Display module and alignment fitting method of display module

Abstract

The invention discloses a display module and an alignment fitting method of the display module. The display module comprises a display panel and a packaging structure located on the light emitting side of the display panel. The packaging structure comprises a packaging cover plate and a packaging pattern structure located on the side, facing the display panel, of the packaging cover plate, and at least one alignment mark is arranged in the packaging pattern structure; and the display panel and the packaging structure are aligned and attached by taking the alignment mark as an alignment reference. By the adoption of the technical scheme, the alignment recognition rate and alignment precision are improved, the requirement for the light transmittance of the packaging cover plate is reduced, and the phenomenon of misrecognition in the packaging process is avoided.

Description

Technical Field

[0001] This invention relates to the field of packaging technology, and in particular to a display module and a method for aligning and bonding the display module. Background Technology

[0002] Current silicon-based organic electroluminescence display (OLED) small-chip cover plate encapsulation technology involves applying optical clear resin (OCR) to the OLED display area, and then using small pieces of glass, cut to size, to adhere on top of the OCR to form a protective layer. However, this method of using glass corners for alignment has poor accuracy, low recognition rate, high light requirements, and the glass corners themselves are prone to chipping and breakage, easily leading to misidentification. Summary of the Invention

[0003] This invention provides a display module and a method for aligning and bonding the display module. By setting a packaging structure including alignment marks, the alignment recognition rate and alignment accuracy are improved, the requirements for the light transmittance of the packaging cover are reduced, and the occurrence of misidentification during the alignment and packaging process is avoided.

[0004] In a first aspect, the present invention provides a display module, the display module comprising: a display panel and an encapsulation structure located on the light-emitting side of the display panel;

[0005] The encapsulation structure includes an encapsulation cover and an encapsulation pattern structure located on the side of the encapsulation cover facing the display panel, wherein at least one alignment mark is provided in the encapsulation pattern structure;

[0006] The display panel and packaging structure are aligned and bonded using alignment marks as the alignment reference.

[0007] Optionally, the encapsulation pattern structure includes a pattern layer and a protective layer, with the protective layer covering the pattern layer;

[0008] The Young's modulus of the protective layer is greater than that of the pattern layer.

[0009] Optionally, the encapsulation pattern structure includes a first pattern portion, a second pattern portion, a third pattern portion and a fourth pattern portion, wherein the first pattern portion and the third pattern portion extend along a first direction, and the second pattern portion and the fourth pattern portion extend along a second direction, wherein the first direction and the second direction intersect and are both parallel to the plane of the encapsulation cover.

[0010] The first pattern section is provided with at least one first alignment mark, the second pattern section is provided with at least one second alignment mark, the third pattern section is provided with at least one third alignment mark, and the fourth pattern section is provided with at least one fourth alignment mark; the alignment marks include the first alignment mark, the second alignment mark, the third alignment mark, and the fourth alignment mark.

[0011] Optionally, along the first direction, at least one first alignment identifier and at least one third alignment identifier overlap;

[0012] Along the second direction, at least one second alignment identifier and at least one fourth alignment identifier overlap.

[0013] Optionally, the alignment identifiers include the fifth alignment identifier, the sixth alignment identifier, the seventh alignment identifier, and the eighth alignment identifier;

[0014] The fifth, sixth, seventh, and eighth alignment marks are located at the four corners of the packaging pattern structure.

[0015] Optionally, the encapsulation pattern structure includes an encapsulation surface facing the display panel side;

[0016] The package surface includes non-planar surfaces.

[0017] Secondly, the present invention provides a method for aligning and bonding a display module, the method comprising:

[0018] Provides encapsulation cover and display panel;

[0019] An encapsulation pattern structure is prepared on one side of the encapsulation cover, and at least one alignment mark is prepared in the encapsulation pattern structure; the encapsulation pattern structure and the encapsulation cover form an encapsulation structure;

[0020] The alignment mark is used as the alignment reference, and the encapsulation structure and the display panel are aligned and bonded with the side of the encapsulation pattern structure facing the display panel.

[0021] Optionally, a package cover is provided, including:

[0022] Provide the packaging cover master plate;

[0023] An encapsulation pattern structure is prepared on one side of the encapsulation cover, and at least one alignment mark is prepared in the encapsulation pattern structure, including:

[0024] Multiple encapsulation pattern structures are prepared on one side of the encapsulation cover master plate, and at least one alignment mark is prepared in each encapsulation pattern structure;

[0025] Using alignment marks as alignment references, and aligning and bonding the encapsulation structure and the display panel with the side of the encapsulation pattern structure facing the display panel, including:

[0026] Cut the packaging cover plate master along the cutting path between two adjacent packaging pattern structures to obtain multiple packaging structures, each of which includes a packaging cover plate and a packaging pattern structure.

[0027] The alignment mark is used as the alignment reference, and the encapsulation structure and the display panel are aligned and bonded with the side of the encapsulation pattern structure facing the display panel.

[0028] Optionally, a packaging pattern structure is prepared on one side of the packaging cover, including:

[0029] An initial pattern layer is prepared on one side of the encapsulation cover plate;

[0030] The initial pattern is patterned to obtain a pattern layer, in which at least one alignment mark is formed;

[0031] A protective layer is prepared on the surface of the patterned layer, the protective layer covers the patterned layer, and the Young's modulus of the protective layer is greater than that of the patterned layer.

