Dry type floor heating module and floor composite construction method

Abstract

The invention discloses a dry type floor heating module and floor composite construction method, and belongs to the technical field of building heating engineering, the construction method comprises the following steps: processing a structural floor base layer, and ensuring the flatness of the structural floor base layer; a cement-based self-leveling material is poured on the structural floor slab to form a cement-based self-leveling layer; bonding a dry type floor heating composite module on the cement-based self-leveling layer; floor heating pipes are mounted and laid in the clamping grooves in the dry type floor heating composite modules; a calcium silicate board layer is glued on the dry-type floor heating composite module; and a ground decoration layer is paved on the calcium silicate board layer. By the adoption of the dry type floor heating composite module, the contradiction between energy saving and quick heating is unified, and low heat loss and high-efficiency heating are achieved; through a self-leveling precise leveling and point frame method efficient bonding process, the high bearing capacity and the low heave rate of the ground are ensured while rapid assembly is achieved; and meanwhile, a calcium silicate board layer point-bonding anti-cracking system effectively absorbs thermal stress, and the service life of the system is remarkably prolonged.

Description

Technical Field

[0001] This invention belongs to the field of building heating engineering technology, and in particular relates to a method for constructing a dry underfloor heating module and floor composite. Background Technology

[0002] With the mandatory implementation of the "Evaluation Standard for Prefabricated Buildings" GB / T51129-2017, the requirement for the prefabrication rate of new buildings has been raised to over 50%. Dry construction methods for flooring can earn 6 points, while pipeline separation can earn 4-6 points. Dry underfloor heating, due to its conformity with the prefabricated concept of "modularization and minimal wet operation," has become the mainstream choice in the industry. However, current traditional dry underfloor heating technology suffers from three core contradictions that have long remained unresolved, severely restricting its application effectiveness: I. The inherent contradiction between thermal insulation performance and thermal conductivity efficiency Traditional dry underfloor heating modules mostly adopt a simple composite structure of "ordinary EPS insulation layer (thermal conductivity ≥0.042W / (m·K) + aluminum foil thermal conductive layer": if the insulation layer is thickened to reduce heat loss (floor heat transfer loss rate ≥20%), the heat conduction path will be lengthened, resulting in a slow indoor heating rate (it takes more than 4 hours to reach 22℃); if the insulation layer is thinned to improve thermal conductivity, heat will be severely lost downwards, and the energy utilization rate will be ≤75%, forming a technical dilemma of "energy saving and rapid heating cannot be achieved at the same time".

[0003] II. The contradiction between structural stability and construction efficiency In pursuit of construction speed, existing dry underfloor heating systems often employ "dry-lay splicing" or "partial spot bonding" techniques, with module bonding areas ≤25%. This results in an overall floor load-bearing capacity of ≤2.5kN / m, and after long-term use, the module displacement rate is ≥8%, leading to floor hollowing and cracking of the decorative layer. If a full bonding process is used to improve stability, the construction time per square meter is ≥40 minutes, which contradicts the core requirement of "efficient assembly" in prefabricated buildings and fails to balance the dual requirements of "fast construction" and "high load-bearing capacity".

[0004] III. The contradiction between crack resistance and compatibility with decorative layer Traditional dry underfloor heating systems typically use a single layer of gypsum board or cement pressure board (thickness ≤12mm) as the surface protective layer. Due to the mismatch between the material's thermal expansion coefficient and the temperature difference (≥50℃) of the underfloor heating pipes, the cracking rate of the board surface is ≥12% after long-term heating, which in turn leads to a cracking rate of ≥10% for decorative layers such as ceramic tiles and wood flooring. The cracking problem is particularly prominent in low-temperature areas in the north (where the indoor and outdoor temperature difference in winter is ≥30℃), requiring frequent repairs and seriously affecting the user experience and the lifespan of the system.

[0005] While existing technologies offer solutions for addressing specific pain points (such as increasing the density of insulation materials or increasing the thickness of boards), none have formed a systematic solution encompassing "insulation, thermal conductivity, load-bearing capacity, crack resistance, and construction," nor have they broken through the industry's bias that "multi-layer boards must be thickened and high thermal conductivity must compromise insulation."

