Wiring board and head-mounted display

Abstract

The invention provides a wiring board and a head-mounted display. The wiring substrate is provided with a transparent substrate and a mesh wiring layer disposed on the substrate. The wiring substrate has an electromagnetic wave transmitting / receiving function. The mesh wiring layer is configured as an electromagnetic wave transmitting / receiving unit and has wiring. The planar shape of the wiring is formed by connecting a plurality of curved lines. The curve is an arc or an elliptic arc.

Description

[0001] This application is a divisional application of Chinese invention patent application filed on February 22, 2024, entitled "Wiring Substrate and Head-Mounted Display", with application number 202480017113.4 (PCT / JP2024 / 006661). Technical Field

[0002] Embodiments of this disclosure relate to wiring boards and head-mounted displays. Background Technology

[0003] Currently, portable terminal devices such as smartphones, tablets, and smart glasses (AR, MR, etc.) are undergoing significant advancements in terms of high functionality, miniaturization, thinness, and lightweight design. These portable terminal devices utilize multiple communication frequency bands. Therefore, multiple antennas corresponding to these communication bands are required. For example, portable terminal devices typically incorporate antennas for telephone communication, WiFi (Wireless Fidelity), 3G (Generation), 4G (Generation), 5G (Generation), LTE (Long Term Evolution), Bluetooth, and NFC (Near Field Communication). However, with the miniaturization of portable terminal devices, the space available for antenna installation is limited, narrowing the design freedom. Furthermore, due to the confined space, the required radio wave sensitivity may not be adequately met.

[0004] Therefore, a thin-film antenna capable of being mounted on the display area of ​​portable terminal devices or the transmission area of ​​smart glasses has been developed. This thin-film antenna is a transparent antenna on a transparent substrate with an antenna pattern formed thereon. The antenna pattern is formed from a grid-like conductive mesh layer. The conductive mesh layer includes conductor portions forming opaque conductive layers and multiple openings forming non-transparent portions.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2011-66610

[0008] Patent Document 2: Japanese Patent No. 5636735

[0009] Patent Document 3: Japanese Patent No. 5695947

[0010] However, in conventional thin-film antennas, there are areas on the transparent substrate where a conductive grid layer (antenna pattern) is formed. Furthermore, when the conductive grid layer is regularly wired and arranged in a grid pattern, light streaks (rays) depending on the direction of the wires may be observed when observing a point light source. Thus, the generation of light rays may reduce image visibility in portable terminal devices and the like.

[0011] To eliminate glare, one could consider eliminating the periodicity of the wiring. However, eliminating the periodicity of the wiring results in various wiring directions, potentially causing flickering due to light reflection.

[0012] One of the objectives of this embodiment is to provide a wiring substrate and a head-mounted display that can suppress the reduction in visibility caused by light and the flicker caused by reflected light. Summary of the Invention

[0013] The first aspect of this disclosure is a wiring substrate comprising: a transparent substrate; and a mesh wiring layer disposed on the substrate, the wiring substrate having electromagnetic wave transceiver function, the mesh wiring layer being configured as an electromagnetic wave transceiver unit and having wiring, the planar shape of the wiring being a shape formed by connecting multiple curves, the curves being circular arcs or elliptical arcs.

[0014] A second aspect of this disclosure may be that, in the wiring substrate of the first aspect described above, the aperture ratio of the mesh wiring layer is 94% or more.

[0015] The third aspect of this disclosure may be that, in the wiring substrate of the first or second aspect described above, an opening is formed by being surrounded by the wiring. In the wiring surrounding the opening, the shape formed by connecting the ends of the chords of the plurality of curves to each other can be a polygon. The wiring may have a shape formed by connecting a plurality of arcs cut at a central angle of 160° or more and 200° or less. One side of the polygon may be composed of 2N chords, where N is a natural number of 1 or more. On the side, the Mth dividing point, counting from one end of the side, is taken as the Mth dividing point, where M is a natural number of 1 or more and 2N-1 or less. On the side, the Mth connection point, counting from the one end of the side, is taken as the Mth connection point. In this case, the distance from the Mth dividing point to the Mth connection point may be 0.1 / N times or less of the length of the side.

[0016] The fourth aspect of this disclosure may be that, in the aforementioned third-party wiring substrate, a plurality of the openings may be formed, and the corners of the polygon may be irregularly arranged.

[0017] The fifth aspect of this disclosure may be that, in the wiring substrate of the first aspect described above, an opening is formed by being surrounded by the wiring. In the wiring surrounding the opening, the shape formed by connecting the ends of the chords of a plurality of curves to each other can be a square. The wiring may have a shape formed by connecting a plurality of arcs cut at a central angle of 160° or more and 200° or less. One side of the square may be composed of 2N chords, where N is a natural number of 1 or more. On the side, the Mth dividing point, counting from one end of the side, is taken as the Mth dividing point, where M is a natural number of 1 or more and 2N-1 or less. On the side, the Mth connection point, counting from the one end of the side, is taken as the Mth connection point. In this case, the distance from the Mth dividing point to the Mth connection point may be 0.1 / N times or less of the length of the side.

[0018] The sixth aspect of this disclosure may be that, in the wiring substrate of the first aspect described above, an opening is formed by being surrounded by the wiring. In the wiring surrounding the opening, the shape formed by connecting the ends of the chords of a plurality of curves to each other can be a square. The wiring may have a shape formed by connecting a plurality of arcs cut at a central angle of 80° or more and 100° or less. One side of the square may be composed of 2N chords, where N is a natural number of 1 or more. On the side, the Mth dividing point, counting from one end of the side, is taken as the Mth dividing point, where M is a natural number of 1 or more and 2N-1 or less. On the side, the Mth connection point, counting from the one end of the side, is taken as the Mth connection point. In this case, the distance from the Mth dividing point to the Mth connection point may be 0.1 / N times or less of the length of the side.

[0019] The seventh aspect of this disclosure may be that, in the wiring substrate of each of the first to fifth aspects described above, the curve may be an arc cut at a central angle of 180°, and in the wiring substrate of the first or sixth aspect described above, the curve may be an arc cut at a central angle of 90°.

[0020] The eighth aspect of this disclosure may be that, in the wiring substrate of the first aspect described above, an opening is formed by being surrounded by the wiring. In the wiring surrounding the opening, the shape formed by connecting the ends of the chords of a plurality of curves to each other may be a rhombus. The wiring may have a shape formed by connecting a plurality of arcs cut at a central angle of 160° or more and 200° or less. One side of the rhombus may be composed of 2N chords, where N is a natural number of 1 or more. On one side, the Mth dividing point, counting from one end of the side, is taken as the Mth dividing point, where M is a natural number of 1 or more and 2N-1 or less. On one side, the Mth connection point, counting from one end of the side, is taken as the Mth connection point. In this case, the distance from the Mth dividing point to the Mth connection point may be 0.1 / N times or less of the length of the side.

[0021] The ninth aspect of this disclosure may be that, in the wiring substrate of the first aspect described above, an opening is formed by being surrounded by the wiring. In the wiring surrounding the opening, the shape formed by connecting the ends of the chords of a plurality of curves to each other can be a regular hexagon. The wiring may have a shape formed by connecting a plurality of arcs cut at a central angle of 160° or more and 200° or less. One side of the regular hexagon may be composed of 2N chords, where N is a natural number of 1 or more. On the side, the Mth dividing point, counting from one end of the side, is taken as the Mth dividing point, where M is a natural number of 1 or more and 2N-1 or less. On the side, the Mth connection point, counting from the one end of the side, is taken as the Mth connection point. In this case, the distance from the Mth dividing point to the Mth connection point may be 0.1 / N times or less of the length of the side.

[0022] The tenth aspect of this disclosure may be that, in the wiring substrate of the first aspect described above, an opening is formed by being surrounded by the wiring. In the wiring surrounding the opening, the shape formed by connecting the ends of the chords of a plurality of curves to each other can be a polygon. The wiring may have a shape formed by connecting a plurality of arcs cut at a central angle of 80° or more and 100° or less. One side of the polygon may be composed of 2N chords, where N is a natural number of 1 or more. On one side, the Mth dividing point, counting from one end of the side, is taken as the Mth dividing point, where M is a natural number of 1 or more and 2N-1 or less. On one side, the Mth connection point, counting from the one end of the side, is taken as the Mth connection point. In this case, the distance from the Mth dividing point to the Mth connection point may be 0.1 / N times or less of the length of the side.

[0023] The eleventh aspect of this disclosure may be that, in the wiring substrate of the tenth aspect described above, the polygon is a rhombus or a hexagon.

[0024] The twelfth aspect of this disclosure may be that, in the wiring substrates of the first to eleventh aspects described above, N is 1.

[0025] The thirteenth aspect of this disclosure may be that, in each of the first to twelfth aspects described above, the wiring substrate has radio wave transceiver functionality at a frequency of 1 GHz or higher.

[0026] The fourteenth aspect of this disclosure may be that, in the wiring substrates of the first to thirteenth aspects described above, the mesh wiring layer may also have an electromagnetic wave shielding function.

[0027] The fifteenth aspect of this disclosure may be that, in each of the first to fourteenth aspects described above, when the wiring substrate is stretched after being bent 180° around a cylinder with a diameter of 1 mm 10 times, the increase in the resistance value of the mesh wiring layer is less than 10%.

[0028] The sixteenth aspect of this disclosure may be that, in each of the first to fifteenth aspects described above, a dummy wiring layer electrically independent of the grid wiring layer is provided around the grid wiring layer.

[0029] The seventeenth aspect of this disclosure may be that, in each of the wiring substrates of the first to the sixteenth aspects described above, a plurality of the aforementioned dummy wiring layers may also be provided, and the aperture ratio of the mesh wiring layer and the aperture ratio of the dummy wiring layer may also increase in stages from the mesh wiring layer toward the dummy wiring layer away from the mesh wiring layer.

[0030] The eighteenth aspect of this disclosure is a head-mounted display comprising: a frame; and a transparent display device mounted on the frame, the display device having: a first substrate; a wiring board of any one of the first to seventeenth aspects described above, disposed on the first substrate; and a display portion disposed between the first substrate and the wiring board.

[0031] According to embodiments of this disclosure, it is possible to suppress the reduction in visibility caused by light and to suppress flicker caused by reflected light. Attached Figure Description

[0032] Figure 1 This is a perspective view showing one embodiment of a head-mounted display.

[0033] Figure 2 This is a front view illustrating one embodiment of a head-mounted display. Figure 1 (View in direction II).

[0034] Figure 3 This is a cross-sectional view of a display device showing one embodiment of a head-mounted display. Figure 2 (Sectional view along line III-III).

[0035] Figure 4 This is a top view showing a wiring substrate according to one embodiment.

