Method and device for determining shell temperature of optical module, optical module and electronic equipment
By acquiring the equivalent voltage signals of the temperature of multiple heat-generating components in the optical module, and using weighted calculation and standardization processing, the problem of large calculation errors in the temperature of the optical module casing is solved, enabling more accurate temperature estimation and fault detection, and ensuring the stable operation of the optical module.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-22
- Publication Date
- 2026-04-03
AI Technical Summary
In existing technologies, the temperature equivalent voltage signal collected by the independent temperature sensor on the optical module is obtained through the analog-to-digital converter of the microprocessor, which results in a large error between the calculated value of the optical module shell temperature and the actual measured value.
At each time point, the equivalent voltage signals of the temperature of multiple heat-generating components in the optical module are acquired. Using data from multiple temperature sensors, the shell temperature of the optical module is determined through weighted calculation and standardization.
It reduces the error between the calculated and actual measured values of the optical module's casing temperature, improves the accuracy and robustness of temperature estimation, enables timely detection of heat-generating component failures, and ensures the stable operation of the optical module.
Smart Images
Figure CN121783373A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of data processing technology, and in particular to a method, apparatus, optical module, and electronic device for determining the casing temperature of an optical module. Background Technology
[0002] The casing temperature of an optical module is determined primarily to ensure stable operation and extend its lifespan. The casing temperature directly affects the performance and reliability of internal components; excessively high temperatures can lead to decreased optical power, increased bit error rate, or even burnout, while excessively low temperatures may affect optical output power and transmission distance.
[0003] In the existing technology, the traditional method for determining the shell temperature of an optical module involves the microprocessor's analog-to-digital converter acquiring the temperature equivalent voltage signal collected by an independent temperature sensor on the optical module, and then using the temperature value converted from the temperature equivalent voltage signal as the shell temperature of the optical module.
[0004] However, in the existing technology, the method of obtaining the temperature equivalent voltage signal collected by the independent temperature sensor on the optical module through the analog-to-digital converter of the microprocessor to determine the shell temperature of the optical module has a single temperature data source, which makes the error between the calculated value of the shell temperature of the optical module and the actual measurement value large. Summary of the Invention
[0005] This application provides a method, apparatus, optical module, and electronic device for determining the casing temperature of an optical module, in order to solve the problem in the prior art that the method of determining the casing temperature of an optical module by obtaining the temperature equivalent voltage signal collected by an independent temperature sensor on the optical module through an analog-to-digital converter of a microprocessor is based on a single temperature data source, resulting in a large error between the calculated value and the actual measured value of the casing temperature of the optical module.
[0006] In a first aspect, this application provides a method for determining the casing temperature of an optical module, applied to the microcontroller of the optical module, comprising:
[0007] At each time point, the temperature equivalent voltage signal of multiple heat-generating components in the optical module and the actual shell temperature of the optical module are obtained, wherein each time point is determined by a preset time period.
[0008] The temperature equivalent voltage signal of each heating component at any given time point is converted to obtain the temperature value of each heating component.
[0009] Extract the standard power of each heating component from the preset reference file;
[0010] The temperature values and standard power of each heat-generating component are weighted by power ratio to obtain the estimated shell temperature of the optical module at the time point.
[0011] The estimated shell temperature values at each time point are standardized based on the actual shell temperature at each time point to obtain the standard shell temperature values at each time point.
[0012] The standard values of the outer casing temperature of the optical module are output for each time period within the preset time period.
[0013] In one possible design, the plurality of heat-generating components include a plurality of processing chips, a microcontroller, and peripheral temperature sensors, wherein each processing chip contains a corresponding temperature sensor, and the microcontroller contains a built-in temperature sensor; the temperature equivalent voltage signal is a first temperature equivalent voltage, a second temperature equivalent voltage, and a third temperature equivalent voltage; correspondingly, acquiring the temperature equivalent voltage signals of the plurality of heat-generating components in the optical module and the actual shell temperature of the optical module at each time point includes: acquiring the first temperature equivalent voltage signal collected by each temperature sensor, the second temperature equivalent voltage signal collected by the built-in temperature sensor, and the third temperature equivalent voltage signal collected by the peripheral temperature sensor at each time point; correspondingly, converting the temperature equivalent voltage signals of each heat-generating component at any time point to obtain the temperature value of each heat-generating component includes: converting the first temperature equivalent voltage signal of each processing chip corresponding to the time point into a third temperature equivalent voltage signal. The equivalent voltage signal is converted into a corresponding first temperature value; the second equivalent voltage signal of the microcontroller corresponding to the time node is converted into a corresponding second temperature value; the third equivalent voltage signal of the peripheral temperature sensor corresponding to the time node is converted into a corresponding third temperature value; correspondingly, the extraction of the standard power of each heat-generating component from the preset reference file includes: extracting the first standard power of each processing chip, the second standard power of the microcontroller, and the third standard power of the peripheral temperature sensor from the preset reference file; correspondingly, the power ratio weighted calculation of the temperature value and standard power of each heat-generating component to obtain the estimated value of the housing temperature of the optical module at the time node includes: performing a weighted average calculation of each first temperature value, second temperature value, third temperature value, first power value, second power value, and third power value to obtain the estimated value of the housing temperature of the optical module at the time node.
