Semiconductor chip packaging equipment

Abstract

The invention relates to the technical field of semiconductors, in particular to semiconductor chip packaging equipment which comprises a workbench and further comprises a carrying assembly, and the carrying assembly comprises a limiting support, a lifting block, a lifting frame, a mounting base, a rotating frame, a transverse support, a translation sliding frame, an electric push rod, a pneumatic suction cup, a lifting component, a rotating component and a translation component. Through lifting movement of the lifting block, rotation of the rotating frame and movement of the translation sliding frame, the chips sucked by the pneumatic suction cup can be carried in multiple directions according to requirements, and then the carrying requirements of the chips in the multiple directions are met.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more particularly to a semiconductor chip packaging device. Background Technology

[0002] When semiconductor chips are packaged, they need to be handled. Pneumatic suction cups are usually used to move the chips. However, when the chips are placed on the worktable, dust adheres to them, making them prone to movement and misalignment, and making it impossible to effectively hold and hold them.

[0003] Existing semiconductor chip packaging equipment includes support legs, a worktable fixedly connected to the top of the support legs, a work plate fixedly connected to the middle of the rear side of the top of the worktable, a work box fixedly connected to the top of the work plate, a drive mechanism inside the work box, a dust blowing mechanism below the drive mechanism, and a maintenance mechanism inside the dust blowing mechanism. The drive mechanism includes a motor fixedly connected to the rear left side of the work box, and the motor has an output shaft with a threaded rod fixedly connected to it. During transport, the electric telescopic rod is controlled to move, causing the pressure plate to move downwards. As the pressure plate moves downwards, the moving column moves downwards, driving the pneumatic suction cups downwards via the transport frame to adsorb and transport the chips. The pressure plate compresses the airbags, causing the air inside the airbags to be discharged through the jet pipe, which can blow dust from the pneumatic suction cups.

[0004] However, when the existing equipment is handling chips, if the receiving station for the chips is not in a certain position, the existing equipment cannot handle the chips from multiple directions as required, and therefore cannot meet the needs of handling chips from multiple directions. Summary of the Invention

[0005] The purpose of this invention is to provide a semiconductor chip packaging device that solves the problem that existing devices cannot transport chips from multiple directions according to requirements when the receiving station positions of the chips are not the same, thus failing to meet the needs of transporting chips from multiple directions.

[0006] To achieve the above objectives, the present invention provides a semiconductor chip packaging apparatus, including a worktable. It also includes transport components; The handling assembly includes a limiting bracket, a lifting block, a lifting frame, a mounting base, a rotating frame, a transverse bracket, a translational slide, an electric push rod, a pneumatic suction cup, a lifting component, a rotating component, and a translational component. The limiting bracket is fixedly connected to the worktable and located on one side of the worktable. The lifting block is slidably connected to the limiting bracket and located on one side of the limiting bracket. The lifting frame is fixedly connected to the lifting block and located on one side of the lifting block. The mounting base is fixedly connected to the lifting frame and located on one side of the lifting frame. The rotating frame and the mounting base are connected by a rotating... The components are connected and located on one side of the mounting base. The transverse support is fixedly connected to the rotating frame and located on one side of the rotating frame. The translation slide is slidably connected to the transverse support and located on one side of the transverse support. The electric push rod is mounted on the translation slide. The pneumatic suction cup is mounted on the output end of the electric push rod. The lifting component is mounted on the limiting bracket and connected to the lifting block. The rotating component is mounted on the mounting base and connected to the rotating frame. The translation component is mounted on the transverse support and connected to the translation slide.

[0007] The lifting component includes a first motor, a first rotating rod, and a first screw. The first motor is mounted on the limiting bracket. The first rotating rod is connected to the output end of the first motor. The first screw is fixedly connected to the first rotating rod and threadedly connected to the lifting block.

[0008] The lifting component further includes an anti-detachment block, which is fixedly connected to the first screw and located on the side of the first screw away from the first rotating rod.

[0009] The rotating component includes a second motor and a second rotating rod. The second motor is mounted on the mounting base. The second rotating rod is connected to the output end of the second motor and is fixedly connected to the rotating frame.

