Flexible precise adhesion device and method based on low-melting-point phase change partition regulation and control

Abstract

The invention relates to the technical field of adhesion structures, in particular to a flexible precise adhesion device and method based on low-melting-point phase change zoning regulation, and the device comprises a main body supporting shell which is used for being connected with external equipment and providing a supporting structure; the flexible shell is arranged in the main body supporting shell, and the bottom end of the flexible shell extends out of the main body supporting shell; a plurality of phase change grooves are formed in the bottom of the flexible shell; a pressure-sensitive adhesive is arranged at the bottom of the phase change groove at the edge; the phase change blocks are arranged in the phase change grooves; the flexible heat conducting plate is arranged in the flexible shell; a plurality of flexible heat conduction columns are arranged on the flexible heat conduction plate, and each flexible heat conduction column extends into the corresponding phase change block; the heating piece is attached to the upper portion of the flexible heat conduction plate; the rigid gasket is attached to the upper part of the heating sheet; and the center pressing device is arranged in the flexible shell, the outer side of the center pressing device is in threaded engagement with the main body supporting shell, the bottom of the center pressing device is provided with a height-adjustable pressing face, and the pressing face is attached to the rigid gasket. According to the invention, the reliability and stability of adhesion and fixation are effectively enhanced.

Description

Technical Field

[0001] This invention relates to the field of adhesion structure technology, and in particular to a flexible and precise adhesion device and method based on low-melting-point phase change partitioning control. Background Technology

[0002] An adhesion device is a device used by robots and robotic arms to temporarily fix precision equipment, bond thermal interfaces of electronic components, position complex curved surfaces during assembly, and temporarily fasten aerospace parts. It is especially suitable for precision manufacturing fields with stringent requirements for fixing stability, non-destructive disassembly, and multi-functional integration.

[0003] Existing adhesion technologies mainly rely on a single adhesive layer, rigid clamping, or homogeneous flexible adhesion structures, which have the following key drawbacks that are difficult to overcome: The contradiction in adhesion force control is prominent: traditional adhesion devices are designed with homogeneous adhesive materials, and the adhesion parameters are fixed, which cannot simultaneously meet the high adhesion strength required for "stable fixation" and the low peeling resistance required for "non-destructive disassembly". For example, high-viscosity adhesive layers used to fix precision equipment are prone to leaving adhesive residue or scratching the surface of the device during disassembly; while low-viscosity structures are easy to disassemble, they are difficult to guarantee the fixation stability under complex working conditions and are prone to loosening due to factors such as vibration and temperature changes.

[0004] The interface adaptability is seriously insufficient: rigid adhesive structures are limited by their own stiffness and cannot adapt to complex curved surface contours. Small gaps are easily generated during the bonding process, which not only reduces the reliability of fixation, but also seriously affects the thermal conductivity in thermal interface bonding scenarios. Even traditional flexible adhesive structures lack partitioned adaptation design, making it difficult to balance the integrity of curved surface bonding and the uniformity of local pressure. The bonding effect is particularly poor on complex curved surfaces with small curvature radii.

[0005] Low functional integration: Most existing adhesion devices can only achieve a single fixing function, while precision manufacturing scenarios often require multiple functions such as fixing, heat conduction, cushioning, and scratch prevention. For example, electronic components need to achieve heat conduction simultaneously during temporary fixing, and fragile devices need to have cushioning and vibration reduction capabilities when fixed. However, traditional devices require additional auxiliary components such as thermal pads and cushioning parts, resulting in complex structures, cumbersome assembly, and the overall performance can be affected by improper coordination of multiple components.

[0006] Poor operational controllability and repeatability: There is a lack of dynamic control mechanism for the adhesion process. The fixation strength depends entirely on the properties of the material itself and cannot be adjusted according to the material, shape and working conditions of different fixed parts. At the same time, traditional adhesive materials are easily affected by ambient temperature and humidity. After multiple uses, the adhesiveness will decrease significantly, resulting in low device reusability and increased usage costs. Summary of the Invention

[0007] This invention provides a flexible and precise adhesion device and method based on low-melting-point phase change partition control. By combining innovative partition structure design with the characteristics of phase change blocks, it achieves differentiated and precise control of adhesion force, thermal conductivity, and buffering effect. At the same time, it solves the core contradiction between "stable fixation" and "non-destructive disassembly", and improves interface adaptability and functional integration.

