Semiconductor laser device and method for setting spot energy distribution

Abstract

The application discloses a semiconductor laser device and a spot energy distribution setting method. The semiconductor laser device comprises a laser, a first microlens array, an adjusting lens, an imaging lens, and an imaging element. The imaging element has a first imaging area and a second imaging area. The first microlens array, the adjusting lens, the imaging lens, and the imaging element are arranged in sequence. The adjusting lens has a first light adjusting surface facing the first microlens array and a second light adjusting surface facing the imaging lens. The second light adjusting surface has a microlens transmission area and a plane transmission area arranged in sequence. The microlens transmission area is provided with a light adjusting microlens array. Part of light beams passes through the light adjusting microlens array of the microlens transmission area and is projected on the first imaging area. The remaining part of the light beams passes through the plane transmission area and is projected on the first imaging area and the second imaging area at the same time. The semiconductor laser device can adjust the gradient distribution of the energy of the light spot, so that the actual production requirements can be met.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more particularly to a semiconductor laser device and a method for setting the energy distribution of the laser spot. Background Technology

[0002] In today's era of rapid technological advancement, the field of high-end semiconductor manufacturing is making great strides towards micron-level precision. However, the traditional hot air heating and infrared heating technologies used in semiconductor manufacturing are facing increasing limitations due to their inherent physical properties, making it difficult to meet the increasingly stringent process requirements of semiconductor manufacturing.

[0003] With the development of semiconductor lasers, homogenized large-spot laser heating technology has achieved groundbreaking progress. This technology, with its innovative concept of a "precise energy matrix," has brought about a complete revolution in industrial thermal management logic. Homogenized large-spot laser heating technology possesses many significant advantages: it can achieve precise control of micron-level temperature gradients, effectively avoiding contamination and workpiece deformation caused by zero-contact thermal shock, and its energy density adjustment is flexible and convenient. Based on these outstanding characteristics, homogenized large-spot laser heating technology is gradually replacing traditional hot air heating and infrared heating methods, becoming a highly promising heat treatment technology in the semiconductor manufacturing field.

[0004] However, although the current semiconductor lasers output homogenized beams with high energy uniformity, this type of semiconductor laser cannot meet the actual production requirements in some situations where energy gradient irradiation of the beam is required. This, to some extent, limits the further promotion and application of semiconductor laser technology. Summary of the Invention

[0005] The purpose of this invention is to provide a semiconductor laser device and a method for setting the energy distribution of the laser spot, which can solve the above-mentioned problems existing in the prior art.

[0006] To achieve the above objectives, this application adopts the following technical solution:

[0007] On the one hand, a semiconductor laser device is provided, comprising:

[0008] A laser that can emit a beam of light along a first linear direction;

[0009] The first microlens array is used to split and homogenize the light beam;

[0010] Adjust the lens;

[0011] Imaging lens;

[0012] as well as

[0013] An imaging element has a first imaging area and a second imaging area arranged sequentially along a second straight line direction, wherein the second straight line direction is perpendicular to the first straight line direction.

[0014] The first microlens array, the adjusting lens, the imaging lens, and the imaging element are arranged sequentially at intervals along the first straight line direction;

[0015] The adjusting lens has a first dimming surface facing the first microlens array and a second dimming surface facing the imaging lens; the second dimming surface has a microlens transmission area and a planar transmission area arranged sequentially along a second straight line, and the microlens transmission area is provided with a dimming microlens array.

[0016] When the laser emits a beam, a portion of the beam passes through the dimming microlens array in the microlens transmission area and is projected onto the first imaging area, while the remaining portion of the beam passes through the planar transmission area and is simultaneously projected onto both the first and second imaging areas.

[0017] Preferably, the first microlens array has a plurality of first curved surfaces that bulge along a direction close to the adjusting lens, and the plurality of first curved surfaces are distributed in an array;

[0018] The planar transmission area is parallel to the first dimming surface. The dimming microlens array has multiple second curved surfaces that bulge along the direction close to the imaging lens. The multiple second curved surfaces are distributed in an array. Each second curved surface has a first semi-circular surface and a second semi-circular surface arranged sequentially along the second straight line direction.

[0019] A portion of the light beam passes sequentially through the first semi-circular surface of the first curved surface and the second curved surface before being projected onto the first imaging area.

[0020] Preferably, two adjacent first surfaces are tangent to each other, and two adjacent second surfaces are tangent to each other.

[0021] Preferably, the first microlens array and / or the adjustment lens are movably mounted to adjust the distance between the first microlens array and the adjustment lens so that the light beam passes through the first semi-circular surface of the second curved surface.

[0022] Preferably, the semiconductor laser device further includes a housing, a window, and an adjustment mechanism; the housing has a cavity and a projection port, the cavity is connected to the outside of the housing through the projection port, the window is installed on the housing and covers the projection port, the first microlens array, the adjustment lens, and the imaging lens are sequentially disposed in the cavity, and the window is located between the imaging lens and the imaging element;

[0023] The adjustment mechanism is installed in the cavity, and the output end of the adjustment mechanism is connected to the adjustment lens to adjust the distance between the first microlens array and the adjustment lens, as well as the height of the adjustment lens along the second straight line direction.

[0024] Preferably, the housing is provided with a water nozzle and an electrode, and the electrode is electrically connected to the laser.

[0025] Preferably, the imaging lens has an incident light surface facing the adjusting lens and an exit light surface facing the imaging element; the incident light surface is a plane, and the exit light surface is an arc surface that convexes towards the imaging element.

[0026] Preferably, the ratio of the area of ​​the microlens transmission region to the area of ​​the planar transmission region is Q, where Q is directly proportional to the light spot energy of the first imaging region and inversely proportional to the light spot energy of the second imaging region.

