Display panel, preparation method thereof and display device

Abstract

The invention discloses a display panel and a preparation method thereof, and a display device, and the display panel comprises a substrate which comprises a bonding pad region; the bonding electrode is arranged in the bonding pad area; a light-emitting element; the conductive adhesive layers are arranged between the bonding electrodes and the light-emitting elements, the light-emitting elements are in one-to-one correspondence with the bonding pad areas, the light-emitting elements comprise contact electrodes, and the contact electrodes are in one-to-one correspondence connection with the bonding electrodes through the conductive adhesive layers; first offset distances exist between the centers of the light-emitting elements and the centers of the bonding pad areas, and the absolute difference value between the first offset distances corresponding to any two light-emitting elements in the first direction does not exceed 5 micrometers. According to the display panel provided by the embodiment of the invention, the absolute difference value of the first offset distance in any two light-emitting elements distributed along the first direction does not exceed 5 microns, so that the problem that the offset between the light-emitting elements and the bonding pad region is gradually increased due to thermal expansion in the bonding process from the center to the edge direction is solved, and the yield of the light-emitting elements is improved. And part of the light-emitting elements are too large in deviation.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, specifically to a display panel and its manufacturing method, and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) display panels and other flat panel display panels that utilize light-emitting diode (LED) devices are widely used in various consumer electronics products such as mobile phones, televisions, personal digital assistants, digital cameras, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream in display devices.

[0003] However, the performance of current display panels still needs to be improved. Summary of the Invention

[0004] This application provides a display panel and its manufacturing method, as well as a display device, which can improve the misalignment problem between the light-emitting element and the corresponding position on the substrate caused by thermal expansion due to high temperature and high pressure during the manufacturing process.

[0005] In a first aspect, an embodiment of this application provides a display panel, comprising: a substrate including a pad area; a bonding electrode disposed on one side of the substrate and within the pad area; a light-emitting element disposed on the side of the bonding electrode away from the substrate; and a conductive adhesive layer disposed between the bonding electrode and the light-emitting element, wherein the light-emitting element corresponds one-to-one with the pad area, and the light-emitting element includes a contact electrode, and the contact electrode and the bonding electrode are connected one-to-one through the conductive adhesive layer; wherein, in the corresponding light-emitting elements and pad areas, there is a first offset distance between the center of the light-emitting element and the center of the pad area, and in a plane parallel to the display panel, the first direction is the direction from the center of the display panel to the edge of the display panel, and the absolute difference between the first offset distances corresponding to any two light-emitting elements along the first direction does not exceed 5 micrometers.

[0006] According to one aspect of the embodiments of this application, in the interconnected bonding electrode and contact electrode, there is a second offset distance between the center of the bonding electrode and the center of the corresponding contact electrode, and the absolute difference between the second offset distances corresponding to any two light-emitting elements along the first direction does not exceed 5 micrometers.

[0007] According to one aspect of the embodiments of this application, the bonding electrode includes a first bonding electrode and a second bonding electrode, and the contact electrode includes a first contact electrode and a second contact electrode. In the interconnected contact electrode and bonding electrode, the first bonding electrode and the first contact electrode are connected accordingly, and the second bonding electrode and the second contact electrode are connected accordingly.

[0008] According to one aspect of the embodiments of this application, in the interconnected first bonding electrode and first contact electrode, there is a third offset distance between the center of the first bonding electrode and the center of the corresponding first contact electrode, and the absolute difference between the third offset distances corresponding to any two light-emitting elements along the first direction does not exceed 5 micrometers.

[0009] According to one aspect of the embodiments of this application, in the interconnected second bonding electrode and the second contact electrode, there is a fourth offset distance between the center of the second bonding electrode and the center of the corresponding second contact electrode, and the absolute difference between the fourth offset distances corresponding to any two light-emitting elements along the first direction does not exceed 5 micrometers.

[0010] According to one aspect of the embodiments of this application, it further includes a first display area and a second display area surrounding the first display area, the light-emitting elements include a first light-emitting element located in the first display area and a second light-emitting element located in the second display area, and the absolute difference between the first offset distance corresponding to any second light-emitting element along the first direction and the first offset distance corresponding to any first light-emitting element does not exceed 5 micrometers.

[0011] According to one aspect of the embodiments of this application, the display panel further includes three or more first edges that are sequentially connected and a top corner region located between two adjacent first edges. The first direction also includes a first sub-direction pointing from the center of the display panel to the top corner region. The absolute difference between the first offset distance between the center of any two light-emitting elements and the center of the corresponding pad area along the first sub-direction does not exceed 5 micrometers.

[0012] According to one aspect of the embodiments of this application, the first offset distance between the center of the light-emitting element and the center of the corresponding pad area along the first direction is zero.

[0013] According to one aspect of the embodiments of this application, the conductive adhesive layer is an anisotropic conductive adhesive film.

[0014] According to one aspect of the embodiments of this application, the light-emitting element is a miniature light-emitting diode.

[0015] Secondly, according to embodiments of this application, a display device is provided, including a display panel according to any of the first aspects of this application.

[0016] Secondly, according to embodiments of this application, a method for manufacturing a display panel is provided, comprising:

[0017] Bonding electrodes are fabricated in the pad area on one side of the substrate;

[0018] The conductive adhesive layer is attached to the side of the bonding electrode away from the substrate.

[0019] Each light-emitting element is positioned at the location of each pad area, with each light-emitting element corresponding to a pad area. Each light-emitting element includes a contact electrode.

[0020] A buffer film and a pressure film are sequentially covered on the side of the light-emitting element away from the conductive adhesive layer. The buffer film includes at least one through hole. The conductive adhesive layer is heated on the side of the substrate away from the bonding electrode, and pressure is applied to the conductive adhesive layer on the side of the pressure film away from the buffer film, so that the contact electrode and the bonding electrode are bonded through the conductive adhesive layer.

[0021] According to one aspect of the embodiments of this application, the substrate includes a first region and a second region surrounding the first region, and the orthographic projection of the via on the substrate is located in the second region;

[0022] According to one aspect of the embodiments of this application, the buffer membrane includes a plurality of through holes, the diameter of which is less than or equal to 50 micrometers.

[0023] According to one aspect of the embodiments of this application, the via further includes a first via and a second via, wherein the orthographic projection of the first via onto the substrate is located in a first region, and the orthographic projection of the second via onto the substrate is located in a second region, and the aperture size of the second via is larger than the aperture size of the first via.

[0024] According to one aspect of the embodiments of this application, the direction from the center of the substrate to the edge of the substrate is a second direction, and the aperture size of the through hole gradually increases along the second direction.

