Display module and display device

Abstract

The invention discloses a display module and a display device, and belongs to the technical field of display. The integrated circuit is arranged on the surface of one side of the display panel in a binding manner; the integrated circuit is coated with the heat-conducting glue layer; the buffer rubber layer is located on the side, away from the integrated circuit, of the heat-conducting rubber layer and surrounds the side face of the integrated circuit; the side face of the integrated circuit is an end face connected between the bottom face and the top face of the integrated circuit, the bottom face of the integrated circuit is the surface, close to the display panel, of the integrated circuit, and the top face of the integrated circuit is the surface, opposite to the bottom face, of the integrated circuit; and the cooling fin is inserted into the buffer rubber layer and is in contact with the heat-conducting rubber layer, and at least part of the cooling fin is exposed out of the buffer rubber layer.

Description

Technical Field

[0001] This application belongs to the field of display technology, specifically relating to a display module and a display device. Background Technology

[0002] With the rapid development of electronic information technology, integrated circuits (ICs), as the heart of modern electronic products, play a crucial role in various fields. Especially in mobile communications, consumer electronics, automotive electronics, and industrial control, the performance requirements for ICs are increasingly stringent, particularly regarding processing speed and power efficiency. However, as the integration density of ICs continues to increase, the heat generated per unit area is also constantly rising. This not only affects the operational stability of ICs but may also shorten their lifespan. Therefore, effectively solving the IC heat dissipation problem has become an important research topic. Summary of the Invention

[0003] This application provides a display module and a display device to improve the heat dissipation effect of integrated circuits in the display module.

[0004] A first aspect of this application provides a display module, the display module comprising: Display panel; An integrated circuit, which is bonded to one side surface of the display panel; A thermally conductive adhesive layer, wherein the thermally conductive adhesive layer covers the integrated circuit; A buffer adhesive layer is located on the side of the thermally conductive adhesive layer facing away from the integrated circuit and surrounds the side surface of the integrated circuit; the side surface of the integrated circuit is the end face connecting the bottom and top surfaces of the integrated circuit; the bottom surface of the integrated circuit is the surface of the integrated circuit closest to the display panel; and the top surface of the integrated circuit is the surface of the integrated circuit opposite to the bottom surface. A heat sink is inserted into the buffer adhesive layer, contacts the thermally conductive adhesive layer, and is at least partially exposed outside the buffer adhesive layer.

[0005] A second aspect of this application provides a display device, the display device comprising: the display module described in the first aspect of this application.

[0006] The beneficial effects of this application are as follows: The display module proposed in this application utilizes a thermally conductive adhesive layer to directly encapsulate the integrated circuit, enabling rapid heat dissipation during chip operation. This close contact between the heat sink and the thermally conductive adhesive layer establishes an efficient heat dissipation path from the chip to the external space, significantly reducing the operating temperature of the integrated circuit. This effectively prevents chip performance degradation or damage due to overheating, greatly improving the long-term operational reliability and lifespan of the display module under high-temperature, high-load conditions. Furthermore, this application's design inserts and fixes the heat sink into the buffer adhesive layer, achieving integrated heat dissipation structure and chip packaging. This design eliminates the need for additional fasteners, resulting in a compact structure and saving valuable internal space, particularly beneficial for achieving the design requirements of thinner and lighter electronic devices. Simultaneously, the partially exposed heat sink can directly contact other internal heat dissipation structures or air, further enhancing heat dissipation efficiency.

[0007] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0008] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. It should be noted that the scale in the drawings is for illustration only and does not represent the actual scale.

[0009] Figure 1 This is a schematic diagram of the structure of a display module proposed in an embodiment of this application; Figure 2 This is a schematic diagram of another display module structure proposed in the embodiments of this application; Figure 3 This is a schematic diagram of a vertically arranged heat sink structure proposed in an embodiment of this application; Figure 4 This is a top view of a heat sink arranged vertically according to an embodiment of this application; Figure 5 This is a top view of a horizontally arranged heat sink as proposed in an embodiment of this application; Figure 6 This is a schematic diagram of a U-shaped heat sink arranged horizontally according to an embodiment of this application; Figure 7 This is a schematic diagram of a U-shaped heat sink arranged vertically according to an embodiment of this application; Figure 8 This is a top view of a U-shaped heat sink arranged vertically according to an embodiment of this application; Figure 9 This is a schematic diagram of the structure of a wave-shaped heat sink proposed in the embodiments of this application; Figure 10 This is a schematic diagram of a horizontally arranged heat dissipation hollow tube structure proposed in the embodiments of this application; Figure 11 This is a schematic diagram of a vertically arranged heat dissipation hollow tube structure proposed in the embodiments of this application; Figure 12 This is a schematic diagram of the structure of a corrosion-resistant coating proposed in the embodiments of this application; Reference numerals: 1. Display panel; 2. Integrated circuit; 3. Thermally conductive adhesive layer; 4. Buffer adhesive layer; 5. Heat sink; 6. Graphite layer; 7. Heat sink strip; 8. Heat sink hollow tube; 9. Corrosion-resistant coating. Part 3 101, Bending area 102, Part 4 103, Frame 104, Back heat dissipation film 105, Flexible circuit board 106, Polarizing film 107, Optical transparent adhesive 108, Glass cover 109, Masking film 110. Detailed Implementation

[0010] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0011] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first" and "second" are generally of the same class, not limited in number; for example, the first object can be one or at least two. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0012] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0013] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0014] To facilitate understanding of the technical solutions provided in this application, the main technical concepts involved in the embodiments of this application are briefly described below.

