LED packaging structure and light-emitting device

Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to an LED packaging structure and a light-emitting device. The LED packaging structure comprises a substrate, LED core particles, an LED controller, an insulating layer and a circuit layer, the LED core particle is provided with a core particle electrode; the LED controller is provided with a first surface and a second surface which are opposite to each other, and a side surface positioned between the first surface and the second surface; the LED controller is further provided with a control electrode located on the second surface. The LED controller is arranged on one side, far away from the substrate, of the LED core particle; the insulating layer at least covers a part of the first surface and a part of the side surface of the LED controller. The circuit layer is electrically connected with the core particle electrode, extends to the insulating layer on the first surface, bypasses the insulating layer on the side surface from the insulating layer on the first surface, extends to the second surface, and is electrically connected with the control electrode. Through the design, the risk that cavities, impurities or fractures are prone to occurring in the circuit layer due to the thickness difference between the LED core particles and the LED controller can be effectively improved, the preparation yield of the circuit layer is improved, and the size miniaturization layout is achieved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to an LED packaging structure and a light-emitting device. Background Technology

[0002] In the field of LED packaging, in order to realize the driving and control functions of LED chips, it is necessary to integrate LED chips and LED controllers in the packaging structure and realize the electrical connection between the two through the circuit layer to ensure the normal operation of the light-emitting device.

[0003] However, existing LED integrated packaging designs are prone to risks such as voids, impurities, or breakage in the fabricated circuit layers due to the difference in thickness between the LED chip and the LED controller. Summary of the Invention

[0004] This invention provides an LED packaging structure that can solve at least one problem in the prior art to effectively improve the quality and fabrication yield of the circuit layer.

[0005] An embodiment of the present invention provides an LED packaging structure, including a substrate; an LED chip located on the substrate, the LED chip having a chip electrode; an LED controller having a first surface and a second surface opposite to each other, and a side surface located between the first surface and the second surface, wherein the first surface faces the substrate and the second surface is away from the substrate; the LED controller further having a control electrode located on the second surface, the LED controller being disposed on the side of the LED chip away from the substrate; an insulating layer covering at least a portion of the first surface and a portion of the side surface of the LED controller; a circuit layer electrically connected to the chip electrode and extending to the insulating layer on the first surface, and extending from the insulating layer on the first surface around the insulating layer on the side surface to the second surface, and electrically connected to the control electrode located on the second surface.

[0006] Another embodiment of the present invention provides a light-emitting device, including an LED packaging structure as described in the above embodiment.

[0007] The LED packaging structure provided in this invention, through the structural design of the LED chip and LED controller, as well as the design of the circuit layer and insulating layer, can effectively improve the risk of voids, impurities or breaks in the circuit layer caused by the thickness difference between the LED chip and LED controller, thereby improving the reliability of the device packaging and achieving a miniaturized layout.

[0008] Other features and beneficial effects of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. Attached Figure Description

[0009] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 This is a top view of an existing LED packaging structure; Figure 2 This is a cross-sectional schematic diagram of an existing LED packaging structure; Figure 3 This is a cross-sectional schematic diagram of the LED packaging structure provided in Embodiment 1 of the present invention; Figure 4 This is a top view circuit diagram of the light-emitting surface side of the LED packaging structure provided in Embodiment 1 of the present invention; Figure 5 This is a top view circuit diagram of the non-light-emitting surface (electrode surface) of the LED packaging structure provided in Embodiment 1 of the present invention; Figure 6 , Figure 9 , Figure 12 This is a cross-sectional schematic diagram of the LED packaging structure of different variations provided in Embodiment 2 of the present invention; Figure 7 yes Figure 6 A schematic diagram of the structure of the LED controller and the insulating layer; Figure 8 It corresponds Figure 6 A top view of the LED packaging structure; Figure 10 yes Figure 9 A schematic diagram of the structure of the LED controller and the insulating layer; Figure 11 It corresponds Figure 9 A top view of the LED packaging structure; Figure 13 yes Figure 12 A schematic diagram of the structure of the LED controller and the insulating layer.

[0011] Figure label: 10. Substrate; 20. LED chip; 20a. Chip electrode; 30. LED controller; 30a. Control electrode; 31. First surface; 32. Second surface; 33. Side surface; 33a. First side edge; 33b. Second side edge; 40. Insulating layer; 50. Circuit layer; 60. Filler layer; 70. Controller lead. Detailed Implementation

[0012] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings; the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0013] It should also be noted that the structural diagrams provided in the embodiments of the present invention are for the purpose of more clearly expressing the structural features of the LED packaging structure, but are not made to scale.

