Inspection apparatus using ultrasonic waves and method of inspecting power module using ultrasonic waves

Abstract

The invention relates to an inspection apparatus using ultrasonic waves and a method of inspecting a power module using ultrasonic waves. The inspection apparatus includes: a first ultrasonic scanner disposed on one side of an inspection object, the first ultrasonic scanner configured to move to scan the inspection object; the second ultrasonic scanner is arranged on the other side of the inspection object. The second ultrasonic scanner is configured to move to scan the examination object. The first ultrasonic scanner is configured to transmit ultrasonic waves to an examination object and receive first reflected ultrasonic waves reflected from the examination object. The second ultrasonic scanner is configured to receive a penetrating ultrasonic wave penetrating the inspection object.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0138218, filed on October 11, 2024, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] This invention relates to an inspection device using ultrasound and a method for inspecting a power module using ultrasound. Background Technology

[0004] Non-destructive testing (NDT), which uses signals within the ultrasonic frequency range to obtain ultrasonic images of the object under inspection, has been used in various fields. Ultrasonic images can include at least one of A-scan, B-scan, and C-scan images. Summary of the Invention

[0005] The present invention provides an inspection apparatus using ultrasound and a method for inspecting a power module using ultrasound, which can (e.g., effectively) simultaneously obtain reflected ultrasonic data for inspecting characteristics of the object under inspection (e.g., power module) (e.g., bonding surface void defects, substrate void defects, substrate crack defects, etc.) and transmitted ultrasonic data for inspecting other characteristics of the object under inspection (e.g., power module) (e.g., delamination defects, lead periphery defects, etc.), and can (e.g., effectively) inspect various characteristics of the object under inspection (e.g., power module) (e.g., bonding surface void defects, substrate void defects, substrate crack defects, delamination defects, lead periphery defects, etc.).

[0006] According to the present invention, an inspection apparatus using ultrasound is provided. The inspection apparatus includes: a first ultrasound scanner and a second ultrasound scanner, the first ultrasound scanner being disposed on one side of the object to be inspected and configured to move to scan the object; the second ultrasound scanner being disposed on the other side of the object to be inspected and configured to move to scan the object. The first ultrasound scanner may be configured to transmit ultrasound waves to the object to be inspected and to receive first reflected ultrasound waves reflected from the object. The second ultrasound scanner may be configured to receive penetrating ultrasound waves that penetrate the object to be inspected.

[0007] For example, the second ultrasonic scanner can be configured to send ultrasonic waves to the object being inspected and to receive second reflected ultrasonic waves reflected from the object being inspected.

[0008] For example, the inspection device may further include a processor configured to generate a first C-scan image based on a first reflected ultrasonic wave, generate a second C-scan image based on a second reflected ultrasonic wave, and generate a T-scan image based on a penetrating ultrasonic wave.

[0009] For example, a first ultrasound scanner can be configured to send first C-scan ultrasound waves and T-scan ultrasound waves to the object being examined. A second ultrasound scanner can be configured to send second C-scan ultrasound waves to the object being examined. The second ultrasound scanner or processor can be configured to distinguish between second reflected ultrasound waves and transmitted ultrasound waves based on frequency difference or time-of-flight difference.

[0010] For example, the object to be inspected may include a power module. The power module may include a first substrate, a second substrate, and a semiconductor device, wherein the first substrate is arranged opposite a first ultrasonic scanner; the second substrate is arranged opposite a second ultrasonic scanner; and the semiconductor device is disposed between the first and second substrates. The processor may be configured to generate a first C-scan image including an image of the first substrate, a second C-scan image including an image of the second substrate, and a T-scan image including an image of the semiconductor device.

[0011] For example, the inspection device may further include a processor configured to generate a first C-scan image based on a first reflected ultrasonic wave and a T-scan image based on a transmitted ultrasonic wave. The first ultrasonic scanner may be configured to transmit the first C-scan and T-scan ultrasonic waves to the object being inspected.

[0012] For example, the object of inspection may include a power module. The power module may include a first substrate and semiconductor devices disposed on the first substrate.

[0013] For example, the inspection equipment may further include a moving device configured to move a first ultrasonic scanner and a second ultrasonic scanner in a horizontal direction to scan the object to be inspected. The first and second ultrasonic scanners may be arranged to overlap each other in a vertical direction, with the object to be inspected situated between them.

[0014] For example, the first ultrasound scanner can be moved by a mobile device for one cycle and can be configured to send the first C-scan ultrasound and the T-scan ultrasound together to the object being inspected each time the object is scanned (e.g., once).

