Optical sensor packaging structure and manufacturing method thereof

Abstract

The invention provides an optical sensor packaging structure and a manufacturing method thereof. The optical sensor packaging structure comprises a substrate; the light-transmitting adapter plate is arranged on the surface of the substrate; the sensor chip is arranged on the surface of the light-transmitting adapter plate, and the surface, deviating from the light-transmitting adapter plate, of the sensor chip is provided with a light sensing area; the sensor chip is coated with the light-transmitting layer, the bottom of the light-transmitting layer is in contact with the light-transmitting adapter plate, and incident light can enter from the side face of the light-transmitting adapter plate and is conducted to the light sensing area of the sensor chip through the light-transmitting layer; and the shading shell is arranged on the periphery of the light-transmitting layer. According to the optical sensor packaging structure, the light-transmitting adapter plate is used as a middle structure, so that light rays incident from the side surface of the optical sensor packaging structure are projected to the light sensing area of the sensor chip through the light-transmitting layer, the light-transmitting area is greatly increased, and the signal-to-noise ratio of the optical sensor packaging structure is effectively improved. In addition, the light-transmitting layer is shielded by the light-shielding shell, so that interference light in other areas can be isolated.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging, and more particularly to an optical sensor packaging structure and its manufacturing method. Background Technology

[0002] An optical sensor is a semiconductor device that can sense external light and convert it into electrical signals. Encapsulating an optical sensor forms an optical sensor package structure, which is commonly used in various electronic terminals, such as cameras, smartphones, digital cameras, automotive imaging systems, and toys.

[0003] Currently, in the packaging process of optical sensors, a light-transmitting cover is typically placed on the sensor chip. For details, please refer to... Figure 1 This is a schematic diagram of a conventional optical sensor packaging structure. A sensor chip 100 is disposed on a substrate 110, and a molding compound 120 covers the substrate 110 and forms an optical transmission cavity. The optical transmission cavity exposes the photosensitive area 101 of the sensor chip 100. A light-transmitting cover 130 is disposed within the optical transmission cavity, protecting the photosensitive area 101 of the sensor chip 100 and allowing incident light to enter the photosensitive area 101 of the sensor chip 100 from the top of the light-transmitting cover 130. In this optical sensor packaging structure, incident light can only enter the photosensitive area 101 of the sensor chip 100 from the top of the light-transmitting cover 130. This single optical path design directly limits the performance of the optical sensor packaging structure to the effective light-transmitting area of ​​the light-transmitting cover 130, making it difficult to improve signal acquisition efficiency, especially in low-light environments where the signal-to-noise ratio deteriorates significantly. The packaging process for forming the optical sensor packaging structure adopts film-assisted molding (FAM) technology. Although FAM technology achieves high-density integration, its packaging cost is high and its quality abnormalities and low yield problems are significant.

[0004] Therefore, improving the performance of optical sensor packaging structures, reducing packaging costs, and addressing issues such as abnormal quality and low yield rates in optical sensor packaging structures have become key research areas. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide an optical sensor packaging structure and its manufacturing method, which can improve the performance of the optical sensor packaging structure, reduce packaging costs, and improve the problems of abnormal quality and low yield of the optical sensor packaging structure.

[0006] To address the aforementioned problems, a specific embodiment of the present invention provides an optical sensor packaging structure, comprising: a substrate; a light-transmitting adapter plate disposed on the surface of the substrate; a sensor chip disposed on the surface of the light-transmitting adapter plate, wherein the surface of the sensor chip facing away from the light-transmitting adapter plate has a photosensitive area; a light-transmitting layer covering the sensor chip, wherein the bottom of the light-transmitting layer is in contact with the light-transmitting adapter plate, and incident light can enter from the side of the light-transmitting adapter plate and be conducted through the light-transmitting layer to the photosensitive area of ​​the sensor chip; and a light-shielding shell disposed around the light-transmitting layer.

[0007] In one specific embodiment, the light-transmitting adapter plate is provided with a conductive connection structure, the sensor chip is mounted on the light-transmitting adapter plate, and is electrically connected to the substrate through the conductive connection structure.

[0008] In one specific embodiment, the sensor chip has solder pads on its surface facing away from the light-transmitting adapter plate, and the solder pads are connected to the conductive connection structure via leads.

[0009] In one specific embodiment, the light-transmitting layer further covers the lead wire.

[0010] In one specific embodiment, the conductive connection structure is a conductive post that penetrates the light-transmitting adapter plate, with one end of the conductive post electrically connected to the substrate and the other end electrically connected to the lead wire.

[0011] In one specific embodiment, a filler layer is provided between the light-transmitting adapter plate and the substrate.

[0012] In one specific embodiment, the optical sensor packaging structure further includes a first reflective member disposed in the light-transmitting adapter plate, wherein incident light can enter from the side of the light-transmitting adapter plate and be reflected by the first reflective member to the light-transmitting layer.

[0013] In one specific embodiment, the first reflective member is disposed in the area corresponding to the light-transmitting layer of the light-transmitting transition plate.

[0014] In one embodiment, the first reflective member has an inclined reflective surface, which is opposite to the side of the light-transmitting transition plate.

[0015] In one specific embodiment, the first reflective member extends along the side of the light-transmitting transition plate and encloses it to form a ring configuration.

[0016] In one specific embodiment, the ring configuration is a continuous structure.

[0017] In one specific embodiment, the ring configuration is a discontinuous structure.

[0018] In one specific embodiment, the light-transmitting adapter plate is provided with a conductive connection structure, which is disposed on the side of the first reflective member away from the sidewall of the light-transmitting adapter plate.

[0019] In one specific embodiment, the light-transmitting adapter plate is provided with a conductive connection structure, and the first reflective member is disposed outside the area where the conductive connection structure is opposite to the side wall of the light-transmitting adapter plate.

[0020] In one specific embodiment, the light-transmitting adapter plate is provided with a conductive connection structure, which is disposed on the side of the first reflective member facing the sidewall of the light-transmitting adapter plate.

[0021] In one specific embodiment, the optical sensor packaging structure further includes a second reflective member disposed on top of the light-transmitting layer, wherein incident light can enter from the light-transmitting layer to the second reflective member and be reflected by the second reflective member to the photosensitive area of ​​the sensor chip.

[0022] In one specific embodiment, the second reflective member is disposed within the light-transmitting layer and is located in a region of the light-transmitting layer that is higher than the sensor chip.

[0023] In one specific embodiment, the top of the light-transmitting layer has a groove, and the second reflective member is disposed within the groove.

[0024] In one embodiment, the second reflective member has an inclined reflective surface, which is opposite to the sensor chip.

[0025] In one specific embodiment, the second reflective member extends along the outer periphery of the light-transmitting layer and encloses it to form a ring configuration.

[0026] In one specific embodiment, the annular configuration of the second reflective member is a continuous structure.

[0027] In one specific embodiment, the annular configuration of the second reflective member is a discontinuous structure.

[0028] In one specific embodiment, when the optical sensor packaging structure includes a first reflective member, the reflective surface of the second reflective member is disposed opposite to the reflective surface of the first reflective member.

[0029] In one specific embodiment, the second reflective member is disposed on the inner top surface of the light-shielding shell facing the light-transmitting layer.

[0030] In one specific embodiment, the second reflective member is embedded in the top of the light-shielding shell facing the light-transmitting layer.

[0031] In one specific embodiment, the light-shielding outer shell is a plastic sealant layer, which covers the outer surface of the light-transmitting layer.

[0032] In one specific embodiment, the light-shielding outer shell is a pre-formed shell that covers the outer surface of the light-transmitting layer.

[0033] In one specific embodiment, the light-transmitting adapter plate is provided with a conductive connection structure, the sensor chip is provided with a through-silicon via, one end of the conductive connection structure is electrically connected to the through-silicon via of the sensor chip, and the other end is electrically connected to the substrate.

[0034] In one specific embodiment, the conductive connection structure is a conductive post that penetrates the light-transmitting adapter plate, with one end of the conductive post electrically connected to the substrate and the other end electrically connected to the through-silicon via.

[0035] To address the aforementioned problems, a specific embodiment of the present invention also provides a method for manufacturing an optical sensor packaging structure, comprising: setting a light-transmitting adapter plate on the surface of a substrate; setting a sensor chip on the surface of the light-transmitting adapter plate, wherein the sensor chip has a photosensitive area on the surface opposite to the light-transmitting adapter plate; forming a light-transmitting layer, wherein the light-transmitting layer covers the sensor chip, and the bottom of the light-transmitting layer is in contact with the light-transmitting adapter plate, wherein incident light can enter from the side of the light-transmitting adapter plate and be conducted through the light-transmitting layer to the photosensitive area of ​​the sensor chip; and setting a light-shielding shell around the light-transmitting layer.

