Multi-point temperature detection system and method

Abstract

The invention discloses a multipoint temperature detection system and method. The system comprises an infrared imaging module, a data processing and control module and a digital communication module, the infrared imaging module collects infrared radiation of a target area and generates an infrared image; the data processing and control module receives a temperature measurement point defined by a user on the infrared image, configures a single-point or regional temperature measurement mode for the temperature measurement point, and performs correction and temperature calculation on a pixel signal based on infrared emissivity and transmissivity parameters; the digital communication module outputs the temperature value of each temperature measurement point in a structured data form; interactive temperature measurement point definition is introduced on an infrared image, a single-point or regional temperature measurement mode is configured for different temperature measurement points, correction and temperature calculation are carried out on infrared signals in combination with emissivity and transmissivity calibration parameters, real-time, automatic and structured output of temperature data of multiple temperature measurement points is achieved, temperature measurement flexibility and precision are improved, and the accuracy of temperature measurement is improved. The cost and the manual dependence are reduced, and the practicability and the integration in industrial automation are enhanced.

Description

Technical Field

[0001] This invention relates to temperature detection systems, and more particularly to a multi-point temperature detection system and method. Background Technology

[0002] With the continuous improvement of industrial automation, continuous and real-time temperature monitoring of multiple key locations or areas has become an important means to ensure system safety and stable operation in applications such as power equipment monitoring, industrial manufacturing process control, energy storage system management, and public safety. In existing technologies, multi-point temperature detection typically involves placing multiple contact or non-contact single-point temperature sensors at different locations on the object being measured, or manually reading temperature information from infrared thermal imagers. The former method requires a large number of independent temperature sensors and associated wiring in practical applications, resulting in high hardware and installation / maintenance costs. Furthermore, once the measurement points are fixed, there is a lack of flexibility to adjust them, making it difficult to adapt to changes in the structure of the object being measured or monitoring needs. While the latter method can utilize infrared imaging technology to acquire the overall temperature distribution of the target area at once, it is primarily geared towards manual observation and analysis. It typically relies on manual reading or estimation of temperatures at multiple locations on thermal images, making it difficult to directly output multi-point temperature data usable by automated systems. Additionally, the repeatability and real-time performance of the temperature measurement results are poor. Furthermore, existing infrared temperature measurement solutions, in multi-point temperature measurement applications, often lack precise differentiation between temperature measurement methods at different points. They cannot flexibly choose between precise single-point temperature measurement or area average temperature measurement based on actual needs. Simultaneously, their ability to uniformly calibrate and dynamically correct key parameters such as emissivity and transmittance is insufficient, easily leading to the accumulation of temperature measurement errors. These problems result in limitations in achieving multi-point, high-precision, automated temperature monitoring within specific areas, including complex system integration, insufficient flexibility, and difficulty in direct integration into industrial automation control systems. These limitations restrict the further application of infrared imaging technology in the field of multi-point temperature detection. Summary of the Invention

[0003] Purpose of the invention: The purpose of this invention is to provide a multi-point temperature detection system based on infrared imaging, which supports interactive temperature measurement point configuration, allows independent selection of temperature measurement modes, and enables unified calibration and correction of temperature measurement parameters; on the other hand, it provides a multi-point temperature detection method.

[0004] Technical Solution: The multi-point temperature detection system of the present invention includes an infrared imaging module, a data processing and control module, and a digital communication module. The infrared imaging module is used to collect infrared radiation information of a target area and generate an infrared image containing pixel-level infrared signals. The data processing and control module is electrically connected to the infrared imaging module and includes an interactive temperature measurement point definition unit, a temperature measurement mode configuration unit, and a temperature calculation unit. The interactive temperature measurement point definition unit receives multiple user-defined temperature measurement points on the infrared image and generates corresponding image coordinate information for each temperature measurement point. The temperature measurement mode configuration unit independently configures a temperature measurement mode for each temperature measurement point, and the temperature measurement mode includes at least a single-point temperature measurement mode and a region temperature measurement mode. The temperature calculation unit extracts the infrared signal of the corresponding pixel from the infrared image according to the image coordinates of each temperature measurement point and its corresponding temperature measurement mode, and performs temperature calculation after correcting the infrared signal based on preset infrared emissivity parameters and infrared transmittance parameters to obtain the temperature value corresponding to each temperature measurement point. The digital communication module is electrically connected to the data processing and control module and is used to output the temperature values ​​corresponding to multiple temperature measurement points in structured data form.