[0006] Therefore, there is an urgent need to design a method for combining dry underfloor heating modules with flooring to solve the problems mentioned above. Summary of the Invention

[0007] The purpose of this invention is to provide a method for constructing a dry underfloor heating module and flooring composite, which has the advantages of balancing energy saving and rapid heating, reducing the hollow rate and extending the service life of the system, and solves the problems mentioned in the background art.

[0008] To achieve the above objectives, the specific technical solution of the present invention for a dry underfloor heating module and floor composite construction method is as follows: A method for constructing a dry underfloor heating module combined with flooring includes the following steps: S1. Treatment of the base layer of the structural floor slab to ensure the flatness of the base layer of the structural floor slab; S2. Pour cement-based self-leveling material into the structural floor slab to form a cement-based self-leveling layer; S3. Adhere the dry underfloor heating composite module to the cement-based self-leveling layer; S4. Install and lay the underfloor heating pipes in the slots on the dry underfloor heating composite module; S5. Adhere the calcium silicate board layer to the dry underfloor heating composite module; S6. Lay a floor decorative layer on the calcium silicate board layer.

[0009] Furthermore, S1 also includes the following steps: S11. Mechanically grind and clean the surface of the structural floor slab to thoroughly remove floating dust, oil stains and loose layers; S12. Repair the cracks in the base layer of the structural floor slab with epoxy resin mortar; S13. High-pressure grouting is used to treat hollow areas to ensure that the base layer is solid, free of hollow areas and cracks; S14. Use an infrared flatness tester for acceptance testing to control the flatness error of the base layer and provide a precise and flat foundation for subsequent construction.

[0010] Furthermore, S2 also includes the following steps: S21. High-strength cement-based self-leveling material is selected, mixed with water, and poured using a mechanical pump. The construction thickness is controlled at 3-5mm. S22. During the pouring process, a defoaming roller is used to roll back and forth to remove air and ensure that the surface of the self-leveling layer is dense, free of air bubbles and pitting. S23. After construction is completed, maintenance shall be carried out.

[0011] Furthermore, in S3, the dry underfloor heating composite module includes a high-density EPS insulation layer and an aluminum heat-conducting plate. The high-density EPS insulation layer is bonded to the cement-based self-leveling layer, and the aluminum heat-conducting plate is composited with the high-density EPS insulation layer by hot melt adhesive.

[0012] Furthermore, in S4, the card slot is located on an aluminum heat-conducting plate.

[0013] Furthermore, S3 also includes the following steps: S31. Apply polymer-modified adhesive mortar to the dry underfloor heating composite module using a dot-and-frame method; S32. Lay the dry underfloor heating composite module with the mortar applied flat on the cement-based self-leveling layer. S33. Then tap and adjust with a rubber mallet to ensure that the dry underfloor heating composite module is tightly bonded to the cement-based self-leveling layer; S34. After the paving is completed, maintenance shall be carried out.

[0014] Furthermore, in S5, the calcium silicate board layer includes a first calcium silicate board, a fiberglass mesh, and a second calcium silicate board. The first calcium silicate board is bonded to the dry underfloor heating composite module by multiple first adhesive dots, the fiberglass mesh is laid on the first calcium silicate board, and the second calcium silicate board is bonded to the fiberglass mesh by multiple second adhesive dots.

[0015] Furthermore, S5 also includes the following steps: S51. Use neutral silicone structural adhesive to tightly bond the first calcium silicate board to the dry underfloor heating composite module. S52. Lay fiberglass mesh on the surface of the first calcium silicate board and fix it with structural adhesive dots; S53. Use neutral silicone structural adhesive to tightly bond the second calcium silicate board to the fiberglass mesh.

[0016] Furthermore, the first calcium silicate board and the second calcium silicate board are laid in a staggered manner.

[0017] Furthermore, after the first and second calcium silicate boards are laid, all board joints are filled with elastic sealant.

