Heat management system

Abstract

Provided is a heat management system that can be made compact by being able to connect modules in proximity to each other. Shell front surface (1d) in a shell (1) of a coolant module (100) forming opposite side shell surfaces opposite to a refrigerant module forms a pair of condenser connection ports (Cy) communicating with an inlet and an outlet of a heat medium (R2) in a condenser of the refrigerant module, and a pair of evaporators communicating with an inlet and an outlet of a heat medium (R2) in an evaporator of the refrigerant module a four-way valve (70) forming a multi-way valve is provided on non-facing side housing surfaces (1c, 1e) other than the housing front surface (1d) forming the facing side housing surfaces in the housing (1), and an eight-way valve, a condenser, and an evaporator are disposed on the housing front surface (1d) side in the refrigerant module. The housing surfaces are arranged side by side in a width direction (D1) intersecting an opposing direction in which the opposing-side housing surfaces and the refrigerant modules face each other.

Description

TECHNICAL FIELD

[0001] The present application relates to a heat management system installed in a vehicle. BACKGROUND

[0002] Generally, it is known that a heat management system that comprehensively performs temperature adjustment of a battery, a motor, and the like, which are on-vehicle devices, and air conditioning of an interior of a vehicle is provided in a vehicle such as an automobile. Such a heat management system is configured of a heat carrier circuit through which a heat carrier flows and a refrigerant circuit that is a heat pump including a compressor, a condenser, a pressure reducing device, and an evaporator.

[0003] In addition, such a heat management system is generally installed in a vehicle in a state in which a part of the heat carrier circuit and a part of the refrigerant circuit are modularly connected, as described in Patent Document 1, for example.

[0004] PRIOR ART DOCUMENTS

[0005] PATENT DOCUMENTS

[0006] Patent Document 1: Specification of Chinese Patent Application Publication No. 116373551 SUMMARY

[0007] PROBLEMS TO BE SOLVED BY THE INVENTION

[0008] However, in the conventional modular heat management system, when connecting a coolant module that configures the heat carrier circuit and a refrigerant module that configures the refrigerant circuit, the constituent components in each module become an obstacle, and workability is poor, and sometimes it is necessary to be disposed at a position away from each module. Therefore, a problem such as a large size of the entire heat management system arises.

[0009] Therefore, the present application provides a heat management system that enables modules to be connected close to each other to achieve compactness.

[0010] TECHNICAL SOLUTION

[0011] A heat management system according to an aspect of the present application is provided in a vehicle and performs temperature adjustment of an on-vehicle device and / or air conditioning of an interior of the vehicle. The heat management system includes a cooler module having a coolant module case that forms a flow path through which a first heat carrier flows and a multi-way valve that is provided in the coolant module case and switches a flow passage of the first heat carrier in the flow path, and a refrigerant module that includes a refrigerant circuit composed of a compressor, a condenser, a pressure-reducing device, and an evaporator, and through which a second heat carrier circulates and that exchanges heat with the first heat carrier in the condenser and the evaporator. Opposite side case surfaces of the coolant module case that face the refrigerant module form a pair of condenser connection ports that communicate with flow inlet and outlet ports of the first heat carrier in the condenser and a pair of evaporator connection ports that communicate with flow inlet and outlet ports of the first heat carrier in the evaporator. The multi-way valve is provided on a non-opposite side case surface of the coolant module case. The condenser and the evaporator are arranged on a side of the refrigerant module that faces the opposite side case surfaces, and are arranged in a first lateral direction that intersects with the opposite direction.

[0012] In the heat management system, the multi-way valve can have a valve rotation shaft and a valve core that switches the flow passage of the first heat carrier by rotation of the valve rotation shaft. The multi-way valve can be provided on a surface of the non-opposite side case surface that is opposite to the opposite side case surface in the opposite direction. A rotation axis of the valve rotation shaft can extend in a direction that intersects with the opposite side case surface.

[0013] In the heat management system, the multi-way valve can be a valve that has five or more connection ports through which the first heat carrier flows.

[0014] In the heat management system, the cooler module can further have a pump that is provided in the coolant module case and that pressurizes the first heat carrier in the flow path. The pump can be provided on a surface of the non-opposite side case surface that faces a direction that intersects with the opposite direction.

[0015] In the aforementioned heat management system, the refrigerant module may also include a refrigerant module housing with the refrigerant circuit provided. The refrigerant module housing forms a refrigerant module-side opposite housing surface that is opposite to the opposite housing surface in the refrigerant module and a refrigerant module-side non-opposite housing surface other than the refrigerant module-side opposite housing surface. The condenser and the evaporator are disposed on the refrigerant module-side opposite housing surface of the refrigerant module housing, and the compressor and the pressure reducing device are disposed on the refrigerant module-side non-opposite housing surface of the refrigerant module housing.