[0015] With the rapid development of electronic information technology, integrated circuits (ICs), as the heart of modern electronic products, play a crucial role in various fields. Especially in mobile communications, consumer electronics, automotive electronics, and industrial control, the performance requirements for ICs are increasingly stringent, particularly regarding processing speed and power efficiency. However, as the integration density of ICs continues to increase, the heat generated per unit area is also constantly rising. This not only affects the operational stability of ICs but may also shorten their lifespan. Therefore, effectively solving the IC heat dissipation problem has become an important research topic.

[0016] Traditional heat dissipation solutions commonly employ heat sinks, fans, and heat pipes to conduct and dissipate heat. However, these traditional methods often have limitations: firstly, they occupy a large space, hindering the design of miniaturized devices; secondly, their heat dissipation efficiency is limited, especially in high-power-density applications, making it difficult to meet the demands for efficient heat dissipation. Furthermore, with the development of Organic Light-Emitting Diode (OLED) display technology, more and more portable electronic devices are adopting OLED displays, further intensifying the demand for compact and efficient heat dissipation solutions. OLEDs are self-emissive, requiring no backlight and enabling thinner and lighter designs, but this also brings higher heat generation issues, especially under high brightness or prolonged operation, where temperature increases can lead to screen color distortion and shortened lifespan.

[0017] OLED technology has garnered widespread attention due to its unique display effects and energy-saving characteristics. OLEDs generate light by exciting currents between layers of organic materials. Compared to liquid crystal displays (LCDs), OLEDs offer more vibrant color contrast and wider viewing angles. However, the integrated circuits (ICs) in OLED panels generate a certain amount of heat. Furthermore, modern smart devices such as smartphones, tablets, and laptops increasingly prioritize thin and light designs, leaving very limited space for cooling systems. This places higher demands on the cooling system—it must ensure good heat dissipation without significantly increasing the device's size.

[0018] In recent years, although some heat dissipation technologies for specific applications have been proposed, such as microfluidic cooling systems and phase change material heat sinks, these technologies are either too expensive or too complex, making them difficult to apply on a large scale. Moreover, most related technologies focus on improvements in a single direction, with few overall solutions that can simultaneously improve heat dissipation efficiency and enhance physical protection. This is especially true for equipment that needs to operate in extreme environments; in addition to efficient heat dissipation, it also requires a certain level of impact resistance and corrosion resistance to ensure long-term stable operation.

[0019] To address the aforementioned issues, this application proposes a display module with a novel annular heat dissipation support structure. This structure not only significantly improves the heat dissipation performance of the IC but also effectively enhances its protective capabilities, making it particularly suitable for high-end electronic devices equipped with OLED display technology. By constructing the annular support using a high-strength material with excellent thermal conductivity and combining it with an optimized heat dissipation component, efficient heat dissipation can be achieved within a limited space while providing additional physical protection for the IC, thereby meeting the urgent demand for high-performance and high-reliability electronic products today.

[0020] The first aspect of this application provides a display module, referring to... Figure 1 , Figure 1 A schematic diagram of the structure of a display module is shown, such as... Figure 1 As shown, the display module includes: Display panel; An integrated circuit, which is bonded to one side surface of the display panel; A thermally conductive adhesive layer, wherein the thermally conductive adhesive layer covers the integrated circuit; A buffer adhesive layer is located on the side of the thermally conductive adhesive layer facing away from the integrated circuit and surrounds the side surface of the integrated circuit; the side surface of the integrated circuit is the end face connecting the bottom and top surfaces of the integrated circuit; the bottom surface of the integrated circuit is the surface of the integrated circuit closest to the display panel; and the top surface of the integrated circuit is the surface of the integrated circuit opposite to the bottom surface. A heat sink is inserted into the buffer adhesive layer, contacts the thermally conductive adhesive layer, and is at least partially exposed outside the buffer adhesive layer.

[0021] In this embodiment, the integrated circuit can be a driver chip. The integrated circuit 2 can be located on one surface of the display panel 1. (Refer to...) Figure 2 , Figure 2 A schematic diagram of another display module is shown, such as Figure 2As shown, the display panel 1 can be a bent display panel, which can be divided into a third part 101, a bent area 102, and a fourth part 103. The third part 101 is the flat portion where the display area is located. One end of the bent area 102 is connected to the third part 101, and the other end is connected to the fourth part 103. The integrated circuit 2 and related heat dissipation structures are located on the surface of the fourth part 103 of the bent display panel 1, facing away from the third part 101. Between the fourth part and the third part, the following are also stacked in sequence: a border frame (BF) 104, a backside heat dissipation film (SCF) 105, and another border. A flexible printed circuit (FPC) 106 is also disposed on the surface of the backside heat dissipation film 105 facing away from the third part 101. On the surface of the integrated circuit and related heat dissipation structure facing away from the display panel, a cover film 110 can be provided. The cover film covers the integrated circuit and related heat dissipation structure (such as a buffer adhesive layer, heat sink, etc.) and connects the display panel and the flexible circuit board 106, serving as a cover and protection. In addition, on the side of the third part 101 of the display panel facing away from the fourth part 103, a polarizer (POL) 107, an optically clear adhesive (OCA) 108, and a cover glass (CG) 109 are stacked in sequence.

