A semiconductor wafer testing apparatus and method of use thereof

Abstract

The application discloses a kind of semiconductor wafer testing device and its using method, belong to semiconductor detection technical field, and its using method to a kind of semiconductor wafer testing device, including device main body, the upper side middle part of device main body is fixedly installed with detection base, the upper side of detection base is fixedly installed with protection box, the middle part of protection box is provided with detection motor, the lower side output end of detection motor is fixedly installed with semiconductor probe, the upper end side of device main body is fixedly installed with operating panel, by being provided with the structure of locating disc, semiconductor wafer can be fixed by negative pressure, slightly deformed, the negative pressure generated by pressure-increasing hole, will be corrected and fixed to semiconductor wafer, when warping area is larger, or deformation is serious, pressure difference sensor detects deformation, can timely stop subsequent detection, and can show warping position, facilitate subsequent processing of operator.

Description

Technical Field

[0001] This invention relates to the field of semiconductor testing technology, and more specifically, to a semiconductor wafer testing apparatus and its method of use. Background Technology

[0002] In the current booming semiconductor industry, semiconductor chips are the core components of various electronic devices, and their quality inspection is of paramount importance. With the continuous evolution of semiconductor technology, more stringent requirements have been placed on the accuracy, efficiency and stability of chip inspection.

[0003] During the manufacturing and subsequent processing of semiconductor wafers, warping or minute deformations often occur due to various complex factors, such as subtle differences in manufacturing processes and the release of internal stress in the material. These deformations are extremely subtle and difficult to detect with the naked eye. However, during the inspection process, the inspection probe is usually extremely sensitive and can respond to even the slightest undulations on the wafer surface. Once the wafer has subtle warping or deformation, it is easily damaged by impact when it comes into contact with the inspection probe. As a key component of the testing equipment, damage to the inspection probe not only leads to inaccurate test data but also significantly increases equipment maintenance costs and downtime, affecting production efficiency.

[0004] Minor vibrations in the environment may cause the detection probe to shift momentarily when it contacts the wafer, resulting in increased impact force. This could alter the contact state between the wafer and the detection probe, leading to unnecessary collisions.

[0005] Developing a new testing device and method that can effectively detect and respond to wafer warpage or deformation while protecting the testing probe from damage has become an urgent need for the development of the semiconductor industry. Summary of the Invention

[0006] The purpose of this invention is to provide a semiconductor wafer testing apparatus and its usage method to solve the problems mentioned in the background art.

[0007] A semiconductor wafer testing device includes a device body, a detection base fixedly installed on the upper middle part of the device body, a protective housing fixedly installed on the upper side of the detection base, a detection motor arranged in the middle of the protective housing, a semiconductor probe fixedly installed on the lower output end of the detection motor, and an operation panel fixedly installed on the upper side of the device body.

[0008] A testing platform is provided on the upper center of the testing base. A protective ring is provided around the upper periphery of the testing platform. A transmission shaft is clamped to the lower end of the testing platform. A transmission gear is fixedly installed at the lower end of the transmission shaft. An electrically controlled push rod is provided on the upper side of the inner cavity of the main body of the device. An installation component is fixedly installed at the output end of the electrically controlled push rod. A transmission gear plate is fixedly installed on the side of the installation component. The transmission gear plate and the transmission gear are meshed and connected.

[0009] The inner cavity of the detection base is fixedly installed with vacuum pumps on both sides of the detection platform. A vacuum generator is fixedly installed on the side of the vacuum pump. An electric gas switch is fixedly installed on the upper output end of the vacuum generator. A middle pipe is fixedly installed on the side of the electric gas switch. A connecting pipe is fixedly installed on the side of the middle pipe.

[0010] The upper side of the testing platform has several pressurization holes equidistantly arranged, and testing holes are staggered between the pressurization holes on the upper side of the testing platform. Thirty differential pressure sensors are arranged in a ring on the inner side of the upper end of the testing platform. The upper side of the testing platform has a number of positioning plates corresponding to the number of differential pressure sensors. The positioning plates divide the testing platform into a corresponding number of areas, in which the testing holes and pressurization holes are evenly distributed. A partition plate is arranged in the middle of the testing platform. The lower side of multiple pressurization holes is connected to a pressurization groove. The pressurization groove is connected to an internal air pressure pipe on the side. The corresponding testing holes are connected to a testing communication groove. The lower end of the testing communication groove is connected to the positioning plate.

