A laser chip automatic test equipment and a test method thereof

Abstract

This application relates to the technical field of chip testing, and in particular to an automatic testing device and method for laser chips. The automatic testing device includes a frame, a conveyor belt, a current detector, and a feeding device. The feeding device is located at the starting end of the conveyor belt and includes a feeding seat and a pushing component. A feeding slot for placing the laser chip is formed on the top surface of the feeding seat. A pushing slot and an ejection slot are formed on the side of the feeding seat, and the starting end of the conveyor belt is connected to the ejection slot. The pushing component is used to push the laser chip from the feeding slot into the ejection slot onto the conveyor belt. A limiting channel is provided on the conveyor belt, and the limiting channel is connected to the ejection slot. The technical solution provided by this application enables the laser chip to face the end of the conveyor belt, eliminating the need for circular holes in the conveyor belt and rotating disks within these holes. This helps reduce the manufacturing difficulty and cost of the conveyor belt, and the conveyor belt is less prone to sagging, ensuring stable transport.

Description

Technical Field

[0001] This application relates to the technical field of chip testing, and more specifically, to an automatic testing device and method for laser chips. Background Technology

[0002] Laser chips are the core components of lasers, and their design and manufacturing significantly impact the performance and characteristics of the laser. Laser chips made of different materials, structures, and processes can generate laser beams with varying wavelengths, powers, and beam characteristics, thus finding wide applications in various fields such as optical communication, laser printing, medical treatment, and scientific research. They are typically made of semiconductor materials, such as gallium nitride or gallium arsenide. Laser chips achieve laser emission through the special structure of semiconductor materials and electron energy level conversion processes. After the laser chip production is completed, it requires multiple tests using laser chip testing equipment.

[0003] In related technologies, laser chip testing equipment includes a frame, a conveyor belt, and a current detector. The conveyor belt is set on the frame, and multiple circular holes are opened on the conveyor belt along the conveying direction. A turntable is set in the circular hole. The current detector is lifted and set above the conveyor belt and is set near the conveying end of the conveyor belt. When using the aforementioned laser chip testing equipment, the operator places the laser chips one by one into the corresponding circular holes at the beginning of the conveyor belt and positions them on a turntable. The circular holes limit the laser chips, preventing them from slipping during transport. At this point, the orientation of the front end of the laser chip is random. Then, the turntable rotates to adjust the orientation of the laser chip, so that the front end of the laser chip faces the end of the conveyor belt, allowing the subsequent electromagnetic testing equipment to accurately land on the chip's contact surface. As the conveyor belt transports the laser chips, they are intermittently transported one by one to the area below the current detector. When the laser chip is below the current detector, the current detector moves downward, entering the interior of the laser chip and contacting the contact surface to begin the testing process. After the test is completed, the current detector moves upward, the conveyor belt continues to transport the laser chips, and the laser chips that have completed the test proceed to the next process. The laser chips to be tested repeat the above testing process.

[0004] However, to adjust the front end of the laser chip to face the end of the conveyor belt, multiple circular holes are made on the conveyor belt, and a rotating turntable is set in each circular hole. On the one hand, this increases the difficulty of processing and manufacturing. On the other hand, the conveyor belt needs to be thick enough so that after the turntable is set in the circular hole, there is still a groove-shaped space to limit the laser chip. The processing and manufacturing cost of the conveyor belt is high, and the dense opening of holes on the conveyor belt will reduce the structural strength of the conveyor belt. At the same time, the structure of the turntable in each circular hole will make the conveyor belt bear a large external force, leading to sagging problems and affecting the stability of the conveying. Summary of the Invention

[0005] The technical problem to be solved by the embodiments of this application is that, in order to adjust the front end of the laser chip to face the end of the conveyor belt, opening a circular hole and setting a turntable in the circular hole will increase the difficulty of processing and manufacturing, increase the cost, and easily lead to sagging problems, affecting the stability of the conveyor.

[0006] To address the aforementioned technical problems, this application provides an automated testing device for laser chips, which employs the following technical solution:

[0007] An automatic testing device for laser chips includes a frame, a conveyor belt, and a current detector. The conveyor belt is mounted on the frame, and the current detector is raised and lowered above the conveyor belt and positioned near the conveying end of the conveyor belt. The device also includes a feeding device, which is located at the conveying start end of the conveyor belt and includes a feeding seat and a pushing component.

[0008] The top surface of the feeding base is provided with a feeding slot for placing laser chips. The feeding slot includes a chip body slot and a chip front end slot that are interconnected.

[0009] The feeding seat has a push-in groove on the side away from the conveyor belt, and an ejection groove is provided on the side of the feeding seat near the conveyor belt, which is opposite to the push-in groove. The starting end of the conveyor belt is connected to the ejection groove, and the bottom walls of the push-in groove and the ejection groove are flush with the bottom wall of the feeding groove. The pushing component is located on the side of the feeding seat away from the conveyor belt and is used to push the laser chip in the feeding groove from the ejection groove onto the conveyor belt.

[0010] At least two limiting strips are provided on the conveyor belt along the conveying direction on its surface. Two adjacent limiting strips form a limiting channel, which is connected to the ejection groove. The width of the limiting channel is adapted to the width of the laser chip.

[0011] Furthermore, multiple partitions are spaced apart along the length of the feed trough, and the partitions divide the feed trough into multiple unit troughs;

[0012] The side wall of the feeding seat is provided with multiple sliding grooves opposite the feeding trough, and the partition is slidably connected to the sliding grooves accordingly; the feeding device also includes a driving mechanism, which is used to drive the partition to slide, and the partition can slide to completely detach from the feeding trough.

[0013] The partition comprises a bottom layer, a middle layer, and a top layer of film stacked together. The bottom layer is made of a rigid substrate, the middle layer is made of a cushioning material, and the top layer of film is a smooth, flexible film.

[0014] Furthermore, the driving mechanism includes a power component, a sliding component, and a reset component. The sliding component is powered by the power component to drive the partition to slide out of the feed trough, and the reset component is used to drive the partition to reset back into the feed trough.

[0015] The sliding assembly includes a drive rod, a drive plate, and a mating wedge. The mating wedge has multiple layers and is arranged corresponding to the partition. Each set of mating wedges includes an active wedge and a driven wedge. The top surface of the active wedge is a rising active wedge surface, and the bottom surface of the driven wedge is a rising driven wedge surface.

[0016] The maximum end of the active wedge and the minimum end of the driven wedge are positioned facing the feed seat; the maximum end of the active wedge is connected to a corresponding connecting post, and the active wedge is fixed to the drive rod through the corresponding connecting post; the drive rod is located between the mating wedge and the feed seat.

