Display panel, manufacturing method of display panel and electronic equipment

Abstract

The invention provides a display panel, a manufacturing method of the display panel and electronic equipment. The display panel comprises a substrate; a first organic layer on the substrate; the first organic layer is located on the substrate, the first inorganic layer is located on the side, away from the substrate, of the first organic layer, the first inorganic layer is provided with a first opening, the orthographic projection of the first opening on the substrate and the orthographic projection of the first organic layer on the substrate are at least partially overlapped, and the orthographic projection of the first opening on the substrate and the orthographic projection of the protective layer on the substrate are overlapped. The protective layer includes an inorganic material. By arranging the protective layer to cover the first opening of the first inorganic layer, a water vapor diffusion path at the first opening can be blocked, so that the yield of the display panel is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing the display panel, and an electronic device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0004] In order to overcome the above-mentioned shortcomings in the prior art, the purpose of this application is to provide a display panel, the display panel comprising:

[0005] Substrate;

[0006] The first organic layer located on the substrate;

[0007] A first inorganic layer is located on the side of the first organic layer away from the substrate. The first inorganic layer has a first opening. The orthographic projection of the first opening on the substrate and the orthographic projection of the first organic layer on the substrate at least partially overlap.

[0008] A protective layer located on the side of the first organic layer away from the substrate, wherein the orthographic projection of the first opening on the substrate overlaps with the orthographic projection of the protective layer on the substrate, and the protective layer comprises an inorganic material.

[0009] In some possible implementations, at least a portion of the protective layer is located within the first opening;

[0010] And / or, the orthographic projection of the first opening on the substrate lies within the orthographic projection of the protective layer on the substrate;

[0011] And / or, at least a portion of the protective layer is located on the side of the first inorganic layer away from the substrate;

[0012] And / or, the first opening exposes the first organic layer, and at least a portion of the protective layer is located on the side of the first organic layer exposed through the first opening that is away from the substrate;

[0013] And / or, the first organic layer includes a planarization layer;

[0014] And / or, the first organic layer includes an organic insulating layer;

[0015] And / or, the first inorganic layer includes a pixel defining layer, the pixel defining layer having at least a portion of a first opening; the pixel defining layer is an inorganic insulating layer;

[0016] And / or, the protective layer includes inorganic insulating materials;

[0017] And / or, the protective layer comes into contact with the first organic layer exposed through the first opening.

[0018] In some possible implementations, the first inorganic layer includes at least a portion of a membrane layer of an isolation structure, the at least portion of which encloses at least a portion forming the first opening and the isolation opening.

[0019] The display panel also includes light-emitting devices, at least a portion of which are located within an isolation opening;

[0020] Optionally, the display panel further includes a pixel defining layer, which has pixel openings, and the orthographic projection of the pixel openings on the substrate is located within the orthographic projection of the isolation openings on the substrate.

[0021] Optionally, the first inorganic layer further includes a pixel defining layer, and the first opening includes a first sub-opening and a second sub-opening that are connected together. The first sub-opening is located on the side of the second sub-opening away from the substrate. The isolation structure is provided with the first sub-opening, and the pixel defining layer is provided with the second sub-opening.

[0022] Optionally, the orthographic projection of the second sub-opening onto the substrate lies within the orthographic projection of the first sub-opening onto the substrate.

[0023] In some possible implementations, the protective layer contacts the first organic layer exposed through the first opening.

[0024] In some possible implementations, the display panel also includes an encapsulation portion located on the side of the light-emitting device away from the substrate;

[0025] The light-emitting device includes a first electrode, a light-emitting layer, and a second electrode, which are sequentially stacked along a direction away from the substrate;

[0026] The pixel opening exposes at least a portion of the first electrode;

[0027] The light-emitting device includes a first light-emitting device, and the protective layer includes multiple film layers. The multiple film layers in the protective layer are made of the same material as the light-emitting layer, the second electrode, and the encapsulation part corresponding to the first light-emitting device and are disposed in the same layer.

[0028] Optionally, the isolation structure is electrically connected to the second electrode.

[0029] In some possible implementations, the protective layer includes a first film layer, a second film layer and a third film layer stacked sequentially in a direction away from the substrate, wherein the orthographic projection of the first film layer on the substrate is located within the orthographic projection of the third film layer on the substrate;

[0030] The first membrane layer is broken at the sidewall of the isolation structure facing the first sub-opening; the second membrane layer is broken at the sidewall of the isolation structure facing the first sub-opening; the third membrane layer is continuous at the sidewall of the isolation structure facing the first sub-opening.

[0031] The first film layer and the light-emitting layer of the first light-emitting device are made of the same material and are disposed in the same layer;

[0032] The second film layer and the second electrode of the first light-emitting device are made of the same material and are disposed in the same layer;

[0033] The third film layer and the encapsulation part corresponding to the first light-emitting device are made of the same material and are disposed in the same layer;

[0034] Optionally, there are multiple first openings, the first film layers in two adjacent first openings are discontinuously arranged, the second film layers in two adjacent first openings are discontinuously arranged, and the third film layers in at least two adjacent first openings are continuously arranged.

[0035] Optionally, the isolation structure includes a conductive material; the second film layer is electrically connected to the isolation structure;

[0036] Optionally, the isolation structure includes a metal layer, and the second film layer is in contact with the metal layer;

[0037] Optionally, the light-emitting device further includes a second light-emitting device, the second light-emitting device having a different light-emitting color than the first light-emitting device; the first light-emitting device and the second light-emitting device have different isolation openings; the first light-emitting device and the second light-emitting device have different encapsulation parts; and the materials of the first film layer and the light-emitting layer of the second light-emitting device are different.

[0038] Optionally, the light-emitting device further includes a third light-emitting device, wherein the first, second, and third light-emitting devices emit different colors; the first, second, and third light-emitting devices correspond to different isolation openings; the first, second, and third light-emitting devices correspond to different encapsulation parts; and the materials of the first film layer and the light-emitting layer of the third light-emitting device are different.

[0039] Optionally, the isolation structure includes a support portion and a shielding portion located on the side of the support portion away from the substrate, wherein the end of the shielding portion near the first opening protrudes from the end of the support portion near the first opening.

[0040] Optionally, at the first opening, the orthographic projection of the side of the isolation structure closer to the substrate onto the substrate lies within the orthographic projection of the side of the isolation structure farther from the substrate onto the substrate.

[0041] In some possible implementations, at least a portion of the third film extends from within the first opening to the side of the isolation structure away from the substrate;

[0042] The first film layer includes a first sub-section located within a first opening and a second sub-section located on the side of the isolation structure away from the substrate; the first sub-section and the second sub-section are discontinuously disposed.

[0043] The second film layer includes a third sub-section located within the first opening and a fourth sub-section located on the side of the isolation structure away from the substrate; the third sub-section and the fourth sub-section are discontinuously arranged.

[0044] Optionally, at least a portion of the second sub-part is located between adjacent first openings; at least a portion of the fourth sub-part is located between adjacent first openings;

[0045] Optionally, at least a portion of the second sub-part is disposed around the first opening; at least a portion of the fourth sub-part is disposed around the first opening.

[0046] In some possible implementations, the first inorganic layer is provided with multiple first openings, and the protective layers corresponding to the multiple first openings are interconnected.

[0047] In some possible implementations, the display panel also includes an organic encapsulation layer located on the side of the protective layer away from the substrate;

[0048] Optionally, the display panel may also include an inorganic encapsulation layer located on the side of the organic encapsulation layer away from the substrate;

[0049] Optionally, the display panel may also include:

[0050] An isolation structure, wherein at least a portion of the isolation structure encloses an isolation opening;

[0051] A light-emitting device, at least a portion of which is located within an isolation opening;

[0052] The packaging section is located on the side of the light-emitting device away from the substrate, and the organic encapsulation layer is located on the side of the packaging section away from the substrate;

[0053] Optionally, at least a portion of the protective layer is located on the side of at least a portion of the package that is away from the substrate.

[0054] Optionally, at least a portion of the protective layer is located on the side of at least a portion of the package that is away from the substrate; or, at least a portion of the protective layer is disposed in the same layer as at least a portion of the package and is integrally formed; or, the orthographic projection of the protective layer on the substrate is located outside the orthographic projection of the isolation opening on the substrate.

[0055] Optionally, the light-emitting device includes a first light-emitting device and a second light-emitting device with different light-emitting colors.

[0056] The protective layer covers the side of the package corresponding to the first light-emitting device that is away from the substrate, and the orthographic projection of the protective layer on the substrate is outside the orthographic projection of the second light-emitting device on the substrate;

[0057] Alternatively, the protective layer covers the packaging portion corresponding to the first light-emitting device and the packaging portion corresponding to the second light-emitting device on the side away from the substrate;

[0058] Optionally, the first inorganic layer includes at least a portion of the membrane layer of the isolation structure, the at least portion of the isolation structure enclosing at least a portion of the first opening;

[0059] The isolation structure includes a support portion and a shielding portion located on the side of the support portion away from the substrate. The end of the shielding portion near the first opening protrudes from or is flush with the end of the support portion near the first opening. In some possible implementations, the display panel includes a display area and a non-display area, with the first opening located in the non-display area.

