Connector

Abstract

The invention provides a connector capable of ensuring shielding property equivalent to that of a rear surface opening of an outer conductor closed by a shielding member. The interior of the outer conductor is provided with a rear space part at a position closer to the rear than a storage hole for storing each dielectric body, and the rear space part is opened to the rear of the outer conductor. Each inner conductor has a substrate connection portion. In each of the inner conductors, the substrate connection portion of the first inner conductor is configured as a front substrate connection portion, and the substrate connection portion of the second inner conductor is configured as a rear substrate connection portion disposed rearward of the front substrate connection portion. The rear substrate connection portion faces the rear space portion. The shield member is disposed between the front substrate connection portion and the rear substrate connection portion in the front-rear direction. The separation distance in the front-rear direction from the rear substrate connection portion to the rear end of the outer conductor is greater than four times the separation distance in the front-rear direction from the front substrate connection portion to the shield member.

Description

Technical Field

[0001] This invention relates to connectors. Background Technology

[0002] The connector described in Patent Document 1 comprises a housing, a shielding shell, front and rear partitions, an outer terminal, a guide sleeve, and an inner terminal. The housing is fitted into the opposite housing. The shielding shell is die-cast and has an upper wall, a pair of side walls, a front wall, left and right partitions, and a middle wall. The shielding shell is open to the rear and downward. The front and rear partitions are rectangular flat metal plates. The front and rear partitions are assembled to the shielding shell, dividing the internal space of the shielding shell into a rear side and a front side. The outer terminal is a metal plate, cylindrical in shape, and is inserted into a terminal receiving hole in the housing. The guide sleeve is made of resin and has a sleeve body extending in the front-rear direction (referred to as the "body" in Patent Document 1) and a sleeve hanging portion extending downward from the rear end of the sleeve body (referred to as the "hanging portion" in Patent Document 1). The guide sleeve has a large guide sleeve (guide sleeve 50A) and a small guide sleeve (guide sleeve 50B). The sleeve body of the large guide sleeve is inserted into the upper outer terminal. A small guide sleeve's main body is inserted into the lower outer terminal. The inner terminal has a rod-shaped terminal main body (referred to as "main body" in Patent Document 1) extending in the front-to-back direction and a rod-shaped terminal droop (referred to as "droop" in Patent Document 1) extending downward from the rear end of the terminal main body. The terminal main body is inserted into the sleeve main body. The terminal droop is configured to contact the sleeve droop from the rear. The top end of the terminal droop is inserted into a through hole in the circuit board and soldered to the conductor pattern of the circuit board. The respective terminal droops on the front and rear sides are respectively disposed in the front and rear spaces separated by front and rear partitions within the internal space of the shielding shell. Patent Documents 2 and 3 also disclose shielded connectors mounted on circuit boards, but they do not have a structure equivalent to the aforementioned front and rear partitions. Existing technical documents Patent documents

[0003] Patent Document 1: Japanese Patent Application Publication No. 2023-8309 Patent Document 2: Japanese Patent Application Publication No. 2022-83728 Patent Document 3: Japanese Patent Application Publication No. 2020-109738 Summary of the Invention The problem that the invention aims to solve

[0004] In the case of Patent Document 1, the rear end position of the shielding shell, i.e., the rear end positions of the upper wall and each side wall, is located further rearward than the rear terminal droop. Therefore, it is presumed that even if the rear of the rear terminal droop is open, shielding (noise shielding) can be ensured within an acceptable range. However, compared with the separation distance in the front-to-back direction from the front terminal droop to the shielding member, the separation distance in the front-to-back direction from the rear terminal droop to the rear end position of the shielding shell is small, so it is presumed that shielding performance equivalent to that of the shielding shell with the rear surface opening closed cannot be ensured. In contrast, for example, the rear surface opening of the shielding shell can be closed with the shielding member, but there is a problem that the number of parts increases accordingly with the installation of the shielding member.

[0005] Therefore, the object of the present invention is to provide a connector that can ensure the same shielding as the shielding member blocking the opening on the rear surface of the outer conductor. Solution for solving the problem

[0006] The connector of the present invention comprises a plurality of inner conductors, a plurality of dielectric bodies housing the plurality of inner conductors, an outer conductor housing the plurality of dielectric bodies, and a plate-shaped shielding member. The outer conductor has a rear space portion located behind the housing holes housing the plurality of dielectric bodies. The rear space portion opens to the rear of the outer conductor. Each of the plurality of inner conductors has a substrate connection portion extending downward from the rear surface of the corresponding dielectric body. Among the plurality of inner conductors, the substrate connection portion of a portion of the inner conductors is configured as a front substrate connection portion, and the substrate connection portion of another portion of the inner conductors is configured as a rear substrate connection portion disposed behind the front substrate connection portion. The rear substrate connection portion faces the rear space portion. The shielding member is disposed between the front substrate connection portion and the rear substrate connection portion in the front-rear direction. The front-rear separation distance from the rear substrate connection portion to the rear end of the outer conductor is greater than four times the front-rear separation distance from the front substrate connection portion to the shielding member in the front-rear direction. Invention Effects

[0007] According to the present invention, a connector is provided that can ensure shielding equivalent to the shielding of the rear surface opening of the outer conductor being closed by a shielding member. Attached Figure Description

[0008] Figure 1 This is a side cross-sectional view showing the state of the connector of Embodiment 1 being mounted on the circuit board. Figure 2 This is an exploded perspective view of the connector according to Embodiment 1. Figure 3 This is a perspective view of the connector of Embodiment 1 viewed from a lower rear angle. Figure 4This is a bottom view showing an enlarged view of the structure of the lower surface side of the outer conductor in the connector of Embodiment 1. Figure 5 This is a rear view of the housing in the connector according to Embodiment 1. Figure 6 This is a front view of the outer conductor in the connector of embodiment 1. Figure 7 This is a bottom view of the outer conductor in the connector of embodiment 1. Figure 8 This is a rear view of the outer conductor in the connector of embodiment 1. Figure 9 In the connector of embodiment 1 Figure 8 A sectional view along line AA. Figure 10 This is a cross-sectional view showing the state in which the guide portion of the connector in Embodiment 1 contacts the inner surface of the receiving hole. Figure 11 This is a magnified transverse cross-sectional view showing the state in which the guide portion is inserted into the guide receiving portion and the protrusion is embedded in the recess during the assembly of the dielectric body relative to the outer conductor in the connector of Embodiment 1. Figure 12 This is a partially cross-sectional side view showing the state in which the guide portion is inserted into the guide receiving portion and the protrusion is embedded in the recess during the assembly of the dielectric body relative to the outer conductor in the connector of Embodiment 1. Detailed Implementation