[0005] Preferably, the area temperature measurement mode is defined as: a circular area with the image coordinates of the temperature measurement point as the center and a preset number of pixels as the radius; the temperature calculation unit selects the pixels located in the circular area as temperature measurement pixels, extracts the infrared signal corresponding to the temperature measurement pixels, and after removing outliers, averages the temperature values ​​corresponding to the remaining pixels as the final temperature value of the temperature measurement point.

[0006] Preferably, in the area temperature measurement mode, the radius of the circular area is defined by the number of pixels and can be adjusted by software to adapt to different detection distances and target sizes; the number of pixels in the circular area is not less than 3 to reduce the impact of single-pixel noise on the temperature measurement results.

[0007] Preferably, the temperature calculation unit performs abnormal temperature value rejection processing in the area temperature measurement mode. The abnormal temperature value rejection processing includes: calculating a preliminary average temperature based on the temperature values ​​corresponding to all temperature measurement pixels within the circular area; identifying and rejecting any temperature measurement pixel whose absolute value of the deviation between its temperature value and the preliminary average temperature exceeds a preset abnormality judgment threshold; the abnormality judgment threshold is set or adjusted by the user through the software interface.

[0008] Preferably, in the area temperature measurement mode, before averaging the pixels within the area, the temperature calculation unit performs a consistency judgment on the temperature values ​​corresponding to each pixel to eliminate abnormal temperature values ​​caused by reflection, occlusion, or transient noise, thereby improving the stability and reliability of the area temperature measurement results.

[0009] Preferably, the temperature calculation unit performs temperature calculations based on the following conversion formula:

[0010] T = K * (Vout - Voffset) + T0;

[0011] Where T is the calculated temperature value, K is the temperature coefficient obtained based on infrared emissivity and infrared transmittance calibration, Vout is the electrical signal output by the infrared photosensitive chip, Voffset is the reference electrical signal obtained by the system through blackbody calibration at the reference temperature point, and T0 is the reference temperature.

[0012] Preferably, the temperature calculation unit establishes a temperature calculation model based on the correspondence between the output signal of the infrared photosensitive chip and the temperature, and introduces correction coefficients related to infrared emissivity and infrared transmittance into the model to correct the infrared signal under different detection targets and optical conditions.

[0013] Preferably, the data processing and control module further includes a parameter calibration unit; the parameter calibration unit is used to store and manage calibration parameters corresponding to different detection targets or detection environments, and the calibration parameters include at least the infrared emissivity parameters of the target material and the infrared transmittance parameters of the sensor optical system.

[0014] Preferably, the parameter calibration unit has a pre-set material database containing infrared emissivity parameters corresponding to various common materials, and provides a material selection menu through the user interface; the parameter calibration unit also supports users to manually input and store custom infrared emissivity parameters and infrared transmittance parameters.

[0015] Preferably, the parameter calibration unit supports storing corresponding calibration parameters for different detection targets and calling the calibration parameters during the temperature measurement point configuration process, so as to realize that different temperature measurement points use different calibration parameters for temperature calculation.

[0016] Preferably, the digital communication module integrates at least two of the following: an Ethernet interface, an RS-485 serial interface, and a CAN bus interface; the structured data frame includes at least a frame header, a device identifier, the number of temperature measurement points, the identifier information of each temperature measurement point, the corresponding temperature data, and timestamp information.

[0017] Preferably, in the structured data frame, the temperature data of each temperature measuring point corresponds one-to-one with the corresponding temperature measuring point identification information, so that the external system can parse, store or further process the temperature data of multiple temperature measuring points.

[0018] Preferably, the infrared imaging module includes an infrared photosensitive chip, the noise equivalent temperature difference of which is no greater than 50 mK (at 25°C), and its spectral response range covers 8 μm to 14 μm.

[0019] A multi-point temperature detection method includes the following:

[0020] Image acquisition and display: The infrared imaging module acquires infrared radiation information of the target area, generates an infrared image containing pixel-level infrared signals, and displays it.