[0025] According to one aspect of the embodiments of this application, the step of covering the side of the light-emitting element away from the conductive adhesive layer with a buffer film further includes:

[0026] The buffer membrane is made of high-temperature resistant plastic material with a heat distortion temperature greater than 180℃.

[0027] According to one aspect of the embodiments of this application, after the step of bonding the light-emitting element and the bonding electrode through the conductive adhesive layer, the method further includes: removing the pressure film and the buffer film to obtain the display panel.

[0028] Fourthly, according to the embodiments of this application, a display panel is provided, which is made by any of the manufacturing methods of the display panel of the third aspect of this application.

[0029] The display panel and its preparation method and display device provided in this application embodiment enable the display panel to have a first offset distance between the center of the corresponding light-emitting element and the center of the corresponding pad area. The absolute difference of the first offset distance between any two light-emitting elements distributed along the first direction does not exceed 5 micrometers. This improves the problem that during the bonding process between the light-emitting element and the corresponding pad area on the substrate, the thermal expansion of the preparation material caused by high temperature and high pressure during the bonding process between the light-emitting element and the pad area gradually increases the misalignment between the light-emitting element and the pad area, resulting in some light-emitting elements having excessive misalignment. Attached Figure Description

[0030] The features, advantages, and technical effects of exemplary embodiments of this application will now be described with reference to the accompanying drawings.

[0031] Figure 1 This is a schematic diagram of a planar structure of a display panel provided in related technologies;

[0032] Figure 2 yes Figure 1 Cross-sectional view along the AA direction;

[0033] Figure 3a This is a schematic diagram of the planar structure of a display panel provided in the first aspect embodiment of this application;

[0034] Figure 3b This is a schematic diagram of another display panel structure provided in the first aspect embodiment of this application;

[0035] Figure 4 yes Figure 3a Cross-sectional view of the structure along the BB direction;

[0036] Figure 5 yes Figure 3a A magnified schematic diagram of a portion of region A in the middle;

[0037] Figure 6 yes Figure 3a Another enlarged schematic diagram of the structure of region A in the middle;

[0038] Figure 7 This is a schematic diagram of the structure of a display device provided in the second aspect of this application;

[0039] Figure 8 This is a flowchart illustrating a method for manufacturing a display panel according to a third aspect embodiment of this application;

[0040] Figures 9a to 9d This is a schematic diagram of the process steps of a method for manufacturing a display panel according to a third aspect embodiment of this application;

[0041] Figure 10This is a schematic diagram of the process steps of another method for manufacturing a display panel provided in the third aspect embodiment of this application;

[0042] Figure 11 This is a schematic diagram of the process steps of another method for manufacturing a display panel provided in the third aspect embodiment of this application;

[0043] Figure 12 This is a flowchart of another method for manufacturing a display panel provided in the third aspect embodiment of this application;

[0044] Figure 13 This is a schematic diagram of the process steps of another method for manufacturing a display panel provided in the third aspect embodiment of this application.

[0045] in:

[0046] 100 - Display panel; 101 - First edge; 102 - Top corner area;

[0047] 10 - Substrate; 11 - Pad area; Z1 - First region; Z2 - Second region;

[0048] 20 - Bonding electrode; 20a - First bonding electrode; 20b - Second bonding electrode;

[0049] 30 - Light-emitting element; 31 - Contact electrode; 31a - First contact electrode; 31b - Second contact electrode;

[0050] 301 - First light-emitting element; 302 - Second light-emitting element;

[0051] 40 - Conductive adhesive layer;

[0052] D1 - First direction; D11 - First sub-direction; D2 - Second direction;

[0053] L1 - First offset distance; L2 - Second offset distance; L3 - Third offset distance; L4 - Fourth offset distance;

[0054] AA1 - First display area; AA2 - Second display area;

[0055] 50 - Buffer membrane; 51 - Through hole; 51a - First through hole; 51b - Second through hole;

[0056] 60-Air pressure membrane;

[0057] 1000 - Display device.

[0058] In the accompanying drawings, the same parts use the same reference numerals. The drawings are not drawn to scale. Detailed Implementation

[0059] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0060] The directional terms used in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of the display panel and display device of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0061] Figure 1 The diagram illustrates a planar structure of a display panel in the related art. Figure 2 It shows Figure 1 Cross-sectional structure along the AA direction.

[0062] Please see Figure 1 and Figure 2 In related technologies, in order to enable micro-LEDs to display and emit light normally after being transferred to the target substrate in batches of millions or more, it is necessary to use conductive adhesive layers to make batch electrical connections between the electrodes on the micro-LEDs and the pads on the substrate in order to achieve normal power supply to the micro-LEDs.

[0063] One commonly used conductive adhesive layer is anisotropic conductive film (ACF). ACF film consists of a resin adhesive and conductive particles distributed in the resin adhesive. The resin adhesive mainly functions to fix the relative position of the Micro-LED and the pads on the substrate, isolate the heat transfer between the substrate and the Micro-LED, and achieve horizontal insulation between the conductive particles.

[0064] The main working principle of ACF film is to use conductive particles to form conductive channels in the vertical direction to connect Micro-LED and pads on the substrate to achieve conductivity. At the same time, in the planar direction, the conductive channels are kept insulated from each other by resin adhesive, thereby avoiding short circuits between adjacent electrodes.

[0065] The conductive particles in the resin adhesive are distributed only between the Micro-LED and the pads on the substrate under no pressure. They do not directly contact the pads or the Micro-LED and do not form an electrical connection.

[0066] When the ACF film is heated and pressurized, the insulating film of the conductive particles breaks down, forming a vertically penetrating conductive channel in the resin adhesive. The two ends of the conductive channel directly contact the Micro-LED and the pads on the substrate, forming an electrical connection. At the same time, the conductive channels are insulated from each other by the resin adhesive.

[0067] Continue heating the ACF film to cure the resin adhesive, ensuring that the conductive channels remain connected and thus maintaining a stable electrical connection.

[0068] Since the bulk electrical connection between Micro-LEDs and the pads on the substrate relies on the ACF film, and the ACF film, i.e. the entire display panel, needs to be heated and pressurized during the processing of the ACF film, a spacer film needs to be covered on the Micro-LED side to buffer the pressure and temperature between the Micro-LED and the pads on the substrate during bonding. This serves to ensure that the display panel is subjected to uniform stress and to insulate the Micro-LED from heat, thus avoiding the risk of damage.

[0069] However, during the heating and pressurization process, the spacer material itself will undergo a certain degree of thermal expansion due to the combined effect of heat and pressure. The linear and uniform expansion of the spacer material from the center to the surrounding edges will cause the Micro-LEDs that are in direct contact with the spacer material to shift slightly. This will reduce the overlap area between some Micro-LEDs and the pads on the substrate, or even cause them to completely misalign. This will affect the electrical connection between the Micro-LEDs and the pads on the substrate, resulting in increased contact resistance or even desoldering, and a decrease in yield.