[0009] [Description of embodiments of the present invention] First, embodiments of the present invention will be described. The connector of the present invention, (1) A device comprising a plurality of inner conductors, a plurality of dielectric bodies housing the plurality of inner conductors, an outer conductor housing the plurality of dielectric bodies, and a plate-shaped shielding member, wherein the outer conductor has a rear space portion located behind the housing hole housing the plurality of dielectric bodies, the rear space portion opening to the rear of the outer conductor, and each of the plurality of inner conductors having a substrate connection portion extending downward from the rear surface of the corresponding dielectric body, wherein in the plurality of inner conductors, the substrate connection portion of a portion of the inner conductors is configured as a front substrate connection portion, and the substrate connection portion of another portion of the inner conductors is configured as a rear substrate connection portion disposed behind the front substrate connection portion, the rear substrate connection portion facing the rear space portion, and the shielding member being disposed between the front substrate connection portion and the rear substrate connection portion in the front-rear direction, wherein the front-rear separation distance from the rear substrate connection portion to the rear end of the outer conductor is greater than 4 times the front-rear separation distance from the front substrate connection portion to the shielding member in the front-rear direction.

[0010] In this way, the separation distance in the front-to-back direction from the rear substrate connection to the rear end of the outer conductor is more than four times the separation distance in the front-to-back direction from the front substrate connection to the shielding member. As a result, the shielding performance of the outer conductor can be adjusted to be the same as when the rear surface opening of the outer conductor is closed by the shielding member (hereinafter referred to as "back surface shielding equivalent shielding"). Therefore, it is not necessary to provide a shielding member that closes the rear surface opening further rear than the rear substrate connection. Accordingly, the number of parts can be reduced, and the cost can be kept low.

[0011] (2) In the connector described in (1) above, it is preferable that the connector has a housing for mounting the outer conductor, the outer conductor protruding rearward from the housing, and the separation distance in the front-rear direction from the rear end of the shielding member to the rear end of the outer conductor is greater than the separation distance in the front-rear direction from the front end of the shielding member to the front end of the outer conductor. If it is the structure described in (2) above, in addition to making it easy to adjust the shielding of the outer conductor to be equal to the shielding of the rear surface, it is also easy to set the center of gravity of the connector on the side where the outer conductor is located. Therefore, for example, when the connector is mounted on the circuit board, the stability of the connector's posture can be ensured.

[0012] (3) In the connector described in (1) or (2) above, it is preferable that the separation distance in the front-rear direction from the rear substrate connection portion to the rear end of the outer conductor is greater than 6 times the separation distance in the front-rear direction from the front substrate connection portion to the shielding member. Based on the structure described in (3) above, the shielding of the outer conductor can be reliably set to the same level of shielding as the rear surface shielding.

[0013] (4) In the connector described in (3) above, it is preferable that the separation distance in the front-rear direction from the rear substrate connection portion to the rear end of the outer conductor is greater than 6 times and less than 7 times the separation distance in the front-rear direction from the front substrate connection portion to the shielding member. According to the structure described in (4) above, the outer conductor can achieve the same shielding performance as the rear surface shielding by not exceeding the necessary amount in the front-back direction.

[0014] [Detailed Description of Embodiments of the Invention] Specific examples of the invention will now be described with reference to the accompanying drawings. Furthermore, the invention is not limited to these examples, but is intended to include all modifications within the meaning and scope of the claims, as shown by the claims.

[0015] <Implementation Method 1> like Figure 1As shown, the connector 10 in this embodiment 1 is a board connector mounted on the circuit board 100, and is a shielded connector having an outer conductor 11, which has a shielding function. Figure 1 and Figure 2 As shown, connector 10 is configured to include, in addition to outer conductor 11, housing 12, grounding member 13, inner conductors 14 and 15, dielectric body 16 and 17, shielding member 18, and outer conductor tube 19. Connector 10 is mated with a counterpart connector (not shown). Figure 1 As shown, inner conductors 14 and 15 are housed within dielectric bodies 16 and 17. Dielectric bodies 16 and 17 are housed within outer conductor 11 and outer conductor tube 19, respectively. Grounding member 13 is mounted on housing 12. Shielding member 18 is mounted on outer conductor 11. Furthermore, in the following description, regarding the front-to-back direction, the side where connector 10 engages with the other connector is considered the front side. In the vertical direction, the side where connector 10 is mounted relative to circuit board 100 is considered the upper side. Figure 1 and Figure 2 In the accompanying drawings, the reference numerals X, Y, and Z represent forward, right, and upward, respectively. These directional references are for convenience and may not necessarily correspond to the directional references when the connector 10 is mounted on a vehicle (not shown) or similar vehicle.

[0016] (Shell 12) The casing 12 is made of synthetic resin, such as Figure 2 As shown, it has a rectangular shape overall. Figure 1 As shown, the housing 12 has a base wall 21 with its surface facing forward and backward, and a cylindrical cover 22 protruding forward from the base wall 21. Multiple insertion holes 23 are formed through the base wall 21 in the forward and backward direction. Figure 5 As shown, each insertion hole 23 is divided into two layers and two rows on the base wall 21, forming a total of four holes. In rear view, each insertion hole 23 is formed with a hexagonal opening shape (cross-sectional shape) that is nearly circular at the apex. The outer conductor tube 19 is inserted into the insertion hole 23 from the front. Figure 1 As shown, a plurality of protruding rings 24 are formed on the front surface of the base wall 21, and the plurality of protruding rings 24 protrude into the interior of the cover portion 22. The front end of each insertion hole 23 is formed inside the protruding ring 24.

