Warping simulation method and device of chip packaging structure and electronic equipment

Abstract

The invention provides a warping simulation method and device of a chip packaging structure and electronic equipment, and is applied to a server. Firstly, model structure parameters corresponding to a chip packaging structure input by a client are acquired; then, according to the model structure parameters, a simulation model structure is constructed, and the simulation model structure comprises a sub-model structure and a structure size and a material attribute corresponding to the sub-model structure; then, according to the simulation model structure, pre-configured solving information used for carrying out warping degree analysis is obtained, and the solving information at least comprises solving parameters; and finally, analyzing and processing the simulation model structure according to the solving information to obtain a warping result of the simulation model structure. According to the scheme, the simulation model structure is constructed through the model structure parameters of different chip packaging structures, and meanwhile, the solving information corresponding to the simulation model structure is matched to analyze the warping degree of the simulation model structure, so that the operation complexity is remarkably reduced, and the efficiency of a warping simulation test and the accuracy of a warping result are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of chip manufacturing, in particular to a warping simulation method and device of a chip packaging structure and an electronic device. BACKGROUND

[0002] In the design and preparation process of a chip packaging structure, simulation testing is a key link for verifying its reliability, for example, simulation testing of the warping degree of a chip packaging structure under different temperature conditions. Due to the obvious differences in structural size, material properties and process flow of different chip packaging structures, the corresponding simulation modeling methods, parameter settings and other operations are also different, resulting in complex simulation operations and difficulty in unification. However, the warping simulation testing of the chip packaging structure currently depends heavily on the professional knowledge and experience of the operator, which increases the operation complexity of the warping simulation testing, and due to the limitation of the operator's experience, the analysis process is inconsistent, which significantly reduces the efficiency of the warping simulation testing and the accuracy of the warping result. SUMMARY

[0003] Therefore, the purpose of the present application is to provide a warping simulation method and device of a chip packaging structure and an electronic device. The above-mentioned scheme constructs a simulation model structure through model structure parameters of different chip packaging structures, and simultaneously matches the solving information corresponding to the simulation model structure to analyze the warping degree, which significantly reduces the operation complexity and improves the efficiency of the warping simulation testing and the accuracy of the warping result.

[0004] According to a first aspect of the present application, a warping simulation method of a chip packaging structure is provided, applied to a server, the server being in communication connection with a client, and the method comprising: obtaining model structure parameters corresponding to a chip packaging structure input by the client; constructing a simulation model structure according to the model structure parameters, wherein the simulation model structure comprises a sub-model structure and structure size and material properties corresponding to the sub-model structure; obtaining solving information for warping degree analysis pre-configured according to the simulation model structure, wherein the solving information at least comprises solving parameters; analyzing and processing the simulation model structure according to the solving information to obtain a warping result of the simulation model structure, wherein the warping result comprises the warping degree of the simulation model structure under different temperature conditions.

[0005] In a possible implementation manner of the first aspect, the step of obtaining the model structure parameters corresponding to the chip packaging structure input by the client comprises: obtaining a packaging platform type corresponding to the chip packaging structure input by the client; obtaining a packaging platform structure parameter corresponding to the chip package structure input by the client, wherein the packaging platform structure parameter at least includes a packaging platform structure type and a quantity corresponding to the packaging platform structure type.

[0006] In a possible implementation of the first aspect, the step of constructing the simulation model structure according to the model structure parameter comprises: constructing the simulation model structure according to the packaging platform type and the packaging platform structure parameter, and determining a structure size and a material attribute corresponding to a sub-model structure in the simulation model structure.

[0007] In a possible implementation of the first aspect, before the step of obtaining the solving information for warping degree analysis preconfigured according to the simulation model structure, the method further comprises: detecting whether a structure size and a material attribute corresponding to a sub-model structure in the simulation model structure meet a requirement; if the structure size and the material attribute corresponding to the sub-model structure meet the requirement, performing the step of obtaining the solving information for warping degree analysis preconfigured according to the simulation model structure; if the structure size and the material attribute corresponding to the sub-model structure do not meet the requirement, adjusting the structure size or the material attribute corresponding to the sub-model structure and then performing the step of obtaining the solving information for warping degree analysis preconfigured according to the simulation model structure.

