An air-cooled laser

Abstract

The application discloses a wind-cooled laser, comprising a semiconductor laser pumping source, a frame structure, a heat pipe assembly and a wind-cooled heat dissipation assembly. The frame structure comprises a frame top plate and a bottom base plate, and the pumping source is fixed to the frame top plate, so that the frame top plate simultaneously serves as a mounting and positioning structure of the pumping source. The frame top plate is provided with a penetrating opening corresponding to a heating area of the pumping source, so that a heat-conducting contact interface is formed between the heating area and the opening. The heat pipe is arranged below the frame top plate and directly attached to the heating area at the opening, so as to conduct heat to the heat dissipation fins. The heat dissipation fins are in thermal connection with the heat pipe, and the heat dissipation fan drives air flow to pass through the fins to carry away heat. A semicircular groove is arranged at the bottom of the pumping source, and the contact section of the heat pipe is in circular cross section and attached to the semicircular groove to increase the contact area and reduce the contact thermal resistance. The heat pipe can also be directly contacted in a plane. The structure shortens the heat transfer path, reduces the thermal resistance of the intermediate layer, improves the wind-cooled heat dissipation efficiency, and improves the long-term light emission stability and reliability.

Description

Technical Field

[0001] This invention relates to the field of laser heat dissipation and structural design technology, specifically to a wind-cooled laser for high-power laser devices such as fiber lasers, and more particularly to a wind-cooled laser that achieves efficient heat dissipation, lightweight design, and improved mechanical stability by opening a through-hole in the top plate of the frame to allow the heat pipe to directly conduct heat to the heating area of ​​the semiconductor laser pump source, and by combining optimized contact interface structure with wind-cooling components. Background Technology

[0002] Fiber lasers, due to their advantages such as high beam quality, high conversion efficiency, compact structure, and relatively low maintenance costs, have been widely used in laser cutting, welding, cleaning, marking, and precision machining. High-power fiber lasers typically use semiconductor lasers as pump sources to provide pump light to the gain fiber. Because the electro-optical conversion efficiency of semiconductor laser pump sources is difficult to achieve 100% during operation, energy not converted into laser output is generated as heat within the pump source and concentrated in the heating region. If this heat cannot be effectively dissipated in time, it will cause the pump source junction temperature to rise, leading to problems such as output power fluctuations, efficiency reduction, wavelength drift, and shortened lifetime. In severe cases, it may even cause device failure or unstable laser output.

[0003] Existing heat dissipation methods for high-power lasers mainly include water cooling and air cooling. Water cooling has strong heat dissipation capabilities, but it typically requires a chiller, piping, water pump, and sealing structure, resulting in a larger system size and higher cost. It also carries the risk of leakage and complex maintenance, hindering miniaturization, lightweight design, and portable applications. In contrast, air cooling offers advantages such as system simplicity and ease of maintenance, making it suitable for applications with stringent requirements regarding size, weight, and maintainability. Therefore, air-cooled lasers have significant engineering application value.

[0004] However, existing air-cooled lasers still have shortcomings in their heat dissipation structure design. Common solutions typically involve placing intermediate heat-conducting structures such as heat-conducting plates, cover plates, or mounting plates below the pump source. The heat generated by the pump source is first transferred to these intermediate heat-conducting structures, and then further conducted to heat pipes, heat sinks, and other heat dissipation devices, and finally carried away by fan convection. This type of "multi-layer heat transfer path" inevitably introduces multiple contact interfaces and intermediate layer thermal resistance, resulting in a longer heat conduction path, increased equivalent thermal resistance, and reduced thermal conductivity. This makes it difficult to achieve rapid and efficient heat removal under limited air-cooling conditions, thus affecting the long-term stability and efficiency of the laser.