[0032] Optionally, using alignment marks as alignment references, and aligning and bonding the encapsulation structure and the display panel with the side of the encapsulation pattern structure facing the display panel, including:

[0033] Apply bonding adhesive to the side of the display panel facing the encapsulation structure, and / or apply bonding adhesive to the side of the encapsulation structure facing the display panel;

[0034] The alignment mark is used as the alignment reference, and the encapsulation structure and the display panel are aligned and bonded with the side of the encapsulation pattern structure facing the display panel.

[0035] The display module provided by this invention includes a display panel and a packaging structure. The packaging structure includes a packaging cover and a packaging pattern structure. At least one alignment mark is set in the packaging pattern structure, and the display panel and packaging structure are aligned and bonded using the alignment mark as an alignment reference. By adopting the above technical solution, the alignment recognition rate and accuracy of the display module during packaging are improved by setting the packaging structure and alignment mark, reducing the requirements for glass transmittance, achieving precise alignment and packaging of the display module, and reducing accuracy errors. This solves the problems of misidentification caused by easy chipping and breakage of glass edges during packaging, and the problem of low alignment accuracy.

[0036] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 This is a schematic diagram of the packaging structure in a display module provided by an embodiment of the present invention;

[0039] Figure 2 This is a schematic diagram of a display panel in a display module provided in an embodiment of the present invention;

[0040] Figure 3 This is a schematic diagram of another packaging structure in a display module provided by an embodiment of the present invention;

[0041] Figure 4 This is a schematic diagram of another packaging structure in a display module provided by an embodiment of the present invention;

[0042] Figure 5 This is a schematic diagram of an encapsulation pattern structure in a display module provided by an embodiment of the present invention;

[0043] Figure 6 This is a flowchart illustrating the first alignment and bonding method for a display module provided in an embodiment of the present invention.

[0044] Figure 7 for Figure 6 A schematic diagram of the process flow for the alignment and bonding method of the corresponding display module;

[0045] Figure 8 This is a flowchart illustrating the second alignment and bonding method for a display module provided in an embodiment of the present invention;

[0046] Figure 9 for Figure 8 A schematic diagram of the process flow for the alignment and bonding method of the corresponding display module;

[0047] Figure 10 This is a flowchart illustrating the third alignment and bonding method for a display module provided in this embodiment of the invention.

[0048] Figure 11 for Figure 10 A schematic diagram of the process flow for the alignment and bonding method of the corresponding display module;

[0049] Figure 12 This is a flowchart illustrating the fourth alignment and bonding method for a display module provided in this embodiment of the invention.

[0050] Figure 13 for Figure 12 A schematic diagram of the process flow for the alignment and bonding method of the corresponding display module.

[0051] In this embodiment of the invention, the reference numerals and corresponding feature names are as follows:

[0052] 1-First alignment mark, 2-Second alignment mark, 3-Third alignment mark, 4-Fourth alignment mark, 10-Encapsulation structure, 11-Encapsulation cover plate, 12-Encapsulation pattern structure, 13-Encapsulation surface, 20-Encapsulation cover plate master, 21-Adhesive, 22-Initial pattern layer, 30-Alignment mark, 31-First pattern section, 32-Second pattern section, 33-Third pattern section, 34-Fourth pattern section, 41-Fifth alignment mark, 42-Sixth alignment mark, 43-Seventh alignment mark, 44-Eighth alignment mark, 100-Display panel, 121-Patterned layer, 122-Protective layer. Detailed Implementation

[0053] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0054] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0055] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0056] Figure 1 This is a schematic diagram of the packaging structure in a display module provided by an embodiment of the present invention. Figure 2 This is a schematic diagram of a display panel in a display module provided in an embodiment of the present invention. Figure 3 This is a schematic diagram of another packaging structure in a display module provided by an embodiment of the present invention. This embodiment can be applied to situations where alignment recognition rate and alignment accuracy are improved in the alignment packaging of display modules. Figure 1 , Figure 2 and Figure 3 As shown, the display module includes: a display panel 100 and an encapsulation structure 10 located on the light-emitting side of the display panel 100; the encapsulation structure 10 includes an encapsulation cover plate 11 and an encapsulation pattern structure 12 located on the side of the encapsulation cover plate 11 facing the display panel 100, and at least one alignment mark 30 is provided in the encapsulation pattern structure 12; the display panel 100 and the encapsulation structure 10 are aligned and bonded with the alignment mark 30 as the alignment reference.

[0057] In this embodiment, the display module includes a display panel 100 and an encapsulation structure 10 located on the light-emitting side of the display panel 100. The display panel 100 can be understood as an optoelectronic device capable of converting electrical signals into visible light images or text information, and can achieve information visualization output by controlling the brightness, color, and grayscale changes of pixel units. Exemplarily, the display panel 100 can be a liquid crystal display panel (LCD), an organic light-emitting diode (OLED), a micro light-emitting diode (Micro LED), or a mini light-emitting diode (Mini LED), but is not limited to these. The encapsulation structure 10 can be understood as a protective and support structure capable of protecting electronic / optoelectronic devices from external environmental corrosion, improving mechanical stability, and ensuring performance reliability. Specifically, the encapsulation structure 10 includes an encapsulation cover plate 11 and an encapsulation pattern structure 12 located on the side of the encapsulation cover plate 11 facing the display panel 100, wherein the encapsulation pattern structure 12 is provided with at least one alignment mark 30.