[0070] In order to solve the above-mentioned technical problems and meet technical needs, this application provides a display panel, a method for manufacturing the same, and a display device.

[0071] Figure 3a This illustration shows a planar structure of a display panel 100 provided in a first aspect embodiment of this application. Figure 4 yes Figure 3a Cross-sectional structure in the middle BB direction.

[0072] Please see Figure 3a and Figure 4 In a first aspect, embodiments of this application provide a display panel 100, including a substrate 10, a bonding electrode 20, a light-emitting element 30, and a conductive adhesive layer 40.

[0073] The substrate 10 includes a pad area 11.

[0074] The bonding electrode 20 is disposed on one side of the substrate 10 and within the pad area 11.

[0075] The light-emitting element 30 is disposed on the side of the bonding electrode 20 away from the substrate 10.

[0076] A conductive adhesive layer 40 is disposed between the bonding electrode 20 and the light-emitting element 30. The light-emitting element 30 corresponds one-to-one with the pad area 11. The light-emitting element 30 includes a contact electrode 31, and the contact electrode 31 and the bonding electrode 20 are connected one-to-one through the conductive adhesive layer 40.

[0077] Among them, in the corresponding light-emitting elements 30 and pad areas 11, there is a first offset distance L1 between the center of the light-emitting element 30 and the center of the pad area 11. In a plane parallel to the display panel 100, the first direction D1 is the direction from the center of the display panel 100 to the edge of the display panel 100. The absolute difference between the first offset distances L1 of any two light-emitting elements 30 along the first direction D1 does not exceed 5 micrometers.

[0078] The display panel 100 provided in the first aspect embodiment of this application enables the first offset distance L1 between the center of the corresponding light-emitting element 30 and the center of the corresponding pad area 11 to be the same among at least two light-emitting elements 30 distributed along the first direction D1. This improves the problem that during the bonding process between the light-emitting element 30 and the corresponding pad area 11 on the substrate from the center to the edge, the thermal expansion of the fabrication material caused by high temperature and high pressure during the bonding process between the light-emitting element 30 and the pad area 11 causes the offset between the light-emitting element 30 and the pad area 11 to gradually increase, resulting in some light-emitting elements 30 having excessive offset.

[0079] There are various ways to arrange the substrate 10. The substrate 10 may include a base material and multiple support layers disposed on the base material. The substrate 10 mainly serves to support and bear loads, and other structures are stacked sequentially on the substrate 10. The stacking arrangement mentioned here means that the other structures are arranged sequentially along the thickness direction of the substrate 10.

[0080] The substrate 10 may include various film layer structures, and the specific composition of the film layer structures of the substrate 10 is not limited in this embodiment. Furthermore, the thickness direction of other film layers located on one side of the substrate 10 is usually consistent with the thickness direction of the substrate 10 itself. Therefore, for ease of description, the thickness direction of the substrate 10 or other film layers mentioned later in this embodiment are all the same direction.

[0081] The substrate 10 has a plurality of pad areas 11, which are specific areas defined by human intervention on the substrate 10. Each pad area 11 has a bonding electrode 20 for bonding with the light-emitting element 30.

[0082] When the light-emitting element 30 is a Micro-LED, the size of the pad area 11 is only slightly larger than the size of the light-emitting element 30, so that the spacing between the light-emitting elements 30 is as small as possible and the pixel density is increased.

[0083] Optionally, a bonding electrode 20 corresponding to a light-emitting element 30 is provided in a pad area 11, and the multiple pad areas 11 of the multiple light-emitting elements 30 are arranged in an array.

[0084] The correspondence between the light-emitting element 30 and the pad area 11 should be understood as follows: the contact electrode 31 of the light-emitting element 30 is disposed on the side that contacts the bonding electrode 20, and the contact electrode 31 and the bonding electrode 20 in the pad area 11 are connected in a corresponding manner through the conductive adhesive layer 40, so that the light-emitting element 30 and the pad area 11 correspond one-to-one.

[0085] Optionally, the light-emitting element 30 is a vertical LED, the contact electrode 31 of the light-emitting element 30 includes only one, and the corresponding bonding electrode 20 in the pad area 11 is also set to one.

[0086] Optionally, the light-emitting element 30 is a horizontal LED, and the contact electrode 31 of the light-emitting element 30 includes two electrodes, and the corresponding bonding electrode 20 in the pad area 11 is also set to two electrodes.

[0087] The first direction D1 is any direction from the center of the display panel 100 to a point on the edge of the display panel 100.

[0088] Optionally, when the planar shape of the display panel 100 is square, the center of the display panel 100 is the intersection of the two diagonals of the square, and the edges of the display panel 100 are four edges connected in sequence.

[0089] Optionally, when the planar shape of the display panel 100 is circular, the center of the display panel 100 is the center of the circle, and the edge of the display panel 100 is the circumference.

[0090] There is a first offset distance L1 greater than or equal to zero between the center of the light-emitting element 30 and the center of the pad area 11. When the spacer film expands linearly and uniformly during the manufacturing process, the light-emitting element 30 in contact with the spacer film is affected and thus shifts to different degrees, resulting in the first offset distance L1.

[0091] Optionally, when the planar shape of the light-emitting element 30 is square, the corresponding pad area 11 is also set to a square shape, the center of the light-emitting element 30 is the intersection of the two diagonals of the square, and the center of the pad area 11 is also the intersection of the two diagonals of the square.

[0092] Optionally, when the planar shape of the light-emitting element 30 is circular, the corresponding pad area 11 is also set to be circular, with the center of the light-emitting element 30 being the center of the circle, and the center of the pad area 11 also being the center of the circle.

[0093] The first offset distance L1 corresponding to the light-emitting element 30 should be understood as the first offset distance L1 between the light-emitting element 30 and the corresponding pad area 11.

[0094] In related technologies, the first offset distance L1 corresponding to the light-emitting element 30 gradually increases in the light-emitting element 30 along the first direction D1 due to the linear and uniform expansion of the spacer film material itself during the preparation process, resulting in the problem that some light-emitting elements 30 are displaced too much.

[0095] The absolute difference should be understood as the absolute value of the difference between two values. Therefore, the absolute difference is a positive value, and the absolute difference is no more than 5 micrometers. The range of the difference between the two values ​​is between -2.5 micrometers and 2.5 micrometers.

[0096] In this embodiment, among the light-emitting elements 30 distributed along the first direction D1, the absolute difference between any two light-emitting elements 30 corresponding to the first offset distance L1 is no more than 5 micrometers. This can improve the problem of excessive displacement of the light-emitting elements 30 in the display panel 100 and avoid the risk of increased resistance or even desoldering caused by the reduction of the contact area between the contact electrode 31 and the bonding electrode 20.