[0017] like Figure 5 As shown, a fitting recess 25 is recessed on the rear surface of the base wall 21. Each insertion hole 23 opens on the inner bottom surface of the fitting recess 25. On the inner circumferential surface of the fitting recess 25 of the base wall 21, there are multiple recesses 26 spaced apart along the circumferential direction. Each recess 26 has two on each of the top, bottom, left, and right sides of the inner circumferential surface of the fitting recess 25. The fitting protrusion 56 of the outer conductor 11 (described later) is fitted into the fitting recess 25. Each protrusion 57 of the outer conductor 11 (described later) is fitted into each recess 26.

[0018] like Figure 1 and Figure 2 As shown, the base wall 21 has an upward-facing end face 27 between its upper end and the portion having the fitting recess 25. Although not shown in detail, the upward-facing end face 27 of the base wall 21 has an opening for mounting a grounding member 13. The mounting groove 28 is formed as a slit shape extending in the left-right direction when viewed from above. The lower end of the mounting groove 28 opens into the inner peripheral surface of the fitting recess 25.

[0019] (Grounding component 13) The grounding component 13 is made of a conductive metal plate. For example... Figure 2 As shown, the grounding member 13 has a flat mounting portion 31 with the plate surface facing the front-rear direction and multiple elastic contact portions 32 that can elastically deform. The multiple elastic contact portions 32 contact the wall surface of a metal enclosure (grounding member) (not shown). Furthermore, the grounding member 13 has a connecting portion 33 extending from the upper end of the mounting portion 31 to the root of each elastic contact portion 32. The connecting portion 33 is flat with the plate surface facing the vertical direction. Figure 1 As shown, the connecting part 33 is mounted on the upper surface of the housing 12. The mounting part 31 is inserted from above into the mounting groove 28 that holds the housing 12 in place. Figure 2 As shown, a pair of left and right protrusions 34 are formed at the lower end of the mounting portion 31. When the mounting portion 31 is inserted into the mounting groove 28, each protrusion 34 is positioned in the fitting recess 25 and contacts the outer conductor tube 19.

[0020] (Inner conductors 14, 15) Inner conductors 14 and 15 are conductive metal components (metal wires), formed in the shape of pins or anode plates. For example... Figure 1 and Figure 2 As shown, the inner conductors 14 and 15 have a counter-connection portion 37 extending in the front-rear direction and substrate connection portions 35 and 36 extending downward from the rear end of the counter-connection portion 37. The inner conductors 14 and 15 are L-shaped in side view. In this embodiment 1, the inner conductor is composed of a first inner conductor 14 and a second inner conductor 15, which is shorter than the first inner conductor 14. The counter-connection portion 37 of the first inner conductor 14 is longer than the counter-connection portion 37 of the second inner conductor 15 in the front-rear direction. The substrate connection portion of the first inner conductor 14 (the rear substrate connection portion 35 described later) is longer than the substrate connection portion of the second inner conductor 15 (the front substrate connection portion 36 described later) in the vertical direction.

[0021] like Figure 1As shown, in the assembled state where the inner conductors 14 and 15 are housed within the dielectric bodies 16 and 17, and the dielectric bodies 16 and 17 are housed within the outer conductor 11, the front end of the opposite connection portion 37 is configured to protrude into the interior of the cover portion 22. When the opposite connector is fitted into the interior of the cover portion 22, the front end of the opposite connection portion 37 contacts the opposite inner conductor (not shown) of the opposite connector, and the inner conductors 14 and 15 are connected to the opposite inner conductor.

[0022] In the assembled state described above, the substrate connection portion (rear substrate connection portion 35) of the first inner conductor 14 is located rearward than the substrate connection portion (front substrate connection portion 36) of the second inner conductor 15. Furthermore, in the following description, the substrate connection portion of the first inner conductor 14 will be referred to as the "rear substrate connection portion 35", and the substrate connection portion of the second inner conductor 15 will be referred to as the "front substrate connection portion 36".

[0023] The rear substrate connecting portion 35 is generally shaped to extend in the vertical direction. The rear substrate connecting portion 35 has a plate-shaped rear wide portion 38 that faces the plate surface in the left and right direction, and a pin-shaped rear substrate connecting body portion 39 that protrudes downward from the lower rear end of the rear wide portion 38.

[0024] The front substrate connecting portion 36 is also generally shaped to extend vertically. The front substrate connecting portion 36 has a wide front portion 41 that directs the board surface to the left and right directions, and a pin-shaped front substrate connecting body portion 42 that protrudes downward from the lower rear end of the wide front portion 41. (As...) Figure 1 As shown, the rear substrate connecting main body 39 and the front substrate connecting main body 42 are both inserted into the corresponding through holes 110 of the circuit board 100 and soldered to a conductive part (not shown) formed on the circuit board 100.

[0025] (Dielectrics 16, 17) like Figure 1 As shown, dielectrics 16 and 17 are insulating synthetic resin materials, located between the inner conductors 14 and 15 and the outer conductor 11, serving to maintain the inner conductors 14 and 15 and the outer conductor 11 in an insulating state. Figure 2 As shown, dielectric bodies 16 and 17 have a cylindrical portion 43 extending in the front-to-back direction and a prismatic lead-out portion 44 extending downward from the rear end of the cylindrical portion 43. The dielectric bodies 16 and 17 are L-shaped in side view. An insertion recess 46 extending in the vertical direction is opened on the rear surface of the lead-out portion 44.

[0026] like Figure 2 As shown, guide portions 45 are formed on the left and right end faces of the lead-out portion 44 of the second dielectric body 17, which will be described later. Figure 12As shown, the guide portion 45 has a rib shape extending in the front-rear direction and is formed throughout the entire length of the lead-out portion 44 in the front-rear direction. Figure 11 As shown, the cross-sectional shape of the guide portion 45 (the shape cut off along a direction orthogonal to the front-back direction) is curved. A pair of guide portions 45 are formed at intervals along the vertical direction on the left and right end faces of the lead-out portion 44. (See diagram) Figure 2 As shown, retaining portions 81 in the shape of ribs corresponding to each guide portion 45 are formed on the left and right end faces of the lead-out portion 44 of the first dielectric body 16 described later. Furthermore, a pair of left and right recesses 47 are formed at the lower ends of the left and right end faces of the lead-out portion 44. Each recess 47 is a groove shape extending in the front-rear direction and is open at the front and rear surfaces of the lower end of the lead-out portion 44. In the case of this embodiment 1, as... Figure 10 As shown, each recess 47 is formed by cutting off the lower corners of the left and right sides of the lead-out portion 44, and the cross-section is square concave.

