Architecture matching method and device for laser direct writing equipment with different parameter requirements

Abstract

The invention relates to an architecture matching method and device of laser direct writing equipment, computer equipment and a storage medium. The method comprises the following steps: acquiring the requirement of a to-be-exposed plate on the line width of mass production, the size of a digital micro-mirror in laser direct writing equipment and an included angle between the digital micro-mirror and a workpiece table; based on the mass production line width requirement of the plate to be exposed, the micro-mirror size of a digital micro-mirror in the laser direct writing equipment and the included angle between the digital micro-mirror and the workpiece table are matched with the multiplying power of an imaging lens of the laser direct writing equipment; collecting the actual use resolution of the digital micromirror, the plate size of the to-be-exposed plate and the capacity requirement; the number of imaging lenses of the laser direct writing equipment and the type of a workpiece table are matched based on the actual use resolution of the digital micromirror, the plate size of the to-be-exposed plate, the capacity requirement and the magnification of the imaging lenses of the laser direct writing equipment. By adopting the method, the framework matching period of the laser direct writing equipment can be greatly shortened, so that the laser direct writing equipment can adapt to the rapid iteration requirement of modern products.

Description

Technical Field

[0001] This application relates to the field of exposure technology, and in particular to a method and apparatus for matching the architecture of laser direct writing devices with different parameter requirements. Background Technology

[0002] With the development of exposure technology, laser direct writing exposure technology has emerged. This technology projects a laser light source directly onto the substrate to be exposed using digital micromirrors, eliminating the need for a photomask, offering greater flexibility and significant cost savings. As laser direct writing technology further develops, its application scenarios are constantly expanding, from wafers and photomasks to circuit boards, with increasingly diverse demands for exposure resolution and throughput. Addressing different exposure resolution and throughput requirements typically involves a lengthy process of equipment configuration, system installation, and process verification based on experience, followed by reconfiguration based on verification results. This process requires substantial manpower and resources. Since current mainstream equipment architectures are mostly based on fixed hardware configurations, they cannot flexibly adapt to the diverse needs ranging from high-precision microstructures to large-size rapid imaging without replacing core components. This limited system responsiveness in the face of the trend towards flexible manufacturing with multiple varieties and small batches makes it difficult to meet the rapid response demands of the current market. Summary of the Invention

[0003] Therefore, it is necessary to provide a method, apparatus, computer device, computer-readable storage medium, and computer program product for matching the architecture of a laser direct writing device that can achieve rapid architecture matching for different parameter requirements, in order to address the above-mentioned technical problems.

[0004] Firstly, this application provides a method for matching the architecture of laser direct-writing devices with different parameter requirements. The method includes:

[0005] Collect the mass production linewidth requirements of the substrate to be exposed, the micromirror size of the digital micromirror in the laser direct writing equipment, and the angle between the digital micromirror and the workpiece stage;

[0006] Based on the mass production linewidth requirements of the substrate to be exposed, the micromirror size of the digital micromirror in the laser direct writing equipment, and the angle between the digital micromirror and the workpiece stage, the magnification of the imaging lens of the laser direct writing equipment is matched.

[0007] The actual resolution of the digital micromirror, the size of the substrate to be exposed, and the production capacity requirements are collected.

[0008] The micromirror size, actual resolution of the digital micromirror, size of the substrate to be exposed, production capacity requirements, and magnification matching of the imaging lens of the laser direct writing equipment are all considered. The number of imaging lenses and the type of workpiece stage in the laser direct writing equipment are also considered.

[0009] In one embodiment, the steps, based on the mass production linewidth requirements of the substrate to be exposed, the micromirror size of the digital micromirror, and the angle between the digital micromirror and the workpiece stage, are matched to the magnification of the imaging lens of the laser direct writing device, including:

[0010] Collect data on the production linewidth differences of the substrate to be exposed;

[0011] The grid accuracy requirement is determined based on the mass production linewidth requirements and the differences in mass production linewidth of the substrate to be exposed.

[0012] The magnification of the imaging lens is matched based on the micromirror size, the angle between the digital micromirror and the workpiece stage, and the grid accuracy requirements.

[0013] In one embodiment, the steps, based on the actual resolution of the digital micromirror, the size of the substrate to be exposed, production capacity requirements, and the magnification of the imaging lenses of the laser direct writing equipment, include matching the number of imaging lenses of the laser direct writing equipment and the type of workpiece stage:

[0014] The exposure area of ​​a single lens is determined based on the micromirror size of the digital micromirror, the actual resolution of the digital micromirror in use, and the magnification of the imaging lens of the laser direct writing device.

