Post-welding indium layer shaping device for optical module and use method of post-welding indium layer shaping device

Abstract

The invention relates to a post-welding indium layer shaping device for an optical module and a using method of the post-welding indium layer shaping device. The shaping device comprises a heating bin, a shaping bin and a cooling bin; the heating bin comprises a heating wall and a runner wall; a runner is arranged on the outer side wall of the runner wall; a photoelectric sensor is arranged on the outer side wall of the heating wall; heating wires are respectively arranged on the inner side walls of the heating wall and the runner wall; the shaping bin comprises a shaping wall and a connecting wall; the heating bin and the shaping bin are separated into two independent bins by the connecting wall; a shaping plate is slidably arranged on the outer side of the shaping wall. An electric push rod is arranged in the shaping bin; a piston of the electric push rod is connected with the tail of the shaping plate; the cooling bin comprises a cooling wall, and cooling fins are arranged on the inner side of the cooling wall. The method is suitable for the post-welding shaping process of the optical module with indium as the welding flux, and weld beading removal and weld joint shaping are achieved; the problems that weld beading affects weld stress distribution and weakens welding strength are solved, and light beam quality and light emitting stability of the optical module are improved.

Description

Technical Field

[0001] This invention relates to a device for shaping the indium layer after soldering of an optical module and its usage method, belonging to the technical field of soldering processing. Background Technology

[0002] Indium, a rare metal, possesses excellent ductility, high plasticity, low melting point, low vapor pressure, low electrical resistance, and corrosion resistance. It also exhibits good thermal and electrical conductivity and a low melting temperature, making it an ideal encapsulation material for hermetic packaging. It is commonly used in welding high-precision products such as lasers and semiconductors. When indium is used as a solder in laser welding, its low melting point allows for low-temperature sintering; its low hardness helps buffer the stress generated during encapsulation.

[0003] The optical module is a core component of a solid-state laser, primarily composed of a crystal and a heat sink. The welding quality of the optical module directly affects the laser's various optical parameters and performance. Indium is typically used as the solder for the crystal and heat sink, and the welding is performed using pressure diffusion soldering. Due to factors such as temperature range selection, pressure parameter adjustment, and tooling clamping, over-soldering can occur in the indium solder layer between the crystal and heat sink after welding, resulting in weld beads of varying sizes on the solder surface. The presence of weld beads directly affects the stress distribution of the weld and weakens the weld strength, making the optical module prone to weld cracking in low-temperature operating environments. Therefore, post-soldering indium layer shaping is crucial for optical modules.

[0004] Currently, the shaping of the indium layer after soldering in optical modules typically involves scraping or re-soldering. A small amount of weld beads can be removed with a scraper, but this method easily damages the original smooth surface of the solder layer, leading to micro-cracks, reduced adhesion, and ultimately cracking under low-temperature operating conditions. For a large number of weld beads, re-soldering is usually used, which wastes time and indium solder and still leaves weld beads behind. Therefore, a device and method are needed to shape the indium layer after soldering in optical modules, quickly and thoroughly removing weld beads to obtain a smooth, crack-free solder surface that meets the operational requirements of the optical module. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a device for shaping the indium layer after soldering of optical modules.

[0006] The present invention also provides a method of using the above-described shaping device.

[0007] The technical solution of this invention is as follows:

[0008] A post-soldering indium layer shaping device for optical modules, wherein the shaping device is a container structure, and the container structure is divided into three parts along the length direction: a heating chamber, a shaping chamber, and a cooling chamber; one edge at the bottom of the container structure is chamfered to obtain a chamfered structure.

[0009] The heating chamber includes a heating wall and a flow channel wall; the outer side of the flow channel wall is provided with a flow channel; the outer side of the heating wall is provided with a photoelectric sensor; the inner side of the heating wall and the flow channel wall are respectively provided with heating wires; a flow baffle is provided inside the heating chamber; the flow baffle is located at the outlet of the flow channel and is perpendicular to the heating wall, and the flow baffle is provided through the heating wall and can slide along the normal direction of the entire heating wall.

[0010] The shaping chamber includes a shaping wall and a connecting wall; the connecting wall separates the heating chamber and the shaping chamber into two independent chambers; a shaping plate is slidably arranged on the outer side of the shaping wall; the sliding direction of the shaping plate is the length direction of the shaping device; an electric push rod is arranged inside the shaping chamber; the extension and retraction direction of the piston of the electric push rod is the length direction of the shaping device, and the piston of the electric push rod is connected to the tail of the shaping plate.