[0060] Optionally, the non-display area includes a bezel area located on at least one side of the display area, and / or, the non-display area includes a light-transmitting hole and a transition area located between the light-transmitting hole and the display area; the first opening is located in the bezel area and / or the transition area.

[0061] Optionally, the display panel may also include:

[0062] An isolation structure, wherein at least a portion of the isolation structure encloses an isolation opening;

[0063] A light-emitting device, at least a portion of which is located within an isolation opening, is located in a display area.

[0064] In some possible implementations, the isolation structure includes a support portion and a shielding portion located on the side of the support portion away from the substrate, wherein the orthographic projection of the end of the support portion near the isolation opening on the substrate is located within the orthographic projection of the end of the shielding portion near the isolation opening on the substrate.

[0065] Alternatively, the corrosion resistance of the support portion is weaker than that of the shielding portion;

[0066] Optionally, the material of the support portion includes metal, and / or the material of the shielding portion includes metal;

[0067] Optionally, the material of the support portion includes aluminum, and / or the material of the shielding portion includes titanium;

[0068] Optionally, the isolation structure also includes a receiving portion located between the support and the substrate;

[0069] Optionally, the orthographic projection of the end of the support near the isolation opening on the substrate is located within the orthographic projection of the end of the receiving portion near the isolation opening on the substrate;

[0070] Optionally, the orthographic projection of the end of the receiving portion near the isolation opening on the substrate is located within the orthographic projection of the end of the shielding portion near the isolation opening on the substrate.

[0071] Optionally, the material of the receiving part may include molybdenum.

[0072] Another object of this application is to provide a method for manufacturing a display panel, the method comprising:

[0073] Provide substrate;

[0074] A first organic layer is formed on the substrate;

[0075] A first inorganic layer is formed on the side of the first organic layer away from the substrate. The first inorganic layer has a first opening, and the orthographic projection of the first opening on the substrate and the orthographic projection of the first organic layer on the substrate at least partially overlap.

[0076] A protective layer is formed, and the orthographic projection of the first opening on the substrate overlaps with the orthographic projection of the protective layer on the substrate.

[0077] In some possible implementations, the first inorganic layer includes at least a portion of the insulating structure; the step of forming the first inorganic layer on the side of the first organic layer away from the substrate includes:

[0078] An isolation structure is formed on the side of the first organic layer away from the substrate, and at least a portion of the isolation structure encloses at least a portion of the first opening and the isolation opening; the isolation opening includes a first isolation opening and a second isolation opening;

[0079] Before the protective layer is formed, the manufacturing process also includes:

[0080] A light-emitting layer, a second electrode, and a corresponding encapsulation portion for the second light-emitting device are formed in the second isolation opening;

[0081] A light-emitting material layer, an electrode material layer, and an encapsulation material layer corresponding to the first light-emitting device are formed, and the orthogonal projections of the light-emitting material layer, the electrode material layer, and the encapsulation material layer on the substrate are offset from the orthogonal projections of the first opening on the substrate.

[0082] Optionally, the protective layer covers the first opening; the orthographic projection of the first opening onto the substrate lies within the orthographic projection of the protective layer onto the substrate.

[0083] Optionally, the manufacturing method may further include, before or after the formation of the protective layer:

[0084] Patterned etching is performed on the light-emitting material layer, electrode material layer and encapsulation material layer to form the light-emitting layer of the first light-emitting device, the second electrode and the encapsulation part corresponding to the first light-emitting device located in the first isolation opening;

[0085] Optionally, the first light-emitting device and the second light-emitting device emit different colors;

[0086] Optionally, the first light-emitting device is the light-emitting device of the last color prepared;

[0087] Optionally, after forming the protective layer, and / or after forming the encapsulation portion corresponding to the first light-emitting device, the manufacturing method further includes:

[0088] An organic encapsulation layer is formed on the side of the protective layer away from the substrate;

[0089] Optionally, the protective layer covers the side of the package corresponding to the first light-emitting device away from the substrate, and the orthographic projection of the protective layer on the substrate is outside the orthographic projection of the second light-emitting device on the substrate;

[0090] Alternatively, the protective layer covers the packaging portion corresponding to the first light-emitting device and the packaging portion corresponding to the second light-emitting device on the side away from the substrate;

[0091] Optionally, the isolation opening may also include a third isolation opening;

[0092] Before forming the light-emitting material layer, electrode material layer, and encapsulation material layer corresponding to the first light-emitting device, the method further includes:

[0093] A light-emitting layer, a second electrode, and a corresponding encapsulation part for the third light-emitting device are formed in the third isolation opening; the first, second, and third light-emitting devices emit different colors.

[0094] In some possible implementations, the first inorganic layer includes at least a portion of the insulating structure; the step of forming the first inorganic layer on the side of the first organic layer away from the substrate includes:

[0095] An isolation structure is formed on the side of the first organic layer away from the substrate. At least a portion of the isolation structure encloses at least a portion of the first opening and the isolation opening. The isolation opening includes the first isolation opening and the second isolation opening.

[0096] A light-emitting layer, a second electrode, and a corresponding encapsulation portion for the second light-emitting device are formed in the second isolation opening;

[0097] A light-emitting material layer, an electrode material layer, and an encapsulation material layer corresponding to the first light-emitting device are formed. The first isolation opening, the second isolation opening, and the orthogonal projection of the first opening on the substrate are located within the orthogonal projection of the light-emitting material layer, the electrode material layer, and the encapsulation material layer on the substrate.

[0098] An etchable barrier material is provided to cover the first isolation opening and the first opening;

[0099] The light-emitting material layer, electrode material layer and encapsulation material layer located in the second isolation opening are etched, while the first isolation opening and the light-emitting material layer, electrode material layer and encapsulation material layer of the first opening are retained, forming the light-emitting layer of the first light-emitting device, the second electrode and the encapsulation part corresponding to the first light-emitting device located in the first isolation opening, and forming a protective layer located in the first opening.

[0100] Optionally, the first light-emitting device and the second light-emitting device emit different colors;

[0101] Optionally, the first light-emitting device is the light-emitting device of the last color prepared;

[0102] Optionally, the isolation opening may also include a third isolation opening;

[0103] Before forming the light-emitting material layer, electrode material layer, and encapsulation material layer corresponding to the first light-emitting device, the method further includes:

[0104] A light-emitting layer, a second electrode, and a corresponding encapsulation part for the third light-emitting device are formed in the third isolation opening; the first, second, and third light-emitting devices emit different colors.

[0105] Another object of this application is to provide an electronic device, which includes the display panel provided in this application, or the electronic device includes a display panel made by the manufacturing method of the display panel provided in this application.

[0106] Compared with the prior art, this application has the following beneficial effects:

[0107] This application provides a display panel, a method for manufacturing the display panel, and an electronic device. By providing a protective layer to cover the first opening of the first organic layer, the diffusion path of water vapor at the first opening can be blocked, thereby improving the yield of the display panel. Attached Figure Description

[0108] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0109] Figure 1 This is one of the cross-sectional schematic diagrams of the display panel provided in this embodiment;

[0110] Figure 2 This is a second cross-sectional schematic diagram of the display panel provided in this embodiment;

[0111] Figure 3 This is the third cross-sectional schematic diagram of the display panel provided in this embodiment;

[0112] Figure 4 This is the fourth cross-sectional schematic diagram of the display panel provided in this embodiment;

[0113] Figure 5This is a top view of the display panel area provided in this embodiment;

[0114] Figure 6 Fifth cross-sectional schematic diagram of the display panel provided in this embodiment;

[0115] Figure 7 This is the sixth cross-sectional schematic diagram of the display panel provided in this embodiment;

[0116] Figure 8 This is the seventh cross-sectional schematic diagram of the display panel provided in this embodiment;

[0117] Figure 9 This is the eighth cross-sectional schematic diagram of the display panel provided in this embodiment;

[0118] Figure 10 This is the ninth cross-sectional schematic diagram of the display panel provided in this embodiment;

[0119] Figure 11 This is the tenth cross-sectional schematic diagram of the display panel provided in this embodiment;

[0120] Figure 12 This is eleventh of the cross-sectional schematic diagrams of the display panel provided in this embodiment;

[0121] Figure 13 This is one of the schematic diagrams of the isolation structure provided in this embodiment;

[0122] Figure 14 This is the second schematic diagram of the isolation structure provided in this embodiment;

[0123] Figure 15 This is a flowchart illustrating the steps of the manufacturing method for the display panel provided in this embodiment;

[0124] Figure 16 This is one of the schematic diagrams illustrating the manufacturing process of the display panel provided in this embodiment;

[0125] Figure 17 This is the second schematic diagram of the manufacturing process of the display panel provided in this embodiment;

[0126] Figure 18 This is the third schematic diagram illustrating the manufacturing process of the display panel provided in this embodiment;

[0127] Figure 19 This is the fourth schematic diagram illustrating the manufacturing process of the display panel provided in this embodiment;

[0128] Figure 20 Fifth schematic diagram of the manufacturing process of the display panel provided in this embodiment;

[0129] Figure 21 This is the sixth schematic diagram of the manufacturing process of the display panel provided in this embodiment.