[0008] In a possible implementation of the first aspect, the step of obtaining the solving information for warping degree analysis preconfigured according to the simulation model structure comprises: obtaining a material parameter, a temperature parameter, a solving parameter, a simulation grid size, and solving calling information corresponding to the simulation model structure according to the simulation model structure; the step of performing analysis processing on the simulation model structure according to the solving information to obtain a warping result of the simulation model structure comprises: performing analysis processing on the simulation model structure according to the material parameter, the temperature parameter, the solving parameter, the simulation grid size, and the solving calling information to obtain the warping result of the simulation model structure.

[0009] In a possible implementation of the first aspect, after the step of performing analysis processing on the simulation model structure according to the solving information to obtain the warping result of the simulation model structure, the method further comprises: obtaining a warpage analysis report of the simulation model structure according to the warpage result, wherein the warpage analysis report at least includes a warpage result curve and a warpage result analysis image corresponding to the warpage result; obtaining a warpage simulation report of the simulation model structure according to the simulation model structure, the solving information and the warpage analysis report.

[0010] In a possible implementation of the first aspect, before the step of obtaining the warpage analysis report of the simulation model structure according to the warpage result, the method further includes: detecting whether the warpage result is abnormal; if the warpage result is abnormal, adjusting the structure size or the material attribute corresponding to the sub-model structure in the simulation model structure, and then performing the step of obtaining the solving information pre-configured for warpage degree analysis according to the simulation model structure; if the warpage result is not abnormal, performing the step of obtaining the warpage analysis report of the simulation model structure according to the warpage result.

[0011] In a possible implementation of the first aspect, before the step of obtaining the warpage analysis report of the simulation model structure according to the warpage result, the method further includes: detecting whether the warpage result conforms to an expected warpage result; if the warpage result does not conform to the expected warpage result, adjusting the structure size or the material attribute corresponding to the sub-model structure in the simulation model structure, and then performing the step of obtaining the solving information pre-configured for warpage degree analysis according to the simulation model structure; if the warpage result conforms to the expected warpage result, performing the step of obtaining the warpage analysis report of the simulation model structure according to the warpage result.

[0012] According to a second aspect of the present application, a warpage simulation device of a chip packaging structure is provided, which is applied to a server, the server is in communication connection with a client, and the device includes: an obtaining module, configured to obtain model structure parameters corresponding to a chip packaging structure input by the client; a constructing module, configured to construct a simulation model structure according to the model structure parameters, wherein the simulation model structure includes a sub-model structure and structure size and material attribute corresponding to the sub-model structure; a determining module, configured to obtain solving information pre-configured for warpage degree analysis according to the simulation model structure, wherein the solving information at least includes a solving parameter; An analysis processing module is configured to analyze and process the simulation model structure according to the solving information to obtain a warping result of the simulation model structure, wherein the warping result includes warping degrees of the simulation model structure under different temperature conditions.

[0013] According to a third aspect of the present application, an electronic device is provided, comprising: a memory configured to store one or more programs; a processor configured to implement the warping simulation method of the chip package structure according to the first aspect when the one or more programs are executed by the processor.