[0008] This invention provides a flexible and precise adhesion device based on low-melting-point phase change partitioning control, comprising: The main support shell is used to connect external equipment and provide a supporting structure; A flexible outer shell is set inside the main support shell, with its bottom end extending out of the main support shell; multiple downward-protruding phase change grooves are provided on the bottom of the flexible outer shell; pressure-sensitive adhesive is provided at the bottom of the phase change grooves located at the edge; Multiple phase change blocks are arranged inside the phase change tank; A flexible heat-conducting plate is set inside a flexible outer shell; multiple flexible heat-conducting pillars are set on the flexible heat-conducting plate, and each flexible heat-conducting pillar extends into a corresponding phase change block; The heating element is housed inside the flexible outer shell and is attached to the top of the flexible heat-conducting plate. A rigid gasket is placed inside the flexible housing and is attached to the top of the heating element; The central pressure applicator is located inside the flexible housing and its outer side is threaded into the main support housing. The bottom is provided with a height-adjustable pressure surface, which is in contact with a rigid gasket.

[0009] Furthermore, multiple phase change tanks form three regions arranged in a circumferential pattern from the inside out. These three regions are respectively designated as the central region, the transition region, and the edge region from the inside out. There is a first gap between the central region and the transition region, as well as between the transition region and the edge region. There is a second gap between two adjacent phase change tanks within each region. The second gap is larger than the first gap.

[0010] Furthermore, the bottom of all phase change tanks has a sloping structure, and the side of each sloping structure facing the center area is higher than the side facing the edge area.

[0011] Furthermore, the number of flexible heat-conducting columns extending into the phase change block corresponding to the central region is less than the number of flexible heat-conducting columns extending into the phase change block corresponding to the transition region; the number of flexible heat-conducting columns extending into the phase change block corresponding to the transition region is less than the number of flexible heat-conducting columns extending into the phase change block corresponding to the edge region.

[0012] Furthermore, the phase change block is a paraffin-based composite material or a bismuth-tin alloy material.

[0013] Furthermore, the flexible shell has a multi-layer composite structure, which includes, from the inside out, a sealing and isolation layer, an elastic support layer, and a wear-resistant and anti-slip layer.

[0014] Furthermore, the central pressure applicator includes: The threaded support wall, in the form of a ring, is set inside the flexible shell, and has threaded holes extending vertically inside. Tighten the inner cover, which has threads extending vertically on the outside; tighten the inner cover by screwing it into the threaded support wall; the bottom of the tightened inner cover is the pressure surface.

[0015] Furthermore, it also includes a temperature feedback unit for detecting temperature, and an overheat protection unit for cutting off power when the temperature exceeds a set threshold.

[0016] This invention also provides a flexible and precise adhesion method based on low-melting-point phase change partition control, using the flexible and precise adhesion device based on low-melting-point phase change partition control as described above, the steps of which include: The heating element is heated to completely melt the phase change block; The adhesion device is moved as a whole above the fixed target, so that the center of the adhesion device is aligned with the center of the fixed target, and the phase change groove at the edge is attached to the fixed target; The central pressure device rotates downward, and the pressure surface exerts pressure on the phase change tank and the phase change block located at the center, causing the molten phase change block to fill the gap on the top surface of the fixed target and form a curved surface that adapts to the shape of the fixed target. Turn off the heating element to allow the phase change block to re-solidify while maintaining the curved surface, thus creating a limiting effect on the fixed target; During disassembly, the heating element is reheated to completely melt the phase change block, allowing the fixed target to be peeled off and the disassembly to be completed.

[0017] Furthermore, when applying downward pressure to the pressure surface, a staged pressure application method is adopted: first, a smaller pressure is applied and maintained for a period of time, then the pressure is increased until the set value is reached and maintained for a period of time.

[0018] The technical solution of this invention can achieve the following technical effects: 1. This invention achieves differentiated control of adhesion force through a functional zoning design of a central area, transition area, and edge area, combined with the "melting-solidification" characteristics of the phase change block. Strong adhesion after solidification ensures fixation stability, while low adhesion after liquefaction enables non-destructive disassembly. This perfectly solves the core contradiction of "fixation and disassembly" in traditional devices, making it suitable for scenarios with stringent surface protection requirements, such as precision equipment.

[0019] 2. The multi-layered composite structure and elastic deformation capability of the flexible adhesive shell, combined with the buffer adaptation of the silicone rubber matrix in the transition zone, enable the device to adapt to complex curved surfaces with small radii of curvature. There are no gaps or stress concentrations during the bonding process, and the fixation stability and thermal conductivity are significantly improved. The pressure regulation function of the auxiliary adapter module further ensures the tightness of the bonding of the fixed parts on different surface conditions, and the adaptation range is wider.

[0020] 3. It simultaneously achieves the combined functions of "precise fixing + efficient heat conduction + buffering and vibration reduction + non-destructive disassembly", eliminating the need for additional auxiliary components such as thermal pads and buffers. This simplifies the assembly process, reduces usage costs, and improves heat conduction efficiency and buffering and vibration reduction performance, meeting the multi-dimensional needs of precision scenarios.

