Voltage conversion module and related device

Abstract

The embodiment of the invention provides a voltage conversion module and a related device, the voltage conversion module comprises a first BUCK circuit and a plurality of second BUCK circuits, and a voltage regulation controller is used for providing pulse width modulation signals of different phases for the multi-phase BUCK circuits so as to realize interleaved parallel connection of the multi-phase BUCK circuits and is used for controlling the working state of the multi-phase BUCK circuits; the first BUCK circuit comprises a first power module and a first inductor, and the first power module is manufactured by adopting a voltage process lower than or equal to a first preset voltage; the second BUCK circuit comprises a second power module and a second inductor, and the second power module is manufactured by adopting a voltage process higher than or equal to a second preset voltage; the first inductor and the second inductor are connected with the output end of the voltage conversion module; and when the load is in a light load state, the first BUCK circuit is used for supplying power to the load. By adopting the method, the power supply efficiency can be improved.

Description

Technical Field

[0001] This application relates to the field of computer technology, and in particular to a voltage conversion module and related devices. Background Technology

[0002] The power supply of a personal computer's (PC) central processing unit (CPU) has a large load current and high transient response requirements. Current CPU power supply topologies all employ multi-phase buck circuits connected in parallel (a buck circuit, also known as a step-down circuit, is a DC-DC converter where the output voltage is lower than the input voltage). Figure 1 As shown, the CPU power supply topology includes a voltage regulator controller, DrMOS, and an inductor. The voltage regulator controller is a pulse-width modulation (PWM) controller, and DrMOS is a power module that integrates a driver and a half-bridge power switch. Figure 1 Each horizontal row of circuits in the middle is a phase. Each phase can implement an independent BUCK circuit. The PWMs between each phase have a certain misalignment (denoted as PWM1, PWM2, PWM3, and PWM4 respectively), that is, there is a phase difference, thereby realizing the interleaved parallel connection of multi-phase BUCK circuits.

[0003] In typical PC user scenarios, the CPU power supply load current is very small. For multi-phase BUCK circuits, only the first phase (ph1) operates. Therefore, improving the power efficiency of ph1 is crucial for improving overall system battery life. Current research has introduced a solution involving large and small inductors, replacing the ph1 inductor with a larger inductance value. Increasing the inductance value in the BUCK circuit reduces inductor ripple current, thereby reducing inductor losses under light loads and improving power efficiency. However, the efficiency improvement brought by this solution is still limited. Summary of the Invention

[0004] This application provides a voltage conversion module and related devices that can improve power efficiency.

[0005] In a first aspect, embodiments of this application provide a voltage conversion module, which includes a voltage regulator controller and a multiphase buck converter BUCK circuit. The multiphase BUCK circuit includes a first BUCK circuit and multiple second BUCK circuits, wherein:

[0006] A voltage regulator controller is used to provide pulse width modulation signals of different phases to a multiphase BUCK circuit to realize the interleaved parallel connection of the multiphase BUCK circuit, and to control the operating state of the multiphase BUCK circuit.

[0007] The first BUCK circuit includes a first power module and a first inductor, wherein the output terminal of the first power module is connected to the input terminal of the first inductor, and the first power module is manufactured using a voltage process that is lower than or equal to a first preset voltage.

[0008] The second BUCK circuit includes a second power module and a second inductor. The output terminal of the second power module is connected to the input terminal of the second inductor. The second power module is manufactured using a voltage process that is higher than or equal to a second preset voltage. The first preset voltage is lower than the second preset voltage.

[0009] Both the first and second inductors are connected to the output of the voltage conversion module;

[0010] When the load is lightly loaded, the first BUCK circuit is used to supply power to the load.

[0011] Using the embodiments of this application, a first BUCK circuit specifically designed for light-load scenarios is provided. The first power module in this first BUCK circuit uses a low-voltage power switch, unlike the second power modules in other second BUCK circuits which use a high-voltage power switch. The power switch of the first power module in the first BUCK current has a smaller current-carrying capacity, unlike the second power modules in other second BUCK circuits which use a larger current-carrying power switch. With this design, when the first BUCK circuit is used to power the load in a light-load scenario, the drive loss and switching loss of the first power module in the first BUCK circuit are smaller, thus the first power switching loss is smaller, thereby improving the power efficiency in light-load scenarios.

[0012] In conjunction with the first aspect, in one optional implementation, the current-carrying capacity of the first power module is lower than or equal to a first preset current, the current-carrying capacity of the second power module is greater than or equal to a second preset current, and the first preset current is lower than the second preset current.

[0013] In conjunction with the first aspect, in one alternative implementation, both the first power module and the second power module include a driver and a power switch, wherein the power switch includes a half-bridge metal-oxide-semiconductor field-effect transistor or a wide bandgap semiconductor.

[0014] In conjunction with the first aspect, in one optional implementation, the inductance value of the first inductor is greater than or equal to a first preset inductance value, the inductance value of the second inductor is less than or equal to a second preset inductance value, and the first preset inductance value is greater than the second preset inductance value.

[0015] It should be noted that the first inductor in the first BUCK circuit is designed to have a relatively large value, but the current carrying capacity of the first inductor is relatively weak. Therefore, it can adopt a smaller or the same package specification as the second inductor. Since the inductance is significantly increased, the inductor ripple current can be significantly reduced. In light load scenarios, the inductor loss will also be significantly reduced, further improving power efficiency.

[0016] In conjunction with the first aspect, in one optional implementation, the voltage regulator controller is used to determine the load state and, when the load is lightly loaded, controls the first BUCK circuit to enter the working state. That is, the voltage regulator controller can determine the load state and selectively select the appropriate BUCK circuit to operate based on that state, improving the flexibility of BUCK circuit control and preventing some BUCKs from operating unnecessarily.

[0017] In conjunction with the first aspect, in one optional implementation, when the load is under heavy load, the first BUCK circuit is used to power the load. Specifically, the voltage regulator cannot detect that the first BUCK circuit is a dedicated BUCK circuit for light loads (in this case, it can be assumed that the voltage regulator does not support Baby Phase mode). In this case, when the load is under light load, it is connected to the first power module in the first BUCK circuit via PWM, that is, the first power module participates in the operation, enabling the first BUCK circuit to power the load, and the second BUCK circuit does not need to power the load. When the load is under heavy load, the first power module also participates in the operation, that is, the first BUCK circuit powers the load, and the voltage regulator will also select at least one of the aforementioned multiple second BUCK circuits to power the load.

[0018] In conjunction with the first aspect, in one alternative implementation, the first power module and the second power module are two different integrated circuit ICs.

