Chip coplanarity detection equipment and detection process

Abstract

The invention relates to the technical field of chip detection, and discloses chip coplanarity detection equipment and a chip coplanarity detection technology.The detection equipment comprises a base, a first support is fixedly installed on the base, a first electric telescopic rod pointing to the base is fixedly installed on the first support, and a vertical rod is fixedly installed at the output end of the first electric telescopic rod; a first pressing plate is rotatably mounted at the end of the vertical rod, a supporting plate which is used in cooperation with the first pressing plate and driven by a motor is rotatably mounted on the base, and a first mounting frame is fixedly mounted on the base. The beneficial effects of the invention are that the chip is supported by the supporting plate, and the pins are in a natural suspension state, thereby avoiding the deformation of the pins when the chip is placed, and improving the detection accuracy.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, specifically to a chip coplanarity testing device and testing process. Background Technology

[0002] Electronic product assembly technology is a supporting technology for electronic information technology and the electronics industry. Each production link is interconnected, and chip packaging is an important part of it. The coplanarity of chip pins will directly affect the operation of the next step.

[0003] Chip pin forming mainly relies on two methods: equipment forming and manual forming. However, during the forming process, the rebound phenomenon caused by the pin material can lead to pins not being coplanar or not adhering to the bottom. If the coplanarity does not meet the requirements, it will directly lead to the chip product being unqualified. To address the above technical problem, the patent with publication number CN114279371A can detect this problem in a timely manner by comparing the first image information with the qualified standard information. Then, unqualified chips can be processed. However, when using this method, the chip is placed on the platform with its pins. Due to the weight of the chip, the warped pins may be flattened, leading to errors in the detection results and reducing the accuracy of the detection results. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing a device for detecting the coplanarity of chip pins, thereby achieving high detection accuracy.

[0005] The objective of this invention can be achieved through the following technical solutions: A chip coplanarity detection device includes a base, a first bracket fixedly mounted on the base, a first electrically operated telescopic rod pointing towards the base fixedly mounted on the first bracket, a vertical rod fixedly mounted at the output end of the first electrically operated telescopic rod, a first pressure plate rotatably mounted at the end of the vertical rod, a support plate rotatably mounted on the base and used in conjunction with the first pressure plate and driven by a motor, a first mounting frame fixedly mounted on the base, a first movable plate slidably mounted on the first mounting frame, and a first servo module for moving the first movable plate on the first mounting frame, a first image sensor mounted on the first movable plate, a horizontal plate fixedly mounted on the first movable plate, a second laser ranging sensor mounted on the horizontal plate, and a side plate fixedly mounted on the base, the second image sensor being perpendicular to the detection plane of the first image sensor.

[0006] As a further embodiment of the present invention: a second mounting bracket is fixedly mounted on the first movable plate, a second movable plate is slidably mounted on the second mounting bracket, a screw that drives the second movable plate to move is rotatably mounted on the second mounting bracket, and a first image sensor is fixedly mounted on the second movable plate.

[0007] As a further embodiment of the present invention: a third movable plate is slidably mounted on the horizontal plate, a second image sensor is fixedly mounted on the third movable plate, and a second servo module that drives the third movable plate to move is provided on the horizontal plate.

[0008] As a further embodiment of the present invention: a base plate is rotatably mounted on the vertical rod. The base plate is square, and a second electric telescopic rod is fixedly mounted on one side of the base plate. A second bracket is fixedly mounted at the end of the second electric telescopic rod. A support plate is slidably mounted on the second bracket. A support rod is fixedly mounted on the surface of the support plate near the base. A first roller is rotatably mounted at the end of the support rod. The upper surface of the first roller is lower than the lower surface of the first pressure plate. Two sets of first laser ranging sensors for detecting the distance from the first moving plate to the side of the base plate are fixedly mounted on the first moving plate.

[0009] As a further embodiment of the present invention: a second pressure plate is slidably mounted on the second bracket, a first spring is fixedly mounted on the second pressure plate, the first spring is fixedly connected to the second bracket, and a pressure sensor that cooperates with the second pressure plate is fixedly mounted on the support plate.