[0014] In one possible design, the step of performing a power ratio weighted calculation on the temperature values and standard power of each heat-generating component to obtain an estimated value of the housing temperature of the optical module at the specified time point includes: acquiring the operating status information of the optical module at the specified time point; adjusting the power ratio weight coefficient corresponding to the standard power of each heat-generating component based on the operating status information to obtain an adjusted power weight coefficient corresponding to each heat-generating component; and performing a power ratio weighted calculation on the temperature values of each heat-generating component and the adjusted power weight coefficient to obtain an estimated value of the housing temperature of the optical module at the specified time point.
[0015] In one possible design, the standardization of the corresponding estimated shell temperature based on the actual shell temperature at each time point to obtain the standard shell temperature value at each time point includes: fitting the estimated shell temperature value and the actual shell temperature at each time point to obtain the corresponding linear calculation equation; and standardizing the estimated shell temperature value at each time point based on the linear calculation equation to obtain the standard shell temperature value at each time point.
[0016] In one possible design, after fitting the estimated and actual shell temperatures at each time point to obtain the corresponding linear calculation equation, the method further includes: periodically collecting the standard shell temperature and the actual shell temperature for any given time period; determining a first temperature difference between the standard shell temperature and the actual shell temperature; determining whether the first temperature difference is greater than a first difference threshold; and if the first temperature difference is greater than the first difference threshold, adjusting the linear calculation equation based on the first temperature difference.
[0017] In one possible design, acquiring the temperature equivalent voltage signal of multiple heating components in the optical module at each time point includes: acquiring the initial temperature equivalent voltage signal of multiple heating components in the optical module at each time point; performing cross-validation on each initial temperature equivalent voltage signal to obtain the validation result of each initial temperature equivalent voltage signal; if each validation result is determined to be valid, then each initial temperature equivalent voltage signal is determined as the corresponding temperature equivalent voltage signal.
[0018] In one possible design, after outputting the standard values of the outer casing temperature of the optical module for each preset time period, the method further includes: determining the power percentage of any heating component at any time node through a polling mechanism; calculating the theoretical temperature of the heating component in reverse based on the power percentage; comparing the theoretical temperature with the sampled temperature of the heating component at the time node to obtain a corresponding second temperature difference; determining whether the second temperature difference is greater than a second difference threshold; if the second temperature difference is greater than the second difference threshold, determining that the heating component has malfunctioned, and obtaining the fault data of the heating component.
[0019] Secondly, this application provides a device for determining the casing temperature of an optical module, applied to the microcontroller of the optical module, comprising:
[0020] The acquisition module is used to acquire the temperature equivalent voltage signal of multiple heat-generating components in the optical module and the actual shell temperature of the optical module at each time point, wherein each time point is determined by a preset time period.
[0021] The conversion module is used to convert the temperature equivalent voltage signal of each heating component at any time point to obtain the temperature value of each heating component.
[0022] The extraction module is used to extract the standard power of each heating component from a preset reference file;
[0023] The first calculation module is used to perform a power ratio weighted calculation on the temperature value and standard power of each heat-generating component to obtain the estimated value of the outer shell temperature of the optical module at the time node.
[0024] The processing module is used to standardize the corresponding estimated shell temperature values based on the actual shell temperature at each time point to obtain the standard shell temperature values at each time point.
[0025] The output module is used to output the standard values of the outer casing temperature of the optical module during the preset time period.
[0026] Thirdly, this application provides an optical module, including: multiple processing chips, a microcontroller and a peripheral temperature sensor, wherein each processing chip contains a corresponding temperature sensor, and the microcontroller contains a built-in temperature sensor.
[0027] The temperature sensors in each processing chip are communicatively connected to the microcontroller.
[0028] The peripheral temperature sensor is connected in communication with the microcontroller.
[0029] Fourthly, this application provides an electronic device, comprising: at least one processor and a memory;
[0030] The memory stores computer-executed instructions;
[0031] The at least one processor executes computer execution instructions stored in the memory, causing the at least one processor to perform the method for determining the housing temperature of the optical module as described in the first aspect and various possible designs of the first aspect.
[0032] The method, apparatus, optical module, and electronic device for determining the housing temperature of an optical module provided in this application acquire the equivalent temperature voltage signals of multiple heat-generating components in the optical module and the corresponding actual housing temperature of the optical module at various time points, wherein each time point is determined by a preset time period; the equivalent temperature voltage signals of each heat-generating component at any time point are converted to obtain the temperature value of each heat-generating component; the standard power of each heat-generating component is extracted from a preset reference file; the temperature value and standard power of each heat-generating component are weighted by power ratio calculation to obtain the estimated value of the housing temperature of the optical module at each time point; the estimated value of the housing temperature is standardized according to the actual housing temperature at each time point to obtain the standard value of the housing temperature at each time point; and the standard value of the housing temperature of the optical module in the preset time period is output. By weighting and standardizing the temperature values and standard power of multiple heat-generating components, the standard value of the housing temperature of the optical module is obtained, thereby reducing the error between the calculated value and the actual measured value of the housing temperature of the optical module. Attached Figure Description
[0033] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0034] Figure 1 A flowchart illustrating the method for determining the housing temperature of an optical module provided in this application embodiment. Figure 1 ;
[0035] Figure 2 A flowchart illustrating the method for determining the housing temperature of an optical module provided in this application embodiment. Figure 2 ;
[0036] Figure 3 A schematic diagram of the structure of the optical module housing temperature determination device provided in the embodiments of this application;
[0037] Figure 4 This is a schematic diagram of the structure of the optical module provided in an embodiment of this application;
[0038] Figure 5 A schematic diagram of the hardware structure of the electronic device provided in the embodiments of this application;
[0039] Figure 6 The power-weighted average temperature curve provided for the embodiments of this application. Detailed Implementation
[0040] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0041] Determining the casing temperature of an optical module is crucial for ensuring stable operation and extending its lifespan. The casing temperature directly impacts the performance and reliability of internal components; excessively high temperatures can lead to decreased optical power, increased bit error rate, and even burnout, while excessively low temperatures may affect optical output power and transmission distance. In existing technologies, traditional methods for determining the casing temperature of optical modules involve using a microprocessor's analog-to-digital converter (ADC) to acquire the temperature equivalent voltage signal from an independent temperature sensor on the optical module, and then using the converted temperature value as the casing temperature. However, this method relies on a single temperature data source, resulting in a significant discrepancy between the calculated and measured casing temperature.