[0130] Icons: 111-Substrate; 112-Array functional layer; 1121-First organic layer; 1122-Trace; 120-First electrode; 600-First inorganic layer; 601-First opening; 130-Pixel defining layer; 1301-Second sub-opening; 1302-Pixel opening; 140-Isolation structure; 1401-First sub-opening; 1402-Isolation opening; 910-First isolation opening; 920-Second isolation opening; 930-Third isolation opening; 141-Support; 142-Shielding; 143-Receiving; 801-Light-emitting device; 8011-First light-emitting device; 8012-First... Second light-emitting device; 8013 - Third light-emitting device; 150 - Light-emitting layer; 154 - First film layer; 1541 - First sub-section; 1542 - Second sub-section; 160 - Second electrode; 164 - Second film layer; 1641 - Third sub-section; 1642 - Fourth sub-section; 170 - Encapsulation section; 174 - Third film layer; 700 - Protective layer; 180 - Organic encapsulation layer; 190 - Inorganic encapsulation layer; 1501 - Light-emitting material layer; 1601 - Electrode material layer; 1701 - Encapsulation material layer; 501 - Etching barrier material; AA - Display area; NA1 - Bezel area; HA - Light-transmitting hole; NA2 - Transition area. Detailed Implementation

[0131] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0132] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0133] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0134] In the description of this application, it should be noted that the terms "center," "upper," "lower," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0135] It should be noted that, where there is no conflict, different features in the embodiments of this application may be partially or completely combined with each other.

[0136] In some display panels, the array substrate includes one or more organic insulating layers (e.g., planarization layers), and an inorganic layer (e.g., an inorganic insulating layer) may be disposed on top of the organic insulating layer. In this case, moisture absorbed by the organic insulating layer during manufacturing cannot be released through the inorganic layer (e.g., the inorganic insulating layer) during subsequent high-temperature manufacturing steps, which can cause bulging of the film layer, leading to film peeling and affecting the yield of the display panel.

[0137] Therefore, in some display panels, vents are created on the inorganic layer (e.g., the inorganic insulating layer) to expose the organic insulating layer, allowing moisture released from the organic insulating layer during manufacturing to escape through these vents. However, moisture generated during the manufacturing of other layers above the inorganic layer can also seep into the organic insulating layer through these vents. After the organic encapsulation layer is subsequently applied, the organic insulating layer comes into contact with the organic encapsulation layer, and moisture may further diffuse from the organic insulating layer through the organic encapsulation layer to the display area, affecting the overall encapsulation effect of the display panel.

[0138] In view of this, this embodiment provides a solution to reduce moisture diffusion in the display panel. The solution provided in this embodiment will be described in detail below.

[0139] Please see Figure 1 , Figure 1 This is a schematic diagram of a display panel provided in this embodiment. The display panel may include a substrate 111, a first organic layer 1121, a first inorganic layer 600, and a protective layer 700.

[0140] In this embodiment, the material of the substrate 111 may include a rigid material, such as glass. Alternatively, the material of the substrate 111 may include a flexible material, such as polyimide (PI).

[0141] The first organic layer 1121 is located on the substrate 111. For example, an array functional layer 112 may be disposed on the substrate 111. The array functional layer 112 may include multiple film layer structures, such as a buffer layer, an active layer, multiple conductive layers, multiple insulating layers, and a planarization layer. The multiple film layer structures of the array functional layer 112 can form multiple thin-film transistors (TFTs) at different locations. The thin-film transistors can cooperate with each other to form multiple pixel driving units or driving circuits.

[0142] The first organic layer 1121 may be the layer furthest from the substrate 111 among the multiple layers of the array functional layers 112. Optionally, the first organic layer 1121 may include an organic insulating layer. In this embodiment, the material of the first organic layer 1121 may include an organic insulating material; for example, the first organic layer 1121 may include a planarization layer.

[0143] Optionally, in this embodiment, the array functional layer 112 may further include traces 1122 covered by the first organic layer 1121 or other insulating layers.

[0144] The first inorganic layer 600 is located on the side of the first organic layer 1121 away from the substrate 111. The first inorganic layer 600 has a first opening 601, and the orthographic projection of the first opening 601 on the substrate 111 at least partially overlaps with the orthographic projection of the first organic layer 1121 on the substrate 111. The first opening 601 can penetrate the first inorganic layer 600. For example, when the first opening 601 penetrates the first inorganic layer 600, the first opening 601 exposes the first organic layer 1121. Optionally, in this embodiment, the first inorganic layer 600 may have multiple first openings 601, which may be concentrated in one area or distributed in different areas. For example, the first opening 601 exposes the first organic layer 1121, and at least a portion of the protective layer 700 is located on the side of the first organic layer 1121 exposed through the first opening 601 away from the substrate 111. Optionally, the orthographic projection of the first opening 601 on the substrate 111 lies within the orthographic projection of the first organic layer 1121 on the substrate 111. The first opening 601 can function as a vent hole, used to expel water vapor generated by the first organic layer 1121. For example, during the vapor deposition of luminescent materials or electrode materials, the first opening 601 can expel water vapor generated by the first organic layer 1121.

[0145] Optionally, the protective layers 700 corresponding to the multiple first openings 601 are interconnected and integrally formed, which is equivalent to the multiple first openings 601 sharing the same protective layer.

[0146] Optionally, in this embodiment, the material of the first inorganic layer 600 may include inorganic materials. In this embodiment, the inorganic materials include inorganic compounds and / or elemental metals. The material of the first inorganic layer 600 may include inorganic insulating materials, such as one or more of silicon oxide, silicon nitride, and silicon oxynitride.

[0147] The protective layer 700 is located on the side of the first organic layer 1121 away from the substrate 111. The orthographic projection of the first opening 601 on the substrate 111 overlaps with the orthographic projection of the protective layer 700 on the substrate 111; for example, the orthographic projection of the first opening 601 on the substrate 111 is located within the orthographic projection of the protective layer 700 on the substrate 111. For example, at least a portion of the protective layer 700 is located on the side of the first inorganic layer 600 away from the substrate 111. For example, at least a portion of the protective layer 700 is in contact with the first inorganic layer 600. For example, the overlapping region of the orthographic projections of the first opening 601 and the first organic layer 1121 on the substrate 111 overlaps with the orthographic projection of the protective layer 700 on the substrate 111. For example, the overlapping region of the orthographic projections of the first opening 601 and the first organic layer 1121 on the substrate 111 is located within the orthographic projection of the protective layer 700 on the substrate 111.

[0148] Optionally, at least a portion of the protective layer 700 is located within the first opening 601. For example, if the first organic layer 1121 is exposed through the first opening 601, at least a portion of the protective layer 700 extends into the first opening 601 and is located on the side of the first organic layer 1121 exposed through the first opening 601 away from the substrate 111. That is, at least a portion of the protective layer 700 extends into the first opening 601 and covers the first organic layer 1121 exposed through the first opening 601.

[0149] In this embodiment, the material of the protective layer 700 may include inorganic materials. For example, the material of the protective layer 700 may include inorganic insulating materials, such as one or more of silicon oxide, silicon nitride, and silicon oxynitride.

[0150] Based on the above design, in the display panel provided in this embodiment, by setting a protective layer 700 to cover the first opening 601 of the first inorganic layer 600, the water vapor diffusion path at the first opening 601 can be blocked, and water vapor generated during the manufacturing process of other film layers after the preparation of the first inorganic layer 600 can be prevented from invading the first organic layer 1121, thereby avoiding water vapor diffusion or reducing the risk of water vapor diffusion and improving the yield of the display panel.

[0151] For some possible implementation methods, please refer to Figure 2 The first inorganic layer 600 may include a pixel defining layer 130, which has at least a portion of a first opening 601 and is an inorganic insulating layer.

[0152] See also some possible implementations. Figure 3 The first inorganic layer 600 includes at least a portion of the film layer of the isolation structure 140. The first inorganic layer 600 includes a portion or all of the film layer of the isolation structure 140. This is related to patent applications CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN117979755A, and CN117998900A. CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A describe relevant technical solutions for the isolation structure 140 (or partition structure or isolation column), the contents of which are incorporated herein by reference.

[0153] At least a portion of the isolation structure 140 encloses at least a portion of the first opening 601 and the isolation opening 1402.

[0154] Optionally, please see again Figure 1 The display panel also includes a pixel defining layer 130, which has a pixel opening 1302. The orthographic projection of the pixel opening 1302 onto the substrate 111 is located within the orthographic projection of the isolation opening 1402 onto the substrate 111. That is, the pixel opening 1302 and the corresponding isolation opening 1402 are connected.

[0155] Please see Figure 3 The display panel also includes a light-emitting device 801, at least a portion of which is located within an isolation opening 1402. For example, the isolation opening 1402 includes a first isolation opening 910, a second isolation opening 920, and a third isolation opening 930, and the light-emitting device 801 includes a first light-emitting device 8011, a second light-emitting device 8012, and a third light-emitting device 8013, at least a portion of the first light-emitting device 8011 being located within the first isolation opening 910, at least a portion of the second light-emitting device 8012 being located within the second isolation opening 920, and at least a portion of the third light-emitting device 8013 being located within the third isolation opening 930.