[0015] The number of imaging lenses and the type of workpiece stage of the laser direct writing equipment are matched based on the exposure area of ​​a single lens, the size of the substrate to be exposed, and the production capacity requirements.

[0016] In one embodiment, the angle between the digital micromirror and the workpiece stage is (0, 1 / 16] radians.

[0017] In one embodiment, the production capacity requirements of the substrate to be exposed include: the energy density required for the photoresist on the surface of the substrate to be exposed and the exposure efficiency of the substrate to be exposed.

[0018] In one embodiment, the workpiece stage type includes a single stage, a left-right double stage, and a top-bottom double stage.

[0019] In one embodiment, the steps are based on the actual resolution of the digital micromirror, the size of the substrate to be exposed, production capacity requirements, and the magnification of the imaging lenses of the laser direct writing equipment, matching the number of imaging lenses of the laser direct writing equipment and the type of workpiece stage, including:

[0020] Collect data on the board exchange time, board loading / unloading time, and alignment time of the laser direct writing equipment.

[0021] The number of imaging lenses and workpiece stage type of the laser direct writing equipment are matched based on the micromirror size and actual usage resolution of the digital micromirror, the size of the substrate to be exposed, the production capacity requirements, the magnification of the imaging lens of the laser direct writing equipment, the board exchange time of the laser direct writing equipment, the board loading and unloading time and the alignment time.

[0022] Secondly, this application also provides an architecture matching device for laser direct writing devices with different parameter requirements, the device comprising:

[0023] The data acquisition module is used to acquire information such as the mass production linewidth requirements, material dimensions, and production capacity requirements of the substrate to be exposed, as well as the micromirror dimensions, actual resolution, and angle between the digital micromirror and the workpiece stage in the laser direct writing equipment.

[0024] The magnification matching module is used to match the magnification of the imaging lens of the laser direct writing equipment based on the mass production linewidth requirements of the substrate to be exposed, the micromirror size of the digital micromirror in the laser direct writing equipment, and the angle between the digital micromirror and the workpiece stage.

[0025] The architecture matching module is used to match the number of imaging lenses and the type of workpiece stage of the laser direct writing equipment based on the actual resolution of the digital micromirror, the size of the substrate to be exposed, the production capacity requirements, and the magnification of the imaging lenses of the laser direct writing equipment.

[0026] Thirdly, this application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:

[0027] Collect the mass production linewidth requirements of the substrate to be exposed, the micromirror size of the digital micromirror in the laser direct writing equipment, and the angle between the digital micromirror and the workpiece stage;

[0028] Based on the mass production linewidth requirements of the substrate to be exposed, the micromirror size of the digital micromirror in the laser direct writing equipment, and the angle between the digital micromirror and the workpiece stage, the magnification of the imaging lens of the laser direct writing equipment is matched.

[0029] The actual resolution of the digital micromirror, the size of the substrate to be exposed, and the production capacity requirements are collected.

[0030] The actual resolution of the digital micromirror, the size of the substrate to be exposed, the production capacity requirements, and the magnification of the imaging lens of the laser direct writing equipment are all considered when matching the number of imaging lenses and the type of workpiece stage of the laser direct writing equipment.

[0031] Fourthly, this application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, performs the following steps:

[0032] Collect the mass production linewidth requirements of the substrate to be exposed, the micromirror size of the digital micromirror in the laser direct writing equipment, and the angle between the digital micromirror and the workpiece stage;

[0033] Based on the mass production linewidth requirements of the substrate to be exposed, the micromirror size of the digital micromirror in the laser direct writing equipment, and the angle between the digital micromirror and the workpiece stage, the magnification of the imaging lens of the laser direct writing equipment is matched.

[0034] The actual resolution of the digital micromirror, the size of the substrate to be exposed, and the production capacity requirements are collected.

[0035] The actual resolution of the digital micromirror, the size of the substrate to be exposed, the production capacity requirements, and the magnification of the imaging lens of the laser direct writing equipment are all considered when matching the number of imaging lenses and the type of workpiece stage of the laser direct writing equipment.