[0027] Preferably, the semiconductor laser device further includes a collimator; the collimator is installed at the output end of the laser.

[0028] On the other hand, a method for setting the energy distribution of a laser spot is provided. Based on the aforementioned semiconductor laser device, the method for setting the energy distribution of a laser spot includes the following steps:

[0029] The laser, the first microlens array, the adjustment lens, the imaging lens, and the imaging element are arranged sequentially at intervals along a first straight line.

[0030] The laser is turned on so that the beam emitted by the laser enters the first microlens array perpendicularly and passes through the first microlens array, the adjustment lens, and the imaging lens in sequence before being projected onto the imaging element;

[0031] A portion of the light beam passes through the dimming microlens array in the microlens transmission area and is projected onto the first imaging area, while the remaining portion of the light beam passes through the planar transmission area and is simultaneously projected onto the first imaging area and the second imaging area, so that the energy of the light spot in the first imaging area is greater than the energy of the light spot in the second imaging area.

[0032] The beneficial effects of this application are as follows: The semiconductor laser device of this application includes a laser, a first microlens array, a regulating lens, an imaging lens, and an imaging element. The regulating lens has a planar transmission area and a regulating microlens array on the side facing the first microlens array. Through the planar transmission area and the regulating microlens array, a portion of the light beam passes through the regulating microlens array in the microlens transmission area and is projected onto the first imaging area. The remaining portion of the light beam passes through the planar transmission area and is simultaneously projected onto the first imaging area and the second imaging area. The light spot is positioned such that the energy of the light spot in the first imaging area is greater than the energy of the light spot in the second imaging area, thereby making the energy of the light spot gradient distribution. This allows the semiconductor laser device to meet the needs of applications requiring gradient energy irradiation of the light spot, satisfying different practical production requirements and facilitating the further promotion and application of semiconductor laser technology.

[0033] The beam energy distribution setting method of this application, by using the aforementioned semiconductor laser equipment, enables the beam energy to be distributed in a gradient, thus meeting the actual production requirements and facilitating the further promotion and application of semiconductor laser technology. Attached Figure Description

[0034] The present application will now be described in further detail with reference to the accompanying drawings and embodiments.

[0035] Figure 1 This is a schematic diagram of the structure of a semiconductor laser device;

[0036] Figure 2 This is a schematic diagram of the structure of the first microlens array;

[0037] Figure 3 This is a schematic diagram of the adjustable lens structure;

[0038] Figure 4 This is a schematic diagram of the structure of the housing, laser, first microlens array, adjustment lens, imaging lens housing, window, adjustment mechanism, water tap, and electrode.

[0039] Figure 5 A schematic diagram of the structure of the housing, water tap, and electrodes;

[0040] Figure 6 This is a schematic diagram of the structure of the adjustment mechanism and the adjustment lens from one of the angles.

[0041] Figure 7 This is a schematic diagram of the adjustment mechanism and adjustment lens from another perspective.

[0042] Figure 8 This is a schematic diagram showing the fit between the top wheel, meshing wheel, and rack;

[0043] Figure 9 This is a schematic diagram of the positioning wheel.

[0044] Figure 10 This is a schematic diagram of the collar structure;

[0045] Figure 11 This is a schematic diagram showing the fit between the positioning wheel and the collar.

[0046] Explanation of reference numerals in the attached figures:

[0047] 1. Laser; 2. First microlens array; 3. Adjustment lens; 4. Imaging lens; 5. Imaging element; 6. Housing; 7. Window; 8. Adjustment mechanism; 9. Water tap; 10. Electrode;

[0048] 21. First surface;

[0049] 31. First dimming surface; 32. Second dimming surface; 33. Microlens transmission area; 34. Planar transmission area; 35. Dimming microlens array; 36. Second curved surface; 37. First semi-circular surface; 38. Second semi-circular surface;

[0050] 41. Surface facing the light; 42. Surface facing the light;

[0051] 51. First imaging region; 52. Second imaging region;

[0052] 61. Cavity;

[0053] 801. First support frame; 802. Rotating shaft; 803. Adjusting wheel; 804. Top wheel; 805. Meshing wheel; 806. Base; 807. Adjusting seat; 808. Spring; 809. Limiting head; 810. Guide rod; 811. Guide rail; 812. Slide table; 813. Positioning wheel; 814. Collar; 815. Positioning hole; 816. Positioning groove; 817. Ball plunger; 821. Abutting positioning surface; 822. Meshing teeth; 823. Rack. Detailed Implementation

[0054] To make the technical problems solved by this application, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of this application are further described in detail below. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0055] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "fixed," "linked," "communicated," "abutting," "clamping," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0056] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0057] Before discussing the exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although the flowcharts describe the operations (or steps) as sequential processes, many of these operations can be performed in parallel, concurrently, or simultaneously. Furthermore, the order of the operations can be rearranged. The process can be terminated when its operation is completed, but it may also have additional steps not included in the figures. The process may correspond to a method, function, procedure, subroutine, subroutine, etc.

[0058] Unless otherwise stated or defined, the term "and / or" as used in this invention includes any and all combinations of one or more of the associated listed items.

[0059] For ease of description, the first straight line direction or front-back direction mentioned below is related to... Figure 1 Its left and right directions are consistent, and the direction of the second straight line described below is the same as... Figure 1 Its vertical direction is consistent.

[0060] like Figures 1 to 3As shown, this embodiment provides a semiconductor laser device, which is a beam energy adjustment device. The semiconductor laser device includes a laser 1, a first microlens array 2, an adjustment lens 3, an imaging lens 4, and an imaging element 5. The laser 1, the first microlens array 2, the imaging lens 4, and the imaging element 5 are all existing components. The imaging element 5 is the location where the beam is projected to form a beam spot, such as a semiconductor processing stage.

