Heat pipe ventilation wall device for heat dissipation of data center
By using modular heat pipe air wall devices and intelligent control systems, the problems of hot and cold air mixing, high energy consumption, and poor flexibility in data center cooling systems are solved, achieving efficient and energy-saving data center cooling, which is suitable for newly built and renovated data centers.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-09
- Publication Date
- 2026-04-10
AI Technical Summary
Existing data center cooling systems suffer from problems such as easy mixing of hot and cold air, low cooling efficiency, high energy consumption, high dependence on mechanical cooling, difficulty in coping with high-density loads, and lack of flexibility.
The modular heat pipe air wall device efficiently transfers server waste heat to the outside through vertically densely arranged heat pipes. Combined with forced convection air cooling and equipped with an intelligent control system, it achieves directional heat transfer and efficient utilization.
It significantly reduces data center cooling energy consumption, improves heat dissipation efficiency, enables flexible adjustment and efficient utilization of natural cooling sources, adapts to different load requirements, and features high availability and ease of deployment.
Smart Images

Figure CN121843047A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of data center thermal management technology, specifically relating to a data center heat dissipation system that combines the high-efficiency thermal conductivity of heat pipes with forced air convection, and particularly a modular heat pipe air wall device suitable for rack-level or server room-level cooling. Background Technology
[0002] With the rapid development of cloud computing, artificial intelligence, and big data technologies, data centers, as critical information infrastructure, are experiencing a continuous increase in scale and power density. The resulting massive heat generation poses unprecedented challenges to data center cooling systems. Traditional data centers primarily rely on room-level air conditioning for cooling, with cool air delivered to the server rack intake side via raised floors or ducts, absorbing heat and then being exhausted as hot air. This approach has significant drawbacks: First, hot and cold airflows easily mix, creating localized hotspots and resulting in low cooling efficiency; second, compressor-driven air conditioning systems consume enormous amounts of energy throughout the year, especially during seasons with favorable climates, as they cannot effectively utilize natural cooling sources; third, system redundancy and over-cooling are common, further increasing operating costs (higher PUE values).
[0003] To improve energy efficiency, the industry has explored various natural cooling technologies, such as indirect air-side natural cooling and water-side natural cooling. Heat pipe technology, due to its extremely high thermal conductivity, passive operation characteristics, and excellent isothermal properties, has also been introduced into the data center cooling field. However, existing heat pipe cooling solutions are often limited to localized cooling of a single server rack or server, or simply coupled with air conditioning systems. These solutions suffer from problems such as dispersed heat pipe layout, limited heat exchange area, poor coordination with airflow organization in the data center, and difficulty in large-scale deployment and flexible adjustment.
[0004] Therefore, there is an urgent need for a new type of heat dissipation device that can be deeply integrated with the building structure and airflow organization of data centers, take into account both efficient heat dissipation and maximizing the utilization of natural cold sources, and has modular and intelligent features. Summary of the Invention
[0005] The purpose of this invention is to overcome the shortcomings of existing data center heat dissipation technologies, such as low energy efficiency, high dependence on mechanical cooling, difficulty in coping with high-density loads, and lack of flexibility, and to provide a heat pipe wall device for data center heat dissipation that is compact, energy-efficient, intelligent and controllable, and easy to deploy and maintain.
[0006] To achieve the above objectives, the present invention adopts the following technical solution: a heat pipe wall device for data center heat dissipation, the specific structure of which is as described in claim 1. The heat pipe wall unit (2) is an independent modular structure whose core function is to efficiently transfer waste heat generated by servers in the computer room to the outdoor side through multiple vertically densely arranged independent heat pipes, and to remove the heat using forced convection air. The functional connections and synergistic effects between the components are as follows:
[0007] The heat pipe air wall unit is one or more, arranged at one or both sides of the side wall along the length of the data center server room, or arranged in the partition wall inside the server room as an insulated heat channel. Each heat pipe air wall unit is an independent modular structure.