[0097] Figure 5 It shows Figure 3a A magnified view of a local area in region A.

[0098] Please see Figure 5 In some embodiments, in the interconnected bonding electrode 20 and contact electrode 31, there is a second offset distance L2 between the center of the bonding electrode 20 and the center of the corresponding contact electrode 31, and the absolute difference between the second offset distance L2 between any two light-emitting elements 30 along the first direction D1 does not exceed 5 micrometers.

[0099] In these embodiments, in any two light-emitting elements 30 along the first direction D1, the absolute difference between the second offset distance L2 between the center of the bonding electrode 20 and the center of the corresponding contact electrode 31 does not exceed 5 micrometers, which further improves the problem of excessive displacement between the contact electrode 31 and the bonding electrode 20 of the vertical LED, and avoids the risk of increased resistance or even desoldering due to the reduced contact area between the contact electrode 31 and the bonding electrode 20.

[0100] When the light-emitting element 30 is a vertical LED, after the light-emitting elements 30 are transferred in batches to the pad area 11, the electrodes of the light-emitting element 30 are distributed on both sides of the light-emitting element 30 along the thickness direction of the substrate 10. Among them, the contact electrode 31 on the side of the light-emitting element 30 near the bonding electrode 20 includes one electrode.

[0101] The bonding electrode 20 and the corresponding contact electrode 31 should be understood as follows: the contact electrode 31 of the light-emitting element 30 contacts the bonding electrode 20 of the corresponding pad area 11 and forms an electrical connection. The contact electrode 31 of the light-emitting element 30 and the bonding electrode 20 of the corresponding pad area 11 are the bonding electrode 20 and the corresponding contact electrode 31.

[0102] There is a second offset distance L2 between the center of the bonding electrode 20 and the center of the contact electrode 31 that is greater than or equal to zero. When the spacer film expands linearly and uniformly during the fabrication process, the light-emitting element 30 in contact with the spacer film is affected. The light-emitting element 30 and the corresponding pad area 11 are displaced to different degrees, which further causes the second offset distance L2 between the contact electrode 31 and the corresponding bonding electrode 20.

[0103] Optionally, when the planar shape of the bonding electrode 20 is square, the planar shape of the corresponding contact electrode 31 is also set to square, the center of the bonding electrode 20 is the intersection of the two diagonals of the square, and the center of the contact electrode 31 is also the intersection of the two diagonals of the square.

[0104] Optionally, when the planar shape of the bonding electrode 20 is circular, the corresponding contact electrode 31 is also set to be circular, with the center of the bonding electrode 20 being the center of the circle, and the center of the contact electrode 31 also being the center of the circle.

[0105] The second offset distance L2 corresponding to the light-emitting element 30 should be understood as the second offset distance L2 between the contact electrode 31 of the light-emitting element 30 and the corresponding bonding electrode 20.

[0106] In this embodiment, among the light-emitting elements 30 distributed along the first direction D1, the absolute difference between the second offset distance L2 corresponding to any two light-emitting elements 30 does not exceed 5 micrometers. This further improves the problem of excessive displacement between the contact electrode 31 and the bonding electrode 20 of the vertical LED, and avoids the risk of increased resistance or even desoldering due to the reduced contact area between the contact electrode 31 and the bonding electrode 20.

[0107] Figure 6 It shows Figure 3a Another locally magnified structure in region A.

[0108] Please see Figure 6 In some optional embodiments, the bonding electrode 20 includes a first bonding electrode 20a and a second bonding electrode 20b, and the contact electrode 31 includes a first contact electrode 31a and a second contact electrode 31b. In the interconnected contact electrode 31 and bonding electrode 20, the first bonding electrode 20a and the first contact electrode 31a are connected accordingly, and the second bonding electrode 20b and the second contact electrode 31b are connected accordingly.

[0109] In these optional embodiments, the light-emitting element 30 is a horizontal LED. The light-emitting element 30 has two electrodes, a first contact electrode 31a and a second contact electrode 31b, on the side that contacts the bonding electrode 20. The bonding electrode 20 has a first bonding electrode 20a connected to the first contact electrode 31a and a second bonding electrode 20b connected to the second contact electrode 31b in the corresponding pad area 11, so as to realize the electrical connection of the light-emitting element 30.

[0110] In a horizontal LED, after the light-emitting elements 30 are transferred in batches onto the substrate 10, two electrodes, a first contact electrode 31a and a second contact electrode 31b, are distributed on the side of the light-emitting element 30 that contacts the bonding electrode 20. The first bonding electrode 20a and the second bonding electrode 20b are provided in the corresponding pad area 11.

[0111] Please see Figure 6 In some optional embodiments, in the interconnected first bonding electrode 20a and first contact electrode 31a, there is a third offset distance L3 between the center of the first bonding electrode 20a and the center of the corresponding first contact electrode 31a, and the absolute difference between the third offset distance L3 between any two light-emitting elements 30 along the first direction D1 does not exceed 5 micrometers.

[0112] In these optional embodiments, in any two light-emitting elements 30 along the first direction D1, the absolute difference between the third offset distance L3 between the center of the first bonding electrode 20a and the center of the corresponding first contact electrode 31a does not exceed 5 micrometers, which further improves the problem of excessive displacement between the first contact electrode 31a and the first bonding electrode 20a of the horizontal LED, and avoids the risk of increased resistance or even desoldering due to the reduced contact area between the first contact electrode 31a and the first bonding electrode 20a.

[0113] The first bonding electrode 20a and the corresponding first contact electrode 31a should be understood as follows: the first contact electrode 31a of the light-emitting element 30 is in contact with and connected to the first bonding electrode 20a of the corresponding pad area 11. The first contact electrode 31a of the light-emitting element 30 and the first bonding electrode 20a connected to the corresponding pad area 11 are the first bonding electrode 20a and the corresponding first contact electrode 31a.

[0114] There is a third offset distance L3 greater than or equal to zero between the center of the first bonding electrode 20a and the center of the first contact electrode 31a. When the spacer film expands linearly and uniformly during the preparation process, the light-emitting element 30 in contact with the spacer film is affected, and the light-emitting element 30 and the corresponding pad area 11 are displaced to different degrees, which further causes a third offset distance L3 between the first contact electrode 31a and the corresponding first bonding electrode 20a.

[0115] Optionally, when the planar shape of the first bonding electrode 20a is square, the planar shape of the corresponding first contact electrode 31a is also set to square, the center of the first bonding electrode 20a is the intersection of the two diagonals of the square, and the center of the first contact electrode 31a is also the intersection of the two diagonals of the square.