[0156] Please see again Figure 1The first inorganic layer 600 further includes a pixel defining layer 130. The first opening 601 includes a first sub-opening 1401 and a second sub-opening 1301 that are connected together. The first sub-opening 1401 is located on the side of the second sub-opening 1301 away from the substrate 111. The isolation structure 140 is provided with the first sub-opening 1401, and the pixel defining layer 130 is provided with the second sub-opening 1301. That is, the first sub-opening 1401 and the second sub-opening 1301 are connected. For example, the orthographic projection of the second sub-opening 1301 on the substrate 111 is located within the orthographic projection of the first sub-opening 1401 on the substrate 111. For example, the orthographic projection area of ​​the second sub-opening 1301 on the substrate 111 is smaller than the orthographic projection area of ​​the first sub-opening 1401 on the substrate 111.

[0157] The first inorganic layer 600 may include at least a portion of the film layer of the isolation structure 140 and one or both of the pixel defining layer 130. Optionally, the pixel defining layer 130 may be continuously disposed in the first opening 601, that is, the pixel defining layer 130 may not have a second sub-opening 1301 in the first opening 601, or the pixel defining layer 130 may have a second sub-opening 1301 in the first opening 601, or there may be no pixel defining layer 130 at the first opening 601.

[0158] At least part of the first opening 60 includes a first type of first opening separately disposed in the pixel defining layer 130, such as Figure 2 As shown. At least a portion of the first opening 601 includes a second type of first opening separately disposed in the isolation structure 140, such as Figure 3 As shown. At least a portion of the first opening 601 includes a third type of first opening disposed in at least a portion of the film layer of the isolation structure 140 and the pixel defining layer 130 stacked along the thickness direction Z of the substrate, such as Figure 1 As shown. The same protective layer 700 may cover one or more of the first type first opening, the second type first opening, and the third type first opening.

[0159] In some possible implementations, the display panel includes a display area and a non-display area, with the first opening 601 located in the non-display area.

[0160] Optionally, please see Figure 5 The non-display area includes a border area NA1 located on at least one side of the display area AA. For example, when the display area AA is rectangular, the border area NA1 may be one of four border areas NA1 surrounding the display area AA. The first opening 601 may be located in one or more of these border areas NA1.

[0161] And / or, the non-display area NA includes a light-transmitting hole HA (e.g., a hole for setting an under-display camera or an under-display light sensor) and a transition area NA2 located between the light-transmitting hole HA and the display area AA, wherein the first opening 601 may be located in the transition area NA2.

[0162] Optionally, at least a portion of the isolation structure 140 encloses an isolation opening 1402. The isolation opening 1402 included in the isolation structure 140 may be located in the display area, and at least a portion of the light-emitting device 801 is located within the isolation opening 1402, that is, the light-emitting device 801 is located in the display area AA.

[0163] Optionally, the display panel also includes an encapsulation portion 170 located on the side of the light-emitting device 801 away from the substrate 111.

[0164] For some possible implementations, please refer again. Figure 1 The display panel provided in this embodiment also includes an organic encapsulation layer 180 located on the side of the protective layer 700 away from the substrate 111.

[0165] Please see Figure 4 In the case where the display panel provided in this embodiment has an isolation structure 140 and a light-emitting device 801, the display panel may further include an encapsulation portion 170 located on the side of the light-emitting device 801 away from the substrate 111. The organic encapsulation layer 180 is also located on the side of the encapsulation portion 170 away from the substrate 111.

[0166] In this embodiment, the protective layer 700 separates the first organic layer 1121 and the organic encapsulation layer 180, thereby blocking the moisture diffusion path between the first organic layer 1121 and the organic encapsulation layer 180 and preventing moisture from diffusing to the display area AA through the organic encapsulation layer 180.

[0167] For some possible implementations, please refer again. Figure 1 The protective layer 700 comes into contact with the first organic layer 1121 exposed through the first opening 601.

[0168] Optionally, please see Figure 6In one example, at the first opening 601, the orthographic projection of the side of the isolation structure 140 near the substrate 111 onto the substrate 111 lies within the orthographic projection of the side of the isolation structure 140 away from the substrate 111 onto the substrate 111. That is, at the first opening 601, the isolation structure 140 forms an undercut structure. The orthographic projection of the cross-section of the first opening 601 on the side away from the substrate 111 onto the substrate 111 lies within the orthographic projection of the cross-section of the first opening 601 on the side near the substrate 111 onto the substrate 111. The orthographic projection area of ​​the cross-section of the first opening 601 on the side away from the substrate 111 onto the substrate 111 is smaller than the orthographic projection area of ​​the cross-section of the first opening 601 on the side near the substrate 111 onto the substrate 111. The cross-section may be parallel to the substrate 111. For example, the first inorganic layer 600 also includes at least a portion of the film layer of the isolation structure 140, the at least portion of the isolation structure 140 enclosing at least a portion of the first opening 601; the isolation structure 140 includes a support portion 141 and a shielding portion 142 located on the side of the support portion 141 away from the substrate 111, the end of the shielding portion 142 near the first opening 601 protruding from the end of the support portion 141 near the first opening 601.

[0169] Alternatively, please see Figure 1 In another example, at the first opening 601, the side of the isolation structure 140 closest to the substrate 111 and the side of the isolation structure 140 furthest from the substrate 111 are flush. That is, at the first opening 601, the isolation structure 140 may not form an undercut structure. For example, the end of the support portion 141 near the first opening 601 may be flush with or protrude from the end of the shielding portion 142 near the first opening 601. Optionally, see [link to relevant documentation]. Figure 7 At least a portion of the protective layer 700 may be located on the side of at least a portion of the encapsulation portion 170 away from the substrate 111. For example, in the case where the display panel includes a plurality of light-emitting devices 801, the protective layer 700 may cover at least a portion of the encapsulation portion 170 corresponding to the light-emitting devices 801, or the protective layer 700 may cover all the encapsulation portions 170 corresponding to the light-emitting devices 801.

[0170] For example, the light-emitting device 801 includes a first light-emitting device 8011 and a second light-emitting device 8012 with different light-emitting colors. The protective layer 700 covers the side of the encapsulation portion corresponding to the first light-emitting device 8011 away from the substrate 111, and the orthogonal projection of the protective layer 700 on the substrate 111 is outside the orthogonal projection of the second light-emitting device 8012 on the substrate 111; or, the protective layer 700 covers the side of the encapsulation portion 170 corresponding to the first light-emitting device 8011 and the encapsulation portion 170 corresponding to the second light-emitting device 8012 away from the substrate.

[0171] For some other possible implementations, please refer to Figure 4 and Figure 8The display panel also includes an encapsulation portion 170 located on the side of the light-emitting device 801 away from the substrate 111. The encapsulation portion 170 may include inorganic materials. The encapsulation portion 170 may include inorganic insulating materials. For example, at least a portion of the protective layer 700 is disposed in the same layer as at least a portion of the encapsulation portion 170 and is integrally formed. For example, at least a portion of the protective layer 700 is disposed in the same layer as the encapsulation portion 170 and is interconnected with it.

[0172] In some other possible implementations, the orthographic projection of the protective layer 700 onto the substrate 111 is outside the orthographic projection of the isolation opening 1402 onto the substrate 111. For example, the protective layer 700 and the package portion 170 are disposed in different layers.

[0173] The light-emitting device 801 may include a first electrode 120, a light-emitting layer 150, and a second electrode 160 sequentially stacked along a direction Z away from the substrate 111. The pixel opening 1302 exposes at least a portion of the first electrode 120.

[0174] For example, the first electrodes 120 of each light-emitting device 801 may be disposed at intervals on the side of the array functional layer 112 away from the substrate 111, and the pixel defining layer 130 may cover the edge of the first electrode 120 and expose the central region of the first electrode 120. The light-emitting layer 150 and the second electrode 160 of the light-emitting device 801 extend into the pixel opening 1302 to cover the exposed first electrode 120.

[0175] The light-emitting device 801 includes a first light-emitting device 8011, and the protective layer 700 includes multiple film layers. The multiple film layers in the protective layer 700 are made of the same material as the light-emitting layer 150, the second electrode 160, and the encapsulation part 170 corresponding to the first light-emitting device 8011, and are disposed in the same layer. Multiple structures disposed in the same layer can be obtained by patterning the same film layer, thereby simplifying the process.

[0176] Optionally, the isolation structure 140 is electrically connected to the second electrode 160. For example, the second electrodes 160 of multiple light-emitting devices 801 are electrically connected through the isolation structure 140. For example, the second electrodes 160 of multiple light-emitting devices 801 with different emission colors are electrically connected through the isolation structure 140.

[0177] See also some possible implementations. Figure 8 and Figure 9 The protective layer 700 includes a first film layer 154, a second film layer 164, and a third film layer 174 sequentially stacked along a direction Z away from the substrate 111. For example, the orthographic projection of the first film layer 154 on the substrate 111 is located within the orthographic projection of the third film layer 174 on the substrate 111.

[0178] The first membrane layer 154 is broken at the sidewall of the isolation structure 140 facing the first sub-opening 1401. The second membrane layer 164 is broken at the sidewall of the isolation structure 140 facing the first sub-opening 1401. The third membrane layer 174 is continuous at the sidewall of the isolation structure 140 facing the first sub-opening 1401.