[0058] The encapsulation cover 11 can be understood as a protective structural component covering the surface of an electronic / optoelectronic device, typically located on the functional output side of the device. Exemplarily, the encapsulation cover 11 includes, but is not limited to, a glass substrate; this embodiment of the invention does not impose any limitations on this. The encapsulation pattern structure 12 can be understood as a functional hierarchical structure located within the encapsulation structure 10, capable of providing mechanical support and structural positioning. The encapsulation pattern structure 12 includes, but is not limited to, formation by photoresist etching; this embodiment of the invention does not impose any limitations on this. At least one alignment mark 30 is provided in the encapsulation pattern structure 12. The alignment mark 30 can be understood as a distinctive geometric pattern or structure prepared in the encapsulation pattern structure 12, serving as a reference for precise positioning and bonding, ensuring the accuracy of the relative position during the encapsulation process. This embodiment of the invention does not impose any limitations on the shape and size of the alignment mark 30.

[0059] Specifically, the display panel 100 and the encapsulation structure 10 use the alignment mark 30 as a positioning reference and alignment benchmark. During alignment encapsulation, the alignment mark 30 on the encapsulation structure 10 is captured to complete the alignment and bonding of the display panel 100 and the encapsulation structure 10. For example, during OLED screen encapsulation, automated equipment identifies the alignment mark 30 on the encapsulation structure 10 to align and mount the OLED display panel 100 and the encapsulation structure 10.

[0060] The display module provided by this invention includes a display panel 100 and an encapsulation structure 10 located on the light-emitting side of the display panel 100, comprising an encapsulation cover plate 11 and an encapsulation pattern structure 12 located on the side of the encapsulation cover plate 11 facing the display panel 100. At least one alignment mark 30 is provided in the encapsulation pattern structure 12, and the display panel 10 and the encapsulation structure 10 are aligned and bonded using the alignment mark 30 as an alignment reference. By adopting the above technical solution, the alignment recognition rate and alignment accuracy during display module encapsulation are improved by setting the encapsulation structure 10 and the alignment mark 30, reducing the requirements for glass transmittance, achieving precise alignment encapsulation of the display module, and reducing accuracy errors. This solves the problems of misidentification caused by easy chipping and breakage of glass corners during encapsulation and the problem of low alignment accuracy.

[0061] Optional, you can continue to refer to Figure 3 The encapsulation pattern structure includes a pattern layer 121 and a protective layer 122, with the protective layer 122 covering the pattern layer 121; the Young's modulus of the protective layer 122 is greater than that of the pattern layer 121.

[0062] In this embodiment, the encapsulation pattern structure 12 includes a pattern layer 121 and a protective layer 122. The pattern layer 121 can be understood as a frame-like structure with specific alignment marks formed on the surface of the encapsulation pattern structure 12 through processes such as photolithography or etching. Exemplarily, the material of the pattern layer 121 includes, but is not limited to, photoresist, and this embodiment of the invention does not impose any limitations on this. The thickness of the pattern layer 121 can be 1.2 μm to 2.1 μm. The protective layer 122 can be understood as a protective layer structure that covers the pattern layer 121, protecting and reinforcing the pattern layer 121, preventing it from detaching or being corroded during subsequent cutting or cleaning processes. Specifically, the Young's modulus of the protective layer 122 is greater than that of the pattern layer 121.

[0063] Young's modulus is a physical quantity that describes the elastic properties of a material under stress. It is defined as the ratio of strain (deformation to original length) of a material under unit stress (tension or compression). It reflects the material's ability to resist deformation. A larger Young's modulus indicates smaller elastic deformation under the same stress, greater material rigidity, and less susceptibility to deformation. In this embodiment, the Young's modulus of the protective layer 122 is greater than that of the pattern layer 121.

[0064] For example, the pattern layer 121 is made of resin, and the protective layer 122 is made of tempered glass. The rigidity of the protective layer 122 is much higher than that of the pattern layer 121, which can effectively prevent the pattern layer 121 from being deformed by external force.

[0065] The display module provided in this embodiment of the invention features an encapsulation pattern structure 12 comprising a pattern layer 121 and a protective layer 122 covering the pattern layer 121, with the Young's modulus of the protective layer 122 being greater than that of the pattern layer 121. The protective layer 122 reinforces and protects the pattern layer 121 through its protective and isolating function, preventing the encapsulation pattern structure 12 from detaching or deforming due to compression and impact during subsequent processing. This effectively protects the pattern layer 121 from erosion and compression without affecting its functionality, thus providing effective protection. This solves the problem of internal structural damage caused by external impacts and extends the service life of the display module.

