Bonding method and object to be bonded

Abstract

The invention provides a bonding method and an object to be bonded, which can reduce the man-hour during bonding, do not need to strictly control the amount and load of the adhesive, and can reduce the overflow of the adhesive to improve the adhesion. The bonding method includes: a coating step, a forming step, or a disposing step; and a setting step and a processing step in which the first base material (210) and the second base material (220) are set in the first die (110) and the second die (120) such that the portion to which the adhesive (300) is applied, molded or disposed is positioned in the recess (114) and the recess (124), and the first base material (210) and the second base material (220) are pressed by the first die (110) and the second die (120). The first base material (210) is deformed by the adhesive (300) in the recessed portion (114), and forms a protruding portion (212) protruding toward the recessed portion (114). The second base material (220) is deformed in the recessed portion (124) by the adhesive (300) and forms a protruding portion (222) protruding toward the recessed portion (124). The adhesive (300) is filled in a gap formed by the convex portion (212) and the convex portion (222).

Description

Technical Field

[0001] This invention relates to bonding methods and adherends. Background Technology

[0002] Conventionally, a method for bonding two substrates (hereinafter referred to as substrates) has involved using a mold (see, for example, Patent Document 1). For instance, adhesive is applied to the desired bonding location (hereinafter referred to as the bonding portion) on one substrate, and the two substrates are pressed and held together using a mold, thereby obtaining an article (hereinafter referred to as the bonded article) that bonds the two substrates together. In conventional methods, there are problems such as the adhesive spreading during pressure, resulting in insufficient thickness and easy peeling, requiring strict control of the load applied to the mold and the amount of adhesive. Therefore, for example, in the case of thick-walled substrates with a thickness exceeding 1 mm, a method exists where a groove is pre-grooved on one substrate to form a groove, and adhesive is applied within the groove. Furthermore, for example, in the case of thin-walled substrates with a thickness of 0.1 mm or less, a method exists where a deep-drawing process is pre-performed on one substrate to form a surrounding portion, and adhesive is applied within the surrounding portion. This prevents adhesive overflow during pressure holding using a mold.

[0003] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2002-347123 Summary of the Invention

[0004] The problem that the invention aims to solve However, methods that pre-form grooves and surrounding sections on a substrate require time-consuming grooving and drawing processes. Furthermore, to prevent adhesive overflow from the grooves and surrounding sections, precise control of the adhesive amount and processing load is necessary. If the amount of adhesive is less than required or the pressure is too low, voids may form in the bonded area, potentially resulting in insufficient strength. Conversely, if the amount of adhesive is more than required or the pressure is too high, adhesive leakage may occur, forming burrs, or the increased internal pressure during molding may cause the substrate to crack.

[0005] The present invention was made in view of the above circumstances, and the exemplary technical problem to be solved by it is to provide a bonding method and a bonded object that can reduce the time required for bonding, and does not require strict control of the amount of adhesive or the load, and can reduce adhesive overflow and improve adhesion.

[0006] Technical solutions for solving technical problems In order to solve the above-mentioned technical problems, the bonding method, as an exemplary aspect of the present invention, has the following configuration.

[0007] An adhesive bonding method wherein an adhesive is sandwiched between a first adhesive surface of a first substrate and a second adhesive surface of a second substrate, and the first substrate and the second substrate are sandwiched between a first mold and a second mold opposite to the first mold and bonded under pressure. The first mold has a first recess. The second mold has a second recess at a position opposite to the first recess. The bonding method comprises the following steps: The first step, wherein the adhesive is applied, shaped, or prepared on the first bonding surface or the second bonding surface; and In the second step, the first substrate is placed on the first mold side and the second substrate is placed on the second mold side such that the portions coated, shaped, or disposed of with the adhesive are located in the first recess and the second recess, and pressure is applied to the first substrate and the second substrate using the first mold and the second mold. The first substrate deforms within the first recess due to the adhesive, forming a first protrusion extending into the first recess. The second substrate deforms within the second recess due to the adhesive, forming a second protrusion extending into the second recess. The adhesive fills the gap formed by the first protrusion and the second protrusion.

[0008] The bonding method, as another exemplary aspect of the present invention, has the following configuration.

[0009] An adhesive bonding method wherein an adhesive is sandwiched between a first adhesive surface of a first substrate and a second adhesive surface of a second substrate, and the first substrate and the second substrate are sandwiched between a first mold and a second mold opposite to the first mold and bonded under pressure. The first mold has a recess. The bonding method comprises the following steps: The first step, wherein the adhesive is applied, shaped, or prepared on the first bonding surface or the second bonding surface; and In the second step, the first substrate is placed on the first mold side and the second substrate is placed on the second mold side, with the portion coated, shaped, or disposed of with the adhesive located in the recess, and pressure is applied to the first substrate and the second substrate using the first mold and the second mold. The first substrate deforms within the recess due to the adhesive, forming a protrusion that extends into the recess. The adhesive fills the voids formed by the protrusions.

[0010] In order to solve the above-mentioned technical problems, the adhesive, as an exemplary aspect of the present invention, has the following configuration.

[0011] An adhesive having the following characteristics: A first substrate having a first adhesive surface; A second substrate having a second adhesive surface; and An adhesive that bonds at least a portion of the first adhesive surface and the second adhesive surface together. The first substrate has a first protrusion that deforms and protrudes to the side opposite to the first adhesive surface due to the adhesive; and / or The second substrate has a second protrusion that deforms and protrudes to the side opposite to the second bonding surface due to the adhesive. The adhesive fills the gap formed by the first protrusion and / or the second protrusion.

[0012] Further objectives or other features of the invention will become clearer from the preferred embodiments described below with reference to the accompanying drawings.

