Deposition thickness monitoring system for cold solid copper spraying production scene and application method

Abstract

The invention relates to the technical field of cold spraying material deposition process detection, and particularly provides a deposition thickness monitoring system for a cold solid copper spraying production scene and an application method. Comprising an optical detection module, an auxiliary positioning module, a thickness calibration module, a data processing unit and a cross-device comparison unit. The optical detection module, the auxiliary positioning module and the thickness calibration module are mounted in a monitoring area; the data processing unit and the cross-device comparison unit are application software installed in an embedded processor; the application method of the deposition thickness monitoring system for the cold solid copper spraying production scene comprises five steps. Under the combined action of related modules and software units, accurate and nondestructive monitoring of the thickness of a deposition layer under different base materials and different deposition parameters in cold solid copper spraying production can be achieved, meanwhile, the online monitoring requirement is met, reliable data support is provided for process optimization, and the product deposition quality can be improved in an assisting mode.

Description

Technical Field

[0001] This invention relates to the field of detection technology for cold spray material deposition processes, and in particular to a deposition thickness monitoring system and application method for cold spray copper production. Background Technology

[0002] Cold spraying (cold-solid copper spraying) is a surface modification technology that uses high-speed airflow to impact solid powder particles onto the surface of a substrate (such as aluminum busbars or aluminum plates), causing plastic deformation to form a coating. It is widely used in aerospace, machinery manufacturing, and automotive repair. In cold spraying operations, the powder feeding device is one of the core pieces of equipment; its stability, accuracy, and continuity directly affect the coating quality and operational efficiency. In the cold-solid copper spraying process, the uniformity of the deposited layer thickness directly affects the subsequent performance of the product, requiring precise monitoring to provide data support for optimizing process parameters (such as step spacing, spray trajectory, and compensation cycles).

[0003] Currently, the commonly used deposition thickness monitoring methods in the industry still have many shortcomings due to technical limitations. (1): Using contact measuring tools such as micrometers and calipers to measure the surface of the substrate sprayed with coatings can easily cause elastic deformation of the deposition layer and coating during the measurement process, resulting in insufficient measurement accuracy and repeatability, and failing to reflect the true thickness of the deposition layer; (2): Ultrasonic thickness gauges can only preliminarily judge the trend of thickness change. This method cannot meet the needs of online real-time monitoring, and the repeatability of the measurement results needs to be further improved; (3): Traditional optical detection schemes lack specific adaptation designs for copper spraying deposition scenarios. For samples with curved surfaces, measurement errors are easily caused by the spatial difference between the reference plane and the coating surface. At the same time, it is difficult to take into account the universal monitoring needs of different substrates (aluminum plates, aluminum bars) and different deposition parameters (number of deposition layers, gas pressure, step spacing, number of compensations). Therefore, it is particularly necessary to provide a deposition thickness monitoring system and application method that has non-destructive testing characteristics, high accuracy, high repeatability, and adaptability to multiple scenarios. Summary of the Invention

[0004] To overcome the shortcomings of existing cold-solid copper spraying deposition thickness monitoring equipment, as described in the background section, this invention provides a deposition thickness monitoring system and application method for cold-solid copper spraying production. This system, through the combined action of relevant modules and software units, enables accurate and non-destructive monitoring of deposition layer thickness under different substrates and deposition parameters during cold-solid copper spraying production. It also meets online monitoring requirements and provides reliable data support for process optimization.

[0005] The technical solution adopted by this invention to solve its technical problem is: A deposition thickness monitoring system for cold-solid copper spraying production includes an optical detection module, an auxiliary positioning module, a thickness calibration module, a data processing unit, and a cross-device comparison unit. The optical detection module, auxiliary positioning module, and thickness calibration module are installed in the monitoring area. The optical detection module captures and identifies the periodic waveform contour information of the deposited layer surface during the cold-solid copper spraying process, accurately reflecting the thickness uniformity. The auxiliary positioning module includes a substrate fixing component submodule and a direction positioning submodule; the substrate fixing submodule is an adjustable clamp. The direction positioning submodule has markings corresponding to the deposition area. The data processing unit and cross-device comparison unit are application software installed in an embedded processor. The data processing unit carries a custom error correction algorithm, receives contour data collected by the optical detection module, and can complete contour data processing and thickness calculation for a single sample. The algorithm eliminates errors caused by sample bending and generates a thickness distribution heatmap, color-coded according to preset thresholds to visually present the thickness distribution. The thickness calibration module is used for daily calibration of the optical detection module and can optimize the optical detection algorithm by combining micrometer contact measurement data, improving the reliability of the measurement results.