[0010] As a further aspect of the present invention: a third mounting bracket is fixedly installed on the surface of the first pressure plate near the substrate, and a first electromagnet is slidably mounted on the third mounting bracket via a sliding plate, and the first electromagnet attracts the substrate when energized.

[0011] As a further embodiment of the present invention: a lifting frame is slidably mounted on the support plate, the lifting frame is U-shaped and a U-shaped auxiliary frame is slidably mounted on the lower end of the lifting frame, a second roller is rotatably mounted on the end of the auxiliary frame and a third electric telescopic rod that drives the auxiliary frame to move is fixedly mounted on the lifting frame.

[0012] As a further aspect of the present invention: a second spring is fixedly installed on the surface of the support plate away from the base, the second spring is fixedly connected to the lifting frame, and a second electromagnet is fixedly installed on the surface of the support plate away from the base, the second electromagnet being energized to attract and fix the lifting frame.

[0013] The present invention also provides a detection process applied to the chip coplanarity detection equipment described above, comprising the following steps: Step S1: Place the chip to be tested on the support plate, and then the first electric telescopic rod drives the first pressure plate to move downward so that the first pressure plate contacts the upper surface of the chip; Step S2: The chip rotates by driving the support plate with a motor, and stops when one side of the chip is parallel to the first moving plate; Step S3: Adjust the positions of the first moving plate and the second moving plate so that the first image sensor moves to the position corresponding to the chip pin; Step S4: The first image sensor and the second image sensor respectively capture images of the two sides of the pin for detection. Then, the support plate drives the chip to rotate 180 degrees so that the pin on the other side moves to the detection position for detection.

[0014] The beneficial effects of this invention are: (1) In this invention, the chip is supported by a support plate and the pins are in a natural suspended state, which avoids pin deformation caused by chip placement and improves the accuracy of detection. The first image sensor and the second image sensor respectively take pictures of the two sides of the pins to realize multi-side detection of the chip pins. When the pins have slight deformation, the specific pin position can be detected and the deformed pin can be individually tested to see if it is qualified, which improves the accuracy of the detection results and can obtain accurate deformation data and position. If the product is unqualified, it is convenient for subsequent adjustment and maintenance.

[0015] (2) In this invention, the second electric telescopic rod retracts to drive the first roller to move along the side of the chip, so that the second electric telescopic rod can be perpendicular to the side of the chip and realize that the four sides of the substrate are parallel to the four sides of the chip. Then, the chip side is positioned by two sets of first laser ranging sensors, which ensures the accuracy of the chip placement position during detection, and enables the first image sensor to accurately capture and detect the side of the pin, thereby improving the accuracy of the detection results.

[0016] (3) In this invention, the second electric telescopic rod is directly pushed to rotate when it is almost perpendicular to the side of the chip by means of the lifting frame, the auxiliary frame and the second roller, which avoids applying a large pressure to the side of the chip, avoids damage to the chip and ensures the quality of the chip. Attached Figure Description

[0017] The invention will now be further described with reference to the accompanying drawings.

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0019] Figure 2 This is a schematic diagram of the structure during the detection process of this invention.

[0020] Figure 3 This is a schematic diagram of the structure of the first pressure plate in this invention.

[0021] Figure 4 This is a schematic diagram of the support plate in this invention.

[0022] Figure 5 yes Figure 2 Enlarged diagram of point A in the middle.