[0019] In conjunction with the first aspect, in one optional implementation, a first power module and a second power module are packaged within the target integrated circuit (IC). It can be understood that packaging the first and second power modules within a single integrated circuit results in a high degree of integration.

[0020] In conjunction with the first aspect, in one alternative implementation, the target IC includes a first wafer, a second wafer, a third wafer, a fourth wafer, a fifth wafer, and a sixth wafer, wherein:

[0021] The first wafer includes the drive circuitry for the first power module;

[0022] The second wafer includes the high-side power switch of the first power module;

[0023] The third wafer includes the low-side power switch of the first power module;

[0024] The fourth wafer includes the drive circuitry for the second power module;

[0025] The fifth wafer includes the high-side power switch of the second power module;

[0026] The sixth wafer includes the low-side power switch of the second power module.

[0027] It is understandable that the first power module and the second power module are packaged in one integrated circuit, which is a packaging method with a high degree of integration.

[0028] In conjunction with the first aspect, in one alternative implementation, the target IC includes a seventh wafer, a second wafer, a third wafer, a fifth wafer, and a sixth wafer, wherein:

[0029] The seventh wafer includes the driving circuit for the first power module and the driving circuit for the second power module.

[0030] The second wafer includes the high-side power switch of the first power module;

[0031] The third wafer includes the low-side power switch of the first power module;

[0032] The fifth wafer includes the high-side power switch of the second power module;

[0033] The sixth wafer includes the low-side power switch of the second power module.

[0034] It is understandable that the first power module and the second power module are packaged in one integrated circuit, which is a packaging method with a high degree of integration.

[0035] In conjunction with the first aspect, in one alternative implementation, the target IC includes an eighth wafer and a ninth wafer, wherein:

[0036] The eighth wafer includes a drive circuit for the first power module, a high-side power switch for the first power module, and a low-side power switch for the first power module.

[0037] The ninth wafer includes a drive circuit for the second power module, a high-side power switch for the second power module, and a low-side power switch for the second power module.

[0038] It is understandable that the first power module and the second power module are packaged in one integrated circuit, which is a packaging method with a high degree of integration.

[0039] In conjunction with the first aspect, in one alternative implementation, the target IC includes a tenth wafer, which includes a driving circuit for a first power module, a high-side power switch for the first power module, a low-side power switch for the first power module, a driving circuit for a second power module, a high-side power switch for the second power module, and a low-side power switch for the second power module.

[0040] It is understandable that the first power module and the second power module are packaged in one integrated circuit, which is a packaging method with a high degree of integration.

[0041] Secondly, embodiments of this application provide a power management module, which includes the voltage conversion module described in the first aspect or any optional implementation of the first aspect.

[0042] Thirdly, embodiments of this application provide an electronic device that includes the voltage conversion module described in the first aspect or any optional implementation of the first aspect. Optionally, the electronic device includes a power management module, which includes the voltage conversion module described in the first aspect or any optional implementation of the first aspect.

[0043] It should be understood that the descriptions of technical features, technical solutions, beneficial effects, or similar language in this application do not imply that all features and advantages can be achieved in any single embodiment. Rather, it is understood that the description of a feature or beneficial effect means that a specific technical feature, technical solution, or beneficial effect is included in at least one embodiment. Therefore, the descriptions of technical features, technical solutions, or beneficial effects in this specification do not necessarily refer to the same embodiment. Furthermore, the technical features, technical solutions, and beneficial effects described in this embodiment can be combined in any suitable manner. Those skilled in the art will understand that embodiments can be implemented without one or more specific technical features, technical solutions, or beneficial effects of a particular embodiment. In other embodiments, additional technical features and beneficial effects may be identified in specific embodiments that do not embody all embodiments. Attached Figure Description

[0044] The accompanying drawings used in the embodiments of this application are described below.

[0045] Figure 1 This is a CPU power supply topology diagram provided in an embodiment of this application;

[0046] Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0047] Figure 3 This is a schematic diagram of the structure of another electronic device provided in the embodiments of this application;

[0048] Figure 4 This is a schematic diagram of the structure of a voltage conversion module provided in an embodiment of this application;

[0049] Figure 5 This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0050] Figure 6 This is a schematic diagram of the structure of multiple power modules provided in an embodiment of this application;

[0051] Figure 7 This is a schematic diagram of the voltage conversion module provided in the embodiments of this application;

[0052] Figure 8 This is a schematic diagram of the structure of a target integrated circuit IC provided in an embodiment of this application;

[0053] Figure 9 This is a schematic diagram of the structure of a target integrated circuit IC provided in an embodiment of this application;

[0054] Figure 10 This is a schematic diagram of the structure of a target integrated circuit IC provided in an embodiment of this application;

[0055] Figure 11 This is a schematic diagram of the structure of a target integrated circuit IC provided in an embodiment of this application;

[0056] Figure 12A This is a schematic diagram of the structure of multiple power modules provided in an embodiment of this application;

[0057] Figure 12B This is a schematic diagram of the structure of a voltage conversion module provided in an embodiment of this application. Detailed Implementation

[0058] The terminology used in the following embodiments of this application is for the purpose of describing specific embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to include the plural expressions as well, unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in this application refers to and includes any or all possible combinations of one or more of the listed items. Hereinafter, the terms “first,” “second,” etc., are used only to distinguish different objects and should not be construed as implying or suggesting relative importance or implicitly indicating the number or sequence of the indicated technical features. Thus, a feature defined as “first” or “second” may explicitly or implicitly include one or more of that feature, and in the description of the embodiments of this application, unless otherwise stated, “a plurality” means two or more.

[0059] For example, the electronic device in the embodiments of this application may be a personal computer (PC), tablet computer, ultra-mobile personal computer (UMPC), netbook, smart screen device, smart TV, mobile phone, as well as cellular phone, personal digital assistant (PDA), wearable device (such as smartwatch, smart bracelet) and other devices that need to convert the voltage of battery or other forms of power supply into a voltage that the load can use. The embodiments of this application do not impose special restrictions on the specific form of the electronic device.

[0060] like Figure 2 As shown, the electronic device in this embodiment includes a battery 201, a power management module 202, and a load 203. The input terminal of the power management module 202 is connected to the battery 201, and the output terminal of the power management module 202 is connected to the load 203. The power management module 202 converts the voltage of the battery 201 and supplies power to the load 203 with the converted voltage.

[0061] The specifications of battery 201 are not limited. For example, it can be a battery with 2 cells (e.g., corresponding to 9V), 3 cells (e.g., corresponding to 12V), or 4 cells (e.g., corresponding to 18V). The power management module 202 can convert a relatively high voltage input to a relatively low voltage output. For example, it can convert the 9V input of battery 201 to a 1V (or other value) output and use the 1V output to power the load 203. It should be noted that the specific values ​​mentioned here are for illustrative purposes only.