[0011] Furthermore, a top cover is fixedly installed on the upper end of the protective housing, and the lower side of the detection motor is fixedly installed on the top cover with bolts. Both the top cover and the upper middle part of the protective housing are provided with circular through slots corresponding to the detection motor.

[0012] By adopting the above technical solution, the detection motor is fixedly installed on the top cover. The detection motor can control the semiconductor probe to move up and down, thereby raising and lowering the semiconductor probe to a suitable height, which facilitates the semiconductor probe to detect semiconductor wafers.

[0013] Furthermore, support frames are fixedly installed on both sides of the detection base, and a reinforcing plate is fixedly installed on the upper end of the support frame. The upper end of the reinforcing plate is fixedly connected to the protective box.

[0014] By adopting the above technical solution, the protective box is fixedly installed on the testing base by reinforcing plates and support frames. The entire top cover and protective box can be removed by disassembling the support frames, which facilitates later maintenance.

[0015] Furthermore, a partition plate is fixedly installed on the upper side of the inner cavity of the main body of the device, a connecting bearing is fixedly installed in the middle of the partition plate, and a transmission shaft is rotatably arranged in the middle of the connecting bearing.

[0016] By adopting the above technical solution, the partition plate can isolate and protect the components on the upper side, and the connecting bearing can limit the movement range of the transmission shaft.

[0017] Furthermore, a pressure relief switch is fixedly installed on the upper side of the detection base, located on the side of the middle pipe. One end of the connecting pipe is connected to the internal air pressure pipe. The connecting pipe is a metal air pressure pipe component with a length greater than the circumference of the detection platform. The metal air pressure pipe is a flexible metal braided pipe component that can be bent.

[0018] By adopting the above technical solution, the pressure inside the connecting pipe can be vented and depressurized through the pressure relief switch. When the testing platform rotates, the long connecting pipe will not affect the normal rotation of the testing platform.

[0019] Furthermore, a second mounting plate is fixedly installed on the top of the inner cavity of the main body of the device, the output end of the electrically controlled push rod passes through the middle of the second mounting plate, a first mounting plate is fixedly installed on the top of the inner cavity of the main body of the device, a limit groove is provided on the front side of the transmission gear plate, and the limit groove is slidably disposed on the rear side of the first mounting plate.

[0020] By adopting the above technical solution, the second mounting plate can support and install the entire electric control push rod. When the electric control push rod pushes the transmission gear plate to move horizontally through the mounting component, the transmission gear plate can move horizontally within the range of the first mounting plate through the limiting slide groove, ensuring the stability of the horizontal movement of the transmission gear plate.

[0021] Furthermore, a main control device is fixedly installed in the middle of the inner cavity of the main body of the device, several ventilation fans are fixedly installed on the rear side of the main body of the device, and an inspection door is installed on the front side of the main body of the device via a hinge.

[0022] By adopting the above technical solution, the inspection door can be opened to inspect and maintain the internal main control device.

[0023] Furthermore, the diameter of the pressure boosting hole and the detection hole is 0.8-1.2 mm, and the vacuum generator is -60 kPa negative pressure.

[0024] Furthermore, it includes the following steps;

[0025] Step 1: Place the semiconductor wafer to be tested on the testing stage, ensuring that the wafer is inside the protective ring;

[0026] Step 2: Start the vacuum pump and vacuum generator. The vacuum pump draws in air, which is then used by the vacuum generator to create a vacuum. The electric gas switch is turned on, and the gas enters the pressurization tank on the lower side of the test bench through the intermediate pipe and connecting pipe. The gas then adsorbs the semiconductor wafer workpiece through the pressurization hole, forming a stable air pressure environment on the test bench. At the same time, the differential pressure sensor monitors the air pressure changes in the test area in real time and feeds the data back to the main control device. If the semiconductor wafer is partially warped and the air pressure is abnormal, the corresponding differential pressure sensor can alarm in real time, thereby interrupting the subsequent test.

[0027] Step 3: Issue a command through the operation panel to start the detection motor and lower the semiconductor probe to a suitable position to detect the semiconductor wafer. When the position needs to be adjusted, the semiconductor probe rises slightly, and the main control device controls the electric push rod to extend. The output end of the electric push rod pushes the mounting component, which in turn drives the transmission gear plate to move horizontally along the limit slide groove on the rear side of the first mounting plate. The transmission gear plate meshes with the transmission gear, causing the transmission gear to rotate, thereby driving the detection table to rotate. Then repeat the above steps.