[0021] 4. Through the closed-loop temperature control of the phase change regulation module, the state of the phase change material can be precisely adjusted according to the characteristics of the fixed part, and the heating and cooling process is fast and controllable; the structure of each component of the device is stable, the phase change material can be repeatedly melted and cured for use, and the flexible adhesive shell has excellent wear resistance, which significantly reduces the long-term use cost.

[0022] 5. The multi-layer sealing structure prevents leakage of phase change materials, and the overheat protection function avoids material deterioration or damage to the fixed parts due to overheating; the design of low-tack pressure-sensitive adhesive and wear-resistant anti-slip layer in the edge area effectively protects the surface of the fixed parts from damage. It is suitable for fixed parts made of various materials such as metal, plastic, ceramic, and flexible electronics, and has a wide range of applications. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of a flexible precision adhesion device based on low-melting-point phase change partitioning control. Figure 2 Another view of the structural schematic diagram of the flexible precision adhesion device based on low-melting-point phase change partition control; Figure 3 A cross-sectional view of a flexible precision adhesion device based on low-melting-point phase change partitioning control; Figure 4 This is a component breakdown diagram of a flexible precision adhesion device based on low-melting-point phase change zoning control. Figure 5 Another view of the component breakdown diagram of the flexible precision adhesion device based on low-melting-point phase change partition control.

[0025] Reference numerals: 1. Main support shell; 2. Flexible outer shell; 21. Phase change groove; 3. Phase change block; 4. Flexible heat conduction plate; 41. Flexible heat conduction column; 5. Heating element; 6. Rigid gasket; 7. Central pressure applicator; 7a. Pressure surface; 71. Threaded support wall; 72. Tighten inner cover. Detailed Implementation

[0026] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0028] This invention relates to a flexible and precise adhesion device based on low-melting-point phase change partitioning control, such as... Figure 1-5 As shown, the main components include a main support shell 1, a flexible outer shell 2, a phase change block 3, a flexible heat-conducting plate 4, a heating element 5, a rigid gasket 6, and a central pressure applicator 7. The specific structures of each component are as follows: The main support shell 1 is used to connect external equipment (such as the actuator of a robotic arm) and provide a support structure. The main support shell 1 adopts a split structure design, including a top flange and a bottom locking shell. The flange and the locking shell are connected to each other by screws or bolts. The flange is made of high-strength aluminum alloy or stainless steel in one piece, with 4-8 mounting holes evenly arranged in the circumference for precise positioning and fixing of the device to the external structure; the upper surface of the flange is provided with a sealing groove and a built-in fluororubber sealing ring to ensure a sealed connection with the locking shell and prevent dust, moisture and other impurities from entering the device. The locking housing has a cylindrical structure and is made of lightweight, high-strength engineering plastics (such as PC / ABS alloy) or aluminum alloy. It has internal space to accommodate other components of the device. The side wall of the locking housing has wiring holes for the lead-out of electrical control system lines. Waterproof connectors are provided at the wiring holes to ensure sealing performance.

[0029] The flexible outer shell 2 is housed within the main support shell 1, with its bottom extending out from the main support shell 1. Multiple downward-protruding phase change grooves 21 are provided at the bottom of the flexible outer shell 2. The flexible outer shell 2 is integrally molded from a silicone-based elastic composite material, with a silicone thickness of 5-8mm on the sides, possessing good elastic deformation capability and an elastic modulus of 0.3-0.5MPa. It also provides thermal conductivity (≥2W / m・K) and damping, absorbing external vibrations and impacts to prevent damage from fixed components. A low-tack pressure-sensitive adhesive can be applied to the bottom of the phase change grooves 21 located at the edge. The low-tack pressure-sensitive adhesive is a silicone-based or acrylic-based material with an adhesion force ≤5N / cm. 2 It effectively enhances the adhesion of the edge area, thereby enabling it to quickly fix the target.

[0030] Multiple phase change blocks 3 are set in the phase change tank 21. By heating, the phase change blocks 3 can be melted to adapt to the surface of the fixed target. Through the phase change process of "heating to soften - bonding - cooling to solidify", a strong adhesion effect is formed to ensure the stability of the fixation.

[0031] A flexible heat-conducting plate 4 is disposed inside the flexible outer shell 2; multiple flexible heat-conducting columns 41 are disposed on the flexible heat-conducting plate 4, and each flexible heat-conducting column 41 extends into a corresponding phase change block 3; the overall material of the flexible heat-conducting plate 4 is preferably aluminum nitride ceramic or carbon fiber reinforced silicone.