[0042] To address the aforementioned technical problems, this application proposes the following technical concept: The inventors consider the equivalent temperature voltage signals of multiple heating components in the optical module acquired at each time point, and the actual shell temperature of the optical module. Based on the equivalent temperature voltage signals of each heating component at each time point, they determine the corresponding estimated shell temperature value. The actual shell temperature at each time point is then used to standardize the corresponding estimated shell temperature value to obtain the standard shell temperature value for each time point, thereby reducing the error between the calculated and actual measured shell temperature of the optical module.
[0043] Figure 1 A flowchart illustrating the method for determining the housing temperature of an optical module provided in this application embodiment. Figure 1 The execution entity in this embodiment can be Figure 1 The microcontroller in the illustrated embodiment is not specifically limited in this embodiment. Figure 1 As shown, the method includes:
[0044] S101: At each time point, acquire the temperature equivalent voltage signal of multiple heat-generating components in the optical module, as well as the actual shell temperature of the optical module, wherein each time point is determined by a preset time period.
[0045] In this embodiment, the multiple heat-generating components include multiple processing chips, a microcontroller, and peripheral temperature sensors, wherein each processing chip contains a corresponding temperature sensor, and the microcontroller contains a built-in temperature sensor; the temperature equivalent voltage signal is a first temperature equivalent voltage, a second temperature equivalent voltage, and a third temperature equivalent voltage; accordingly, step S101 specifically includes:
[0046] At each time point, the first temperature equivalent voltage signal collected by each temperature sensor, the second temperature equivalent voltage signal collected by the internal temperature sensor, and the third temperature equivalent voltage signal collected by the external temperature sensor are acquired.
[0047] For example, the multiple processing chips are chip12, chip22, chip11 and chip21; the microcontroller is an MCU; and the peripheral temperature sensor is a TS-Temperature Sensor.
[0048] The external temperature sensor contains an ADC unit, or analog-to-digital converter. Its core function is to convert the temperature equivalent voltage signal into a digital signal for processing by the MCU.
[0049] The temperature sensor within each processing chip is an ADC unit; the built-in temperature sensor within the microcontroller is an Internal Temperature Sensor, exemplified by an ADC unit.
[0050] Specifically, the actual housing temperature of the optical module is obtained by measuring the center point of the housing temperature using an infrared imager.
[0051] For example, each time point is 0 seconds, 1 second...15 seconds and 16 seconds, and the corresponding preset time period is [0, 16], in seconds.
[0052] For example, the actual housing temperature of the optical module at each time point is -10, -5...65, 70.
[0053] In addition, step S101 may specifically include steps a~c:
[0054] Step a: At each time point, acquire the initial temperature equivalent voltage signal of multiple heat-generating components in the optical module.
[0055] Step b: Perform cross-validation on each initial temperature equivalent voltage signal to obtain the validation results of each initial temperature equivalent voltage signal.
[0056] Specifically, step b includes steps b1 to b3:
[0057] Step b1: Obtain the equivalent voltage signals of any two initial target temperatures, and perform cross-validation on the two initial target temperature equivalent voltage signals to obtain the corresponding voltage signal difference.
[0058] For example, the initial temperature equivalent voltage signals of any two targets are the initial temperature equivalent voltage signals of the external temperature sensor and the initial temperature equivalent voltage signals of the MCU's internal temperature sensor.
[0059] The initial temperature equivalent voltage signal of the external temperature sensor is 2.5V, and the initial temperature equivalent voltage signal of the MCU's internal temperature sensor is 1.2V, with a corresponding voltage signal difference of 1.3V.
[0060] Step b2: Determine whether the voltage signal difference is greater than the preset voltage signal difference threshold.
[0061] In this embodiment, the preset voltage signal difference threshold can be any value among 0.5V, 1V, or 1.5V, or other values.
[0062] For example, the preset voltage signal difference threshold is 1.5V.
[0063] Step b3: If the voltage signal difference is less than or equal to the preset voltage signal difference threshold, the verification result of generating the two target initial temperature equivalent voltage signals is verified as passed.
[0064] For example, if the voltage signal difference of 1.3V is determined to be less than or equal to the preset voltage signal difference threshold of 1.5V, then the verification result of generating two target initial temperature equivalent voltage signals is verified as passed.
