High-thermal-conductivity anti-sagging and anti-cracking thermal conductive gel and preparation method thereof

Abstract

The invention provides a high-thermal-conductivity anti-sagging and anti-cracking thermal conductive gel and a preparation method thereof, and the thermal conductive gel comprises the following components by weight: 80-95 parts of branched chain functionalized polydimethylvinyl silicone oil; 0.1 to 1 part of organic peroxide; 0.1-2 parts of a metal complexing agent; 0.1 to 2 parts of an isocyanate high polymer; 2000 to 3000 parts of a heat conduction filler; and 3-10 parts of a coupling agent. Branched chain functionalized polydimethylvinyl silicone oil is used as matrix resin and compositely filled with heat-conducting powder, and a vinyl-terminated part is subjected to cross-linking reaction to provide cohesion for the heat-conducting gel, so that the gel is prevented from cracking at high temperature and high pressure; according to the branched chain function key of the matrix resin, the matrix resin, the heat-conducting powder and the metal surface of the heating device are connected in series through the metal complexing agent and the isocyanate tackifier to generate chemical crosslinking, so that the heat-conducting gel can be stably used in a high-temperature and high-pressure working environment of a thermal interface gap, and sagging, slippage and cracking do not occur.

Description

Technical Field

[0001] This invention relates to the field of thermal conductive gel technology, specifically to a high thermal conductivity, anti-sagging and cracking thermal conductive gel and its preparation method. Background Technology

[0002] With the comprehensive and in-depth coverage of 5G base stations, the rapid increase in the popularity of new energy vehicles, and the rapid expansion of intelligent robot applications, human society has entered an era of full informatization and intelligence. Hardware devices in these cutting-edge high-tech fields are rapidly developing towards higher power density and higher integration. In this process, system heat dissipation design has become a key component directly affecting its performance, reliability, safety, and lifespan. The ever-increasing heat flux density and increasingly complex and variable working environments place higher demands on the long-term stability and reliability of thermal interface materials.

[0003] Thermal conductive gel, as a common thermal interface material, is widely used in filling the gaps between chips and heat sinks due to its advantages such as good wettability, low contact thermal resistance, and ease of automated dispensing. However, in practical applications, especially in harsh working environments with high temperature and humidity, the soft gel will gradually separate into oil and powder, and the material will slowly be squeezed out from the interface gap. This can lead to localized cracking or loss of thermal conductive material at the thermal interface, thus damaging the chip's heat dissipation system. Summary of the Invention

[0004] In view of the aforementioned problems, this application is made to provide a high thermal conductivity, anti-sagging, and crack-resistant thermally conductive gel and a method for preparing the same, which overcomes or at least partially solves the aforementioned problems, comprising: A high thermal conductivity, anti-sagging, and crack-resistant thermally conductive gel, comprising the following components by weight: 80-95 parts of branched functionalized polydimethylvinyl silicone oil; 0.1-1 part of organic peroxide; Metal complexing agent 0.1-2 parts; 0.1 to 2 parts of isocyanate polymers; 2000-3000 parts of thermally conductive filler; 3-10 parts of coupling agent.

[0005] Furthermore, the branched functionalized polydimethyl vinyl silicone oil includes one or more of the following: side-chain vinyl polydimethyl vinyl silicone oil, side-chain hydroxylated polydimethyl vinyl silicone oil, branched methoxylated polydimethyl vinyl silicone oil, and branched ethoxylated polydimethyl vinyl silicone oil.

[0006] Furthermore, the organic peroxide includes one or more of 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, dicumyl peroxide, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane and 2,4-dichlorobenzoyl peroxide.

[0007] Furthermore, the metal complexing agent includes one or more of ethylenediaminetetraacetic acid, hydroxyethylethylenediaminetriacetic acid, and hydroxyethylidene diphosphonic acid.

[0008] Furthermore, the isocyanate polymers include one or more of 1,3,5-tris[3-(trimethoxysilyl)propyl]-1,3,5-triazine-2,4,6(1H,3H,5H)-trione isocyanurate triglycidyl ester, 1,3,5-tris(2-hydroxyethyl) isocyanurate, and isocyanurate triacrylate.