[0032] Heating element 5 is set inside the flexible shell 2 and attached to the top of the flexible heat-conducting plate 4. Heating element 5 adopts a flexible polyimide film heater with a thickness of 0.1-0.2mm and a heating power of 5-15W. It can achieve precise temperature adjustment within the range of 35-120℃ and a heating rate of ≥5℃ / min to ensure rapid melting of phase change material.

[0033] The rigid gasket 6 is set inside the flexible shell 2 and is attached to the top of the heating element 5. The rigid gasket 6 is made of carbon fiber reinforced resin matrix composite material or thin steel plate with a thickness of 2-3mm. Its outer diameter is adapted to the inner diameter of the main support shell 1. The rigid gasket 6 is aligned with the center area of ​​the phase change groove 21, which can enhance the overall structural strength of the device, avoid zonal deformation or uneven stress, and does not affect the deformation adaptability of the flexible adhesive shell.

[0034] The central pressure applicator 7 is housed within the flexible housing 2, and its outer side is threaded into the main support housing 1. An adjustable pressure surface 7a is located at the bottom, and this pressure surface 7a is in contact with the rigid gasket 6. The central pressure applicator 7 can apply a pressure of 0.05-0.3 MPa to the central area. The specific pressure can be adjusted by regulating the screwing depth of the central pressure applicator 7 within the main support housing 1 and the position of the pressure surface 7a. When the phase change block 3 melts, applying appropriate pressure through the central pressure applicator 7 promotes the molten material to fully fill the tiny gaps and scratches on the surface of the fixed component, improving the tightness of the interface adhesion and enhancing the fixing stability and thermal conductivity. Simultaneously, the pressure adjustment can adapt to fixed components of different materials and surface roughness, avoiding damage caused by excessive pressure or poor adhesion caused by insufficient pressure.

[0035] Preferably, multiple phase change grooves 21 form three regions arranged in a circumferential direction from the inside to the outside. The three regions are respectively referred to as the central region, the transition region, and the edge region from the inside to the outside. The width ratio of the central region, the transition region, and the edge region is (2-3):(1-2):(0.5-1), forming a functional zoning design. The phase change block 3 in the central region fills the tiny scratches and gaps on the surface of the component under pressure. The phase change block 3 in the transition region adapts to the curved surface contour of the component on the fixed target surface and produces flexible deformation. The phase change block 3 in the edge region completely fits the fixed target surface, achieving gapless fitting throughout the entire area.

[0036] There are first gaps between the central area and the transition area, as well as between the transition area and the edge area; there are second gaps between two adjacent phase change grooves 21 in each area. The second gap is larger than the first gap. When the phase change block 3 melts and the phase change groove 21 is squeezed and deformed, it will naturally diffuse into the second gap with a larger space. This circumferential diffusion method allows the molten phase change block 3 and the phase change groove 21 to fill more of the hollow parts of the fixed target surface, thereby effectively improving the fixing effect.

[0037] All phase change grooves 21 have a sloping bottom structure, and the side of each sloping structure facing the center area is higher than the side facing the edge area, so that each partition forms a gradient design in structure, which can work together to achieve multi-dimensional performance requirements, and ensure that the edge area first adheres to the fixed target to achieve basic positioning during adhesion and fixation.

[0038] Preferably, the number of flexible heat-conducting columns 41 extending into the phase change block 3 corresponding to the central region is less than the number of flexible heat-conducting columns 41 extending into the phase change block 3 corresponding to the transition region; the number of flexible heat-conducting columns 41 extending into the phase change block 3 corresponding to the transition region is less than the number of flexible heat-conducting columns 41 extending into the phase change block 3 corresponding to the edge region. In this way, during cooling, the difference in the number of flexible heat-conducting columns 41 will result in a different solidification sequence of the phase change blocks 3. Following the sequence of edge region-transition region-central region, the edge region solidifies first, forming adhesion and fixation on most of the fixed target, while the phase change blocks 3 in the transition region and the central region are still flexible and can automatically adjust to the situation after the phase change blocks 3 in the edge region solidify. Similarly, when the phase change blocks 3 in the transition region solidify first, the phase change blocks 3 in the central region can also automatically adjust.

[0039] Preferably, the phase change block 3 is a paraffin-based composite material or a bismuth-tin alloy material. The melting point of this material is 30-100℃ (the specific model can be selected according to the working conditions, such as a 30-60℃ melting point material for precision components and an 80-100℃ melting point material for high-temperature applications). The melting point is relatively low and will not damage the fixed target.

[0040] Preferably, the flexible outer shell 2 has a multi-layer composite structure, which includes, from the inside out, a sealing and isolation layer, an elastic support layer, and a wear-resistant and anti-slip layer.