[0005] Furthermore, in existing air-cooled laser structures, to meet the requirements of pump source installation and heat dissipation device arrangement, the load-bearing structures such as frames and top plates (or covers) often adopt relatively thick solid plates or multi-layer stacked structures, resulting in a large overall weight and hindering lightweight design. At the same time, these plates may warp or deform under long-term operating thermal cycling and assembly stress, causing the pump source mounting plane and related optical coupling positions to shift, thus affecting the stability of light output and even leading to abnormal situations such as failure to output light. Moreover, in pursuit of heat dissipation capacity, some existing solutions tend to adopt a "uniformly laid, multiple heat pipes" arrangement, which, while increasing the heat dissipation area to some extent, also brings problems such as increased material usage, more complex structure, increased weight, and low heat pipe placement efficiency.

[0006] Therefore, how to shorten the heat conduction path between the pump source heating area and the heat dissipation device, reduce the thermal resistance of the intermediate layer, and improve the heat dissipation efficiency of air cooling while keeping the air cooling system structure simple and easy to maintain, so as to improve the output stability and reliability of the laser during long-term operation, has become a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0007] The present invention aims to provide an air-cooled laser, which has a through opening in the top plate of the frame corresponding to the heating area of ​​the pump source, so that the heat pipe and the heating area can directly conduct heat and make contact, thereby increasing the contact area, shortening the heat transfer path, reducing thermal resistance, improving the air cooling efficiency, and achieving lightweight structure and enhanced mechanical stability, so as to improve the output stability and reliability of the laser during long-term operation.

[0008] To achieve the above-mentioned technical objectives, the present invention adopts the following technical solution:

[0009] A wind-cooled laser includes: a semiconductor laser pump source, a frame structure, a heat pipe assembly, and a wind-cooling heat dissipation assembly;

[0010] The frame structure includes a top frame plate and a bottom substrate for mounting the semiconductor laser pump source. The semiconductor laser pump source is fixedly mounted on the top frame plate, so that the top frame plate also serves as the mounting and positioning structure for the semiconductor laser pump source.

[0011] The top plate of the frame is provided with a through opening corresponding to the heating area of ​​the semiconductor laser pump source, so that when the semiconductor laser pump source is installed on the top plate of the frame, the heating area forms a thermally conductive contact interface at the through opening.

[0012] The heat pipe assembly includes at least one heat pipe, which is disposed below the top plate of the frame and directly attached to the heating area of ​​the semiconductor laser pump source at the through opening, so as to conduct the heat generated by the semiconductor laser pump source to the heat pipe.

[0013] The air-cooled heat dissipation assembly includes heat dissipation fins thermally connected to the heat pipe and a heat dissipation fan for driving airflow through the heat dissipation fins.

[0014] The bottom of the semiconductor laser pump source is provided with a semi-circular groove for accommodating the heat pipe. The heat pipe has a circular cross-section at the contact section that fits with the semi-circular groove, so that the heat pipe forms a direct thermally conductive contact with the semiconductor laser pump source through the semi-circular groove, increasing the contact area. The through opening allows the top plate of the frame to avoid the heat-generating area and not participate in the heat conduction path between the heat-generating area and the heat pipe.

[0015] Optionally, there are multiple through openings, and each through opening corresponds one-to-one with the heating area of ​​each pump unit of the semiconductor laser pump source, so that each pump unit forms direct thermal contact with the heat pipe at the corresponding through opening.

[0016] Optionally, for each pump unit, at least one heat pipe is provided at its bottom, and the contact section of the heat pipe is directly attached to the heating area of ​​the pump unit through the corresponding through opening.

[0017] Optionally, the heat pipe is arranged along the length of the top plate of the frame and includes a contact section corresponding to the heat-generating area and a heat dissipation section thermally connected to the heat dissipation fins.

[0018] Optionally, the top plate of the frame and the frame structure are integrally formed aluminum alloy components, and the top plate of the frame is provided with weight-reducing hollow holes in addition to the through opening.