[0013] Invention Effects According to the present invention, a bonding method and a bonded object can be provided, which can reduce the time required for bonding and does not require strict control of the amount of adhesive or the load, thereby reducing adhesive overflow and improving adhesion. Attached Figure Description

[0014] Figure 1 This is a schematic diagram illustrating the bonding method of the substrate according to the first embodiment. Figure 1 (a) is a schematic diagram showing the coating process of applying adhesive to a substrate. Figure 1 (b) is a schematic diagram showing a pressure device for bonding two substrates. Figure 1 (c) is a schematic diagram showing the situation where two substrates are pressurized and held using a mold. Figure 1 (d) is a schematic diagram showing the condition of the substrate after it has been removed from the bonded container.

[0015] Figure 2 (a) to (d) are diagrams showing the state of the adhesive being formed by the injection molding method of the first to fifth embodiments.

[0016] Figure 3 This is a diagram illustrating the relationship between the concave portion of the mold and the convex portion of the substrate in the first embodiment.

[0017] Figure 4This is a schematic diagram illustrating the bonding method of the substrate according to the second embodiment. Figure 4 (a) is a schematic diagram showing the coating process of applying adhesive to a substrate. Figure 4 (b) is a schematic diagram showing a pressure device for bonding two substrates. Figure 4 (c) is a schematic diagram showing the situation where two substrates are pressurized and held using a mold. Figure 4 (d) is a schematic diagram showing the condition of the substrate after it has been removed from the bonded container.

[0018] Figure 5 This is a schematic diagram illustrating the bonding method of the substrate according to the third embodiment. Figure 5 (a) is a schematic diagram showing the first coating process of applying adhesive to a substrate. Figure 5 (b) is a schematic diagram showing the second coating process of applying adhesive (binder) to the substrate. Figure 5 (c) is a schematic diagram showing the bonding of two substrates. Figure 5 (d) is a schematic diagram showing the situation where two substrates are pressurized and held using a mold. Figure 5 (e) is a schematic diagram showing the condition of the substrate after it has been removed from the bonded area.

[0019] Figure 6 This represents the fourth embodiment, wherein Figure 6 (a) is an enlarged view of the adhesive portion bonded using the bonding method of the third embodiment. Figure 6 (b) is a schematic diagram showing a molded article in which the two substrates are bonded together while the sealing component is being manufactured. Figure 6 (c) is Figure 6 (b) EE-direction view. Detailed Implementation

[0020] Hereinafter, embodiments will be described with reference to the accompanying drawings. Here, "forming" refers to a process of creating the shape of rubber, resin, or adhesive without a curing (crosslinking) reaction, regardless of whether a mold is used; "molding" refers to a process of creating the shape of rubber, resin, or adhesive simultaneously with a curing (crosslinking) reaction using a mold heated, for example, to 150°C to 200°C. Furthermore, the location (part) where the two substrates are to be bonded (or require bonding) is referred to as the bonding portion.

[0021] [First Implementation Method] In the first embodiment, an adhesive bonding method is described in which an adhesive is sandwiched between a first adhesive surface of a first substrate and a second adhesive surface of a second substrate, and the first substrate and the second substrate are sandwiched between a first mold and a second mold opposite to the first mold and bonded under pressure.

[0022] <Substrate, Adhesives and Molds> Figure 1 This is a schematic diagram illustrating the bonding method of the substrate according to the first embodiment. Figure 1 (a) is a schematic diagram showing the coating process of applying adhesive to a substrate. Figure 1 (b) is a schematic diagram showing a pressure device for bonding two substrates. Figure 1 (c) is a schematic diagram showing the situation where two substrates are pressurized and held using a mold. Figure 1 (d) is a schematic diagram showing the condition of the substrate after it has been removed from the bonded container.

[0023] The bonding method of the first embodiment is implemented using a coating apparatus 400 and a pressure device 100. Here, the adhesive 300 is applied to the first substrate 210 by the coating apparatus 400, and the first substrate 210 is bonded to the second substrate 220 by the pressure device 100.

[0024] (Substrate) The first substrate 210 and the second substrate 220, which are the materials to be bonded, are, for example, deformation-resistant materials such as thin metal sheets or resin films, and have a thickness of, for example, 0.1 mm or less. It should be noted that as long as the material is deformation-resistant, the thickness can exceed 0.1 mm. The first substrate 210 and the second substrate 220 do not include materials that are prone to brittle fracture, such as ceramics and glass.

[0025] The first substrate 210 has a surface 210a that serves as a first bonding surface for coating the adhesive 300, and a surface 210b that is opposite to surface 210a. The second substrate 220 has a surface 220a that serves as a second bonding surface for coating the adhesive 300, and a surface 220b that is opposite to surface 220a.

[0026] (Adhesive) The adhesive 300 is a material capable of bonding to both the first substrate 210 and the second substrate 220. Furthermore, the adhesive 300 is a material with a viscosity sufficient to maintain its shape when applied to the first substrate 210. Therefore, the adhesive 300 does not contain any adhesive whose viscosity is insufficient to maintain its shape during application.

[0027] (Mold) The pressurizing device 100 of the first embodiment includes a first mold 110 and a second mold 120. Both the first mold 110 and the second mold 120 have concave portions. For example... Figure 1As shown in (b), when observing the vertical cross-section of the first mold 110 and the second mold 120, a recess 114, which is a concave first recess (or recess), is provided on the surface 112 of the first mold 110 opposite to the second mold 120. The recess 114 is formed by a bottom surface 114a, a wall surface 114b connecting the bottom surface 114a and the surface 112, and a wall surface 114c opposite to the wall surface 114b, forming a space 114Sp. In the first embodiment, the cross-section of the recess 114 is U-shaped, but the shape is not limited to U-shaped as long as it can accommodate the deformed first substrate 210 described later within the space 114Sp formed by the recess 114. For example, the cross-section can also be curved.

