Circuit board manufacturing method and system based on embedded 3D printing

Abstract

The invention discloses a circuit board manufacturing method and system based on embedded 3D printing, and the method comprises the steps: generating a printing path of a target circuit board according to the three-dimensional model structure data of the target circuit board; printing an insulating medium layer on the working substrate by using a multi-material droplet jetting technology, and printing a sacrificial material on a corresponding preset pattern area and a vertical interconnection channel area on the insulating medium layer to form a sacrificial material continuous channel; selectively transferring and depositing a conductive material to a region, which is not covered by the sacrificial material, on the insulating dielectric layer by using a laser-induced forward transfer technology, so as to form a conductive circuit layer and obtain a first layer of the circuit board; a plurality of insulating medium layers and conductive circuit layers are circularly constructed on the first layer of the circuit board; and after all the insulating dielectric layers and the conductive circuit layers are constructed, removing all the sacrificial materials to obtain a target circuit board. An additive manufacturing mode is adopted in the whole process, the technological process is simplified, and high conductivity and high reliability can be achieved.

Description

Technical Field

[0001] This invention relates to the field of circuit board technology, and in particular to a circuit board manufacturing method and system based on embedded 3D printing. Background Technology

[0002] Currently, the mainstream PCB industry adopts traditional PCB processes based on subtractive manufacturing. Typical processes include copper lamination, photolithography, chemical etching, mechanical drilling, chemical copper plating, and electroplating. However, this process is complex, prone to pollution, and manufactured in a two-dimensional plane, making it difficult to achieve complex three-dimensional structures such as three-dimensional wiring.

[0003] To address this, some technologies apply additive manufacturing to PCB production. This involves first printing an insulating substrate with microchannels, then depositing conductive lines within the channels using liquid phase deposition. However, liquid-phase deposited metal lines exhibit low density and conductivity. The quality of the microchannel inner wall directly affects the deposition effect, requiring high process stability and making it difficult to achieve high-quality filling of high aspect ratio vias. Summary of the Invention

[0004] This invention provides a method and system for manufacturing circuit boards based on embedded 3D printing, in order to solve the technical problem of low circuit conductivity in existing PCB manufacturing processes.

[0005] In a first aspect, the present invention provides a circuit board manufacturing method based on embedded 3D printing, comprising: Based on the three-dimensional model structure data of the target circuit board, the printing paths for the dielectric structure, sacrificial material, and conductive lines of the target circuit board are generated. Using multi-material microdroplet jetting technology, an insulating dielectric layer is printed on a working substrate according to the printing path of the dielectric structure, and a sacrificial material is printed on the corresponding preset pattern area and / or vertical interconnect channel area on the insulating dielectric layer according to the printing path of the sacrificial material, forming a continuous channel of sacrificial material. Using laser-induced forward transfer technology, conductive material is selectively transferred and deposited onto the area of ​​the insulating dielectric layer that is not covered by the sacrificial material, according to the conductive line printing path, to form a conductive line layer and obtain the first layer of the circuit board; On the first layer of the circuit board, multiple layers of insulating dielectric layers and conductive circuit layers are cyclically constructed; After all insulating dielectric layers and conductive circuit layers are constructed, all sacrificial materials are removed to obtain the target circuit board.

[0006] In some embodiments, the method of using multi-material microdroplet jetting technology to print an insulating dielectric layer on a working substrate according to the dielectric structure printing path, and printing sacrificial material in the corresponding preset pattern area and / or vertical interconnect channel area on the insulating dielectric layer according to the sacrificial material printing path to form a continuous channel of sacrificial material includes: The three-dimensional model is sliced ​​to obtain multiple cross-sectional layer data of the three-dimensional model; Based on the multiple cross-sectional layers, the geometric contour of each cross-sectional layer is identified to extract the insulating dielectric contour and conductive pattern contour of each cross-sectional layer; Based on the insulating dielectric profile and the conductive pattern profile, the printing path of the dielectric structure, the printing path of the sacrificial material, and the printing path of the conductive lines for each of the cross-sectional layers are planned.

[0007] In some embodiments, the process of printing an insulating dielectric layer on a working substrate using multi-material microdroplet jetting technology, according to the dielectric structure printing path, includes: According to the printing path of the medium structure, the insulating medium material is printed on the working substrate to form the insulating medium layer. At the same time, based on the preset timing logic and according to the printing path of the sacrificial material, the sacrificial material droplets are sprayed onto the preset pattern area at the target time point so that the sacrificial material is wrapped by the uncured insulating medium material. The insulating dielectric layer is cured, and the cured insulating dielectric layer is verified to meet the preset conditions. If the cured insulating dielectric layer meets the preset conditions, proceed to the next step; if the cured insulating dielectric layer does not meet the preset conditions, perform compensation treatment on the insulating dielectric layer.

