Resin molding apparatus and method for manufacturing resin molded article

Abstract

A resin molding device (1) is provided with: a resin supply mechanism (26) that supplies a particulate resin to a resin accommodating part (24) that includes a mold release film (F) and a frame-shaped member (24a) disposed on the mold release film (F); a resin molding mechanism (3) having a molding die (M) comprising an upper die (UM) and a lower die (LM) facing the upper die (UM), the resin molding mechanism (3) performing resin molding by disposing a release film (F) to which a powder-like resin is supplied between the upper die (UM) and the lower die (LM); and a resin recovery mechanism (6) capable of sucking and recovering the particulate resin supplied to the mold release film (F) before the mold release film (F) is disposed on the molding mold (M).

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a resin molding apparatus and a manufacturing method of a resin molded product. BACKGROUND

[0002] A substrate or the like on which a semiconductor chip is mounted is generally used as an electronic component by being resin-encapsulated. In the past, in a resin molding apparatus, there has been an apparatus that supplies a resin material to a demolding film that is cut in advance and transports the demolding film to which the resin material is supplied to a molding die (for example, Patent Literature 1).

[0003] In the resin molding apparatus of Patent Literature 1, in a case where the resin material supplied to the demolding film is more than a target weight or the like, the demolding film is discarded together with the supplied resin material.

[0004] PRIOR ART DOCUMENTS PATENT LITERATURE Patent Literature 1: Japanese Patent Application Publication No. 2021-171920 SUMMARY

[0005] PROBLEMS TO BE SOLVED BY THE INVENTION When the demolding film to which the resin material is supplied is discarded, depending on a user of the resin molding apparatus, there is a demand to separate and recover the resin material and the demolding film for recycling or the like.

[0006] Therefore, a resin molding apparatus and a manufacturing method of a resin molded product that can separate and recover the resin material and the demolding film are desired.

[0007] SOLUTION TO PROBLEM One embodiment of the resin molding apparatus of the present disclosure includes a resin supply mechanism that supplies a powder particle-shaped resin to a resin accommodating portion including a demolding film and a frame-shaped member disposed on the demolding film, a resin molding mechanism that has a molding die composed of an upper die and a lower die that opposes the upper die, and performs resin molding by disposing the demolding film to which the powder particle-shaped resin is supplied between the upper die and the lower die, and a resin recovery mechanism that can recover the powder particle-shaped resin supplied to the resin accommodating portion by suction before the demolding film is disposed in the molding die.

[0008] One embodiment of a method of manufacturing a resin-molded article of the present disclosure includes: a resin supply step of supplying a prescribed amount of a powder-particle-shaped resin to a resin container including a release film and a frame-shaped member disposed on the release film; a determination step of determining whether the powder-particle-shaped resin supplied to the resin container is appropriate; a recovery step of recovering the powder-particle-shaped resin supplied to the resin container in a case where it is determined in the determination step that the powder-particle-shaped resin is not appropriate; and a molding step of performing resin molding by disposing the release film to which the powder-particle-shaped resin is supplied and a pre-molding substrate between an upper mold and a lower mold in a case where it is determined in the determination step that the powder-particle-shaped resin is appropriate.

[0009] Effects of Invention According to the embodiment of the present disclosure, it is possible to provide a resin molding device and a method of manufacturing a resin-molded article that can distinguish and recover a resin material and a release film. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 is a schematic view that shows a resin molding device of the present embodiment.

[0011] Figure 2 is a schematic view that shows a configuration of a resin molding module.

[0012] Figure 3A is a schematic view that shows a resin recovery mechanism of the first embodiment.

[0013] Figure 3B is a plan view of a plate-shaped member.

[0014] Figure 4 is a schematic view that shows a resin recovery mechanism of the second embodiment.

[0015] Figure 5 is a flowchart that shows a method of manufacturing a resin-molded article. DETAILED DESCRIPTION

[0016] Hereinafter, embodiments of a resin molding device and a method of manufacturing a resin-molded article of the present disclosure will be described based on the drawings. Note that the embodiments described below are examples for describing the present disclosure, and the present disclosure is not limited only to these embodiments. Therefore, the present disclosure can be implemented in various ways without departing from the gist thereof.

[0017] A substrate (molding object) or the like on which a semiconductor chip (hereinafter, sometimes referred to as "chip") is fixed is used as an electronic component (resin molded product) by resin packaging. As a technique of resin packaging a substrate, a compression method (compression molding), a transfer method, or the like can be cited. As one of the compression methods, a resin packaging method can be cited in which, after a release film is supplied with a liquid resin or a resin in a powder particle form, the release film is placed on a lower mold of a molding mold, and the molding object is immersed in a state in which the liquid resin or the resin in a powder particle form on the release film is melted to perform resin molding. As examples of electronic components, in addition to semiconductor chips, a resistance element, a capacitor can be cited.