[0006] Furthermore, the optical detection module adopts line laser detection technology with a detection wavelength of 650nm, which is suitable for thickness monitoring in the range of 0.02-1.6mm. The detection accuracy of the optical detection module is not less than 0.001mm, and the scanning frequency is not less than 1000Hz.

[0007] Furthermore, the substrate fixing submodule can adapt to various substrate types, can clamp substrates with a width of 50-200mm, and supports left / right fixture position switching to meet the monitoring requirements of different arrangement positions and directions, with a positioning accuracy of ±0.1mm.

[0008] Furthermore, the orientation positioning submodule can accurately locate key measurement positions of 5mm, 15mm, and 30mm, ensuring the consistency of measurement points, and supports orientation switching indicators on different surfaces.

[0009] Furthermore, the data processing unit can automatically calibrate the spatial difference between the reference plane and the coating surface when the sample is bent, avoiding measurement deviations caused by substrate deformation; it also has a USB data export function, supporting data export and comparative analysis.

[0010] Furthermore, the thickness calibration module is made of stainless steel, and the standard thickness ranges include 0.05mm, 0.1mm, 0.3mm, 0.5mm, 0.8mm, 1.0mm, and 1.5mm, with a calibration accuracy of ±0.0005mm.

[0011] Furthermore, the cross-device comparison unit supports data linkage and linkage calibration with micrometers and ultrasonic thickness gauges.

[0012] The application method of the deposition thickness monitoring system for cold-solid copper spraying production includes the following steps: S1: Substrate fixing. The target substrate is fixed according to the test requirements through the substrate fixing submodule of the auxiliary positioning module, and the position, arrangement direction, and measurement point positioning of the fixture are adjusted; S2: Calibration start-up. The optical detection module is calibrated for accuracy through the thickness calibration module to ensure the accuracy of the detection benchmark; S3: Thickness detection. The optical detection module emits a linear laser to scan the surface of the deposition layer, collects contour data, and transmits it to the data processing unit; S4: Data processing. The data processing unit automatically calibrates the error caused by sample bending, calculates the deposition thickness at each measurement point, and generates a thickness distribution heatmap and data report; S5: Process adaptation. Based on the data processing results, the deposition parameters are correlated and compared to provide a basis for process optimization.

[0013] Furthermore, in step S4, a multi-dimensional data report is generated by associating deposition parameters.

[0014] Furthermore, in step S4, the deposition parameters include the number of deposition layers, gas pressure, step spacing, and number of compensation cycles.

[0015] Compared with existing technologies, the advantages of this invention are: it avoids the influence of contact measurement on the elastic deformation of the deposited layer, significantly improves measurement accuracy and repeatability, and supports online monitoring requirements; it has strong versatility and can meet the needs of different testing scenarios in cold-bonded copper production; it solves the measurement error problem of surface-bent samples, and at the same time, it visualizes the thickness distribution through thermal mapping, making the data more intuitive; it ensures the stability of measurement accuracy and can be linked and optimized with traditional measurement tools, taking into account the advantages of traditional measurement; it can accurately capture the thickness distribution differences under different deposition parameters, providing reliable data support for process parameter optimization and helping to improve product deposition quality. Attached Figure Description