[0036] Figure 5 This is an enlarged top view showing the grid wiring layer of a wiring substrate according to one embodiment.

[0037] Figure 6 This is a cross-sectional view of a wiring substrate illustrating one embodiment. Figure 5 (VI-VI line sectional view).

[0038] Figure 7 This is a cross-sectional view of a wiring substrate illustrating one embodiment. Figure 5 (Sectional view along line VII-VII).

[0039] Figure 8A This is a cross-sectional view illustrating a method for manufacturing a wiring substrate according to one embodiment.

[0040] Figure 8BThis is a cross-sectional view illustrating a method for manufacturing a wiring substrate according to one embodiment.

[0041] Figure 8C This is a cross-sectional view illustrating a method for manufacturing a wiring substrate according to one embodiment.

[0042] Figure 8D This is a cross-sectional view illustrating a method for manufacturing a wiring substrate according to one embodiment.

[0043] Figure 8E This is a cross-sectional view illustrating a method for manufacturing a wiring substrate according to one embodiment.

[0044] Figure 8F This is a cross-sectional view illustrating a method for manufacturing a wiring substrate according to one embodiment.

[0045] Figure 9 This is an enlarged top view showing the wiring substrate of the first modified example.

[0046] Figure 10A This is an enlarged top view showing the wiring substrate of the second modified example.

[0047] Figure 10B This is an enlarged top view showing another example of the wiring substrate of the second modified example.

[0048] Figure 11 This is an enlarged top view showing the wiring substrate of the third modified example.

[0049] Figure 12A This is an enlarged top view showing the wiring substrate of the fourth modified example.

[0050] Figure 12B This is an enlarged top view showing another example of the wiring substrate of the fourth modified example.

[0051] Figure 13 This is an enlarged top view showing the wiring substrate of the fifth modified example.

[0052] Figure 14 This is an enlarged top view showing another example of the wiring substrate of the fifth modified example.

[0053] Figure 15 This is an enlarged top view showing another example of the wiring substrate of the fifth modified example.

[0054] Figure 16 This is a top view showing the wiring substrate of the sixth modified example.

[0055] Figure 17 This is an enlarged top view showing the wiring substrate of the sixth modified example.

[0056] Figure 18 This is a top view showing the wiring substrate of the seventh modified example.

[0057] Figure 19 This is an enlarged top view showing the wiring substrate of the seventh modified example. Detailed Implementation

[0058] First, through Figures 1 to 8F One implementation method will be described. Figures 1 to 8F This is a diagram illustrating this embodiment.

[0059] The figures shown below are schematic illustrations. Therefore, for ease of understanding, the size and shape of each part have been appropriately exaggerated. Furthermore, modifications can be made appropriately without departing from the technical concept. In addition, in the figures shown below, the same reference numerals are used for the same parts, and sometimes detailed descriptions are omitted. Furthermore, the dimensions and material names of the various components described in this specification are examples of embodiments and are not limiting; appropriate selections can be made. In this specification, terms describing conditions for determining shape or geometry, such as parallel, orthogonal, and perpendicular, are interpreted in addition to their strict meaning as encompassing substantially the same state.

[0060] Additionally, in the following embodiments, "X direction" refers to a direction parallel to one side of the substrate. "Y direction" refers to a direction perpendicular to the X direction and parallel to the other side of the substrate. "Z direction" refers to a direction perpendicular to both the X and Y directions and parallel to the thickness direction of the substrate. "Surface" refers to the positive side of the Z direction, which is the side facing the wearer. "Back side" refers to the negative side of the Z direction, which is the side opposite to the side facing the wearer.

[0061] First, refer to Figures 1 to 3 The structure of the head-mounted display (hereinafter referred to as HMD) of this embodiment will be described. The HMD of this embodiment is a transmissive (see-through) HMD.

[0062] like Figure 1 As shown, the HMD 90 of this embodiment includes a frame 91 and a transparent display device 95 mounted on the frame 91. In this embodiment, the HMD 90 includes a display device 95 for the right eye and a display device 95 for the left eye, making it a so-called glasses-type HMD. Furthermore, the display devices 95 for the right eye and the left eye have substantially the same structure. Additionally, the display devices 95 are synchronized with each other, configured to display the same image on both eyes, or to display corresponding images on both eyes. Moreover, the two display devices 95 can also be controlled independently, and the two display devices 95 can also display different images. Furthermore, the HMD 90 can also be a so-called goggle-type HMD with a single display device 95.

[0063] The frame 91 of the HMD 90 has a lens frame 92 and a pair of temples 93 connected to the lens frame 92. Each display device 95 is embedded in the lens frame 92. In this embodiment, a wireless communication circuit 94a for the HMD 90 is provided in the lens frame 92.

[0064] Additionally, a control unit 94b for controlling each display device 95 is provided on each pair of temples 93. This control unit 94b may also include an image display unit (not shown) that generates image light. In this embodiment, one control unit 94b is provided on each temple 93. Furthermore, the control unit 94b located on the right temple 93 controls the display device 95 for the right eye, and the control unit 94b located on the left temple 93 controls the display device 95 for the left eye.

[0065] Next, the display device 95 will be described. For example... Figure 2 and Figure 3 As shown, the display device 95 includes a first substrate 96, a wiring board 10 disposed on the first substrate 96, and a display portion 97 disposed between the first substrate 96 and the wiring board 10. In this embodiment, the wiring board 10 covers the entire area of ​​the first substrate 96. However, although not shown, the wiring board 10 may also cover only a portion of the first substrate 96.

[0066] The material of the first substrate 96 can be any material that is transparent in the visible light region. For example, a glass substrate can be used as the first substrate 96. In this embodiment, when the HMD 90 is worn by the wearer, the first substrate 96 is disposed on the side away from the wearer, and the wiring substrate 10 is disposed on the side closer to the wearer. That is, when the HMD 90 is worn by the wearer, the wiring substrate 10 is disposed between the first substrate 96 and the wearer. Therefore, even when the HMD 90 is worn by the wearer, contact between the wiring substrate 10 and surrounding structures or other people can be suppressed. Thus, it is possible to suppress the situation where the first direction wiring 21 and the second direction wiring 22 of the mesh wiring layer 20 of the wiring substrate 10 break due to contact with surrounding structures or other objects. Alternatively, when the HMD 90 is worn by the wearer, the first substrate 96 may be disposed on the side closer to the wearer, and the wiring substrate 10 may be disposed on the side away from the wearer.

[0067] Such a display device 95 can be a display device that projects images using a prism or hologram, or it can be a display device that uses a transmissive liquid crystal display or the like.

[0068] In the case where the display device projects an image, the display unit 97 of the display device 95 may also include a semi-transparent mirror. This semi-transparent mirror is a component that allows ambient light in front of the display device 95 to overlap with image light from an image display unit (not shown) that generates image light. If the display device 95 uses a transmissive liquid crystal display or similar device, a semi-transparent mirror is not required. Furthermore, the display unit 97 is configured such that when the image is not displayed, the image display area becomes transparent, allowing the wearer to visually perceive the outside world through the light transmitted through the display unit 97. Moreover, the wearer can visually perceive both the outside world and the virtual image formed by the image light. In the illustrated example, the display unit 97 is positioned at a location that approximately overlaps with the center of the first substrate 96 when viewed from the front (see reference). Figure 2 However, it is not limited to this; the display unit 97 may also be positioned to overlap with any area of ​​the first substrate 96 when viewed from the front. The display unit 97 and the wiring substrate 10 may be positioned in an overlapping location without interfering with each other's positions, or they may be positioned in a non-overlapping location.

[0069] Next, refer to Figures 4 to 7 The structure of the wiring substrate will be explained. Figures 4 to 7 This is a diagram showing the wiring substrate of this embodiment.

[0070] The wiring substrate 10 in this embodiment is, for example, used in the HMD90 described above (see reference). Figures 1 to 3 The wiring substrate 10 can also be used in portable terminal devices such as smartphones and tablets.

[0071] The wiring substrate 10 is capable of transmitting and receiving radio waves at a specified frequency (e.g., frequencies above 1 GHz) for communication. The wiring substrate 10 can also correspond to any of the following: millimeter-wave antennas, telephone antennas, WiFi antennas, 3G antennas, 4G antennas, 5G antennas, LTE antennas, Bluetooth antennas, NFC antennas, etc. Alternatively, the wiring substrate 10 may also have functions such as gesture sensing, wireless power supply, anti-fog, heater, hovering (operation without direct user contact with the display), fingerprint authentication, and noise cutoff (electromagnetic shielding). Here, in this specification, "gesture sensing" refers to the function of detecting the relative position (distance, angle, etc.) of an object with respect to the mesh wiring layer 20 described later on the wiring substrate 10, or the object's moving speed. In this case, for example, the mesh wiring layer 20 of the wiring substrate 10 can also perform gesture sensing by detecting millimeter waves.

[0072] The wiring substrate 10 includes: a transparent substrate 11; and a grid wiring layer 20 disposed on the substrate 11. In addition, a power supply unit 40 is electrically connected to the grid wiring layer 20.

[0073] The substrate 11 is roughly rectangular in shape when viewed from above (a rectangle with rounded corners). Figure 2 In the illustrated example, its long side is parallel to the X direction, and its short side is parallel to the Y direction. The substrate 11 is transparent and generally flat, with a generally uniform thickness overall. Furthermore, the shape of the substrate 11 can be appropriately selected according to the shape of the first substrate 96 of the display device 95 mounted on the frame 91.

[0074] The material of substrate 11 can be any material that is transparent and electrically insulating in the visible light region. For example, organic insulating materials such as polyester resins, acrylic resins, polycarbonate resins, polyimide resins, polyolefin resins, cellulose resins, or fluoropolymers are preferred as the material of substrate 11. Polyester resins can also be polyethylene terephthalate, etc. Acrylic resins can also be polymethyl methacrylate, etc. Polyolefin resins can be cyclic olefin polymers, etc. Cellulose resins can be triacetyl cellulose, etc. Fluoropolymers can also be PTFE or PFA, etc. For example, organic insulating materials such as cyclic olefin polymers (e.g., ZF-16 manufactured by ZEON Corporation of Japan) or polynorbornene polymers (manufactured by Sumitomo Bakelite Co., Ltd.) can also be used as the material of substrate 11. Furthermore, glass or ceramics can be appropriately selected as the material of substrate 11 depending on the application. Although an example of substrate 11 consisting of a single layer is illustrated, it is not limited to this, and a structure with multiple substrates or layers stacked can also be used. Alternatively, the substrate 11 can be a film-shaped component or a plate-shaped component.