[0066] Optional, you can continue to refer to Figure 1The encapsulation pattern structure includes a first pattern portion 31, a second pattern portion 32, a third pattern portion 33, and a fourth pattern portion 34. The first pattern portion 31 and the third pattern portion 33 extend along a first direction, and the second pattern portion 32 and the fourth pattern portion 34 extend along a second direction. The first and second directions intersect and are both parallel to the plane of the encapsulation cover plate 11. At least one first alignment mark 1 is provided in the first pattern portion 31, at least one second alignment mark 2 is provided in the second pattern portion 32, at least one third alignment mark 3 is provided in the third pattern portion 33, and at least one fourth alignment mark 4 is provided in the fourth pattern portion 34. The alignment mark 30 includes the first alignment mark 1, the second alignment mark 2, the third alignment mark 3, and the fourth alignment mark 4.

[0067] In this embodiment, the encapsulation pattern structure 12 includes a first pattern portion 31, a second pattern portion 32, a third pattern portion 33, and a fourth pattern portion 34. The first pattern portion 31, the second pattern portion 32, the third pattern portion 33, and the fourth pattern portion 34 can be understood as marking pattern structures respectively disposed on the front surface, rear surface, left surface, and right surface of the encapsulation pattern structure 12 at four different locations. This embodiment of the invention does not limit the placement orientation of the first pattern portion 31, the second pattern portion 32, the third pattern portion 33, and the fourth pattern portion 34. The alignment mark 30 includes a first alignment mark 1, a second alignment mark 2, a third comparison mark 3, and a fourth alignment mark 4. The first alignment mark 1, the second alignment mark 2, the third comparison mark 3, and the fourth alignment mark 4 can be understood as iconic geometric patterns or structures respectively disposed on the first pattern portion 31, the second pattern portion 32, the third pattern portion 33, and the fourth pattern portion 34, serving as a reference for precise positioning and bonding. The embodiments of the present invention do not impose restrictions on the shape and area of ​​the alignment mark 30.

[0068] Specifically, the first pattern portion 31 and the third pattern portion 33 extend along a first direction (the X direction as shown in the figure), and the second pattern portion 32 and the fourth pattern portion 34 extend along a second direction (the Y direction as shown in the figure). Furthermore, the first pattern portion 31 is provided with at least one first alignment mark 1, the second pattern portion 32 is provided with at least one second alignment mark 2, the third pattern portion 33 is provided with at least one third alignment mark 3, and the fourth pattern portion 34 is provided with at least one fourth alignment mark 4. That is, each side of the encapsulation pattern structure 12 contains alignment marks 30, ensuring multi-dimensional precise alignment during display panel encapsulation and further improving alignment accuracy.

[0069] The display module provided in this embodiment of the invention, by setting a first pattern portion 31 including at least one first alignment mark 1, a second pattern portion 32 including at least one second alignment mark 2, a third pattern portion 33 including at least one third alignment mark 3, and a fourth pattern portion 34 including at least one fourth alignment mark 4 in the encapsulation pattern structure 12, ensures that each side of the encapsulation pattern structure 12 includes an alignment mark 30, thereby guaranteeing multi-dimensional precise alignment during display panel encapsulation, reducing the risk of inaccurate bonding due to the failure of an alignment mark 30 in a single direction, and improving the stability of alignment encapsulation. This solves the problem of low encapsulation yield caused by the failure of a single alignment mark in traditional methods.

[0070] Optional, you can continue to refer to Figure 1 Along the first direction, at least one first alignment identifier 1 and at least one third alignment identifier 3 overlap; along the second direction, at least one second alignment identifier 2 and at least one fourth alignment identifier 4 overlap.

[0071] Specifically, along the first direction (the X direction as shown in the figure), at least one first alignment mark 1 and at least one third alignment mark 3 are overlapped, that is, in the first direction, the center lines of at least one first alignment mark 1 and at least one third alignment mark 3 are collinear, forming an alignment structure. Along the second direction (the Y direction as shown in the figure), at least one second alignment mark 2 and at least one fourth alignment mark 4 are overlapped, that is, in the second direction, the center lines of at least one second alignment mark 2 and at least one fourth alignment mark 4 are collinear, forming an alignment structure.

[0072] The display module provided in this embodiment of the invention has at least one overlapping first alignment mark 1 and at least one overlapping third alignment mark 3 along a first direction, and at least one overlapping second alignment mark 2 and at least one overlapping fourth alignment mark 4 along a second direction. This alignment arrangement allows for further detection and calibration of angular tilt deviations during packaging and bonding, enabling timely adjustment of the alignment angle, improving the accuracy and reliability of the alignment results, and increasing packaging efficiency. It solves the problem that angular deviations during packaging are difficult to calibrate and detect, affecting packaging accuracy and efficiency.

[0073] Figure 4 This is a schematic diagram of another packaging structure in a display module provided by an embodiment of the present invention. As another optional implementation of the present invention, such as... Figure 4 As shown, the alignment mark 30 includes a fifth alignment mark 41, a sixth alignment mark 42, a seventh alignment mark 43, and an eighth alignment mark 44; the fifth alignment mark 41, the sixth alignment mark 42, the seventh alignment mark 43, and the eighth alignment mark 44 are disposed at the four corners of the packaging pattern structure 12.