[0018] This invention has the following advantages: First, by adopting a dry underfloor heating composite module, the contradiction between energy saving and rapid heating is resolved, achieving low heat loss and high-efficiency heating. Second, through self-leveling precision leveling and point-frame method efficient bonding process, construction efficiency and structural stability are perfectly balanced, ensuring high load-bearing capacity and low hollow rate of the ground while assembling quickly. Finally, the innovative calcium silicate board layer point-bonding crack-resistant system effectively absorbs thermal stress, fundamentally improving crack resistance and compatibility with decorative layers, and significantly extending the service life of the system. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the composite structure of the dry underfloor heating module and the floor of the present invention; The markings in the diagram are as follows: 1. Structural floor slab; 2. Cement-based self-leveling layer; 3. Dry underfloor heating composite module; 4. Card slot; 5. Underfloor heating pipe; 6. First calcium silicate board; 7. Second calcium silicate board; 8. Floor decoration layer. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Those skilled in the art will understand that although some embodiments herein include certain features included in other embodiments but not others, combinations of features from different embodiments are intended to be within the scope of the invention and form different embodiments. For example, in the claims, any of the claimed embodiments can be used in any combination.

[0022] The following is a reference to the appendix. Figure 1 This invention describes a method for constructing a dry underfloor heating module combined with flooring.

[0023] While existing technologies offer solutions for addressing specific pain points (such as increasing the density of insulation materials or increasing the thickness of boards), none have formed a systematic solution encompassing "insulation-thermal conductivity and load-bearing capacity-crack resistance-construction," nor have they overcome the industry's bias that "multi-layer boards must be thicker and high thermal conductivity must compromise insulation." Therefore, this dry underfloor heating module and floor composite installation device includes: Structural floor slab 1; Specifically, the surface of structural floor slab 1 is mechanically ground and cleaned to remove floating dust, oil stains and loose layers; epoxy resin mortar is used to repair cracks in the base layer (width ≥ 0.3mm), and high-pressure grouting is used to treat hollow areas to ensure that there are no hollow areas or cracks in the base layer.

[0024] Furthermore, an infrared flatness detector is used for acceptance testing to control the flatness error of the structural floor slab base layer to ≤2mm / 2m, providing a precise foundation for subsequent self-leveling layer construction and avoiding uneven stress on the modules due to uneven base layer.

[0025] Cement-based self-leveling layer 2 is laid on structural floor slab 1; Specifically, the cement-based self-leveling layer 2 uses high-strength cement-based self-leveling material with a compressive strength ≥20MPa. After mixing with water, it is poured using a mechanical pump, and the construction thickness is controlled at 3-5mm.

[0026] Furthermore, during the pouring process, defoaming rollers are used to vent air, ensuring that the surface of the self-leveling layer is free of bubbles and pitting. Its flowability is tested to be ≥130mm (tested according to GB / T 28638-2012 standard), and the surface flatness error after 24 hours of curing is ≤1mm / 2m, providing a high-precision reference surface for the installation of underfloor heating modules.

[0027] Dry underfloor heating composite module 3 is bonded to cement-based self-leveling layer 2; Specifically, the dry underfloor heating composite module 3 is a prefabricated composite module with dimensions of 600mm x 1200mm. The dry underfloor heating composite module 3 includes: High-density EPS insulation layer is bonded to cement-based self-leveling layer 2; Specifically, the closed-cell rate of the high-density EPS insulation layer is ≥95%, and the thermal conductivity is ≤0.035W / (mK).

[0028] The high-density EPS insulation layer is bonded to the cement-based self-leveling layer 2 by polymer-modified bonding mortar. Specifically, the tensile bond strength of the polymer-modified bonding mortar is ≥1.0MPa.

[0029] Apply polymer-modified bonding mortar using the dot-frame method. Specifically, apply a mortar frame with a width of 30mm and a thickness of 5mm to the edge of the dry underfloor heating composite module 3. Inside, set mortar dots with a diameter of 50mm at 200mm x 200mm intervals to ensure that the bonding area is ≥40%. Lay the dry underfloor heating composite module 3 flat on the cement-based self-leveling layer 2 and use a rubber mallet to tap and level it. Control the module splicing joints to be ≥2mm. After curing for 24 hours, proceed with subsequent construction.

[0030] The aluminum heat-conducting plate is composited with a high-density EPS insulation layer using hot melt adhesive. Specifically, the aluminum heat-conducting plate is 0.3mm thick.

[0031] Slot 4 is located on dry underfloor heating composite module 3; Specifically, the card slot 4 is formed on an aluminum heat-conducting plate, and the depth of the card slot 4 is 20mm and the width is 20mm.