[0008] Within each heat pipe air wall unit, multiple heat pipes are densely arranged vertically to form the main body of the "air wall". Each heat pipe is divided into three sections: the section located inside the data center server room is the heat pipe evaporation section, which extends into the server rack exhaust duct formed by the server rack rear door or a dedicated air duct to directly capture the heat from the high-temperature exhaust gas discharged by the server; the section passing through the server room wall or partition structure is the heat pipe insulation section, which is covered with high-efficiency insulation material to minimize heat loss along the transfer path; and the section located inside the heat pipe air wall unit cavity is the heat pipe condensation section.
[0009] The heat pipe air wall unit is equipped with an air inlet and an air outlet. An air filter is installed at the air inlet to purify the incoming air. An axial flow fan unit is installed at the top (top outlet mode) or bottom (bottom inlet mode) of the unit to force ambient air or cooler return air from the machine room to flow across the surface of the heat pipe condenser section. Air dampers are installed at the air inlet and / or air outlet to regulate airflow or switch between different operating modes.
[0010] The control system is the intelligent hub of the entire device, connected to multiple temperature and humidity sensors deployed inside the computer room (such as the air inlet and outlet of the server rack), on the surfaces of the heat pipe evaporation and condensation sections, and in the external environment. The control system collects this data in real time and, based on preset logic and algorithms, coordinates the rotational speed of the axial fan unit, the opening degree of the air valves, and the electric regulating valves (for fine adjustment of the working fluid flow rate) that may be configured on the heat pipe circuit.
[0011] The heat pipe mounting bracket is used to securely fix the heat pipe array inside the heat pipe air wall unit and within the cabinet exhaust duct, ensuring structural stability. The liquid collector and liquid distributor are located at the lower and upper parts of the heat pipe evaporation section, respectively (for gravity-assisted heat pipes), ensuring effective circulation of the working fluid. The bracket guide rail design facilitates the sliding installation, disassembly, and maintenance of the entire heat pipe air wall unit as a module.
[0012] The heat pipe is preferably a gravity-assisted heat pipe or a loop heat pipe, and its internal working fluid is selected according to the outdoor ambient temperature range, such as R134a, R410a or water.
[0013] Furthermore, the axial flow fan unit preferably adopts a high-efficiency EC fan, which supports stepless speed regulation by PWM or 0-10V signal and responds to the commands of the control system.
[0014] Furthermore, the outer surface of the heat pipe condensation section is provided with large-area fins or ribs to significantly increase the air-side heat exchange area and improve heat dissipation efficiency.
[0015] Furthermore, the device is designed to operate in conjunction with the existing precision air conditioning system in the data center. Based on outdoor enthalpy or dry-bulb temperature, the control system prioritizes or even fully relies on the heat pipe wall device for heat dissipation during transitional seasons and winter, shutting down or minimizing the operation of the air conditioning compressor. In hot and humid summer weather, the air conditioning system is activated as a supplement or primary cooling system, while the heat pipe wall operates as a pre-cooling device or auxiliary heat dissipation device, thereby achieving the lowest energy consumption throughout the year.
[0016] The working principle and beneficial effects of this invention are as follows: The heat generated by the server is directly carried to the heat pipe evaporation section by the high-temperature air in the exhaust duct of the server rack rear door. The heat drives the working fluid inside the heat pipe to evaporate, and the vapor quickly flows to the condensation section. In the condensation section, the heat released by the condensation of the working fluid is carried away by the forced convection air driven by the fan and discharged to the outside or the return air space of the server room. The extremely high thermal conductivity of the heat pipe enables rapid directional heat transfer. The evaporation section and the condensation section are nearly isothermal with a small temperature difference and high heat exchange drive efficiency. The core heat dissipation link of this device (condensation section heat dissipation) directly utilizes the low-temperature outdoor air or the relatively cool return air in the server room. For most of the year, there is no need to start the compressor for cooling, maximizing the use of natural cold sources and significantly reducing the cooling energy consumption of the data center (PUE can be reduced to below 1.2 or even lower). The device adopts a standardized modular design, which can flexibly increase or decrease the number of air wall units according to the growth of the data center's heat load, making deployment and maintenance simple. An integrated intelligent control system can automatically optimize operation based on real-time heat load and internal and external environmental parameters, adjusting fans and air valves to achieve "on-demand cooling" and avoid over-cooling. By tightly integrating the heat pipe evaporator section into the rack exhaust duct, hot air is effectively captured and removed, preventing hot air recirculation. Simultaneously, the modular airwall structure can be perfectly integrated with cold / hot aisle containment systems, forming an efficient and orderly airflow path within the server room, improving overall cooling efficiency. The heat pipes themselves have no moving parts, operate passively, and have a long lifespan. Active components such as fans can employ redundant designs. The system has a simple structure, few points of failure, and high overall reliability, meeting the high availability requirements of data centers. Attached Figure Description
[0017] Figure 1This is a top sectional view of an embodiment of the present invention (arranged on the end wall of the computer room).
