Power amplifier, testing method thereof and solid-state microwave source

Abstract

The invention discloses a power amplifier, a test method thereof and a solid-state microwave source, the power of an output signal of the power amplifier is Y watt, and the power amplifier comprises a pre-power amplification unit, a main power amplification unit and a power synthesis unit, wherein the main power amplifier unit comprises X secondary power amplifier circuits; the input of the power amplifier is connected with the pre-power amplification unit, the pre-power amplification unit performs primary amplification on a signal input by the power amplifier, the output end of the pre-power amplification unit is connected with the input end of the main power amplification unit, and the main power amplification unit sequentially performs distribution and secondary amplification on the signal subjected to primary amplification; the rated output power of each secondary power amplifier circuit is not lower than Y / X watt; the output end of the main power amplifier unit is connected with the input end of the power synthesis unit, and the power synthesis unit outputs an amplified power signal; wherein Y is greater than or equal to 1000, and X is a positive integer. According to the invention, kilowatt-level power output can be realized, so that the debugging difficulty and instability of the solid-state microwave source are reduced.

Description

Technical Field

[0001] This invention relates to the field of amplifiers, and more particularly to a power amplifier and its testing method, and a solid-state microwave source. Background Technology

[0002] Solid-state microwave power amplifiers are microwave power amplifiers made using semiconductor materials. Their core characteristics include high reliability, long lifespan (no easily damaged parts, lifespan exceeding 100,000 hours), excellent linearity (supporting complex modulation signals), simple power supply and instant start-up (no high-voltage preheating required), and small size, light weight, and ease of integration. With technological advancements and increased single-chip power, especially in industrial and medical fields and high-energy physics accelerators, solid-state microwave power amplifiers are replacing traditional magnetrons due to their precise frequency and power control capabilities.

[0003] In the fields of industry and high-energy physics, solid-state microwave sources have largely replaced vacuum devices in the low-frequency band (≤650MHz).

[0004] However, the widespread adoption of solid-state microwave sources in high-frequency (≥2450MHz) and high-power (≥10kW) applications still faces significant technical challenges. To achieve such high power output, existing solid-state microwave sources employ the integration of numerous branch power amplifier modules. However, as the number of branch channels increases, the efficiency of synthesizing these modules decreases significantly. Even the radial combiner, currently the most theoretically efficient, places extremely high demands on the amplitude and phase consistency of the signals in each branch. The more channels there are, the more difficult consistency control becomes, and the system complexity, instability risk, and debugging difficulty increase accordingly. Existing power amplifiers in solid-state microwave sources are limited by semiconductor technology, resulting in low output power and poor amplification, leading to reduced efficiency and instability. Summary of the Invention

[0005] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a power amplifier capable of achieving kilowatt-level power output, thereby reducing the debugging difficulty and instability of solid-state microwave sources.

[0006] The present invention also proposes a test method for the above-mentioned power amplifier and a solid-state microwave source having the above-mentioned power amplifier.

[0007] A power amplifier according to a first aspect of the present invention, applied to a solid-state microwave source, having an output signal power of Y watts, comprises: The system includes a preamplifier unit, a main amplifier unit, and a power combining unit; the main amplifier unit comprises X secondary amplifier circuits. The input of the power amplifier is connected to the preamplifier unit, which amplifies the signal input to the power amplifier in one stage. The output of the preamplifier unit is connected to the input of the main power amplifier unit, which distributes and amplifies the amplified signal in two stages. The rated output power of each secondary power amplifier circuit is not less than Y / X watts. The output of the main power amplifier unit is connected to the input of the power combining unit, which outputs the amplified power signal. Wherein, Y≥1000, and X is a positive integer.

[0008] The power amplifier provided by this invention has the following beneficial effects: First, the input signal is amplified in one stage, then distributed, amplified a second time, and combined sequentially. The final output signal has a kilowatt-level output capability, capable of outputting a 1kW power signal. This invention first performs a single-stage amplification through a pre-amplifier unit, then amplifies it separately through two secondary power amplifiers before combining them to achieve kilowatt-level power output, thereby reducing the debugging difficulty and instability of solid-state microwave sources.