[0036] Fifthly, this application also provides a computer program product. The computer program product includes a computer program that, when executed by a processor, performs the following steps:

[0037] Collect the mass production linewidth requirements of the substrate to be exposed, the micromirror size of the digital micromirror in the laser direct writing equipment, and the angle between the digital micromirror and the workpiece stage;

[0038] Based on the mass production linewidth requirements of the substrate to be exposed, the micromirror size of the digital micromirror in the laser direct writing equipment, and the angle between the digital micromirror and the workpiece stage, the magnification of the imaging lens of the laser direct writing equipment is matched.

[0039] The actual resolution of the digital micromirror, the size of the substrate to be exposed, and the production capacity requirements are collected.

[0040] The actual resolution of the digital micromirror, the size of the substrate to be exposed, the production capacity requirements, and the magnification of the imaging lens of the laser direct writing equipment are all considered when matching the number of imaging lenses and the type of workpiece stage of the laser direct writing equipment.

[0041] The aforementioned laser direct-writing equipment architecture matching method, apparatus, computer equipment, storage medium, and computer program products first match the magnification of the imaging lens of the laser direct-writing equipment based on mass production linewidth requirements, the micromirror size of the digital micromirror, and the angle between the digital micromirror and the workpiece stage. Then, the architecture of the laser direct-writing equipment is matched based on the size of the substrate to be exposed, the lens magnification, the actual resolution of the digital micromirror, and production capacity requirements, determining the number of imaging lenses and the type of workpiece stage. Compared to traditional methods, this technology completely changes the equipment configuration process. The traditional model relies on engineers' experience for initial configuration, followed by system installation and process verification, and repeated adjustments to hardware parameters based on the verification results, resulting in a lengthy and costly process. The new method, through pre-parameter input and algorithm calculation, completes architecture verification during the configuration phase, eliminating the need for subsequent trial and error. This transformation significantly shortens the architecture matching cycle, enabling it to adapt to the rapid iteration and ever-increasing demands of modern products. Furthermore, the architecture of the laser direct-writing equipment output by this matching method possesses strong logicality, ensuring a balance between technical feasibility and economic efficiency. Attached Figure Description

[0042] Figure 1This is a flowchart illustrating the architecture matching method for laser direct writing devices with different parameter requirements in one embodiment;

[0043] Figure 2 This is a flowchart illustrating the steps for matching the magnification of the imaging lens based on grid accuracy requirements in one embodiment.

[0044] Figure 3 This is a flowchart illustrating the steps of matching the number of imaging lenses and the type of workpiece stage for a laser direct writing device in one embodiment.

[0045] Figure 4 This is a flowchart illustrating the architecture matching method for laser direct writing devices with different parameter requirements in another embodiment;

[0046] Figure 5 This is a structural block diagram of the architecture matching device for a laser direct writing device in one embodiment;

[0047] Figure 6 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0049] In one embodiment, such as Figure 1 As shown, an architecture matching method for a laser direct-writing device is provided. This embodiment illustrates the application of this method to a terminal. It is understood that this method can also be applied to a server, and further to a system including both a terminal and a server, and is implemented through interaction between the terminal and the server. In this embodiment, the method includes the following steps:

[0050] S01: Collect the mass production linewidth requirements of the substrate to be exposed, the micromirror size of the digital micromirror in the laser direct writing equipment, and the angle between the digital micromirror and the workpiece stage;

[0051] S02: Based on the mass production linewidth requirements of the substrate to be exposed, the micromirror size of the digital micromirror in the laser direct writing equipment and the angle between the digital micromirror and the workpiece stage, the magnification of the imaging lens of the laser direct writing equipment is matched.

[0052] S03: Collect the actual resolution of the digital micromirror, the size of the substrate to be exposed, and the production capacity requirements;

[0053] S04: Based on the actual resolution of the digital micromirror, the size of the substrate to be exposed, the production capacity requirements, and the magnification of the imaging lens of the laser direct writing equipment, the number of imaging lenses of the laser direct writing equipment and the type of workpiece stage.

