Adjustable magnetron sputtering source
By adopting an adjustable magnetron sputtering source design in the magnetron sputtering source, the fine adjustment and tilt angle adjustment of the permanent magnet steel can be achieved by using elastic components and adjusting bolts, which solves the problem of magnetic field inhomogeneity of permanent magnet magnetron sputtering source and improves magnetic field uniformity and magnetization accuracy.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-14
- Publication Date
- 2026-04-03
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure CN121781089A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of glass coating equipment technology, and more particularly to an adjustable magnetron sputtering source. Background Technology
[0002] Magnetron sputtering is a deposition method that uses a magnetic field to "direct" the movement of electrons, making the sputtering of target materials more efficient and controllable. Currently, there are pure permanent magnetic field sputtering sources, electromagnetic field sputtering sources, and composite solutions of electromagnetic and permanent magnet. Among them, the electromagnetic and permanent magnet composite solution has advantages in terms of structural design, cost, and sputtering efficiency. However, permanent magnet materials are magnetized first, and the magnetized magnet itself has a certain degree of error. During installation, even a slight deviation in the installation position will cause a small difference between the overall magnetic field and the designed magnetic field. In addition, demagnetization and weakening will occur to varying degrees during use. Therefore, the adjustability of permanent magnets is very necessary. At present, there is no effective micro-adjustment solution for permanent magnets. Summary of the Invention
[0003] To address the shortcomings of existing technologies, this invention proposes a method that allows adjustment of the position of permanent magnets to accommodate differences in magnetization and magnetic loss.
[0004] To achieve the above objectives, the present invention adopts the following technical solution: an adjustable magnetron sputtering source, characterized in that it includes a shielding shell and a plurality of magnetic mounting backplates installed inside the shielding shell. The magnetic mounting backplate includes a body, and a plurality of magnet mounting plates are respectively provided on both sides of the body. The magnet mounting plates are connected to the body through an elastic part, and there is a gap between adjacent magnet mounting plates on the same side of the body. An electromagnetic winding is installed on the inner surface of the body, and permanent magnets are installed on the inner side of the magnet mounting plates. The body and the shielding shell are fixedly connected by a plurality of fastening bolts. The shielding shell has adjustment holes corresponding one-to-one with each magnet mounting plate, and adjustment bolts are threaded into the adjustment holes.
[0005] Furthermore, a target material is fixedly disposed on the shielding shell, and the magnetic mounting backplate is located between the target material and the shielding shell.
[0006] Compared with the prior art, the present invention has the following advantages:
[0007] 1. Since the position of the permanent magnet mounting plate can be slightly adjusted by loosening or tightening the adjusting bolts, the magnetic field of the permanent magnet can be adjusted slightly to cope with differences in magnetization and magnetic loss. This makes the magnetic field more uniform during the debugging and maintenance phases, and allows for more relaxed requirements on the magnetization accuracy and replacement cycle of the permanent magnet.
[0008] 2. Multiple magnet mounting plates on the same magnetic mounting backplate can be adjusted independently, so that permanent magnets that were originally in the same plane can be adjusted to a slight tilt angle, thereby adjusting the magnetic field. The magnetic field of the sputtering source is optimized through the overall debugging of electromagnetic adjustment and permanent magnet adjustment. Attached Figure Description
[0009] Figure 1 This is a schematic diagram of an adjustable magnetron sputtering source in a state where the shielding housing is separated from multiple magnetic mounting backplates.
[0010] Figure 2 This is a cross-sectional view of an adjustable magnetron sputtering source.
[0011] Figure 3 This is a schematic diagram of a single magnetic mounting backplate.
[0012] Legend: 1. Shielding shell; 2. Magnetic mounting backplate; 3. Body; 4. Magnet mounting plate; 5. Elastic part; 6. Electromagnetic winding; 7. Permanent magnet; 8. Fastening bolt; 9. Adjusting bolt; 10. Target material. Detailed Implementation
[0013] The following are specific embodiments of the present invention, which are described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments.
[0014] like Figure 1 , Figure 2 and Figure 3 As shown, the device includes a shielding shell 1 and several magnetic mounting backplates 2 installed inside the shielding shell 1. The magnetic mounting backplate 2 includes a body 3, and several magnetic steel mounting plates 4 are respectively provided on both sides of the body 3. The magnetic steel mounting plates 4 are connected to the body 3 through an elastic part 5. There is a gap between adjacent magnetic steel mounting plates 4 located on the same side of the body 3. An electromagnetic winding 6 is installed on the inner surface of the body 3, and a permanent magnet 7 is installed on the inner side of the magnetic steel mounting plate 4. The body 3 and the shielding shell 1 are fixedly connected by several fastening bolts 8. The shielding shell 1 has adjustment holes that correspond one-to-one with each magnetic steel mounting plate 4, and adjustment bolts 9 are threaded into the adjustment holes.
[0015] A target 10 is fixedly mounted on the shielding shell 1, and a magnetic mounting backplate 2 is located between the target 10 and the shielding shell 1. Since the position of the magnet mounting plate 4 for mounting the permanent magnet 7 can be slightly adjusted by tightening or loosening the adjusting bolts 9, the magnetic field of the permanent magnet 7 can be slightly adjusted to address differences in magnetization and magnetic loss. This allows for a more uniform magnetic field during commissioning and maintenance, and provides more lenient requirements for the magnetization accuracy and replacement cycle of the permanent magnet 7. Multiple magnet mounting plates 4 on the same magnetic mounting backplate 2 can be adjusted independently, allowing the permanent magnet 7, originally in the same plane, to be tilted at a slight angle, thereby adjusting the magnetic field. Optimization of the sputtering source magnetic field is achieved through the coordinated adjustment of electromagnetic and permanent magnet adjustments.
[0016] The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.
Claims
1. An adjustable magnetron sputtering source, characterized in that, The shield includes a shielding shell (1) and several magnetic mounting backplates (2) installed inside the shielding shell (1). The magnetic mounting backplate (2) includes a body (3). Several magnetic steel mounting plates (4) are respectively provided on both sides of the body (3). The magnetic steel mounting plates (4) are connected to the body (3) through an elastic part (5). There is a gap between adjacent magnetic steel mounting plates (4) on the same side of the body (3). An electromagnetic winding (6) is installed on the inner surface of the body (3). A permanent magnet (7) is installed on the inner side of the magnetic steel mounting plate (4). The body (3) and the shielding shell (1) are fixedly connected by several fastening bolts (8). The shielding shell (1) has adjustment holes that correspond one-to-one with each magnetic steel mounting plate (4). Adjustment bolts (9) are threaded into the adjustment holes.
2. The adjustable magnetron sputtering source according to claim 1, characterized in that, The shielding shell (1) is fixedly provided with a target material (10), and the magnetic mounting back plate (2) is located between the target material (10) and the shielding shell (1).