[0018] [Configuration of resin molding apparatus] Figure 1 A schematic view of a resin molding apparatus 1 is shown. The resin molding apparatus 1 of the present embodiment adopts a compression method, and is provided with a resin supply module 2, a plurality of (three in the present embodiment) resin molding modules 3 (one example of resin molding mechanism), a substrate supply module 4, and a control section 5. The resin supply module 2, the plurality of resin molding modules 3, and the substrate supply module 4 can be attached or detached independently. Note that, in the present embodiment, the resin molding modules 3 are constituted by three, but can be constituted by two or less or four or more, and an optimum number of modules can be appropriately adopted in accordance with a production amount. Note that, Figure 1 The Z direction shown is an up-down direction of the resin molding apparatus 1, and the arrangement direction of the resin supply module 2, the resin molding modules 3, and the substrate supply module 4 is the X direction, and a direction (the depth direction of each module) perpendicular to the X direction and the Z direction is the Y direction. In the present embodiment, the resin supply module 2, the resin molding modules 3, and the substrate supply module 4 are arranged in the X direction. Figure 1 Among the X direction, the Y direction, and the Z direction shown, the direction toward which the arrow points is the +X direction, the +Y direction, and the +Z direction, and the direction opposite to the direction toward which the arrow points is the -X direction, the -Y direction, and the -Z direction.

[0019] The control section 5 includes a processor such as a CPU (Central Processing Unit) and a storage device such as a RAM (Random Access Memory). The control section 5 controls the operation of the resin molding apparatus 1 by executing a control program stored in the storage device with the processor. Unless otherwise specified, the operation of the resin molding apparatus 1 described below is performed based on the operation instruction of the control section 5. In the following description, the operation instruction of the control section 5 is omitted in principle, and the operation instruction of the control section 5 is described as needed.

[0020] The substrate supply module 4 includes a pre-molding substrate supply section 41 for supplying a pre-molding substrate Sa (an example of a molded object), a finished substrate storage section 42 for storing a finished substrate Sb (an example of a resin molded article), a substrate mounting section 43 for delivering the pre-molding substrate Sa and the finished substrate Sb, and a substrate transport mechanism 44 for transporting the pre-molding substrate Sa and the finished substrate Sb. The substrate mounting section 43 moves along the Y direction within the substrate supply module 4. The substrate transport mechanism 44 moves along the X and Y directions in both the substrate supply module 4 and the resin molding module 3.

[0021] The specified position S1 is the standby position of the substrate transport mechanism 44 when it is not in operation.

[0022] Each of the three resin molding modules 3 is equipped with a lower mold LM that can be raised and lowered, and an upper mold UM that is opposite to the lower mold LM (see also...). Figure 2 The upper mold UM and the lower mold LM constitute the molding mold M. Each resin molding module 3 has a mold closing mechanism 35 (the circular portion indicated by the double-dotted line) for closing and opening the upper mold UM and the lower mold LM. The lower mold LM and the upper mold UM move relative to each other via the mold closing mechanism 35 to close and open the mold. The lower mold LM has a lower mold cavity MC (also see below) supplied with a release film F and powdered resin as resin material. Figure 2 The detailed structure of resin molding module 3 will be described later.

[0023] The release film F used in this embodiment is made of a resin with properties such as heat resistance, release properties, softness, and elongation. Examples of suitable materials include PTFE (polytetrafluoroethylene), ETFE (ethylene-tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), polypropylene, polystyrene, and polyvinylidene chloride. Furthermore, the average particle size of the granular resin used in this embodiment is not particularly limited, but is, for example, 5 mm or less. Preferably, it is 1 mm or less, and more preferably 0.9 mm or less, 0.8 mm or less, 0.7 mm or less, 0.6 mm or less, 0.5 mm or less, 0.4 mm or less, 0.3 mm or less, 0.2 mm or less, or 0.1 mm or less. The particle size distribution of the granular resin is preferably such that 80% or more of the resin has a particle size distribution within a range of ±10% of the average particle size.

[0024] The resin supply module 2 includes an X-Y worktable 21, a release film supply mechanism 22 for supplying release film F to the X-Y worktable 21, a cleaning mechanism 23 for cleaning the lower surface or inner surface of the frame-shaped member 24a, a resin receiving part 24 including the frame-shaped member 24a and the release film F, a resin conveying mechanism 25 for conveying the resin receiving part 24, a resin supply mechanism 26 for supplying granular resin to the resin receiving part 24, and a resin recovery mechanism 6 for recovering the granular resin supplied to the release film F. The X-Y worktable 21 moves along the X and Y directions within the resin supply module 2. The frame-shaped member 24a is a hollow frame that appears rectangular when viewed along the Z direction. The resin conveying mechanism 25 moves along the X and Y directions in both the resin supply module 2 and the three resin molding modules 3. The designated position M1 is the standby position of the resin conveying mechanism 25 when it is not in operation. The resin recovery mechanism 6 is arranged adjacent to the resin supply mechanism 26. The specific composition of resin recycling unit 6 will be described later.

[0025] [Composition of the resin molding module] Next, the specific structure of the resin molding module 3, including the molding die M, will be described. For example... Figure 2 As shown, the resin molding module 3 of this embodiment is composed of a pressing frame that integrates a lower fixed platen 31 and an upper fixed platen 33 via a plate-shaped member 32. A movable platform 34 is provided between the lower fixed platen 31 and the upper fixed platen 33. The movable platform 34 can move up and down along the plate-shaped member 32. A mold closing mechanism 35, composed of a ball screw or the like, is provided on the lower fixed platen 31 as a device for moving the movable platform 34 up and down. The mold closing mechanism 35 is configured to close the molding mold M by moving the movable platform 34 upward and to open the molding mold M by moving the movable platform 34 downward. The drive source of the mold closing mechanism 35 is not particularly limited; for example, an electric motor (not shown) such as a servo motor can be used.