[0008] In some embodiments, the preset timing logic includes: When the minimum linewidth in the preset pattern area or vertical interconnect channel area is less than the first preset value, after printing a continuous area of ​​the insulating dielectric layer, the sacrificial material is printed in the preset pattern area corresponding to the continuous area. When the image complexity in the preset graphic area or vertical interconnect channel area is less than the second preset value, the insulating dielectric material and the sacrificial material are printed alternately in the same motion stroke according to the composite path, wherein the composite path is a merged path of the dielectric structure printing path and the sacrificial material printing path.

[0009] In some embodiments, if the cured insulating dielectric layer does not meet the preset conditions, a compensation process is performed on the insulating dielectric layer, including: If the alignment deviation between the position data of the cured insulating dielectric layer and the three-dimensional model structure data is greater than the first preset difference, the alignment deviation of the insulating dielectric layer is determined, and a path offset compensation amount is generated based on the alignment deviation value to perform alignment compensation processing on the insulating dielectric layer. If the morphological deviation between the morphological data of the cured insulating dielectric layer and the 3D model structure data is greater than a second preset difference, the morphological deviation of the insulating dielectric layer is determined, and microdroplet jetting compensation parameters are generated based on the morphological deviation value for morphological compensation processing of the insulating dielectric layer.

[0010] In some embodiments, the use of laser-induced forward transfer technology to selectively transfer and deposit conductive material onto areas of the insulating dielectric layer not covered by the sacrificial material, according to the conductive line printing path, to form a conductive line layer and obtain the first layer of the circuit board, includes: A transparent donor substrate covered with a uniform conductive material layer is arranged parallel above the insulating dielectric layer and calibrated to an inert gas atmosphere gap of a preset width. The conductive line printing path data is mapped to the scanning path of the laser scanning system, and the scanning path is compensated for z-axis focal length based on the preset width to obtain the scanning compensation path. According to the scanning compensation path, the pulsed laser beam of the laser scanning system is controlled to penetrate the transparent donor substrate in sequence to induce the conductive material on the transparent donor substrate to undergo an instantaneous phase change and detach from the donor, and then be directionally deposited to the exposed area corresponding to the insulating dielectric layer under the drive of pulse pressure. The conductive circuit layer is formed through the path scanning accumulation effect of the laser scanning system.

[0011] In some embodiments, the step of removing all sacrificial materials after all insulating dielectric layers and conductive line layers have been constructed to obtain the target circuit board includes: After all insulating dielectric layers and conductive circuit layers are constructed, a solvent is added to the communication port of the continuous channel of the sacrificial material located on the outer surface of the circuit board, and the solvent is allowed to penetrate the entire continuous channel of the sacrificial material to dissolve and remove all sacrificial material, thereby obtaining the target circuit board.

[0012] Secondly, the present invention provides a circuit board manufacturing system based on embedded 3D printing, comprising: The path generation module is used to generate the dielectric structure printing path, sacrificial material printing path, and conductive line printing path of the target circuit board based on the three-dimensional model structure data of the target circuit board. The microdroplet jetting module is used to print an insulating dielectric layer on a working substrate according to the printing path of the dielectric structure using multi-material microdroplet jetting technology, and to print sacrificial material in the corresponding preset pattern area and vertical interconnect channel area on the insulating dielectric layer according to the printing path of the sacrificial material, thereby forming a continuous channel of sacrificial material. The laser printing module is used to selectively transfer and deposit conductive material onto the area of ​​the insulating dielectric layer that is not covered by the sacrificial material, according to the conductive line printing path, using laser-induced forward transfer technology to form a conductive line layer and obtain the first layer of the circuit board. A circulation module is used to cyclically construct multiple layers of insulating dielectric layers and conductive circuit layers on the first layer of the circuit board. The post-processing module is used to remove all sacrificial materials after all insulating dielectric layers and conductive circuit layers have been constructed, so as to obtain the target circuit board.

[0013] Thirdly, the present invention also provides a circuit board manufacturing apparatus, including a processor and a memory, the memory being used to store a computer program, which, when executed by the processor, implements the circuit board manufacturing method based on embedded 3D printing as described in the first aspect.

[0014] Fourthly, the present invention also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the circuit board manufacturing method based on embedded 3D printing as described in the first aspect.