[0014] Based on any one of the above aspects, the embodiments of the present application provide a warping simulation method, device and electronic device of a chip package structure, which are applied to a server. First, model structure parameters corresponding to a chip package structure input by a client are obtained. Then, a simulation model structure is constructed according to the model structure parameters, wherein the simulation model structure includes a sub-model structure and structure dimensions and material properties corresponding to the sub-model structure. Then, solving information for warping degree analysis is obtained according to the simulation model structure, wherein the solving information at least includes solving parameters. Finally, the simulation model structure is analyzed and processed according to the solving information to obtain a warping result of the simulation model structure. The above scheme constructs a simulation model structure through model structure parameters of different chip package structures, and simultaneously matches solving information corresponding to the simulation model structure to analyze the warping degree, which significantly reduces the complexity of operation and improves the efficiency of warping simulation test and the accuracy of the warping result. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be called in the embodiments will be briefly introduced below, and it should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0016] Figure 1 A flowchart of a warping simulation method of a chip package structure provided by the present embodiment; Figure 2 A flowchart of a warping simulation method of a chip package structure provided by the present embodiment; Figure 3 A schematic diagram of a simulation model structure provided by the present embodiment; Figure 4 A schematic diagram of solving information provided by the present embodiment; Figure 5 A schematic diagram of model structure parameters provided by the present embodiment; Figure 6 For Figure 1 The schematic diagram of the step flow after step S14 is shown in the figure; Figure 7 The schematic diagram of the part of the warping analysis report provided in the embodiment is shown in the figure; Figure 8 The schematic diagram of the part of the warping simulation report provided in the embodiment is shown in the figure; Figure 9 The schematic diagram of the functional modules of the warping simulation device of the chip packaging structure provided in the embodiment is shown in the figure.

[0017] Figure: 20-warping simulation device of chip packaging structure, 200-acquisition module, 210-constructing module, 220-determining module, 230-analysis processing module. DETAILED DESCRIPTION

[0018] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0019] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without making creative efforts are within the scope of protection of the present application.

[0020] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0021] In the description of the present application, it should be noted that the orientation or position relationship indicated by the terms "upper", "lower", etc. is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship when the product of the present application is usually placed, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", etc. are only used for differentiation and cannot be understood as indicating or implying relative importance.

[0022] It should be noted that the different features in the embodiments of the present application can be combined with each other without conflict.

[0023] In order to solve the technical problems mentioned in the background section, the inventors have innovatively designed the following technical solutions, and the specific implementation scheme of this application will be described in detail below with reference to the accompanying drawings.

[0024] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic flowchart illustrating the steps of a warpage simulation method for a chip packaging structure provided in this embodiment. Figure 2 This is a flowchart illustrating a warpage simulation method for a chip packaging structure according to this embodiment. The warpage simulation method is applied to a server, which is communicatively connected to a client. In this embodiment, the server and client can communicate with each other via a wired or wireless network. The server can be an independent electronic device or a cluster of multiple electronic devices. The client can be a mobile terminal device, such as a smartphone, personal computer (PC), tablet computer, etc.

[0025] The detailed steps of the server-side chip package structure warpage simulation method are described below.

[0026] Step S11: Obtain the model structure parameters corresponding to the chip packaging structure input by the client.

[0027] In this step, the model structure parameters input on the client side include at least the packaging platform type and packaging platform structure parameters of the chip packaging structure. The packaging platform type is used to characterize the chip packaging structure design template or architecture, and the packaging platform structure parameters are the specific configuration information for that packaging platform type. Different packaging platform types and different packaging platform structure parameters are used to construct different initial models with specific dimensions, i.e., simulation model structures. The structural dimensions, material properties, and solution information of the sub-model structures corresponding to different simulation model structures are all pre-set in the server.

[0028] Step S12: Construct the simulation model structure based on the model structure parameters. The simulation model structure includes sub-model structures and the corresponding structural dimensions and material properties of the sub-model structures.

[0029] In this step, a simulation model structure is constructed based on the packaging platform type and packaging platform structural parameters. The packaging platform structure in the packaging platform structural parameters corresponds to a sub-model structure. The structural dimensions of the sub-model structure include at least the X-axis distance, Y-axis distance, Z-axis distance, length, width, and height. The material properties of the sub-model structure include at least the material name, material processing temperature, or coefficient of thermal expansion for each sub-model structure.