[0010] The translation component includes a third motor, a third rotating rod, and a second screw. The third motor is mounted on the transverse support. The third rotating rod is connected to the output end of the third motor. The second screw is fixedly connected to the third rotating rod and threadedly connected to the translation carriage.

[0011] The limiting bracket has a first sliding groove, which is located on the side of the limiting bracket close to the lifting block and cooperates with the lifting block.

[0012] The transverse support has a second sliding groove, which is located on the side of the transverse support near the translational slide and cooperates with the translational slide.

[0013] The conveying assembly further includes a reinforcing component, which includes a reinforcing bracket and a reinforcing bolt. The reinforcing bracket is welded to the limiting bracket and is located on one side of the limiting bracket. The reinforcing bolt is disposed on the reinforcing bracket and connected to the worktable.

[0014] The conveying assembly further includes a control component, which includes a control base and a wire. The control base is disposed on the limiting bracket, and the wire is connected to the control base.

[0015] This invention discloses a semiconductor chip packaging device. When it is necessary to move the chip on the worktable, the pneumatic suction cup can pick up the chip on the worktable by the output of the electric push rod. The lifting component is activated to drive the lifting block to move up and down. The lifting block can drive the mounting seat on the lifting frame to move up and down. The rotating component can rotate the rotating frame connected to the mounting seat. The translation component can drive the translation bracket in the transverse support connected to the rotating frame to move along the longitudinal direction of the transverse support. Thus, through the lifting block, the rotation of the rotating frame and the movement of the translation bracket, the chip picked up by the pneumatic suction cup can be moved in multiple directions as needed, thereby meeting the chip moving needs in multiple directions. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0017] Figure 1 This is a schematic diagram of the structure of a semiconductor chip packaging device according to the first embodiment of the present invention.

[0018] Figure 2 This is a schematic diagram of the lifting component according to the first embodiment of the present invention.

[0019] Figure 3 This is a schematic diagram of the translation component according to the first embodiment of the present invention.

[0020] Figure 4 This is a schematic diagram of the structure of a semiconductor chip packaging device according to the second embodiment of the present invention.

[0021] Figure 5 This is a schematic diagram of the structure of a semiconductor chip packaging device according to the third embodiment of the present invention.

[0022] In the diagram: 101-Workbench, 102-Limit Bracket, 103-Lifting Block, 104-Lifting Frame, 105-Mounting Base, 106-Rotating Frame, 107-Horizontal Bracket, 108-Transverse Slide, 109-Electric Push Rod, 110-Pneumatic Suction Cup, 111-First Motor, 112-First Rotating Rod, 113-First Screw, 114-Anti-detachment Block, 115-Second Motor, 116-Second Rotating Rod, 117-Third Motor, 118-Third Rotating Rod, 119-Second Screw, 120-First Slide, 121-Second Slide, 201-Reinforcing Bracket, 202-Reinforcing Bolt, 301-Control Base, 302-Wire. Detailed Implementation

[0023] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0024] The first embodiment of this application is as follows: Please see Figures 1-3 ,in Figure 1 This is a schematic diagram of the structure of a semiconductor chip packaging device according to the first embodiment of the present invention. Figure 2 This is a schematic diagram of the lifting component according to the first embodiment of the present invention. Figure 3 This is a schematic diagram of the translation component according to the first embodiment of the present invention.

[0025] This invention provides a semiconductor chip packaging device, including a worktable 101 and a transport assembly. The transport assembly includes a limiting bracket 102, a lifting block 103, a lifting frame 104, a mounting base 105, a rotating frame 106, a transverse bracket 107, a translational slide 108, an electric push rod 109, a pneumatic suction cup 110, a lifting component, a rotating component, and a translational component. The lifting component includes a first motor 111, a first rotating rod 112, a first screw 113, and an anti-detachment block 114. The rotating component includes a second motor 115 and a second rotating rod 116. The translational component includes a third motor 117, a third rotating rod 118, and a second screw 119. The limiting bracket 102 has a first sliding groove 120, and the transverse bracket 107 has a second sliding groove 121. The aforementioned solution addresses the issue that existing equipment cannot handle chips from multiple directions when the receiving station positions for the chips are not uniform, thus failing to meet the demand for handling chips from multiple locations. It is understood that the aforementioned solution can be used in situations where it is necessary to handle chips on the workbench from multiple directions.

