Display panel, display module and mobile terminal

Abstract

The invention discloses a display panel, a display module and a mobile terminal. The display panel comprises a substrate, a light-emitting device layer arranged on the substrate and a color film layer arranged on the light-emitting device layer, the color film layer comprises a light shielding layer and a plurality of color resistance units embedded in the light shielding layer, and the light shielding layer comprises a first light shielding part arranged close to a cutting surface of the display panel; the first shading part comprises a first edge close to one side of the cutting surface, and the substrate comprises a second edge close to one side of the cutting surface; the distance between the first edge and the cutting surface is larger than the distance between the second edge and the cutting surface, so that the shading layer and the cutting surface are separated, the situation that a shading material is carbonized due to the high temperature of laser L in the panel cutting process is avoided, then carbonized carbon chips are prevented from remaining in edge gaps of the display panel, and the display quality is improved. And the cleanliness of the product is improved.

Description

[0001] This divisional application is a divisional application of Chinese patent application No. 202411898010.1, filed on December 22, 2021, entitled "Display Panel and Display Device". Technical Field

[0002] This application relates to the field of display technology, and in particular to a display panel and display module, and a mobile terminal. Background Technology

[0003] OLED (Organic Light-Emitting Diode) panels have advantages such as being thin and light, having a wide viewing angle, and being energy-saving, making them the mainstream of future development.

[0004] In existing OLED display panels, to reduce the panel thickness, a depolarization technique can be used, replacing the existing polarizer with a color resist layer and a black matrix layer. However, during panel cutting, a laser (L) is used to cut the black matrix around the display panel. The high temperature of the laser (L) causes the black matrix to carbonize, and the carbonized carbon particles may remain in the edge gaps of the display panel, affecting its cleanliness.

[0005] Therefore, there is an urgent need for a display panel to solve the above-mentioned technical problems. Summary of the Invention This application provides a display panel, display module, and mobile terminal to solve the technical problem of carbon dust in the edge gaps of existing display panels.

[0006] To address the above issues, the technical solution provided in this application is as follows: This application provides a display panel, which includes: Substrate; A light-emitting device layer is disposed on the substrate; and A color filter layer is disposed on the light-emitting device layer. The color filter layer includes a light-shielding layer and a plurality of color resist units embedded in the light-shielding layer. The light-shielding layer includes a first light-shielding portion disposed near the cut surface of the display panel. The first light-shielding portion includes a first edge near the cut surface, and the substrate includes a second edge near the cut surface. The distance from the first edge to the cut surface is greater than the distance from the second edge to the cut surface.

[0007] In the display panel of this application, the distance between the first edge and the cut surface is greater than or equal to 50 micrometers and less than or equal to 150 micrometers.

[0008] In the display panel of this application, the light-shielding layer further includes a second light-shielding portion away from the cut surface, and the thickness of the second light-shielding portion is greater than the thickness of the first light-shielding portion.

[0009] In the display panel of this application, the display panel further includes a first planarization layer disposed on the color filter layer, the first planarization layer covering the color filter layer; The first flattening layer covers the first light-shielding portion and extends toward the cut surface.

[0010] In the display panel of this application, the display panel further includes a first planarization layer disposed on the color filter layer, the first planarization layer covering the color filter layer; The light-shielding layer has a first notch in the area near the cut surface of the display panel, and the first flat layer has a second notch in the area near the cut surface, with the first notch and the second notch facing the cut surface.

[0011] In the display panel of this application, the thickness of the first planarization layer is less than or equal to the thickness of the second light-shielding portion.

[0012] In the display panel of this application, in the direction from the substrate to the color filter layer, the distance between the film layer boundary and the second edge on the side of the display panel closer to the cut surface gradually increases.

[0013] In the display panel of this application, the acute angle between the cut surface and the substrate ranges from 60° to 80°.

[0014] In the display panel of this application, the display panel includes multiple organic layers, and at least one of the organic layers has a black material disposed on the side near the cut surface.

