Highly conductive graphene / copper composite wire and method for manufacturing the same

Multilayer graphene-copper composite structures were prepared by chemical vapor deposition, low-power oxygen plasma activation, and non-aqueous electroplating, solving the problem of optimizing the performance of copper wires in the prior art and realizing copper/graphene composite wires with high conductivity, high strength and excellent thermal management performance.

CN121885312BActive Publication Date: 2026-05-29SOUTH CHINA UNIV OF TECH
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Patent Information

Application Number
CN202610343230.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2026-03-20
Publication Date
2026-05-29
Estimated Expiration
2046-03-20

AI Technical Summary

Technical Problem

Existing technologies struggle to achieve high conductivity in copper wires without increasing material costs and reducing production efficiency, especially in terms of performance stability and synergistic optimization of mechanical and electrical properties under high temperature and high frequency conditions. Furthermore, the preparation process of graphene/copper composite materials is difficult to guarantee structural integrity and large-scale production.

Method used

In-situ growth of graphene layers was achieved using chemical vapor deposition, combined with low-power oxygen plasma activation and non-aqueous electroplating to form multilayered alternating graphene-copper composite structural units. Interfacial bonding was enhanced through annealing. A choline chloride-ethylene glycol-based deep eutectic solvent system was used to replace traditional aqueous electroplating, and process parameters were optimized to control the deposition and nucleation of the copper layer.

Benefits of technology

This achievement enables high conductivity and high-strength interface bonding of copper/graphene composite wires, reduces contact resistance, optimizes high-frequency current transmission and thermal management performance, and ensures product performance uniformity and large-scale reliability.

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Abstract

The application discloses a kind of high-conductivity graphene / copper composite wires and preparation method thereof.The preparation method uses the circulating process of "chemical vapor deposition-low-power oxygen plasma activation-non-aqueous solution electroplating", and multiple layers of "graphene-copper" alternating composite structure units can be autonomously controlled on the surface of copper core.Through the synergistic design of interface chemical bonding, non-aqueous solution system pulse electroplating and parallel graphene channel, the problems of high interface resistance, insufficient high-frequency performance and heat dissipation capacity of traditional materials are solved.The prepared graphene / copper composite wire has high conductivity, high strength interface and excellent current-carrying heat dissipation capacity, and is suitable for medium and high voltage power transmission.
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