[0017] A miniature rotary motor is provided on the drive plate, and the shaft of the miniature rotary motor is connected to the end of the drive rod. The power component is used to control the lifting and lowering of the drive plate.

[0018] The smallest end of the driven wedge is connected to a connecting rod, and the driven wedge is fixed to the partition plate by the connecting rod. The distance between the axis of the driving rod and the side wall of the feed seat away from the conveyor belt is L1, and the distance between the smallest end of the active wedge and the axis of the driving rod is L2. L1 is greater than L2.

[0019] The inclination of the wedge surface of the mating wedge gradually increases from bottom to top.

[0020] Furthermore, two connecting rods are spaced apart on the same driven wedge block, and the driving rod passes between the two connecting rods. The thickness of the active wedge block is less than the interval between the two connecting rods on the corresponding driven wedge block.

[0021] The reset assembly is provided in multiple sets and is arranged corresponding to the partition. Each set of the reset assembly includes a reset spring, a guide rod and a reset plate. The reset plate is fixedly connected to the side of two connecting rods that are far apart from each other. The guide rod passes through the reset plate. One end of the guide rod is fixedly connected to the side wall of the feed seat and the other end of the guide rod is fixedly connected to an anti-detachment cap. The reset spring is sleeved on the guide rod. One end of the reset spring abuts against the side wall of the feed seat and the other end abuts against the reset plate.

[0022] Both the active wedge and the driven wedge are arranged in the shape of an isosceles trapezoid. The bottom surface of the active wedge is a buffer active wedge surface, and the top surface of the driven wedge is a buffer driven wedge surface.

[0023] The orthographic projection of the reset spring, guide rod, reset plate, and anti-dislodgement cap on the side wall of the connecting rod is located within the height range of the minimum end of the corresponding driven wedge.

[0024] Furthermore, the drive rod is a round rod, and a limiting rod is fixedly connected to the side wall of the feed seat. A guide ring is fixedly connected to the end of the limiting rod away from the feed seat, and the guide ring is sleeved on the drive rod.

[0025] Furthermore, the power assembly includes a drive motor, an eccentric wheel, and a first H-shaped connecting wheel. The output shaft of the drive motor is connected to the eccentric wheel to drive the eccentric wheel to rotate. The peripheral sidewall of the eccentric wheel abuts against or is adjacent to the bottom surface of the drive plate. A raised annular groove is formed on the peripheral sidewall of the eccentric wheel. A first raised straight groove is formed on the bottom surface of the drive plate. The first H-shaped connecting wheel includes a first fixed post and first rollers rotatably connected to both ends of the fixed post. The first rollers at both ends are slidably connected in the raised annular groove and the first raised straight groove, respectively.

[0026] Furthermore, multiple feed troughs are arranged in parallel, and the number of limiting channels, current detectors, push-in troughs, push-out troughs, sliding components and reset components are set in accordance with the number of feed troughs. Multiple drive rods are connected to the same drive plate through corresponding micro rotary motors.

[0027] Furthermore, the pushing component includes a pusher plate, a synchronization plate, a second I-beam connecting wheel, and a guide frame;

[0028] The number of push plates corresponds to the number of push slots and is fixedly connected to the side of the synchronization plate. The push plates are slidably connected in the push slots and are adapted to the push slots.

[0029] The synchronizing plate has a second convex straight groove on the side away from the push plate. The second I-shaped connecting wheel includes a second fixed column and second rollers rotatably connected to both ends of the fixed column. The second rollers at both ends are slidably connected in the convex ring groove and the second convex straight groove, respectively. The peripheral sidewall of the eccentric wheel is also in contact with or adjacent to the synchronizing plate.

[0030] The guide frame is fixedly connected to the side wall of the feed seat and multiple guide frames are arranged in parallel. The synchronization plate is provided with a guide groove for the guide frame to pass through.

[0031] A push rod is fixedly connected to the synchronization plate, and a pushing groove is provided on the side wall of the feed seat for the push rod to pass through; the ejection groove includes the main groove and a widening groove located above the main groove, the pushing groove is located inside the widening groove and outside the feed groove; a limit baffle is hinged in the widening groove by a torsion spring, the limit baffle is adapted to the widening groove, and the hinge is located at the top of the widening groove;

[0032] When the feeding device is in its initial state, the active wedge is located directly below the driven wedge, the rising active wedge surface and the rising driven wedge surface are in complete contact, the minimum eccentric end of the eccentric wheel is in contact with the bottom surface of the drive plate, and there is a gap between the end of the push rod away from the synchronization plate and the limiting baffle.

[0033] Furthermore, the frame is equipped with clamping components for positioning the laser chip during testing.

[0034] To address the aforementioned technical problems, this application also provides an automatic testing method for laser chips, which employs the aforementioned automatic laser chip testing equipment and includes the following steps:

[0035] S1. Feeding: Place the laser chip into the feeding slot, with the main body of the laser chip located in the chip body slot and the front end of the laser chip located in the laser chip front end slot.

[0036] S2, Pushing: The pushing component pushes the laser chip in the feed slot from the ejection slot onto the conveyor belt from the push-in slot;

[0037] S3, Feeding: The conveyor belt transports the laser chip to the area below the current detector;

[0038] S4. Detection: The current detector descends to detect the laser chip;

[0039] S5. Unloading: After the laser chip is inspected, the conveyor belt continues to transport the chip to the next process and unloads it from the end of the conveyor belt.

[0040] Compared with the prior art, the embodiments of this application have the following main advantages:

[0041] First, the laser chip is placed into the feed slot. Due to the chip front end slot, the chip's front end can be inserted from a fixed position and direction. Then, a pushing component pushes the laser chip out of the ejection slot. After contacting the conveyor belt, the laser chip enters the limiting channel on the conveyor belt, which limits the laser chip's posture, ensuring that the front end of the laser chip always faces the end of the conveyor belt. Compared to opening circular holes in the conveyor belt and setting turntables in the holes, this method helps reduce the difficulty and cost of conveyor belt processing and manufacturing, and the conveyor belt is less prone to sagging, resulting in stable conveying. Attached Figure Description

[0042] To more clearly illustrate the solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0043] Figure 1 This is a schematic diagram of the overall structure of the automatic testing equipment for laser chips in the embodiments of this application.

[0044] Figure 2 This is a schematic diagram illustrating the structure of the mounting shell in an embodiment of this application.

[0045] Figure 3 This is a schematic diagram of the structure of the top of the feed trough in an embodiment of this application.

[0046] Figure 4 This is a schematic diagram illustrating the structure of the laser chip in an embodiment of this application.

[0047] Figure 5 This is a schematic diagram of the feeding device in the embodiments of this application.

[0048] Figure 6 This is a schematic diagram illustrating the structure of the limiting baffle in an embodiment of this application.