[0041] Preferably, the central pressure applicator 7 specifically includes a threaded support wall 71 and a screw-on inner cover 72: The threaded support wall 71 has a ring-shaped structure and is made of engineering plastic (such as POM, PA66) or aluminum alloy. It is set inside the flexible shell 2. The threaded support wall 71 has threads on the outside for screwing into the main support shell 1. After being installed on the main support shell 1, the circumferential sidewall of the flexible shell 2 will be clamped by the outside of the threaded support wall 71 and the inner sidewall of the main support shell 1. The threaded support wall 71 has threaded holes extending vertically inside.

[0042] The inner cover 72 is made of a material that matches the threaded support wall 71. The outer side of the inner cover 72 is provided with threads that extend vertically, so that the inner cover 72 can be screwed into the threaded support wall 71 through the threads. The bottom of the inner cover 72 is the pressure surface 7a, and the top is provided with an anti-slip knob or internal hexagonal groove for easy manual or tool rotation.

[0043] In addition to the heating element 5, the circuit system includes a temperature feedback unit for temperature detection. This unit uses an NTC thermistor or a PT100 platinum resistance thermometer, embedded in the center of the phase change block 3. It provides real-time feedback on the material temperature, forming a closed-loop control with the control circuit board to ensure the phase change process is controllable. It also includes an overheat protection unit to cut off power when the temperature exceeds a set threshold. When the temperature feedback unit detects that the phase change material temperature exceeds the set threshold (10-15°C above the melting point), the overheat protection unit automatically cuts off the heating circuit to prevent the material from overheating and deteriorating or damaging the fasteners. The circuit system uses an STM32 series microcontroller as the core control chip, supporting manual button control or automated operation via an external control system through RS485, Bluetooth, or other communication interfaces.

[0044] This invention also relates to a flexible and precise adhesion method based on low-melting-point phase change partitioning control, using the flexible and precise adhesion device based on low-melting-point phase change partitioning control as described above, the steps of which include: Before use, pretreatment and parameter setting are performed. Based on the material of the component to be fixed (such as metal, plastic, ceramic, etc.), surface contour (flat or curved surface, radius of curvature ≥ 5cm), and working temperature environment, a suitable phase change block (paraffin-based composite material or bismuth-tin alloy) is selected, and its melting point temperature T0 is determined. The heating temperature T1 is set by controlling the circuit board, where T1 = T0 + 5-10℃. The temperature of T1 ensures that the phase change block 3 melts completely without damaging the fixed target. If the fixed target is a heat-sensitive material (such as plastic, flexible electronic devices), T1 is set to T0 + 3-5℃, and the heating power is reduced while extending the heating time.

[0045] In use, the heating element 5 is heated first, so that the phase change block 3 is heated to T1 and completely melted. The temperature sensor monitors the temperature of the phase change block 3 in the central area in real time. When the temperature is stable at T1±0.5℃ and the duration is ≥30s, it is determined that the phase change material is completely melted and the next step is carried out.

[0046] The adhesion device is moved to the top of the fixed target. The device is initially fixed by using the mounting holes and bolts, so that the center of the adhesion device is aligned with the center of the fixed target. The main support shell 1 is pressed down lightly so that the phase change groove 21 at the edge (i.e. the edge area) fits against the fixed target, thus temporarily fixing the fixed target and preventing the device from shifting during subsequent operations.

[0047] The central pressure device 7 rotates downward, and the pressure surface 7a exerts pressure on the phase change block 3 in the phase change tank 21 located at the center (i.e., the central area). The pressure is selected according to the surface condition of the fixed part, so that the molten phase change block 3 fills the gap on the top surface of the fixed target and forms a curved surface that adapts to the shape of the fixed target.

[0048] When the heating element 5 is turned off, the heat of the phase change block 3 is quickly dissipated through the flexible heat-conducting column 41. The heat is transferred to the rigid gasket and the locking shell, and finally dissipated into the environment. The phase change block 3 re-solidifies while maintaining the curved surface, forming a high-strength mechanical adhesion and a stable connection with the surface of the fixed part, thus creating a limiting effect on the fixed target. Its internal flexible heat-conducting column 41 realizes the heat conduction between the fixed target and the external heat dissipation structure, and the buffer function effectively absorbs external vibrations.

[0049] During disassembly, set the heating temperature T2 = T0 + 5 - 10℃, start the heating program, and reheat the heating element 5 to completely melt the phase change block 3. The temperature sensor monitors the phase change block 3 and its temperature in real time. When the temperature stabilizes at T2 ± 0.5℃ and the duration is ≥ 20s, it is determined that the phase change material has completely softened, and heating is stopped. At this time, the device can be slowly peeled off from the edge area along the surface of the fixed part. The peeling rate is controlled at 1-10mm / s to avoid impact damage caused by excessive peeling. Due to the softening of the phase change material, the adhesion force of the adhesion area is significantly reduced, and it can be easily separated from the fixed part without any adhesive residue.