[0065] Step c: If each verification result is determined to be a successful verification, then each initial temperature equivalent voltage signal is determined as the corresponding temperature equivalent voltage signal.
[0066] S102: Convert the temperature equivalent voltage signal of each heating component at any time point to obtain the temperature value of each heating component.
[0067] Specifically, step S102 includes steps a~c:
[0068] Step a: Convert the first temperature equivalent voltage signal of each processing chip corresponding to the time node into the corresponding first temperature value.
[0069] Specifically, the ADC unit converts the first temperature equivalent voltage signal of each processing chip corresponding to the time node into the corresponding first temperature value.
[0070] For example, the first temperature value of each processing chip chip12, chip22, chip11 and chip21 is T.12 T 22 T 11 and T 21 .
[0071] Step b: Convert the second temperature equivalent voltage signal of the microcontroller corresponding to the time node into the corresponding second temperature value.
[0072] For example, the second temperature value of the microcontroller is T mcu .
[0073] Step c: Convert the third temperature equivalent voltage signal of the external temperature sensor corresponding to the time node into the corresponding third temperature value.
[0074] For example, the third temperature value of the peripheral temperature sensor is T. ts .
[0075] For example, the temperature values of each heating component are shown in the table below:
[0076] Table 1 Temperature values of each heating element
[0077]
[0078] S103: Extract the standard power of each heating component from the preset reference file.
[0079] Specifically, step S103 involves extracting the first standard power of each processing chip, the second standard power of the microcontroller, and the third standard power of the peripheral temperature sensor from a preset reference file.
[0080] In this embodiment, the preset reference file can be a chip manual or other reference files.
[0081] For example, the first standard power of each processing chip (chip12, chip22, chip11, and chip21) is P. 12 P 22 P 11 and P 21 .
[0082] For example, the second standard-condition power of the microcontroller is P. mcu The third standard condition power of the external temperature sensor is P. ts .
[0083] For example, the standard power of each heat-generating component is shown in the table below:
[0084] Table 2 Standard power of each heating component
[0085]
[0086] S104: Perform a power ratio weighted calculation on the temperature values and standard power of each heat-generating component to obtain the estimated shell temperature of the optical module at a given time point.
[0087] Specifically, step S104 involves: performing a weighted average calculation on each of the first temperature value, the second temperature value, the third temperature value, each of the first power value, the second power value, and the third power value to obtain an estimated value of the outer casing temperature of the optical module at a given time point.
[0088] For example, a weighted average is calculated using the first temperature value, the second temperature value, the third temperature value, the first power value, the second power value, and the third power value to obtain an estimated value of the housing temperature of the optical module at a given time point. The calculation formula is as follows:
[0089]
[0090] In the formula, T module This is an estimated value for the casing temperature.
[0091] For example, the estimated shell temperature at each time point is approximately 10, 17...94, 99.
[0092] In addition, step S104 also includes steps a~c:
[0093] Step a: Obtain the operating status information of the optical module at the specified time point.
[0094] In this embodiment, the operating status information may be the power-on initialization stage, a sudden change in ambient temperature, or a normal operating state, etc.
[0095] Step b: Adjust the power ratio weighting coefficient corresponding to the standard power of each heat-generating component based on the operating status information to obtain the adjusted power weighting coefficient for each heat-generating component.
[0096] For example, when the ambient temperature drops sharply, the weighting factor corresponding to the standard power of high-power chips such as microprocessors is adjusted from 0.3 to 0.5.
[0097] Step c: Perform a power ratio weighted calculation on the temperature values of each heat-generating component and the adjusted power weighting coefficient to obtain the estimated shell temperature of the optical module at the time node.
[0098] S105: Standardize the estimated shell temperature values based on the actual shell temperature at each time point to obtain the standard shell temperature values at each time point.
[0099] Specifically, step S105 includes a~b:
[0100] Step a: Fit the estimated shell temperature and the actual shell temperature at each time point to obtain the corresponding linear calculation equation.
[0101] For example, the estimated shell temperature and the actual shell temperature at each time point are fitted to obtain the corresponding linear calculation equation y=0.8913x-19.623.
[0102] Based on the above example, the estimated and actual casing temperatures at each time point are fitted to obtain a power-weighted average temperature curve, as shown in the figure. Figure 6 As shown.
[0103] In the power-weighted average temperature curve, the horizontal axis represents the estimated shell temperature at each time point, i.e., the power-weighted average temperature; the vertical axis represents the actual shell temperature at each time point. The solid curve represents the power-weighted average temperature curve, and the dashed line represents the linear calculation equation.
[0104] In addition, steps a1 to a4 are included after step a:
[0105] Step a1: Periodically collect the standard value and actual shell temperature for any given time period.
[0106] In this embodiment, the cycle can be any one of every 1 day, every 2 days, or every 3 days, or other cycles.
[0107] Step a2: Determine the first temperature difference between the standard value of the outer casing temperature and the actual outer casing temperature.
[0108] Step a3: Determine whether the first temperature difference is greater than the first difference threshold.
[0109] In this embodiment, the first difference threshold is any temperature difference of ±2℃, ±3℃ or ±5℃, or it can be other temperature differences.