[0009] According to some embodiments of the present invention, X=2, the main power amplifier unit includes a first secondary power amplifier circuit, a second secondary power amplifier circuit, and a power divider; The power divider connects its input to the output of the preamplifier unit and its output to the inputs of the first and second secondary power amplifier circuits, respectively, to evenly distribute the signal amplified by the preamplifier unit to the first and second secondary power amplifier circuits.

[0010] According to some embodiments of the present invention, the first circuit of the secondary power amplifier and the second circuit of the secondary power amplifier are respectively disposed on different circuit boards, and a shielding plate is disposed between the circuit board corresponding to the first circuit of the secondary power amplifier and the circuit board corresponding to the second circuit of the secondary power amplifier. The difference between the width of the shielding plate and the width of the circuit board corresponding to the first circuit of the secondary power amplifier and the circuit board corresponding to the second circuit of the secondary power amplifier is less than a preset width difference threshold.

[0011] According to some embodiments of the present invention, the preamplifier unit is disposed in the first chamber, the main amplifier unit and the power combining unit are disposed in the second chamber, a through hole is provided between the first chamber and the second chamber, the output end of the preamplifier unit is connected to a coaxial transmission line, and the coaxial transmission line passes through the through hole and is connected to the input end of the main amplifier unit.

[0012] According to some embodiments of the present invention, the first chamber and the second chamber adopt a water-cooled chamber structure, wherein the water-cooling pipe of the first chamber is disposed below the primary power amplifier circuit, and the water-cooling pipe of the second chamber is disposed below the primary power amplifier circuit and the secondary power amplifier circuit.

[0013] According to some embodiments of the present invention, the first chamber and the second chamber are respectively provided with a first cover plate and a second cover plate, the opening of the first chamber matches the first cover plate, and the opening of the second chamber matches the second cover plate.

[0014] According to some embodiments of the present invention, the power combining unit includes: a first circulator, a second circulator, and a power combiner; The first circulator and the second circulator have their input terminals connected to the output terminals of the first circuit and the second circuit of the two-stage power amplifier, respectively, and their output terminals connected to the input terminals of the power combiner, respectively. Their isolation terminals are connected to the first load and the second load, respectively. The signal output from the power combiner is the signal output from the power amplifier.

[0015] According to some embodiments of the present invention, the pre-amplifier unit, the power divider, the first circuit of the second-stage power amplifier, the second circuit of the second-stage power amplifier, and the power combining unit are respectively disposed on different circuit boards; The preamplifier unit includes: a first isolator, a first-stage power amplifier circuit, and a second isolator; The input of the power amplifier is connected to the input terminal of the first isolator, the output terminal of the first isolator is connected to the input terminal of the first-stage power amplifier circuit, the output terminal of the first-stage power amplifier circuit is connected to the input terminal of the second isolator, and the output terminal of the second isolator is connected to the input terminal of the power divider.

[0016] A test method for a power amplifier according to a second aspect of the present invention, applied to the power amplifier of any one of the first aspects, includes: Connect the output of the main power amplifier unit to the input of each of the X attenuators, and connect the output of each attenuator to the input of each of the X power meters. The power of each secondary power amplifier circuit is obtained by measuring with X power meters. Determine whether the power difference between each secondary power amplifier circuit exceeds the preset high power difference threshold. If not, then the power amplifier is confirmed to meet the standard; if yes, then replace any power amplifier chip in the first circuit of the second-stage power amplifier or the second circuit of the second-stage power amplifier.

[0017] A solid-state microwave source according to a third aspect of the present invention is characterized in that it includes a power amplifier according to any one of the first aspects.

[0018] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the description, claims, and drawings. Attached Figure Description

[0019] The accompanying drawings are provided to further understand the technical solutions of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the technical solutions of the present invention, and do not constitute a limitation on the technical solutions of the present invention.