[0021] Interactive configuration of temperature measurement points: Users can define multiple temperature measurement points on the infrared image, generate corresponding image coordinates, and independently select single-point temperature measurement mode or area temperature measurement mode for each temperature measurement point.

[0022] Temperature calculation and output: Based on the image coordinates and temperature measurement mode of each temperature measurement point, the infrared signal of the corresponding pixel is extracted from the infrared image, and the temperature is calculated by combining the preset infrared emissivity and infrared transmittance calibration parameters. The calculated temperature results are then packaged into a structured data frame for output.

[0023] Preferably, when a temperature measurement point is configured in area temperature measurement mode, the temperature calculation process includes: calculating the initial average temperature based on the temperature values ​​corresponding to the pixels in the area; removing abnormal temperature values ​​in the area according to a preset algorithm; and recalculating the average temperature using the pixel temperature values ​​after removing the abnormal values, which is then used as the final output temperature of the temperature measurement point.

[0024] Preferably, in the multi-point temperature detection method, each step is completed collaboratively by the corresponding functional units in the multi-point temperature detection system to ensure consistency between the system structure and the detection method.

[0025] Beneficial effects: Compared with the prior art, the present invention has the following significant advantages: By introducing an interactive temperature measurement point definition mechanism based on pixel-level infrared images acquired by infrared imaging, and combining single-point temperature measurement mode and area temperature measurement mode independently configured for different temperature measurement points, a flexible temperature measurement framework for multi-point temperature detection is formed. At the same time, with the addition of emissivity and transmittance calibration parameters to uniformly correct the infrared signal and calculate the temperature, real-time, automatic acquisition and structured output of temperature data from multiple temperature measurement points are realized. This not only improves the flexibility and measurement accuracy of multi-point temperature measurement, but also solves the problems of high cost and low automation caused by the reliance on a large number of single-point sensors or manual image reading in the prior art, significantly improving the practicality and integration capability of the infrared temperature measurement system in industrial automation applications. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure of the multi-point temperature detection system of the present invention;

[0027] Figure 2 This is a schematic diagram of the multi-point temperature detection method of the present invention;

[0028] Figure 3This is a schematic diagram of the temperature measurement point configuration based on infrared images according to the present invention;

[0029] Figure 4 This is a schematic diagram showing the connection relationship of the hardware modules of the multi-point temperature detection system of the present invention. Detailed Implementation

[0030] The technical solution of the present invention will be further described below with reference to the accompanying drawings.

[0031] like Figure 1-4 The diagram shown is a schematic representation of the overall structure of a multi-point temperature detection system provided in this embodiment. It illustrates the functional division and connection relationships between the infrared imaging module, data processing and control module, and digital communication module. The module division, device types, interface forms, and parameter configurations shown in the diagram are merely illustrative implementations of this embodiment, intended to facilitate understanding of the technical solution of the present invention, and do not constitute a limitation on the scope of protection of the present invention. The multi-point temperature detection system of this embodiment includes an infrared imaging module, a data processing and control module, and a digital communication module. These modules interact and work collaboratively through electrical connections.

[0032] The infrared imaging module is used for non-contact infrared detection of target areas, acquiring infrared radiation information from the target surface and generating infrared image data containing pixel-level infrared signals. The module includes an infrared photosensitive chip and a supporting optical system. The infrared photosensitive chip has a noise equivalent temperature difference of no more than 50 mK (at 25℃) and a spectral response range covering 8μm to 14μm, thus meeting the requirements for sensitivity and stability to temperature changes in industrial settings. The infrared imaging module can continuously output infrared image data at a preset frame rate for subsequent processing.

[0033] In this embodiment, the infrared imaging module can employ an infrared photosensitive chip with a resolution of no less than 240×240 pixels, such as a microbolometer chip, with a pixel pitch of no more than 20μm and a spectral response range covering the 8μm to 14μm band. Under 25℃ environmental conditions, the noise equivalent temperature difference of the infrared photosensitive chip is no greater than 50mK to meet the detection requirements for minute temperature changes in multi-temperature measurement applications. The output frame rate of the infrared imaging module supports adjustment within the range of 1fps to 60fps, with a typical operating frame rate set to 10fps to achieve a balance between temperature measurement accuracy and system processing load. The infrared imaging module is equipped with an infrared optical component, which can be a fixed-focus infrared lens with a focal length of 20mm to 30mm and a field of view of no less than 10×7.5°. The infrared lens is made of optical materials with an infrared transmittance of no less than 90% in the 8μm to 14μm band, with a minimum imaging distance of no more than 0.5m and a maximum detection distance of no less than 10m. An anti-reflective coating, such as a magnesium fluoride film, with a thickness of 95nm to 105nm, is applied to the front of the infrared lens to further improve infrared transmission efficiency while also providing dust and scratch resistance. Depending on the application scenario, telephoto, zoom, or ultra-short focal length lens components can also be replaced.

