Pin bending equipment of electronic device

Abstract

The invention discloses a pin bending device of an electronic device, and belongs to the technical field of electronic device processing. The pin bending device comprises a frame, the top of the frame is fixedly connected with a motor, the interior of the frame is rotatably connected with a middle shaft rod, and the surface of the middle shaft rod is sleeved with a limiting mechanism. Through a limiting mechanism, a pushing mechanism and a bending mechanism, a rotating substrate drives a capacitor to rotate, pins at the top and the bottom of the capacitor are in contact with rotating cylinders, the two rotating cylinders press and bend the pins at the two ends when the pins continuously move to pass through the rotating cylinders, and when the rotating cylinders bend the pins, due to the fact that the rotating cylinders are rotationally connected with bending rods, the pins can be bent more stably, and the bending efficiency is improved. When the rotating drum presses and bends the pins, the rotating drum rotates to avoid excessive friction between the pins and the rotating drum to cause damage to coatings on the surfaces of the pins, capacitors are sequentially and continuously pushed into the two inner grooves in cooperation with the push plate, and the pins of the capacitors are continuously bent along with continuous rotation of the two substrates. And the bending processing efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of electronic device processing technology, and in particular to a pin bending device for electronic devices. Background Technology

[0002] Electronic components are the basic units that make up electronic devices. They can be used individually or combined to form more complex circuits or systems. Electronic components mainly include passive components, capacitors, resistors, etc. Most electronic components have metal contacts, or leads, for electrical connection with other circuit components or systems. During the manufacturing and assembly of electronic components, these leads need to be bent as required to better secure the components and correctly mount them onto circuit boards or other carriers.

[0003] A capacitor is a capacitor made by using anodizing to form a thin layer of oxide as a dielectric on the surface of a metal such as aluminum, tantalum, niobium, or titanium, and using an electrolyte as a cathode. Electrolytic capacitors can be mainly divided into two types according to the position of the leads: those with two leads on the same side and those with two leads symmetrically distributed on both sides. When soldering leads on both sides, they need to be bent to the same side in order to insert the leads into the soldering holes on the circuit board.

[0004] Currently, most capacitor processing on production lines is done manually. Workers need to hold a capacitor in their hand to hold it in place, and then use pliers to bend the two leads. When bending, the force applied by the worker cannot be kept stable, which can easily damage the leads and cause inconsistencies in the bending angle, greatly affecting the bending effect. At the same time, only one capacitor's leads can be processed at a time, resulting in low overall efficiency. Summary of the Invention

[0005] The purpose of this invention is to address the problem that most capacitor processing on current production lines relies on manual operation. Workers need to hold a capacitor in their hand and then use pliers to bend the two leads. During bending, the worker's force cannot be kept constant, easily causing damage to the leads and resulting in inconsistent bending angles, significantly affecting the bending effect. Furthermore, only one capacitor's lead can be processed at a time, leading to low overall efficiency. Therefore, this invention proposes a lead bending device for electronic devices.

[0006] To achieve the above objectives, the present invention employs the following technology: a pin bending device for electronic devices, comprising a frame, a motor fixedly connected to the top of the frame, a central shaft rotatably connected inside the frame, a limiting mechanism sleeved on the surface of the central shaft, adjusting mechanisms threadedly connected to both sides of the frame, a support frame fixedly connected to the bottom of the frame, a storage box fixedly connected to the top of the support frame, and a pushing mechanism passing through one side of the storage box; The bending mechanism includes an electric push rod fixedly installed on the side of the storage box. The other end of the electric push rod is fixedly connected to a telescopic cylinder. Bending rods are inserted into both ends of the telescopic cylinder. Crosses are slidably connected to the surfaces of the two bending rods. One end of the two crosses passes through the top and bottom of the frame, respectively. A rotating cylinder is rotatably connected to one side of the surface of each bending rod. A third spring is sleeved on the surface of the two crosses, and the two ends of the third spring are fixedly connected to the crosses and the frame, respectively.

[0007] As a further description of the pin bending device for an electronic device described above: the limiting mechanism includes a substrate slidably connected to both sides of the surface of the central shaft, and hollow plates are provided on the opposite surfaces of the two substrates. The connecting surfaces of the substrates and the hollow plates are respectively arrayed with a first groove and a second groove. A clamping mechanism is provided between the first groove and the second groove, wherein the substrates and the hollow plates are connected by the clamping mechanism.