[0075] Furthermore, the substrate 11 is transparent. In this specification, "transparent" means that the transmittance of visible light (light with a wavelength of 400 nm or more and 700 nm or less) is 85% or more. The transmittance of the substrate 11 under visible light (light with a wavelength of 400 nm or more and 700 nm or less) can be 85% or more, preferably 90% or more. In addition, there is no particular upper limit to the transmittance of the substrate 11 under visible light, for example, it can be 100% or less. By setting the transmittance of the substrate 11 under visible light to the above range, it is possible to suppress the obstruction of external visibility when the wiring substrate 10 is assembled on the HDM90. It should be noted that the transmittance under visible light of 85% or more means that when the absorbance of the substrate 11 is measured using a known spectrophotometer (spectrometer manufactured by Nippon Spectrophotometer Co., Ltd.: V-670), its transmittance is 85% or more in the entire wavelength region of 400 nm or more and 700 nm or less.

[0076] The tensile modulus of elasticity of the substrate 11 is preferably 0.5 GPa or higher and 4.5 GPa or lower. By ensuring that the tensile modulus of elasticity of the substrate 11 is 0.5 GPa or higher, the rigidity of the substrate 11 can be maintained, and deformation of the substrate 11 can be suppressed. Furthermore, by ensuring that the tensile modulus of elasticity of the substrate 11 is 4.5 GPa or lower, it is possible to prevent the substrate 11 from becoming too stiff. Therefore, even if the substrate 11 buckles, damage to the substrate 11 can be suppressed. Thus, the reduction in antenna performance caused by deformation of the wiring substrate 10 can be suppressed. It should be noted that the tensile modulus of elasticity of the substrate 11 can be measured according to ASTM-D-882. Specifically, the elongation of the test piece can be measured using a tensile testing machine, and the modulus can be determined based on the maximum elasticity before plastic deformation (a linear expression of the tangent to the maximum slope of the stress-strain curve).

[0077] The dielectric loss tangent of substrate 11 can be 0.002 or less, preferably 0.001 or less. Furthermore, the lower limit of the dielectric loss tangent of substrate 11 is not particularly limited, but it can exceed 0. By making the dielectric loss tangent of substrate 11 within the above range, it is possible to reduce the gain loss (i.e., the decrease in sensitivity) associated with the transmission and reception of electromagnetic waves, especially when the electromagnetic waves (e.g., millimeter waves) transmitted and received by the mesh wiring layer 20 are high-frequency.

[0078] The relative permittivity of the substrate 11 is preferably 2 or higher and 10 or lower. By setting the relative permittivity of the substrate 11 to 2 or higher, the selection of materials for the substrate 11 can be increased. Furthermore, by setting the relative permittivity of the substrate 11 to 2 or higher, inexpensive materials can be selected, thus reducing manufacturing costs. Moreover, by setting the relative permittivity of the substrate 11 to 2 or higher, materials suitable for the manufacturing process can be selected, improving manufacturing yield and further reducing manufacturing costs. Additionally, by setting the relative permittivity of the substrate 11 to 10 or lower, the loss of gain (sensitivity) associated with the transmission and reception of electromagnetic waves can be reduced. That is, when the relative permittivity of the substrate 11 increases, the thickness of the substrate 11 has a greater impact on the propagation of electromagnetic waves. Furthermore, if the propagation of electromagnetic waves is adversely affected, the dielectric loss tangent of the substrate 11 increases, and the loss of gain associated with the transmission and reception of electromagnetic waves may increase. In contrast, by setting the relative permittivity of the substrate 11 to 10 or lower, the impact of the thickness of the substrate 11 on the propagation of electromagnetic waves can be reduced. Therefore, it is possible to reduce the gain loss associated with the transmission and reception of electromagnetic waves. In particular, when the electromagnetic waves (e.g., millimeter waves) transmitted and received by the mesh wiring layer 20 are high-frequency, it is possible to reduce the gain loss associated with the transmission and reception of electromagnetic waves.

[0079] The dielectric loss tangent and relative permittivity of substrate 11 can be measured according to IEC 62562. Specifically, firstly, a test piece is prepared by cutting out the portion of substrate 11 before the formation of the mesh wiring layer 20. The dimensions of the test piece are: a width of 10 mm to 20 mm and a length of 50 mm to 100 mm. Next, the dielectric loss tangent or relative permittivity is measured according to IEC 62562.

[0080] In this embodiment, the mesh wiring layer 20 is configured as an electromagnetic wave transceiver. In other words, the mesh wiring layer 20 is configured with an antenna pattern that functions as an antenna. The mesh wiring layer 20 can also be configured as an array antenna containing two or more antenna elements (radiating elements (the end portion 20b described later)). Thus, by configuring the mesh wiring layer 20 as an array antenna, the performance of millimeter-wave antennas with high transceiver straight-line characteristics can be improved. Furthermore, an array antenna refers to an antenna with multiple antenna elements arranged in a regular pattern, and is an antenna in which the amplitude and phase of the excitation of the elements can be controlled independently.

[0081] like Figure 4 As shown, multiple mesh wiring layers 20 are formed on the substrate 11. Preferably, four or more mesh wiring layers 20 are provided. In this case, four or more antenna elements (the end-side portion 20b described later) are provided on the wiring substrate 10. In the illustrated example, four mesh wiring layers 20 are formed on the substrate 11 (see reference). Figure 2 Additionally, such as Figure 4 As shown, the mesh wiring layer 20 may not exist on the entire surface of the substrate 11, but only in a portion of the substrate 11. Each mesh wiring layer 20 may also have the same shape as each other. In this case, regarding each mesh wiring layer 20, it is preferable that the length (length in the Y direction) of the end-side portion 20b, described later, is L. a Error and width (length in the X direction) W a The errors are all within 10%. Therefore, the performance of millimeter-wave antennas can be effectively improved.

[0082] The mesh wiring layer 20 has a base-side portion (transmission section) 20a on the power supply section 40 side and an end-side portion (transceiver section) 20b connected to the base-side portion 20a. The base-side portion 20a is connected to the power supply section 40. In this case, the base-side portion (transmission section) 20a can also be configured as a microstrip line or a coplanar line. The shapes of the base-side portion 20a and the end-side portion 20b are both approximately rectangular when viewed from above. In this case, the width (X-direction distance) of the end-side portion 20b is larger than the width (X-direction distance) of the base-side portion 20a.

[0083] The end portion 20b of the mesh wiring layer 20 corresponds to a specified frequency band. That is, the length (length in the Y direction) L of the end portion 20b... a This becomes the length corresponding to a specific frequency band. Furthermore, the lower the corresponding frequency band, the longer the length L of the 20b portion at the end. a The longer the mesh wiring layer 20, the better. Besides corresponding to millimeter-wave antennas, it can also correspond to any of the following: telephone antennas, WiFi antennas, 3G antennas, 4G antennas, 5G antennas, LTE antennas, Bluetooth antennas, NFC antennas, etc. Furthermore, the lengths of the multiple end-side portions 20b can be different, and each can correspond to a different frequency band. Alternatively, each mesh wiring layer 20 can also serve functions such as hovering, fingerprint authentication, a heater, or noise cutoff (electromagnetic wave shielding).

[0084] In the illustrated example, the long side of the end portion 20b is parallel to the X direction, and its short side is parallel to the Y direction. Alternatively, the end portion 20b can also have its long side parallel to the Y direction and its short side parallel to the X direction. The length L in the Y direction of the end portion 20b is... a For example, it can be selected within a range of 1mm to 100mm. The width W in the X direction of the end-side portion 20b. a For example, it can be selected within a range of 1mm to 100mm. In particular, in the case where the mesh wiring layer 20 is a millimeter-wave antenna, the length L of the end portion 20b... a The selection can be made within a range of 1 mm or more, and more preferably within a range of 1.5 mm or more. In the case where the mesh wiring layer 20 is a millimeter-wave antenna, the length L of the end portion 20b... a It can be selected within a range of less than 10mm, and more preferably within a range of less than 5mm.

[0085] The distance between the mesh wiring layers 20 can be appropriately set according to the corresponding frequency, but is preferably 1 mm or more and 30 mm or less. That is, the distance D between the end portions 20b is... 20b (Reference Figure 4 The preferred distance is 1mm or more and 30mm or less. By setting an appropriate distance, the desired antenna directivity and gain can be improved.

[0086] like Figure 4As shown, the mesh wiring layer 20 has a pattern shape in which the metal wires are arranged in a mesh pattern. This pattern shape is repeated in the X and Y directions. That is, the mesh wiring layer 20 has a pattern shape composed of a portion extending in a first direction (e.g., the Y direction) (first direction wiring 21 described later) and a portion extending in a second direction (e.g., the X direction) (second direction wiring 22 described later).

[0087] like Figure 5 As shown, the mesh wiring layer 20 has wiring. Specifically, the mesh wiring layer 20 has a plurality of first-direction wirings (wiring) 21 and a plurality of second-direction wirings (wiring) 22 connecting the plurality of first-direction wirings 21. The plurality of first-direction wirings 21 and the plurality of second-direction wirings 22 are integrally formed to create a mesh-like shape. Each first-direction wiring 21 extends in the long side direction (Y direction) of the mesh wiring layer 20. Each second-direction wiring extends in the width direction (X direction) of the mesh wiring layer 20. In addition, the first-direction wirings 21 and the second-direction wirings 22 may also extend in directions that are not parallel to either the X or Y direction.

[0088] The planar shape of the first directional wiring 21 and the second directional wiring 22 is a shape formed by connecting multiple curves. In this case, the curves are circular arcs or elliptical arcs. In the illustrated example, the planar shape of the first directional wiring 21 and the second directional wiring 22 is a shape formed by connecting multiple circular arcs. Here, the diffraction pattern generated by the linear structure extends in a direction orthogonal to the long side direction of the structure, becoming rays (observed as trailing light fringes). On the other hand, when the planar shape of the first directional wiring 21 and the second directional wiring 22 is a shape formed by connecting multiple circular arcs, the generated rays extend in all directions. When the generated rays extend in all directions, since the rays overlap, it is difficult to identify each ray. Thus, the influence of the rays on visibility can be reduced. Furthermore, when the curve is an elliptical arc, the length of the major axis of the ellipse formed by the elliptical arc can be more than 1 times but less than 1.1 times the length of the minor axis.

[0089] In the mesh wiring layer 20, openings 23 are formed by being surrounded by first-direction wiring 21 and second-direction wiring 22. Specifically, in the mesh wiring layer 20, a plurality of openings 23 are formed by being surrounded by adjacent first-direction wiring 21 and adjacent second-direction wiring 22. A transparent substrate 11 is exposed from each opening 23. As a result, the overall transparency of the wiring substrate 10 can be improved.