[0074] In this embodiment, the alignment markers 30 include a fifth alignment marker 41, a sixth alignment marker 42, a seventh alignment marker 43, and an eighth alignment marker 44. These fifth, sixth, seventh, and eighth alignment markers 44 can be understood as marker pattern structures respectively disposed at the corner positions of four different orientations within the encapsulation pattern structure 12. This embodiment of the invention does not limit the order in which the corner positions of the fifth, sixth, seventh, and eighth alignment markers 41, 42, 43, and 44 are located. Furthermore, this embodiment of the invention does not limit the number, shape, or area of ​​the fifth, sixth, seventh, and eighth alignment markers 44.

[0075] For example, the fifth alignment mark 41 is disposed at the upper left corner of the surface of the encapsulation pattern structure 12 facing the display panel 100. The sixth alignment mark 42 is disposed at the lower left corner of the surface of the encapsulation pattern structure 12 facing the display panel 100. The seventh alignment mark 43 is disposed at the upper right corner of the surface of the encapsulation pattern structure 12 facing the display panel 100, and the eighth alignment mark 44 is disposed at the lower right corner of the surface of the encapsulation pattern structure 12 facing the display panel 100.

[0076] The display module provided in this embodiment of the invention has a fifth alignment mark 41, a sixth alignment mark 42, a seventh alignment mark 43, and an eighth alignment mark 44 respectively set at the four corners of the encapsulation pattern structure 12. While using the corners of the encapsulation cover plate 11 for alignment identification, high-precision positioning is performed based on the alignment marks 30 set at the corners, providing further assurance for the alignment and bonding of the display module. This solves the problem of alignment errors caused by edge chipping of the encapsulation cover plate 11 when only relying on the corners for alignment identification, ensuring alignment recognition rate and alignment accuracy.

[0077] Figure 5 This is a schematic diagram of an encapsulation pattern structure in a display module provided by an embodiment of the present invention. For example... Figure 5 As shown, the encapsulation pattern structure 12 includes an encapsulation surface 13 facing the display panel side; the encapsulation surface 13 includes a non-planar surface.

[0078] Specifically, the encapsulation pattern structure 12 includes an encapsulation surface 13 facing the display panel 100, which is used for bonding in subsequent processes. The encapsulation surface 13 is designed as a non-smooth, uneven plane. For example, the uneven plane includes, but is not limited to, a wavy plane, and this embodiment of the invention does not limit this.

[0079] This invention employs a non-planar encapsulation surface 12. This non-planar structure increases the frictional resistance between the edge of the encapsulation surface 13 and the non-functional areas of the display panel 100, controlling the angular deviation caused by encapsulation misalignment during adhesive extension after bonding. This enhances the fit between the encapsulation structure 10 and the display panel 100, improving alignment accuracy. Simultaneously, the adhesive fills the non-planar gaps and grooves, increasing the sealing of the display module encapsulation. This effectively solves the problem of light leakage at the edges of functional areas and the intrusion of dust / moisture, extending the lifespan of the display module.

[0080] Based on the same inventive concept, embodiments of the present invention also provide a method for aligning and bonding a display module. Figure 6 This is a flowchart illustrating the first alignment and bonding method for a display module provided in this embodiment of the invention. Figure 7 for Figure 6 A schematic diagram of the process flow for the alignment and bonding method of the corresponding display module is shown. This alignment and bonding method can be used to complete the bonding of the display module provided in any of the above optional embodiments. Figure 6 and Figure 7 As shown, the alignment and bonding method for the display module includes:

[0081] S101 provides a package cover and a display panel.

[0082] For details, please refer to Figure 7 In step (a1), the encapsulation cover 11 can be understood as a protective structural component covering the surface of an electronic / optoelectronic device, typically disposed on the functional output side of the device. Exemplarily, the encapsulation cover 11 includes, but is not limited to, a glass substrate; this embodiment of the invention does not impose such limitations. The encapsulation cover 11 serves as the encapsulation substrate for subsequent fabrication of the encapsulation structure.

[0083] The display panel 100 can be understood as an optoelectronic device that converts electrical signals into visible light images or text information. It can achieve information visualization output by controlling the brightness, color, and grayscale changes of pixel units. The display panel serves as the core functional structure of the display module.

[0084] S102. A packaging pattern structure is prepared on one side of the packaging cover, and at least one alignment mark is prepared in the packaging pattern structure; the packaging pattern structure and the packaging cover form a packaging structure.

[0085] For details, please refer to Figure 7 In step (b1), the encapsulation pattern structure 12 can be understood as a functional hierarchical structure capable of mechanical support and structural positioning. The encapsulation pattern structure 12 includes, but is not limited to, being formed by photoresist etching. This embodiment of the invention does not impose any limitations on this.

[0086] A packaging pattern structure 12 is prepared on one side of the packaging cover plate 11, and at least one alignment mark 30 is prepared in the packaging pattern structure 12. The alignment mark 30 can be understood as a landmark geometric pattern or structure prepared in the packaging pattern structure 12, which can serve as a reference for precise positioning and bonding, and ensure the relative position accuracy during the packaging process. The shape and size of the alignment mark 30 are not limited in this embodiment of the invention.

[0087] S103. Using the alignment mark as the alignment reference, the encapsulation structure and the display panel are aligned and bonded with the side of the encapsulation pattern structure facing the display panel.