[0110] Step a4: If the first temperature difference is determined to be greater than the first difference threshold, the linear calculation equation is adjusted according to the first temperature difference.
[0111] Step b: Standardize the estimated shell temperature values for each time point according to the linear calculation equation to obtain the standard shell temperature values for each time point.
[0112] Specifically, the estimated shell temperature values corresponding to each time point are substituted into the linear calculation equation to obtain the standard shell temperature values for each time point.
[0113] S106: Standard values of the outer casing temperature of the output optical module during a preset time period.
[0114] In summary, the method for determining the outer casing temperature of the optical module provided in this embodiment obtains the equivalent temperature voltage signals of multiple heat-generating components in the optical module and the corresponding actual outer casing temperature at each time point, wherein each time point is determined by a preset time period; the equivalent temperature voltage signals of each heat-generating component at any time point are converted to obtain the temperature value of each heat-generating component; the standard power of each heat-generating component is extracted from a preset reference file; the temperature value and standard power of each heat-generating component are weighted by power ratio calculation to obtain the estimated value of the outer casing temperature of the optical module at each time point; the estimated value of the outer casing temperature at each time point is standardized according to the actual outer casing temperature at each time point to obtain the standard value of the outer casing temperature at each time point; and the standard value of the outer casing temperature of the optical module in the preset time period is output. By performing weighted calculation and standardization on the temperature values and standard power of multiple heat-generating components, the standard value of the outer casing temperature of the optical module is obtained, thereby reducing the error between the calculated value and the actual measured value of the outer casing temperature of the optical module.
[0115] In addition, the method for determining the outer casing temperature of the optical module provided in this embodiment calculates the estimated outer casing temperature of the optical module at a given time point by weighting the temperature values of each heat-generating component and the standard power. Although the temperature value calculated by sampling will change abruptly when a heat-generating component inside the optical module fails, it will not have a significant impact on the estimated outer casing temperature, thereby improving the accuracy of the estimated outer casing temperature.
[0116] Furthermore, the method for determining the outer casing temperature of the optical module provided in this embodiment obtains the operating status information of the optical module at a given time point; adjusts the power weighting coefficients corresponding to the standard power of each heat-generating component based on the operating status information to obtain the adjusted power weighting coefficients for each heat-generating component; and performs a power weighted calculation on the temperature values of each heat-generating component and the adjusted power weighting coefficients to obtain the estimated outer casing temperature of the optical module at that time point. Through dynamic weight adjustment, the adaptability of the algorithm under complex operating conditions is improved. For example, during the module power-on phase or when the ambient temperature changes abruptly, dynamic weight adjustment can avoid the accumulation of errors due to sensor lag or unstable data, thereby improving the real-time performance and robustness of temperature estimation.
[0117] Furthermore, the method for determining the housing temperature of the optical module provided in this embodiment acquires the initial temperature equivalent voltage signals of multiple heat-generating components in the optical module at each time point; cross-validates each initial temperature equivalent voltage signal to obtain the verification result of each initial temperature equivalent voltage signal; if each verification result is determined to be verified, each initial temperature equivalent voltage signal is determined as the corresponding temperature equivalent voltage signal. By cross-validating sensor data, the estimation error caused by sensor failure or aging is reduced.
[0118] Figure 2 A flowchart illustrating the method for determining the housing temperature of an optical module provided in this application embodiment. Figure 2 In the embodiments of this application, in Figure 1 Based on the provided embodiments, a detailed explanation of the specific implementation method for determining the fault of the heating component after S106 is given. Figure 2 As shown, the method includes:
[0119] S201: Through a polling mechanism, determine the power percentage of any heat-generating component at any given time point.
[0120] In this embodiment, the polling mechanism is a commonly used task management or device status check method in computer systems. Its core is active inquiry rather than passive waiting. Its working principle is that the CPU or controller checks the status register or ready flag of each device or task in a fixed order to determine whether it is ready for data transmission or processing.
[0121] In this embodiment, the power ratio is the proportion of the power of the heating component to the sum of the power of all heating components at that point in time.
[0122] S202: The theoretical temperature of the heating element is calculated by reverse calculation based on the power ratio.
[0123] Specifically, the theoretical temperature of the heating component is calculated in reverse based on the power ratio and the estimated shell temperature at that time point.
[0124] S203: Compare the theoretical temperature with the sampled temperature of the heating component at the time node to obtain the corresponding second temperature difference.
[0125] S204: Determine whether the second temperature difference is greater than the second difference threshold.
[0126] In this embodiment, the second difference threshold is any temperature difference among ±2℃, ±3℃, or ±5℃, or it can be other temperature differences.
[0127] S205: If the second temperature difference is determined to be greater than the second difference threshold, the heating element is determined to be faulty, and the fault data of the heating element is obtained.
[0128] In this embodiment, the fault data can be DDM Fault data or other data.
[0129] In addition, the acquired fault data of the heat-generating components will be reported.
[0130] In summary, the method for determining the outer casing temperature of the optical module provided in this embodiment uses a polling mechanism to determine the power percentage of any heat-generating component at any given time point; it then calculates the theoretical temperature of the heat-generating component based on the power percentage; it compares the theoretical temperature with the sampled temperature of the heat-generating component at the given time point to obtain a corresponding second temperature difference; it determines whether the second temperature difference is greater than a second difference threshold; if the second temperature difference is greater than the second difference threshold, it determines that the heat-generating component has malfunctioned and obtains the fault data of the heat-generating component. By locating the malfunctioning heat-generating component, it is possible to detect operational faults in the optical module in a timely manner, ensuring the safe operation of the optical module.