[0019] Optionally, the radius of the semicircular groove is matched with the outer diameter of the heat pipe so that the heat pipe and the semicircular groove form a surface contact fit.

[0020] Optionally, the heat dissipation fins are multiple fins arranged at intervals, the fin groups form a through-flow channel along the airflow direction, and the heat dissipation fan is installed on the side of the fin group to drive the airflow through the airflow channel.

[0021] Optionally, the cooling fan is mounted on the bottom substrate, allowing cool air to enter the air duct from bottom to top and carry away the heat conducted by the heat pipe, while the hot air is discharged from the front or rear end of the frame structure.

[0022] Optionally, it also includes a fiber laser assembly disposed around the semiconductor laser pump source and fixed to the top plate of the frame or the bottom substrate.

[0023] The main advantages of this invention compared to existing technologies are as follows:

[0024] This invention provides a through-hole on the top plate of the frame that corresponds to the heating area of ​​the semiconductor laser pump source. This allows the heat pipe to directly contact the heating area at the through-hole to form a thermally conductive interface. This avoids the multi-interface thermal resistance introduced by heat transfer through intermediate layers such as the cover plate / mounting plate to the heat pipe, thereby shortening the heat conduction path from the pump source to the heat pipe, reducing the equivalent thermal resistance, improving the heat removal efficiency of the pump source, and quickly dissipating the heat through forced convection of the heat dissipation fins and cooling fan. This improves the heat dissipation capacity and operational stability under air-cooled conditions.

[0025] The semiconductor laser pump source of the present invention has a semi-circular groove at the bottom, and the heat pipe has a circular cross section at the contact section and fits into the semi-circular groove to form a larger effective contact area. This is beneficial to reduce the interfacial contact thermal resistance and reduce local hot spots, thereby improving the stability and consistency of heat transfer from the pump source to the heat pipe.

[0026] This invention enables the top plate of the frame to simultaneously serve as the installation and positioning function of the pump source, and forms a heat-conducting contact interface at the heating area of ​​the pump source through the through opening, realizing the integrated design of the installation structure and the heat-conducting interface, reducing the number of structural layers and assembly interfaces, and improving the structural compactness and overall reliability.

[0027] Since the pump source mounting and positioning structure and the heat conduction interface are all uniformly supported and constrained by the frame top plate, the present invention reduces the number of structural layers and makes the stress and thermal deformation path more controllable. This helps to reduce the risk of local warping or deformation caused by long-term thermal cycling and assembly stress, thereby improving the stability of the pump source and related optical coupling positions, and enhancing the long-term light output stability and reliability of the laser.

[0028] This invention reduces intermediate heat-conducting structures, uses heat pipes to directly couple the heat-generating area, and can be combined with a hollowed-out frame structure for weight reduction. This reduces structural redundancy and material usage while meeting heat dissipation requirements, which helps to reduce the overall weight and assembly load, and improves the portability and engineering adaptability of the equipment. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the overall structure of the air-cooled laser of the present invention;

[0030] Figure 2 This is a side view of the air-cooled laser of the present invention;

[0031] Figure 3 This is a top view of the air-cooled laser of the present invention;

[0032] Figure 4 This is a schematic diagram of the heat pipe structure of the present invention. Detailed Implementation

[0033] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the following embodiments are only used to explain the technical solutions of the present invention and do not constitute a limitation on the scope of protection of the present invention; equivalent substitutions or modifications made by those skilled in the art to the structural forms, connection methods, and arrangement positions without departing from the concept of the present invention should all fall within the scope of protection of the present invention.

[0034] like Figures 1 to 4 As shown, a wind-cooled laser of the present invention mainly includes: a semiconductor laser pump source 1, a frame top plate 2, a heat dissipation part 3, a heat dissipation fan 4, heat dissipation fins 5, a heat pipe 6, a bottom substrate 7, and a fiber laser part 8.