[0027] The dielectric body is composed of a first dielectric body 16 and a second dielectric body 17, which is shorter than the first dielectric body 16. The cylindrical portion 43 of the first dielectric body 16 is longer than the cylindrical portion 43 of the second dielectric body 17 in the front-to-back direction. The lead-out portion 44 of the first dielectric body 16 is longer than the lead-out portion 44 of the second dielectric body 17 in the vertical direction.

[0028] The opposite connection portion 37 of the first inner conductor 14 is inserted into the interior of the cylindrical portion 43 of the first dielectric body 16 from the rear, and the front end protrudes from the front end of the cylindrical portion 43 into the interior of the cover portion 22. Similarly, the opposite connection portion 37 of the second inner conductor 15 is inserted into the interior of the cylindrical portion 43 of the second dielectric body 17 from the rear, and the front end protrudes from the front end of the cylindrical portion 43 into the interior of the cover portion 22.

[0029] The rear wide portion 38 of the first inner conductor 14 is inserted from the rear into the insertion recess 46 of the lead-out portion 44 of the first dielectric body 16. For example... Figure 1 As shown, the rear substrate connecting body 39 of the first inner conductor 14 protrudes downward from the insertion recess 46 of the lead-out portion 44 of the first dielectric body 16 and is inserted into the corresponding through hole 110. The front wide portion 41 of the second inner conductor 15 is inserted from the rear into the insertion recess 46 of the lead-out portion 44 of the second dielectric body 17. The front substrate connecting body 42 of the second inner conductor 15 protrudes downward from the insertion recess 46 of the lead-out portion 44 of the second dielectric body 17 and is inserted into the corresponding through hole 110.

[0030] like Figure 4 As shown, the center of the axis of the rear substrate connecting main body 39 of the first inner conductor 14 and the center of the axis of the front substrate connecting main body 42 of the second inner conductor 15 are located at the front and rear center of the insertion recess 46 when viewed from below in the assembled state.

[0031] (Shielding component 18) The shielding component 18 is a conductive metal plate. For example... Figure 2 As shown, the shielding member 18 is a rectangular flat plate, with its surface facing forward and backward. Figure 1 and Figure 4 As shown, the shielding member 18, when assembled to the outer conductor 11, is disposed between the lead-out portions 44 of the first dielectric body 16 and the second dielectric body 17. The shielding member 18 is disposed rearward of the front substrate connection portion 36 disposed on the lead-out portion 44 of the second dielectric body 17. This shielding member 18 ensures shielding behind the first inner conductor 14.

[0032] (Outer conductor tube 19) The outer conductor tube 19 is made of a conductive metal sheet, formed by bending (stamping) the metal sheet into a cylindrical shape. For example... Figure 2 As shown, the outer conductor tube 19 has a through hole 48 extending in the front-to-back direction. The front portion 49 of the outer conductor tube 19 is formed with a larger diameter than the rear portion 51. The outer conductor tube 19 has a radially stepped portion 52 between the front portion 49 and the rear portion 51. The rear portion 51 of the outer conductor tube 19 is inserted from the front into the insertion hole 23 of the housing 12 and held in the housing 12. Figure 1 As shown, the stepped portion 52 abuts against the front end of the protruding ring portion 24 of the housing 12, preventing the outer conductor tube 19 from falling off the housing 12 rearward. In this embodiment 1, a total of four outer conductor tubes 19 are provided so that they can be inserted into each of the four insertion holes 23. The shapes of each outer conductor tube 19 are the same.

[0033] (Outer conductor 11) The outer conductor 11 is a conductive rigid body made of die-cast zinc alloy, aluminum alloy, or other cast materials. For example... Figure 2 As shown, the front, rear, upper, lower, and left and right sides of the outer conductor 11 each have a quadrilateral shape. Multiple receiving holes 54 and 63 are formed inside the outer conductor 11. Figure 6 and Figure 9 As shown, the receiving hole has a main body hole 54 extending in the front-to-back direction with a circular opening shape (cross-sectional shape). The main body holes 54 are divided into upper and lower layers and left and right rows in the outer conductor 11, forming a total of four. Figure 9 As shown, the front end of each main hole 54 opens on the front surface of the outer conductor 11, and the rear end communicates with the rear space portion 55 described later. Figure 1 As shown, the cylindrical portion 43 of the corresponding dielectric bodies 16 and 17 is inserted from the rear and housed in the main body hole 54.

[0034] like Figure 6As shown, a fitting protrusion 56 is formed protruding from the front surface of the outer conductor 11. The fitting protrusion 56 is a quadrilateral with rounded corners in its main view. The front surface of the fitting protrusion 56 is arranged along the vertical and horizontal directions. Each main body hole 54 opens on the front surface of the fitting protrusion 56. Multiple protrusions 57 are formed on the outer peripheral surface of the fitting protrusion 56. Each protrusion 57 is quadrilateral in its main view, and two protrudes from the upper surface, lower surface, and left and right sides of the fitting protrusion 56, respectively. Figure 7 As shown, each protrusion 57 on the left and right sides has a locking claw 59. The locking claw 59 protrudes shortly to the left and right sides from the top end of the protrusion 57 in the protruding direction.

[0035] like Figure 9 As shown, in each main body hole 54, the rear end of the upper main body hole 54 is disposed inside the outer conductor 11 at or near the front-rear center of the outer conductor 11. The rear end of the lower main body hole 54 is disposed inside the outer conductor 11 at a position corresponding to the front-rear center of the upper main body hole 54. The upper main body hole 54 houses the cylindrical portion 43 of the first dielectric body 16. The lower main body hole 54 houses the cylindrical portion 43 of the second dielectric body 17.