[0015] For example, the inspection device may further include a clamp arranged between a first ultrasonic scanner and a second ultrasonic scanner to position (e.g., fix) the object to be inspected, and at least a portion of the moving device has a U-shaped shape that may surround the clamp.

[0016] According to the present invention, a method for inspecting a power module using ultrasound is provided. The method may include: arranging the power module between a first ultrasound scanner and a second ultrasound scanner, the power module including a first substrate and semiconductor devices disposed on the first substrate; generating scan images, comprising: generating a first C-scan image based on first reflected ultrasound waves transmitted and received by the first ultrasound scanner, and generating a T-scan image based on transmitted ultrasound waves transmitted by the first ultrasound scanner and received by the second ultrasound scanner.

[0017] For example, generating a scanned image includes generating a second C-scan image based on a second reflected ultrasonic wave transmitted and received by a second ultrasonic scanner.

[0018] For example, generating a scanned image may further include: transmitting a first C-scan ultrasound and a T-scan ultrasound via a first ultrasound scanner; transmitting a second C-scan ultrasound via a second ultrasound scanner; and distinguishing the second reflected ultrasound and the penetrating ultrasound (e.g., each other) based on a frequency difference or a time-of-flight difference.

[0019] For example, the power module may further include a second substrate arranged opposite to a second ultrasonic scanner. A first substrate may be arranged opposite to a first ultrasonic scanner. A semiconductor device may be disposed between the first and second substrates. Generating scan images may include generating a first C-scan image including an image of the first substrate, a second C-scan image including an image of the second substrate, and a T-scan image including an image of the semiconductor device.

[0020] For example, generating a scanned image may further include moving a first ultrasonic scanner and a second ultrasonic scanner in a horizontal direction to scan the power module. The first and second ultrasonic scanners may be arranged to overlap each other in a vertical direction, with the power module positioned between them. Attached Figure Description

[0021] The aspects and features of the invention will be understood through detailed description and accompanying drawings, wherein:

[0022] Figure 1 This is a perspective view of an inspection device using ultrasound according to an exemplary embodiment of the present invention;

[0023] Figure 2 This is a side view of a power module inspected using an ultrasonic inspection device and a method for inspecting a power module using ultrasonic waves, according to an exemplary embodiment of the present invention.

[0024] Figure 3This is a schematic diagram illustrating the generation of C-scan images using an ultrasonic inspection device and a method using an ultrasonic inspection power module according to an exemplary embodiment of the present invention.

[0025] Figure 4 This is a block diagram of an ultrasonic scanner using an ultrasonic inspection apparatus and a method for using an ultrasonic inspection power module according to an exemplary embodiment of the present invention; and

[0026] Figure 5 This is a flowchart of a method for inspecting a power module using ultrasound according to an exemplary embodiment of the present invention. Detailed Implementation

[0027] Modifications can be made to the exemplary embodiments. These exemplary embodiments are not intended to be limited to the present invention, and should be understood to include modified embodiments, equivalent embodiments, and alternative embodiments according to the present invention.

[0028] In this document, terms such as first, second, A, B, (a), and (b) may be used to describe components. Each of these terms distinguishes the corresponding component from other components. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component. The term "and / or" may include a combination of multiple related descriptive terms or any one of multiple related descriptive terms.

[0029] The terminology used herein describes exemplary embodiments and may not limit the scope of the exemplary embodiments. As used herein, the singular forms “a,” “an,” and “the” may include the plural forms unless the context otherwise indicates. As used herein, the term “and / or” includes any one of the associated enumerations and any combination of any two or more. When used herein (e.g., in this code), the terms “comprising” and / or “including” may provide the stated feature, value, step, operation, element, component, or combination thereof, but do not exclude one or more other features, values, steps, operations, elements, components, and / or combinations thereof.

[0030] Furthermore, unless otherwise defined, the terms used herein (including technical or scientific terms) may have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains.

[0031] As used herein, a vehicle (including electric vehicles) means a vehicle that transports a person, animal, or object from a point of origin to a point of destination. Such vehicles are not limited to those that travel on roads or tracks.

[0032] In this document, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

[0033] Figure 1 This is a perspective view of an inspection device using ultrasound according to an exemplary embodiment of the present invention. Figure 2 This is a side view of a power module inspected using an ultrasonic inspection device and a method for inspecting a power module using ultrasonic waves, according to an exemplary embodiment of the present invention.