[0088] For details, please refer to Figure 7 In step (c1), the display panel 100 and the packaging structure 10 use the alignment mark 30 as a positioning reference and alignment base. During the alignment and packaging process, the alignment mark 30 on the packaging structure 10 is captured to complete the alignment and bonding of the display panel 100 and the packaging structure 10.

[0089] For example, during OLED screen encapsulation, automated equipment aligns and mounts the OLED display panel 100 and the encapsulation structure 10 by identifying the alignment mark 30 on the encapsulation structure 10.

[0090] The alignment and bonding method for a display module provided in this invention involves preparing an encapsulation pattern structure on one side of a provided encapsulation cover plate, and preparing at least one alignment mark within the encapsulation pattern structure, thereby forming an encapsulation structure with the encapsulation cover plate. Then, using the alignment mark as an alignment reference, the encapsulation structure and the display panel are aligned and bonded with the side of the encapsulation pattern structure facing the provided display panel, completing the alignment and bonding of the display module. By setting the encapsulation layer and alignment mark, the alignment recognition rate during display module encapsulation is improved, alignment accuracy is increased, and the requirements for glass transmittance are reduced, achieving precise alignment and encapsulation of the display module and reducing accuracy errors. This solves the problem of misidentification and low alignment accuracy caused by easy chipping and breakage of glass edges during encapsulation.

[0091] Figure 8 This is a flowchart illustrating the second alignment and bonding method for a display module provided in this embodiment of the invention. Figure 9 for Figure 8 A schematic diagram of the process flow for the alignment and bonding method of the corresponding display module. Figure 8 and Figure 9 The specific process of obtaining the encapsulation cover plate in the above-described embodiments is described in detail. For example... Figure 8 and Figure 9 As shown, the alignment and bonding method of the display module specifically includes:

[0092] S201 provides a packaging cover plate master and a display panel.

[0093] For details, please refer to Figure 9 In step (a2), the encapsulation cover master plate 20 can be understood as a large-size base carrier used to prepare the encapsulation cover plate 11. Multiple encapsulation cover plates 11 to be cut can be integrated on the same large-size encapsulation cover master plate 20. Exemplarily, the encapsulation cover master plate 20 includes, but is not limited to, a large-size glass substrate, and this embodiment of the invention does not limit this. After batch processing, the encapsulation cover master plate 20 can be separated into master-level components of individual encapsulation cover plates 11.

[0094] S202. Prepare multiple encapsulation pattern structures on one side of the encapsulation cover master plate, and prepare at least one alignment mark in each encapsulation pattern structure.

[0095] For details, please refer to Figure 9 In step (b2), multiple identical encapsulation pattern structures 12 are prepared on the same side of the encapsulation cover master 20, and at least one alignment mark 30 is prepared in each encapsulation pattern structure 12. Exemplarily, the shape of the alignment mark 30 can be rectangular or cross-shaped, and the size of each alignment mark 30 can be the same or different. This embodiment of the invention does not limit the shape and size of the alignment mark 30. The number of encapsulation pattern structures 12 can be set according to the specifications of the encapsulation cover master 20 and the size of each encapsulation pattern structure 12; this embodiment of the invention does not limit this.

[0096] Each encapsulation pattern structure 12 includes an encapsulation surface 13 facing the display panel 100, and each encapsulation surface 13 can be designed as a non-smooth, uneven plane.

[0097] S203. Cut the packaging cover plate master along the cutting path between two adjacent packaging pattern structures to obtain multiple packaging structures, including packaging cover plates and packaging pattern structures.

[0098] For details, please refer to Figure 9 In step (c2), a cutting groove is provided between every two adjacent encapsulation pattern structures 12. After multiple encapsulation pattern structures 12 are prepared, the encapsulation cover plate 20 is cut along the cutting groove to obtain multiple independent encapsulation structures 10. Each encapsulation structure 10 includes an encapsulation cover plate 11 and an encapsulation pattern structure 12. The cutting groove is set along the outer contour of each encapsulation pattern structure 12 to improve the ease of cutting.

[0099] S204. Using the alignment mark as the alignment reference, the encapsulation structure and the display panel are aligned and bonded with the side of the encapsulation pattern structure facing the display panel.

[0100] For details, please refer to Figure 9 Step (d2) in the process.

[0101] The alignment and bonding method for display modules provided in this invention involves first providing a packaging cover plate master and a display panel. Multiple packaging pattern structures are prepared on one side of the packaging cover plate master, and at least one alignment mark is prepared in each packaging pattern structure. Then, the packaging cover plate master is cut along the cutting path between two adjacent packaging pattern structures to obtain multiple packaging structures including the packaging cover plate and packaging pattern structures. Finally, using the alignment mark as an alignment reference, the packaging structures and the display panel are aligned and bonded. By preparing the packaging structure first and then cutting it, standardized mass production of the packaging structures is achieved, ensuring the accuracy of each packaging structure. Pre-fabricating alignment marks on the master plate for each packaging unit ensures that the positioning reference of all packaging structures is consistent, achieving precise and rapid alignment and bonding of the packaging structure and the display panel, solving the problems of long alignment and bonding time and low efficiency.