[0008] As a further description of the pin bending device for an electronic device of the above technology: the other end of the cross is in contact with the outside of the substrate, and one side of the bottom of the storage box extends to contact the circumferential surface of one of the substrates.

[0009] As a further description of the pin bending device for an electronic device of the above technology: pin slots are arrayed on the circumference of the substrate, and inner grooves are arrayed on the circumference of the hollow plate.

[0010] As a further description of the lead bending device for an electronic device described above: the pressing mechanism includes a through rod fixedly connected to the inner wall of a first groove and a first spring disposed between the first groove and a second groove, wherein the first spring is sleeved on the surface of the through rod, and both ends of the first spring are fixedly connected to the inner walls of the first groove and the second groove, respectively, and one end of the through rod extends through the second groove.

[0011] As a further description of the pin bending device for an electronic device described above: the adjusting mechanism includes a threaded rod threaded through both sides of a frame, the other end of which is rotatably connected to a trapezoidal block, and the top and bottom of the trapezoidal block are slidably connected to an expansion block, one side of which is slidably connected to the surface of two substrates.

[0012] As a further description of the lead bending device for an electronic device described above: the pushing mechanism includes a push rod passing through one side of the storage box, one end of the push rod being fixedly connected to a push plate, and a second spring being sleeved on the surface of the push rod, the two ends of the second spring being connected to the push plate and the inner side wall of the storage box, respectively.

[0013] As a further description of the pin bending device for an electronic device described above: one end of the bending rod extends between two hollow plates.

[0014] In summary, due to the adoption of the above-mentioned technology in the pin bending device for electronic devices, the beneficial effects of this invention are: By setting up a limiting mechanism, a pushing mechanism, and a bending mechanism, the capacitors in the storage box are first pushed sequentially into the two inner grooves by the elastic push plate of the third spring. Then, the rotating base plate drives the capacitors to rotate, and the top and bottom leads of the capacitors come into contact with the rotating drum. As the leads move continuously past the rotating drum, the two rotating drums press and bend the leads at both ends. At the same time, when the rotating drum bends the leads, since the rotating drum and the bending rod are rotatably connected, the rotating drum rotates while pressing and bending the leads, avoiding excessive friction between the leads and the rotating drum, which would damage the plating on the lead surface. Then, in conjunction with the push plate, the capacitors are continuously pushed into the two inner grooves. As the two base plates continue to rotate, the capacitor leads are continuously bent, thereby improving the efficiency of the bending process. Attached Figure Description

[0015] Figure 1 An overall rear perspective view provided according to an embodiment of the present invention is shown; Figure 2 An overall front perspective view provided according to an embodiment of the present invention is shown; Figure 3 A structural diagram of the adjusting mechanism provided according to an embodiment of the present invention is shown; Figure 4 A structural diagram of a defined mechanism provided according to an embodiment of the present invention is shown; Figure 5 A breakdown diagram of the defined mechanism provided according to an embodiment of the present invention is shown; Figure 6 A structural diagram of a bending mechanism provided according to an embodiment of the present invention is shown; Figure 7 The present invention provides an embodiment of the invention. Figure 1 Enlarged view of point A in the middle; Figure 8 The present invention provides an embodiment of the invention. Figure 5 Enlarged view of section B in the middle.

[0016] Legend: 1. Frame; 2. Motor; 3. Central shaft; 4. Limiting mechanism; 401. Base plate; 4011. Pin slot; 4012. Inner groove; 402. Hollow plate; 403. Pressing mechanism; 4031. Through rod; 4032. First spring; 5. Adjusting mechanism; 501. Threaded rod; 502. Trapezoidal block; 503. Outer expansion block; 6. Support frame; 7. Storage box; 8. Pushing mechanism; 801. Push rod; 802. Push plate; 803. Second spring; 9. Bending mechanism; 901. Electric push rod; 902. Bending rod; 903. Cross; 904. Rotary drum; 905. Third spring; 906. Telescopic drum. Detailed Implementation