[0011] The cooling chamber includes a cooling wall, and cooling fins are provided on the inner side of the cooling wall;

[0012] The bottom surface of the shaping plate, the bottom surface of the cooling wall, and the bottom surface of the flow channel are all located on the chamfered surface of the chamfered structure;

[0013] Preferably, the heating wall is perpendicular to the flow channel wall; the other two walls adjacent to the flow channel wall in the heating chamber section are a heat insulation wall and a detection wall, respectively; a heat insulation plate is provided on the inner side wall of the heat insulation wall; a sensor control module is provided on the inner side wall of the detection wall; the photoelectric sensor and the sensor control module are communicatively connected; in the shaping chamber section, the wall that is on the same plane as the heat insulation wall is a fixed wall, and the electric push rod is fixedly installed on the fixed wall;

[0014] More preferably, the heating wires on the inner walls of the heating wall and the flow channel wall are independently controlled, with a heating range of 0–180°C; the heat insulation plate is used at a temperature of 0–800°C.

[0015] Preferably, the front side of the shaping plate is provided with two springs, and the rear side of the shaping plate is provided with two reset rods; the outer side of the shaping wall is provided with two mounting grooves, and the springs and reset rods are respectively installed in the front and rear mounting grooves of the shaping plate; the shaping wall inside the shaping chamber is provided with meshing bearing gears and transmission racks.

[0016] The shaping plate has slots at both ends that mate with the walls of the mounting groove. The shaping plate slides on the wall of the mounting groove through the slots. One end of the spring is connected to the shaping plate and the other end is connected to the connecting wall. The initial position of the shaping plate is at the front end of the shaping chamber, and the initial position of the reset rod is at the rear end of the shaping chamber. The slot at the reset rod position is connected to the inside of the shaping chamber, and the reset rod is connected to the bearing gear key inside the shaping chamber.

[0017] The bearing gear is equipped with a drive linkage, which connects the bearing gear to the piston of the electric push rod.

[0018] Preferably, the photoelectric sensor has a fan-shaped scanning surface, and flow guide grids are provided around the photoelectric sensor; multiple negative pressure suction holes are provided through the inlet of the flow channel and on the top wall of the flow channel; a sealing cap is provided at the position corresponding to the negative pressure suction hole and on the inner side of the flow channel wall, and the sealing cap and the flow channel wall at the position of the negative pressure suction hole form a cavity; the sealing cap is connected to a negative pressure suction pipe. The negative pressure suction holes promote the entry of molten indium into the flow channel.

[0019] Preferably, the tail of the baffle block is connected to the telescopic cylinder; the main body of the baffle block is located inside the heating chamber, and the initial position of the baffle block is that its lower surface coincides with the upper surface of the flow channel.

[0020] Preferably, the heating wire, sensor control module, electric push rod, telescopic cylinder and cooling plate are respectively connected to an external PLC module for communication, and the external PLC module controls the above structures to work in conjunction; the negative pressure suction pipe is connected to an external negative pressure fan.

[0021] Preferably, the top of the modular structure is provided with a mounting cover; the mounting cover is provided with a universal mounting base, and the universal mounting base is connected to a handle;

[0022] The rear cover has a double-layer structure. The bottom has holes for the heating wire, sensor control module, negative pressure suction pipe, electric push rod, telescopic cylinder, and cooling plate. The top has outlet holes and pipe outlets on both sides. The inside of the universal mounting base has a spherical structure and an annular baffle.

[0023] The grip is cylindrical; the bottom of the grip is provided with a ball joint connecting post that mates with the universal mounting base, and wire inlet holes and air pipe inlet holes are provided on both sides; a switch button is provided in the middle of the grip; and wire outlet holes and air pipe outlet holes are provided at the top of the grip.