[0061] Laser 1 emits a beam along a first straight line. The beam is a horizontally collimated beam, and it enters the first microlens array 2 along a direction perpendicular to the first microlens array 2.

[0062] The first microlens array 2 is used to split and homogenize the beam. The first microlens array 2 is set in the output optical path of the laser beam 1. Under the action of the first microlens array 2, the beam is split, focused and then diverged.

[0063] The imaging element 5 has a first imaging region 51 and a second imaging region 52 arranged sequentially along a second straight line. The second straight line is perpendicular to the first straight line. The second straight line is one of the directions in which multiple spherical mirror arrays are distributed on the first microlens array 2.

[0064] The first microlens array 2, the adjusting lens 3, the imaging lens 4, and the imaging element 5 are arranged sequentially at intervals along the first straight line. The light beam passes through the first microlens array 2, the adjusting lens 3, and the imaging lens 4 in sequence, and finally forms a light spot on the first imaging area 51 and the second imaging area 52 of the imaging element 5.

[0065] An adjustment lens 3 is disposed at the rear end of the first microlens array 2. The adjustment lens 3 has a first dimming surface 31 facing the first microlens array 2 and a second dimming surface 32 facing the imaging lens 4. The first dimming surface 31 faces the first microlens array 2, so that the light beam emitted from the first microlens array 2 directly enters the adjustment lens 3 from the first dimming surface 31. The second dimming surface 32 faces the imaging lens 4, so that the light beam exits from the second dimming surface 32 of the adjustment lens 3 and then enters the imaging lens 4.

[0066] The second dimming surface 32 has a microlens transmission area 33 and a planar transmission area 34 arranged sequentially along the second straight line. The microlens transmission area 33 is equipped with a dimming microlens array 35, that is, the microlens transmission area 33 is arrayed with multiple spherical mirrors, one of which is arranged in the same direction as the second straight line. Through the microlens transmission area 33, the dimming microlens array 35 can split and homogenize the light beam.

[0067] Both the first microlens array 2 and the dimming microlens array 35 mentioned above are microlens arrays. A microlens array is an optical element composed of lens units with micron-level apertures and relief depths. Its smallest functional unit encompasses various types, including spherical mirrors, aspherical mirrors, and cylindrical mirrors. Based on their working principle, they can be divided into two categories: refractive (ROE) and diffractive (DOE). The first microlens array 2 and the dimming microlens array 35 of this application are both refractive. Refractive microlens arrays can achieve laser wavefront segmentation and beam uniformity using high-refractive-index materials.

[0068] When the semiconductor laser device of this application is in use, the laser 1 emits a light beam. When the light beam passes through the first microlens array 2 and enters the adjustment lens 3, a portion of the light beam passes through the dimming microlens array 35 of the microlens transmission area 33 and is projected onto the first imaging area 51. The remaining portion of the light beam passes through the planar transmission area 34 and is simultaneously projected onto the first imaging area 51 and the second imaging area 52. Thus, the light beam passing through the dimming microlens array 35 falls only on the first imaging area 51, forming a light spot with a certain energy. A portion of the light beam passing through the planar transmission area 34 falls on the first imaging area 51, forming a light spot with a certain energy, while the other portion falls on the second imaging area 52, forming a light spot with a certain energy. In other words, the light beam passing through either the dimming microlens array 35 or the planar transmission area 34 falls on the first imaging area 51, and only the light beam passing through the planar transmission area 34 falls on the second imaging area 52. This results in the energy of the light spot in the first imaging area 51 being greater than the energy of the light spot in the second imaging area 52, thereby causing the energy of the light spot to have a gradient distribution. Gradient distribution refers to the regular spatial variation of a certain feature or indicator from high to low (or from low to high).

[0069] Thus, the semiconductor laser device of this application can make the energy of the light spot have a gradient distribution, thereby enabling the semiconductor laser device to be used in some occasions that require energy gradient irradiation of the light spot, meeting different actual production requirements, and facilitating the further promotion and application of semiconductor laser device technology.

[0070] Furthermore, the first microlens array 2 has multiple first curved surfaces 21 protruding along the direction close to the adjusting lens 3, and the multiple first curved surfaces 21 are arrayed. That is, the first microlens array 2 has spherical mirrors arrayed on it, and the first curved surfaces 21 are located on the spherical mirrors. When the first curved surfaces 21 are arrayed, at least some of the first curved surfaces 21 are arranged sequentially along the second straight line direction, that is, multiple first curved surfaces 21 are arranged along the second straight line direction. The first curved surfaces 21 can be set only once or multiple along the third straight line direction, which is perpendicular to both the first and second straight line directions.

[0071] The planar transmission area 34 is parallel to the first dimming surface 31. The light beam that passes through the first dimming surface 31 and is emitted from the planar transmission area 34 will not change the refraction angle, so that this part of the light beam, after being refracted by the imaging lens 4, simultaneously illuminates the first imaging area 51 and the second imaging area 52.

[0072] The dimming microlens array 35 has multiple second curved surfaces 36 protruding along the direction close to the imaging lens 4. That is, spherical mirrors are arrayed on the dimming microlens array 35, and the second curved surfaces 36 are located on the spherical mirrors. The multiple second curved surfaces 36 are arrayed and distributed. When the second curved surfaces 36 are arrayed and distributed on the microlens transmission area 33, at least some of the second curved surfaces 36 are arranged sequentially along the second straight line direction. That is, multiple second curved surfaces 36 are arranged along the second straight line direction. The second curved surfaces 36 can be provided in only one or multiple along the third straight line direction, which is perpendicular to both the first and second straight line directions.