[0116] Optionally, when the planar shape of the first bonding electrode 20a is circular, the corresponding shape of the first contact electrode 31a is also set to be circular, and the center of the first bonding electrode 20a is the center of the circle, and the center of the first contact electrode 31a is also the center of the circle.

[0117] The third offset distance L3 corresponding to the light-emitting element 30 should be understood as the third offset distance L3 between the first contact electrode 31a of the light-emitting element 30 and the corresponding first bonding electrode 20a.

[0118] In this embodiment, among the light-emitting elements 30 distributed along the first direction D1, the absolute difference between any two light-emitting elements 30 corresponding to the third offset distance L3 is no more than 5 micrometers. This further improves the problem of excessive displacement between the first contact electrode 31a and the first bonding electrode 20a of the horizontal LED, and avoids the risk of increased resistance or even desoldering due to the reduced contact area between the first contact electrode 31a and the first bonding electrode 20a.

[0119] Please see Figure 6 In some optional embodiments, in the interconnected second bonding electrode 20b and the second contact electrode 31b, there is a fourth offset distance L4 between the center of the second bonding electrode 20b and the center of the corresponding second contact electrode 31b, and the absolute difference between the fourth offset distance L4 between any two light-emitting elements 30 along the first direction D1 does not exceed 5 micrometers.

[0120] In these optional embodiments, in any two light-emitting elements 30 along the first direction D1, the absolute difference between the fourth offset distance L4 between the center of the second bonding electrode 20b and the center of the corresponding second contact electrode 31b does not exceed 5 micrometers, which further improves the problem of excessive displacement between the second contact electrode 31b and the second bonding electrode 20b of the horizontal LED, and avoids the risk of increased resistance or even desoldering due to the reduced contact area between the second contact electrode 31b and the second bonding electrode 20b.

[0121] The second bonding electrode 20b and the corresponding second contact electrode 31b should be understood as follows: the second contact electrode 31b of the light-emitting element 30 contacts and is connected to the second bonding electrode 20b of the corresponding pad area 11. The second contact electrode 31b of the light-emitting element 30 and the second bonding electrode 20b connected to the corresponding pad area 11 are the second bonding electrode 20b and the corresponding second contact electrode 31b.

[0122] There is a fourth offset distance L4 between the center of the second bonding electrode 20b and the center of the second contact electrode 31b, which is greater than or equal to zero. When the spacer film expands linearly and uniformly during the fabrication process, the light-emitting element 30 in contact with the spacer film is affected, and the light-emitting element 30 and the corresponding pad area 11 are displaced to different degrees, which further causes the fourth offset distance L4 between the second contact electrode 31b and the corresponding second bonding electrode 20b.

[0123] Optionally, when the planar shape of the second bonding electrode 20b is square, the planar shape of the corresponding second contact electrode 31b is also set to square, the center of the second bonding electrode 20b is the intersection of the two diagonals of the square, and the center of the second contact electrode 31b is also the intersection of the two diagonals of the square.

[0124] Optionally, when the planar shape of the second bonding electrode 20b is circular, the corresponding shape of the second contact electrode 31b is also set to be circular, with the center of the second bonding electrode 20b being the center of the circle, and the center of the second contact electrode 31b also being the center of the circle.

[0125] The fourth offset distance L4 corresponding to the light-emitting element 30 should be understood as the fourth offset distance L4 between the second contact electrode 31b of the light-emitting element 30 and the corresponding second bonding electrode 20b.

[0126] In this embodiment, among the light-emitting elements 30 distributed along the first direction D1, the absolute difference between any two light-emitting elements 30 corresponding to the fourth offset distance L4 is no more than 5 micrometers. This further improves the problem of excessive displacement between the second contact electrode 31b and the second bonding electrode 20b of the horizontal LED, and avoids the risk of increased resistance or even desoldering due to a decrease in the contact area between the second contact electrode 31b and the second bonding electrode 20b.

[0127] Figure 3b This illustrates another planar structure of a display panel provided in the first aspect embodiment of this application.

[0128] Please see Figure 3b In some embodiments, the display panel 100 further includes a first display area AA1 and a second display area AA2 surrounding the first display area AA1. The light-emitting element 30 includes a first light-emitting element 301 located in the first display area AA1 and a second light-emitting element 302 located in the second display area AA2. The absolute difference between the first offset distance L1 corresponding to any second light-emitting element 302 and the first offset distance L1 corresponding to any first light-emitting element 301 along the first direction D1 does not exceed 5 micrometers.

[0129] In these embodiments, by setting the first offset distance L1 corresponding to any second light-emitting element 302 along the first direction D1 to be consistent with the first offset distance L1 corresponding to any first light-emitting element 301, the problem of excessive displacement between the second light-emitting element 302 and the corresponding pad area 11 in the second display area AA2, where the thermal expansion of the spacer film is more obvious, can be improved. This further avoids the risk of increased resistance or even desoldering due to a decrease in the contact area between the contact electrode 31 and the bonding electrode 20.

[0130] In related technologies, due to the uniform linear expansion of the spacer film, the thermal expansion of the spacer film is more pronounced at the edges compared to the center. Micro-LEDs located at the edges of the substrate or even the corners 102 where the edges intersect have a greater risk of shifting, leading to increased contact resistance or even desoldering, thus affecting the yield of the entire display panel 100.

[0131] Therefore, if the first offset distance L1 corresponding to any second light-emitting element 302 in the second display area AA2 surrounding the first display area AA1 is consistent with the first offset distance L1 corresponding to any first light-emitting element 301 along the first direction D1, the problem of excessive displacement between the second light-emitting element 302 and the corresponding pad area 11 can be improved, and the risk of increased resistance or even desoldering caused by the reduction of the contact area between the contact electrode 31 and the bonding electrode 20 can be further avoided.

[0132] Figure 3b The diagram only shows a set of second light-emitting elements 302 surrounding the first light-emitting element 301 in the second display area AA2. Optionally, the second light-emitting elements 302 may include multiple sets of second light-emitting elements 302 sequentially surrounding the first light-emitting element 301 in the first display area AA1. The display panel 100 provided in this application does not limit the specific number of second light-emitting elements 302 or the specific division position of the first display area AA1 and the second display area AA2, as long as the second display area AA2 is arranged around the first display area AA1, and the first light-emitting element 301 is located in the first display area AA1, and the second light-emitting elements 302 are located in the second display area AA2.

[0133] Please see Figure 3b In some alternative embodiments, the display panel 100 further includes three or more first edges 101 connected in sequence and a corner region 102 located between two adjacent first edges 101. The first direction D1 also includes a first sub-direction D11 pointing from the center of the display panel 100 to the corner region 102. The absolute difference between the first offset distance L1 between the center of any two light-emitting elements 30 and the center of the corresponding pad area 11 along the first sub-direction D11 does not exceed 5 micrometers.

