamber, and the fourth coating chamber are arranged along the second linear conveying direction.

[0014] Optionally, the feeding chamber, the first buffer chamber, and the first coating chamber are connected in sequence; the discharging chamber, the second buffer chamber, and the fourth coating chamber are connected in sequence.

[0015] Optionally, the feeding chamber and the discharging chamber are arranged in a mirror-symmetric configuration; the first buffer chamber and the second buffer chamber are arranged in a mirror-symmetric configuration.

[0016] Compared with existing technologies, the coating equipment of this application can be flexibly configured with multiple process paths, adapt to the deposition needs of multiple specifications and types of films, and ensure the continuity and efficiency of production. The equipment has a wide range of applications. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the coating equipment in this application; Figure 2 This is a process flow diagram of the coating equipment in one embodiment; Figure 3 This is another process flow diagram for the coating equipment; Figure 4This is a process flow diagram of the coating equipment in one embodiment; Figure 5 This is another process flow diagram for the coating equipment; Figure 6 This is a process flow diagram of the coating equipment in another embodiment; Figure 7 This is another process flow diagram for the coating equipment; Figure 8 This is a process flow diagram of the coating equipment in another embodiment; Figure 9 This is a process flow diagram of the coating equipment.

[0018] The annotations in the figure are explained as follows: 10. Feeding chamber; 20. First buffer chamber; 30. First coating chamber; 31. First target material; 40. Second coating chamber; 41. Second target material; 50. Third coating chamber; 51. Third target material; 60. Fourth coating chamber; 61. Fourth target material; 70. Second buffer chamber; 80. Discharge chamber; 90. Transfer chamber; 91. Rotating platform; V1, First valve; V2, Second valve; V3, Third valve; V4, Fourth valve; V5, Fifth valve; V6, Sixth valve; V7, Seventh valve; V8, Eighth valve; V9, Ninth valve; V10, Tenth valve; G, Substrate. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] It should be noted that when a component is said to be "connected" to another component, it can be directly connected to the other component or it can be connected to a component in between. When a component is said to be "set on" another component, it can be directly set on the other component or it may be set to a component in between.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0022] Traditional coating equipment for panels includes multiple coating chambers arranged sequentially in a straight line, each configured to perform a specific film deposition process. During production, the substrate must strictly follow a predetermined process, sequentially depositing the target film layer in each coating chamber. However, traditional coating equipment has significant limitations: (1) The process path is fixed and lacks flexibility, making it difficult to adapt to the deposition requirements of multiple specifications and types of films, which limits the application of equipment; (2) A single coating production line is formed. If any coating chamber fails, the entire production line will stop working, which will seriously affect the continuity and efficiency of production.

[0023] See Figure 1 To address the problems of existing technologies, this application provides a multi-process compatible coating equipment. The coating equipment includes a transfer chamber 90 and coating chambers. Multiple coating chambers are arranged around the transfer chamber 90, including a first coating chamber 30, a second coating chamber 40, a third coating chamber 50, and a fourth coating chamber 60. The surrounding layout can optimize the space utilization of the equipment and provide a structural basis for multi-path process switching. Compared with traditional linear equipment, it is beneficial to significantly improve process flexibility and production redundancy.

[0024] The coating equipment is spatially defined by a first linear conveying direction and a second linear conveying direction that are parallel to each other. Each coating chamber is functionally arranged based on these two linear conveying directions. Specifically, the first coating chamber 30 and the second coating chamber 40 are arranged along the first linear conveying direction, and the third coating chamber 50 and the fourth coating chamber 60 are arranged along the second linear conveying direction.

[0025] Each coating cavity is equipped with a conveying component for stabilizing the transport of the substrate G. Specifically, the first coating cavity 30 is equipped with a first conveying component, the second coating cavity 40 is equipped with a second conveying component, the third coating cavity 50 is equipped with a third conveying component, and the fourth coating cavity 60 is equipped with a fourth conveying component.

[0026] The transfer chamber 90 is equipped with a rotating platform 91 and a fifth conveying component. The fifth conveying component is eccentrically positioned on the rotating platform 91. This eccentricity can be preset by an offset to create an eccentric trajectory during rotation, easily aligning with the first and second linear conveying directions. This effectively shortens the switching time and improves production efficiency. Specifically, the rotating platform 91 has a first conveying position and a second conveying position, which can be switched by rotation. In the first conveying position, the fifth conveying component extends along the first linear conveying direction and is aligned with the first and second conveying components. In the second conveying position, the fifth conveying component extends along the second linear conveying direction and is aligned with the third and fourth conveying components.