[0036] In one specific embodiment, the light-transmitting adapter plate is provided with a conductive connection structure, and the step of setting the sensor chip on the surface of the light-transmitting adapter plate further includes: mounting the sensor chip upright on the surface of the light-transmitting adapter plate, and providing a solder pad on the surface of the sensor chip facing away from the light-transmitting adapter plate, wherein the solder pad is in contact with the conductive connection structure through a lead wire.

[0037] In one specific embodiment, the light-transmitting adapter plate is provided with a conductive connection structure, and the sensor chip is provided with a through-silicon via. The step of setting the sensor chip on the surface of the light-transmitting adapter plate further includes: mounting the sensor chip upright on the surface of the light-transmitting adapter plate, and electrically connecting the conductive connection structure to the through-silicon via.

[0038] In one specific embodiment, before or after the step of setting the light-transmitting transition plate on the substrate surface, the method further includes: forming a first reflective member in the light-transmitting transition plate, wherein the first reflective member enables incident light to enter from the side of the light-transmitting transition plate and be reflected by the first reflective member to the light-transmitting layer.

[0039] In one specific embodiment, the step of forming the light-transmitting layer further includes: forming the light-transmitting layer using a 3D printing process.

[0040] In one specific embodiment, before the step of setting a light-shielding shell around the light-transmitting layer, the method further includes: setting a second reflective member on the top of the light-transmitting layer, wherein incident light can enter from the light-transmitting layer to the second reflective member and be reflected by the second reflective member to the photosensitive area of ​​the sensor chip.

[0041] In one specific embodiment, the step of setting a second reflective member on the top of the light-transmitting layer further includes: setting a groove on the top of the light-transmitting layer; and installing the second reflective member in the groove.

[0042] In one specific embodiment, before the step of setting a light-shielding shell around the light-transmitting layer, the method further includes: setting the second reflective member on the top surface inside the light-shielding shell.

[0043] In one specific embodiment, the step of providing a light-shielding outer shell around the light-transmitting layer further includes: molding to form a molding layer, the molding layer covering the outer surface of the light-transmitting layer, the molding layer serving as the light-shielding outer shell.

[0044] In one specific embodiment, the step of providing a light-shielding shell around the light-transmitting layer further includes: forming a light-shielding shell; and covering the outer surface of the light-transmitting layer with the light-shielding shell.

[0045] The optical sensor packaging structure and manufacturing method of the present invention involve setting a light-transmitting adapter plate on a substrate, and then setting a sensor chip and a light-transmitting layer on the light-transmitting adapter plate. The light-transmitting adapter plate serves as an intermediate structure, allowing incident light rays from the side of the optical sensor packaging structure to be projected onto the photosensitive area of ​​the sensor chip through the light-transmitting layer. Compared to traditional top-incident optical sensor packaging structures (such as…), this method… Figure 1 As shown in the figure, this significantly increases the light-transmitting area, improves signal acquisition efficiency, effectively enhances the signal-to-noise ratio of the optical sensor packaging structure, and greatly improves its performance. Furthermore, the light-transmitting layer is shielded by a light-shielding shell, which not only isolates interfering light from other areas and reduces stray light, preventing it from entering the photosensitive area of ​​the sensor chip, but also reduces packaging costs and improves the quality and yield issues of the optical sensor packaging structure.

[0046] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit the invention. Techniques, methods, and apparatus known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and apparatus should be considered part of the specification. Attached Figure Description

[0047] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0048] Figure 1 This is a schematic diagram of an existing optical sensor packaging structure; Figure 2 This is a schematic diagram of the first specific embodiment of the optical sensor packaging structure of the present invention; Figure 3 This is an optical path diagram of the first specific embodiment of the optical sensor packaging structure of the present invention; Figure 4 This is a schematic diagram of the second specific embodiment of the optical sensor packaging structure of the present invention; Figure 5 This is a schematic diagram showing the distribution of the first reflective component in the light-transmitting adapter plate in a second specific embodiment of the optical sensor packaging structure of the present invention; Figure 6 This is a schematic diagram showing the distribution of the first reflective component in the light-transmitting adapter plate in a third specific embodiment of the optical sensor packaging structure of the present invention; Figure 7 This is a schematic diagram of the fourth specific embodiment of the optical sensor packaging structure of the present invention; Figure 8 This is a schematic diagram showing the distribution of the first reflective component and conductive connection structure in the light-transmitting adapter plate in the fifth specific embodiment of the optical sensor packaging structure of the present invention. Figure 9 This is a schematic diagram of the sixth specific embodiment of the optical sensor packaging structure of the present invention; Figure 10 This is a schematic diagram of the distribution of the second reflective component in the light-transmitting layer in the sixth specific embodiment of the optical sensor packaging structure of the present invention; Figure 11 This is a schematic diagram of the distribution of the second reflective component in the light-transmitting layer in the seventh specific embodiment of the optical sensor packaging structure of the present invention; Figure 12 This is a schematic diagram of the eighth specific embodiment of the optical sensor packaging structure of the present invention; Figure 13 This is a schematic diagram of the ninth specific embodiment of the optical sensor packaging structure of the present invention; Figure 14 This is a schematic diagram of the tenth specific embodiment of the optical sensor packaging structure of the present invention; Figure 15 This is a schematic diagram of the eleventh specific embodiment of the optical sensor packaging structure of the present invention; Figure 16 This is a schematic diagram of a specific embodiment of the optical sensor packaging structure of the present invention disposed on a circuit board; Figure 17 This is a schematic diagram illustrating the steps of a specific embodiment of the manufacturing method of the optical sensor packaging structure of the present invention.

[0049] Explanation of reference numerals in the attached figures: 200 substrates 210 light-transmitting adapter plate 212 conductive connection structure 211 filler layer 220 sensor chip 221 photosensitive area 224 Adhesion Layer 222 lead 223 Through Silicon Via 230 light-transmitting layer 240 light-shielding housing 250 First Reflecting Component 260 Second Reflector 300 lead-out solder balls 310 Printed Circuit Board. Detailed Implementation

[0050] The technical solutions in the embodiments of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0051] Figure 2 This is a schematic diagram of the first specific embodiment of the optical sensor packaging structure of the present invention. Please refer to [link / reference]. Figure 2 The optical sensor packaging structure includes: a substrate 200; a light-transmitting adapter plate 210 disposed on the surface of the substrate 200; a sensor chip 220 disposed on the surface of the light-transmitting adapter plate 210, wherein the sensor chip 220 has a photosensitive area 221 on the surface opposite to the light-transmitting adapter plate 210; a light-transmitting layer 230 covering the sensor chip 220, wherein the bottom of the light-transmitting layer 230 is in contact with the light-transmitting adapter plate 210, and incident light can enter from the side of the light-transmitting adapter plate 210 and be conducted through the light-transmitting layer 230 to the photosensitive area 221 of the sensor chip 220; and a light-shielding shell 240 disposed around the light-transmitting layer 230.

[0052] The optical sensor packaging structure of the present invention has a light-transmitting adapter plate 210 disposed on a substrate 200, and a sensor chip 220 and a light-transmitting layer 230 disposed on the light-transmitting adapter plate 210. The light-transmitting adapter plate 210 serves as an intermediate structure, allowing incident light rays from the side of the optical sensor packaging structure to be projected onto the photosensitive area 221 of the sensor chip 220 through the light-transmitting layer 230. Compared to traditional top-incident optical sensor packaging structures (such as…), this design offers advantages over traditional top-incident optical sensor packaging structures. Figure 1 As shown in the figure, the light-transmitting area is greatly increased, the signal acquisition efficiency is improved, the signal-to-noise ratio of the optical sensor packaging structure is effectively improved, and the performance of the optical sensor packaging structure is greatly enhanced. Furthermore, the light-transmitting layer 230 is shielded by a light-shielding shell 240, which not only isolates interfering light from other areas and reduces stray light, preventing it from entering the photosensitive area 221 of the sensor chip 220, but also reduces packaging costs and improves the quality abnormalities and low yield problems of the optical sensor packaging structure.