[0131] Figure 3 This is a schematic diagram of the structure of the optical module housing temperature determination device provided in an embodiment of this application. Figure 3 As shown, the device for determining the outer shell temperature of the optical module includes: an acquisition module 301, a conversion module 302, an extraction module 303, a first calculation module 304, a processing module 305, and an output module 306.
[0132] The acquisition module 301 is used to acquire the temperature equivalent voltage signal of multiple heat-generating components in the optical module and the actual shell temperature of the optical module at each time point, wherein each time point is determined by a preset time period.
[0133] The conversion module 302 is used to convert the temperature equivalent voltage signal of each heating component at any time point to obtain the temperature value of each heating component.
[0134] Extraction module 303 is used to extract the standard power of each heating component from a preset reference file;
[0135] The first calculation module 304 is used to perform power ratio weighted calculation on the temperature value and standard power of each heat-generating component to obtain the estimated value of the outer shell temperature of the optical module at a time node.
[0136] The processing module 305 is used to standardize the corresponding estimated shell temperature based on the actual shell temperature at each time point to obtain the standard shell temperature value at each time point.
[0137] Output module 306 is used to output the standard values of the housing temperature of the optical module during a preset time period.
[0138] In one possible implementation, the multiple heat-generating components include multiple processing chips, a microcontroller, and peripheral temperature sensors, wherein each processing chip contains a corresponding temperature sensor, and the microcontroller contains a built-in temperature sensor; the temperature equivalent voltage signal is a first temperature equivalent voltage, a second temperature equivalent voltage, and a third temperature equivalent voltage; correspondingly, the acquisition module 301 is specifically used to: at each time point, acquire the first temperature equivalent voltage signal collected by each temperature sensor, the second temperature equivalent voltage signal collected by the built-in temperature sensor, and the third temperature equivalent voltage signal collected by the peripheral temperature sensor;
[0139] Accordingly, the conversion module 302 specifically includes:
[0140] The first conversion unit is used to convert the first temperature equivalent voltage signal of each processing chip corresponding to the time node into the corresponding first temperature value.
[0141] The second conversion unit is used to convert the second temperature equivalent voltage signal of the microcontroller corresponding to the time node into the corresponding second temperature value;
[0142] The third conversion unit is used to convert the third temperature equivalent voltage signal of the peripheral temperature sensor corresponding to the time node into the corresponding third temperature value.
[0143] Accordingly, the extraction module 303 is specifically used to: extract the first standard power of each processing chip, the second standard power of the microcontroller, and the third standard power of the peripheral temperature sensor from the preset reference file; accordingly, the first calculation module 304 is specifically used to: perform a weighted average calculation on each first temperature value, second temperature value, third temperature value, first power value, second power value, and third power value to obtain the estimated value of the outer casing temperature of the optical module at the time node.
[0144] In one possible implementation, the first computing module 304 specifically includes:
[0145] The acquisition unit is used to acquire the operating status information of the optical module at a given time point.
[0146] The adjustment unit is used to adjust the power ratio weighting coefficient corresponding to the standard power of each heat-generating component according to the operating status information, so as to obtain the adjusted power weighting coefficient corresponding to each heat-generating component.
[0147] The calculation unit is used to perform power ratio weighted calculation on the temperature values of each heat-generating component and the adjusted power weight coefficient to obtain the estimated value of the outer shell temperature of the optical module at a given time point.
[0148] In one possible implementation, processing module 305 specifically includes:
[0149] The fitting unit is used to fit the estimated shell temperature and the actual shell temperature at each time point to obtain the corresponding linear calculation equation.
[0150] The processing unit is used to standardize the estimated shell temperature values at each time point according to the linear calculation equation to obtain the standard shell temperature values at each time point.
[0151] In one possible implementation, the device further includes:
[0152] The data acquisition module is used to periodically collect the standard value and actual shell temperature for any given time period.
[0153] The first determining module is used to determine the first temperature difference between the standard value of the outer casing temperature and the actual outer casing temperature;
[0154] The first judgment module is used to determine whether the first temperature difference is greater than the first difference threshold.
[0155] The adjustment module is used to adjust the linear calculation equation based on the first temperature difference if the first temperature difference is determined to be greater than the first difference threshold.
[0156] In one possible implementation, module 301 specifically includes:
[0157] The acquisition unit is used to acquire the initial temperature equivalent voltage signal of multiple heat-generating components in the optical module at each time point;
[0158] The verification unit is used to cross-verify each initial temperature equivalent voltage signal to obtain the verification results of each initial temperature equivalent voltage signal.
[0159] The determining unit is used to determine each initial temperature equivalent voltage signal as the corresponding temperature equivalent voltage signal if each verification result is determined to be a verification pass.
[0160] In one possible implementation, the device further includes:
[0161] The second determining module is used to determine the power percentage of any heat-generating component at any time point through a polling mechanism.
[0162] The second calculation module is used to calculate the theoretical temperature of the heating component in reverse based on the power ratio.
[0163] The comparison module is used to compare the theoretical temperature with the sampled temperature of the heating component at a given time point to obtain the corresponding second temperature difference.