[0017] The pin bending device for an electronic device according to the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Reference Figures 1-8 This embodiment provides a pin bending device for electronic devices, including a frame 1. A motor 2 is fixedly connected to the top of the frame 1. A central shaft 3 is rotatably connected inside the frame 1. A limiting mechanism 4 is sleeved on the surface of the central shaft 3. Adjustment mechanisms 5 are threadedly connected to both sides of the frame 1. A support frame 6 is fixedly connected to the bottom of the frame 1. A storage box 7 is fixedly connected to the top of the support frame 6. A pushing mechanism 8 is passed through one side of the storage box 7. The top of the central shaft 3 is connected to the output end of the motor 2. When the motor 2 starts, it drives the central shaft 3 to rotate. Then, the rotating central shaft 3 drives the limiting mechanism 4 to rotate. The rotating limiting mechanism 4 conveys the capacitor, thereby indirectly feeding it.

[0019] Specifically, such as Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, the limiting mechanism 4 includes a base plate 401 slidably connected to both sides of the surface of the central shaft 3. A hollow plate 402 is provided on the opposite surface of the two base plates 401. The connecting surfaces of the base plates 401 and the hollow plates 402 are respectively arrayed with a first groove and a second groove. A pressing mechanism 403 is provided between the first groove and the second groove. The base plates 401 and the hollow plates 402 are connected by the pressing mechanism 403. The substrate 401 has pin slots 4011 arranged in an array around its circumference, and the hollow plate 402 has an inner groove 4012 arranged in an array around its circumference. When the central shaft 3 rotates, it drives the two substrates 401 and the hollow plate 402 to rotate, and then aligns the inner groove 4012 and the pin slots 4011 with the opening of the storage box 7. Then, the capacitor is clamped and positioned by the gap between the two inner grooves 4012. Then, the capacitor can be indirectly fed and delivered by rotating the substrate 401 and the hollow plate 402.

[0020] Specifically, such as Figure 8 As shown, the clamping mechanism 403 includes a through rod 4031 fixedly connected to the inner wall of the first groove and a first spring 4032 disposed between the first groove and the second groove. The first spring 4032 is sleeved on the surface of the through rod 4031, and both ends of the first spring 4032 are fixedly connected to the inner walls of the first groove and the second groove, respectively. One end of the through rod 4031 extends through the second groove, and then the substrate 401 and the hollow plate 402 are connected together by the first spring 4032. The first spring 4032 strengthens the tightness between the substrate 401 and the hollow plate 402, preventing the substrate 401 from separating and falling off during device operation. At the same time, when the two substrates 401 clamp the capacitor, the first spring 4032 prevents the two substrates 401 from clamping the capacitor too tightly and causing damage. At the same time, when the two substrates 401 clamp the capacitor, the first spring 4032 can adjust the distance between the two substrates 401 by a short distance, which can facilitate fine adjustment according to capacitors of different lengths.

[0021] Specifically, such as Figure 3 As shown, the adjusting mechanism 5 includes a threaded rod 501 threaded through both sides of the frame 1. The other end of the threaded rod 501 is rotatably connected to a trapezoidal block 502. The top and bottom of the trapezoidal block 502 are slidably connected to an expansion block 503. One side of the two expansion blocks 503 is slidably connected to the surface of the two substrates 401.

[0022] Rotating the threaded rods 501 on both sides causes the trapezoidal blocks 502 on both sides to move. When the trapezoidal blocks 502 move, they cause the two outward expansion blocks 503 to move up and down to expand outward. The outward expansion of the two outward expansion blocks 503 can adjust the distance between the two hollow plates 402. When the distance between the two hollow plates 402 is adjusted, the distance between the two substrates 401 is also adjusted, thereby allowing for a larger adjustment of the distance between the two inner grooves 4012. This makes it easy to adjust according to the different lengths of the capacitor. The two outward expansion blocks 503 are slidably connected to the two hollow plates 402 respectively. The two outward expansion blocks 503 are connected to each other through the trapezoidal blocks 502. The two hollow plates 402 are connected through the distance adjustment mechanism 5, thus providing an overhead support for the limiting mechanism 4.

[0023] Specifically, such as Figure 2 and Figure 6 As shown, the pushing mechanism 8 includes a push rod 801 that passes through one side of the storage box 7. One end of the push rod 801 is fixedly connected to a push plate 802. A second spring 803 is sleeved on the surface of the push rod 801. The two ends of the second spring 803 are respectively connected to the push plate 802 and the inner wall of the storage box 7.