[0134] In these optional embodiments, by setting the absolute difference between the first offset distance L1 corresponding to any two light-emitting elements 30 along the first sub-direction D11 to no more than 5 micrometers, the problem of excessive displacement between the light-emitting element 30 and the corresponding pad area 11 in the apex region 102 where the thermal expansion of the spacer film is more obvious can be improved, and the risk of increased resistance or even desoldering caused by the reduction of the contact area between the contact electrode 31 and the bonding electrode 20 can be further avoided.

[0135] In related technologies, due to the uniform linear expansion of the spacer film, in a display panel 100 comprising three or more first edges 101 connected in sequence, the thermal expansion of the spacer film is more pronounced and the displacement is greater at the apex region 102 between the first edges 101 compared to the middle position of the first edge 101. The Micro-LEDs located at the apex region 102 where the edges intersect have a greater risk of displacement, leading to increased contact resistance or even desoldering, thereby affecting the yield of the entire display panel 100.

[0136] Optionally, the display panel 100 has a triangular planar shape, and includes three first edges 101, with the apex region 102 being the three included corner regions of the display panel 100.

[0137] Optionally, the display panel 100 has a square planar shape and includes four first edges 101, with the top corner area 102 being the four corner areas of the display panel 100.

[0138] The first sub-direction D11, which is the direction from the center of the display panel 100 to the top corner region 102, should be understood as the first sub-direction D11 pointing from the center of the display panel 100 to any point in the top corner region 102 formed by the two first edges 101.

[0139] Preferably, the first sub-direction D11 is the intersection of the two second edges that enclose and form the top corner region 102, pointing from the center of the display panel 100. Along this first sub-direction D11, the first offset distance L1 corresponding to the light-emitting element 30 changes the most, the probability of displacement between the light-emitting element 30 and the corresponding pad area 11 is the greatest, and the risk of the contact area between the contact electrode 31 and the bonding electrode 20 decreasing, leading to increased resistance or even desoldering is the greatest.

[0140] In the display panel 100 formed by three or more first edges 101 connected in sequence, the problem of excessive displacement between the light-emitting element 30 and the corresponding pad area 11 in the top corner region 102 where the thermal expansion of the spacer film is more obvious can be improved by ensuring that the absolute difference between the first offset distance L1 corresponding to any two light-emitting elements 30 along the first sub-direction D11 does not exceed 5 micrometers. This further avoids the risk of increased resistance or even desoldering caused by the reduction of the contact area between the contact electrode 31 and the bonding electrode 20.

[0141] In some embodiments, the first offset distance L1 between the center of the light-emitting element 30 and the center of the corresponding pad area 11 along the first direction D1 is zero.

[0142] In these embodiments, in at least two light-emitting elements 30 along the first direction D1, the first offset distance L1 corresponding to the light-emitting element 30 is zero, which further improves the displacement problem between the light-emitting element 30 and the corresponding pad area 11, and further avoids the risk of increased resistance or even desoldering due to the reduced contact area between the contact electrode 31 and the bonding electrode 20.

[0143] In some embodiments, the conductive adhesive layer 40 is an ACF film.

[0144] In these embodiments, the conductive adhesive layer 40 is set as an ACF film, which enables the display panel 100 to electrically connect the light-emitting elements 30 and the bonding electrodes 20 in batches, thereby realizing the fabrication of large-size display panels 100 and improving production efficiency.

[0145] In some alternative embodiments, the light-emitting element 30 is a Micro-LED.

[0146] In these optional embodiments, the light-emitting element 30 is a Micro-LED, and its size is generally controlled to be 34*58 micrometers or 25*40 micrometers, which further reduces the size of the light-emitting element 30 and improves the pixel resolution.

[0147] Figure 7 The structure of a display device 1000 provided in a second aspect embodiment of this application is shown.

[0148] Please see Figure 7 Secondly, embodiments of this application provide a display device 1000, including the display panel 100 provided in any of the first aspects of this application.

[0149] The display device 1000 provided in the second aspect embodiment of this application includes the display panel 100 provided in any of the first aspect embodiments of this application, and therefore also has the beneficial effects of any of the first aspect embodiments of this application, which will not be repeated here.

[0150] The display device 1000 in the second aspect of this application includes, but is not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0151] Figure 8 The illustration shows a flow chart of a method for manufacturing a display panel 100 according to a third aspect embodiment of this application. Figures 9a to 9d The process steps of a method for manufacturing a display panel 100 provided in a third aspect embodiment of this application are shown.

[0152] Please see Figure 8as well as Figures 9a to 9d Thirdly, embodiments of this application provide a method for manufacturing a display panel 100, comprising:

[0153] Step S10: Prepare bonding electrode 20 in pad area 11 on one side of substrate 10;

[0154] Step S20: The conductive adhesive layer 40 is attached to the side of the bonding electrode 20 away from the substrate 10;

[0155] Step S30: Each light-emitting element 30 is positioned at the location of each pad area 11, with each light-emitting element 30 corresponding to a pad area 11. Each light-emitting element 30 includes a contact electrode 31.

[0156] In step S40, a buffer film 50 and a pressure film 60 are sequentially covered on the side of the light-emitting element 30 away from the conductive adhesive layer 40. The buffer film 50 includes at least one through hole 51. The conductive adhesive layer 40 is heated on the side of the substrate 10 away from the bonding electrode 20, and pressure is applied to the conductive adhesive layer 40 on the side of the pressure film 60 away from the buffer film 50, so that the contact electrode 31 and the bonding electrode 20 are bonded through the conductive adhesive layer 40.

[0157] The method for manufacturing a display panel 100 provided in the third aspect of this application changes the structure of the buffer film 50 by providing a through hole 51 structure on the buffer film 50. The through hole 51 structure can absorb the deformation caused by the thermal expansion of the buffer film 50 itself during the manufacturing process, thereby improving the problem of overall deformation of the buffer film 50 due to thermal expansion and preventing the light-emitting element 30 in contact with the buffer film 50 from shifting. This further avoids the risk of increased resistance or even desoldering due to a decrease in the contact area between the contact electrode 31 and the bonding electrode 20.

[0158] Please see Figure 9a In step S10, a bonding electrode 20 is prepared in the pre-defined pad area 11. The size and shape of the bonding electrode 20 are adapted to the contact electrode 31 of the corresponding light-emitting element 30.

[0159] Please see Figure 9b In step S20, the conductive adhesive layer 40 is first bonded to the bonding electrode 20 on the substrate 10 before the light-emitting element 30 is transferred in batches to the substrate 10, so as to realize the batch connection between the light-emitting element 30 and the bonding electrode 20 in the subsequent preparation process.