[0015] This application also proposes a display module, which includes the above-mentioned display panel and a cover layer located on the display panel; The orthographic projection of the display panel onto the cover plate layer is located within the cover plate layer.

[0016] This application also proposes a mobile terminal, wherein the mobile terminal includes a terminal body and the aforementioned display module, and the terminal body and the display module are combined into one unit.

[0017] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0020] Figure 1 A cross-sectional view of the existing display panel; Figure 2 An enlarged view of the abnormal area on the existing display panel; Figure 3 This is a schematic diagram of the cutting process of the display panel in this application; Figure 4 for Figure 3 The first type of cross-sectional view of the mid-section AA; Figure 5 for Figure 4 Detailed structural diagram of the middle part of the film layer; Figure 6 This is a schematic diagram of the Gaussian spot of a laser beam. Figure 7 This is a top view of the display panel in the cut area of ​​this application; Figure 8 This is a cross-sectional view of the display panel in the cut area of ​​this application; Figure 9 for Figure 3 The second cross-sectional view of section AA; Figure 10 for Figure 3 The third cross-sectional view of section AA; Figure 11 for Figure 3 Cross-sectional view of section AA before cutting; Figure 12 This is a schematic diagram of the structure of the display module in this application. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0022] Please see Figure 1 , Figure 1This is a diagram of the film layer structure after cutting an existing display panel. In existing OLED display panels, to reduce the panel thickness, a depolarization technique can be used, replacing the existing polarizer with a color resist layer and a black matrix layer. To ensure flatness, a first planarization layer is typically coated on the color filter layer, and a protective layer is bonded to the first planarization layer for protection. However, during panel cutting, the temperature of the laser L may carbonize the black light-shielding layer 71 near the cutting surface 200. Simultaneously, due to the low peel force between the first protective layer 81 and the first planarization layer 80, the carbonized black material can seep into the gap between them, affecting the cleanliness of the display panel. Please refer to [link to relevant documentation] for details. Figure 2 The structure of circles in the picture Figure 1 The black unevenness in the central area BB. Therefore, this application proposes a display panel to solve the above-mentioned technical problem.

[0023] Please see Figures 3 to 12 This application provides a display panel 100, which may include a substrate 10, a light-emitting device layer 30, and a color filter layer 70. The light-emitting device layer 30 is disposed on the substrate 10. The color filter layer 70 is disposed on the light-emitting device layer 30. The color filter layer 70 includes a light-shielding layer 71 and a plurality of color resist units 72 embedded in the light-shielding layer 71. The light-shielding layer 71 includes a first light-shielding portion 711 disposed near the cut surface 200 of the display panel 100. The first light-shielding portion 711 includes a first edge M1 near the side of the cut surface 200, and the substrate 10 includes a second edge M2 near the side of the cut surface 200. The distance from the first edge M1 to the cut surface 200 is greater than the distance from the second edge M2 to the cut surface 200.

[0024] This application separates the light-shielding layer 71 from the cutting surface 200 by making the distance between the first edge M1 and the cutting surface greater than the distance between the second edge M2 and the cutting surface. This prevents the light-shielding material from being carbonized due to the high temperature of the laser L during the panel cutting process, thereby preventing carbon dust from remaining in the edge gaps of the display panel 100 and improving the cleanliness of the product.

[0025] The technical solution of this application will now be described in conjunction with specific embodiments.

[0026] Please see Figure 3 , Figure 3 The dashed line in the middle represents the cutting groove GG of the target panel, and the shape enclosed by the cutting groove GG is the outer shape of the display panel 100.

[0027] Please see Figure 4 and Figure 5 , Figure 4 for Figure 3 The first type of cross-sectional view of mid-section AA. Figure 5 for Figure 4 Detailed structural diagram of the middle part of the membrane layer.