[0023] In the diagram: 1. Base; 2. Support plate; 3. First bracket; 4. First electric telescopic rod; 5. Vertical rod; 6. First pressure plate; 7. First mounting bracket; 8. First moving plate; 9. First servo module; 10. First laser rangefinder sensor; 11. Second mounting bracket; 12. Second moving plate; 13. First image sensor; 14. Screw; 15. Horizontal plate; 16. Third moving plate; 17. Second laser rangefinder sensor; 18. Second servo module; 19. 20. Side plate; 21. Second image sensor; 22. Substrate; 23. Third mounting bracket; 24. Slide plate; 25. First electromagnet; 26. Second electric telescopic rod; 27. Second bracket; 28. Support plate; 29. ​​Support rod; 30. First roller; 31. Second pressure plate; 32. Pressure sensor; 33. Lifting frame; 34. Second spring; 35. Second electromagnet; 36. Third electric telescopic rod; 37. Auxiliary frame; 38. Second roller. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] Please see Figures 1-5As shown, this invention is a chip coplanarity detection device, including a base 1, a first bracket 3 fixedly mounted on the base 1, a first electric telescopic rod 4 pointing towards the base 1 fixedly mounted on the first bracket 3, a vertical rod 5 fixedly mounted at the output end of the first electric telescopic rod 4, a first pressure plate 6 rotatably mounted at the end of the vertical rod 5, a support plate 2 rotatably mounted on the base 1 that cooperates with the first pressure plate 6 and is driven by a motor, a first mounting frame 7 fixedly mounted on the base 1, a first movable plate 8 slidably mounted on the first mounting frame 7, and a first servo module 9 that drives the first movable plate 8 to move on the first mounting frame 7, a first image sensor 13 mounted on the first movable plate 8, and a second mounting frame 11 fixedly mounted on the first movable plate 8. A second movable plate 12 is slidably mounted on the second mounting bracket 11. A screw 14 that drives the second movable plate 12 to move is rotatably mounted on the second mounting bracket 11. A first image sensor 13 is fixedly mounted on the second movable plate 12. A horizontal plate 15 is fixedly mounted on the first movable plate 12. A second laser rangefinder sensor 17 is provided on the horizontal plate 15. A third movable plate 16 is slidably mounted on the horizontal plate 15. A second image sensor 20 is fixedly mounted on the third movable plate 16. A second servo module 18 that drives the third movable plate 16 to move is provided on the horizontal plate 15. A side plate 19 is fixedly mounted on the base 1. A second image sensor 20 is fixedly mounted on the side plate 19. The second image sensor 20 is perpendicular to the detection plane of the first image sensor 13.

[0026] In practical application, the chip to be tested is placed on the support plate 2, with the chip's pins located outside the support plate 2 and in a naturally suspended state. Then, the first electric telescopic rod 4 drives the first pressure plate 6 to move downwards, making the first pressure plate 6 contact the upper surface of the chip, thus fixing the chip. The support plate 2 is rotated by the motor, causing the chip to rotate. When one side of the chip is parallel to the first moving plate 8, the rotation stops. At this time, the side where the chip pins are located is perpendicular to the first moving plate 8 and faces the second image sensor 20. The position of the first moving plate 8 is adjusted by the first servo module 9, and the position of the second moving plate 12 is adjusted by the screw 14, so that the first image sensor 13 moves to the position corresponding to the chip pins. The first image sensor 13 and the second image sensor 20 respectively capture and detect the two sides of the pins. If the image captured by the first image sensor 13 completely matches the side trajectory of the pins, and the pin ends captured by the second image sensor 20 are on a straight line, it indicates that multiple sets of pins are completely coplanarly distributed, and the product is qualified. Then, the support plate 2 drives the chip to rotate 180 degrees, moving the pins on the other side to the detection position for detection. If the image captured by the first image sensor 13 does not perfectly match the side trajectory of the pin, resulting in extra trajectories, it indicates that the pin is warped and multiple sets of pins are not completely coplanarly distributed. In this case, the ends of the pins captured by the second image sensor 20 are not completely aligned on a straight line. The pins whose ends are distributed outside this straight line are the deformed pins. At this time, the second servo module 18 drives the third moving plate 16 to move below the deformed pins. The second laser ranging sensor 17 detects the distance to the lower surface of this set of pins, and simultaneously detects the distance to the lower surface of another set of undeformed pins, calculating the difference between the two. If the difference is... If the chip is within the acceptable range, it is considered an unacceptable product; otherwise, it is considered unacceptable. The chip is supported by the support plate 2, and the pins are in a naturally suspended state, which avoids pin deformation caused by chip placement and improves the accuracy of detection. The first image sensor 13 and the second image sensor 20 respectively capture images of the two sides of the pins, realizing multi-side detection of the chip pins. When the pins show slight deformation, the specific pin position can be detected and the deformed pin can be individually tested to see if it is qualified, which improves the accuracy of the detection results and can obtain accurate deformation data and position. If the product is unacceptable, it is convenient for subsequent adjustment and maintenance.