[0062] The load 203 can be a device in an electronic device that requires power, such as a processor (e.g., CPU), internal memory, display screen, camera, and wireless communication module, etc., and is not specifically limited here.

[0063] For example, taking an electronic device as a PC, Figure 3 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. That is, exemplary, Figure 3 The electronic device shown can be a PC.

[0064] like Figure 3As shown, the electronic device may include a processor 110, an external memory interface 120, an internal memory 129, a universal serial bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, a headphone jack 170D, a sensor module 180, buttons 190, a motor 191, an indicator 192, a camera 193, a display screen 194, and a subscriber identification module (SIM) card interface 195, etc. The sensor module 180 may include a pressure sensor 180A, a gyroscope sensor 180B, a barometric pressure sensor 180C, a magnetic sensor 180D, an accelerometer sensor 180E, a distance sensor 180F, a proximity sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, etc.

[0065] It is understood that the structures illustrated in the embodiments of this application do not constitute a specific limitation on the electronic device. In other embodiments of this application, the electronic device may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0066] Processor 110 may include one or more processing units, such as a Central Processing Unit (CPU), an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural network processing unit (NPU). Different processing units may be independent devices or integrated into one or more processors. The controller can generate operation control signals based on instruction opcodes and timing signals to control instruction fetching and execution.

[0067] The processor 110 may also include a memory for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. This memory can store instructions or data that the processor 110 has just used or that are used repeatedly. If the processor 110 needs to use the instruction or data again, it can retrieve it directly from the memory. This avoids repeated accesses, reduces the waiting time of the processor 110, and thus improves the efficiency of the system.

[0068] In some embodiments, the processor 110 may include one or more interfaces. Interfaces may include an inter-integrated circuit (I2C) interface, an inter-integrated circuit sound (I2S) interface, a pulse code modulation (PCM) interface, a universal asynchronous receiver / transmitter (UART) interface, a mobile industry processor interface (MIPI), a general-purpose input / output (GPIO) interface, a subscriber identity module (SIM) interface, and / or a universal serial bus (USB) interface, etc.

[0069] The I2C interface is a bidirectional synchronous serial bus, including a serial data line (SDA) and a serial clock line (SCL). In some embodiments, the processor 110 may include multiple I2C buses. The processor 110 can couple to the touch sensor 180K, charger, flash, camera 193, etc., through different I2C bus interfaces. For example, the processor 110 can couple to the touch sensor 180K through the I2C interface, enabling the processor 110 and the touch sensor 180K to communicate through the I2C bus interface, thereby realizing the touch function of the electronic device.

[0070] The I2S interface can be used for audio communication. In some embodiments, the processor 110 may include multiple I2S buses. The processor 110 can be coupled to the audio module 170 via the I2S bus to enable communication between the processor 110 and the audio module 170. In some embodiments, the audio module 170 can transmit audio signals to the wireless communication module 160 via the I2S interface to enable the function of answering phone calls through a Bluetooth headset.

[0071] The PCM interface can also be used for audio communication, sampling, quantizing, and encoding analog signals. In some embodiments, the audio module 170 and the wireless communication module 160 can be coupled via the PCM bus interface. In some embodiments, the audio module 170 can also transmit audio signals to the wireless communication module 160 via the PCM interface, enabling the function of answering phone calls through a Bluetooth headset. Both the I2S interface and the PCM interface can be used for audio communication.

[0072] The UART interface is a universal serial data bus used for asynchronous communication. This bus can be a bidirectional communication bus. It converts the data to be transmitted between serial and parallel communication. In some embodiments, the UART interface is typically used to connect the processor 110 and the wireless communication module 160. For example, the processor 110 communicates with the Bluetooth module in the wireless communication module 160 via the UART interface to implement Bluetooth functionality. In some embodiments, the audio module 170 can transmit audio signals to the wireless communication module 160 via the UART interface to enable music playback through Bluetooth headphones.

[0073] The MIPI interface can be used to connect the processor 110 to peripheral devices such as the display screen 194 and the camera 193. The MIPI interface includes a camera serial interface (CSI) and a display serial interface (DSI). In some embodiments, the processor 110 and the camera 193 communicate via the CSI interface to enable the electronic device to capture images. The processor 110 and the display screen 194 communicate via the DSI interface to enable the electronic device to display images.

[0074] The GPIO interface can be configured via software. It can be configured as a control signal or a data signal. In some embodiments, the GPIO interface can be used to connect the processor 110 to a camera 193, a display screen 194, a wireless communication module 160, an audio module 170, a sensor module 180, etc. The GPIO interface can also be configured as an I2C interface, an I2S interface, a UART interface, a MIPI interface, etc.

[0075] USB port 130 is a USB standard compliant interface, which can be a Mini USB port, Micro USB port, USB Type-C port, etc. USB port 130 can be used to connect a charger to charge electronic devices, and can also be used for data transfer between electronic devices and peripheral devices. It can also be used to connect headphones for audio playback. This interface can also be used to connect other electronic devices, such as AR devices.

[0076] It is understood that the interface connection relationships between the modules illustrated in the embodiments of this application are merely illustrative and do not constitute a limitation on the structure of the electronic device. In other embodiments of this application, the electronic device may also employ different interface connection methods or combinations of multiple interface connection methods as described in the above embodiments.

[0077] The charging management module 140 receives charging input from a charger. The charger can be a wireless charger or a wired charger. In some wired charging embodiments, the charging management module 140 receives charging input from the wired charger via a USB interface 130. In some wireless charging embodiments, the charging management module 140 receives wireless charging input via the wireless charging coil of the electronic device. While charging the battery 142, the charging management module 140 can also supply power to the electronic device via the power management module 141.

[0078] The power management module 141 is used to connect the battery 142 to the processor 110, and optionally, it can also be connected to the charging management module 140. The power management module 141 receives input from the battery 142 and / or the charging management module 140 to power loads, such as the processor 110, internal memory 129, display 194, camera 193, and wireless communication module 160.

[0079] The wireless communication function of electronic devices can be realized through antenna 1, antenna 2, mobile communication module 150, wireless communication module 160, modem processor and baseband processor, etc.

[0080] Antenna 1 and antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in the electronic device can be used to cover one or more communication frequency bands. Different antennas can also be reused to improve antenna utilization. For example, antenna 1 can be reused as a diversity antenna for a wireless local area network. In some other embodiments, the antennas can be used in conjunction with a tuning switch.