[0020] Figure 1 This is a schematic diagram of a power amplifier provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of a power amplifier provided in another embodiment of the present invention; Figure 3 This is a schematic diagram of a power amplifier testing method provided in another embodiment of the present invention. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0022] It should be understood that in the description of the embodiments of the present invention, "multiple" (or "amounts") means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first," "second," etc., are used in the description, they are only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0023] like Figure 1 As shown, this embodiment of the invention provides a power amplifier applied to a solid-state microwave source, with an output signal power of Y watts, comprising: The system includes a preamplifier unit, a main amplifier unit, and a power combining unit; the main amplifier unit comprises X secondary amplifier circuits. The input of the amplifier is connected to the preamplifier unit, which amplifies the input signal of the amplifier in one stage. The output of the preamplifier unit is connected to the input of the main amplifier unit, which distributes and amplifies the amplified signal in two stages. The rated output power of each secondary amplifier circuit is not less than Y / X watts. The output of the main amplifier unit is connected to the input of the power combining unit, which outputs the amplified power signal. Wherein, Y≥1000, and X is a positive integer.

[0024] The power amplifier provided by this invention has the following beneficial effects: First, the input signal is amplified in one stage, then distributed, amplified a second time, and combined sequentially. The final output signal has a kilowatt-level output capability, capable of outputting a 1kW power signal. This invention first performs a single-stage amplification through a pre-amplifier unit, then amplifies and combines the signals through two separate secondary power amplifiers to achieve kilowatt-level power output, thereby reducing the debugging difficulty and instability of solid-state microwave sources.

[0025] In one embodiment, the preamplifier unit includes a first isolator, a first-stage power amplifier circuit, and a second isolator. The input of the amplifier is connected to the input terminal of the first isolator, the output terminal of the first isolator is connected to the input terminal of the first-stage power amplifier circuit, the output terminal of the first isolator is connected to the input terminal of the second isolator, and the output terminal of the second isolator is connected to the input terminal of the main power amplifier unit. The main power amplifier unit includes a first-stage power amplifier circuit and a second-stage power amplifier circuit, which sequentially distribute and amplify the signal amplified by the preamplifier unit. The maximum steady-state output power of the first-stage power amplifier circuit and the second-stage power amplifier circuit is not less than 550W. The output terminal of the main power amplifier unit is connected to the input terminal of the power combining unit, and the power combining unit outputs the amplified power signal.

[0026] The power amplifier provided in this embodiment has the following beneficial effects: Firstly, the input signal is passed through a low-power first isolator, then amplified by a second stage before being connected to a second isolator, preventing interference from high-frequency signals transmitted between power amplifier circuits and improving the input VSWR. The main power amplifier unit divides the power amplified by the first stage into two paths, each signal being amplified by a second-stage power amplifier circuit before being sent to the power combining unit. The power combining unit combines the two signals to achieve a combined power output. The maximum steady-state output power of the second-stage power amplifier circuit is not less than 550W, and the final output signal has a kilowatt-level output capability, capable of outputting a 1kW power signal. This invention first performs a first-stage amplification through a pre-amplifier unit, then amplifies and combines the two second-stage power amplifiers separately. Isolators are installed between the power amplifier circuits to avoid interference from amplified high-frequency signals, achieving kilowatt-level power output, thereby reducing the debugging difficulty and instability of the solid-state microwave source.

[0027] Because this invention achieves the output of kilowatt-level power signals, fewer power amplifier modules are required to achieve the same high output power, thus reducing the number of power amplifiers that need to be debugged and lowering the debugging difficulty.

[0028] In one embodiment, the power amplifier specifically includes: a first isolator, a first-stage power amplifier circuit, a second isolator, a power divider, a second-stage power amplifier first circuit, a second-stage power amplifier second circuit, a first circulator, a second circulator, and a power combiner; The amplifier's input is connected to the input of the first isolator, the output of the first isolator is connected to the input of the first-stage power amplifier circuit, the output of the first-stage power amplifier circuit is connected to the input of the second isolator, the output of the second isolator is connected to the input of the power divider, the output of the power divider is connected to the inputs of the first and second-stage power amplifier circuits, the outputs of the first and second-stage power amplifier circuits are connected to the inputs of the first and second circulators, and the outputs of the first and second circulators are connected to the input of the power combiner. The power combiner outputs the amplified power signal. The maximum steady-state output power of the first and second-stage power amplifier circuits is not less than 550W.