[0032] The slot 4 includes a vertical section and an elbow section. Adjacent vertical sections are connected by corresponding elbow sections, and adjacent elbow sections are connected by corresponding vertical sections. The distance between adjacent vertical sections is 200mm.

[0033] Underfloor heating pipe 5 is embedded in slot 4; Specifically, the underfloor heating pipe 5 is an S5 grade PE-RT underfloor heating pipe (nominal outer diameter 20mm, wall thickness 2.0mm), which is embedded in the groove 4 at 200mm intervals; After the installation is completed, a water pressure test is conducted on the underfloor heating pipe 5. The test pressure is 0.8MPa, and the pressure drop is ≤0.05MPa after 30 minutes to ensure that there is no leakage in the pipe.

[0034] The calcium silicate board layer is bonded to the dry underfloor heating composite module 3 by multiple first adhesive dots; Specifically, the calcium silicate liner includes: The first calcium silicate board 6 is bonded to the dry underfloor heating composite module 3 by multiple first adhesive dots; Specifically, the first calcium silicate board 6 has a thickness of 15mm and a density ≥1.2g / cm³. 3 Flexural strength ≥12 MPa; The first adhesive dot is a neutral silicone structural adhesive, applied at 300mm x 300mm intervals. The diameter of the first adhesive dot is 30mm and the thickness is 3mm. When applying the adhesive, ensure that the first calcium silicate board 6 and the dry underfloor heating composite module 3 are tightly bonded, and control the board gap width between 3-5mm.

[0035] Fiberglass mesh is laid on the first calcium silicate board 6; Specifically, the fiberglass mesh is 80g / ㎡ alkali-resistant fiberglass mesh with an overlap width of ≥100mm, and is fixed by structural adhesive dots to enhance interlayer crack resistance.

[0036] The second calcium silicate board 7 is bonded to the fiberglass mesh through multiple second adhesive dots.

[0037] Specifically, the second calcium silicate board 7 has a thickness of 8 mm and a density ≥ 1.2 g / cm³. 3 Flexural strength ≥12 MPa; The second adhesive dot is a neutral silicone structural adhesive, applied at 300mm x 300mm intervals. The diameter of the second adhesive dot is 30mm and the thickness is 3mm. The position of the second adhesive dot is staggered from the position of the first adhesive dot by ≥50mm to avoid overlapping adhesive dots that could cause stress concentration on the board.

[0038] Specifically, the second calcium silicate board 7 and the first calcium silicate board 6 are laid in a staggered manner, and the width of the staggered joint between the second calcium silicate board 7 and the first calcium silicate board 6 is not less than 1 / 2 of the board length.

[0039] Elastic sealant is used to fill the gap between the first calcium silicate board 6 and the second calcium silicate board 7, so that the surface of the sealant is flush with the board. After curing for 72 hours, the floor decoration layer is applied.

[0040] Floor decorative layer 8 is laid on top of the calcium silicate board layer.

[0041] Specifically, the floor decoration layer 8 is made of ceramic tile or wood flooring, and the floor decoration layer 8 is laid on the second calcium silicate board 7 using flexible ceramic tile adhesive.

[0042] The flexible tile adhesive used is C2T grade flexible tile adhesive (according to GB / T 25181-2019 standard). It is applied using a 6mm x 6mm notched trowel at a 45° angle, with the adhesive layer thickness controlled at 4-6mm. When laying the floor decoration layer, use a laser positioning instrument to control the width of the tile joints to 2-3mm to ensure that the flatness error of the floor decoration layer is ≤2mm / 2m; after the tiles are laid, fill the joints 24 hours later with anti-mildew grout (stain resistance ≥4 level), and clean and maintain them 48 hours later.

[0043] The method for installing dry underfloor heating modules and flooring together, using the aforementioned installation device, also includes the following steps: S1. Treatment of the base layer of structural floor slab 1 to ensure the flatness of the base layer of structural floor slab 1; S1 also includes the following steps: S11. Mechanically grind and clean the surface of structural floor slab 1 to thoroughly remove floating dust, oil stains and loose layers; S12. Repair the cracks in the base layer of structural floor slab 1 with epoxy resin mortar. Specifically, epoxy resin mortar is used to repair base layer cracks with a width of ≥0.3mm.