[0160] Please see Figure 9c In step S30, the light-emitting elements 30 are transferred in batches to the corresponding pad area 11 on the substrate 10. The light-emitting elements 30 are provided with a contact electrode 31 on the side that contacts the bonding electrode 20, so as to achieve pre-alignment of the light-emitting elements 30 with the bonding electrode 20 in the pad area 11.

[0161] Please see Figure 9d In step S40, the buffer film 50 is placed between the light-emitting element 30 and the air pressure film 60, which can ensure that the air pressure of the light-emitting element 30 is uniform and that the light-emitting element 30 is heat-insulated, thus avoiding the risk of damage.

[0162] Heating and pressurizing both sides cause the conductive particles in the conductive adhesive layer 40 to break, forming a conductive channel connecting the contact electrode 31 and the bonding electrode 20, thus bonding the contact electrode 31 and the bonding electrode 20.

[0163] During the heating and pressurization process, the buffer film 50 is provided with a through hole 51 structure, which can absorb the deformation caused by the thermal expansion of the buffer film 50 itself. This improves the problem of displacement between the light-emitting element 30 and the pad area 11 caused by the overall displacement of the buffer film 50 due to thermal expansion, and further avoids the risk of increased resistance or even desoldering due to the reduced contact area between the contact electrode 31 and the bonding electrode 20.

[0164] Figure 10 The process steps of another method for manufacturing a display panel 100 provided in the third aspect embodiment of this application are shown.

[0165] Please see Figure 10 In some embodiments, the substrate 10 includes a first region Z1 and a second region Z2 surrounding the first region Z1, and the orthographic projection of the via 51 on the substrate 10 is located in the second region Z2.

[0166] In these embodiments, the orthogonal projection of the through-hole 51 of the buffer film 50 is located in the second region Z2 of the substrate 10, which can improve the displacement problem between the light-emitting element 30 and the corresponding pad area 11 in the second region Z2 where the thermal expansion of the buffer film 50 is more obvious, and further avoid the risk of increased resistance or even desoldering due to the reduced contact area between the contact electrode 31 and the bonding electrode 20.

[0167] In related technologies, due to the uniform linear expansion of the spacer film, the thermal expansion of the spacer film is more pronounced at the edges compared to the center. Micro-LEDs located at the edges of the substrate or even the corners 102 where the edges intersect have a greater risk of shifting, leading to increased contact resistance or even desoldering, thus affecting the yield of the entire display panel 100.

[0168] Therefore, by positioning the orthogonal projection of the via 51 within the second region Z2 surrounding the first region Z1 of the substrate 10, the via 51 can absorb the thermal expansion of the buffer film 50 within the second region Z2, thereby improving the displacement problem between the light-emitting element 30 and the corresponding pad area 11, and further avoiding the risk of increased resistance or even desoldering due to the reduced contact area between the contact electrode 31 and the bonding electrode 20.

[0169] Figure 10 The diagram only shows a set of through holes 51 whose orthographic projection is located in the second region Z2 and surrounds the first region Z1. Optionally, the through holes 51 include multiple sets of through holes 51 sequentially surrounding the first region Z1. The method for manufacturing the display panel provided in this application does not limit the specific number of through holes 51 or the specific division position of the first region Z1 and the second region Z2, as long as the second region Z2 is arranged around the first region Z1 and the orthographic projection of the through holes 51 is located in the second region Z2.

[0170] In some alternative embodiments, the buffer membrane 50 includes a plurality of through holes 51, the diameter of which is less than or equal to 50 micrometers.

[0171] In these optional embodiments, the aperture of the through hole 51 is less than 50 micrometers. When the light-emitting element 30 is a micro-LED, the optional size includes 34*58 micrometers or 25*40 micrometers. In this way, the buffer film 50 can always be in contact with the light-emitting element 30, which can play the role of heat insulation and uniform force distribution, avoid the risk of the buffer film 50 failing to buffer, and improve the problem that the light-emitting element 30 is damaged during the manufacturing process and the yield is reduced because it is sleeved in the through hole 51.

[0172] Figure 11 The process steps of another method for manufacturing a display panel 100 provided in the third aspect embodiment of this application are shown.

[0173] Please see Figure 11 In some optional embodiments, the via 51 further includes a first via 51a and a second via 51b. The orthographic projection of the first via 51a onto the substrate 10 is located in a first region Z1, and the orthographic projection of the second via 51b onto the substrate 10 is located in a second region Z2. The aperture size of the second via 51b is larger than that of the first via 51a.

[0174] In these optional embodiments, the aperture size of the second through hole 51b, whose orthogonal projection is located in the second region Z2, needs to absorb a larger thermal expansion deformation. Therefore, setting the aperture size of the second through hole 51b to be larger than the aperture size of the first through hole 51a, can further improve the displacement problem between the light-emitting element 30 and the corresponding pad area 11 in the second region Z2, where the thermal expansion of the buffer film 50 is more obvious, and further avoid the risk of increased resistance or even desoldering caused by the reduction of the contact area between the contact electrode 31 and the bonding electrode 20.

[0175] The buffer film 50 in the second region Z2 has a larger thermal expansion deformation. Therefore, in addition to only setting the through hole 51 with its orthographic projection located in the second region Z2, the aperture size of the second through hole 51b with its orthographic projection located in the second region Z2 can also be larger than the aperture size of the first through hole 51a with its orthographic projection located in the first region Z1. Similarly, the second through hole 51b can better absorb the thermal expansion deformation of the buffer film 50 in the second region Z2.

[0176] Figure 11 The diagram only shows a set of second through holes 51b whose orthographic projection is located in the second region Z2 and surrounds the first through hole 51a whose orthographic projection is located in the first region Z1. Optionally, the second through holes 51b include multiple sets of second through holes 51b sequentially surrounding the first region Z1. The method for manufacturing the display panel provided in this application does not limit the specific number of second through holes 51b or the specific division position of the first region Z1 and the second region Z2, as long as the second region Z2 is arranged around the first region Z1, and the orthographic projection of the first through hole 51a is located in the first region Z1, and the orthographic projection of the second through hole 51b is located in the second region Z2.

[0177] Please see Figure 11 In some optional embodiments, the direction from the center of the substrate 10 to the edge of the substrate 10 is the second direction D2, and the aperture size of the via 51 gradually increases along the second direction D2.

[0178] In these optional embodiments, since the deformation of the buffer film 50 gradually increases along the second direction D2, the aperture size of the through hole 51 also gradually increases along the second direction D2, so that the buffer film 50 itself can absorb the deformation caused by thermal expansion and gradually increase. This can further improve the displacement problem between the light-emitting element 30 and the corresponding pad area 11, and further avoid the risk of increased resistance or even desoldering caused by the reduction of the contact area between the contact electrode 31 and the bonding electrode 20.