[0024] A method of using the above-mentioned optical module post-soldering indium layer shaping device includes the following steps:

[0025] 1) Place the indium layer of the optical module vertically; attach the chamfered surface of the container structure to the surface of the indium layer, and make the shaping plate parallel and attached to the indium layer; the photoelectric sensor starts working, and moves the shaping device along the indium layer;

[0026] 2) After the photoelectric sensor detects the weld bead, the heating wire starts to work; after the outer side of the heating wall comes into contact with the weld bead, the weld bead is melted into a molten state under the action of the heating wire, and the molten indium enters the flow channel;

[0027] 3) Under the action of the heating wire inside the flow channel wall, indium remains in a molten state. The molten indium enters the outer wall of the forming chamber by gravity. Under the action of gravity, the molten indium pushes the forming plate downward. After the photoelectric sensor no longer detects the weld bead, the telescopic cylinder drives the baffle block downward, sealing the flow channel outlet and preventing the molten indium from flowing back into the flow channel from the outside of the forming chamber. The forming plate, baffle block, forming wall and indium layer together form a temporary storage chamber for molten indium.

[0028] 4) The electric push rod retracts, which drives the shaping plate forward through the reset rod. The space of the temporary storage chamber is compressed, and the molten indium in the temporary storage chamber overflows under pressure onto the lower surface of the shaping plate. The surface of the shaping plate smooths out the overflowing indium during the movement. When the shaping plate returns to the initial position, the heating wire stops working, and the telescopic cylinder and electric push rod return to the initial position.

[0029] 5) The cooling plate starts working, the cooling chamber moves to the area where the indium has been smoothed, accelerates the solidification of indium, and the shaping of a single weld bead is completed;

[0030] 6) Repeat steps 1) to 5) to complete the shaping of the entire post-soldering indium layer.

[0031] The beneficial effects of this invention are as follows:

[0032] 1. The optical module post-soldering indium layer shaping device of the present invention is applicable to the post-soldering shaping process of optical modules using indium as solder, realizing the removal of weld beads and weld shaping; it solves the problem that weld beads affect the stress distribution of the weld and weaken the welding strength, and improves the beam quality and output stability of the optical module.

[0033] 2. This invention can remove weld beads at a single point. Local heating and cooling do not affect the performance of the original weld. The device can be operated by hand, which is flexible and convenient, with low operation difficulty and high safety. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the indium layer shaping device for optical modules after soldering according to the present invention;

[0035] Figure 2 This is an overall schematic diagram of the indium layer shaping device for optical modules after soldering according to the present invention;

[0036] Figure 3 This is an enlarged view of region A of the present invention;

[0037] Figure 4 This is an enlarged view of region B of the present invention;

[0038] Figure 5 This is a schematic diagram of the internal structure of the indium layer shaping device described in this invention;

[0039] Figure 6 This is a schematic diagram of the heating chamber described in this invention;

[0040] Figure 7 This is a schematic diagram of the heating wall described in this invention;

[0041] Figure 8 This is a schematic diagram of the flow-blocking block described in this invention;

[0042] Figure 9 This is a schematic diagram of the interior of the shaping chamber described in this invention;

[0043] Figure 10 This is a schematic diagram of the connecting wall described in this invention;

[0044] Figure 11 This is a schematic diagram of the shaping part of the present invention;

[0045] Figure 12 This is a schematic diagram of the cooling chamber described in this invention;

[0046] Figure 13 This is a schematic diagram of the installation of the rear cover according to the present invention;

[0047] Figure 14 This is a schematic diagram of the grip described in this invention;

[0048] In the diagram: 1. Heating chamber; 1-1. Flow channel; 1-2. Photoelectric sensor; 1-3. Heating wall; 1-4. Flow channel wall; 1-5. Insulation wall; 1-6. Detection wall; 1-7. Heating wire; 1-8. Insulation plate; 1-9. Sensor control module; 1-10. Fixing bracket; 1-11. Baffle block; 1-12. Flow guide grid; 1-13. Negative pressure suction port; 1-14. Sealing cover; 1-15. Negative pressure suction pipe; 1-16. Fixing flange; 2. Shaping chamber; 2-1. Mounting groove; 2-2. Spring; 2-3. Reset rod; 2-4. Shaping plate; 2-5. Shaping 1. Wall; 2-6. Fixed wall; 2-7. Connecting wall; 2-8. Bearing gear; 2-9. Transmission rack; 2-10. Electric push rod; 2-11. Mounting bracket; 2-12. Telescopic cylinder; 2-13. Drive linkage; 3. Cooling chamber; 3-1. Cooling wall; 3-2. Cooling fins; 4. Rear cover; 4-1. Universal mounting base; 4-2. Cable outlet; 4-3. Pipe outlet; 4-4. Annular baffle; 5. Handle; 5-1. Ball joint connecting post; 5-2. Wire inlet; 5-3. Air pipe inlet; 5-4. Switch button; 5-5. Wire outlet; 5-6. Air pipe outlet. Detailed Implementation

[0049] The following describes some embodiments of the present invention in detail with reference to the accompanying drawings.