[0009] Furthermore, the thermally conductive filler includes one or more of alumina, aluminum powder, aluminum nitride, silicon carbide, silicon nitride, diamond micro powder, zinc oxide, carbon fiber, carbon nanotubes, and graphene.

[0010] Furthermore, the coupling agent comprises one or more of the following: single-sided trimethoxy-terminated polydimethylsilane, γ-(methacryloyloxy)propyltrimethoxysilane, tridecafluorooctyltriethoxysilane, phthalate, trimethoxyphenylsilane, and tris(3-trimethoxysilylpropyl)cyclotriisocyanurate.

[0011] A method for preparing a high thermal conductivity, anti-sagging, and crack-resistant thermally conductive gel as described above includes the following steps: Weigh out the branched functionalized polydimethylvinyl silicone oil, organic peroxide, metal complexing agent, isocyanate polymer and thermally conductive filler according to the specified ratio; The branched functionalized polydimethyl vinyl silicone oil, the organic peroxide, the thermally conductive filler and the coupling agent are mixed and stirred at a first specified temperature. After cooling, a pre-cured thermally conductive gel is obtained. The metal complexing agent and the isocyanate polymer are added to the pre-cured thermally conductive gel to obtain the target high thermal conductivity and anti-sagging and cracking thermally conductive gel.

[0012] Furthermore, it also includes: The thermally conductive filler is vacuum stirred at a second specified temperature, cooled, and then dehydrated to obtain a dehydrated thermally conductive filler.

[0013] Furthermore, the first specified temperature is 80~110℃, and the second specified temperature is 100~120℃.

[0014] This application has the following advantages: In the embodiments of this application, in view of the problems of sagging, slippage, cracking and oil-powder separation that easily occur in the prior art under complex working environments, this application provides a solution of using branched functionalized polydimethyl vinyl silicone oil as the base resin composite filler thermal conductive powder, specifically: by weight, it includes the following components: 80-95 parts of branched functionalized polydimethyl vinyl silicone oil; 0.1-1 parts of organic peroxide; 0.1-2 parts of metal complexing agent; 0.1-2 parts of isocyanate polymer; 2000-3000 parts of thermal conductive filler; and 3-10 parts of coupling agent. By using branched functionalized polydimethyl vinyl silicone oil as the matrix resin and composite filling thermal conductive powder, the cross-linking reaction of the terminal vinyl portion provides cohesion for the thermal conductive gel, preventing the gel from cracking under high temperature and high pressure. The branched functional bonds of the matrix resin are connected in series with the matrix resin, thermal conductive powder, and metal surface of the heating device through metal complexing agents and isocyanate tackifiers, resulting in chemical cross-linking. This allows the thermal conductive gel to be used stably in the high temperature and high pressure working environment of the thermal interface gap without sagging, slippage, or cracking. Attached Figure Description

[0015] To more clearly illustrate the technical solution of this application, the drawings used in the description of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a flowchart illustrating the steps of a method for preparing a high thermal conductivity, anti-sagging, and crack-resistant thermally conductive gel according to an embodiment of this application. Detailed Implementation

[0017] To make the objectives, features, and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0018] The inventors, through analysis of existing technologies, discovered that current thermally conductive gels are gradually revealing their insufficient reliability. Periodic temperature fluctuations caused by changes in system operating conditions lead to continuous thermal expansion and contraction of the thermally conductive gel itself and its bonding interface. Under long-term effects, the material will be subjected to alternating stress, inducing mechanical fatigue. Under fatigue stress, the soft gel's internal physical structure may gradually deteriorate, resulting in oil-powder separation between the base polymer and the thermally conductive filler. Simultaneously, fatigue stress can also drive the material to be slowly squeezed out from the originally filled micro-gaps at the thermal interface. These problems collectively lead to localized cracking or complete loss of the thermally conductive material at the thermal interface, disrupting the effective heat conduction path between the chip and the heat sink, causing a sharp increase in contact thermal resistance, ultimately leading to chip overheating, performance degradation, or even damage, seriously threatening the stable operation of the entire electronic system.