[0029] In one embodiment, the rated output power of the first-stage power amplifier circuit is 60W, and the rated output power of the first and second-stage power amplifier circuits is 500W.

[0030] In one embodiment, the power combining unit includes: a first circulator, a second circulator, and a power combiner; The input terminals of the first circulator and the second circulator are connected to the output terminals of the first circuit and the second circuit of the two-stage power amplifier, respectively. Their output terminals are connected to the input terminals of the power combiner, respectively. Their isolation terminals are connected to the first load and the second load, respectively. The signal output from the power combiner is the signal output from the amplifier.

[0031] This embodiment uses a circulator to achieve unidirectional signal transmission, thereby isolating the signal and avoiding interference from high-frequency signals. This invention is mainly applied to the amplification of high-frequency signals. High-frequency signals are easily propagated and interfered with through the coupling between wires, lines and devices. Therefore, isolators, circulators, etc. are used to isolate the signals of each unit to avoid interference caused by the high-frequency signals transmitted by each module.

[0032] In one embodiment, the power capacity of both the first circulator and the second circulator is not less than 500W, and both the first load and the second load are 50-ohm matched loads that can withstand a power of not less than 250W.

[0033] In one embodiment, the main power amplifier unit further includes: a power divider, whose input terminal is connected to the output terminal of the second isolator, and whose output terminal is respectively connected to the input terminals of the first secondary power amplifier circuit and the second secondary power amplifier circuit, so as to evenly distribute the signal amplified by the pre-amplifier unit to the first secondary power amplifier circuit and the second secondary power amplifier circuit; In one embodiment, the first circuit of the two-stage power amplifier and the second circuit of the two-stage power amplifier have the same structure.

[0034] like Figure 2As shown, in one embodiment, the preamplifier unit is disposed in the first chamber, the main amplifier unit and the power combining unit are disposed in the second chamber, a through hole is provided between the first chamber and the second chamber, the output end of the preamplifier unit is connected to a coaxial transmission line, and the coaxial transmission line passes through the through hole and is connected to the input end of the main amplifier unit.

[0035] In one embodiment, a movable insert plate is provided between the first chamber and the second chamber. The movable insert plate is provided with through holes of different diameters to accommodate coaxial transmission lines of different diameters and to help suppress self-excited oscillations caused by the sealed cavity.

[0036] In one embodiment, the first circuit of the secondary power amplifier and the second circuit of the secondary power amplifier are respectively disposed on different circuit boards, and a shielding plate is disposed between the first circuit of the secondary power amplifier and the second circuit of the secondary power amplifier, the width of the shielding plate being equal to the width of the first circuit of the secondary power amplifier and the second circuit of the secondary power amplifier.

[0037] It is easy to understand that the first circuit and the second circuit of the two-stage power amplifier have the same structure, so the width of the first circuit of the two-stage power amplifier is equal to the width of the second circuit of the two-stage power amplifier.

[0038] This invention designs the power amplifier in a split manner, with amplification achieved sequentially through a pre-amplifier and a secondary power amplifier. Therefore, the pre-amplifier and the secondary power amplifier can be set in different chambers to amplify high-frequency signals in different chambers, reducing electromagnetic radiation and facilitating testing and replacement. Meanwhile, to minimize mutual interference between high-power microwaves in a confined space, a metal shielding plate was installed between the two secondary power amplifiers. The width of the shielding plate was the same as the width of the secondary power amplifiers to improve isolation.

[0039] In one embodiment, the first chamber and the second chamber adopt a water-cooled chamber structure, wherein the water-cooling pipe of the first chamber is located below the primary power amplifier circuit, and the water-cooling pipe of the second chamber is located below the primary power amplifier first circuit and the primary power amplifier second circuit.