[0028] Additionally, in the second mold 120, a second recess (or recess) 124 is provided on the surface 122 opposite to the first mold 110 and at a position opposite to the recess 114. The recess 124 is formed by a bottom surface 124a, a wall surface 124b connecting the bottom surface 124a and the surface 122, and a wall surface 124c opposite to the wall surface 124b, forming a space 124Sp. The recess 124 is also in the same U-shaped cross-section as the recess 114, but the cross-sectional shape is not limited to the U-shape.

[0029] It should be noted that, regarding the relationship with Figure 1 In the direction orthogonal to the paper surface of (b), the lengths of the recesses 114 and 124, in other words, the lengths of the adhesive portions in the direction orthogonal to the paper surface, can be determined according to the uses of the first substrate 210 and the second substrate 220. Furthermore, when viewed from a direction orthogonal to the surface 112 of the first mold 110 and the surface 122 of the second mold 120, the recesses 114 and 124 are not limited to extending in a straight line, and can be formed into free shapes depending on the uses of the first substrate 210 and the second substrate 220.

[0030] For example, as described later Figure 6 As shown in (b), the protrusion 222 of the second substrate 220, described later, is depicted as a combination of straight lines and curves. Thus, the protrusion 212 (see reference) can also be formed on the surface 112 of the first mold 110 and the surface 122 of the second mold 120. Figure 6 (c) and the concave portion 114 and concave portion 124 corresponding to the convex portion 222.

[0031] <Adhesion Method> The bonding method of the first embodiment is performed using a coating apparatus 400 and a pressure device 100, and includes a coating process, a setting process, a pressure application process, and a removal process. In the first embodiment, a bonding method utilizing the deformation of the substrate caused by the adhesive will be described.

[0032] (Coating process, forming process, or preparation process) like Figure 1 As shown in (a), the first step, namely the coating step, of applying adhesive 300 to surface 210a or surface 220a is performed using a coating apparatus 400. The coating apparatus 400 includes a nozzle 410 and a worktable 420. The nozzle 410 sprays the adhesive 300 contained in the coating apparatus 400 downwards. The worktable 420 holds the positioned first substrate 210. The first substrate 210 is precisely positioned and placed on the worktable 420 in a manner that ensures high-precision bonding at a predetermined location.

[0033] The nozzle 410 sprays adhesive 300 onto the surface 210a of the first substrate 210, which is positioned on the worktable 420. It should be noted that the coating apparatus 400 may also be configured such that either or both of the nozzle 410 and the worktable 420 can move within a plane orthogonal to the vertical direction (hereinafter referred to as the horizontal plane). Thus, in order to form adhesive 300 on the first substrate 210 and the second substrate 220... Figure 6 The protrusions 212 and 222 are drawn with the required lines using adhesive 300.

[0034] It should be noted that, Figure 1 The coating apparatus 400 shown in (a) is an example. The coating method for the adhesive 300 can be implemented using, for example, a spray gun, a dispenser, a coating machine, a printer, or injection molding using a mold. Alternatively, it is also possible to use adhesives that are not used in a coating apparatus or mold, such as hot melt adhesives processed into sheets or films, or films in which the adhesive is formed on both sides (simple setup). In this case, the bonding method includes a first step of applying the adhesive to a substrate. Thus, the bonding method of the first embodiment includes a coating step of applying the adhesive or a preparation step of applying the adhesive. It should be noted that the following description will focus on the case where the adhesive is applied in the coating step.

[0035] (Injection molding) Figure 2 It means to substitute Figure 1 (a) is a diagram of a method of coating adhesive 300 by injection molding using a coating apparatus 400. Figure 2 The forming apparatus 450 for the adhesive 300 shown includes molds 450A, 450B, and 450C. Mold 450B is provided with a gate 450Ba and a recess 450Bb. Figure 2 As shown in (a), an adhesive or binder 301 is placed between molds 450A and 450B, and a first substrate 210 is placed between molds 450B and 450C. Figure 2As shown in (b), by applying pressure using the forming device 450, adhesive or binder 301 is injected from the gate 450Ba into the recess 450Bb on the first substrate 210, thereby forming adhesive 300 on the first substrate 210. Figure 2 As shown in (c), by separating molds 450A and 450B from mold 450C, i.e., by opening the mold, it is possible to obtain the following: Figure 2 (d) shows the bonding (forming) of a first substrate 210 with adhesive 300. It should be noted that... Figure 2 The method shown can replace the one described later. Figure 4 (a) The coating method performed using coating apparatus 400 Figure 5 (b) is used for the coating method performed by the coating apparatus 500.

[0036] (Setting up the process) Next, the process of setting the first substrate 210 on the side of the first mold 110 and the second substrate 220 on the side of the second mold 120, such that the portion coated with adhesive 300 is located in the recesses 114 and 124, will be described. Figure 1 As shown in (b), the first substrate 210 and the second substrate 220 are precisely positioned and placed on the pressurizing device 100. For the first substrate 210 coated with adhesive 300, the position of the adhesive 300 and the positions of the recesses 114 of the first mold 110 and 124 of the second mold 120 are precisely positioned and placed on the surface 112 of the first mold 110. Similarly, the second substrate 220 is precisely positioned and placed on the first substrate 210 coated with adhesive 300. Regarding the positioning of the first substrate 210 and the second substrate 220 relative to the first mold 110, the positions can be identified and positioned, for example, by engaging pre-set holes (not shown) in the first substrate 210 and the second substrate 220 with positioning pins (not shown) on the first mold 110, or by using a camera, etc.