[0073] Each second curved surface 36 has a first semi-circular surface 37 and a second semi-circular surface 38 arranged sequentially along the second straight line direction. The second curved surface 36 is a semi-circular arc, and the first semi-circular surface 37 and the second semi-circular surface 38 each occupy half of the second curved surface 36, that is, the first semi-circular surface 37 and the second semi-circular surface 38 are a quarter of a sphere.

[0074] A portion of the light beam passes sequentially through the first semi-circular surface 37 of the first curved surface 21 and the second curved surface 36 before being projected onto the first imaging area 51. When the light beam passing through the first curved surface 21 passes through the second curved surface 36, it only passes through the first semi-circular surface 37, allowing the beam to be refracted once on the first semi-circular surface 37 and then refracted again by the imaging lens 4 before precisely falling into the first imaging area 51. The planar transmission area 34 of the adjusting lens 3 receives the remaining light beam transmitted from the first microlens array 2, which then falls precisely into the first imaging area 51 and the second imaging area 52 after refraction by the imaging lens 4.

[0075] Optionally, the light beam diverges under the segmentation effect of the cutting surface of the first microlens array 2. After the light beam diverges from each first curved surface 21, it forms a diverging surface, and multiple first curved surfaces 21 form multiple diverging surfaces. By adjusting the distance between the first microlens array 2 and the adjusting lens 3, the lower middle region of each second curved surface 36 of the dimming microlens array 35 corresponds to the light beam of each diverging surface of the first microlens array 2, that is, the diverging surface is smaller than the cutting surface.

[0076] Thus, by making the divergence surface smaller than the cutting surface, the propagation path and range of the laser beam can be controlled more precisely. With the adjustment lens 3, the beam can be guided to a specific area according to design requirements, achieving fine-grained beam control. This satisfies applications with strict requirements on beam position and shape, such as laser processing, where the laser beam can more accurately target the processing area. Simultaneously, a smaller divergence surface means more concentrated energy during beam propagation. In applications requiring high energy density, this energy concentration improves processing efficiency and quality while reducing energy waste. Furthermore, this setup helps optimize the performance of the entire optical system. It reduces beam distortion and loss during transmission, allowing the beam to better meet the operational requirements of subsequent optical components, thus improving system stability and reliability.

[0077] Optionally, two adjacent first curved surfaces 21 are tangent to each other, and two adjacent second curved surfaces 36 are tangent to each other, so that the arrangement of the first microlens array 2 and the dimming microlens array 35 is more compact and the energy is more concentrated.

[0078] Optionally, the microlens transmission area 33 and the planar transmission area 34 are arranged sequentially from top to bottom, the first semi-circular surface 37 and the second semi-circular surface 38 are arranged sequentially from top to bottom, and the first imaging area 51 and the second imaging area 52 are arranged sequentially from top to bottom, so that a light spot with an energy gradient distribution from top to bottom can be formed on the imaging element 5.

[0079] In one embodiment, the light beams emitted from the first microlens array 2 intersect and then diverge. The focal point of the intersection is between the first microlens array 2 and the adjusting lens 3. The distance between the first microlens array 2 and the adjusting lens 3 is D. The arc length of the second curved surface 36 is S. When the adjusting lens 3 is positioned between the focal point and the first microlens array 2, D is inversely proportional to S. When the adjusting lens 3 is positioned between the focal point and the imaging lens 4, D is directly proportional to S. In this application, the curvature and arc length of each first curved surface 21 are the same, and the curvature and arc length of each second curved surface 36 are the same. The arcs of the first curved surface 21 and the second curved surface 36 are both semicircles. When the arc length of the first curved surface 21 and the arc length of the second curved surface 36 increase, the diameter and chord length of the first curved surface 21 and the diameter and chord length of the second curved surface 36 also increase.

[0080] Taking the adjustment lens 3 positioned between the focal point and the imaging lens 4 as an example, when the distance between the first microlens array 2 and the adjustment lens 3 is large, the divergence surface of the light beam increases before it reaches the second curved surface 36 of the adjustment lens 3 after passing through the first microlens array 2. By increasing the arc length of the second curved surface 36, the area of ​​the second curved surface 36 is increased, ensuring that the diverging light beam emitted from the first curved surface 21 can accurately enter the first semi-circular surface 37 of the second curved surface 36. Similarly, when the distance between the first microlens array 2 and the adjustment lens 3 is small, the arc length of the second curved surface 36 can be appropriately reduced to ensure that the diverging light beam emitted from the first curved surface 21 can accurately enter the first semi-circular surface 37 of the second curved surface 36. Since this application needs to ensure that the light beam enters the area where the first semi-circular surface 37 of the second curved surface 36 is located, and avoids entering the second semi-circular surface 38 of the second curved surface 36, the first microlens array 2 and / or the adjusting lens 3 are movably installed to adjust the distance between the first microlens array 2 and the adjusting lens 3 so that the light beam passes through the first semi-circular surface 37 of the second curved surface 36.

[0081] Furthermore, the first microlens array 2 and / or the adjusting lens 3 are movably mounted to adjust the distance between the first microlens array 2 and the adjusting lens 3. The movable mounting includes sliding, detachable, and other mounting methods. The detachable mounting of the adjusting lens 3 allows for the replacement of different adjusting lenses 3 to change the width of the arc length of the second curved surface 36, i.e., replacing the dimming microlens array 35 with second curved surfaces 36 of different diameters. By adjusting the distance between the first microlens array 2 and the adjusting lens 3, and changing the width of the arc length of the second curved surface 36, the energy distribution of the light spot can be precisely controlled.