[0054] In step S01, the substrate to be exposed refers to a substrate coated with photoresist that needs to be exposed, developed, or etched, such as a printed circuit board (PCB) in the integrated circuit field, a flat panel display (FPD) in the new display field, a wafer or mask in the optoelectronic sensing field, and a photovoltaic silicon wafer in the photovoltaic, energy storage, and charging new energy field. The mass production linewidth requirement refers to the mass production linewidth requirement of the substrate to be exposed, such as common linewidths of 60μm, 55μm, 50μm, 45μm, 40μm, 30μm, 20μm, 12μm, 10μm, 8μm, 4μm, 1μm, 0.8μm, and 0.6μm. In laser direct writing equipment, the micromirror size of the digital micromirror (DMD) refers to the size of the micromirror, which is mainly distinguished by the model number. TI's DMD models include DLP6500, DLP7000, DLP9500, and DLP9000X. The main differences between these models are their resolution and micromirror size. For example, the DLP7000 has a resolution of 1024×768 and a micromirror size of 13.68μm×13.68μm; the DLP9500 has a resolution of 1920×1080 and a micromirror size of 10.8μm×10.8μm. The angle between the digital micromirror and the stage refers to the angle formed by the short side of the digital micromirror device on the horizontal plane and the direction of movement of the substrate to be exposed on the stage.

[0055] In step S02, the magnification of the imaging lens refers to the magnification of the imaging lens assembly that passes through when the DMD is emitted onto the substrate to be exposed. The function of the imaging lens assembly is to magnify or reduce the pattern on the DMD and then illuminate it onto the substrate to be exposed. For example, the magnification of the imaging lens is 1.5x, 0.5x, 2x, 4x, 0.1x, etc.

[0056] In step S03, the actual resolution of the digital micromirror (DMM) is based on the micromirror model and the actual number of rows and columns used by the DMM during exposure. For example, the resolution of the DLP9500 is 1920×1080, meaning the DMD has 1920 columns and 1080 rows. If the DMM actually uses 1900 columns and 500 rows, then the actual resolution of the DMM is considered to be 1900×500. The dimensions of the substrate to be exposed include wafers and photomasks (2-inch, 4-inch, 6-inch, 8-inch, etc.), PCBs (24-inch, 28-inch, 32-inch, 36-inch, etc.), and FPDs (G6 (1500mm × 1850mm), G8 (2200 mm × 2500mm), G10 (2940mm × 3370mm, etc.).

[0057] In the aforementioned architecture matching method for laser direct writing equipment, the magnification of the imaging lens is determined based on mass production linewidth requirements, the micromirror size of the DMD, and the angle between the DMD and the workpiece stage. Subsequently, the architecture of the laser direct writing equipment is matched with the actual usage resolution of the DMD, the material size, the magnification of the imaging lens, and production capacity requirements to determine the number of lenses and the type of workpiece stage. This transforms the traditional "installation, verification, rework" model into an "input, calculation, verification" model, achieving a closed-loop architecture selection process before equipment manufacturing. Compared to relying on extensive experience for architecture matching, this significantly shortens the configuration cycle and resolves the contradiction between the increasing complexity of technical requirements as technology advances and the long verification cycle of traditional laser direct writing architecture design. Furthermore, the architecture matching stage completes a preliminary assessment of technical feasibility, significantly reducing the number of hardware adjustments during subsequent installation and debugging, thus improving the design efficiency of the laser direct writing equipment. Finally, all output parameters are derived from mathematical models and physical constraints, avoiding empirical bias and ensuring synergistic optimization between imaging accuracy, production efficiency, and equipment cost.

[0058] In one specific embodiment, the magnification of the imaging lens is matched as follows: the magnification of the imaging lens of the laser direct writing equipment is matched based on the mass production linewidth requirements of the substrate to be exposed, the micromirror size of the digital micromirror in the laser direct writing equipment, and the micromirror size parameters; wherein, the micromirror size parameters are determined according to the type of photoresist, the mass production linewidth difference requirements, and the size of the included angle.

[0059] Specifically, if the micromirror size of a DMD is 13.68μm × 13.68μm, the mass production linewidth requirement is 60μm, and the angle between the acquired digital micromirror and the workpiece stage is 1 / 16 radian, then a rough imaging lens magnification can be calculated using the following formula: Imaging lens magnification = mass production linewidth requirement / (micromirror size × micromirror size parameter). The micromirror size parameter is greater than or equal to 1. If the photoresist has weak photosensitivity and the mass production linewidth difference requirement is high, it is 10% of the mass production linewidth requirement. For example, 50μm is ±5μm. The larger the angle, the larger the micromirror size parameter. If the photoresist has strong photosensitivity and the mass production linewidth difference is low, it is 5% of the mass production linewidth requirement. The smaller the angle, the smaller the micromirror size parameter.

