Leveling mechanism for keying pressure plate

Abstract

The present application relates to chip manufacturing technology field, particularly to a kind of bonding pressure disc leveling mechanism.The present application aims to provide a kind of bonding pressure disc leveling mechanism, which can control the parallelism of the upper and lower heating disc surfaces to higher precision, specifically comprising spindle, connecting fixing, connecting plate, upper heating disc and at least three leveling screws, the connecting fixing is rigid annular body, the connecting fixing is located at the bottom of the spindle periphery, the connecting plate is located below the connecting fixing, the connecting plate is connected with the lower end of the spindle, and the position of the connecting plate relative to the spindle is adjustable, each leveling screw passes through the connecting plate, the connecting fixing, connects the connecting plate with the connecting fixing, each leveling screw is arranged at intervals, the upper heating disc is located below the connecting plate, the upper heating disc is connected with the connecting plate, and the upper heating disc moves synchronously with the connecting plate.

Description

Technical Field

[0001] This invention relates to the field of chip manufacturing technology, and in particular to a leveling mechanism for a bonding pressure plate. Background Technology

[0002] Wafer bonding is a crucial step in chip manufacturing, significantly impacting the overall chip quality. Bonding equipment presses upper and lower wafers together. The parallelism of the upper and lower heating pads on this equipment is a critical parameter. Parallelism not only determines the uniformity of stress and heat distribution on the wafer but also affects whether misalignment occurs. Therefore, a leveling mechanism is urgently needed to adjust the parallelism of the upper and lower heating pads. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a leveling mechanism for bonding pressure plates that can control the parallelism of the upper and lower heating plates to a higher precision.

[0004] To address the aforementioned technical problems, this application provides the following technical solution:

[0005] The leveling mechanism for the bonding pressure plate of the present invention includes a main shaft, a connecting fastener, a connecting plate, an upper heating plate, at least three leveling screws, and a leveling fixture. The connecting fastener is a rigid ring-shaped body located on the outer periphery of the bottom of the main shaft. The connecting plate is located below the connecting fastener and is connected to the lower end of the main shaft. The position of the connecting plate relative to the main shaft is adjustable. Each leveling screw passes through the connecting plate and the connecting fastener, connecting the connecting plate and the connecting fastener. The leveling screws are spaced apart. The upper heating plate is located below the connecting plate and is connected to the connecting plate. The upper heating plate and the connecting plate move synchronously. The leveling fixture includes a lower mounting plate, an upper mounting plate, multiple support columns, and at least three pen-shaped sensors. The lower mounting plate and the upper mounting plate are both horizontally arranged. Each support column is connected between the lower mounting plate and the upper mounting plate. Each support column and the upper mounting plate are detachable. Each pen-shaped sensor is connected to the upper surface of the lower mounting plate and is spaced apart.

[0006] The present invention relates to a leveling mechanism for a bonding pressure plate, which further includes an elastic diaphragm, a hemispherical bearing, and a ball-shaped plate. The elastic diaphragm has notches at positions corresponding to each leveling screw. The elastic diaphragm is positioned below the connecting fastener, and the connecting plate is located below the elastic diaphragm. The upper end of the hemispherical bearing passes through the elastic diaphragm and connects to the lower end of the main shaft. Each leveling screw passes through the notch in the elastic diaphragm and connects the connecting plate to the connecting fastener. The lower end of the hemispherical bearing is a first hemisphere, and the upper end of the ball-shaped plate is a second hemisphere. One of the first and second hemispheres is a convex surface, and the other is a concave surface. The first and second hemispheres cooperate with each other. The upper end of the hemispherical bearing is connected to the lower end of the main shaft, the second hemisphere of the ball-shaped plate abuts against the first hemisphere, and the lower end of the ball-shaped plate is connected to the connecting plate.

[0007] The leveling mechanism of the bonding pressure plate of the present invention further includes a plurality of ball washers, each ball washer corresponding to a leveling screw. The leveling screw is provided with a spherical surface, and the spherical surface of each ball washer corresponds to the spherical surface of a leveling screw that is assembled with it.