[0102] Figure 10 This is a flowchart illustrating the third alignment and bonding method for a display module provided in this embodiment of the invention. Figure 11 for Figure 10 The corresponding display module alignment and bonding method process flow diagram is shown in this embodiment. This embodiment elaborates in detail the specific process of preparing the encapsulation pattern structure on one side of the encapsulation cover plate in the above embodiments. Figure 10 and Figure 11 As shown, the method specifically includes:

[0103] S301 provides a package cover and a display panel.

[0104] For details, please refer to Figure 11 Step (a3) ​​in the text.

[0105] S302. Prepare an initial pattern layer on one side of the encapsulation cover.

[0106] For details, please refer to [link / reference]. Figure 11 In step (a3), an initial pattern layer 22 is prepared on the side of the encapsulation cover plate 11 facing the light-emitting side of the display panel 100 using processes such as photolithography, printing, or coating. This initial pattern layer 22 can subsequently form alignment marks through processes such as secondary exposure or development. For example, the shape of the initial pattern in the initial pattern layer 22 may include, but is not limited to, a rectangle; this embodiment of the invention does not impose such limitations.

[0107] S303. Pattern the initial pattern to obtain a pattern layer, so as to form at least one alignment mark in the pattern layer.

[0108] For details, please refer to Figure 11In step (b3), a layer of photoresist is uniformly coated on the surface of the package cover 11. Then, the initial pattern at the location where the initial pattern is set on the package cover 11 is exposed and developed to remove the photoresist at the location where multiple initial patterns are set on the package cover 11, forming a pattern layer 121. The pattern layer 121 can be understood as a frame-like structure with specific alignment marks formed on the surface of the package pattern structure 12. At this time, at least one alignment mark 30 is formed in the pattern layer 121, and the thickness of the pattern layer 121 can be 1.2μm-2.1μm.

[0109] S304. Prepare a protective layer on the surface of the patterned layer, the protective layer covering the patterned layer, and the Young's modulus of the protective layer is greater than that of the patterned layer.

[0110] For details, please refer to [link / reference]. Figure 11 In step (b3), the protective layer 122 can be understood as covering the pattern layer 121, which protects and reinforces the pattern layer 121, preventing it from peeling off or being corroded during subsequent cutting or cleaning processes. Young's modulus reflects a material's resistance to deformation; a larger Young's modulus indicates less elastic deformation under the same stress, greater rigidity, and less susceptibility to deformation. In this embodiment, the Young's modulus of the protective layer 122 is greater than that of the pattern layer 121, and it is used to cure and protect the pattern layer 121.

[0111] S305. Using the alignment mark as the alignment reference, the encapsulation structure and the display panel are aligned and bonded with the side of the encapsulation pattern structure facing the display panel.

[0112] For details, please refer to Figure 11 Step (c3) in the process.

[0113] The alignment and bonding method for display modules provided in this invention involves preparing an initial pattern layer on one side of the encapsulation cover plate, then patterning the initial pattern to obtain a pattern layer, in which alignment marks are formed. Alignment marks can be selectively set to form the pattern layer, achieving high-precision graphic forming of the alignment marks and strictly ensuring their dimensional and positional accuracy. A protective layer is prepared on the surface of the pattern layer, ensuring that the Young's modulus of the protective layer is greater than that of the pattern layer. Through the protective and isolating effect of the protective layer, the pattern layer is reinforced and protected, preventing the encapsulated pattern structure from detaching and deforming due to extrusion and impact during subsequent processing. This effectively protects the pattern layer from erosion and extrusion without affecting its functionality, thus solving the problem of internal structural damage caused by external impacts and extending the service life of the display module.

[0114] Figure 12This is a flowchart illustrating the fourth alignment and bonding method for a display module provided in this embodiment of the invention. Figure 13 for Figure 12 The corresponding display module alignment and bonding method process flow diagram is shown in this embodiment. This embodiment elaborates in detail on the specific process of alignment and bonding the packaging structure and display panel in the above embodiments. Figure 12 and Figure 13 As shown, the method specifically includes:

[0115] S401 provides a package cover and a display panel.

[0116] For details, please refer to Figure 13 Step (a4) in the text.

[0117] S402. A packaging pattern structure is prepared on one side of the packaging cover, and at least one alignment mark is prepared in the packaging pattern structure; the packaging pattern structure and the packaging cover form a packaging structure.

[0118] For details, please refer to Figure 13 Step (b4) in the text.

[0119] S403. Apply bonding adhesive to the side of the display panel facing the encapsulation structure, and / or apply bonding adhesive to the side of the encapsulation structure facing the display panel.

[0120] For details, please refer to Figure 13 In step (c4), both the encapsulation structure 10 and the display panel 100 include functional areas. After the encapsulation structure 10 is prepared, bonding adhesive 21 is applied to the functional area of ​​the display panel 100 facing the encapsulation structure 10, and / or bonding adhesive 21 is applied to the functional area of ​​the encapsulation structure 10 facing the display panel 100, so that the encapsulation structure 10 and the display panel 100 can be mounted. The bonding adhesive 21 includes, but is not limited to, OCR adhesive, and this embodiment of the invention does not impose limitations on it.