[0028] Compared with the prior art, the advantages of this invention are:

[0029] In this invention, by setting a structure with a positioning disk, the semiconductor wafer can be fixed by negative pressure. At the same time, for slight deformation, the negative pressure generated by the pressure boosting hole will correct and fix the semiconductor wafer. When the warping area is large or the deformation is severe, the differential pressure sensor detects the deformation, stops the subsequent detection in time, and can display the warping position, which is convenient for the operator to handle later. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0031] Figure 2 This is a cross-sectional view of the overall structure of the present invention;

[0032] Figure 3 For the present invention Figure 2 Enlarged view of the structure at point A in the image;

[0033] Figure 4 This is a schematic diagram of the structure of the electrically controlled actuator of the present invention;

[0034] Figure 5 This is a schematic diagram of the transmission gear of the present invention;

[0035] Figure 6 This is a schematic diagram of the transmission gear plate of the present invention;

[0036] Figure 7 This is a schematic diagram of the positioning disk of the present invention;

[0037] Figure 8 This is a schematic diagram of the detection communication groove of the present invention.

[0038] Explanation of the numbers in the diagram: 1. Detection motor; 101. Semiconductor probe; 2. Top cover; 3. Protective housing; 4. Detection platform; 5. Detection base; 6. Main body of the device; 7. Inspection door; 8. Operation panel; 9. Support frame; 901. Reinforcing plate; 10. Vacuum pump; 11. Main control unit; 12. Ventilation fan; 13. Differential pressure sensor; 14. Electric gas switch; 15. Vacuum generator; 16. Partition plate; 17. Connecting bearing; 1 8. Drive shaft; 19. Drive gear; 1901. Drive gear plate; 20. Internal air pressure pipe; 21. Intermediate pipe; 22. Pressure relief switch; 23. Connecting pipe; 24. First mounting plate; 25. Second mounting plate; 26. Electrically controlled push rod; 27. Protective ring; 28. Mounting component; 29. ​​Limiting slide groove; 30. Pressure boosting hole; 3001. Pressure boosting groove; 31. Detection hole; 3101. Detection connecting groove; 32. Partition plate; 33. Positioning plate. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] like Figure 1 - Figure 8 As shown, the embodiment of the present invention provides: a device body 6, a detection base 5 fixedly installed on the upper middle part of the device body 6, a protective box 3 fixedly installed on the upper side of the detection base 5, a detection motor 1 provided in the middle of the protective box 3, a semiconductor probe 101 fixedly installed on the lower output end of the detection motor 1, and an operation panel 8 fixedly installed on the upper side of the device body 6.

[0041] A testing platform 4 is provided on the upper middle part of the testing base 5. A protective ring 27 is provided around the upper periphery of the testing platform 4. A transmission shaft 18 is clamped on the lower end of the testing platform 4. A transmission gear 19 is fixedly installed on the lower end of the transmission shaft 18. An electric control push rod 26 is provided on the upper side of the inner cavity of the device body 6. An installation part 28 is fixedly installed on the output end of the electric control push rod 26. A transmission gear plate 1901 is fixedly installed on the side of the installation part 28. The transmission gear plate 1901 and the transmission gear 19 are meshed and connected.

[0042] The inner cavity of the test base 5 is located on both sides of the test platform 4 and a vacuum pump 10 is fixedly installed. A vacuum generator 15 is fixedly installed on the side of the vacuum pump 10. An electric gas switch 14 is fixedly installed on the upper output end of the vacuum generator 15. An intermediate pipe 21 is fixedly installed on the side of the electric gas switch 14. A connecting pipe 23 is fixedly installed on the side of the intermediate pipe 21.

[0043] The upper side of the testing platform 4 is provided with several pressure boosting holes 30 at equal intervals. The upper side of the testing platform 4 is provided with testing holes 31 interspersed between the pressure boosting holes 30. Thirty differential pressure sensors 13 are arranged in a ring on the inner side of the upper end of the testing platform 4. The upper side of the testing platform 4 is provided with a number of positioning disks 33 corresponding to the number of differential pressure sensors 13. The positioning disks 33 divide the testing platform 4 into a corresponding number of areas, in which the testing holes 31 and pressure boosting holes 30 are evenly distributed. A partition plate 32 is provided in the middle of the testing platform 4. The lower side of the multiple pressure boosting holes 30 is connected to the pressure boosting groove 3001. The pressure boosting groove 3001 is connected to the internal air pressure pipe 20 on the side. The corresponding testing holes 31 are connected to the testing communication groove 3101. The lower end of the testing communication groove 3101 is connected to the positioning disk 33.