[0014] This invention provides an LED packaging structure, including: a substrate 10, an LED chip 20, an LED controller 30, an insulating layer 40, and a circuit layer 50; the LED chip 20 is located on the substrate 10 and has a chip electrode 20a; the LED controller 30 has a first surface 31 and a second surface 32 opposite to each other, and a side surface 33 located between the first surface 31 and the second surface 32, wherein the first surface 31 faces the substrate 10, and the second surface 32 is away from the substrate 10; the LED controller 30 also has a control electrode 30a located on the second surface 32, and the LED controller 30 is disposed on the side of the LED chip 20 away from the substrate 10; the insulating layer 40 at least covers a portion of the first surface 31 and a portion of the side surface 33 of the LED controller 30; the circuit layer 50 is electrically connected to the chip electrode 20a and extends to the insulating layer 40 on the first surface 31, and extends from the insulating layer 40 on the first surface 31 around the insulating layer 40 on the side surface 33 to the second surface 32, and is electrically connected to the control electrode 30a located on the second surface 32.

[0015] By designing the positions of the LED chip 20 and the LED controller 30, as well as the designing the combination of the insulating layer 40 and the circuit layer 50, the risks of voids, impurities, or breaks in the circuit layer 50 caused by the thickness difference between the LED chip 20 and the LED controller 30 can be effectively mitigated, thereby improving the reliability of the device packaging.

[0016] In one embodiment, the orthographic projections of the LED chip 20 and the LED controller 30 in the direction perpendicular to the substrate 10 at least partially overlap, and the LED chip 20 and the LED controller 30 are spaced apart along the direction perpendicular to the substrate 10, so as to achieve a miniaturized layout while ensuring heat dissipation between the two.

[0017] In one embodiment, the side 33 of the LED controller 30 is an inclined plane, and the angle α formed by the inclined plane and the second surface 32 or the first surface 31 satisfies: α≥20° and α≤160°, so as to ensure the rationality of the layout of the LED controller 30.

[0018] In one embodiment, the side 33 of the LED controller 30 is an inclined plane, and the angle α formed by the inclined plane and the second surface 32 or the first surface 31 satisfies: α≥20° and α≤80°, so as to avoid the reliability of the preparation of the insulating layer 40 and the circuit layer 50 being compromised due to the excessive angle.

[0019] In one embodiment, the side surface 33 of the LED controller 30 is an arc-shaped surface, and in a cross section perpendicular to the direction of the substrate 10, the angle β formed by the line connecting the two ends of the arc-shaped surface and the second surface 32 or the first surface 31 satisfies: 20°≤β<90°, so as to uniformly disperse the bending stress of the circuit layer 50 and reduce the interface defects between the insulating layer 40 and the circuit layer 50.

[0020] In one embodiment, the orthographic projection of the second surface 32 in a direction perpendicular to the substrate 10 falls within the orthographic projection range of the first surface 31 in a direction perpendicular to the substrate 10, or the orthographic projection of the first surface 31 in a direction perpendicular to the substrate 10 falls within the orthographic projection range of the second surface 32 in a direction perpendicular to the substrate 10. This design effectively solves the problems of uneven deposition and stress concentration that easily occur in the circuit layer 50 in the traditional "equal-sized top and bottom surfaces, vertical sides" structure, thus improving the uniformity of circuit layer 50 deposition.

[0021] In one embodiment, the side 33 where the circuit layer 50 is located has a first side 33a connected to the first surface 31 and a second side 33b connected to the second surface 32; the orthographic projection of the first side 33a in the direction perpendicular to the substrate 10 falls within the orthographic projection range of the second surface 32 in the direction perpendicular to the substrate 10; or, the orthographic projection of the second side 33b in the direction perpendicular to the substrate 10 falls within the orthographic projection range of the first surface 31 in the direction perpendicular to the substrate 10. This design can also reduce circuit defects and improve the deposition yield of the circuit layer 50.

[0022] In one embodiment, the thickness h1 of the insulating layer 40 is less than the thickness h2 of the circuit layer 50 to improve heat dissipation.

[0023] In one embodiment, the thickness h1 of the insulating layer 40 and the thickness h2 of the circuit layer 50 satisfy: 0.15≤h1 / h2≤0.65, so as to effectively achieve synergistic optimization of insulation performance, heat dissipation efficiency and circuit conductivity reliability.

[0024] In one embodiment, the thickness h1 of the insulating layer 40 is between 300 nm and 650 nm, and / or the thickness h2 of the circuit layer 50 is between 1 μm and 2 μm.