[0018] Figure 2 This is a front structural schematic diagram (partial cross-section) of a single heat pipe air wall unit.
[0019] Figure 3 This is a schematic diagram illustrating the working principle of the heat pipe and the system control logic of the present invention. Detailed Implementation
[0020] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.
[0021] like Figure 1 As shown, in a typical data center server room 1, server racks A are arranged in a "face-to-face, back-to-back" manner, forming a closed cold aisle 11 and a closed hot aisle (rack exhaust duct) 10. One or more heat pipe air wall units 2 of the present invention are centrally arranged on the end wall on one side of the server room, and their air inlets are connected to the return air duct 12 inside the server room (or connected to the outdoor fresh air according to the mode selection).
[0022] like Figure 2 As shown, a single heat pipe fan wall unit 2 is a rectangular box structure. Inside the box, dozens of gravity-assisted heat pipes are arranged vertically. The lower part of the heat pipes (evaporation section 3) extends through the wall into the server rack exhaust duct 10 in the computer room, directly immersed in the hot airflow exhausted from the server. The middle part of the heat pipes (insulation section 4) is tightly wrapped by a thick insulation layer as it passes through the wall. The upper part of the heat pipes (condensation section 5) is located inside the box, with aluminum fins on its outer surface. An air inlet is provided at the bottom of the box, equipped with an air filter 7 and an air valve 8. Multiple parallel EC axial flow fans 6 are installed at the top of the box, forming a forced ventilation system. The lower end of the heat pipes is collected by a liquid collector 17, and the upper end is connected by a liquid distributor 18. The entire unit can be pushed in using the bottom support rail 19.
[0023] like Figure 3As shown, the control system 9 receives signals from the hot aisle temperature sensor, cold aisle temperature sensor, outdoor temperature and humidity sensor, and condenser section surface temperature sensor in the computer room. The control system (9) has a pre-stored control strategy mapping table corresponding to the outdoor temperature, humidity, and computer room heat load. Its built-in control logic is as follows: When the outdoor temperature is lower than the set threshold (e.g., 15°C) and the humidity is suitable, the control system completely shuts down the precision air conditioner, opens the air valve 8 and axial fan 6 of the heat pipe air wall unit, and adjusts the fan to a suitable speed, making full use of the outdoor cold air to dissipate heat through the heat pipe condenser section 5. When the outdoor temperature is in the middle range, the control system may adjust the air valve to mix in some computer room return air, or adjust the fan speed to match the heat load. When the outdoor temperature is too high or the humidity is too high, the control system reduces the axial fan speed of the heat pipe air wall or shuts down some units, while starting the precision air conditioner for supplementary cooling. At this time, the heat pipe air wall can still bear part of the basic load. The electric regulating valve 16 (if configured) can finely adjust the working fluid circulation volume according to the temperature difference between the evaporation section and the condensation section to achieve more precise heat transfer control.
[0024] Workflow: Hot air generated by the server operation is confined within the rack exhaust duct 10. The hot air flows through the heat pipe evaporator section 3, heating the working fluid inside and causing it to evaporate. The steam rises to the condenser section 5. At this point, the axial fan 6 starts, drawing in cool outdoor air (or a mixture of air) from the bottom, flowing through the finned condenser section 5, carrying away the condensation heat, and then exiting from the top. The condensed working fluid flows back to the evaporator section 3 under gravity, completing the cycle. Heat is thus efficiently and with low energy consumption transferred from inside the server room to the outside.