[0036] Inside the outer conductor 11, a fitting hole 63 is formed as part of a receiving hole. The fitting hole 63 intersects the rear end of the lower main body hole 54 and extends downward from the lower main body hole 54. Furthermore, the fitting hole 63 opens on the lower surface of the outer conductor 11 and, like the main body hole 54, is formed in pairs on the left and right sides separated by the partition wall portion 65 described later. Figure 10 As shown, the lead-out portion 44 of the second dielectric body 17 is inserted into the fitting hole 63 from the rear. (As indicated...) Figure 1 As shown, the inner front surface of the fitting hole 63 (the surface facing rearward on the front side) is configured as the front stop surface 64 that abuts against the lead-out portion 44 of the second dielectric body 17.

[0037] like Figure 8 As shown, a partition wall 65 is formed inside the outer conductor 11. Adjacent main holes 54 in the left-right direction are separated in the middle by the partition wall 65. In addition, the left and right outer sides of each main hole 54 are defined by side wall portions 66 formed on the left and right sides of the outer conductor 11.

[0038] like Figure 9 As shown, a rear space 55 is formed inside the outer conductor 11, rearward of the main body hole 54 above it. The rear space 55 opens rearward via a rear surface opening 67 that opens on the rear surface of the outer conductor 11, and opens downward via a lower surface opening 68 that opens on the lower surface of the outer conductor 11. In the case of this embodiment 1, as... Figure 3 , Figure 4 , Figure 7 as well as Figure 8As shown, rear space portions 55 are formed in pairs inside the outer conductor 11 on the left and right sides隔着隔壁部65的左右两侧. That is, as Figure 8 shown, the periphery of each rear space portion 55 is defined by the upper wall portion 69, the side wall portion 66, and the partition wall portion 65 of the outer conductor 11. The outer periphery of the upper end portion of each rear space portion 55 is curved in an arch shape along the lower surface of the upper wall portion 69.

[0039] As Figure 9 shown, the front-rear length of the rear space portion 55 is the same as or longer than the front-rear length of the upper-layer main body hole 54. Further, as Figure 1 and Figure 4 shown, in the assembled state of the connector 10, the front-rear separation distance from the rear end of the front large-width portion 41 of the second inner conductor 15 (in the case of the first embodiment, the rearmost end of the front substrate connection portion 36) to the front end of the shielding member 18 (in the case of the first embodiment, the front plate surface of the shielding member 18) is set as LF, and the front-rear separation distance from the rear end of the rear large-width portion 38 of the first inner conductor 14 (in the case of the first embodiment, the rearmost end of the rear substrate connection portion 35) to the rear end of the outer conductor 11 (corresponding to the formation position of the rear surface opening portion 67, in the case of the first embodiment, the rearmost end of the side wall portion 66) is set as LR. In this case, it is set such that LR is greater than 4 times LF (4LF < LR). Preferably, it is set such that LR is greater than 5 times LF (5LF < LR). More preferably, it is set such that LR is greater than 6 times LF (6LF < LR). Further preferably, it is set such that LR is greater than 6 times LF and less than 7 times LF (6LF < LR < 7LF). In the case of the first embodiment, LR is sufficiently long with respect to LF, and thus the outer conductor 11 can ensure high shielding performance (shielding property).

[0040] As Figure 9 shown, the main body holes 54 adjacent in the vertical direction are separated in the middle by the shelf wall portion 71. As Figure 7 shown, a slit-shaped holding groove 72 extending in the left-right direction is formed inside the outer conductor 11 when viewed from above. The holding groove 72 is formed at a position corresponding to the rear end portion of the lower-layer main body hole 54 in the front-rear direction. The upper end portion of the holding groove 72 is recessed and provided on the lower surface of the rear end portion of the shelf wall portion 71. On the inner surfaces of the left and right side wall portions 66, the left and right end portions of the holding groove 72 are recessed and provided in a manner extending in the vertical direction. As Figure 1 and Figure 4 shown, the shielding member 18 is inserted and held in the holding groove 72 from below.

[0041] As Figure 8As shown, the inner surfaces of the sidewall portion 66 and the partition wall portion 65 each form opposing surfaces 73, separated by the rear space portion 55. A plurality of guide receiving portions 74 are formed on this opposing surface 73. Figure 3 and Figure 9 As shown, each guide receiving portion 74 is a groove shape extending in the front-rear direction on the opposing surface 73, with its front end communicating with the retaining groove 72 and its rear end opening rearward through the rear surface opening 67. Specifically, each guide receiving portion 74 is formed with the same front-rear length as the rear space portion 55. Figure 11 As shown, the cross-section of each guide receiving part 74 is a square concave shape that is longer in the vertical direction than in the horizontal direction. Additionally, as... Figure 8 As shown, each guide receiving portion 74 is paired at the same height in the vertical direction on the opposing surface 73, and is arranged with a gap in the vertical direction. Between the cylindrical portion 43 of the second dielectric body 17 and the lower body hole 54, as... Figure 11 As shown, the guide portion 45 can contact the guide receiving portion 74 to receive the second dielectric body 17.

[0042] like Figure 7 and Figure 8 As shown, protrusions 75 are formed in pairs at the lower rear end of the opposing surface 73 of the outer conductor 11. Figure 7 and Figure 9 As shown, each protrusion 75 is formed as a rib shape extending relatively shortly in the front-rear direction at the lower rear end of the opposing surface 73 of the outer conductor 11. Each protrusion 75 faces the rear surface opening 67 and the lower surface opening 68 respectively, thus narrowing the opening width in the left-right direction. The left-right separation distance (minimum opposing distance) of the paired protrusions 75 is less than the left-right thickness of the lower rear portion (including each protrusion 75) of the partition wall portion 65 and the side wall portion 66 respectively. By narrowing the opening width of the rear surface opening 67 and the lower surface opening 68 by each protrusion 75, for example, it can prevent the partition wall portion 65 or the side wall portion 66 from intruding into the rear space portion 55 during plating or transportation, thus avoiding the outer conductor 11 from tangling with each other. Each protrusion 75 is formed only at a position near the rear end of the opposing surface 73. The front end of each protrusion 75 is set at a position further rearward than the holding groove 72. Before each dielectric body 16, 17 is inserted into the corresponding main body hole 54, each protrusion 75 contacts the recess 47 of each dielectric body 16, 17 in an engaged state.