[0049] Figure 7 This is a structural schematic diagram used to illustrate the partition in an embodiment of this application.

[0050] Figure 8 This is a schematic diagram illustrating the structure of the reset component in an embodiment of this application.

[0051] Figure 9 This is a schematic diagram illustrating the structure of the push plate in an embodiment of this application.

[0052] Figure 10 This is a schematic diagram showing the orientation of the smallest end of the active wedge during the upward movement of the drive rod in an embodiment of this application.

[0053] Figure 11 This is a schematic diagram showing the orientation of the smallest end of the active wedge during the descent of the drive rod in an embodiment of this application.

[0054] Figure 12 This is a schematic diagram illustrating the structure of the lowest active wedge and the smallest end of the driven wedge in contact, as shown in the embodiments of this application.

[0055] Figure 13 This is a schematic diagram illustrating the structure of the second layer of active wedge and driven wedge when their smallest ends abut against each other in an embodiment of this application.

[0056] Figure 14 This is a schematic diagram in the embodiments of this application used to show the structure when the smallest ends of the topmost active wedge and the driven wedge are in contact.

[0057] Figure 15 This is a schematic diagram of the structure when the drive rod rises to its highest position in an embodiment of this application.

[0058] Figure 16 This is a schematic diagram illustrating the structure of the drive rod when it begins to descend, as shown in the embodiments of this application.

[0059] Figure 17 This is a structural schematic diagram used in the embodiments of this application to illustrate the thickness of the active wedge.

[0060] Figure 18 This is a top view used in the embodiments of this application to show the thickness of the active wedge.

[0061] Figure 19 This is a schematic diagram of the structure used for the side of the connecting rod in an embodiment of this application.

[0062] Figure 20 This is a schematic diagram used in the embodiments of this application to illustrate the structure of each layer of the partition.

[0063] Figure 21 This is a schematic diagram illustrating the structure of the eccentric wheel in an embodiment of this application.

[0064] Figure 22 This is a structural schematic diagram of the first I-beam connecting wheel in an embodiment of this application, where point A is a cross-sectional view of the drive plate.

[0065] Figure 23 This is a schematic diagram of the structure in this application embodiment where the drive mechanism is disposed on both sides of the feed seat.

[0066] Figure 24 This is a schematic diagram of the structure in an embodiment of this application, showing that the partition is divided into two parts.

[0067] Reference numerals: 1. Frame; 11. Elevator frame; 12. Mounting housing; 13. First frame; 14. Second frame; 2. Conveyor belt; 21. Limiting strip; 22. Limiting channel; 3. Current detector; 4. Feeding device; 41. Feeding seat; 411. Feeding groove; 412. Chip body groove; 413. Chip front end groove; 414. Pushing groove; 415. Pushing groove; 416. Clearing groove; 42. Pushing assembly; 421. Push plate; 422. Synchronizing plate; 423. Second I-beam connecting wheel; 424. Guide frame; 425. Second fixing column; 426. Second roller; 427. Second convex straight groove; 428. Guide groove; 43. Slide groove; 44. Push rod; 45. Pushing through groove; 46. Main groove; 47. Widening groove; 48. Limiting baffle; 5. Partition; 51. Bottom 52. Middle layer; 53. Top layer coating; 6. Power assembly; 61. Drive motor; 62. Eccentric wheel; 621. T-shaped ring groove; 63. First I-shaped connecting wheel; 631. First fixed column; 632. First roller; 7. Sliding assembly; 71. Drive rod; 72. Drive plate; 721. Micro rotating motor; 722. First T-shaped straight groove; 73. Active wedge; 731. Rising active wedge surface; 732. Connecting column; 733. Buffer active wedge surface; 74. Driven wedge; 741. Rising driven wedge surface; 742. Connecting rod; 743. Buffer driven wedge surface; 75. Limiting rod; 751. Guide ring; 8. Reset assembly; 81. Reset spring; 82. Guide rod; 821. Anti-detachment cap; 83. Reset plate; 9. Laser chip; 91. Main body; 92. Front end. Detailed Implementation

[0068] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0069] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0070] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

[0071] Reference Figures 1 to 6 An automatic testing device for laser chips includes a frame 1, a conveyor belt 2, and a current detector 3. The frame 1 includes a first frame 13 and a second frame 14. The conveyor belt 2 is disposed on the first frame 13. The current detector 3 is lifted and disposed above the conveyor belt 2 and near the conveying end of the conveyor belt 2 by a cylinder. The device also includes a feeding device 4, which is disposed at the conveying start end of the conveyor belt 2. The feeding device 4 includes a feeding seat 41 and a pushing component 42.

[0072] The top surface of the feed holder 41 is provided with a feed groove 411 for inserting the laser chip 9. The feed groove 411 includes a chip body groove 412 and a chip front end groove 413 that are interconnected. Figure 3 As shown; the shape of laser chip 9 is as follows Figure 4 As shown, it includes a main body 91 and a front end 92. The shape of the chip main body groove 412 is adapted to the outline shape of the laser chip main body 91, and the shape of the chip front end groove 413 is adapted to the outline shape of the laser chip front end 92. If the shape or size of the laser chip 9 is changed, such as replacing it with another type of laser chip 9, the shape of the feed groove 411 can be designed to be the corresponding shape and size.

[0073] A push-in groove 414 is provided on the side of the feed seat 41 away from the conveyor belt 2, and an ejection groove 415 is provided on the side of the feed seat 41 close to the conveyor belt 2, which is opposite to the push-in groove 414. The starting end of the conveyor belt 2 is connected to the ejection groove 415. The bottom walls of the push-in groove 414 and the ejection groove 415 are flush with the bottom wall of the feed groove 411. The push assembly 42 is provided on the side of the feed seat 41 away from the conveyor belt 2 and is used to push the laser chip 9 in the feed groove 411 from the ejection groove 415 onto the conveyor belt 2.

[0074] Four limiting strips 21 are arranged on the conveyor belt 2 along its conveying direction, forming two limiting channels 22. The limiting channels 22 are connected to the ejection groove 415, and the width of the limiting channels 22 is adapted to the width of the laser chip 9. The height of the limiting channels 22 is lower than the height of the laser chip 9. The bottom of the feed seat 41 is integrally formed with a heightening frame 11. A clearance groove 416 is opened on the side wall of the feed seat 41 near the conveyor belt 2. The clearance groove 416 is located on both sides of the ejection groove 415 and is adjacent to the ejection groove 415. The bottom of the clearance groove 416 penetrates the bottom surface of the feed seat 41 for the limiting strips 21 to pass through, in order to make way for the limiting strips 21.