[0025] In one embodiment, the thermal conductivity of the insulating layer 40 is greater than that of the LED controller 30 to improve the heat conduction effect.

[0026] In one embodiment, the distance W from the edge of the LED chip 20 to the edge of the first surface 31 of the LED controller 30 is greater than or equal to 3 μm to ensure a high yield rate.

[0027] In one embodiment, the orthographic projection of the LED chip 20 in the direction perpendicular to the substrate 10 is located within the orthographic projection range of the LED controller 30 in the direction perpendicular to the substrate 10.

[0028] In one embodiment, a filler layer 60 is further included, which fills the space between the LED chip 20, the LED controller 30 and the circuit layer 50, and the filler layer 60 is a transparent or opaque insulating material.

[0029] In one embodiment, a controller lead 70 is also included, one end of which is electrically connected to a control electrode 30a located on the second surface 32.

[0030] This invention also provides a light-emitting device, including an LED packaging structure as described in any of the above embodiments, to effectively improve the performance of the device.

[0031] The technical solution of the present invention will now be described and explained in detail through various specific embodiments and accompanying drawings.

[0032] Example 1 Please see Figures 3-5 , Figure 3 This is a cross-sectional schematic diagram of the LED packaging structure provided in Embodiment 1 of the present invention; Figure 4 This is a top view circuit diagram of the light-emitting surface side of the LED packaging structure provided in Embodiment 1 of the present invention; Figure 5 This is a top view circuit diagram of the non-light-emitting surface (electrode surface) of the LED packaging structure provided in Embodiment 1 of the present invention. The LED packaging structure provided in Embodiment 1 of the present invention includes at least a substrate 10, an LED chip 20, an LED controller 30, an insulating layer 40, and a circuit layer 50.

[0033] In this embodiment, the substrate 10 is a transparent substrate to meet the light transmittance requirements of the packaging structure. Specifically, the transparent substrate has a light transmittance of not less than 90% in the visible light band of 380nm to 760nm. The material of the transparent substrate 10 can be flexibly selected according to the actual application scenario, including but not limited to sapphire, glass, epoxy, silicone, and other materials. Furthermore, the thickness of the transparent substrate can be set to 50μm to 200μm according to the structural strength requirements. For example, the thickness of the sapphire substrate can be selected from 50μm to 150μm to balance strength and lightweight, and the thickness of the glass substrate can be selected from 70μm to 200μm to balance light transmittance and processability.

[0034] LED chips 20 are located on the substrate 10. Each LED chip 20 has a chip electrode 20a, and the chip electrode 20a of each LED chip 20 can be multiple according to actual circuit connection requirements. The LED chip 20 may include at least one of red, blue, and green light chips, and the number of LED chips 20 may be one or more, specifically designed according to actual needs. In this embodiment, the LED chip 20 is fixed to the upper surface of the substrate 10 through a transfer layer (not shown in the figure). The transfer layer may be made of an insulating material, such as epoxy resin, polyimide (PI), silicon nitride (Si3N4), or silicon oxide (SiO2), to achieve an insulating connection between the substrate 10 and the LED chip 20. Preferably, in this embodiment, the light-emitting surface of the LED chip 20 is located close to the substrate 10, and its chip electrode 20a is located on the non-light-emitting side away from the substrate 10, reserving reasonable space for the connection of the circuit layer 50. As an example, the size of the LED chip 20 is less than 100μm, and the thickness h3 of the LED chip 20 is preferably less than 10μm to meet the requirements of miniaturized packaging.

[0035] The LED controller 30, as an IC chip driving and controlling the LED chip 20, has an internal dedicated LED driving and control circuit for driving and controlling the LED chip 20. The specific circuit design is reasonably set according to actual needs, and this embodiment does not limit it. In this embodiment, the LED controller 30 is defined to have a first surface 31 and a second surface 32 opposite to each other, and a side surface 33 located between the first surface 31 and the second surface 32. The first surface 31 faces the substrate 10 and is close to the LED chip 20, providing a basis for the partial attachment of the insulating layer 40 and the circuit layer 50. The second surface 32 is away from the substrate 10 and has control electrodes 30a of the LED controller 30 for signal output. The side surface 33 is located between the first surface 31 and the second surface 32, providing a path for the circuit layer 50 to be wound. As an example, the size of the LED controller 30 is less than 110 μm, and the thickness of the LED controller 30 is preferably less than 12 μm. In this embodiment, the LED controller 30 also has control electrodes 30a located on the second surface 32. Multiple control electrodes 30a can be set according to actual circuit connection requirements, for example... Figure 3 The control electrode 30a is set to 3.