[0035] The air-cooled laser proposed in this invention is constructed around the goals of "reducing the thermal resistance between the pump source heating area and the heat pipe, shortening the heat transfer path, enhancing air-cooling heat dissipation capacity, and improving the stability of the integrated structural positioning." Its key features are: the frame top plate 2 serves as both the frame top plate and the pump source mounting and positioning structure; a through-hole corresponding to the pump source heating area is provided on the frame top plate 2, allowing the heat pipe 6 to directly contact the pump source heating area at this through-hole to form a thermally conductive contact interface; and the semi-circular groove at the bottom of the pump source matches the circular cross-section of the heat pipe 6 to increase the contact area, thereby reducing the interface contact thermal resistance. The heat pipe 6 conducts heat to the area where the heat dissipation fins 5 are located, and the cooling fan 4 drives airflow through the fin gaps to form forced convection, quickly carrying away the heat and achieving stable and efficient air-cooling heat dissipation.

[0036] In one embodiment, the heat pipe and the heating area of ​​the pump unit can also be in planar contact. In planar contact, the contact end of the heat pipe is flattened and directly adheres to the heating area of ​​the pump unit.

[0037] The frame structure of the present invention consists of at least a top frame plate 2 and a bottom substrate 7. After assembly, the top frame plate 2 and the bottom substrate 7 form a basic load-bearing structure for accommodating the heat dissipation part 3 and its internal airflow channels. Specifically: the top frame plate 2 is used to mount and position the laser semiconductor laser pump source 1, serving as the mounting and positioning structure for the semiconductor laser pump source 1; the bottom substrate 7 provides bottom support and can be used to mount the cooling fan 4 or as a support reference for forming the air inlet / outlet path.

[0038] In one embodiment, the top plate 2 and the bottom plate 7 of the frame can be enclosed with the side sealing plates (optional, the disclosure also gives the option of "the front and rear side sealing plates forming a hollow structure") to form a hollow frame, thereby forming a controllable air circulation channel inside the frame, which is convenient for air cooling.

[0039] The semiconductor laser pump source 1 is a semiconductor laser pump source that can be used in series with multiple semiconductor lasers to provide high-power pump light. To meet the engineering requirements of high-power output, the semiconductor laser pump source 1 can be structurally decomposed into multiple "pump units," each with a relatively independent heating area. The semiconductor laser pump source 1 is fixedly mounted on the top plate 2 of the frame, so that the top plate 2 simultaneously undertakes the functions of mounting and supporting the semiconductor laser pump source 1, as well as positioning and stabilizing the semiconductor laser pump source 1 within the entire machine.

[0040] The heat pipe 6 is a core component of the heat pipe assembly, located below the top plate 2 of the frame, and is used to quickly conduct heat from the semiconductor laser pump source 1 and transfer it to the area where the heat sink fins 5 are located. The heat dissipation part 3 consists of at least the heat pipe 6, the heat sink fins 5, and the cooling fan 4: the heat sink fins 5 are mounted on the heat pipe 6 or thermally connected to the heat pipe 6 to form a heat sink structure with a large heat dissipation area; the cooling fan 4 is arranged on one or more sides of the heat sink fins 5 to drive airflow through the heat sink fins 5, forming forced convection to improve heat dissipation efficiency.

[0041] The fiber laser section 8 includes a gain fiber and its optical components, which can be arranged around the semiconductor laser pump source 1 (an arrangement scheme of "perched around the pump source") and fixed to the top plate 2 or the bottom substrate 7 of the frame, thereby forming a compact arrangement structure, shortening the internal optical path and electrical connection path, which is conducive to achieving overall miniaturization and integration.

[0042] The key difference between this invention and common air-cooling solutions is that: a through-hole (or a mounting groove in the form of a through-hole) corresponding to the heating area of ​​the semiconductor laser pump source 1 is provided on the top plate 2 of the frame, so that the heating area of ​​the pump source forms a thermally conductive contact interface at the through-hole, and the heat pipe 6 can directly fit with the heating area of ​​the pump source at this interface.