[0179] In some embodiments, step S40 further includes:

[0180] The buffer membrane 50 is made of a high-temperature resistant plastic material with a heat distortion temperature greater than 180°C.

[0181] In these embodiments, since the temperature required for the high-temperature and high-pressure bonding of the conductive adhesive layer 40 between the contact electrode 31 and the bonding electrode 20 is in the range of 170°C to 180°C, the buffer film 50 is made of a plastic material with a heat distortion temperature greater than 180°C to avoid the risk of the buffer film 50 itself undergoing heat deformation and causing buffer failure during the preparation process.

[0182] Figure 12 The flowchart illustrates another method for manufacturing a display panel 100 provided in the third aspect embodiment of this application. Figure 13 The process steps of another method for manufacturing a display panel 100 provided in the third aspect embodiment of this application are shown.

[0183] Please see Figure 12 and Figure 13 In some optional embodiments, step S40 is followed by:

[0184] Step S50: Remove the air pressure membrane 60 and the buffer membrane 50 to obtain the display panel 100.

[0185] In these optional embodiments, after the buffer film 50 and the air pressure film 60 are removed in sequence, a display panel 100 can be obtained in which the light-emitting element 30 is bonded to the bonding electrode 20 to form an electrical connection. Since the buffer film 50 has a through hole 51 structure, the contact area between the buffer film 50 and the light-emitting element 30 is reduced, which makes it easier to separate the buffer film 50 and the light-emitting element 30 during the removal of the buffer film 50.

[0186] Fourthly, embodiments of this application provide a display panel manufactured by the method for preparing a display panel provided in any third aspect of this application.

[0187] The display panel provided in this application embodiment is manufactured by the method of manufacturing the display panel provided in any third aspect embodiment of this application, and therefore has the beneficial effects of the method of manufacturing the display panel provided in any third aspect embodiment of this application, which will not be repeated here.

[0188] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0189] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that, include: Substrate, including pad areas; A bonding electrode is disposed on one side of the substrate and within the pad area; A light-emitting element is disposed on the side of the bonding electrode away from the substrate; A conductive adhesive layer is disposed between the bonding electrode and the light-emitting element, wherein the light-emitting element corresponds one-to-one with the pad area, and the light-emitting element includes a contact electrode, which is connected to the bonding electrode through the conductive adhesive layer. In the corresponding light-emitting elements and pad areas, there is a first offset distance between the center of the light-emitting element and the center of the pad area. In a plane parallel to the display panel, the first direction is the direction from the center of the display panel to the edge of the display panel. The absolute difference between the first offset distances corresponding to any two light-emitting elements along the first direction does not exceed 5 micrometers.

2. The display panel according to claim 1, characterized in that, In the interconnected bonding electrode and the contact electrode, there is a second offset distance between the center of the bonding electrode and the center of the corresponding contact electrode, and the absolute difference between the second offset distances corresponding to any two light-emitting elements along the first direction does not exceed 5 micrometers; Preferably, the bonding electrode includes a first bonding electrode and a second bonding electrode, and the contact electrode includes a first contact electrode and a second contact electrode. In the interconnected contact electrode and the bonding electrode, the first bonding electrode and the first contact electrode are connected accordingly, and the second bonding electrode and the second contact electrode are connected accordingly. Preferably, in the interconnected first bonding electrode and the first contact electrode, there is a third offset distance between the center of the first bonding electrode and the center of the corresponding first contact electrode, and the absolute difference between the third offset distances corresponding to any two light-emitting elements along the first direction does not exceed 5 micrometers; Preferably, in the interconnected second bonding electrode and the second contact electrode, there is a fourth offset distance between the center of the second bonding electrode and the center of the corresponding second contact electrode, and the absolute difference between the fourth offset distances corresponding to any two light-emitting elements along the first direction does not exceed 5 micrometers.

3. The display panel according to claim 1, characterized in that, It also includes a first display area and a second display area surrounding the first display area. The light-emitting elements include a first light-emitting element located in the first display area and a second light-emitting element located in the second display area. The absolute difference between the first offset distance of any second light-emitting element along the first direction and the first offset distance of any first light-emitting element does not exceed 5 micrometers. Preferably, the display panel further includes three or more first edges that are sequentially connected and a top corner region located between two adjacent first edges. The first direction also includes a first sub-direction pointing from the center of the display panel to the top corner region. The absolute difference between the first offset distance between the center of any two light-emitting elements and the center of the corresponding pad area along the first sub-direction does not exceed 5 micrometers.

4. The display panel according to claim 1, characterized in that, The first offset distance along the first direction between the center of the light-emitting element and the center of the corresponding pad area is zero.

5. The display panel according to claim 1, characterized in that, The conductive adhesive layer is an anisotropic conductive adhesive film; Preferably, the light-emitting element is a miniature light-emitting diode.

6. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 5.

7. A method for manufacturing a display panel, characterized in that, include: Bonding electrodes are fabricated in the pad area on one side of the substrate; The conductive adhesive layer is attached to the side of the bonding electrode away from the substrate; Each light-emitting element is disposed at the location of each of the said pad areas, and the light-emitting element corresponds one-to-one with the pad area. The light-emitting element includes a contact electrode. A buffer film and a pressure film are sequentially covered on the side of the light-emitting element away from the conductive adhesive layer. The buffer film includes at least one through hole. The conductive adhesive layer is heated on the side of the substrate away from the bonding electrode, and pressure is applied to the conductive adhesive layer on the side of the pressure film away from the buffer film, so that the contact electrode and the bonding electrode are bonded through the conductive adhesive layer.

8. The preparation method according to claim 7, characterized in that, The substrate includes a first region and a second region surrounding the first region, and the orthographic projection of the via on the substrate is located in the second region; Preferably, the buffer membrane includes a plurality of through holes, the pore diameter of which is less than or equal to 50 micrometers; Preferably, the via further includes a first via and a second via, wherein the orthographic projection of the first via onto the substrate is located in the first region, and the orthographic projection of the second via onto the substrate is located in the second region, and the aperture size of the second via is larger than the aperture size of the first via. Preferably, the direction from the center of the substrate to the edge of the substrate is the second direction, and the aperture size of the through hole gradually increases along the second direction.

9. The preparation method according to claim 7, characterized in that, The step of covering the side of the light-emitting element away from the conductive adhesive layer with a buffer film further includes: The buffer membrane is made of a high-temperature resistant plastic material with a heat distortion temperature greater than 180℃; Preferably, after the step of bonding the light-emitting element to the bonding electrode through a conductive adhesive layer, the method further includes: removing the pressure film and the buffer film to obtain the display panel.

10. A display panel, characterized in that, It is manufactured by the method of manufacturing the display panel according to any one of claims 7 to 9.

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