[0081] The mobile communication module 150 can provide solutions for wireless communication applications including 2G / 3G / 4G / 5G in electronic devices. The mobile communication module 150 may include at least one filter, switch, power amplifier, low noise amplifier (LNA), etc. The mobile communication module 150 can receive electromagnetic waves via antenna 1, and perform filtering, amplification, and other processing on the received electromagnetic waves before transmitting them to a modem processor for demodulation. The mobile communication module 150 can also amplify the signal modulated by the modem processor and convert it into electromagnetic waves for radiation via antenna 1. In some embodiments, at least some functional modules of the mobile communication module 150 may be housed in processor 110. In some embodiments, at least some functional modules of the mobile communication module 150 and at least some modules of the processor 110 may be housed in the same device.

[0082] The modem processor may include a modulator and a demodulator. The modulator modulates the low-frequency baseband signal to be transmitted into a mid-to-high frequency signal. The demodulator demodulates the received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low-frequency baseband signal to the baseband processor for processing. After processing by the baseband processor, the low-frequency baseband signal is transmitted to the application processor. The application processor outputs sound signals through audio devices (not limited to speaker 170A, receiver 170B, etc.) or displays images or videos through the display screen 194. In some embodiments, the modem processor may be a separate device. In other embodiments, the modem processor may be independent of the processor 110 and may be housed in the same device as the mobile communication module 150 or other functional modules.

[0083] The wireless communication module 160 can provide solutions for wireless communication applications in electronic devices, including wireless local area networks (WLANs) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), and infrared (IR) technologies. The wireless communication module 160 can be one or more devices integrating at least one communication processing module. The wireless communication module 160 receives electromagnetic waves via antenna 2, demodulates and filters the electromagnetic wave signals, and sends the processed signal to processor 110. The wireless communication module 160 can also receive signals to be transmitted from processor 110, frequency modulate and amplify them, and then convert them into electromagnetic waves for radiation via antenna 2.

[0084] In some embodiments, antenna 1 of the electronic device is coupled to mobile communication module 150, and antenna 2 is coupled to wireless communication module 160, enabling the electronic device to communicate with networks and other devices via wireless communication technology. The wireless communication technology may include Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Time-Division Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), BT, GNSS, WLAN, NFC, FM, and / or IR technologies. The GNSS may include Global Positioning System (GPS), Global Navigation Satellite System (GLONASS), BeiDou Navigation Satellite System (BDS), Quasi-Zenith Satellite System (QZSS), and / or Satellite Based Augmentation Systems (SBAS).

[0085] Electronic devices implement display functions through a GPU, a display screen 194, and an application processor. The GPU is a microprocessor for image processing, connecting the display screen 194 and the application processor. The GPU is used to perform mathematical and geometric calculations and for graphics rendering. The processor 110 may include one or more GPUs, which execute program instructions to generate or modify display information.

[0086] Display screen 194 is used to display images, videos, etc. Display screen 194 includes a display panel. The display panel may be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), a miniature LED, a microLED, a quantum dot light-emitting diode (QLED), etc. In some embodiments, the electronic device may include one or N displays 194, where N is a positive number greater than 1.

[0087] Electronic devices can achieve shooting functions through ISP, camera 193, video codec, GPU, display 194 and application processor.

[0088] The ISP (Image Signal Processor) is used to process data fed back from the camera 193. For example, when taking a picture, the shutter is opened, and light is transmitted through the lens to the camera's photosensitive element. The light signal is converted into an electrical signal, and the camera's photosensitive element transmits the electrical signal to the ISP for processing, converting it into an image visible to the naked eye. The ISP can also perform algorithmic optimization on image noise and brightness. The ISP can also optimize parameters such as exposure and color temperature of the shooting scene. In some embodiments, the ISP can be set in the camera 193.

[0089] Camera 193 is used to capture still images or videos. An object is projected onto a photosensitive element by generating an optical image through the lens. The photosensitive element can be a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor. The photosensitive element converts the light signal into an electrical signal, which is then passed to an ISP for conversion into a digital image signal. The ISP outputs the digital image signal to a DSP for processing. The DSP converts the digital image signal into image signals in standard RGB, YUV, or other formats. In some embodiments, the electronic device may include one or N cameras 193, where N is a positive number greater than 1.

[0090] Digital signal processors (DSPs) are used to process digital signals. Besides digital image signals, they can also process other digital signals. For example, when an electronic device is selecting a frequency, a DSP can perform a Fourier transform on the frequency energy.

[0091] Video codecs are used to compress or decompress digital video. Electronic devices can support one or more video codecs. This allows the electronic device to play or record video in various encoded formats, such as Moving Picture Experts Group (MPEG) 1, MPEG2, MPEG3, MPEG4, etc.

[0092] An NPU (Neural Processing Unit) is a computational processor for neural networks (NNs). By borrowing the structure of biological neural networks, such as the transmission patterns between neurons in the human brain, it can rapidly process input information and continuously learn on its own. NPUs enable intelligent cognitive applications in electronic devices, such as image recognition, facial recognition, speech recognition, and text understanding.

[0093] Internal memory 129 may include one or more random access memory (RAM) and one or more non-volatile memory (NVM).

[0094] Random access memory can include static random-access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), and double data rate synchronous dynamic random access memory (DDR SDRAM, such as fifth-generation DDR SDRAM, which is generally called DDR5 SDRAM). Non-volatile memory can include disk storage devices and flash memory.

[0095] Flash memory can be classified according to its operating principle, including NOR FLASH, NAND FLASH, 3D NAND FLASH, etc.; according to the level of the storage cell, including single-level cell (SLC), multi-level cell (MLC), triple-level cell (TLC), quad-level cell (QLC), etc.; and according to the storage specification, including universal flash storage (UFS) and embedded multimedia card (eMMC), etc.

[0096] The random access memory can be directly read and written by the processor 110. It can be used to store executable programs (such as machine instructions) of the operating system or other running programs, as well as user and application data.

[0097] Non-volatile memory can also store executable programs and user and application data, and can be pre-loaded into random access memory for direct reading and writing by the processor 110.

[0098] The external memory interface 120 can be used to connect to external non-volatile memory, thereby expanding the storage capacity of the electronic device. The external non-volatile memory communicates with the processor 110 through the external memory interface 120 to perform data storage functions. For example, music, video, and other files can be stored in the external non-volatile memory.

[0099] Electronic devices can implement audio functions such as music playback and recording through audio modules 170, speakers 170A, receivers 170B, microphones 170C, headphone jacks 170D, and application processors.