[0034] refer to Figure 1 and Figure 2 An ultrasound examination device 100 according to an exemplary embodiment of the present invention may include: a first ultrasound scanner 110 and a second ultrasound scanner 120. The first ultrasound scanner 110 is arranged on one side of the object to be examined (e.g., in the +Z direction) to scan the object to be examined, and the second ultrasound scanner 120 is arranged on the other side of the object to be examined (e.g., in the -Z direction) to scan the object to be examined. The first ultrasound scanner 110 can transmit ultrasound waves (e.g., a first C-scan ultrasound CT1 and / or a T-scan ultrasound TT) to the object to be examined, and can receive first reflected ultrasound waves reflected from the object to be examined (e.g., corresponding to first reflected ultrasound wave data CS1). The second ultrasound scanner 120 can receive penetrating ultrasound waves that penetrate the object to be examined (e.g., corresponding to penetrating ultrasound wave data TS).

[0035] The first reflected ultrasonic data CS1 can be used to inspect the object 10 for (e.g., some) characteristics (e.g., bonding surface void defects, substrate void defects, substrate crack defects, etc.), and the transmitted ultrasonic data TS can be used to inspect the object 10 for (e.g., some) other characteristics (e.g., delamination defects, lead periphery defects, etc.). According to an exemplary embodiment of the present invention, the ultrasonic inspection device 100 can acquire both the first reflected ultrasonic data CS1 and the transmitted ultrasonic data TS simultaneously, even when using only the first ultrasonic scanner 110, thus enabling (e.g., effectively) inspection of the object 10 for (e.g., various) characteristics (e.g., bonding surface void defects, substrate void defects, substrate crack defects, delamination defects, lead periphery defects, etc.).

[0036] The second ultrasonic scanner 120 can transmit ultrasonic waves (e.g., a second C-scan ultrasonic CT2) to the object under inspection 10, and can receive second reflected ultrasonic waves reflected from the object under inspection 10 (e.g., corresponding to second reflected ultrasonic wave data CS2). The first reflected ultrasonic wave data CS1 can be used to inspect the upper characteristics of the object under inspection 10 (e.g., bonding surface void defects, substrate void defects, substrate crack defects, etc.), the second reflected ultrasonic wave data CS2 can be used to inspect the lower characteristics of the object under inspection 10 (e.g., bonding surface void defects, substrate crack defects, etc.), and the penetrating ultrasonic wave data TS can be used to inspect the middle characteristics of the object under inspection 10 (e.g., delamination defects, lead periphery defects, etc.).

[0037] When using both the first ultrasonic scanner 110 and the second ultrasonic scanner 120, the ultrasonic inspection device 100 according to an exemplary embodiment of the present invention can also obtain first reflected ultrasonic data CS1, second reflected ultrasonic data CS2 and transmitted ultrasonic data TS together, thereby (e.g., effectively) inspecting (e.g., various) characteristics (e.g., bonding surface void defects, substrate void defects, substrate crack defects, delamination defects, lead periphery defects, etc.) of (e.g., various) parts (e.g., upper, middle and lower parts).

[0038] The first ultrasound scanner 110 can transmit a first C-scan ultrasound CT1 and a T-scan ultrasound TT to the object 10 being examined, and the second ultrasound scanner 120 can transmit a second C-scan ultrasound CT2 to the object 10 being examined. For example, the first ultrasound scanner 110 can adjust the frequency and / or amplitude of the ultrasound waves to be transmitted, thereby (e.g., differently) achieving the characteristics of the first C-scan ultrasound CT1 (e.g., characteristics favorable for reflection) and the characteristics of the T-scan ultrasound TT (e.g., characteristics favorable for penetration).

[0039] The processor 130, which may be included in the ultrasound inspection device 100, may be configured to generate a first C-scan image C-SCAN-1 based on a first reflected ultrasound wave (e.g., corresponding to first reflected ultrasound wave data CS1), a second C-scan image C-SCAN-2 based on a second reflected ultrasound wave (e.g., corresponding to second reflected ultrasound wave data CS2), and a T-scan image T-SCAN based on transmitted ultrasound waves (e.g., corresponding to transmitted ultrasound wave data TS). For example, the processor 130 may be implemented as a computing system (e.g., including a processor, memory, input / output devices, and communication devices) and may be implemented as a controller.

[0040] The first C-scan image C-SCAN-1 and the second C-scan image C-SCAN-2 can be two-dimensional images of multiple object layers located at different depths (or levels) of the object 10 under inspection. The T-scan image T-SCAN can be a two-dimensional (or three-dimensional) penetration image used for internal volume analysis of the object 10 under inspection.