[0028] The display panel 100 may include a thin-film transistor array layer 20 disposed on the substrate 10, a pixel definition layer 40 disposed on the thin-film transistor array layer 20, a light-emitting device layer 30 disposed on the same layer as the pixel definition layer 40, an encapsulation layer 50 disposed on the pixel definition layer 40, a touch layer 60 disposed on the encapsulation layer 50, a color filter layer 70 disposed on the touch layer 60, a first planarization layer 80 disposed on the color filter layer 70, and a first protective layer 81 disposed on the first planarization layer 80.

[0029] In this embodiment, the substrate 10 can be made of materials such as glass, quartz, or polyimide.

[0030] In this embodiment, please refer to Figure 5 The thin-film transistor array layer 20 may include multiple thin-film transistors 21. These thin-film transistors 21 may be etch-block type, back-channel etch type, or, depending on the position of the gate and active layer, may be classified as bottom-gate thin-film transistors, top-gate thin-film transistors, etc. There are no specific limitations. For example, Figure 5 The thin-film transistor 21 shown is a top-gate thin-film transistor. The thin-film transistor 21 may include a light-shielding metal layer 211 disposed on the substrate 10, a buffer layer 212 disposed on the light-shielding metal layer 211, an active layer 213 disposed on the buffer layer 212, a gate insulating layer 214 disposed on the active layer 213, a gate layer 215 disposed on the gate insulating layer 214, an inter-insulating layer 216 disposed on the gate layer 215, a source-drain layer 217 disposed on the inter-insulating layer 216, and a second planarization layer 218 disposed on the source-drain layer 217.

[0031] In this embodiment, please refer to Figure 5 The display panel 100 may further include an anode layer 31 disposed on the second planarization layer 218, a light-emitting layer 33 disposed on the anode layer 31, and a cathode layer 32 disposed on the light-emitting layer 33. The anode layer 31 includes a plurality of anodes 311, the pixel definition layer 40 includes a plurality of pixel openings corresponding one-to-one with the plurality of anodes 311, and each pixel opening exposes the upper surface of one anode 311. The light-emitting layer 33 may include a plurality of light-emitting pixels corresponding one-to-one with the plurality of anodes 311.

[0032] In this embodiment, please refer to Figure 4The encapsulation layer 50 covers the pixel definition layer 40 and continuously covers multiple pixel openings and multiple light-emitting pixels; wherein, the encapsulation layer 50 may include at least a first inorganic encapsulation layer, a first organic encapsulation layer and a second inorganic encapsulation layer stacked on the pixel definition layer 40.

[0033] In this embodiment, please refer to Figure 4 The touch layer 60 may include a first touch metal layer and a second touch metal layer disposed on the encapsulation layer 50, and an insulating layer disposed between the first touch metal layer and the second touch metal layer.

[0034] In this embodiment, the touch layer 60 provided in this application embodiment may be mutually capacitive or self-capacitive.

[0035] In this embodiment, please refer to Figure 4 The color filter layer 70 can be disposed on the touch layer 60. The color filter layer 70 may include a light-shielding layer 71 and a plurality of color resist units 72 of different colors embedded in the light-shielding layer 71. Each color resist unit 72 corresponds to a light-emitting pixel, and the color of the color resist unit 72 is the same as the light emitted by the corresponding light-emitting pixel.

[0036] In this embodiment, please refer to Figure 4 The light-emitting layer 33 includes a first light-emitting pixel 331 that emits a first color, a second light-emitting pixel 332 that emits a second color, and a third light-emitting pixel 333 that emits a third color. The color filter layer 70 includes a first color resist unit 721, a second color resist unit 722, and a third color resist unit 723. The first light-emitting pixel 331 corresponds to the first color resist unit 721, the second light-emitting pixel 332 corresponds to the second color resist unit 722, and the third light-emitting pixel 333 corresponds to the third color resist unit 723.

[0037] In this embodiment, the first light-emitting pixel 331 is a red light-emitting pixel, the second light-emitting pixel 332 is a green light-emitting pixel, the third light-emitting pixel 333 is a blue light-emitting pixel, the first color resist unit 721 is a red color resist, the second color resist unit 722 is a green color resist, and the third color resist unit 723 is a blue color resist.