[0100] The audio module 170 is used to convert digital audio information into analog audio signals for output, and also to convert analog audio input into digital audio signals. The audio module 170 can also be used for encoding and decoding audio signals. In some embodiments, the audio module 170 may be located in the processor 110, or some functional modules of the audio module 170 may be located in the processor 110.

[0101] The speaker 170A, also known as a "loudspeaker," is used to convert audio electrical signals into sound signals. Electronic devices can listen to music or make hands-free calls through the speaker 170A.

[0102] The receiver 170B, also known as the "earpiece," is used to convert audio electrical signals into sound signals. When an electronic device answers a phone call or voice message, the receiver 170B can be brought close to the ear to hear the voice.

[0103] Microphone 170C, also known as a "microphone" or "voice transducer," is used to convert sound signals into electrical signals. When making a phone call or sending a voice message, the user can speak by bringing their mouth close to microphone 170C, inputting the sound signal into microphone 170C.

[0104] The 170D headphone jack is used to connect wired headphones. The 170D headphone jack can be a USB 130 interface or a 3.5mm Open Mobile Terminal Platform (OMTP) standard interface, a CTIA (Cellular Telecommunications Industry Association of the USA) standard interface.

[0105] The pressure sensor 180A is used to sense pressure signals and can convert the pressure signals into electrical signals. In some embodiments, the pressure sensor 180A may be disposed on the display screen 194.

[0106] The gyroscope sensor 180B can be used to determine the motion attitude of an electronic device. In some embodiments, the angular velocity of the electronic device about three axes (i.e., the x, y, and z axes) can be determined by the gyroscope sensor 180B.

[0107] The barometric pressure sensor 180C is used to measure air pressure. In some embodiments, the electronic device calculates altitude using the air pressure value measured by the barometric pressure sensor 180C to assist in positioning and navigation.

[0108] The magnetic sensor 180D includes a Hall sensor.

[0109] The 180E accelerometer can detect the magnitude of acceleration in various directions (typically three axes) of electronic devices.

[0110] A distance sensor 180F is used to measure distance. Electronic devices can measure distance using infrared or laser. In some embodiments, during a shooting scene, the electronic device can utilize the distance sensor 180F to measure distance for rapid focusing.

[0111] The proximity light sensor 180G may include, for example, a light-emitting diode (LED) and a light detector, such as a photodiode.

[0112] An ambient light sensor 180L is used to detect ambient light levels. Electronic devices can adaptively adjust the brightness of the display screen 194 based on the detected ambient light levels.

[0113] The fingerprint sensor 180H is used to collect fingerprints. Electronic devices can utilize the characteristics of the collected fingerprints to achieve fingerprint unlocking, app access locks, fingerprint photography, fingerprint answering of calls, etc.

[0114] Temperature sensor 180J is used to detect temperature. In some embodiments, the electronic device uses the temperature detected by temperature sensor 180J to execute a temperature processing strategy.

[0115] Touch sensor 180K, also known as a "touch device," can be located on display screen 194. The touch sensor 180K and display screen 194 together form a touchscreen, also known as a "touchscreen." Touch sensor 180K detects touch operations applied to or near it. The touch sensor can transmit the detected touch operation to the application processor to determine the type of touch event. Visual output related to the touch operation can be provided through display screen 194. In other embodiments, touch sensor 180K may also be located on the surface of the electronic device, in a different position than display screen 194.

[0116] The bone conduction sensor 180M can acquire vibration signals. In some embodiments, the bone conduction sensor 180M can acquire vibration signals from the vibrating bone segments of the human vocal cords.

[0117] Button 190 includes the power button, volume buttons, etc. Button 190 can be a mechanical button or a touch button.

[0118] Motor 191 can generate vibration alerts. Motor 191 can be used for incoming call vibration alerts or for touch vibration feedback.

[0119] Indicator 192 can be an indicator light, used to indicate charging status, power changes, or to indicate messages, missed calls, notifications, etc.

[0120] The SIM card interface 195 is used to connect a SIM card. The SIM card can be inserted into or removed from the SIM card interface 195 to achieve contact and separation with the electronic device.

[0121] The power management module supplies power to the load under various conditions, including heavy load and light load. It converts the battery voltage into a usable voltage for the load. More specifically, the voltage conversion module within the power management module converts the battery voltage into a usable voltage for the load. This voltage conversion process involves losses. The inventors of this application discovered that, under light load conditions, the highest proportion of losses comes from the power switches (such as high-side and low-side power switches), followed by the AC losses from the inductor. Based on this finding, the inventors of this application propose improvements to the power switches and inductor in the voltage conversion module. Please refer to [link to details]. Figure 4 , Figure 4 This is a schematic diagram of the structure of a voltage conversion module provided in an embodiment of this application.

[0122] like Figure 4 As shown, the voltage conversion module includes a voltage regulator controller 401 and a multiphase buck converter BUCK circuit. The multiphase BUCK circuit includes a first BUCK circuit 402 and multiple second BUCK circuits 403, wherein:

[0123] A voltage regulator controller is used to provide pulse width modulation signals of different phases to a multiphase BUCK circuit to achieve interleaved parallel connection of the multiphase BUCK circuit. The pulse width modulation signals of different phases can be represented as PWM0, PWM1, PWM2, PWM3, and PWM4 in sequence. This voltage regulator controller can also be called a voltage regulator module (VRM) or a PWM controller. This voltage regulator controller is used to control the operating state of the multiphase BUCK circuit.

[0124] The first BUCK circuit includes a first power module and a first inductor. The output terminal of the first power module is connected to the input terminal of the first inductor. The first power module is manufactured using a voltage process lower than or equal to a first preset voltage. The first preset voltage is a relatively low voltage, therefore the first power module is manufactured using a low voltage process. The magnitude of the first preset voltage can be configured according to actual needs and scenarios. Optionally, the current carrying capacity of the first power module is lower than or equal to a first preset current value. The first preset current is a relatively low current value, therefore the current carrying capacity of the first power module is small, and the magnitude of the first preset current can be configured according to actual needs and scenarios.

[0125] The second BUCK circuit includes a second power module and a second inductor. The output terminal of the second power module is connected to the input terminal of the second inductor. The second power module is manufactured using a voltage process higher than or equal to a second preset voltage. This second preset voltage is relatively high, hence the use of a higher voltage process. The magnitude of the second preset voltage can be configured according to actual needs and scenarios. The current-carrying capacity of the second power module is greater than or equal to a second preset current value. This second preset current is relatively large, hence the large current-carrying capacity of the second power module. The magnitude of the second preset current can be configured according to actual needs and scenarios; for example, the second preset current is a positive multiple of the first preset current. It should be noted that multiple second BUCK circuits correspond to multiple second power modules. The parameter configurations or specifications of these multiple second power modules can be the same or different. However, these multiple second power modules are manufactured using a voltage process higher than or equal to the second preset voltage, meaning they are all manufactured using a higher voltage process; and the current-carrying capacity of these multiple second power modules is all greater than or equal to the second preset current, meaning they have a larger current-carrying capacity.

