Radio frequency switch chip, radio frequency front-end module and electronic equipment

Abstract

The invention relates to the technical field of radio frequency devices, and discloses a radio frequency switch chip, a radio frequency front-end module and electronic equipment, and the radio frequency switch chip comprises a substrate which is provided with a grounding point and a grounding wire connected with the grounding point; a first switch circuit module and a second switch circuit module; the control circuit module is arranged on the substrate and close to the first side edge opposite to the second side edge, and the control circuit module, the first switching circuit module and the second switching circuit module are arranged at intervals and electrically connected; the first switch circuit module and the second switch circuit module are arranged at intervals along the extension direction of the second side edge, and the first switch module, the second switch module and the first side edge surround to form a target area to accommodate at least part of the control circuit module; at least part of the grounding wire is located between the first switch circuit module and the second switch circuit module. At least part of the grounding wires are arranged between the first switch circuit module and the second switch circuit module to form grounding isolation, crosstalk between radio frequency signals transmitted by the switch circuits on the two sides is reduced, and the signal transmission quality is improved while the radio frequency switch chip area is controlled.

Description

Technical Field

[0001] This application relates to the field of radio frequency technology, and in particular to a radio frequency switch chip, a radio frequency front-end module, and an electronic device. Background Technology

[0002] The radio frequency (RF) front-end module is an important component of a wireless transceiver system. With the development of technology, the RF front-end module needs to support more and more frequency bands, which means that the number of switching units that need to be set in the RF switch chip is also increasing. Due to the high integration of the RF switch chip, crosstalk can easily occur between different signals inside the RF switch chip, affecting the quality of RF signal transmission.

[0003] Therefore, how to control the area of ​​RF switch chips and ensure their performance while supporting more frequency bands has been a problem that those skilled in the art have been eager to solve. Summary of the Invention

[0004] This application provides an RF switch chip, an RF front-end module, and an electronic device, aiming to control the area of ​​the RF switch chip and ensure its performance.

[0005] In a first aspect, embodiments of this application provide a radio frequency switch chip, including: A substrate having opposing first and second sides, and at least one ground point is provided on the substrate; The first switching circuit module includes at least two first switching circuits; The second switching circuit module includes at least two second switching circuits. The control circuit module is disposed on the substrate and close to the first side. The control circuit module, the first switch circuit module, and the second switch circuit module are all disposed at intervals and electrically connected to each other. The first switch circuit module and the second switch circuit module are arranged at intervals along the extension direction of the second side. The first switch module, the second switch module, and the first side surround to form the target area. At least part of the control circuit module is located in the target area. Furthermore, the substrate is provided with grounding traces connected to the grounding point, and at least part of the grounding traces are located between the first switching circuit module and the second switching circuit module.

[0006] Secondly, embodiments of this application also provide another radio frequency switch chip, the radio frequency switch chip comprising: The substrate has a first side and a second side opposite to each other, and a plurality of grounding points are provided on the substrate; The first switching circuit module includes at least two first switching circuits; The second switching circuit module includes at least two second switching circuits. The control circuit module is disposed on the substrate and close to the first side. The control circuit module, the first switch circuit module, and the second switch circuit module are all disposed at intervals and electrically connected to each other. The first switch circuit module and the second switch circuit module are arranged at intervals along the extension direction of the second side. Multiple grounding points include a first grounding point located between the first switch circuit module and the second switch circuit module. Grounding traces are also provided on the substrate. At least some of the grounding traces are located between the first switch circuit module and the second switch circuit module and are connected to the first grounding point. The number of grounding points closer to the second switch circuit module is greater than the number of grounding points closer to the first switch circuit module.

[0007] Thirdly, embodiments of this application also provide a radio frequency front-end module, characterized in that it includes a radio frequency switch chip as provided in any embodiment of this application.

[0008] Fourthly, embodiments of this application also provide an electronic device, including a radio frequency switch chip as provided in any embodiment of this application or a radio frequency front-end module as provided in any embodiment of this application.

[0009] In summary, this application provides an RF switch chip, an RF front-end module, and an electronic device. The RF switch chip includes: a substrate having opposing first and second sides, and at least one ground point disposed on the substrate; a first switch circuit module including at least two first switch circuits; a second switch circuit module including at least two second switch circuits; and a control circuit module disposed on the substrate and close to the first side, wherein the control circuit module is spaced apart from the first and second switch circuit modules and electrically connected to them respectively; wherein the first and second switch circuit modules are arranged spaced apart along the extension direction of the second side, and the first and second switch modules and the first side surround to form a target area, and at least a portion of the control circuit module is located within the target area; furthermore, a ground trace connected to the ground point is disposed on the substrate, and at least a portion of the ground trace is located between the first and second switch circuit modules. By providing grounding traces connected to ground points on the substrate, and placing at least a portion of these grounding traces between the first and second switch circuit modules, ground isolation is formed between the first switch circuit of the first switch circuit module and the second switch circuit of the second switch circuit module. This reduces crosstalk between the radio frequency (RF) signals transmitted on both switch circuits, improving RF signal transmission quality while maintaining the integration density and controlling the RF switch chip area. As one embodiment, if the first switch circuit on the first switch circuit module and the first switch circuit on the second switch circuit module operate in different frequency bands (e.g., the first switch circuit operates in the mid-to-high frequency band, and the second switch circuit operates in the low frequency band), the grounding traces can reduce crosstalk between RF signals of different frequency bands, thus improving RF signal transmission quality. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic diagram of the layout of a radio frequency switch chip provided in an embodiment of this application; Figure 2 This is a schematic diagram of another layout of a radio frequency switch chip provided in an embodiment of this application; Figure 3 A schematic diagram of the layout of a radio frequency front-end module provided in an embodiment of this application; Figure 4 This is a schematic diagram of another layout of a radio frequency switch chip provided in an embodiment of this application; Figure 5 This is a schematic diagram of another layout of a radio frequency switch chip provided in an embodiment of this application; Figure 6 This is a schematic diagram of another layout of a radio frequency switch chip provided in an embodiment of this application; Figure 7 This is a schematic diagram of another layout of a radio frequency switch chip provided in an embodiment of this application; Figure 8 This is a schematic diagram of another layout of a radio frequency switch chip provided in an embodiment of this application; Figure 9 This is a schematic diagram of another layout of a radio frequency switch chip provided in an embodiment of this application; Figure 10 A schematic diagram of a module structure of a radio frequency front-end module provided in an embodiment of this application; Figure 11 This is a schematic diagram of a module structure of an electronic device provided in an embodiment of this application.

[0012] Figure label: 100. RF switch chip; 10. Substrate; 11. First side; 12. Second side; 13. Third side; 14. Fourth side; 20. Control circuit module; 21. Main body; 22. Stepped section; 23. Clearance space; 30. First switch circuit module; 31. First switch setting section; 32. Second switch setting section; 33. First switch circuit; 40. Second switch circuit module; 41. Third switch setting section; 42. Fourth switch setting section; 43. Second switch circuit; 50. Target area; 60. Grounding trace; 61. First line segment; 62. Second line segment; 621. First sub-line segment; 622. Second sub-line segment; 63. Third line segment 631. Third sub-segment; 632. Fourth sub-segment; 633. Fifth sub-segment; 634. Sixth sub-segment; 635. Seventh sub-segment; 64. First grounding trace; 65. Second grounding trace; 66. Outer ring grounding trace; 70. Grounding point; 71. First grounding point; 72. Second grounding point; 73. Third grounding point; 74. Fourth grounding point; 75. Fifth grounding point; 76. Sixth grounding point; 77. Seventh grounding point; 81. First RF input terminal; 82. Second RF input terminal; 91. First RF transmission line; 911. First sub-transmission line; 912. Second sub-transmission line; 913. Third sub-transmission line; 92. Second RF transmission line; 200. RF front-end module; 210. Substrate; 220. Filter; 300. Electronic devices. Detailed Implementation

[0013] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application. The flowcharts shown in the accompanying drawings are merely illustrative and do not necessarily include all content and operations / steps, nor do they necessarily have to be performed in the described order. For example, some operations / steps can be decomposed, combined, or partially merged; therefore, the actual execution order may change according to the actual situation.