[0121] S404. Using the alignment mark as the alignment reference, the encapsulation structure and the display panel are aligned and bonded with the side of the encapsulation pattern structure facing the display panel.

[0122] For details, please refer to Figure 13 Step (d4) in the process.

[0123] The alignment and bonding method for display modules provided in this invention involves applying bonding adhesive to the side of the display panel facing the packaging structure and / or the side of the packaging structure facing the display panel before aligning and bonding the packaging structure and the display panel. This ensures that the packaging structure or display panel is ready for mounting before the alignment and bonding of the packaging structure and the display panel. By precisely controlling the area of ​​adhesive application, contamination of functional areas is avoided, the distribution range of the adhesive is limited, and adhesive overflow is prevented from causing product scrap. Applying adhesive first for identification before alignment and bonding improves alignment accuracy, ensures the accuracy of packaging and bonding, and reduces packaging errors.

[0124] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0125] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A display module, characterized in that, include: The display panel and the encapsulation structure located on the light-emitting side of the display panel; The encapsulation structure includes an encapsulation cover plate and an encapsulation pattern structure located on the side of the encapsulation cover plate facing the display panel, wherein at least one alignment mark is provided in the encapsulation pattern structure; The display panel and the packaging structure are aligned and bonded with the alignment mark as the alignment reference.

2. The display module according to claim 1, characterized in that, The encapsulation pattern structure includes a pattern layer and a protective layer, wherein the protective layer covers the pattern layer; The Young's modulus of the protective layer is greater than that of the patterned layer.

3. The display module according to claim 1, characterized in that, The encapsulation pattern structure includes a first pattern portion, a second pattern portion, a third pattern portion, and a fourth pattern portion. The first pattern portion and the third pattern portion extend along a first direction, and the second pattern portion and the fourth pattern portion extend along a second direction. The first direction and the second direction intersect and are both parallel to the plane of the encapsulation cover. The first pattern portion is provided with at least one first alignment mark, the second pattern portion is provided with at least one second alignment mark, the third pattern portion is provided with at least one third alignment mark, and the fourth pattern portion is provided with at least one fourth alignment mark; the alignment mark includes the first alignment mark, the second alignment mark, the third alignment mark, and the fourth alignment mark.

4. The display module according to claim 3, characterized in that, Along the first direction, at least one first alignment identifier and at least one third alignment identifier overlap; Along the second direction, at least one second alignment identifier and at least one fourth alignment identifier overlap.

5. The display module according to claim 1, characterized in that, The alignment identifiers include the fifth alignment identifier, the sixth alignment identifier, the seventh alignment identifier, and the eighth alignment identifier; The fifth alignment identifier, the sixth alignment identifier, the seventh alignment identifier, and the eighth alignment identifier are located at the four corners of the packaging pattern structure.

6. The display module according to claim 1, characterized in that, The encapsulation pattern structure includes an encapsulation surface facing the side of the display panel; The packaging surface includes a non-planar surface.

7. A method for aligning and bonding a display module, characterized in that, include: Provides encapsulation cover and display panel; An encapsulation pattern structure is prepared on one side of the encapsulation cover, and at least one alignment mark is prepared in the encapsulation pattern structure; The encapsulation pattern structure and the encapsulation cover plate form an encapsulation structure; Using the alignment mark as the alignment reference, the encapsulation structure and the display panel are aligned and bonded together with the side of the encapsulation pattern structure facing the display panel.

8. The alignment and bonding method according to claim 7, characterized in that, Provide a package cover, including: Provide the master plate for the encapsulation cover; An encapsulation pattern structure is prepared on one side of the encapsulation cover, and at least one alignment mark is prepared in the encapsulation pattern structure, including: Multiple encapsulation pattern structures are prepared on one side of the encapsulation cover master plate, and at least one alignment mark is prepared in each of the encapsulation pattern structures; Using the alignment mark as an alignment reference, and aligning and bonding the encapsulation structure and the display panel with the side of the encapsulation pattern structure facing the display panel, including: The packaging cover plate master is cut along the cutting path between two adjacent packaging pattern structures to obtain a plurality of packaging structures, each packaging structure including a packaging cover plate and the packaging pattern structure. Using the alignment mark as the alignment reference, the encapsulation structure and the display panel are aligned and bonded together with the side of the encapsulation pattern structure facing the display panel.

9. The alignment and bonding method according to claim 7, characterized in that, A packaging pattern structure is prepared on one side of the packaging cover, including: An initial pattern layer is prepared on one side of the encapsulation cover plate; The initial pattern is patterned to obtain a pattern layer, in which at least one alignment mark is formed; A protective layer is prepared on the surface of the patterned layer, the protective layer covering the patterned layer, and the Young's modulus of the protective layer is greater than that of the patterned layer.

10. The alignment and bonding method according to claim 7, characterized in that, Using the alignment mark as an alignment reference, and aligning and bonding the encapsulation structure and the display panel with the side of the encapsulation pattern structure facing the display panel, including: Apply bonding adhesive to the side of the display panel facing the encapsulation structure, and / or apply bonding adhesive to the side of the encapsulation structure facing the display panel; Using the alignment mark as the alignment reference, the encapsulation structure and the display panel are aligned and bonded together with the side of the encapsulation pattern structure facing the display panel.

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