[0060] Among them, such as Figure 2 As shown, step S02: Based on the mass production linewidth requirements of the substrate to be exposed, the micromirror size of the digital micromirror, and the angle between the digital micromirror and the workpiece stage, the magnification of the imaging lens of the laser direct writing equipment is matched. This includes:

[0061] S021: Collect the mass production linewidth difference requirements of the substrate to be exposed;

[0062] S022: Determine the grid accuracy requirements based on the mass production linewidth requirements and mass production linewidth difference requirements of the substrate to be exposed;

[0063] S023: Match the magnification of the imaging lens to the micromirror size, the angle between the digital micromirror and the workpiece stage, and the grid accuracy requirements.

[0064] Generally, the required grid precision of the substrate to be exposed is less than the required linewidth for mass production. For example, the required grid precision may be three-quarters, one-half, one-third, or one-tenth of the required linewidth. This is determined based on the required linewidth for mass production and the differences in linewidth between production processes. These differences include the type of photoresist and the required linewidth for mass production. For instance, a certain type of photoresist might be a high-sensitivity photoresist (sensitivity of 10 mJ / cm²). 2 If the mass production linewidth difference requirement is 10%, then the mesh accuracy requirement is 90% of the mass production linewidth requirement; in another embodiment, the photoresist is a low-sensitivity dry film (sensitivity of 100 mj / cm). 2 If the mass production linewidth variation requirement is 5%, then the mesh accuracy requirement is one-tenth of the mass production linewidth requirement; or in another embodiment, the photoresist's photosensitivity is 50 mj / cm. 2 If the mass production linewidth variation requirement is 6%, then the grid accuracy requirement is half of the mass production linewidth requirement. After collecting the micromirror size, included angle, and grid accuracy requirement, the lens magnification is then calculated as: Grid accuracy requirement / (Micromirror size × sin(angle)).

[0065] The above method, by obtaining the mass production linewidth requirements, calculates the grid accuracy requirements. Based on the grid accuracy requirements, micromirror size, and included angle, the lens magnification is determined. Compared to experimentally obtaining magnification based on mass production linewidth requirements, mass production linewidth variation requirements, and micromirror size, this method avoids the possibility of errors due to experience-based judgments. It also avoids the subjective experience-based judgments of traditional methods that rely on mass production linewidth requirements, mass production linewidth variation requirements, and micromirror size to estimate magnification, thereby reducing the risk of systematic deviations. This provides strong theoretical support for obtaining lens magnification, ensures the traceability of imaging accuracy and imaging magnification, improves the reliability and consistency of the design process, and provides a robust design foundation for high-precision imaging systems.

[0066] In one specific embodiment, the matching of the number of imaging lenses and the workpiece stage type of the laser direct writing equipment based on the actual resolution of the digital micromirror, the size of the substrate to be exposed, the production capacity requirements, and the magnification of the imaging lenses of the laser direct writing equipment includes:

[0067] The exposure area of ​​a single lens is determined based on the micromirror size, the actual resolution of the digital micromirror, and the magnification of the imaging lens in the laser direct-writing device. The exposure area of ​​a single lens is calculated as: micromirror size × actual resolution × imaging lens magnification. For example, if a digital micromirror has a micromirror size of 13.68μm × 13.68μm, an actual resolution of 1900 × 800, and an imaging lens magnification of 2x, then the exposure area of ​​a single lens is 568.9 mm². 2 .

[0068] The number of imaging lenses and the type of workpiece stage of the laser direct writing equipment are matched based on the exposure area of ​​a single lens, the size of the substrate to be exposed, and the production capacity requirements.

[0069] Specifically, the actual resolution of a digital micromirror (DMD) is determined based on the different models of the DMD. The actual resolution of the DMD is obtained based on the included angle and exposure requirements. After calculating the exposure area of ​​a lens, the required number of lenses and the type of workpiece stage can be calculated based on the size of the material to be exposed.

[0070] In one specific embodiment, the angle between the digital micromirror and the workpiece stage is (0, 1 / 16] radians, such as 1 / 16 radians, 1 / 28 radians, 1 / 32 radians, 1 / 64 radians, etc.

[0071] In a specific embodiment, the production capacity requirements of the substrate to be exposed in step S03 include the energy density required for the photoresist on the surface of the substrate and the exposure efficiency of the substrate. Here, exposure efficiency refers to the production capacity speed, for example, 5 wafers / min, 4 sides / min, 15s / side, 10min / side. The specific production capacity speed is determined according to the type of substrate to be exposed.