[0019] One embodiment of this application provides a high thermal conductivity, anti-sagging, and crack-resistant thermally conductive gel, which, by weight, comprises the following components: 80-95 parts of branched functionalized polydimethylvinyl silicone oil; 0.1-1 part of organic peroxide; Metal complexing agent 0.1-2 parts; 0.1 to 2 parts of isocyanate polymers; 2000-3000 parts of thermally conductive filler; 3-10 parts of coupling agent.

[0020] In the embodiments of this application, addressing the problems of sagging, slippage, cracking, and oil-powder separation that easily occur in the prior art under complex working environments, this application provides a solution using branched functionalized polydimethylvinyl silicone oil as the matrix resin and composite filling thermal conductive powder. By using branched functionalized polydimethylvinyl silicone oil as the matrix resin and composite filling thermal conductive powder, the cross-linking reaction of the terminal vinyl portion provides cohesion for the thermal conductive gel, preventing the gel from cracking under high temperature and high pressure. The branched functional bonds of the matrix resin, through metal complexing agents and isocyanate tackifiers, connect the matrix resin, thermal conductive powder, and the metal surface of the heating device in series, resulting in chemical cross-linking. This allows the thermal conductive gel to be used stably under high temperature and high pressure working environments at the thermal interface gap, without sagging, slippage, or cracking.

[0021] The following will further describe a high thermal conductivity, anti-sagging, and crack-resistant thermally conductive gel in this exemplary embodiment.

[0022] In this embodiment, the branched functionalized polydimethyl vinyl silicone oil includes one or more of the following: side-chain vinyl polydimethyl vinyl silicone oil, side-chain hydroxylated polydimethyl vinyl silicone oil, branched methoxylated polydimethyl vinyl silicone oil, and branched ethoxylated polydimethyl vinyl silicone oil.

[0023] It should be noted that branched functionalized polydimethylvinyl silicone oil is a modified organosilicon polymer with polydimethylsiloxane as the main chain, branched functional groups grafted onto the silicon atoms of the main chain, and vinyl groups introduced at the ends of the molecular chain.

[0024] The vinyl groups at the ends of the molecular chains of branched functionalized polydimethylvinyl silicone oil can undergo partial cross-linking reactions to form a mildly cross-linked three-dimensional network structure. This structure retains the flexibility of the thermally conductive gel, which can fill the gaps at thermal interfaces, while providing sufficient cohesion to resist the shrinkage-expansion stress caused by temperature cycling, preventing the material from cracking due to mechanical fatigue, and preventing the gel from sagging or slipping under high temperature and pressure.

[0025] The side functional bonds on the main chain can chemically interact with the surface groups of the thermally conductive powder and the hydroxyl groups on the metal surface of the heating device through metal complexing agents and isocyanate thickeners to form chemical bonds, thereby firmly linking the matrix resin, thermally conductive powder and metal interface together.

[0026] This chemical cross-linking process differs from traditional physical mixing. It can effectively suppress the separation of oil and powder between the thermally conductive powder and the organosilicon matrix, while preventing the material from being squeezed out of the interfacial gap, thus ensuring the integrity of the thermal interface and the stability of the thermal conductivity.

[0027] In this embodiment, the organic peroxide includes one or more of 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, dicumyl peroxide, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane and 2,4-dichlorobenzoyl peroxide.

[0028] It should be noted that organic peroxides, as crosslinking initiators, play a crucial role in decomposing under heating conditions to generate free radicals. These radicals then initiate partial crosslinking reactions of the vinyl groups at the ends of the branched functionalized polydimethylvinyl silicone oil molecular chains, forming a mild three-dimensional network structure. This provides cohesion for the thermally conductive gel, preventing gel cracking and sagging under high temperature and pressure. Different types of organic peroxides have different decomposition temperatures and crosslinking efficiencies, and can be selected based on the temperature conditions of the preparation process and the required cohesion of the gel.