[0026] In this embodiment, the limiting bracket 102 is fixedly connected to the worktable 101 and located on one side of the worktable 101; the lifting block 103 is slidably connected to the limiting bracket 102 and located on one side of the limiting bracket 102; the lifting frame 104 is fixedly connected to the lifting block 103 and located on one side of the lifting block 103; the mounting base 105 is fixedly connected to the lifting frame 104 and located on one side of the lifting frame 104; the rotating frame 106 is connected to the mounting base 105 through the rotating member and located on one side of the mounting base 105; the transverse bracket 107 is fixedly connected to the rotating frame 106 and located on one side of the rotating frame 106; and the translational slide 108... The electric push rod 109 is slidably connected to the transverse support 107 and located on one side of the transverse support 107. The electric push rod 109 is mounted on the translation slide 108, and the pneumatic suction cup 110 is mounted on the output end of the electric push rod 109. The lifting component is mounted on the limiting bracket 102 and connected to the lifting block 103. The rotating component is mounted on the mounting base 105 and connected to the rotating frame 106. The translation component is mounted on the transverse support 107 and connected to the translation slide 108. The limiting bracket 102 is welded to the worktable 101, and the lifting block 103 is slidably connected in the limiting bracket 102. The limiting bracket 102 can control the movement of the lifting block 103. The lifting frame 104 is welded to the lifting block 103, and the mounting base 105 is welded to the lifting frame 104. The lifting block 103 moves up and down, thereby moving the mounting base 105 on the lifting frame 104. The rotating frame 106 is connected to the moving mounting base 105 via a rotating component, which allows the rotating frame 106 to rotate. The transverse support 107 is welded to the rotating frame 106, and the rotation of the rotating frame 106 causes the transverse support 107 to rotate. The translational slide 108 is slidably connected within the transverse support 107. The electric push rod 109 is disposed on the transverse slide. On the sliding carriage 108, the pneumatic suction cup 110 is mounted on the output end of the electric push rod 109. The pneumatic suction cup 110 can move towards the worktable 101 through the output of the electric push rod 109 to pick up the chip on the worktable 101. At the same time, through the lifting and moving of the lifting block 103, the rotation of the rotating frame 106, and the movement of the sliding carriage 108, the chip picked up by the pneumatic suction cup 110 can be transported in multiple directions as needed. The lifting component is mounted on the limiting bracket 102 and connected to the lifting block 103. The lifting component provides the corresponding power source for the lifting and moving of the lifting block 103. The rotating component is mounted on the mounting base 105.The rotating component is connected to the rotating frame 106, providing a power source for the rotation of the rotating frame 106. The translation component is mounted on the transverse support 107 and connected to the translation slide 108, providing a power source for the movement of the translation slide 108. This allows the pneumatic suction cup 110 to pick up the chip from the worktable 101 via the output of the electric push rod 109, and the lifting component to move the lifting block 103 up and down. The lifting and lowering movement of block 103 drives the mounting base 105 on the lifting frame 104 to move up and down. The rotating component allows the rotating frame 106 connected to the mounting base 105 to rotate. The translation component allows the translation bracket within the transverse support 107 connected to the rotating frame 106 to move along the longitudinal direction of the transverse support 107. Thus, through the lifting and lowering movement of block 103, the rotation of the rotating frame 106, and the movement of the translation slide 108, the chip picked up by the pneumatic suction cup 110 can be transported in multiple directions as needed, thereby meeting the multi-directional chip handling requirements.