[0037] (Pressure process) Next, the pressurization process of pressurizing the first substrate 210 and the second substrate 220 using the first mold 110 and the second mold 120 will be described. In this state, the first substrate 210 and the second substrate 220 are pressurized and held by the first mold 110 and the second mold 120.

[0038] Here, as Figure 1As shown in (c), portions A1 and A2, indicated by dashed lines, are formed on the first substrate 210 and the second substrate 220, respectively, and portion B1, indicated by dashed lines, is not pressed due to the presence of recesses 114 and 124. Portion B1 is pre-positioned such that the portion coated with adhesive 300 is located therein, thus forming a state where the adhesive 300 is sandwiched between the first substrate 210 and the second substrate 220. It should be noted that in portion B1, with reference to either the first substrate 210 or the second substrate 220, the side containing the adhesive 300 is referred to as the inner side, and the side without the adhesive 300 is referred to as the outer side.

[0039] Regarding portion B1, before the deformation of the first substrate 210 and the second substrate 220, the first substrate 210 and the second substrate 220 do not contact the first mold 110 and the second mold 120, and do not hinder the flow of the adhesive 300 in the vertical direction within portion B1 caused by pressure. On the other hand, due to the presence of the pressurized portions A1 and A2, the flow in the horizontal direction of the paper surface is restricted. Through the anisotropic flow accompanying the adhesive 300, in at least a portion of portion B1, the first substrate 210 and the second substrate 220 deform to become a first protrusion (or protrusion), namely protrusion 212, and a second protrusion (or protrusion), namely protrusion 222, protruding outward. It should be noted that, regarding portion B1, after the deformation of the first substrate 210 and the second substrate 220, the first substrate 210 may or may not contact the first mold 110, and similarly, the second substrate 220 may or may not contact the second mold 120. Whether the first substrate 210 and the first mold 110, and the second substrate 220 and the second mold 120, come into contact after deformation depends on the amount of adhesive 300 filled inside.

[0040] Figure 3This diagram illustrates the relationship between the recess 114 of the first mold 110, the protrusion 212 of the first substrate 210, the recess 124 of the second mold 120, and the protrusion 222 of the second substrate 220 according to the first embodiment. Here, the widths of the recesses 114 and 124 are denoted as W1, and their heights as H1. The widths of the protrusions 212 and 222 after deformation due to the flow of the adhesive 300 are denoted as W2, and their heights as deformation due to the flow of the adhesive 300 are denoted as H2. It should be noted that when observing the cross-section in the direction of the adhesive extension (the direction orthogonal to the paper surface), the widths of the protrusions 212 and 222 are defined as the distance from the start of deformation of the first substrate 210 and the second substrate 220 to the end of deformation. In addition, the height is based on the surface 210b of the first substrate 210 or the surface 220b of the second substrate 220, but other positions can be used as references as long as the heights H1 and H2 can be measured with the same reference.

[0041] At this time, the recess 114 of the first mold 110 and the recess 124 of the second mold 120 are formed in such a way that they satisfy the following relationship.

[0042] W1≥W2 H1≥H2 It should be noted that the first substrate 210 and the second substrate 220 use the same substrate material, and the protrusions of the protrusions 212 and 222 are approximately the same.

[0043] By satisfying the above relationships, the first mold 110 and the second mold 120 will not hinder the deformation of the first substrate 210 and the second substrate 220, and the adhesive 300 can be prevented from overflowing into unwanted parts. The protrusions 212 and 222 are filled with adhesive 300, forming adhesive accumulation bodies 310.

[0044] (Removal process) like Figure 1 As shown in (d), the first substrate 210 and the second substrate 220, which are bonded together by adhesive 300, are removed as the bonded objects 200 during the processing step. It should be noted that the removal process can be automated, for example, by a robotic arm or robot, or it can be done manually.

[0045] <Substance to be glued> The bonded object 200, formed by bonding the first substrate 210 and the second substrate 220 together with an adhesive 300, comprises an adhesive 300 that bonds at least a portion of the surface 210a of the first substrate 210 and a portion of the surface 220a of the second substrate 220. Furthermore, in the bonded object 200, the first substrate 210 has a protrusion 212 that deforms and protrudes towards the surface 210b opposite to the surface 210a together with the adhesive 300. And / or, the second substrate 220 has a protrusion 222 that deforms and protrudes towards the surface 220b opposite to the surface 220a together with the adhesive 300.

[0046] <Effect> Thus, in the bonding method of the first embodiment, the adhesive 300 flows under pressure by the first mold 110 and the second mold 120 in the second step. Due to the flow of the adhesive 300, the first substrate 210 deforms within the recess 114, forming a protrusion 212 protruding into the recess 114. Similarly, due to the flow of the adhesive 300, the second substrate 220 deforms within the recess 124, forming a protrusion 222 protruding into the recess 124.

[0047] According to the bonding method using the pressure device 100 in the first embodiment, grooving and drawing processes for the first substrate 210 and the second substrate are not required. By forming an adhesive reservoir 310 at the bonding portion of the first substrate 210 and the second substrate 220, a sufficient amount of adhesive 300 can be ensured, making it difficult for the bonded first substrate 210 and the second substrate 220 to peel off with shear force. Here, the direction of the shear force is... Figure 1 The direction of the arrows Sr1 and Sr2 (or Sr3 and Sr4, indicated by solid lines) in (d).

[0048] Furthermore, the first substrate 210 and the second substrate 220 deform due to the flow of the adhesive 300. Therefore, the first substrate 210 and the second substrate 220 can deform in accordance with the amount of adhesive 300, as long as the deformation is within the deformation limit. Regarding the degree of protrusion of the protrusion 212 of the first substrate 210 and the protrusion 222 of the second substrate 220, the less adhesive 300 is sealed inside, the smaller the protrusion, and the more adhesive 300 is used, the larger the protrusion. Therefore, it is not necessary to strictly control the amount of adhesive as in the past.