[0026] The upper mold UM and lower mold LM, serving as molding molds M, are arranged opposite each other and are both composed of molds, etc. An upper mold holder 39, including an upper heater 37, is disposed on the lower surface of the upper fixed platen 33, and the upper mold UM is mounted below the upper mold holder 39. An upper mold substrate mounting section (not shown) for mounting the pre-molding substrate Sa is provided on the upper mold UM, and the pre-molding substrate Sa, on which chips, etc., are fixed, is mounted on the lower surface of the upper mold UM. A lower mold holder 38, including a lower heater 36, is disposed on the upper surface of the movable platform 34, and the lower mold LM is disposed on the lower mold holder 38. The lower mold LM has a lower mold cavity MC for which a release film F and granular resin R are supplied. The pre-molding substrate Sa becomes the molded substrate Sb by resin encapsulation with granular resin R.

[0027] [The structure of the resin recycling mechanism in the first embodiment] Next, use Figure 3A , Figure 3B The specific configuration of the resin recovery mechanism 6 in the first embodiment will be described. The resin recovery mechanism 6 of this embodiment is configured to include a plate-shaped member 61, a first hose 63 (an example of a recovery path), a second hose 64, an air pump 65 (an example of a suction source), a resin recovery section 66 (an example of a recovery section), and a membrane recovery section 67 (see reference 68). Figure 1 ).

[0028] The plate-shaped member 61 is made of resin or metal and is a rectangular plate with an outer shape approximately the same size as the frame-shaped member 24a. The surface of the plate-shaped member 61 has an area that at least covers the entire hollow portion inside the frame-shaped member 24a. The plate-shaped member 61 has a first hole 61a at its center, which is a circular through hole, and around the first hole 61a, there are a plurality of (four in this embodiment) second holes 61b, which are circular through holes with a diameter smaller than the diameter of the first hole 61a. In this embodiment, the four second holes 61b are formed near the four corners of the plate-shaped member 61. The first hole 61a and the second holes 61b are formed in the hollow portion inside the frame-shaped member 24a when the plate-shaped member 61 is placed in an overlapping manner with the frame-shaped member 24a.

[0029] One end of the first flexible hose 63 is connected to the first hole 61a of the plate-shaped member 61 via the first connecting member 63a. Gaskets (not shown) are provided at the connection points between the plate-shaped member 61 and the first connecting member 63a, and between the first connecting member 63a and the first flexible hose 63, to prevent air leakage from these connection points. An air pump 65 capable of drawing air is connected to the other end of the first flexible hose 63. The air pump 65 is housed in a box-shaped resin recovery section 66. The resin recovery section 66 may be, for example, the dust collection box provided with the resin molding apparatus 1, but may also be constructed from other dedicated boxes different from the dust collection box.

[0030] Each of the four second holes 61b in the plate-like member 61 is connected to one end of a second hose 64 via a second connecting member 64a. Gaskets (not shown) are provided at the connection points between the plate-like member 61 and the second connecting member 64a, and between the second connecting member 64a and the second hose 64, to prevent air leakage from these connection points. An air compressor (not shown) capable of delivering air (an example of gas) is connected to the other end of each of the four second hoses 64.

[0031] Next, a method for recovering the powdery resin R from the release film F supplied to the resin receiving section 24 will be described. A frame-shaped member 24a is placed on the release film F, which has been cut to a predetermined size, constituting the resin receiving section 24. The resin receiving section 24 is moved by the X-Y worktable 21 and stops at a predetermined position below the resin supply mechanism 26 (see reference). Figure 1 After stopping, granular resin R is supplied to the resin container 24. If, at this time, it is necessary to recycle the granular resin R for reasons described later, the resin container 24 is kept in its original position below the resin supply mechanism 26 at a predetermined position. The plate-shaped member 61 is moved using an actuator (not shown) or the like, so that it covers the upper part of the resin container 24, including the frame-shaped member 24a. At this time, a gap G is not generated at the boundary between the plate-shaped member 61 and the frame-shaped member 24a (see reference). Figure 4 The resin is sealed in a manner that allows for close contact. Therefore, a slight force can be applied to the plate-shaped member 61 to press it toward the frame-shaped member 24a. As a result, the powdery resin R is contained in a resin-containing space 62, which is a space formed by the release film F, the frame-shaped member 24a, and the plate-shaped member 61.

[0032] Next, in this state, the air pump 65 and the air compressor are operated. As a result, the granular resin R, along with the air in the resin containing space 62, is drawn into the air pump 65 via the first hose 63, and then discharged from the resin containing space 62 to the outside (first hose 63) through the first hole 61a. At this time, if the amount of air drawn from the first hole 61a by the air pump 65 per unit time into the resin containing space 62 is equal to the total amount of air supplied to the resin containing space 62 per unit time by the air compressor from the four second holes 61b, the granular resin R can be discharged while maintaining a constant pressure (air pressure) in the resin containing space 62.