[0029] In this embodiment, the metal complexing agent includes one or more of ethylenediaminetetraacetic acid, hydroxyethylethylenediaminetriacetic acid, and hydroxyethylidene diphosphonic acid.

[0030] It should be noted that the metal complexing agent works by forming a complex with the metal ions on the metal surface of the heating device through the coordinating groups in its molecule. At the same time, it interacts with the branched functional bonds of branched functionalized polydimethyl vinyl silicone oil and isocyanate polymers to enhance the interfacial bonding force and inhibit gel slip and extrusion.

[0031] In this embodiment, the isocyanate polymer includes one or more of 1,3,5-tris[3-(trimethoxysilyl)propyl]-1,3,5-triazine-2,4,6(1H,3H,5H)-trione isocyanurate triglycidyl ester, 1,3,5-tris(2-hydroxyethyl) isocyanurate and isocyanurate triacrylate.

[0032] It should be noted that isocyanate polymers, as thickening and crosslinking agents, can chemically crosslink with the branched functional bonds of branched functionalized polydimethyl vinyl silicone oil and the active groups of metal complexing agents through the isocyanate groups (-NCO) in their molecules. At the same time, they can form chemical bonds with the hydroxyl groups on the surface of thermally conductive powders, thereby improving the gel's anti-sagging and anti-cracking properties.

[0033] In this embodiment, the thermally conductive filler includes one or more of the following: alumina, aluminum powder, aluminum nitride, silicon carbide, silicon nitride, diamond micro powder, zinc oxide, carbon fiber, carbon nanotubes, and graphene.

[0034] It should be noted that the thermally conductive filler is filled into the branched functionalized polydimethyl vinyl silicone oil matrix to construct continuous heat conduction channels and reduce thermal resistance. Different thermally conductive fillers have different thermal conductivity, particle size and morphology. The use of compound fillers can optimize the packing density, reduce interfacial voids and further improve thermal conductivity, while not affecting the gel's anti-sagging and anti-cracking properties.

[0035] In this embodiment, the coupling agent includes one or more of the following: single-sided trimethoxy-terminated polydimethylsilane, γ-(methacryloyloxy)propyltrimethoxysilane, tridecafluorooctyltriethoxysilane, phthalate, trimethoxyphenylsilane, and tris(3-trimethoxysilylpropyl)cyclotriisocyanurate.

[0036] It should be noted that coupling agents can improve the interfacial compatibility between thermally conductive fillers and branched functionalized polydimethyl vinyl silicone oil matrix, reduce interfacial thermal resistance, and enhance the bonding force between powder and matrix, avoiding oil-powder separation and gel cracking caused by interfacial separation during temperature cycling; the functional groups of coupling agents can react with hydroxyl groups on the powder surface and branched functional bonds of matrix resin to form chemical bonds.

[0037] Reference Figure 1 This application illustrates a method for preparing a high thermal conductivity, anti-sagging, and crack-resistant thermally conductive gel according to an embodiment of the present application, comprising the following steps: S110. Weigh out the branched functionalized polydimethylvinyl silicone oil, organic peroxide, metal complexing agent, isocyanate polymer and thermally conductive filler according to the specified ratio; S120. The branched functionalized polydimethylvinyl silicone oil, the organic peroxide, the thermally conductive filler and the coupling agent are mixed and stirred at a first specified temperature. After cooling, a pre-cured thermally conductive gel is obtained. S130. The metal complexing agent and the isocyanate polymer are added to the pre-cured thermally conductive gel to obtain the target high thermal conductivity and anti-sagging cracking thermally conductive gel.

[0038] The preparation method of a high thermal conductivity, anti-sagging, and crack-resistant thermally conductive gel in this exemplary embodiment will be further described below.

[0039] In one embodiment of the present invention, the specific process of "weighing branched functionalized polydimethyl vinyl silicone oil, organic peroxide, metal complexing agent, isocyanate polymer and thermally conductive filler according to the specified ratio" in step S110 can be further described in conjunction with the following description.