[0016] In the aforementioned thermal management system, the compressor in the refrigerant module may also be configured on the opposite side of the refrigerant module in the aforementioned relative direction to the condenser and the evaporator.

[0017] In the aforementioned thermal management system, the compressor in the refrigerant module may be arranged relative to the condenser and the evaporator in the aforementioned relative direction and in the second transverse direction intersecting the aforementioned first transverse direction.

[0018] Invention Effects

[0019] According to the aforementioned thermal management system, compactness can be achieved by connecting modules in close proximity to each other. Attached Figure Description

[0020] Figure 1 This is a loop diagram of the heat management system according to an embodiment of the present invention.

[0021] Figure 2 This is a three-dimensional diagram of the overall heat management system described above. Figure 2 (a) is a diagram taken from the near-front side of the system in the depth direction. Figure 2 (b) is a diagram obtained from the inside view in the depth direction of the system.

[0022] Figure 3 This is a perspective view of the coolant module of the aforementioned thermal management system, taken from the back side of the casing.

[0023] Figure 4 This is a perspective view of the coolant module as seen from the front side of the casing.

[0024] Figure 5 This is a perspective view of the coolant module taken from the back side of the housing, and an exploded view showing the multi-way valve and pump separated from the housing.

[0025] Figure 6 This is a three-dimensional view of the refrigerant module of the aforementioned thermal management system, viewed from the inside of the system's depth direction.

[0026] Figure 7 This is an overall perspective view of the heat management system of a modified embodiment of the above-described embodiments. Figure 7 (a) is a diagram taken from the near-front side of the system in the depth direction. Figure 7 (b) is a diagram obtained from the inside view in the depth direction of the system.

[0027] Figure 8 This is a perspective view of the refrigerant module of the thermal management system of the above-described modified example, viewed from above in the height direction of the system. Detailed Implementation

[0028] The heat management system 200 according to an embodiment of the present invention will be described below.

[0029] like Figure 1 As shown, the thermal management system 200 of this embodiment is, for example, a device installed in a vehicle such as an automobile to regulate the temperature of on-board equipment K that may generate heat and / or to regulate the air inside the vehicle.

[0030] Specifically, the thermal management system 200 has a refrigerant circuit 50 and a heat carrier circuit 60 connected to the refrigerant circuit 50. The refrigerant circuit 50 is specifically included in the refrigerant module 150 described later, and the heat carrier circuit 60 is specifically included in the coolant module (coolant device) 100 described later.

[0031] (Refrigerant circuit)

[0032] The refrigerant circuit 50 includes a compressor 51, a condenser 52, a pressure reducing device 53, an evaporator 54, and a storage tank 55. A flow path C6 connects these compressors 51, condensers 52, pressure reducing devices 53, evaporators 54, and storage tank 55, and forms a heat pump for the refrigerant (second heat transfer medium) R1 to circulate (circulate).

[0033] (Heat carrier circuit)

[0034] The heat transfer circuit 60 is a circuit for the flow (circulation) of the heat transfer medium (first heat transfer medium) R2, and it includes: a four-way valve (first multi-way valve) 70 and an eight-way valve (second multi-way valve) 71, which are multi-way valves that switch the flow path of the heat transfer medium R2; a radiator circuit section 61 connected to the vehicle's radiator 300 between the four-way valve 70 and the eight-way valve 71; a high-temperature side heat transfer circuit section 62 connected to the four-way valve 70 and passing through the condenser 52 in the refrigerant circuit 50; a low-temperature side heat transfer circuit section 63 connected to the eight-way valve 71 and passing through the evaporator 52 in the refrigerant circuit 50; and an on-board equipment temperature regulating heat transfer circuit section 64 connected to the eight-way valve 71 and passing through the on-board equipment K.

[0035] The four-way valve 70 has four connection ports 70x for the heat transfer medium R2 to flow in and out relative to itself. That is, the four-way valve 70 is a valve with fewer than five connection ports 70x. The eight-way valve 71 has eight connection ports 71x for the heat transfer medium R2 to flow in and out relative to itself. That is, the eight-way valve 71 is a valve with more than five connection ports 71x.

[0036] The radiator circuit section 61 has a flow path C1 that connects the four-way valve 70 and the eight-way valve 71 and passes through the radiator 300. The heat carrier R2 flowing in the flow path C1 can exchange heat with the external gas in the radiator 300. Therefore, a pair of pipes forming the flow path C1 of the radiator circuit section 61 are connected to the two connection ports 71x of the eight-way valve 71, and a pair of pipes forming the flow path C1 are connected to the two connection ports 70x of the four-way valve 70.