[0033] When the granular resin R is drawn in together with the air in the resin containing space 62 by the air pump 65, the release film F is also subjected to a suction force by the air pump 65. The release film F is adsorbed onto the X-Y stage 21 by the air suction, but if the suction force generated by the air pump 65 is large, the release film F may be sucked in by the air pump 65. However, in this embodiment, since the compressed air supplied from the second hole 61b is directed towards the release film F, the compressed air presses the release film F against the X-Y stage 21 on which the release film F is placed, thus preventing the release film F from being sucked in. In particular, since the second hole 61b is formed near the four corners of the plate-shaped member 61, the suction of the release film F can be more effectively suppressed. In addition, when the compressed air blows onto the granular resin R, the granular resin R flies up, so the granular resin R located far from the first hole 61a is easily sucked in, and the granular resin R can be recovered in a short time.

[0034] The powdery resin R, drawn out of the resin receiving space 62 by the air pump 65, flows together with air in the first hose 63 and is recycled to the resin recycling unit 66. The release film F, after the powdery resin R has been recycled, is delivered from the X-Y worktable 21 to the resin conveying mechanism 25 along with the frame member 24a. After the control unit 5 returns the resin conveying mechanism 25 to the predetermined position M1, it moves it from the +X direction to the -Y direction, recycling the release film F to the film recycling unit 67 (see reference). Figure 1 ).

[0035] Thus, with the resin recycling mechanism 6 of this embodiment, even after the granular resin R is supplied from the resin supply mechanism 26 to the release film F of the resin receiving section 24, the granular resin R and the release film F can be automatically separated and recycled. Therefore, the separation operation of the granular resin R and the release film F, which was previously required by humans, can be easily separated and recycled.

[0036] [The structure of the resin recycling mechanism in the second embodiment] Next, use Figure 4 The specific configuration of the resin recovery mechanism 6 in the second embodiment will be described. In this embodiment, the method for maintaining a constant pressure in the resin containing space 62 differs from that in the first embodiment. Otherwise, it has the same configuration as the first embodiment. Therefore, in the description of this embodiment, the same reference numerals are used to mark the parts with the same configuration as in the first embodiment, and detailed descriptions of the same configurations are omitted.

[0037] In the resin recycling mechanism 6 of this embodiment, the plate-shaped member 61 has only a first hole 61a and no second hole 61b. When recycling the powdered resin R supplied to the release film F, the upper part of the resin receiving portion 24 including the frame-shaped member 24a is covered by the plate-shaped member 61 in such a way that a gap G is formed at the boundary between the plate-shaped member 61 and the frame-shaped member 24a. "Covering the upper part of the resin receiving portion 24 including the frame-shaped member 24a by the plate-shaped member 61" includes both the case where the plate-shaped member 61 is in contact with the frame-shaped member 24a as in the first embodiment and the case where a gap G is provided between the plate-shaped member 61 and the frame-shaped member 24a as in this embodiment. If, as in this embodiment, the plate-shaped member 61 covers the upper part of the resin receiving portion 24, including the frame-shaped member 24a, with the gap G present, even without supplying air to the resin receiving space 62 through the four second holes 61b via an air compressor, the resin receiving space 62 is connected to the outside of the resin receiving portion 24 via the gap G, and the pressure (air pressure) of the resin receiving space 62 is always equal to the air pressure outside the resin receiving portion 24. Therefore, even if the air and powdery resin R in the resin receiving space 62 are drawn out by the air pump 65, the pressure in the resin receiving space 62 will not become negative.

[0038] [Manufacturing method for the completed substrate] Next, use Figure 1 To Figure 3, Figure 5 The method for manufacturing a molded substrate Sb (a resin molded article) using a resin molding apparatus 1 equipped with the resin recovery mechanism 6 of the first embodiment will be described. The method for manufacturing the molded substrate Sb includes: a resin supply step, in which a predetermined amount of granular resin R is supplied to a resin receiving portion 24 including a release film F and a frame-shaped member 24a holding the release film F; a determination step, in which it is determined whether the granular resin R supplied to the resin receiving portion 24 is appropriate; a recovery step, in which, if it is determined in the determination step that the granular resin R is inappropriate, the granular resin R supplied to the release film F is sucked up and recovered; and a molding step, in which, if it is determined in the determination step that the granular resin R is appropriate, the release film F to which the granular resin R is supplied and the substrate Sa (the object to be molded) before molding are arranged between the upper mold UM and the lower mold LM for resin molding.

[0039] First, in the substrate supply module 4, the pre-molding substrate Sa is fed from the pre-molding substrate supply section 41 to the substrate placement section 43. Next, the substrate transport mechanism 44 moves from a predetermined position S1 in the -Y direction to receive the pre-molding substrate Sa from the substrate placement section 43. After receiving, the substrate transport mechanism 44 returns to the predetermined position S1. Next, for example, the substrate transport mechanism 44 moves along the +X direction to a predetermined position P1 of the centrally located resin molding module 3 among the three resin molding modules 3. Next, in the central resin molding module 3, the substrate transport mechanism 44 moves in the -Y direction and stops at a predetermined position C1 on the lower mold LM. Next, the substrate transport mechanism 44 moves upward to fix the pre-molding substrate Sa to the upper mold UM. Afterward, the substrate transport mechanism 44 returns to the predetermined position S1 of the substrate supply module 4.