[0015] Compared with the prior art, the present invention has the following beneficial effects: This invention employs additive manufacturing throughout, avoiding the severe pollution caused by traditional etching and electroplating, and simplifying the process flow. The use of microdroplet jetting ensures micron-level printing precision for both insulating and sacrificial materials, while laser transfer printing of metal routes provides the high conductivity and reliability of traditional copper-clad laminates. The continuous channel printing of sacrificial materials allows for the simultaneous formation of vertical interconnect vias and planar circuits, and the embedded structure ensures the flatness of the circuit surface and excellent mechanical protection, meeting the manufacturing requirements for three-dimensional circuit board structures that include curved wiring, embedded cavities, and complex three-dimensional interconnects. Attached Figure Description

[0016] Figure 1 This is a schematic flowchart illustrating a circuit board manufacturing method based on embedded 3D printing, as shown in an embodiment of the present invention. Figure 2 This is a partial top view of the first layer of the circuit board shown in an embodiment of the present invention; Figure 3 This is a structural block diagram of a circuit board manufacturing system based on embedded 3D printing, as shown in an embodiment of the present invention. Figure 4 This is a structural block diagram of a circuit board manufacturing equipment shown in an embodiment of the present invention. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Please refer to Figure 1 , Figure 1 This is a flowchart illustrating a circuit board manufacturing method based on embedded 3D printing, provided by an embodiment of the present invention. The circuit board manufacturing method based on embedded 3D printing in this embodiment includes steps S101 to S105, detailed below: Step S101: Based on the three-dimensional model structure data of the target circuit board, generate the dielectric structure printing path, sacrificial material printing path, and conductive line printing path of the target circuit board.

[0019] In this step, the dielectric structure printing path guides the layer-by-layer stacking of the insulating substrate (such as photosensitive resin) to ensure the geometry and mechanical strength of the insulating layer; the sacrificial material printing path defines the deposition location of a removable temporary material (such as a water-soluble polymer), which forms a negative cavity template with vertical through holes on the surface of the insulating layer; and the conductive line printing path controls the deposition trajectory of metallic materials (such as copper foil) in the laser-induced forward transfer process.

[0020] In some embodiments, step S101 includes: The three-dimensional model is sliced ​​to obtain multiple cross-sectional layer data of the three-dimensional model; Based on the multiple cross-sectional layers, the geometric contour of each cross-sectional layer is identified to extract the insulating dielectric contour and conductive pattern contour of each cross-sectional layer; Based on the insulating dielectric profile and the conductive pattern profile, the printing path of the dielectric structure, the printing path of the sacrificial material, and the printing path of the conductive lines for each of the cross-sectional layers are planned.

[0021] In this embodiment, based on the three-dimensional digital model of the target circuit board (such as CAD file, STEP file, or STL file), an adaptive layering algorithm is used for discretization. According to the accuracy requirements of the circuit design (such as minimum line width and line spacing), the fluidity and curing characteristics of the insulating material, and the resolution of laser processing, the slice thickness of each layer is dynamically determined (for example, a thin layer of 10-50 μm is used in the fine wiring layer, and a thick layer of 50-100 μm can be used in the pure dielectric support area), thereby producing a series of parallel two-dimensional cross-sectional layer data. For each two-dimensional cross-sectional layer, the insulation contour, sacrificial material occupancy area, and conductive pattern of each layer are extracted and converted into corresponding machine motion instructions (such as G-code) to realize the collaborative additive manufacturing of the three materials.

[0022] Step S102: Using multi-material microdroplet jetting technology, an insulating dielectric layer is printed on the working substrate according to the dielectric structure printing path, and sacrificial material is printed on the corresponding preset pattern area and / or vertical interconnect channel area on the insulating dielectric layer according to the sacrificial material printing path, forming a continuous channel of sacrificial material.

[0023] In this step, multi-material microdroplet jetting technology uses nozzles based on piezoelectric or thermal bubble principles to jet droplets from picolinates to nanoliters as needed. The insulating dielectric layer is formed by layer-by-layer deposition and curing of materials such as UV-curable photosensitive resins; the sacrificial material is a removable material such as a water-soluble polymer (e.g., PVA), which is printed into specific structures according to the path where conductors (e.g., pre-defined pattern areas) and vias, blind vias, etc. (vertical interconnection channel areas) need to be formed; the continuous channel of the sacrificial material refers to ensuring that the sacrificial material is interconnected in three-dimensional space to form a network during printing. By precisely controlling the nozzle switching, movement, and material switching through the printing path, the sacrificial material extends from the interior of the structure to the accessible external interface to form the insulating dielectric layer and provide a physical channel for the subsequent complete removal of the sacrificial material.

[0024] In some embodiments, step S102 includes: According to the printing path of the medium structure, the insulating medium material is printed on the working substrate to form the insulating medium layer. At the same time, based on the preset timing logic and according to the printing path of the sacrificial material, the sacrificial material droplets are sprayed onto the preset pattern area at the target time point so that the sacrificial material is wrapped by the uncured insulating medium material. The insulating dielectric layer is cured, and the cured insulating dielectric layer is verified to meet the preset conditions. If the cured insulating dielectric layer meets the preset conditions, proceed to the next step; if the cured insulating dielectric layer does not meet the preset conditions, perform compensation treatment on the insulating dielectric layer.