[0024] Under the action of the elastic force of the second spring 803, the elastic force of the second spring 803 pushes the push plate 802 to move, and then the push plate 802 pushes the capacitor inside the storage box 7 to move. Under the action of the elastic force of the second spring 803, the capacitor can be pushed between the two inner grooves 4012 for automatic feeding of the capacitor.

[0025] Specifically, such as Figure 6 As shown, the bending mechanism 9 includes an electric push rod 901 fixedly installed on the side of the storage box 7. A telescopic cylinder 906 is fixedly connected to the other end of the electric push rod 901. Bending rods 902 are inserted into both ends of the telescopic cylinder 906. Crosses 903 are slidably connected to the surfaces of both bending rods 902. One end of each cross 903 passes through the top and bottom of the frame 1, respectively. A rotating cylinder 904 is rotatably connected to one side of each bending rod 902. A third spring 905 is sleeved on the surfaces of the two crosses 903, with both ends of the third spring 905 fixedly connected to the cross 903 and the frame 1, respectively. When the fixed mechanism 4 rotates to feed the capacitor, the top and bottom leads of the capacitor come into contact with the rotating drum 904. Since the rotating drum 904 can only rotate around the bending rod 902 and cannot move left, right or up and down, the leads move through the rotating drum 904. The rotating drum 904 then presses and bends the leads at both ends. At the same time, when the rotating drum 904 bends the leads, since the rotating drum 904 and the bending rod 902 are rotatably connected, the rotating drum 904 rotates when pressing and bending the leads. This prevents excessive friction between the leads and the rotating drum 904, which could damage the plating on the lead surface. One end of the bending rod 902 extends between the two hollow plates 402.

[0026] In this process, after the leads at both ends of the capacitor are bent, the capacitor rotates and is fed. When the capacitor rotates to the hook-shaped part of the bending rod 902, the electric push rod 901 is activated to push the telescopic cylinder 906 to move. When the telescopic cylinder 906 moves horizontally, it drives the bending rod 902 to move horizontally. Then, when the bending rod 902 moves horizontally left and right, the bending rod 902 separates the capacitor from the two substrates 401 through the hook-shaped part, and the capacitor is unloaded.

[0027] Specifically, such as Figure 2As shown, the other end of the cross 903 contacts the outer side of the substrate 401, and one side of the bottom of the storage box 7 extends to contact the circumferential surface of one of the substrates 401. The bottom of the storage box 7 is level with the inner groove 4012, thereby avoiding jamming when the capacitor is loaded due to the height difference between the storage box 7 and the inner groove 4012.

[0028] Working steps: First, observe and measure the length of the capacitor. Then, based on the length of the capacitor, rotate the threaded rods 501 on both sides to move the trapezoidal blocks 502 on both sides. When the trapezoidal blocks 502 move, they drive the two outward expansion blocks 503 to move up and down to expand outward. The up and down movement of the two outward expansion blocks 503 can adjust the distance between the two hollow plates 402. When the distance between the two hollow plates 402 is adjusted, the distance between the two base plates 401 is also adjusted, thereby facilitating the adjustment of the distance between the two inner grooves 4012 according to the length of the capacitor. This allows the two inner grooves 4012 to clamp the capacitor and adapt it. Then, the second spring 803 itself... The elastic force pushes the push plate 802 to move, and then the push plate 802 pushes the capacitor inside the storage box 7 to move. Under the elastic force of the second spring 803, the capacitor can be pushed between the two inner grooves 4012. Then, through the first spring 4032, the two base plates 401 clamp the capacitor. When the base plates 401 clamp the capacitor, the first spring 4032 uses its own elastic force to prevent the two base plates 401 from clamping the capacitor too tightly and causing damage. At the same time, through the first spring 4032, when the two base plates 401 clamp the capacitor, the distance between the two base plates 401 can be adjusted by a short distance, which can facilitate fine adjustment according to capacitors of different lengths. Once the capacitor is clamped, motor 2 starts and drives the central shaft 3 to rotate. The rotating central shaft 3 then drives the two substrates 401 and the two hollow plates 402 to rotate. As the two substrates 401 and the two hollow plates 402 rotate, they feed the capacitor clamped in the middle. When the capacitor is fed, the top and bottom leads of the capacitor touch the rotating drum 904. As the leads move past the rotating drum 904, the rotating drum 904 presses and bends the leads at both ends. At the same time, when the rotating drum 904 bends the leads, since the rotating drum 904 and the bending rod 902 are rotatably connected, the rotating drum 904 rotates when pressing and bending the leads to avoid excessive friction between the leads and the rotating drum 904, which would damage the plating on the lead surface. Finally, after the leads at both ends of the capacitor are bent, the capacitor is rotated and fed. When the capacitor rotates to the hook-shaped part of the bending rod 902, the electric push rod 901 is activated to push the telescopic cylinder 906 to move. When the telescopic cylinder 906 moves horizontally, it drives the bending rod 902 to move horizontally. Then, when the bending rod 902 moves horizontally left and right, the bending rod 902 passes through the hook-shaped part to separate the capacitor from the two substrates 401, and the capacitor is unloaded.