[0040] Parallel to the feeding of the pre-molding substrate Sa from the substrate supply module 4 to the resin molding module 3, a predetermined amount of powdered resin is supplied to the release film F in the resin supply module 2 (resin supply process). The specific operation is as follows: In the resin supply module 2, the release film F supplied from the release film supply mechanism 22 to the X-Y worktable 21 is cut into predetermined sizes (…). Figure 5 (Step S51). Next, the resin delivery mechanism 25 is moved from the predetermined position M1 in the -Y direction to receive the frame-shaped member 24a after it has been cleaned by the cleaning mechanism 23. Next, the resin delivery mechanism 25 is moved along the -Y direction to place the frame-shaped member 24a onto the release film F that is adsorbed by air onto the X-Y worktable 21. Thus, the release film F is held by the frame-shaped member 24a, forming the resin receiving portion 24. Afterward, the resin delivery mechanism 25 is returned to its original position M1.

[0041] Next, the X-Y stage 21, which houses the resin container 24, is moved along the +X direction until the resin container 24 stops at a predetermined position below the resin supply mechanism 26. Then, by moving the X-Y stage 21 along the X and Y directions, a predetermined amount of powdered resin is supplied from the resin supply mechanism 26 to the release film F in the hollow inner portion of the frame member 24a located in the resin container 24 (step S52). At this time, the weight of the powdered resin R supplied to the resin container 24 is measured using a weight sensor (not shown) (step S53). The weight sensor can be installed in the resin storage section 26a of the resin supply mechanism 26 or on the X-Y stage 21. When a weight sensor is installed in the resin storage section 26a, the weight (supply amount) of the granular resin R supplied to the resin container 24 is measured based on the decrease in weight of the granular resin R. When installed in the X-Y stage 21, the weight (supply amount) of the granular resin R supplied to the resin container 24 is measured based on the increase in weight of the granular resin R. The measured weight data of the granular resin R is sent to the control section 5 at any time.

[0042] Based on the weight data of the granular resin R sent from the weight sensor, the control unit 5 continuously determines whether the amount of granular resin R supplied to the resin container 24 is appropriate (determination process). If the weight of the granular resin R supplied to the resin container 24 reaches a predetermined amount, the control unit 5 determines that the supplied granular resin R is appropriate (predetermined amount) and stops supplying granular resin R to the resin supply mechanism 26 (No in step S54). Afterwards, the X-Y stage 21 of the resin container 24, which carries the predetermined amount of granular resin R supplied to the release film F, returns to its original position.

[0043] Next, after releasing the X-Y stage 21 from the adsorption of the release film F, the release film F is held in the frame member 24a by suction using the adsorption groove (not shown) provided in the frame member 24a. Then, the resin delivery mechanism 25 is moved from a predetermined position M1 in the -Y direction to receive the resin receiving portion 24 placed on the X-Y stage 21. The resin delivery mechanism 25 is then returned to its original position M1. Next, the resin delivery mechanism 25 is moved along the -X direction to a predetermined position P1 of the centrally located resin molding module 3 among the three resin molding modules 3. Then, in the resin molding module 3, the resin delivery mechanism 25 is moved in the -Y direction and stops at a predetermined position C1 on the lower mold LM. Next, the resin delivery mechanism 25 is lowered to supply the powdered resin and the release film F to the lower mold cavity MC (step S55).

[0044] Furthermore, the release film F, which is drawn into the lower mold cavity MC by the suction mechanism (not shown), is held with its face downwards. Thus, the powdery resin R on the release film F is supplied to the lower mold cavity MC. Afterwards, the resin delivery mechanism 25, on which the frame member 24a is mounted, is returned to the predetermined position M1.

[0045] Next, in the resin molding module 3, the movable platform 34 is moved upward (in the +Z direction) by the mold closing mechanism 35 to close the upper mold UM and the lower mold LM. In the closed state, the lower mold LM is heated by the lower heater 36 and the upper mold UM is heated by the upper heater 37, causing the granular resin R in the lower mold cavity MC to melt and solidify. That is, with the pre-molding substrate Sa and the release film F containing the granular resin R placed between the upper mold UM and the lower mold LM, the molding mold M is closed by the mold closing mechanism 35, and resin encapsulation is performed through resin molding (molding process). As a result, the chip, etc., fixed to the pre-molding substrate Sa is resin-encapsulated by the granular resin R in the lower mold cavity MC to become the molded substrate Sb (step S56). Afterward, the movable platform 34 is moved downward by the mold closing mechanism 35 to open the upper mold UM and the lower mold LM. Next, the substrate transport mechanism 44 is moved from the predetermined position S1 of the substrate supply module 4 to the predetermined position C1 on the lower mold LM, so that the substrate transport mechanism 44 receives the molded substrate Sb. Then, the substrate transport mechanism 44 moves from the predetermined position S1 above the substrate placement section 43, delivering the molded substrate Sb to the substrate placement section 43. The substrate placement section 43 then stores the molded substrate Sb in the molded substrate storage section 42.