[0025] In this step, based on path data and a preset timing sequence, the insulating material nozzle is controlled to perform layer printing. At specific coordinates or times, the sacrificial material nozzle is triggered to perform interlaced spraying, causing sacrificial material droplets to fall into the uncured insulating layer. After curing, the layer thickness and surface morphology are scanned in real time for verification. If the deviation exceeds the limit, a compensation step is initiated, controlling the nozzle to perform local re-printing or global overprinting in the defective area, and correcting the nozzle printing parameters to avoid multi-layer circuit alignment failures and interconnection reliability issues caused by layer accumulation errors, significantly improving the stability of the manufacturing process and the yield.

[0026] In some embodiments, the preset timing logic includes: When the minimum line width in the preset graphic area is less than the first preset value, after printing a continuous area of ​​the insulating dielectric layer, the sacrificial material is printed in the preset graphic area corresponding to the continuous area. When the image complexity in the preset graphic area is less than the second preset value, the insulating medium material and the sacrificial material are printed alternately in the same motion stroke according to the composite path. The composite path is the merged path of the medium structure printing path and the sacrificial material printing path.

[0027] In this embodiment, for areas with fine linewidths, a step-by-step isolation printing strategy is adopted. This strategy ensures the size limits and edge clarity of the sacrificial material template through isolated printing, avoiding material interference. For simple graphic areas, a composite path interlacing printing strategy is adopted. This strategy combines the deposition instructions of two materials through a path optimization algorithm, enabling alternating spraying of multiple materials within a single stroke, significantly reducing nozzle idle strokes and the number of start-stop cycles.

[0028] In some embodiments, the compensation process for the insulating dielectric layer includes: If the alignment deviation between the position data of the cured insulating dielectric layer and the three-dimensional model structure data is greater than the first preset difference, the alignment deviation of the insulating dielectric layer is determined, and a path offset compensation amount is generated based on the alignment deviation value to perform alignment compensation processing on the insulating dielectric layer. If the morphological deviation between the morphological data of the cured insulating dielectric layer and the 3D model structure data is greater than a second preset difference, the morphological deviation of the insulating dielectric layer is determined, and microdroplet jetting compensation parameters are generated based on the morphological deviation value for morphological compensation processing of the insulating dielectric layer.

[0029] In this embodiment, for alignment deviation compensation, after each layer of insulating medium has cured, a high-resolution machine vision unit or laser tracking interferometer is used to quickly scan and acquire the actual position data of its surface feature points (such as alignment marks and edge contours), and compares them with the theoretical position data in the 3D model at the pixel or micrometer level. When the calculated deviation value exceeds a first preset tolerance (e.g., ±5 micrometers), it is determined to be an alignment deviation. Subsequently, based on the direction and magnitude of the deviation vector, the corresponding path offset compensation amount is calculated in reverse and generated. This compensation amount includes rotation and scaling factors and is automatically injected into the printing path planning of the next layer and all subsequent related layers, dynamically adjusting the nozzle's movement trajectory, thereby correcting accumulated errors in subsequent deposition and ensuring the absolute alignment accuracy of the multilayer structure in 3D space.

[0030] For topography deviation compensation, a three-dimensional topography scan of the cured layer surface is performed using a confocal displacement sensor or white light interferometer to generate a high-precision actual surface topology map, which is then compared point-by-point with the theoretical surface data of the three-dimensional model. When local depressions, protrusions, or overall thickness unevenness are detected, and the deviation value exceeds the second preset tolerance (e.g., thickness deviation > ±3%), it is determined to be a topography deviation. Subsequently, based on the deviation value spectrum of each deviation point, a set of microdroplet jetting compensation parameters is generated. For example, for depressed areas, the jetting frequency or microdroplet volume per unit area is increased to implement fill-type compensation printing; for protruding areas, subsequent printing reduces or suspends microdroplet jetting in that area to ensure the flatness and dimensional consistency of each layer surface, providing a perfect geometric structure for the subsequent transfer and deposition of high-quality circuit patterns.

[0031] The manufacturing process in this embodiment has extremely high fault tolerance and adaptability, and can actively overcome inherent or random interferences such as equipment mechanical errors, uneven material shrinkage, and environmental disturbances, effectively reducing the accumulation of errors that are difficult to avoid in traditional open-loop additive manufacturing.

[0032] Step S103: Using laser-induced forward transfer technology, conductive material is selectively transferred and deposited onto the area of ​​the insulating dielectric layer not covered by the sacrificial material according to the conductive line printing path, forming a conductive line layer and obtaining the first layer of the circuit board.