[0044] S13. High-pressure grouting is used to treat hollow areas to ensure that the base layer is solid, free of hollow areas and cracks; S14. Use an infrared flatness detector for acceptance testing to control the flatness error of the base layer and provide a precise and flat foundation for subsequent construction. Specifically, the flatness error of the base layer should be controlled to be ≤2mm / 2m.

[0045] S2. Pour cement-based self-leveling material onto the structural floor slab 1 to form a cement-based self-leveling layer 2; S2 also includes the following steps: S21. High-strength cement-based self-leveling material is selected, mixed with water, and poured using a mechanical pump. The construction thickness is controlled at 3-5mm. S22. During the pouring process, a defoaming roller is used to roll back and forth to remove air and ensure that the surface of the self-leveling layer is dense, free of air bubbles and pitting. S23. After construction is completed, maintenance shall be carried out; Specifically, after construction is completed and cured for 24 hours under standard conditions, the surface flatness error should be ≤1mm / 2m during acceptance, and the flowability should be ≥130mm according to GB / T 28638-2012 standard.

[0046] S3. Adhere the dry underfloor heating composite module 3 onto the cement-based self-leveling layer 2; S3 also includes the following steps: S31. Apply polymer-modified bonding mortar to the dry underfloor heating composite module 3 using a dot-and-frame method; Specifically, first apply a mortar frame with a width of 30mm and a thickness of 5mm to the edge of the dry underfloor heating composite module 3, and then set mortar dots with a diameter of 50mm inside the dry underfloor heating composite module 3 at a spacing of 200mm×200mm to ensure that the total bonding area is ≥40%.

[0047] S32. Lay the dry underfloor heating composite module 3, which has been coated with mortar, on the cement-based self-leveling layer 2. S33. Then tap and adjust with a rubber hammer to ensure that the dry underfloor heating composite module 3 and the cement-based self-leveling layer 2 are tightly bonded. Specifically, the joint gap between the dry underfloor heating composite modules 3 should not be less than 2mm.

[0048] S34. After the laying is completed, curing shall be carried out; Specifically, after the paving is completed, it needs to be cured for 24 hours before the next process can be carried out.

[0049] S4. Install and lay the underfloor heating pipes 5 in the slots 4 on the dry underfloor heating composite module 3; After the pipeline is laid, a water pressure test is conducted. The test pressure is 0.8 MPa, and the pressure is maintained for 30 minutes. The pressure drop should not exceed 0.05 MPa to be considered qualified, thus ensuring that there is no leakage in the pipeline system.

[0050] S5. Adhere the calcium silicate board layer onto the dry underfloor heating composite module 3. S5 also includes the following steps: S51. Use neutral silicone structural adhesive to tightly bond the first calcium silicate board 6 to the dry underfloor heating composite module 3. Specifically, neutral silicone structural adhesive (tensile strength ≥ 1.5 MPa) is used for spot bonding at a spacing of 300 mm × 300 mm, with each adhesive dot having a diameter of 30 mm and a thickness of 3 mm.

[0051] S52. Fiberglass mesh is laid on the surface of the first calcium silicate board 6 and fixed with structural adhesive dots; Specifically, the fiberglass mesh fabrics are overlapped, and the overlap width is ≥100mm.

[0052] S53. Use neutral silicone structural adhesive to tightly bond the second calcium silicate board 7 to the fiberglass mesh. Specifically, neutral silicone structural adhesive (tensile strength ≥1.5MPa) is applied in dots at 300mm×300mm intervals. Each adhesive dot is 30mm in diameter and 3mm thick. However, the position of the second adhesive dot must be staggered from the position of the first layer of adhesive dots by ≥50mm to prevent stress concentration.

[0053] Specifically, the first calcium silicate board 6 and the second calcium silicate board 7 are laid in a staggered manner, and the width of the staggered joint between the first calcium silicate board 6 and the second calcium silicate board 7 is not less than 1 / 2 of the board length.

[0054] Specifically, after the first calcium silicate board 6 and the second calcium silicate board 7 are laid, all the seams are filled with elastic sealant, making the sealant surface flush with the boards. Allow it to cure for 72 hours after completion.

[0055] S6. Lay a floor decorative layer 8 on the calcium silicate board layer; Specifically, the floor decoration layer 8 is laid on the second calcium silicate board 7. During the laying process, a laser positioning instrument is used to control the width of the brick joints to be 2-3mm, ensuring that the overall flatness error of the floor decoration layer is ≤2mm / 2m.