[0027] Please see Figure 1 , Figure 2 , Figure 4 As shown, the present invention is a chip coplanarity detection device. A substrate 21 is rotatably mounted on a vertical rod 5. The substrate 21 is square, and a second electric telescopic rod 25 is fixedly mounted on one side of the substrate 21. A second bracket 26 is fixedly mounted at the end of the second electric telescopic rod 25. A support plate 27 is slidably mounted on the second support 26. A support rod 28 is fixedly mounted on the surface of the support plate 27 near the base 1. A first roller 29 is rotatably mounted at the end of the support rod 28. The upper surface of the first roller 29 is lower than the lower surface of the first pressure plate 6. Two sets of first laser ranging sensors 10 for detecting the distance from the first moving plate 8 to the side of the substrate 21 are fixedly mounted on the first moving plate 8.

[0028] Specifically, a second pressure plate 31 is slidably mounted on the second bracket 26, a first spring 30 is fixedly mounted on the second pressure plate 31, the first spring 30 is fixedly connected to the second bracket 26, and a pressure sensor 32 that works in conjunction with the second pressure plate 31 is fixedly mounted on the support plate 27.

[0029] Specifically, a third mounting bracket 22 is fixedly mounted on the surface of the first pressure plate 6 near the substrate 21. A first electromagnet 24 is slidably mounted on the third mounting bracket 22 via a sliding plate 23. When the first electromagnet 24 is energized, it attracts the substrate 21.

[0030] In practical application, after the chip is placed and fixed, the second electric telescopic rod 25 retracts, causing the second support 26 to move. Since the upper surface of the first roller 29 is lower than the lower surface of the first pressure plate 6, the first roller 29 will contact the side of the chip. As the second electric telescopic rod 25 retracts, the second support 26 moves, causing the end of the first spring 30 to move. After the first spring 30 is compressed, it applies pressure to the support plate 27 through the second pressure plate 31 and the pressure sensor 32. The pressure direction is along the length of the second electric telescopic rod 25. If the second electric telescopic rod 25 is not perpendicular to the side of the chip, the direction of the pressure will have an angle with the side of the chip. At this time, the pressure will push the second support 26. Roller 29 moves along the side of the chip, at which point the pressure on pressure sensor 32 disappears. Subsequently, as the second electric telescopic rod 25 continues to retract, the pressure on pressure sensor 32 reappears, causing the second electric telescopic rod 25 to gradually move in a direction perpendicular to the side of the chip until the two are perpendicular. After the second electric telescopic rod 25 is perpendicular to the side of the chip, the pressure on pressure sensor 32 increases linearly as the second electric telescopic rod 25 continues to retract, indicating that the second electric telescopic rod 25 is perpendicular to the side of the chip. At this time, the four sides of substrate 21 are parallel to the four sides of the chip. Then the second electric telescopic rod 25 extends until the pressure on pressure sensor 32 disappears. At this time, the first electromagnet 24 is energized. After being energized, the first electromagnet 24 moves upward under the action of magnetic force and is attracted and fixed to the substrate 21, so that the first pressure plate 6 is fixedly connected to the substrate 21. Then, the support plate 2 can drive the chip and the substrate 21 to rotate synchronously. The distance between the first moving plate 8 and the side of the substrate 21 is detected by two sets of first laser ranging sensors 10. When the detection readings of the two sets of first laser ranging sensors 10 are the same, the support plate 2 stops rotating. At this time, the side of the chip is parallel to the first moving plate 8, and the chip positioning adjustment is completed. The second electric telescopic rod 25 retracts and drives the first roller 29 to move along the side of the chip, so that the second electric telescopic rod 25 can be perpendicular to the side of the chip and realize that the four sides of the substrate 21 are parallel to the four sides of the chip. Then, the two sets of first laser ranging sensors 10 realize the positioning of the chip side, ensuring the accuracy of the chip placement position during detection, so that the first image sensor 13 can accurately capture and detect the side of the pin, improving the accuracy of the detection results.