[0164] The second judgment module is used to determine whether the second temperature difference is greater than the second difference threshold.
[0165] The determination module is used to determine that the heating component has malfunctioned if the second temperature difference is greater than the second difference threshold, and to obtain the fault data of the heating component.
[0166] The apparatus provided in this embodiment can be used to execute the technical solutions of the above method embodiments. Its implementation principle and technical effects are similar, and will not be described again here.
[0167] Figure 4 This is a schematic diagram of the structure of an optical module provided in an embodiment of this application. Figure 4 As shown, the optical module 40 of this embodiment includes: multiple processing chips 401, microcontroller 402 and peripheral temperature sensor 403, wherein each processing chip 401 contains a corresponding temperature sensor 4011 and the microcontroller 402 contains a built-in temperature sensor 4021.
[0168] Among them, the temperature sensor 4011 in each processing chip 401 is connected to the microcontroller 402.
[0169] The peripheral temperature sensor 403 is connected to the microcontroller 402.
[0170] Figure 5 This is a schematic diagram of the hardware structure of the electronic device provided in an embodiment of this application. Figure 5 As shown, the electronic device of this embodiment includes: a processor 501 and a memory 502; the memory stores computer execution instructions; at least one processor executes the computer execution instructions stored in the memory, causing at least one processor to execute the above-described method for determining the housing temperature of the optical module.
[0171] Alternatively, the memory 502 can be either standalone or integrated with the processor 501.
[0172] When the memory 502 is set up independently, the electronic device also includes a bus 503 for connecting the memory 502 and the processor 501.
[0173] This application also provides a computer storage medium storing computer execution instructions. When the processor executes the computer execution instructions, the above-mentioned method for determining the outer casing temperature of the optical module is implemented.
[0174] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the above-described method for determining the casing temperature of an optical module.
[0175] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative; for instance, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple modules may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, devices, or modules, and may be electrical, mechanical, or other forms.
[0176] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to implement the solution of this embodiment according to actual needs.
[0177] Furthermore, the functional modules in the various embodiments of this application can be integrated into one processing unit, or each module can exist physically separately, or two or more modules can be integrated into one unit. The unit composed of the above modules can be implemented in hardware or in the form of hardware plus software functional units.
[0178] The integrated modules described above, implemented as software functional modules, can be stored in a computer-readable storage medium. These software functional modules, stored in a storage medium, include several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) or processor to execute some steps of the methods of the various embodiments of this application.
[0179] It should be understood that the aforementioned processor can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), etc. A general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in this invention can be directly manifested as execution by a hardware processor, or execution by a combination of hardware and software modules within the processor.
[0180] The memory may include high-speed RAM, and may also include non-volatile storage (NVM), such as at least one disk storage device, and may also be a USB flash drive, external hard drive, read-only memory, disk or optical disc, etc.
[0181] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc. For ease of illustration, the buses shown in the accompanying drawings are not limited to a single bus or a single type of bus.
[0182] The aforementioned storage media can be implemented from any type of volatile or non-volatile storage device or a combination thereof, such as Static Random-Access Memory (SRAM), Electrically Erasable Programmable Read-Only Memory (EEPROM), Erasable Programmable Read-Only Memory (EPROM), Programmable Read-Only Memory (PROM), Read-Only Memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk. The storage media can be any available medium accessible to general-purpose or special-purpose computers.
[0183] An exemplary storage medium is coupled to a processor, enabling the processor to read information from and write information to the storage medium. Alternatively, the storage medium can be an integral part of the processor. Both the processor and the storage medium can reside in an Application Specific Integrated Circuit (ASIC). Alternatively, the processor and storage medium can exist as discrete components in an electronic device or host device.
[0184] Those skilled in the art will understand that all or part of the steps of the above-described method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When executed, the program performs the steps of the above-described method embodiments; and the aforementioned storage medium includes various media capable of storing program code, such as ROM, RAM, magnetic disks, or optical disks.
[0185] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.
Claims
1. A method for determining the casing temperature of an optical module, characterized in that, Microcontrollers used in optical modules include: At each time point, the temperature equivalent voltage signal of multiple heat-generating components in the optical module and the actual shell temperature of the optical module are obtained, wherein each time point is determined by a preset time period. The temperature equivalent voltage signal of each heating component at any given time point is converted to obtain the temperature value of each heating component. Extract the standard power of each heating component from the preset reference file; The temperature values and standard power of each heat-generating component are weighted by power ratio to obtain the estimated shell temperature of the optical module at the time point. The estimated shell temperature values at each time point are standardized based on the actual shell temperature at each time point to obtain the standard shell temperature values at each time point. The standard values of the outer casing temperature of the optical module are output for each time period within the preset time period.