[0038] In this embodiment, the orthographic projection of the first light-emitting pixel 331 onto the first color resist unit 721 is located within the first color resist unit 721, the orthographic projection of the second light-emitting pixel 332 onto the second color resist unit 722 is located within the second color resist unit 722, and the orthographic projection of the third light-emitting pixel 333 onto the third color resist unit 723 is located within the third color resist unit 723.

[0039] In this embodiment, the material of the first planarization layer 80 can be the same organic material as that of the second planarization layer 218.

[0040] In this embodiment, the material of the first protective layer 81 can be a flexible material such as polyethylene terephthalate.

[0041] In this embodiment, the display panel 100 may further include a back plate 90 and a second protective layer 91 attached to the back plate 90. The back plate 90 is disposed on the side of the substrate 10 away from the light emission direction, and the second protective layer is located on the side of the back plate 90 away from the light emission direction.

[0042] In this embodiment, the second protective layer 91 has the same function as the first protective layer 81, and the material of the second protective layer 91 can be the same as the material of the first protective layer 81.

[0043] In this embodiment, the peel force between the first protective layer 81 and the first planarization layer 80 is 1 to 4 g / inch, and the peel force between the second protective layer 91 and the backing plate 90 is 45 to 55 g / inch.

[0044] In this embodiment, the first protective layer 81 and the second protective layer 91 are intermediate products in the manufacturing process of the display panel 100. They exist only in the middle of the process to protect the first planarization layer 80 and other film layer structures below it. In the final product, the first protective layer 81 and the second protective layer 91 will be peeled off.

[0045] Please see Figure 4 The display panel 100 may include a display area 300 and a non-display area 400 located around the display area 300. At the same time, a cutting area 500 and a cutting product 600 left by cutting are provided on the side away from the non-display area 400.

[0046] During the cutting process, the display panel 100 needs to be cut using a laser L, for example... Figure 4 In the structure, the product to the left of the cutting zone 500 is the target product, and the product to the right of the cutting zone 500 is the useless cutting product 600.

[0047] In this embodiment, since the laser spot L is a Gaussian spot, please refer to [link / reference needed]. Figure 6 As shown, the laser L has the characteristic of high energy in the middle and decreasing energy around the edges. Therefore, the cross-section of the film cut by the laser L may appear as follows. Figure 4 The inverted triangle shape shown.

[0048] Please refer to the display panel 100 in this application. Figure 4In the direction from the substrate 10 to the color filter layer 70, the distance between the film layer boundary and the second edge M2 on the side of the display panel 100 near the cut surface 200 gradually increases; that is, in the direction from the substrate 10 to the color filter layer 70, without considering the patterning of each film layer, the outer contour area of ​​the film layer in the display panel 100 gradually decreases.

[0049] In this embodiment, in addition to the characteristics of the laser L itself, the film layer near the light emission direction has more organic materials, such as the first planarization layer 80, color filter layer 70, organic encapsulation layer, and pixel definition layer 40. The high temperature of the laser L will cause the organic materials to carbonize, producing carbon dust that affects the cleanliness of the panel. Therefore, the area of ​​the film layer near the light emission direction can be smaller than the area of ​​the film layer away from the light emission direction. That is, the distance between the boundary of the film layer near the light emission direction and the second edge M2 is greater than the distance between the boundary of the film layer away from the light emission direction and the second edge M2, so as to avoid the accumulation of carbon dust.

[0050] During the cutting process, as the laser L moves away from the light emission direction of the display panel 100, the cutting surface 200 of the display panel 100 becomes a slope with a certain tilt angle due to the influence of the laser L itself.

[0051] In this embodiment, the acute angle m between the cut surface 200 and the substrate 10 can range from 60° to 80°, and this acute angle m can be the actual angle between the cut surface 200 and the substrate 10. Due to the inherent characteristics of the laser L, the angle between the cut surface 200 and the substrate 10 can be made as close to 90° as possible by controlling the energy of the laser L. However, currently, due to process limitations, only 80° can be achieved. In the future, edge grinding or other treatments can be used to make the side of the display panel 100 closer to 90° with the substrate 10.