[0043] In one embodiment, the top plate 2 of the frame has a through opening at the position corresponding to the heating area of ​​each pump unit. The through opening can be single or multiple. When the semiconductor laser pump source 1 contains multiple pump units, the through opening can be set one-to-one with the heating area of ​​each pump unit, thereby ensuring that each pump unit can form direct thermal contact with the heat pipe 6 at its corresponding through opening.

[0044] The semiconductor laser pump source 1 is fixed on the top plate 2 of the frame, which itself serves as the mounting and positioning element. Traditional structures often place the mounting plate / cover as an independent solid layer in the thermal path, requiring heat to cross this solid layer or multiple contact interfaces before reaching the heat pipe, easily resulting in superimposed thermal resistance. This invention addresses this by providing a through-hole in the top plate 2, allowing the pump source's heating area to "avoid" the solid intervention of the top plate 2 at the through-hole. This achieves the following structural benefits: the top plate 2 still provides mounting and structural support for the pump source; however, at the corresponding location of the pump source's heating area, the top plate 2 does not act as an intermediate layer in the heat conduction path; the heat pipe 6 directly adheres to the pump source's heating area at the through-hole, forming a shorter, lower thermal resistance heat conduction path.

[0045] With the above structural arrangement, the heat generated by the pump source can be introduced into the heat pipe 6 with fewer interface layers and a shorter path, significantly reducing the equivalent thermal resistance and improving the heat removal efficiency.

[0046] To further reduce the interfacial contact thermal resistance and improve contact consistency, the present invention provides a semi-circular groove at the bottom of the semiconductor laser pump source 1, and the heat pipe 6 has a circular cross section at the contact section that fits with the semi-circular groove, so that the two form a "groove-pipe" fitting relationship.

[0047] A semi-circular groove is provided at the bottom of the semiconductor laser pump source 1 to accommodate the contact section of the heat pipe 6 and achieve a proper fit. The radius of the semi-circular groove can be matched with the outer diameter of the heat pipe 6 so that the heat pipe 6 forms a surface or near-surface contact with the semiconductor laser pump source 1 within the semi-circular groove, rather than a point or line contact. This increases the effective thermal contact area, reduces interfacial thermal resistance, reduces the probability of local heat concentration and hot spots, and makes the fit between the heat pipe 6 and the semiconductor laser pump source 1 more stable and consistent, reducing the impact of assembly tolerances on thermal conductivity.

[0048] Heat pipe 6 maintains a circular cross-section at the contact section, which, together with the semi-circular groove, achieves a matching fit. Compared to the solution of processing the top of the heat pipe into a flat shape, this design can reduce the dependence on the heat pipe processing technology while ensuring the contact area. Furthermore, the semi-circular groove structure positions and supports the heat pipe contact section, making the bonding interface more controllable.

[0049] The improved thermal conductivity of this invention does not come from a single structure, but from the synergy of two factors: the through-hole allows the heat pipe 6 to directly contact the pump source heating area, reducing the thermal resistance of the intermediate layer; the semi-circular groove-circular pipe bonding further reduces the interfacial contact thermal resistance and improves the heat coupling efficiency. Together, these two factors allow heat to enter the heat pipe 6 more quickly and stably and be transferred to the heat dissipation fins 5 area.

[0050] The heat pipe 6 is located below the top plate 2 of the frame and includes at least: a contact section corresponding to the heat-generating area of ​​the pump source (located at the through opening and directly attached to the heat-generating area); and a heat dissipation section thermally connected to the heat dissipation fins 5 (which transfers heat to the fins and is carried away by air cooling).

[0051] In one embodiment, the heat pipe 6 can be arranged horizontally along the length of the frame top plate 2, so that the contact section of the heat pipe is aligned with the pump source heating area, while the heat dissipation section of the heat pipe extends to the area where the heat dissipation fins 5 are located, so that heat can be effectively released into the air.