[0053] The substrate 200 can be made from existing materials such as BT substrates (Bismaleimide Triazine), ceramic substrates, FR-4 substrates (epoxy fiberglass substrates), flexible substrates, metal substrates, and silicon substrates. Each of these substrate materials and technologies has its own characteristics: BT substrates balance heat resistance, electrical performance, and cost, making them the preferred choice for mid-to-high-end optical sensors; ceramic substrates have excellent thermal conductivity and mechanical strength, suitable for high-power and high-reliability applications; FR-4 substrates are low-cost and easy to process, suitable for low-power optical sensors; flexible substrates are bendable, thin, and have excellent bending resistance, suitable for optical sensors in wearable devices; metal substrates have excellent heat dissipation performance and high mechanical strength, suitable for high-power LED sensors and LiDAR heat dissipation modules; silicon substrates have ultra-high precision and CTE matching with silicon chips, and can be used in advanced image sensors (such as stacked CMOS) and micro-optical MEMS devices. The material selection and structural design of the substrate can be adjusted according to the specific application requirements. For example, low dielectric constant materials can be used in high-frequency applications to reduce signal loss, or high-temperature resistant materials can be used in high-temperature environments to improve reliability. In this specific embodiment, the substrate 200 is a BT substrate.

[0054] The substrate 200 includes a top surface and a bottom surface that are distributed opposite to each other, and a circuit layer (not shown in the figures) is provided within the substrate 200 for transmitting and distributing electrical signals. In some specific embodiments, a conductive connection area (not shown in the figures) is provided on the top surface of the substrate 200 for electrically connecting the sensor chip 220 to the substrate 200.

[0055] The light-transmitting adapter plate 210 is a light-transmitting isolation plate, through which external light passes and then enters the light-transmitting layer 230. External light includes, but is not limited to, laser light, visible light, and infrared light. External light enters the light-transmitting adapter plate 210 from its sidewall, and is then conducted through total internal reflection (TIR) ​​or scattering within the light-transmitting adapter plate 210 before finally entering the light-transmitting layer 230. In this specific embodiment, the light-transmitting adapter plate 210 is a light-transmitting glass plate. The thickness of the light-transmitting adapter plate 210 can be set according to the specific requirements of the optical sensor packaging structure, and the thickness of the light-transmitting adapter plate 210 can be adjusted to balance light collection efficiency and packaging size.

[0056] The light-transmitting adapter plate 210 is disposed on the top surface of the substrate 200. In this specific embodiment, the light-transmitting adapter plate 210 is disposed on the top surface of the substrate 200 and is electrically connected to the substrate.

[0057] The sensor chip 220 is an optical sensor chip, a semiconductor structure that converts light signals into electrical signals, used to detect, measure, or analyze the presence, intensity, wavelength, phase, and other characteristics of light. The sensor chip 220 is disposed on the upper surface of the light-transmitting adapter plate 210, used to sense external light and convert it into electrical signals. Specifically, the surface of the sensor chip 220 facing away from the light-transmitting adapter plate 210 has a photosensitive area 221, which receives external light, converts it into an electrical signal, and transmits it to the substrate 200 through the circuitry of the sensor chip 220.

[0058] In some specific embodiments, the light-transmitting adapter plate 210 is provided with a conductive connection structure 212. The sensor chip 220 is mounted on the light-transmitting adapter plate 210 and is electrically connected to the substrate 200 through the conductive connection structure 212. The electrical signal of the sensor chip 220 is transmitted to the conductive connection structure 212 through the circuit of the sensor chip 220, and then to the substrate 200 through the conductive connection structure 212, thereby realizing the signal conduction of the sensor chip 220. In this specific embodiment, the back of the sensor chip 220 is fixed to the surface of the light-transmitting adapter plate 210 by an adhesive layer 224. The surface of the sensor chip 220 facing away from the light-transmitting adapter plate 210 is provided with solder pads (not shown in the figure). The solder pads are contacted and connected to the conductive connection structure 212 through leads 222. The sensor chip 220 has a metal wiring layer inside. The electrical signal of the sensor chip 220 is transmitted to the pad through the metal wiring layer within the sensor chip 220, then to the conductive connection structure 212 via the lead 222, and finally to the substrate 200, thereby realizing the signal conduction of the sensor chip 220.

[0059] In this specific embodiment, the conductive connection structure 212 is a conductive post penetrating the light-transmitting transition plate 210. One end of the conductive post is electrically connected to the substrate 200, and the other end is electrically connected to the lead 222. One end of the conductive post is electrically connected to the substrate 200 via microbumps or thermo-press bonding (TCB) to achieve low impedance electrical connection, while the other end is electrically connected to the lead 222 via wire bonding technology. The conductive post is used to electrically lead out the pads of the substrate 200, thereby achieving electrical connection between the sensor chip 220 and the substrate 200. In some specific embodiments, the conductive connection structure 212 is a copper post, a tungsten post, or a conductive polymer post, etc. In another specific embodiment, the conductive connection structure 212 may also be a circuit layer disposed in the light-transmitting transition plate 210, through which the lead 222 is electrically connected to the substrate 200. In one embodiment, the conductive connection structure 212 is interconnected with the substrate via microbumps. An underfiller is filled between the substrate and the light-transmitting transition plate 210 to form a filler layer 211, thereby improving the connection strength between the light-transmitting transition plate 210 and the substrate 200, and simultaneously alleviating stress caused by differences in thermal expansion coefficients. In another embodiment, an organic redistribution layer (not shown) is disposed at the bottom of the light-transmitting transition plate, and the light-transmitting transition plate achieves hybrid bonding interconnection with the substrate through the organic redistribution layer.

[0060] The conductive connection structure 212 is disposed in a portion of the light-transmitting adapter plate 210. Specifically, the conductive connection structure 212 is disposed in the area corresponding to the solder pads of the light-transmitting adapter plate 210 and the substrate 200, rather than in the entire area of ​​the light-transmitting adapter plate 210, thereby reducing the obstruction of incident light by the conductive connection structure 212.

[0061] The light-transmitting layer 230 is a light-transmitting cover layer that covers the sides and top surface of the sensor chip 220 and a portion of the upper surface of the light-transmitting adapter plate 210. The bottom of the light-transmitting layer 230 contacts the light-transmitting adapter plate 210, allowing incident light to enter from the side of the light-transmitting adapter plate 210 and be conducted through the light-transmitting layer 230 to the photosensitive area 221 of the sensor chip 220. In the direction perpendicular to the substrate 200 (e.g.) Figure 2In the Z-direction, the top surface of the light-transmitting layer 230 is higher than the top surface of the sensor chip 220, so that incident light can be conducted through the light-transmitting layer 230 to the photosensitive area 221 of the sensor chip 220. In this specific embodiment, the light-transmitting layer 230 not only covers the side and top surfaces of the sensor chip 220 and part of the top area of ​​the light-transmitting adapter plate 210, but also completely covers the lead wire 222, forming an integrated sealed protection structure to ensure that the lead wire 222 is isolated from the external environment.

[0062] In some specific embodiments, the light transmitted by the light-transmitting adapter plate 210 is transmitted through total internal reflection (TIR) ​​or scattering within the light-transmitting layer 230, and is ultimately uniformly distributed to the photosensitive area 221 of the sensor chip 220. The material of the light-transmitting layer 230 can be light-transmitting glass adhesive, optical-grade epoxy resin, or transparent silicone, etc. In this specific embodiment, the material of the light-transmitting layer 230 is light-transmitting glass adhesive, which can be used to coat the outer surface of the sensor chip 220 through 3D printing. The thickness of the light-transmitting layer 230 can be set according to the specific requirements of the optical sensor packaging structure, and the thickness of the light-transmitting layer 230 can be adjusted to balance light collection efficiency and packaging size.

[0063] The light-shielding shell 240 is a structure with light-blocking function. It is tightly surrounded around the periphery of the light-transmitting layer 230, forming a physical light-shielding barrier to prevent external light from entering its internal transmission path through the upper surface, side surface, or edge area of ​​the light-transmitting layer 230. In one specific embodiment, the bottom of the light-shielding shell 240 is in contact with and fixed to the top surface of the light-transmitting adapter plate 210 to further prevent external light from entering its internal transmission path through the upper surface, side surface, or edge area of ​​the light-transmitting layer 230. In another specific embodiment, the inner surface of the light-shielding shell 240 can reflect light, further ensuring that the light propagating through the light-transmitting layer 230 can enter the photosensitive area 221 of the sensor chip 220.

[0064] In this specific embodiment, the light-shielding outer shell 240 is a molding compound that covers the outer surface of the light-transmitting layer 230. The molding compound is manufactured using injection molding with thermosetting materials such as epoxy resin, and uniformly covers the entire surface of the light-transmitting layer 230. The molding compound possesses good mechanical strength, thermal stability, and moisture resistance, effectively protecting the light-transmitting layer 230 from external environmental influences (such as moisture, dust, and mechanical stress). It also provides structural support for the photoelectric sensor packaging structure and offers effective light-shielding functionality. Furthermore, the thickness and shape of the molding compound can be precisely controlled according to packaging requirements to meet the size requirements of different application scenarios.