[0029] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitution or modification made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technology of the present invention, to the lead bending device of an electronic device and its inventive concept, should be covered within the scope of protection of the present invention.

Claims

1. A pin bending apparatus for electronic devices, comprising a frame (1), characterized in that, A motor (2) is fixedly connected to the top of the frame (1), a central shaft (3) is rotatably connected inside the frame (1), a limiting mechanism (4) is sleeved on the surface of the central shaft (3), an adjusting mechanism (5) is threaded to both sides of the frame (1), a support frame (6) is fixedly connected to the bottom of the frame (1), a storage box (7) is fixedly connected to the top of the support frame (6), and a pushing mechanism (8) is provided on one side of the storage box (7). The bending mechanism (9) includes an electric push rod (901) fixedly installed on the side of the storage box (7). The other end of the electric push rod (901) is fixedly connected to a telescopic cylinder (906). Bending rods (902) are inserted into both ends of the telescopic cylinder (906). Crosses (903) are slidably connected to the surfaces of the two bending rods (902). One end of the two crosses (903) passes through the top and bottom of the frame (1) respectively. A rotating cylinder (904) is rotatably connected to one side of the surface of the bending rods (902). A third spring (905) is sleeved on the surface of the two crosses (903). The two ends of the third spring (905) are fixedly connected to the crosses (903) and the frame (1) respectively.

2. The apparatus according to claim 1, wherein The limiting mechanism (4) includes a base plate (401) slidably connected to both sides of the surface of the central shaft (3). A hollow plate (402) is provided on the opposite surface of the two base plates (401). The connecting surfaces of the base plates (401) and the hollow plates (402) are respectively arrayed with a first groove and a second groove. A pressing mechanism (403) is provided between the first groove and the second groove. The base plates (401) and the hollow plates (402) are connected by the pressing mechanism (403).

3. The apparatus according to claim 2, wherein The other end of the cross (903) contacts the outside of the substrate (401), and one side of the bottom of the storage box (7) extends to contact the circumferential surface of one of the substrates (401).

4. The apparatus according to claim 2, wherein The substrate (401) has pin slots (4011) arranged in an array on its circumference, and the hollow plate (402) has grooves (4012) arranged in an array on its circumference.

5. The apparatus according to claim 2, wherein The clamping mechanism (403) includes a through rod (4031) fixedly connected to the inner wall of the first groove and a first spring (4032) disposed between the first groove and the second groove. The first spring (4032) is sleeved on the surface of the through rod (4031), and the two ends of the first spring (4032) are fixedly connected to the inner walls of the first groove and the second groove, respectively. One end of the through rod (4031) extends through the second groove.

6. The apparatus according to claim 1, wherein The adjusting mechanism (5) includes a threaded rod (501) threaded through both sides of the frame (1), and a trapezoidal block (502) rotatably connected to the other end of the threaded rod (501). The top and bottom of the trapezoidal block (502) are slidably connected to an expansion block (503), and one side of the two expansion blocks (503) is slidably connected to the surface of the two base plates (401).

7. The apparatus according to claim 1, wherein The pushing mechanism (8) includes a push rod (801) passing through one side of the storage box (7). One end of the push rod (801) is fixedly connected to a push plate (802). A second spring (803) is sleeved on the surface of the push rod (801). The two ends of the second spring (803) are respectively connected to the push plate (802) and the inner wall of the storage box (7).

8. The pin bending device for an electronic device according to claim 1, characterized in that, One end of the bending rod (902) extends between the two hollow plates (402).

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