[0016] Figure 1 This is a flowchart illustrating the application method of a deposition thickness monitoring system for cold-solid copper spraying production. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Figure 1As shown, a deposition thickness monitoring system for cold-solid copper spraying production includes an optical detection module, an auxiliary positioning module, a thickness calibration module, a data processing unit, and a cross-device comparison unit. The optical detection module, auxiliary positioning module, and thickness calibration module are installed in the monitoring area. The optical detection module employs line laser detection technology. This module is the core unit for non-destructive testing, with a detection wavelength of 650nm, suitable for thickness monitoring within the range of 0.02-1.6mm, covering the common deposition thickness range in cold-solid copper spraying processes. The optical detection module has a detection accuracy of no less than 0.001mm and a scanning frequency of no less than 1000Hz, capable of capturing and identifying the periodic waveform contour information of the deposited layer surface, accurately reflecting the thickness uniformity. The auxiliary positioning module includes a substrate fixing component submodule and an orientation positioning submodule. The substrate fixing submodule uses an adjustable clamp to adapt to various substrate types (it can fix aluminum plates, 180 aluminum strips, short aluminum strips, etc.), and can hold substrates with a width of 50-200mm. It also supports left / right fixture carriage position switching to meet the monitoring needs of different arrangement positions and orientations, with a positioning accuracy of ±0.1mm. The orientation positioning submodule has markings corresponding to the deposition area, which can accurately locate key measurement positions such as 5mm, 15mm, and 30mm, ensuring the consistency of measurement points, and supports orientation switching markings on different surfaces. The data processing unit and cross-device comparison unit are application software installed within the embedded processor. The data processing unit is equipped with a custom error correction algorithm. It receives contour data collected by the optical detection module and can complete the contour data processing and thickness calculation of a single sample within 0.5 seconds. The algorithm eliminates errors caused by sample bending. When the sample is bent, it automatically calibrates the spatial difference between the reference plane and the coating surface to avoid measurement deviations caused by substrate deformation (such as the accurate correction of bent samples #1 and #2). At the same time, it can generate a thickness distribution heat map (heat map output via HDMI interface, with USB data export function), and color-code according to preset thresholds (such as green for 0.1-0.2mm, blue for 0.2-0.3mm, yellow for 0.3-0.4mm, etc.) to intuitively present the thickness distribution. It supports data export and comparative analysis, and can associate deposition parameters (number of deposition layers, gas pressure, step spacing, number of compensations, etc.) to form multi-dimensional data reports. The thickness calibration module is made of stainless steel and offers standard thickness settings of 0.05mm, 0.1mm, 0.3mm, 0.5mm, 0.8mm, 1.0mm, and 1.5mm, with a calibration accuracy of ±0.0005mm. It is used for the daily calibration of the optical inspection module. The cross-device comparison unit supports data linkage and joint calibration with the Guanglu Shenggong micrometer and the Linshang LS216 ultrasonic thickness gauge. It optimizes the optical inspection algorithm by combining the contact measurement data of the micrometer, thereby improving the reliability of the measurement results.

[0019] Figure 1As shown, the application method of the deposition thickness monitoring system for cold-solid copper spraying production includes the following steps: Step 1: Substrate Fixation. The target substrate (aluminum plate, aluminum busbar, etc.) is fixed according to the testing requirements using the substrate fixing submodule of the auxiliary positioning module. The position of the jig carriage (the substrate fixing submodule is installed on the sliding block of the jig carriage), the arrangement direction, and the positioning of the measurement points (5mm / 15mm / 30mm, etc.) are adjusted. Step 2: Calibration Start-up. The optical detection module is calibrated for accuracy using the thickness calibration module to ensure accurate detection benchmarks. Step 3: Thickness Detection. The optical detection module emits a linear laser to scan the surface of the deposited layer, collects contour data, and transmits it to the data processing unit. Step 4: Data Processing. The data processing unit automatically calibrates for errors caused by sample bending, calculates the deposition thickness at each measurement point, and generates a thickness distribution heatmap and data report. Step 5: Process Adaptation. Based on the data processing results, deposition parameters (such as step spacing of 5.5mm, compensation times of 1-3 times, etc.) can be correlated for comparative analysis, providing a basis for process optimization.

[0020] In actual production, this invention applies the equipment to the following scenarios in the deposition thickness monitoring of the cold-solid copper spraying production area: (1) Substrate type: aluminum plate, 180 aluminum busbar, short aluminum busbar; (2) Deposition parameters: 1-4 deposition layers, gas pressure 0.55-0.72MPa, powder type C-02-02Y, step spacing 5.5mm, compensation times 1-3 times; (3) The monitoring results of the deposition thickness monitoring system applied to the cold-solid copper spraying production scenario are as follows: It can successfully capture the thickness distribution differences of different samples. For example, when the step spacing is 5.5mm and the compensation times are 2, the deposition layer thickness is 0.3-0.4mm and the distribution is the most uniform. At the same time, it accurately corrects the measurement error of the 1# and 2# bent samples. The measurement results are highly matched with the optimized process parameters, providing a direct basis for the subsequent adjustment of process parameters such as step spacing and compensation times.

[0021] The foregoing has shown and described the basic principles and main features of the present invention, as well as its advantages. It will be apparent to those skilled in the art that the present invention is limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or basic characteristics. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within the present invention.