[0090] In the first-direction wiring 21 and the second-direction wiring 22 surrounding the opening 23, the shape of connecting the ends of the chords of multiple arcs (curves) to each other is a polygon. In this case, one side of the polygon may also be composed of 2N (N is a natural number greater than or equal to 1) chords. In this embodiment, one side of the polygon is composed of two (N=1) chords. Furthermore, in this embodiment, in the first-direction wiring 21 and the second-direction wiring 22 surrounding the opening 23, the shape of connecting the ends of the chords of multiple arcs (curves) to each other is a square. That is, the straight line L1 connecting the ends of the chords of the first-direction wiring 21 to each other and the straight line L2 connecting the ends of the chords of the second-direction wiring 22 to each other are arranged at equal intervals. The spacing P1 of the straight lines L1 connecting the ends of the chords of the first-direction wiring 21 to each other can be set to a range of 0.01 mm or more and 1 mm or less, for example. Similarly, the spacing P2 of the straight lines L2 connecting the ends of the chords of the second-direction wiring 22 to each other can be set to a range of 0.01 mm or more and 1 mm or less, for example. Therefore, the size of the openings 23 within the mesh wiring layer 20 is consistent, making the mesh wiring layer 20 difficult to discern with the naked eye. Furthermore, while each straight line L1 and each straight line L2 is orthogonal, it is not limited to this; they may also intersect at acute or obtuse angles. Additionally, the shape of the openings 23 is preferably uniform in shape and size across the entire surface, but it can be varied depending on the location, resulting in unevenness across the surface. Moreover, although not illustrated, one side of the polygon may be composed of four or more chords (N≥2), or it may be composed of an odd number of chords.

[0091] Here, the first-direction wiring 21 and the second-direction wiring 22 may also have a shape formed by connecting multiple arcs cut at a central angle of 160° or more and 200° or less. In this case, the diameter of the circle from which the arcs are cut may be 0.4 times or more and 0.6 times or less the length of one side of the square S1 formed by lines L1 and L2. Furthermore, in this specification, the square S1 formed by lines L1 and L2 refers to the square with the smallest area in the area (square) enclosed by lines L1 and L2 (see reference). Figure 5 (The slanted part).

[0092] Furthermore, on one side of the square (polygon) S1, the Mth dividing point (where M is a natural number greater than 1 and less than (2N-1)) among the dividing points of the side divided into 2N equal parts is designated as the Mth dividing point. Additionally, on one side, the Mth connecting point among the connecting points of the chords is designated as the Mth connecting point. In this case, the distance from the Mth dividing point to the Mth connecting point can also be less than 0.1 / N times the length of the side.

[0093] In this embodiment, as described above, one side of the polygon is composed of two chords, N=1. Therefore, on one side, the dividing point that divides the side 2N is only the first (M=1) dividing point counted from one end E1 of the side, namely the first dividing point DiP1 (M=1). In this embodiment, the first dividing point DiP1 is the midpoint of the side. Furthermore, on one side, the connection point between the chords is only the first (M=1) connection point counted from one end E1 of the side, namely the first connection point CP1.

[0094] Thus, in the case where N=1 and M=1, such as Figure 5 As shown by the imaginary line (double-dotted line), the shortest distance D from the first dividing point DiP1 to the first connecting point CP1 is... p1 It can be less than 0.1 times the length of one side (N=1). When the first direction wiring 21 and the second direction wiring 22 are in the form of an arc connecting the two sides satisfying the above relationship, a substantially complete circle can be formed by joining the first direction wiring 21 and the second direction wiring 22 surrounding the opening 23. Furthermore, Figure 5 The imaginary line is the curve formed by connecting two circular arcs, and it is the curve when the first connection point CP1 is not the midpoint of one side (the first dividing point DiP1).

[0095] In this embodiment, such as Figure 5 As shown, the first directional wiring 21 has a shape formed by connecting multiple arcs cut at a central angle θ1 of 180°. In this case, the diameter of the circle C1 with the cut arcs is 0.5 times the length of one side of the square S1 formed by lines L1 and L2. Furthermore, on one side of the square S1 formed by lines L1 and L2, the first connection point CP1 is located at the first dividing point DiP1 (the midpoint of one side). Similarly, the second directional wiring 22 has a shape formed by connecting multiple arcs cut at a central angle θ2 of 180°. In this case, the diameter of the circle C2 with the cut arcs is 0.5 times the length of one side of the square S1 formed by lines L1 and L2. Furthermore, on one side of the square S1 formed by lines L1 and L2, the first connection point CP1 is located at the first dividing point DiP1 (the midpoint of one side). In this case, by surrounding the opening 23 (refer to...) Figure 5 The second direction wirings 22 and 22a of the first direction wiring 21 and the second direction wiring 22 (in the shaded area) that form the upper straight line L1, for example, can be joined to form a complete circle. Here, a complete circle refers to a circle formed when the arcs do not overlap when joining curves. Furthermore, in this case, by surrounding the opening 23 (see reference 22a), a complete circle can be formed. Figure 5The first-direction wiring 21 and the second-direction wiring 22 (in the shaded area) join together, thereby forming multiple complete circles. Furthermore, in this specification, opening 23 refers to the smallest area within the region surrounded by the first-direction wiring 21 and the second-direction wiring 22 (see reference). Figure 5 (The shaded area).

[0096] As described above, the diffraction pattern generated by the linear structure extends in a direction orthogonal to the long side of the structure, forming rays (observed as trailing light stripes). On the other hand, when the generated rays extend in all directions (360°), each ray is difficult to identify. That is, by having multiple rays overlap in a circular shape, the influence of the rays on visibility can be reduced. Therefore, in order for the rays to extend in all directions and as a result, for multiple rays to overlap and be visually perceived as a circle, it is sufficient that the normals of the first directional wiring 21 and the second directional wiring 22 surrounding the opening 23, which are orthogonal to the long side, are distributed in all directions.

[0097] In contrast, in this embodiment, the first directional wiring 21 and the second directional wiring 22 can have a shape formed by connecting multiple arcs cut at a central angle of 160° or more and 200° or less. Furthermore, the shortest distance D from the first dividing point DiP1 to the first connecting point CP1... p1 It can be less than 0.1 times the length of one side. Therefore, the area surrounding the opening 23 (see reference) Figure 5 The normals of the first-direction wiring 21 and the second-direction wiring 22 (in the shaded area) orthogonal to the long side direction can be distributed approximately throughout all directions. Therefore, the reduction in visibility caused by glare can be suppressed more effectively. In particular, when the first-direction wiring 21 and the second-direction wiring 22 have a shape formed by connecting multiple arcs obtained by cutting circles C1 and C2 at 180° central angles θ1 and θ2, and the first connection point CP1 is located at the first dividing point DiP1 (the midpoint of one side), the aforementioned normals are distributed throughout all directions, wherein the circles C1 and C2 have a diameter 0.5 times the diameter of one side of the square S1 formed by lines L1 and L2. Therefore, the reduction in visibility caused by glare can be suppressed more effectively.

[0098] like Figure 6 As shown, each first-direction wiring 21 has a cross-section perpendicular to its long side that is approximately rectangular or approximately square. In this case, the cross-sectional shape of the first-direction wiring 21 is approximately uniform along its long side. Figure 7As shown, the cross-section of each second-direction wiring 22 perpendicular to its long side is approximately rectangular or approximately square, having a shape approximately the same as the cross-sectional shape of the first-direction wiring 21 described above. In this case, the cross-sectional shape of the second-direction wiring 22 is approximately uniform along the long side direction of the second-direction wiring 22. The cross-sectional shapes of the first-direction wiring 21 and the second-direction wiring 22 do not necessarily have to be approximately rectangular or approximately square. For example, the cross-sectional shapes of the first-direction wiring 21 and the second-direction wiring 22 may also be approximately trapezoidal with the front side (positive side in the Z direction) narrower than the back side (negative side in the Z direction), or shapes with curved sides on both sides in the width direction.

[0099] In this embodiment, the line width W1 of the first direction wiring 21 (refer to...) Figure 6 ) and the line width W2 of the second direction wiring 22 (refer to Figure 7 There are no particular limitations, and the appropriate width can be selected according to the application. Here, the linewidth W1 of the first-direction wiring 21 is the width on the cross-section perpendicular to its long side, and the linewidth W2 of the second-direction wiring 22 is the width on the cross-section perpendicular to its long side. For example, the linewidth W1 of the first-direction wiring 21 can be selected in the range of 0.1μm or more and 5.0μm or less, or it can be set to 0.2μm or more and 2.0μm or less. Similarly, the linewidth W2 of the second-direction wiring 22 can be selected in the range of 0.1μm or more and 5.0μm or less, or it can be set to 0.2μm or more and 2.0μm or less.

[0100] The height H1 of the first direction wiring 21 (see...) Figure 6 ) and the height H2 of the second direction wiring 22 (see Figure 7 There are no particular restrictions, and the appropriate height can be selected according to the application. Here, the height H1 of the first direction wiring 21 and the height H2 of the second direction wiring 22 are the lengths in the Z direction. The height H1 of the first direction wiring 21 and the height H2 of the second direction wiring 22 can be selected in a range of, for example, greater than 0.1 μm, and can be greater than 0.2 μm. The height H1 of the first direction wiring 21 and the height H2 of the second direction wiring 22 can be selected in a range of, for example, less than 5.0 μm, and can be less than 2.0 μm.

[0101] The materials for the first directional wiring 21 and the second directional wiring 22 can be any conductive metallic material. In this embodiment, the materials for the first directional wiring 21 and the second directional wiring 22 are copper, but this is not a limitation. For example, the materials for the first directional wiring 21 and the second directional wiring 22 can be metallic materials such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel, or alloys containing these metals. Alternatively, the first directional wiring 21 and the second directional wiring 22 can also be plating layers formed by electroplating.

[0102] The overall aperture ratio At of the mesh wiring layer 20 can be, for example, in the range of 87% or more and less than 100%. By setting the overall aperture ratio At of the mesh wiring layer 20 to this range, the conductivity and transparency of the wiring substrate 10 can be ensured. The overall aperture ratio At of the mesh wiring layer 20 is preferably 94% or more and less than 100%. Thus, the conductivity of the wiring substrate 10 can be ensured while improving the transparency of the wiring substrate 10. Furthermore, the aperture ratio refers to the percentage (%) of the area of ​​the open region to the unit area of ​​a specified area (e.g., the entire area of ​​the mesh wiring layer 20). The open region refers to the area where the substrate 11 is exposed due to the absence of metal portions such as the first direction wiring 21 and the second direction wiring 22.

[0103] Furthermore, although not shown, a protective layer can also be formed on the first surface 11a of the substrate 11 to cover the mesh wiring layer 20. The protective layer protects the mesh wiring layer 20 and is formed to cover at least the mesh wiring layer 20 in the substrate 11. As a material for the protective layer, colorless and transparent insulating resins such as copolymers of acrylic resins and modified resins thereof, such as poly(methyl methacrylate) and poly(ethyl methacrylate), polyester, polyvinyl alcohol, polyvinyl acetate, polyvinyl alcohol acetal, polyvinyl butyral, polyurethane, epoxy resin, polyamide, and chlorinated polyolefin can be used.