[0037] The high-temperature side heat transfer circuit 62 has a flow path C2 connecting the four-way valve 70, the condenser 52, and the heater core 311 in the vehicle's HVAC (Heating, Ventilation and Air-Conditioning) 310. The heat transfer fluid R2 flowing through the flow path C2 can exchange heat with the refrigerant R1 in the refrigerant circuit 50 in the condenser 52. The high-temperature side heat transfer circuit 62 also has a first pump 3a, which will be described in detail later, downstream of the four-way valve 70 and upstream of the condenser 52. Additionally, the high-temperature side heat transfer circuit 62 has a first reservoir 4a adjacent to the first pump 3a and upstream of the first pump 3a, storing the heat transfer fluid R2. A pair of pipes forming the flow path C2 are connected to the two connection ports 70x of the four-way valve 70.

[0038] The low-temperature side heat transfer fluid circuit 63 has a flow path C3 connecting the eight-way valve 71, the evaporator 54, and the cooler core 312 in the HVAC 310. The heat transfer fluid R2 flowing through the flow path C3 can exchange heat with the refrigerant R1 in the refrigerant circuit 50 in the evaporator 54. The low-temperature side heat transfer fluid circuit 63 also has a second pump 3b, which will be described in detail later, downstream of the cooler core 312 and upstream of the evaporator 54. Furthermore, the low-temperature side heat transfer fluid circuit 63 has a second reservoir 4b adjacent to the second pump 3b and upstream of the second pump 3b, storing the heat transfer fluid R2. In addition, the low-temperature side heat transfer fluid circuit 63 has a three-way valve 72, which serves as a multi-way valve for switching the flow path of the heat transfer fluid R2 within itself. A pair of pipes forming the flow path C3 of the low-temperature side heat transfer fluid circuit 63 are connected to the two connection ports 71x of the eight-way valve 71.

[0039] The vehicle-mounted device temperature-regulating heat transfer circuit 64 has a flow path C4 connecting the eight-way valve 71 to the vehicle-mounted device K. The heat transfer fluid R2 flowing through the flow path C4 can exchange heat with the vehicle-mounted device K. Examples of the vehicle-mounted device K include the battery 320 and an ECH (Electric Coolant Heater) 330, also known as a water heater. In this embodiment, the heat transfer fluid R2 flows through the flow path C4 in the order of the eight-way valve 71, ECH 330, and battery 320. The vehicle-mounted device temperature-regulating heat transfer circuit 64 also has a third pump 3c, which will be described in detail later, downstream of the eight-way valve 71 and upstream of the ECH 330. Furthermore, the vehicle-mounted device temperature-regulating heat transfer circuit 64 has a third reservoir 4c adjacent to the third pump 3c and storing the heat transfer fluid R2 upstream of the third pump 3c. A pair of pipes forming the flow path C4 of the on-board equipment temperature regulation heat transfer circuit section 64 are connected to the two connection ports 71x of the eight-way valve 71.

[0040] Furthermore, in this embodiment, unlike the on-board equipment temperature regulating heat carrier circuit 64, the motor having a flow path C5 passing through the motor 340, which is the on-board equipment K, is connected to the eight-way valve 71 via the circuit 65. That is, a pair of pipes forming the flow path C5 of the motor passing through the circuit 65 are connected to the two connection ports 71x of the eight-way valve 71.

[0041] Next, the coolant module 100 constituting the heat carrier circuit 60 and the refrigerant module 150 constituting the refrigerant circuit 50 will be described in detail. Figure 2 (a) and Figure 2 As shown in (b), the coolant module 100 and the refrigerant module 150 are integrated and constitute the thermal management system 200.

[0042] (Coolant module)

[0043] like Figure 3 and Figure 4 As shown, the coolant module 100 includes: a housing (housing for the coolant module) 1; the aforementioned multi-way valves (four-way valve 70, eight-way valve 71, three-way valve 72), multiple pumps 3a, 3b, 3c, and multiple reservoirs 4a, 4b, 4c disposed on the housing 1. Figure 3 and Figure 4 (not shown in the figure); and a portion of the aforementioned flow paths C1 to C5 formed in the housing 1.

[0044] The shell 1 is generally rectangular in shape and has: a first shell side 1a facing one side of its own width direction (shell width direction) D1; a second shell side 1b facing the other side of the width direction D1; a shell back 1c facing one side (inner side) of its own depth direction (shell depth direction) D2 that intersects (orthogonally) the width direction D1; a shell front 1d facing the other side (near the front side) of the depth direction D2; a shell top 1e facing one side (upper side) of its own height direction (shell height direction) D3 that intersects (orthogonally) the width direction D1 and the depth direction D2; and a shell bottom 1f facing the other side (lower side) of the height direction D3.

