Mechanical shock test clamp for CCGA1296 welding column array ceramic packaging integrated circuit

Abstract

The invention belongs to the technical field of integrated circuit testing, and particularly relates to a mechanical shock test clamp for a CCGA1296 welding column array ceramic packaging integrated circuit. Comprising a base which is detachably locked on a mechanical impact table; the mounting cavity is formed in the base, and the mounting cavity comprises a groove and a counter bore; the groove is formed in the top of the base and is used for mounting a porcelain body of an integrated circuit; the counter bores are uniformly formed in the bottom in the groove and are used for mounting a welding column lead of an integrated circuit; the cover plate protection sheet abuts against the top of the cover plate of the integrated circuit; and the cover plate pressing strip is detachably locked on the base, and the cover plate protection sheet is tightly pressed through the cover plate pressing strip. Through the conformal structural design, damage to the leading-out end, deformation of the cover plate, air leakage of a seal, even breakage of a porcelain body and the like are avoided, the to-be-tested integrated circuit is placed and taken down through fixation of the pressing strips and the screws, and operation is simplified.

Description

Technical Field

[0001] This invention belongs to the field of integrated circuit testing technology, and specifically relates to a mechanical impact test fixture for CCGA1296 ceramic packaged integrated circuits with bonding pillar array. Background Technology

[0002] Mechanical impact testing is an effective screening method for determining the impact resistance of integrated circuit packages, internal metallization and lead systems, chips, and other internal components or substrate metal bonding. With the increasing functionality and packaging density of monolithic and hybrid integrated circuits, package sizes are growing larger, the sealed area is increasing, and the shapes are becoming more complex, resulting in impact test stresses ranging from tens to thousands of grams.

[0003] There are currently two main types of fixing methods for integrated circuits during mechanical shock testing: one is the "adhesive method," where the integrated circuit is glued to the fixture base with hard adhesive; the other is fixing it directly with screws and clamps. The adhesive method is prone to causing the integrated circuit to detach due to weak adhesion, while overly strong adhesion makes disassembly difficult, thus limiting its applicability. Direct fixing with screws and clamps is prone to causing excessive localized stress on large-size, high-mass integrated circuits under high-frequency acceleration due to protruding cover plates or package bodies, leading to air leakage or even package body cracking, thus limiting its applicability as well.

[0004] For example, the patent publication number CN116086751A describes a new type of impact testing fixture and its usage method. This patent mainly solves the installation problem of some electronic components during mechanical impact testing by opening a central threaded hole on the bottom plate of the impact table and opening a hole on the pressure strip, and fixing it with several bolts. However, it cannot solve the installation problem of mechanical impact testing of large-size high-density integrated circuits.

[0005] For example, a detachable vibration and shock test fixture with patent publication number CN 223332578U mainly solves the installation problem of some casing components in large-scale mechanical shock tests by symmetrically setting a pair of side support plates on both sides of the base plate, a detachable hoisting plate on the top, and fixing it with screws. However, it is not suitable for the installation of mechanical shock tests of large-size high-density integrated circuits.

[0006] For example, a sample holder for impact testing, with patent publication number CN202141641U, mainly uses a spring, a lighting lamp, and a cuboid positioning block. The top ends of two clamping pieces are fixedly connected, and a spring is placed in the middle of the two clamping pieces. A cuboid positioning block is installed at the bottom of one of the clamping pieces. The long side of the positioning block has a protrusion that matches the notch of the sample, thus fixing it to the mechanical impact table to solve the installation problem of some specific samples during impact testing. However, it is also not suitable for the installation of large-size high-density integrated circuits (especially those with a large sealing surface ratio) during mechanical impact testing. It cannot solve the problems of easy damage, air leakage, or even ceramic cracking around the sealing cover (core cavity) during the test. Summary of the Invention

[0007] The purpose of this invention is to provide a mechanical shock test fixture that can protect large-size monolithic integrated circuits or hybrid integrated circuits and multi-cavity system-in-package integrated circuits such as cover plates, ceramic bodies or leads, and solve problems such as lead wire damage, deformation of large-size thin cover plates, and damage to the large-mass package body leading to air leakage or even ceramic body breakage in mechanical shock tests.

[0008] To address the aforementioned technical problems, this invention provides a mechanical shock test fixture for CCGA1296 post array ceramic packaged integrated circuits, comprising:

[0009] The base is detachable and lockable onto the mechanical impact platform;

[0010] A mounting cavity is formed on the base, the mounting cavity comprising: a groove and a countersunk hole; the groove is formed on the top of the base for mounting the ceramic body of the integrated circuit; the countersunk hole is uniformly formed at the bottom of the groove for mounting the solder leads of the integrated circuit.

[0011] A cover plate protective sheet is attached to the top of the cover plate of the integrated circuit;

[0012] The cover plate pressure strip is detachably locked onto the base and presses the cover plate protective sheet firmly.