[0104] Furthermore, when performing a flexural strength test on the wiring substrate 10, the increase in resistance of the mesh wiring layer 20 can be less than 10% or less than 5%. The flexural strength test refers to performing the following operation 100 times using a cylindrical mandrel bending tester: bending the wiring substrate 10 180° around a cylinder with a diameter of 1 mm and then stretching it.

[0105] Specifically, the experiment is conducted as follows: First, the resistance between the two ends of the long side of the mesh wiring layer 20 is measured. This resistance value is set as R0 (Ω). Next, the wiring substrate 10 is wound around the cylinder of a cylindrical mandrel bending tester, with the two ends of the long side of the wiring substrate 10 facing opposite directions at 180°. Then, the wiring substrate 10 is removed from the cylinder and laid flat. This operation is repeated 100 times. Afterward, the resistance between the two ends of the long side of the mesh wiring layer 20 is measured again. This resistance value is set as R1 (Ω). The value obtained by calculating ((R1-R0) / R0)×100 (%) is taken as the increase in resistance value. By keeping this increase in resistance value below 10%, the durability of the wiring substrate 10 can be improved when it is used after bending or buckling.

[0106] Refer again Figure 4The power supply unit 40 is electrically connected to the mesh wiring layer 20. The power supply unit 40 is composed of a generally rectangular conductive thin plate-shaped component.

[0107] Additionally, the power supply unit 40 is disposed at the long side end (negative side end in the Y direction) of the substrate 11. The material of the power supply unit 40 can be, for example, metals such as gold, silver, copper, platinum, tin, aluminum, iron, or nickel, or alloys containing these metals.

[0108] The wiring substrate 10 is assembled on the HDM90 (see reference). Figure 2 When the power supply unit 40 is in operation, it is electrically connected to the wireless communication circuit 94a disposed in the frame 91 of the HMD 90. Preferably, the power supply unit 40 is disposed at a position overlapping the frame 92 of the frame 91 in the front view of the HMD 90. This facilitates easier connection between the mesh wiring layer 20 and the wireless communication circuit 94a, and reduces obstruction of external visibility. Furthermore, while the power supply unit 40 is disposed on the first surface 11a of the substrate 11, it is not limited to this; part or all of the power supply unit 40 may be located further outward than the periphery of the substrate 11.

[0109] [Manufacturing method of wiring substrate]

[0110] Next, refer to Figures 8A to 8F The manufacturing method of the wiring substrate 10 of this embodiment will be described.

[0111] First, such as Figure 8A As shown, a substrate 11 is prepared, comprising a first surface 11a and a second surface 11b located on the opposite side of the first surface 11a. The substrate 11 is transparent.

[0112] Next, a grid wiring layer 20 and a power supply section 40 electrically connected to the grid wiring layer 20 are formed on the first surface 11a of the substrate 11.

[0113] At this point, firstly, as Figure 8B As shown, a metal foil 51 is laminated over approximately the entire area of ​​the first surface 11a of the substrate 11. In this embodiment, the thickness of the metal foil 51 may be 0.1 μm or more and 5.0 μm or less. In this embodiment, the metal foil 51 may also contain copper.

[0114] Next, as Figure 8C As shown, a photocurable insulating resist 52 is supplied to approximately the entire surface area of ​​the metal foil 51. Examples of such photocurable insulating resist 52 include organic resins such as acrylic resins and epoxy resins.

[0115] Next, as Figure 8DAs shown, the insulating layer 54 is formed by photolithography. In this case, the insulating layer 54 (resist pattern) is formed by patterning a photocurable insulating resist 52 using photolithography. At this time, the insulating layer 54 is formed such that the metal foil 51 corresponding to the first direction wiring 21 and the second direction wiring 22 is exposed.

[0116] Next, as Figure 8E As shown, the metal foil 51 located on the first surface 11a of the substrate 11, where it is not covered by the insulating layer 54, is removed. At this time, the metal foil 51 is etched so that the first surface 11a of the substrate 11 is exposed by performing a wet treatment using strong acids such as ferric chloride, copper chloride, sulfuric acid / hydrochloric acid, persulfate, hydrogen peroxide or aqueous solutions thereof, or combinations thereof.

[0117] Next, as Figure 8F As shown, the insulating layer 54 is removed. In this case, the insulating layer 54 on the metal foil 51 is removed by performing a wet treatment using a permanganate solution, N-methyl-2-pyrrolidone, acid or alkali solution, or a dry treatment using oxygen plasma.

[0118] Thus, a wiring substrate 10 having a substrate 11 and a mesh wiring layer 20 disposed on a first surface 11a of the substrate 11 is obtained. In this case, the mesh wiring layer 20 includes first-direction wiring 21 and second-direction wiring 22. At this time, the power supply section 40 may also be formed from a portion of a metal foil. Alternatively, a flat plate-shaped power supply section 40 may be prepared separately and electrically connected to the mesh wiring layer 20.

[0119] Then, by mounting the wiring substrate 10 into the first substrate 96 embedded in the frame 92 of the frame 91, the following is obtained: Figure 1 The HMD90 shown. Alternatively, the wiring board 10 can be mounted on the first substrate 96 before the first substrate 96 is embedded in the frame 92 of the frame 91.

[0120] [The function of this implementation method]

[0121] Next, the function of this embodiment, which is constructed in this way, will be explained.

[0122] like Figure 2 As shown, the wiring board 10 is assembled on the HMD 90 as a component of the display device 95. The grid wiring layer 20 of the wiring board 10 is electrically connected to the wireless communication circuit 94a of the HMD 90 via the power supply unit 40. In this way, radio waves of a specified frequency can be transmitted and received via the grid wiring layer 20, enabling communication using the HMD 90.

[0123] According to this embodiment, the planar shape of the first directional wiring 21 and the second directional wiring 22 is formed by connecting multiple arcs. As a result, the generated light rays extend in all directions. Therefore, by overlapping the individual light rays, each ray becomes difficult to identify. Consequently, the reduction in visibility caused by the light rays can be suppressed. Furthermore, in this case, the reduction in visibility caused by the light rays can be suppressed without increasing the deviation in the spacing between the first directional wiring 21 and the second directional wiring 22, or the deviation in the spacing of the second directional wiring 22. Therefore, flicker caused by the reflection of visible light by the mesh wiring layer 20 can be suppressed. Moreover, since the planar shape of the first directional wiring 21 and the second directional wiring 22 is formed by connecting multiple arcs, the reflection of electromagnetic waves in the first directional wiring 21 and the second directional wiring 22 can be reduced. Therefore, the transmission efficiency of the wiring substrate 10 can be improved.

[0124] Furthermore, according to this embodiment, in the HMD90, the wiring substrate 10 includes a transparent substrate 11 and a mesh wiring layer 20 disposed on the substrate 11. Moreover, the aperture ratio of the mesh wiring layer 20 is 94% or more. Therefore, the transparency of the wiring substrate 10 is ensured. Thus, when the wiring substrate 10 is assembled into the HMD90, the outside world can be observed through the openings 23 of the mesh wiring layer 20, and therefore, external visibility is not obstructed.

[0125] Next, a modified example of the wiring substrate will be described.

[0126] Figure 9 A first modified example of the wiring substrate 10 is shown. Figure 9 The variant shown differs from the one described above in that the first-direction wiring 21 and the second-direction wiring 22 are formed by connecting multiple arcs cut at a central angle of 80° or more and 100° or less. Other structures are different from those described above. Figures 1 to 8F The shapes shown are roughly the same. Figure 9 In the middle, to and Figures 1 to 8F Parts with the same shape are labeled with the same number and detailed descriptions are omitted.

[0127] exist Figure 9 In the wiring substrate 10 shown, the first-direction wiring 21 and the second-direction wiring 22 have a shape formed by connecting multiple arcs cut at a central angle of 80° or more and 100° or less. In this case, the diameter of the circle from which the arcs are cut can also be (1 / √2) × 0.8 times or more and (1 / √2) × 1.2 times or less than the length of one side of the square S1 formed by straight lines L1 and L2. Furthermore, in this modified example, the shortest distance D from the first dividing point DiP1 to the first connecting point CP1 on one side of the square S1 formed by straight lines L1 and L2 is... p1 (Reference Figure 5It can also be less than 0.1 times the length of one side. Even if the first direction wiring 21 and the second direction wiring 22 are in the shape of connecting arcs that satisfy the above relationship, a roughly complete circle can be formed by joining the first direction wiring 21 and the second direction wiring 22 surrounding the opening 23.

[0128] In this variation, such as Figure 9 As shown, the first directional wiring 21 has a shape formed by connecting multiple arcs cut at a central angle θ3 of 90°. In this case, the diameter of the circle C3 with the cut arcs is 1 / √2 times the length of one side of the square S1 formed by lines L1 and L2. Furthermore, on one side of the square S1 formed by lines L1 and L2, the first connection point CP1 is located at the first dividing point DiP1 (the midpoint of one side). Similarly, the second directional wiring 22 has a shape formed by connecting multiple arcs cut at a central angle θ4 of 90°. In this case, the diameter of the circle C4 with the cut arcs is 1 / √2 times the length of one side of the square S1 formed by lines L1 and L2. Furthermore, on one side of the square S1 formed by lines L1 and L2, the first connection point CP1 is located at the first dividing point DiP1 (the midpoint of one side). In this case, by joining the first directional wiring 21 and the second directional wiring 22 surrounding the opening 23, multiple complete circles can also be formed. In this situation, by having multiple rays overlap in a circular shape, the impact of the rays on visibility can also be reduced. Therefore, the reduction in visibility caused by the rays can be suppressed more effectively.

[0129] Furthermore, in this modified example, the first directional wiring 21 has a shape formed by connecting multiple arcs cut at a central angle θ3 of 80° or more and 100° or less, and the second directional wiring 22 has a shape formed by connecting multiple arcs cut at a central angle θ4 of 80° or more and 100° or less. In this case, in the first directional wiring 21 and the second directional wiring 22 surrounding the opening 23, the difference between the line length of the shape (polygon) formed by connecting the ends of the chords of multiple curves to each other and the total line length of the first directional wiring 21 and the second directional wiring 22 can be reduced. In other words, compared to the case where the central angles θ3 and θ4 are, for example, 180°, by making the central angles θ3 and θ4 80° or more and 100° or less, the rate of increase of the total line length of the first directional wiring 21 and the second directional wiring 22 relative to the aforementioned polygon can be reduced. As a result, the increase in the resistance value of the mesh wiring layer 20 can be suppressed.