[0065] Please see Figure 2 and Figure 3 , Figure 3 This is an optical path diagram of a first specific embodiment of the optical sensor packaging structure of the present invention. In the optical sensor packaging structure of the present invention, the light propagation path is as follows: external light enters the light-transmitting adapter plate 210 through the sidewall of the light-transmitting adapter plate 210; the light is scattered or refracted within the light-transmitting adapter plate 210 to the light-transmitting layer 230; the light is totally reflected or scattered within the light-transmitting layer 230 to the photosensitive area 221 of the sensor chip 220, and the photosensitive area 221 converts the light into an electrical signal. Compared with the traditional top-incident optical sensor packaging structure, the optical sensor packaging structure of the present invention greatly increases the light-transmitting area, improves the signal acquisition efficiency, effectively improves the signal-to-noise ratio of the optical sensor packaging structure, and greatly enhances the performance of the optical sensor packaging structure. Furthermore, the light-transmitting layer 230 is shielded by a light-shielding shell 240, which can isolate interfering light from other areas and prevent it from entering the photosensitive area 221 of the sensor chip 220, and also reduce packaging costs, improve the quality abnormalities and low yield problems of the optical sensor packaging structure.

[0066] Figure 4 This is a schematic diagram of a second specific embodiment of the optical sensor packaging structure of the present invention. Please refer to [link / reference]. Figure 4 The difference between the second and first embodiments lies in that the optical sensor packaging structure further includes a first reflective member 250. The first reflective member 250 is disposed in the light-transmitting adapter plate 210, allowing incident light to enter from the side of the light-transmitting adapter plate 210 and be reflected by the first reflective member 250 to the light-transmitting layer 230. By disposing of the first reflective member 250 in the light-transmitting adapter plate 210, the reflection of light by the first reflective member 250 further ensures that all or most of the light incident on the light-transmitting adapter plate 210 can propagate to the light-transmitting layer 230, thereby improving the light incident rate of the photosensitive area 221 of the sensor chip 220 and significantly enhancing the signal-to-noise ratio and weak light detection capability of the optical sensor packaging structure.

[0067] In some embodiments, the first reflective member 250 may employ a high-reflectivity coating (such as metallic silver, aluminum, or a dielectric multilayer reflective film), a microprism array, or a total internal reflection optical structure to precisely control the propagation direction of incident light. The first reflective member 250 is optically optimized, with its radius of curvature, tilt angle, and spatial distribution matching the refractive index distribution of the light-transmitting transition plate 210. This ensures that incident light entering the light-transmitting transition plate 210 from the outside undergoes directional reflection upon encountering the first reflective member 250, guaranteeing efficient deflection of the light propagation path towards the light-transmitting layer 230. In a second embodiment, the first reflective member 250 is a total internal reflection optical structure. Light incident on the first reflective member 250 undergoes total internal reflection before entering the light-transmitting layer 230. In some embodiments, the first reflective member 250 is a glass component.

[0068] In some specific embodiments, the first reflective member 250 is disposed in the region corresponding to the light-transmitting transition plate 210 and the light-transmitting layer 230. Specifically, as shown... Figure 4 As shown, the first reflective member 250 is disposed in the area corresponding to the contact between the light-transmitting transition plate 210 and the light-transmitting layer 230, so that all light incident through the light-transmitting transition plate 210 can be reflected by the first reflective member 250 before entering the light-transmitting layer 230. If the first reflective member 250 is at least partially disposed outside the area corresponding to the light-transmitting transition plate 210 and the light-transmitting layer 230, that is, if the first reflective member 250 is disposed entirely or partially below the sensor chip 220, then the outgoing light reflected by the first reflective member 250 will be blocked by the sensor chip 220 and cannot be fully incident into the light-transmitting layer 230, thereby affecting the light incident rate of the photosensitive area 221 of the sensor chip 220. In this specific embodiment, the first reflective member 250 is disposed in the area corresponding to the light-transmitting transition plate 210 and the light-transmitting layer 230, which effectively avoids the sensor chip 220 from blocking the incident light, and is conducive to further enhancing the signal-to-noise ratio and weak light detection capability of the optical sensor packaging structure.

[0069] In some embodiments, the first reflective member 250 has an inclined reflective surface (not shown in the figures), which faces the side of the light-transmitting transition plate 210. Light incident from the side of the light-transmitting transition plate 210 is incident on the reflective surface, reflected, and then incident on the light-transmitting layer 230. In some embodiments, a high-reflectivity reflective layer can be formed on the first reflective member 250 by physical vapor deposition (PVD), chemical vapor deposition (CVD), or electroplating. This reflective layer serves as the reflective surface to achieve efficient directional reflection of incident light. The reflective layer can be a metal layer, such as silver (Ag), aluminum (Al), or gold (Au), which have high reflectivity.

[0070] In some specific embodiments, the first reflective member 250 extends along the side of the light-transmitting transition plate 210 and forms a ring-shaped configuration to expand the distribution area of ​​the first reflective member 250, further ensuring that all or most of the light incident on the light-transmitting transition plate 210 can propagate to the light-transmitting layer 230, thereby further improving light transmission efficiency. Specifically, as... Figure 5 As shown, it is a schematic diagram of the distribution of the first reflective member 250 in the light-transmitting adapter plate 210 in the second specific embodiment of the optical sensor packaging structure of the present invention. In this specific embodiment, the light-transmitting adapter plate 210 is rectangular, and the first reflective member 250 is correspondingly provided on each side of the rectangle. The four first reflective members 250 enclose a ring configuration.

[0071] In some specific embodiments, the annular configuration is a continuous structure, that is, the annular configuration is a continuous closed structure, which is seamlessly connected along the circumference of the light-transmitting transition plate 210. Light incident on different positions of the light-transmitting transition plate 210 can be effectively captured by the first reflective member 250 and propagated to the light-transmitting layer 230, improving the light transmission efficiency and helping to further enhance the signal-to-noise ratio and weak light detection capability of the optical sensor packaging structure. Specifically, such as Figure 5 As shown, in the second specific embodiment, the four first reflective members 250 are connected end to end, so that the ring configuration formed by the four first reflective members 250 is a continuous closed structure.

[0072] In some specific embodiments, the annular configuration is a discontinuous structure, that is, the annular configuration is a non-closed, intermittent arrangement structure to bypass other structures in the light-transmitting transition plate, such as the conductive connection structure 212. Specifically, as... Figure 6The diagram shown illustrates the distribution of the first reflective member 250 within the light-transmitting adapter plate 210 in a third embodiment of the optical sensor packaging structure of the present invention. In this third embodiment, the first reflective member 250 is discretely distributed within the light-transmitting adapter plate 210, thus bypassing the conductive connection structure 212 disposed within the light-transmitting adapter plate 210. Multiple independent first reflective members 250 are respectively disposed in the edge region of the light-transmitting adapter plate 210, and are physically isolated from each other, resulting in the annular configuration formed by the multiple first reflective members 250 exhibiting a discontinuous structure.

[0073] In some specific embodiments, the light-transmitting transition plate 210 is provided with the conductive connection structure 212. The conductive connection structure 212 is located on the side of the first reflective member 250 away from the sidewall of the light-transmitting transition plate 210, ensuring that the physical positions of the conductive connection structure 212 and the first reflective member 250 do not overlap, thereby avoiding the blocking or scattering of incident light by the conductive connection structure 212 and ensuring efficient transmission of the light path. Specifically, as... Figure 7 The diagram shown is a structural schematic of a fourth specific embodiment of the optical sensor packaging structure of the present invention. In this fourth specific embodiment, the conductive connection structure 212 is a conductive pillar, which is disposed on the side of the first reflective member 250 away from the sidewall of the light-transmitting transition plate 210, that is, within the annular configuration formed by the first reflective member 250. In these specific embodiments, since the conductive connection structure 212 is disposed on the side of the first reflective member 250 away from the sidewall of the light-transmitting transition plate 210, the conductive connection structure 212 will not affect the optical path, and the annular configuration formed by multiple first reflective members 250 can be configured as a continuously closed structure.

[0074] In some specific embodiments, the first reflective member 250 is disposed outside the area opposite to the sidewall of the conductive connection structure 212 and the light-transmitting transition plate 210, that is, the conductive connection structure 212 is not disposed between the first reflective member 250 and the sidewall of the light-transmitting transition plate 210, so as to avoid the conductive connection structure 212 from blocking or scattering the incident light and ensuring efficient transmission of the light path. Figure 8 The diagram shown is a schematic representation of the distribution of the first reflective member 250 and the conductive connection structure 212 in the light-transmitting adapter plate 210 in the fifth specific embodiment of the optical sensor packaging structure of the present invention. In this specific embodiment, the ring configuration formed by the plurality of first reflective members 250 is a non-closed, intermittent arrangement structure. The conductive connection structure 212 is disposed in the area between two adjacent first reflective members 250, thereby avoiding the conductive connection structure 212 from affecting the optical path.