[0030] For example, please see Figure 3 ,Figure 3 This is a schematic diagram of the simulation model structure provided in this embodiment. When the packaging platform type is selected as "5S", and the packaging platform structure parameters are selected as 2 layers of "PI", 1 layer of "Metal", 1 layer of "UBM", and 1 "initialization DIE quantity", Figure 3 The “simulation model structure” shown is an initial model built based on the packaging platform type and packaging platform structure parameters, i.e., the simulation mode structure. Figure 3 The “Structural Dimensions of Sub-model Structures” shown in the example illustrates the structural dimensions of each sub-model structure of the simulation model structure. For example, the sub-model structures include at least “PI1”, “M1”, “PI2” and “Die”, wherein the structural dimensions of the sub-model structure “PI1” are “X-axis distance = 0, Y-axis distance = 0, Z-axis distance = 0, length = 5, width = 5 and height = 0.1”. Figure 3 The “Material Properties of Sub-model Structures” shown in the example lists the material properties of each sub-model structure in the simulation model structure. For example, the material properties of the sub-model structure “PI1” are “Material Name = PI11-16-23, Material Processing Temperature = 230”.

[0031] Step S13: Obtain pre-configured solution information for warpage analysis based on the simulation model structure, wherein the solution information includes at least solution parameters.

[0032] In this step, the solution information is the complete set of instructions that drives the solver. See also... Figure 4 , Figure 4 This is a schematic diagram of the solution information provided in this embodiment. The solution information includes material parameters, temperature parameters, solution parameters, simulation mesh size, and solution call information obtained from the simulation model structure. Figure 4 The “Material Parameters” shown in the example list the material parameters of the simulation model structure. For example, the material parameters include at least the material properties corresponding to the sub-model structures in the simulation model structure. Figure 4 The “Temperature Parameters” shown in the example list the temperature parameters of the simulation model structure. The temperature parameters include at least the different temperature conditions for testing the warping degree of the simulation model structure and define the thermal load conditions. For example, the temperatures in the temperature parameters include 30 degrees Celsius, 50 degrees Celsius, and 100 degrees Celsius. Figure 4 The “Solution Parameters” shown in the example list the solution parameters of the simulation model structure. The solution parameters are the core set of settings that control the mathematical algorithm of the solver. They include at least the analysis type (e.g., static structural analysis, thermal-stress sequential coupling analysis, etc.), solver options (e.g., direct solver or iterative solver, etc.), convergence criteria (e.g., residual tolerance, maximum number of iterations, etc.) and nonlinear settings (e.g., load step, substep, etc.). Figure 4The “simulation mesh size” shown in the example illustrates the simulation mesh size of the simulation model structure. The simulation mesh size includes at least the average size of the overall mesh and the mesh refinement of key areas of the simulation model structure. For example, the simulation mesh size obtained from the simulation model structure can be 0.1 mm. Figure 4 The “Solution Call Information” shown in the example illustrates the solution call information of the simulation model structure. The solution call information includes at least the scheduling instructions for computing resources (e.g., the number of CPU cores, memory allocation, etc.). For example, the number of solution cores in the solution call information obtained from the simulation model structure can be 12.

[0033] Step S14: Analyze and process the simulation model structure based on the solution information to obtain the warping result of the simulation model structure. The warping result includes the degree of warping of the simulation model structure under different temperature conditions.

[0034] In this step, firstly, based on the simulation mesh size parameters, the continuous geometric model is discretized into a mesh model composed of a finite number of elements. Next, each mesh model is processed and integrated according to material parameters to obtain the global stiffness matrix and global load vector. Then, the temperature parameters are converted into equivalent thermal loads and added to the global load vector. Finally, the solver solves the linear simulation group formed by the global stiffness matrix and the global load vector with added temperature parameters based on the solution parameters. At this point, calculations are allocated according to the solver call information, and the final solution yields the nodal displacements. All nodal displacements are quantified to obtain the warping result.

[0035] In the above scheme, a simulation model structure is constructed using the model structure parameters of different chip packaging structures. Simultaneously, the warpage degree is analyzed by matching the solution information corresponding to this simulation model structure. This significantly reduces the complexity of the operation and improves the efficiency and accuracy of warpage simulation testing. Furthermore, when using the warpage results to verify the reliability of the chip packaging structure, it provides a stable and reliable quantitative basis for design decisions, effectively guiding the design optimization and process improvement of the chip packaging structure, ultimately ensuring the high reliability and long-term stability of the chip packaging structure in terms of thermomechanical performance.