[0130] Furthermore, by reducing the aforementioned rate of increase in line length, the decrease in the aperture ratio of the mesh wiring layer 20 can be suppressed. Additionally, by reducing the aforementioned rate of increase in line length, the excessive length of the first-direction wiring 21 and the second-direction wiring 22 can be prevented. Therefore, the risk of breakage in the first-direction wiring 21 and the second-direction wiring 22 can also be reduced. Moreover, by suppressing the excessive length of the first-direction wiring 21 and the second-direction wiring 22, the patterning accuracy during the fabrication of the first-direction wiring 21 and the second-direction wiring 22, as well as the dimensional stability of the first-direction wiring 21 and the second-direction wiring 22, can be improved. Therefore, the productivity of the wiring substrate 10 can be increased.

[0131] Figure 10A A second modified example of the wiring substrate 10 is shown. Figure 10A The difference in the variant shown is that in the first direction wiring 21 and the second direction wiring 22 surrounding the opening 23, the shape formed by connecting the ends of the chords of multiple curves to each other is a rhombus; the other structures are the same as described above. Figures 1 to 9 The shapes shown are roughly the same. Figure 10A In the middle, to and Figures 1 to 9 Parts with the same shape are labeled with the same number and detailed descriptions are omitted.

[0132] exist Figure 10A In the wiring substrate 10 shown, the shape formed by connecting the ends of the chords of multiple curves to each other in the first-direction wiring 21 and the second-direction wiring 22 surrounding the opening 23 is a rhombus. In other words, the aforementioned polygon is a rhombus. In this case, the first-direction wiring 21 and the second-direction wiring 22 extend in directions that are not parallel to either the X or Y directions. As a result, the resistance in the Y direction, where current flows, can be reduced. Therefore, the antenna characteristics can be improved.

[0133] Furthermore, the first-direction wiring 21 and the second-direction wiring 22 have a shape formed by connecting multiple arcs cut at a central angle of 160° or more and 200° or less. In this case, the diameter of the circle from which the arcs are cut can also be 0.4 times or more and 0.6 times or less the length of one side of the rhombus S2 formed by straight lines L1 and L2. Additionally, as... Figure 10A As shown by the imaginary line (double-dotted line), on one side of the rhombus S2 formed by lines L1 and L2, the shortest distance D from the first dividing point DiP1 to the first connecting point CP1 is... p2 It can also be less than 0.1 times the length of one side. Even when the first direction wiring 21 and the second direction wiring 22 are in the form of an arc connecting the two sides that satisfies the above relationship, a substantially complete circle can be formed by joining the first direction wiring 21 and the second direction wiring 22 surrounding the opening 23. Furthermore, Figure 10A The imaginary line is the curve formed by connecting two circular arcs, and it is the curve when the first connection point CP1 is not the midpoint of one side (the first dividing point DiP1).

[0134] In this variation, such as Figure 10A As shown, the first directional wiring 21 has a shape formed by connecting multiple arcs cut at a central angle θ5 of 180°. In this case, the diameter of the circle C5 with the cut arcs is 0.5 times the length of one side of the rhombus S2 formed by lines L1 and L2. Furthermore, on one side of the rhombus S2 formed by lines L1 and L2, the first connection point CP1 is located at the first dividing point DiP1 (the midpoint of one side). Similarly, the second directional wiring 22 has a shape formed by connecting multiple arcs cut at a central angle θ6 of 180°. In this case, the diameter of the circle C6 with the cut arcs is 0.5 times the length of one side of the rhombus S2 formed by lines L1 and L2. Furthermore, on one side of the rhombus S2 formed by lines L1 and L2, the first connection point CP1 is located at the first dividing point DiP1 (the midpoint of one side). In this case, by joining the first directional wiring 21 and the second directional wiring 22 surrounding the opening 23, multiple complete circles can also be formed. In this situation, by having multiple rays overlap in a circular shape, the impact of the rays on visibility can also be reduced. Therefore, the reduction in visibility caused by the rays can be suppressed more effectively.

[0135] In addition, Figure 10A In the wiring substrate 10 shown, an example is illustrated where the first-direction wiring 21 and the second-direction wiring 22 have a shape formed by connecting multiple arcs cut at a central angle of 160° or more and 200° or less, but this is not a limitation. For example, the first-direction wiring 21 and the second-direction wiring 22 may also have a shape formed by connecting multiple arcs cut at a central angle of 80° or more and 100° or less. In this case, the diameter of the circle from which the arcs are cut may be 0.4 times or more and 0.6 times or less the length of one side of the rhombus S2 formed by straight lines L1 and L2. Furthermore, as... Figure 10B As shown by the imaginary line (double-dotted line), on one side of the rhombus S2 formed by lines L1 and L2, the shortest distance D from the first dividing point DiP1 to the first connecting point CP1 is... p2 It can also be less than 0.1 times the length of one side. Furthermore, Figure 10B The imaginary line is the curve formed by connecting two circular arcs, and it is the curve when the first connection point CP1 is not the midpoint of one side (the first dividing point DiP1).

[0136] In this variation, such as Figure 10BAs shown, the first directional wiring 21 has a shape formed by connecting multiple arcs cut at a central angle θ5 of 90°. In this case, the diameter of the circle C5 with the cut arcs is also 0.5 times the length of one side of the rhombus S2 formed by lines L1 and L2. Furthermore, on one side of the rhombus S2 formed by lines L1 and L2, the first connection point CP1 is located at the first dividing point DiP1 (the midpoint of one side). Similarly, the second directional wiring 22 has a shape formed by connecting multiple arcs cut at a central angle θ6 of 90°. In this case, the diameter of the circle C6 with the cut arcs is also 0.5 times the length of one side of the rhombus S2 formed by lines L1 and L2. Furthermore, on one side of the rhombus S2 formed by lines L1 and L2, the first connection point CP1 is located at the first dividing point DiP1 (the midpoint of one side).

[0137] exist Figure 10B In the example shown, multiple complete circles can also be formed by joining the first-direction wiring 21 and the second-direction wiring 22 surrounding the opening 23. In this case, by having multiple rays overlap each other in a circular shape, the impact of the rays on visibility can also be reduced. Therefore, the reduction in visibility caused by the rays can be suppressed more effectively. Furthermore, in Figure 10B In the example shown, the rate of increase of the combined line length of the first direction wiring 21 and the second direction wiring 22 relative to the aforementioned polygon can also be reduced, thus suppressing the increase in the resistance value of the mesh wiring layer 20. Furthermore, since the rate of increase in line length can be reduced, the decrease in the aperture ratio of the mesh wiring layer 20 can be suppressed. Additionally, in Figure 10B In the example shown, it is also possible to prevent the line length of the first-direction wiring 21 and the line length of the second-direction wiring 22 from becoming excessively long, thereby reducing the risk of breakage of the first-direction wiring 21 and the second-direction wiring 22. Furthermore, it is possible to improve the patterning accuracy and dimensional stability of the first-direction wiring 21 and the second-direction wiring 22 during fabrication. Therefore, it is possible to improve the productivity of the wiring substrate 10.

[0138] Figure 11 A third modified example of the wiring substrate 10 is shown. Figure 11 The variant shown differs from the one described above in that one side of the rhombus S2 is composed of 4 (N=2) chords; otherwise, the structure is the same. Figures 1 to 10B The shapes shown are roughly the same. Figure 11 In the middle, to and Figures 1 to 10B Parts with the same shape are labeled with the same number and detailed descriptions are omitted.

[0139] exist Figure 11In the wiring substrate 10 shown, one side of the rhombus S2 is composed of 4 chords (N=2). Therefore, the dividing points that divide one side into 4 (N=2) are the first dividing point DiP1, the second dividing point DiP2, and the third dividing point DiP3. Among them, the second dividing point DiP2 is the midpoint of the side. In addition, the connection points between the chords on one side are the first connection point CP1, the second connection point CP2, and the third connection point CP3.

[0140] In this variation, such as Figure 11 As shown by the imaginary line (double-dotted line), on one side of rhombus S2, the shortest distance D from the first dividing point DiP1 to the first connecting point CP1 is... p3 It can also be less than 0.05 times the length of one side (N=2). Additionally, on one side of rhombus S2, the shortest distance D from the second dividing point DiP2 to the second connecting point CP2 is... p4 It can also be less than 0.05 times the length of one side (N=2). Furthermore, on one side of rhombus S2, the shortest distance D from the third dividing point DiP3 to the third connecting point CP3 is... p5 It can also be less than 0.05 times the length of one side (N=2). Even when the first direction wiring 21 and the second direction wiring 22 are in the form of an arc connecting the two sides that satisfies the above relationship, a substantially complete circle can be formed by joining the first direction wiring 21 and the second direction wiring 22 surrounding the opening 23. Furthermore, Figure 11 The imaginary line is a curve formed by connecting four circular arcs. It is the curve when the first connection point CP1 is not the first dividing point DiP1, the second connection point CP2 is not the second dividing point DiP2, and the third connection point CP3 is not the third dividing point DiP3.

[0141] like Figure 11 As shown, the diameters of the circles C5 and C6, from which the arcs are cut, are 0.25 times the length of one side of rhombus S2. Furthermore, on one side of rhombus S2 formed by lines L1 and L2, the first connection point CP1 is located at the first dividing point DiP1, the second connection point CP2 is located at the second dividing point DiP2 (the midpoint of one side), and the third connection point CP3 is located at the third dividing point DiP3.

[0142] In this variation, such as Figure 11 As shown, on one side of rhombus S2, the shortest distance D from the first dividing point DiP1 to the first connecting point CP1 is... p3 It is less than 0.05 times the length of one side (N=2). Additionally, on one side of rhombus S2, the shortest distance D from the second dividing point DiP2 to the second connecting point CP2 is... p4It is less than 0.05 times the length of one side (N=2). Furthermore, on one side of rhombus S2, the shortest distance D from the third dividing point DiP3 to the third connecting point CP3 is... p5 The length of one side is less than 0.05 times (N=2). In this case, by joining the first direction wiring 21 and the second direction wiring 22 surrounding the opening 23, multiple complete circles can also be formed. In this case, by making multiple rays overlap each other in a circular shape, the influence of the rays on visibility can also be reduced. Therefore, the reduction in visibility caused by the rays can be suppressed more effectively.

[0143] Figure 12A A fourth modified example of the wiring substrate 10 is shown. Figure 12A The difference in the variant shown is that in the first direction wiring 21, the second direction wiring 22, and the third direction wiring 24 surrounding the opening 23, the shape formed by connecting the ends of the chords of multiple curves is a regular hexagon; the other structures are the same as described above. Figures 1 to 11 The shapes shown are roughly the same. Figure 12A In the middle, to and Figures 1 to 11 Parts with the same shape are labeled with the same number and detailed descriptions are omitted.