[0050] After disassembly, turn off the heating circuit and wait for the phase change block 3 to cool and solidify. Clean any remaining impurities from the surface of the device before reuse. If the adhesive strength of the pressure-sensitive adhesive in the edge area decreases, the pressure-sensitive adhesive layer can be replaced or a pressure-sensitive adhesive can be applied to extend the service life of the device.

[0051] Preferably, when applying downward pressure, for the fixed part with a complex curved surface, a staged pressure application method is adopted. First, a small pressure (0.05-0.1MPa) is applied and held for a period of time, and then the pressure is increased until the set value is reached and held for a period of time.

[0052] If the application scenario involves vibration (such as the vibration frequency of 10-50Hz during equipment operation), the phase change block 3 status is monitored through the temperature feedback unit. If abnormal temperature fluctuations (exceeding ±5℃) are detected, it indicates that there may be a fitting gap caused by vibration, and the control center pressure applicator 7 needs to apply an additional 0.05MPa of supplementary pressure.

[0053] If long-term fixation is required (more than 24 hours), activate the insulation mode of the control circuit board, setting the temperature of the central area to be maintained at 10-15°C below the melting point. Adjust the heating power in real time through the temperature feedback unit to prevent material softening due to ambient temperature fluctuations. Regularly (every 12 hours), check the display data of the control circuit board to confirm that the temperature is stable at 10-15°C below the melting point, and check that the flange fixing bolts are not loose and that the low-tack pressure-sensitive adhesive at the edge area is not peeling.

[0054] The following, in conjunction with the accompanying drawings and a specific application scenario (fixing a precision electronic component in an aluminum alloy casing, with a curved surface radius of 10cm and a surface roughness Ra=0.8μm), details the complete implementation steps of this device, including the entire process of preliminary preparation, adhesion operation, fixation and maintenance, and non-destructive disassembly: I. Preliminary Preparation Stage: Device selection and inspection: Select a flange with a diameter of 80mm, a PC / ABS alloy locking shell with an inner diameter of 70mm, a flexible shell with a total thickness of 6mm, a central area diameter of 30mm, a transition area width of 15mm, and an edge area width of 8mm.

[0055] Phase change block 3 was confirmed to be a paraffin-based composite material with a melting point of 55℃, and the coating adhesion at the edge area was 3 N / cm. 2 The silicone-based low-tack pressure-sensitive adhesive has a transition zone silicone rubber matrix with a Shore hardness of 40A and an internally embedded aluminum nitride flexible heat-conducting column 41 with a diameter of 2mm.

[0056] Check the device's sealing performance: Fluororubber sealing rings have been installed in the sealing groove of the flange, the wiring holes of the locking housing are equipped with IP67 waterproof connectors, and the sealing isolation layer of the flexible housing 2 is undamaged, ensuring that there is no leakage of the phase change material.

[0057] Test circuit system: Connect the power supply of the control circuit board to confirm that the heating element 5 (power 10W) ​​heats up normally, the temperature feedback unit feedback signal is stable, and the overheat protection unit can automatically cut off the power when the temperature exceeds 70℃.

[0058] Parameter settings: The heating temperature T1 is set to 62℃ (higher than the melting point of 55℃ + 7℃) by using the buttons on the control circuit board. The heating rate is set to 5℃ / min, and the holding time is set to 30s (to ensure that the material is completely melted).

[0059] Based on the surface hardness of the fixed part (aluminum alloy hardness HB60-80), the applied pressure P of the auxiliary adapter module is preset to 0.2MPa, and the positions of the central pressure applicator 7 and the pressure surface 7a are pre-adjusted so that the pressure surface 7a only fits but does not generate pressure.

[0060] II. Adhesion and Fixation Operation Stage: Preliminary device positioning: Place the precision electronic components to be fixed on a horizontal workbench, ensuring that the fixing area is free of oil, dust and other impurities, wipe the surface with anhydrous ethanol and let it air dry naturally.

[0061] Align the mounting holes of the flange with the reserved holes of the external fixing structure, insert the M4 bolts and tighten them gently to achieve the initial positioning of the device and ensure that the center area is aligned with the core fixing area of ​​the electronic components.

[0062] Lightly press the main support shell 1 to pre-bond the low-tack pressure-sensitive adhesive in the edge area with the surface of the electronic component. Use the initial tack of the pressure-sensitive adhesive to fix the position of the device and prevent displacement during subsequent operations.

[0063] The heating program on the control circuit board is started, and the heating element 5 begins to heat up. The temperature feedback unit collects temperature data from the central area. When the temperature displayed on the control circuit board stabilizes at 62℃±0.5℃ for 30 seconds, it is determined that the phase change block 3 has completely melted. At this point, the heating program's heating mode is turned off to maintain temperature stability.