[0045] Furthermore, the front surface 1d of the housing 1 is a facing housing surface opposite to the refrigerant module 150, which will be described in detail later, while the other surfaces 1a, 1b, 1c, 1e, and 1f of the housing 1 are non-facing housing surfaces that do not face the refrigerant module 150. In the front surface 1d, which is a facing housing surface, a pair of condenser connection ports Cy are formed, communicating with each of the inlet 52a and outlet 52b of the heat carrier R2 of the condenser 52 of the refrigerant module 150, which will be described in detail later. Additionally, a pair of evaporator connection ports Cz are formed in the front surface 1d, communicating with each of the inlet 54a and outlet 54b of the heat carrier R2 in the evaporator 54. The pair of evaporator connection ports Cz are arranged at a distance from each other in the height direction D3 and at approximately the same position in the width direction D1, and are arranged on the second housing side surface 1b in the width direction D1 relative to the pair of condenser connection ports Cy.

[0046] Here, return to Figure 2 (a) and Figure 2 (b) In the thermal management system 200, the coolant module 100 is configured such that its depth direction D2 is aligned with the overall depth direction (system depth direction Dy) of the thermal management system 200, and its height direction D3 is aligned with the overall height direction (system height direction Dz) of the thermal management system 200. That is, the coolant module 100 is opposite to and connected to the refrigerant module 150 (described in detail later) from the inside of the system depth direction Dy.

[0047] like Figure 5As shown, the eight-way valve 71 includes: a valve rotation shaft 71a; a valve drive unit 71b that rotates the valve rotation shaft 71a; and a valve core 71c that switches the flow path of the heat carrier R2 in the heat carrier circuit 60 by rotating the valve rotation shaft 71a. The valve rotation shaft 71a rotates about a rotation axis O1 extending along the depth direction D2. That is, the valve rotation shaft 71a extends in the depth direction D2. In addition, the valve core 71c has the aforementioned eight connection ports 71x for the heat carrier R2 to flow (inflow and out) relative to itself. The eight-way valve 71 is provided on the back surface 1c of the housing 1, which forms the non-opposite side housing surface (see reference). Figure 3 ).

[0048] Like the eight-way valve 71, the four-way valve 70 includes: a valve rotation shaft 70a; a valve drive unit 70b that rotates the valve rotation shaft 70a; and a valve core 70c that switches the flow path of the heat carrier R2 in the heat carrier circuit 60 by rotating the valve rotation shaft 70a. The valve rotation shaft 70a rotates about a rotation axis O2 extending along the height direction D3. That is, the valve rotation shaft 70a extends in the height direction D3. In addition, the valve core 70c has the aforementioned four connection ports 70x for the heat carrier R2 to flow (inflow and out) relative to itself. The four-way valve 70 is disposed on the housing surface 1e of the housing 1, which forms the non-opposite side housing surface (see reference). Figure 3 ).

[0049] Therefore, in the four-way valve 70 and eight-way valve 71, which are multi-way valves in this embodiment, the rotation axes O1 and O2 of the valve rotation shafts 70a and 71a extend in a direction that intersects the width direction D1.

[0050] Return to Figure 3 In this embodiment, a first pump 3a, a second pump 3b, and a third pump 3c are provided as multiple pumps. These pumps 3a, 3b, and 3c pressurize heat carriers R2 at different temperature ranges in the heat carrier circuit 60. That is, the first pump 3a pressurizes the heat carrier R2 at the highest temperature, the second pump 3b pressurizes the heat carrier R2 at the lowest temperature, and the third pump 3c pressurizes heat carrier R2 at any temperature from the temperature of the heat carrier R2 pressed by the first pump 3a to the temperature of the heat carrier R2 pressed by the second pump 3b.

[0051] Moreover, such as Figure 5As shown, the first pump 3a includes: a pump rotating shaft 30a that rotates about a rotation axis O3a extending in the width direction D1; a pump drive unit 31a that rotates the pump rotating shaft 30a; and an impeller 32a that actuates by the rotation of the pump rotating shaft 30a to pressurize the heat transfer fluid R2. The first pump 3a is disposed on the side surface 1a of the first housing such that its own pump rotating shaft 30a extends in the width direction D1, and the side surface 1a of the first housing is the surface of the non-opposing side housing surface facing the width direction D1 that intersects the depth direction D2 (see reference). Figure 8 ).

[0052] Similarly, the second pump 3b includes: a pump rotating shaft 30b that rotates about a rotation axis O3b extending in the width direction D1; a pump drive unit 31b that rotates the pump rotating shaft 30b; and an impeller 32b that actuates by the rotation of the pump rotating shaft 30b to pressurize the heat transfer fluid R2. The second pump 3b is disposed on the side surface 1b of the second housing such that its own pump rotating shaft 30b extends in the width direction D1, and the side surface 1b of the second housing forms a surface in the non-opposite side housing surface facing the width direction D1 that intersects the depth direction D2 (see reference). Figure 7 Here, the three-way valve 72, which is a multi-way valve, is arranged with the second pump 3b in the height direction D3 in the side 1b of the second housing, and is disposed on the other side (lower side) of the height direction D3 relative to the second pump 3b.