[0179] The first film layer 154 and the light-emitting layer 150 of the first light-emitting device 8011 are made of the same material and are disposed in the same layer. The second film layer 164 and the second electrode 160 of the first light-emitting device 8011 are made of the same material and are disposed in the same layer. The third film layer 174 and the encapsulation portion 170 corresponding to the first light-emitting device 8011 are made of the same material and are disposed in the same layer. That is, in this embodiment, at least one encapsulation portion 170 corresponding to the light-emitting device 801 can be reused as a protective layer 700.

[0180] Furthermore, in some possible implementations, at the first opening 601, the orthographic projection of the side of the isolation structure 140 near the substrate 111 onto the substrate 111 lies within the orthographic projection of the side of the isolation structure 140 away from the substrate 111 onto the substrate 111. That is, at the first opening 601, the isolation structure 140 forms an undercut structure. For example, the end of the shielding portion 142 in the isolation structure 140 near the first opening 601 protrudes beyond the end of the support portion 141 near the first opening 601.

[0181] Alternatively, in some possible implementations, please refer again. Figure 4 At the location facing the isolation opening 1402, the orthographic projection of the side of the isolation structure 140 closest to the substrate 111 onto the substrate 111 lies within the orthographic projection of the side of the isolation structure 140 furthest from the substrate 111 onto the substrate 111. That is, at the location facing the isolation opening 1402, the isolation structure 140 also forms an undercut structure. The undercut structures at the isolation opening 1402 and the first sub-opening 1401 can be formed in the same side-etching process.

[0182] In this case, since the isolation structure 140 has an undercut structure facing the first opening 601, the first film layer 154 formed by vapor deposition is broken at the undercut structure, so that the first film layer 154 located in the first sub-opening 1401 can be completely covered by the protective layer 700, avoiding contact between the first film layer 154 and the organic encapsulation layer 180, thereby blocking the water vapor diffusion path between the first film layer 154 and the organic encapsulation layer 180, and preventing water vapor from diffusing from the first organic layer 1121 through the first film layer 154 to the organic encapsulation layer 180.

[0183] Optionally, the light-emitting device 801 further includes a second light-emitting device 8012, the emission color of which is different from that of the first light-emitting device 8011. The first light-emitting device 8011 and the second light-emitting device 8012 correspond to different isolation openings 1402, and the first light-emitting device 8011 and the second light-emitting device 8012 correspond to different encapsulation portions 170. The first film layer 154 and the light-emitting layer 150 of the second light-emitting device 8012 are made of different materials.

[0184] Optionally, the light-emitting device 801 further includes a third light-emitting device 8013, and the first light-emitting device 8011, the second light-emitting device 8012, and the third light-emitting device 8013 emit different colors. The first light-emitting device 8011, the second light-emitting device 8012, and the third light-emitting device 8013 correspond to different isolation openings 1402, and the first light-emitting device 8011, the second light-emitting device 8012, and the third light-emitting device 8013 correspond to different encapsulation portions 170. The first film layer 154 and the light-emitting layer 150 of the third light-emitting device 8013 are made of different materials.

[0185] That is, in this embodiment, when the display panel has at least two kinds of light-emitting devices 801, the encapsulation part 170 corresponding to one of the color light-emitting devices 801 can be reused as the protective layer 700.

[0186] Optionally, please see again Figure 9 There are multiple first openings 601, the first film layer 154 in two adjacent first openings 601 is intermittently arranged, the second film layer 164 in two adjacent first openings 601 is intermittently arranged, and the third film layer 174 in at least two adjacent first openings 601 is continuously arranged.

[0187] The second film layer 164 contacts the sidewall of the isolation structure 140. Optionally, the isolation structure 140 includes a conductive material; the second film layer 164 is electrically connected to the isolation structure 140. For example, the isolation structure 140 includes a metal layer, and the second film layer 164 contacts the metal layer. This arrangement reduces line impedance and improves package reliability.

[0188] See also some possible implementations. Figure 9 At least a portion of the third film layer 174 extends from within the first opening 601 to the side of the isolation structure 140 away from the substrate 111.

[0189] In this case, the first film layer 154 includes a first sub-part 1541 located within the first opening 601 and a second sub-part 1542 located on the side of the isolation structure 140 away from the substrate 111; the first sub-part 1541 and the second sub-part 1542 are intermittently arranged.

[0190] The second film layer 164 includes a third sub-section 1641 located within the first opening 601 and a fourth sub-section 1642 located on the side of the isolation structure 140 away from the substrate 111; the third sub-section 1641 and the fourth sub-section 1642 are intermittently arranged.

[0191] Optionally, at least a portion of the second sub-part 1542 is located between adjacent first openings 601; at least a portion of the fourth sub-part 1642 is located between adjacent first openings 601. Optionally, at least a portion of the second sub-part 1542 is disposed around the first opening 601; at least a portion of the fourth sub-part 1642 is disposed around the first opening 601.

[0192] That is, in this embodiment, during the etching process to form the first light-emitting device 8011, the encapsulation material layer at the first sub-opening 1401 can be retained to form the third film layer 174. In this case, since the third film layer 174 and the etching barrier material (e.g., photoresist) on the side of the third film layer 174 away from the substrate 111 block the etching of the light-emitting material layer and the electrode material layer, the light-emitting material layer and the electrode material layer located within the first opening 601 are retained to form the first sub-part 1541 and the third sub-part 1641, and the light-emitting material layer and the electrode material layer located between the first openings 601 are retained to form the second sub-part 1542 and the fourth sub-part 1642.

[0193] See also some possible implementations. Figure 10 Figure 11 and Figure 12 The display panel provided in this embodiment also includes an inorganic encapsulation layer 190 located on the side of the organic encapsulation layer 180 away from the substrate 111. That is, the encapsulation part 170, the organic encapsulation layer 180 and the inorganic encapsulation layer 190 form a three-layer composite thin film encapsulation layer structure, thereby ensuring the encapsulation effect of the display panel.

[0194] See also some possible implementations. Figure 12 The isolation structure 140 includes a support portion 141 and a shielding portion 142 located on the side of the support portion 141 away from the substrate 111. The orthographic projection of the end of the support portion 141 near the isolation opening 1402 on the substrate 111 lies within the orthographic projection of the end of the shielding portion 142 near the isolation opening 1402 on the substrate 111. For example, the end of the shielding portion 142 near the isolation opening 1402 protrudes beyond the end of the support portion 141 near the isolation opening 1402.

[0195] Optionally, the corrosion resistance of the support portion 141 is weaker than that of the shielding portion 142.

[0196] Optionally, the material of the support portion 141 may include metal, and / or the material of the shielding portion 142 may include metal.

[0197] Optionally, the material of the support portion 141 may include aluminum, and / or the material of the shielding portion 142 may include titanium.

[0198] Optionally, the second electrode 160 may contact the support portion 141, for example, through electrical contact.

[0199] Optionally, please see Figure 14 The isolation structure 140 also includes a receiving portion 143 located between the support portion 141 and the substrate 111. For example, the orthographic projection of the end of the support portion 141 near the isolation opening 1402 on the substrate 111 lies within the orthographic projection of the end of the receiving portion 143 near the isolation opening 1402 on the substrate 111. For example, the end of the receiving portion 143 near the isolation opening 1402 protrudes beyond the end of the support portion 141 near the isolation opening 1402.

[0200] Optionally, the orthographic projection of the end of the receiving portion 143 near the isolation opening on the substrate 111 is located within the orthographic projection of the end of the shielding portion 142 near the isolation opening on the substrate 111.

[0201] Optionally, the material of the receiving part 143 includes molybdenum.

[0202] Optionally, the second electrode 160 may contact the receiving portion 143, for example, through electrical contact.

[0203] In some possible implementations, the display panel provided in this embodiment may also include a touch function layer, an optical film (e.g., a polarizer), a transparent adhesive layer (e.g., an optical adhesive layer), and a cover plate, etc., located on the side of the inorganic encapsulation layer 190 away from the substrate 111.

[0204] This application also provides a method for manufacturing a display panel, which can be used to manufacture the display panel described in the above embodiments. Please refer to... Figure 15 The method may include the following steps.

[0205] Step S110: Provide substrate 111.

[0206] Step S120: A first organic layer 1121 is formed on the substrate 111.

[0207] In step S130, a first inorganic layer 600 is formed on the side of the first organic layer 1121 away from the substrate 111. The first inorganic layer 600 has a first opening 601. The orthographic projection of the first opening 601 on the substrate 111 and the orthographic projection of the first organic layer 1121 on the substrate 111 at least partially overlap.

[0208] In step S140, a protective layer 700 is formed, and the orthographic projection of the first opening 601 on the substrate 111 overlaps with the orthographic projection of the protective layer 700 on the substrate 111.

[0209] In some possible implementations, the first inorganic layer 600 includes at least a portion of the film layer of the isolation structure 140, and the isolation structure 140 may be formed on the side of the first organic layer 1121 away from the substrate 111 in step S130.

[0210] Wherein, at least a portion of the isolation structure 140 encloses at least a portion of the first opening 601 and the isolation opening 1402, the isolation opening 1402 including the first isolation opening 910 and the second isolation opening 920.

[0211] At the first opening 601, the orthographic projection of the side of the isolation structure 140 near the substrate 111 onto the substrate 111 lies within the orthographic projection of the side of the isolation structure 140 away from the substrate 111 onto the substrate 111. That is, the isolation structure 140 forms an undercut structure at the first opening 601. Alternatively, at the first opening 601, the side of the isolation structure 140 near the substrate 111 and the side of the isolation structure away from the substrate 111 can also be flush, that is, the isolation structure 140 does not form an undercut structure at the first opening 601.