[0033] In this step, laser-induced forward transfer technology involves controlling a pulsed laser beam to focus on the surface of an independent metal foil (such as copper foil) donor. The laser energy creates localized high temperature and pressure on the donor, propelling micron-sized molten metal droplets or plasma forward and precisely depositing them onto the acceptor plane. A sacrificial material acts as a physical isolation layer to prevent metal from adhering to non-circuit areas. For example, Figure 2 This diagram shows a partial top view of the first layer of the circuit board, with through-holes / blind vias printed using sacrificial material.

[0034] This step directly transfers high-purity metal foil using laser-induced forward technology, avoiding organic matter and pores in traditional inks, making the circuit conductivity approach that of bulk metal. The high-temperature and high-pressure environment generated by the laser causes the molten metal to solidify densely, forming a nearly defect-free microstructure and significantly reducing bulk resistance. The high-temperature interface effect forms a metallurgical bonding transition layer between the metal and the substrate, significantly reducing contact resistance and improving bonding strength and stability, thereby forming a high-density, high-conductivity embedded bulk metal circuit with electrical performance comparable to traditional copper clad laminate processes.

[0035] In some embodiments, step S103 includes: A transparent donor substrate covered with a uniform conductive material layer is arranged parallel above the insulating dielectric layer and calibrated to an inert gas atmosphere gap of a preset width. The conductive line printing path data is mapped to the scanning path of the laser scanning system, and the scanning path is compensated for z-axis focal length based on the preset width to obtain the scanning compensation path. According to the scanning compensation path, the pulsed laser beam of the laser scanning system is controlled to penetrate the transparent donor substrate in sequence to induce the conductive material on the transparent donor substrate to undergo an instantaneous phase change and detach from the donor, and then be directionally deposited to the exposed area corresponding to the insulating dielectric layer under the drive of pulse pressure. The conductive circuit layer is formed through the path scanning accumulation effect of the laser scanning system.

[0036] In this embodiment, a transparent glass or quartz substrate coated with a uniform metal film (such as a copper film) is used as a donor. A high-precision displacement platform positions the substrate parallel to the insulating dielectric layer, maintaining a precisely controllable inert gas gap to prevent material oxidation and regulate shock wave dynamics. Two-dimensional conductive line data is converted into three-dimensional laser scanning commands, and the laser focal length is dynamically compensated based on the real-time gap width to generate a precise scanning compensation path. A pulsed laser (such as a nanosecond or femtosecond laser) is sequentially focused onto the donor metal film along this path, inducing instantaneous vaporization or plasma phase transition. The resulting pulse pressure directionally pushes molten metal droplets onto the exposed area of ​​the underlying insulating layer. This process of multiple accumulations forms the conductive line layer.

[0037] Step S104: On the first layer of the circuit board, multiple layers of insulating dielectric layer and conductive circuit layer are cyclically constructed.

[0038] In this step, based on the preset total number of layers, insulating medium and sacrificial material are repeatedly printed on the already formed first layer to achieve reliable construction from two-dimensional planar circuits to three-dimensional high-density multilayer circuits.

[0039] Step S105: After all insulating dielectric layers and conductive circuit layers are constructed, remove all sacrificial materials to obtain the target circuit board.

[0040] In this step, depending on the properties of the sacrificial material (such as water-soluble polymers or thermally decomposable polymers), the completed structure is immersed in the appropriate solvent (such as deionized water) or placed in a controlled heating environment to remove the sacrificial material.

[0041] In some embodiments, step S105 includes: After all insulating dielectric layers and conductive circuit layers are constructed, a solvent is added to the communication port of the continuous channel of the sacrificial material located on the outer surface of the circuit board, and the solvent is allowed to penetrate the entire continuous channel of the sacrificial material to dissolve and remove all sacrificial material, thereby obtaining the target circuit board.

[0042] In this embodiment, after the sacrificial material is removed, the space originally occupied by the sacrificial material is transformed into a continuous cavity and vertical interconnecting vias. The metal circuit is completely embedded inside the insulating medium. The entire process ensures that there are no residual contaminants inside the circuit, guaranteeing the high insulation reliability, stable electrical performance and superior structural strength of the final product.