[0144] exist Figure 12A In the wiring substrate 10 shown, the shape formed by connecting the ends of the chords of multiple curves to each other in the first-direction wiring 21, second-direction wiring 22, and third-direction wiring (wiring) 24 surrounding the opening 23 is a regular hexagon. In other words, the aforementioned polygon is a regular hexagon. In this case, the first-direction wiring 21 and the second-direction wiring 22 extend in directions that are not parallel to either the X or Y direction. On the other hand, the third-direction wiring 24 extends in the X direction. This reduces the resistance in the Y direction where current flows, thereby improving antenna characteristics. Furthermore, the third-direction wiring 24 connects the first-direction wiring 21 and the second-direction wiring 22, thus effectively suppressing breaks in the mesh wiring layer 20. Additionally, the third-direction wiring 24 can also extend in a direction that is not parallel to either the X or Y direction. Furthermore, the linewidth and height of the third-direction wiring 24, as well as the material constituting the third-direction wiring 24, can be the same as those of the first-direction wiring 21.

[0145] Furthermore, the first-direction wiring 21, the second-direction wiring 22, and the third-direction wiring 24 have a shape formed by connecting multiple arcs cut at a central angle of 160° or more and 200° or less. In this case, the diameter of the circle from which the arcs are cut can also be 0.4 times or more and 0.6 times or less the length of one side of a regular hexagon S3 formed by lines L1, L2, and L3. Additionally, as... Figure 12AAs shown by the imaginary line (double-dotted line), on one side of the regular hexagon S3 formed by lines L1, L2, and L3, the shortest distance D from the first dividing point DiP1 to the first connecting point CP1 is... p6 It can also be 0.1 times the length of one side or less (N=1). Even if the first direction wiring 21, the second direction wiring 22, and the third direction wiring 24 are in the shape of connecting arcs that satisfy the above relationship, a roughly complete circle can be formed by joining the first direction wiring 21, the second direction wiring 22, and the third direction wiring 24 surrounding the opening 23. Furthermore, Figure 12A The imaginary line is the curve formed by connecting two circular arcs, and it is the curve when the first connection point CP1 is not the midpoint of one side (the first dividing point DiP1).

[0146] In this variation, such as Figure 12A As shown, the first directional wiring 21 has a shape formed by connecting multiple arcs cut at a central angle θ7 of 180°. In this case, the diameter of the circle C7 with the cut arcs is 0.5 times the length of one side of the regular hexagon S3 formed by lines L1, L2, and L3. Furthermore, on one side of the regular hexagon S3 formed by lines L1, L2, and L3, the first connection point CP1 is located at the first dividing point DiP1 (the midpoint of one side). Similarly, the second directional wiring 22 has a shape formed by connecting multiple arcs cut at a central angle θ8 of 180°. In this case, the diameter of the circle C8 with the cut arcs is 0.5 times the length of one side of the regular hexagon S3 formed by lines L1, L2, and L3. Furthermore, on one side of the regular hexagon S3 formed by lines L1, L2, and L3, the first connection point CP1 is located at the first dividing point DiP1 (the midpoint of one side). Furthermore, the third-direction wiring 24 has a shape formed by connecting multiple arcs cut at a central angle θ9 of 180°. In this case, the diameter of the circle C9 where the arcs are cut is 0.5 times the length of one side of the regular hexagon S3 formed by lines L1, L2, and L3. Additionally, on one side of the regular hexagon S3 formed by lines L1, L2, and L3, the first connection point CP1 is located at the first dividing point DiP1 (the midpoint of one side). In this case, multiple complete circles can also be formed by joining the first-direction wiring 21, the second-direction wiring 22, and the third-direction wiring 24 surrounding the opening 23. In this case, by having multiple rays overlap in a circular shape, the impact of the rays on visibility can be reduced. Therefore, the reduction in visibility caused by the rays can be suppressed more effectively.

[0147] Furthermore, in this modified example, the shape (polygon) formed by connecting the ends of the chords of multiple curves to each other in the first-direction wiring 21, second-direction wiring 22, and third-direction wiring 24 surrounding the opening 23 is a regular hexagon. In this case, there are at most three wirings (first-direction wiring 21, second-direction wiring 22, and third-direction wiring 24) connected to the vertices of the polygon. Moreover, at the vertices of the polygon, the angle between the first-direction wiring 21, second-direction wiring 22, and third-direction wiring 24 is 120°, which is larger than when the polygon is a square. Therefore, near the vertices of the polygon, the patterning accuracy when manufacturing the first-direction wiring 21, second-direction wiring 22, and third-direction wiring 24, as well as the dimensional stability of the first-direction wiring 21, second-direction wiring 22, and third-direction wiring 24, can be improved. Therefore, the productivity of the wiring substrate 10 can be improved.

[0148] In addition, Figure 12A In the wiring substrate 10 shown, an example is illustrated where the first-direction wiring 21, the second-direction wiring 22, and the third-direction wiring 24 have a shape formed by connecting multiple arcs cut at a central angle of 160° or more and 200° or less, but this is not limited to this. For example, the first-direction wiring 21, the second-direction wiring 22, and the third-direction wiring 24 may also have a shape formed by connecting multiple arcs cut at a central angle of 80° or more and 100° or less. In this case, the diameter of the circle from which the arcs are cut may be 0.4 times or more and 0.6 times or less the length of one side of the regular hexagon S3 formed by lines L1, L2, and L3. Furthermore, as... Figure 12B As shown by the imaginary line (double-dotted line), on one side of the regular hexagon S3 formed by lines L1, L2, and L3, the shortest distance D from the first dividing point DiP1 to the first connecting point CP1 is... p6 It can also be less than 0.1 times the length of one side (N=1). Furthermore, Figure 12B The imaginary line is the curve formed by connecting two circular arcs, and it is the curve when the first connection point CP1 is not the midpoint of one side (the first dividing point DiP1).

[0149] In this variation, such as Figure 12BAs shown, the first directional wiring 21 has a shape formed by connecting multiple arcs cut at a central angle θ7 of 90°. In this case, the diameter of the circle C7 with the cut arcs is also 0.5 times the length of one side of the regular hexagon S3 formed by lines L1, L2, and L3. Furthermore, on one side of the regular hexagon S3 formed by lines L1, L2, and L3, the first connection point CP1 is located at the first dividing point DiP1 (the midpoint of one side). Similarly, the second directional wiring 22 has a shape formed by connecting multiple arcs cut at a central angle θ8 of 90°. In this case, the diameter of the circle C8 with the cut arcs is also 0.5 times the length of one side of the regular hexagon S3 formed by lines L1, L2, and L3. Furthermore, on one side of the regular hexagon S3 formed by lines L1, L2, and L3, the first connection point CP1 is located at the first dividing point DiP1 (the midpoint of one side). Furthermore, the third-party directional wiring 24 has a shape formed by connecting multiple arcs cut at a central angle θ9 of 90°. In this case, the diameter of the circle C9 where the arcs are cut is also 0.5 times the length of one side of the regular hexagon S3 formed by lines L1, L2, and L3. In addition, on one side of the regular hexagon S3 formed by lines L1, L2, and L3, the first connection point CP1 is located at the first dividing point DiP1 (the midpoint of one side).

[0150] exist Figure 12B In the example shown, multiple complete circles can also be formed by joining the first-direction wiring 21, the second-direction wiring 22, and the third-direction wiring 24 surrounding the opening 23. In this case, by having multiple rays overlap each other in a circular shape, the impact of the rays on visibility can also be reduced. Therefore, the reduction in visibility caused by the rays can be suppressed more effectively. Furthermore, in Figure 12B In the example shown, the rate of increase of the total line length of the first direction wiring 21, the second direction wiring 22, and the third direction wiring 24 relative to the aforementioned polygon can also be reduced, thereby suppressing the increase in the resistance value of the mesh wiring layer 20. Furthermore, since the rate of increase in the aforementioned line length can be reduced, the decrease in the aperture ratio of the mesh wiring layer 20 can be suppressed. Additionally, in Figure 12B In the example shown, the excessive lengths of the first-direction wiring 21, the second-direction wiring 22, and the third-direction wiring 24 can be prevented, thus reducing the risk of breakage of these wirings. Furthermore, the patterning accuracy and dimensional stability of the first-direction wiring 21, the second-direction wiring 22, and the third-direction wiring 24 can be improved during fabrication. Therefore, the productivity of the wiring substrate 10 can be increased.

[0151] Figure 13 The fifth modified example of the wiring substrate is shown. Figure 13 The variant shown differs in that the corners of the polygon are irregularly arranged; other structures are the same as those described above. Figures 1 to 12B The shapes shown are roughly the same. Figure 13 In the middle, to and Figures 1 to 12B Parts with the same shape are labeled with the same number and detailed descriptions are omitted.

[0152] exist Figure 13 In the wiring substrate 10 shown, the corners of the polygon S4 formed by straight lines L1 and L2 are irregularly arranged. That is, the straight line L1 connecting the ends of the chords of the first direction wiring 21 to each other and the straight line L2 connecting the ends of the chords of the second direction wiring 22 to each other are irregularly arranged. Specifically, the straight lines L1 are arranged parallel to each other with an irregular spacing P1. Similarly, the straight lines L2 are arranged parallel to each other with an irregular spacing P2. In this way, by making the spacing P1 of the straight lines L1 and the spacing P2 of the straight lines L2 irregular, the reduction in visibility caused by light rays can be suppressed. In addition, in this case, by joining the first direction wiring 21 and the second direction wiring 22 surrounding the opening 23, multiple complete circles can also be formed. In this case, by making multiple light rays overlap each other in a circular shape, the influence of light rays on visibility can also be reduced. Therefore, the reduction in visibility caused by light rays can be suppressed more effectively.

[0153] In addition, such as Figure 14 As shown, the polygon S5 formed by lines L1 and L2 can also be a quadrilateral with opposing sides that are not parallel to each other. In this case, the chords of the curve can also extend in a bent line shape. In other words, the connected chords can also extend in directions that are not parallel to each other. Furthermore, as... Figure 15 As shown, in the mesh wiring (wiring) 200 surrounding the opening 23, the shape formed by connecting the ends of the chords of multiple arcs (curves) to each other can also be a polygon S6, and the planar structure formed by the polygon S6 can also be a Voronoi pattern. In addition, the line width and height of the mesh wiring 200, as well as the material constituting the mesh wiring 200, can be the same as the first direction wiring 21.