[0014] The radio frequency (RF) front-end module is a crucial component of a wireless transceiver system. With technological advancements, RF front-end modules need to support an increasing number of frequency bands, leading to a greater number of switching units required in the RF switch chip. Due to the high integration of RF switch chips, crosstalk can easily occur between different signals within the chip, affecting the quality of RF signal transmission. Therefore, controlling the RF switch chip area and ensuring the performance of the RF front-end module while supporting more frequency bands has been a persistent problem for those skilled in the art.

[0015] To address the aforementioned problems, this application provides an RF switch chip 100, an RF front-end module 200, and an electronic device 300. The technical solution of this application will be described below with reference to the accompanying drawings.

[0016] like Figures 1 to 2 As shown, this application provides an embodiment of a radio frequency switch chip 100, which has multiple switching circuits (including those hereinafter referred to as...) Figure 4 The circuit includes at least two first switching circuits 33 and at least two second switching circuits 43, each with a corresponding operating frequency band. Radio frequency signals corresponding to the operating frequency band can be transmitted through the switching circuit. In some embodiments, the two different switching circuits operate at different frequency bands.

[0017] like Figure 3 As shown, the RF switch chip 100 can be disposed in the RF front-end module 200. For example, the RF front-end module 200 includes a substrate 210, and the RF switch chip 100 can be disposed on the substrate 210 of the RF front-end module 200.

[0018] The radio frequency switch chip 100 includes at least a substrate 10, a first switch circuit module 30, a second switch circuit module 40, and a control circuit module 20. The following is a detailed description of each circuit component in the radio frequency switch chip 100.

[0019] Specifically, the substrate 10 has opposing first sides 11 and second sides 12, and at least one ground point 70 is provided on the substrate 10. As one embodiment, the substrate 10 also has opposing third sides 13 and fourth sides 14, with the third side 13 connected to the first side 11 and second side 12, and the fourth side 14 also connected to the first side 11 and second side 12. By way of example and not limitation, the substrate 10 is quadrilateral; for example, the substrate 10 can be rectangular, trapezoidal, or parallelogram-shaped. In this case, the first side 11, second side 12, third side 13, and fourth side 14 correspond to the outer contours of the four sides of the substrate 10. In the embodiments of this application, the outer contours of the substrate 10 can also be set to other polygonal shapes. The aforementioned outer contours are merely the boundaries of the substrate 10, and the shape of the boundaries can be adjusted according to different products, all within the scope of protection of this application. The following embodiments use a quadrilateral outer contour of the substrate as an example for illustration.

[0020] like Figure 4 As shown, specifically, both the first switch circuit module 30 and the second switch circuit module 40 are disposed on the substrate 10. The RF switch chip 100 also has multiple switch circuits, wherein the first switch circuit module 30 includes at least two first switch circuits 33, and the second switch circuit module 40 includes at least two second switch circuits 43. As an example and not a limitation, each switch circuit has a corresponding operating frequency band, and the RF of the corresponding operating frequency band can be controlled by the switch circuit.

[0021] Specifically, the first switching circuit 33 and the second switching circuit 43 operate at different frequencies. For example, the first switching circuit 33 operates in the mid-to-high frequency range, while the second switching circuit 43 operates in the low frequency range. For instance, the first switching circuit 33 operates at a frequency greater than or equal to 2GHz, while the second switching circuit 43 operates at a frequency less than 2GHz. The two different first switching circuits 33 can operate in the same or different frequency ranges, and similarly, the two different second switching circuits 43 can operate in the same or different frequency ranges.

[0022] In some implementations, the operating frequency bands of at least two first switching circuits 33 are all within a first frequency band set, and the operating frequency bands of at least two second switching circuits 43 are all within a second frequency band set, and the center frequency of the operating frequency of any frequency band in the first frequency band set is greater than the center frequency of the operating frequency of any frequency band in the second frequency band set.

[0023] Specifically, the control circuit module 20 is disposed on the substrate 10 and close to the first side 11. The control circuit module 20 is disposed at intervals with the first switch circuit module 30 and the second switch circuit module 40, and is electrically connected to each other.

[0024] It should be noted that the control circuit module 20 is electrically connected to each switching circuit and is used to control the conduction and shutdown of each switching circuit. When a switching circuit is on, it can transmit radio frequency signals; when a switching circuit is off, it does not transmit radio frequency signals. In some embodiments, the control circuit module 20 is provided with a control signal port. The control circuit module 20 is used to receive control signals through the control signal port and control the conduction and shutdown of each switching circuit according to the control signals. Specifically, the control signal port is also called a MIPI port (Mobile Industry Processor Interface), which receives control signals based on the MIPIRFFE (MIPI RF Front-end) interface standard.

[0025] In one embodiment, the control signal port on the control circuit module 20 is located close to the first side 11, and the distance from the control circuit module 20 to the first side 11 is less than the distance to the second side 12. This arrangement facilitates the connection between the control signal port on the control circuit module 20 and the corresponding port on the substrate 210 to receive control signals.

[0026] like Figure 2 and Figure 4 As shown, the first switch circuit module 30 and the second switch circuit module 40 are arranged at intervals along the extension direction of the second side 12. The first switch circuit module 30, the second switch circuit module 40, and the first side 11 surround to form a target area 50, and at least a portion of the control circuit module 20 is located within the target area 50. As an example, one of the first switch circuit module 30 and the second switch circuit module 40 is arranged in an L-shape, and the first switch circuit module 30, the second switch circuit module 40, and the first side 11 surround to form a quadrilateral or near-quadrilateral target area 50, so that at least a portion of the control circuit module 20 is housed within the target area 50. It should be noted that when arranged in an L-shape, a portion of the first switch circuit 33 within the first switch circuit module 30 is arranged along one side of the target area 50, and another portion of the first switch circuit 33 is arranged along the other side of the target area 50. The aforementioned two sides are two adjacent sides. The second switch circuit module 40 and the second switch circuit 34 are also mentioned.

[0027] It should also be noted that, for example, in Figure 1 In the middle, the target area 50 is formed by the line connecting the outer edge of the first switch circuit module 30, the outer edge of the second switch circuit module 40, and the first side 11.

[0028] It should be noted that the first switch circuit module 30 and the second switch circuit module 40 are arranged at intervals along the extension direction of the second side 12, and the first switch module, the second switch module, and the first side 11 surround to form the target area 50 to accommodate at least part of the control circuit module 20. This arrangement ensures that the control circuit module 20, the first switch circuit module 30, and the second switch circuit module 40 are spaced apart to reduce crosstalk, while also effectively utilizing the area on the substrate 10, reducing the overall area layout, and allowing each switch circuit on the first switch circuit module 30 and the second switch circuit module 40 to be electrically connected to the control circuit module 20. This facilitates the electrical connection between the control circuit module 20 and each switch circuit, further reducing the size and achieving device miniaturization. In some embodiments, the control circuit module 20 is entirely located within the target area 50 to further improve the integration of the RF switch chip 100 and control the area of ​​the RF switch chip 100.