[0022] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in the embodiments can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A deposition thickness monitoring system for cold-spray copper production, characterized in that, It includes an optical inspection module, an auxiliary positioning module, a thickness calibration module, a data processing unit, and a cross-device comparison unit; The optical detection module, auxiliary positioning module, and thickness calibration module are installed in the monitoring area; The optical detection module can capture and identify the periodic waveform contour information of the deposited layer surface in the cold-solid copper spraying process, accurately reflecting the thickness uniformity. The auxiliary positioning module includes a substrate fixing component submodule and a direction positioning submodule. The substrate fixing submodule is an adjustable clamp. The orientation positioning submodule is equipped with markings corresponding to the deposition area; The data processing unit and the cross-device comparison unit are application software installed in the embedded processor. The data processing unit is equipped with a custom error correction algorithm, receives the contour data collected by the optical detection module, and can complete the contour data processing and thickness calculation of a single sample. The algorithm eliminates the error caused by sample bending and can generate a thickness distribution heat map, color-marked according to a preset threshold, and intuitively present the thickness distribution. The thickness calibration module is used for the daily calibration of the optical inspection module. It can combine micrometer contact measurement data to optimize the optical inspection algorithm and improve the reliability of the measurement results.

2. The deposition thickness monitoring system for cold-spray copper production as described in claim 1, characterized in that, The optical inspection module adopts line laser inspection technology with a detection wavelength of 650nm, which is suitable for thickness monitoring in the range of 0.02-1.6mm. The detection accuracy of the optical inspection module is not less than 0.001mm and the scanning frequency is not less than 1000Hz.

3. The deposition thickness monitoring system for cold-spray copper production as described in claim 1, characterized in that, The substrate fixing submodule can adapt to various substrate types and can clamp substrates with a width of 50-200mm. It also supports left / right fixture position switching to meet the monitoring needs of different arrangement positions and directions, with a positioning accuracy of ±0.1mm.

4. The deposition thickness monitoring system for cold-spray copper production as described in claim 1, characterized in that, The orientation positioning submodule can accurately locate key measurement positions of 5mm, 15mm, and 30mm, ensuring the consistency of measurement points, and supports orientation switching markings on different surfaces.

5. The deposition thickness monitoring system for cold-spray copper production as described in claim 1, characterized in that, The data processing unit can automatically calibrate the spatial difference between the reference plane and the coating surface when the sample is bent, avoiding measurement deviations caused by substrate deformation; it also has a USB data export function, supporting data export and comparative analysis.

6. The deposition thickness monitoring system for cold-spray copper production as described in claim 1, characterized in that, The thickness calibration module is made of stainless steel, and the standard thickness ranges include 0.05mm, 0.1mm, 0.3mm, 0.5mm, 0.8mm, 1.0mm, and 1.5mm, with a calibration accuracy of ±0.0005mm.

7. The deposition thickness monitoring system for cold-spray copper production as described in claim 1, characterized in that, The cross-device comparison unit supports data linkage and joint calibration with micrometers and ultrasonic thickness gauges.

8. The application method of the deposition thickness monitoring system for cold-solid copper spraying production scenarios according to any one of claims 1 to 7, characterized in that, The process includes the following steps: S1: Substrate fixing, using the substrate fixing sub-module of the auxiliary positioning module to fix the target substrate according to the test requirements, and adjusting the position, arrangement direction and measurement point positioning of the fixture carriage; S2: Calibration start, using the thickness calibration module to perform precision calibration on the optical detection module to ensure accurate detection benchmark; S3: Thickness detection, the optical detection module emits a line laser to scan the surface of the deposited layer, collects contour data and transmits it to the data processing unit. S4: Data processing. The data processing unit automatically calibrates the error caused by sample bending, calculates the deposition thickness at each measurement point, and generates a thickness distribution heat map and data report. S5: Process adaptation. Based on the data processing results, the deposition parameters are correlated and compared to provide a basis for process optimization.

9. The application method of the deposition thickness monitoring system for cold-solid copper spraying production as described in claim 8, characterized in that, In step S4, a multi-dimensional data report is generated by associating deposition parameters.

10. The application method of the deposition thickness monitoring system for cold-solid copper spraying production as described in claim 8, characterized in that, In step S4, the deposition parameters include the number of deposition layers, gas pressure, step spacing, and number of compensation steps.

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