[0034] The data processing and control module includes a computation unit and a storage unit. The computation unit can employ an embedded processor supporting single-precision floating-point operations, such as, but not limited to, ARM Cortex-A series processors or FPGAs, with at least one core and a clock speed of at least 500MHz to ensure that the processing time for a single frame of infrared image does not exceed 100ms. The storage unit includes high-speed volatile memory and non-volatile flash memory. The high-speed memory has a capacity of at least 128MB and an operating frequency of at least 1600MHz, used to cache image data and intermediate processing results; the non-volatile flash memory (such as eMMC or NAND Flash) has a capacity of at least 1GB, used to store dedicated software programs, parameter configuration data, and temporary image data. The data processing and control module runs a dedicated software system based on an embedded operating system, such as Linux or RTOS. This software system supports a display interface with a resolution of at least 1024×768 and is compatible with input methods such as touch, mouse, or keyboard. The software interface includes an image display area, a temperature measurement point list area, a parameter configuration area, and a data output area. The image display area is used to display infrared images in real time, the temperature measurement point list area is used to display the temperature value and temperature measurement mode of each temperature measurement point, the parameter configuration area is used to input or adjust calibration parameters, and the data output area is used to configure the communication interface and output mode.

[0035] The data processing and control module is electrically connected to the infrared imaging module and is used for processing, analyzing, and controlling infrared image data. The data processing and control module includes an interactive temperature measurement point definition unit, a temperature measurement mode configuration unit, a temperature calculation unit, and a parameter calibration unit. All functional units are integrated into the same processing platform via software.

[0036] The interactive temperature measurement point definition unit is used to receive user input on the infrared image display interface. Users can select multiple locations of interest as temperature measurement points on the displayed infrared image via touch, mouse, or other interactive methods. The system then generates corresponding image coordinate information for each temperature measurement point based on the user's selection. This method eliminates the dependence on the fixed installation of physical sensors, allowing for flexible adjustment according to actual monitoring needs.

[0037] The interactive temperature measurement point definition unit not only supports the creation of temperature measurement points but also the editing and management of existing points, such as deleting, enabling, or disabling them. Different temperature measurement points can be assigned corresponding identifiers or numbers. Each temperature measurement point's identifier is linked to its image coordinates, temperature measurement mode, and output temperature data, ensuring a one-to-one mapping between temperature measurement points and temperature data during subsequent data output. Through this method, the user's configuration results on the infrared image interface are directly reflected in the system's output data, achieving WYSIWYG consistency between temperature measurement configuration and data output.

[0038] The temperature measurement mode configuration unit is used to configure the temperature measurement method for each temperature measurement point. Each temperature measurement point can independently select a single-point temperature measurement mode or a regional temperature measurement mode, so that different temperature measurement points in the same infrared image can adopt different temperature acquisition strategies to adapt to different target characteristics and temperature measurement accuracy requirements.

[0039] The system supports parallel processing of multiple temperature measurement points within the same infrared image frame. Each temperature measurement point independently performs pixel selection, infrared signal extraction, and temperature calculation based on its own image coordinates and temperature measurement mode, without affecting each other. The system can synchronously refresh the temperature results corresponding to all temperature measurement points when each infrared image frame is updated, or periodically update the temperature data according to a preset refresh cycle to meet application scenarios with different real-time requirements.

[0040] When a temperature measurement point is configured in single-point temperature measurement mode, the temperature calculation unit directly extracts the infrared signal of the corresponding pixel from the infrared image based on the image coordinates corresponding to the temperature measurement point, and performs temperature calculation in combination with calibration parameters.