[0052] The heat dissipation fins 5 can be multiple fins arranged at intervals, forming a through-flow channel along the airflow direction. The interval arrangement of the fins increases the heat dissipation area and forms an airflow channel to reduce wind resistance, allowing the airflow driven by the cooling fan 4 to pass through the fin gaps more fully and exchange heat with the fin surface.

[0053] In one embodiment, the fin assembly can be disposed on both sides of the frame or around the heat pipe heat dissipation section, and maintain a reliable thermal connection with the heat pipe 6 so that the heat conducted by the heat pipe can be quickly diffused to the fin surface.

[0054] The cooling fan 4 can be set on one or more sides of the cooling fins 5 to drive airflow through the fin assembly to form forced convection cooling.

[0055] Lateral air supply / suction method: The cooling fan 4 is installed on the side of the fin assembly, so that the airflow passes through the gap between the fins laterally to form a lateral air channel for heat dissipation.

[0056] Bottom air supply implementation method: The cooling fan 4 is installed on the bottom base plate 7, so that the cold air enters the air duct from bottom to top and takes away the heat. The hot air is discharged from the front or rear end of the frame, forming a bottom-up convection circulation.

[0057] Different arrangement methods can be selected according to the overall space, air duct resistance, noise control and maintenance requirements, but none of them change the basic heat dissipation principle of the present invention: "heat pipes are directly connected to the heat-generating area and heat is dissipated through air-cooled fins".

[0058] When the semiconductor laser pump source 1 contains multiple pump units, the following arrangement strategy can be adopted to further achieve "directional heat dissipation" and rapid heat removal:

[0059] 1. The through-hole corresponds one-to-one with the pump unit.

[0060] The top plate 2 of the frame is provided with multiple through openings, and each through opening corresponds to the heating area of ​​each pump unit in position, so that each pump unit can form a direct thermal contact interface with the heat pipe 6 at its corresponding through opening, avoiding the decrease in thermal conductivity caused by positional deviation or the intervention of intermediate layers.

[0061] 2. Each pump unit corresponds to at least one heat pipe.

[0062] For each pump unit, at least one heat pipe 6 is installed at its bottom, so that the heat generated by the pump unit can be preferentially introduced into the corresponding heat pipe 6 through the direct contact interface and quickly carried away. This "heat source-heat pipe" correspondence makes the number of heat pipes and the number / power distribution of heat sources more controllable, avoiding the increase in weight and decrease in utilization caused by the rough arrangement of "uniformly laying multiple heat pipes" in the traditional structure.

[0063] 3. Dual-pipe arrangement on the left and right edges (further optimization)

[0064] In a further preferred embodiment, for each pump unit, a heat pipe 6 can be respectively installed at its left and right edges, so that the two heat pipes form direct thermal contact with the heating area of ​​the pump unit at their corresponding through openings. This arrangement helps to improve the uniformity of heat dissipation within the pump unit and reduce local temperature rise peaks without significantly increasing structural complexity.

[0065] It should be noted that the above-mentioned "dual heat pipes on the left and right edges" is a preferred solution; while meeting the heat dissipation requirements, each pump unit may also correspond to only one heat pipe, or equivalent adjustments may be made according to power density and spatial layout.

[0066] The fiber laser section 8 includes a gain fiber and its optical components, which can be disposed around the semiconductor laser pump source 1 and fixed to the top plate 2 or the bottom substrate 7 of the frame to form a compact arrangement. By arranging the fiber and its optical components around the pump source, the internal connection path can be shortened, the overall integration can be improved, and the internal space of the frame can be utilized more rationally, thereby achieving miniaturization while maintaining heat dissipation channels.