[0126] In this embodiment, the first preset voltage is lower than the second preset voltage. For example, the second preset voltage is greater than or equal to n times the first preset voltage, where n is a positive number greater than or equal to 1. Therefore, compared with the second power module, the first power module optimizes parasitic parameters, reduces drive losses and switching losses, thereby reducing the losses of the first power module (compared to the second power module).

[0127] Optionally, the inductance value of the first inductor is greater than or equal to a first preset inductance value, which is a relatively large inductance value. This first preset inductance value can be configured according to actual needs and scenarios. Alternatively, the current-carrying capacity of the first inductor is less than or equal to a third preset current value, which is a relatively small current value. This third preset current value can be configured according to actual needs and scenarios. Similarly, the inductance value of the second inductor is less than or equal to a second preset inductance value, which is a relatively small inductance value. This second preset inductance value can be configured according to actual needs and scenarios. Optionally, the current-carrying capacity of the second inductor is greater than or equal to a fourth preset current value, which is a relatively large current value. This fourth preset current value can be configured according to actual needs and scenarios. The first preset inductance value is greater than the second preset inductance value. For example, the first preset inductance value is greater than the second inductance value by m times, where m is a positive number greater than or equal to 1. In one case, the first preset inductance value is between 1uH and 2uH, while the second inductance value is between 0.22uH and 0.33uH. The third preset current value is less than the fourth preset current value (for example, the fourth preset current value is greater than the third preset current value by r times, where r is a positive number greater than or equal to 1). Optionally, since the first inductor in the first BUCK circuit in this application is much larger than the second inductor in the second BUCK circuit, but the current carrying capacity of the first inductor in the first BUCK circuit is much smaller than that of the second inductor in the second BUCK circuit, the first inductor in the first BUCK circuit can adopt a package specification that is less than or equal to that of the second inductor in the second BUCK circuit. For example, in the voltage conversion module of a high-performance laptop's CPU, the height of the corresponding second inductor is less than or equal to 4 mm, while in the voltage conversion module of a thin and light laptop's CPU, the height of the corresponding inductor is less than or equal to 3 mm. The height of the first inductor can be greater (or its specifications), and a larger package can be provided for it.

[0128] It should be noted that multiple second BUCK circuits correspond to multiple second inductors. The parameters or specifications of these multiple second inductors may be the same or different. However, the inductance values ​​of these multiple second inductors are all less than the inductance value of the first inductor.

[0129] Both the first and second inductors are connected to the output of the voltage conversion module, which can be directly or indirectly connected to the load. Corresponding rules or strategies can be pre-configured to define which inductor(s) of the BUCK circuit will supply power to the load at a certain time or under certain conditions; for example, a voltage regulator controller.

[0130] When the load is lightly loaded, the first BUCK circuit supplies power to the load. Optionally, when the load is lightly loaded, the first BUCK circuit supplies power to the load, while the other multiple second BUCK circuits do not supply power to the load.

[0131] In this embodiment, the voltage regulator controller can determine the load state of the load, i.e., whether it is light or heavy load. For example, a reference threshold can be preset. When the load current is higher than the reference threshold, the load state is heavy load; when the load current is lower than the reference threshold, the load is light load. Of course, other modules or components may determine the load state and then notify the voltage regulator controller of the load state. Optionally, when the load is light load, the voltage regulator controller controls the first BUCK circuit to enter the working state.

[0132] In one alternative approach, the voltage regulator controller can detect that the first BUCK circuit is a dedicated BUCK circuit for light loads (in this case, the voltage regulator controller can be considered to support Baby Phase mode). In this case, when the load is lightly loaded, it is connected to the first power module in the first BUCK circuit via PWM, that is, the first power module participates in the operation, so that the first BUCK supplies power to the load, and the second BUCK circuit does not need to supply power to the load. When the load is heavily loaded, the first power module stops working, that is, the first BUCK does not supply power to the load, and the voltage regulator controller will select at least one BUCK circuit from the above-mentioned multiple second BUCK circuits to supply power to the load.

[0133] In another alternative scheme, the voltage regulator controller cannot detect that the first BUCK circuit is a dedicated BUCK circuit for light loads (in this case, it can be assumed that the voltage regulator controller does not support Baby Phase mode). In this case, when the load is lightly loaded, it is connected to the first power module in the first BUCK circuit via PWM, that is, the first power module participates in the operation, so that the first BUCK circuit supplies power to the load, and the second BUCK circuit does not need to supply power to the load. When the load is heavily loaded, the first power module also participates in the operation, that is, the first BUCK circuit supplies power to the load, and the voltage regulator controller will also select at least one BUCK circuit from the above-mentioned multiple second BUCK circuits to supply power to the load.

[0134] In this embodiment, both the first power module and the second power module include a driver and a power switch. The power switch includes a half-bridge metal-oxide-semiconductor field-effect transistor (MOSFET) or a wide-bandgap semiconductor (e.g., gallium nitride, silicon carbide, etc.). When the power switch in the first power module and the second power module uses a half-bridge metal-oxide-semiconductor field-effect transistor (MOSFET), both the first power module and the second power module can be referred to as DrMOS.

[0135] Figure 5 This application embodiment illustrates a structural diagram of a power module (such as a first power module and a second power module). The power module can be a DrMOS. It can be seen that the power module includes a drive circuit 501, a high-side power switch 502 (e.g., a high-side MOS switch), and a low-side power switch 503 (e.g., a low-side MOS switch), wherein:

[0136] The drive circuit 501 includes two inputs from voltage regulation control, namely an EN signal and a PWM signal. The EN signal is used to control the power module to work or not work through the drive circuit 501. The PWM signal can have three states: high level, low level, and no signal. The input signals of these three states are used by the drive circuit to control the power switch.

[0137] The high-side power switch 502 includes a gate, a source, and a drain. The gate of the high-side power switch 502 is connected to the drive circuit 501. The drive circuit 501 generates a drive signal (HS MOS drive signal) for the high-side power switch 502 based on the input PWM signal, and controls the high-side power switch 502 to be turned off or on. The drain of the high-side power switch 502 is connected to the input voltage Vin (usually provided by a battery). The source of the high-side power switch 502 is connected to the drain of the low-side power switch 503.