[0072] In a specific embodiment, step S04, when matching the workpiece stage type, includes matching based on existing workpiece stage types with mature systems and technological achievements. Specifically, the workpiece stage types include single-table, left-right double-table, and top-bottom double-table. Among these, single-table has the advantages of low cost, simple structure, low rework risk, and small footprint. Left-right double-table has the advantages of high production speed and compatibility with large and multi-board boards. Top-bottom double-table combines the advantages of high production speed and small footprint.

[0073] In a specific embodiment, such as Figure 3 As shown, step S04: Based on the micromirror size and actual resolution of the digital micromirror, the size of the substrate to be exposed, the production capacity requirements, and the magnification of the imaging lens of the laser direct writing equipment, the number of imaging lenses of the laser direct writing equipment and the type of workpiece stage are matched, including:

[0074] S041: Collect the board exchange time, board loading / unloading time, and alignment time of the laser direct writing equipment;

[0075] S042: Based on the micromirror size and actual usage resolution of the digital micromirror, the size of the substrate to be exposed, the production capacity requirements, the magnification of the imaging lens of the laser direct writing equipment, the board exchange time of the laser direct writing equipment, the board loading and unloading time and alignment time, the number of imaging lenses of the laser direct writing equipment and the type of workpiece stage are matched.

[0076] Specifically, after obtaining the production capacity requirements, the overall exposure time for one board is calculated. The time for board exchange, loading / unloading, and alignment is then subtracted from the overall exposure time, leaving the simple exposure time. Next, the exposure width of one lens is calculated. In practical applications, the exposure area of ​​one lens is calculated as the micromirror size of the DMD × the actual resolution of the DMD × the magnification of the imaging lens. The micromirror size of the DMD is generally determined by the DMD model. The actual resolution of the DMD is determined based on the model and then calculated based on the angle and exposure requirements. After calculating the exposure area of ​​one lens, the required number of lenses can be calculated based on the size of the board to be exposed. Finally, the workpiece stage type is matched according to cost, floor space requirements, and production capacity requirements. When production capacity requirements are high, a double-stage stage (top and bottom or left and right) is selected. Compared to a single stage, double stages allow for parallel board exchange and alignment steps, thus extending the simple exposure time of one board and increasing production capacity.

[0077] The matching method described above considers plate exchange time, plate loading / unloading time, and alignment time as input variables. It also takes into account the automation process, which dynamically coordinates these variables. For example, by processing time-series data in real time through algorithms, it avoids subjective biases that may arise from manual intervention, enabling more accurate matching of the number of lenses and workpiece stage type. Therefore, the system can more accurately calculate and select the number of lenses while adapting to the workpiece stage type, ultimately improving matching accuracy and enhancing the reliability and consistency of the entire process.

[0078] Based on the aforementioned solution, the following embodiments will specifically demonstrate the application of the entire process. For example... Figure 4 As shown, it provides an architecture matching method for laser direct writing devices, including the following steps:

[0079] S201: Collect the mass production linewidth requirements of the substrate to be exposed, the micromirror dimensions of the digital micromirror in the laser direct writing equipment, and the angle between the digital micromirror and the workpiece stage.

[0080] S202: Determine the grid accuracy requirements based on the mass production linewidth requirements and mass production linewidth difference requirements of the substrate to be exposed.

[0081] S203: The magnification of the imaging lens is matched based on the micromirror size, the angle between the digital micromirror and the workpiece stage, and the grid accuracy requirements, where the lens magnification = grid accuracy requirements / (micromirror size × sin (angle)).

[0082] S204: Collect the actual resolution of the digital micromirror, the size of the substrate to be exposed, and the production capacity requirements.

[0083] S205: Collects the board exchange time, board loading / unloading time, and alignment time of the laser direct writing equipment.

[0084] S206: Based on the micromirror size and actual usage resolution of the digital micromirror, the size of the substrate to be exposed, the production capacity requirements, the magnification of the imaging lens of the laser direct writing equipment, the board exchange time of the laser direct writing equipment, the board loading and unloading time and alignment time, the number of imaging lenses of the laser direct writing equipment and the type of workpiece stage are matched.