[0064] Manually rotate and tighten the anti-slip knob of the inner cover 72 to move the pressure surface 7a downward, applying a pressure of 0.2 MPa to the phase change block 3 in the central area. Maintain the pressure for 30 seconds and observe the deformation of the flexible shell 2: the silicone rubber matrix in the transition area adapts to the curved contour of the electronic component, resulting in flexible deformation; the molten phase change material in the central area fills the tiny scratches and gaps on the component surface under pressure; and the low-viscosity pressure-sensitive adhesive in the edge area completely adheres to the surface, achieving gapless bonding across the entire area.

[0065] III. Fixed Maintenance Phase: The power to the heating element 5 is turned off, and the molten phase change block 3 dissipates heat rapidly through the flexible heat-conducting column 41 at a cooling rate of approximately 3°C / min. During the cooling process, the device is kept free from external disturbances to prevent internal stress in the phase change block 3. After 2.5 minutes, the material temperature drops to room temperature (25°C), and it completely solidifies to form a 18 N / cm³ structure. 2 It has strong adhesion.

[0066] IV. Non-destructive disassembly stage: When it is necessary to disassemble the device, restart the heating program of the control circuit board, set the heating temperature T2=62℃, and make the heating element 5 heat up again.

[0067] When the temperature in the central region stabilizes at 62℃±0.5℃ for 20 seconds, it is determined that phase change block 3 has completely softened and the adhesion force has decreased to 1.5 N / cm. 2 Now, turn off the heating program.

[0068] Pinch the outer edge of the edge area with your fingers and slowly peel it off along the surface of the electronic component at a rate of 8 mm / s. The peeling direction should be parallel to the bonding surface to avoid vertical pulling that could damage the component surface. Once the edge area is completely peeled off, continue peeling towards the center area. Because the material in the center area has softened, it can be easily separated from the component surface without any adhesive residue. If you encounter significant local resistance during peeling, you can pause the peeling process, restart the heating program, and hold the temperature for 10 seconds until the phase change block 3 softens further before continuing.

[0069] After disassembly, wipe the lower surface of the flexible shell 2 with a clean, lint-free cloth to remove any remaining small impurities. If the low-tack pressure-sensitive adhesive in the edge area loses its adhesion, apply a supplementary pressure-sensitive adhesive or replace the pressure-sensitive adhesive layer.

[0070] After the phase change block 3 cools and solidifies, check that the wear-resistant and anti-slip layer and elastic support layer of the flexible shell 2 are undamaged, the external threads of the threaded support wall 71 are unworn, and the electronic components of the circuit system are free from moisture and damage. Store the device in a dry environment for easy use next time.

[0071] V. Adaptation and Adjustments for Special Scenarios: If the target material is ABS plastic (heat resistance temperature ≤70℃), adjust the heating temperature T1 to 58℃ (above the melting point 55℃ + 3℃), reduce the heating power to 5W, and extend the heating time to 1 minute to avoid high-temperature damage to the workpiece. Adjust the applied pressure P to 0.1MPa to reduce the compressive stress of the phase change block 3 on the plastic surface and prevent surface depression.

[0072] If the fixed target has a complex curved surface (radius of curvature 5cm), a flexible shell 2 with an increased elastic support layer thickness of 5mm is selected to enhance deformation adaptability. The transition zone width is adjusted to 20mm to improve the buffering effect of the curved surface bonding. Pressure is applied in two stages during bonding: first, apply 0.1MPa pressure and hold for 20s to allow the material to initially fill the gaps, then supplement the pressure to 0.15MPa and hold for 30s to ensure no bonding gaps.

[0073] If in a high-temperature environment (ambient temperature 40℃), use a bismuth-tin alloy with a melting point of 80℃ as phase change block 3, set the heating temperature to 90℃, and extend the holding time to 40s to ensure the material is completely melted. Activate the high-temperature compensation mode on the control circuit board to maintain the holding temperature at 70℃ (10℃ below the melting point) to prevent premature softening of the material due to ambient temperature.

[0074] Although this application has been described in conjunction with specific features and embodiments, it is obvious that various modifications and combinations can be made thereto without departing from the spirit and scope of this application. Accordingly, this specification and drawings are merely exemplary illustrations of the application as defined herein, and are to be considered as covering any and all modifications, variations, combinations, or equivalents within the scope of this application. Clearly, those skilled in the art can make various alterations and modifications to this application without departing from its scope. Thus, if such modifications and modifications fall within the scope of this application and its equivalents, this application intends to include such modifications and modifications.