[0044] The upper top cover 2 is fixedly installed on the upper end of the protective box 3. The lower side of the detection motor 1 is fixedly installed on the upper top cover 2 with bolts. The upper top cover 2 and the upper middle part of the protective box 3 are both provided with circular through slots corresponding to the detection motor 1. The detection motor 1 is fixedly installed on the upper top cover 2. The detection motor 1 can control the semiconductor probe 101 to move up and down, so that the semiconductor probe 101 can be raised and lowered to a suitable height, so that the semiconductor probe 101 can detect the semiconductor wafer.

[0045] Support frames 9 are fixedly installed on both sides of the testing base 5. A reinforcing plate 901 is fixedly installed on the upper end of the support frame 9. The upper end of the reinforcing plate 901 is fixedly connected to the protective box 3. The protective box 3 is fixedly installed on the testing base 5 through the reinforcing plate 901 and the support frame 9. The entire top cover 2 and the protective box 3 can be removed by disassembling the support frame 9, which is convenient for later maintenance.

[0046] A partition plate 16 is fixedly installed on the upper side of the inner cavity of the main body 6 of the device. A connecting bearing 17 is fixedly installed in the middle of the partition plate 16. A transmission shaft 18 is rotatably arranged in the middle of the connecting bearing 17. The partition plate 16 can isolate and protect the upper part of the component. The connecting bearing 17 can limit the movement range of the transmission shaft 18.

[0047] A pressure relief switch 22 is fixedly installed on the upper side of the test base 5, located on the side of the middle pipe 21. One end of the connecting pipe 23 is connected to the internal air pressure pipe 20. The connecting pipe 23 is a metal air pressure pipe component with a length greater than the circumference of the test platform 4. The metal air pressure pipe is a flexible metal braided pipe component that can be bent. The pressure relief switch 22 can be used to release air pressure inside the connecting pipe 23. When the test platform 4 rotates, the longer connecting pipe 23 will not affect the normal rotation of the test platform 4.

[0048] A second mounting plate 25 is fixedly installed on the top of the inner cavity of the main body 6. The output end of the electric push rod 26 passes through the middle of the second mounting plate 25. A first mounting plate 24 is fixedly installed on the top of the inner cavity of the main body 6. A limit groove 29 is provided on the front side of the transmission gear plate 1901. The limit groove 29 is slidably disposed on the rear side of the first mounting plate 24. The second mounting plate 25 can support the electric push rod 26 as a whole. When the electric push rod 26 pushes the transmission gear plate 1901 to move horizontally through the mounting part 28, the transmission gear plate 1901 can move horizontally within the range of the first mounting plate 24 through the limit groove 29, ensuring the stability of the horizontal movement of the transmission gear plate 1901.

[0049] The main control device 11 is fixedly installed in the middle of the inner cavity of the main body 6. Several ventilation fans 12 are fixedly installed on the rear side of the main body 6. The maintenance door 7 is installed on the front side of the main body 6 by hinge. By opening the maintenance door 7, the main control device 11 inside can be inspected and maintained.

[0050] The diameters of the pressure boosting port 30 and the detection port 31 are 0.8–1.2 mm, and the vacuum generator 15 is at a negative pressure of -60 kPa.

[0051] A method of using a semiconductor wafer testing apparatus includes the following steps;

[0052] Step 1: Place the semiconductor wafer to be tested on the testing stage 4, ensuring that the wafer is inside the protective ring 27;

[0053] Step 2: Start the vacuum pump 10 and vacuum generator 15. The vacuum pump 10 draws in air, which is then used by the vacuum generator 15 to create a vacuum. The electric gas switch 14 is turned on, and the gas enters the pressurization tank 3001 on the lower side of the test station 4 through the intermediate pipe 21 and the connecting pipe 23. The gas then adsorbs the semiconductor wafer workpiece through the pressurization hole 30, forming a stable air pressure environment on the test station 4. At the same time, the differential pressure sensor 13 monitors the air pressure changes in the test area in real time and feeds the data back to the main control device 11. If the semiconductor wafer is partially warped and the air pressure is abnormal, the corresponding differential pressure sensor 13 can alarm in real time, thereby interrupting the subsequent test.