[0049] According to the first embodiment, a bonding method and a bonded object can be provided, which can reduce the time required for bonding and does not require strict control of the amount of adhesive or the load, thereby reducing adhesive overflow and improving adhesion.

[0050] It should be noted that in the first embodiment, an example of adhesive flowing under pressure and substrate deformation is described. However, the present invention is not limited to this. For example, when the adhesive is hard and has low fluidity, the flow caused by pressure will deform the substrate under pressure, at least due to the presence of the adhesive. In addition, in the case of thermoplastic adhesives (hot melt adhesives) and thermosetting adhesives (e.g., epoxy adhesives), heating is required while applying pressure, but in this case, in addition to the flow of the adhesive caused by pressure, the substrate also deforms due to the thermal expansion of the adhesive. In this case, by appropriately setting the width W1 and height H1 while taking into account the amount of expansion, the adhesive 300 can also be prevented from overflowing into unwanted parts. The following embodiments are the same. That is, the adhesive includes adhesives with low fluidity, adhesives whose volume changes due to expansion, and adhesives whose volume does not change (non-expanding adhesives, non-compressible adhesives). That is, the present invention includes a first substrate 210, a second substrate 220, and an adhesive 300 as follows. The first substrate 210 deforms within the recess 114 due to the adhesive 300, forming a protrusion 212 protruding into the recess 114. The second substrate 220 deforms within the recess 124 due to the adhesive 300, forming a protrusion 222 protruding into the recess 124. Furthermore, the adhesive 300 fills the gap formed by the protrusions 212 and 222.

[0051] [Second Implementation] In the first embodiment described above, a concave shape is provided in both the first mold 110 and the second mold 120, but in the second embodiment, a concave shape (recess) is provided only in either of the two molds. Figure 4 This is a schematic diagram illustrating the bonding method of the substrate according to the second embodiment. Figure 4 (a) is a schematic diagram showing the coating process of applying adhesive to the first substrate. Figure 4 (b) is a schematic diagram showing the pressure device for bonding the first substrate and the second substrate. Figure 4 (c) is a schematic diagram showing the situation in which the first substrate and the second substrate are pressurized and held using the first mold and the second mold. Figure 4 (d) is a schematic diagram showing the condition of the first and second substrates after the bonding is removed.

[0052] <Mold> The pressurizing device 100 of the second embodiment includes a first mold 110A and a second mold 120. The first mold 110A does not have a concave portion on surface 112A. The second mold 120 is the same as in the first embodiment, so its description is omitted. The first mold 110A of the second embodiment does not have a recess. That is, the pressurizing device 100 of the second embodiment has a recess 124 in only one mold (the second mold 120). It should be noted that the structure of the recess 124 is the same as in the first embodiment, so its description is omitted.

[0053] <Pressure Process> Figure 4 The coating process of (a), Figure 4 The setup process of (b) and Figure 1 of (a) Figure 1 Similarly, (b) is omitted from the description. The pressurization process of the second embodiment will be described. Here, as... Figure 4 As shown in (c), portions C1 and C2, indicated by dashed lines, are formed on the first substrate 210 and the second substrate 220, respectively, and a portion D1, indicated by dashed lines, is not pressed due to the presence of the recess 124. Portion D1 is pre-positioned such that the portion coated with adhesive 300 is located therein, resulting in a state where the adhesive 300 is sandwiched between the first substrate 210 and the second substrate 220. It should be noted that in portion D1, with reference to either the first substrate 210 or the second substrate 220, the side containing the adhesive 300 is referred to as the inner side, and the side without the adhesive 300 is referred to as the outer side.

[0054] Part D1 does not contact the first mold 110A and the second mold 120, thus not hindering the flow of the adhesive 300 caused by pressure upwards within part D1. On the other hand, due to the presence of the pressurized parts C1 and C2, the flow in the left-right direction of the paper surface is restricted. Through the anisotropic flow accompanying the adhesive 300, in at least a portion of part D1, only the second substrate 220 located on the side where the recess 124 is provided deforms, becoming a protruding convex part 222 protruding outwards. It should be noted that the relationship between W1, W2, H1, and H2 is the same as in the first embodiment, and its description is omitted.

[0055] (Removal process) like Figure 4 As shown in (d), the first substrate 210 and the second substrate 220, which are bonded by adhesive 300 during the processing step, are taken out as the bonded object 200A. Except that only the second substrate 220 is deformed in the bonded object 200A, it is the same as the first embodiment.

[0056] <Effect> According to the bonding method using the pressure device 100 of the second embodiment, which has a recess in a mold on only one side, grooving and drawing processes for the first substrate 210 and the second substrate are not required. By forming an adhesive reservoir 310, a sufficient amount of adhesive 300 can be ensured, making it difficult for the bonded first substrate 210 and the second substrate 220 to peel off with shear force. Figure 4 As shown in (d), the shear force is the same as in the first embodiment, and the description is omitted.

[0057] Furthermore, in the second embodiment, only the second substrate 220 deforms due to the flow of the adhesive 300. In this case, the second substrate 220 can deform in accordance with the amount of adhesive 300 as long as it is within the deformation limit. Regarding the degree of protrusion of the protrusion 222 of the second substrate 220, the less adhesive 300 is sealed inside, the smaller the protrusion; the more adhesive 300 is used, the larger the protrusion. Therefore, it is not necessary to strictly control the amount of adhesive as in the past.