[0043] To implement the embedded 3D printing-based circuit board manufacturing method corresponding to the above method embodiments, and to achieve the corresponding functions and technical effects. See also Figure 3 , Figure 3 This diagram illustrates a structural block diagram of a circuit board manufacturing system based on embedded 3D printing according to an embodiment of the present invention. For ease of explanation, only the parts relevant to this embodiment are shown. The circuit board manufacturing system based on embedded 3D printing provided in this embodiment of the present invention includes: The path generation module 301 is used to generate the dielectric structure printing path, sacrificial material printing path and conductive line printing path of the target circuit board based on the three-dimensional model structure data of the target circuit board. The microdroplet jetting module 302 is used to print an insulating dielectric layer on a working substrate according to the printing path of the dielectric structure using multi-material microdroplet jetting technology, and to print sacrificial material in the corresponding preset pattern area and / or vertical interconnect channel area on the insulating dielectric layer according to the printing path of the sacrificial material, thereby forming a continuous channel of sacrificial material. The laser printing module 303 is used to selectively transfer and deposit conductive material onto the area of ​​the insulating dielectric layer that is not covered by the sacrificial material, according to the conductive line printing path, using laser-induced forward transfer technology to form a conductive line layer and obtain the first layer of the circuit board. The circulation module 304 is used to cyclically construct multiple layers of insulating dielectric layers and conductive circuit layers on the first layer of the circuit board; Post-processing module 305 is used to remove all sacrificial materials after all insulating dielectric layers and conductive line layers have been constructed, so as to obtain the target circuit board.

[0044] In some embodiments, the path generation module 301 is specifically used for: The three-dimensional model is sliced ​​to obtain multiple cross-sectional layer data of the three-dimensional model; Based on the multiple cross-sectional layers, the geometric contour of each cross-sectional layer is identified to extract the insulating dielectric contour and conductive pattern contour of each cross-sectional layer; Based on the insulating dielectric profile and the conductive pattern profile, the printing path of the dielectric structure, the printing path of the sacrificial material, and the printing path of the conductive lines for each of the cross-sectional layers are planned.

[0045] In some embodiments, the microdroplet ejection module 302 is specifically used for: According to the printing path of the medium structure, the insulating medium material is printed on the working substrate to form the insulating medium layer. At the same time, based on the preset timing logic and according to the printing path of the sacrificial material, the sacrificial material droplets are sprayed onto the preset pattern area at the target time point so that the sacrificial material is wrapped by the uncured insulating medium material. The insulating dielectric layer is cured, and the cured insulating dielectric layer is verified to meet the preset conditions. If the cured insulating dielectric layer meets the preset conditions, proceed to the next step; if the cured insulating dielectric layer does not meet the preset conditions, perform compensation treatment on the insulating dielectric layer.

[0046] In some embodiments, the preset timing logic includes: When the minimum line width in the preset graphic area is less than the first preset value, after printing a continuous area of ​​the insulating dielectric layer, the sacrificial material is printed in the preset graphic area corresponding to the continuous area. When the image complexity in the preset graphic area is less than the second preset value, the insulating medium material and the sacrificial material are printed alternately in the same motion stroke according to the composite path. The composite path is the merged path of the medium structure printing path and the sacrificial material printing path.

[0047] In some embodiments, the compensation process includes: If the alignment deviation between the position data of the cured insulating dielectric layer and the three-dimensional model structure data is greater than the first preset difference, the alignment deviation of the insulating dielectric layer is determined, and a path offset compensation amount is generated based on the alignment deviation value to perform alignment compensation processing on the insulating dielectric layer. If the morphological deviation between the morphological data of the cured insulating dielectric layer and the 3D model structure data is greater than a second preset difference, the morphological deviation of the insulating dielectric layer is determined, and microdroplet jetting compensation parameters are generated based on the morphological deviation value for morphological compensation processing of the insulating dielectric layer.

[0048] In some embodiments, the laser printing module 303 is specifically used for: A transparent donor substrate covered with a uniform conductive material layer is arranged parallel above the insulating dielectric layer and calibrated to an inert gas atmosphere gap of a preset width. The conductive line printing path data is mapped to the scanning path of the laser scanning system, and the scanning path is compensated for z-axis focal length based on the preset width to obtain the scanning compensation path. According to the scanning compensation path, the pulsed laser beam of the laser scanning system is controlled to penetrate the transparent donor substrate in sequence to induce the conductive material on the transparent donor substrate to undergo an instantaneous phase change and detach from the donor, and then be directionally deposited to the exposed area corresponding to the insulating dielectric layer under the drive of pulse pressure. The conductive circuit layer is formed through the path scanning accumulation effect of the laser scanning system.

[0049] In some embodiments, the post-processing module 305 is specifically used for: After all insulating dielectric layers and conductive circuit layers are constructed, a solvent is added to the communication port of the continuous channel of the sacrificial material located on the outer surface of the circuit board, and the solvent is allowed to penetrate the entire continuous channel of the sacrificial material to dissolve and remove all sacrificial material, thereby obtaining the target circuit board.

[0050] The aforementioned embedded 3D printing-based circuit board manufacturing system can implement the embedded 3D printing-based circuit board manufacturing method described in the above method embodiments. The options in the above method embodiments are also applicable to this embodiment, and will not be detailed here. The remaining contents of this embodiment can be referred to the contents of the above method embodiments, and will not be repeated in this embodiment.