[0082] In addition, in this application, the energy distribution state of the light spots on the first imaging area 51 and the second imaging area 52 can be changed by setting the number of dimming microlens arrays 35 or adjusting the ratio of the microlens transmission area 33 to the planar transmission area 34.

[0083] Specifically, the ratio of the microlens transmission area 33 to the planar transmission area 34 is Q. That is, when the area of ​​the second dimming surface 32 remains unchanged, the ratio between the area of ​​the microlens transmission area 33 and the area of ​​the planar transmission area 34, or the ratio between the area of ​​the dimming microlens array 35 and the area of ​​the planar transmission area 34, is Q. When the areas of the first imaging area 51 and the second imaging area 52 remain unchanged, Q is directly proportional to the light spot energy of the first imaging area 51 and inversely proportional to the light spot energy of the second imaging area 52.

[0084] In one embodiment, the imaging lens 4 has an incident light surface 41 facing the adjusting lens 3 and an exit light surface 42 facing the imaging element 5. The incident light surface 41 is a plane, and the exit light surface 42 is an arc surface that convexes towards the imaging element 5. The imaging lens 4 is disposed at the rear end of the adjusting lens 3 and images the light beam incident on the imaging lens 4. The light beams, after being divided and adjusted by the first microlens array 2 and the adjusting lens 3, are distributed and superimposed on the imaging surface of the imaging lens 4, finally forming a light spot with regular energy and gradient distribution on the imaging element 5.

[0085] Key reference Figure 1 For example, this application describes the application using a rectangular beam emitted by a laser 1 and directed into a first microlens array 2. The rectangular beam is divided and diverged by the first microlens array 2 to form multiple beams. Some beams pass through a dimming microlens array 35, and some beams pass through a planar transmission region 34. For example, in the figure, the rectangular beam is divided and diverged by the first microlens array 2 to form six beams (the remaining beams are omitted). Four beams pass through the dimming microlens array 35 and are represented by dashed lines, while two beams pass through the planar transmission region 34 and are also represented by dashed lines.

[0086] Based on the embodiment described above, where four beams pass through the dimming microlens array 35 and two pass through the planar transmission area 34, the four beams formed by the first microlens array 2 diverge and are incident on the adjusting lens 3. The second curved surface 36 of the dimming microlens array 35 of the adjusting lens 3 receives two beams respectively. The beams passing through the adjusting lens 3 pass through the imaging lens 4 and then undergo phase plane overlap before being projected onto the first imaging area 51. The remaining two beams pass through the planar transmission area 34 of the adjusting lens 3 and are then transmitted to the imaging lens 4. After phase plane overlap is achieved by the imaging lens 4, they are simultaneously projected onto the first imaging area 51 and the second imaging area 52. The width of the light spot formed after the light beam passes through the planar transmission area 34 and coincides with the imaging lens 4 is greater than the width of the light spot formed after the light beam passes through the dimming microlens array 35 and coincides with the imaging lens 4. This causes the energy of the light beam passing through the planar transmission area 34 and the imaging lens 4 to be superimposed on the first imaging area 51 with the energy of the light beam passing through the dimming microlens array 35 and the imaging lens 4. The superimposed light spot forms a strong and weak energy trapezoidal distribution on the imaging element 5, that is, the energy of the first imaging area 51 is stronger than the energy of the second imaging area 52.

[0087] Phase plane coincidence refers to the complete alignment of the imaging planes (image planes) of two or more optical systems, the wavefront phase planes of beams, or the focal points in terms of spatial position and phase distribution. The core is to achieve spatial and phase synchronization of multiple optical paths / beams on the target surface, ensuring the accuracy and effectiveness of laser processing, detection, or beam combining.

[0088] In the embodiments of this application, the area of ​​the light spot formed by the light beam passing through the planar transmission area 34 and the imaging lens 4 falling into the first imaging area 51 is the overlapping area, and the area of ​​the light spot formed by the light beam falling into the second imaging area 52 is the non-overlapping area. Adjusting the distance between the first microlens array 2 and the adjusting lens 3, and changing the width of the second curved surface 36 by replacing the adjusting lens 3, can adjust the energy ratio of the light spot or the size and position of the light beam, thereby obtaining different light spot energy distribution patterns.

[0089] In one embodiment, the semiconductor laser device further includes a collimator. The collimator is installed at the output end of the laser 1. The collimator can directly emit a parallel collimated beam, or a parallel collimated beam can be formed by adjusting the collimator.

[0090] Embodiments of this application also provide a method for setting the beam energy distribution. Based on any of the above embodiments of the semiconductor laser device, the method for setting the beam energy distribution includes the following steps:

[0091] Laser 1, first microlens array 2, adjustment lens 3, imaging lens 4, and imaging element 5 are arranged sequentially at intervals along a first straight line. Laser 1, first microlens array 2, adjustment lens 3, imaging lens 4, and imaging element 5 are arranged sequentially from left to right along a horizontal direction. Laser 1 emits a horizontal beam from left to right.

[0092] Laser 1 is turned on so that the beam emitted by laser 1 enters the first microlens array 2 perpendicularly and passes through the first microlens array 2, the adjustment lens 3, and the imaging lens 4 in sequence before being projected onto the imaging element 5. The beam of light passing through different areas of the adjustment lens 3 is projected onto different areas of the imaging element 5.

[0093] After being divided and homogenized by the first microlens array 2, the light beam is emitted and diverges. A portion of the light beam passes through the dimming microlens array 35 of the microlens transmission area 33 and is projected onto the first imaging area 51. The remaining portion of the light beam passes through the planar transmission area 34 and is simultaneously projected onto the first imaging area 51 and the second imaging area 52. The light spots overlap on the first imaging area 51 so that the energy of the light spot in the first imaging area 51 is greater than the energy of the light spot in the second imaging area 52.