[0052] In the display panel 100 of this application, the display panel 100 includes multiple organic layers, and at least one of the organic layers is provided with a black material on the side near the cut surface 200.

[0053] In this embodiment, since the display panel 100 includes organic layers such as a first planarization layer 80, a color filter layer 70, an organic encapsulation layer, and a pixel definition layer 40, the high temperature of the laser L may cause the organic material to carbonize. Therefore, after cutting, carbonized carbon debris may remain at the edge of the aforementioned film layers. This carbon debris cannot be completely eliminated during the subsequent edge grinding process and may remain on the cut surface 200. Simultaneously, the carbonized organic layer adheres to the sides of the organic layer, providing some protection to the organic material in the display area 300, such as preventing water and oxygen penetration.

[0054] Figure 7 and Figure 8 The structures shown are a top view and a cross-sectional view of the display panel before it is completely cut. Existing display panels are generally cut by laser L to cut the motherboard. The high temperature of laser L has a certain carbonization effect on organic materials. Therefore, this application separates the light-shielding material that may be carbonized from the cutting area 500.

[0055] In the display panel 100 of this application, the light-shielding layer 71 includes a first light-shielding portion 711 near the cut surface 200 of the display panel 100, wherein the distance between the first edge M1 of the first light-shielding portion 711 and the cut surface 200 is greater than or equal to 50 micrometers and less than or equal to 150 micrometers.

[0056] Please see Figure 7 and Figure 8 In the figure, region a is the distance between the boundary of the light-shielding part and the center of the cutting track GG, region b is the width of the cutting track GG, and region d is the heat-affected zone H of the laser L. That is, the structure in region b will be cut, while the structure in region d will be affected by the high temperature of the laser L. Therefore, in order to avoid the light-shielding material being carbonized by the high temperature of the laser L, this application needs to make the boundary of the first light-shielding part 711 far away from the area that can be affected by the laser L, that is, a needs to be greater than d.

[0057] In this embodiment, the range of the difference c between a and b can be: 50um ≤ c ≤ 150um. That is, the minimum distance between the boundary of the first light-shielding part 711 and the boundary of the cutting channel GG is 50 micrometers, and the maximum distance is 150 micrometers.

[0058] In this embodiment, by setting the first light-shielding part 711 away from the center of the cutting track GG, the light-shielding material in the non-display area 400 is at a certain distance from the center of the cutting track GG, thus avoiding carbonization of the light-shielding material by the high-temperature laser L, and at the same time solving the problem of carbon residue between the first protective layer 81 and the planarization layer.

[0059] Please refer to the display panel 100 in this application. Figure 9 The light-shielding layer 71 further includes a second light-shielding portion 712 away from the cut surface 200, and the thickness of the second light-shielding portion 712 is greater than the thickness of the first light-shielding portion 711.

[0060] In this embodiment, the light-shielding layer 71 may include a second light-shielding portion 712 disposed in the display area 300 and a first light-shielding portion 711 disposed in the non-display area 400. Since the first light-shielding portion 711 is disposed close to the cutting surface 200, when the display panel 100 is cut, the distance between the boundary of the first light-shielding portion 711 and the laser L with a high temperature is small, and there is a possibility that the laser L carbonizes the boundary of the first light-shielding portion 711. However, by reducing the thickness of the first light-shielding portion 711, this application can reduce the generation of carbon debris when the first light-shielding portion 711 is carbonized, thereby alleviating the residual amount of carbon debris between the first protective layer 81 and the planarization layer.

[0061] In the display panel 100 of this application, the display panel 100 further includes a first planarization layer 80 disposed on the color filter layer 70. The first planarization layer 80 covers the color filter layer 70 and can cover the first light-shielding portion 711 and extend to the cut surface 200.