[0027] The first motor 111 is mounted on the limiting bracket 102; the first rotating rod 112 is connected to the output end of the first motor 111; the first screw 113 is fixedly connected to the first rotating rod 112 and threadedly connected to the lifting block 103; the anti-detachment block 114 is fixedly connected to the first screw 113 and located on the side of the first screw 113 away from the first rotating rod 112; the first motor 111 is bolted to the limiting bracket 102; the first rotating rod 112 is connected to and fixed to the output end of the first motor 111; and the first motor 111 drives the first rotating rod 112. A rotating rod 112 rotates, and the first screw 113 is welded to the first rotating rod 112 and threadedly connected to the lifting block 103. The rotation of the first rotating rod 112 can drive the rotation of the first screw 113. Under the directional limiting effect of the thread of the first screw 113 and the limiting bracket 102 on the movement of the lifting block 103, the first screw 113 can make the lifting block 103 slide up and down within the limiting bracket 102 when it rotates. The anti-detachment block 114 is welded to the first screw 113, and the anti-detachment block 114 can prevent the lifting block 103 from detaching from the first screw 113.

[0028] Secondly, the second motor 115 is mounted on the mounting base 105; the second rotating rod 116 is connected to the output end of the second motor 115 and fixedly connected to the rotating frame 106. The second motor 115 is bolted to the mounting base 105, the second rotating rod 116 is connected to the output end of the second motor 115, and the second rotating rod 116 is welded to the rotating frame 106, so that the rotating frame 106 on the rotating rod can be rotated by the drive output of the second motor 115.

[0029] Meanwhile, the third motor 117 is mounted on the transverse support 107; the third rotating rod 118 is connected to the output end of the third motor 117; the second screw 119 is fixedly connected to the third rotating rod 118 and threadedly connected to the translation slide 108; the third motor 117 is bolted to the transverse support 107; the third rotating rod 118 is connected to the output end of the third motor 117; the third rotating rod 118 can be rotated by the drive output of the third motor 117; the second screw 119 is welded to the third rotating rod 118 and threadedly connected to the translation slide 108; the rotation of the third rotating rod 118 can drive the rotation of the second screw 119; under the directional limiting action of the thread of the second screw 119 and the transverse support 107 on the movement of the translation slide 108, the second screw 119 can slide within the transverse support 107 when it rotates.

[0030] In addition, the first slide groove 120 is located on the side of the limiting bracket 102 close to the lifting block 103 and cooperates with the lifting block 103. The lifting block 103 can move along the length of the first slide groove 120. The first slide groove 120 can achieve the purpose of limiting the movement of the lifting block 103 in the limiting bracket 102.

[0031] Finally, the second slide groove 121 is located on the side of the transverse support 107 close to the translation slide 108 and cooperates with the translation slide 108. The translation slide 108 can move along the length of the second slide groove 121. The second slide groove 121 can achieve the purpose of limiting the movement of the translation slide 108 in the transverse support 107.

[0032] When using the semiconductor chip packaging equipment of this embodiment, when it is necessary to move the chip on the worktable 101, the pneumatic suction cup 110 can move towards the worktable 101 through the output of the electric push rod 109 to pick up the chip on the worktable 101. The lifting component is activated to drive the lifting block 103 to move up and down. The lifting block 103 can drive the mounting base 105 on the lifting frame 104 to move up and down. The rotating component can rotate the rotating frame 106 connected to the mounting base 105. The translation component can drive the translation bracket in the transverse support 107 connected to the rotating frame 106 to move along the longitudinal direction of the transverse support 107. Thus, through the lifting block 103, the rotation of the rotating frame 106 and the movement of the translation slide 108, the chip picked up by the pneumatic suction cup 110 can be moved in multiple directions as needed, thereby meeting the chip moving needs in multiple directions.

[0033] The second embodiment of this application is as follows: Please see Figure 4 ,in Figure 4 This is a schematic diagram of the structure of a semiconductor chip packaging device according to the second embodiment of the present invention.

[0034] Based on the first embodiment, the semiconductor chip packaging device of this embodiment further includes a reinforcing component, which includes a reinforcing bracket 201 and a reinforcing bolt 202.

[0035] The reinforcing bracket 201 is welded to the limiting bracket 102 and located on one side of the limiting bracket 102. The reinforcing bolt 202 is disposed on the reinforcing bracket 201 and connected to the workbench 101. There are two reinforcing brackets 201, which are welded to both sides of the limiting bracket 102. There are multiple reinforcing bolts 202. By tightening the reinforcing bolts 202, the reinforcing bracket 201 can be connected and fixed to the workbench 101. Thus, the limiting bracket 102 can be more closely connected and fixed to the workbench 101 through the reinforcing bracket 201 and the reinforcing bolts 202, thereby increasing the connection stability of the limiting bracket 102.