[0050] Example 1

[0051] like Figures 2-12 As shown.

[0052] A post-soldering indium layer shaping device for optical modules, wherein the shaping device is a container structure, and the container structure is divided into three parts along the length direction: a heating chamber 1, a shaping chamber 2, and a cooling chamber 3; one edge at the bottom of the container structure is chamfered to obtain a chamfered structure.

[0053] The heating chamber 1 includes a heating wall 1-3 and a flow channel wall 1-4; a flow channel 1-1 is provided on the outer side wall of the flow channel wall 1-4; a photoelectric sensor 1-2 is provided on the outer side wall of the heating wall 1-3; heating wires 1-7 are respectively provided on the inner side walls of the heating wall 1-3 and the flow channel wall 1-4; a baffle block 1-11 is provided inside the heating chamber 1; the baffle block 1-11 is located at the outlet position of the flow channel 1-1 and is perpendicular to the heating wall 1-3, and the baffle block 1-11 is provided through the heating wall 1-3 and can slide along the normal direction of the entire heating wall 1-3;

[0054] The shaping chamber 2 includes a shaping wall 2-5 and a connecting wall 2-7; the connecting wall 2-7 separates the heating chamber 1 and the shaping chamber 2 into two independent chambers; a shaping plate 2-4 is slidably arranged on the outer side of the shaping wall 2-5; the sliding direction of the shaping plate 2-4 is the length direction of the shaping device; an electric push rod 2-10 is arranged inside the shaping chamber 2; the extension and retraction direction of the piston of the electric push rod 2-10 is the length direction of the shaping device, and the piston of the electric push rod 2-10 is connected to the tail of the shaping plate 2-4;

[0055] The cooling chamber 3 includes a cooling wall 3-1, and a cooling fin 3-2 is provided on the inner side of the cooling wall 3-1;

[0056] The bottom surface of the shaping plate 2-4, the bottom surface of the cooling wall 3-1, and the bottom surface of the flow channel 1-1 are all located on the chamfered surface of the chamfered structure;

[0057] The cooling plate 3-2 is a TEC cooling plate or a cooling pipe; in this embodiment, a TEC cooling plate is used.

[0058] Example 2

[0059] As described in Example 1, the indium layer shaping device for optical modules after soldering is further characterized in that the heating wall 1-3 is perpendicular to the flow channel wall 1-4; the other two walls adjacent to the flow channel wall 1-4 in the heating chamber 1 are the heat insulation wall 1-5 and the detection wall 1-6, respectively; a heat insulation plate 1-8 is provided on the inner side wall of the heat insulation wall 1-5; a sensor control module 1-9 is provided on the inner side wall of the detection wall 1-6; the photoelectric sensor 1-2 and the sensor control module 1-9 are communicatively connected; in the shaping chamber 2, the fixed wall 2-6 is on the same plane as the heat insulation wall 1-5, and the electric push rod 2-10 is fixedly mounted on the fixed wall 2-6; the heat insulation plate 1-8 is a mica plate, which is insulating and has a stable coefficient of thermal expansion. The electric push rod 2-10 is mounted on the fixed wall 2-6 via a mounting bracket 2-11.

[0060] Example 3

[0061] As described in Example 2, the indium layer shaping device for optical modules after soldering further includes independently controlled heating wires 1-7 on the inner walls of heating wall 1-3 and flow channel wall 1-4, with a heating range of 0–180°C; the heat insulation plate 1-8 has an operating temperature of 0–800°C. Heating wires 1-7 are fixed to heating wall 1-3 and flow channel wall 1-4 via fixing flanges.