[0075] In some specific embodiments, the conductive connection structure 212 may also be selectively disposed on the side of the first reflective member 250 facing the sidewall of the light-transmitting adapter plate 210, to adapt to circuit layout requirements or signal transmission optimization requirements, such as... Figure 4 As shown. In some specific embodiments, the conductive connection structure 212 may be a transparent conductive structure to reduce the light blocking effect of the conductive connection structure 212. The transparent conductive structure may be a transparent conductive oxide (TCO), such as indium tin oxide (ITO), fluorine-doped tin oxide (FTO), aluminum zinc oxide (AZO), etc.

[0076] In some specific embodiments, the optical sensor packaging structure further includes a second reflective member 260 (see...). Figure 9 The second reflective member 260 is disposed on top of the light-transmitting layer 230. Incident light can enter from the light-transmitting layer 230 to the second reflective member 260 and be reflected by the second reflective member 260 to the photosensitive area 221 of the sensor chip 220. The optical sensor packaging structure utilizes the reflection effect of the second reflective member 260 to redirect light that might otherwise escape to the photosensitive area 221 of the sensor chip 220, further ensuring that all or most of the light incident on the light-transmitting layer 230 can enter the photosensitive area 221 of the sensor chip 220, thereby improving the light incident rate of the photosensitive area 221 of the sensor chip 220 and significantly enhancing the signal-to-noise ratio and weak light detection capability of the optical sensor packaging structure.

[0077] Specifically, such as Figure 9 As shown, Figure 9 This is a schematic diagram of a sixth specific embodiment of the optical sensor packaging structure of the present invention. In this specific embodiment, the optical sensor packaging structure further includes a second reflective member 260, which is disposed on top of the light-transmitting layer 230. Incident light can enter from the light-transmitting layer 230 to the second reflective member 260 and be reflected by the second reflective member 260 to the photosensitive area 221 of the sensor chip 220. In this specific embodiment, the light-shielding shell 240 is a molding compound. The molding compound, through injection molding, can cover the outer surfaces of the light-transmitting layer 230 and the second reflective member 260, thereby effectively protecting the light-transmitting layer 230 and the second reflective member 260 from the influence of the external environment.

[0078] In some embodiments, the second reflective member 260 may employ a high-reflectivity coating (such as metallic silver, aluminum, or a dielectric multilayer reflective film), a microprism array, or a total internal reflection optical structure to precisely control the propagation direction of incident light. The second reflective member 260 is optically optimized so that its radius of curvature, tilt angle, and spatial distribution match the refractive index distribution of the light-transmitting layer 230, ensuring that incident light undergoes directional reflection upon encountering the second reflective member 260, thus guaranteeing efficient deflection of the light propagation path towards the photosensitive area 221 of the sensor chip 220. In a sixth embodiment, the second reflective member 260 is a total internal reflection optical structure; light incident on the second reflective member 260 undergoes total internal reflection before entering the photosensitive area 221 of the sensor chip 220. In some embodiments, the second reflective member 260 is a glass component.

[0079] Furthermore, in this specific embodiment, the second reflective member 260 is disposed within the light-transmitting layer 230 and located in the region of the light-transmitting layer 230 that is higher than the sensor chip 220. That is, the second reflective member 260 is positioned higher than the photosensitive area 221 of the sensor chip 220. This high-position arrangement allows the reflective surface of the second reflective member 260 to form a specific downward angle relationship with the photosensitive area 221 of the sensor chip 220. By using the principle of geometric optics to directionally deflect the propagation path of the incident light, it is possible to further ensure that the light propagation path is efficiently deflected towards the photosensitive area 221 of the sensor chip 220, thereby improving the light transmission efficiency.

[0080] In some specific embodiments, the top of the light-transmitting layer 230 has a groove (not shown in the drawings), and the second reflective member 260 is disposed within the groove, which serves to limit the second reflective member 260. The sidewalls and bottom contours of the groove match the geometry of the second reflective member 260, achieving precise three-dimensional spatial positioning through physical constraints, ensuring that the angular deviation of the reflective surface is controlled within a set range, and avoiding optical path deviation caused by assembly offset.

[0081] In some embodiments, the second reflective member 260 has an inclined reflective surface (not shown in the figures), which faces the sensor chip 220. Light propagating through the light-transmitting layer 230 is incident on the reflective surface, reflected, and then incident on the photosensitive area 221 of the sensor chip 220. In some embodiments, a high-reflectivity reflective layer can be formed on the second reflective member 260 by physical vapor deposition (PVD), chemical vapor deposition (CVD), or electroplating processes. This reflective layer serves as the reflective surface to achieve efficient directional reflection of incident light. The reflective layer can be a metal layer, such as silver (Ag), aluminum (Al), or gold (Au), which have high reflectivity.

[0082] The second reflective member 260 extends along the outer periphery of the light-transmitting layer 230 and forms a ring-shaped configuration to expand the distribution area of ​​the second reflective member 260, further ensuring that all or most of the light rays propagating through the light-transmitting layer 230 can be incident on the photosensitive area 221 of the sensor chip 220, thereby further improving light transmission efficiency. Specifically, as Figure 10 As shown, it is a schematic diagram of the distribution of the second reflective member 260 in the light-transmitting layer 230 in the sixth specific embodiment of the optical sensor packaging structure of the present invention. In this specific embodiment, the cross-section of the light-transmitting layer 230 is rectangular, and the second reflective member 260 is correspondingly provided on each side of the rectangle. The four second reflective members 260 enclose a ring configuration.

[0083] In some specific embodiments, the annular configuration is a continuous structure, that is, the annular configuration is a continuous closed structure, which is seamlessly connected along the circumference of the light-transmitting layer 230. Light propagating through different positions of the light-transmitting layer 230 can be effectively captured by the second reflective member 260 and incident on the photosensitive area 221 of the sensor chip 220, further improving the light transmission efficiency and helping to further enhance the signal-to-noise ratio and weak light detection capability of the optical sensor packaging structure. Specifically, as Figure 10 As shown, in the sixth specific embodiment, the four second reflective members 260 are connected end to end, so that the ring configuration formed by the four second reflective members 260 is a continuous closed structure.

[0084] In some specific embodiments, the ring configuration is a discontinuous structure, that is, the ring configuration is a non-closed, intermittent arrangement. Specifically, such as Figure 11The diagram shown illustrates the distribution of the second reflective member 260 within the light-transmitting layer 230 in a seventh embodiment of the optical sensor packaging structure of the present invention. In this seventh embodiment, the second reflective member 260 is discretely distributed within the light-transmitting layer 230. Multiple independent second reflective members 260 are respectively disposed in the edge region of the light-transmitting layer 230 and are physically isolated from each other, thus making the annular configuration formed by the multiple second reflective members 260 exhibit a discontinuous structure.

[0085] In the above specific embodiments, the first reflective member 250 and the second reflective member 260 are selectively provided in the optical sensor packaging structure. In other specific embodiments, in order to further improve the light transmission efficiency, the first reflective member 250 and the second reflective member 260 are provided in the optical sensor packaging structure at the same time.

[0086] Specifically, such as Figure 12 The diagram shown is a schematic representation of the eighth specific embodiment of the optical sensor packaging structure of the present invention. In this embodiment, the optical sensor packaging structure includes a first reflective member 250 disposed in the light-transmitting adapter plate 210 and a second reflective member 260 disposed on the top of the light-transmitting layer 230. The reflective surface of the second reflective member 260 is disposed opposite to the reflective surface of the first reflective member 250. Incident light enters from the side wall of the light-transmitting adapter plate 210 at a horizontal or large angle, is deflected by a preset angle by the reflective surface of the first reflective member 250, and becomes a vertically upward propagating light path, entering the light-transmitting layer 230. The light is propagated by total internal reflection or direct transmission within the light-transmitting layer 230, reaching the second reflective member 260 located on the top of the light-transmitting layer 230. The second reflective member 260 deflects the light again to an angle adapted to the photosensitive area 221 of the sensor chip 220, precisely guiding it to the photosensitive area 221 of the sensor chip 220.

[0087] In this specific embodiment, the optical sensor packaging structure adopts a cascaded optical path design with dual reflective components. Efficient light transmission is achieved through the synergistic effect of the light-transmitting adapter plate 210, the first reflective component 250, the light-transmitting layer 230, and the second reflective component 260, which helps to further enhance the signal-to-noise ratio and weak light detection capability of the optical sensor packaging structure. Furthermore, the folded optical path of the dual reflective components enables a long optical path design within a limited packaging thickness, which helps to optimize the thickness of the optical sensor packaging structure. In another specific embodiment, the reflective surface of the second reflective component 260 is arranged parallel to the reflective surface of the first reflective component 250, forming a symmetrical dual reflective optical path system.