[0043] like Figure 3 , Figure 4 as well as Figure 7 As shown, four legs 77 protrude from the lower surface of the outer conductor 11 near the four corners. Each leg 77 is cylindrical, as shown in the figure. Figure 1 As shown, it is inserted into the mounting hole 120 formed on the circuit board 100 and fixed by soldering. Additionally, as... Figure 7As shown, a plurality of mounting portions 79 extending along the edge of the rear surface opening 67 are formed on the lower surface of the outer conductor 11. The lower end face of each mounting portion 79 is formed flat. The lower end face of each mounting portion 79 is face-to-face with the surface of the circuit board 100 and is soldered to a grounding conductive portion (not shown) formed on the circuit board 100.

[0044] (Function of connector 10) Next, an example of the assembly steps of connector 10 will be described. First, the rear portion 51 of each outer conductor tube 19 is inserted from the front into the insertion hole 23 of the base wall 21 of the housing 12, and each outer conductor tube 19 is held in the housing 12. Next, the grounding member 13 is inserted from above into the mounting groove 28 of the housing 12. Each protrusion 34 of the grounding member 13 contacts the outer peripheral surface of each outer conductor tube 19.

[0045] Next, the outer conductor 11 is assembled in the housing 12 by inserting the fitting protrusion 56 of the outer conductor 11 into the fitting recess 25 of the housing 12. Here, the rear portion 51 of the outer conductor tube 19 is fitted and held inside the main body holes 54 of the fitting protrusion 56 from the front. The outer conductor 11 is connected to a box (grounding member) (not shown) via the outer conductor tube 19 and the grounding member 13.

[0046] Furthermore, each protrusion 57 is embedded in each recess 26. Further, the locking claws 59 of each protrusion 57 on both the left and right sides engage with the inner surface of the corresponding recess 26. Thus, the outer conductor 11 is kept in a state where it is prevented from falling rearward relative to the housing 12.

[0047] Next, the second dielectric body 17 is inserted from the rear into the lower body hole 54 of the outer conductor 11. Here, compared to the first dielectric body 16, the second dielectric body 17 moves a longer distance within the rear space 55 before being inserted into the lower body hole 54, and must pass over the retaining groove 72 in the final stage of its movement. Therefore, it is sometimes difficult for the second dielectric body 17 to maintain a stable moving posture (insertion posture) during insertion into the lower body hole 54. However, in the case of this embodiment 1, when the lead-out portion 44 of the second dielectric body 17 is inserted into the rear space 55, as... Figure 11 and Figure 12As shown, each guide portion 45 of the second dielectric body 17 can slide (slide) on the inner surface of each guide receiving portion 74 while being embedded in each guide receiving portion 74 of the outer conductor 11, guiding the movement of the second dielectric body 17 toward the lower body hole 54. In particular, because the front-to-back length of each guide portion 45 is greater than the front-to-back width of the retaining groove 72, each guide portion 45 can pass through the retaining groove 72 without hooking onto the groove surface of the retaining groove 72. Therefore, the movement posture of the second dielectric body 17 is not easily deformed, and the cylindrical portion 43 of the second dielectric body 17 can be quickly and stably inserted into the lower body hole 54. Moreover, when the lead-out portion 44 of the second dielectric body 17 is inserted into the rear space portion 55, the second dielectric body 17 is supported by the protrusions 75 of the outer conductor 11 and the recesses 47 of the second dielectric body 17, thus reliably suppressing the deformation of the movement posture of the second dielectric body 17.

[0048] When the cylindrical portion 43 of the second dielectric body 17 is inserted into the lower main body hole 54 in its normal position, the front portion of the cylindrical portion 43 engages with the through hole 48 of the rear portion 51 of the outer conductor tube 19. Furthermore, the lead-out portion 44 of the second dielectric body 17 engages with the engagement hole 63, and the front surface of the lead-out portion 44 is configured to contact the front stop surface 64 of the engagement hole 63. Figure 11 As shown, each guide portion 45 of the second dielectric body 17 is pressed (including crushed) into the left and right inner end faces (inner surfaces) of the fitting hole 63 and tightly adheres to them. Thus, the second dielectric body 17 is stably held on the outer conductor 11.

[0049] Before and after the second dielectric body 17 is assembled to the outer conductor 11, the second inner conductor 15 is housed in the second dielectric body 17. The opposite connection portion 37 of the second inner conductor 15 is inserted into the interior of the cylindrical portion 43, and the front substrate connection portion 36 of the second inner conductor 15 is inserted into the insertion recess 46 of the lead-out portion 44 of the second dielectric body 17.

[0050] Next, the shielding member 18 is inserted from below into the retaining groove 72 of the outer conductor 11. The shielding member 18 is pressed into and held in the retaining groove 72 of the outer conductor 11. The front surface of the shielding member 18 is spaced rearward from the front wide portion 41 of the second inner conductor 15 and is face-to-face with the rear surface of the lead-out portion 44 of the second dielectric body 17. The rear surface of the shielding member 18 is positioned at the same front-rear position as the rear end of the shelf wall portion 71.

[0051] Next, the first dielectric body 16 is inserted from the rear into the body hole 54 of the upper layer of the outer conductor 11. (As...) Figure 1As shown, when the cylindrical portion 43 of the first dielectric body 16 is inserted into the upper main body hole 54 in a normal state, similar to the second dielectric body 17, the front portion of the cylindrical portion 43 is fitted into the through hole 48 of the rear portion 51 of the outer conductor tube 19. The lead-out portion 44 of the second dielectric body 17 is arranged at the front end portion of the rear space portion 55 so as to be in contact with the rear surface of the shielding member 18. Further, each holding portion 81 of the first dielectric body 16 is press-fitted (including crushed) into the opposing surface 73 of the outer conductor 11 and is in close contact therewith, and the first dielectric body 16 is held by the outer conductor 11. At the timing before and after the first dielectric body 16 is assembled to the outer conductor 11, the first inner conductor 14 is accommodated in the first dielectric body 16. The opposing connection portion 37 of the first inner conductor 14 is inserted into the inside of the cylindrical portion 43, and the rear substrate connection portion 35 of the first inner conductor 14 is inserted into the insertion recess 46 of the lead-out portion 44 of the first dielectric body 16. The front portion (portion in front of the insertion recess 46) of the lead-out portion 44 of the second dielectric body 17 is arranged in a sandwiched manner between the rear substrate connection portion 35 of the first inner conductor 14 and the shielding member 18.