[0054] Step 3: Issue a command through the operation panel 8 to start the detection motor 1, causing the semiconductor probe 101 to descend to a suitable position to detect the semiconductor wafer. When the position needs to be adjusted, the semiconductor probe 101 rises slightly, and the main control device 11 controls the electric push rod 26 to extend. The output end of the electric push rod 26 pushes the mounting piece 28, which in turn drives the transmission gear plate 1901 to move horizontally along the limiting slide groove 29 on the rear side of the first mounting plate 24. The transmission gear plate 1901 meshes with the transmission gear 19, causing the transmission gear 19 to rotate, thereby driving the detection table 4 to rotate. Then repeat the above steps.

[0055] The working principle of this invention is as follows: The semiconductor wafer to be tested is placed on the testing stage 4, ensuring that the wafer is located inside the protective ring 27. The protective ring 27 serves as an initial limiting element to prevent the wafer from accidentally slipping during the testing process. The vacuum pump 10 and vacuum generator 15 are activated, generating a negative pressure of -60 kPa through the vacuum generator 15. The electric gas switch 14 is opened, and gas enters the pressurization tank 3001 of the testing stage 4 sequentially through the intermediate pipe 21 and the connecting pipe 23, continuously generating negative pressure from the pressurization hole 30, thereby adsorbing and fixing the semiconductor wafer. This negative pressure adsorption method ensures that the wafer remains stable during the testing process. Thirty differential pressure sensors 13 arranged in a ring on the inner side of the upper end of the testing stage 4 monitor the air pressure changes in the testing area in real time and feed the data back to the main control device 11. Since the positioning plate 33 divides the detection stage 4 into corresponding areas, and the detection holes 31 and pressure boosting holes 30 are evenly distributed, when the semiconductor wafer is partially warped, causing abnormal air pressure, the corresponding differential pressure sensor 13 can sensitively detect it. If the semiconductor wafer is slightly deformed, the negative pressure generated by the pressure boosting hole 30 will correct and fix the semiconductor wafer. If the warped area is large or the deformation is severe, after the differential pressure sensor 13 detects the abnormal air pressure change, it will immediately send a signal to the main control device 11 to interrupt the subsequent detection and can display the warped position, which is convenient for the operator to handle later and effectively avoids damage to the detection probe due to wafer warping.

[0056] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. A semiconductor wafer testing apparatus, comprising an apparatus body (6), characterized in that: A detection base (5) is fixedly installed on the upper middle part of the main body (6) of the device. A protective box (3) is fixedly installed on the upper side of the detection base (5). A detection motor (1) is provided in the middle of the protective box (3). A semiconductor probe (101) is fixedly installed on the lower output end of the detection motor (1). An operation panel (8) is fixedly installed on the upper side of the main body (6). A testing platform (4) is provided on the upper middle part of the testing base (5). A protective ring (27) is provided around the upper end of the testing platform (4). A transmission shaft (18) is clamped on the lower end of the testing platform (4). A transmission gear (19) is fixedly installed on the lower end of the transmission shaft (18). An electric control push rod (26) is provided on the upper side of the inner cavity of the device body (6). An installation part (28) is fixedly installed on the output end of the electric control push rod (26). A transmission gear plate (1901) is fixedly installed on the side of the installation part (28). The transmission gear plate (1901) and the transmission gear (19) are meshed and connected. The inner cavity of the detection base (5) is located on both sides of the detection platform (4) and a vacuum pump (10) is fixedly installed. A vacuum generator (15) is fixedly installed on the side of the vacuum pump (10). An electric gas switch (14) is fixedly installed on the upper output end of the vacuum generator (15). An intermediate pipe (21) is fixedly installed on the side of the electric gas switch (14). A connecting pipe (23) is fixedly installed on the side of the intermediate pipe (21). The upper side of the testing platform (4) is provided with several pressure-boosting holes (30) at equal intervals. The upper side of the testing platform (4) is provided with testing holes (31) staggered between the pressure-boosting holes (30). Thirty differential pressure sensors (13) are arranged in a ring on the inner side of the upper end of the testing platform (4). The upper side of the testing platform (4) is provided with a number of positioning disks (33) corresponding to the differential pressure sensors (13). The positioning disks (33) divide the testing platform (4) into a corresponding number of areas, in which the testing holes (31) and pressure-boosting holes (30) are evenly distributed. The middle part of the testing platform (4) is provided with a partition plate (32). The lower side of the multiple pressure-boosting holes (30) is connected to the pressure-boosting groove (3001). The pressure-boosting groove (3001) is connected to the internal air pressure pipe (20) on the side. The corresponding testing hole (31) is connected to the testing communication groove (3101). The lower end of the testing communication groove (3101) is connected to the positioning disk (33).