[0031] Please see Figure 1 , Figure 2 , Figure 4 As shown, the present invention is a chip coplanarity detection device. A lifting frame 33 is slidably mounted on the support plate 27. The lifting frame 33 is U-shaped and a U-shaped auxiliary frame 37 is slidably mounted on the lower end of the lifting frame 33. A second roller 38 is rotatably mounted on the end of the auxiliary frame 37, and a third electric telescopic rod 36 that drives the auxiliary frame 37 to move is fixedly mounted on the lifting frame 33.

[0032] Specifically, a second spring 34 is fixedly installed on the surface of the support plate 27 away from the base 1. The second spring 34 is fixedly connected to the lifting frame 33. A second electromagnet 35 is fixedly installed on the surface of the support plate 27 away from the base 1. When the second electromagnet 35 is energized, it attracts and fixes the lifting frame 33.

[0033] In practical application, when the first roller 29 moves on the side of the chip so that the second electric telescopic rod 25 is almost perpendicular to the side of the chip, the thrust generated by the first spring 30 exerts a large pressure on the side of the chip and a small force on the first roller 29. Therefore, when the pressure detected by the pressure sensor 32 is greater than the set threshold, the second electric telescopic rod 25 stops retracting and extends. When the pressure of the pressure sensor 32 disappears, it continues to extend to the set length. When the second electromagnet 35 is energized, the lifting frame 33 moves downward under the action of magnetic force, compressing the second spring 34. The downward movement of the lifting frame 33 causes the second roller 38 to drop to a height that can contact the side of the chip. Then, the third electric telescopic rod 36 drives the auxiliary frame 37 to move closer to the chip. Since the support plate 27 is set at an angle with the side of the chip, when the auxiliary frame 37 moves, one set of second rollers 38 contacts the side of the chip first. Then, as the auxiliary frame 37 moves, it can push the substrate 21 to rotate through the support plate 27 and the second electric telescopic rod 25. When the pressure sensor 3... When the reading on 2 increases linearly again, it indicates that both sets of second rollers 38 are in contact with the side of the chip, and the second electric telescopic rod 25 is perpendicular to the side of the chip. At this time, the first electromagnet 24 fixes the first pressure plate 6 to the substrate 21. Then the auxiliary frame 37 is reset until the reading of the pressure sensor 32 disappears. The second electric telescopic rod 25 is directly pushed to rotate when it is about to be perpendicular to the side of the chip through the lifting frame 33, the auxiliary frame 37, and the second roller 38. This avoids applying too much pressure to the side of the chip, prevents damage to the chip, and ensures the quality of the chip.

[0034] Please see Figures 1-4 As shown, the present invention is a detection process applied to the chip coplanarity detection equipment described above, which includes the following steps: Step S1: Place the chip to be tested on the support plate 2, and then the first electric telescopic rod 4 drives the first pressure plate 6 to move downward so that the first pressure plate 6 contacts the upper surface of the chip. Step S2: The chip rotates by driving the support plate 2 with a motor, and stops when one side of the chip is parallel to the first moving plate 8; Step S3: Adjust the positions of the first moving plate 8 and the second moving plate 12 so that the first image sensor 13 moves to the position corresponding to the chip pin; Step S4: The first image sensor 13 and the second image sensor 20 respectively capture images of the two sides of the pin for detection. Then, the support plate 2 drives the chip to rotate 180 degrees so that the pin on the other side moves to the detection position for detection.

Claims

1. A chip coplanarity testing device, comprising a base (1), wherein a first support (3) is fixedly mounted on the base (1), characterized in that, The first bracket (3) is fixedly mounted with a first electric telescopic rod (4) pointing to the base (1). The output end of the first electric telescopic rod (4) is fixedly mounted with a vertical rod (5). The end of the vertical rod (5) is rotatably mounted with a first pressure plate (6). The base (1) is rotatably mounted with a support plate (2) that works with the first pressure plate (6) and is driven by a motor. The base (1) is fixedly mounted with a first mounting bracket (7). The first mounting bracket (7) is slidably mounted with a first moving plate (8). The first mounting bracket (7) is provided with a first servo module (9) that drives the first moving plate (8) to move. The first moving plate (8) is provided with a first image sensor (13). The first moving plate (8) is fixedly mounted with a horizontal plate (15). The horizontal plate (15) is provided with a second laser rangefinder (17). The base (1) is fixedly mounted with a side plate (19). The side plate (19) is fixedly mounted with a second image sensor (20). The second image sensor (20) is perpendicular to the detection plane of the first image sensor (13).