[0036] In existing technologies, such as Figure 1 , Figure 2 As shown, the layout of LED chip 20 and LED controller 30 is mostly "planar parallel", that is, the two are fixed to the surface of the same substrate 10 through a transfer process to form a structure distributed along the plane of substrate 10; then a circuit layer 50 is prepared, so that the circuit layer 50 connects the electrodes of LED chip 20 and the electrodes of LED controller 30 respectively, and finally realizes the transmission of electrical signals.

[0037] In this design process, at least the following problems exist: On the one hand, due to the inherent difference in thickness between the LED chip 20 and the LED controller 30 (the thickness of the two typically differs by 5μm to 50μm), and both are fixed to the surface of the substrate 10, a significant height difference is formed between their electrodes in the direction perpendicular to the substrate 10. When fabricating the circuit layer 50, the circuit layer 50 needs to cross this height difference to connect the two types of electrodes. The existence of the height difference will cause defects such as discontinuous coating, voids, and impurity embedding in the crossing area of ​​the circuit layer 50. Especially when using evaporation or sputtering processes, the coating coverage at the height difference is low, which easily leads to circuit breakage or poor contact, directly resulting in unstable electrical performance of the LED device and a significant decrease in product yield. At the same time, in order to improve this problem, the fabrication process of the circuit layer 50 needs to be improved, such as increasing the number of coatings and adjusting process parameters to improve the circuit quality, but this will significantly increase production costs and process complexity.

[0038] On the other hand, when the LED chip 20 and the LED controller 30 are arranged side by side along the plane of the substrate 10, they each need to occupy independent, non-overlapping mounting areas on the substrate 10, and additional wiring space needs to be reserved for the circuit layer 50. This makes it difficult to reduce the overall planar size of the LED packaged product. With the rapid development of electronic devices towards miniaturization and integration (such as micro-display modules, portable lighting devices, wearable electronic devices, etc.), existing planar LED packaged products are too large to fit into small mounting spaces. Even if the overall product size is reduced by shrinking the size of the LED chip 20 or the LED controller 30, the size of the chip and controller cannot be reduced indefinitely due to the limitations of the device's luminous performance and control function requirements, and the size problem caused by the planar layout cannot be fundamentally solved.

[0039] Therefore, based on the above problems, this embodiment solves the circuit connectivity problem caused by the electrode height difference in the prior art by vertically stacking the LED chip 20 and the LED controller 30, and by designing a circuit layer 50 with the wiring around the side 33 of the LED controller 30, while also reducing the product size.

[0040] For details, please continue reading. Figure 3 The LED controller 30 is located on the side of the LED chip 20 away from the substrate 10.

[0041] Furthermore, the orthographic projections of the LED chip 20 and the LED controller 30 in the direction perpendicular to the substrate 10 at least partially overlap, and the LED chip 20 and the LED controller 30 are spaced apart along the direction perpendicular to the substrate 10. This spacing provides space for the wiring of the circuit layer 50 and the subsequent filling layer 60, and also provides heat dissipation space for the LED chip and the LED controller 30. (Comparison) Figure 1 and Figure 5 It is evident that by at least partially overlapping the LED controller 30 and the LED chip 20, the planar area of ​​the LED package structure can be significantly reduced, allowing for a more compact overall electrode and circuit layout on the electrode side of the LED package structure, which is more conducive to miniaturized design scenarios. Simultaneously, the overlapping design completely avoids the influence of electrode height differences in existing technologies.

[0042] Furthermore, the orthographic projection of the LED chip 20 in the direction perpendicular to the substrate 10 lies within the orthographic projection range of the LED controller 30 in the direction perpendicular to the substrate 10. That is, the boundary of the LED chip 20's projection does not exceed the boundary of the LED controller 30's projection, thereby effectively optimizing the planar dimensions of the packaging structure, achieving miniaturization, and further mitigating the impact of height differences during the transfer of different components. In this embodiment, the orthographic projection of the LED chip 20 is preferably located in the central region of the orthographic projection of the LED controller 30 to improve structural strength and prevent deviation.