[0040] In one embodiment, the water-cooling pipe of the first chamber is disposed below the first-stage power amplifier chip in the first-stage power amplifier circuit, and the water-cooling pipe of the second chamber is disposed below the first-stage power amplifier chip in the first-stage power amplifier circuit and the second-stage power amplifier chip in the second-stage power amplifier circuit.

[0041] A water-cooling pipe is installed below the power amplifier circuit to alleviate the heat generated by the circuit outputting high-power signals and solve the heat dissipation problem under high heat power density.

[0042] In one embodiment, the preamplifier unit, power divider, first secondary power amplifier circuit, second secondary power amplifier circuit, and power combining unit are respectively disposed on different circuit boards.

[0043] It is easy to understand that the preamplifier unit is an independent circuit board, the power divider, the first circuit of the second-stage power amplifier, and the second circuit of the second-stage power amplifier in the main power amplifier unit are set on different circuit boards, and the power combining unit is set on an independent circuit board.

[0044] In one embodiment, each circuit board is provided with a copper substrate to aid in heat dissipation. Specifically, the power amplifier chips in the first-stage power amplifier circuit, the first second-stage power amplifier circuit, and the second second-stage power amplifier circuit are provided with copper substrates.

[0045] In one embodiment, the first circuit of the secondary power amplifier and the first circulator are disposed on the same copper substrate, while the second circuit of the secondary power amplifier and the second circulator are disposed on a different copper substrate.

[0046] It should be noted that more than two copper substrates are used; this description only indicates that different copper substrates are used for the two secondary power amplifier circuits. Since the secondary power amplifier and circulator are connected via microwave capacitors, and high-power microwave transmission is susceptible to factors such as gaps between copper modules and microstrip losses, the output structure of the third part of the kilowatt-level power amplifier has been adapted to realistically simulate actual operating conditions: the secondary power amplifier and circulator are located on the same circuit board and equipped with copper substrates; an N-type connector is fixed on the copper substrate at the output end of each circulator. The two output signals are connected to a high-power attenuator via cables, and the power is finally measured by a power meter.

[0047] In one embodiment, a thermally conductive layer is provided between each electrical device (including: a first isolator, a first-stage power amplifier circuit, a second isolator, a power divider, a second-stage power amplifier first circuit, a second-stage power amplifier second circuit, a first circulator, a second circulator, and a power combiner) and the first or second chamber. The thermally conductive layer may be thermally conductive silicone grease, a film, or a phase change material.

[0048] In one embodiment, the first chamber and the second chamber are respectively provided with a first cover plate and a second cover plate, the opening of the first chamber matches the first cover plate, and the opening of the second chamber matches the second cover plate.

[0049] In one embodiment, both the first cover plate and the second cover plate adopt a stepped sealing design.

[0050] It is easy to understand that the first and second chambers are semi-open designs, and the openings of the chambers are matched with the corresponding cover plates.

[0051] Existing solid-state microwave sources have relatively harsh operating conditions. The power amplifier must be tested before it can be put into actual operation. The power amplifier must be assembled and sealed before testing. If the test results show that the power amplifier needs to be replaced, it is necessary to disassemble and test which part of the power amplifier is faulty, which is a troublesome testing process. In contrast, the present invention sets the power amplifier chips on different circuit boards, and the circuit boards are shielded to reduce electromagnetic radiation and facilitate testing and debugging before use.

[0052] Furthermore, due to the high output power and high heat power density of the power amplifier, the existing cavity structure design has technical problems: open design is prone to excessive electromagnetic radiation, while closed cavity may cause arcing or self-excited oscillation due to excessive power density, which restricts the further improvement of power capacity; therefore, this application adopts a semi-open cavity design, and the debugging before use is carried out without the cover plate, which facilitates testing and replacement.

[0053] In one embodiment, both the first chamber and the second chamber are made of aluminum.