[0067] The working principle of the laser of this invention is as follows:

[0068] When the air-cooled laser is operating, the semiconductor laser pump source 1 generates heat during electro-optic conversion, which is concentrated in the heating area of ​​the pump source. Since the top plate 2 of the frame has a through-hole corresponding to this heating area, a thermally conductive contact interface is formed at the through-hole, allowing the heat pipe 6 to directly contact the heating area. Furthermore, the semi-circular groove at the bottom of the pump source matches and fits into the circular cross-section of the heat pipe 6, increasing the contact area and reducing the contact thermal resistance. Thus, heat is quickly introduced into the heat pipe 6 via a shorter path and with lower thermal resistance, and then conducted along the heat pipe 6 to the heat dissipation section, where the heat dissipation area is expanded by the heat dissipation fins 5 thermally connected to the heat pipe. The cooling fan 4 drives airflow through the fin assembly, forming forced convection heat transfer, quickly carrying away the heat from the fin surface and expelling it outside the frame, thereby achieving stable and efficient air-cooling.

[0069] The semiconductor laser pump source 1 is fixedly mounted on the frame top plate 2. The frame top plate 2 serves as both the frame top plate and the mounting and positioning structure, ensuring that the mounting reference of the pump source is uniformly supported and constrained by the frame structure. Compared to the interface loosening and thermal cycling warping caused by multi-layer plate stacking, this invention, through the structural organization of "frame top plate 2 mounting and positioning + through-opening to avoid heat conduction paths," reduces the intervention of intermediate layers in the heat conduction path and makes the number of assembly interfaces and deformation paths more controllable. This helps reduce the risk of installation plane deformation under long-term thermal cycling conditions, thereby improving the stability of the pump source and related optical coupling positions, enhancing the light output stability and overall system reliability.

[0070] This invention, through direct thermal connection and increased interface contact area design, substantially reduces the equivalent thermal resistance from the pump source to the heat pipe and shortens the heat transfer path, improving heat removal efficiency under air-cooled conditions and reducing the risk of pump source temperature rise and thermal drift. The forced convection structure formed by the heat pipe-fins-fan allows heat to be quickly dissipated, ensuring long-term operational stability. At the same time, the top plate of the frame provides installation positioning and organizes the thermal interface through openings, making the structure more compact, with fewer layers and more controllable mechanical stability, thereby improving heat dissipation capacity and enhancing the long-term light output reliability of the entire unit.

[0071] In summary, this invention provides a through-hole on the top plate of the frame that corresponds to the heating area of ​​the semiconductor laser pump source. This allows the heat pipe to directly contact the heating area at the through-hole to form a thermally conductive interface. This avoids the multi-interface thermal resistance introduced by heat transfer through intermediate layers such as the cover plate / mounting plate to the heat pipe, thereby shortening the heat conduction path from the pump source to the heat pipe, reducing the equivalent thermal resistance, improving the heat removal efficiency of the pump source, and quickly dissipating heat through forced convection of the heat dissipation fins and cooling fan. This improves the heat dissipation capacity and operational stability under air-cooled conditions.

[0072] The semiconductor laser pump source of the present invention has a semi-circular groove at the bottom, and the heat pipe has a circular cross section at the contact section and fits into the semi-circular groove to form a larger effective contact area. This is beneficial to reduce the interfacial contact thermal resistance and reduce local hot spots, thereby improving the stability and consistency of heat transfer from the pump source to the heat pipe.

[0073] This invention enables the top plate of the frame to simultaneously serve as the installation and positioning function of the pump source, and forms a heat-conducting contact interface at the heating area of ​​the pump source through the through opening, realizing the integrated design of the installation structure and the heat-conducting interface, reducing the number of structural layers and assembly interfaces, and improving the structural compactness and overall reliability.

[0074] Since the pump source mounting and positioning structure and the heat conduction interface are all uniformly supported and constrained by the frame top plate, the present invention reduces the number of structural layers and makes the stress and thermal deformation path more controllable. This helps to reduce the risk of local warping or deformation caused by long-term thermal cycling and assembly stress, thereby improving the stability of the pump source and related optical coupling positions, and enhancing the long-term light output stability and reliability of the laser.