[0058] It should be noted that, with Figure 4 Conversely, a configuration can be adopted in which a recess 114 is provided in the first mold 110 and no recess is provided in the second mold 120. In this case, due to the flow of the adhesive 300 under pressure, the first substrate 210 deforms to form a protrusion 212, while the second substrate 220 does not deform. In this case, the same effect as described above can also be obtained.

[0059] According to the second embodiment, a bonding method and a bonded object can be provided, which can reduce the time required for bonding and does not require strict control of the amount of adhesive or the load, thereby reducing adhesive overflow and improving adhesion.

[0060] [Third Implementation Method] In the first and second embodiments, two substrates are bonded together with an adhesive. However, depending on the material of the substrate, there may be situations where the compatibility with the adhesive is poor, making bonding difficult. In the third embodiment, a method for bonding two substrates using an adhesive that can achieve this even under such circumstances will be described. Furthermore, in the third embodiment, before the coating process, there are steps of applying an adhesive to the first substrate 210 to bond it to the adhesive, and applying an adhesive to the second substrate 220 to bond it to the adhesive. In the embodiments described above, the flow of the adhesive and the deformation of the substrate are utilized; however, in the third embodiment, the flow of the adhesive and the deformation of the substrate are utilized.

[0061] <Adhesive> Figure 5 This is a schematic diagram illustrating the bonding method of the substrate according to the third embodiment. Figure 5 (a) is a schematic diagram showing the first coating process of applying adhesive to a substrate, and (b) is a schematic diagram showing the second coating process of applying adhesive to a substrate. Figure 5 (c) is a schematic diagram showing a pressure device for bonding two substrates. Figure 5 (d) is a schematic diagram showing the state in which two substrates are pressurized and held by a mold. Figure 5 (e) is a schematic diagram showing the condition of the substrate after it has been removed from the bonded area.

[0062] The adhesive 360, serving as the first adhesive, can be, for example, resin, rubber, etc. Furthermore, the adhesive 360 ​​is applied by a coating apparatus 500. Figure 5 As shown in (b), a second coating process is performed using a coating apparatus 500. The coating apparatus 500 includes a nozzle 510 and a worktable 520. The nozzle 510 sprays the adhesive 360 ​​contained in the coating apparatus 500 downwards. The worktable 520 holds a first substrate 210 that has been positioned. The first substrate 210 is precisely positioned and placed on the worktable 520 in a manner that ensures high-precision bonding at a predetermined location.

[0063] The nozzle 510 sprays adhesive 360 ​​onto the surface 210a of the first substrate 210, which is positioned on the worktable 520. It should be noted that the coating apparatus 500 may also be configured such that either or both of the nozzle 510 and the worktable 520 are movable in a horizontal plane. Therefore, in order to form adhesive 360 ​​on the first substrate 210 and the second substrate 220... Figure 6 The protrusions 212 and 222, as shown in (b), are used to draw the desired lines using adhesive 360. It should be noted that... Figure 5 The coating apparatus 500 shown in (b) is an example. The coating method for the adhesive 360 ​​can be implemented using, for example, a spray gun, a dispensing machine, a coating machine, a printer, or injection molding using a mold. For example, hot melt adhesives processed into sheets or films can be prepared, or films with adhesives formed on both sides can be prepared. Alternatively, a preparation step can be performed instead of a coating step, similar to the first embodiment. That is, the first coating step and / or the second coating step described later can be the first preparation step and / or the second preparation step.

[0064] <Adhesion Method> The bonding method of the third embodiment is performed using a coating apparatus 400, a coating apparatus 500, and a pressure device 100, and includes a first coating process, a second coating process, a setting process, a pressure process, and a removal process.

[0065] (First coating process) In the third embodiment, the adhesive 300, which serves as the second adhesive, is uniformly applied to the surface 210a of the first substrate 210 and the surface 220a of the second substrate 220 by the coating apparatus 400.

[0066] It should be noted that in the third embodiment, the adhesive 300 is applied to both the first substrate 210 and the second substrate 220 in the same manner, but it may also be applied to only one of them. Furthermore, in the first coating step, the adhesive 300 is applied to both the first substrate 210 and the second substrate 220 in addition to the portions where the adhesive 360 ​​is applied, but it may also be applied to a portion of the portions containing the adhesive 360. Alternatively, the first coating step may be omitted, that is, the adhesive 300 may not be applied to both the first substrate 210 and the second substrate 220, and the adhesive 360 ​​may be applied directly to the first substrate 210 and the second substrate 220.

[0067] (Second coating process) In the third embodiment, in the second coating process, the following is performed: Figure 1 of (a) Figure 4 The same process as the coating process in (a). Here, in the third embodiment, the adhesive 360 ​​is applied to the surface 210a of the first substrate 210 coated with the adhesive 300 by the coating apparatus 500. By pre-applying the adhesive 300 to the first substrate 210 and the second substrate 220, the adhesion of the adhesive 360 ​​can be made stronger.

[0068] (Pressure process) Figure 5 The setting process of (c) and Figure 1 of (b) Figure 4 (b) is the same, therefore the explanation is omitted. Additionally, regarding... Figure 5 The pressure application process shown in (d) is the same except that adhesive 300 is applied to both the first substrate 210 and the second substrate 220, and adhesive 360 ​​is replaced with adhesive 300 in the first embodiment and the second embodiment, so the description is omitted.

[0069] like Figure 5 As shown in (d), in the third embodiment, a protrusion 212 is formed on the first substrate 210 and a protrusion 222 is formed on the second substrate 220 by the flow of adhesive 360. Adhesive 360 ​​is filled into the protrusions 212 and 222, forming an adhesive accumulation body 370. It should be noted that... Figure 5 The removal process of the bonded object 200B from (e) is the same as the removal process of the bonded object 200B from (e). Figure 1 of (d), Figure 4 The (d) is the same, so the explanation is omitted.