[0053] Similarly, the third pump 3c includes: a pump rotating shaft 30c that rotates about a rotation axis O3c extending in the width direction D1; a pump drive unit 31c that rotates the pump rotating shaft 30c; and an impeller 32c that operates by the rotation of the pump rotating shaft 30c to pressurize the heat transfer medium R2. The third pump 3c is disposed on the side surface 1a of the first housing such that its own pump rotating shaft 30a extends in the width direction D1, and the side surface 1a of the first housing forms a surface in the non-opposite side housing surface facing the width direction D1, which intersects the depth direction D2. In addition, the third pump 3c is arranged with the first pump 3a in the height direction D3 in the side surface 1a of the first housing, and is disposed on the other side (lower side) of the height direction D3 relative to the first pump 3a.

[0054] Multiple liquid storage tanks 4a, 4b, 4c (refer to) Figure 1 It is integrally disposed on a housing not shown, for example, on the upper part 1e of the housing above the four-way valve 70, and connected to the inlet / outlet Ct of the heat transfer fluid formed on the upper part 1e of the housing.

[0055] (Refrigerant Module)

[0056] Next, the refrigerant module 150 constituting the above-mentioned refrigerant circuit 50 will be described in detail.

[0057] Return to Figure 2 (a) and Figure 2 (b) The refrigerant module 150 includes: a housing (housing for refrigerant module) 5; and the aforementioned compressor 51, condenser 52, and pressure reducing device 53 (see reference) disposed in the housing 5. Figure 1 ), evaporator 54 and storage tank 55; and the aforementioned flow path C6 formed in the shell 5 (refer to Figure 1 ).

[0058] like Figure 6 As shown, housing 5, like housing 1 in coolant module 100, is generally cuboid in shape. On its inner side, it has a flow path C6 for refrigerant R1, which, together with compressor 51, condenser 52, pressure reducing device 53, evaporator 54, and storage tank 55, to flow through. Housing 5 has: a first housing side 5a facing one side in the width direction D1; a second housing side 5b facing the other side in the width direction D1; a housing top 5c facing the upper side in the system height direction Dz; a housing bottom 5d facing the lower side in the system height direction Dz; a housing front 5e facing one side (near the front) in the system depth direction Dy; and a housing back 5f facing the other side (inner side) in the system depth direction Dy. The housing back 5f is positioned opposite the housing front 1d of housing 1 in the system depth direction Dy.

[0059] That is, the back surface 5f of the housing 5 forms a refrigerant module side housing surface opposite to the front surface 1d of the housing of the coolant module 100, and the other surfaces 5a, 5b, 5c, 5d, and 5e of the housing 5 form non-opposite refrigerant module side housing surfaces that are not opposite to the coolant module 100.

[0060] The compressor 51 compresses the refrigerant R1 to a high temperature and high pressure state. The compressor 51 is disposed on the front side 5e of the housing 5, which is the non-opposite side of the housing surface forming the refrigerant module side.

[0061] The condenser 52 dissipates heat from the refrigerant R1, which has been compressed by the compressor 51 to a high-temperature, high-pressure state, and condenses the refrigerant R1 to a low-temperature, high-pressure state. The condenser 52 is located on the back side 5f of the housing 5, opposite the refrigerant module side, and a portion of it protrudes from the back side 5f. Furthermore, the condenser 52 has an inlet 52a and an outlet 52b. The inlet 52a is connected to the condenser formed on the front 1d of the housing of the coolant module 100 via a connection port Cy, allowing heat transfer fluid R2 from the coolant module 100 to flow into the condenser 52. The outlet 52b allows the heat transfer fluid R2 to flow out of the condenser 52 toward the coolant module 100. In this embodiment, the inlet 52a is located on the lower 5d side of the housing, and the outlet 52b is located on the upper 5c side of the housing.

[0062] In this embodiment, the pressure reducing device 53 is an expansion valve that reduces the pressure of the refrigerant R1, which is in a low-temperature, high-pressure state in the condenser 52, to a low-temperature, low-pressure state. The pressure reducing device 53 is located on the upper part 5c of the housing, which is not opposite to the housing surface forming the refrigerant module side.

[0063] The evaporator 54 absorbs heat from the refrigerant R1, which is in a low-temperature, low-pressure state in the pressure reducing device 53, and evaporates the refrigerant R1 to a high-temperature, low-pressure state. The evaporator 54 is located on the back side 5f of the housing 5, opposite the refrigerant module side, and partially protrudes from the back side 5f. Furthermore, the evaporator 54 is arranged relative to the condenser 52 in the width direction (first transverse) D1, intersecting the system depth direction Dy (D2), on the second housing side side 5b. In addition, the evaporator 54 has an inlet 54a and an outlet 54b. The inlet 54a is connected to the evaporator formed on the front 1d of the coolant module 100 housing via a connection port Cz, allowing the heat transfer fluid R2 from the coolant module 100 to flow into the evaporator 54. The outlet 54b allows the heat transfer fluid R2 to flow out of the evaporator 54 towards the coolant module 100. In this embodiment, the inlet 54a is located on the upper side 5c of the housing, and the outlet 54b is located on the lower side 5d of the housing.