[0043] For example, please refer to Figure 4 The distance W from the edge of the LED chip 20 to the edge of the first surface 31 of the LED controller 30 is greater than or equal to 3 μm. By limiting W, on the one hand, sufficient space is provided for the extension wiring of the circuit layer 50 on the side 33 and the first surface 31 of the LED controller 30, effectively avoiding wiring congestion, excessively narrow line width, or line crossing problems caused by insufficient spacing when the circuit layer 50 bypasses the edge of the insulating layer 40; on the other hand, it ensures that the insulating layer 40 can completely cover part of the first surface 31 and side 33 of the LED controller 30, avoiding problems such as incomplete coverage or defects caused by insufficient spacing of the insulating layer 40.

[0044] Based on this, this embodiment also includes an insulating layer 40, which at least covers a portion of the first surface 31 and a portion of the side surface 33 of the LED controller 30. That is, as Figure 4 As shown, the insulating layer 40 can cover the entire first surface 31 and all sides 33; the insulating layer 40 can also cover only a portion of the first surface 31 and a portion of the sides 33 located below the circuit layer 50 (not shown in the figure), and the specific design can be made according to actual needs.

[0045] The insulating layer 40 is fabricated on the surface of the LED controller 30 using a sputtering process. It is made of a high thermal conductivity insulating material, such as aluminum nitride or silicon nitride. This material possesses both excellent electrical insulation and thermal conductivity, effectively preventing leakage between the circuit layer 50 and the LED controller 30 body. Simultaneously, the high thermal conductivity of the insulating layer 40 conducts the heat generated by the LED controller 30 during operation to the outside, preventing localized high temperatures from affecting the driving stability of the LED controller 30 and improving heat dissipation uniformity. In this embodiment, the thermal conductivity of the insulating layer 40 is preferably greater than that of the LED controller 30, ensuring efficient heat conduction from the LED controller 30 to the insulating layer 40, achieving efficient heat conduction and uniform diffusion along the heat dissipation path.

[0046] The circuit layer 50 is constructed using a metal material through a sputtering process, such as copper, which has low sheet resistance and strong adhesion, preventing the circuit layer 50 from detaching during long-term use. Of course, depending on actual needs, the circuit layer 50 can also use other alloys or composite layer structures.

[0047] In this embodiment, the wiring path of the circuit layer 50 is as follows: one end is electrically connected to the chip electrode 20a of the LED chip 20, and extends to the insulating layer 40 on the first surface 31, so that the circuit layer 50 is in close contact with the insulating layer 40 on the first surface 31, ensuring a firm adhesion; and extends from the insulating layer 40 on the first surface 31 around the insulating layer 40 on the side surface 33 to the second surface 32, and finally electrically connected to the control electrode 30a of the LED controller 30 located on the second surface 32. In this embodiment, it is preferable that the thickness of the circuit layer 50 covering the first surface 31 is the same as the thickness of the circuit layer 50 covering the side surface 33 to prevent sudden changes in local resistance due to uneven thickness.

[0048] When the circuit layer 50 passes around the insulating layer 40 on the side surface 33 from the insulating layer 40 on the first surface 31, it is attached to the insulating layer 40 on the side surface 33 to provide support for the deposition of the circuit layer 50, so as to avoid the circuit layer 50 being suspended and affecting the fabrication quality of the circuit layer 50.

[0049] This embodiment transforms the "vertical height difference" into a "smooth transition along the side 33 of the controller" by arranging the wiring layer 50 along the side of the insulating layer 40. Specifically, after extending from the core electrode 20a of the LED chip 20 to the insulating layer 40 on the first surface 31, the wiring layer 50 smoothly winds around the insulating layer 40 on the side 33 of the LED controller 30 to the second surface 32. This avoids steep wiring that crosses the height difference, effectively mitigating wiring defects caused by height differences and improving the conductivity stability of the circuit. Furthermore, this design of the wiring layer 50 does not increase the planar dimensions, meeting the adaptation requirements of miniaturized applications. Simultaneously, the wiring path wound around the side 33 eliminates the need for additional lead wires and soldering processes, avoiding the increased complexity and cost associated with lead wire soldering.

[0050] Preferably, the thickness h1 of the insulating layer 40 is less than the thickness h2 of the circuit layer 50. A thinner, highly thermally conductive insulating layer 40 not only reduces material consumption, does not increase the vertical height of the structure, reduces size occupancy, and achieves electrical isolation, but also further improves heat dissipation uniformity. Conversely, an excessively thick h1 will reduce thermal conductivity and affect heat dissipation.