[0054] This invention also provides a method for manufacturing a power amplifier, comprising: The electrical components on each circuit board corresponding to each unit of the power amplifier are soldered using high-temperature soldering. The copper is fixed to each circuit board by pre-set fixing screw holes for fixing copper; The power amplifier chips in the first-stage power amplifier circuit, the first circuit of the second-stage power amplifier, and the second circuit of the second-stage power amplifier are pre-tinned with low-temperature solder. Low-temperature solder pads are laid in the corresponding copper groove positions and flux is evenly applied. Low-temperature solder pads are laid on the copper positions below the output terminals of the main power amplifier unit (i.e., the output terminals of the first circuit of the second power amplifier and the second circuit of the second power amplifier), and low-temperature solder pads are laid on the bottom non-hollow part of the power combining unit. The circuit boards corresponding to the pre-amplifier unit, the first circuit of the second-stage power amplifier, the second circuit of the second-stage power amplifier, and the power combining unit were welded in a vacuum heating furnace. Each circuit board is fixed to the first chamber and the second chamber via pre-set fixing screw holes; Based on the connection relationship of the power amplifier mentioned above, connect the pre-amplifier unit, the main power amplifier unit, and the power combining unit to obtain the power amplifier.

[0055] In one embodiment, the method of manufacturing the power amplifier further includes: fixing a first cover plate to the opening of a first chamber to form a sealed space in the first chamber; and fixing a second cover plate to the opening of a second chamber to form a sealed space in the second chamber.

[0056] In one embodiment, the manufacturing method of the power amplifier further includes: fixing the circuit board with M3 screws and fixing the copper module with M2.5 screws. After the circuit is soldered, the screws are removed and replaced with 2.5 screws to fix it to the first chamber and the second chamber.

[0057] like Figure 3 As shown, this embodiment of the invention also provides a test method for a power amplifier, applied to the aforementioned power amplifier, comprising: Test the output of the power divider separately to determine whether the power difference between the two output signals of the power divider exceeds the preset low power difference threshold; if so, replace the power divider and continue testing the power divider. If not, connect the output of the main power amplifier unit to the input of the first attenuator and the input of the second attenuator respectively, and connect the output of the first attenuator and the output of the second attenuator to the input of the first power meter and the input of the second power meter respectively. The power of the first circuit and the second circuit of the two-stage power amplifier are obtained by measuring with the first power meter and the second power meter, respectively. Determine whether the power difference between the first circuit of the secondary power amplifier and the second circuit of the secondary power amplifier exceeds the preset high power difference threshold. If not, then the power amplifier is confirmed to meet the standard, and the first cover plate and the second cover plate are sealed accordingly to obtain a complete power amplifier; if yes, then any power amplifier chip in the first circuit of the second-stage power amplifier or the second circuit of the second-stage power amplifier is replaced.

[0058] Before assembly, the core functional modules must be tested, especially the two secondary power amplifiers. Although the power amplifier chips, circuit components, and soldering positions are exactly the same, the unavoidable differences due to inconsistencies in the chips themselves and slight differences in soldering will result in the output functions not being exactly the same. If two secondary power amplifier circuits with a large difference in output power are assembled together, the heat-conducting end of the load may overheat severely, and the stability of the power amplifier will be greatly reduced over time. Therefore, the modules of the secondary power amplifiers must be screened before assembly.

[0059] In one embodiment, the high power difference threshold is 5W.

[0060] The embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0061] This document describes embodiments of the invention, including preferred embodiments known to the inventors for carrying out the invention. Variations of these embodiments will become apparent to those skilled in the art upon reading the foregoing description. The inventors encourage those skilled in the art to adopt such variations as appropriate, and the inventors intend to practice embodiments of the invention in ways other than those specifically described herein. Therefore, the scope of the invention includes all modifications and equivalents of the subject matter set forth in the appended claims, as permitted by applicable law. Furthermore, the scope of the invention covers any combination of the foregoing elements in all possible variations thereof, unless otherwise indicated herein or otherwise clearly contradicted by the context.