[0046] As described above, when the resin supply mechanism 26 supplies granular resin R to the resin container 24, the weight of the supplied granular resin R is measured by a weight sensor (not shown), and the measured weight data of the granular resin R is continuously sent to the control unit 5. Furthermore, when the weight of the granular resin R supplied to the resin container 24 reaches a predetermined amount, the supply of granular resin R is stopped. It should be noted that the "predetermined amount" is the amount of resin that allows for proper resin encapsulation of the pre-molding substrate Sa, which will subsequently undergo resin sealing, without any unfilled areas or voids. The control unit 5 determines that it is appropriate when the final weight of the granular resin R supplied to the resin container 24 is the predetermined amount. However, if, when the resin supply mechanism 26 stops supplying granular resin R, the weight of the granular resin R in the resin container 24 exceeds the predetermined amount for some reason, the granular resin R cannot be used for encapsulating the pre-molding substrate Sa. Therefore, such granular resin R and the release film F need to be discarded. In this case, the control unit 5 determines that the supplied powdered resin R is inappropriate ("Yes" in step S54).

[0047] If the control unit 5 determines that the granular resin R supplied to the resin container 24 is inappropriate, the control unit 5 activates the resin recovery mechanism 6 to recover the granular resin R. According to the instruction of the control unit 5, the resin recovery mechanism 6 moves the plate-shaped member 61 via an actuator (not shown) to position the plate-shaped member 61 such that it covers the upper part of the resin container 24, including the frame-shaped member 24a. Then, the air pump 65 and the air compressor (not shown) are activated, causing the granular resin R in the resin container 24 (resin container space 62) to flow through the first hole 61a and the first hose 63 and be recovered to the resin recovery unit 66 (recovery process) (step S57). The release film F, after the granular resin R has been recovered, is delivered from the X-Y worktable 21 to the resin delivery mechanism 25 along with the frame-shaped member 24a. After the control unit 5 returns the resin delivery mechanism 25 to the predetermined position M1, it moves it from the +X direction to the -Y direction to recycle the demolding film F to the film recycling unit 67 (step S58).

[0048] [Other Implementation Methods] Hereinafter, other embodiments of the first and second embodiments described above will be described. It should be noted that, for ease of understanding, the same terms and reference numerals are used to describe components that are the same as those in the above embodiments.

[0049] <1> In the first embodiment described above, the plate member 61 and the frame member 24a are tightly connected without creating a gap G at their boundary. However, as in the second embodiment, the plate member 61 can also be arranged such that a gap G is formed at the boundary between the plate member 61 and the frame member 24a. If configured in this way, the pressure in the resin receiving space 62 is always equal to the air pressure outside the resin receiving portion 24. Therefore, even if the amount of air drawn into the resin receiving space 62 per unit time by the air pump 65 from the first hole 61a is not equal to the amount of air supplied to the resin receiving space 62 per unit time by the air compressor from the four second holes 61b, the pressure (air pressure) in the resin receiving space 62 can always remain constant.

[0050] <2> In the first embodiment described above, a second hose 64 is connected to the second hole 61b to supply air to the resin receiving space 62. However, it can also be configured so that the second hose 64 is not connected to the second hole 61b and it is in communication with the outside air. In this way, even if the plate member 61 and the frame member 24a are made in close contact without forming a gap G at the boundary between the plate member 61 and the frame member 24a, the pressure in the resin receiving space 62 can always be equal to the pressure of the air outside the resin receiving portion 24.

[0051] <3> In the above embodiments, although only one first hole 61a is formed, it is also possible to form two or more first holes 61a. The first hole 61a can be formed at an optimal location according to the distribution of the powdery resin R on the release film F.

[0052] <4> In the above embodiments, the second holes 61b are formed near the four corners of the plate-shaped member 61, but they can also be formed in other locations. Furthermore, four second holes 61b are formed around the first hole 61a, but three or fewer, or five or more, can also be formed. The second holes 61b can be formed in the optimal number at the optimal location according to the distribution of the powdery resin R on the release film F.

[0053] <5> In the above embodiments, the resin recovery mechanism 6 is arranged adjacent to the resin supply mechanism 26. However, the resin recovery mechanism 6 only needs to be arranged at a position where the granular resin R supplied by the resin supply mechanism 26 can be recovered without causing significant movement of the resin receiving portion 24, should the granular resin R be inappropriate. For example, the plate-shaped member 61 of the resin recovery mechanism 6 can also be arranged above the resin supply mechanism 26 (in the +Z direction) or above the movement path of the X-Y worktable 21. According to this configuration, by lowering the plate-shaped member 61, it is easy to cover the area above the resin receiving portion 24 arranged on the X-Y worktable 21. Furthermore, the film recovery portion 67 of the resin recovery mechanism 6 can also be provided midway along the movement path of the X-Y worktable 21.

[0054] <6> In the above embodiments, the control unit 5 determines whether the granular resin R is appropriate based on whether the weight of the granular resin R supplied to the release film F is a predetermined amount, but is not limited to this. For example, the determination criterion for whether the granular resin R is appropriate may also be whether the flow rate of the granular resin R supplied from the resin supply mechanism 26 exceeds a threshold. In this case, if the flow rate of the granular resin R exceeds the threshold, the control unit 5 determines that the granular resin R is inappropriate. Alternatively, it may be based on whether the distribution of the granular resin R supplied to the release film F is uniform. In this case, if the distribution of the granular resin R supplied to the release film F is not uniform, the control unit 5 determines that the granular resin R is inappropriate. The determination criterion for whether the granular resin R is appropriate is whether a qualified molded substrate Sb can be manufactured using the granular resin R supplied to the release film F; any determination criterion for this purpose can be adopted.