[0062] Example 4

[0063] As described in Example 1, the indium layer shaping device for optical modules after soldering is further provided with two springs 2-2 on the front side of the shaping plate 2-4 and two reset rods 2-3 on the rear side of the shaping plate 2-4; two mounting grooves 2-1 are provided on the outer side of the shaping wall 2-5, and the springs 2-2 and reset rods 2-3 are respectively located in the mounting grooves 2-1 at the front and rear of the shaping plate 2-4; the shaping wall 2-5 inside the shaping chamber 2 is provided with meshing bearing gears 2-8 and transmission racks 2-9;

[0064] The shaping plate 2-4 has slots at both ends that mate with the wall of the mounting groove 2-1. The shaping plate 2-4 is slidably mounted on the wall of the mounting groove 2-1 through the slots. One end of the spring 2-2 is connected to the shaping plate 2-4 and the other end is connected to the connecting wall 2-7. The initial position of the shaping plate 2-4 is at the front end of the shaping chamber 2, and the initial position of the reset rod 2-3 is at the rear end of the shaping chamber 2. The slot at the position of the reset rod 2-3 is connected to the interior of the shaping chamber 2, and the reset rod 2-3 is connected to the bearing gear 2-8 inside the shaping chamber 2 through the connecting flange.

[0065] A drive link 2-13 is provided on the bearing gear 2-8, and the bearing gear 2-8 is connected to the piston of the electric push rod 2-10 through the drive link 2-13.

[0066] Example 5

[0067] As described in Example 1, the indium layer shaping device for post-soldering of optical modules further includes a photoelectric sensor 1-2 with a fan-shaped scanning surface and flow guide grids 1-12 around the photoelectric sensor 1-2; multiple negative pressure suction holes 1-13 are provided through the inlet position of the flow channel 1-1 and the flow channel wall 1-4 at the top of the flow channel 1-1; a sealing cover 1-14 is provided at the position corresponding to the negative pressure suction hole 1-13 and on the inner side of the flow channel wall 1-4, and the sealing cover 1-14 and the flow channel wall at the position of the negative pressure suction hole 1-13 form a cavity; the sealing cover 1-14 is connected to a negative pressure suction pipe 1-15.

[0068] Example 6

[0069] As described in Example 1, the indium layer shaping device for optical modules after soldering is further provided, with the tail of the baffle block 1-11 connected to the telescopic cylinder 2-12; the main body of the baffle block 1-11 is located in the heating chamber 1, and the initial position of the baffle block 1-11 is that its lower surface coincides with the upper surface of the flow channel 1-1.

[0070] Example 7

[0071] As described in Example 1, the indium layer shaping device for optical modules after soldering is further provided that the heating wire 1-7, sensor control module 1-9, electric push rod 2-10, telescopic cylinder 2-12 and cooling plate 3-2 are respectively connected to an external PLC module for communication, and the external PLC module controls the above structures to work in conjunction; the negative pressure suction pipe 1-15 is connected to an external negative pressure fan.

[0072] Example 8

[0073] like Figure 13 , Figure 14 As shown.

[0074] As described in Example 1, the optical module post-soldering indium layer shaping device further includes a mounting cover 4 on the top of the cabin structure; a universal mounting seat 4-1 is provided on the mounting cover 4, and a handle 5 is connected to the universal mounting seat 4-1.

[0075] The rear cover 4 has a double-layer structure. The bottom has holes for heating wire, sensor control module, negative pressure suction pipe, electric push rod, telescopic cylinder and cooling plate. The top has cable outlet 4-2 and pipe outlet 4-3 on both sides. The inner side of the universal mounting base 4-1 has a spherical structure and an annular baffle 4-4.

[0076] The grip 5 is a cylindrical structure; the bottom of the grip 5 is provided with a ball joint connecting post 5-1 that mates with the universal mounting base 4-1, and wire inlet holes 5-2 and air pipe inlet holes 5-3 are provided on both sides; a switch button 5-4 is provided in the middle of the grip 5; and a wire outlet hole 5-5 and an air pipe outlet hole 5-6 are provided at the top of the grip 5.

[0077] Example 9

[0078] The method of using the optical module post-soldering indium layer shaping device as described in any one of Examples 1-8 includes the following steps:

[0079] 1) such as Figure 1 As shown, the indium layer of the optical module is placed vertically; the chamfered surface of the cabin structure is attached to the surface of the indium layer, and the shaping plate 2-4 is parallel and attached to the indium layer; the sensor control module 1-9 controls the photoelectric sensor 1-2 to start working and moves the shaping device along the indium layer;

[0080] 2) After the photoelectric sensor 1-2 detects the weld bead, the heating wire 1-7 and the negative pressure fan start to work; after the outer side of the heating wall 1-3 comes into contact with the weld bead, the weld bead is melted into a molten state under the action of the heating wire 1-7, and the molten indium enters the flow channel;