2. The method according to claim 1, characterized in that, The plurality of heating components include a plurality of processing chips, a microcontroller, and a peripheral temperature sensor, wherein each processing chip contains a corresponding temperature sensor, and the microcontroller contains a built-in temperature sensor; the temperature equivalent voltage signal is a first temperature equivalent voltage, a second temperature equivalent voltage, and a third temperature equivalent voltage; Accordingly, acquiring the temperature-equivalent voltage signals of multiple heat-generating components in the optical module and the actual casing temperature of the optical module at each time point includes: At each time point, the first temperature equivalent voltage signal collected by each temperature sensor, the second temperature equivalent voltage signal collected by the built-in temperature sensor, and the third temperature equivalent voltage signal collected by the external temperature sensor are acquired. Accordingly, the conversion of the temperature equivalent voltage signal of each heating component at any given time point to obtain the temperature value of each heating component includes: The first temperature equivalent voltage signal of each processing chip corresponding to the time node is converted into the corresponding first temperature value; The second temperature equivalent voltage signal of the microcontroller corresponding to the time node is converted into the corresponding second temperature value; The third temperature equivalent voltage signal of the peripheral temperature sensor corresponding to the time node is converted into the corresponding third temperature value; Accordingly, the step of extracting the standard power of each heating component from the preset reference file includes: Extract the first standard power of each processing chip, the second standard power of the microcontroller, and the third standard power of the peripheral temperature sensor from the preset reference file; Accordingly, the step of performing a power-weighted calculation of the temperature values and standard power of each heat-generating component to obtain an estimated value of the outer casing temperature of the optical module at the specified time point includes: The first temperature value, the second temperature value, the third temperature value, the first power value, the second power value, and the third power value are weighted and averaged to obtain the estimated shell temperature of the optical module at the time node.
3. The method according to claim 1, characterized in that, The step of performing a power-weighted calculation based on the temperature values and standard power of each heat-generating component to obtain an estimated value of the outer casing temperature of the optical module at the specified time point includes: Obtain the operating status information of the optical module at the specified time point; The power ratio weighting coefficient corresponding to the standard power of each heat-generating component is adjusted according to the operating status information to obtain the adjusted power weighting coefficient for each heat-generating component. The temperature values of each heat-generating component and the adjusted power weighting coefficient are used to perform a power ratio weighted calculation to obtain the estimated value of the outer shell temperature of the optical module at the time node.
4. The method according to claim 1, characterized in that, The standardization process for the estimated shell temperature based on the actual shell temperature at each time point to obtain the standard shell temperature value at each time point includes: The estimated shell temperature at each time point is fitted with the actual shell temperature to obtain the corresponding linear calculation equation; The estimated shell temperature at each time point is standardized according to the linear calculation equation to obtain the standard shell temperature value at each time point.
5. The method according to claim 4, characterized in that, After fitting the estimated and actual shell temperatures at each time point to obtain the corresponding linear calculation equation, the method further includes: Periodically collect the standard value and actual shell temperature for any given time period; Determine a first temperature difference between the standard value of the outer casing temperature and the actual outer casing temperature; Determine whether the first temperature difference is greater than the first difference threshold; If it is determined that the first temperature difference is greater than the first difference threshold, then the linear calculation equation is adjusted according to the first temperature difference.
6. The method according to claim 1, characterized in that, The step of acquiring the temperature equivalent voltage signal of multiple heat-generating components in the optical module at each time point includes: At each time point, the initial temperature equivalent voltage signal of multiple heat-generating components in the optical module is acquired; Cross-validation was performed on each initial temperature equivalent voltage signal to obtain the validation results of each initial temperature equivalent voltage signal; If each verification result is determined to be a successful verification, then each initial temperature equivalent voltage signal is determined as the corresponding temperature equivalent voltage signal.
7. The method according to claim 1, characterized in that, After outputting the standard values of the housing temperature of the optical module for each preset time period, the method further includes: The power percentage of any heat-generating component at any given time point is determined through a polling mechanism. The theoretical temperature of the heating component is calculated by reverse calculation based on the power ratio. The theoretical temperature is compared with the sampled temperature of the heating component at the time point to obtain the corresponding second temperature difference. Determine whether the second temperature difference is greater than the second difference threshold; If the second temperature difference is determined to be greater than the second difference threshold, then the heating component is determined to be faulty, and the fault data of the heating component is obtained.
8. A device for determining the shell temperature of an optical module, characterized in that, Microcontrollers used in optical modules include: The acquisition module is used to acquire the temperature equivalent voltage signal of multiple heat-generating components in the optical module and the actual shell temperature of the optical module at each time point, wherein each time point is determined by a preset time period. The conversion module is used to convert the temperature equivalent voltage signal of each heating component at any time point to obtain the temperature value of each heating component. The extraction module is used to extract the standard power of each heating component from a preset reference file; The first calculation module is used to perform a power ratio weighted calculation on the temperature value and standard power of each heat-generating component to obtain the estimated value of the outer shell temperature of the optical module at the time node. The processing module is used to standardize the corresponding estimated shell temperature values based on the actual shell temperature at each time point to obtain the standard shell temperature values at each time point. The output module is used to output the standard values of the outer casing temperature of the optical module during the preset time period.
9. An optical module, characterized in that, include: Multiple processing chips, microcontrollers and peripheral temperature sensors, wherein each processing chip contains a corresponding temperature sensor and the microcontroller contains a built-in temperature sensor. The temperature sensors in each processing chip are communicatively connected to the microcontroller. The peripheral temperature sensor is connected in communication with the microcontroller.
10. An electronic device, characterized in that, include: At least one processor and memory; The memory stores computer-executed instructions; The at least one processor executes computer execution instructions stored in the memory, causing the at least one processor to perform the method for determining the housing temperature of the optical module as described in any one of claims 1 to 7.