[0088] In the above specific embodiments, the light-shielding outer shell 240 is a molding compound, formed by injection molding. In other specific embodiments, the light-shielding outer shell 240 is a pre-formed housing covering the outer surface of the light-transmitting layer 230. The inner surface of the housing may be pre-treated to improve light reflection and reduce light absorption. In some specific embodiments, the housing includes, but is not limited to, a metal housing or a plastic housing.

[0089] In some specific embodiments, when the light-shielding housing 240 is a pre-formed shell, the second reflective member 260 can be pre-installed within the light-shielding housing 240 and then assembled with the light-transmitting layer 230. For example... Figure 13 The diagram shown is a structural schematic of a ninth specific embodiment of the optical sensor packaging structure of the present invention. In this embodiment, the second reflective member 260 is pre-disposed on the inner top surface of the light-shielding shell 240 facing the light-transmitting layer 230. The second reflective member 260 can be attached to the inner top surface of the light-shielding shell 240 via an adhesive layer or similar material. Figure 14 The diagram shown is a structural schematic of the tenth specific embodiment of the optical sensor packaging structure of the present invention. In this embodiment, the second reflective member 260 is pre-embedded on the top of the light-shielding shell 240 facing the light-transmitting layer 230. A groove (not shown in the figure) can be formed on the top of the light-shielding shell 240, and the second reflective member 260 is embedded in the groove. The groove limits the position of the second reflective member 260. The sidewalls and bottom contours of the groove match the geometry of the second reflective member 260. Precise three-dimensional spatial positioning is achieved through physical constraints, ensuring that the angular deviation of the reflective surface is controlled within a set range, and avoiding optical path deviation caused by assembly misalignment.

[0090] In the above specific embodiments, the electrical signal of the sensor chip 220 is transmitted through the metal wiring layer within the sensor chip 220 to the pads on the surface of the sensor chip 220, and then through the lead 222 to the conductive connection structure 212 of the light-transmitting adapter plate 210. In other specific embodiments, the sensor chip 220 is not electrically connected to the conductive connection structure 212 of the light-transmitting adapter plate 210 via the lead 222, but rather through a through-silicon via 223 (e.g., ...). Figure 15The through-silicon via 223 is electrically connected to the conductive connection structure 212 of the light-transmitting adapter plate 210. The via 223 is exposed at the bottom of the sensor chip 220 and electrically connected to the conductive connection structure 212 of the light-transmitting adapter plate 210. This eliminates the obstruction of the light field by the metal traces within the light-transmitting layer 230, which is beneficial for improving light transmission efficiency. In the optical sensor packaging structure, the through-silicon via 223 can also serve as a heat conduction path for the sensor chip 220, which is beneficial for improving the heat dissipation performance of the sensor chip 220.

[0091] Specifically, such as Figure 15 The diagram shown is a schematic representation of the eleventh specific embodiment of the optical sensor packaging structure of the present invention. In this embodiment, a conductive connection structure 212 is provided in the light-transmitting adapter plate 210, and a through-silicon via (TSV) 223 is provided in the sensor chip 220. One end of the conductive connection structure 212 is electrically connected to the TSV 223 of the sensor chip 220, and the other end is electrically connected to the substrate 200. In this embodiment, the conductive connection structure 212 is a conductive post penetrating the light-transmitting adapter plate 210, with one end electrically connected to the substrate 200 and the other end electrically connected to the TSV 223. In other embodiments, the conductive connection structure 212 may also be a circuit layer disposed in the light-transmitting adapter plate 210, through which the TSV 223 and the substrate 200 are electrically connected.

[0092] In some specific implementations, such as Figure 16 The diagram shown is a schematic representation of a specific embodiment of the optical sensor packaging structure of the present invention disposed on a circuit board, in conjunction with reference to the reference. Figure 2 The bottom surface of the substrate 200 is provided with a plurality of solder balls 300 electrically connected to the circuit layer of the substrate 200. The solder balls 300 not only provide electrical connection, but also serve as mechanical support. The substrate 200 is mounted on the printed circuit board 310 through the solder balls 300, and is electrically connected to the printed circuit board 310 through the solder balls 300.

[0093] Compared to traditional top-incident optical sensor packaging structures, the optical sensor packaging structure of this invention significantly increases the light-transmitting area, improves signal acquisition efficiency, effectively enhances the signal-to-noise ratio, and greatly improves the performance of the optical sensor packaging structure. Furthermore, it reduces packaging costs and addresses issues such as quality abnormalities and low yield rates in optical sensor packaging structures.

[0094] This invention also provides a method for manufacturing the above-described optical sensor packaging structure; please refer to [link to relevant documentation]. Figure 17This is a schematic diagram illustrating the steps of a specific embodiment of the manufacturing method of the optical sensor packaging structure of the present invention. The manufacturing method of the optical sensor packaging structure includes the following steps: Step S70, a light-transmitting adapter plate is disposed on the surface of a substrate; Step S71, a sensor chip is disposed on the surface of the light-transmitting adapter plate, and the surface of the sensor chip facing away from the light-transmitting adapter plate has a photosensitive area; Step S72, a light-transmitting layer is formed, the light-transmitting layer covers the sensor chip, and the bottom of the light-transmitting layer is in contact with the light-transmitting adapter plate, so that incident light can enter from the side of the light-transmitting adapter plate and be conducted through the light-transmitting layer to the photosensitive area of ​​the sensor chip; Step S73, a light-shielding shell is disposed around the light-transmitting layer.

[0095] The optical sensor packaging structure manufacturing method of this invention involves setting a light-transmitting adapter plate on a substrate, and then setting a sensor chip and a light-transmitting layer on the light-transmitting adapter plate. Using the light-transmitting adapter plate as an intermediate structure, incident light rays from the side of the optical sensor packaging structure are projected onto the photosensitive area of ​​the sensor chip through the light-transmitting layer. This significantly increases the light-transmitting area, improves signal acquisition efficiency, effectively enhances the signal-to-noise ratio of the optical sensor packaging structure, and greatly improves its performance. Furthermore, the light-transmitting layer is shielded by a light-shielding shell, which not only isolates interfering light from other areas and reduces stray light, preventing it from entering the photosensitive area of ​​the sensor chip, but also reduces packaging costs and improves the quality abnormalities and low yield problems of the optical sensor packaging structure.

[0096] The following is combined Figures 2-17 The specific implementation method of the manufacturing method of the optical sensor packaging structure of the present invention will be described in detail.

[0097] See Figure 2 and Figure 17 In step S70, a light-transmitting adapter plate 210 is disposed on the surface of the substrate 200.

[0098] In one specific embodiment, the light-transmitting adapter plate 210 is attached to the top surface of the substrate 200. The step of setting the light-transmitting adapter plate 210 on the surface of the substrate 200 specifically includes: interconnecting the microbumps of the adapter plate with the substrate, and then filling the space between the substrate and the light-transmitting adapter plate 210 with an underfiller to form a filling layer 211.

[0099] The substrate 200 includes a top surface and a bottom surface that are distributed opposite to each other, and a circuit layer is disposed within the substrate 200. A conductive connection area is disposed on the top surface of the substrate 200, and the conductive connection area is electrically connected to the circuit layer. The light-transmitting adapter plate 210 is disposed on the top surface of the substrate 200. In some specific embodiments, such as Figure 2As shown, the light-transmitting transition plate 210 is provided with a conductive connection structure 212, which is electrically connected to the conductive connection area of ​​the substrate 200, so that the sensor chip 220 can be electrically connected to the substrate 200 through the conductive connection structure 212 in step S71. In this specific embodiment, the conductive connection structure 212 is a conductive post penetrating the light-transmitting transition plate 210. One end of the conductive post is electrically connected to the substrate 200 through a microbump to achieve low impedance, and the other end is used for electrical connection with the sensor chip 220. In some specific embodiments, the conductive connection structure 212 is formed in the light-transmitting transition plate 210 by etching and wiring processes before or after the step of setting the light-transmitting transition plate 210 on the surface of the substrate 200.

[0100] In another specific embodiment, before or after the step of setting the light-transmitting transition plate 210 on the surface of the substrate 200, the method further includes: forming a first reflective member 250 in the light-transmitting transition plate 210. (See also...) Figure 4 Incident light enters from the side of the light-transmitting transition plate 210 and is reflected by the first reflective member 250 to the light-transmitting layer 230. In one specific embodiment, before or after the step of setting the light-transmitting transition plate 210 on the surface of the substrate 200, a groove is first formed on the surface of the light-transmitting transition plate 210 opposite to the substrate 200, and then the first reflective member 250 is embedded in the groove. The groove is used to limit the first reflective member 250. The sidewalls and bottom contours of the groove match the geometry of the first reflective member 250, achieving precise three-dimensional spatial positioning through physical constraints, ensuring that the angular deviation of the reflective surface of the first reflective member 250 is controlled within a set range, and avoiding optical path deviation caused by assembly misalignment.