[0212] Optionally, the first inorganic layer 600 may further include a pixel defining layer 130 located between the isolation structure 140 and the first organic layer 1121, the pixel defining layer 130 being made of an inorganic insulating material.

[0213] In step S130, a pixel defining layer 130 and an isolation structure 140 may be sequentially stacked in the first organic layer 1121 in a direction away from the substrate 111. The pixel defining layer 130 includes a pixel opening 1302, and the orthographic projection of the pixel opening 1302 on the substrate 111 lies within the orthographic projection of the isolation opening 1402 on the substrate 111. That is, the pixel opening 1302 and the corresponding isolation opening 1402 are connected.

[0214] The first opening 601 includes a first sub-opening 1401 and a second sub-opening 1301 that are connected together. The first sub-opening 1401 is located on the side of the second sub-opening 1301 away from the substrate 111. The isolation structure 140 is provided with the first sub-opening 1401, and the pixel defining layer 130 is provided with the second sub-opening 1301. That is, the first sub-opening 1401 and the second sub-opening 1301 are connected.

[0215] Optionally, in this embodiment, a pixel defining layer 130 and an isolation structure 140 covering the entire layer can be formed first, and then the isolation structure 140 can be etched to form an isolation opening 1402 and a first sub-opening 1401. Then, the pixel defining layer 130 can be etched to form a pixel opening 1302 and a second sub-opening 1301.

[0216] Prior to step S140, the method provided in this embodiment may include the following sub-steps.

[0217] In step S202, the light-emitting layer 150 and the second electrode 160 of the second light-emitting device 8012 are formed in the second isolation opening 920. In this step, the encapsulation part 170 corresponding to the second light-emitting device 8012 may also be formed.

[0218] Optionally, in this embodiment, the light-emitting layer 150 and the second electrode 160 of the second light-emitting device 8012 can be formed in the second isolation opening 920 by patterned etching after whole-layer vapor deposition.

[0219] Optionally, the isolation opening 1402 further includes a third isolation opening 930. Before or after the formation of the second light-emitting device 8012, the light-emitting layer 150 and the second electrode 160 of the third light-emitting device 8013 may be formed in the third isolation opening 930. This step may also form a package portion 170 corresponding to the third light-emitting device 8013.

[0220] Step S203: A light-emitting material layer 1501, an electrode material layer 1601, and an encapsulation material layer 1701 corresponding to the first light-emitting device 8011 are formed. The light-emitting material layer 1501 and the electrode material layer 1601 corresponding to the first light-emitting device 8011 can be formed by a vapor deposition process.

[0221] In this embodiment, after forming the second light-emitting device 8012 and / or the third light-emitting device 8013, a light-emitting material layer 1501, an electrode material layer 1601, and an encapsulation material layer 1701 corresponding to the first light-emitting device 8011 can be formed.

[0222] Please see below. Figure 16 The orthographic projections of the light-emitting material layer 1501, the electrode material layer 1601, and the encapsulation material layer 1701 corresponding to the first light-emitting device 8011 on the substrate 111 are offset from the orthographic projection of the first opening 601 on the substrate 111.

[0223] That is, in this embodiment, in order to prevent the light-emitting material layer 1501 corresponding to the first light-emitting device 8011 from extending into the first opening 601 and contacting the first organic layer 1121 to form a water vapor diffusion path, the evaporation range of the light-emitting material layer 1501, the electrode material layer 1601, and the deposition range of the encapsulation material layer 1701 can be controlled to prevent the light-emitting material layer 1501, the electrode material layer 1601, and the encapsulation material layer 1701 corresponding to the first light-emitting device 8011 from extending into the first opening 601.

[0224] Optionally, before or after step S140, the method provided in this embodiment may further include step S301.

[0225] S301, patterning etching is performed on the light-emitting material layer 1501, the electrode material layer 1601 and the encapsulation material layer 1701 to form the light-emitting layer 150, the second electrode 160 and the encapsulation part 170 corresponding to the first light-emitting device 8011 located in the first isolation opening 910.

[0226] In one example, step S301 may follow step S140. Optionally, step S140 may follow the formation of the second light-emitting device 8012 and / or the third light-emitting device 8013.

[0227] In this case, when forming the light-emitting material layer 1501 and the electrode material layer 1601, since the first opening 601 is not yet closed, the water vapor previously absorbed by the first organic layer 1121 during the high-temperature vapor deposition process can be discharged through the first opening 601 after evaporation. The protective layer covers the packaging portion corresponding to the first light-emitting device and the packaging portion corresponding to the second light-emitting device on the side away from the substrate.

[0228] After the light-emitting material layer 1501, electrode material layer 1601, and encapsulation material layer 1701 corresponding to the first light-emitting device 8011, please refer to... Figure 17 A protective layer 700 is set to cover the first opening 601, thereby preventing moisture from entering the first organic layer 1121 through the first opening 601 during subsequent etching operations.

[0229] In this embodiment, please refer to Figure 18 After setting the protective layer 700, the patterning etching of the first light-emitting device 8011 is then performed. In this way, the water vapor generated during the etching process, such as exposure, development, and cleaning, will no longer invade the first organic layer 1121 through the first opening 601.

[0230] Optionally, in the above case, the protective layer 700 may only cover each of the first openings 601, or the protective layer 700 may also cover the encapsulation portion 170 corresponding to the first light-emitting device 8011, such as... Figure 7 As shown.

[0231] In another example, step S301 may also precede step S140.

[0232] That is, first complete the fabrication of each light-emitting device 801, such as Figure 19 Then set the protection layer to 700, such as... Figure 18In this case, the protective layer 700 may also cover part or all of the encapsulation portion 170 corresponding to the light-emitting device 801 located in the display area AA. For example, the protective layer 700 covers the side of the encapsulation portion corresponding to the first light-emitting device 8011 away from the substrate, and the orthographic projection of the protective layer 700 on the substrate is outside the orthographic projection of the second light-emitting device 8012 on the substrate.

[0233] In some other possible implementations, step S140 may include the following sub-steps.

[0234] In some possible implementations, the first inorganic layer 600 includes at least a portion of the film layer of the isolation structure 140, and the isolation structure 140 may be formed on the side of the first organic layer 1121 away from the substrate 111 in step S130.

[0235] The isolation structure 140 encloses at least a portion of the first opening 601 and the isolation opening 1402, which includes a first isolation opening 910 and a second isolation opening 920. At the location facing the first opening 601, the orthographic projection of the side of the isolation structure 140 closest to the substrate 111 onto the substrate 111 lies within the orthographic projection of the side of the isolation structure 140 furthest from the substrate 111 onto the substrate 111; that is, the isolation structure 140 forms an undercut structure at the location facing the first opening 601.

[0236] Optionally, the first inorganic layer 600 may further include a pixel defining layer 130 located between the isolation structure 140 and the first organic layer 1121, the pixel defining layer 130 being made of an inorganic insulating material.

[0237] In step S130, a pixel defining layer 130 and an isolation structure 140 may be sequentially stacked on the first organic layer 1121 in a direction away from the substrate 111. The pixel defining layer 130 includes a pixel opening 1302, and the orthographic projection of the pixel opening 1302 on the substrate 111 lies within the orthographic projection of the isolation opening 1402 on the substrate 111. That is, the pixel opening 1302 and the isolation opening 1402 are connected.

[0238] The first opening 601 includes a first sub-opening 1401 and a second sub-opening 1301 that are connected together. The first sub-opening 1401 is located on the side of the second sub-opening 1301 away from the substrate 111. The isolation structure 140 is provided with the first sub-opening 1401, and the pixel defining layer 130 is provided with the second sub-opening 1301. That is, the first sub-opening 1401 and the second sub-opening 1301 are connected.

[0239] Optionally, in this embodiment, a pixel defining layer 130 and an isolation structure 140 covering the entire layer can be formed first, and then the isolation structure 140 can be etched to form an isolation opening 1402 and a first sub-opening 1401. Then, the pixel defining layer 130 can be etched to form a pixel opening 1302 and a second sub-opening 1301.

[0240] Prior to step S140, the method provided in this embodiment may include the following sub-steps.

[0241] In step S302, the light-emitting layer 150 and the second electrode 160 of the second light-emitting device 8012 are formed in the second isolation opening 920. In this step, the encapsulation part 170 corresponding to the second light-emitting device 8012 may also be formed.

[0242] Optionally, in this embodiment, the light-emitting layer 150 and the second electrode 160 of the second light-emitting device 8012 can be formed in the second isolation opening 920 by patterned etching after whole-layer vapor deposition.

[0243] Step S303: A light-emitting material layer 1501, an electrode material layer 1601, and an encapsulation material layer 1701 corresponding to the first light-emitting device 8011 are formed.

[0244] In this embodiment, after forming the second light-emitting device 8012 and / or the third light-emitting device 8013, a light-emitting material layer 1501, an electrode material layer 1601, and an encapsulation material layer 1701 corresponding to the first light-emitting device 8011 can be formed.