[0094] Based on the aforementioned technical features, the distance between the first microlens array 2 and the adjusting lens 3 is adjustable, and the light beam passes through the first semi-circular surface 37 of the second curved surface 36. The semiconductor laser device of this application also includes an adjustment mechanism, which can adjust both the distance between the first microlens array 2 and the adjusting lens 3, and the height of the lens 3 in the vertical direction, to ensure that the light beam passes through the first semi-circular surface 37 of the second curved surface 36.

[0095] like Figure 4As shown, in one embodiment, the semiconductor laser device further includes a housing 6, a window 7, and an adjustment mechanism 8. The housing 6 has a cavity 61 and a projection port. The cavity 61 communicates with the outside of the housing 6 through the projection port. The window 7 is installed on the housing 6 and covers the projection port. The first microlens array 2, the adjustment lens 3, and the imaging lens 4 are sequentially disposed in the cavity 61. The window 7 is located between the imaging lens 4 and the imaging element 5.

[0096] The first microlens array 2 and the imaging lens 4 are both mounted within the cavity 61 of the housing 6 via a lens frame. An adjustment mechanism 8 is installed within the cavity 61, and its output is connected to the adjustment lens 3 to adjust the distance between the first microlens array 2 and the adjustment lens 3, as well as the height of the adjustment lens 3 along the second linear direction. The output of the adjustment mechanism 8 can move along either the first or second linear direction, thus achieving adjustment of the distance between the first microlens array 2 and the adjustment lens 3, and adjustment of the height of the adjustment lens 3 along the second linear direction.

[0097] Furthermore, the semiconductor laser device also includes a heat exchange device, a water tap 9, and an electrode 10, all mounted on the housing 6. The electrode 10 is connected to the power supply of the laser 1 to provide power. The heat exchange device can be a chiller or similar equipment, connected to the water tap 9 to dissipate heat from the laser 1.

[0098] like Figures 5 to 8 As shown, in one embodiment, the adjustment mechanism 8 includes a first support frame 801, a rotating shaft 802, an adjusting wheel 803, a top wheel 804, a meshing wheel 805, a base 806, an adjusting seat 807, a spring 808, and a guide rod 810 with a limiting head 809. The guide rod 810 can be a plug screw. The first support frame 801 is disposed inside the cavity 61. The adjusting wheel 803, the top wheel 804, and the meshing wheel 805 are all rotatably mounted on the first support frame 801 via the rotating shaft 802, and the adjusting wheel 803 is located outside the housing 6. The adjusting wheel 803, the top wheel 804, and the meshing wheel 805 rotate synchronously. There are two first support frames 801, and the base 806 is located between the two first support frames 801.

[0099] A guide rod 810 slides along a first straight line on a base 806. A guide rail 811 extends along the first straight line on the base 806, and a slide table 812 is mounted on the guide rail 811. One end of the guide rod 810 is mounted on the slide table 812, and the other end of the guide rod 810 is mounted on a limiting head 809. An adjusting seat 807 slides along a second straight line on the guide rod 810. A spring 808 is sleeved on the guide rod 810 and clamped between the adjusting seat 807 and the limiting head 809. An adjusting lens 3, an adjusting seat 807, and a top wheel 804 are arranged sequentially along the second straight line. The adjusting lens 3 is detachably mounted on the adjusting seat 807. The top wheel 804 has a contact positioning surface 821 that abuts against the adjusting seat 807. The contact positioning surface 821 is flat. Using the elastic force of the spring 808 and the weight of the adjusting lens 3 and the adjusting seat 807, the adjusting seat 807 abuts against the contact positioning surface 821. Multiple abutment positioning surfaces 821 are arranged at intervals along the first circumferential direction of the rotation axis of the rotating shaft 802, and the distance between the multiple abutment positioning surfaces 821 and the rotation axis of the rotating shaft 802 increases sequentially. The distance between the multiple abutment positioning surfaces 821 and the rotation axis of the rotating shaft 802 can increase linearly or non-linearly. Non-linear means that the increase in the distance between the abutment positioning surfaces 821 and the rotation axis of the rotating shaft 802 is not equal. For example, in the case of non-linear increase, along the first circumferential direction, the distance between the first abutment positioning surface 821 and the rotation axis of the rotating shaft 802 is 5, the distance between the second abutment positioning surface 821 and the rotation axis of the rotating shaft 802 is 8, the distance between the third abutment positioning surface 821 and the rotation axis of the rotating shaft 802 is 12, and the distance between the fourth abutment positioning surface 821 and the rotation axis of the rotating shaft 802 is 18.

[0100] Adjacent abutment positioning surfaces 821 are smoothly connected by transition arc surfaces or arcs to avoid right angles in the top wheel 804, which could cause jamming in the relative rotation between the top wheel 804 and the adjusting seat 807.

[0101] The base 806 is provided with a rack 823 extending along a first straight line. The meshing wheel 805 is provided with multiple meshing teeth 822 that mesh with the rack 823. The multiple meshing teeth 822 are arranged at intervals along the first circumferential direction of the rotation axis of the rotating shaft 802, and the distance between two adjacent meshing teeth 822 increases sequentially. The distance between two adjacent meshing teeth 822 can increase linearly or non-linearly. The first circumferential direction is the direction in which the rotating shaft 802 rotates along one of the directions. That is to say, the direction in which the distance between two adjacent meshing teeth 822 increases matches the direction in which the distance between the abutting positioning surface 821 and the rotation axis of the rotating shaft 802 increases.