[0101] See Figure 2 and Figure 17In step S71, a sensor chip 220 is disposed on the surface of the light-transmitting adapter plate 210. The sensor chip 220 has a photosensitive area 221 on the surface facing away from the light-transmitting adapter plate 210. In this specific embodiment, the sensor chip 220 is mounted upright on the surface of the light-transmitting adapter plate 210. A solder pad is disposed on the surface of the sensor chip 220 facing away from the light-transmitting adapter plate 210. The solder pad is contacted and connected to the conductive connection structure 212 through a lead wire 222. Specifically, in this step, the bottom of the sensor chip 220 is first fixed to the surface of the light-transmitting adapter plate 210 through an adhesive layer 224; then, the solder pad is electrically connected to the conductive connection structure 212 of the light-transmitting adapter plate 210 through the lead wire 222 using wire bonding technology. In this specific embodiment, the conductive connection structure 212 is a conductive post that penetrates the light-transmitting transition plate 210. In another specific embodiment, the conductive connection structure 212 may also be a circuit layer disposed in the light-transmitting transition plate 210.

[0102] In another specific embodiment, the sensor chip 220 is not electrically connected to the conductive connection structure 212 of the light-transmitting adapter plate 210 via lead 222, but rather via through-silicon via 223. Figure 15 As shown, the light-transmitting adapter plate 210 is provided with a conductive connection structure 212, and the sensor chip 220 is provided with a through-silicon via 223. The step of setting the sensor chip 220 on the surface of the light-transmitting adapter plate 210 further includes: mounting the sensor chip 220 upright on the surface of the light-transmitting adapter plate 210, and electrically connecting the conductive connection structure 212 to the through-silicon via 223. In one specific embodiment, before setting the sensor chip 220 on the surface of the light-transmitting adapter plate 210, the through-silicon via 223 is first formed within the sensor chip 220.

[0103] See Figure 2 and Figure 17 In step S72, a light-transmitting layer 230 is formed. This light-transmitting layer 230 covers the sensor chip 220, and its bottom is in contact with the light-transmitting adapter plate 210. Incident light can enter from the side of the light-transmitting adapter plate 210 and be conducted through the light-transmitting layer 230 to the photosensitive area 221 of the sensor chip 220. In this specific embodiment, in the direction perpendicular to the substrate 200 (e.g., ... Figure 2In the Z-direction, the top surface of the light-transmitting layer 230 is higher than the top surface of the chip, so that incident light can be transmitted through the light-transmitting layer 230 to the photosensitive area 221 of the sensor chip 220. In one specific embodiment, the light-transmitting layer 230 is formed using a 3D printing process to further increase the uniformity of the light-transmitting layer 230 and improve the light transmission efficiency.

[0104] In another specific embodiment, after the step of forming the light-transmitting layer 230, the method further includes: providing a second reflective member 260 on top of the light-transmitting layer 230, so that incident light can enter from the light-transmitting layer 230 to the second reflective member 260 and be reflected by the second reflective member 260 to the photosensitive area 221 of the sensor chip 220. (See also...) Figure 9 In some specific embodiments, the second reflective member 260 is formed simultaneously with the formation of the light-transmitting layer 230. For example, the second reflective member 260 is formed simultaneously with the formation of the light-transmitting layer 230 using a 3D printing process; or, a groove is formed on the top of the light-transmitting layer 230 during its formation; the second reflective member 260 is installed in the groove. For example, a groove is formed on the top of the light-transmitting layer 230 during its formation using a 3D printing process; and the pre-formed second reflective member 260 is then embedded in the groove.

[0105] See Figure 2 and Figure 17 In step S73, a light-shielding shell 240 is provided around the light-transmitting layer 230.

[0106] In one specific embodiment, the step of providing a light-shielding outer shell 240 around the light-transmitting layer 230 further includes: molding to form a molding layer, the molding layer covering the outer surface of the light-transmitting layer 230, the molding layer serving as the light-shielding outer shell 240. The molding layer is formed by injection molding using thermosetting materials such as epoxy resin, uniformly covering the entire surface of the light-transmitting layer 230. This step uses a traditional molding process to form the molding layer covering the light-transmitting layer 230, eliminating the need for thin-film assisted encapsulation technology, reducing encapsulation costs, and improving the issues of abnormal quality and low yield in optical sensor encapsulation structures. Figure 2 As shown, the molding compound also covers the lead 222. The thickness and shape of the molding compound can be precisely controlled according to packaging requirements to meet the packaging size requirements of different application scenarios. When the second reflective member 260 is provided on the top of the light-transmitting layer 230, the molding compound also covers the second reflective member 260.

[0107] In another specific embodiment, the light-shielding outer shell 240 is not the plastic sealing layer, but a pre-formed shell. Specifically, the step of setting the light-shielding outer shell 240 around the light-transmitting layer 230 further includes: forming the light-shielding outer shell 240; and covering the outer surface of the light-transmitting layer 230 with the light-shielding outer shell 240. That is, the light-shielding outer shell 240 is a pre-formed shell, and after the light-transmitting layer 230 is formed, the shell is then covered on the outer surface of the light-transmitting layer 230 through an assembly process. The shell can be prepared by a stamping process or an injection molding process; for example, a metal shell can be prepared by a stamping process, and a plastic shell can be prepared by an injection molding process. The shell can be bonded to the light-transmitting layer 230 by mechanical fasteners or a curing adhesive.

[0108] In one specific embodiment, when the light-shielding shell 240 is a pre-formed shell, before the step of setting the light-shielding shell 240 around the light-transmitting layer 230, the method further includes: setting the second reflective member 260 on the inner top surface of the light-shielding shell 240. (See also...) Figure 13 The method includes: forming a second reflective member 260; and attaching the second reflective member 260 to the inner top surface of the light-shielding housing 240 via an adhesive layer. In another specific embodiment, please refer to... Figure 14 A groove is formed on the top of the light-shielding housing 240; the pre-formed second reflective member 260 is embedded in the groove, and the groove is used to limit the second reflective member 260.

[0109] In some specific implementations, see [reference] Figure 16 After forming the optical sensor packaging structure, the method further includes providing a plurality of solder balls 300 electrically connected to the circuit layer of the substrate 200 on the bottom surface of the substrate 200; and electrically connecting the substrate 200 to the printed circuit board 310 through the solder balls 300. This connection method is achieved through a reflow soldering process to ensure that the solder balls 300 and the pads on the printed circuit board 310 form a reliable electrical and mechanical connection.

[0110] The manufacturing method of the optical sensor packaging structure of the present invention greatly increases the light transmission area, improves the signal acquisition efficiency, effectively improves the signal-to-noise ratio of the optical sensor packaging structure, greatly enhances the performance of the optical sensor packaging structure, reduces packaging costs, and improves the problems of abnormal quality and low yield of the optical sensor packaging structure.

[0111] It should be noted that references to "an embodiment," "an embodiment," "an exemplary embodiment," "some embodiments," etc., in the specification indicate that the described embodiments may include specific features, structures, or characteristics, but each embodiment may not necessarily include that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. In addition, when a specific feature, structure, or characteristic is described in connection with an embodiment, whether explicitly described or not, implementing such a feature, structure, or characteristic in conjunction with other embodiments is within the knowledge of those skilled in the art.

[0112] It should be noted that the terms "comprising" and "having," and their variations, used in this invention document are intended to cover non-exclusive inclusion. The terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence, unless explicitly indicated by the context. It should be understood that such data used interchangeably where appropriate. Furthermore, embodiments and features within embodiments of this invention can be combined with each other unless otherwise specified. In addition, descriptions of well-known components and technologies have been omitted in the above description to avoid unnecessarily obscuring the concepts of this invention. In the various embodiments described above, each embodiment focuses on its differences from other embodiments; similar or identical parts between embodiments can be referred to interchangeably.

[0113] The above description is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make several improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. An optical sensor package structure, characterized by, include: substrate; A light-transmitting adapter plate is disposed on the surface of the substrate; A sensor chip is disposed on the surface of the light-transmitting adapter plate, and the surface of the sensor chip facing away from the light-transmitting adapter plate has a photosensitive area; A light-transmitting layer covers the sensor chip, and the bottom of the light-transmitting layer is in contact with the light-transmitting adapter plate. Incident light can enter from the side of the light-transmitting adapter plate and be conducted through the light-transmitting layer to the photosensitive area of ​​the sensor chip. A light-shielding outer shell is disposed around the light-transmitting layer.