[0025] This invention combines high-efficiency heat pipe technology with modular air walls and intelligent control, providing a revolutionary heat dissipation solution for data centers. It is especially suitable for newly built green data centers or energy-saving renovations of existing data centers, with significant economic and social benefits.
[0026] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A heat pipe fan wall device for data center heat dissipation, characterized in that: It consists of a data center computer room (1), a heat pipe air wall unit (2), a heat pipe evaporation section (3), a heat pipe insulation section (4), a heat pipe condensation section (5), an axial flow fan unit (6), an air filter (7), an air valve (8), a control system (9), a cabinet exhaust duct (10), a cold aisle (11), a return air duct (12), a heat pipe fixing bracket (13), a temperature sensor (14), a humidity sensor (15), an electric regulating valve (16), a liquid collector (17), a liquid dispenser (18), and a bracket guide rail (19); The heat pipe wall unit (2) is arranged on one or both sides of the data center server room (1). Multiple independent heat pipes are vertically arranged in each heat pipe wall unit (2). The heat pipe evaporation section (3) is located inside the data center server room (1) and extends into the server rack exhaust duct (10). The heat pipe condensation section (5) is located inside the heat pipe wall unit (2). The heat pipe insulation section (4) passes through the server room wall and connects the heat pipe evaporation section (3) and the heat pipe condensation section (5). The heat pipe insulation section (4) is covered with insulation material. The axial flow fan unit (6) is arranged at the top or bottom of the heat pipe wall unit (2) and drives the external air to flow through the heat pipe condensation section (5). Air filtration The device (7) is located at the air inlet of the heat pipe air wall unit (2); the air valve (8) is located at the air inlet and / or air outlet; the control system (9) is connected to the temperature sensor (14), humidity sensor (15), axial flow fan unit (6), and electric regulating valve (16), and the control system (9) includes a PLC controller or a DDC controller; the heat pipe fixing bracket (13) is used to fix the heat pipe evaporation section (3) and the heat pipe condensation section (5); the liquid collector (17) and the liquid distributor (18) are respectively located at the lower and upper parts of the heat pipe evaporation section (3) to form a working fluid circulation in the heat pipe; the bracket guide rail (19) facilitates the installation and maintenance of the heat pipe air wall unit (2).
2. The heat pipe fan wall device for data center heat dissipation according to claim 1, characterized in that: The heat pipe wall unit (2) adopts a modular design. The heat pipes in a single unit are arranged vertically in a rectangular array or staggered manner, and the units can be spliced side by side.
3. A heat pipe fan wall device for data center heat dissipation according to claim 1, characterized in that: The heat pipe is a gravity-assisted heat pipe or a loop heat pipe, and the heat pipe is filled with a phase change working fluid, which is one of R134a, R410a or water.
4. A heat pipe fan wall device for data center heat dissipation according to claim 1, characterized in that: The axial flow fan unit (6) adopts an EC fan, which can steplessly adjust the speed according to the signal fed back by the temperature sensor (14).
5. A heat pipe fan wall device for data center heat dissipation according to claim 1, characterized in that: The control system (9) can automatically adjust the speed of the axial fan unit (6), the opening degree of the air valve (8) and the opening degree of the electric regulating valve (16) according to the temperature difference, humidity and surface temperature of the heat pipe condensation section (5) inside and outside the computer room, so as to achieve energy-saving operation.
6. A heat pipe fan wall device for data center heat dissipation according to claim 1, characterized in that: The outer surface of the heat pipe condenser section (5) is provided with fins or ribs to enhance air-side heat exchange.
7. A heat pipe fan wall device for data center heat dissipation according to claim 1, characterized in that: The device operates in conjunction with the existing air conditioning system of the data center, serving as the main cooling system during transitional seasons or winter, and as an auxiliary cooling system during summer.