[0051] Figure 4 This is a schematic diagram of a circuit board manufacturing equipment provided in an embodiment of the present invention. Figure 4 As shown, the circuit board manufacturing equipment 4 of this embodiment includes: at least one processor 40 ( Figure 4 (Only one is shown in the diagram), memory 41, and computer program 42 stored in the memory 41 and executable on the at least one processor 40, wherein the processor 40 executes the computer program 42 to implement the steps in any of the above method embodiments.

[0052] The circuit board manufacturing equipment 4 can be a computing device such as a smartphone, tablet, desktop computer, or cloud server. This circuit board manufacturing equipment may include, but is not limited to, a processor 40 and a memory 41. Those skilled in the art will understand that... Figure 4 This is merely an example of the circuit board manufacturing equipment 4 and does not constitute a limitation on the circuit board manufacturing equipment 4. It may include more or fewer components than shown, or combine certain components, or different components, such as input / output devices, network access devices, etc.

[0053] The processor 40 may be a Central Processing Unit (CPU), or it may be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor.

[0054] In some embodiments, the memory 41 may be an internal storage unit of the circuit board manufacturing equipment 4, such as a hard disk or memory of the circuit board manufacturing equipment 4. In other embodiments, the memory 41 may be an external storage device of the circuit board manufacturing equipment 4, such as a plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, etc., equipped on the circuit board manufacturing equipment 4. Further, the memory 41 may include both internal storage units and external storage devices of the circuit board manufacturing equipment 4. The memory 41 is used to store operating systems, applications, bootloaders, data, and other programs, such as the program code of computer programs. The memory 41 can also be used to temporarily store data that has been output or will be output.

[0055] In addition, embodiments of the present invention also provide a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps in any of the above method embodiments.

[0056] This invention provides a computer program product that, when run on a circuit board manufacturing equipment, enables the circuit board manufacturing equipment to implement the steps described in the above-described method embodiments.

[0057] In the several embodiments provided by this invention, it will be understood that each block in the flowchart or block diagram may represent a module, segment, or portion of code, which contains one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those shown in the figures. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved.

[0058] If the aforementioned functions are implemented as software functional modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, essentially, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a circuit board manufacturing device to execute all or part of the steps of the methods described in the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0059] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above descriptions are merely specific embodiments of the present invention and are not intended to limit the scope of protection of the present invention. In particular, it should be noted that any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention for those skilled in the art.

Claims

1. A method for manufacturing a circuit board based on embedded 3D printing, characterized by, include: Based on the three-dimensional model structure data of the target circuit board, the printing paths for the dielectric structure, sacrificial material, and conductive lines of the target circuit board are generated. Using multi-material microdroplet jetting technology, an insulating dielectric layer is printed on a working substrate according to the printing path of the dielectric structure, and a sacrificial material is printed on the corresponding preset pattern area and / or vertical interconnect channel area on the insulating dielectric layer according to the printing path of the sacrificial material, forming a continuous channel of sacrificial material. Using laser-induced forward transfer technology, conductive material is selectively transferred and deposited onto the area of ​​the insulating dielectric layer that is not covered by the sacrificial material, according to the conductive line printing path, to form a conductive line layer and obtain the first layer of the circuit board; On the first layer of the circuit board, multiple layers of insulating dielectric layers and conductive circuit layers are cyclically constructed; After all insulating dielectric layers and conductive circuit layers are constructed, all sacrificial materials are removed to obtain the target circuit board.

2. The embedded 3D printing-based circuit board manufacturing method according to claim 1, characterized by, The step of generating the dielectric structure printing path, sacrificial material printing path, and conductive line printing path of the target circuit board based on the three-dimensional model structure data of the target circuit board includes: The three-dimensional model is sliced ​​to obtain multiple cross-sectional layer data of the three-dimensional model; Based on the multiple cross-sectional layers, the geometric contour of each cross-sectional layer is identified to extract the insulating dielectric contour and conductive pattern contour of each cross-sectional layer; Based on the insulating dielectric profile and the conductive pattern profile, the printing path of the dielectric structure, the printing path of the sacrificial material, and the printing path of the conductive lines for each of the cross-sectional layers are planned.

3. The method of claim 1, wherein the method further comprises: The method of using multi-material microdroplet jetting technology to print an insulating dielectric layer on a working substrate according to the dielectric structure printing path, and printing sacrificial material on the corresponding preset pattern area and / or vertical interconnect channel area on the insulating dielectric layer according to the sacrificial material printing path, forming a continuous channel of sacrificial material, includes: According to the printing path of the medium structure, the insulating medium material is printed on the working substrate to form the insulating medium layer. At the same time, based on the preset timing logic and according to the printing path of the sacrificial material, the sacrificial material droplets are sprayed onto the preset pattern area and / or the vertical interconnect channel area at the target time point. The insulating dielectric layer is cured, and the cured insulating dielectric layer is verified to meet the preset conditions. If the cured insulating dielectric layer meets the preset conditions, proceed to the next step; if the cured insulating dielectric layer does not meet the preset conditions, perform compensation treatment on the insulating dielectric layer.