[0022] A thermally conductive adhesive layer 3 covers the integrated circuit 2, providing rapid heat conduction. Specifically, as shown... Figure 1 As shown, the thermally conductive adhesive layer 3 is in contact with the surface of the integrated circuit 2. The thermally conductive adhesive layer 3 covering the integrated circuit 2 means that the thermally conductive adhesive layer 3 contacts all surfaces of the integrated circuit 2 except for the bottom surface (the surface of the integrated circuit 2 that contacts the display panel 1) (the surrounding sides and the top surface). The material used for the thermally conductive adhesive layer can be silicone, epoxy resin, or polyurethane adhesive filled with high thermally conductive fillers such as boron nitride, alumina, silicon carbide, or aluminum nitride, which has high heat transfer efficiency and transfers the heat generated by the integrated circuit to the outside of the thermally conductive adhesive layer (the surface away from the integrated circuit). In some embodiments, the thickness of the thermally conductive adhesive layer is greater than or equal to 0.1 mm and less than or equal to 0.3 mm.

[0023] A buffer adhesive layer 4 is located on the side of the thermally conductive adhesive layer 3 facing away from the integrated circuit 2 and surrounds the side of the integrated circuit 2. The buffer adhesive layer 4 contacts the surface of the thermally conductive adhesive layer 3 (the surface facing away from the integrated circuit) and surrounds the side of the integrated circuit. The buffer adhesive layer 4 can also cover the top surface of the integrated circuit 2. The buffer adhesive layer 4 serves as a buffer and protector, and supports the heat sink 5 inserted therein, reducing the impact of mechanical shock on the integrated circuit.

[0024] In some embodiments, the material used for the buffer adhesive layer is conductive foam adhesive. The conductive foam adhesive provides conductivity, preventing the generation of charges on the display panel surface and thus preventing electrostatic discharge (ESD). The size of the buffer adhesive layer can be determined based on the external dimensions of the integrated circuit in the actual module to ensure optimal fit and protection. Optionally, the thickness of the buffer adhesive layer is greater than or equal to 10 mm and less than or equal to 15 mm. For example, based on the typical external dimensions of an integrated circuit, the length Lp (the long side of the buffer adhesive layer's orthographic projection on the display panel) is greater than or equal to 30 mm and less than or equal to 40 mm, the width Wp (the short side of the buffer adhesive layer's orthographic projection on the display panel) is greater than or equal to 20 mm and less than or equal to 30 mm, and the height Hp (the height of the buffer adhesive layer in the thickness direction of the display panel) is greater than or equal to 15 mm and less than or equal to 20 mm.

[0025] A heat sink 5 is inserted into the buffer adhesive layer 4 and contacts the thermally conductive adhesive layer 3, with at least a portion of the heat sink 5 exposed outside the buffer adhesive layer 4. The heat sink can be made of heat-conducting materials such as copper or aluminum alloy. The heat sink is primarily interspersed between the buffer adhesive layers and contacts the internal thermally conductive adhesive, forming a heat dissipation path. It absorbs and transfers the heat generated by the integrated circuit, and its large exposed heat dissipation area improves heat dissipation efficiency, exhibiting excellent thermal conductivity and mechanical strength.

[0026] Currently, IC devices in display modules generally suffer from the following problems: (1) High-efficiency heat dissipation requirements. With the increase in IC integration, the heat generated per unit area increases significantly. Especially in OLED display devices, the panel and its driving circuit will generate additional heat under high brightness or long-term operation. Traditional heat dissipation solutions are difficult to meet the requirements of high-efficiency heat dissipation, resulting in excessively high temperatures, which affect the performance and lifespan of the device. (2) Space constraints. Modern electronic devices pursue thin and light designs, leaving extremely limited space for heat dissipation systems. Traditional large heat dissipation devices cannot meet the requirements of this compact design, and a solution that can achieve high-efficiency heat dissipation in a limited space is needed. (3) Insufficient protection capabilities. Existing heat dissipation solutions often neglect the physical protection of ICs and other key components, especially in terms of shock resistance and corrosion resistance. In addition, it is necessary to prevent electrostatic discharge (ESD) to protect sensitive electronic components from damage. (4) Cost and complexity. Although some related heat dissipation technologies are efficient, they are expensive and technically complex, making them unsuitable for large-scale production and application. Therefore, it is necessary to develop a heat dissipation structure that is both economical and easy to manufacture.

[0027] To address the aforementioned issues, this application designs a display module that directly encapsulates the integrated circuit using a thermally conductive adhesive layer, enabling rapid heat dissipation during chip operation. This close contact between the heat sink and the thermally conductive adhesive layer establishes an efficient heat dissipation path from the chip to the external space, significantly reducing the operating temperature of the integrated circuit. This effectively prevents chip performance degradation or damage due to overheating, greatly improving the long-term reliability and lifespan of the display module under high-temperature, high-load conditions.

[0028] Furthermore, this application's design inserts and fixes the heat sink within the buffer adhesive layer, achieving integrated heat dissipation structure and chip packaging. This design eliminates the need for additional fasteners, resulting in a compact structure that saves valuable internal space, particularly beneficial for achieving the design requirements of thinner and lighter electronic devices. Simultaneously, the exposed portion of the heat sink allows direct contact with other internal heat dissipation structures or air, further enhancing heat dissipation efficiency.

[0029] In addition, the buffer adhesive layer placed outside the thermally conductive adhesive layer can effectively absorb and disperse mechanical stress (such as impact and vibration) from the outside, as well as stress generated by the thermal expansion and contraction of internal materials. It surrounds the side of the driver chip and together with the thermally conductive adhesive layer, it forms a protective package to prevent stress concentration from damaging the driver chip or its bonding leads, thereby improving the mechanical robustness and durability of the module.