[0064] The storage tank 55 performs gas-liquid separation of the heat carrier R2 upstream of the compressor 51. In this embodiment, the storage tank 55 is disposed on the second housing side 5b forming the non-opposite side housing surface of the refrigerant module, that is, on the second housing side 5b side in the width direction D1 relative to the condenser 52 and the evaporator 54, and is disposed in the system depth direction Dy at a position closer to the front side than the housing back 5f.

[0065] Therefore, relative to the evaporator 54 and condenser 52, the compressor 51 is positioned on the side opposite to the refrigerant module 100 in the system depth direction Dy. Furthermore, when the inlet 52a and outlet 52b are connected to the condenser connection port Cy, and the inlet 54a and outlet 54b are connected to the evaporator connection port Cz, the front end 1d of the housing and the back end 5f of the housing are in at least partial contact, and the refrigerant module housing 5 and the coolant module housing 1 are integrated.

[0066] (Effects)

[0067] According to the thermal management system 200 of this embodiment described above, the condenser 52 and evaporator 54 of the refrigerant module 150 are arranged close to or opposite to the front 1d of the housing in the coolant module 100. A condenser connection port Cy is formed on the front 1d of the housing, connecting to the condenser 52 and allowing the heat transfer medium R2 to flow between the condenser 52 and the evaporator. An evaporator connection port Cz is formed on the front 1d of the housing, connecting to the evaporator 54 and allowing the heat transfer medium R2 to flow between the evaporator and the evaporator. Therefore, when the coolant module 100 and the refrigerant module 150 are connected, the components in the coolant module 100 and the refrigerant module 150 do not obstruct each other, allowing the coolant module 100 and the refrigerant module 150 to be brought close together and connected, making it easy to integrate the modules 100 and 150. As a result, the overall compactness of the thermal management system 200 can be achieved.

[0068] In particular, in this embodiment, the eight-way valve 71, which is a multi-way valve, is disposed on the back side 1c of the housing opposite to the front side 1d of the housing in the depth direction D2. In particular, in this embodiment, the rotation axis O2 of the eight-way valve 71 extends in the depth direction D2, which intersects the front side 1d of the housing. Therefore, when connecting the coolant module 100 and the refrigerant module 150, the eight-way valve 71 will not be an obstruction, the coolant module 100 and the refrigerant module 150 can be arranged close to each other, and sufficient space can be provided for the installation of the eight-way valve 71, which often has a large diameter due to having multiple connection ports 71x, to cope with the complexity of the flow path of the heat carrier R2 in the heat carrier circuit 60.

[0069] Furthermore, pumps 3a and 3c are disposed on the first housing side 1a facing the width direction D1 intersecting the depth direction D2, and pump 3b is disposed on the second housing side 1b. Therefore, pumps 3a to 3c are disposed on a surface other than the front 1d of the housing 1, and on a surface different from the four-way valve 70 and eight-way valve 71 that form the multi-way valves. Therefore, when connecting the coolant module 100 and the refrigerant module 150, pumps 3a to 3c will not obstruct the connection, allowing the coolant module 100 and refrigerant module 150 to be arranged close together, and ensuring sufficient space for the four-way valve 70 and eight-way valve 71 that form the multi-way valves.

[0070] Furthermore, in the refrigerant module 150, the condenser 52 and evaporator 54 are disposed on the back side 5f of the housing, while the compressor 51 and pressure reducing device 53 are disposed on the side of the housing 5 other than the back side 5f. Therefore, the compressor 51 and pressure reducing device 53 are positioned in a location not opposite to the front side 1d of the housing in the refrigerant module 100, so that they do not obstruct the connection between the refrigerant module 100 and the refrigerant module 150.

[0071] In addition, by connecting modules 10 and 150 relative to each other in the system depth direction Dy, the size of the system height direction Dz in the thermal management system 200 can be suppressed.

[0072] Furthermore, the first pump 3a and the third pump 3c are disposed on the first housing side 1a within the housing 1, and the second pump 3b is disposed on the second housing side 1b opposite to the first housing side 1a in the width direction D1. The extension directions of the rotation axes O1 and O2 of the valve rotation shafts 70a and 71a of the multi-way valves (four-way valve 70 and eight-way valve 71) are arranged to intersect the width direction D1. In particular, in this embodiment, the eight-way valve 71, which forms the multi-way valve, is disposed on the back side 1c of the housing. Therefore, compared to the case where the pumps 3a to 3c are disposed on a surface facing the same direction as the extension directions of the rotation axes O1 and O2 of the multi-way valves, the dimensions of the extension directions of the rotation axes O1 and O2 of the multi-way valves within the housing 1 can be suppressed, enabling a more compact coolant module 100.