[0008] The leveling mechanism of the bonding pressure plate of the present invention further includes a plurality of connecting screws, wherein the connecting plate is connected to the upper heating plate by the plurality of connecting screws.

[0009] The bonding pressure plate leveling mechanism of the present invention further includes a vacuum chamber cover, which is located above the connecting fixing member and connected to the main shaft. The vacuum chamber cover is horizontally arranged.

[0010] The bonding pressure plate leveling mechanism of the present invention further includes a mounting flange, and the vacuum chamber cover is connected to the main shaft through the mounting flange.

[0011] The leveling mechanism of the bonding pressure plate of the present invention further includes a bushing, which is disposed between the mounting flange and the main shaft.

[0012] The present invention provides a leveling mechanism for a bonding pressure plate, which further includes a bellows sleeved on the main shaft. The upper end of the bellows is connected to the lower end of the mounting flange, and the lower end of the bellows is connected to the main shaft.

[0013] The present invention relates to a leveling mechanism for a bonding pressure plate, wherein a plurality of sensor brackets are provided on the upper surface of the lower mounting plate, and each of the pen-shaped sensors is respectively connected to one of the sensor brackets.

[0014] Compared with the prior art, the leveling mechanism of the bonding pressure plate of the present invention has at least the following beneficial effects:

[0015] The leveling mechanism of the bonding pressure plate of the present invention includes a main shaft, a connecting fastener, a connecting plate, an upper heating plate, and multiple leveling screws. Each leveling screw passes through the connecting plate and the connecting fastener, connecting the connecting plate and the connecting fastener. The leveling screws are spaced apart. Therefore, the levelness of the upper heating plate relative to the lower heating plate can be adjusted by each leveling screw, further improving the parallelism of the upper heating plate surface relative to the lower heating plate surface, and controlling the parallelism of the upper heating plate surface relative to the lower heating plate surface within the micron-level precision range.

[0016] The leveling mechanism of the bonding pressure plate of the present invention will be further described below with reference to the accompanying drawings. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the upper heating plate adjustment device in the leveling mechanism of the bonding pressure plate of the present invention.

[0018] Figure 2 This is a schematic diagram of the leveling fixture in the leveling mechanism of the bonding pressure plate of the present invention. Detailed Implementation

[0019] The lower heating plate of the bonding equipment is fixed to the bottom surface of the vacuum chamber, while the upper heating plate is connected to the power supply device via a spindle and can move up and down relative to the lower heating plate. When leveling the relative positions of the upper and lower heating plates, the surface of the lower heating plate is used as a reference, and a level can be used to adjust the levelness of the lower heating plate. The surface of the upper heating plate is also adjustable.

[0020] like Figure 1 As shown, the present invention discloses a leveling mechanism for a bonding pressure plate, comprising an upper heating plate adjustment device. The upper heating plate adjustment device includes a main shaft 8, a connecting fastener 11, a connecting plate 15, an upper heating plate 7, and three or more leveling screws 13. The upper end of the main shaft 8 is used to connect a power supply device. The connecting fastener 11 is a rigid ring-shaped body located on the outer periphery of the bottom of the main shaft 8. The connecting plate 15 is located below the connecting fastener 11 and is a flat plate. The connecting plate 15 is connected to the lower end of the main shaft 8. The position of the 5 relative to the main shaft 8 is adjustable. Each leveling screw 13 passes through the connecting plate 15 and the connecting fastener 11, connecting the connecting plate 15 and the connecting fastener 11. The leveling screws 13 are spaced apart. Each leveling screw 13 is provided with an elastic washer 2 and a locking nut 3 at a position below the connecting fastener 11 to limit the relative position of the connecting fastener 11 and the leveling screw 13. The upper heating plate 7 is located below the connecting plate 15. The upper heating plate 7 is connected to the connecting plate 15, and the upper heating plate 7 moves synchronously with the connecting plate 15.