[0051] Please continue reading. Figure 3In this embodiment, the thickness h1 of the insulating layer 40 and the thickness h2 of the circuit layer 50 preferably satisfy: 0.15 ≤ h1 / h2 ≤ 0.65. This limitation not only avoids the problem of insufficient insulation strength and increased leakage current risk due to an excessively low ratio causing the insulating layer 40 to be too thin relative to the circuit layer 50, but also avoids the problem of increased thermal resistance, uneven heat dissipation, and excessively high circuit resistance due to an excessively high ratio causing the insulating layer 40 to be too thick relative to the circuit layer 50. As an example, the thickness h1 of the insulating layer 40 is between 300 nm and 650 nm; the thickness h2 of the circuit layer 50 is between 1 μm and 2 μm.

[0052] For other implementations, please refer to Figure 3 The LED packaging structure also includes a filler layer 60, which is filled between the LED chip 20, the LED controller 30 and the circuit layer 50. The filler layer 60 is a transparent or opaque insulating material.

[0053] Specifically, the filler layer 60 is disposed between the LED chip 20, the LED controller 30, and the circuit layer 50 in a manner that either completely covers or selectively covers them. The coverage area includes at least one of the following: a portion of the surface of the LED controller 30 (such as the first surface 31, the second surface 32, and the side surface 33), a portion of the surface of the LED chip 20, the outer side of the circuit layer 50, and exposed areas not occupied by the chip. This forms a continuous protective interface, thereby achieving electrical isolation, preventing external moisture and dust from intruding, and protecting the chip. The material of the filler layer 60 can be an organic insulating material, such as transparent polyimide (PI), epoxy-modified acrylic resin, or silicone; it can also be an inorganic insulating material, such as silicon nitride (Si3N4), silicon oxide (SiO2), or aluminum oxide (Al2O3); or it can be other composite insulating materials. The specific material and coverage thickness can be reasonably designed according to actual protection requirements. This embodiment does not limit this.

[0054] Furthermore, the LED packaging structure also includes a controller lead 70, one end of which is electrically connected to the control electrode 30a of the LED controller 30 located on the second surface 32. The controller lead 70 achieves its electrical connection to the control electrode 30a of the LED controller 30 through the design of a conductive layer, and the specific electrical connection relationship between the controller lead 70 and one or more control electrodes 30a can be reasonably designed according to actual needs; this embodiment does not impose any limitations on this.

[0055] Example 2 Based on Example 1, in order to optimize the fabrication process of the circuit layer 50 and reduce circuit defects, Example 2 designs the projection relationship between the first surface 31 and the second surface 32 of the LED controller 30 to further improve the quality of the circuit layer 50.

[0056] In an alternative implementation, please refer to Figure 6 , Figure 7 The orthographic projection of the second surface 32 in the direction perpendicular to the substrate 10 falls within the orthographic projection range of the first surface 31 in the direction perpendicular to the substrate 10, or, please refer to Figure 9 , Figure 10 The orthographic projection of the first surface 31 in the direction perpendicular to the substrate 10 falls within the orthographic projection range of the second surface 32 in the direction perpendicular to the substrate 10. This projection relationship design optimizes the transition path of the circuit layer 50 between the first surface 31, the side surface 33, and the second surface 32 by creating a stepped profile of the LED controller 30 that is either smaller at the top or larger at the bottom, or larger at the top and smaller at the bottom. This solves problems such as uneven deposition and stress concentration that easily occur in the traditional "equal-sized top and bottom surfaces, vertical side surface" structure, thus improving the uniformity of circuit layer 50 deposition. Of course, according to this concept, the first surface 31 and the second surface 32 can also be of equal area, with their orthographic projections partially overlapping, such as a trapezoidal cross-section design for the LED controller 30. This also allows the side surface 33 to be non-vertical, avoiding problems with the fabrication of the circuit layer 50 and the insulating layer 40.

[0057] In another optional embodiment, the side 33 where the circuit layer 50 is located has a first side 33a connected to the first surface 31 and a second side 33b connected to the second surface 32. The first side 33a is defined as the intersection line between the side 33 where the circuit layer 50 is located and the first surface 31, and can be a straight line or a curve, extending parallel to the substrate 10. The second side 33b is defined as the intersection line between the side 33 where the circuit layer 50 is located and the second surface 32, similarly being a straight line or a curve, with the same length as the first side 33a. (See also...) Figure 11 The orthographic projection of the first side 33a in the direction perpendicular to the substrate 10 falls within the orthographic projection range of the second surface 32 in the direction perpendicular to the substrate 10; or, please refer to Figure 8 The orthographic projection of the second side 33b in the direction perpendicular to the substrate 10 falls within the orthographic projection range of the first surface 31 in the direction perpendicular to the substrate 10. That is, this indicates that only the side 33 where the circuit layer 50 is located can be designed with a gentle slope, while other sides 33 not containing the circuit layer 50 can be either vertical or gently sloped; this embodiment does not impose such limitations. By precisely defining the projection positional relationship between the two sides of the side 33 containing the circuit layer 50 and the first surface 31 and the second surface 32, the same effect of reducing circuit defects and improving the deposition yield of the circuit layer 50 can be achieved.