[0070] It should be noted that when using adhesive 360, bonding can also be performed by providing a recess in only one mold, as in the second embodiment.

[0071] In the third embodiment, the same effects as in the first and second embodiments can be obtained, and by using adhesives such as rubber and resin as binders, the selection of materials that can be used as substrates can be increased.

[0072] According to the third embodiment, a bonding method and a bonded object can be provided, which can reduce the time required for bonding, and does not require strict control of the amount of adhesive or the load, thereby reducing adhesive overflow and improving adhesion.

[0073] [Fourth Implementation Method] In the first, second, and third embodiments, a mold for bonding two substrates using an adhesive or binder was described. The bonding of the two substrates can be performed simultaneously with the process of molding a sealing member such as rubber onto the substrates. That is, recesses 114 and 124, used to form protrusions on the first substrate 210 and the second substrate 220 that deform due to the flow of the adhesive or binder, can also be provided in the mold for molding the sealing member. In the fourth embodiment, during the processing step, the sealing member is molded on the surface 210b of the first substrate 210, opposite to surface 210a, and / or, on the surface 220b of the second substrate 220, opposite to surface 220a.

[0074] <Sealing components and adhesive parts> Figure 6 (a) is an enlarged view of the adhesive portion bonded using the bonding method of the third embodiment. Figure 6 (b) is a schematic diagram showing a molded article in which the two substrates are bonded together while the sealing component is being manufactured. Figure 6 (c) is Figure 6 (b) EE-direction view. Figure 6 As shown in (a), even when bonding is performed simultaneously with the processing of the sealing component, protrusions 212 and 222 can be formed on the first substrate 210 and the second substrate 220 by the flow of adhesive 360, and adhesive accumulation 370 can be formed on their inner sides. Thus, the first substrate 210 and the second substrate 220 are firmly bonded together.

[0075] Figure 6(b) is a view of the molded article 700 on the second substrate 220 side after the sealing member 600 has been molded. In the molded article 700, the sealing member 600 is molded on the surface 220b of the second substrate 220, and the first substrate 210 and the second substrate 220 are bonded together by an adhesive 360. A protrusion 222, with lines depicting a shape suitable for the sealing member 600, is formed on the surface 220b of the second substrate 220. It should be noted that the first substrate 210 and the second substrate 220 are also provided with holes 228. Thus, the first substrate 210 and the second substrate 220 can have holes 228, notches, etc., depending on the application, etc., and the arrangement and shape of the sealing member molded on the surface 210b and the surface 220b can be freely designed. Moreover, the bonding portion, in other words, the protrusion 212 and the protrusion 222, can also be provided in a shape and position corresponding to the application of the molded article 700.

[0076] Figure 6 (c) is Figure 6 (b) is a cross-sectional view along the EE direction. Through the flow of adhesive 360, the first substrate 210 deforms to form a protrusion 212, and the second substrate 220 deforms to form a protrusion 222. Adhesive reservoirs 370 are present inside the protrusions 212 and 222, separated by adhesive 300, to firmly bond the first substrate 210 to the second substrate 220.

[0077] Additionally, a sealing member 600 is formed on the right side of the adhesive portion. More specifically, a sealing member 600A1 is formed on the first substrate 210, and a sealing member 600A2 is formed on the second substrate 220. It should be noted that... Figure 6 The example described is an example of molding a sealing member together with the bonding method described in the third embodiment, but the sealing member can also be molded together with the bonding methods described in the first and second embodiments.

[0078] According to the fourth embodiment, a bonding method and a bonded object can be provided, which can reduce the time required for bonding, and does not require strict control of the amount of adhesive or the load, thereby reducing adhesive overflow and improving adhesion.

[0079] [Other Implementation Methods] In the first to fourth embodiments, the two substrates are made of the same material, but they can also be made of different materials and bonded using the bonding method described in the above embodiments. Even when using the same adhesive, the degree to which the substrates deform due to the flow of the adhesive will differ depending on the material of the substrate. Therefore, the width W1 and height H1 of the recesses in the mold can be set to sizes corresponding to the size of the protrusions formed on each substrate in the recesses 114 of the first mold 110 and the recesses 124 of the second mold 120.

[0080] The preferred embodiments of the present invention have been described above, but the present invention is not limited thereto and various modifications and alterations can be made within the scope of its spirit.

[0081] Additionally, for example, the present invention includes the following principles.

[0082] [Main Idea 1] An adhesive bonding method wherein an adhesive is sandwiched between a first adhesive surface of a first substrate and a second adhesive surface of a second substrate, and the first substrate and the second substrate are sandwiched between a first mold and a second mold opposite to the first mold and bonded under pressure. The first mold has a first recess. The second mold has a second recess at a position opposite to the first recess. The bonding method comprises the following steps: The first step, wherein the adhesive is applied, shaped, or prepared on the first bonding surface or the second bonding surface; and In the second step, the first substrate is placed on the first mold side and the second substrate is placed on the second mold side such that the portions coated, shaped, or disposed of with the adhesive are located in the first recess and the second recess, and pressure is applied to the first substrate and the second substrate using the first mold and the second mold. The first substrate deforms within the first recess due to the adhesive, forming a first protrusion extending into the first recess. The second substrate deforms within the second recess due to the adhesive, forming a second protrusion extending into the second recess. The adhesive fills the gap formed by the first protrusion and the second protrusion.