2. The chip coplanarity detection device according to claim 1, characterized in that, A second mounting bracket (11) is fixedly installed on the first movable plate (8), a second movable plate (12) is slidably installed on the second mounting bracket (11), a screw (14) that drives the second movable plate (12) to move is rotatably installed on the second mounting bracket (11), and a first image sensor (13) is fixedly installed on the second movable plate (12).

3. The chip coplanarity detection device according to claim 1, characterized in that, A third movable plate (16) is slidably mounted on the horizontal plate (15), and a second image sensor (20) is fixedly mounted on the third movable plate (16). A second servo module (18) that drives the third movable plate (16) to move is provided on the horizontal plate (15).

4. The chip coplanarity detection device according to claim 1, characterized in that, A base plate (21) is rotatably mounted on the vertical rod (5). The base plate (21) is square and a second electric telescopic rod (25) is fixedly mounted on one side of the base plate (21). A second bracket (26) is fixedly mounted at the end of the second electric telescopic rod (25). A support plate (27) is slidably mounted on the second bracket (26). A support rod (28) is fixedly mounted on the surface of the support plate (27) near the base (1). A first roller (29) is rotatably mounted at the end of the support rod (28). The upper surface of the first roller (29) is lower than the lower surface of the first pressure plate (6). Two sets of first laser rangefinders (10) for detecting the distance from the first moving plate (8) to the side of the base plate (21) are fixedly mounted on the first moving plate (8).

5. The chip coplanarity detection device according to claim 4, characterized in that, A second pressure plate (31) is slidably mounted on the second bracket (26), and a first spring (30) is fixedly mounted on the second pressure plate (31). The first spring (30) is fixedly connected to the second bracket (26), and a pressure sensor (32) that works in conjunction with the second pressure plate (31) is fixedly mounted on the support plate (27).

6. The chip coplanarity detection device according to claim 5, characterized in that, A third mounting bracket (22) is fixedly mounted on the surface of the first pressure plate (6) near the substrate (21). A first electromagnet (24) is slidably mounted on the third mounting bracket (22) via a sliding plate (23). The first electromagnet (24) is energized to attract the substrate (21).

7. The chip coplanarity detection device according to claim 4, characterized in that, A lifting frame (33) is slidably installed on the support plate (27). The lifting frame (33) is U-shaped and a U-shaped auxiliary frame (37) is slidably installed at the lower end of the lifting frame (33). A second roller (38) is rotatably installed at the end of the auxiliary frame (37), and a third electric telescopic rod (36) that drives the auxiliary frame (37) to move is fixedly installed on the lifting frame (33).

8. The chip coplanarity detection device according to claim 7, characterized in that, A second spring (34) is fixedly installed on the surface of the support plate (27) away from the base (1). The second spring (34) is fixedly connected to the lifting frame (33). A second electromagnet (35) is fixedly installed on the surface of the support plate (27) away from the base (1). The second electromagnet (35) is energized to attract and fix the lifting frame (33).

9. A detection process, characterized in that, An apparatus for detecting chip coplanarity as described in any one of claims 1-8, comprising the following steps: Step S1: Place the chip to be tested on the support plate (2), and then the first electric telescopic rod (4) drives the first pressure plate (6) to move downward so that the first pressure plate (6) contacts the upper surface of the chip; Step S2: The chip rotates by driving the support plate (2) with a motor, and stops when one side of the chip is parallel to the first moving plate (8); Step S3: Adjust the positions of the first moving plate (8) and the second moving plate (12) so that the first image sensor (13) moves to the position corresponding to the chip pin; Step S4: The first image sensor (13) and the second image sensor (20) are used to take pictures of the two sides of the pin respectively. Then the support plate (2) drives the chip to rotate 180 degrees so that the pin on the other side can be moved to the detection position for detection.

Images