[0075] This invention reduces intermediate heat-conducting structures, uses heat pipes to directly couple the heat-generating area, and can be combined with a hollowed-out frame structure for weight reduction. This reduces structural redundancy and material usage while meeting heat dissipation requirements, which helps to reduce the overall weight and assembly load, and improves the portability and engineering adaptability of the equipment.

[0076] The above are merely preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A wind-cooled laser, characterized in that, include: Semiconductor laser pump source, frame structure, heat pipe assembly, and air-cooled heat dissipation assembly; The frame structure includes a top frame plate and a bottom substrate for mounting the semiconductor laser pump source. The semiconductor laser pump source is fixedly mounted on the top frame plate, so that the top frame plate also serves as the mounting and positioning structure for the semiconductor laser pump source. The top plate of the frame is provided with a through opening corresponding to the heating area of ​​the semiconductor laser pump source, so that when the semiconductor laser pump source is installed on the top plate of the frame, the heating area forms a thermally conductive contact interface at the through opening. The heat pipe assembly includes at least one heat pipe, which is disposed below the top plate of the frame and directly attached to the heating area of ​​the semiconductor laser pump source at the through opening, so as to conduct the heat generated by the semiconductor laser pump source to the heat pipe. The air-cooled heat dissipation assembly includes heat dissipation fins thermally connected to the heat pipe and a heat dissipation fan for driving airflow through the heat dissipation fins. The bottom of the semiconductor laser pump source is provided with a semi-circular groove for accommodating the heat pipe. The heat pipe has a circular cross-section at the contact section that fits with the semi-circular groove, so that the heat pipe forms a direct thermally conductive contact with the semiconductor laser pump source through the semi-circular groove, increasing the contact area. The through opening allows the top plate of the frame to avoid the heat-generating area and not participate in the heat conduction path between the heat-generating area and the heat pipe.

2. The air-cooled laser according to claim 1, characterized in that, The through-openings are multiple, and each through-opening corresponds to the heating area of ​​each pump unit of the semiconductor laser pump source, so that each pump unit forms direct thermal contact with the heat pipe at the corresponding through-opening.

3. The air-cooled laser according to claim 2, characterized in that, For each pump unit, at least one heat pipe is provided at its bottom, and the contact section of the heat pipe is directly attached to the heating area of ​​the pump unit through the corresponding through opening.

4. The air-cooled laser according to claim 1, characterized in that, The heat pipe is arranged along the length of the top plate of the frame and includes a contact section corresponding to the heat-generating area and a heat dissipation section thermally connected to the heat dissipation fins.

5. The air-cooled laser according to claim 1, characterized in that, The top plate of the frame and the frame structure are integrally formed aluminum alloy components, and the top plate of the frame is provided with weight-reducing hollow holes in addition to the through opening.

6. The air-cooled laser according to claim 1, characterized in that, The radius of the semicircular groove is matched with the outer diameter of the heat pipe so that the heat pipe and the semicircular groove form a surface contact fit.

7. The air-cooled laser according to claim 1, characterized in that, The heat dissipation fins are multiple fins arranged at intervals. The fin groups form a through-flow channel along the airflow direction, and the heat dissipation fan is installed on the side of the fin groups to drive the airflow through the air channel.

8. The air-cooled laser according to claim 7, characterized in that, The cooling fan is installed on the bottom base plate, allowing cold air to enter the air duct from bottom to top and carry away the heat conducted by the heat pipe. The hot air is discharged from the front or rear end of the frame structure.

9. The air-cooled laser according to claim 1, characterized in that, It also includes a fiber laser assembly, which is disposed around the semiconductor laser pump source and fixed to the top plate of the frame or the bottom substrate.

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