[0062] Please see Figure 9 and 10 The light-shielding layer 71 has a first notch 710 in the area near the cut surface 200 of the display panel 100, and the first notch 710 faces the cut surface 200; at the same time, the first flattening layer 80 has a second notch 810 in the area near the cut surface 200, and the second notch 810 faces the cut surface 200.

[0063] Please see Figure 9 and 10 Because the thicknesses of the color filter unit 72 and the light-shielding layer 71 are inconsistent, the flatness of the color filter layer 70 is low after the color filter process is completed. Therefore, the first flattening layer 80 needs to be set on the color filter layer 70. At the same time, since the first flattening layer 80 is made of organic material, the material of the flattening layer can also be carbonized to form black carbon dust when the laser L cuts. Therefore, the flattening layer material cannot be set on the side of the first flattening layer 80 close to the cutting surface 200.

[0064] Please see Figure 11 , Figure 11 This is a cross-sectional view of the display panel 100 before cutting, section AA. The display panel 100 and the first planarization layer 80 are hollowed out on the side near the cutting kerf GG. Since both the first planarization layer 80 and the light-shielding layer 71 can be made of photoresist-type organic materials, the hollowed-out area can be formed by a photomask process, for example, by exposure and development processes, to hollow out the edges of the first planarization layer 80 and the light-shielding layer 71 so that the boundaries of the first planarization layer 80 and the light-shielding layer 71 are far away from the cutting kerf GG.

[0065] In this embodiment, the second notch 810 corresponds to the first notch 710, and the area of ​​the second notch 810 can be greater than or equal to the area of ​​the first notch 710, so as to further increase the distance between the boundary of the second notch 810 and the cutting surface 200.

[0066] This application forms a second notch 810 in the region of the first planarization layer 80 near the cutting surface 200, so that the boundary of the first planarization layer 80 is far away from the cutting surface 200. Even if the boundary of the first planarization layer 80 is far away from the cutting path GG, the organic material constituting the first planarization layer 80 is prevented from being carbonized by the high temperature of the laser L, and carbonized carbon debris is prevented from remaining between the first planarization layer 80 and the first protective layer 81.

[0067] Please refer to the display panel 100 in this application. Figure 4 The thickness of the first planarization layer 80 can be less than or equal to the thickness of the second light-shielding portion 712. Since the first planarization layer 80 is disposed close to the cutting surface 200, the thickness of the first planarization layer 80 can be reduced to avoid the proportion of the first planarization layer 80 being carbonized by the laser L.

[0068] In this embodiment, since the first flattening layer 80 is mainly used to flatten the surface of the uneven color filter layer 70, the first flattening layer 80 only needs to ensure the flatness of the surface of the color filter layer 70. That is, the minimum thickness of the first flattening layer 80 is the difference between the thickness of the color resist unit 72 and the light-shielding layer 71, so as to ensure that the thickness of the area corresponding to the light-shielding layer 71 is the same as the thickness of the area corresponding to the color resist unit 72.

[0069] This application also proposes a display module 700, please refer to... Figure 12 The display module 700 includes the aforementioned display panel 100 and a cover plate layer CG located on the display panel 100; the orthographic projection of the display panel 100 on the cover plate layer is located within the cover plate layer CG.

[0070] In this embodiment, with Figure 4 Compared to the structure in, Figure 12 The structure in Figure 4 The first protective layer 81 and the second protective layer 91 are removed. At the same time, the display panel 100 can bond the first planarization layer 80 and the cover layer CG together with optical adhesive.

[0071] In this embodiment, the cover plate layer CG mainly serves to protect the panel structure below. Therefore, in the top view direction of the display module 700, the outer boundary of the cover plate layer CG should be larger than the outer boundary of the display panel 100.

[0072] This application also proposes a mobile terminal, which includes a terminal body and the aforementioned display module, wherein the terminal body and the display module are integrated into one unit. The terminal body may be a circuit board or other device bonded to the display module. The mobile terminal may include electronic devices such as mobile phones, televisions, and laptops.