[0041] When a temperature measurement point is configured in area temperature measurement mode, this area temperature measurement mode is defined as a circular area centered on the image coordinates of the temperature measurement point and with a preset number of pixels as the radius. The radius of the circular area is defined by the number of pixels and can be adjusted through the software interface to adapt to different detection distances and target sizes; the circular area contains no fewer than 3 pixels to reduce the impact of single-pixel noise on the temperature measurement results.

[0042] In the area temperature measurement mode, the temperature calculation unit selects pixels located within a circular area as temperature measurement pixels and extracts the infrared signal corresponding to each pixel. To improve temperature measurement stability, the temperature calculation unit performs outlier removal processing on the temperature values ​​corresponding to pixels within the area before performing averaging calculations. First, a preliminary average temperature is calculated based on the temperature values ​​corresponding to all temperature measurement pixels within the area. Then, the absolute value of the deviation between the temperature value of any temperature measurement pixel and this preliminary average temperature is compared. When the deviation exceeds a preset anomaly judgment threshold, the corresponding temperature measurement pixel is judged as an anomaly pixel and excluded. The anomaly judgment threshold can be set or adjusted by the user through the software interface to adapt to different application scenarios. After completing the outlier removal, the system averages the temperature values ​​of the remaining temperature measurement pixels to obtain the final output temperature for that measurement point.

[0043] Abnormal temperature values ​​within a region may be caused by factors such as local reflections from the target surface, occlusion, background interference, or infrared imaging noise. By introducing the above-mentioned outlier removal process in the regional temperature measurement mode, the impact of local abnormal pixels on the overall temperature measurement results can be effectively reduced, thereby improving the stability and reliability of regional temperature measurement results during continuous acquisition.

[0044] In single-point temperature measurement mode, the temperature measurement point corresponds to a single pixel in the infrared image. Its coverage size in actual space is determined by the detection distance and the lens field of view. For example, under a detection distance of 3m, the actual area size corresponding to a single pixel is no greater than 1.5mm × 1.5mm. In area temperature measurement mode, the radius of the circular area can be adjusted within the range of 1 to 20 pixels, with a step size of 1 pixel. The system has a built-in conversion relationship between pixel size and actual space size, and displays the actual size corresponding to the current area in real time in the user interface.

[0045] The temperature calculation unit establishes a temperature calculation model based on the correspondence between the output signal of the infrared photosensitive chip and temperature, and introduces correction parameters related to infrared emissivity and infrared transmittance into this model. In this embodiment, the temperature calculation can be performed based on the following conversion formula:

[0046] T = K * (Vout - Voffset) + T0;

[0047] Where T is the calculated temperature value, K is the temperature coefficient obtained based on infrared emissivity and infrared transmittance calibration, Vout is the electrical signal output by the infrared photosensitive chip, Voffset is the reference electrical signal obtained by the system through blackbody calibration at the reference temperature point, and T0 is the reference temperature. This method can correct infrared signals for different target materials and under different optical conditions, improving temperature measurement accuracy.

[0048] The parameter calibration unit is used to store and manage calibration parameters. It contains a pre-built material database with infrared emissivity parameters for various common materials and provides a material selection menu through a user interface, allowing users to select the appropriate parameter based on the actual material of the target being measured. Furthermore, the unit also supports user-inputted and stored custom infrared emissivity and transmittance parameters. The unit can store corresponding calibration parameters for different detection targets and recall these parameters during temperature measurement point configuration, enabling the use of different calibration parameters for temperature calculation at different measurement points.

[0049] The infrared emissivity parameter supports continuous adjustment within the range of 0.1 to 1.0, with an adjustment step of 0.01, and preset emissivity reference values ​​for various common materials are available. The infrared transmittance parameter supports adjustment within the range of 0.8 to 1.0, used to correct for infrared attenuation introduced by optical components such as lenses and protective windows. The system also supports configuring the temperature measurement range, such as −40℃ to 100℃, 0℃ to 300℃, or −20℃ to 500℃, and calls the corresponding temperature conversion coefficient according to different ranges. It also supports setting the temperature sampling frequency to 1Hz to 50Hz to adapt to different real-time monitoring requirements.