[0041] A moving device 140, which may be included in the inspection apparatus 100 using ultrasound, can move the first ultrasound scanner 110 and the second ultrasound scanner 120 in a horizontal direction (e.g., the X and / or Y directions) to scan the object 10 to be inspected. Accordingly, each of the first reflected ultrasound data CS1, the second reflected ultrasound data CS2, and the transmitted ultrasound data TS obtained by the first ultrasound scanner 110 and the second ultrasound scanner 120 can be implemented as two-dimensional data (ultrasound data corresponding to two-dimensional coordinate values). According to the design, the transmitted ultrasound data TS can be implemented as three-dimensional data. The first ultrasound scanner 110 and the second ultrasound scanner 120 can be arranged to overlap each other in a vertical direction (e.g., the Z direction), with the object 10 to be inspected between them.

[0042] For example, the first ultrasonic scanner 110 and the second ultrasonic scanner 120 can scan each of the plurality of Y-direction coordinates of the object 10 being inspected while moving along the X-direction, or while moving along a zigzag path, thereby transmitting and receiving ultrasonic waves for the plurality of X-direction coordinates and the plurality of Y-direction coordinates of the object 10 being inspected (e.g., all of the plurality of X-direction coordinates and the plurality of Y-direction coordinates of the object 10 being inspected). The movement path of the moving device 140 in one cycle can be defined as a path that overlaps (e.g., once) with the plurality of X-direction coordinates and the plurality of Y-direction coordinates of the object 10 being inspected in the Z-direction, and scanning the object 10 for each of the plurality of X-direction coordinates and the plurality of Y-direction coordinates (e.g., once) can be defined as scanning the object 10 (e.g., once).

[0043] For example, the first ultrasonic scanner 110 can be moved by the moving device 140 for one cycle, and the first C-scan ultrasonic CT1 and T-scan ultrasonic TT can be sent to the object 10 for inspection together each time the object 10 is scanned (e.g., once). Accordingly, the ultrasonic inspection device 100 according to an exemplary embodiment of the present invention can reduce the time required to obtain the first reflected ultrasonic data CS1 and the transmitted ultrasonic data TS together, thereby reducing the total inspection time for various characteristics of the object 10 (e.g., bonding surface void defects, substrate void defects, substrate crack defects, delamination defects, lead periphery defects, etc.). In an exemplary embodiment, the second ultrasonic scanner 120 can also be moved by the moving device 140 for one cycle, and the second C-scan ultrasonic CT2 can be sent to the object 10 for inspection each time the object 10 is scanned (e.g., once).

[0044] For example, processor 130 can control the movement of mobile device 140. For example, mobile device 140 may include actuators (not shown) that generate a force for moving the first ultrasonic scanner 110 and the second ultrasonic scanner 120 in the horizontal direction, and processor 130 can send signals to mobile device 140 to control the force generated by the actuators. In an exemplary embodiment, processor 130 can, for example, correlate the object coordinates of mobile device 140 with ultrasonic data.

[0045] For example, the moving device 140 may include a first support portion 141, a second support portion 142, and a connecting portion 143. The first support portion 141 supports a first ultrasonic scanner 110; the second support portion 142 supports a second ultrasonic scanner 120; and the connecting portion 143 connects one end of the first support portion 141 and the second support portion 142 to each other. The first support portion 141 may have a through-hole through which the first ultrasonic scanner 110 passes, and the second support portion 142 may include a through-hole through which the second ultrasonic scanner 120 passes. The connecting portion 143 may receive a force generated by an actuator to move the first support portion 141 and the second support portion 142, thereby moving the first ultrasonic scanner 110 and the second ultrasonic scanner 120.

[0046] A clamp 150, which may be included in an ultrasonic inspection apparatus 100, may be arranged between a first ultrasonic scanner 110 and a second ultrasonic scanner 120 to position (e.g., fix) the object 10 to be inspected. At least a portion of a moving device 140 may have a U-shape surrounding the clamp 150. A first support 141, a connecting portion 143, and a second support 142 may also have a U-shape. The clamp 150 may include a fixing portion 151 and a plate 152, the fixing portion 151 positioning (e.g., fixing) the object 10 to be inspected; the plate 152 providing a surface for placing the fixing portion 151. The plate 152 may have (e.g., an effective) shape to engage with the U-shape of the moving device 140.

[0047] Accordingly, the space occupied by the moving device 140 and the clamp 150 can be (e.g., effectively) compressed and stably housed in a specific structure (e.g., a water tank). For example, the combination of the moving device 140 and the clamp 150 can be arranged in a water tank containing water, thereby enabling operation in water. Water can be used as an ultrasonic transmission medium, and the water tank can include means for receiving water or circulating water.