[0058] To achieve the projection relationship between the first surface 31, the second surface 32, and the first side 33a and the second side 33b, this embodiment improves the quality of the circuit layer 50 by designing the side 33 as non-perpendicular.

[0059] In one implementation method, please refer to Figures 6-11 In this embodiment, the side 33 of the LED controller 30 is preferably an inclined plane. That is, the side 33 of the LED controller 30 where the circuit layer 50 is located is an inclined plane, or the side 33 where the circuit layer 50 is located and the multiple side 33s where the non-circuit layer 50 is located are all inclined planes. The inclined plane can be as follows: Figure 6 The diagram shows an angled inclination that forms an acute angle with the first surface 31. It could also be as follows: Figure 9 The diagram shows the tilt pattern that forms an acute angle with the second surface 32.

[0060] Compared to the traditional vertical side (i.e., the vertical side is perpendicular to the first surface 31 / second surface 32), the inclined plane design avoids the risk of voids, uneven thickness, and impurities during sputtering / evaporation of the circuit layer 50, which can lead to uneven metal atomic deposition on the vertical side, especially as the thickness of the LED controller 30 itself is more affected by the deposition. This also results in longer fabrication times and lower efficiency. The inclined plane eliminates the right-angle steps of the vertical side through a "gentle transition," allowing metal atoms to be deposited continuously along the inclined surface, resulting in better thickness uniformity. This improves the density of the circuit layer 50, reduces the fabrication defect rate of the circuit layer 50, and ensures the adhesion between the circuit layer 50 and the insulating layer 40, avoiding electrical hazards. Furthermore, the inclined plane allows the circuit layer 50 to extend smoothly along the inclined surface, distributing stress evenly, reducing stress concentration in the circuit layer 50, and improving structural reliability.

[0061] As an example, please continue reading Figure 7 , Figure 10The angle α formed by the inclined plane and the second surface 32 or the first surface 31 satisfies: α ≥ 20° and α ≤ 160°. Examples include 20°, 30°, 40°, 45°, 50°, 60°, 70°, 80°, 100°, 110°, 120°, 130°, 140°, 150°, and 160°. Here, the angle α is the acute angle formed between the inclined plane and the second surface 32 or the first surface 31. By limiting the angle α to ≥ 20°, the excessively long extension length of the inclined plane due to a small angle is avoided, which would result in an excessively large projected area of ​​the LED controller 30 in the direction perpendicular to the substrate 10. Simultaneously, an excessively large angle avoids an excessively long extension path of the circuit layer 50 along the inclined plane, which would increase electrical signal transmission loss and waste the coating material of the circuit layer 50. Furthermore, when the angle approaches 90°, the inclined plane will tend towards a vertical side, losing the core advantage of a "smooth transition." More preferably, the angle α formed by the inclined plane and the second surface 32 or the first surface 31 satisfies: α≥20° and α≤80°, so as to avoid the angle being too large and approaching vertical, which may cause the adhesion of the circuit layer 50 on the inclined plane to decrease.

[0062] In an alternative implementation, please refer to Figure 12 , Figure 13 The side surface 33 of the LED controller 30 is an arc-shaped surface, and in a cross-section perpendicular to the substrate 10, the angle β formed by the line connecting the two ends of the arc-shaped surface and the second surface 32 or the first surface 31 satisfies: 20°≤β<90°, for example 20°, 30°, 40°, 45°, 50°, 60°, 70°, 80°, etc. Here, the angle β is the acute angle formed between the line connecting the two ends of the arc-shaped surface and the second surface 32 or the first surface 31. In this embodiment, the arc-shaped surface is a smooth single-circular arc surface or a multi-circular arc surface, and the center of the arc is located inside the LED controller 30 (to avoid the arc-shaped surface being concave inward, resulting in insufficient wiring yield). The height of the arc-shaped surface is consistent with the thickness of the LED controller 30, ensuring that the circuit layer 50 can completely conform to the arc-shaped surface extension and does not exceed the boundary of the arc-shaped surface. The curved surface design can achieve the same effect that the vertical side cannot, and can more evenly distribute the bending stress of the circuit layer 50, reduce interface defects between the insulation layer 40 and the circuit layer 50, and further extend the service life of the device.