[0050] The digital communication module is electrically connected to the data processing and control module, used to output temperature data corresponding to multiple temperature measurement points to an external system. It can integrate at least two of the following interfaces: Ethernet, RS-485 serial, and CAN bus, to adapt to the communication needs of different industrial sites. The system outputs temperature data in the form of structured data frames. Each structured data frame includes at least a frame header, device identifier, number of temperature measurement points, identification information for each temperature measurement point, corresponding temperature data, and timestamp information. The temperature data for each temperature measurement point corresponds one-to-one with its identification information, facilitating parsing, storage, and further processing by the external system. Structured data frames can be sent to the external system in real-time or on a timed basis, with the specific upload strategy configurable via software parameters. When a temperature measurement point is disabled or the corresponding pixel area cannot temporarily acquire a valid infrared signal, the system can indicate the status information of that temperature measurement point in the output data for external system identification and processing, thereby improving the reliability and maintainability of the system during industrial operation.

[0051] The digital communication module integrates Ethernet, serial, and CAN bus interfaces. The Ethernet interface supports 10 / 100Mbps adaptive speed and is compatible with TCP / IP and UDP protocols. The serial interface supports RS485 or RS232 communication standards, and the CAN bus interface supports CAN2.0B and CAN-FD protocols. Temperature data is output using a standardized data frame structure. Each data frame includes a frame header, device address, data length, number of temperature measurement points, timestamp for each measurement point, temperature value, temperature measurement mode identifier, and a checksum field. It also supports programmable custom data formats based on external system requirements.

[0052] Based on the above-mentioned multi-point temperature detection system, this embodiment also provides a multi-point temperature detection method. This method is executed collaboratively by an infrared imaging module, a data processing and control module, and a digital communication module. The specific process includes the following steps:

[0053] 1. Image acquisition and display.

[0054] The infrared imaging module performs non-contact infrared detection on the target area, collects infrared radiation information of the target area, and generates infrared image data containing pixel-level infrared signals. The infrared image data is transmitted to the data processing and control module and displayed in real time through the display interface for users to perform subsequent temperature measurement point configuration operations.

[0055] 2. Interactive configuration of temperature measurement points.

[0056] Based on the displayed infrared image, the user defines multiple temperature measurement points on the image through interactive operation. The system generates corresponding image coordinate information for each temperature measurement point. For each temperature measurement point, the user selects a temperature measurement mode, which includes at least a single-point temperature measurement mode and a region temperature measurement mode, thus enabling different temperature measurement points to use different temperature acquisition methods.

[0057] 3. Temperature calculation and output.

[0058] The data processing and control module extracts the infrared signals of corresponding pixels from the infrared image based on the image coordinates of each temperature measurement point and its corresponding temperature measurement mode. After correcting the infrared signals using preset infrared emissivity and transmittance parameters, it performs temperature calculation to obtain the temperature value corresponding to each temperature measurement point. The temperature calculation process is consistent with the operation of the temperature calculation unit in the aforementioned system embodiment. The temperature values ​​are packaged into structured data frames containing temperature measurement point identification information and output to an external system via the digital communication module.

[0059] When a temperature measurement point is set to area temperature measurement mode, the temperature calculation process further includes the following steps: First, calculate the initial average temperature based on the temperature value corresponding to the pixel in the area; then, remove the temperature outliers in the area according to the preset algorithm; finally, recalculate the average temperature using the pixel temperature values ​​after removing the outliers, and use the average temperature as the final output temperature of the temperature measurement point.

[0060] Through the above embodiments, the present invention can achieve flexible configuration, accurate measurement and automated data output of multiple temperature measurement points in the target area without adding additional physical sensors, and is applicable to various application scenarios such as power equipment monitoring, industrial manufacturing process control and energy storage system management.

Claims

1. A multi-point temperature detection system, characterized in that, It includes an infrared imaging module, a data processing and control module, and a digital communication module; the infrared imaging module is used to collect infrared radiation information of the target area and generate an infrared image containing pixel-level infrared signals; the data processing and control module is electrically connected to the infrared imaging module and includes an interactive temperature measurement point definition unit, a temperature measurement mode configuration unit, and a temperature calculation unit. The interactive temperature measurement point definition unit receives multiple user-defined temperature measurement points on the infrared image and generates corresponding image coordinate information for each temperature measurement point; the temperature measurement mode configuration unit independently configures a temperature measurement mode for each temperature measurement point, and the temperature measurement mode includes at least a single-point temperature measurement mode and a region temperature measurement mode; the temperature calculation unit extracts the infrared signal of the corresponding pixel from the infrared image according to the image coordinates of each temperature measurement point and its corresponding temperature measurement mode, and performs temperature calculation after correcting the infrared signal based on preset infrared emissivity parameters and infrared transmittance parameters to obtain the temperature value corresponding to each temperature measurement point. The digital communication module is electrically connected to the data processing and control module and is used to output the temperature values ​​corresponding to multiple temperature measurement points in the form of structured data.