[0030] In some embodiments, the heat sink is a flat, sheet-like structure, and multiple heat sinks located on the same side of the integrated circuit are arranged in the same direction; and The plane of the heat sink is parallel to the top surface of the integrated circuit and perpendicular to the side surface of the integrated circuit; or The plane of the heat sink is perpendicular to the top surface of the integrated circuit and also perpendicular to the side surface of the integrated circuit.

[0031] Reference Figure 1 , Figure 3 , Figure 4 and Figure 5 , Figure 1 A schematic diagram of a structure with horizontally arranged heat sinks is shown. Figure 3 A schematic diagram of a heat sink structure with vertically arranged fins is shown. Figure 4 A top view showing a heat sink with vertically arranged fins is shown. Figure 5 A top view of a heat sink with horizontally arranged fins is shown, as follows. Figures 1 to 5 As shown, the heat sink 5 is a flat, sheet-like structure. The thickness of the heat sink 5 is greater than or equal to 0.5 mm and less than or equal to 1 mm.

[0032] When the heat sink is arranged horizontally, such as Figure 1 As shown, the plane containing the heat sink is parallel to the top surface of the integrated circuit, which is also parallel to the surface of the display panel. Furthermore, the plane containing the heat sink is perpendicular to the side surface of the integrated circuit. The heat sink can be a sheet-like structure of any shape. For multiple heat sinks located on the same side of the integrated circuit, they are arranged along a first direction. The first direction is the thickness direction of the integrated circuit, that is, the direction from the bottom surface of the integrated circuit to the top surface, equivalent to the normal direction of the bottom surface of the integrated circuit. In some embodiments, among the multiple heat sinks located on the same side of the integrated circuit, the shortest straight-line distance between any two adjacent heat sinks is greater than or equal to 3 mm and less than or equal to 5 mm. (Refer to...) Figure 5 To achieve maximum heat dissipation area, the heat sink 5 can be a ring-shaped structure with a U-shape. In this case, the heat sink is interspersed in layers within the buffer adhesive layer for heat conduction and dissipation. For example, based on the typical dimensions of integrated circuits, the length Lt (the long side of the heat sink's orthographic projection on the display panel) of the heat sink is greater than or equal to 60mm and less than or equal to 80mm, and the width Wt (the short side of the heat sink's orthographic projection on the display panel) is greater than or equal to 15mm and less than or equal to 25mm.

[0033] When the heat sink is arranged vertically, such as Figure 3 and Figure 4As shown, the plane of the heat sink is perpendicular to the top surface of the integrated circuit, that is, perpendicular to the surface of the display panel. Furthermore, the plane of the heat sink is perpendicular to the side surface of the integrated circuit. The heat sink can be a sheet-like structure of any shape. For multiple heat sinks located on the same side of the integrated circuit, they are arranged along a second direction (the direction extending from the side surface of the integrated circuit). In some embodiments, among the multiple heat sinks located on the same side of the integrated circuit, the shortest straight-line distance between any two adjacent heat sinks is greater than or equal to 3 mm and less than or equal to 5 mm. The heat sinks are interspersed in layers within the buffer adhesive layer for heat conduction and dissipation. Simultaneously, the vertical arrangement of the heat sinks enhances the mechanical strength of the internal buffer adhesive layer, providing better support. For example, based on the typical dimensions of an integrated circuit, the length Lt' (the long side of the heat sink parallel to the plane of the display panel) of the heat sink is greater than or equal to 25 mm and less than or equal to 35 mm, and the height Hf (the side parallel to the thickness direction of the integrated circuit) is greater than or equal to 8 mm and less than or equal to 12 mm.

[0034] The main source of heat in this module is the operation of the integrated circuit. The inner thermally conductive adhesive layer quickly absorbs the heat generated by the integrated circuit and transfers it through the heat sink. The heat sink transfers the heat to the exposed heat sink part through the buffer adhesive layer for rapid heat dissipation. At the same time, the graphite layer on the surface can also quickly absorb heat and transfer it to the outer cover film 110 for heat dissipation.

[0035] In some embodiments, the heat sink has a U-shaped cross-section, with the U-shaped opening facing the side of the integrated circuit; and The heat sink includes a first part and a second part. The first part consists of two flat portions that are opposite and parallel to each other in the heat sink, and the second part consists of a bent portion that connects one end of the two flat portions in the heat sink. Wherein, the plane containing the first portion of the heat sink is parallel to the top surface of the integrated circuit and perpendicular to the side surface of the integrated circuit; or The plane containing the first portion of the heat sink is perpendicular to the top surface of the integrated circuit and also perpendicular to the side surface of the integrated circuit.

[0036] Reference Figure 6 and Figure 7 , Figure 6 A schematic diagram of a U-shaped heat sink with horizontally arranged fins is shown. Figure 7 A schematic diagram of a U-shaped heat sink with vertically arranged fins is shown, as follows: Figure 6 and Figure 7 As shown, the heat sink has a U-shaped sheet structure, with the opening of the U facing the integrated circuit side. This means that the two ends of the U are inserted into the buffer adhesive layer and are in contact with the internal thermally conductive adhesive layer. The thickness of the heat sink is greater than or equal to 0.5 mm and less than or equal to 1 mm.