[0085] The calculation method for lens magnification in the above embodiments shows that the smaller the included angle, the greater the lens magnification. A greater lens magnification results in a larger exposure area for the DMD. Under the same board size and production capacity requirements, a larger exposure area for the DMD means a larger area that a single lens can handle, thus reducing the total number of lenses required and directly lowering equipment hardware costs. Simultaneously, the increased exposure area shortens the time required for a single exposure (under constant light flux), freeing up time resources that can be reallocated to processes such as alignment. This time optimization allows the system to streamline equipment configuration—for example, replacing a dual-stage architecture with a single-stage architecture, further reducing mechanical and control system costs. In summary, through the above parameter matching mechanism, the system can dynamically optimize the selection of the number of lenses and the type of stage while ensuring production capacity, thereby constructing diversified, low-cost equipment configuration schemes and achieving a precise balance between manufacturing costs and production efficiency.

[0086] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0087] Based on the same inventive concept, this application also provides an architecture matching device for implementing the architecture matching method described above in a laser direct writing device. The solution provided by this device is similar to the implementation described in the above method; therefore, the specific limitations in one or more embodiments of the architecture matching device for a laser direct writing device provided below can be found in the limitations of the architecture matching method described above, and will not be repeated here.

[0088] In one embodiment, such as Figure 5 As shown, an architecture matching device for laser direct writing equipment with different parameter requirements is provided, including: an acquisition module, a magnification matching module, and an architecture matching module, wherein:

[0089] The data acquisition module is used to acquire information such as the mass production linewidth requirements, material dimensions, and production capacity requirements of the substrate to be exposed, as well as the micromirror dimensions, actual resolution, and angle between the digital micromirror and the workpiece stage in the laser direct writing equipment.

[0090] The magnification matching module is used to match the magnification of the imaging lens of the laser direct writing equipment based on the mass production linewidth requirements of the substrate to be exposed, the micromirror size of the digital micromirror in the laser direct writing equipment, and the angle between the digital micromirror and the workpiece stage.

[0091] The architecture matching module is used to match the number of imaging lenses and the type of workpiece stage of the laser direct writing equipment based on the actual usage resolution of the digital micromirror, the size of the substrate to be exposed, the production capacity requirements, and the magnification of the imaging lenses of the laser direct writing equipment.

[0092] In one specific embodiment, the acquisition module further includes acquiring the board exchange time, board loading / unloading time, and alignment time of the laser direct writing device.

[0093] In specific implementation, the magnification matching module is used to determine the grid accuracy requirements based on the mass production linewidth requirements of the substrate to be exposed, and to match the magnification of the imaging lens based on the micromirror size of the digital micromirror, the angle between the digital micromirror and the workpiece stage, and the grid accuracy requirements.

[0094] In a specific embodiment, the architecture matching module is used to determine the exposure area of ​​a single lens based on the actual usage resolution of the digital micromirror and the magnification of the imaging lens of the laser direct writing device; and to match the number of imaging lenses and the workpiece stage type of the laser direct writing device based on the exposure area of ​​a single lens, the size of the substrate to be exposed, and the production capacity requirements.

[0095] In another specific embodiment, the architecture matching module is used to match the number of imaging lenses and workpiece stage type of the laser direct writing equipment based on the micromirror size of the digital micromirror, the actual resolution of the digital micromirror, the size of the substrate to be exposed, the production capacity requirements, the magnification of the imaging lens of the laser direct writing equipment, the board exchange time, board loading and unloading time and alignment time of the laser direct writing equipment.

[0096] The modules in the architecture matching device of the aforementioned laser direct writing equipment can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in a computer device in hardware form, or stored in the memory of a computer device in software form, so that the processor can call and execute the operations corresponding to each module.

[0097] In one embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be as follows: Figure 6 As shown, the computer device includes a processor, memory, input / output (I / O) interfaces, and a communication interface. The processor, memory, and I / O interfaces are connected via a system bus, and the communication interface is also connected to the system bus via the I / O interfaces. The processor provides computational and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system, computer programs, and a database. The internal memory provides the environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The database stores acquired data. The I / O interfaces are used for exchanging information between the processor and external devices. The communication interface is used for communication with external terminals via a network connection. When the computer program is executed by the processor, it implements an architecture matching method for a laser direct-writing device.

[0098] Those skilled in the art will understand that Figure 6 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0099] In one embodiment, a computer device is also provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps in the above method embodiments.

[0100] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon that, when executed by a processor, implements the steps in the above method embodiments.