[0081] 3) Under the action of heating wire 1-7 inside the flow channel wall 1-4, indium remains in a molten state. The molten indium enters the outer wall of the forming chamber 2 through the flow channel 1-1 by gravity. Under the action of gravity, the molten indium pushes the forming plate 2-4 downward. After the photoelectric sensor 1-2 no longer detects the weld bead, the telescopic cylinder 2-12 drives the flow baffle 1-11 downward, sealing the outlet of the flow channel 1-1 and preventing the molten indium from flowing back into the flow channel from the outside of the forming chamber 2. The forming plate 2-4, the flow baffle 1-11, the forming wall 2-5 and the indium layer together form a temporary storage chamber for molten indium.

[0082] 4) The electric push rod 2-10 retracts, which drives the shaping plate 2-4 forward through the reset rod 2-3. The space of the temporary storage chamber is compressed, and the molten indium in the temporary storage chamber overflows under pressure onto the lower surface of the shaping plate 2-4. The surface of the shaping plate 2-4 smooths out the overflowing indium during the movement. When the shaping plate 2-4 returns to the initial position, the heating wire 1-7 and the negative pressure fan stop working, and the telescopic cylinder 2-12 and the electric push rod 2-10 return to the initial position.

[0083] 5) Cooling plate 3-2 starts working, cooling chamber 3 moves to the area where indium has been smoothed, accelerates indium solidification, and the shaping of a single weld bead is completed;

[0084] 6) Repeat steps 1) to 5) to complete the shaping of the entire post-soldering indium layer.

Claims

1. A device for shaping the indium layer after soldering of an optical module, characterized in that, The shaping device is a container structure, which is divided into three parts along its length: a heating chamber, a shaping chamber, and a cooling chamber. One edge at the bottom of the container structure is chamfered. The heating chamber includes a heating wall and a flow channel wall. A flow channel is provided on the outer side of the flow channel wall. A photoelectric sensor is provided on the outer side of the heating wall. Heating wires are provided on the inner side walls of both the heating wall and the flow channel wall. A flow-blocking block is provided inside the heating chamber. The flow-blocking block is located at the outlet of the flow channel and is perpendicular to the heating wall. The flow-blocking block is installed through the heating wall and can move along the entire heating wall. The shaping chamber slides along the normal direction; the shaping chamber includes a shaping wall and a connecting wall; the connecting wall separates the heating chamber and the shaping chamber into two independent chambers; a shaping plate is slidably arranged on the outer side of the shaping wall; the sliding direction of the shaping plate is the length direction of the shaping device; an electric push rod is arranged inside the shaping chamber; the extension and retraction direction of the piston of the electric push rod is the length direction of the shaping device, and the piston of the electric push rod is connected to the tail of the shaping plate; the cooling chamber includes a cooling wall, and cooling fins are arranged on the inner side of the cooling wall; the bottom surface of the shaping plate, the bottom surface of the cooling wall, and the bottom surface of the flow channel are all located on the chamfered surface of the chamfered structure.

2. The indium layer shaping device for optical modules after soldering according to claim 1, characterized in that, The heating wall is perpendicular to the flow channel wall; the other two walls adjacent to the flow channel wall in the heating chamber section are the heat insulation wall and the detection wall, respectively; the inner side wall of the heat insulation wall is provided with a heat insulation plate; the inner side wall of the detection wall is provided with a sensor control module; the photoelectric sensor and the sensor control module are connected in communication; in the shaping chamber section, the wall that is on the same plane as the heat insulation wall is the fixed wall, and the electric push rod is fixedly installed on the fixed wall.

3. The indium layer shaping device for optical modules after soldering according to claim 2, characterized in that, The heating wires on the inner walls of the heating wall and the flow channel wall are independently controlled, with a heating range of 0 to 180°C; the heat insulation plate has a working temperature of 0 to 800°C.