[0138] The low-side power switch 503 includes a gate, a source, and a drain. The gate of the low-side power switch 503 is connected to the driving circuit 501. The driving circuit 501 generates a driving signal (LS MOS driving signal) for the low-side power switch 503 based on the input PWM signal. This driving signal controls the low-side power switch 503 to turn on or off. The drain of the low-side power switch 503 is connected to the source of the high-side power switch 502. The source of the low-side power switch 503 is grounded.

[0139] In this circuit, the source of the high-side power switch 502 is connected to the drain of the low-side power switch 503, and the connection point between the two serves as the output terminal SW of the power module. The output terminal SW of the power module is connected to the inductor in the BUCK circuit where the power module is located, specifically to the input terminal of the inductor. For example, the output terminal of the first power module is connected to the input terminal of the first inductor in the first BUCK circuit, and the output terminal of the second power module is connected to the input terminal of the second inductor in the second BUCK circuit.

[0140] It should be noted that the structures of the first power module and the second power module are as follows: Figure 5 As shown, however, in some alternative solutions, the inputs of the first power module and the second power module can be different, such as... Figure 6As shown, although the drains of the high-side power switches in the first power module 601 and the second power module 602 are both connected to the input voltage, the input voltages are different. This means that different input voltages can be configured for the first power module 601 and the second power module 602. For example, the input voltage P_vin(V) of the second power module 602... BAT The power is supplied by a battery, and the input voltage P_vin (5V) of the first power module 601 is P_vin (V BAT After conversion, the voltage obtained is a voltage obtained by converting the battery voltage. This P_vin (5V) is less than P_vin (V). BAT ).

[0141] like Figure 7 The diagram shows a circuit topology for a voltage conversion module implemented with a voltage regulator controller, as provided in an embodiment of this application. This voltage conversion module includes five BUCK circuits (there may be more or fewer BUCK circuits). The order from top to bottom can be considered the priority of these BUCK circuits. Generally, when fewer BUCK circuits are needed, higher priority BUCK circuits are selected to participate in the operation, while lower priority BUCK circuits may not participate. However, when the load is high, lower priority BUCK circuits may also participate in the operation. Figure 7 In the diagram, the topmost BUCK circuit (corresponding to phase 0) is the first BUCK circuit mentioned earlier, and the four BUCK circuits below (corresponding to phase 1, phase 2, phase 3, and phase 4 respectively) are the multiple second BUCK circuits mentioned earlier. It can be seen that the first inductor of the first BUCK circuit is 1.5uH, while the second inductors of the multiple second BUCK circuits are all 0.15uH, meaning the first inductor is much larger than the second inductor. Compared to the second power modules of the multiple second BUCK circuits, the first power module in the first BUCK circuit has the same input voltage (P_Driver) for its drive circuit, and the input PWM signals all originate from the voltage regulator controller (VRController), but there is a phase difference. From top to bottom, they are labeled PWM0 (or baby phase PWM), PWM1, PWM2, PWM3, and PWM4 respectively. The input voltage P_vin (5V) of the high-side power switch of the first power module is different from the input voltage P_vin (V) of the high-side power switch of the multiple second power modules. BAT They are different. A voltage regulator controller (VRController) also requires an input voltage (P_controller) to operate normally.

[0142] like Figure 7As shown, the first power module in the first BUCK circuit and the second power module in the second BUCK circuit with the highest priority can be deployed in an integrated IC circuit, which can be referred to as the target integrated IC circuit for ease of description. Therefore, the target integrated IC circuit is an integrated IC circuit that includes heterogeneous power modules (such as heterogeneous DrMOS).

[0143] There are many possible encapsulation schemes for the integrated IC circuit of this heterogeneous power module. Several encapsulation schemes are listed below:

[0144] Option 1, such as Figure 8 As shown, the target IC includes multiple wafers (dies), for example, including a first wafer 801, a second wafer 802, a third wafer 803, a fourth wafer 804, a fifth wafer 805, and a sixth wafer 806, wherein:

[0145] The first wafer 801 includes a drive circuit for the first power module (such as a Baby DrMOS drive circuit).

[0146] The second wafer 802 includes the high-side power switch (such as a low-voltage Baby HS MOS) of the first power module.

[0147] The third wafer 803 includes the low-side power switch (such as a low-voltage Baby LS MOS) of the first power module.

[0148] The fourth wafer 804 includes the drive circuitry for the second power module (such as a conventional DrMOS drive circuitry).

[0149] The fifth wafer 805 includes the high-side power switch (such as a conventional HS MOS) of the second power module.

[0150] The sixth wafer 806 includes the low-side power switch (such as a conventional LS MOS) of the second power module.

[0151] Option 2, such as Figure 9 As shown, the target IC includes multiple wafers (dies), for example, including a seventh wafer 901, a second wafer 802, a third wafer 803, a fifth wafer 805, and a sixth wafer 806, wherein:

[0152] The seventh wafer 901 includes a drive circuit for the first power module (such as a Baby DrMOS drive circuit) and a drive circuit for the second power module (such as a conventional DrMOS drive circuit).

[0153] The second wafer 802 includes the high-side power switch (such as a low-voltage Baby HS MOS) of the first power module.

[0154] The third wafer 803 includes the low-side power switch (such as a low-voltage Baby LS MOS) of the first power module.

[0155] The fifth wafer 805 includes the high-side power switch (such as a conventional HS MOS) of the second power module.

[0156] The sixth wafer 806 includes the low-side power switch (such as a conventional LS MOS) of the second power module.

[0157] Option 3, such as Figure 10 As shown, the target IC includes multiple wafers (dies), for example, including an eighth wafer 1001 and a ninth wafer 1002, wherein:

[0158] The eighth wafer 1001 includes a drive circuit for the first power module (such as a Baby DrMOS drive circuit), a high-side power switch for the first power module (such as a low-voltage Baby HS MOS), and a low-side power switch for the first power module (such as a low-voltage Baby LS MOS).

[0159] The ninth wafer 1002 includes a drive circuit for the second power module (such as a conventional DrMOS drive circuit), a high-side power switch for the second power module (such as a conventional HS MOS), and a low-side power switch for the second power module (such as a conventional LS MOS).

[0160] Option 4, such as Figure 11 As shown, the target IC includes a single wafer (die), for example, a tenth wafer 1101. The tenth wafer 1101 includes a drive circuit for a first power module (such as a Baby DrMOS drive circuit), a high-side power switch for the first power module (such as a low-voltage Baby HS MOS), a low-side power switch for the first power module (such as a low-voltage Baby LS MOS), a drive circuit for a second power module (such as a conventional DrMOS drive circuit), a high-side power switch for the second power module (such as a conventional HSMOS), and a low-side power switch for the second power module (such as a conventional LS MOS).