[0073] This application discloses a display panel, a display module, and a mobile terminal. The display panel includes a substrate, a light-emitting device layer disposed on the substrate, and a color filter layer disposed on the light-emitting device layer. The color filter layer includes a light-shielding layer and a plurality of color resist units embedded in the light-shielding layer. The light-shielding layer includes a first light-shielding portion disposed near the cut surface of the display panel. The first light-shielding portion includes a first edge near the cut surface, and the substrate includes a second edge near the cut surface. This application separates the light-shielding layer from the cut surface by making the distance between the first edge and the cut surface greater than the distance between the second edge and the cut surface. This avoids the light-shielding material from being carbonized due to the high temperature of the laser L during the panel cutting process, thereby preventing carbon dust from remaining in the edge gaps of the display panel and improving the cleanliness of the product.

[0074] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0075] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0076] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0077] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A display panel, characterized in that, include: Substrate; A light-emitting device layer is disposed on the substrate; as well as An encapsulation layer is disposed on the side of the light-emitting device layer away from the substrate; A color filter layer is disposed on the side of the encapsulation layer away from the substrate. The color filter layer includes a light-shielding layer and a plurality of color resist units embedded in the light-shielding layer. The light-shielding layer includes a first light-shielding portion disposed near the cut surface of the display panel. A first planarization layer is disposed on the side of the color filter layer away from the substrate, and the first planarization layer covers the side of the first light-shielding portion near the cut surface.

2. The display panel according to claim 1, characterized in that, The first light-shielding portion includes a first edge near the side of the cut surface, and the distance between the first edge and the cut surface is greater than or equal to 50 micrometers and less than or equal to 150 micrometers.

3. The display panel according to claim 2, characterized in that, The light-shielding layer includes a second light-shielding portion disposed away from the cut surface, and the substrate includes a second edge close to the side of the cut surface; Wherein, the distance from the first edge to the cutting surface is greater than the distance from the second edge to the cutting surface.

4. The display panel according to claim 3, characterized in that, The thickness of the second light-shielding part is greater than the thickness of the first light-shielding part; Alternatively, the thickness of the second light-shielding part is equal to the thickness of the first light-shielding part.

5. The display panel according to claim 3, characterized in that, The thickness of the first flattening layer is less than or equal to the thickness of the second light-shielding portion.

6. The display panel according to any one of claims 1 to 5, characterized in that, In the direction from the substrate to the color filter layer, the area of ​​the film layer on the side of the display panel away from the substrate is smaller than the area of ​​the film layer on the side closer to the substrate.

7. The display panel according to any one of claims 1 to 5, characterized in that, The angle between the surface of the substrate facing the light-emitting device layer and / or the surface of the substrate facing the light-emitting device layer and the cut surface is an acute angle.

8. The display panel according to claim 7, characterized in that, The acute angle between the cut surface and the substrate ranges from 60° to 80°.

9. The display panel according to any one of claims 1 to 5, characterized in that, The display panel includes multiple organic layers, and at least one of the organic layers has a black material disposed on the side near the cut surface.

10. A display panel, characterized in that, include: Substrate; A light-emitting device layer is disposed on the substrate; as well as An encapsulation layer is disposed on the side of the light-emitting device layer away from the substrate; A color filter layer is disposed on the side of the encapsulation layer away from the substrate. The color filter layer includes a light-shielding layer and a plurality of color resist units embedded in the light-shielding layer. The light-shielding layer includes a first light-shielding portion disposed near the cut surface of the display panel. A first planarization layer is disposed on the side of the color filter layer away from the substrate, and the edge of the first planarization layer near the cut surface is on the same plane as the edge of the first light-shielding portion near the cut surface.

11. A display module, characterized in that, The display module includes a display panel as described in any one of claims 1 to 10 and a cover plate layer located on the display panel; The orthographic projection of the cut surface of the display panel onto the cover plate layer is located within the cover plate layer.

12. A mobile terminal, characterized in that, The mobile terminal includes a terminal body and a display module as described in claim 11, wherein the terminal body and the display module are combined into one unit.

Images