2. The semiconductor wafer testing apparatus according to claim 1, characterized in that: The upper end of the protective box (3) is fixedly installed with an upper cover (2), and the lower side of the detection motor (1) is fixedly installed on the upper cover (2) with bolts. The upper middle part of the upper cover (2) and the protective box (3) are both provided with a circular through groove corresponding to the detection motor (1).

3. The semiconductor wafer testing apparatus according to claim 1, characterized in that: The detection base (5) is fixedly installed with support frames (9) on both sides, and a reinforcing plate (901) is fixedly installed on the upper end of the support frame (9). The upper end of the reinforcing plate (901) is fixedly connected to the protective box (3).

4. The semiconductor wafer testing apparatus according to claim 1, characterized in that: A partition plate (16) is fixedly installed on the upper side of the inner cavity of the main body (6) of the device. A connecting bearing (17) is fixedly installed in the middle of the partition plate (16). A transmission shaft (18) is rotatably arranged in the middle of the connecting bearing (17).

5. A semiconductor wafer testing apparatus according to claim 1, characterized in that: A pressure relief switch (22) is fixedly installed on the upper side of the detection base (5) on the side of the middle pipe (21). One end of the connecting pipe (23) is connected to the internal air pressure pipe (20). The connecting pipe (23) is a metal air pressure pipe component with a length greater than the circumference of the detection platform (4). The metal air pressure pipe is a flexible metal braided pipe component that can be bent.

6. The semiconductor wafer testing apparatus according to claim 1, characterized in that: A second mounting plate (25) is fixedly installed on the top of the inner cavity of the main body (6) of the device. The output end of the electric control push rod (26) passes through the middle of the second mounting plate (25). A first mounting plate (24) is fixedly installed on the top of the inner cavity of the main body (6). A limit groove (29) is provided on the front side of the transmission gear plate (1901). The limit groove (29) is slidably disposed on the rear side of the first mounting plate (24).

7. The semiconductor wafer testing apparatus according to claim 1, characterized in that: The main control device (11) is fixedly installed in the middle of the inner cavity of the main body (6) of the device, and several ventilation fans (12) are fixedly installed on the rear side of the main body (6). The maintenance door (7) is installed on the front side of the main body (6) by hinge rotation.

8. A semiconductor wafer testing apparatus according to claim 1, characterized in that: The diameter of the pressure boosting hole (30) and the detection hole (31) is 0.8-1.2 mm, and the vacuum generator (15) is -60 kPa negative pressure.

9. A method of using a semiconductor wafer testing apparatus, relating to the semiconductor wafer testing apparatus according to any one of claims 1-8, characterized in that... Includes the following steps; Step 1: Place the semiconductor wafer to be tested on the testing stage (4) and ensure that the wafer is inside the protective ring (27); Step 2: Start the vacuum pump (10) and vacuum generator (15). The vacuum pump (10) draws air and generates a vacuum through the vacuum generator (15). The electric gas switch (14) is turned on, and the gas enters the pressure tank (3001) on the lower side of the test bench (4) through the intermediate pipe (21) and the connecting pipe (23). The semiconductor wafer workpiece is adsorbed through the pressure hole (30) to form a stable air pressure environment on the test bench (4). At the same time, the differential pressure sensor (13) monitors the air pressure change in the test area in real time and feeds the data back to the main control device (11). If the semiconductor wafer is partially warped and the air pressure is abnormal, the corresponding differential pressure sensor (13) can alarm in real time, thereby interrupting the subsequent test. Step 3: Issue a command through the operation panel (8) to start the detection motor (1) so that the semiconductor probe (101) descends to a suitable position to detect the semiconductor wafer. When the position needs to be adjusted, the semiconductor probe (101) rises slightly, and the main control device (11) controls the electric control push rod (26) to extend. The output end of the electric control push rod (26) pushes the mounting part (28), which in turn drives the transmission gear plate (1901) to move horizontally along the limiting slide groove (29) on the rear side of the first mounting plate (24). The transmission gear plate (1901) meshes with the transmission gear (19), causing the transmission gear (19) to rotate, thereby driving the detection table (4) to rotate. Then repeat the above steps.

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