[0048] refer to Figure 2The inspection object 10 may include a power module, which may include at least one of a first substrate 11, a second substrate 12, a semiconductor device 13, a spacer 14, and a lead terminal 15. For example, the power module of the inspection object 10 may be (e.g., electrically) connected to the space between a motor (which is used to drive an environmentally friendly vehicle such as an electric vehicle) and a battery, and may be implemented as an inverter that converts the DC voltage of the battery to an AC voltage.

[0049] The first substrate 11 may be arranged opposite the first ultrasonic scanner 110, and the second substrate 12 may be arranged opposite the second ultrasonic scanner 120. The first substrate 11 and the second substrate 12 arranged opposite the first ultrasonic scanner 110 and the second ultrasonic scanner 120 may include at least one surface (e.g., an upper or lower surface) of the first substrate 11 and the second substrate 12 that overlaps with the first ultrasonic scanner 110 and the second ultrasonic scanner 120 in the normal direction (e.g., the Z direction). For example, the first substrate 11 and the second substrate 12 (e.g., each of the first substrate 11 and the second substrate 12) may be implemented as an active metal brazing (AMB) substrate or a direct-bonded copper (DBC) substrate, and may have a structure in which at least one metal layer (e.g., a copper layer) and at least one insulating layer (e.g., a ceramic layer) are alternately stacked.

[0050] Semiconductor device 13 may be disposed between first substrate 11 and second substrate 12. For example, semiconductor device 13 may be implemented as an integrated circuit or a chip and may be mounted on first substrate 11 or second substrate 12 by soldering or sintering. For example, semiconductor device 13 may include one or more power semiconductor devices with high power capacity, such as insulated gate bipolar transistors (IGBTs) or thyristors, or may include silicon carbide (SiC) based semiconductor devices or gallium nitride (GaN) based semiconductor devices.

[0051] The spacer 14 can be arranged to overlap the semiconductor device 13 in a direction (e.g., the Z direction) opposite to each other on the first substrate 11 and the second substrate 12. When the semiconductor device 13 is mounted on the first substrate 11, the spacer 14 can be arranged between the semiconductor device 13 and the second substrate 12. For example, the spacer 14 can contain a metallic material (e.g., copper (Cu) or molybdenum (Mo)) and can provide a heat dissipation path for the semiconductor device 13. For example, the spacer 14 can be bonded to each of the semiconductor device 13 and the second substrate 12 by multiple adhesive layers.

[0052] Lead terminal 15 can be (e.g., electrically) connected to semiconductor device 13 and can extend in a horizontal direction (e.g., X and / or Y direction). For example, lead terminal 15 can connect the power module of the object under inspection 10 (e.g., electrically) to an external motor or battery and can provide a path for transmitting control signals from the motor controller of the motor system to semiconductor device 13.

[0053] The processor 130 can generate a first C-scan image (C-SCAN-1) including an image of the first substrate 11, a second C-scan image (C-SCAN-2) including an image of the second substrate 12, and a T-scan image (T-SCAN) including an image of the semiconductor device 13. For example, the first C-scan image (C-SCAN-1) can be used to inspect for defects in the first substrate 11 (e.g., internal void defects and bonding surface void defects), and the second C-scan image (C-SCAN-2) can be used to inspect for defects in the second substrate 12 (e.g., internal voids and bonding surfaces). The T-scan image (T-SCAN) can be used to inspect for defects in the semiconductor device 13 (e.g., defects around leads) and can be used to inspect for defects that are challenging (e.g., difficult) to detect using C-scan.

[0054] From the perspective of the first ultrasonic scanner 110 and the second ultrasonic scanner 120, the space between the first substrate 11 and the second substrate 12 of the power module may be obstructed, thus potentially making the space (e.g., difficult) to inspect using only the first C-scan image C-SCAN-1 and the second C-scan image C-SCAN-2 challenging (e.g., difficult) spaces (or spaces where inspection accuracy is challenging (e.g., difficult)). The T-scan image T-SCAN can be used to improve the inspection accuracy for spaces that are challenging (e.g., difficult) to inspect. According to an exemplary embodiment of the invention, the ultrasonic inspection apparatus 100 and the method for inspecting a power module using ultrasonic waves can further obtain the T-scan image T-SCAN without adding an ultrasonic scanner, thereby (e.g., effectively) inspecting (e.g., various) defects (including defects challenging (e.g., difficult) to inspect using C-scan) on (e.g., various) parts of the power module (which includes spaces that are challenging (e.g., difficult) to inspect).

[0055] Figure 3 This is a schematic diagram illustrating the generation of C-scan images using an ultrasonic inspection device and a method using an ultrasonic inspection power module according to an exemplary embodiment of the present invention.