[0056] 24 hours after the 8th floor decorative layer is laid, apply anti-mildew grout (stain resistance ≥ 4) to the joints. 48 hours after grouting, perform final cleaning and curing.

[0057] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A method for constructing a dry underfloor heating module combined with flooring, characterized in that, Includes the following steps: S1. Treatment of the base layer of the structural floor slab to ensure the flatness of the base layer of the structural floor slab; S2. Pour cement-based self-leveling material into the structural floor slab to form a cement-based self-leveling layer; S3. Adhere the dry underfloor heating composite module to the cement-based self-leveling layer; S4. Install and lay the underfloor heating pipes in the slots on the dry underfloor heating composite module; S5. Adhere the calcium silicate board layer to the dry underfloor heating composite module; S6. Lay a floor decorative layer on the calcium silicate board layer.

2. The method for constructing a dry underfloor heating module and flooring composite according to claim 1, characterized in that, S1 also includes the following steps: S11. Mechanically grind and clean the surface of the structural floor slab to thoroughly remove floating dust, oil stains and loose layers; S12. Repair the cracks in the base layer of the structural floor slab with epoxy resin mortar; S13. High-pressure grouting is used to treat hollow areas to ensure that the base layer is solid, free of hollow areas and cracks; S14. Use an infrared flatness tester for acceptance testing to control the flatness error of the base layer and provide a precise and flat foundation for subsequent construction.

3. The method for constructing a dry underfloor heating module and flooring composite according to claim 1, characterized in that, S2 also includes the following steps: S21. High-strength cement-based self-leveling material is selected, mixed with water, and poured using a mechanical pump. The construction thickness is controlled at 3-5mm. S22. During the pouring process, a defoaming roller is used to roll back and forth to remove air and ensure that the surface of the self-leveling layer is dense, free of air bubbles and pitting. S23. After construction is completed, maintenance shall be carried out.

4. The method for constructing a dry underfloor heating module and flooring composite according to claim 1, characterized in that, In S3, the dry underfloor heating composite module includes a high-density EPS insulation layer and an aluminum heat-conducting plate. The high-density EPS insulation layer is bonded to the cement-based self-leveling layer, and the aluminum heat-conducting plate is bonded to the high-density EPS insulation layer by hot melt adhesive.

5. The method for constructing a dry underfloor heating module and flooring composite according to claim 4, characterized in that, In the S4, the card slot is located on an aluminum heat-conducting plate.

6. The method for constructing a dry underfloor heating module and flooring composite according to claim 1, characterized in that, S3 also includes the following steps: S31. Apply polymer-modified adhesive mortar to the dry underfloor heating composite module using a dot-and-frame method; S32. Lay the dry underfloor heating composite module with the mortar applied flat on the cement-based self-leveling layer. S33. Then tap and adjust with a rubber mallet to ensure that the dry underfloor heating composite module is tightly bonded to the cement-based self-leveling layer; S34. After the paving is completed, maintenance shall be carried out.

7. The method for constructing a dry underfloor heating module and flooring composite according to claim 1, characterized in that, In S5, the calcium silicate board layer includes a first calcium silicate board, a fiberglass mesh, and a second calcium silicate board. The first calcium silicate board is bonded to the dry underfloor heating composite module by multiple first adhesive points. The fiberglass mesh is laid on the first calcium silicate board, and the second calcium silicate board is bonded to the fiberglass mesh by multiple second adhesive points.

8. The method for constructing a dry underfloor heating module and flooring composite according to claim 7, characterized in that, S5 also includes the following steps: S51. Use neutral silicone structural adhesive to tightly bond the first calcium silicate board to the dry underfloor heating composite module. S52. Lay fiberglass mesh on the surface of the first calcium silicate board and fix it with structural adhesive dots; S53. Use neutral silicone structural adhesive to tightly bond the second calcium silicate board to the fiberglass mesh.

9. The method for constructing a dry underfloor heating module and flooring composite according to claim 8, characterized in that, The first and second calcium silicate boards are laid in a staggered pattern.

10. The method for constructing a dry underfloor heating module and flooring composite according to claim 8, characterized in that, After the first and second calcium silicate boards are laid, use elastic sealant to fill all the gaps between the boards.

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