[0036] The third embodiment of this application is as follows: Please see Figure 5 ,in Figure 5 This is a schematic diagram of the structure of a semiconductor chip packaging device according to the third embodiment of the present invention.

[0037] Based on the second embodiment, the semiconductor chip packaging device of this embodiment further includes a control component, which includes a control base 301 and a wire 302.

[0038] The control base 301 is mounted on the limiting bracket 102. The wire 302 is connected to the control base 301. The control base 301 has a microcontroller and can electrically connect to the electrical devices installed on the equipment. The controller in the control base 301 can control the electrical devices installed on the equipment. The wire 302 is connected to the control base 301 and connected to the controller in the control base 301. The wire 302 can be used to externally assist the operator in inputting corresponding control commands.

[0039] The above-disclosed embodiments are merely one or more preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art can understand that all or part of the processes for implementing the above embodiments and equivalent changes made in accordance with the claims of this application still fall within the scope of this application.

Claims

1. A semiconductor chip packaging device, comprising a worktable, characterized in that, It also includes transport components; The handling assembly includes a limiting bracket, a lifting block, a lifting frame, a mounting base, a rotating frame, a transverse bracket, a translational slide, an electric push rod, a pneumatic suction cup, a lifting component, a rotating component, and a translational component. The limiting bracket is fixedly connected to the worktable and located on one side of the worktable. The lifting block is slidably connected to the limiting bracket and located on one side of the limiting bracket. The lifting frame is fixedly connected to the lifting block and located on one side of the lifting block. The mounting base is fixedly connected to the lifting frame and located on one side of the lifting frame. The rotating frame and the mounting base are connected by a rotating... The components are connected and located on one side of the mounting base. The transverse support is fixedly connected to the rotating frame and located on one side of the rotating frame. The translation slide is slidably connected to the transverse support and located on one side of the transverse support. The electric push rod is mounted on the translation slide. The pneumatic suction cup is mounted on the output end of the electric push rod. The lifting component is mounted on the limiting bracket and connected to the lifting block. The rotating component is mounted on the mounting base and connected to the rotating frame. The translation component is mounted on the transverse support and connected to the translation slide.

2. The semiconductor chip packaging equipment as described in claim 1, characterized in that, The lifting component includes a first motor, a first rotating rod, and a first screw. The first motor is mounted on the limiting bracket. The first rotating rod is connected to the output end of the first motor. The first screw is fixedly connected to the first rotating rod and threadedly connected to the lifting block.

3. The semiconductor chip packaging equipment as described in claim 1, characterized in that, The rotating component includes a second motor and a second rotating rod. The second motor is mounted on the mounting base. The second rotating rod is connected to the output end of the second motor and is fixedly connected to the rotating frame.

4. The semiconductor chip packaging equipment as described in claim 1, characterized in that, The translation component includes a third motor, a third rotating rod, and a second screw. The third motor is mounted on the transverse support. The third rotating rod is connected to the output end of the third motor. The second screw is fixedly connected to the third rotating rod and threadedly connected to the translation slide.

5. The semiconductor chip packaging equipment as described in claim 1, characterized in that, The limiting bracket has a first sliding groove, which is located on the side of the limiting bracket close to the lifting block and cooperates with the lifting block.

6. The semiconductor chip packaging equipment as described in claim 1, characterized in that, The conveying assembly also includes a reinforcing component, which includes a reinforcing bracket and a reinforcing bolt. The reinforcing bracket is welded to the limiting bracket and is located on one side of the limiting bracket. The reinforcing bolt is disposed on the reinforcing bracket and connected to the worktable.

7. The semiconductor chip packaging equipment as described in claim 1, characterized in that, The transport assembly further includes a control component, which includes a control base and a wire. The control base is disposed on the limiting bracket, and the wire is connected to the control base.

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