[0075] Through the above technical solution, the automatic laser chip testing equipment of this application embodiment, when in use, first puts the laser chip 9 into the feeding slot 411, and multiple chips can be put in at once to improve work efficiency. Even if the operator is temporarily busy, the remaining amount of laser chip 9 in the feeding slot 411 provides a certain buffer time. Due to the setting of the chip front end slot 413, the front end of the chip can be put in from a fixed position and direction. Then, the laser chip 9 is pushed out from the ejection slot 415 by the pushing component 42. After the laser chip 9 contacts the conveyor belt 2, it enters the limiting channel 22 on the conveyor belt 2, which limits the posture of the laser chip 9, so that the front end of the laser chip 9 always faces the conveying end of the conveyor belt 2. Compared with opening a circular hole on the conveyor belt 2 and setting a turntable in the circular hole, it helps to reduce the manufacturing difficulty and cost of the conveyor belt 2, and the conveyor belt 2 is not easy to collapse, and the conveying is stable.

[0076] Reference Figures 6 to 8 Furthermore, three layers of partitions 5 are provided at intervals along the length of the feed trough 411. The width of the partitions 5 is greater than the width of the feed trough 411, and the partitions 5 divide the feed trough 411 into four unit troughs.

[0077] The side wall of the feed seat 41 is provided with four sliding grooves 43 opposite to the feed trough 411, and the partition 5 is slidably connected in the sliding grooves 43. The feeding device 4 also includes a driving mechanism, which is used to drive the partition 5 to slide, and the partition 5 can slide to completely detach from the feed trough 411.

[0078] Reference Figure 8 , Figure 9 and Figure 20 The bottom wall and partition 5 of the feed trough 411 both include a bottom layer 51, a middle layer 52 and a top layer film 53 stacked together. The bottom layer 51 is made of a rigid substrate, such as stainless steel plate; the middle layer 52 is made of a cushioning material, such as flexible rubber with a Shore A hardness of 40-60 degrees; the top layer film 53 is a smooth flexible film, such as PET film with an extremely low coefficient of dynamic friction.

[0079] If multiple laser chips 9 are stacked sequentially in the feed trough 411, the bottom laser chip 9 will bear the weight of the multiple laser chips 9 above it. When the pushing component 42 pushes the bottom laser chip 9, the top surface of the bottom laser chip 9 will generate a large frictional force with the bottom surface of the laser chips 9 above it, which may easily lead to quality problems of the laser chip 9.

[0080] In the above technical solution of this application embodiment, laser chips 9 are placed in four unit slots in advance. The laser chips 9 in the upper three unit slots are respectively placed on the corresponding partitions 5, and the laser chip 9 in the lowermost unit slot is located on the bottom wall of the feed trough 411. Multiple laser chips 9 in the feed trough 411 are placed independently. After the bottom laser chip 9 is pushed out and conveyed away, the bottom partition 5 exits the feed trough 411, and the laser chip 9 on this partition 5 falls along the inner wall of the feed trough 411 to the top of the bottom wall of the feed trough 411. Then, this partition 5 gradually resets. During the gradual reset of the bottom partition 5, the second partition 5 completely exits the feed trough 411, and the laser chip 9 on the second partition 5 falls onto the bottom partition 5. Then, the second partition 5 gradually resets. During the gradual reset of the second partition 5, the top partition 5 completely exits the feed trough 411, and the laser chip 9 on the top partition 5 falls onto the second partition 5. Then, the top partition 5 gradually resets. During the gradual reset of the top partition 5, the operator places a new laser chip 9 to be tested onto the top partition 5. Repeating the above steps, the laser chips 9 are conveyed downwards one by one and pushed to the right onto the conveyor belt 2 for subsequent testing processes. Furthermore, the bottom wall of the feed trough 411 and the bottom layer 51 of the partition 5 are made of rigid substrate to ensure sufficient structural strength; the middle layer 52 is made of buffer material to reduce the impact when the laser chip 9 falls; the top layer film 53 is a smooth flexible film that can reduce the friction between the laser chip 9 and the partition 5 and the bottom wall of the feed trough 411, making it easier for the partition 5 to be pulled out from under the laser chip 9 and for the laser chip 9 to be pushed out from the bottom wall of the feed trough 411.

[0081] Reference Figure 6 and Figure 7 Furthermore, the drive mechanism includes a power assembly 6, a sliding assembly 7, and a reset assembly 8. The power assembly 6 and the sliding assembly 7 are connected and disposed on the upper or lower side of the sliding assembly 7. The sliding assembly 7 is powered by the power assembly 6 to drive the partition 5 to slide out of the feed trough 411. The reset assembly 8 is disposed correspondingly to the sliding assembly 7. The reset assembly 8 is used to drive the partition 5 to reset back into the feed trough 411.

[0082] The sliding assembly 7 includes a drive rod 71, a drive plate 72, and mating wedges. The drive plate 72 is connected to the end of the drive rod 71, and the mating wedges are connected to the side wall of the drive rod 71. The mating wedges are arranged in three layers, corresponding to the partition plate 5. The three layers of mating wedges are of equal length and are greater than the width of the feed chute 411 from left to right in the horizontal direction. Each set of mating wedges includes an active wedge 73 and a driven wedge 74 that cooperate with each other. The active wedge 73 can be located below the driven wedge 74 or can move above the driven wedge 74. The top surface of the active wedge 73 is a rising active wedge surface 731, and the bottom surface of the driven wedge 74 is a rising driven wedge surface 741.

[0083] The maximum end of the active wedge 73 and the minimum end of the driven wedge 74 are set towards the feed seat 41; the maximum end of the active wedge 73 is connected to a corresponding connecting post 732, and the active wedge 73 is fixed to the drive rod 71 through the corresponding connecting post 732. The drive rod 71 is located between the mating wedge and the feed seat 41.

[0084] A miniature rotary motor 721 is provided on the drive plate 72. The shaft of the miniature rotary motor 721 is connected to the end of the drive rod 71. The power assembly 6 is used to control the lifting and lowering of the drive plate 72.

[0085] The smallest end of the driven wedge 74 is connected to a connecting rod 742. The driven wedge 74 is fixed to the partition plate 5 via the connecting rod 742. The distance between the axis of the drive rod 71 and the side wall of the feed seat 41 away from the conveyor belt 2 is L1. The distance between the smallest end of the active wedge 73 and the axis of the drive rod 71 is L2. L1 is greater than L2, but slightly greater is acceptable. Figure 10 and Figure 11 As shown; so that L1 has sufficient length for the active wedge 73 to pass through during the subsequent descent, and when the active wedge 73 descends to its lowest position during the descent process, as shown... Figure 11 As shown, the descent method will be described in detail later;

[0086] The inclination of the wedge surface of the mating wedge gradually increases from bottom to top.