4. The circuit board manufacturing method based on embedded 3D printing according to claim 3, characterized in that, The preset timing logic includes: When the minimum linewidth in the preset pattern area or vertical interconnect channel area is less than the first preset value, after printing a continuous area of ​​the insulating dielectric layer, the sacrificial material is printed in the preset pattern area corresponding to the continuous area. When the image complexity in the preset graphic area or vertical interconnect channel area is less than the second preset value, the insulating dielectric material and the sacrificial material are printed alternately in the same motion stroke according to the composite path, wherein the composite path is a merged path of the dielectric structure printing path and the sacrificial material printing path.

5. The circuit board manufacturing method based on embedded 3D printing according to claim 3, characterized in that, If the cured insulating dielectric layer does not meet the preset conditions, a compensation process is performed on the insulating dielectric layer, including: If the alignment deviation between the position data of the cured insulating dielectric layer and the three-dimensional model structure data is greater than the first preset difference, the alignment deviation of the insulating dielectric layer is determined, and a path offset compensation amount is generated based on the alignment deviation value to perform alignment compensation processing on the insulating dielectric layer. If the morphological deviation between the morphological data of the cured insulating dielectric layer and the 3D model structure data is greater than a second preset difference, the morphological deviation of the insulating dielectric layer is determined, and microdroplet jetting compensation parameters are generated based on the morphological deviation value for morphological compensation processing of the insulating dielectric layer.

6. The circuit board manufacturing method based on embedded 3D printing according to claim 1, characterized in that, The method utilizes laser-induced forward transfer technology to selectively transfer and deposit conductive material onto areas of the insulating dielectric layer not covered by the sacrificial material, according to the conductive circuit printing path, to form a conductive circuit layer, thus obtaining the first layer of the circuit board, including: A transparent donor substrate covered with a uniform conductive material layer is arranged parallel above the insulating dielectric layer and calibrated to an inert gas atmosphere gap of a preset width. The conductive line printing path data is mapped to the scanning path of the laser scanning system, and the scanning path is compensated for z-axis focal length based on the preset width to obtain the scanning compensation path. According to the scanning compensation path, the pulsed laser beam of the laser scanning system is controlled to penetrate the transparent donor substrate in sequence to induce the conductive material on the transparent donor substrate to undergo an instantaneous phase change and detach from the donor, and then be directionally deposited to the exposed area corresponding to the insulating dielectric layer under the drive of pulse pressure. The conductive circuit layer is formed through the path scanning accumulation effect of the laser scanning system.

7. The circuit board manufacturing method based on embedded 3D printing according to claim 1, characterized in that, After all insulating dielectric layers and conductive circuit layers are constructed, all sacrificial materials are removed to obtain the target circuit board, including: After all insulating dielectric layers and conductive circuit layers are constructed, a solvent is added to the communication port of the continuous channel of the sacrificial material located on the outer surface of the circuit board, and the solvent is allowed to penetrate the entire continuous channel of the sacrificial material to dissolve and remove all sacrificial material, thereby obtaining the target circuit board.

8. A circuit board manufacturing system based on embedded 3D printing, characterized in that, include: The path generation module is used to generate the dielectric structure printing path, sacrificial material printing path, and conductive line printing path of the target circuit board based on the three-dimensional model structure data of the target circuit board. The microdroplet jetting module is used to print an insulating dielectric layer on a working substrate according to the printing path of the dielectric structure using multi-material microdroplet jetting technology, and to print sacrificial material in the corresponding preset pattern area and / or vertical interconnect channel area on the insulating dielectric layer according to the printing path of the sacrificial material, thereby forming a continuous channel of sacrificial material. The laser printing module is used to selectively transfer and deposit conductive material onto the area of ​​the insulating dielectric layer that is not covered by the sacrificial material, according to the conductive line printing path, using laser-induced forward transfer technology to form a conductive line layer and obtain the first layer of the circuit board. A circulation module is used to cyclically construct multiple layers of insulating dielectric layers and conductive circuit layers on the first layer of the circuit board. The post-processing module is used to remove all sacrificial materials after all insulating dielectric layers and conductive circuit layers have been constructed, so as to obtain the target circuit board.

9. A circuit board manufacturing equipment, characterized in that, It includes a processor and a memory, the memory being used to store a computer program, which, when executed by the processor, implements the circuit board manufacturing method based on embedded 3D printing as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, It stores a computer program that, when executed by a processor, implements the circuit board manufacturing method based on embedded 3D printing as described in any one of claims 1 to 7.

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