[0161] It should be noted that the first power module and the second power module can also be two different integrated circuit ICs, for example, such as Figure 12A The diagram shows the structural relationship and input voltage of the first and second power modules, which are two different integrated circuits (ICs). The corresponding integration method is as follows: Figure 12BAs shown, the first power module corresponds to the first integrated circuit IC1201, and the second power module corresponds to the second integrated circuit IC1202. It should be noted that the first integrated circuit IC includes a drive circuit for the first power module, a high-side power switch for the first power module, and a low-side power switch for the first power module. These three parts can be on one wafer or on different wafers (e.g., on two or three wafers). Similarly, the second integrated circuit IC includes a drive circuit for the second power module, a high-side power switch for the second power module, and a low-side power switch for the second power module. These three parts can be on one wafer or on different wafers (e.g., on two or three wafers).

[0162] Using the embodiments of this application, a first BUCK circuit specifically designed for light-load scenarios is described. The first power module in this first BUCK circuit employs a low-voltage power switch, unlike the second power modules in other second BUCK circuits which use high-voltage switches. The power switch in the first power module has a smaller current-carrying capacity, unlike the second power modules in other second BUCK circuits which use power switches with larger current-carrying capacities. With this design, when the first BUCK circuit powers the load under light-load conditions, the drive loss and switching loss of the first power module in the first BUCK circuit are lower, resulting in lower first power switching losses and thus improved power efficiency under light-load conditions. Furthermore, the first inductor in the first BUCK circuit can be designed with a larger value, but its current-carrying capacity is still relatively small. Therefore, it can be packaged in a smaller or the same size package as the second inductor. Because the inductance is significantly increased, the inductor ripple current can be significantly reduced, and the inductor loss under light-load conditions will also be significantly reduced, further improving power efficiency.

[0163] The various embodiments of this application can be combined arbitrarily to achieve different technical effects.

[0164] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product. A computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the flow or function according to this application is generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid-state disk).

[0165] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. This program can be stored in a computer-readable storage medium, and when executed, it can include the processes described in the above method embodiments. The aforementioned storage medium includes various media capable of storing program code, such as ROM or random access memory (RAM), magnetic disks, or optical disks.

[0166] In summary, the above are merely embodiments of the technical solutions of this application and are not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made based on the disclosure of this application should be included within the scope of protection of this application.

Claims

1. A voltage conversion module, characterized in that, It includes a voltage regulator controller and a multiphase buck converter BUCK circuit, wherein the multiphase BUCK circuit includes a first BUCK circuit and multiple second BUCK circuits, wherein: The voltage regulation controller is used to provide pulse width modulation signals of different phases to the multiphase BUCK circuit to realize the interleaved parallel connection of the multiphase BUCK circuit, and to control the working state of the multiphase BUCK circuit. The first BUCK circuit includes a first power module and a first inductor, wherein the output terminal of the first power module is connected to the input terminal of the first inductor, and the first power module is manufactured using a voltage process lower than or equal to a first preset voltage. The second BUCK circuit includes a second power module and a second inductor, wherein the output terminal of the second power module is connected to the input terminal of the second inductor, and the second power module is manufactured using a voltage process higher than a second preset voltage; The first preset voltage is lower than the second preset voltage; Both the first inductor and the second inductor are connected to the output terminal of the voltage conversion module; When the load is lightly loaded, the first BUCK circuit is used to supply power to the load.

2. The voltage conversion module according to claim 1, characterized in that, The current carrying capacity of the first power module is lower than or equal to the first preset current, the current carrying capacity of the second power module is greater than or equal to the second preset current, and the first preset current is lower than the second preset current.

3. The voltage conversion module according to claim 1 or 2, characterized in that: Both the first power module and the second power module include a driver and a power switch, wherein the power switch includes a half-bridge metal-oxide-semiconductor field-effect transistor or a wide bandgap semiconductor.

4. The voltage conversion module according to any one of claims 1-3, characterized in that, The inductance value of the first inductor is greater than or equal to a first preset inductance value, the inductance value of the second inductor is less than or equal to a second preset inductance value, and the first preset inductance value is greater than the second preset inductance value.

5. The voltage conversion module according to any one of claims 1-4, characterized in that: The voltage regulation controller is used to determine the load state and, when the load is under light load, control the first BUCK circuit to enter the working state.

6. The voltage conversion module according to any one of claims 1-4, characterized in that: When the load is under heavy load, the first BUCK circuit is used to supply power to the load.

7. The voltage conversion module according to any one of claims 1-5, characterized in that, The first power module and the second power module are two different integrated circuits (ICs).

8. The voltage conversion module according to any one of claims 1-5, characterized in that, The first power module and a second power module are power-packaged within the target integrated circuit IC.

9. The voltage conversion module according to claim 8, characterized in that, The target IC includes a first wafer, a second wafer, a third wafer, a fourth wafer, a fifth wafer, and a sixth wafer, wherein: The first wafer includes the driving circuit of the first power module; The second wafer includes the high-side power switch of the first power module; The third wafer includes the low-side power switch of the first power module; The fourth wafer includes the drive circuitry for the second power module; The fifth wafer includes the high-side power switch of the second power module; The sixth wafer includes the low-side power switch of the second power module.

10. The voltage conversion module according to claim 8, characterized in that, The target IC includes a seventh wafer, a second wafer, a third wafer, a fifth wafer, and a sixth wafer, wherein: The seventh wafer includes the driving circuit of the first power module and the driving circuit of the second power module. The second wafer includes the high-side power switch of the first power module; The third wafer includes the low-side power switch of the first power module; The fifth wafer includes the high-side power switch of the second power module; The sixth wafer includes the low-side power switch of the second power module.

11. The voltage conversion module according to claim 8, characterized in that, The target IC includes an eighth wafer and a ninth wafer, wherein: The eighth wafer includes a driving circuit for the first power module, a high-side power switch for the first power module, and a low-side power switch for the first power module. The ninth wafer includes a drive circuit for the second power module, a high-side power switch for the second power module, and a low-side power switch for the second power module.

12. The voltage conversion module according to claim 8, characterized in that, The target IC includes a tenth wafer, which includes a driving circuit for the first power module, a high-side power switch for the first power module, a low-side power switch for the first power module, a driving circuit for the second power module, a high-side power switch for the second power module, and a low-side power switch for the second power module.

13. A power management module, characterized in that, Includes the voltage conversion module as described in any one of claims 1-12.

14. An electronic device, characterized in that, Includes the voltage conversion module as described in any one of claims 1-12.

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