[0087] Through the above technical solution, when the partition 5 needs to slide out of the feed trough 411, the power assembly 6 controls the drive plate 72 and drive rod 71 to rise from the initial position. Under the action of the rising active wedge surface 731 and the rising driven wedge surface 741, the active wedge 73 rises, driving the driven wedge 74 to move to the left, thereby causing the partition 5 to slide out of the slide trough 43 and be pulled away from the feed trough 411. Since the inclination of the wedge surface of the mating wedge gradually increases from bottom to top, when the smallest end of the lowest active wedge 73 abuts against the smallest end of the driven wedge 74 (e.g. Figure 12As shown), at this time, the bottom partition 5 is completely removed from the feed trough 411, the laser chip 9 on the bottom wall of the feed trough 411 has been pushed away, and the laser chip 9 on the bottom partition 5 falls onto the bottom wall of the feed trough 411. The rising active wedge surface 731 of the second active wedge 73 and the rising driven wedge surface 741 of the driven wedge 74 are still in contact. The rising active wedge surface 731 of the top active wedge 73 and the rising driven wedge surface 741 of the driven wedge 74 are also still in contact, and the rising active wedge surface 731 and the driven wedge 74 of the top active wedge are in contact more. The specific size of the inclination of the wedge surface of the wedge can be set according to the actual situation.

[0088] Then, each layer of active wedge 73 continues to move upwards. At this time, the lowest active wedge 73 moves above the lowest driven wedge 74. When each active wedge 73 moves to its highest position, it is not higher than the bottom of the driven wedge 74 of the layer above it. The active wedge 73 moves vertically up and down, and the driven wedge moves horizontally left and right. The lowest partition 5 is gradually reset by the reset assembly 8. During the gradual reset of the lowest partition 5, when the smallest end of the second active wedge 73 abuts against the smallest end of the driven wedge 74 (e.g.) Figure 13 As shown), at this time, the second partition 5 is completely separated from the feed trough 411, and the laser chip 9 on the second partition 5 falls onto the bottom partition 5 which is gradually resetting. The rising active wedge surface 731 of the top active wedge 73 and the rising driven wedge surface 741 of the driven wedge 74 are still in contact.

[0089] Each layer of active wedge 73 continues to move upward, and the second layer partition 5 is gradually reset by the reset assembly 8. The bottommost partition 5 has been reset. During the gradual reset of the second layer partition 5, when the smallest end of the top active wedge 73 abuts against the smallest end of the driven wedge 74 (e.g.) Figure 14 As shown), at this time, the top partition 5 is completely separated from the feed trough 411, and the laser chip 9 on the top partition 5 falls onto the gradually resetting second partition 5.

[0090] Each layer of active wedge 73 continues to move upwards, the second layer partition 5 completes its reset, and then the top layer partition 5 completes its reset. At this time, the state of each layer of active wedge 73 is as follows: Figure 15 As shown, a new laser chip 9 to be tested is placed on the top partition 5;

[0091] Then, the drive rod 71 is rotated 180° along its own axis by the miniature rotary motor 721 (e.g., ...). Figure 16 and Figure 17As shown), the drive rod 71 is lowered by the power component 6, so that the active wedge 73 passes down from the distance between the left side wall of the feed seat 41 and the smallest end of the driven wedge 74 to the height of the initial position. Then the drive rod 71 is rotated 180° along its own axis to return the active wedge 73 to the initial position. This cycle is repeated to feed one by one.

[0092] Reference Figures 6 to 8 Furthermore, two connecting rods 742 are spaced apart on the same driven wedge 74, and the drive rod 71 passes between the two connecting rods 742. The thickness of the driving wedge 73 is smaller than the gap between the two connecting rods 742 on the corresponding driven wedge 74, so that when the driving wedge 73 descends, it can smoothly pass between the two connecting rods 742 (e.g., Figure 17 and Figure 18 (as shown)

[0093] The reset assembly 8 is provided in multiple sets and is arranged corresponding to the partition 5. Each set of reset assembly 8 includes a reset spring 81, a guide rod 82 and a reset plate 83. The reset plate 83 is fixedly connected to the side of the two connecting rods 742 that are far apart from each other. The guide rod 82 passes through the reset plate 83. One end of the guide rod 82 is fixedly connected to the side wall of the feed seat 41, and the other end of the guide rod 82 is fixedly connected to an anti-detachment cap 821. The reset spring 81 is sleeved on the guide rod 82. One end of the reset spring 81 abuts against the side wall of the feed seat 41, and the other end abuts against the reset plate 83, so that the partition 5 can automatically reset.

[0094] Both the active wedge 73 and the driven wedge 74 are arranged in the shape of an isosceles trapezoid. The bottom surface of the active wedge 73 is the buffer active wedge surface 733, and the top surface of the driven wedge 74 is the buffer driven wedge surface 743. When the partition 5 is reset by the reset spring 81, the buffer active wedge surface 733 and the buffer driven wedge surface 743 will abut against each other and move gradually, so that the partition 5 will not suddenly reset and impact during the reset, thus playing a buffering role in the reset process of the partition 5. In order to facilitate the cooperation between the active wedge 73 and the driven wedge 74, the smallest end of the driven wedge 74 of the active wedge 73 can be rounded.

[0095] The orthographic projections of the reset spring 81, guide rod 82, reset plate 83, and anti-dislodgement cap 821 onto the side wall of connecting rod 742 are located within the height range of the minimum end of the corresponding driven wedge block 74 (e.g., Figure 19 As shown in the figure, this allows the active wedge 73 to rotate smoothly 180° without easily causing interference.

[0096] Reference Figure 6 and Figure 7Furthermore, the drive rod 71 is a round rod, and a limit rod 75 is fixedly connected to the side wall of the feed seat 41. The position of the limit rod 75 does not interfere with the rotation of the active wedge block 73. A guide ring 751 is fixedly connected to the end of the limit rod 75 away from the feed seat 41. The guide ring 751 is sleeved on the drive rod 71 to play a guiding role, so as to facilitate the stable lifting and lowering of the drive rod 71.

[0097] Reference Figure 6 and Figures 20 to 22 Furthermore, the power assembly 6 includes a drive motor 61, an eccentric wheel 62, and a first I-beam connecting wheel 63. The output shaft of the drive motor 61 is connected to the eccentric wheel 62 to drive the eccentric wheel 62 to rotate. The peripheral sidewall of the eccentric wheel 62 abuts against or is adjacent to the bottom surface of the drive plate 72. A raised annular groove 621 is formed on the peripheral sidewall of the eccentric wheel 62, and a first raised straight groove 722 is formed on the bottom surface of the drive plate 72. The first I-beam connecting wheel 63 includes a first fixed post 631 and first rollers 632 rotatably connected to both ends of the first fixed post 631. The first rollers 632 at both ends are slidably connected in the raised annular groove 621 and the first raised straight groove 722, respectively, to realize the limiting connection between the eccentric wheel 62 and the drive plate 72.