[0036] Furthermore, step S11 can be implemented in the following way.

[0037] First, obtain the packaging platform type corresponding to the chip packaging structure input by the client.

[0038] Next, the packaging platform structure parameters corresponding to the chip packaging structure input by the client are obtained. The packaging platform structure parameters include at least the packaging platform structure type and the quantity corresponding to the packaging platform structure type.

[0039] In this embodiment, the packaging platform type is used to characterize the chip packaging structure design template or architecture, and the packaging platform structure parameters are the specific configuration information of that packaging platform type. For example, please refer to... Figure 5 , Figure 5 This is a schematic diagram of the model structure parameters provided in this embodiment. Figure 5 The “Packaging Platform Type” shown in the example lists the packaging platform types for building the simulation model structure. For example, the packaging platform type can be “5S”, “FCPLP”, “FOMCM” or “FOEB”, etc. The specific packaging platform type is not specifically limited here. Figure 5 The “Packaging Platform Structure Parameters” example shown in the document lists the packaging platform structure parameters for building the simulation model structure. When the packaging platform type is entered or selected, the packaging platform structure parameters are automatically generated. The packaging platform structure parameters can be structures such as “PI”, “Metal”, “UBM”, and “Initial DIE Quantity”. The client can modify or enter the quantity of this structure.

[0040] Furthermore, step S12 can be implemented in the following way.

[0041] The simulation model structure is constructed based on the packaging platform type and packaging platform structural parameters, and the structural dimensions and material properties of the sub-model structures in the simulation model structure are determined.

[0042] Furthermore, prior to step S13, the method further includes: First, check whether the structural dimensions and material properties of the sub-model structures in the simulation model structure meet the requirements.

[0043] Next, if the structural dimensions and material properties of the sub-model structure meet the requirements, the step of obtaining the pre-configured solution information for warpage analysis based on the simulation model structure is executed.

[0044] Finally, if the structural dimensions and material properties of the sub-model structure do not meet the requirements, the structural dimensions or material properties of the sub-model structure are adjusted, and then the step of obtaining the pre-configured solution information for warpage analysis based on the simulation model structure is executed.

[0045] In this embodiment, the client or server checks whether the structural dimensions and material properties of the sub-model structure are within the physically feasible and technologically reasonable range. For example, whether the thickness of the structure is a positive number and greater than the minimum technological limit. The client can modify and adjust the structural dimensions and material properties of the sub-model structure; if no modification is needed, it can proceed directly to the next step. Thus, by pre-checking the structural dimensions and material properties of the sub-model structure before generating the solution information for the simulation model structure, the accuracy of the input data is improved, thereby ensuring the accuracy of the simulation warp test.

[0046] Furthermore, step S13 can be implemented in the following way.

[0047] Based on the simulation model structure, obtain the corresponding material parameters, temperature parameters, solution parameters, simulation mesh size, and solution call information.

[0048] In this step, the simulation mesh size and solution call information are intelligently determined and preset based on the simulation model structure.

[0049] Step S14 can be achieved in the following way.

[0050] The warping results of the simulation model structure are obtained by analyzing and processing the material parameters, temperature parameters, solution parameters, simulation mesh size, and solution call information.

[0051] Further, please see Figure 6 , Figure 6 for Figure 1 A flowchart illustrating the steps following step S14. After step S14, the method further includes: Step S15: Obtain a warping analysis report of the simulation model structure based on the warping results. The warping analysis report includes at least the warping result curve and the warping result analysis image corresponding to the warping results.

[0052] In this embodiment, please refer to Figure 7 , Figure 7 This is a partial schematic diagram of the warpage analysis report provided in this embodiment. The warpage result curve includes a numerical table of warpage results under different temperature conditions obtained based on the warpage results, such as... Figure 7 The "Warpage Result Curve" displayed includes a "Warpage Value Table for Each Temperature Condition." The warpage result curve also includes a warpage result curve with "Temperature" on the x-axis and "Warpage Result" on the y-axis, such as... Figure 7 The "Warpage Result Curves" displayed in the document include "Warpage Curves for Various Temperature Conditions." The warpage result curves also include the diagonal deformation curves of the warpage result, such as... Figure 7 The "diagonal deformation curve" is shown in the "warping result curve".