[0055] <7> In the above embodiments, the release film F after recovering the powdered resin R is conveyed to the film recycling unit 67 by the resin conveying mechanism 25, but is not limited thereto. Any other mechanism can be used. For example, it may also be configured such that after recovering the powdered resin R, the plate-shaped member 61 is used by the air pump 65 to adsorb the release film F and convey it to the film recycling unit 67, thereby recovering the release film F in the film recycling unit 67.

[0056] <8> The substrate Sa before resin molding performed by the resin molding apparatus 1 of the above embodiment is, for example, a semiconductor substrate (silicon wafer, etc.), a metal substrate (lead frame, etc.), a glass substrate, a ceramic substrate, a resin substrate, or a wiring substrate.

[0057] [Summary of the above embodiments] Hereinafter, a summary of the resin molding apparatus 1 and the method for manufacturing the resin molded article (Sb) described in the above embodiments will be given.

[0058] (1) The resin molding apparatus (1) is characterized by comprising: a resin supply mechanism (26) for supplying granular resin (R) to a resin receiving portion (24) including a release film (F) and a frame-shaped member (24a) disposed on the release film (F); a resin molding mechanism (3) having a molding die (M) consisting of an upper die (UM) and a lower die (LM) opposite to the upper die (UM), wherein the release film (F) to which the granular resin (R) is supplied is disposed between the upper die (UM) and the lower die (LM) for resin molding; and a resin recovery mechanism (6) for recovering the granular resin (R) supplied to the resin receiving portion (24) by suction before the release film (F) is disposed on the molding die (M).

[0059] The resin molding apparatus (1) configured in this way has a resin recovery mechanism (6), which can separate and recover the powdery resin (R) on the release film (F) supplied to the resin receiving section (24). Therefore, since only the release film (F) remains in the resin receiving section (24), only the release film (F) can be recovered. Thus, a resin molding apparatus (1) capable of automatically separating and recovering the powdery resin (R) and the release film (F) can be provided.

[0060] (2) In the resin molding apparatus (1) described in (1) above, the resin recycling mechanism (6) includes: a plate-shaped member (61) covering the upper part of the resin receiving portion (24) including the frame-shaped member (24a) and forming a resin receiving space (62) between the release film (F) and the frame-shaped member (24a); a recycling path (63) having one end connected to a first hole (61a) formed in the plate-shaped member (61) and the other end connected to a suction source (65); and a recycling portion (66) connected to the other end of the recycling path (63).

[0061] According to this configuration, by using a plate-shaped member (61) to cover the upper part of the resin receiving part (24) to form a resin receiving space (62) and by making the suction source (65) work, the powdery resin (R) supplied to the resin receiving part (24) can be suctioned and recovered from the first hole (61a) to the recovery part (66) via the recovery path (63).

[0062] In the resin molding apparatus (1) described in (2) above (3), the plate member (61) may also have a second hole (61b) that allows the resin receiving space (62) to communicate with the outside of the resin receiving space (62) to supply gas.

[0063] Gas (air) is drawn in together with the powdered resin (R) through the first hole (61a). According to this configuration, by supplying gas to the resin receiving space (62) through the second hole (61b), the reduction of gas in the resin receiving space (62) can be suppressed. As a result, it is possible to prevent the release film (F) from floating or the powdered resin (R) from being leaked.

[0064] (4) In the resin molding apparatus (1) described in (3) above, the plate member (61) may have a plurality of second holes (61b) arranged around the first hole (61a).

[0065] When the resin in the resin-containing space (62) is drawn using the suction source (65), a suction force also acts on the release film (F). However, according to this configuration, since a plurality of second holes (61b) are arranged around the first hole (61a), even if the suction force acts on the release film (F), the gas supplied to the resin-containing space (62) from the plurality of second holes (61b) arranged around the first hole (61a) can press down on the area around the release film (F) where the suction force acts, thus effectively suppressing the release film (F) from being drawn by the suction force. In addition, when the gas is blown onto the granular resin (R), the granular resin (R) flies, so the granular resin (R) located around the first hole (61a) is easily drawn, and the granular resin (R) can be recovered in a short time.

[0066] (5) In the resin molding apparatus (1) described in (3) or (4) above, the plate member (61) may contact the frame member (24a) to cover the upper part of the resin receiving part (24).

[0067] Since the gas (air) is drawn in together with the granular resin (R) from the first hole (61a), if the plate member (61) contacts the frame member (24a) and covers the upper part of the resin container (24), the resin container (62) will become negative pressure if the gas is not supplied to the resin container (62) from the second hole (61b). However, according to this configuration, if the gas is supplied to the resin container (62) from the second hole (61b), for example, so that the amount of gas in the resin container (62) drawn from the first hole (61a) by the suction source (65) per unit time is equal to the amount of gas supplied to the resin container (62) from the second hole (61b) per unit time, the granular resin (R) can be recovered while maintaining the pressure (air pressure) in the resin container (62) at a constant state.

[0068] (6) In any of the resin molding apparatus (1) described in (2) to (4) above, the plate member (61) may cover the upper part of the resin receiving part (24) with a gap (G) between it and the frame member (24a).