[0245] Please see below. Figure 20 The orthographic projections of the first isolation opening 910, the second isolation opening 920, and the first opening 601 on the substrate 111 are located within the orthographic projections of the light-emitting material layer 1501, the electrode material layer 1601, and the encapsulation material layer 1701 on the substrate 111.

[0246] When the luminescent material layer 1501 and the electrode material layer 1601 are formed by vapor deposition, since the first opening 601 has not been closed, the water vapor absorbed by the first organic layer 1121 during the high-temperature vapor deposition process can be discharged from the first opening 601 after evaporation.

[0247] Step S304: Set an etching barrier material 501 to cover the first isolation opening 910 and the first opening 601.

[0248] Please see Figure 21In step S304, an etching barrier material 501 (e.g., photoresist) can be set, and the etching barrier material 501 can be made to cover only the first isolation opening 910 and the first opening 601 by exposure and development. During this process, since the first opening 601 is covered by the encapsulation material layer 1701, moisture during the exposure and development process will not invade the first organic layer 1121.

[0249] Step S305: Etch the light-emitting material layer 1501, electrode material layer 1601 and encapsulation material layer 1701 located in the second isolation opening 920, retain the light-emitting material layer 1501, electrode material layer 1601 and encapsulation material layer 1701 in the first isolation opening 910 and the first opening 601, to form the light-emitting layer 150, the second electrode 160 and the encapsulation part 170 corresponding to the first light-emitting device 8011 located in the first isolation opening 910, and form the protective layer 700 located in the first opening 601.

[0250] Due to the obstruction of the etching barrier material 501, during the etching process, the light-emitting material layer 1501, electrode material layer 1601, and encapsulation material layer 1701 of the first isolation opening 910 are retained, forming the light-emitting layer 150, the second electrode 160, and the encapsulation portion 170 corresponding to the first light-emitting device 8011. The light-emitting material layer 1501, electrode material layer 1601, and encapsulation material layer 1701 within the first sub-opening 1401 are also retained, forming the first film layer 154, the second film layer 164, and the third film layer 174 of the protective layer 700, forming... Figure 8 The structure shown.

[0251] Optionally, the first light-emitting device 8011 and the second light-emitting device 8012 may have different colors. The light-emitting color of the first light-emitting device 8011 may include one of red, green, and blue. The light-emitting color of the second light-emitting device 8012 may include one of red, green, and blue.

[0252] Optionally, the first light-emitting device 8011 is the light-emitting device of the last color prepared.

[0253] Optionally, the isolation opening 1402 further includes a third isolation opening 930. Before or after the formation of the second light-emitting device 8012, or before, and / or before step S303, the process may further include:

[0254] In step S306, the light-emitting layer 150 of the third light-emitting device 8013 and the second electrode 160 are formed in the third isolation opening 930. In this step, the encapsulation part 170 corresponding to the third light-emitting device 8013 may also be formed.

[0255] The first light-emitting device 8011, the second light-emitting device 8012, and the third light-emitting device 8013 emit different colors. The third light-emitting device 8013 may emit one of the following colors: red, green, or blue.

[0256] In step S303, the orthographic projections of the first isolation opening 910, the second isolation opening 920, the third isolation opening 930 and the first opening 601 on the substrate 111 are located within the orthographic projections of the light-emitting material layer 1501, the electrode material layer 1601 and the encapsulation material layer 1701 on the substrate 111.

[0257] In step S305, the light-emitting material layer 1501, electrode material layer 1601 and encapsulation material layer 1701 located in the third isolation opening 930 are also etched.

[0258] In some possible implementations, after step S140, an organic insulating layer (e.g., organic encapsulation layer 180) and an inorganic insulating layer (e.g., inorganic encapsulation layer 190) covering the entire layer can also be formed. After forming the inorganic insulating layer (e.g., inorganic encapsulation layer 190), multiple touch-sensitive functional film layers can be formed sequentially, which will not be described in detail in this embodiment.

[0259] This application also provides an electronic device, which includes the display panel provided in this application, or a display panel manufactured using the manufacturing method of the display panel provided in this application. The electronic device may include mobile phones, tablets, smart wearable devices, televisions, laptops, monitors, and other devices with display functions.

[0260] In summary, this application provides a display panel, a method for manufacturing the display panel, and an electronic device. By setting a protective layer to cover the first opening of the first inorganic layer, the water vapor diffusion path at the first opening can be blocked, preventing water vapor generated during the manufacturing process of other film layers after the preparation of the first inorganic layer from invading the first organic layer, thereby avoiding water vapor diffusion or reducing the risk of water vapor diffusion and improving the yield of the display panel.

[0261] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0262] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0263] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A display panel, characterized in that, The display panel includes: Substrate; The first organic layer located on the substrate; A first inorganic layer is located on the side of the first organic layer away from the substrate. The first inorganic layer has a first opening, and the orthographic projection of the first opening on the substrate and the orthographic projection of the first organic layer on the substrate at least partially overlap. A protective layer located on the side of the first organic layer away from the substrate, wherein the orthographic projection of the first opening on the substrate overlaps with the orthographic projection of the protective layer on the substrate, and the protective layer comprises an inorganic material.

2. The display panel according to claim 1, characterized in that, At least a portion of the protective layer is located within the first opening; And / or, the orthographic projection of the first opening on the substrate lies within the orthographic projection of the protective layer on the substrate; And / or, at least a portion of the protective layer is located on the side of the first inorganic layer away from the substrate; And / or, the first opening exposes the first organic layer, and at least a portion of the protective layer is located on the side of the first organic layer exposed through the first opening away from the substrate; And / or, the first organic layer includes a planarization layer; And / or, the first organic layer includes an organic insulating layer; And / or, the first inorganic layer includes a pixel defining layer, the pixel defining layer having at least a portion of the first opening; the pixel defining layer is an inorganic insulating layer; And / or, the protective layer comprises an inorganic insulating material; And / or, the protective layer is in contact with the first organic layer exposed through the first opening.

3. The display panel according to claim 1, characterized in that, The first inorganic layer includes at least a portion of a membrane layer with an insulating structure, the at least portion of which encloses at least a portion forming the first opening and the insulating opening. The display panel also includes a light-emitting device, at least a portion of which is located within the isolation opening.

4. The display panel according to claim 3, characterized in that, The display panel further includes a pixel defining layer, the pixel defining layer being provided with pixel openings, and the orthographic projection of the pixel openings on the substrate being located within the orthographic projection of the isolation openings on the substrate; Preferably, the first inorganic layer further includes the pixel defining layer, and the first opening includes a first sub-opening and a second sub-opening that are connected together. The first sub-opening is located on the side of the second sub-opening away from the substrate. The isolation structure is provided with the first sub-opening, and the pixel defining layer is provided with the second sub-opening. Preferably, the orthographic projection of the second sub-opening on the substrate lies within the orthographic projection of the first sub-opening on the substrate.

5. The display panel according to claim 4, characterized in that, The display panel also includes an encapsulation portion located on the side of the light-emitting device away from the substrate; The light-emitting device includes a first electrode, a light-emitting layer, and a second electrode sequentially stacked along a direction away from the substrate; The pixel opening exposes at least a portion of the first electrode; The light-emitting device includes a first light-emitting device, and the protective layer includes multiple film layers. The multiple film layers in the protective layer are made of the same material as the light-emitting layer, the second electrode, and the encapsulation part corresponding to the first light-emitting device and are disposed in the same layer. Preferably, the isolation structure is electrically connected to the second electrode.

6. The display panel according to claim 5, characterized in that, The protective layer includes a first film layer, a second film layer, and a third film layer stacked sequentially in a direction away from the substrate, wherein the orthographic projection of the first film layer on the substrate is located within the orthographic projection of the third film layer on the substrate; The first membrane layer is broken at the sidewall of the isolation structure facing the first sub-opening; The second membrane layer is broken at the sidewall of the isolation structure facing the first sub-opening; The third membrane layer is continuous on the sidewall of the isolation structure facing the first sub-opening; The first film layer and the light-emitting layer of the first light-emitting device are made of the same material and are disposed in the same layer; The second film layer and the second electrode of the first light-emitting device are made of the same material and are disposed in the same layer; The third film layer and the encapsulation portion corresponding to the first light-emitting device are made of the same material and are disposed in the same layer; Preferably, there are multiple first openings, the first film layers in two adjacent first openings are intermittently arranged, the second film layers in two adjacent first openings are intermittently arranged, and the third film layers in at least two adjacent first openings are continuously arranged. Preferably, the isolation structure comprises a conductive material; The second membrane layer is electrically connected to the isolation structure; Preferably, the isolation structure includes a metal layer, and the second film layer is in contact with the metal layer; Preferably, the light-emitting device further includes a second light-emitting device, the second light-emitting device emitting a different color than the first light-emitting device; the first light-emitting device and the second light-emitting device correspond to different isolation openings; The first light-emitting device and the second light-emitting device correspond to different packaging portions; the materials of the first film layer and the light-emitting layer of the second light-emitting device are different; Preferably, the light-emitting device further includes a third light-emitting device, wherein the first light-emitting device, the second light-emitting device, and the third light-emitting device emit different colors; and the first light-emitting device, the second light-emitting device, and the third light-emitting device correspond to different isolation openings; The first light-emitting device, the second light-emitting device, and the third light-emitting device correspond to different packaging portions; the materials of the first film layer and the light-emitting layer of the third light-emitting device are different; Preferably, the isolation structure includes a support portion and a shielding portion located on the side of the support portion away from the substrate, wherein the end of the shielding portion near the first opening protrudes from the end of the support portion near the first opening.