[0029] Furthermore, a grounding trace 60 connected to the grounding point 70 is also provided on the substrate 10, and at least a portion of the grounding trace 60 is located between the first switch circuit module 30 and the second switch circuit module 40. In this embodiment, the first switch circuit module 30 and the second switch circuit module 40 are spaced apart in the extension direction of the first side. It should be noted that the grounding point 70 is used for grounding. For example, when the RF switch chip 100 is disposed on the substrate 210 of the RF front-end module 200, the grounding point 70 is connected to the grounding port on the substrate 210 so that the grounding trace 60 is grounded through the grounding point 70 and the grounding port. It should also be noted that the grounding point 70 can be set to one, two or more. The setting position of the grounding point 70 can be adjusted according to the actual layout of the RF switch chip 100. For example, some grounding points 70 can be set between the first switch circuit module 30 and the second switch circuit module 40, so that the grounding trace 60 between the first switch circuit module 30 and the second switch circuit module 40 can be connected to the grounding point 70. Other grounding points 70 can be set along the side of the substrate 10, so that they can be connected to the grounding port on the substrate 210, and also facilitate the routing of the grounding trace 60.

[0030] By providing a grounding trace 60 connected to a grounding point 70 on the substrate 10, and placing at least a portion of the grounding trace 60 between the first switch circuit module 30 and the second switch circuit module 40, grounding isolation is formed between the first switch circuit 33 of the first switch circuit module 30 and the second switch circuit 43 of the second switch circuit module 40. This grounding point 70 enhances the grounding isolation effect and effectively reduces crosstalk between the radio frequency signals transmitted on both switch circuits. This improves the quality of radio frequency signal transmission while ensuring the integration level of the radio frequency switch chip 100 and controlling the area of ​​the radio frequency switch chip 100.

[0031] As one embodiment, the first switch circuit 33 on the first switch circuit module 30 and the first switch circuit 33 on the second switch circuit module 40 have different operating frequency bands. In some embodiments, the operating frequency band of the first switch circuit 33 is in the mid-to-high frequency band, and the operating frequency band of the second switch circuit 43 is in the low frequency band. For example, the operating frequency band of the first switch circuit 33 is greater than or equal to 2GHz, and the operating frequency band of the second switch circuit 43 is less than 2GHz. Therefore, the grounding trace 60 can reduce crosstalk between different frequency bands of radio frequency signal transmission, improving the quality of radio frequency signal transmission.

[0032] As one embodiment, the grounding trace 60, besides forming ground isolation between the first switch circuit module 30 and the second switch circuit module 40, can also be used to connect to various switch circuits. For example, the first switch circuit 33 in the first switch circuit module 30 is connected to the grounding trace 60 through a corresponding grounding switch transistor, and the second switch circuit 43 in the second switch circuit module 40 is connected to the grounding trace 60 through a corresponding grounding switch transistor. Each switch circuit can have its input terminal connected to the grounding trace 60 through a corresponding grounding switch transistor, or its output terminal connected to the grounding trace 60 through a corresponding grounding switch transistor. When the control circuit module 20 controls any switch circuit to turn off, it also controls the corresponding grounding switch transistor of that switch circuit to turn on, ensuring that the corresponding switch circuit is turned off and no radio frequency signals are transmitted.

[0033] In some embodiments, the grounding trace 60 includes at least a first segment 61 connected to the grounding point 70, and the first segment 61 is continuously disposed within the gap area between the first switch circuit module 30 and the second switch circuit module 40. In some embodiments, when the first segment 60 is disposed within the gap between the first switch circuit module 30 and the second switch circuit module 40, the first segment 60 may be disposed perpendicular to the first side 11 to reduce the space occupied by the first segment 60 in the extension direction of the first side 11, thereby facilitating a reduction in the gap between the first switch circuit module 30 and the second switch circuit module 40.

[0034] Specifically, the first segment 61 can be directly connected to the grounding point 70, or it can be connected to the grounding point 70 through other segments in the grounding line 60 (such as the second segment 62 and / or the third segment 63 described below).

[0035] like Figure 1As shown, as an example, grounding point 70 includes at least a first grounding point 71, which is located between the first switching circuit module 30 and the second switching circuit module 40. The first line segment 61 is electrically connected to the first grounding point 71. It should be understood that the grounding point 70 is provided between the first switching circuit module 30 and the second switching circuit module 40 to facilitate the grounding of the first line segment 61. Moreover, the first grounding point 71 itself can also form grounding isolation between the first switching circuit module 30 and the second switching circuit module 40, reducing crosstalk in the radio frequency signal transmission on the first switching circuit 33 and the second switching circuit 43, thereby forming a multiple isolation effect and improving the quality of radio frequency signal transmission.

[0036] As an example, some grounding points 70 can also be provided along the side of the substrate 10. The first line segment 61 can be connected to the grounding point 70 of that part through other line segments or can extend directly to the corresponding side to connect to the grounding point 70 of that part. It should be understood that providing multiple grounding points 70 on the substrate 10, and providing different grounding points 70 between the first switching circuit module 30 and the second switching circuit module 40 and on the side, can enhance the isolation effect and further reduce crosstalk in the radio frequency signal transmission on the first switching circuit 33 and the second switching circuit 43.

[0037] like Figures 4 to 7 As shown, in some embodiments, the grounding trace 60 further includes a second trace 62 connected to the first trace 61, at least a portion of the second trace 62 being located on the side of the first switch circuit module 30 away from the control circuit module 20, and the second trace 62 being disposed around at least a portion of the outer edge of the first switch circuit module 30.

[0038] Specifically, when the RF switch chip 100 is disposed in the RF front-end module 200, the second line segment 62 can be used to form ground isolation between at least a portion of the first switch circuit module 30 and the filter 220 on the RF front-end module 200, thereby preventing signal crosstalk between the filter 220 and at least a portion of the first switch circuit 33. The filter 220 is, for example, disposed in a filter 220 chip located on the substrate 210. As one embodiment, each first switch circuit 33 is electrically connected to the second line segment 62 through a corresponding grounding switch transistor, so that each first switch circuit 33 is grounded when turned off. The configuration and function of the grounding switch transistor have been described above and will not be repeated here.

[0039] like Figures 4 to 6In some embodiments, the first switch circuit module 30 includes a first switch setting part 31 and a second switch setting part 32. The first switch setting part 31 is disposed along the second side 12, and the second switch setting part 32 is disposed along the third side 13. The first switch setting part 31 and the second switch setting part 32 are adjacent to each other. The third side 13 is a side on the substrate 10 that is connected to the first side 11 and the second side 12 and is close to the first switch setting part 31.

[0040] It should be noted that the first switch setting part 31 and the second switch setting part 32 are adjacent to each other, meaning that the first switch setting part 31 and the second switch setting part 32 abut against each other, and one side of the first switch setting part 31 is connected to one side of the second switch setting part 32. Other descriptions of adjacent parts in the following text can also refer to this definition.

[0041] Specifically, the first switch circuit module 30 is L-shaped, and both the first switch setting part 31 and the second switch setting part 32 are respectively provided with first switch circuits 33. The first switch setting part 31 is positioned along the second side 12, and the second switch setting part 32 is positioned along the third side 13. This facilitates full utilization of the area on the substrate 10 for the placement of the first switch circuits 33, and also facilitates the electrical connection between the control circuit module 20 and each of the first switch circuits 33. While meeting performance requirements, this further reduces the area and achieves high integration. Simultaneously, combined with... Figure 3 In the layout structure, multiple filter chips, such as a first filter chip, a second filter chip, and a third filter chip, are arranged at corresponding positions on the left and upper sides of the first switch circuit module 30. In this embodiment, the first switch circuit module 30 is configured as an L-shape. This shortens the distance between the L-shaped first switch circuit module 30 and the filter chips on the side closer to the second and third filter chips, thus facilitating electrical connection between them. Correspondingly, the distance between the first switch circuit module 30 and each filter 220 on the side closer to the filter 220 is also shorter, facilitating electrical connection and allowing the first switch circuit module 30 to better cooperate with different filter chips.