[0102] Similarly, the nonlinear increase in distance between two adjacent meshing teeth 822 means that the increase in distance between two adjacent meshing teeth 822 is not equal. For example, when the nonlinear increase occurs, along the first circumferential direction, the distance between the first meshing tooth 822 and the second meshing tooth 822 is 1, the distance between the second meshing tooth 822 and the third meshing tooth 822 is 3, the distance between the third meshing tooth 822 and the fourth meshing tooth 822 is 7, and the distance between the fourth meshing tooth 822 and the fifth meshing tooth 822 is 13.

[0103] The adjusting wheel 803 can be driven manually or electrically. In this application, the adjusting wheel 803 is located outside the housing 6. The adjusting wheel 803 can be driven to rotate manually, thereby driving the top wheel 804 and the meshing wheel 805 to rotate.

[0104] The distances between the multiple abutment positioning surfaces 821 and the rotation axis of the rotating shaft 802 increase linearly in sequence, and the distances between two adjacent meshing teeth 822 also increase linearly in sequence. This allows for step-by-step adjustment of the light spot energy. For example, when rotating the adjustment wheel 803, the light spot energy at the same position can be gradually adjusted to 3 joules, 4 joules, and 5 joules. This application preferentially adopts a method where the distances between the multiple abutment positioning surfaces 821 and the rotation axis of the rotating shaft 802 increase non-linearly in sequence, and the distances between two adjacent meshing teeth 822 also increase non-linearly in sequence. Combined with the manually driven adjustment wheel 803, this application allows for setting multiple distance parameters according to the light spot energy requirements. By utilizing the adjustment lens 3, step-by-step adjustment can be achieved, enabling rapid adjustment to the required light spot energy and improving efficiency. For example, rotating the adjustment wheel 803 to the first position can adjust the energy from 3 joules to 5 joules, and rotating it to the second position can directly increase the energy from 5 joules to 10 joules.

[0105] When the adjusting wheel 803 rotates, it drives the meshing wheel 805 to rotate. The meshing teeth 822 engage with the rack 823, causing the guide rod 810 to move the adjusting seat 807 along a first linear direction, thus adjusting the distance between the first microlens array 2 and the adjusting lens 3. Simultaneously, the rotation of the adjusting wheel 803 also drives the top wheel 804 to rotate, causing the top wheel 804 to switch between different abutment positioning surfaces 821 that abut against the adjusting seat 807, causing the adjusting seat 807 to move along a second linear direction, thus adjusting the position of the adjusting lens 3 along the second linear direction. The adjusting wheel 803 has a preset adjustment scale, which corresponds to multiple meshing teeth 822 and multiple abutment positioning surfaces 821. By adjusting the preset scale on the adjusting wheel 803, the rotation angle of the top wheel 804 and the meshing wheel 805 is adjusted, so that the corresponding abutment positioning surface 821 abuts against the adjusting seat and the corresponding meshing teeth 822 mesh with the rack 823. This causes the adjusting seat 807 to drive the adjusting lens 3 to move along the first straight line to a suitable distance from the first microlens array 2, and the adjusting lens 3 to move along the second straight line to a suitable position, ultimately achieving a gradient distribution of light spot energy.

[0106] like Figures 9 to 11 As shown, the rotating shaft 802 is rotatably mounted on one of the first support frames 801 via a damper. The damper is used for positioning to prevent the top wheel 804 and meshing wheel 805 from rotating and causing the position of the adjusting lens 3 to change when there is no external force. When the external force applied to the adjusting wheel 803 exceeds the damping force of the damper, the adjusting wheel 803 drives the top wheel 804 and meshing wheel 805 to rotate.

[0107] Optionally, the damper includes a positioning wheel 813, a collar 814, and a ball-head plunger 817. The positioning wheel 813 has a positioning groove 816 and multiple positioning holes 815 on its upper ring. The multiple positioning holes 815 are spaced apart along the circumference of the positioning wheel 813 within the positioning groove 816. The collar 814 has a sleeve hole, and a ball-head plunger 817 is located within the sleeve hole. The ball-head plunger 817 has a tube body installed on the collar, an elastic element disposed within the tube body, and a positioning ball abutting against the elastic element. The collar 814 is fitted onto the positioning wheel 813 through the sleeve hole, and a portion of the positioning ball is engaged in the positioning groove, with the positioning hole located on the movement path of the positioning ball. When the positioning wheel 813 and the collar 814 rotate relative to each other, the positioning ball rotates along the positioning groove 816, and positioning is achieved by the positioning ball engaging one of the positioning holes 815.

[0108] The positioning wheel 813 is mounted on the first support frame 801 and the rotating shaft 802 is connected to the collar 814, or the collar 814 is mounted on the first support frame 801 and the rotating shaft 802 is connected to the positioning wheel 813. When the adjusting wheel 803 rotates, it drives the positioning wheel 813 and the collar 814 to rotate relative to each other.

[0109] Different positioning holes 815 represent different gear positions. When the adjusting wheel 803 rotates, it drives the rotating shaft 802 to rotate in conjunction, causing the positioning wheel 813 and the collar 814 to rotate relative to each other until the positioning ball of the ball head plunger 817 is engaged in one of the positioning holes 815. This causes the rotation of the rotating shaft 802 to stop at the gear position corresponding to the current positioning hole 815. If further adjustment is needed, more force is required to make the positioning ball of the ball head plunger 817 pass over the positioning hole 815 and continue to rotate along the positioning groove 816 to the next positioning hole 815.

[0110] Optionally, the positions of the positioning hole 815 and the positioning groove 816 can be interchanged with the position of the ball plunger 817.