[0053] In this embodiment, the warping result analysis image includes, for example, the image shown. Figure 7 The images displayed in the "Warpage Result Analysis Image" include the overall deformation cloud map and the diagonal deformation cloud map. This provides a multi-faceted view of the warpage results of the chip packaging structure.

[0054] Step S16: Obtain the warping simulation report of the simulation model structure based on the simulation model structure, solution information, and warping analysis report.

[0055] In this step, please refer to Figure 8 , Figure 8 This is a partial schematic diagram of the warpage simulation report provided in this embodiment. Figure 8 The simulation displays warpage values ​​and corresponding warpage analysis images under different temperature conditions. For example, it shows a warpage value of 9.6106 micrometers at 30 degrees Celsius and a warpage image at that temperature. After the warpage results are generated, the entire warpage simulation process of the chip package structure is integrated into a warpage simulation report, which can be presented in PowerPoint format. This provides a convenient and intuitive demonstration of the chip package structure warpage simulation process.

[0056] Furthermore, prior to step S15, the method further includes: First, check if there are any abnormalities in the warping results.

[0057] Next, if the warping result is abnormal, the structural dimensions or material properties of the sub-model structure in the simulation model structure are adjusted, and then the step of obtaining the pre-configured solution information for warping degree analysis based on the simulation model structure is executed.

[0058] Finally, if there are no abnormalities in the warping results, proceed with the step of obtaining a warping analysis report of the simulation model structure based on the warping results.

[0059] In this embodiment, the client or server detects whether the warping result is physically reasonable or numerically reliable. If there is an anomaly, the client can modify and adjust the structural dimensions and material properties of the sub-model structure and reconstruct the simulation model structure.

[0060] Furthermore, prior to step S15, the method further includes: First, check whether the warping result matches the expected warping result.

[0061] Next, if the warping result does not meet the expected warping result, the structural dimensions or material properties corresponding to the sub-model structure in the simulation model structure are adjusted, and then the step of obtaining the pre-configured solution information for warping degree analysis based on the simulation model structure is executed.

[0062] Finally, if the warping result matches the expected warping result, proceed with the step of obtaining a warping analysis report of the simulation model structure based on the warping result.

[0063] In this embodiment, the client or server checks whether the warpage result matches the expected warpage result. If not, the client can modify and adjust the structural dimensions and material properties of the sub-model structure, and redesign the chip packaging structure and reconstruct the corresponding simulation model structure. This increases the flexibility and fault tolerance of the chip packaging structure warpage simulation method.

[0064] Based on the same inventive concept, please refer to Figure 9 , Figure 9 This is a schematic diagram of the functional modules of a warpage simulation device 20 for a chip packaging structure provided in this embodiment. This embodiment can divide the memory information update device 20 into functional modules according to the above method embodiment. For example, each function can be divided into its own functional modules, or two or more functions can be integrated into one processing module. The integrated modules can be implemented in hardware or as software functional modules. It should be noted that the module division in this embodiment is illustrative and only represents one logical functional division; actual implementation may have other division methods. For example, in the case of dividing each functional module according to its own function... Figure 9 The illustrated chip package structure warpage simulation device 20 is merely a schematic diagram. The chip package structure warpage simulation device 20 may include an acquisition module 200, a construction module 210, a determination module 220, and an analysis and processing module 230. The functions of each module of this chip package structure warpage simulation device will be described in detail below.

[0065] The acquisition module 200 is used to acquire the model structure parameters corresponding to the chip package structure input by the client.

[0066] In this embodiment, the acquisition module 200 can be used to perform... Figure 1 For a detailed description of the acquisition module 200, please refer to the description of step S11 shown.