4. The indium layer shaping device for optical modules after soldering according to claim 1, characterized in that, Two springs are provided on the front side of the shaping plate, and two reset rods are provided on the rear side of the shaping plate. Two mounting grooves are provided on the outer side of the shaping wall, and the springs and reset rods are respectively installed in the front and rear mounting grooves of the shaping plate. The shaping wall inside the shaping chamber is provided with meshing bearing gears and transmission racks. Both ends of the shaping plate are provided with slots that mate with the groove walls of the mounting grooves, and the shaping plate is slidably mounted on the groove walls of the mounting grooves through the slots. One end of the spring is connected to the shaping plate and the other end is connected to the connecting wall. The initial position of the shaping plate is located at the front end of the shaping chamber, and the initial position of the reset rod is located at the rear end of the shaping chamber. The slot at the position of the reset rod is connected to the interior of the shaping chamber, and the reset rod is connected to the bearing gear key inside the shaping chamber. A drive linkage is provided on the bearing gear, and the bearing gear is connected to the piston of the electric push rod through the drive linkage.

5. The indium layer shaping device for optical modules after soldering according to claim 1, characterized in that, The photoelectric sensor has a fan-shaped scanning surface, and flow guide grids are set around the photoelectric sensor. Multiple negative pressure suction holes are set through the inlet of the flow channel and the top of the flow channel wall. A sealing cover is set at the position corresponding to the negative pressure suction hole and on the inner side of the flow channel wall. The sealing cover and the flow channel wall at the position of the negative pressure suction hole form a cavity. The sealing cover is connected to a negative pressure suction pipe.

6. The indium layer shaping device for optical modules after soldering according to claim 1, characterized in that, The tail of the baffle block is connected to the telescopic cylinder; the main body of the baffle block is located inside the heating chamber, and the initial position of the baffle block is that its lower surface coincides with the upper surface of the flow channel.

7. The indium layer shaping device for optical modules after soldering according to claim 1, characterized in that, The heating wire, sensor control module, electric push rod, telescopic cylinder and cooling plate are respectively connected to an external PLC module for communication, and the external PLC module controls the above structures to work in conjunction; the negative pressure suction pipe is connected to an external negative pressure fan.

8. The indium layer shaping device for optical modules after soldering according to claim 1, characterized in that, The top of the modular structure is equipped with a mounting cover; the mounting cover has a universal mounting base connected to a handle; the mounting cover has a double-layer structure, with wiring holes for heating wires, sensor control modules, negative pressure suction pipes, electric push rods, telescopic cylinders, and cooling fins at the bottom; wiring outlets and pipe outlets are provided on both sides of the top; the inner side of the universal mounting base has a spherical structure and an annular baffle; the handle has a cylindrical structure; the bottom of the handle has a ball-head connecting post that mates with the universal mounting base, and wire inlet holes and air pipe inlet holes are provided on both sides; a switch button is provided in the middle of the handle; and wire outlet holes and air pipe outlet holes are provided at the top of the handle.

9. The method of using the indium layer shaping device for optical modules after soldering as described in any one of claims 1-8, characterized in that, The steps include the following: 1) Place the indium layer of the optical module vertically; attach the chamfered surface of the container structure to the surface of the indium layer, and make the shaping plate parallel and attached to the indium layer; the photoelectric sensor starts working, and moves the shaping device along the indium layer; 2) After the photoelectric sensor detects the weld bead, the heating wire starts working; After the weld bead comes into contact with the outer side of the heated wall, it is melted into a molten state under the action of the heating wire, and the molten indium enters the flow channel; 3) Under the action of the heating wire inside the flow channel wall, indium remains in a molten state. The molten indium enters the outer wall of the forming chamber by gravity through the flow channel. Under the action of gravity, the molten indium pushes the forming plate down. After the photoelectric sensor no longer detects the weld bead, the telescopic cylinder drives the baffle block down to close the flow channel outlet and prevent the molten indium from flowing back into the flow channel from the outside of the forming chamber. The shaping plate, the flow-blocking block, the shaping wall, and the indium layer together form a temporary storage chamber for storing molten indium. 4) The electric push rod retracts, which drives the shaping plate forward through the reset rod. The space of the temporary storage chamber is compressed, and the molten indium in the temporary storage chamber overflows under pressure onto the lower surface of the shaping plate. The surface of the shaping plate smooths out any overflowing indium as it moves. When the shaping plate returns to its initial position, the heating wire stops working, and the telescopic cylinder and electric push rod return to their initial positions. 5) The cooling plate starts working, the cooling chamber moves to the area where the indium has been smoothed, accelerates the solidification of indium, and the shaping of a single weld bead is completed; 6) Repeat steps 1) to 5) to complete the shaping of the entire post-soldering indium layer.

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