[0056] refer to Figure 3The first ultrasound scanner 110 can send a first C-scan ultrasound CT1 to the object being examined 10, receive first reflected ultrasound waves R1, R2, R3, and R4, and generate first reflected ultrasound data CS1 based on the first reflected ultrasound waves R1, R2, R3, and R4. The second C-scan ultrasound wave and the second reflected ultrasound data of the second ultrasound scanner 120 can be implemented in a similar manner to the first C-scan ultrasound CT1 and the first reflected ultrasound data CS1.

[0057] For example, a portion of the first C-scan ultrasound CT1 can be viewed from the front surface of the object being examined 10 (e.g., the first substrate 11). Figure 2 The upper surface of the object being examined reflects the light. Subsequently, a portion of the first C-scan ultrasound CT1 can be reflected from the boundary of the object being examined (e.g., the first substrate 11). Figure 2 The boundary between the metal layer and the insulating layer of the first C-scan ultrasound CT1 reflects the image. Then, a portion of the first C-scan ultrasound CT1 can be detected from the defect FP (e.g., the first substrate 11) of the object being inspected. Figure 2 The internal cavity of the object reflects the light. Subsequently, a portion of the first C-scan ultrasound CT1 can be reflected from the rear surface of the object being examined (e.g., the first substrate 11). Figure 2 The lower surface of the surface reflects the light.

[0058] For example, a first ultrasonic scanner 110 can identify the reflection locations (e.g., front surface, boundary, region of interest, and rear surface) of the first reflected ultrasonic waves R1, R2, R3, and R4 based on the echo amplitude and / or time of flight of the first reflected ultrasonic waves R1, R2, R3, and R4. This is because the echo amplitude and / or time of flight of the first reflected ultrasonic waves R1, R2, R3, and R4 can be determined based on the medium properties (e.g., acoustic impedance and density) of the reflection locations of the first reflected ultrasonic waves R1, R2, R3, and R4. For example, a second ultrasonic scanner 120 or processor 130 ( Figure 1 The second reflected ultrasound and the penetrating ultrasound can be distinguished from each other based on the time difference of flight.

[0059] The first reflected ultrasonic data CS1 may include the received coordinate data of the first reflected ultrasonic wave R3, and may include the time-of-flight data of the first reflected ultrasonic wave R3. The time-of-flight data may be the Z-direction position information of the defect FP. Processor 130 ( Figure 1 It can generate a first C-scan image, which includes an image of the object 10 under inspection based on the first reflected ultrasonic data CS1, the first reflected ultrasonic waves R1, R2 and R4, and an image of the defect FP based on the first reflected ultrasonic wave R3.

[0060] Figure 4This is a block diagram of an ultrasonic scanner, which is an inspection device using ultrasonic waves and a method for inspecting an ultrasonic power module according to an exemplary embodiment of the present invention.

[0061] refer to Figure 4 The first ultrasonic scanner 110 and the second ultrasonic scanner 120 may refer to signal processing system modules including transducers 111 and 121, respectively. For example, the first ultrasonic scanner 110 and the second ultrasonic scanner 120 may each include: transducers 111 and 121, preamplifiers 112 and 122, pulse receivers 113 and 123, A / D converters 114 and 124, and trigger boards 115 and 125.

[0062] Transducers 111 and 121 can be configured to convert electrical signals and ultrasonic signals. Preamplifiers 112 and 122 can be configured to amplify electrical signals (or ultrasonic signals). Pulse receivers 113 and 123 can generate or process electrical signals. For example, pulse receivers 113 and 123 can generate electrical signals and send them to preamplifiers 112 and 122, which can amplify the electrical signals, and transducers 111 and 121 can convert the electrical signals into ultrasonic signals and output them. For example, transducers 111 and 121 can convert received ultrasonic signals (e.g., reflected or transmitted ultrasonic signals) and send them to preamplifiers 112 and 122, which can amplify the electrical signals, and pulse receivers 113 and 123 can receive and process the electrical signals.

[0063] For example, transducers 111 and 121 and / or pulse receivers 113 and 123 can determine the frequency of each type of ultrasound signal (e.g., first C-scan ultrasound CT1, second C-scan ultrasound CT2, and T-scan ultrasound TT). Accordingly, the second ultrasound scanner 120 or processor 130 ( Figure 1 The second reflected ultrasound and the penetrating ultrasound can be distinguished from each other based on the frequency difference.