2. The optical sensor packaging structure according to claim 1, characterized in that, The light-transmitting adapter plate is provided with a conductive connection structure, and the sensor chip is mounted on the light-transmitting adapter plate and electrically connected to the substrate through the conductive connection structure.

3. The optical sensor packaging structure according to claim 2, characterized in that, The sensor chip has solder pads on its surface away from the light-transmitting adapter plate, and the solder pads are connected to the conductive connection structure via leads.

4. The optical sensor packaging structure according to claim 3, characterized in that, The light-transmitting layer also covers the lead wire.

5. The optical sensor packaging structure according to claim 3, characterized in that, The conductive connection structure is a conductive post that penetrates the light-transmitting adapter plate. One end of the conductive post is electrically connected to the substrate, and the other end is electrically connected to the lead wire.

6. The optical sensor packaging structure according to claim 1, characterized in that, A filler layer is provided between the light-transmitting adapter plate and the substrate.

7. The optical sensor packaging structure according to claim 1, characterized in that, The optical sensor packaging structure further includes a first reflective member disposed in the light-transmitting adapter plate, wherein incident light can enter from the side of the light-transmitting adapter plate and be reflected by the first reflective member to the light-transmitting layer.

8. The optical sensor packaging structure according to claim 7, characterized in that, The first reflective member is disposed in the area corresponding to the light-transmitting layer of the light-transmitting transition plate.

9. The optical sensor packaging structure according to claim 7, characterized in that, The first reflective member has an inclined reflective surface, which is opposite to the side of the light-transmitting transition plate.

10. The optical sensor packaging structure according to claim 7, characterized in that, The first reflective member extends along the side of the light-transmitting transition plate and encloses it to form a ring configuration.

11. The optical sensor packaging structure according to claim 10, characterized in that, The ring configuration is a continuous structure.

12. The optical sensor packaging structure according to claim 10, characterized in that, The ring configuration is a discontinuous structure.

13. The optical sensor packaging structure according to claim 7, characterized in that, The light-transmitting adapter plate is provided with a conductive connection structure, which is located on the side of the first reflective member away from the sidewall of the light-transmitting adapter plate.

14. The optical sensor packaging structure according to claim 7, characterized in that, The light-transmitting adapter plate is provided with a conductive connection structure, and the first reflective member is located outside the area where the conductive connection structure is opposite to the side wall of the light-transmitting adapter plate.

15. The optical sensor packaging structure according to claim 7, characterized in that, The light-transmitting adapter plate is provided with a conductive connection structure, which is located on the side of the first reflective member facing the sidewall of the light-transmitting adapter plate.

16. The optical sensor packaging structure according to any one of claims 1 to 15, characterized in that, The optical sensor packaging structure further includes a second reflective member, which is disposed on top of the light-transmitting layer. Incident light can enter the second reflective member from the light-transmitting layer and be reflected by the second reflective member to the photosensitive area of ​​the sensor chip.

17. The optical sensor packaging structure according to claim 16, characterized in that, The second reflective member is disposed within the light-transmitting layer and is located in the region of the light-transmitting layer that is higher than the sensor chip.

18. The optical sensor packaging structure according to claim 17, characterized in that, The top of the light-transmitting layer has a groove, and the second reflective member is disposed in the groove.

19. The optical sensor packaging structure according to claim 16, characterized in that, The second reflective member has an inclined reflective surface, which is opposite to the sensor chip.

20. The optical sensor packaging structure according to claim 16, characterized in that, The second reflective member extends along the outer periphery of the light-transmitting layer and encloses it to form a ring configuration.

21. The optical sensor packaging structure according to claim 20, characterized in that, The annular configuration of the second reflective member is a continuous structure.

22. The optical sensor packaging structure according to claim 20, characterized in that, The annular configuration of the second reflective member is a discontinuous structure.

23. The optical sensor packaging structure according to claim 16, characterized in that, When the optical sensor packaging structure includes a first reflective member, the reflective surface of the second reflective member is disposed opposite to the reflective surface of the first reflective member.

24. The optical sensor packaging structure according to claim 16, characterized in that, The second reflective member is disposed on the inner top surface of the light-shielding shell facing the light-transmitting layer.

25. The optical sensor packaging structure according to claim 16, characterized in that, The second reflective member is embedded in the top of the light-shielding shell facing the light-transmitting layer.

26. The optical sensor packaging structure according to claim 1, characterized in that, The light-shielding outer shell is a plastic sealant layer, which covers the outer surface of the light-transmitting layer.

27. The optical sensor packaging structure according to claim 1, characterized in that, The light-shielding outer shell is a pre-formed shell that covers the outer surface of the light-transmitting layer.

28. The optical sensor packaging structure according to claim 1, characterized in that, The light-transmitting adapter plate is provided with a conductive connection structure, and the sensor chip is provided with a through-silicon via. One end of the conductive connection structure is electrically connected to the through-silicon via of the sensor chip, and the other end is electrically connected to the substrate.

29. The optical sensor packaging structure according to claim 28, characterized in that, The conductive connection structure is a conductive post that penetrates the light-transmitting adapter plate. One end of the conductive post is electrically connected to the substrate, and the other end is electrically connected to the through-silicon via.

30. A method for manufacturing an optical sensor packaging structure, characterized in that, include: A light-transmitting adapter plate is disposed on the surface of the substrate; A sensor chip is disposed on the surface of the light-transmitting adapter plate, and the surface of the sensor chip facing away from the light-transmitting adapter plate has a photosensitive area; A light-transmitting layer is formed, which covers the sensor chip, and the bottom of the light-transmitting layer is in contact with the light-transmitting adapter plate. Incident light can enter from the side of the light-transmitting adapter plate and be conducted through the light-transmitting layer to the photosensitive area of ​​the sensor chip. A light-shielding outer shell is provided around the light-transmitting layer.

31. The method for manufacturing the optical sensor packaging structure according to claim 30, characterized in that, The light-transmitting adapter plate is provided with a conductive connection structure. The step of setting the sensor chip on the surface of the light-transmitting adapter plate further includes: mounting the sensor chip upright on the surface of the light-transmitting adapter plate, and providing a solder pad on the surface of the sensor chip facing away from the light-transmitting adapter plate. The solder pad is connected to the conductive connection structure through a lead wire.

32. The method for manufacturing the optical sensor packaging structure according to claim 30, characterized in that, The light-transmitting adapter plate is provided with a conductive connection structure, and the sensor chip is provided with a through-silicon via. The step of setting the sensor chip on the surface of the light-transmitting adapter plate further includes: mounting the sensor chip upright on the surface of the light-transmitting adapter plate, and electrically connecting the conductive connection structure to the through-silicon via.

33. The method for manufacturing the optical sensor packaging structure according to claim 30, characterized in that, Before or after the step of setting a light-transmitting transition plate on the substrate surface, the method further includes: forming a first reflective member in the light-transmitting transition plate, wherein the first reflective member enables incident light to enter from the side of the light-transmitting transition plate and be reflected by the first reflective member to the light-transmitting layer.

34. The method for manufacturing the optical sensor packaging structure according to claim 30, characterized in that, The step of forming the light-transmitting layer further includes: forming the light-transmitting layer using a 3D printing process.

35. The method for manufacturing the optical sensor packaging structure according to claim 30, characterized in that, Before the step of setting a light-shielding shell around the light-transmitting layer, the method further includes: setting a second reflective member on the top of the light-transmitting layer, so that incident light can enter from the light-transmitting layer to the second reflective member and be reflected by the second reflective member to the photosensitive area of ​​the sensor chip.

36. The method for manufacturing the optical sensor packaging structure according to claim 35, characterized in that, The step of setting a second reflective member on the top of the light-transmitting layer further includes: setting a groove on the top of the light-transmitting layer; and installing the second reflective member in the groove.

37. The method for manufacturing the optical sensor packaging structure according to claim 35, characterized in that, Before the step of setting a light-shielding shell around the light-transmitting layer, the method further includes: setting the second reflective member on the top surface inside the light-shielding shell.

38. The method for manufacturing the optical sensor packaging structure according to claim 30, characterized in that, The step of setting a light-shielding shell around the light-transmitting layer further includes: molding to form a molding layer, the molding layer covering the outer surface of the light-transmitting layer, the molding layer serving as the light-shielding shell.

39. The method for manufacturing the optical sensor packaging structure according to claim 30, characterized in that, The step of setting a light-shielding shell around the light-transmitting layer further includes: forming a light-shielding shell; and covering the outer surface of the light-transmitting layer with the light-shielding shell.

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