[0052] Then, each leg portion 77 is inserted into each fixing hole 120, the front substrate connection main body portion 42 of the second inner conductor 15 is inserted into the corresponding through hole 110, and the rear substrate connection main body portion 39 of the first inner conductor 14 is inserted into the corresponding through hole 110. Then, the connector 10 is mounted on the circuit board 100 through a soldering process such as reflow soldering.

[0053] In addition, the inventors of the present invention measured the shielding attenuation amount based on the international standard IEC62153-4-7 for various connectors including the present connector 10. As a result, it was found that: as described above, when the separation distance LR in the front-rear direction from the rear end of the rear substrate connection portion 35 of the first inner conductor 14 to the rear end of the outer conductor 11 (the rear surface opening portion 67) is more than four times the separation distance LF in the front-rear direction from the rear end of the front substrate connection portion 36 of the second inner conductor 15 to the front end of the shielding member 18 (4LF < LR), the same shielding property as when the rear surface opening of the outer conductor 11 is blocked by a shielding member such as a shielding member (hereinafter referred to as "shielding property equivalent to rear surface shielding") is obtained. In particular, it was found that when LR is more than six times LF, the shielding attenuation amount is the same as or less than the shielding attenuation amount calculated when the rear surface opening of the shielding member 18 is shielded by the shielding member 18. It was also confirmed that the shielding attenuation amount reaches its peak when LR is more than seven times LF. Therefore, it can be seen that: as Figure 1 and Figure 4As shown, when the separation distance (LR) in the front-rear direction from the rear substrate connection portion 35 to the rear end of the outer conductor 11 is greater than 6 times but less than 7 times the separation distance (LF) in the front-rear direction from the front substrate connection portion 36 to the shielding member 18, it is preferable that the outer conductor 11 can achieve the same shielding performance as the rear surface shielding in the front-rear direction without exceeding the necessary amount.

[0054] Furthermore, in this embodiment 1, the separation distance in the front-rear direction from the rear end of the shielding member 18 to the rear end of the outer conductor 11 is set to be greater than the separation distance in the front-rear direction from the front end of the shielding member 18 to the front end of the outer conductor 11. Specifically, the shielding member 18 is disposed inside the outer conductor 11 further forward than the front-rear center of the outer conductor 11. Therefore, in addition to easily adjusting the shielding of the outer conductor 11 to the same level as the rear surface shielding, it is also easy to set the center of gravity of the connector 10 on the side where the outer conductor 11 is located. Therefore, when the connector 10 is mounted on the circuit board 100, the stability of the connector 10's posture can be ensured.

[0055] Furthermore, in this embodiment 1, the outer conductor 11 has a protrusion 75 at its lower rear end of the opposing surface 73 (inner surface) facing the rear space portion 55. The protrusion 75 protrudes in such a way that the opening widths of the rear surface opening 67 and the lower surface opening 68 in the left and right directions are narrowed. Thus, for example, when performing a plating process, if multiple outer conductors 11 are placed in a cylinder (not shown), the partition walls 65 or sidewalls 66 of other outer conductors 11 interfere with the protrusion 75 of one outer conductor 11, preventing other outer conductors 11 from entering the rear space portion 55 of one outer conductor 11, thereby preventing the outer conductors 11 from tangling with each other.

[0056] Furthermore, the protrusion 75 is configured to contact the dielectric bodies 16 and 17 that move in the rear space 55 from below. As a result, the dielectric bodies 16 and 17, which can suppress the movement process, fall downward from the rear space 55.

[0057] Furthermore, the protrusion 75 is configured to be embedded in the recess 47, which is formed on the outer surface of the dielectric bodies 16 and 17 that move in the rear space 55. As a result, the dielectric bodies 16 and 17 can move smoothly in the rear space 55 without swaying in the left or right direction.

[0058] Furthermore, the protrusion 75 is provided only at the lower rear end of the opposing surface 73 of the outer conductor 11, moving rearward away from the substrate connection portions 35 and 36. As a result, electrical connection between the substrate connection portions 35 and 36 and the protrusion 75 can be prevented, and electrical connection between the outer conductor 11 and the inner conductors 14 and 15 can be easily avoided.

[0059] Furthermore, according to Embodiment 1, the second dielectric body 17 has a guide portion 45, and a guide receiving portion 74 is provided on the opposing surface 73 (inner surface) of the outer conductor 11 facing the rearward space portion 55. The guide receiving portion 74 receives the guide portion 45 and guides the cylindrical portion 43 of the second dielectric body 17 into the main body hole 54 (receiving hole). Thus, during the assembly process of the second dielectric body 17 relative to the outer conductor 11, the cylindrical portion 43 of the second dielectric body 17 can smoothly enter the corresponding main body hole 54.

[0060] Specifically, the guide receiving portion 74 is formed in the shape of a groove extending in the front-rear direction on the opposing surface 73 of the outer conductor 11, and the guide portion 45 is formed in the shape of a rib extending in the front-rear direction on the outer surface of the second dielectric body 17. When the second dielectric body 17 is housed in the outer conductor 11, it is held in contact with the inner surface of the fitting hole 63 (housing hole). Therefore, the guide portion 45 can both guide the second dielectric body 17 to the main body hole 54 and hold the second dielectric body 17 in the outer conductor 11.

[0061] Furthermore, a plate-shaped shielding member 18 is disposed between the front substrate connection portion 36 and the rear substrate connection portion 35. The outer conductor 11 has a retaining groove 72 for retaining the shielding member 18. The retaining groove 72 communicates with the rear space portion 55. The length of the guide portion 45 in the front-rear direction exceeds the groove width of the retaining groove 72 in the front-rear direction. As a result, the guide portion 45 and the guide receiving portion 74 can be kept in contact before the cylindrical portion 43 of the second dielectric body 17 enters the corresponding main body hole 54. Therefore, the guide portion 45 can be prevented from getting stuck on the groove surface of the retaining groove 72, and the guide portion 45 can smoothly enter the corresponding main body hole 54.