[0042] The second line segment 62 includes a first sub-line segment 621 connected to the first line segment 61 and a second sub-line segment 622 connected to the first sub-line segment 621. The first sub-line segment 621 is located between the first switch setting part 31 and the first side 11, and the second sub-line segment 622 is located between the second switch setting part 32 and the third side 13 (e.g., Figure 4 and Figure 5 (as shown) or located between the second switch setting unit 32 and the control circuit module 20 (e.g. Figure 6 (As shown).

[0043] In some embodiments, the width of the second switch mounting portion 32 is greater than the width of the control circuit module 20 along the extending direction of the third side 13. It should be understood that the width of the second switch mounting portion 32 is greater than the width of the control circuit module 20, so that the second switch mounting portion 32 covers the control circuit module 20 in the opposite direction of the first side 11 and the second side 12, which facilitates the first switch module, the second switch module, and the first side 11 to surround the control circuit module 20.

[0044] In some embodiments, the grounding point 70 includes at least a second grounding point 72, which is located on either the first sub-segment 621 or the second sub-segment 622. As one embodiment, the second grounding point 72 is disposed along the second side 12 or the third side 13 and located on the first sub-segment 621, in which case the first sub-segment 621 can be directly connected to the second grounding point 72 along its routing path. As another embodiment, the second grounding point 72 is disposed along the third side 13 and located on the second sub-segment 622, in which case the second sub-segment 622 can be directly connected to the second grounding point 72 along its routing path.

[0045] like Figures 4 to 6 As shown, in some embodiments, the grounding trace 60 further includes a third segment 63 connected to the first segment 61, with at least a portion of the third segment 63 located between the second switching circuit module 40 and the control circuit module 20. It should be understood that the third segment 63 can form ground isolation between the second switching circuit module 40 and the control circuit module 20, reducing crosstalk between the second switching circuit 40 and the control circuit module 20.

[0046] like Figure 4 and Figure 7 As shown, in some embodiments, the RF switch chip 100 further includes a first RF input terminal 81 and a first RF transmission line 91 disposed on the substrate 10. The first RF input terminal 81 is disposed along a fourth side 14, which is a side of the substrate 10 connected to the first side 11 and the second side 12 and close to the second switch setting part 32. The first RF transmission line 91 is connected to the first RF input terminal 81 and each of the first switch circuits 33, and is used to transmit the RF signal input from the first RF input terminal 81 to the corresponding first switch circuit 33. At least a portion of the first RF transmission line 91 and the second switch circuit module 40 are located on both sides of the third line segment 63.

[0047] It should be understood that the third segment 63 can form a ground isolation between the second switching circuit module 40 and the control circuit module 20, reducing crosstalk between the second switching circuit 43 and at least part of the first radio frequency transmission line 91.

[0048] Moreover, as explained above, part of the grounding trace 60 (including the second segment 62) extends to the side of the first switching circuit module 30 away from the control circuit module 20. This arrangement also facilitates the routing of the first radio frequency transmission line 91 between the second switching circuit module 40 and the control circuit module 20, thereby reducing the area of ​​the radio frequency switch chip 100.

[0049] like Figure 4 As shown, in some embodiments, the first radio frequency transmission line 91 includes a first sub-transmission line 911, a second sub-transmission line 912, and a third sub-transmission line 913. One end of the first sub-transmission line 911 is connected to the first radio frequency input terminal 81, and the other end extends towards the side close to the first switch module and is connected to the second sub-transmission line 912 and the third sub-transmission line 913 respectively, so that the second sub-transmission line 912 and the third sub-transmission line 913 form a branch. The first switch circuit module 30 includes a first switch setting part 31 and a second switch setting part 32. The first switch setting part 31 is disposed along the second side 12, and the second switch setting part 32 is disposed along the third side 13. The first switch setting part 31 and the second switch setting part 32 are adjacent to each other. The third side 13 is a side on the substrate 10 that is connected to the first side 11 and the second side 12 and is close to the first switch setting part 31. Both the first switch setting unit 31 and the second switch setting unit 32 are provided with a first switch circuit 33. The first radio frequency input terminal 81 is connected to the first switch circuit 33 on the first switch setting unit 31 through the first sub-transmission line 911 and the second sub-transmission line 912, and is connected to the first switch circuit 33 on the second switch setting unit 32 through the first sub-transmission line 911 and the third sub-transmission line 913.

[0050] Specifically, through the branched second sub-transmission line 912 and third sub-transmission line 913, the first radio frequency transmission line 91 can be connected to the first switch circuit 33 on the first switch setting unit 31 and the first switch circuit 33 on the second switch setting unit 32, respectively. As one embodiment, the second sub-transmission line 912 extends along the extension direction of the second side 12 to shorten the distance between the second sub-transmission line 912 and the first switch circuit 33 on the first switch setting part 31, facilitating the connection between the second sub-transmission line 912 and the first switch circuit 33 on the first switch setting part 31. Furthermore, the shortest distance between the input terminals of each first switch circuit 33 on the first switch setting part 31 and the second sub-transmission line 912 is the same, facilitating the wiring of the first radio frequency transmission line 91. Similarly, the third sub-transmission line 913 extends along the extension direction of the third side 13 to shorten the distance between the third sub-transmission line 913 and the first switch circuit 33 on the second switch setting part 32, facilitating the connection between the third sub-transmission line 913 and the first switch circuit 33 on the second switch setting part 32. Furthermore, the shortest distance between the input terminals of each first switch circuit 33 on the second switch setting part 32 and the second sub-transmission line 912 is the same, facilitating the wiring of the first radio frequency transmission line 91.

[0051] like Figure 4 As shown, in some embodiments, the first radio frequency transmission line 91 and the grounding line 60 are symmetrically arranged on both sides of the first switching circuit 33. In some embodiments, multiple first switching circuits 33 are spaced apart, and the distance from the first switching circuit 33 to the first radio frequency transmission line 91 and the shortest distance to the grounding line 60 are the same. In the embodiments of this application, when the first switch setting part 31 and the second switch setting part 32 are set, along the direction of the first side 11, the distance between the first switch setting part 31 and the third sub-transmission line 913 is the same as the distance between the first switch setting part 31 and the second sub-segment 622, and the second sub-segment 622 is set on the side closer to the third side 13. In this way, the third sub-transmission line 913 and the second sub-segment 622 can be symmetrically arranged relative to the first switch setting part 31, thereby making the layout of different lines with the first switch setting part 31 more reasonable, and ensuring the transmission distance between the first switch setting part 31 and other components, thus ensuring signal transmission quality. Specifically, multiple first switching circuits 33 are spaced apart along the extension direction of the first side 11.

[0052] Specifically, the shortest distance from the first switch circuit 33 on the first switch setting unit 31 to the second sub-transmission line 912 and the shortest distance to the second sub-segment 622 are the same, and the shortest distance from the first switch circuit 33 on the second switch setting unit 32 to the third sub-transmission line 913 and the shortest distance to the third sub-segment 631 are the same.

[0053] like Figure 2As shown, in some embodiments, the control circuit module 20 includes a main body 21 and a step portion 22. The main body 21 and the step portion 22 are disposed along the first side 11 and are adjacent to each other. The step portion 22 is located on the side of the main body 21 near the fourth side 14. Along the extending direction of the fourth side 14, the width of the main body 21 is greater than the width of the step portion 22, and the side of the step portion 22 near the second side 12 and the side of the main body 21 near the step portion 22 form a clearance space 23.