[0101] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, performs the following steps:

[0102] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of related data must comply with the relevant laws, regulations and standards of the relevant countries and regions.

[0103] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments described above. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0104] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0105] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for matching the architecture of laser direct writing devices with different parameter requirements, characterized in that, The method includes: Collect the mass production linewidth requirements of the substrate to be exposed, the micromirror size of the digital micromirror in the laser direct writing equipment, and the angle between the digital micromirror and the workpiece stage; Based on the mass production linewidth requirements of the substrate to be exposed, the micromirror size of the digital micromirror in the laser direct writing equipment, and the angle between the digital micromirror and the workpiece stage, the magnification of the imaging lens of the laser direct writing equipment is matched. The actual resolution of the digital micromirror, the size of the substrate to be exposed, and the production capacity requirements are collected. The micromirror size, actual resolution of the digital micromirror, size of the substrate to be exposed, production capacity requirements, and magnification matching of the imaging lens of the laser direct writing equipment are all considered. The number of imaging lenses and the type of workpiece stage in the laser direct writing equipment are also considered.

2. The method according to claim 1, characterized in that, The steps, based on the mass production linewidth requirements of the substrate to be exposed, the micromirror size of the digital micromirror, and the angle between the digital micromirror and the workpiece stage, are matched with the magnification of the imaging lens of the laser direct writing device, including: Collect data on the production linewidth differences of the substrate to be exposed; The grid accuracy requirement is determined based on the mass production linewidth requirements and mass production linewidth difference requirements of the material to be exposed; The magnification of the imaging lens is matched based on the micromirror size, the angle between the digital micromirror and the workpiece stage, and the grid accuracy requirements.

3. The method according to claim 1, characterized in that, Based on the actual resolution of the digital micromirror, the size of the substrate to be exposed, production capacity requirements, and the magnification matching of the imaging lenses of the laser direct writing equipment, the number of imaging lenses and the type of workpiece stage of the laser direct writing equipment include: The exposure area of ​​a single lens is determined based on the micromirror size of the digital micromirror, the actual resolution of the digital micromirror, and the magnification of the imaging lens of the laser direct writing device. The number of imaging lenses and the type of workpiece stage of the laser direct writing equipment are matched based on the exposure area of ​​a single lens, the size of the substrate to be exposed, and the production capacity requirements.

4. The method according to any one of claims 1-3, characterized in that, The angle between the digital micromirror and the workpiece stage is (0, 1 / 16] radians.

5. The method according to any one of claims 1-3, characterized in that, The production capacity requirements of the substrate to be exposed include: the energy density required for the photoresist on the surface of the substrate to be exposed and the exposure efficiency of the substrate to be exposed.

6. The method according to any one of claims 1-3, characterized in that, The workpiece stage types include single-face stage, left-right double-face stage, and top-bottom double-face stage.

7. The method according to claim 1 or 2, characterized in that, The steps are based on the actual resolution of the digital micromirror, the size of the substrate to be exposed, production capacity requirements, and the magnification of the imaging lenses of the laser direct writing equipment. These steps match the number of imaging lenses and the type of workpiece stage in the laser direct writing equipment. Collect the board exchange time, board loading / unloading time, and alignment time of the laser direct writing device; The number of imaging lenses and the type of workpiece stage of the laser direct writing equipment are matched based on the micromirror size and actual resolution of the digital micromirror, the size of the substrate to be exposed, the production capacity requirements, the magnification of the imaging lens of the laser direct writing equipment, the board exchange time, board loading and unloading time and alignment time of the laser direct writing equipment.

8. An architecture matching device for laser direct writing equipment with different parameter requirements, characterized in that, The device includes: The data acquisition module is used to acquire information such as the mass production linewidth requirements, material dimensions, and production capacity requirements of the substrate to be exposed, as well as the micromirror dimensions, actual resolution, and angle between the digital micromirror and the workpiece stage in the laser direct writing equipment. The magnification matching module is used to match the magnification of the imaging lens of the laser direct writing equipment based on the mass production linewidth requirements of the substrate to be exposed, the micromirror size of the digital micromirror in the laser direct writing equipment, and the angle between the digital micromirror and the workpiece stage. The architecture matching module is used to match the number of imaging lenses and the type of workpiece stage of the laser direct writing equipment based on the actual resolution of the digital micromirror, the size of the substrate to be exposed, the production capacity requirements, and the magnification of the imaging lenses of the laser direct writing equipment.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 7.

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