[0083] [Main Theme 2] An adhesive bonding method wherein an adhesive is sandwiched between a first adhesive surface of a first substrate and a second adhesive surface of a second substrate, and the first substrate and the second substrate are sandwiched between a first mold and a second mold opposite to the first mold and bonded under pressure. The first mold has a recess. The bonding method comprises the following steps: The first step, wherein the adhesive is applied, shaped, or prepared on the first bonding surface or the second bonding surface; and In the second step, the first substrate is placed on the first mold side and the second substrate is placed on the second mold side, with the portion coated, shaped, or disposed of with the adhesive located in the recess, and pressure is applied to the first substrate and the second substrate using the first mold and the second mold. The first substrate deforms within the recess due to the adhesive, forming a protrusion that extends into the recess. The adhesive fills the voids formed by the protrusions.

[0084] [Main Theme 3] The adhesive may contain rubber or resin.

[0085] [Main Theme 4] According to claim 3, the bonding method wherein, when the adhesive is used as the first adhesive, Prior to the first step, the following steps are performed: applying, shaping, or applying a second adhesive on the first substrate for bonding the first substrate to the first adhesive; and / or applying, shaping, or applying a second adhesive on the second substrate for bonding the second substrate to the first adhesive.

[0086] [Main Theme 5] In the second process, a sealing member can be formed on the side of the first substrate opposite to the first adhesive surface using the first mold and the second mold, and / or on the side of the second substrate opposite to the second adhesive surface.

[0087] [Main Theme 6] An adhesive having the following characteristics: A first substrate having a first adhesive surface; A second substrate having a second adhesive surface; and An adhesive that at least partially bonds the first adhesive surface and the second adhesive surface. The first substrate has a first protrusion that deforms and protrudes towards the side opposite to the first bonding surface due to the adhesive; and / or The second substrate has a second protrusion that deforms and protrudes towards the side opposite to the second bonding surface due to the adhesive. The adhesive fills the gap formed by the first protrusion and / or the second protrusion.

[0088] Explanation of reference numerals in the attached figures 100: Pressurization device 110, 110A: First mold 112: Noodles 114: concave part 114Sp: Space, 114a: Bottom, 114b: Wall, 114c: Wall 120: Second mold 122: Noodles 124: concave part 124Sp: Space, 124a: Bottom, 124b: Wall, 124c: Wall 200, 200A: Adhesives 210: First substrate 210a, 210b: Surface 212: convex part 220: Second substrate 220a, 220b: Surface 222: convex part 228: Hole 300: Adhesive; 301: Adhesive or binder; 310: Adhesive accumulation. 360: Adhesive 400: Coating apparatus 410: Nozzle 420: Workbench 450: Forming device 450A, 450B, 450C: Module 450Ba: Gate 450Bb: concave part 500: Coating apparatus 510: Nozzle 520: Workbench 600, 600A1, 600A2: Sealing components 700: Molded parts A1, A2, B1, C1, C2, D1: Partial Sr1, Sr2, Sr3, Sr4: Arrows W1, W2: Width H1, H2: Height.

Claims

1. An adhesive bonding method, characterized in that, An adhesive is sandwiched between a first bonding surface of a first substrate and a second bonding surface of a second substrate. The first substrate and the second substrate are sandwiched between a first mold and a second mold opposite to the first mold and bonded together under pressure. The first mold has a first recess. The second mold has a second recess at a position opposite to the first recess. The bonding method comprises the following steps: The first step, wherein the adhesive is applied, shaped, or prepared on the first bonding surface or the second bonding surface; and In the second step, the first substrate is placed on the first mold side and the second substrate is placed on the second mold side such that the portions coated, shaped, or disposed of with the adhesive are located in the first recess and the second recess, and pressure is applied to the first substrate and the second substrate using the first mold and the second mold. The first substrate deforms within the first recess due to the adhesive, forming a first protrusion extending into the first recess. The second substrate deforms within the second recess due to the adhesive, forming a second protrusion extending into the second recess. The adhesive fills the gap formed by the first protrusion and the second protrusion.

2. An adhesive bonding method, characterized in that, An adhesive is sandwiched between a first bonding surface of a first substrate and a second bonding surface of a second substrate. The first substrate and the second substrate are sandwiched between a first mold and a second mold opposite to the first mold and bonded together under pressure. The first mold has a recess. The bonding method comprises the following steps: The first step, wherein the adhesive is applied, shaped, or prepared on the first bonding surface or the second bonding surface; and In the second step, the first substrate is placed on the first mold side and the second substrate is placed on the second mold side, with the portion coated, shaped, or disposed of with the adhesive located in the recess, and pressure is applied to the first substrate and the second substrate using the first mold and the second mold. The first substrate deforms within the recess due to the adhesive, forming a protrusion that extends into the recess. The adhesive fills the voids formed by the protrusions.

3. The bonding method according to claim 1 or 2, wherein, The adhesive comprises rubber or resin.

4. The bonding method according to claim 3, wherein, When the adhesive is used as the first adhesive... Prior to the first step, the following steps are performed: applying, shaping, or applying a second adhesive on the first substrate in order to bond the first substrate to the first adhesive; and / or applying, shaping, or applying a second adhesive on the second substrate in order to bond the second substrate to the first adhesive.

5. The bonding method according to claim 1 or 2, wherein, In the second step, the sealing member is formed on the side of the first substrate opposite to the first adhesive surface using the first mold and the second mold; and / or, the sealing member is formed on the side of the second substrate opposite to the second adhesive surface.

6. An adhesive, characterized in that, have: A first substrate having a first adhesive surface; A second substrate having a second adhesive surface; and An adhesive that at least partially bonds the first adhesive surface and the second adhesive surface. The first substrate has a first protrusion that deforms and protrudes towards the side opposite to the first bonding surface due to the adhesive; and / or The second substrate has a second protrusion that deforms and protrudes towards the side opposite to the second bonding surface due to the adhesive. The adhesive fills the gap formed by the first protrusion and / or the second protrusion.

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