[0040] As an example, weigh out 90 parts of branched functionalized polydimethyl vinyl silicone oil, 1 part of organic peroxide, 2500 parts of thermally conductive filler, 7 parts of coupling agent, 1 part of metal complexing agent and 1 part of isocyanate polymer.

[0041] In one embodiment of the present invention, the specific process of step S120, which involves "mixing the branched functionalized polydimethyl vinyl silicone oil, the organic peroxide, the thermally conductive filler and the coupling agent, stirring at a first specified temperature, and obtaining a pre-cured thermally conductive gel after cooling", can be further described in conjunction with the following description.

[0042] It is important to note that mixing must ensure uniform dispersion of all components to prevent the thermally conductive filler from agglomerating and affecting the construction of thermally conductive channels. The first specified temperature is the critical temperature for the organic peroxide to initiate the crosslinking of the vinyl end portions of the branched functionalized polydimethylvinyl silicone oil. This temperature range balances the crosslinking rate and degree, ensuring the formation of a pre-cured gel with sufficient cohesion without causing excessive crosslinking and gel embrittlement. Vacuum stirring removes air bubbles generated during mixing, improves the density of the pre-cured gel, and ensures the morphological stability of the gel after cooling, preventing component separation when other components are added subsequently.

[0043] As an example, the branched functionalized polydimethyl vinyl silicone oil, organic peroxide, thermally conductive filler and coupling agent weighed above are mixed and stirred evenly, heated to 80~110℃ and stirred under vacuum, and then cooled to obtain a pre-cured thermally conductive gel.

[0044] In one embodiment of the present invention, the specific process of step S130, "adding the metal complexing agent and the isocyanate polymer to the pre-cured thermally conductive gel to obtain the target high thermal conductivity and anti-sagging and cracking thermally conductive gel," can be further described in conjunction with the following description.

[0045] It should be noted that the subsequent addition of metal complexing agents and isocyanate polymers is to prevent these two types of components from reacting prematurely during the high-temperature stirring process in step S120, and to ensure that they fully interact with the pre-cured gel at room temperature or lower temperature.

[0046] As an example, a metal complexing agent and an isocyanate polymer are added to the pre-cured thermal conductive gel in step S120 and stirred evenly to obtain an anti-sagging and cracking thermal conductive gel.

[0047] In this embodiment, it also includes: The thermally conductive filler is vacuum stirred at a second specified temperature, cooled, and then dehydrated to obtain a dehydrated thermally conductive filler.

[0048] It should be noted that the purpose of dehydration is to remove the water adsorbed on the surface of the thermally conductive filler, so as to avoid the water from generating bubbles during the subsequent high-temperature stirring process, which would affect the density and thermal conductivity of the gel; at the same time, it can prevent water from reacting with isocyanate polymers, ensuring that their interfacial cross-linking function works properly.

[0049] As an example, one or more of alumina, aluminum powder, aluminum nitride, silicon carbide, silicon nitride, diamond micro powder, zinc oxide, carbon fiber, carbon nanotubes, and graphene are mixed and placed in a high-temperature oven at 100~120℃ to perform deep dehydration treatment on the thermally conductive powder, thereby obtaining a dehydrated mixed powder.

[0050] Example 1 1. Mix 1200 parts of aluminum nitride powder with a medium particle size of 100 μm, 400 parts of alumina powder with a medium particle size of 45 μm, 500 parts of alumina powder with a medium particle size of 5 μm, and 400 parts of zinc oxide powder with a medium particle size of 0.5 μm in a certain proportion, and place them in a high-temperature oven at 120℃ to remove water, so as to obtain dehydrated mixed powder A1. 2. Mix 91 parts of branched methoxylated polydimethyl vinyl silicone oil, 1 part of dicumyl peroxide, 2500 parts of A1 dehydrated mixed powder, and 7 parts of single-sided trimethoxy-terminated polydimethylsilane according to the specified ratio, heat to 80~110℃ and stir under vacuum, and obtain pre-cured thermally conductive gel B1 after cooling. 3. Add 0.5 parts of ethylenediaminetetraacetic acid and 0.5 parts of 1,3,5-tris[3-(trimethoxysilyl)propyl]-1,3,5-triazine-2,4,6(1H,3H,5H)-trione isocyanurate triglycidyl ester to the pre-cured thermal conductive gel B1 in step (2), and stir evenly to obtain anti-sagging and cracking thermal conductive gel C1.