[0064] A / D converters 114 and 124 can convert electrical signals received by pulse receivers 113 and 123 from analog signals into digital signals (e.g., first and second reflected ultrasound data or transmitted ultrasound data), and can send the digital signals to processor 130. Figure 1 ).

[0065] Trigger boards 115 and 125 can store information about the timing of ultrasonic waves transmitted by the first ultrasonic scanner 110 and the second ultrasonic scanner 120, and can control the generation time of electrical signals by triggering pulse receivers 113 and 123 according to the timing information. In an exemplary embodiment, trigger boards 115 and 125 can convert the trigger signal into a digital timing signal via A / D converters 114 and 124, and send the digital timing signal to processor 130. Figure 1 Processor 130 ( Figure 1 It can be synchronized with the first ultrasonic scanner 110 and the second ultrasonic scanner 120 via digital timing signals.

[0066] Alternatively, A / D converters 114 and 124 can be derived from processor 130 ( Figure 1 The system receives control signals and sends them to trigger boards 115 and 125. The trigger boards 115 and 125 can control the generation time of electrical signals of pulse receivers 113 and 123 according to the control signals.

[0067] Figure 5 This is a flowchart of a method for inspecting a power module using ultrasound according to an exemplary embodiment of the present invention.

[0068] refer to Figure 5 According to an exemplary embodiment of the present invention, a method for inspecting a power module using ultrasound may include an arrangement step S110 and a scan image generation step S120. The arrangement step S110 is to arrange a power module (an example of the inspection object 10) including a first substrate 11 and a semiconductor device 13 disposed on the first substrate 11 between a first ultrasound scanner 110 and a second ultrasound scanner 120. The scan image generation step S120 is to generate a first C-scan image C-SCAN-1 based on a first reflected ultrasound wave transmitted and received by the first ultrasound scanner 110 (e.g., corresponding to first reflected ultrasound wave data CS1) (step S122), and to generate a T-scan image based on a transmitted ultrasound wave transmitted by the first ultrasound scanner 110 and received by the second ultrasound scanner 120 (e.g., corresponding to transmitted ultrasound wave data TS) (step S124).

[0069] The image generation step S120 may further include: moving the first ultrasound scanner 110 and the second ultrasound scanner 120 in the horizontal direction to scan the power module (an example of the object being inspected 10), and transmitting a first C-scan ultrasound CT1 and a T-scan ultrasound TT via the first ultrasound scanner 110 (step S121). The transmitting step S121 may further include transmitting a second C-scan ultrasound CT2 via the second ultrasound scanner 120.

[0070] The scan image generation step S120 may include generating a second C-scan image C-SCAN-2 based on a second reflected ultrasonic wave (e.g., corresponding to second reflected ultrasonic wave data CS2) transmitted and received by the second ultrasonic scanner 120 (step S123).

[0071] The scan image generation step S120 may further include: distinguishing the second reflected ultrasound (e.g., corresponding to the second reflected ultrasound data CS2) and the penetrating ultrasound (e.g., corresponding to the penetrating ultrasound data TS) from each other based on the frequency difference or time-of-flight difference.

[0072] The scan image generation step S120 may include: generating a first C-scan image C-SCAN-1 including an image of the first substrate 11, a second C-scan image C-SCAN-2 including an image of the second substrate 12, and a T-scan image T-SCAN including an image of the semiconductor device 13.

[0073] According to the present invention, an inspection device using ultrasound and a method for inspecting a power module using ultrasound can (e.g., effectively) simultaneously obtain reflected ultrasonic data for inspecting (e.g., some) characteristics (e.g., bonding surface void defects, substrate void defects, substrate crack defects, etc.) of the inspection object (e.g., power module) and transmitted ultrasonic data for inspecting (e.g., other) characteristics (e.g., delamination defects, lead periphery defects, etc.) of the inspection object (e.g., power module), and can (e.g., effectively) inspect (e.g., various) characteristics (e.g., bonding surface void defects, substrate void defects, substrate crack defects, delamination defects, lead periphery defects, etc.) of the inspection object (e.g., power module).

[0074] Although exemplary embodiments have been shown and described above, modifications and variations may be made without departing from the scope of the invention as defined by the appended claims.

Claims

1. An inspection device using ultrasound, the inspection device comprising: A first ultrasonic scanner is arranged on one side of the object to be inspected, and the first ultrasonic scanner is configured to move to scan the object to be inspected. and A second ultrasonic scanner is arranged on the other side of the object to be inspected, and the second ultrasonic scanner is configured to move to scan the object to be inspected. The first ultrasonic scanner is configured to send ultrasonic waves to the object being inspected and to receive first reflected ultrasonic waves reflected from the object being inspected. The second ultrasonic scanner is configured to receive penetrating ultrasonic waves that penetrate the object being inspected.