[0098] With the above technical solution, when the drive rod 71 needs to be raised or lowered, the eccentric wheel 62 is rotated by the drive motor 61. Under the connection of the first I-beam connecting wheel 63, the drive plate 72 is raised or lowered, thereby realizing the raising or lowering of the drive rod 71.

[0099] Reference Figure 1 and Figures 4 to 6 Furthermore, two feed troughs 411 are provided in parallel. The number of limit channels 22, current detectors 3, push-in grooves 414, push-out grooves 415, sliding components 7 and reset components 8 are the same as the number of feed troughs 411. The two drive rods 71 ​​are connected to the same drive plate 72 through corresponding micro rotary motors 721 to realize dual-station detection.

[0100] Reference Figures 4 to 6 and Figures 20 to 22 Furthermore, the pusher component 42 includes a pusher plate 421, a synchronization plate 422, a second I-beam connecting wheel 423, and a guide frame 424;

[0101] The number of push plates 421 corresponds to the number of push slots 414 and they are all fixedly connected to the side of the synchronization plate 422. The push plates 421 are slidably connected to the push slots 414 and are adapted to the push slots 414.

[0102] The synchronizing plate 422 has a second convex straight groove 427 on the side away from the push plate 421. The second I-shaped connecting wheel 423 includes a second fixed column 425 and second rollers 426 rotatably connected to both ends of the second fixed column 425. The second rollers 426 at both ends are slidably connected to the convex ring groove 621 and the second convex straight groove 427 respectively. The peripheral sidewall of the eccentric wheel 62 is also in contact with or adjacent to the synchronizing plate 422.

[0103] The guide frame 424 is fixedly connected to the side wall of the feed seat 41 and two are arranged side by side. The two ends of the synchronization plate 422 each have a guide groove 428 for the guide frame 424 to pass through.

[0104] An L-shaped push rod 44 is fixedly connected to the synchronization plate 422. A push passage 45 for the push rod 44 to pass through is provided on the side wall of the feed seat 41. The ejection groove 415 includes the main groove 46 and a widening groove 47 located above the main groove 46. The push passage 45 is located inside the widening groove 47 and outside the feed groove 411. A limit baffle 48 is hinged to the widening groove 47 by a torsion spring. The top surface of the laser chip 9 (the laser chip 9 to be ejected) on the bottom wall of the feed groove 411 is higher than the bottom surface of the limit baffle 48. The limit baffle 48 is adapted to the widening groove 47, and the hinge is located at the top of the widening groove 47 (e.g., Figure 6 (As shown).

[0105] Reference Figures 4 to 6 and Figures 20 to 22 Through the above technical solution, when the eccentric wheel 62 rotates counterclockwise, it includes four states:

[0106] The first state is the initial state, which is also the initial state of the feeding device 4. At this time, the maximum eccentric end of the eccentric wheel 62 is at the bottom, the active wedge 73 is located directly below the driven wedge 74, the rising active wedge surface 731 and the rising driven wedge surface 741 are in complete contact, the minimum eccentric end of the eccentric wheel 62 is in contact with the bottom surface of the drive plate 72, and there is a gap between the end of the push rod 44 away from the synchronous plate 422 and the limit baffle 48. The push plate 421 has not yet entered the feeding trough 411.

[0107] The second state is the pushing state, at which point the eccentric wheel 62 rotates 90° counterclockwise, and the maximum eccentric end of the eccentric wheel 62 is at the far right.

[0108] During the transition from the first state to the second state of the eccentric wheel 62, on the one hand, the drive synchronization plate 422 moves horizontally to the right, thereby driving the push plate 421 to move to the right in the push barrel groove, gradually pushing the laser chip 9 on the bottom wall of the feed trough 411 out of the ejection groove 415. The laser chip 9 does not need to be completely pushed out of the ejection groove 415; as long as the front middle part of the laser chip 9 contacts the conveyor belt 2, the conveyor belt 2 can transport the laser chip 9 away. During the process of the push plate 421 moving to the right, the push rod 44 also moves to the right. Since there is a gap between the end of the push rod 44 away from the synchronization plate 422 and the limit baffle 48 in the initial state, the push rod 44 will not contact the limit when it first moves to the right. The baffle 48 and the limiting baffle 48 remain vertical under the action of the torsion spring until the laser chip 9 is about to reach the outlet of the ejection slot 415, that is, when the laser chip 9 is about to contact the side of the limiting baffle 48 facing the inside of the feed slot 411. At this time, the push rod 44 has already abutted against the limiting baffle 48. As the push plate 421 and the push rod 44 continue to move to the right, the limiting baffle 48 is pushed up by the push rod 44 and rotates, so that the ejection slot 415 exposes a larger space to facilitate the ejection of the laser chip 9. The ejected laser chip 9 immediately contacts the conveyor belt 2 and is transported by the conveyor belt 2 to the detection process until the maximum eccentric end of the eccentric wheel 62 is on the right. At this time, the push plate 421 enters the feed slot 411 to the maximum extent.

[0109] During the transition from the first to the second state of the eccentric wheel 62, on the other hand, the eccentric wheel 62 causes the drive plate 72 and drive rod 71 to move vertically upward, driving the active wedge block 73 to move vertically upward. The bottom partition 5 is completely pulled out of the feed trough 411, and the laser chip 9 on the bottom partition 5 falls onto the top surface of the push plate 421. When the laser chip 9 on the bottom partition 5 falls onto the top surface of the push plate 421, the laser chip 9 originally on the bottom wall of the feed trough 411 has been pushed out and conveyed away. The push plate 421 also includes a layered bottom layer 51, a middle layer 52, and a top layer coating 53, and the materials of each layer are the same as those of the partition 5. Then the active wedge block 73 continues to move vertically upward, and the bottom partition 5 gradually returns to its original position under the action of the return spring 81.

[0110] The third state is a continuously rising state, which is obtained by rotating the second state counterclockwise by 90°. At this time, the maximum eccentric end of the eccentric wheel 62 is at the top.

[0111] During the process from the second state to the third state of the eccentric wheel 62, on the one hand, the drive synchronization plate 422 moves horizontally to the left, so that the push plate 421 is gradually pulled out from the bottom of the laser chip 9 and reset to the initial state of the push plate 421, and the laser chip 9 falls onto the bottom wall of the feed trough 411.