[0051] Example 2 1. Mix 1200 parts of diamond micro powder with a medium particle size of 100 μm, 400 parts of alumina powder with a medium particle size of 45 μm, 500 parts of alumina powder with a medium particle size of 5 μm, and 400 parts of alumina powder with a medium particle size of 0.5 μm in a certain proportion, and place them in a high-temperature oven at 120℃ to remove water, so as to obtain dehydrated mixed powder A2. 2. Mix 90 parts of branched ethoxylated polydimethyl vinyl silicone oil, 1 part of 2,4-dichlorobenzoyl peroxide, 2500 parts of A1 dehydrated mixed powder, and 7 parts of phthalate coupling agent according to the specified ratio, heat to 80~110℃ and stir under vacuum, and obtain pre-cured thermally conductive gel B2 after cooling. 3. Add 1 part of hydroxyethylidene diphosphonic acid and 1 part of isocyanuric acid triacrylate to the pre-cured thermal conductive gel B2 in step (2), stir evenly, and obtain anti-sagging and cracking thermal conductive gel C2.

[0052] Comparative Example 1: 1. Mix 1200 parts of diamond micro powder with a medium particle size of 100 μm, 400 parts of alumina powder with a medium particle size of 45 μm, 500 parts of alumina powder with a medium particle size of 5 μm, and 400 parts of alumina powder with a medium particle size of 0.5 μm in a certain proportion, and place them in a high temperature oven at 120℃ to remove water, so as to obtain dehydrated mixed powder A3. 2. Mix 91 parts of branched ethoxylated polydimethyl vinyl silicone oil, 1 part of 2,4-dichlorobenzoyl peroxide, 2500 parts of A1 dehydrated mixed powder, and 7 parts of phthalate coupling agent according to the specified ratio, heat to 80~110℃ and stir under vacuum, and obtain pre-cured thermally conductive gel B3 after cooling. 3. Add 1 part of 3,5-tris[3-(trimethoxysilyl)propyl]-1,3,5-triazine-2,4,6(1H,3H,5H)-trione isocyanurate triglycidyl ester to the pre-cured thermal conductive gel B3 in step (2), and stir evenly to obtain anti-sagging and cracking thermal conductive gel C3.

[0053] The above embodiments underwent ASTM5470 thermal conductivity testing and reliability testing. The reliability test and test fixture were subjected to aging tests as follows: High thermal conductivity gel was applied to the center of a square aluminum plate using a dispensing machine. A 1mm thick pad was added around the perimeter of the aluminum plate. A glass plate was then clamped onto the applied thermal conductivity gel. The assembled fixture was placed in a 150℃ high-temperature furnace, a -40~125℃ rapid temperature change chamber, and a high-temperature (85℃) high-humidity (85%) aging chamber for testing. The results are shown in Table 1.

[0054] Table 1 Comparing the test data of the above embodiments, Examples 1 and 2 used peroxide crosslinking to enhance cohesion, while adding metal complexing agents and polyisocyanate tackifiers to promote the adhesion strength between the thermally conductive gel and the metal surface. After high temperature testing, rapid temperature change testing, and high temperature and high humidity testing, the thermally conductive gel did not show obvious sagging or cracking, and had good reliability. In contrast, Comparative Example 3 did not add metal complexing agents. The thermally conductive gel could not resist high temperature and rapid temperature change testing by relying solely on its own cohesion. In a high temperature and humidity environment, the material sagging occurred. Due to the different sagging speeds of the gel in the gaps, the colloid tearing caused the prepolymerized gel to crack, which further deteriorated the heat dissipation system pathway.