[0073] Furthermore, by configuring the eight-way valve 71 such that the extension direction of the rotation axis O2 of the eight-way valve 71 intersects the width direction D1, even if the eight-way valve 71, which has a certain diameter due to having eight connection ports 71x, is set as a multi-way valve, interference between the multi-way valve and the pumps 3a to 3c can be avoided. This allows for setting more switching modes of the flow path of the heat transfer medium R2 and can also cope with the complexity of the flow path.

[0074] In addition, by setting the first pump 3a and the third pump 3c on the first housing side 1a in the housing 1, and setting the second pump 3b on the second housing side 1b opposite to the first housing side 1a in the width direction D1, it is possible to obtain the weight balance in the width direction D1 of the coolant module 100.

[0075] In addition, by placing the first pump 3a and the second pump 3b, which pressurize the heat carriers R2 of different temperature zones, on different surfaces of the housing 1, and placing the second pump 3b and the third pump 3c on different surfaces of the housing 1, it is possible to avoid the heat carriers R2 of different temperature zones from being thermally affected by each other between the first pump 3a and the second pump 3b and between the second pump 3b and the third pump 3c.

[0076] In particular, in this embodiment, since the high-temperature side heat carrier circuit section 62 constituting the heat carrier circuit 60 of the thermal management system 200 has a first pump 3a, the first pump 3a among the plurality of pumps 3a to 3c pressurizes the heat carrier R2 with the highest temperature. On the other hand, since the low-temperature side heat carrier circuit section 63 constituting the heat carrier circuit 60 of the thermal management system 200 has a second pump 3b, the second pump 3b among the plurality of pumps 3a to 3c pressurizes the heat carrier R2 with the lowest temperature. In view of this, in this embodiment, by providing the first pump 3a for the high-temperature heat carrier R2 and the second pump 3b for the low-temperature heat carrier R2 on opposite sides of the width direction D1 of the housing 1, the thermal influence between them can be minimized.

[0077] Furthermore, in this embodiment, an eight-way valve 71, which serves as a multi-way valve, is disposed on the front 1c of the housing facing the side intersecting the width direction D2, and a four-way valve 70, which also serves as a multi-way valve, is disposed on the upper 1e of the housing facing the side intersecting the width direction D3. That is, by arranging the pumps 3a to 3c, the four-way valve 70, and the eight-way valve 71 on different surfaces of the housing 1, the dimensions of each surface in the housing 1 can be reduced to a smaller size, further achieving a more compact overall coolant module 100.

[0078] This invention is not limited to the embodiments described above, and various modifications can be made without departing from the spirit of the invention.

[0079] For example, the relative positions of the coolant module 100 and the refrigerant module 150 are not limited to the above-described cases. Specifically, as... Figure 7 of (a) Figure 7As shown in (b), the upper part 5c of the housing of the refrigerant module 150 can also be arranged opposite to the front part 1d of the housing of the coolant module 100. That is, the modules 100 and 150 can also be arranged opposite each other in the system height direction Dz. Moreover, in this case, the compressor 51 is arranged on the side opposite to the coolant module 100 in the system depth direction (second lateral direction) Dy relative to the condenser 52 and the evaporator 54. Furthermore, in this case, as Figure 8 As shown, an inlet 52a for the heat transfer fluid R2 from the coolant module 100 to flow into the condenser 52 and an outlet 52b for the heat transfer fluid R2 to flow out from the condenser 52 toward the coolant module 100 are formed on the shell surface 5c. Similarly, an inlet 54a for the heat transfer fluid R2 from the coolant module 100 to flow into the evaporator 54 and an outlet 54b for the heat transfer fluid R2 to flow out from the evaporator 54 toward the coolant module 100 are also formed on the shell surface 5c. The inlet 52a is located on the inner side in the system depth direction Dy, and the outlet 52b is located near the front side. The inlet 54a is located near the front side in the system depth direction Dy, and the outlet 54b is located on the inner side. Thus, in... Figure 7 of (a) Figure 7 (b) and Figure 8 The thermal management system 200 shown can suppress the size of the system depth direction Dy.

[0080] Alternatively, the third pump 3c can be located on the second housing side 1b instead of the first housing side 1a, as long as at least the first pump 3a and the second pump 3b are located on opposite sides of the housing 1.

[0081] In addition, the positions of the four-way valve 70 and the eight-way valve 71 can be reversed as described above, as can the positions of the three-way valve 72 and the four-way valve 70.

[0082] Furthermore, the structure of the heat carrier circuit 60 is not limited to the above, as long as the flow path of the heat carrier R2 can be switched in order to perform temperature regulation and / or air regulation of the vehicle equipment K.