Claims

1. A power amplifier applied to a solid-state microwave source, characterized in that, The power of the output signal is Y watts, including: The system includes a preamplifier unit, a main amplifier unit, and a power combining unit; the main amplifier unit comprises X secondary amplifier circuits. The input of the power amplifier is connected to the preamplifier unit, which amplifies the signal input to the power amplifier in one stage. The output of the preamplifier unit is connected to the input of the main power amplifier unit, which distributes and amplifies the amplified signal in two stages. The rated output power of each secondary power amplifier circuit is not less than Y / X watts. The output of the main power amplifier unit is connected to the input of the power combining unit, which outputs the amplified power signal. Wherein, Y≥1000, and X is a positive integer.

2. A power amplifier according to claim 1, characterized in that, X=2, the main power amplifier unit includes the first circuit of the second-stage power amplifier, the second circuit of the second-stage power amplifier, and a power divider; The power divider connects its input to the output of the preamplifier unit and its output to the inputs of the first and second secondary power amplifier circuits, respectively, to evenly distribute the signal amplified by the preamplifier unit to the first and second secondary power amplifier circuits.

3. A power amplifier according to claim 2, characterised in that, The first circuit and the second circuit of the secondary power amplifier are respectively set on different circuit boards, and a shielding plate is set between the circuit boards corresponding to the first circuit and the circuit boards corresponding to the second circuit. The difference between the width of the shielding plate and the width of the circuit boards corresponding to the first circuit and the second circuit is less than a preset width difference threshold.

4. A power amplifier according to claim 2, characterized in that The preamplifier unit is located in the first chamber, and the main amplifier unit and power combining unit are located in the second chamber. A through hole is provided between the first chamber and the second chamber. The output end of the preamplifier unit is connected to a coaxial transmission line, and the coaxial transmission line passes through the through hole and is connected to the input end of the main amplifier unit.

5. A power amplifier according to claim 4, characterised in that The first chamber and the second chamber adopt a water-cooled chamber structure. The water-cooling pipe of the first chamber is located below the primary power amplifier circuit, and the water-cooling pipe of the second chamber is located below the primary power amplifier circuit and the secondary power amplifier circuit.

6. A power amplifier according to claim 4, characterized in that The first chamber and the second chamber are respectively equipped with a first cover plate and a second cover plate. The opening of the first chamber matches the first cover plate, and the opening of the second chamber matches the second cover plate.

7. A power amplifier according to claim 4, wherein The power combining unit includes: a first circulator, a second circulator, and a power combiner; The first circulator and the second circulator have their input terminals connected to the output terminals of the first circuit and the second circuit of the two-stage power amplifier, respectively, and their output terminals connected to the input terminals of the power combiner, respectively. Their isolation terminals are connected to the first load and the second load, respectively. The signal output from the power combiner is the signal output from the power amplifier.

8. A power amplifier according to claim 2, characterized in that The preamplifier unit, power divider, first circuit of the second power amplifier, second circuit of the second power amplifier, and power combining unit are respectively set on different circuit boards; The preamplifier unit includes: a first isolator, a first-stage power amplifier circuit, and a second isolator; The input of the power amplifier is connected to the input terminal of the first isolator, the output terminal of the first isolator is connected to the input terminal of the first-stage power amplifier circuit, the output terminal of the first-stage power amplifier circuit is connected to the input terminal of the second isolator, and the output terminal of the second isolator is connected to the input terminal of the power divider.

9. A test method for a power amplifier, applied to a power amplifier as described in any one of claims 1 to 8, comprising: Connect the output of the main power amplifier unit to the input of each of the X attenuators, and connect the output of each attenuator to the input of each of the X power meters. The power of each secondary power amplifier circuit is obtained by measuring with X power meters. Determine whether the power difference between each secondary power amplifier circuit exceeds the preset high power difference threshold. If not, then the power amplifier is confirmed to meet the standard; if yes, then replace any power amplifier chip in the first circuit of the second-stage power amplifier or the second circuit of the second-stage power amplifier.

10. A solid state microwave source, characterized by, Includes the power amplifier as described in any one of claims 1 to 8.

Images