[0054] Specifically, along the extension direction of the fourth side 14, the step portion 22 narrows towards the side closer to the first side 11 near the edge of the second side 12 to form the aforementioned clearance space 23, and the clearance space 23 is at least used for the second switch circuit module 40 of the set portion, so that the second switch circuit module 40 and the control circuit module 20 are positioned closer together.

[0055] like Figure 4 and Figure 7 As shown, in some embodiments, the second switch circuit module 40 includes a third switch setting part 41 and a fourth switch setting part 42. The third switch setting part 41 is disposed along the second side 12, and the fourth switch setting part 42 is disposed along the fourth side 14. The side of the fourth switch setting part 42 near the second side 12 is adjacent to the third switch setting part 41, and the side of the fourth switch setting part 42 near the first side 11 extends to the clearance space 23.

[0056] Specifically, both the third switch setting section 41 and the fourth switch setting section 42 are respectively provided with a second switch circuit 43. The second switch circuit module 40 is L-shaped so that the second switch circuit module 40 and the side adjacent to the control circuit module 20 are mutually adapted. It should be understood that the arrangement of the clearance space 23 can make full use of the area on the substrate 10 to set the second switch circuit module 40 and the control circuit module 20, and also facilitates the electrical connection between the control circuit module 20 and each of the second switch circuits 43, further reducing the area of ​​the switch control module. At the same time, combined with Figure 3In the layout structure of the second switch circuit module 40, multiple filter chips, such as a second filter chip and a third filter chip, are disposed at corresponding positions on the upper side. In this embodiment, the second switch circuit module 40 is configured as an L-shape. This allows the two parts of the L-shaped second switch circuit module 40, which are close to the second and third filter chips, to be connected to the second and third filter chips respectively, thereby reducing the distance between the second switch circuit module 40 and the second and third filter chips. This facilitates the electrical connection between the second switch circuit module 40 and different filter chips and allows for better cooperation between the second switch circuit module 40 and different filter chips. In this embodiment, the arrangement of the multiple filter chips is not limited by the layout of the first, second, and third filter chips outside the first switch circuit module 30 and the second switch circuit module 40. Different filter chips can also be placed in other areas, and the arrangement scheme of different filter chips is within the protection scope of this application. Furthermore, it is not limited by the isolation scheme between control signals and radio frequency signals in this application.

[0057] like Figure 4 and Figure 7 As shown, in some embodiments, the third line segment 63 includes a third sub-line segment 631, a fourth sub-line segment 632, and a fifth sub-line segment 633. The third sub-line segment 631 is located between the main body 21 and the third switch setting part 41 and is connected to the first line segment 61. The fourth sub-line segment 632 is located between the main body 21 and the fourth switch setting part 42 and is connected to the third sub-line segment 631. The fifth sub-line segment 633 is located between the step part 22 and the fourth switch setting part 42 and is connected to the fourth sub-line segment 632. The first radio frequency input terminal 81 is located on the side of the fifth sub-line segment 633 near the step part 22.

[0058] Specifically, by setting a third sub-segment 631, a fourth sub-segment 632, and a fifth sub-segment 633 in the clearance space 23, the third sub-segment 63 can adapt to the edge shape of both the second switch circuit module 40 and the control circuit module 20, forming ground isolation between the second switch circuit module 40 and the control circuit module 20. Since the first RF input terminal 81 is located on the side of the fifth sub-segment 633 near the step portion 22, the first RF input terminal 81 and the second switch circuit module 40 are separated on both sides of the fifth sub-segment 633. This also facilitates at least part of the first RF transmission line 91 and the second switch circuit module 40 being separated on both sides of the third sub-segment 63, thereby avoiding crosstalk between the RF signals transmitted on the first RF transmission line 91 and the second switch circuit 43 and ensuring isolation.

[0059] In some embodiments, a third ground point 73 is further provided on the substrate 10, the third ground point 73 being located within the clearance space 23, and at least one of the fourth sub-segment 632 and the fifth sub-segment 633 is connected to the third ground point 73. For example, in Figure 4 and Figure 7 In the layout shown, the third grounding point 73 is located at the corner where the fourth sub-segment 632 and the fifth sub-segment 633 connect.

[0060] Specifically, the step portion 22 forms a clearance space 23, which is also used to set the third grounding point 73. As one embodiment, at least some of the grounding points 70 on the RF switch chip 100 are bumps disposed on the surface of the substrate 10, which have a certain cross-sectional area, that is, they need to occupy a sufficient area on the surface of the substrate 10. As an example, the aforementioned first grounding point 71, second grounding point 72, third grounding point 73, and the fourth grounding point 74, fifth grounding point 75, sixth grounding point 76 and seventh grounding point 77, which will appear later, are all bumps disposed on the surface of the substrate 10.

[0061] like Figure 4 and Figure 7 As shown, in some embodiments, a fourth grounding point 74 is also provided on the substrate 10. The fourth grounding point 74 is provided along the first side 11 and located on the side close to the second switching circuit module 40. The third line segment 63 also includes a sixth sub-line segment 634. One end of the sixth sub-line segment 634 is connected to the fifth sub-line segment 633, and the other end extends in the direction of the first side 11 and is connected to the fourth grounding point 74.

[0062] It should be noted that, based on the third sub-segment 631, the fourth sub-segment 632, the fifth sub-segment 633, and the third grounding point 73, the additional provision of a fourth grounding point 74 and a sixth sub-segment 634 can further reduce signal crosstalk between the second switching circuit 43 and the switching control module. Compared to the third segment 63, which only extends to the area between the step portion 22 and the fourth switch setting portion 42, i.e., the position of the fifth sub-segment 633 (see [reference]), this further reduces signal crosstalk between the second switching circuit 43 and the switching control module. Figure 5 and Figure 6 A sixth sub-segment 634 is provided on the side of the step 22 near the fourth side 14 (see...). Figure 4 and Figure 7 This allows the grounding line 60 to surround the control circuit module 20 from more directions, further improving the isolation between the second switching circuit 43 and the switching control module.

[0063] like Figure 4 and Figure 7As shown, in some embodiments, the third line segment 63 further includes a seventh sub-line segment 635, which is connected to the end of the third sub-line segment 631 away from the first line segment 61 and extends toward the fourth side 14 to form a gap between the third switch setting part 41 and the fourth switch setting part 42.

[0064] As explained above, different second switch circuits 43 have different operating frequency bands. The seventh sub-segment 635 is provided between the third switch setting section 41 and the fourth switch setting section 42 to reduce crosstalk between the second switch circuit 43 on the third switch setting section 41 and the second switch circuit 43 on the fourth switch setting section 42 when transmitting radio frequency signals, thereby improving the isolation between them.

[0065] In some embodiments, during CA mode, the third switch setting unit 41 and the fourth switch setting unit 42 may need to operate simultaneously. In this case, the second switch circuit 43 on the third switch setting unit 41 and the second switch circuit 43 on the fourth switch setting unit 42 may experience crosstalk during radio frequency signal transmission. Particularly in some embodiments, at least two of the second switch circuits 43 operate within the same second frequency band. Since both operate within the second frequency band, crosstalk is more likely to occur between the second switch circuit 43 on the third switch setting unit 41 and the second switch circuit 43 on the fourth switch setting unit 42. Therefore, the isolation between the two types of second switch circuits 43 is crucial. As an example, the two frequency bands in some common CA combinations can be respectively set on the third switch setting unit 41 and the fourth switch setting unit 42.

[0066] In addition to providing a continuous first line segment 61 in the interval area between the first switch circuit module 30 and the second switch module, at least two unconnected grounding lines 60 can also be provided in the interval area, and the two grounding lines 60 are connected to different grounding points 70.