[0083] [Industrial Applicability]

[0084] The thermal management system according to the present invention can achieve compactness by enabling modules to be connected close to each other.

[0085] Symbol Explanation

[0086] 1…Housing for coolant module; 1a…First shell side; 1b…Second shell side; 1c…back of the casing; 1d…front of the shell; 1e…on the shell; 1f…below the shell; 3a…First pump; 3b…Second pump; 3c…the third pump; 5…Housing for refrigerant modules; 5a…First shell side; 5b…Second shell side; 5c…on the shell; 5d…below the shell; 5e…front of the casing; 5f…back of the casing; 30a, 30b, 30c… Pump rotating shafts; 31a, 31b, 31c… Pump drive unit; Impellers 32a, 32b, 32c… 50…refrigerant circuit; 51…compressor; 52…Condenser; 52… Evaporator; 52a…flow inlet; 52b…outlet; 53…pressure reducing device; 54… Evaporator; 54a…flow inlet; 54b…outlet; 55… storage tanks; 60…Heat carrier circuit; 61…Radiator circuit section; 62…High-temperature side heat transfer circuit section; 63… Low-temperature side heat transfer circuit section; 64…Onboard equipment temperature regulation heat transfer circuit section; 65…The motor passes through the circuit section; 70… Four-way valve; 70a…valve rotating shaft; 71…Eight-way valve; 71a…valve rotating shaft; 100… Coolant module; 150…refrigerant module; 200… Heat Management System; C1~C6… flow path; Cy…Condenser connection port; Cz…Evaporator connection port; D1…width direction; D2…Depth direction; D3…height direction; Dy…system depth direction; Dz…system height direction; K…vehicle-mounted equipment; R1…refrigerant (second heat carrier); R2… heat carrier (first heat carrier).

Claims

1. A heat management system, The thermal management system is installed in the vehicle and performs temperature regulation for on-board equipment and / or air conditioning within the vehicle. The thermal management system includes: A cooler module having a coolant module housing and a multi-way valve, the coolant module housing forming a flow path for a first heat carrier to flow through, and the multi-way valve being disposed in the coolant module housing and switching the flow path of the first heat carrier in the flow path; as well as The refrigerant module has a refrigerant circuit consisting of a compressor, a condenser, a pressure reducing device, and an evaporator, which circulates a second heat carrier. The second heat carrier exchanges heat with the first heat carrier in the condenser and the evaporator. The coolant module housing has a pair of condenser connection ports on its opposite side housing surface, which communicate with the inlet and outlet of the first heat carrier in the condenser, and a pair of evaporator connection ports, which communicate with the inlet and outlet of the first heat carrier in the evaporator. The multi-way valve is provided on a non-opposite side housing surface, other than the opposite side housing surface, in the housing for the coolant module. The condenser and the evaporator are disposed on one side of the opposite housing surface of the refrigerant module and are arranged in a first transverse direction that intersects the opposite direction of the opposite housing surface and the refrigerant module.

2. The heat management system as described in claim 1, characterized in that, The multi-way valve includes: Valve rotating shaft; and The valve core switches the flow path of the first heat carrier by rotating the valve rotation shaft. The multi-way valve is disposed on the side of the non-opposite side housing surface opposite to the opposite side housing surface in the opposite direction. The axis of rotation of the valve rotation shaft extends in a direction that intersects the opposite side housing surface.

3. The heat management system as described in claim 1 or 2, characterized in that, The multi-port valve is a valve having five or more connection ports for the first heat carrier to flow through.

4. The heat management system as described in claim 1 or 2, characterized in that, The coolant module also includes a pump, which is disposed in the housing of the coolant module and pressurizes the first heat transfer medium in the flow path. The pump is disposed on the non-opposite side of the housing surface, facing a direction that intersects with the opposite direction.

5. The heat management system as described in claim 1 or 2, characterized in that, The refrigerant module also includes a refrigerant module housing in which the refrigerant circuit is provided. The refrigerant module is formed by a housing with a refrigerant module-side opposite housing surface that is opposite to the opposite housing surface in the coolant module, and a refrigerant module-side non-opposite housing surface other than the refrigerant module-side opposite housing surface. The condenser and the evaporator are disposed on opposite sides of the refrigerant module housing within the refrigerant module housing. The compressor and the pressure reducing device are disposed on the non-opposite side of the housing surface of the refrigerant module in the housing of the refrigerant module.

6. The heat management system as described in claim 1 or 2, characterized in that, The compressor in the refrigerant module is configured on the opposite side of the refrigerant module in the relative direction to the condenser and the evaporator.

7. The heat management system as described in claim 1 or 2, characterized in that, The compressor in the refrigerant module is arranged relative to the condenser and the evaporator in the opposite direction and in a second transverse direction intersecting the first transverse direction.

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