[0021] like Figure 1 , Figure 2As shown, the leveling mechanism of the bonding pressure plate of the present invention works in conjunction with the leveling fixture. The leveling fixture first moves the upper heating plate 7 by driving the main shaft 8, so that the upper heating plate 7 is raised to the initial position. The upper heating plate 7 is coarsely leveled by using the upper cover 1 of the vacuum chamber as a reference by using a vernier caliper. The depth of each leveling screw 13 screwed into the connecting fastener 11 is adjusted to adjust the parallelism of the connecting plate 15. Then, the leveling fixture assembly is placed between the upper heating plate 7 and the lower heating plate. The upper heating plate 7 is slowly lowered by the spindle 8 until it stops against the upper mounting plate 16 of the leveling fixture. This position is marked as 1. Then, the upper heating plate 7 is raised to the initial position. The upper mounting plate 16 and support column 17 are removed and then placed back on the surface of the lower heating plate. The upper heating plate 7 is slowly lowered again. The lowering height is the height of position 1 plus the height of the upper mounting plate 16. The changes in the readings of the three pen-shaped sensors 20 on the leveling fixture are observed. Each pen-shaped sensor 20 is used to measure the distance from the position on the upper heating plate 7 corresponding to each pen-shaped sensor 20 to the lower mounting plate 18. The leveling screws 13 in the corresponding positions are screwed into the connecting fasteners 11 to make the readings of the three pen-shaped sensors 20 the same. Using the principle that three points determine a plane, it can be seen that the surface of the upper heating plate 7 and the surface of the lower heating plate are parallel to each other at this time. The leveling mechanism of the bonding pressure plate of the present invention includes a main shaft 8, a connecting fastener 11, a connecting plate 15, an upper heating plate 7, and multiple leveling screws 13. Each leveling screw 13 passes through the connecting plate 15 and the connecting fastener 11, connecting the connecting plate 15 and the connecting fastener 11. The leveling screws 13 are spaced apart. Therefore, the levelness of the upper heating plate 7 relative to the lower heating plate can be adjusted by each leveling screw 13, further improving the parallelism of the plate surface of the upper heating plate 7 relative to the plate surface of the lower heating plate, and controlling the parallelism of the plate surface of the upper heating plate 7 relative to the plate surface of the lower heating plate within the micron-level precision range.

[0022] The leveling mechanism of the bonding pressure plate of the present invention further includes an elastic diaphragm 12, a hemispherical bearing 4, and a spherical plate 6. The elastic diaphragm 12 has a small elastic modulus and its edges are easily deformed. There are notches at the positions of the elastic diaphragm 12 corresponding to each leveling screw 13. The elastic diaphragm 12 is located below the connecting fastener 11, and the connecting plate 15 is located below the elastic diaphragm 12. The upper end of the hemispherical bearing 4 passes through the notch of the elastic diaphragm 12 and is connected to the lower end of the main shaft 8. Each leveling screw 13 passes through the elastic diaphragm 12 and connects the connecting plate 15 to the connecting fastener 11. The upper end of the hemispherical bearing 4 is the first connecting... The lower end of the hemispherical bearing 4 is the first hemispherical surface, the upper end of the ball plate 6 is the second hemispherical surface, and the lower end of the ball plate 6 is the second connecting end. One of the first hemispherical surface and the second hemispherical surface is a convex spherical surface, and the other is a concave spherical surface. The first hemispherical surface and the second hemispherical surface cooperate with each other. In this embodiment, the first hemispherical surface is a convex spherical surface and the second hemispherical surface is a concave spherical surface. A connecting hole is opened at the lower end of the spindle 8. The first connecting end of the upper end of the hemispherical bearing 4 is threaded into the connecting hole of the spindle 8. The second hemispherical surface of the ball plate 6 abuts against the first hemispherical surface. The second connecting end of the lower end of the ball plate 6 is connected to the connecting plate 15. When the upper heating plate 7 and the lower heating plate begin to press the wafer, if there is still a micron-level non-parallelism between the surface of the upper heating plate 7 and the surface of the lower heating plate, the lower end of the surface of the upper heating plate 7 contacts the surface of the lower heating plate first. During the downward movement of the upper heating plate 7, the connecting plate 15 corresponding to the lower position of the upper heating plate 7 reduces the tension on the leveling screw 13, and the connecting plate 15 corresponding to the higher position of the upper heating plate 7 increases the tension on the leveling screw 13. When the tension of the leveling screw 13 increases, the connecting fastener 11 connected to the leveling screw 13 causes the elastic diaphragm 12, which has a relatively small elastic modulus and is prone to edge deformation, to generate an additional downward displacement. Since the second hemisphere of the spherical plate 6 abuts against the first hemisphere of the hemisphere bearing 4, the connecting plate 15 drives the upper heating plate 7 to rotate in a direction parallel to the surface of the lower heating plate, thereby realizing the self-leveling function and further improving the leveling accuracy of the leveling mechanism of the bonding pressure plate.