[0067] like Figure 8 As shown, in some embodiments, the grounding trace 60 includes a first grounding trace 64 and a second grounding trace 65, and the grounding point 70 includes a fifth grounding point 75 located near the first switching circuit module 30 and a sixth grounding point 76 located near the second switching circuit module 40; wherein, the first grounding trace 64 is connected to the fifth grounding point 75, and at least a portion of the first grounding trace 64 is located between the first switching circuit module 30 and the second switching circuit module 40, the second grounding trace 65 is connected to the sixth grounding point 76, and at least a portion of the second grounding trace 65 is located between the first grounding trace 64 and the second switching circuit module 40, and the first grounding trace 64 and the second grounding trace 65 are spaced apart.

[0068] Specifically, the first grounding trace 64 and the second grounding trace 65 can form a double layer of isolation between the first switching circuit module 30 and the second switching circuit module 40. Compared with single-layer isolation, two isolation lines are set between the first switching circuit module 30 and the second switching circuit module 40, thereby improving the isolation effect and further reducing signal crosstalk.

[0069] like Figure 9 As shown, in some embodiments, the grounding trace 60 further includes an outer grounding trace 66, and the grounding point 70 further includes at least one seventh grounding point 77. The outer grounding trace 66 is disposed between the first switch circuit module 30, the second switch circuit module 40 and the control circuit module 20 and is connected to the seventh grounding point 77, and at least a portion of the outer grounding trace 66 is disposed around the edge of the control circuit module 20.

[0070] Specifically, the outer grounding trace 66 is at least located on the side of the control circuit module 20 closest to the first switch circuit module 30 and the second switch circuit module 40, to form ground isolation between the control circuit module 20 and the first switch circuit module 30, and between the control circuit module 20 and the second switch circuit module 40. For example, the routing shape of the outer grounding trace 66 is adapted to the side of the control circuit module 20 closest to the first switch circuit module 30 and the second switch circuit module 40, so as to reduce the area occupied by the RF switch module while forming ground isolation. Meanwhile, in this embodiment, by setting an outer grounding trace 66 and a grounding trace 60, and with the first radio frequency transmission line 91 located outside the outer grounding trace 66, the outer grounding trace 66 can further isolate the first radio frequency transmission line 91 and the first radio frequency input terminal 81 from the internal control circuit module 20, preventing crosstalk between them. Furthermore, a grounding trace 60 is also provided between the first radio frequency transmission line 91 and the second switching circuit module 40, further isolating the first radio frequency transmission line 91 and the first radio frequency input terminal 81 from the second switching circuit module 40, thereby further avoiding crosstalk between the first radio frequency transmission line 91 and the first radio frequency input terminal 81 and the second switching circuit module 40. This ensures the quality and stability of signal transmission.

[0071] like Figure 9 As shown, in one embodiment, the seventh grounding point 77 is disposed along the first side, for example, disposed on the first side and located between the first switch circuit module 30 and the control circuit module 20 and / or located between the second switch circuit module 40 and the control circuit module 20.

[0072] In some embodiments, the first switch circuit module 30 and the second switch circuit module 40 are flush with one edge of the second side 12, and in the opposite direction of the first side 11 and the second side 12, the width of the first switch circuit module 30 is greater than the width of the control circuit module 20, the width of the second switch circuit module 40 is greater than the width of the control circuit module 20, and the width of the first switch circuit module 30 is greater than the width of the second switch circuit module 40.

[0073] Specifically, in the direction relative to the first side 11 and the second side 12, which is the extension direction of the third side 13 / fourth side 14, the first switch circuit module 30 covers the control circuit module 20, and the second switch circuit module 40 also covers the control circuit module 20, so that the first switch module, the second switch module, and the first side 11 can surround the control circuit module 20. On the other hand, since part of the second switch circuit module 40 extends into the clearance space 23, and is constrained by the control circuit module 20, the width of the first switch circuit module 30 in the extension direction of the third side 13 / fourth side 14 is greater than the width of the second switch circuit module 40, so as to flexibly adapt to the outer contour of the control circuit module 20, thereby making full use of the area on the substrate 10.

[0074] like Figure 4 and Figure 7 As shown, in some embodiments, the RF switch chip 100 further includes a second RF input terminal 82 and a second RF transmission line 92. Specifically, the second RF input terminal 82 is connected to each of the second switch circuits 43 on the second switch circuit module 40 via the second RF transmission line 92 to transmit RF signals to the second switch circuits 43. As one embodiment, the second RF input terminal 82 is disposed along the third side 13, the second RF transmission line 92 is connected to the second RF input terminal 82, and a portion of the second RF transmission line 92 is disposed along the third side 13, while another portion of the second RF transmission line 92 is disposed along the second side 12.

[0075] like Figure 7 As shown in the figure, this application embodiment also provides another radio frequency switch chip 100, which includes a substrate 10, a first switch circuit module 30, a second switch circuit module 40, and a control circuit module 20. The substrate 10 has opposing first sides 11 and second sides 12, and a plurality of grounding points 70 are provided on the substrate 10. The first switch circuit module 30 includes at least two first switch circuits 33, and the second switch circuit module 40 includes at least two second switch circuits 43. The control circuit module 20 is disposed on the substrate 10 and close to the first side 11. The control circuit module 20 is spaced apart from the first switch circuit module 30 and the second switch circuit module 40, and is electrically connected to them respectively.

[0076] The first switch circuit module 30 and the second switch circuit module 40 are arranged at intervals along the extension direction of the second side 12. The plurality of grounding points 70 include a first grounding point 71 located between the first switch circuit module 30 and the second switch circuit module 40. A grounding trace 60 is also provided on the substrate 10. At least a portion of the grounding trace 60 is located between the first switch circuit module 30 and the second switch circuit module 40 and is connected to the first grounding point 71. The number of grounding points 70 closer to the second switch circuit module 40 is greater than the number of grounding points 70 closer to the first switch circuit module 30.

[0077] Specifically, the grounding trace 60 includes at least a third segment 63, and at least a portion of the third segment 63 is located between the second switching circuit module 40 and the control circuit module 20 to form grounding isolation between the second switching circuit module 40 and the control circuit module 20. Based on this, the number of grounding points 70 near the second switching circuit module 40 is greater than the number of grounding points 70 near the first switching circuit module 30, facilitating the connection between the third segment 63 and the grounding points 70. Furthermore, the grounding points 70 themselves can also form grounding isolation between the second switching circuit module 40 and the switch control module, reducing crosstalk in the radio frequency signal transmission between the second switching circuit module 40 and the switch control module, thereby improving the quality of radio frequency signal transmission.

[0078] In some embodiments, the first switch circuit module 30, the second switch circuit module 40 and the first side 11 enclose a target area 50, and at least a portion of the control circuit module 20 is located within the target area 50.

[0079] In some embodiments, the control circuit module 20 includes a main body 21 and a step portion 22. The main body 21 and the step portion 22 are disposed along a first side 11 and are adjacent to each other. The main body 21 is located on the side of the step portion 22 near the third side 13. The third side 13 is a side on the substrate 10 that is connected to the first side 11 and the second side 12 and is close to the first switch setting portion 31. Along the extending direction of the third side 13, the width of the main body 21 is greater than the width of the step portion 22, and the side of the step portion 22 near the second side 12 and the side of the main body 21 near the step portion 22 form a clearance space 23. The third side 13 is a side on the substrate 10 that is connected to the first side 11 and the second side 12 and is close to the first switch setting portion 31.