[0154] Figure 16 and Figure 17 The illustration shows a sixth modified example of the wiring substrate. Figure 16 and Figure 17 The variant shown differs from the one described above in that a dummy wiring layer 30 is provided around the mesh wiring layer 20; otherwise, the structure is the same as described above. Figures 1 to 15 The shapes shown are roughly the same. Figure 16 and Figure 17 In the middle, to and Figures 1 to 15Parts with the same shape are labeled with the same number and detailed descriptions are omitted.

[0155] exist Figure 16 In the wiring substrate 10 shown, a dummy wiring layer 30 is provided around the grid wiring layer 20. This dummy wiring layer 30 is different from the grid wiring layer 20 and does not actually function as an antenna.

[0156] like Figure 17 As shown, the dummy wiring layer 30 is composed of repeated dummy wirings 30a having a predetermined pattern shape. That is, the dummy wiring layer 30 includes a plurality of dummy wirings 30a, each of which is electrically independent from the grid wiring layer 20 (first direction wiring 21 and second direction wiring 22). Furthermore, the plurality of dummy wirings 30a are regularly arranged throughout the entire area of ​​the dummy wiring layer 30. The plurality of dummy wirings 30a are separated from each other in the planar direction and are arranged protrudingly on the substrate 11. That is, each dummy wiring 30a is electrically independent from the grid wiring layer 20, the power supply section 40, and other dummy wirings 30a.

[0157] In this case, the dummy wiring 30a has a shape formed by a partial absence of the pattern shape of the aforementioned mesh wiring layer 20. Therefore, the difference between the mesh wiring layer 20 and the dummy wiring layer 30 is difficult to discern visually, and the mesh wiring layer 20 disposed on the substrate 11 is difficult to see. Figure 17 As shown, the dummy wiring 30a includes a first portion 31a formed by cutting off a portion of the first-direction wiring 21, and a second portion 32a formed by cutting off a portion of the second-direction wiring 22. Thus, the dummy wiring 30a is composed of the portion of the first-direction wiring 21 or the second-direction wiring 22 after a portion has been cut off, thereby making the mesh wiring layer 20 disposed on the substrate 11 more difficult to see. The aperture ratio of the dummy wiring layer 30 can be the same as or different from that of the mesh wiring layer 20, but is preferably close to the aperture ratio of the mesh wiring layer 20. Therefore, it is also possible to arrange copper wiring having the same shape as the missing portion at arbitrary positions within the region of the dummy wiring layer 30, without connecting the dummy wiring 30a. In this case, it is also possible to arrange copper wiring having the same area as the missing portion when viewed from above at arbitrary positions within the region of the dummy wiring layer 30, without connecting the dummy wiring 30a.

[0158] As in this variation, by providing a dummy wiring layer 30 that is electrically independent of the mesh wiring layer 20 around the mesh wiring layer 20, the outer edge of the mesh wiring layer 20 can be made unclear. As a result, the mesh wiring layer 20 is difficult to see on the surface of the HMD90, and the user of the HMD90 cannot easily identify the mesh wiring layer 20 with the naked eye.

[0159] Figure 18 and Figure 19 A seventh modified example of the wiring substrate is shown. Figure 18 and Figure 19 The difference in the variant shown is that multiple dummy wiring layers 30A and 30B with different aperture ratios are provided around the mesh wiring layer 20; the other structures are the same as described above. Figures 1 to 17 The shapes shown are roughly the same. Figure 18 and Figure 19 In the middle, to and Figures 1 to 17 Parts with the same shape are labeled with the same number and detailed descriptions are omitted.

[0160] exist Figure 18 In the wiring substrate 10 shown, multiple (in this case, two) dummy wiring layers 30A and 30B (first dummy wiring layer 30A and second dummy wiring layer 30B) with different aperture ratios are arranged around the grid wiring layer 20. Specifically, the first dummy wiring layer 30A is arranged around the grid wiring layer 20, and the second dummy wiring layer 30B is arranged around the first dummy wiring layer 30A. These dummy wiring layers 30A and 30B are different from the grid wiring layer 20 and do not actually function as antennas.

[0161] like Figure 19 As shown, the first dummy wiring layer 30A is formed by repeating dummy wirings 30a1 with a predetermined pattern shape. The second dummy wiring layer 30B is formed by repeating dummy wirings 30a2 with a predetermined pattern shape. That is, dummy wiring layers 30A and 30B each contain a plurality of dummy wirings 30a1 and 30a2, and each dummy wiring 30a1 and 30a2 is electrically independent from the grid wiring layer 20. The dummy wirings 30a1 and 30a2 are regularly arranged throughout the entire area of ​​the dummy wiring layers 30A and 30B, respectively. Each dummy wiring 30a1 and 30a2 is separated from each other in the planar direction and is prominently arranged on the substrate 11. Each dummy wiring 30a1 and 30a2 is electrically independent from the grid wiring layer 20, the power supply section 40, and other dummy wirings 30a1 and 30a2.

[0162] In this case, the dummy wirings 30a1 and 30a2 have shapes formed by a partial absence of the pattern shape of the aforementioned mesh wiring layer 20. Therefore, it is difficult to visually identify the difference between the mesh wiring layer 20 and the first dummy wiring layer 30A, and the difference between the first dummy wiring layer 30A and the second dummy wiring layer 30B, making the mesh wiring layer 20 disposed on the substrate 11 difficult to see. Figure 19As shown, the dummy wiring 30a1 includes a first portion 31a1 and a second portion 32a1. The first portion 31a1 has a shape formed by cutting off a portion of the first-direction wiring 21, and the second portion 32a1 has a shape formed by cutting off a portion of the second-direction wiring 22. The dummy wiring 30a2 includes: a first portion 31a2 formed by cutting off a portion of the first-direction wiring 21; and a second portion 32a2 formed by cutting off a portion of the second-direction wiring 22.

[0163] Furthermore, the area of ​​dummy wiring 30a1 in the first dummy wiring layer 30A is larger than the area of ​​dummy wiring 30a2 in the second dummy wiring layer 30B. In this case, the linewidth of each dummy wiring 30a1 is the same as the linewidth of each dummy wiring 30a2, but it is not limited to this; the linewidth of each dummy wiring 30a1 may also be larger than the linewidth of each dummy wiring 30a2.

[0164] In this modified example, it is preferable that the aperture ratios of the mesh routing layer 20 and the plurality of dummy routing layers 30A, 30B increase progressively from the mesh routing layer 20 toward the dummy routing layers 30A, 30B farther from the mesh routing layer 20. In other words, the aperture ratio of each dummy routing layer preferably increases gradually from the dummy routing layer closer to the mesh routing layer 20 toward the dummy routing layer farther from the mesh routing layer 20. In this case, the aperture ratio of the first dummy routing layer 30A is preferably larger than that of the mesh routing layer 20. The aperture ratio of the second dummy routing layer 30B is preferably larger than that of the first dummy routing layer 30A. As a result, the outer edges of the mesh routing layer 20 and the dummy routing layers 30A, 30B can be made less distinct. Therefore, the mesh routing layer 20 is more difficult to see on the surface of the HMD90.

[0165] In this way, by configuring dummy routing layers 30A and 30B that are electrically independent of the mesh routing layer 20, the outer edge of the mesh routing layer 20 can be made less distinct. Therefore, the mesh routing layer 20 is difficult to see on the surface of the HMD90, making it difficult for HMD90 users to visually identify it. Alternatively, three or more dummy routing layers with different aperture ratios can be set around the mesh routing layer 20.

[0166] The constituent elements disclosed in the above embodiments and variations can also be appropriately combined as needed. Alternatively, several constituent elements can be deleted from all the constituent elements shown in the above embodiments and variations.

Claims

1. A wiring substrate comprising: A transparent substrate; and A mesh wiring layer disposed on the substrate, The wiring substrate has electromagnetic wave transceiver function. The mesh wiring layer is configured as a transceiver for electromagnetic waves and has wiring. The planar shape of the wiring is formed by connecting multiple curves. The curve is a circular arc or an elliptical arc. The wiring has: a first-direction wiring that extends in a first direction; Second-direction wiring extends in a second direction different from the first direction; And third-party directional wiring, which extends upward in a third direction that is not parallel to either the first or the second direction. An opening is formed by being surrounded by the first direction wiring, the second direction wiring, and the third direction wiring. In the wiring surrounding the opening, the shape formed by connecting the ends of the chords of multiple curves to each other is hexagonal. One side of the hexagon is composed of 2N chords, where N is a natural number greater than 1. On the stated side, the Mth dividing point, counting from one end of the side, is selected from the 2N equal division points of the side, where M is a natural number greater than 1 and less than 2N-1. On one side, the Mth connection point among the connection points of the strings, counting from one end of that side, is designated as the Mth connection point. at this time, The distance from the Mth dividing point to the Mth connecting point is less than 0.1 / N times the length of one side.

2. The wiring substrate according to claim 1, wherein, The aperture ratio of the mesh wiring layer is above 94%.

3. The wiring substrate according to claim 1, wherein, The wiring has a shape formed by connecting multiple arcs cut at a central angle of 160° or more and 200° or less.

4. The wiring substrate according to claim 3, wherein, Multiple openings are formed. The corners of the hexagon are irregularly arranged.

5. The wiring substrate according to claim 3, wherein, The hexagon is a regular hexagon.

6. The wiring substrate according to claim 1, wherein, The wiring has a shape formed by connecting multiple arcs cut at a central angle of 80° or more and 100° or less.

7. The wiring substrate according to claim 6, wherein, Multiple openings are formed. The corners of the hexagon are irregularly arranged.

8. The wiring substrate according to claim 6, wherein, The hexagon is a regular hexagon.

9. The wiring substrate according to claim 1, wherein, The curve is an arc cut at a central angle of 90° or 180°.

10. The wiring substrate according to claim 1, wherein, N is 1.

11. The wiring substrate according to claim 1, wherein, The wiring substrate has radio wave transceiver capabilities at frequencies above 1 GHz.

12. The wiring substrate according to claim 1, wherein, The mesh wiring layer has electromagnetic wave shielding function.

13. The wiring substrate according to claim 1, wherein, When the wiring substrate is bent 180° around a cylinder with a diameter of 1 mm and then stretched 10 times, the increase in resistance of the mesh wiring layer is less than 10%.

14. The wiring substrate according to claim 1, wherein, A dummy wiring layer, electrically independent of the mesh wiring layer, is provided around the mesh wiring layer.

15. The wiring substrate according to claim 14, wherein, Multiple dummy routing layers are provided, and the aperture ratio of the mesh routing layer and the aperture ratio of the dummy routing layer increase in stages from the mesh routing layer toward the dummy routing layer away from the mesh routing layer.

16. A head-mounted display, comprising: Framework; and A transparent display device mounted on the frame. The display device has: First substrate; The wiring substrate according to any one of claims 1 to 15 is disposed on the first substrate; as well as The display unit is disposed between the first substrate and the wiring substrate.

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