[0055] Although preferred embodiments of the present application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of the present application.

[0056] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0057] The above provides a detailed description of a high thermal conductivity, anti-sagging, and crack-resistant thermally conductive gel and its preparation method. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A high thermal conductivity, anti-sagging, and crack-resistant thermally conductive gel, characterized in that, By weight, it includes the following components: 80-95 parts of branched functionalized polydimethylvinyl silicone oil; 0.1-1 part of organic peroxide; Metal complexing agent 0.1-2 parts; 0.1 to 2 parts of isocyanate polymers; 2000-3000 parts of thermally conductive filler; 3-10 parts of coupling agent.

2. The high thermal conductivity, anti-sagging, and crack-resistant thermally conductive gel according to claim 1, characterized in that, The branched functionalized polydimethyl vinyl silicone oil includes one or more of the following: side-chain vinyl polydimethyl vinyl silicone oil, side-chain hydroxylated polydimethyl vinyl silicone oil, branched methoxylated polydimethyl vinyl silicone oil, and branched ethoxylated polydimethyl vinyl silicone oil.

3. The high thermal conductivity, anti-sagging, and crack-resistant thermally conductive gel according to claim 1, characterized in that, The organic peroxides include one or more of 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, dicumyl peroxide, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane and 2,4-dichlorobenzoyl peroxide.

4. The high thermal conductivity, anti-sagging, and crack-resistant thermally conductive gel according to claim 1, characterized in that, The metal complexing agent includes one or more of ethylenediaminetetraacetic acid, hydroxyethylethylenediaminetriacetic acid, and hydroxyethylidene diphosphonic acid.

5. The high thermal conductivity, anti-sagging, and crack-resistant thermally conductive gel according to claim 1, characterized in that, The isocyanate polymers include one or more of 1,3,5-tris[3-(trimethoxysilyl)propyl]-1,3,5-triazine-2,4,6(1H,3H,5H)-trione isocyanurate triglycidyl ester, 1,3,5-tris(2-hydroxyethyl) isocyanurate and isocyanurate triacrylate.

6. The high thermal conductivity, anti-sagging, and crack-resistant thermally conductive gel according to claim 1, characterized in that, The thermally conductive filler includes one or more of the following: alumina, aluminum powder, aluminum nitride, silicon carbide, silicon nitride, diamond micro powder, zinc oxide, carbon fiber, carbon nanotubes, and graphene.

7. The high thermal conductivity, anti-sagging, and crack-resistant thermally conductive gel according to claim 1, characterized in that, The coupling agent includes one or more of the following: single-sided trimethoxy-terminated polydimethylsilane, γ-(methacryloyloxy)propyltrimethoxysilane, tridecafluorooctyltriethoxysilane, phthalate, trimethoxyphenylsilane, and tris(3-trimethoxysilylpropyl)cyclotriisocyanurate.

8. A method for preparing a high thermal conductivity, anti-sagging, and crack-resistant thermally conductive gel as described in any one of claims 1 to 7, characterized in that, Including the following steps: Weigh out the branched functionalized polydimethylvinyl silicone oil, organic peroxide, metal complexing agent, isocyanate polymer and thermally conductive filler according to the specified ratio; The branched functionalized polydimethyl vinyl silicone oil, the organic peroxide, the thermally conductive filler and the coupling agent are mixed and stirred at a first specified temperature. After cooling, a pre-cured thermally conductive gel is obtained. The metal complexing agent and the isocyanate polymer are added to the pre-cured thermally conductive gel to obtain the target high thermal conductivity and anti-sagging and cracking thermally conductive gel.

9. The preparation method according to claim 8, characterized in that, Also includes: The thermally conductive filler is vacuum stirred at a second specified temperature, cooled, and then dehydrated to obtain a dehydrated thermally conductive filler.

10. The preparation method according to claim 9, characterized in that, The first specified temperature is 80~110℃, and the second specified temperature is 100~120℃.

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