[0037] When the heat sink is arranged horizontally, such as Figure 6 As shown, the plane containing the first portion of the heat sink is parallel to the top surface of the integrated circuit and perpendicular to the side surface of the integrated circuit. Multiple heat sinks located on the same side of the integrated circuit are arranged along a first direction (the thickness direction of the integrated circuit, i.e., the direction from the bottom surface to the top surface of the integrated circuit). In some embodiments, among the multiple heat sinks located on the same side of the integrated circuit, the shortest straight-line distance between any two adjacent heat sinks is greater than or equal to 3 mm and less than or equal to 5 mm. To achieve the maximum heat dissipation area, the orthographic projection shape of the heat sink on the display panel can be a U-shaped ring (top view as shown). Figure 5 (As shown). The heat sink is layered and interspersed within the buffer adhesive layer for heat conduction and dissipation. For example, based on the typical dimensions of an integrated circuit, the length Lr (the long side of the heat sink's orthographic projection on the display panel) of the heat sink is greater than or equal to 60 mm and less than or equal to 80 mm, and the width Wr (the short side of the heat sink's orthographic projection on the display panel) is greater than or equal to 15 mm and less than or equal to 25 mm.

[0038] Reference Figure 8 , Figure 8 A top view of a U-shaped heat sink with vertically arranged fins is shown. When the heat sink is arranged vertically, as... Figure 7 and Figure 8 As shown, the plane containing the first portion of the heat sink is perpendicular to the top surface of the integrated circuit and also perpendicular to the side surface of the integrated circuit. Multiple heat sinks located on the same side of the integrated circuit are arranged along a second direction (the direction extending from the side surface of the integrated circuit). Simultaneously, the vertical arrangement of the heat sinks enhances the mechanical strength of the internal buffer adhesive layer, providing better support. In some embodiments, among the multiple heat sinks located on the same side of the integrated circuit, the shortest straight-line distance between any two adjacent heat sinks is greater than or equal to 3 mm and less than or equal to 5 mm. For example, based on the typical dimensions of an integrated circuit, the length Lt' (the long side of the heat sink parallel to the plane of the display panel) of the heat sink is greater than or equal to 25 mm and less than or equal to 35 mm, and the height Hf (the side parallel to the thickness direction of the integrated circuit) is greater than or equal to 8 mm and less than or equal to 12 mm.

[0039] In some embodiments, the heat sink is a sheet-like structure with a wavy cross-section, and the heat sink is continuously bent along its extension direction to form multiple arc-shaped units; and The angle between the extension direction of the heat sink and the thickness direction of the integrated circuit is greater than or equal to 15° and less than or equal to 30°.

[0040] Reference Figure 9 , Figure 9A schematic diagram of a wave-shaped heat sink is shown, as follows: Figure 9 As shown, the heat sink has an arc-shaped, wavy structure. This wavy structure significantly increases the surface area (i.e., heat dissipation area) of the heat sink in contact with the air within a limited space, thus increasing heat transfer efficiency. Extending continuously in one direction ensures that the heat dissipation path covers the entire length of the chip and may also facilitate airflow.

[0041] Furthermore, the heat sink is inserted into the buffer adhesive layer at an angle, meaning that the extension direction of the heat sink has a certain angle α with the thickness direction of the integrated circuit (i.e., the direction from the bottom surface of the integrated circuit to the top surface, and the normal direction of the bottom surface of the integrated circuit), rather than being completely parallel or perpendicular. Here, the extension direction of the heat sink refers to the wavy extension direction (e.g.,...). Figure 9 The direction indicated by the dashed line refers to the length of this wavy, sheet-like structure along its main dimensions, and also the direction in which its wave-like shape continuously unfolds. The inclined insertion method can further increase the heat dissipation area of ​​the heat sink and improve its heat dissipation efficiency.

[0042] In some embodiments, among a plurality of heat sinks located on the same side of the integrated circuit, the shortest straight-line distance between any two adjacent heat sinks is greater than or equal to 3 mm and less than or equal to 5 mm. The thickness of the heat sink is greater than or equal to 0.5 mm and less than or equal to 1 mm. Specifically, the inner thermally conductive adhesive layer rapidly absorbs the heat generated by the integrated circuit and transfers it through the arc-shaped heat sink. The large-area heat dissipation area of ​​the heat sink's inclined arc quickly contacts the air for heat dissipation, while the graphite on the surface also quickly absorbs heat and transfers it to the outside.

[0043] In some embodiments, at least one heat dissipation hollow tube is fixedly connected to the edge of the heat sink away from the buffer adhesive layer, and the heat dissipation hollow tube is filled with coolant.

[0044] Specifically, this embodiment proposes a heat dissipation structure with nested hollow heat dissipation tubes. By nesting hollow heat dissipation tubes on the surface of the heat sink, rapid heat dissipation is achieved, improving heat dissipation efficiency. The hollow heat dissipation tubes can be filled with a cooling fluid (i.e., coolant) to form a flowing cooling system, which can quickly remove heat and significantly improve the heat dissipation effect. In some embodiments, the coolant can be deionized water or acetone solution. The hollow heat dissipation tubes can be copper tubes. The hollow heat dissipation tubes and the heat sink can be integrally formed (both using copper material), or the heat sink can have a mounting structure for embedding the hollow heat dissipation tubes. In this embodiment, as long as the heat sink and the hollow heat dissipation tubes can be connected and fixed, and the heat from the heat sink can be transferred to the hollow heat dissipation tubes, the specific structure is not limited.