2. The multi-point temperature detection system according to claim 1, characterized in that, The area temperature measurement mode is defined as: a circular area with the image coordinates of the temperature measurement point as the center and a preset number of pixels as the radius; the temperature calculation unit selects the pixels located in the circular area as temperature measurement pixels, extracts the infrared signal corresponding to the temperature measurement pixels, and after removing outliers, averages the temperature values ​​corresponding to the remaining pixels as the final temperature value of the temperature measurement point.

3. The multi-point temperature detection system according to claim 2, characterized in that, The temperature calculation unit performs abnormal temperature value rejection processing in the area temperature measurement mode. The abnormal temperature value rejection processing includes: calculating a preliminary average temperature based on the temperature values ​​corresponding to all temperature measurement pixels within the circular area; identifying and rejecting any temperature measurement pixel whose absolute value of the temperature value of any temperature measurement pixel deviates from the preliminary average temperature by more than a preset abnormality judgment threshold; the abnormality judgment threshold is set or adjusted by the user through the software interface.

4. The multi-point temperature detection system according to claim 2, characterized in that, The temperature calculation unit performs temperature calculations based on the following conversion formula: T = K * (Vout - Voffset) + T0; Where T is the calculated temperature value, K is the temperature coefficient obtained based on infrared emissivity and infrared transmittance calibration, Vout is the electrical signal output by the infrared photosensitive chip, Voffset is the reference electrical signal obtained by the system through blackbody calibration at the reference temperature point, and T0 is the reference temperature.

5. The multi-point temperature detection system according to claim 1, characterized in that, The data processing and control module further includes a parameter calibration unit; the parameter calibration unit is used to store and manage calibration parameters corresponding to different detection targets or detection environments, and the calibration parameters include at least the infrared emissivity parameters of the target material and the infrared transmittance parameters of the sensor optical system.

6. The multi-point temperature detection system according to claim 5, characterized in that, The parameter calibration unit is pre-loaded with a material database containing infrared emissivity parameters for various common materials, and provides a material selection menu through a user interface; the parameter calibration unit also supports users to manually input and store custom infrared emissivity and infrared transmittance parameters.

7. The multi-point temperature detection system according to claim 1, characterized in that, The digital communication module integrates at least two of the following: Ethernet interface, RS-485 serial interface, and CAN bus interface; the structured data frame includes at least a frame header, device identifier, number of temperature measurement points, identification information of each temperature measurement point, corresponding temperature data, and timestamp information.

8. The multi-point temperature detection system according to claim 1, characterized in that, The infrared imaging module includes an infrared photosensitive chip, the noise equivalent temperature difference of which is no greater than 50 mK (at 25°C), and its spectral response range covers 8 μm to 14 μm.

9. A multi-point temperature detection method, characterized in that, Includes the following: Image acquisition and display: The infrared imaging module acquires infrared radiation information of the target area, generates an infrared image containing pixel-level infrared signals, and displays it. Interactive configuration of temperature measurement points: Users can define multiple temperature measurement points on the infrared image, generate corresponding image coordinates, and independently select single-point temperature measurement mode or area temperature measurement mode for each temperature measurement point. Temperature calculation and output: Based on the image coordinates and temperature measurement mode of each temperature measurement point, the infrared signal of the corresponding pixel is extracted from the infrared image, and the temperature is calculated by combining the preset infrared emissivity and infrared transmittance calibration parameters. The calculated temperature results are then packaged into a structured data frame for output.

10. The multi-point temperature detection method according to claim 9, characterized in that, When a temperature measurement point is set to area temperature measurement mode, the temperature calculation process includes: calculating the initial average temperature based on the temperature values ​​corresponding to the pixels in the area; removing temperature outliers in the area according to a preset algorithm; and recalculating the average temperature using the pixel temperature values ​​after removing outliers, which is then used as the final output temperature of the temperature measurement point.

Images