[0062] [Other embodiments of the present invention] It should be considered that the above-described embodiment 1 disclosed herein is illustrative rather than restrictive in all respects. In the case of Embodiment 1 described above, the substrate connection portions 35 and 36 of the four inner conductors 14 and 15 are arranged in both the front-back and left-right directions when viewed from below the outer conductor 11. In contrast, according to other embodiments, the substrate connection portions 35 and 36 of the two inner conductors may also be arranged only in the front-back direction when viewed from below the outer conductor. In the case of Embodiment 1 described above, the outer conductor 11 and the outer conductor tube 19 are formed separately. In contrast, according to other embodiments, the outer conductor may also be formed integrally with the outer conductor tube. For example, the outer conductor may also be a die-cast component integral with the cylindrical portion corresponding to the outer conductor tube. In the case of Embodiment 1 described above, the rear space portion 55 is formed in pairs on the left and right sides of the outer conductor 11, separated by the partition wall portion 65. In contrast, according to other embodiments, the rear space portion may also be formed only once inside the outer conductor between a pair of side wall portions. Alternatively, multiple partition walls may be formed on the outer conductor, and the rear space portion may be formed in three or more places between the side wall portions and the partition walls, as well as between adjacent partition walls. In the case of Embodiment 1 described above, the rear space portion 55 is formed in pairs on the left and right sides of the outer conductor 11, separated by the partition wall portion 65. In contrast, according to other embodiments, the rear space portion may also be formed only once inside the outer conductor between a pair of side wall portions. Furthermore, if multiple partition walls are formed on the outer conductor, the rear space portion may be formed in three or more places between the side wall portions and the partition walls, and between adjacent partition walls. In the case of Embodiment 1 described above, the guide portion 45 protrudes from the outer surface of the dielectric body 17, and the guide receiving portion 74 is recessed from the opposing surface 73 of the outer conductor 11. In contrast, according to other embodiments, opposite to Embodiment 1 described above, the guide portion may be recessed from the outer surface of the dielectric body, and the guide receiving portion may protrude from the opposing surface of the outer conductor. In the case of Embodiment 1 described above, the lower surface of the protrusion 75 is located at the lower end face of the outer conductor 11 (lower surface opening 68), and the rear surface of the protrusion 75 is located at the rear end face of the outer conductor 11 (rear surface opening 67). In contrast, according to other embodiments, the lower surface of the protrusion may also be located above the lower end face of the outer conductor, and the rear surface of the protrusion may also be located in front of the rear end face of the outer conductor. Explanation of reference numerals in the attached figures

[0063] 10: Connector 11: Outer conductor 12: Shell 13: Grounding components 14: First inner conductor (inner conductor) 15: Second inner conductor (inner conductor) 16: First dielectric (dielectric body) 17: Second dielectric (dielectric body) 18: Shielding components 19: Outer conductor tube 21: Base Wall 22: Cover 23: Insertion Hole 24: Protruding ring 25: Fitting recess 26: concave area 27: Top face 28: Mounting slot 31: Installation Department 32: Elastic contact part 33: Connecting part 34: Protrusion 35: Rear substrate connection portion (substrate connection portion) 36: Front substrate connection portion (substrate connection portion) 37: The other party's connecting part 38: Wide rear section 39: Rear substrate connection body 41: Wide front section 42: Front substrate connecting main body 43: Cylindrical part 44: Introduction 45: Guiding section 46: Insert into the recess 47: Concave 48: Through hole 49: Front 51: Rear 52: Step section 54: Main body hole (storage hole) 55: Rear Space Section 56: Fitting convex part 57: Protruding part 59: Locking claw 63: Fitting hole (storage hole) 64: Front stop surface 65: Next door 66: Side wall portion 67: Rear surface opening 68: Opening on the lower surface 69: Upper wall 71: Shelf wall 72: Retaining groove 73: Opposing surface (inner surface facing the rear space) 74: Guiding Reception Department 75: protrusion 77: Legs 79: Installation Department 81: Maintaining Department 100: Circuit board 110: Through hole 120: Fixing hole LF: Separation distance in the front-to-back direction from the rear end of the rear substrate connection to the rear end of the outer conductor. LR: Separation distance in the front-to-back direction from the rear end of the front substrate connector to the front end of the shielding member.

Claims

1. A connector comprising a plurality of inner conductors, a plurality of dielectric bodies housing the plurality of inner conductors, an outer conductor housing the plurality of dielectric bodies, and a plate-shaped shielding member. The outer conductor has a rear space located behind the receiving hole that houses the plurality of dielectric bodies, and the rear space opens toward the rear of the outer conductor. Each of the plurality of inner conductors has a substrate connection portion extending downward from the rear surface of the corresponding dielectric body. In one of the inner conductors, the substrate connection portion of a portion of the inner conductors is configured as a front substrate connection portion, and the substrate connection portion of another portion of the inner conductors is configured as a rear substrate connection portion disposed rearward than the front substrate connection portion. The rear substrate connection portion faces the rear space portion. The shielding member is disposed in the front substrate connection portion and the rear substrate connection portion in the front-to-back direction. The front-to-back separation distance from the rear end of the rear substrate connection to the rear end of the outer conductor is greater than four times the front-to-back separation distance from the rear end of the front substrate connection to the front end of the shielding member.

2. The connector according to claim 1, wherein, The connector has a housing for mounting the outer conductor. The outer conductor protrudes rearward beyond the housing. The front-to-back separation distance from the rear end of the shielding member to the rear end of the outer conductor is greater than the front-to-back separation distance from the front end of the shielding member to the front end of the outer conductor.

3. The connector according to claim 1 or claim 2, wherein, The front-to-back separation distance from the rear end of the rear substrate connection to the rear end of the outer conductor is greater than 6 times the front-to-back separation distance from the rear end of the front substrate connection to the front end of the shielding member.

4. The connector according to claim 3, wherein, The front-to-back separation distance from the rear end of the rear substrate connection to the rear end of the outer conductor is greater than 6 times and less than 7 times the front-to-back separation distance from the rear end of the front substrate connection to the front end of the shielding member.

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