[0067] The construction module 210 is used to construct the simulation model structure based on the model structure parameters. The simulation model structure includes sub-model structures and the corresponding structural dimensions and material properties of the sub-model structures. In this embodiment, the construction module 210 can be used to execute... Figure 1 For a detailed description of the construction module 210, see the description of step S12 shown.

[0068] The determination module 220 is used to obtain pre-configured solution information for warpage analysis based on the structure of the simulation model, wherein the solution information includes at least solution parameters.

[0069] In this embodiment, the determining module 220 can be used to perform...Figure 1 For a detailed description of the determination module 220, please refer to the description of step S13 shown.

[0070] The analysis and processing module 230 is used to analyze and process the simulation model structure based on the solution information to obtain the warping result of the simulation model structure. The warping result includes the degree of warping of the simulation model structure under different temperature conditions.

[0071] In this embodiment, the analysis and processing module 230 can be used to execute... Figure 1 For a detailed description of the analysis and processing module 230, please refer to the description of step S14 shown.

[0072] Based on the same inventive concept, embodiments of this application also provide an electronic device, including a memory and a processor. The memory stores one or more programs, and when the processor executes one or more programs, it implements the warpage simulation method for chip package structures as described in the preceding multiple first aspects. The aforementioned warpage simulation method for chip package structures can construct a simulation model structure using model structure parameters of different chip package structures, and simultaneously match the solution information corresponding to the simulation model structure to analyze its warpage degree. This significantly reduces operational complexity and improves the efficiency and accuracy of warpage simulation testing, thereby enhancing the market competitiveness of the electronic device.

[0073] In summary, the warpage simulation method, apparatus, and electronic device for chip packaging structures provided in this application are applied to a server. First, the model structure parameters corresponding to the chip packaging structure input by the client are obtained. Next, a simulation model structure is constructed based on the model structure parameters, wherein the simulation model structure includes sub-model structures and their corresponding structural dimensions and material properties. Then, pre-configured solution information for warpage analysis is obtained based on the simulation model structure, wherein the solution information includes at least solution parameters. Finally, the simulation model structure is analyzed and processed based on the solution information to obtain the warpage result of the simulation model structure. The above scheme constructs simulation model structures using model structure parameters for different chip packaging structures and simultaneously matches the corresponding solution information for warpage analysis, significantly reducing operational complexity and improving the efficiency and accuracy of warpage simulation testing.

[0074] This application describes embodiments with reference to flowchart illustrations and / or block diagrams of methods, apparatus, and computer program products according to embodiments of this application. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0075] Although this application has been described herein in conjunction with various embodiments, those skilled in the art, by reviewing the accompanying drawings, disclosure, and appended claims, will understand and implement other variations of the disclosed embodiments in carrying out the claimed application. In the claims, the word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude a plurality. A single processor or other unit can implement several functions listed in the claims. While different dependent claims may recite certain measures, this does not mean that these measures cannot be combined to produce a good effect.

[0076] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A method for simulating the warpage of a chip packaging structure, characterized in that, Applied to a server, wherein the server communicates with a client, the method includes: Obtain the model structure parameters corresponding to the chip packaging structure input by the client; A simulation model structure is constructed based on the model structure parameters, wherein the simulation model structure includes sub-model structures and the corresponding structural dimensions and material properties of the sub-model structures; Based on the simulation model structure, pre-configured solution information for warpage analysis is obtained, wherein the solution information includes at least solution parameters; The simulation model structure is analyzed and processed based on the solution information to obtain the warping result of the simulation model structure, wherein the warping result includes the degree of warping of the simulation model structure under different temperature conditions.

2. The warpage simulation method as described in claim 1, characterized in that, The step of obtaining the model structure parameters corresponding to the chip packaging structure input by the client includes: Obtain the packaging platform type corresponding to the chip packaging structure input by the client; Obtain the packaging platform structure parameters corresponding to the chip packaging structure input by the client, wherein the packaging platform structure parameters include at least the packaging platform structure type and the quantity corresponding to the packaging platform structure type.