[0027] This application establishes a linkage between the coating chambers through the transfer chamber 90, which enables the switching and connection of processes. Furthermore, it allows for flexible selection of film deposition procedures based on the panel array process requirements, making the equipment suitable for a wide range of applications and improving equipment utilization.

[0028] Furthermore, the transfer cavity 90 extends perpendicular to the first and second linear transmission directions, and the rotating platform 91 is located at the center of the transfer cavity 90. Specifically, the transfer cavity 90 has a rectangular structure, the rotating platform 91 has a disc structure, and the fifth transmission component is eccentrically positioned relative to the rotation center of the rotating platform 91.

[0029] Furthermore, the first coating chamber 30 and the fourth coating chamber 60 are arranged in a mirror symmetry, as are the second coating chamber 40 and the third coating chamber 50. This mirror symmetry layout can improve the docking efficiency between the rotating platform 91 and each coating chamber, as well as improve the fault redundancy capability. If a coating chamber fails, a backup coating chamber can be quickly switched to ensure the continuity of the coating process.

[0030] Each coating chamber is equipped with a sputtering deposition target, namely a first target 31, a second target 41, a third target 51, and a fourth target 61. In the panel coating process, at least two of the first coating chamber 30, the second coating chamber 40, the third coating chamber 50, and the fourth coating chamber 60 are configured to perform different coating processes to deposit specific film layers. These specific film layers include barrier layers, conductive layers, and transparent conductive layers. Specifically, the barrier layer is, for example, a molybdenum (Mo) layer; the conductive layer is, for example, a metal layer such as aluminum, copper, or silver; and the transparent conductive layer is, for example, an indium tin oxide layer. Each coating chamber is equipped with a corresponding target type according to the specific film layer to be deposited.

[0031] In one embodiment, the first coating chamber 30 and the fourth coating chamber 60 are configured to perform the same coating process, and / or the second coating chamber 40 and the third coating chamber 50 are configured to perform the same coating process. In the coating equipment, if a coating chamber malfunctions, the production system can quickly switch to another process path to continue operation, avoiding overall production shutdown and significantly improving equipment uptime and production stability.

[0032] In this application, each conveying component is a roller-type structure, consisting of multiple rollers arranged at intervals along a straight conveying direction, and the multiple rollers are linked by a synchronous belt. Furthermore, the second, third, and fifth conveying components are all bidirectional conveying structures, capable of conveying workpieces in either the forward or reverse direction. Specifically, at the first conveying position, the rotary platform 91 can convey the substrate G to the second coating chamber 40. After the coating process is completed in the second coating chamber 40, the substrate G is conveyed back to the transfer chamber 90 by the second conveying component. At the second conveying position, the rotary platform 91 can convey the substrate G to the fourth coating chamber 60 or the third coating chamber 50. If the coating process is completed in the third coating chamber 50, the substrate G is conveyed back to the transfer chamber 90 by the third conveying component.

[0033] In this application, a first valve V1 is provided between the first coating chamber 30 and the transfer chamber 90, a second valve V2 is provided between the second coating chamber 40 and the transfer chamber 90, a third valve V3 is provided between the third coating chamber 50 and the transfer chamber 90, and a fourth valve V4 is provided between the fourth coating chamber 60 and the transfer chamber 90. During panel coating, different coating chambers may perform different processes. Each valve allows for selective switching between a single coating chamber and the transfer chamber 90, achieving process isolation, avoiding cross-contamination, and ensuring the purity of the film layer.

[0034] See Figure 1 The coating equipment of this application further includes a feeding chamber 10, a discharging chamber 80, a first buffer chamber 20, and a second buffer chamber 70, wherein the feeding chamber 10, the first buffer chamber 20, the first coating chamber 30, and the second coating chamber 40 are arranged along a first linear conveying direction; the discharging chamber 80, the second buffer chamber 70, the third coating chamber 50, and the fourth coating chamber 60 are arranged along a second linear conveying direction.

[0035] Specifically, the feeding chamber 10, the first buffer chamber 20, and the first coating chamber 30 are connected in sequence. A fifth valve V5 is provided between the first coating chamber 30 and the first buffer chamber 20, a seventh valve V7 is provided between the first buffer chamber 20 and the feeding chamber 10, and a ninth valve V9 is provided at the inlet end of the feeding chamber 10. The first buffer chamber 20 is equipped with a heating device for preheating the substrate G.