[0045] Reference Figure 10 , Figure 10A schematic diagram of a horizontally arranged hollow heat dissipation tube structure is shown, as follows: Figure 10 As shown, the heat dissipation hollow tube 8 can be arranged horizontally, such that the extension direction of the tube is parallel to the edge of the top surface of the integrated circuit. The heat dissipation hollow tube can also be annular, arranged horizontally around a buffer adhesive layer. The arrangement of the heat dissipation hollow tube does not need to be consistent with the arrangement of the heat sink. Specifically, when the heat dissipation hollow tube is arranged horizontally, the heat sink can also be arranged horizontally, so that the edge of each layer (i.e., each piece) of heat sink is connected and nested with the heat dissipation hollow tube, that is, the edges of the heat dissipation hollow tube and the heat sink overlap. Or, as... Figure 10 As shown, the heat sink 5 can also be arranged vertically, that is, the heat sink 5 is perpendicular to the heat dissipation hollow tube 8, so that each heat sink is in contact with multiple heat dissipation hollow tubes. In addition, the heat sink can also be other shapes (such as wavy or U-shaped) and arrangements, as long as the edge of the heat sink's orthogonal projection on the display panel (the edge opposite to the integrated circuit) is connected to the heat dissipation hollow tube.

[0046] Reference Figure 11 , Figure 11 A schematic diagram of a vertically arranged hollow heat dissipation tube structure is shown, as follows: Figure 11 As shown, the tube bodies of the heat dissipation hollow tubes 8 can be arranged vertically, such that the extension direction of the tube bodies is the thickness direction of the integrated circuit, that is, the direction from the bottom surface of the integrated circuit to the top surface. The arrangement of the heat dissipation hollow tubes does not need to be consistent with the arrangement of the heat sinks. Specifically, when the heat dissipation hollow tubes are arranged vertically, the heat sinks can also be arranged horizontally, with the heat sinks perpendicular to the heat dissipation hollow tubes, so that each heat sink is in contact with multiple heat dissipation hollow tubes. Alternatively, the heat sinks can also be arranged vertically, that is, the edge of each heat sink is connected and nested with the heat dissipation hollow tubes, and the edges of the heat dissipation hollow tubes and heat sinks overlap.

[0047] In some embodiments, the inner diameter of the heat dissipation hollow tube is greater than or equal to 2 mm and less than or equal to 4 mm. The heat dissipation hollow tube can reinforce the heat sink, ensuring its stability, and can quickly transfer and dissipate heat from the heat sink to form heat dissipation. Various heat dissipation methods can be formed according to different arrangements, optimizing airflow paths and heat dissipation effects. The inner thermally conductive adhesive layer quickly absorbs the heat generated by the integrated circuit and transfers it outward through the heat sink. The coolant inside the heat dissipation hollow tube, nestled on the surface of the heat sink, also absorbs heat from the heat sink and transfers it to lower temperatures through fluid transfer. Simultaneously, the graphite on the surface can also quickly absorb heat and transfer it to the outside.

[0048] In some embodiments, the shortest straight-line distance between any two adjacent heat sinks is greater than or equal to 3 mm and less than or equal to 5 mm.

[0049] Specifically, the spacing between each heatsink is designed to ensure smooth airflow and further improve heat dissipation efficiency. If the distance between heatsinks is too narrow (e.g., less than 3mm), it creates a narrow airflow channel, resulting in significant air resistance and hindering the expulsion of hot air. Simultaneously, excessively small gaps can easily accumulate dust, clogging the airflow channel. If the distance between heatsinks is too wide (e.g., greater than 5mm), although airflow resistance is lower, the total number of heatsinks that can be arranged within the limited space will be reduced. The total surface area of ​​the heatsinks (i.e., the area in contact with the air for heat exchange) will be correspondingly reduced, thereby decreasing the overall heat dissipation capacity. This embodiment, by controlling the distance between heatsinks, ensures that the heat dissipation structure can establish an efficient and smooth airflow channel, thereby quickly and effectively dissipating the heat absorbed by the heatsinks from the driver chip to the surrounding environment, achieving the goal of improving heat dissipation efficiency.

[0050] In some embodiments, for each heat sink, the ratio between the length of the portion of the heat sink inserted into the buffer adhesive layer in the normal direction along the side of the integrated circuit and the overall length of the heat sink is greater than or equal to 0.4 and less than or equal to 0.6.

[0051] Specifically, the direction along the normal to the side of the integrated circuit refers to a horizontal direction perpendicular to the side of the integrated circuit, which is also the thickness direction of the buffer film layer. It can be simply understood as a direction extending horizontally outward from the side of the integrated circuit. This direction is also the dividing direction between the inserted and exposed portions of the heat sink. The length of the portion of the heat sink inserted into the buffer adhesive layer refers to the depth to which the heat sink is buried within the buffer adhesive layer. Approximately 40%-60% of the length of a heat sink is inserted into the buffer adhesive layer, while the remaining portion is exposed outside the adhesive layer and in contact with the air. Specifying this particular range is to simultaneously satisfy the sometimes contradictory requirements of structural stability and efficient heat dissipation, thereby achieving optimal overall performance.