[0063] It should be noted that, based on the above concept, those skilled in the art can also achieve this by designing the side 33 as a single-level sloping step structure, a multi-level sloping step structure, or a combination of inclined planes and inclined arc surfaces. The specific design should be made reasonably according to actual needs, and this embodiment does not impose further limitations here.

[0064] Example 3 Based on the above, Embodiment 3 of the present invention also provides a light-emitting device, which adopts the LED packaging structure described in Embodiment 1 or Embodiment 2 above, so as to effectively improve the preparation yield of the circuit layer, reduce the planar space occupied, and improve the reliability of the light-emitting device.

[0065] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An LED package structure, characterized in that, include: substrate; LED chips are located on the substrate, and the LED chips have chips electrodes; An LED controller has a first surface and a second surface opposite to each other, and a side surface located between the first surface and the second surface, wherein the first surface faces the substrate and the second surface is away from the substrate; the LED controller also has a control electrode located on the second surface, and the LED controller is disposed on the side of the LED chip away from the substrate; An insulating layer that at least covers a portion of the first surface and a portion of the side surfaces of the LED controller; A circuit layer, electrically connected to the core electrode, extends to an insulating layer on the first surface, and extends from the insulating layer on the first surface around the insulating layer on the side surface to the second surface, where it is electrically connected to the control electrode located on the second surface.

2. The LED package structure of claim 1, wherein: The LED chip and the LED controller have at least partial overlap in their orthogonal projections in the direction perpendicular to the substrate, and the LED chip and the LED controller are spaced apart in the direction perpendicular to the substrate.

3. The LED package structure of claim 1, wherein: The side of the LED controller is an inclined plane, and the angle α formed by the inclined plane and the second surface or the first surface satisfies: α≥20° and α≤160°.

4. The LED packaging structure according to claim 1, characterized in that: The side of the LED controller is an inclined plane, and the angle α formed by the inclined plane and the second surface or the first surface satisfies: α≥20° and α≤80°.

5. The LED packaging structure according to claim 1, characterized in that: The side of the LED controller is an arc-shaped surface, and in a cross section perpendicular to the substrate, the angle β formed by the line connecting the two ends of the arc-shaped surface and the second surface or the first surface satisfies: 20°≤β<90°.

6. The LED packaging structure according to claim 1, characterized in that: The orthographic projection of the second surface in the direction perpendicular to the substrate falls within the orthographic projection range of the first surface in the direction perpendicular to the substrate, or the orthographic projection of the first surface in the direction perpendicular to the substrate falls within the orthographic projection range of the second surface in the direction perpendicular to the substrate.

7. The LED packaging structure according to claim 1, characterized in that: The side containing the circuit layer has a first side connected to a first surface and a second side connected to a second surface; the orthographic projection of the first side in the direction perpendicular to the substrate falls within the orthographic projection range of the second surface in the direction perpendicular to the substrate; or, the orthographic projection of the second side in the direction perpendicular to the substrate falls within the orthographic projection range of the first surface in the direction perpendicular to the substrate.

8. The LED packaging structure according to claim 1, characterized in that: The thickness h1 of the insulation layer is less than the thickness h2 of the circuit layer.

9. The LED packaging structure according to claim 1, characterized in that: The thickness h1 of the insulation layer and the thickness h2 of the circuit layer satisfy the following condition: 0.15≤h1 / h2≤0.

65.

10. The LED packaging structure according to claim 1, characterized in that: The thickness h1 of the insulating layer is between 300nm and 650nm, and / or the thickness h2 of the circuit layer is between 1μm and 2μm.

11. The LED packaging structure according to claim 1, characterized in that: The thermal conductivity of the insulating layer is greater than that of the LED controller.

12. The LED packaging structure according to claim 1, characterized in that: The distance W from the edge of the LED chip to the edge of the first surface of the LED controller is greater than or equal to 3 μm.

13. The LED packaging structure according to claim 1, characterized in that: The orthographic projection of the LED chip in the direction perpendicular to the substrate is located within the orthographic projection range of the LED controller in the direction perpendicular to the substrate.

14. The LED packaging structure according to claim 1, characterized in that: It also includes a filler layer, which is filled between the LED chip, the LED controller and the circuit layer, and the filler layer is a transparent or opaque insulating material.

15. The LED packaging structure according to claim 1, characterized in that: It also includes a controller lead, one end of which is electrically connected to a control electrode located on the second surface.

16. A light-emitting device, characterized in that: This includes using the LED packaging structure as described in any one of claims 1 to 15.

Images