[0036] The discharge chamber 80, the second buffer chamber 70 and the fourth coating chamber 60 are connected in sequence. A sixth valve V6 is provided between the fourth coating chamber 60 and the second buffer chamber 70, an eighth valve V8 is provided between the second buffer chamber 70 and the discharge chamber 80, and a tenth valve V10 is provided at the outlet end of the discharge chamber 80.

[0037] Furthermore, the feeding chamber 10 and the discharging chamber 80 are mirror-symmetrically arranged, and the first buffer chamber 20 and the second buffer chamber 70 are mirror-symmetrically arranged, which can form a precise match with the first linear conveying direction and the second linear conveying path to achieve bidirectional parallel production.

[0038] This application provides further details with reference to specific processes. In one embodiment, the first plating cavity 30 or the fourth plating cavity 60 is used to perform plating of a transparent conductive layer (indium tin oxide layer): See Figure 2 The substrate G enters the first coating chamber 30 for coating. After the coating process is completed, it is transferred to the transfer chamber 90. The rotating platform 91 rotates to the second transfer position, and the substrate G is discharged sequentially through the fourth coating chamber 60, the second buffer chamber 70 and the discharge chamber 80.

[0039] See Figure 3 The substrate G enters the transfer cavity 90, the rotating platform 91 rotates to the second conveying position, and then the substrate G is conveyed to the fourth coating cavity 60 for coating process. After the coating process is completed, the substrate G is discharged through the second buffer cavity 70 and the discharge cavity 80 in sequence.

[0040] In another embodiment, the first coating chamber 30 is used to perform molybdenum layer plating, and the second coating chamber 40 or the third coating chamber 50 is used to perform conductive layer plating (copper or silver). See Figure 4 The substrate G enters the first coating chamber 30 for the first coating process. After the first coating process is completed, it enters the transfer chamber 90 and enters the second coating chamber 40 along the first linear conveying direction for the second coating process. After the second coating process is completed, the substrate G returns to the transfer chamber 90. The rotating platform 91 rotates to the second conveying position and discharges the substrate G through the fourth coating chamber 60, the second buffer chamber 70, and the discharge chamber 80.

[0041] See Figure 5 The substrate G enters the first coating chamber 30 to complete the first coating process and is then transferred to the transfer chamber 90. The rotating platform 91 rotates to the second transfer position and moves the substrate G into the third coating chamber 50 along the second straight transfer direction for the second coating process. After the second coating process is completed, the substrate G is returned to the transfer chamber 90 and is discharged sequentially through the fourth coating chamber 60, the second buffer chamber 70, and the discharge chamber 80.

[0042] In another embodiment, the second coating chamber 40 or the third coating chamber 50 is used to perform the coating of a conductive layer (aluminum layer), and the fourth coating chamber 60 is used to coat a barrier layer (molybdenum layer). See Figure 6 During the coating process, the substrate G sequentially passes through the feeding chamber 10, the first buffer chamber 20, the first coating chamber 30, and the transfer chamber 90 into the second coating chamber 40 for the first coating process. After the first coating process is completed, the substrate G is returned to the transfer chamber 90, and the rotating platform 91 rotates to the second conveying position to send the substrate G into the fourth coating chamber 60 for the second coating process. After the second coating process is completed, the substrate G is discharged through the second buffer chamber 70 and the discharge chamber 80.

[0043] See Figure 7 The substrate G enters the transfer chamber 90 sequentially through the feeding chamber 10, the first buffer chamber 20, and the first coating chamber 30. The rotating platform 91 rotates to the second conveying position and then conveys the substrate G to the third coating chamber 50 for the first coating process. After the first coating process is completed, the substrate G is returned to the transfer chamber 90 and conveyed to the fourth coating chamber 60 for the second coating process. After the second coating process is completed, it is discharged sequentially through the second buffer chamber 70 and the discharge chamber 80.

[0044] In another embodiment, the first coating chamber 30 is used to perform the coating of a barrier layer (molybdenum layer), the second coating chamber 40 or the third coating chamber 50 is used to perform the coating of a conductive layer (aluminum layer), and the fourth coating chamber 60 is used to perform the coating of a barrier layer (molybdenum layer). See Figure 8 During the coating process, the substrate G sequentially passes through the feeding chamber 10 and the first buffer chamber 20, and enters the first coating chamber 30 for the first coating process. After completing the first coating process, it passes through the transfer chamber 90 and enters the second coating chamber 40 for the second coating process. After completing the second coating process, the substrate G is returned to the transfer chamber 90, and the rotating platform 91 rotates to the second conveying position to convey the substrate G to the fourth coating chamber 60 for the third coating process. After completing the third coating process, the substrate G is discharged sequentially through the second buffer chamber 70 and the discharge chamber 80.