[0112] On the other hand, the eccentric wheel 62 causes the drive plate 72 and drive rod 71 to continue moving vertically upward, which in turn drives the active wedge block 73 to move vertically upward. The second layer partition 5 and the top layer partition 5 are completely removed from the feed trough 411 one after another, so that the corresponding laser chip 9 falls down one layer. Among the three layers of partition 5, when the upper layer partition 5 is completely removed from the feed trough 411, the lower layer partition 5 is in the reset process or in a fully reset state.

[0113] The fourth state is the reset state of the eccentric wheel 62. The fourth state is obtained by continuing to rotate counterclockwise by 180° from the third state. At this time, the maximum eccentric end of the eccentric wheel 62 is at the bottom, restoring the eccentric wheel 62 to its initial state.

[0114] On one hand, after the eccentric wheel 62 reaches the third state, the rotation of the eccentric wheel 62 stops, and the micro rotary motor 721 controls the drive rod 71 to rotate 180° along its own axis. Then the eccentric wheel 62 starts and rotates from the third state to the fourth state. When the eccentric wheel 62 reaches the fourth state, the rotation of the eccentric wheel 62 stops again, and the micro rotary motor 721 continues to control the drive rod 71 to rotate 180° along its own axis, so that the active wedge block 73 returns to the initial state.

[0115] On the other hand, the push plate 421 first moves to the left relative to the initial state, and then returns to the initial state. In order to facilitate the push plate 421 moving to the left out of the push groove 414 and then returning to the initial state, the opening of the push groove 414 can be set as a trumpet-shaped opening.

[0116] like Figure 23 and Figure 24 As shown, furthermore, to improve the stability of the laser chip 9 on both sides when it falls from the partition 5, the partition 5 can also be divided into two abutting halves. The aforementioned drive mechanisms are respectively set on the left and right sides of the feed seat 41. The power component 6 in the drive mechanism closer to the conveyor belt 2 is located on the top of the drive rod 71 and fixed to the side wall of the feed seat 41. The two drive mechanisms respectively control the corresponding two halves of the partition 5 to move in a direction away from or towards each other, such as... Figure 12 As shown.

[0117] Reference Figure 2 Furthermore, in order to improve the overall aesthetics and safety, a mounting shell 12 is fixedly connected to the side wall of the feed seat 41, the drive mechanism is covered inside the mounting shell 12, and an opening and closing door for maintenance is provided on the side of the mounting shell 12.

[0118] Furthermore, the second frame 14 is equipped with a clamping component. The clamping component is existing technology, and any structure that can clamp and fix the laser chip 9 during testing is acceptable. Since the height of the limiting channel 22 is lower than the height of the laser chip 9, the clamping position is located in the upper middle part of the side of the laser chip 9, which is offset from the limiting strip 21. This application does not elaborate on it or show it. It is used to position the laser chip 9 during testing and improve the stability of the laser chip 9 during testing.

[0119] To address the aforementioned technical problems, this application also provides an automatic testing method for laser chip 9, which uses the aforementioned automatic laser chip testing equipment for testing and includes the following steps:

[0120] S1. Feeding: Place the laser chip 9 into the feeding slot 411. The main body of the laser chip 9 is located in the chip body slot 412, and the front end of the laser chip 9 is located in the chip front end slot 413.

[0121] S2, Pushing: The pushing component 42 pushes the laser chip 9 in the feed groove 411 from the push-in groove 414 to the ejection groove 415 onto the conveyor belt 2, specifically:

[0122] The eccentric wheel 62 drives the synchronous plate 422 to move horizontally to the right, thereby driving the push plate 421 to move to the right in the push barrel groove, gradually pushing the laser chip 9 on the bottom wall of the feed trough 411 out of the ejection groove 415. The laser chip 9 does not need to be completely pushed out of the ejection groove 415; as long as the front middle part of the laser chip 9 contacts the conveyor belt 2, the conveyor belt 2 can transport the laser chip 9 away. During the process of the push plate 421 moving to the right, the push rod 44 also moves to the right. Since there is a gap between the end of the push rod 44 away from the synchronous plate 422 and the limiting baffle 48 in the initial state, the push rod 44 will not contact the limiting baffle 48 when it first moves to the right. 8 remains vertical under the action of the torsion spring until the laser chip 9 is about to reach the outlet of the ejection slot 415, that is, when the laser chip 9 is about to contact the side of the limiting baffle 48 facing the inside of the feed slot 411. At this time, the push rod 44 has already abutted against the limiting baffle 48. As the push plate 421 and the push rod 44 continue to move to the right, the limiting baffle 48 is pushed up by the push rod 44 and rotates, so that the ejection slot 415 exposes a larger space to facilitate the ejection of the laser chip 9. The ejected laser chip 9 immediately contacts the conveyor belt 2 and is transported by the conveyor belt 2 to the detection process until the maximum eccentric end of the eccentric wheel 62 is on the right. At this time, the push plate 421 enters the feed slot 411 to the maximum extent.

[0123] S3, Feeding: Conveyor belt 2 transports laser chip 9 to below current detector 3;

[0124] S4. Detection: The current detector 3 drops to detect the laser chip 9;

[0125] S5. Unloading: After the laser chip 9 is inspected, the conveyor belt 2 continues to transport it to the subsequent process and unloads it from the end of the conveyor belt 2.

[0126] Obviously, the embodiments described above are only some embodiments of this application, not all embodiments. The accompanying drawings show preferred embodiments of this application, but do not limit the patent scope of this application. This application can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this application's specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the scope of patent protection of this application.