[0013] Preferably, it also includes fixed through holes. Four fixed through holes are symmetrically opened at the left and right ends of the top of the base. The base is detachably locked to the mechanical impact table by engaging with the fixed through holes by locking screws.

[0014] Preferably, the base is made of hard aluminum, and the cover plate protective sheet is made of hard rubber gasket, which is made of polyurethane rubber or polyethylene sheet with a certain hardness.

[0015] Preferably, the length, width, and hardness of the cover plate are similar to those of the cover plate of the integrated circuit, and the thickness of the cover plate is slightly thinner than that of the cover plate of the integrated circuit.

[0016] Preferably, it also includes screw holes. Six screw holes are symmetrically provided at the top left and right ends of the base near the groove. One end of the cover plate strip is detachably locked to the base by cooperating with the screw holes by locking screw two.

[0017] Preferably, one end of the cover plate pressure strip also includes a through hole for inserting the second locking screw into the screw hole.

[0018] Preferably, the width of the cover strip is slightly wider than the width of the cover plate of the integrated circuit, and the thickness of the cover strip is slightly thinner than the thickness of the ceramic body of the integrated circuit.

[0019] Preferably, the cover plate pressure strip is configured in a T-shape.

[0020] Preferably, the groove and the ceramic body of the integrated circuit are conformal structures, and the countersunk hole and the solder post leads of the integrated circuit are conformal structures to avoid deformation of the solder post leads.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] The mechanical impact test fixture for large-size, high-density CCGA1296 solder pillar array ceramic packaged integrated circuits provided by this invention avoids damage to the leads, deformation of the cover plate, leakage of the seal, and even breakage of the ceramic body through a conformal structure design. It uses pressure strips and screws to fix and place and remove the integrated circuit under test, simplifying the operation. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of a mechanical impact test fixture for a large-size, high-density CCGA1296 bonding pillar array ceramic packaged integrated circuit according to an embodiment of the present invention.

[0024] Figure 2 This is a two-dimensional schematic diagram of a mechanical impact test fixture base for a large-size, high-density CCGA1296 bonding pillar array ceramic packaged integrated circuit according to an embodiment of the present invention.

[0025] Figure 3 This is a two-dimensional schematic diagram of a mechanical impact test fixture for a large-size, high-density CCGA1296 ceramic-packaged integrated circuit according to an embodiment of the present invention.

[0026] Figure 4 This is a two-dimensional schematic diagram of the cover plate pressure strip of a mechanical impact test fixture for a large-size, high-density CCGA1296 solder pillar array ceramic packaged integrated circuit according to an embodiment of the present invention.

[0027] Figure 5This is a two-dimensional schematic diagram of the cover plate protective sheet of a mechanical impact test fixture for a large-size, high-density CCGA1296 solder pillar array ceramic packaged integrated circuit according to an embodiment of the present invention.

[0028] In the diagram: 1-Base; 2-Ceramic body of integrated circuit; 3-Cover plate protective plate; 4-Cover plate pressure strip; 5-Cover plate of integrated circuit; 6-Securing screw two; 7-Securing screw one; 8-Fixing through hole; 9-Screw hole; 10-Groove; 11-Counterhole; 12-Bond post lead wire. Detailed Implementation

[0029] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.

[0030] like Figures 1 to 5 As shown, this embodiment of the invention provides a mechanical impact test fixture for a large-size, high-density CCGA1296 post-contact ceramic packaged integrated circuit, including a base 1, a cover plate strip 4, and a cover plate protective sheet 3. The base 1 has four corner holes 8 for fixing to a mechanical impact table. A groove 10 for the integrated circuit ceramic body is formed on the base 1. A countersunk hole 11 for the array post-contact leads 12 is formed at the bottom of the groove 10. Three screw holes 9 are formed on each side of the groove 10. The cover plate strip 4 has through holes corresponding to the screw holes 9. The integrated circuit is secured to the cover plate strip 4 in the corresponding groove 10 on the base 1 by locking screws 6. For the cover plate 5 of a large-size, thin integrated circuit, a cover plate protective sheet 3 of similar size to the cover plate is abutted at the bottom of the cover plate strip 4. The integrated circuit to be tested is fixed in the groove 10 of the fixture, and the fixture is installed on the mechanical impact table for testing.

[0031] In the aforementioned test fixture, the base 1 is made of hard aluminum; the hard rubber gasket is made of polyurethane rubber or polyethylene sheet with a certain hardness, determined according to the quality of the integrated circuit and the contact surface. The aforementioned hard rubber gasket eliminates the problem of local stress concentration caused by the rigidity of traditional hard aluminum fixtures due to the size difference between large-size integrated circuits, which can lead to sealing leakage or even ceramic body breakage. Furthermore, a cover plate protection plate 3 is used for large-size thin cover plates to protect them from deformation caused by compression.

[0032] In the above-mentioned test fixture, for large-size, high-mass integrated circuits under test (especially those with a large ratio of sealing area to package size), a cover plate protective sheet 3 that is close to the size and hardness of the integrated circuit cover plate and slightly thinner than the cover plate is inserted at the location corresponding to the cover plate 5 of the integrated circuit under test.