[0023] The leveling mechanism of the bonding pressure plate of the present invention further includes a plurality of ball washers 5, each ball washer 5 corresponding to a leveling screw 13. The leveling screw 13 is provided with a spherical surface, and the spherical surface of each ball washer 5 corresponds to the spherical surface of a leveling screw 13 that is assembled with it.

[0024] The leveling mechanism of the bonding pressure plate of the present invention also includes a plurality of connecting screws 14, and the connecting plate 15 is connected to the upper heating plate 7 by the plurality of connecting screws 14.

[0025] The leveling mechanism for the bonding pressure plate of the present invention further includes a vacuum chamber cover 1, which is located above the connecting fixing member 11 and connected to the main shaft 8. The vacuum chamber cover 1 is horizontally positioned. The setting of the vacuum chamber cover 1 facilitates coarse leveling of the upper heating plate 7 with the vacuum chamber cover 1 as a reference.

[0026] The leveling mechanism of the bonding pressure plate of the present invention further includes a mounting flange 81, and the vacuum chamber cover 1 is connected to the main shaft 8 through the mounting flange 81.

[0027] The leveling mechanism of the bonding pressure plate of the present invention further includes a bushing 9, which is disposed between the mounting flange 81 and the main shaft 8. The bushing 9 is disposed to prevent the mounting flange 81 from being excessively worn.

[0028] The leveling mechanism of the bonding pressure plate of the present invention also includes a bellows 10, which is sleeved on the main shaft 8. The upper end of the bellows 10 is connected to the lower end of the mounting flange 81, and the lower end of the bellows 10 is welded to the main shaft 8 or connected by other means.

[0029] The present invention provides a leveling mechanism for a bonding pressure plate, which further includes leveling fixtures, such as... Figure 2 As shown, the leveling fixture includes a lower mounting plate 18, an upper mounting plate 16, multiple support columns 17, and three or more pen-shaped sensors 20. Both the lower mounting plate 18 and the upper mounting plate 16 are horizontally positioned. The multiple support columns 17 connect the lower mounting plate 18 and the upper mounting plate 16, and each support column 17 and the upper mounting plate 16 are detachable. Multiple sensor brackets 21 are spaced apart on the upper surface of the lower mounting plate 18, and each pen-shaped sensor 20 is connected to one of the sensor brackets 21. Cable clips 19 are provided on the outer wall of the lower mounting plate 18, and the leads of each pen-shaped sensor 20 are connected to one of the cable clips 19. Each pen-shaped sensor 20 is used to measure the distance from the position on the upper heating plate 7 corresponding to each pen-shaped sensor 20 to the lower mounting plate 18. Because the pen-shaped sensors have high accuracy (up to 1µm), the parallelism of the upper and lower heating plates can be controlled at the micrometer level.

[0030] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Various modifications and improvements made by those skilled in the art to the technical solutions of the present invention without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.