[0052] The heatsink needs to be securely fixed above the integrated circuit. If the insertion portion is too short (e.g., a ratio less than 0.4), it means that less of the heatsink is within the buffer layer, making it prone to loosening, tilting, or even detaching from the buffer layer. Especially when the device is subjected to vibration or impact, an unstable heatsink may not only fail to dissipate heat but may also collide with or press against other components, causing damage. An insertion ratio of at least 0.4 ensures that a sufficiently long portion of the heatsink is wrapped and held by the buffer layer, providing the necessary mechanical strength and stability, making the entire heat dissipation structure robust and reliable.

[0053] The ultimate goal of a heatsink is to dissipate heat into the air. If the insertion portion is too long (e.g., a ratio greater than 0.6), it means that the portion exposed to the air and capable of free heat exchange is too short. After heat is conducted from the integrated circuit to the heatsink, most of it is trapped inside the buffer layer. Although the buffer layer also has some thermal conductivity, its heat dissipation efficiency is far lower than that of the heatsink directly in contact with the air, leading to heat buildup and significantly reduced heat dissipation efficiency. An insertion ratio of no more than 0.6 ensures that a sufficiently long portion of the heatsink (at least 40%) is exposed outside the buffer layer. This provides a large effective heat dissipation surface area, allowing heat to be efficiently dissipated into the surrounding environment through convection and radiation.

[0054] In some embodiments, the buffer adhesive layer covers the top surface of the integrated circuit; The display module further includes: a graphite layer and at least one heat sink, wherein the graphite layer contacts and covers the side surface of the buffer adhesive layer opposite to the integrated circuit; the heat sink is inserted into the buffer adhesive layer, and one end of the heat sink contacts the thermally conductive adhesive layer, and the other end contacts the graphite layer.

[0055] like Figure 1 As shown, the buffer adhesive layer 4 covers the top surface of the integrated circuit 2. Instead of inserting a heat sink, a heat sink strip 7 (made of copper) can be embedded in the buffer adhesive layer 4 on the top surface of the integrated circuit 2. Through the heat sink strip 7, heat is conducted to the graphite layer 6, dissipating the heat from the integrated circuit. The size of the heat sink strip is determined according to actual needs. For example, the length L1 (the distance from the end in contact with the thermally conductive adhesive layer to the other end in contact with the graphite layer) is greater than or equal to 30 mm and less than or equal to 40 mm, the width W1 is greater than or equal to 1 mm and less than or equal to 2 mm, and the thickness T1 is greater than or equal to 1.5 mm and less than or equal to 2.5 mm.

[0056] A graphite layer 6 covers the surface of the buffer adhesive layer 4 (conductive foam adhesive), enhancing heat dissipation efficiency, providing electromagnetic shielding, and reducing the impact of external electromagnetic interference on the integrated circuit. The thickness of the graphite layer can be set according to actual needs; for example, the thickness is greater than or equal to 0.1 mm and less than or equal to 0.3 mm. Furthermore, the graphite layer needs to be tightly adhered to the surface of the buffer adhesive layer (conductive foam adhesive) to ensure no air gaps, maximizing heat dissipation.

[0057] In some embodiments, a corrosion-resistant coating is provided on the side of the buffer adhesive layer facing away from the integrated circuit. (Refer to...) Figure 12 , Figure 12 A schematic diagram of a corrosion-resistant coating is shown, as follows. Figure 12As shown, the corrosion-resistant coating 9 covers the buffer adhesive layer 4 to provide protection. The material used for the corrosion-resistant coating 9 can be polytetrafluoroethylene (PTFE), epoxy resin, or ceramic coating, which enhances the material's corrosion resistance, reduces maintenance costs, and is particularly suitable for use in humid or corrosive environments.

[0058] The beneficial effects of the display module proposed in this application embodiment are, firstly, a significant improvement in the heat dissipation efficiency of the integrated circuit. Specifically, it employs a multi-layer composite material design, including an inner thermally conductive adhesive layer, a buffer adhesive layer (conductive foam adhesive), a heat sink, and a graphite layer. These materials together constitute an efficient heat conduction path. The heat sink, as the main heat dissipation component, optimizes the airflow path and improves the effects of natural and forced convection. In some embodiments, a microchannel cooling system is formed by filling the hollow heat dissipation tubes nested on the surface of the heat sink with a rapidly dissipating fluid, providing an efficient liquid cooling effect, particularly suitable for high power density applications. This multi-layered, multi-path heat dissipation solution ensures effective control of the integrated circuit's operating temperature, extends the lifespan of the integrated circuit and other key components, and improves the overall performance of the device.

[0059] Secondly, the display module proposed in this application's embodiments meets the requirements of compact design. Specifically, modern electronic devices, especially products equipped with OLED screens, pursue a thin and light design, leaving extremely limited space for the heat dissipation system. The annular heat dissipation support structure proposed in this application's embodiments makes full use of the limited space around the integrated circuit, without occupying additional volume, making it very suitable for application in miniaturized and thin electronic products. By integrating the heat sink, heat dissipation hollow tube, and thermally conductive adhesive layer into a compact annular structure, the problem of traditional large-volume heat sinks occupying too much space is avoided, exhibiting good integration and scalability.

[0060] Furthermore, the display module proposed in this application enhances physical and electrical protection capabilities. Traditional heat dissipation solutions neglect the physical protection of integrated circuits and other critical components. This application's embodiment uses high-strength materials (such as aluminum alloy or copper) to construct the support structure (heat sink), ensuring structural stability and mechanical strength, effectively resisting external impacts and vibrations. The protective layer covering the heat dissipation component is made of a highly heat-resistant material, preventing external factors from damaging internal components while providing electromagnetic shielding. Conductive foam adhesive prevents the generation of charges on the display panel surface, preventing electrostatic discharge (ESD) and enhancing overall protection capabilities.