Claims

1. A flexible and precise adhesion device based on low-melting-point phase change zonal control, characterized in that, include: The main support shell (1) is used to connect external equipment and provide a support structure; A flexible outer shell (2) is disposed inside the main support shell (1) and its bottom end extends out from the main support shell (1); a plurality of downwardly protruding phase change grooves (21) are provided at the bottom of the flexible outer shell (2); pressure-sensitive adhesive is provided at the bottom of the phase change grooves (21) located at the edge; Multiple phase change blocks (3) are disposed within the phase change groove (21); A flexible heat-conducting plate (4) is disposed inside the flexible outer shell (2); a plurality of flexible heat-conducting columns (41) are disposed on the flexible heat-conducting plate (4), and each flexible heat-conducting column (41) extends into a corresponding phase change block (3); A heating element (5) is disposed inside the flexible outer shell (2) and attached to the top of the flexible heat-conducting plate (4); A rigid gasket (6) is disposed inside the flexible housing (2) and is attached to the top of the heating element (5); A central pressure applicator (7) is disposed inside the flexible housing (2) and its outer side is threadedly engaged with the main support housing (1). A height-adjustable pressure surface (7a) is provided at the bottom and the pressure surface (7a) is attached to the rigid gasket (6).

2. The flexible and precise adhesion device based on low-melting-point phase change partitioning control according to claim 1, characterized in that, Multiple phase change slots (21) form three regions arranged in a ring from the inside to the outside. The three regions are respectively called the central region, the transition region and the edge region from the inside to the outside. There is a first gap between the central region and the transition region, and between the transition region and the edge region. There is a second gap between two adjacent phase change slots (21) in each region. The second gap is larger than the first gap.

3. The flexible and precise adhesion device based on low-melting-point phase change partitioning control according to claim 2, characterized in that, The bottom of all the phase change tanks (21) is a sloping structure, and the side of each sloping structure facing the center area is higher than the side facing the edge area.

4. The flexible and precise adhesion device based on low-melting-point phase change partitioning control according to claim 3, characterized in that, The number of flexible heat-conducting columns (41) extending into the phase change block (3) corresponding to the central region is less than the number of flexible heat-conducting columns (41) extending into the phase change block (3) corresponding to the transition region; the number of flexible heat-conducting columns (41) extending into the phase change block (3) corresponding to the transition region is less than the number of flexible heat-conducting columns (41) extending into the phase change block (3) corresponding to the edge region.

5. The flexible and precise adhesion device based on low-melting-point phase change partitioning control according to claim 1, characterized in that, The phase change block (3) is a paraffin-based composite material or a bismuth-tin alloy material.

6. The flexible and precise adhesion device based on low-melting-point phase change partitioning control according to claim 1, characterized in that, The flexible shell (2) is a multi-layer composite structure, which includes a sealing and isolation layer, an elastic support layer and a wear-resistant and anti-slip layer from the inside to the outside.

7. The flexible and precise adhesion device based on low-melting-point phase change partitioning control according to claim 1, characterized in that, The central pressure applicator (7) includes: The threaded support wall (71) has a ring-shaped structure and is disposed inside the flexible shell (2), with threaded holes extending vertically inside; Tighten the inner cover (72), which has vertically extending threads on the outside; the tightened inner cover (72) is screwed into the threaded support wall (71) through the threads; the bottom of the tightened inner cover (72) is the pressure surface (7a).

8. The flexible and precise adhesion device based on low-melting-point phase change partitioning control according to claim 1, characterized in that, It also includes a temperature feedback unit for detecting temperature, and an overheat protection unit for cutting off power when the temperature exceeds a set threshold.

9. A flexible and precise adhesion method based on low-melting-point phase change partitioning control, characterized in that, Using the flexible and precise adhesion device based on low-melting-point phase change partitioning control as described in any one of claims 1 to 8, the steps include: The heating element (5) is heated to completely melt the phase change block (3); The adhesion device is moved to a position above the fixed target, so that the center of the adhesion device is aligned with the center of the fixed target, and the phase change groove (21) at the edge adheres to the fixed target. The central pressure device (7) rotates downward, and the pressure surface (7a) exerts pressure on the phase change tank (21) located at the center and the phase change block (3) therein, so that the molten phase change block (3) fills the gap on the top surface of the fixed target and forms a curved surface that adapts to the shape of the fixed target. Turn off the heating element (5) to allow the phase change block (3) to re-solidify while maintaining the curved surface, thus creating a limiting effect on the fixed target; During disassembly, the heating element (5) is reheated to completely melt the phase change block (3), and the fixed target can be peeled off to complete the disassembly.

10. The flexible and precise adhesion method based on low-melting-point phase change partitioning control according to claim 9, characterized in that, When applying downward pressure to the pressure surface (7a), a staged pressure application method is adopted. First, a smaller pressure is applied and held for a period of time, then the pressure is increased until the set value is reached and held for a period of time.

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