[0080] In some embodiments, the second switch circuit module 40 includes a third switch setting part 41 and a fourth switch setting part 42. The third switch setting part 41 is disposed along the second side 12, and the fourth switch setting part 42 is disposed along the fourth side 14. The side of the fourth switch setting part 42 near the second side 12 is adjacent to the third switch setting part 41, and the side of the fourth switch setting part 42 near the first side 11 extends to the clearance space 23. The fourth side 14 is a side on the substrate 10 that is connected to the first side 11 and the second side 12 and is close to the second switch setting part 32.

[0081] In some embodiments, the RF switch chip 100 further includes a first RF input terminal 81 and a first RF transmission line 91 disposed on the substrate 10. The first RF input terminal 81 is disposed along a fourth side 14, which is a side of the substrate 10 connected to the first side 11 and the second side 12 and close to the second switch setting part 32. The first RF transmission line 91 is connected to the first RF input terminal 81 and each of the first switch circuits 33, and is used to transmit the RF signal input from the first RF input terminal 81 to the corresponding first switch circuit 33. The grounding trace 60 includes a first segment 61 and a third segment 63 connected to the first segment 61. The first segment 61 is continuously arranged in the interval area between the first switch circuit module 30 and the second switch circuit module 40. At least part of the third segment 63 is located between the second switch circuit module 40 and the control circuit module 20. The third segment 63 includes a third sub-segment 631, a fourth sub-segment 632 and a fifth sub-segment 633. The third sub-segment 631 is located between the main body 21 and the third switch setting part 41 and is connected to the first segment 61. The fourth sub-segment 632 is located between the main body 21 and the fourth switch setting part 42 and is connected to the third sub-segment 631. The fifth sub-segment 633 is located between the step part 22 and the fourth switch setting part 42 and is connected to the fourth sub-segment 632. The first radio frequency input terminal 81 is located on the side of the fifth sub-segment 633 near the step part 22.

[0082] Furthermore, since the first RF input terminal 81 is located along the fourth side 14 and is situated on the side of the fifth sub-segment 633 near the step portion 22, in order to form grounding isolation around the first RF input terminal 81 and the first RF transmission line 91, grounding traces 60 need to be arranged between the first RF input terminal 81, the first RF transmission line 91 and the second switching circuit module 40, and between the first RF input terminal 81, the first RF transmission line 91 and the control circuit module 20. Therefore, a greater number of grounding points 70 are set on the side near the second switching circuit module 40.

[0083] In some embodiments, a third grounding point 73 is also provided on the substrate 10, the third grounding point 73 is located in the clearance space 23, and at least one of the fourth sub-segment 632 and the fifth sub-segment 633 is connected to the third grounding point 73.

[0084] It should be noted that the further specific settings of the radio frequency switch chip 100 provided in this embodiment can be referred to the description of the radio frequency switch chip 100 in the foregoing embodiment, and will not be repeated here.

[0085] like Figure 10 As shown, this application embodiment also provides an RF front-end module 200, including an RF switch chip 100 as provided in any embodiment of this application.

[0086] like Figure 11 As shown, this application embodiment also provides an electronic device 300, including any of the radio frequency front-end modules 200 provided in this application embodiment or any of the radio frequency switch chips 100 provided in this application embodiment.

[0087] The electronic device 300 can be a mobile phone, tablet computer, vehicle terminal, or other communication device. Of course, it can also be other communication devices with communication functions. This application does not limit the specific type of electronic device 300. Furthermore, with the development of 5G technology, the performance requirements for radio frequency front-end modules are becoming increasingly stringent. The technical solution of this application can be applied to 5G radio frequency front-end modules to improve the communication performance of 5G communication devices.

[0088] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the scope of the technology disclosed in this application. These modifications or substitutions should all be covered within the scope of protection of this application, and the scope of protection of this application should be determined by the scope of the claims.

[0089] It should be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection via an intermediate medium; or a connection within two elements. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances. As used in this specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a," "an," and "the" are intended to include the plural forms. It should also be understood that the term "and / or" as used in this specification and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes such combinations. In this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system.

Claims

1. A radio frequency switch chip, characterized in that, The radio frequency switch chip includes: A substrate having opposing first and second sides, wherein at least one grounding point is provided on the substrate; A first switching circuit module, the first switching circuit module including at least two first switching circuits; The second switching circuit module includes at least two second switching circuits; A control circuit module is disposed on the substrate and close to the first side. The control circuit module is disposed at intervals from the first switch circuit module and the second switch circuit module and is electrically connected to each other. The first switch circuit module and the second switch circuit module are arranged at intervals along the extension direction of the second side, and the first switch module, the second switch module and the first side surround to form a target area, and at least part of the control circuit module is located in the target area; Furthermore, the substrate is provided with grounding traces connected to the grounding point, and at least a portion of the grounding traces are located between the first switching circuit module and the second switching circuit module.

2. The radio frequency switch chip as described in claim 1, characterized in that, The grounding trace includes at least a first segment, which is connected to the grounding point, and the first segment is continuously arranged in the interval area between the first switch circuit module and the second switch circuit module.

3. The radio frequency switch chip as described in claim 2, characterized in that, The grounding point includes at least a first grounding point, which is located between the first switch circuit module and the second switch circuit module, and the first line segment is electrically connected to the first grounding point.

4. The radio frequency switch chip as described in claim 2, characterized in that, The grounding trace also includes a second segment connected to the first segment, at least a portion of the second segment being located on the side of the first switching circuit module away from the control circuit module, and the second segment being arranged around at least a portion of the outer edge of the first switching circuit module.

5. The radio frequency switch chip as described in claim 4, characterized in that, The first switch circuit module includes a first switch setting part and a second switch setting part. The first switch setting part is disposed along the second side, and the second switch setting part is disposed along the third side. The first switch setting part and the second switch setting part are adjacent to each other. The third side is a side on the substrate that is connected to the first side and the second side and is close to the first switch setting part. The second line segment includes a first sub-line segment connected to the first line segment and a second sub-line segment connected to the first sub-line segment. The first sub-line segment is located between the first switch setting part and the first side, and the second sub-line segment is located between the second switch setting part and the third side or between the second switch setting part and the control circuit module.

6. The radio frequency switch chip as described in claim 5, characterized in that, Along the extending direction of the third side, the width of the second switch setting part is greater than the width of the control circuit module.

7. The radio frequency switch chip as described in claim 5, characterized in that, The grounding point includes at least a second grounding point, which is located on either the first sub-segment or the second sub-segment.

8. The radio frequency switch chip as described in claim 2, characterized in that, The grounding trace also includes a third segment connected to the first segment, and at least a portion of the third segment is located between the second switching circuit module and the control circuit module.

9. The radio frequency switch chip as described in claim 8, characterized in that, The radio frequency switch chip further includes a first radio frequency input terminal and a first radio frequency transmission line disposed on the substrate. The first radio frequency input terminal is disposed along a fourth side, which is a side on the substrate that is connected to the first side and the second side and is close to the second switch setting part. The first radio frequency transmission line is connected to the first radio frequency input terminal and each of the first switch circuits and is used to transmit the radio frequency signal input from the first radio frequency input terminal to the corresponding first switch circuit. At least a portion of the first radio frequency transmission line and the second switching circuit module are located on opposite sides of the third line segment.

10. The radio frequency switch chip as described in claim 9, characterized in that, The first radio frequency transmission line includes a first sub-transmission line, a second sub-transmission line, and a third sub-transmission line. One end of the first sub-transmission line is connected to the first radio frequency input terminal, and the other end extends towards the side close to the first switch module and is connected to the second sub-transmission line and the third sub-transmission line respectively, so that the second sub-transmission line and the third sub-transmission line form a branch. The first switch circuit module includes a first switch setting part and a second switch setting part. The first switch setting part is disposed along the second side, and the second switch setting part is disposed along the third side. The first switch setting part and the second switch setting part are adjacent to each other. The third side is a side on the substrate that is connected to the first side and the second side and is close to the first switch setting part. Both the first switch setting part and the second switch setting part are provided with the first switch circuit. The first radio frequency input terminal is connected to the first switch circuit on the first switch setting part through the first sub-transmission line and the second sub-transmission line, and is also connected to the first switch circuit on the second switch setting part through the first sub-transmission line and the third sub-transmission line.