[0061] Furthermore, the display module proposed in this application reduces manufacturing costs and technical complexity. This application employs standardized material selection, such as common industrial materials (aluminum alloy, copper, conductive foam, etc.), reducing raw material costs. It simplifies the manufacturing process, facilitates maintenance and replacement, extends product lifespan, ensures the cost-effectiveness and technical feasibility of the design, and is suitable for large-scale production and application.

[0062] Furthermore, the efficient heat dissipation design helps reduce the operating temperature of integrated circuits, thereby reducing energy consumption, leveraging the low power consumption advantage of OLEDs, and achieving an energy-saving and environmentally friendly operating mode. Good heat dissipation performance can also extend battery life and reduce overall energy consumption, aligning with the concept of green and sustainable development.

[0063] Finally, the display module proposed in this application is not only applicable to the integrated circuit area in OLED display devices, but also to other fields requiring efficient heat dissipation, such as servers and high-performance computing platforms. Its flexible structural design allows for adjustments to size and materials to meet specific needs based on different application scenarios. Furthermore, with technological advancements, this structure can be further optimized and upgraded to adapt to higher heat dissipation requirements and technical standards.

[0064] A second aspect of this application also provides a display device, the display device comprising: the display module described in the first aspect of this application.

[0065] The display panel proposed in this embodiment can be an OLED. The aforementioned display device can be any product or component with display function, such as a television, digital camera, mobile phone, or tablet computer.

[0066] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0067] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0068] The above provides a detailed description of a display module and display device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

[0069] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0070] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

[0071] The terms "an embodiment," "embodiment," or "one or more embodiments" as used herein mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of this application. Furthermore, please note that the examples of the phrase "in one embodiment" do not necessarily all refer to the same embodiment.

[0072] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of this application may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0073] In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. This application can be implemented by means of hardware comprising several different elements and by means of a suitably programmed computer. In a unit claim enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names.

[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A display module, characterized in that, The display module includes: Display panel; An integrated circuit, which is bonded to one side surface of the display panel; A thermally conductive adhesive layer, wherein the thermally conductive adhesive layer covers the integrated circuit; A buffer adhesive layer is located on the side of the thermally conductive adhesive layer facing away from the integrated circuit and surrounds the side surface of the integrated circuit; the side surface of the integrated circuit is the end face connecting the bottom and top surfaces of the integrated circuit; the bottom surface of the integrated circuit is the surface of the integrated circuit closest to the display panel; and the top surface of the integrated circuit is the surface of the integrated circuit opposite to the bottom surface. A heat sink is inserted into the buffer adhesive layer, contacts the thermally conductive adhesive layer, and is at least partially exposed outside the buffer adhesive layer.

2. The display module according to claim 1, characterized in that, The heat sink is a flat, sheet-like structure, and multiple heat sinks located on the same side of the integrated circuit are arranged in the same direction; and The plane of the heat sink is parallel to the top surface of the integrated circuit and perpendicular to the side surface of the integrated circuit; or The plane of the heat sink is perpendicular to the top surface of the integrated circuit and also perpendicular to the side surface of the integrated circuit.

3. The display module according to claim 1, characterized in that, The heat sink has a U-shaped cross-section, with the U-shaped opening facing the side of the integrated circuit; and The heat sink includes a first part and a second part. The first part consists of two flat portions that are opposite and parallel to each other in the heat sink, and the second part consists of a bent portion that connects one end of the two flat portions in the heat sink. Wherein, the plane containing the first portion of the heat sink is parallel to the top surface of the integrated circuit and perpendicular to the side surface of the integrated circuit; or The plane containing the first portion of the heat sink is perpendicular to the top surface of the integrated circuit and also perpendicular to the side surface of the integrated circuit.

4. The display module according to claim 1, characterized in that, The heat sink has a wavy cross-section and is continuously bent along its extension direction to form multiple arc-shaped units; and The angle between the extension direction of the heat sink and the thickness direction of the integrated circuit is greater than or equal to 15° and less than or equal to 30°.

5. The display module according to claim 1, characterized in that, At least one heat dissipation hollow tube is fixedly connected to the edge of the heat sink away from the buffer adhesive layer, and the heat dissipation hollow tube is filled with coolant.

6. The display module according to claim 1, characterized in that, The material used for the buffer adhesive layer is conductive foam adhesive.

7. The display module according to any one of claims 1-6, characterized in that, Among the plurality of heat sinks, the shortest straight-line distance between any two adjacent heat sinks is greater than or equal to 3 mm and less than or equal to 5 mm.

8. The display module according to any one of claims 1-6, characterized in that, For each heat sink, the ratio between the length of the portion of the heat sink inserted into the buffer adhesive layer in the normal direction along the side of the integrated circuit and the overall length of the heat sink is greater than or equal to 0.4 and less than or equal to 0.

6.

9. The display module according to any one of claims 1-6, characterized in that, The buffer adhesive layer covers the top surface of the integrated circuit; The display module further includes: a graphite layer and at least one heat sink, wherein the graphite layer contacts and covers the side surface of the buffer adhesive layer opposite to the integrated circuit; the heat sink is inserted into the buffer adhesive layer, and one end of the heat sink contacts the thermally conductive adhesive layer, and the other end contacts the graphite layer.

10. A display device, characterized in that, The display device includes: the display module according to any one of claims 1-9.

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