[0111] The beam energy distribution setting method of this application can be applied to semiconductor laser processing. By utilizing the energy of different beams, corresponding processing steps can be performed on different regions of the semiconductor, which can meet the actual production requirements of semiconductors and is conducive to the further promotion and application of semiconductor laser equipment technology.

[0112] The method for setting the energy distribution of the light spot in this application adjusts the size and direction of the split light beam by setting a first microlens array 2 in conjunction with an adjusting lens 3. Finally, the imaging lens 4 makes the phase planes of each light beam overlap and distribute in a specific proportion on the imaging element 5. The energy distribution adjustment of the light spot achieved by this method has a good definition effect and is easy to operate.

[0113] The technical principles of this application have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this application and should not be construed as limiting the scope of protection of this application in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this application without inventive effort, and these embodiments will all fall within the scope of protection of this application.

Claims

1. A semiconductor laser device, characterized in that, include: The laser (1) can emit a beam along a first straight line direction; The first microlens array (2) is used to split and homogenize the beam; Adjust the lens (3); Imaging lens (4); as well as The imaging element (5) has a first imaging area (51) and a second imaging area (52) arranged sequentially along a second straight line direction, wherein the second straight line direction is perpendicular to the first straight line direction. The first microlens array (2), the adjustment lens (3), the imaging lens (4), and the imaging element (5) are arranged sequentially at intervals along the first straight line direction; The adjusting lens (3) has a first dimming surface (31) facing the first microlens array (2) and a second dimming surface (32) facing the imaging lens (4); the second dimming surface (32) has a microlens transmission area (33) and a planar transmission area (34) arranged sequentially along a second straight line direction, and the microlens transmission area (33) is provided with a dimming microlens array (35); When the laser emits a beam, a portion of the beam passes through the dimming microlens array (35) of the microlens transmission area (33) and is projected onto the first imaging area (51), while the remaining portion of the beam passes through the planar transmission area (34) and is simultaneously projected onto the first imaging area (51) and the second imaging area (52). The first microlens array (2) has a plurality of first curved surfaces (21) protruding along the direction close to the adjustment lens (3), and the plurality of first curved surfaces (21) are arrayed. The planar transmission area (34) is parallel to the first dimming surface (31). The dimming microlens array (35) has a plurality of second curved surfaces (36) protruding along the direction close to the imaging lens (4). The plurality of second curved surfaces (36) are arrayed. Each second curved surface (36) has a first semi-circular surface (37) and a second semi-circular surface (38) arranged sequentially along the second straight line direction. A portion of the light beam passes sequentially through the first semi-circular surface (37) of the first curved surface (21) and the second curved surface (36) and is then projected onto the first imaging area (51).

2. The semiconductor laser device according to claim 1, characterized in that, Two adjacent first surfaces (21) are tangent to each other, and two adjacent second surfaces (36) are tangent to each other.

3. The semiconductor laser device according to claim 1, characterized in that, The first microlens array (2) and / or the adjustment lens (3) are movably mounted to adjust the distance between the first microlens array (2) and the adjustment lens (3) so that the light beam passes through the first semi-circular surface (37) of the second curved surface (36).

4. The semiconductor laser device according to claim 3, characterized in that, It also includes a housing (6), a window (7), and an adjustment mechanism (8); the housing (6) has a cavity (61) and a projection port, the cavity (61) is connected to the outside of the housing (6) through the projection port, the window (7) is installed on the housing (6) and covers the projection port, the first microlens array (2), the adjustment lens (3), and the imaging lens (4) are sequentially arranged in the cavity (61), and the window (7) is located between the imaging lens (4) and the imaging element (5); The adjustment mechanism (8) is installed inside the cavity (61). The output end of the adjustment mechanism (8) is connected to the adjustment lens (3) to adjust the distance between the first microlens array (2) and the adjustment lens (3) and the height of the adjustment lens (3) along the second straight line direction.

5. The semiconductor laser device according to claim 4, characterized in that, The housing (6) is provided with a water nozzle (9) and an electrode (10), and the electrode (10) is electrically connected to the laser (1).

6. The semiconductor laser device according to any one of claims 1 to 4, characterized in that, It also includes a collimator; the collimator is installed at the output end of the laser (1).

7. The semiconductor laser device according to any one of claims 1 to 4, characterized in that, The imaging lens (4) has an incident light surface (41) facing the adjustment lens (3) and an exit light surface (42) facing the imaging element (5); the incident light surface (41) is a plane, and the exit light surface (42) is an arc surface that convexes toward the imaging element (5).

8. The semiconductor laser device according to any one of claims 1 to 4, characterized in that, The ratio of the area of ​​the microlens transmission region (33) to the area of ​​the planar transmission region (34) is Q, where Q is directly proportional to the light spot energy of the first imaging region (51) and inversely proportional to the light spot energy of the second imaging region (52).

9. A method for setting the energy distribution of a laser spot, based on the semiconductor laser device according to any one of claims 1 to 8, characterized in that, Includes the following steps: The laser (1), the first microlens array (2), the adjustment lens (3), the imaging lens (4), and the imaging element (5) are arranged sequentially at intervals along a first straight line; Turn on the laser (1) so that the beam emitted by the laser (1) enters the first microlens array (2) perpendicularly and passes through the first microlens array (2), the adjustment lens (3), and the imaging lens (4) in sequence before being projected onto the imaging element (5); A portion of the light beam passes through the dimming microlens array (35) of the microlens transmission area (33) and is projected onto the first imaging area (51). The remaining portion of the light beam passes through the planar transmission area (34) and is simultaneously projected onto the first imaging area (51) and the second imaging area (52), so that the energy of the light spot in the first imaging area (51) is greater than the energy of the light spot in the second imaging area (52).

Images