11. The radio frequency switch chip as described in claim 9, characterized in that, Multiple first switching circuits are spaced apart, and the distance from the first switching circuit to the first radio frequency transmission line and the shortest distance to the grounding trace are the same.

12. The radio frequency switch chip as described in claim 9, characterized in that, The control circuit module includes a main body and a step portion. The main body and the step portion are arranged along the first side and are adjacent to each other. The step portion is located on the side of the main body near the fourth side. Along the extension direction of the fourth side, the width of the main body is greater than the width of the step portion, and the side of the step portion near the second side and the side of the main body near the step portion form a clearance space.

13. The radio frequency switch chip as described in claim 12, characterized in that, The second switch circuit module includes a third switch setting part and a fourth switch setting part. The third switch setting part is arranged along the second side, and the fourth switch setting part is arranged along the fourth side. The side of the fourth switch setting part near the second side is adjacent to the third switch setting part, and the side of the fourth switch setting part near the first side extends into the clearance space.

14. The radio frequency switch chip as described in claim 13, characterized in that, in, The third line segment includes a third sub-line segment, a fourth sub-line segment, and a fifth sub-line segment. The third sub-line segment is located between the main body and the third switch setting part and is connected to the first line segment. The fourth sub-line segment is located between the main body and the fourth switch setting part and is connected to the third sub-line segment. The fifth sub-line segment is located between the step part and the fourth switch setting part and is connected to the fourth sub-line segment. The first radio frequency input terminal is located on the side of the fifth sub-line segment closer to the step part.

15. The radio frequency switch chip as described in claim 14, characterized in that, A third grounding point is also provided on the substrate, the third grounding point is located in the clearance space, and at least one of the fourth sub-segment and the fifth sub-segment is connected to the third grounding point.

16. The radio frequency switch chip as described in claim 15, characterized in that, A fourth grounding point is also provided on the substrate, which is located along the first side and close to the second switching circuit module. The third line segment also includes a sixth sub-line segment, one end of which is connected to the fifth sub-line segment, and the other end extends toward the first side and is connected to the fourth grounding point.

17. The radio frequency switch chip as described in claim 14, characterized in that, The third line segment also includes a seventh sub-line segment, which is connected to the end of the third sub-line segment away from the first line segment and extends toward the fourth side to form a gap between the third switch setting part and the fourth switch setting part.

18. The radio frequency switch chip as described in claim 1, characterized in that, The grounding trace includes a first grounding trace and a second grounding trace, and the grounding point includes a fifth grounding point located near the first switching circuit module and a sixth grounding point located near the second switching circuit module; The first grounding trace is connected to the fifth grounding point, and at least a portion of the first grounding trace is located between the first switch circuit module and the second switch circuit module. The second grounding trace is connected to the sixth grounding point, and at least a portion of the second grounding trace is located between the first grounding trace and the second switch circuit module. The first grounding trace and the second grounding trace are spaced apart.

19. The radio frequency switch chip as described in claim 1, characterized in that, The grounding trace also includes an outer ring grounding trace, and the grounding point also includes at least one seventh grounding point. The outer ring grounding trace is disposed between the first switch circuit module, the second switch circuit module and the control circuit module and connected to the seventh grounding point, and at least a portion of the outer ring grounding trace is disposed around the edge of the control circuit module.

20. The radio frequency switch chip as described in claim 1, characterized in that, The first switch circuit module and the second switch circuit module are flush with each other at the edge of the end closest to the second side, and in the direction opposite to the first side and the second side, the width of the first switch circuit module is greater than the width of the second switch circuit module.

21. A radio frequency switch chip, characterized in that, The radio frequency switch chip includes: A substrate having opposing first and second sides, wherein a plurality of grounding points are disposed on the substrate; A first switching circuit module, the first switching circuit module including at least two first switching circuits; The second switching circuit module includes at least two second switching circuits; A control circuit module is disposed on the substrate and close to the first side. The control circuit module is disposed at intervals from the first switch circuit module and the second switch circuit module and is electrically connected to each other. The first switch circuit module and the second switch circuit module are arranged at intervals along the extension direction of the second side. The plurality of grounding points include a first grounding point located between the first switch circuit module and the second switch circuit module. Grounding traces are also provided on the substrate. At least a portion of the grounding traces are located between the first switch circuit module and the second switch circuit module and are connected to the first grounding point. The number of grounding points closer to the second switch circuit module is greater than the number of grounding points closer to the first switch circuit module.

22. The radio frequency switch chip as described in claim 21, characterized in that, The first switch circuit module, the second switch circuit module, and the first side surround form a target area, and at least a portion of the control circuit module is located within the target area.

23. The radio frequency switch chip as described in claim 21, characterized in that, The control circuit module includes a main body and a stepped portion. The main body and the stepped portion are disposed along the first side and are adjacent to each other. The main body is located on the side of the stepped portion near the third side. The third side is a side on the substrate that is connected to the first side and the second side and is close to the first switch setting portion. Along the extending direction of the third side, the width of the main body is greater than the width of the stepped portion, and the side of the stepped portion near the second side and the side of the main body near the stepped portion form a clearance space. The third side is the side on the substrate that is connected to the first side and the second side and is close to the first switch setting part.

24. The radio frequency switch chip as described in claim 23, characterized in that, The second switch circuit module includes a third switch setting part and a fourth switch setting part. The third switch setting part is arranged along the second side, and the fourth switch setting part is arranged along the fourth side. The side of the fourth switch setting part closer to the second side is adjacent to the third switch setting part, and the side of the fourth switch setting part closer to the first side extends to the clearance space. The fourth side is the side on the substrate that is connected to the first side and the second side and is close to the second switch setting part.

25. The radio frequency switch chip as described in claim 24, characterized in that, The radio frequency switch chip further includes a first radio frequency input terminal and a first radio frequency transmission line disposed on the substrate. The first radio frequency input terminal is disposed along a fourth side, which is a side on the substrate that is connected to the first side and the second side and is close to the second switch setting part. The first radio frequency transmission line is connected to the first radio frequency input terminal and each of the first switch circuits and is used to transmit the radio frequency signal input from the first radio frequency input terminal to the corresponding first switch circuit. The grounding trace includes a first segment and a third segment connected to the first segment. The first segment is continuously arranged in the interval area between the first switch circuit module and the second switch circuit module. At least a portion of the third segment is located between the second switch circuit module and the control circuit module. The third segment includes a third sub-segment, a fourth sub-segment, and a fifth sub-segment. The third sub-segment is located between the main body and the third switch setting part and is connected to the first segment. The fourth sub-segment is located between the main body and the fourth switch setting part and is connected to the third sub-segment. The fifth sub-segment is located between the stepped part and the fourth switch setting part and is connected to the fourth sub-segment. The first radio frequency input terminal is located on the side of the fifth sub-segment closer to the stepped part.

26. The radio frequency switch chip as described in claim 25, characterized in that, A third grounding point is also provided on the substrate, the third grounding point is located in the clearance space, and at least one of the fourth sub-segment and the fifth sub-segment is connected to the third grounding point.

27. A radio frequency front-end module, characterized in that, Includes the radio frequency switch chip as described in any one of claims 1-26.

28. An electronic device, characterized in that, Includes the RF switch chip as described in any one of claims 1-26 or the RF front-end module as described in claim 27.

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