Claims

1. A leveling mechanism for a bonding pressure plate, characterized in that, Includes a main spindle (8), a connecting fastener (11), a connecting plate (15), an upper heating plate (7), and at least three leveling screws (13) and a leveling fixture. The connecting fastener (11) is a rigid ring-shaped body located on the bottom periphery of the main spindle (8). The connecting plate (15) is located below the connecting fastener (11) and is connected to the lower end of the main spindle (8). The position of the connecting plate (15) relative to the main spindle (8) is adjustable. Each leveling screw (13) passes through the connecting plate (15) and the connecting fastener (11) to connect the connecting plate (15) and the connecting fastener (11). The leveling screws (13) are spaced apart. The upper heating plate (7) 7) Located below the connecting plate (15), the upper heating plate (7) is connected to the connecting plate (15), and the upper heating plate (7) moves synchronously with the connecting plate (15). The leveling fixture includes a lower mounting plate (18), an upper mounting plate (16), multiple support columns (17), and at least three pen-shaped sensors (20). The lower mounting plate (18) and the upper mounting plate (16) are both horizontally arranged. Each support column (17) is connected between the lower mounting plate (18) and the upper mounting plate (16). Each support column (17) and the upper mounting plate (16) are detachable. Each pen-shaped sensor (20) is connected to the upper surface of the lower mounting plate (18), and each pen-shaped sensor (20) is spaced apart.

2. The leveling mechanism for the bonding pressure plate according to claim 1, characterized in that, It also includes an elastic diaphragm (12), a hemispherical bearing (4), and a ball-shaped plate (6). The elastic diaphragm (12) has notches at the positions corresponding to each of the leveling screws (13). The elastic diaphragm (12) is located below the connecting fastener (11), and the connecting plate (15) is located below the elastic diaphragm (12). The upper end of the hemispherical bearing (4) passes through the elastic diaphragm (12) and is connected to the lower end of the main shaft (8). Each of the leveling screws (13) passes through the notch of the elastic diaphragm (12) and then connects the connecting plate (6). The plate (15) is connected to the connecting fastener (11). The lower end of the hemispherical bearing (4) is the first hemisphere, and the upper end of the ball plate (6) is the second hemisphere. One of the first hemisphere and the second hemisphere is a convex spherical surface, and the other is a concave spherical surface. The first hemisphere and the second hemisphere cooperate with each other. The upper end of the hemispherical bearing (4) is connected to the lower end of the main shaft (8). The second hemisphere of the ball plate (6) abuts against the first hemisphere. The lower end of the ball plate (6) is connected to the connecting plate (15).

3. The leveling mechanism for the bonding pressure plate according to claim 2, characterized in that, It also includes multiple ball washers (5), each ball washer (5) corresponding to a leveling screw (13). The leveling screw (13) is provided with a spherical surface, and the spherical surface of each ball washer (5) corresponds to the spherical surface of a leveling screw (13) that is assembled with it.

4. The leveling mechanism for the bonding pressure plate according to claim 3, characterized in that, It also includes a plurality of connecting screws (14), and the connecting plate (15) is connected to the upper heating plate (7) by the plurality of connecting screws (14).

5. The leveling mechanism for the bonding pressure plate according to claim 4, characterized in that, It also includes a vacuum chamber cover (1), which is located above the connecting fastener (11) and is connected to the main shaft (8). The vacuum chamber cover (1) is horizontally positioned.

6. The leveling mechanism for the bonding pressure plate according to claim 5, characterized in that, It also includes a mounting flange (81), through which the vacuum chamber cover (1) is connected to the main shaft (8).

7. The leveling mechanism for the bonding pressure plate according to claim 6, characterized in that, It also includes a bushing (9), which is disposed between the mounting flange (81) and the main shaft (8).

8. The leveling mechanism for the bonding pressure plate according to claim 7, characterized in that, It also includes a bellows (10), which is sleeved on the main shaft (8). The upper end of the bellows (10) is connected to the lower end of the mounting flange (81), and the lower end of the bellows (10) is connected to the main shaft (8).

9. The leveling mechanism for the bonding pressure plate according to claim 8, characterized in that, The upper surface of the lower mounting plate (18) is provided with multiple sensor brackets (21), and each of the pen-shaped sensors (20) is connected to one of the sensor brackets (21).

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