3. The warpage simulation method as described in claim 2, characterized in that, The step of constructing the simulation model structure based on the model structure parameters includes: The simulation model structure is constructed based on the packaging platform type and the packaging platform structural parameters, and the structural dimensions and material properties of the sub-model structures in the simulation model structure are determined.

4. The warpage simulation method as described in claim 3, characterized in that, Prior to the step of obtaining pre-configured solution information for warpage analysis based on the simulation model structure, the method further includes: Check whether the structural dimensions and material properties of the sub-model structures in the simulation model structure meet the requirements; If the structural dimensions and material properties corresponding to the sub-model structure meet the requirements, then the step of obtaining the pre-configured solution information for warpage analysis based on the simulation model structure is executed. If the structural dimensions and material properties corresponding to the sub-model structure do not meet the requirements, then after adjusting the structural dimensions or material properties corresponding to the sub-model structure, the step of obtaining the pre-configured solution information for warpage analysis based on the simulation model structure is executed.

5. The warpage simulation method as described in claim 1, characterized in that, The step of obtaining pre-configured solution information for warpage analysis based on the simulation model structure includes: Based on the simulation model structure, obtain the corresponding material parameters, temperature parameters, solution parameters, simulation mesh size, and solution call information. The step of analyzing and processing the simulation model structure based on the solution information to obtain the warping result of the simulation model structure includes: The warping result of the simulation model structure is obtained by analyzing and processing the simulation model structure based on the material parameters, temperature parameters, solution parameters, simulation mesh size, and solution call information.

6. The warpage simulation method as described in claim 1, characterized in that, After the step of analyzing and processing the simulation model structure based on the solution information to obtain the warping result of the simulation model structure, the method further includes: Based on the warping results, a warping analysis report of the simulation model structure is obtained, wherein the warping analysis report includes at least the warping result curve and the warping result analysis image corresponding to the warping results; Based on the simulation model structure, the solution information, and the warping analysis report, a warping simulation report of the simulation model structure is obtained.

7. The warpage simulation method as described in claim 6, characterized in that, Before the step of obtaining the warping analysis report of the simulation model structure based on the warping results, the method further includes: The test will detect whether there are any abnormalities in the warping results; If the warping result is abnormal, the structural dimensions or material properties corresponding to the sub-model structure in the simulation model structure are adjusted, and then the step of obtaining the pre-configured solution information for warping degree analysis based on the simulation model structure is executed. If the warping result is not abnormal, then proceed to the step of obtaining a warping analysis report of the simulation model structure based on the warping result.

8. The warpage simulation method as described in claim 6, characterized in that, Before the step of obtaining the warping analysis report of the simulation model structure based on the warping results, the method further includes: The test is performed to determine whether the warping result matches the expected warping result. If the warping result does not meet the expected warping result, then after adjusting the structural dimensions or material properties of the sub-model structure in the simulation model structure, the step of obtaining the pre-configured solution information for warping degree analysis based on the simulation model structure is executed. If the warping result matches the expected warping result, then the step of obtaining a warping analysis report of the simulation model structure based on the warping result is executed.

9. A warpage simulation device for a chip packaging structure, characterized in that, Applied to a server, the server communicating with a client, the device includes: The acquisition module is used to acquire the model structure parameters corresponding to the chip packaging structure input by the client; A construction module is used to construct a simulation model structure based on the model structure parameters, wherein the simulation model structure includes sub-model structures and the corresponding structural dimensions and material properties of the sub-model structures; The determination module is used to obtain pre-configured solution information for warpage analysis based on the structure of the simulation model, wherein the solution information includes at least solution parameters; The analysis and processing module is used to analyze and process the simulation model structure according to the solution information to obtain the warping result of the simulation model structure, wherein the warping result includes the degree of warping of the simulation model structure under different temperature conditions.

10. An electronic device, characterized in that, include: Memory, used to store one or more programs; A processor, when the one or more programs are executed by the processor, implements the warpage simulation method for the chip package structure as described in any one of claims 1-8.

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