2. The inspection device using ultrasound according to claim 1, wherein, The second ultrasonic scanner is configured to send ultrasonic waves to the object being inspected and to receive a second reflected ultrasonic wave reflected from the object being inspected.

3. The inspection device using ultrasound according to claim 2, further comprising: The processor is configured to generate a first C-scan image based on the first reflected ultrasonic wave, generate a second C-scan image based on the second reflected ultrasonic wave, and generate a T-scan image based on the transmitted ultrasonic wave.

4. The inspection device using ultrasound according to claim 3, wherein, The first ultrasonic scanner is configured to send a first C-scan ultrasonic wave and a T-scan ultrasonic wave to the object being inspected; The second ultrasonic scanner is configured to send a second C-scan ultrasonic wave to the object being inspected; The second ultrasonic scanner or processor is configured to distinguish between the second reflected ultrasonic waves and the penetrating ultrasonic waves based on the frequency difference or time-of-flight difference.

5. The inspection device using ultrasound according to claim 3, wherein, The inspection target includes the power module; The power module includes: A first substrate is arranged opposite to a first ultrasonic scanner; A second substrate, arranged opposite to a second ultrasonic scanner; and A semiconductor device disposed between a first substrate and a second substrate; The processor is configured to generate a first C-scan image including an image of a first substrate, a second C-scan image including an image of a second substrate, and a T-scan image including an image of a semiconductor device.

6. The inspection device using ultrasound according to claim 1, further comprising: The processor is configured to generate a first C-scan image based on a first reflected ultrasonic wave and to generate a T-scan image based on a transmitted ultrasonic wave. The first ultrasonic scanner is configured to send a first C-scan ultrasonic wave and a T-scan ultrasonic wave to the object being examined.

7. The inspection device using ultrasound according to claim 6, wherein, The inspection target includes the power module; The power module includes a first substrate and semiconductor devices disposed on the first substrate.

8. The inspection device using ultrasound according to claim 1, further comprising: A mobile device configured to move a first ultrasonic scanner and a second ultrasonic scanner in a horizontal direction to scan the object to be inspected. The first and second ultrasonic scanners are arranged to overlap in the vertical direction, and the object to be inspected is located between the first and second ultrasonic scanners.

9. The inspection device using ultrasound according to claim 8, wherein, The first ultrasonic scanner is moved by the mobile device for one cycle, and the first ultrasonic scanner is configured to send a first C-scan ultrasonic wave and a T-scan ultrasonic wave to the object to be inspected each time the object is scanned.

10. The inspection device using ultrasound according to claim 8, further comprising: A fixture is arranged between the first ultrasonic scanner and the second ultrasonic scanner to position the object to be inspected. At least a portion of the moving device has a U-shaped shape surrounding the clamp.

11. A method for inspecting a power module using ultrasound, the method comprising: A power module is arranged between a first ultrasonic scanner and a second ultrasonic scanner, the power module including a first substrate and a semiconductor device arranged on the first substrate; Generating a scan image includes: generating a first C-scan image based on a first reflected ultrasonic wave transmitted and received by a first ultrasonic scanner, and generating a T-scan image based on a penetrating ultrasonic wave transmitted by the first ultrasonic scanner and received by a second ultrasonic scanner.

12. The method according to claim 11, wherein, Generating a scanned image includes generating a second C-scan image based on a second reflected ultrasonic wave transmitted and received by a second ultrasonic scanner.

13. The method according to claim 12, wherein, Generating a scanned image further includes: The first C-scan ultrasound and the T-scan ultrasound are transmitted via the first ultrasound scanner; A second C-scan ultrasound wave is sent via a second ultrasound scanner; The second reflected ultrasound and the penetrating ultrasound are distinguished based on the frequency difference or time-of-flight difference.

14. The method according to claim 12, wherein, The power module further includes a second substrate, which is arranged opposite to the second ultrasonic scanner. The first substrate is arranged opposite to the first ultrasonic scanner; The semiconductor device is disposed between the first substrate and the second substrate; Generating scan images includes generating a first C-scan image including an image of a first substrate, a second C-scan image including an image of a second substrate, and a T-scan image including an image of a semiconductor device.

15. The method according to claim 12, wherein, Generating a scanned image further includes: moving the first and second ultrasonic scanners in the horizontal direction to scan the power module; The first ultrasonic scanner and the second ultrasonic scanner are arranged to overlap in the vertical direction, and the power module is located between the first ultrasonic scanner and the second ultrasonic scanner.

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