7. The display panel according to claim 6, characterized in that, At least a portion of the third film extends from within the first opening to the side of the isolation structure away from the substrate; The first film layer includes a first sub-section located within the first opening and a second sub-section located on the side of the isolation structure away from the substrate; the first sub-section and the second sub-section are discontinuously arranged. The second film layer includes a third sub-section located within the first opening and a fourth sub-section located on the side of the isolation structure away from the substrate; the third sub-section and the fourth sub-section are discontinuously arranged. Preferably, at least a portion of the second sub-part is located between adjacent first openings; at least a portion of the fourth sub-part is located between adjacent first openings; Preferably, at least a portion of the second sub-part is disposed around the first opening; At least a portion of the fourth sub-part is disposed around the first opening.

8. The display panel according to claim 1, characterized in that, The first inorganic layer is provided with a plurality of first openings, and the protective layers corresponding to the plurality of first openings are interconnected.

9. The display panel according to claim 1, characterized in that, The display panel also includes an organic encapsulation layer located on the side of the protective layer away from the substrate; Preferably, the display panel further includes an inorganic encapsulation layer located on the side of the organic encapsulation layer away from the substrate; Preferably, the display panel further includes: An isolation structure, wherein at least a portion of the isolation structure encloses an isolation opening; A light-emitting device, at least a portion of which is located within the isolation opening; The encapsulation portion is located on the side of the light-emitting device away from the substrate, and the organic encapsulation layer is located on the side of the encapsulation portion away from the substrate; Preferably, at least a portion of the protective layer is located on the side of at least a portion of the encapsulation portion away from the substrate; or, at least a portion of the protective layer is disposed in the same layer as at least a portion of the encapsulation portion and is integrally formed; or, the orthographic projection of the protective layer on the substrate is located outside the orthographic projection of the isolation opening on the substrate. Preferably, the light-emitting device includes a first light-emitting device and a second light-emitting device with different emitting colors. The protective layer covers the side of the encapsulation portion corresponding to the first light-emitting device that is away from the substrate, and the orthographic projection of the protective layer on the substrate is outside the orthographic projection of the second light-emitting device on the substrate; Alternatively, the protective layer covers the side of the encapsulation portion corresponding to the first light-emitting device and the encapsulation portion corresponding to the second light-emitting device away from the substrate; Preferably, the first inorganic layer includes at least a portion of a membrane layer of an isolation structure, the at least portion of which encloses at least a portion of the first opening; The isolation structure includes a support portion and a shielding portion located on the side of the support portion away from the substrate, wherein the end of the shielding portion near the first opening protrudes from or is flush with the end of the support portion near the first opening.

10. The display panel according to claim 1, characterized in that, The display panel includes a display area and a non-display area, and the first opening is located in the non-display area. Preferably, the non-display area includes a border area located on at least one side of the display area, and / or, the non-display area includes a light-transmitting hole and a transition area located between the light-transmitting hole and the display area; The first opening is located in the border area and / or the transition area; Preferably, the display panel further includes: An isolation structure, wherein at least a portion of the isolation structure encloses an isolation opening; A light-emitting device, at least a portion of which is located within the isolation opening, and which is located in the display area.

11. The display panel according to claim 3 or 10, characterized in that, The isolation structure includes a support portion and a shielding portion located on the side of the support portion away from the substrate. The orthographic projection of the end of the support portion near the isolation opening on the substrate is located within the orthographic projection of the end of the shielding portion near the isolation opening on the substrate. Preferably, the corrosion resistance of the support portion is weaker than that of the shielding portion; Preferably, the material of the support portion includes metal, and / or the material of the shielding portion includes metal; Preferably, the material of the support portion includes aluminum, and / or the material of the shielding portion includes titanium; Preferably, the isolation structure further includes a receiving portion located between the support portion and the substrate; Preferably, the orthographic projection of the end of the support portion near the isolation opening on the substrate is located within the orthographic projection of the end of the receiving portion near the isolation opening on the substrate; Preferably, the orthographic projection of the end of the receiving portion near the isolation opening on the substrate is located within the orthographic projection of the end of the blocking portion near the isolation opening on the substrate; Preferably, the material of the receiving part includes molybdenum.

12. A method for manufacturing a display panel, characterized in that, The method includes: Provide substrate; A first organic layer is formed on the substrate; A first inorganic layer is formed on the side of the first organic layer away from the substrate. The first inorganic layer has a first opening, and the orthographic projection of the first opening on the substrate and the orthographic projection of the first organic layer on the substrate at least partially overlap. A protective layer is formed, wherein the orthographic projection of the first opening on the substrate overlaps with the orthographic projection of the protective layer on the substrate.

13. The method according to claim 12, characterized in that, The first inorganic layer includes at least a portion of a film layer with an insulating structure; the step of forming the first inorganic layer on the side of the first organic layer away from the substrate includes: An isolation structure is formed on the side of the first organic layer away from the substrate, and at least a portion of the isolation structure encloses at least a portion of the first opening and the isolation opening; The isolation opening includes a first isolation opening and a second isolation opening; Before forming the protective layer, the manufacturing method further includes: A light-emitting layer, a second electrode, and a corresponding encapsulation portion of the second light-emitting device are formed in the second isolation opening; A light-emitting material layer, an electrode material layer, and an encapsulation material layer corresponding to the first light-emitting device are formed. Preferably, the orthographic projections of the light-emitting material layer, the electrode material layer, and the encapsulation material layer on the substrate are offset from the orthographic projections of the first opening on the substrate; Preferably, the protective layer covers the first opening; the orthographic projection of the first opening on the substrate lies within the orthographic projection of the protective layer on the substrate. Preferably, before or after forming the protective layer, the manufacturing method further includes: The light-emitting material layer, the electrode material layer, and the encapsulation material layer are patterned and etched to form the light-emitting layer, the second electrode, and the encapsulation part corresponding to the first light-emitting device located at the first isolation opening; Preferably, the first light-emitting device and the second light-emitting device emit different colors; Preferably, the first light-emitting device is the last light-emitting device of the prepared color; Preferably, after forming the protective layer, and / or after forming the encapsulation portion corresponding to the first light-emitting device, the manufacturing method further includes: An organic encapsulation layer is formed on the side of the protective layer away from the substrate; Preferably, the protective layer covers the side of the encapsulation portion corresponding to the first light-emitting device away from the substrate, and the orthographic projection of the protective layer on the substrate is outside the orthographic projection of the second light-emitting device on the substrate; Alternatively, the protective layer covers the side of the encapsulation portion corresponding to the first light-emitting device and the encapsulation portion corresponding to the second light-emitting device away from the substrate; Preferably, the isolation opening further includes a third isolation opening; Before forming the light-emitting material layer, electrode material layer, and encapsulation material layer corresponding to the first light-emitting device, the method further includes: A light-emitting layer, a second electrode, and a corresponding encapsulation portion for the third light-emitting device are formed in the third isolation opening; the first light-emitting device, the second light-emitting device, and the third light-emitting device emit different colors.

14. The method according to claim 12, characterized in that, The first inorganic layer includes at least a portion of a film layer with an insulating structure; the step of forming the first inorganic layer on the side of the first organic layer away from the substrate includes: An isolation structure is formed on the side of the first organic layer away from the substrate, and at least a portion of the isolation structure encloses at least a portion of the first opening and the isolation opening. The isolation opening includes a first isolation opening and a second isolation opening; A light-emitting layer, a second electrode, and a corresponding encapsulation portion of the second light-emitting device are formed in the second isolation opening; A light-emitting material layer, an electrode material layer, and an encapsulation material layer corresponding to the first light-emitting device are formed, wherein the first isolation opening, the second isolation opening, and the orthogonal projection of the first opening on the substrate are located within the orthogonal projection of the light-emitting material layer, the electrode material layer, and the encapsulation material layer on the substrate; An etchable barrier material is provided to cover the first isolation opening and the first opening; The light-emitting material layer, the electrode material layer, and the encapsulation material layer located in the second isolation opening are etched to retain the first isolation opening and the light-emitting material layer, the electrode material layer, and the encapsulation material layer of the first opening, forming the light-emitting layer of the first light-emitting device, the second electrode, and the encapsulation part corresponding to the first light-emitting device located in the first isolation opening, and forming the protective layer located in the first opening. Preferably, the first light-emitting device and the second light-emitting device emit different colors; Preferably, the first light-emitting device is the last light-emitting device of the prepared color; Preferably, the isolation opening further includes a third isolation opening; Before forming the light-emitting material layer, electrode material layer, and encapsulation material layer corresponding to the first light-emitting device, the method further includes: A light-emitting layer, a second electrode, and a corresponding encapsulation portion for the third light-emitting device are formed in the third isolation opening; the first light-emitting device, the second light-emitting device, and the third light-emitting device emit different colors.

15. An electronic device, characterized in that, The electronic device includes a display panel as described in any one of claims 1-11, or the electronic device includes a display panel made by a method of manufacturing a display panel as described in any one of claims 12-14.

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