[0069] According to this configuration, the pressure of the gas in the resin containing space (62) can always be equal to the gas pressure outside the resin containing part (24). As a result, the granular resin (R) around the first hole (61a) can be easily drawn in, and the granular resin (R) can be recovered in a short time.

[0070] (7) The method for manufacturing a resin molded article (Sb) is characterized by comprising: a resin supply step, wherein a predetermined amount of granular resin (R) is supplied to a resin receiving portion (24) comprising a release film (F) and a frame-shaped member (24a) disposed on the release film (F); a judgment step, wherein the granular resin (R) supplied to the resin receiving portion (24) is deemed appropriate; a recycling step, wherein if the granular resin (R) is deemed inappropriate in the judgment step, the granular resin (R) supplied to the resin receiving portion (24) is sucked up to recycle it; and a molding step, wherein if the granular resin (R) is deemed appropriate in the judgment step, the release film (F) to which the granular resin (R) is supplied and the molding object (Sa) are disposed between an upper mold (UM) and a lower mold (LM) for resin molding.

[0071] According to the method for manufacturing a resin molded article (Sb) with this feature, there is a determination step for determining whether the granular resin (R) supplied to the resin receiving section (24) in the resin supply step is appropriate. Therefore, only the granular resin (R) determined to be appropriate in the determination step can be disposed between the upper mold (UM) and the lower mold (LM) for resin molding. Furthermore, if it is determined to be inappropriate in the determination step, the granular resin (R) supplied to the resin receiving section (24) is separated from the release film (F) and recycled in the recycling step, thus enabling automatic separation and recycling of the granular resin (R) and the release film (F).

[0072] (8) In the method for manufacturing the resin molded article (Sb) described in (7) above, it is also possible that, in the determination process, if the supply amount of the granular resin (R) exceeds the specified amount, if the flow rate of the granular resin (R) exceeds the threshold, or if the distribution of the granular resin (R) is uneven, the granular resin (R) is determined to be inappropriate.

[0073] Based on this feature, it is possible to reliably recover powdered resin (R) that may not be able to produce qualified products in the molding process.

[0074] Industrial availability This disclosure can be used for resin molding apparatus and methods for manufacturing resin molded articles.

[0075] Explanation of reference numerals in the attached figures 1: Resin molding device; 3: Resin molding module (resin molding mechanism); 6: Resin recycling facilities; 24: Resin container; 24a: Frame-like component; 26: Resin supply mechanism; 61: Plate-like components; 61a: First hole; 61b: Second hole; 62: Resin containment space; 63: First hose (recovery path); 65: Air pump (suction source); 66: Resin Recycling Department (Recycling Department); F: Release film; G: Gap; LM: Lower mold; M: Molding mold; R: Powdered or granular resin; Sa: Substrate before molding (object to be molded); Sb: The completed substrate (resin molded product); UM: Upper mold.

Claims

1. A resin molding apparatus, comprising: A resin supply mechanism supplies powdered resin to a resin receiving portion comprising a release film and a frame-shaped member disposed on the release film. A resin molding mechanism comprising a molding die consisting of an upper mold and a lower mold opposite to the upper mold, wherein a release film to which the powdered resin is supplied is disposed between the upper mold and the lower mold for resin molding; and The resin recovery mechanism can extract and recover the powdery resin supplied to the resin container before the release film is placed in the molding die.

2. The resin molding apparatus according to claim 1, wherein, The resin recycling mechanism includes: a plate-shaped member covering the upper part of the resin receiving portion including the frame-shaped member, forming a resin receiving space between the release film and the frame-shaped member; a recycling path, one end of which is connected to a first hole formed in the plate-shaped member, and the other end of which is connected to a suction source; and a recycling section connected to the other end of the recycling path.

3. The resin molding apparatus according to claim 2, wherein, The plate-shaped member has a second hole that allows the resin-containing space to communicate with the outside of the resin-containing space to supply gas.

4. The resin molding apparatus according to claim 3, wherein, The plate-shaped member has a plurality of the second holes. Multiple second holes are disposed around the first hole.

5. The resin molding apparatus according to claim 3 or 4, wherein, The plate-shaped member contacts the frame-shaped member to cover the upper part of the resin receiving portion.

6. The resin molding apparatus according to any one of claims 2 to 4, wherein, The plate-shaped member covers the upper part of the resin receiving portion with a gap between it and the frame-shaped member.

7. A method for manufacturing a resin molded article, comprising: In the resin supply process, a predetermined amount of powdered resin is supplied to a resin receiving portion comprising a release film and a frame-shaped member disposed on the release film. The determination process determines whether the powdered resin supplied to the resin container is appropriate. In the recycling process, if the powdered resin is determined to be unsuitable in the determination process, the powdered resin supplied to the resin container is sucked up to recycle it. as well as In the molding process, if the determination process determines that the granular resin is appropriate, the release film containing the granular resin and the object to be molded are placed between the upper mold and the lower mold for resin molding.

8. The method for manufacturing a resin molded article according to claim 7, wherein, In the determination process, if the supply amount of the granular resin exceeds the specified amount, if the flow rate of the granular resin exceeds the threshold, or if the distribution of the granular resin is uneven, the granular resin is determined to be unsuitable.

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