[0045] See Figure 9 During the coating process, the substrate G sequentially passes through the feeding chamber 10 and the first buffer chamber 20, and enters the first coating chamber 30 for the first coating process. After completing the first coating process, it enters the transfer chamber 90. The rotating platform 91 rotates to the second conveying position and conveys the substrate G to the third coating chamber 50 for the second coating process. After completing the second coating process, the substrate G is returned to the transfer chamber 90 and conveyed to the fourth coating chamber 60 for the third coating process. After completing the third coating process, the substrate G is discharged sequentially through the second buffer chamber 70 and the discharge chamber 80.

[0046] The coating equipment of this application can be flexibly configured with multiple process paths, which can adapt to the deposition requirements of multiple specifications and types of film layers, and ensure the continuity and efficiency of production.

[0047] The technical features of the embodiments described above can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered to be within the scope of this specification. When technical features of different embodiments are embodied in the same drawing, it can be regarded as the drawing also disclosing examples of combinations of the various embodiments involved.

[0048] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A multi-process compatible coating apparatus, comprising a transfer chamber and a first coating chamber, a second coating chamber, a third coating chamber, and a fourth coating chamber arranged around the transfer chamber, characterized in that: The coating equipment spatially defines a first linear conveying direction and a second linear conveying direction that are parallel to each other. The first coating cavity and the second coating cavity are arranged along the first linear conveying direction, and the third coating cavity and the fourth coating cavity are arranged along the second linear conveying direction. A first conveying component is disposed in the first coating cavity, a second conveying component is disposed in the second coating cavity, a third conveying component is disposed in the third coating cavity, and a fourth conveying component is disposed in the fourth coating cavity. A rotating platform and a fifth conveying component are disposed in the transfer cavity. The fifth conveying component is eccentrically disposed on the rotating platform, and the rotating platform has a first conveying position and a second conveying position. At the first conveying position, the fifth conveying component extends along the first linear conveying direction and is aligned with the first conveying component and the second conveying component. At the second transmission position, the fifth transmission component extends along the second straight transmission direction and is aligned with the third and fourth transmission components.

2. The multi-process compatible coating equipment according to claim 1, characterized in that, The first coating cavity and the fourth coating cavity are arranged in a mirror symmetrical configuration, as are the second coating cavity and the third coating cavity.

3. The multi-process compatible coating equipment according to claim 1, characterized in that, At least two of the first coating chamber, the second coating chamber, the third coating chamber, and the fourth coating chamber are configured to perform different coating processes.

4. The multi-process compatible coating equipment according to claim 1, characterized in that, The first coating chamber and the fourth coating chamber are configured to perform the same coating process.

5. The multi-process compatible coating equipment according to claim 1, characterized in that, The second coating chamber and the third coating chamber are configured to perform the same coating process.

6. The multi-process compatible coating equipment according to claim 1, characterized in that, The second, third, and fifth transmission components are all bidirectional transmission structures.

7. The multi-process compatible coating equipment according to claim 1, characterized in that, A first valve is provided between the first coating chamber and the transfer chamber, a second valve is provided between the second coating chamber and the transfer chamber, a third valve is provided between the third coating chamber and the transfer chamber, and a fourth valve is provided between the fourth coating chamber and the transfer chamber.

8. The multi-process compatible coating equipment according to claim 1, characterized in that, It also includes a feeding chamber, a discharging chamber, a first buffer chamber, and a second buffer chamber; The feeding chamber, the first buffer chamber, the first coating chamber, and the second coating chamber are arranged along the first linear conveying direction, and the discharging chamber, the second buffer chamber, the third coating chamber, and the fourth coating chamber are arranged along the second linear conveying direction.

9. The multi-process compatible coating equipment according to claim 8, characterized in that, The feeding chamber, the first buffer chamber, and the first coating chamber are connected in sequence; The discharge chamber, the second buffer chamber, and the fourth coating chamber are connected in sequence.

10. The multi-process compatible coating equipment according to claim 8, characterized in that, The feeding chamber and the discharging chamber are arranged in a mirror symmetrical manner; The first buffer cavity and the second buffer cavity are arranged in a mirror-symmetric manner.

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