Claims

1. An automatic testing device for laser chips, comprising a frame, a conveyor belt, and a current detector, wherein the conveyor belt is mounted on the frame, and the current detector is vertically mounted above the conveyor belt and positioned near the conveyor end of the conveyor belt, characterized in that... It also includes a feeding device, which is located at the starting end of the conveyor belt and includes a feeding seat and a pushing assembly; The top surface of the feeding base is provided with a feeding slot for placing laser chips. The feeding slot includes a chip body slot and a chip front end slot that are interconnected. Multiple partitions are arranged at intervals along the length of the feeding slot, and the partitions divide the feeding slot into multiple unit slots. The feeding device also includes a driving mechanism for driving the partitions to slide, and the partitions can slide to completely detach from the feeding slot. The feeding seat has a push-in groove on the side away from the conveyor belt, and an ejection groove is provided on the side of the feeding seat near the conveyor belt, which is opposite to the push-in groove. The starting end of the conveyor belt is connected to the ejection groove, and the bottom walls of the push-in groove and the ejection groove are flush with the bottom wall of the feeding groove. The pushing component is located on the side of the feeding seat away from the conveyor belt and is used to push the laser chip in the feeding groove from the ejection groove onto the conveyor belt. At least two limiting strips are provided on the conveyor belt along the conveying direction of its own surface. Two adjacent limiting strips form a limiting channel. The limiting channel is connected to the ejection groove, and the width of the limiting channel is adapted to the width of the laser chip. The driving mechanism includes a power component, a sliding component, and a reset component. The sliding component is powered by the power component to drive the partition to slide out of the feed trough. The reset component is used to drive the partition to reset back into the feed trough. The sliding assembly includes a drive rod, a drive plate, and a mating wedge. The mating wedge has multiple layers and is arranged corresponding to the partition. Each set of mating wedges includes an active wedge and a driven wedge. The top surface of the active wedge is a rising active wedge surface, and the bottom surface of the driven wedge is a rising driven wedge surface. The maximum end of the active wedge and the minimum end of the driven wedge are positioned facing the feed seat; the maximum end of the active wedge is connected to a corresponding connecting post, and the active wedge is fixed to the drive rod through the corresponding connecting post; the drive rod is located between the mating wedge and the feed seat. A miniature rotary motor is provided on the drive plate, and the shaft of the miniature rotary motor is connected to the end of the drive rod. The power component is used to control the lifting and lowering of the drive plate. The smallest end of the driven wedge is connected to a connecting rod. The distance between the axis of the driving rod and the side wall of the feed seat away from the conveyor belt is L1. The distance between the smallest end of the active wedge and the axis of the driving rod is L2. L1 is greater than L2. The inclination of the wedge surface of the mating wedge gradually increases from bottom to top.

2. The automatic testing equipment for laser chips according to claim 1, characterized in that, The side wall of the feeding seat is provided with multiple sliding grooves opposite the feeding trough, and the partition is slidably connected to the sliding grooves accordingly; The partition comprises a bottom layer, a middle layer, and a top layer of film stacked together. The bottom layer is made of a rigid substrate, the middle layer is made of a cushioning material, and the top layer of film is a smooth, flexible film.

3. The automatic testing equipment for laser chips according to claim 1, characterized in that, Two connecting rods are spaced apart on the same driven wedge block, and the driving rod passes between the two connecting rods. The thickness of the driving wedge block is smaller than the interval between the two connecting rods on the corresponding driven wedge block. The reset assembly is provided in multiple sets and is arranged corresponding to the partition. Each set of the reset assembly includes a reset spring, a guide rod and a reset plate. The reset plate is fixedly connected to the side of two connecting rods that are far apart from each other. The guide rod passes through the reset plate. One end of the guide rod is fixedly connected to the side wall of the feed seat and the other end of the guide rod is fixedly connected to an anti-detachment cap. The reset spring is sleeved on the guide rod. One end of the reset spring abuts against the side wall of the feed seat and the other end abuts against the reset plate. Both the active wedge and the driven wedge are arranged in the shape of an isosceles trapezoid. The bottom surface of the active wedge is a buffer active wedge surface, and the top surface of the driven wedge is a buffer driven wedge surface. The orthographic projection of the reset spring, guide rod, reset plate, and anti-dislodgement cap on the side wall of the connecting rod is located within the height range of the minimum end of the corresponding driven wedge.

4. The automatic testing equipment for laser chips according to claim 1, characterized in that, The drive rod is a round rod, and a limit rod is fixedly connected to the side wall of the feed seat. A guide ring is fixedly connected to the end of the limit rod away from the feed seat, and the guide ring is sleeved on the drive rod.

5. The automatic testing equipment for laser chips according to claim 4, characterized in that, The power assembly includes a drive motor, an eccentric wheel, and a first H-shaped connecting wheel. The output shaft of the drive motor is connected to the eccentric wheel to drive its rotation. The peripheral sidewall of the eccentric wheel abuts against or is adjacent to the bottom surface of the drive plate. A raised annular groove is formed on the peripheral sidewall of the eccentric wheel. A first raised straight groove is formed on the bottom surface of the drive plate. The first H-shaped connecting wheel includes a first fixed post and first rollers rotatably connected to both ends of the fixed post. The first rollers at both ends are slidably connected in the raised annular groove and the first raised straight groove, respectively.

6. The automatic testing equipment for laser chips according to claim 1, characterized in that, Multiple feed troughs are arranged in parallel. The number of limiting channels, current detectors, push-in troughs, push-out troughs, sliding components and reset components are set in accordance with the number of feed troughs. Multiple drive rods are connected to the same drive plate through corresponding micro rotary motors.

7. The automatic testing equipment for laser chips according to claim 5, characterized in that, The pushing component includes a push plate, a synchronization plate, a second I-beam connecting wheel, and a guide frame; The number of push plates corresponds to the number of push slots and is fixedly connected to the side of the synchronization plate. The push plates are slidably connected in the push slots and are adapted to the push slots. The synchronizing plate has a second convex straight groove on the side away from the push plate. The second I-shaped connecting wheel includes a second fixed column and second rollers rotatably connected to both ends of the fixed column. The second rollers at both ends are slidably connected in the convex ring groove and the second convex straight groove, respectively. The peripheral sidewall of the eccentric wheel is also in contact with or adjacent to the synchronizing plate. The guide frame is fixedly connected to the side wall of the feed seat and multiple guide frames are arranged in parallel. The synchronization plate is provided with a guide groove for the guide frame to pass through. A push rod is fixedly connected to the synchronization plate, and a pushing groove is provided on the side wall of the feed seat for the push rod to pass through; the ejection groove includes the main groove and a widening groove located above the main groove, the pushing groove is located inside the widening groove and outside the feed groove; a limit baffle is hinged in the widening groove by a torsion spring, the limit baffle is adapted to the widening groove, and the hinge is located at the top of the widening groove; When the feeding device is in its initial state, the active wedge is located directly below the driven wedge, the rising active wedge surface and the rising driven wedge surface are in complete contact, the minimum eccentric end of the eccentric wheel is in contact with the bottom surface of the drive plate, and there is a gap between the end of the push rod away from the synchronization plate and the limiting baffle.

8. The automatic testing equipment for laser chips according to claim 1, characterized in that, The frame is equipped with clamping components for positioning the laser chip during testing.

9. An automatic testing method for laser chips, characterized in that, The laser chip automatic testing equipment according to any one of claims 1-8 is used for testing, comprising the following steps: S1. Feeding: Place the laser chip into the feeding slot, with the main body of the laser chip located in the chip body slot and the front end of the laser chip located in the chip front end slot. S2, Pushing: The pushing component pushes the laser chip in the feed slot from the ejection slot onto the conveyor belt from the push-in slot; S3, Feeding: The conveyor belt transports the laser chip to the area below the current detector; S4. Detection: The current detector descends to detect the laser chip; S5. Unloading: After the laser chip is inspected, the conveyor belt continues to transport the chip to the next process and unloads it from the end of the conveyor belt.

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