[0033] In the above-mentioned test fixture, a cover plate pressure strip 4, which is slightly wider than the cover plate and slightly thinner than the ceramic body, is used in conjunction with locking screw 6 to fix the cover plate.

[0034] A CCGA1296 packaged integrated circuit is placed in the ceramic recess 10 of the integrated circuit on the base 1. 1296 solder leads 12 are installed into the corresponding 1296 countersunk holes 11. A cover plate protective plate 3 is placed on the cover plate. The cover plate pressure strip 4 is tightened onto the cover plate protective plate 3 by means of the locking screw 6.

[0035] It also includes the following working principles:

[0036] During the mechanical impact test, first, the CCGA1296 packaged integrated circuit to be tested is installed and fixed in the test fixture. Then, the fixture is fixed to the mechanical impact test bench with fixing screws, and then the mechanical impact test begins. After the mechanical impact test, the fixture is removed and the CCGA1296 packaged integrated circuit is taken out to complete the test.

[0037] In summary, the integrated circuit mechanical impact test fixture provided by this invention differs from conventional fixtures by using pressure strips, hard plastic cover plates, and locking screws to fix the integrated circuit, eliminating the need for adhesive bonding or fixture fixing steps. Through conformal structure design, it avoids damage to the leads, deformation of the cover plate, air leakage, and even breakage of the ceramic body. The use of cover plate pressure strips and locking screws to fix the integrated circuit under test simplifies the operation for placement and removal.

[0038] The above description is merely a description of preferred embodiments of the present invention and is not intended to limit the scope of the present invention in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A mechanical impact testing fixture for CCGA1296 post-contact ceramic packaged integrated circuits, characterized in that, include: The base (1) is detachably locked onto the mechanical impact platform; The mounting cavity is formed on the base (1). The mounting cavity includes a groove (10) and a countersunk hole (11). The groove (10) is formed on the top of the base (1) and is used to mount the ceramic body (2) of the integrated circuit. The countersunk hole (11) is formed evenly on the bottom of the groove (10) and is used to mount the solder leads (12) of the integrated circuit. The cover plate protective sheet (3) abuts against the top of the cover plate (5) of the integrated circuit; The cover plate pressure strip (4) is detachably locked onto the base (1) and presses the cover plate protective piece (3) tightly through the cover plate pressure strip (4).

2. The mechanical impact test fixture for a CCGA1296 post array ceramic packaged integrated circuit as described in claim 1, characterized in that, It also includes fixed through holes (8). Four fixed through holes (8) are symmetrically provided at the top left and right ends of the base (1). The base (1) is detachably locked to the mechanical impact table by engaging with the fixed through holes (8) through locking screws (7).

3. The mechanical impact test fixture for a CCGA1296 post array ceramic packaged integrated circuit as described in claim 1, characterized in that, The base (1) is made of hard aluminum, and the cover plate protective sheet (3) is made of hard rubber gasket. The hard rubber gasket is made of polyurethane rubber or polyethylene sheet with a certain hardness.

4. The mechanical impact test fixture for a CCGA1296 post array ceramic packaged integrated circuit as described in claim 1, characterized in that, The length, width, and hardness of the cover plate (3) are similar to those of the cover plate (5) of the integrated circuit, and the thickness of the cover plate (3) is slightly thinner than that of the cover plate (5) of the integrated circuit.

5. The mechanical impact test fixture for a CCGA1296 post array ceramic packaged integrated circuit as described in claim 1, characterized in that, It also includes screw holes (9). Six screw holes (9) are symmetrically opened at the top left and right ends of the base (1) near the groove (10). The screw holes (9) are engaged with the screw holes (9) by locking screws (6) to detachably lock one end of the cover plate strip (4) onto the base (1).

6. The mechanical impact test fixture for a CCGA1296 post array ceramic packaged integrated circuit as described in claim 5, characterized in that, One end of the cover plate pressure strip (4) also includes a through hole for inserting the locking screw (6) into the screw hole (9).

7. The mechanical impact test fixture for a CCGA1296 post array ceramic packaged integrated circuit as described in claim 1, characterized in that, The width of the cover strip (4) is slightly wider than the width of the cover plate (5) of the integrated circuit, and the thickness of the cover strip (4) is slightly thinner than the thickness of the ceramic body (2) of the integrated circuit.

8. The mechanical impact test fixture for a CCGA1296 post array ceramic packaged integrated circuit as described in claim 1, characterized in that, The cover plate pressure strip (4) is set in a T-shaped structure.

9. A mechanical impact test fixture for a CCGA1296 post array ceramic packaged integrated circuit as described in any one of claims 1 to 8, characterized in that, The groove (10) and the ceramic body (2) of the integrated circuit are conformal structures, and the countersunk hole (11) and the solder post lead (12) of the integrated circuit are conformal structures.

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